2011-2020 Microchip Technology Inc. DS40002166A-page 1
ATxmega128/64/32/16A4U
AV R ® XMEGA® Data Sheet
Introduction
The Microchip AVR® XMEGA® is a family of low power, high performance, and peripheral rich 8/16-bit
microcontrollers based on the AVR enhanced RISC architecture. By executing instructions in a single
clock cycle, the AVR XMEGA devices achieve CPU throughput approaching one million instructions per
second (MIPS) per megahertz, allowing the system designer to optimize power consumption versus
processing speed.
Features
• High-performance, low-power Microchip AVR® XMEGA® 8/16-bit Microcontroller
• Nonvolatile program and data memories
- 16K - 128KB of in-system self-programmable flash
- 4K - 8KB boot section
- 1K - 2KB EEPROM
- 2K - 8KB internal SRAM
• Peripheral Features
- Four-channel DMA controller
- Eight-channel event system
- Five 16-bit timer/counters
• Three timer/counters with 4 output compare or input capture channels
• Two timer/counters with 2 output compare or input capture channels
• High-resolution extensions on all timer/counters
• Advanced waveform extension (AWeX) on one timer/counter
- One USB device interface
• USB 2.0 full speed (12Mbps) and low speed (1.5Mbps) device compliant
• 32 Endpoints with full configuration flexibility
- Five USARTs with IrDA support for one USART
- Two Two-wire interfaces with dual address match (I2C and SMBus compatible)
- Two serial peripheral interfaces (SPIs)
- AES and DES crypto engine
- CRC-16 (CRC-CCITT) and CRC-32 (IEEE® 802.3) generator
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- 16-bit real time counter (RTC) with separate oscillator
- One twelve-channel, 12-bit, 2msps Analog to Digital Converter
- One two-channel, 12-bit, 1msps Digital to Analog Converter
- Two Analog Comparators with window compare function, and current sources
- External interrupts on all general purpose I/O pins
- Programmable watchdog timer with separate on-chip ultra low power oscillator
-QTouch
® library support
• Capacitive touch buttons, sliders and wheels
• Special microcontroller features
- Power-on reset and programmable brown-out detection
- Internal and external clock options with PLL and prescaler
- Programmable multilevel interrupt controller
- Five sleep modes
- Programming and debug interfaces
• PDI (program and debug interface)
• I/O and packages
- 34 Programmable I/O pins
-44 - lead TQFP
- 44 - pad VQFN
- 49 - ball VFBGA
• Operating voltage
- 1.6 – 3.6V
• Operating frequency
- 0 – 12MHz from 1.6V
- 0 – 32MHz from 2.7V
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Table of Contents
1 Ordering Information ............................................................................... 8
2 Pinout/Block Diagram ............................................................................ 10
3 Overview ................................................................................................. 12
3.1 Block Diagram ................................................................................................. 13
4 Resources ............................................................................................... 14
4.1 Recommended reading ................................................................................... 14
5 Capacitive touch sensing ...................................................................... 14
6 AVR CPU ................................................................................................. 15
6.1 Features .......................................................................................................... 15
6.2 Overview.......................................................................................................... 15
6.3 Architectural Overview..................................................................................... 15
6.4 ALU - Arithmetic Logic Unit ............................................................................. 16
6.5 Program Flow .................................................................................................. 17
6.6 Status Register ................................................................................................ 17
6.7 Stack and Stack Pointer .................................................................................. 17
6.8 Register File .................................................................................................... 18
7 Memories ................................................................................................ 19
7.1 Features .......................................................................................................... 19
7.2 Overview.......................................................................................................... 19
7.3 Flash Program Memory ................................................................................... 20
7.4 Fuses and Lock bits......................................................................................... 21
7.5 Data Memory ................................................................................................... 21
7.6 EEPROM ......................................................................................................... 22
7.7 I/O Memory...................................................................................................... 22
7.8 Data Memory and Bus Arbitration ................................................................... 23
7.9 Memory Timing................................................................................................ 23
7.10 Device ID and Revision ................................................................................... 23
7.11 I/O Memory Protection..................................................................................... 23
7.12 Flash and EEPROM Page Size....................................................................... 23
8 DMAC – Direct Memory Access Controller .......................................... 25
8.1 Features .......................................................................................................... 25
8.2 Overview.......................................................................................................... 25
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9 Event System .......................................................................................... 26
9.1 Features .......................................................................................................... 26
9.2 Overview.......................................................................................................... 26
10 System Clock and Clock options ......................................................... 27
10.1 Features .......................................................................................................... 27
10.2 Overview.......................................................................................................... 27
10.3 Clock Sources ................................................................................................. 28
11 Power Management and Sleep Modes ................................................. 30
11.1 Features .......................................................................................................... 30
11.2 Overview.......................................................................................................... 30
11.3 Sleep Modes.................................................................................................... 30
12 System Control and Reset .................................................................... 32
12.1 Features .......................................................................................................... 32
12.2 Overview.......................................................................................................... 32
12.3 Reset Sequence .............................................................................................. 32
12.4 Reset Sources ................................................................................................. 32
13 WDT – Watchdog Timer ......................................................................... 34
13.1 Features .......................................................................................................... 34
13.2 Overview.......................................................................................................... 34
14 Interrupts and Programmable Multilevel Interrupt Controller ........... 35
14.1 Features .......................................................................................................... 35
14.2 Overview.......................................................................................................... 35
14.3 Interrupt vectors............................................................................................... 35
15 I/O Ports .................................................................................................. 37
15.1 Features .......................................................................................................... 37
15.2 Overview.......................................................................................................... 37
15.3 Output Driver ................................................................................................... 37
15.4 Input sensing ................................................................................................... 40
15.5 Alternate Port Functions .................................................................................. 40
16 TC0/1 – 16-bit Timer/Counter Type 0 and 1 ......................................... 41
