ES3AB - ES3JB Taiwan Semiconductor 3A, 50V - 600V Surface Mount Super Fast Rectifier FEATURES KEY PARAMETERS Glass passivated junction chip Ideal for automated placement Low profile package Super fast recovery time for high efficiency Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC Halogen-free according to IEC 61249-2-21 APPLICATIONS PARAMETER VALUE UNIT IF(AV) 3 A VRRM 50 - 600 V IFSM 100 A TJ MAX 150 C Package DO-214AA (SMB) Configuration Single die Switching mode power supply (SMPS) Adapters Lighting application Converter MECHANICAL DATA Case: DO-214AA (SMB) Molding compound meets UL 94V-0 flammability rating Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Moisture sensitivity level: level 1,per J-STD-020 Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: As marked Weight: 0.11 g (approximately) DO-214AA (SMB) ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise noted) PARAMETER SYMBOL Marking code on the device ES ES ES ES ES ES ES ES 3AB 3BB 3CB 3DB 3FB 3GB 3HB 3JB ES ES ES ES ES ES ES ES 3AB 3BB 3CB 3DB 3FB 3GB 3HB 3JB UNIT Repetitive peak reverse voltage VRRM 50 100 150 200 300 400 500 600 V Reverse voltage, total rms value VR(RMS) 30 70 105 140 210 280 350 420 V Forward current Surge peak forward current, 8.3 ms single half sine-wave superimposed on rated load per diode Junction temperature IF(AV) 3 A IFSM 100 A TJ - 55 to +150 C Storage temperature TSTG - 55 to +150 C 1 Version:B1706 ES3AB - ES3JB Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL LIMIT UNIT Junction-to-lead thermal resistance RJL 24 C/W Junction-to-ambient thermal resistance RJA 84 C/W Junction-to-case thermal resistance RJC 26 C/W Thermal Performance Note: Units mounted on recommended PCB (10mm x 10mm Cu pad test board) ELECTRICAL SPECIFICATIONS (TA = 25C unless otherwise noted) PARAMETER Forward voltage per diode CONDITIONS (1) ES3AB ES3BB ES3CB ES3DB ES3FB ES3GB ES3HB ES3JB ES3AB ES3BB ES3CB ES3DB ES3FB ES3GB ES3HB ES3JB ES3AB ES3BB ES3CB ES3DB ES3FB ES3GB ES3HB ES3JB ES3AB ES3BB ES3CB ES3DB ES3FB ES3GB ES3HB ES3JB Reverse current @ rated VR per diode Junction capacitance Reverse recovery time (2) ES3AB ES3BB ES3CB ES3DB ES3FB ES3GB ES3HB ES3JB IF = 1.5A,TJ = 25C IF = 3.0A,TJ = 25C IF = 1.5A,TJ = 125C IF = 3.0A,TJ = 125C TJ = 25C SYMBOL 1 MHz, VR=4.0V IF=0.5A ,IR=1.0A IRR=0.25A MAX UNIT 0.80 0.92 V 0.90 1.04 V 1.11 1.30 V 0.86 1.00 V 0.98 1.13 V 1.24 1.45 V 0.66 0.75 V 0.73 0.85 V 0.85 0.98 V 0.73 0.84 V 0.83 0.95 V 0.99 1.13 V - 10 A - 100 A 46 - pF 41 - pF 34 - pF - 35 ns VF VF VF VF IR TJ = 125C TYP CJ trr Notes: 1. Pulse test with PW=0.3 ms 2. Pulse test with PW=30 ms 2 Version:B1706 ES3AB - ES3JB Taiwan Semiconductor ORDERING INFORMATION PART NO. PART NO. SUFFIX PACKING PACKING CODE CODE SUFFIX R5 ES3xB (Note 1, 2) H R4 G M4 PACKAGE PACKING SMB 850 / 7" Plastic reel SMB 3,000 / 13" Paper reel SMB 3,000 / 13" Plastic reel Notes: 1. "x" defines voltage from 50V (ES3AB) to 600V (ES3JB) 2. Whole series with green compound (halogen-free) EXAMPLE P/N EXAMPLE P/N PART NO. ES3JBHR5G ES3JB PART NO. PACKING PACKING CODE SUFFIX CODE SUFFIX H R5 G 3 DESCRIPTION AEC-Q101 qualified Green compound Version:B1706 ES3AB - ES3JB Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 1000 ES3AB - ES3DB 3 CAPACITANCE (pF) 2 1 100 10 Heat sink 10mm x 10mm Cu pad test board f=1.0MHz Vsig=50mVp-p 0 1 25 50 75 100 125 LEAD TEMPERATURE 150 1 Fig.4 Typical Forward Characteristics INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (A) 10.000 ES3AB - ES3DB TJ=125C 0.100 0.010 TJ=25C 0.001 10 20 30 40 50 60 70 100 REVERSE VOLTAGE (V) Fig.3 Typical Reverse Characteristics 1.000 10 (C) 80 90 100 10 ES3AB - ES3DB 10 TJ=125C 0.1 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) TJ=25C TJ=125C TJ=25C 10.01 Pulse width 0.001 0.3 0.1 0.4 100 UF1DLW 1 (A) AVERAGE FORWARD CURRENT (A) 4 0.4 0.6 0.5 0.6 0.8 0.7 Pulse width 300s 1% duty 0.8 0.9 cycle1 1.1 1.0 1.2 1.4 FORWARD VOLTAGE (V) 4 Version:B1706 1.2 ES3AB - ES3JB Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25C unless otherwise noted) Fig.5 Typical Junction Capacitance Fig.6 Typical Reverse Characteristics INSTANTANEOUS REVERSE CURRENT (A) 1000 AVERAGE FORWARD CURRENT (A) ES3FB - ES3GB 100 10 f=1.0MHz Vsig=50mVp-p 1 1 10 10.000 ES3FB - ES3GB TJ=125C 1.000 0.100 TJ=25C 0.010 0.001 10 100 20 30 40 50 60 70 80 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) REVERSE VOLTAGE (V) Fig.7 Typical Forward Characteristics INSTANTANEOUS FORWARD CURRENT (A) (A) 100 ES3FB - ES3GB 10 TJ=125C TJ=25C 1 Pulse width 300s 1% duty cycle 0.1 0.4 0.6 0.8 1.0 1.2 1.4 1.6 FORWARD VOLTAGE (V) 5 Version:B1706 ES3AB - ES3JB Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25C unless otherwise noted) Fig.8 Typical Junction Capacitance Fig.9 Typical Reverse Characteristics INSTANTANEOUS REVERSE CURRENT (A) 1000 CAPACITANCE (pF) ES3HB - ES3JB 100 10 f=1.0MHz Vsig=50mVp-p 1 1 10 10.000 ES3HB - ES3JB TJ=125C 1.000 0.100 TJ=25C 0.010 0.001 10 100 REVERSE VOLTAGE (V) 20 30 40 50 60 70 80 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 100 10 ES3HB - ES3JB UF1DLW 1 10 TJ=125C TJ=125C 0.1 TJ=25C (A) INSTANTANEOUS FORWARD CURRENT (A) Fig.10 Typical Forward Characteristics TJ=25C 1 0.01 Pulse width 0.001 0.1 0.3 0.4 0.4 0.6 0.5 0.8 1.0 0.6 1.2 0.7 1.4 Pulse width 300s 0.81% duty 0.9 cycle 1 1.1 1.6 1.8 2.0 1.2 2.2 FORWARD VOLTAGE (V) 6 Version:B1706 ES3AB - ES3JB Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AA (SMB) DIM. Unit (mm) Unit (inch) Min Max Min Max A 1.95 2.20 0.077 0.087 B 4.05 4.60 0.159 0.181 C 3.30 3.95 0.130 0.156 D 1.95 2.65 0.077 0.104 E 0.75 1.60 0.030 0.063 F 5.10 5.60 0.201 0.220 G 0.05 0.20 0.002 0.008 H 0.15 0.31 0.006 0.012 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 2.3 0.091 B 2.5 0.098 C 4.3 0.169 D 1.8 0.071 E 6.8 0.268 MARKING DIAGRAM P/N G YW F 7 = Marking Code = Green Compound = Date Code = Factory Code Version:B1706 ES3AB - ES3JB Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 8 Version:B1706