C1210F475M3RAC7800 - Kemet Corp. - Datasheet.Directory

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

CERAMIC OPEN MODE CAPACITORS

Applications: Markets:

• Input side filtering (power plane/bus) • Automotive

• High current applications (battery line) - All applications connected directly to the battery

• Circuits that cannot be fused to open when - Conversion to 42V power system

• Power Conversion

- Raw power input side filtering

short circuits occur due to flex cracks

EIA Si

Size Code Code L - Length W - Width B - Bandwidth Separation

2012 0805 2.00 (.079) ± .20 (.008) 1.25 (.049) ± .20 (.008) 0.50 (.02) ± .25 (.010) 0.75 (.030)

3216 1206 3.20 (.126) ± .20 (.008) 1.60 (.063) ± .20 (.008) 0.50 (.02) ± .25 (.010) N/A

3225 1210 3.20 (.126) ± .20 (.008) 2.50 (.098) ± .20 (.008) 0.50 (.02) ± .25 (.010) N/A

Note: For thickness dimensions, see Table 2.

C 1812 F 105 K 1 R A C

Style

C - Ceramic

Size Code

0805, 1206, 1210, 1812

Specification

F - Open-Mode

Capacitance Code, pF

First two digits represent significant figures.

Third digit specifies number of zeros. 100 pF = 101.

(Use “9” for 1.0 through 9.9 pF)

(Use “8” for 0.1 through .99 pF)

Capacitance Tolerance

K = ±10% M = ±20%

Voltage

2 = 200V 5 = 50V

1 = 100V 3 = 25V

4 = 16V

Temperature Characteristic

Designated by Capacitance

Change over Temperature Range

R – X7R (±15%) (-55°C +125°C)

End Metallization

C = Standard

Failure Rate Level

A = Not Applicable

The open-mode dimension (OM)

exceeds the termination bandwidth

dimensions: OM >BW

FEATURES

OUTLINE DRAWING

TABLE 1 - DIMENSIONS - MILLIMETERS (INCHES)

CAPACITOR ORDERING INFORMATION

OPEN-MODE INTERNAL DESIGN

KEMET’s Open Mode Ceramic Surface Mount Capacitor is designed to significantly minimize the probability

of a low IR or Short Circuit Condition when forced to failure in a board flex situation. This reduces the poten-

tial for causing catastrophic failures. This product is RoHS Compliant.

Metric

Size Code

EIA Size

Code L - Length W - Width B - Bandwidth Separation

2012 0805 2.0 (.079) ± .20 (.008) 1.25 (.049) ± 0.2 (.008) 0.50 (.02) ± .25 (.010) 0.75 (.030)

3216 1206 3.2 (.126) ± .20 (.008) 1.6 (.063) ± 0.2 (.008) 0.50 (.02) ± .25 (.010) N/A

3225 1210 3.2 (.126) ± .20 (.008) 2.5 (.098) ± 0.2 (.008) 0.50 (.02) ± .25 (.010) N/A

4532 1812 4.5 (.177) ± 0.3 (.012) 3.2 (.126) ± 0.3 (.012) 0.60 (.024) ± .35 (.014) N/A

TIN PLATE

NICKEL PLATE

CONDUCTIVE

METALLIZATION

ELECTRODES

Ceramic Surface Mount

L = 70Sn/30Pb Plated

C = 100% Tin Plated

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

CERAMIC OPEN MODE CAPACITORS

TABLE 2

X7R DIELECTRIC CAPACITANCE RANGE AND THICKNESS TARGETS (mm)

