33-01/G4C-ARTB - Everlight International Corp.

1

：

DPE-0000057

www.everlight.com

3mm Advanced Super Flux LEDs

33-01/G4C-ARTB

Benefits

. High Flux Output.

. Low Profile.

. Low Thermal Resistance.

. Low Power Consumption.

.The product itself will remain within RoHS compliant version.

. ESD-withstand voltage: up to 4KV.

Descriptions

This revolutionary package design allows the light designer to reduce the number of LEDs required and

provide a more uniform and unique illuminated appearance than with other LED solutions. This is possible

through the efficient optical package design and high-current capabilities.

The low profile package can be easily coupled with reflectors or lenses to efficiently distribute light and

provide the desired light appearance.

Applications

. Automotive Exterior Lighting

. Electronic Signs and Signals

. Channel Letter

. Special Lighting application

Device Selection Guide

PART NO.

Chip

Lens Color

Material Emitted Color

33-01/G4C-ARTB InGaN Brilliant Green Water Clear

DATASHEET

P-LED

33-01-G4C-ARTB

2

：

DPE-0000057

www.everlight.com

Package Dimensions

Notes: 1.All dimensions are in millimeters

2.An epoxy meniscus may extend about 1.5mm(0.059") down the leads

3.Tolerances unless dimensions ±0.25mm

DATASHEET

P-LED

33-01-G4C-ARTB

3

：

DPE-0000057

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Absolute Maximum Ratings (Ta=25℃

℃℃

℃)

Parameter Symbol Rating Units

Continuous Forward Current I

F

30 mA

Peak Forward Current(Duty 1/10 @ 1KHZ) I

FP

100 mA

Operating Temperature T

opr

-40 ~ +85 ℃

Storage Temperature T

stg

-40 ~ +100 ℃

Soldering Temperature(T=5 sec) T

sol

260 ± 5 ℃

Power Dissipation P

d

120 mW

Zener Reverse Current Iz 100 mA

Electrostatic Discharge ESD 4K V

LED Junction Temperature T

j

110 ℃

Electro-Optical Characteristics (Ta=25℃

℃℃

℃)

Parameter Symbol

Min. Typ. Max. Condition Unit

Total Flux Φv 4500 5650 9000 I

F

=30mA mlm

Viewing Angle 2θ1/2 ---- 90 ---- I

F

=30mA deg

Peak Wavelength λp ---- 518 ---- I

F

=30mA Nm

Dominant Wavelength

λd 520 525 532 I

F

=30mA Nm

Forward Voltage V

F

2.8 ---- 3.8 I

F

=30mA V

Reverse Current I

R

---- ---- 10 V

R

=5V uA

Zener Reverse Voltage

Vz 5.2 ---- ---- Iz=5mA V

DATASHEET

P-LED

33-01-G4C-ARTB

4

：

DPE-0000057

www.everlight.com

Rank

33-01/G4C-ARTB

(1) (2) (3)

(1)

V

F

(V)

(2)

λd

(3)

Φv(mlm)

Bin. Min. Max. Bin. Min. Max. Bin. Min. Max.

0 2.80 3.00 3 520 524 R 4500 5650

1 3.00 3.20 4 524 528 S 5650 7150

2 3.20 3.40 5 528 532 T 7150 9000

3 3.40 3.60

4 3.60 3.80

*Measurement Uncertainty of Forward Voltage：±0.1V

*Measurement Uncertainty of Total Flux: ±15%

*Measurement Uncertainty of Dominant Wavelength ±1.0nm

DATASHEET

P-LED

33-01-G4C-ARTB

5

：

DPE-0000057

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Typical Electro-Optical Characteristics Curves

Relative Intensity vs. Wavelength Forward Current vs. Forward Voltage

Relative Intensity vs. Forward Current Forward Current vs. Ambient Temp.

Relative Intensity vs. Displacement Angle

450 475 500 525 550 575 600 625 650

WAVELENGTH (nm)

0.00

0.50

1.00

RELATIVE INTENSITY

3.00 3.40 3.802.80 3.20 3.60 4.00

FORWARD VOLTAGE (V)

0

10

20

30

FORWARD CURRENT (mA)

0 20 40 60 80 100

AMBIENT TEMPERATURE (C)

5

15

25

35

0

10

20

30

40

FORWARD CURRENT (mA)

0 5 10 15 20 25 30

FORWARD CURRENT (mA)

0.00

0.20

0.40

0.60

0.80

1.00

RELATIVE INTENSITY

-90 -75 -60 -45 -30 -15 0

0.00

0.25

0.50

0.75

1.00

015

30

45

60

75

90

Relative Intensity (a.u.)

