1
FEATURES
DESCRIPTION/ORDERING INFORMATION
1
2
3
4
5
6
7
8
1A
1Y
1Z
G
2Z
2Y
2A
GND
VCC
4A
4Y
4Z
G
3Z
3Y
3A
9
12
10
13
15
11
14
16
4
5
6
7
8
18
17
16
15
14
9
10
11 12 13
3
2
120 19
1Z
G
2Z
2Y
NC
1Y
1A
VCC
4A
NC
NC – No internal connection
4Y
4Z
G
NC
3Z
2A
GND
NC
3Y
3A
AM26C31M. . .J OR W PACKAGE
AM26C31Q. . .D PACKAGE
AM26C31C. . .D, DB, OR NS PACKAGE
AM26C31I. . .D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
AM26C31M. . .FK PACKAGE
(TOP VIEW)
AM26C31
www.ti.com
................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008
QUADRUPLE DIFFERENTIAL LINE DRIVER
•Meets or Exceeds the Requirements ofTIA/EIA-422-B and ITU Recommendation V.11•Low Power, I
CC
= 100 µA Typ•Operates From a Single 5-V Supply•High Speed, t
PLH
= t
PHL
= 7 ns Typ•Low Pulse Distortion, t
sk(p)
= 0.5 ns Typ•High Output Impedance in Power-OffConditions
•Improved Replacement for AM26LS31•Available in Q-Temp Automotive– High-Reliability Automotive Applications– Configuration Control/Print Support– Qualification to Automotive Standards
The AM26C31 is a differential line driver withcomplementary outputs, designed to meet therequirements of TIA/EIA-422-B and ITU (formerlyCCITT). The 3-state outputs have high-currentcapability for driving balanced lines, such astwisted-pair or parallel-wire transmission lines, andthey provide the high-impedance state in thepower-off condition. The enable functions arecommon to all four drivers and offer the choice of anactive-high (G) or active-low ( G) enable input.BiCMOS circuitry reduces power consumption withoutsacrificing speed.
The AM26C31C is characterized for operation from 0 ° C to 70 ° C, the AM26C31I is characterized for operationfrom – 40 ° C to 85 ° C, the AM26C31Q is characterized for operation over the automotive temperature range of– 40 ° C to 125 ° C, and the AM26C31M is characterized for operation over the full military temperature range of– 55 ° C to 125 ° C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1990 – 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
AM26C31
SLLS103M – DECEMBER 1990 – REVISED JUNE 2008 ...................................................................................................................................................
www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
PDIP (N) Tube of 25 AM26C31CN AM26C31CNTube of 40 AM26C31CDSOIC (D) AM26C31C0 ° C to 70 ° C Reel of 2500 AM26C31CDRSOP (NS) Reel of 2000 AM26C31CNSR 26C31SSOP (DB) Reel of 2000 AM26C31CDBR 26C31PDIP (N) Tube of 25 AM26C31IN AM26C31INTube of 40 AM26C31IDSOIC (D) AM26C31IReel of 2500 AM26C31IDR– 40 ° C to 85 ° C
SOP (NS) Reel of 2000 AM26C31INSR 26C31ISSOP (DB) Reel of 2000 AM26C31IDBR 26C31ITSSOP (PW) Tube of 90 AM26C31IPW 26C31ITube of 40 AM26C31QD– 40 ° C to 125 ° C SOIC (D) AM26C31QDReel of 2500 AM26C31QDRCDIP (J) Tube of 25 AM26C31MJ AM26C31MJ– 55 ° C to 125 ° C CFP (W) Tube of 150 AM26C31MW AM26C31MWLCCC (FK) Tube of 55 AM26C31MFK AM26C31MFK
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .
FUNCTION TABLE(Each Driver)
(1)
INPUT ENABLES OUTPUTSA
G G Y Z
H H X H LL H X L HH X L H LL X L L HX L H Z Z
(1) H = High level, L = Low level, X = Irrelevant,Z = High impedance (off)
2Submit Documentation Feedback Copyright © 1990 – 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26C31
1A
G
2A
4A
G
3A
1
4
7
9
12
15
3Y
10
3Z
11
1Y
2
1Z
3
4Y
14
4Z
13
2Y
6
2Z
5
Input
VCC
TYPICAL OF ALL OUTPUTS
Output
VCC
GND GND
EQUIVALENT OF EACH INPUT
AM26C31
www.ti.com
................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008
LOGIC DIAGRAM (POSITIVE LOGIC)
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
SCHEMATICS OF INPUTS AND OUTPUTS
Copyright © 1990 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): AM26C31
ABSOLUTE MAXIMUM RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
AM26C31
SLLS103M – DECEMBER 1990 – REVISED JUNE 2008 ...................................................................................................................................................
