BB804... Silicon Variable Capacitance Diode * For FM tuners * Monolithic chip with common cathode for perfect tracking of both diodes * Uniform "square law" characteristics * Ideal HiFi tuning device when used in low-distortion, back-to-back configuration * Pb-free (ROHS compliant) package BB804 ! , , Type BB804 Package SOT23 Configuration common cathode LS(nH) 1.8 Marking SF1/2/3* *For differences see next page Capacitance groups Maximum Ratings at T A = 25C, unless otherwise specified Parameter Symbol Diode reverse voltage VR 18 Peak reverse voltage VRM 20 Forward current IF 50 mA Operating temperature range Top -55 ... 125 C Storage temperature Tstg -55 ... 150 1 Value Unit V 2011-06-15 BB804... Electrical Characteristics at T A = 25C, unless otherwise specified Symbol Parameter Values min. typ. Unit max. DC Characteristics Reverse current IR nA VR = 16 V - - 20 VR = 16 V, TA = 65 C - - 200 42 - 47.5 1.65 1.71 - rS - 0.18 - Q - 200 - TCC - 330 - AC Characteristics Diode capacitance1) CT pF VR = 2 V, f = 1 MHz Capacitance ratio CT2 /CT8 VR = 2 V, VR = 8 V, f = 1 MHz Series resistance VR = 2 V, f = 100 MHz Figure of merit f = 100 MHz, VR = 2 V Temperature coefficient of diode capacitance ppm/K VR = 2 V, f = 1 MHz 1 Capacitance groups at 2V , coded 1; 2 ; 3 CT /groups 1 2 3 C2V min 43pF 44pF 45pF C2V max 44.5pF 45.5pF 46.5pF The capacitance subgroup is marked by the subgroup number printed on the component and the package label. A packing unit (e.g. 8mm tape) contain diodes of one subgroup only. Delivery of different capacitance subgroups requires a special agreement. 2 2011-06-15 BB804... Diode capacitance CT = (VR ) Capacitance ratio CTref/CT = (VR) f = 1MHz f = 1MHz CT EHD07050 80 pF 70 EHD07051 3 C T1V CT C T ref CT 60 C T2V CT 2 50 40 30 1 20 10 0 10 -1 10 0 10 1 V VR 0 10 2 0 5 10 15 V 20 VR Temperatur coefficient TCC = (VR ) EHD07052 10 -3 TC C 1 K 10 -4 10 -5 10 -1 100 101 V 10 2 VR 3 2011-06-15 Package SOT23 BB804... 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 0.1 1 2.4 0.15 3 0.1 MAX. 10 MAX. B 1 0.1 10 MAX. 2.9 0.1 0.15 MIN. Package Outline A 5 0...8 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 4 2011-06-15 BB804... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 5 2011-06-15