Viewing angle (degree)

DATASHEET

P-LED

33-01-G4C-ARTB

6

：

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Packing Specification

1. Tube

Cross section image of tube

2. Inner Box

ANTISTATIC

485

±

2

mm

Tube Label

Whole image of tube

Box Label

Unit: mm

DATASHEET

P-LED

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：

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3. Outside Box

4. Packing Quantity

(1) 60 pcs/1 tube, 30 tubes/1 small inside box, 12 small inside boxes/1 outside box.

(2) 60 pcs/1 tube, 105 tubes/1 big inside box, 4 big inside boxes/1 outside box.

Label Form Specification

(1)Tube Label Form

(2)Box Label Form

Notes

1. Lead Forming

 During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy

bulb.

 Lead forming should be done before soldering.

CPN:

P/N:

EVERLIGHT

33-01/G4C-ARTB

QTY：

CAT:

HUE:

REF:

LOT NO：

RoHS

Box Label

QTY: Packing Quantity

LOT NO: Lot Number

CAT: Ranks of Forward Voltage, Color Bin

Grade and Total Flux

CPN: Customer’s Production Number

P/N : Production Number

HUE: Reference

REF: Reference

DATASHEET

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：

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 Avoid stressing the LED package during leads forming. The stress to the base may damage the

LED’s characteristics or it may break the LEDs.

 Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may

cause failure of the LEDs.

 When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead

position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the

epoxy resin and this will degrade the LEDs.

2. Storage

 The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight

and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be

stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.

 Please avoid rapid transitions in ambient temperature, especially, in high humidity environments

where condensation can occur.

3. Soldering

 Careful attention should be paid during soldering. Solder the LED no lower than 1.6mm from the

base of stopper is recommended.

 Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly

when soldering.

 Recommended soldering conditions:

Hand Soldering DIP Soldering

Temp. at tip of iron 300

℃

Max. (30W Max.) Preheat temp. 100

℃

Max. (60 sec Max.)

Soldering time 3 sec Max. Bath temp. 260 Max.

Distance No lower than 1.6mm from

the base of stopper

Bath time. 5 sec Max.

Distance No lower than 1.6mm from

the base of stopper

 Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly

when soldering.

 Dip and hand soldering should not be done more than one time

 After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration

until the LEDs return to room temperature.

 A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

 Although the recommended soldering conditions are specified in the above table, dip or

handsoldering at the lowest possible temperature is desirable for the LEDs.

 Wave soldering parameter must be set and maintain according to recommended temperature and

dwell time in the solder wave.

DATASHEET

P-LED

33-01-G4C-ARTB

9

：

DPE-0000057

www.everlight.com

4. Cleaning

 When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a

duration of no more than one minute. Dry at room temperature before use.

 Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of

ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled

condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the

LED

5. Circuit Protection

 Below the zener reference voltage Vz, all the current flows through LED and as the voltage rises to

Vz, the zener diode “breakdown." If the voltage tries to rise above Vz current flows through the

zener branch to keep the voltage at exactly Vz.

 When the LED is connected using serial circuit, if either piece of LED is no light up but current

can’t flow through causing others to light down. In new design, the LED is parallel with zener

diode. if either piece of LED is no light up but current can flow through causing others to light up.

6. Heat Management

 Heat management of LEDs must be taken into consideration during the design stage of LED

application. The current should be de-rated appropriately by referring to the de-rating curve found

in each product specification.

 The temperature surrounding the LED in the application should be controlled. Please refer to the

data sheet de-rating curve.

DATASHEET

P-LED

33-01-G4C-ARTB

10

：

DPE-0000057

www.everlight.com

7. ESD (Electrostatic Discharge)

 Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.

 An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs.

 All devices, equipment and machinery must be properly grounded.



Use ion

blower to neutralize the static charge which might have built up on surface of the LEDs

plastic le

ns as a result of friction between LEDs during storage and handing.

8. Other

 Above specification may be changed without notice. EVERLIGHT will reserve authority on

material change for above specification.

 When using this product, please observe the absolute maximum ratings and the instructions

for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any

damage resulting from use of the product which does not comply with the absolute maximum

ratings and the instructions included in these specification sheets.

 These specification sheets include materials protected under copyright of EVERLIGHT

corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s

consent.

DATASHEET

P-LED

33-01-G4C-ARTB

11

：

DPE-0000057

www.everlight.com

Revision History

Rev. Modified date File modified contents

3 2013/5/2 Change the form of data