1. General description
The 74HC257; 74HCT 257 are hig h- speed Si-g ate CMOS d evices and ar e pin co mpatible
with Low-power Schottky TTL (LSTTL).
The 74HC257 and 74 HCT257 have four identical 2-input multiplexers with 3-state outputs,
which select 4 bits of data from two sources and are controlled by a common data select
input (S).
The data input s from source 0 (1 I0 to 4I0) are selected when input S is LOW an d the dat a
inputs fr om source 1 (1I1 to 4I1) are selected when S is HIGH. Data appears at the
outputs (1Y to 4Y) in tr ue (non-inverting) form from the selected inputs.
The 74HC257 and 7 4HCT257 are the logic implemen tation of a 4-pole, 2-position switch,
where the position of the switch is determined by the logic levels applied to S. The output s
are forced to a high-impedance OFF-state when OE is HIGH.
The logic equations for the outputs are :
Except for their non-inverting (true) outputs the 74HC257; 74HCT257 are identical to the
74HC258.
2. Features and benefits
Non-inverting data path
3-state outp uts interface directly with system bus
Complies with JEDEC standard no. 7A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from 40 Cto+85C and from 40 Cto+125C
74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
Rev. 6 — 26 January 2015 Product data sheet
1Y OE 1I1 S1I0S=
2Y OE 2I1 S2I0S=
3Y OE 3I1 S3I0S=
4Y OE 4I1 S4I0S=
74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 2 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
3. Ordering information
4. Functional diagram
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74HC257N 40 C to +125 C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4
74HCT257N
74HC257D 40 C to +125 C SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
74HCT257D
74HC257DB 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads;
body width 5.3 mm SOT338-1
74HCT257DB
74HC257PW 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm SOT403-1
74HCT257PW
Fig 1. Logic symbol Fig 2. IEC logic symbol
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74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 3 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
Fig 3. Functional diag ram
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74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 4 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
5. Pinning information
5.1 Pinning
5.2 Pin description
6. Functional description
6.1 Function table
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
Fig 5. Pin configuration DIP16, SO16, SSOP16 and TSSOP16
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Table 2. Pin description
Symbol Pin Description
S 1 common data select input
1I0 to 4I0 2, 5, 11, 14 data input from source 0
1I1 to 4I1 3, 6, 10, 13 data input from source 1
1Y to 4Y 4, 7, 9, 12 3-state multiplexer output
GND 8 ground (0 V)
OE 15 3-state output enable input (active LOW)
VCC 16 supply voltage
Table 3. Function table[1]
Control Input Output
OE Snl0 nl1 nY
HXXXZ
LHXLL
LHXHH
LLLXL
LLHXH
74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 5 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
7. Limiting values
[1] For DIP16 packages: above 70 C, Ptot derates linearly with 12 mW/K.
[2] For SO16 packages: above 70 C, Ptot derates linearly with 8 mW/K.
[3] For SSOP16 and TSSOP16 packages: above 60 C, Ptot derates linearly with 5.5 mW/K.