Ceramic Surface Mount

THICKNESS AND PACKAGING INFORMATION

16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 25V 50V 100V 200V

102 DD DD DD DD DD

122 DD DD DD DD DD

152 DD DD DD DD DD

182 DD DD DD DD DD

222 DD DD DD DD DD

272 DD DD DD DD DD

332 DD DD DD DD DD

392 DD DD DD DD DD

472 DD DD DD DD DD

562 DD DD DD DD DD

682 DD DD DD DD DD

822 DD DD DD DD DD

103 DD DD DD DD DD

123 DD DD DD DD DG

153 DD DD DD DD DG

183 DD DD DD DD EC

223 DD DD DD DG EC

273 DD DD DD DG EC

333 DD DD DD DG EC

393 DD DD DD DG EC

473 DD DD DD DE EC EC EC EC EG GB

563 DD DD DD EC EC EC EC EG GB

683 DD DD DG DG EC EC EC EC EG FD GB

823 DD DD DG EC EC EC EC EG FD GB

104 DG DG DG EC EC EC EC EG FD FD FD FD FG GB GB GB GB

124 DG DG EC EC EC EC FD FD FD FD FG GB GB GB GB

154 DG DG EC EC EC EG FD FD FD FD FH GB GB GB GB

184 DG DG EC EC EC EG FD FD FD FD FH GB GB GB GB

224 DG DD DG EC EC EC ED FD FD FD FG FJ GB GB GB GC

274 EC EC EC FD FD FD FG GB GB GB GF

334 EG EG FD FD FD FH GB GB GB GK

394 EG EG FD FD FG FH GB GB GB GL

474 DE DG EG EG EC FD FD FG FJ GB GB GC

564 EG FD FD FG FR GB GB GD

684 DG EG FD FG FH FR GD GD GF

824 EG FD FG FJ GD GD GK

105 EG EC EH FD FH FJ FQ GN GN GM

125 FG

155 FH

185 FH

225 EC EH FJ FM

475 EH FG FM

18120805 1206

Cap

Code

1210

Thickness

Code Series Dimension 7" Reel Qty. 13" Reel Qty.

DD 0805 .90 ± .10 4000 10000

DE 0805 1.00 ± .10 2500 10000

DG 0805 1.25 ± .15 2500 10000

EC 1206 .90 ± .10 4000 10000

EG 1206 1.60 ± .15 2000 8000

EH 1206 1.60 ± .20 2000 8000

FD 1210 .95 ± .10 4000 10000

FG 1210 1.25 ± .15 2500 10000

FH 1210 1.55 ± .15 2000 8000

FJ 1210 1.85 ± .20 2000 8000

FM 1210 1.70 ± .20 2000 8000

FR 1210 2.25 ± .20 2000 8000

FQ 1210 2.5 ± .20 1500 8000

GB 1812 1.0 ± .10 1000 4000

GC 1812 1.1 ± .10 1000 4000

GD 1812 1.25 ± .15 1000 4000

GF 1812 1.50 ± .15 1000 4000

GK 1812 1.60 ± .20 1000 4000

GL 1812 1.90 ± .20 1000 4000

GM 1812 2.00 ± .20 1000 4000

GN 1812 1.70 ± .20 1000 4000

16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 25V 50V 100V 200V

102 DD DD DD DD DD

122 DD DD DD DD DD

152 DD DD DD DD DD

182 DD DD DD DD DD

222 DD DD DD DD DD

272 DD DD DD DD DD

332 DD DD DD DD DD

392 DD DD DD DD DD

472 DD DD DD DD DD

562 DD DD DD DD DD

682 DD DD DD DD DD

822 DD DD DD DD DD

103 DD DD DD DD DD

123 DD DD DD DD DG

153 DD DD DD DD DG

183 DD DD DD DD EC

223 DD DD DD DG EC

273 DD DD DD DG EC

333 DD DD DD DG EC

393 DD DD DD DG EC

473 DD DD DD DE EC EC EC EC EG GB

563 DD DD DD EC EC EC EC EG GB

683 DD DD DG DG EC EC EC EC EG FD GB

823 DD DD DG EC EC EC EC EG FD GB

104 DG DG DG EC EC EC EC EG FD FD FD FD FG GB GB GB GB

124 DG DG EC EC EC EC FD FD FD FD FG GB GB GB GB

154 DG DG EC EC EC EG FD FD FD FD FH GB GB GB GB

184 DG DG EC EC EC EG FD FD FD FD FH GB GB GB GB

224 DG DD DG EC EC EC ED FD FD FD FG FJ GB GB GB GC

274 DD DD EC EC EC FD FD FD FG GB GB GB GF

334 DG DG EG EG EG EG FD FD FD FH GB GB GB GK

394 DG DG EG EG FD FD FG FH GB GB GB GL

474 DE DG EG EG EC FD FD FG FJ GB GB GC

564 EG FD FD FG FR GB GB GD

684 DG EG FD FG FH FR GD GD GF

824 EG FD FG FJ GD GD GK

105 EG EC EH FD FH FJ FQ GN GN GM

125 FG

155 FH

185 FH

225 EC EH FJ FM

475 EH FG FM

685 FQ

18120805 1206

Cap

Code 1210

Thickness

Code Series Dimension 7"

Reel Qty. 13"

Reel Qty.

