- 1 - E05X02-PS
This IC is ESD sensitive device. Special handling precautions are required.
The actual ESD test data will be available later.
S
ony reserves the right to change products and speci
f
ications without prior notice. This in
f
ormation does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
CXG1194XR
SP4T Antenna Switch for GSM/UMTS
Description
The CXG1194XR is a high power SP4T antenna switch for GSM/UMTS applications . The low insertion loss on
transmit means incre ased talk time as the Tx power ampli fier can be op erated at a lower output l evel. On chip
logic reduces component count and simplifies the PCB layout by allowing direct connection of the switch to
digital baseband control lines with CMOS logic levels. This switch is SP4T, one antenna can be routed to either
of the 2Tx or 2Rx ports. It requires 2 CMOS control li nes. The Sony GaAs JP HEMT MMIC process is used f or
low insertion loss.
(Applications: GSM dual-band handsets, GSM/UMTS dual-mode handsets)
Features
Insertion loss (Tx) : 0.35dB (Typ.) at 34dBm (GSM900)
0.45dB (Typ.) at 32dBm (GSM1800)
Package
Small and Low height package size: 14-pin XQFN (2.5mm × 2.5mm × 0.35mm (Typ.))
Structure
GaAs JPHEMT MMIC
CXG1194XR
- 2 -
Absolute Maximum Ratings
(Ta = 25°C)
・Copper-clad lamination of glass board (4 layers) : 30mm square, t = 0.8mm, FR-4.
Note) Use this product without exceeding the PD value specified in this specification.
If it is used with exceeding the PD value even for a moment, the heat generated by the operation may
cause the degradation or breakdown of the product.
Block Diagram
Pin Configuration
Truth Table
Bias Voltage VDD 7V
Control Voltage Vctl 5 V
Input power max. [ANT, RF1, RF4] 35 dBm (Duty cycle = 12.5 to 50%)
Input power max. [RF2, RF3] 13 dBm
Operating temperature Topr –35 to +85 °C
Maximum power dissipation PD 500 mW
ANT RF1 (Tx)
RF4 (Tx)
F4
RF3 (Rx)
F3 F7
F8
RF2 (Rx)
F2
F1 F5
F6
11 12 13 14
7 6 5 4
3
2
1
RF1
GND
ANT
GND
RF3
GND
RF4
GND
VDD
CTLA
CTLB
8
9
10
GND
RF2
GND
ON Path CTLA CTLB F1 F2 F3 F4 F5 F6 F7 F8
ANT – RF1 L L ON OFF OFF OFF OFF ON ON ON
ANT – RF2 H L OFF ON OFF OFF ON OFF ON ON
ANT – RF3 L H OFF OFF ON OFF ON ON OFF ON
ANT – RF4 H H OFF OFF OFF ON ON ON ON OFF
CXG1194XR
- 3 -
Elec trical Charac teristics
(Ta = 25°C)
Note) Electrical Characteristics are measured with all RF ports terminated in 50Ω.
*1 Harmonics measured with Tx inputs harmonically matched. The use of harmonic matching is recommended
to ensure optimum performance.
*2 Power incident on Tx, Pin = 34dBm, 824 to 915MHz, VDD = 2.8V, RF1 or RF4 enabled
*3 Power incident on Tx, Pin = 32dBm, 1710 to 1910MHz, VDD = 2.8V, RF1 or RF4 enabled
Item Symbol Port Condition Min. Typ. Max. Unit
Insertion loss IL
ANT – RF1 824 to 960MHz 0.35 0.50 dB
1710 to 1990MHz 0.45 0.65 dB
ANT – RF2 824 to 960MHz 0.45 0.60 dB
1710 to 1990MHz 0.55 0.70 dB
ANT – RF3 824 to 960MHz 0.45 0.60 dB
1710 to 1990MHz 0.55 0.70 dB
ANT – RF4 824 to 960MHz 0.35 0.50 dB
1710 to 1990MHz 0.45 0.65 dB
Isolation ISO.
ANT – RF1 824 to 960MHz 25 30 dB
1710 to 1990MHz 22 26 dB
ANT – RF2 824 to 960MHz 30 35 dB
1710 to 1990MHz 25 30 dB
ANT – RF3 824 to 960MHz 30 35 dB
1710 to 1990MHz 25 30 dB
ANT – RF4 824 to 960MHz 30 35 dB
1710 to 1990MHz 25 30 dB
VSWR VSWR 824 to 960MHz 1.2 —
1710 to 1990MHz 1.2 —
Harmonics*1
2fo
ANT – RF1
*2 –33 –28 dBm
3fo –34 –28 dBm
2fo *3 –35 –30 dBm
3fo –37 –33 dBm
2fo
ANT – RF4
*2 –34 –30 dBm
3fo –35 –30 dBm
2fo *3 –35 –30 dBm
3fo –38 –34 dBm
P1dB compression
input power P1dB ANT – RF1, 4 *2 35 dBm
ANT – RF1, 4 *3 33 dBm
Control current Ictl Vctl = 2.8V 15 40 µA
Supply current IDD VDD = 2.8V 0.12 0.23 mA
CXG1194XR
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DC Bias Condition
(Ta = 25°C)
Item Min. Typ. Max. Unit
Vctl (H) 2.0 2.8 3.6 V
Vctl (L) 0 — 0.4 V
VDD 2.6 2.8 3.6 V
CXG1194XR
- 5 -
Reco mmended Circuit
11 12 13 14
7654
3
2
1
RF1 ANT
GNDGND
RF3
VDD
Cbypass
CTLA
Cbypass
CTLB
Cbypass
8
9
10
RF2
CRF
CRF CRF
CRF
RF4
CRF
GND
GND
GND GND
When using this IC, the following external components should be used:
CRF: This capacitor is used for RF decoupling and must be used for all applications.
Cbypass: This capacitor is used for DC line filtering. 100pF is recommended.
CXG1194XR
- 6 - Sony Corporation
Package Outline
(Unit: mm)
SONY CODE
EIAJ CODE
JEDEC CODE
XQFN-14P-01
14PIN XQFN (PLASTIC)
TERMINAL SECTION
Note:Cutting burr of lead are 0.05mm MAX.
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
PACKAGE STRUCTURE
PACKAGE MASS
C
S
S
3
AB
C
SA-B
M
S
PIN 1 INDEX
10
11
14
1
4
7
8
0.35 ± 0.05 0.4 ± 0.1
8-C0.1
0.24
0.5
0.05
0.05
0.24 +0.09
-0.03
MAX 0.02
Solder Plating
0.01g
2.5
2.5
C
A-B
S
x4
0.05
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL COPPER ALLOY
SOLDER COMPOSITION Sn-Bi Bi:1-4wt%
PLATING THICKNESS 5-18µm
SPEC.