www.ti.com
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range
(2)
– 0.5 7 VV
I
Input voltage range – 0.5 V
CC
+ 0.5 VV
ID
Differential input voltage range – 14 14 VV
O
Output voltage range – 0.5 7I
IK
Input or output clamp current ± 20 mAI
OK
I
O
Output current ± 150 mAV
CC
current 200 mAGND current – 200 mAD package 73DB package 82θ
JA
Package thermal impedance
(3) (4)
N package 67 ° C/WNS package 64PW package 108T
J
Operating virtual junction temperature 150 ° CT
stg
Storage temperature range – 65 150 ° C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operatingconditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values, except differential voltages, are with respect to the network ground terminal.(3) Maximum power dissipation is a function of T
J(max
), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J(max)
– T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 ° C can affect reliability.(4) The package thermal impedance is calculated in accordance with JESD 51-7.
MIN NOM MAX UNIT
V
CC
Supply voltage 4.5 5 5.5 VV
ID
Differential input voltage ± 7 VV
IH
High-level input voltage 2 VV
IL
Low-level input voltage 0.8 VI
OH
High-level output current – 20 µAI
OL
Low-level output current 20 mAAM26C31C 0 70AM26C31I – 40 85T
A
Operating free-air temperature ° CAM26C31Q – 40 125AM26C31M – 55 125
4Submit Documentation Feedback Copyright © 1990 – 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26C31
ELECTRICAL CHARACTERISTICS
SWITCHING CHARACTERISTICS
AM26C31
www.ti.com
................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
AM26C31C
AM26C31IPARAMETER TEST CONDITIONS UNITMIN TYP
(1)
MAX
V
OH
High-level output voltage I
O
= – 20 mA 2.4 3.4 VV
OL
Low-level output voltage I
O
= 20 mA 0.2 0.4 VV
OD
Differential output voltage magnitude R
L
= 100 Ω, See Figure 1 2 3.1 V
Δ|V
OD
| Change in magnitude of differential output voltage
(2)
R
L
= 100 Ω, See Figure 1 ± 0.4 VV
OC
Common-mode output voltage R
L
= 100 Ω, See Figure 1 3 V
Δ|V
OC
| Change in magnitude of common-mode output voltage
(2)
R
L
= 100 Ω, See Figure 1 ± 0.4 VI
I
Input current V
I
= V
CC
or GND ± 1 µAV
O
= 6 V 100I
O(off)
Driver output current with power off V
CC
= 0 µAV
O
= – 0.25 V – 100I
OS
Driver output short-circuit current V
O
= 0 – 30 – 150 mAV
O
= 2.5 V 20I
OZ
High-impedance off-state output current µAV
O
= 0.5 V – 20V
I
= 0 or 5 V 100 µAI
CC
Quiescent supply current I
O
= 0
V
I
= 2.4 V or 0.5
1.5 3 mAV
(3)
C
i
Input capacitance 6 pF
(1) All typical values are at V
CC
= 5 V and T
A
= 25 ° C.(2) Δ|V
OD
| and Δ|V
OC
| are the changes in magnitude of V
OD
and V
OC
, respectively, that occur when the input is changed from a high levelto a low level.(3) This parameter is measured per input. All other inputs are at 0 or 5 V.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
AM26C31C
AM26C31IPARAMETER TEST CONDITIONS UNITMIN TYP
(1)
MAX
t
PLH
Propagation delay time, low-to-high-level output 3 7 12S1 is open, See Figure 2 nst
PHL
Propagation delay time, high-to-low-level output 3 7 12t
sk(p)
Pulse skew time (|t
PLH
– t
PHL
|) S1 is open, See Figure 2 0.5 4 nst
r(OD)
, t
f(OD)
Differential output rise and fall times S1 is open, See Figure 3 5 10 nst
PZH
Output enable time to high level 10 19S1 is closed, See Figure 4 nst
PZL
Output enable time to low level 10 19t
PHZ
Output disable time from high level 7 16S1 is closed, See Figure 4 nst
PLZ
Output disable time from low level 7 16C
pd
Power dissipation capacitance (each driver)
(2)
S1 is open, See Figure 2 170 pF
(1) All typical values are at V
CC
= 5 V and T
A
= 25 ° C.(2) C
pd
is used to estimate the switching losses according to P
D
= C
pd
× V
CC
2
× f, where f is the switching frequency.