DD 0805 .90 ± .10 4000 10000

DE 0805 1.00 ± .10 2500 10000

DG 0805 1.25 ± .15 2500 10000

EC 1206 .90 ± .10 4000 10000

ED 1206 1.00 ± .10 2500 10000

EG 1206 1.60 ± .15 2000 8000

EH 1206 1.60 ± .20 2000 8000

FD 1210 .95 ± .10 4000 10000

FG 1210 1.25 ± .15 2500 10000

FH 1210 1.55 ± .15 2000 8000

FJ 1210 1.85 ± .20 2000 8000

FM 1210 1.70 ± .20 2000 8000

FR 1210 2.25 ± .20 2000 8000

FQ 1210 2.5 ± .20 1500 8000

GB 1812 1.0 ± .10 1000 4000

GC 1812 1.1 ± .10 1000 4000

GD 1812 1.25 ± .15 1000 4000

GF 1812 1.50 ± .15 1000 4000

GK 1812 1.60 ± .20 1000 4000

GL 1812 1.90 ± .20 1000 4000

GM 1812 2.00 ± .20 1000 4000

GN 1812 1.70 ± .20 1000 4000

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

KEMET offers Multilayer Ceramic Chip Capacitors

packaged in 8mm and 12mm plastic tape on 7" and

13" reels in accordance with EIA standard 481-1:

Taping of surface mount components for automatic

handling. This packaging system is compatible with all

tape

fed

automatic

pick

and

place

systems. See page 78

for details on reeling quantities for commercial chips

and page 87 for MIL-PRF-55681 chips.

CERAMIC CHIP CAPACITORS

Packaging Information

Tape & Reel Packaging

8mm ±.30

(.315 ±.012")

12mm ±.30

(.472 ±.012")

178mm (7.00")

330mm (13.00")

Anti-Static Reel

Embossed Carrier*

0402 and 0603 case sizes

available on punched paper only.

Embossment

Anti-Static Cover Tape

(.10mm (.004") Max Thickness)

Chip Orientation

in Pocket

(except 1825 Commercial, and 1825 & 2225 Military)

* Punched paper carrier used for 0402 and 0603 case size.

handling. This packaging system is compatible with all

tape

fed

automatic

pick

and

place

systems. See page 81

for details on reeling quantities for commercial chips

and page 90 for MIL-PRF-55681 chips.

KEMET

Grid

placement

courtyard Z

2.14

2.78

3.30

4.50

5.90

7.00

0.28

0.68

0.70

1.50

2.30

3.30

0.74

1.08

1.60

2.00

2.90

3.70

6.90

5.50

6.80

Y(ref)

0.93

1.05

1.30

1.50

1.80

1.85

C(ref)

1.21

1.73

2.00

3.00

4.10

5.15

3.18

3.70

4.90

0.68

0.70

1.50

0.80

1.10

1.40

2.00

Y(ref)

1.25

1.50

1.70

Smin

1.93

2.20

3.20

Wave SolderReflow Solder

Calculation Formula

Z = Lmin + 2Jt + Tt

G = Smax - 2Jh -Th

X = Wmin + 2Js + Ts

Tt, Th, Ts = Combined tolerances

0402

0603

0805

1206

1210

1812

1825

2220

2225

Dimension

Not Recommended

Grid

Placement

Courtyard

SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM

Packaging

TM suffix represents tape and reel packaging of marked components.

Case Sizes ≤ 1210 are 8 mm tape with 4 mm pitch.

Case Sizes > 1210 are 12 mm tape with 8 mm pitch

Note: TU suffix represents tape and reel packaging of marked components.

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

Performance Notes

1. Cover Tape Break Force: 1.0 Kg Minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width Peel Strength

8 mm 0.1 Newton to 1.0 Newton (10g to 100g)

12 mm 0.1 Newton to 1.3 Newton (10g to 130g)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier

tape shall be 165to 180from the plane of the carrier tape. During peeling, the carrier and/or cover tape

shall be pulled at a velocity of 300 ±10 mm/minute.

3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")

reels (with C-7280). Note that 13” reels are preferred.

4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.

Refer to EIA-556.

Embossed Carrier Tape Configuration: Figure 1

NOTES

1. B1 dimension is a reference dimension for tape feeder clearance only.

2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of

embossment location and hole location shall be applied independent of each other.

3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require

additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)

4. The cavity defined by A0,B0,and K0shall be configured to surround the part with sufficient clearance such that the chip does not pro-

trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical

restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm

maximum in the pocket (not applicable to vertical clearance.)

Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern)

Constant Dimensions — Millimeters (Inches)

Tape Size D0EP

0P2T Max T1Max

8 mm 1.5 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.100

and +0.10 -0.0

12 mm (0.059 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.024) (0.004)

+0.004, -0.0)

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch B1Max. D1Min. F P1R Min. T2Max W A0B0K0

Note 1 Note 2 Note 3 Note 4

8 mm Single 4.4 1.0 3.5 ±0.05 4.0 ±0.10 25.0 2.5 8.0 ±0.30

(4 mm)

(0.173) (0.039) (0.138 ±0.002) (0.157 ±0.004) (0.984) (0.098) (.315 ±0.012)

12 mm Double 8.2 1.5 5.5 ±0.05 8.0 ±0.10 30.0 4.6 12.0 ±0.30

(8 mm) (0.323) (0.059) (0.217 ±0.002) (0.315 ±0.004) (1.181) (0.181) (0.472 ±0.012)

TANTALUM, CERAMIC AND

ALUMINUM CHIP CAPACITORS

Packaging Information

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

Embossed Carrier Tape Configuration (cont.)

Sketch D: Tape Camber (Top View)

Allowable camber to be 1 mm/250 mm.

250mm (9.843)

1mm (0.039) Max.

Table 2 – REEL DIMENSIONS (Metric will govern)

Figure 3: Reel Dimensions (Metric Dimensions will govern)

Tape Size A Max B* Min C D* Min N Min W1W2Max W3

8 mm 330.0 1.5 13.0 ± 0.20 20.2 50.0 8.4 14.4 7.9 Min

(12.992) (0.059) (0.512 ± 0.008) (0.795) (1.969) +1.5, -0.0 (0.567) (0.311)

See (0.331 10.9 Max

Note 3 +0.059, -0.0) (0.429)

12 mm 330.0 1.5 13.0 ± 0.20 20.2 Table 1 12.4 18.4 11.9 Min

(12.992) (0.059) (0.512 ± 0.008) (0.795) +2.0, -0.0 (0.724) (0.469)

(0.488 15.4 Max

+0.078, -0.0) (0.606)

TANTALUM, CERAMIC AND

ALUMINUM CHIP CAPACITORS

Packaging Information

Figure 2:

Tape Leader

& Trailer

Dimensions

(Metric

Dimensions

Will Govern)

400mm (15.75) Min.

20°

Packaging

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

20°

Maximum

component rotation.

Typical

component

center line

Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):

Table 1: 8 & 12mm Punched Tape

(Metric Dimensions Will Govern)

Variable Dimensions - Millimeters (Inches)

Note:

1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the

body and/or the body dimensions of the component. The clearance between the ends of the terminals or

body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)

minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component

within the cavity of not more than 20 degrees (see sketches A and B).

2. Tape with components shall pass around radius "R" without damage.

3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.

8mm

and

12mm

1.5

+0.10, -0.0

(.059

+0.004, -0.0)

1.75 ±0.10

(.069 ±0.004)

4.0 ± 0.10

(.157 ± 0.004)

2.0 ± 0.05

(.079 ± 0.002)

0.10

(.004)

Max.

0.75

(.030)

Min.

0.75

(.030)

Min.

25 (.984)

See Note 2

Table 1

Tape

Size D0P0

EP2T1G1G2R Min.

8mm

1/2

Pitch

2.0 ± 0.10

(.079 ±.004)

See Require-

ments

Section 3.3 (d)

3.5 ± 0.05

(.138 ± .002)

8.0 ± 0.3

(.315 ± 0.012)

See Note 1

Table 1

1.1mm (.043)

Max. for Paper

Base Tape and

1.6mm (.063)

Max. for Non-

Paper Base

Compositions.

See Note 3.

Tape

Size P1W

FA0B0T

8mm 4.0 ± 0.10

(0.157 ± .004)

12mm 4.0 ± 0.10

(0.157 ± .004)

12mm

Double

Pitch

8.0 ± 0.10

(0.315 ± .004)

12.0 ± 0.3

(.472 ± .012)

5.5 ± 0.05

(.217 ± .002)

Table 1: 8 & 12mm Punched Tape

(Metric Dimensions Will Govern)

Constant Dimensions - Millimeters (Inches)

Sketch B:

Max. Component

Rotation - Front

Cross Sectional View

Sketch C:

Component Rotation - Top View

Center lines

of cavity

10 pitches cumulative

tolerance on tape

±0.2 (±0.008)

Top

Tape

Cover

User Direction of Feed

Max. Cavity Size

See Note 1

Table 1

Bottom

Tape

Cover

(Min.)