8. Recommended operating conditions
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +7 V
IIK input clamping current VI < 0.5 V or
VI>V
CC + 0.5 V -20 mA
IOK output clamping current VO<0.5 V or
VO>V
CC +0.5V -20 mA
IOoutput current VO = 0.5 V to VCC +0.5V - 35 mA
ICC supply current - +70 mA
IGND ground current - 70 mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation DIP16 package [1] - 750 mW
SO16 package [2] - 500 mW
SSOP16 package [3] - 500 mW
TSSOP16 package [3] - 500 mW
Table 5. Recommended operating con ditions
Symbol Parameter Conditions Min Typ Max Unit
74HC257
VCC supply voltage 2.0 5.0 6.0 V
VIinput voltage 0 - VCC V
VOoutput voltage 0 - VCC V
t/V input transition rise and
fall rates VCC = 2.0 V - - 625 ns
VCC = 4.5 V - 1.67 139 ns
VCC = 6.0 V - - 83 ns
Tamb ambient temperature 40 - +125 C
74HCT257
VCC supply voltage 4.5 5.0 5.5 V
VIinput voltage 0 - VCC V
VOoutput voltage 0 - VCC V
t/V input transition rise and
fall rates VCC = 4.5 V - 1.67 139 ns
Tamb ambient temperature 40 - +125 C
74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 6 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
9. Static characteristics
Table 6. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 C40 C to
+85 C40 C to
+125 CUnit
Min Typ Max Min Max Min Max
74HC257
VIH HIGH-level
input voltage VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V
VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V
VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V
VIL LOW-level
input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V
VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V
VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL
IO=20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V
IO=20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V
IO=20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V
IO=6.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V
IO=7.8 m A; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V
VOL LOW-level
output voltage VI=V
IH or VIL
IO=20A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V
IO=20A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO=20A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V
IO= 6.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V
IO= 7.8 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V
IIinput leakage curren t VI=V
CC or GND; VCC =6.0V - - 0.1 - 1.0 1.0 1.0 A
IOZ OFF-state
output current VI=V
IH or VIL;
VO=V
CC or GND;
VCC =6.0V
--0.5 - 5.0 10.0 10.0 A
ICC supply current VI=V
CC or GND; IO=0A;
VCC =6.0V - - 8.0 - 80 160 160 A
Ciinput capacitance - 3.5 - pF
74HCT257
VIH HIGH-level
input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V
VIL LOW-level
input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL; VCC =4.5V
IO=20 A 4.4 4.5 - 4.4 - 4.4 - V
IO=6 mA 3.98 4.32 - 3.84 - 3.7 - V
VOL LOW-level
output voltage VI=V
IH or VIL; VCC =4.5V - 0.1 - 0.1
IO=20A-00.1-0.33-0.4V
IO= 6.0 mA - 0.15 0.26 - 1.0 - 1.0 V
IIinput leakage curren t VI=V
CC or GND; VCC =5.5V - - 0.1 - 5.0 - 10 A
74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 7 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
10. Dynamic characteristics
IOZ OFF-state
output current VI=V
IH or VIL; VCC =5.5V;
VO=V
CC or GND per input
pin; other inputs at VCC or
GND; IO=0A
--0.5 - 80 - 160 A
ICC supply current VI=V
CC or GND; IO=0A;
VCC =5.5V --8.0 A
ICC additional supply
current VI=V
CC 2.1 V ;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V; IO=0A
per input pin; nI0, nI1 inputs - 40 144 - 180 - 196 A
per input pin; OE input - 135 486 - 608 - 662 A
per input pin; S input - 70 252 - 315 - 343 A
CIinput capacitance - 3.5 - pF
Table 6. Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 C40 C to
+85 C40 C to
+125 CUnit
Min Typ Max Min Max Min Max
Table 7. Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8.
Symbol Parameter Conditions 25 C 40 C to
+85 C40 C to
+125 CUnit
Typ Max Max Max
74HC257
tpd propagation delay nl0 to nYor nl1 to nY;
see Figure 6 [1]
VCC = 2.0 V 36 110 140 165 ns
VCC = 4.5 V 13 22 28 33 ns
VCC = 5.0 V; CL = 15 pF 11 - - - ns
VCC = 6.0 V 10 19 24 28 ns
StonY; see Figure 6
VCC = 2.0 V 47 150 190 225 ns
VCC = 4.5 V 17 30 38 45 ns
VCC = 5.0 V; CL = 15 pF 14 - - - ns
VCC = 6.0 V 14 26 33 38 ns
ten enable time OE to nY; see Figure 7 [2]
VCC = 2.0 V 33 150 190 225 ns
VCC = 4.5 V 12 30 38 45 ns
VCC = 6.0 V 10 26 33 38 ns
tdis disable time OE to n Y; see Figure 7 [3]
VCC = 2.0 V 41 150 190 225 ns
VCC = 4.5 V 15 30 38 45 ns
VCC = 6.0 V 12 26 33 38 ns
74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 8 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
[1] tpd is the same as tPHL, tPLH.
[2] ten is the same as tPZH, tPZL.
[3] tdis is the same as tPHZ, tPLZ.