Copyright © 1990 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): AM26C31
ELECTRICAL CHARACTERISTICS
SWITCHING CHARACTERISTICS
AM26C31
SLLS103M – DECEMBER 1990 – REVISED JUNE 2008 ...................................................................................................................................................
www.ti.com
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
AM26C31Q
AM26C31MPARAMETER TEST CONDITIONS UNITMIN TYP
(1)
MAX
V
OH
High-level output voltage I
O
= – 20 mA 2.2 3.4 VV
OL
Low-level output voltage I
O
= 20 mA 0.2 0.4 VV
OD
Differential output voltage magnitude R
L
= 100 Ω, See Figure 1 2 3.1 V
Δ|V
OD
| Change in magnitude of differential output voltage
(2)
R
L
= 100 Ω, See Figure 1 ± 0.4 VV
OC
Common-mode output voltage R
L
= 100 Ω, See Figure 1 3 V
Δ|V
OC
| Change in magnitude of common-mode output voltage
(2)
R
L
= 100 Ω, See Figure 1 ± 0.4 VI
I
Input current V
I
= V
CC
or GND ± 1 µAV
O
= 6 V 100I
O(off)
Driver output current with power off V
CC
= 0 µAV
O
= – 0.25 V – 100I
OS
Driver output short-circuit current V
O
= 0 – 170 mAV
O
= 2.5 V 20I
OZ
High-impedance off-state output current µAV
O
= 0.5 V – 20V
I
= 0 or 5 V 100 µAI
CC
Quiescent supply current I
O
= 0
V
I
= 2.4 V or 0.5
3.2 mAV
(3)
C
i
Input capacitance 6 pF
(1) All typical values are at V
CC
= 5 V and T
A
= 25 ° C.(2) Δ|V
OD
| and Δ|V
OC
| are the changes in magnitude of V
OD
and V
OC
, respectively, that occur when the input is changed from a high levelto a low level.(3) This parameter is measured per input. All other inputs are at 0 or 5 V.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
AM26C31Q
AM26C31MPARAMETER TEST CONDITIONS UNITMIN TYP
(1)
MAX
t
PLH
Propagation delay time, low-to-high-level output 7 12S1 is open, See Figure 2 nst
PHL
Propagation delay time, high-to-low-level output 6.5 12t
sk(p)
Pulse skew time (|t
PLH
– t
PHL
|) S1 is open, See Figure 2 0.5 4 nst
r(OD)
, t
f(OD)
Differential output rise and fall times S1 is open, See Figure 3 5 12 nst
PZH
Output enable time to high level 10 19S1 is closed, See Figure 4 nst
PZL
Output enable time to low level 10 19t
PHZ
Output disable time from high level 7 16S1 is closed, See Figure 4 nst
PLZ
Output disable time from low level 7 16C
pd
Power dissipation capacitance (each driver)
(2)
S1 is open, See Figure 2 100 pF
(1) All typical values are at V
CC
= 5 V and T
A
= 25 ° C.(2) C
pd
is used to estimate the switching losses according to P
D
= C
pd
× V
CC
2
× f, where f is the switching frequency.
6Submit Documentation Feedback Copyright © 1990 – 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26C31
PARAMETER MEASUREMENT INFORMATION
Input A
(see Note B)
Output Y
1.3 V
50%
tsk(p)
Output Z
tPHL tPLH
tsk(p)
tPLH tPHL
C3 = 40 pF
C2 = 40 pF
C1 =
40 pF
Input
See Note A
TEST CIRCUIT
RL/2
RL/2
1.5 V
500 Ω
S1
1.3 V
1.3 V
3 V
0 V
50%
50%
50%
AM26C31
www.ti.com
................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008
Figure 1. Differential and Common-Mode Output Voltages
A. C1, C2, and C3 include probe and jig capacitance.B. All input pulses are supplied by generators having the following characteristics: PRR ≤1 MHz, duty cycle ≤50%, andt
r
, t
f
≤6 ns.