Sketch A:

Bending Radius

See Note 2

Table 1

CERAMIC CHIP CAPACITORS

Packaging Information

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

CERAMIC CHIP CAPACITORS

Packaging Information

CAPACITOR MARKING TABLE

(Marking Optional - Not Available

for 0402 Size or Y5V Dielectric)

0.10

0.11

0.12

0.13

0.15

0.16

0.18

0.20

0.22

0.24

0.27

0.30

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.40

0.45

0.50

0.60

0.70

0.80

0.90

1.0

1.1

1.2

1.3

1.5

1.6

1.8

2.0

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

2.5

3.5

4.0

4.5

5.0

6.0

7.0

8.0

9.0

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1000

1100

1200

1300

1500

1600

1800

2000

2200

2400

2700

3000

3300

3600

3900

4300

4700

5100

5600

6200

6800

7500

8200

9100

2500

3500

4000

4500

5000

6000

7000

8000

9000

10,000

11,000

12,000

13,000

15,000

16,000

18,000

20,000

22,000

24,000

27,000

30,000

33,000

36,000

39,000

43,000

47,000

51,000

56,000

62,000

68,000

75,000

82,000

91,000

25,000

35,000

40,000

45,000

50,000

60,000

70,000

80,000

90,000

100,000

110,000

120,000

130,000

150,000

160,000

180,000

200,000

220,000

240,000

270,000

300,000

330,000

360,000

390,000

430,000

470,000

510,000

560,000

620,000

680,000

750,000

820,000

910,000

250,000

350,000

400,000

450,000

500,000

600,000

700,000

800,000

900,000

Alpha

Character

Numeral

901 2 3 4 5

Capacitance (pF) For Various Numeral Identifiers

1,000,000

1,100,000

1,200,000

1,300,000

1,500,000

1,600,000

1,800,000

2,000,000

2,200,000

2,400,000

2,700,000

3,000,000

3,300,000

3,600,000

3,900,000

4,300,000

4,700,000

5,100,000

5,600,000

6,200,000

6,800,000

7,500,000

8,200,000

9,100,000

2,500,000

3,500,000

4,000,000

4,500,000

5,000,000

6,000,000

7,000,000

8,000,000

9,000,000

10,000,000

11,000,000

12,000,000

13,000,000

15,000,000

16,000,000

18,000,000

20,000,000

22,000,000

24,000,000

27,000,000

30,000,000

33,000,000

36,000,000

39,000,000

43,000,000

47,000,000

51,000,000

56,000,000

62,000,000

68,000,000

75,000,000

82,000,000

91,000,000

25,000,000

35,000,000

40,000,000

45,000,000

50,000,000

60,000,000

70,000,000

80,000,000

90,000,000

Laser marking is available as an extra-cost option for

most KEMET ceramic chips. Such marking is two

sided, and includes a K to identify KEMET, followed by

two characters (per EIA-198 - see table below) to

identify the capacitance value. Note that marking is

not available for size 0402 nor for any Y5V chip. In

addition, the 0603 marking option is limited to the K

only.

Example shown is 1,000 pF capacitor.

KA3

Table 2 – Capacitance Values Available

In Bulk Cassette Packaging

0402

0603

0805

All

C0G

X7R

Y5V

All

109

221

104

All

181

331

102

392

103

273

104

224

Case

Size Dielectric Voltage

Min.

Cap

Value

Max.

Cap

Value

All

200

100

200

100

Terminations: KEMET nickel barrier layer with a tin overplate.

0.3

0.7

0.75

EIA

Size

Code

Length

Width

Thickness

Bandwidth

Minimum

Separation

Metric

Size

Code

Number of

Pcs/Cassette

50,000

15,000

10,000

0402

0603

0805

1.0 ± 0.05

1.6 ± 0.07

2.0 ± 0.10

0.5 ± 0.05

0.8 ± 0.07

1.25 ± 0.10

0.5 ± .05

0.8 ± .07

0.6 ± .10

0.2 to 0.4

0.2 to 0.5

0.5 to 0.75

1005

1608

2012

Table 1 – Capacitor Dimensions for Bulk

Cassette Packaging – Millimeters

Unit: mm

* Reference

110 ± 0.7

31.5 ±0

0.2

36 ±0

0.2

19.0*

5.0*

10*

53.3*

6.8 ± 0.1

8.8 ± 0.1

12.0 ± 0.1

3.0 ±0

0.2

2.0 ±0.1

1.5 ±0

0.1

Bulk Cassette Packaging (Ceramic Chips only)

(Meets Dimensional Requirements IEC-286-6 and EIAJ 7201)

Packaging