[4] tt is the same as tTHL, tTLH.
[5] CPD is used to determine the dynamic power dissipation (PD in W).
PD=C
PD VCC2fiN+(CLVCC2fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CLVCC2 fo) = sum of outputs.
tttransition time see Figure 6 [4]
VCC = 2.0 V 14 60 75 90 ns
VCC = 4.5 V 5 12 15 18 ns
VCC = 6.0 V 4 10 13 15 ns
CPD power dissipation
capacitance per multiplexer;
VI=GNDtoV
CC
[5] 45 - pF
74HCT257
tpd propagation delay nl0 to nYor nl1 to nY;
see Figure 6 [1]
VCC = 4.5 V 16 30 38 45 ns
VCC = 5.0 V; CL = 15 pF 13 - - ns
S to nY; see Figure 6
VCC = 4.5 V 20 35 44 53 ns
VCC = 5.0 V; CL = 15 pF 17 - ns
ten enable time OE to nY; VCC = 4.5 V;
see Figure 7 [2] 15 30 38 45 ns
tdis disable time OE to n Y; VCC = 4.5 V;
see Figure 7 [3] 16 30 38 45 ns
tttransition time V CC = 4.5 V ; see Figure 6 [4] 512 15 18ns
CPD power dissipation
capacitance per multiplexer;
VI=GNDtoV
CC 1.5 V [5] 45 - pF
Table 7. Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8.
Symbol Parameter Conditions 25 C 40 C to
+85 C40 C to
+125 CUnit
Typ Max Max Max
74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 9 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
11. Waveforms
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6. Propagation delays input (S, nI0, nI1) to output (nY) and output (nY) transition times
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VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7. 3-state output enable and disable times
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Type Input Output
VMVM
74HC257 0.5VCC 0.5VCC
74HCT257 1.3 V 1.3 V
74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 10 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
Measurement points are given in Table 8 and test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistor.
Fig 8. Test circuit for measuring switching times
Table 9. Test data
Type Input Load Switch position
VItr, tfCLRLtPHL, tPLH tPZH, tPHZ tPZL, tPLZ
74HC257 VCC 6 ns 50 pF 1 kopen GND VCC
74HCT257 3 V 6 ns 50 pF 1 kopen GND VCC
74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 11 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
12. Package outline
Fig 9. Package outline SOT38-4 (DIP16)
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74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 12 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
Fig 10. Package outline SOT109-1 (SO16)
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74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 13 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
Fig 11. Package outline SOT338-1 (SSOP16)
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74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 14 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
Fig 12. Package outline SOT403-1 (TSSOP16)
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74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 15 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
13. Abbreviations
14. Revision history
Table 10. Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74HC_HCT257 v.6 20150126 Product data sheet - 74HC_HCT257 v.5
Modifications: •Table 7: Power dissipation capacitance condition for 74HCT257 is corrected.
74HC_HCT257 v.5 20100113 Product data sheet - 74HC_HCT257 v.4
Modifications: •Table 7: changed 3OE to OE
74HC_HCT257 v.4 20090608 Product data sheet - 74HC_HCT257 v.3
74HC_HCT257 v.3 20050920 Product data sheet - 74HC_HCT257_CNV v.2
74HC_HCT257_CNV v.2 19980930 Product specification - -
74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 16 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
15. Legal information
15.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semicond uctors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre va il.
Product specificatio n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warrant ies, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulat ive liability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors product s are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for t he customer’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Custo mers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party custo mer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or inte llectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 26 January 2015 17 of 18
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It i s neit her qualif ied nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standards, custome r
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such au tomotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y
liability, damages or failed product claims resulting from custome r design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respective ow ners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors 74HC257; 74HCT257
Quad 2-input multiplexer; 3-state
© NXP Semiconductors N.V. 2015. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 26 January 2015
Document identifier: 74HC_HCT257
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
17. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Functional description . . . . . . . . . . . . . . . . . . . 4
6.1 Function table. . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Recommended operating conditions. . . . . . . . 5
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16 Contact information. . . . . . . . . . . . . . . . . . . . . 17
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18