Figure 2. Propagation Delay Time and Skew Waveforms and Test Circuit
Copyright © 1990 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): AM26C31
AM26C31
SLLS103M – DECEMBER 1990 – REVISED JUNE 2008 ...................................................................................................................................................
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
A. C1, C2, and C3 include probe and jig capacitance.B. All input pulses are supplied by generators having the following characteristics: PRR ≤1 MHz, duty cycle ≤50%, andt
r
, t
f
≤6 ns.
Figure 3. Differential-Output Rise- and Fall-Time Waveforms and Test Circuit
8Submit Documentation Feedback Copyright © 1990 – 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26C31
Enable G Input
(see Note C)
Output WIth
0 V to A Input VOL + 0.3 V
tPLZ
tPHZ tPZH
tPZL
C3 =
40 pF
C2 =
40 pF
C1 =
40 pF
Input A
50 Ω
50 Ω
500 Ω
TEST CIRCUIT
VOLTAGE WAVEFORMS
3 V
0 V
1.5 V
VOL
VOH
VOH - 0.3 V
1.5 V
See Note A
G
G
Enable G Input
Output
Output
Output WIth
3 V to A Input
Enable Inputs
(see Note B)
0 V
3 V 1.5 V
S1
1.3 V1.3 V
2 V
0.8 V
AM26C31
www.ti.com
................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008
PARAMETER MEASUREMENT INFORMATION (continued)
A. C1, C2, and C3 include probe and jig capacitance.B. All input pulses are supplied by generators having the following characteristics: PRR ≤1 MHz, duty cycle ≤50%, andt
r
, t
f
≤6 ns.C. Each enable is tested separately.
Figure 4. Output Enable- and Disable-Time Waveforms and Test Circuit
Copyright © 1990 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): AM26C31
TYPICAL CHARACTERISTICS
AM26C31
SLLS103M – DECEMBER 1990 – REVISED JUNE 2008 ...................................................................................................................................................
www.ti.com
SUPPLY CURRENT
vsSWITCHING FREQUENCY
Figure 5.
10 Submit Documentation Feedback Copyright © 1990 – 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26C31
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
AM26C31CD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31CDBLE OBSOLETE SSOP DB 16 TBD Call TI Call TI
AM26C31CDBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31CDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31CDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31CDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31CDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31CDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31CN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
AM26C31CNE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
AM26C31CNSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31CNSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31CNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31ID ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IDBLE OBSOLETE SSOP DB 16 TBD Call TI Call TI
AM26C31IDBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IN ACTIVE PDIP N 16 25 Pb-Free CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
(RoHS)
AM26C31INE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
AM26C31INSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31INSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IPW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31IPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31QD ACTIVE SOIC D 16 40 TBD CU NIPDAU Level-1-220C-UNLIM
AM26C31QDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C31QDR ACTIVE SOIC D 16 2500 TBD CU NIPDAU Level-1-220C-UNLIM
AM26C31QDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF AM26C31 :
•Enhanced Product: AM26C31-EP
•Military: AM26C31M
NOTE: Qualified Version Definitions:
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
•Military - QML certified for Military and Defense Applications
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
AM26C31CDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
AM26C31CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26C31CNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
AM26C31IDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
AM26C31IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26C31INSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
AM26C31IPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Apr-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
AM26C31CDBR SSOP DB 16 2000 346.0 346.0 33.0
AM26C31CDR SOIC D 16 2500 333.2 345.9 28.6
AM26C31CNSR SO NS 16 2000 346.0 346.0 33.0
AM26C31IDBR SSOP DB 16 2000 346.0 346.0 33.0
AM26C31IDR SOIC D 16 2500 333.2 345.9 28.6
AM26C31INSR SO NS 16 2000 346.0 346.0 33.0
AM26C31IPWR TSSOP PW 16 2000 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Apr-2008
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDLP® Products www.dlp.com Broadband www.ti.com/broadbandDSP dsp.ti.com Digital Control www.ti.com/digitalcontrolClocks and Timers www.ti.com/clocks Medical www.ti.com/medicalInterface interface.ti.com Military www.ti.com/militaryLogic logic.ti.com Optical Networking www.ti.com/opticalnetworkPower Mgmt power.ti.com Security www.ti.com/securityMicrocontrollers microcontroller.ti.com Telephony www.ti.com/telephonyRFID www.ti-rfid.com Video & Imaging www.ti.com/videoRF/IF and ZigBee® Solutions www.ti.com/lprf Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2009, Texas Instruments Incorporated