16.1 Features .......................................................................................................... 41
16.2 Overview.......................................................................................................... 41
17 TC2 - Timer/Counter Type 2 .................................................................. 43
17.1 Features .......................................................................................................... 43
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17.2 Overview.......................................................................................................... 43
18 AWeX – Advanced Waveform Extension ............................................. 44
18.1 Features .......................................................................................................... 44
18.2 Overview.......................................................................................................... 44
19 Hi-Res – High Resolution Extension .................................................... 45
19.1 Features .......................................................................................................... 45
19.2 Overview.......................................................................................................... 45
20 RTC – 16-bit Real-Time Counter ........................................................... 46
20.1 Features .......................................................................................................... 46
20.2 Overview.......................................................................................................... 46
21 USB – Universal Serial Bus Interface ................................................... 47
21.1 Features .......................................................................................................... 47
21.2 Overview.......................................................................................................... 47
22 TWI – Two-Wire Interface ...................................................................... 49
22.1 Features .......................................................................................................... 49
22.2 Overview.......................................................................................................... 49
23 SPI – Serial Peripheral Interface ........................................................... 50
23.1 Features .......................................................................................................... 50
23.2 Overview.......................................................................................................... 50
24 USART ..................................................................................................... 51
24.1 Features .......................................................................................................... 51
24.2 Overview.......................................................................................................... 51
25 IRCOM – IR Communication Module .................................................... 52
25.1 Features .......................................................................................................... 52
25.2 Overview.......................................................................................................... 52
26 AES and DES Crypto Engine ................................................................ 53
26.1 Features .......................................................................................................... 53
26.2 Overview.......................................................................................................... 53
27 CRC – Cyclic Redundancy Check Generator ...................................... 54
27.1 Features .......................................................................................................... 54
27.2 Overview.......................................................................................................... 54
28 ADC – 12-bit Analog to Digital Converter ............................................ 55
28.1 Features .......................................................................................................... 55
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28.2 Overview.......................................................................................................... 55
29 DAC – 12-bit Digital to Analog Converter ............................................ 57
29.1 Features .......................................................................................................... 57
29.2 Overview.......................................................................................................... 57
30 AC – Analog Comparator ...................................................................... 59
30.1 Features .......................................................................................................... 59
30.2 Overview.......................................................................................................... 59
31 Programming and Debugging ............................................................... 61
31.1 Features .......................................................................................................... 61
31.2 Overview.......................................................................................................... 61
32 Pinout and Pin Functions ...................................................................... 61
32.1 Alternate Pin Function Description .................................................................. 61
32.2 Alternate Pin Functions ................................................................................... 64
33 Peripheral Module Address Map .......................................................... 67
34 Instruction Set Summary ....................................................................... 69
35 Packaging information .......................................................................... 74
35.1 44A .................................................................................................................. 74
35.2 PW................................................................................................................... 76
35.3 44M1................................................................................................................ 79
35.4 49C2 ................................................................................................................ 82
36 Electrical Characteristics ...................................................................... 85
36.1 ATxmega16A4U .............................................................................................. 85
36.2 ATxmega32A4U ............................................................................................ 106
36.3 ATxmega64A4U ............................................................................................ 128
36.4 ATxmega128A4U .......................................................................................... 150
37 Typical Characteristics ........................................................................ 172
37.1 ATxmega16A4U ............................................................................................ 172
37.2 ATxmega32A4U ............................................................................................ 214
37.3 ATxmega64A4U ............................................................................................ 256
37.4 ATxmega128A4U .......................................................................................... 298
38 Errata ..................................................................................................... 340
39 Datasheet Revision History ................................................................. 341
39.1 Rev. A – 04/2020........................................................................................... 341
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39.2 8387H –09/2014 ............................................................................................ 341
39.3 8387G – 03/2014........................................................................................... 341
39.4 8387F – 01/2014 ........................................................................................... 342
39.5 8387E – 11/2013 ........................................................................................... 342
39.6 8387D – 02/2013 ........................................................................................... 342
39.7 8387C – 03/2012 ........................................................................................... 343
39.8 8387B – 12/2011 ........................................................................................... 343
39.9 8387A – 07/2011 ........................................................................................... 344
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1. Ordering Information
Notes: 1. This device can also be supplied in wafer form. Please contact your local Microchip sales office for detailed ordering information.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
3. For packaging information, see “Instruction Set Summary” on page 69.
4. Tape and Reel
Ordering code Flash (bytes) EEPROM (bytes) SRAM (bytes) Speed (MHz) Power supply Package (1)(2)(3) Temp.
ATxmega128A4U-AU 128K + 8K 2K 8K
32 1.6 - 3.6V
44A
-40C - 85C
ATxmega128A4U-AUR(4) 128K + 8K 2K 8K
ATxmega64A4U-AU 64K + 4K 2K 4K
ATxmega64A4U-AUR(4) 64K + 4K 2K 4K
ATxmega32A4U-AU 32K + 4K 1K 4K
ATxmega32A4U-AUR(4) 32K + 4K 1K 4K
ATxmega16A4U-AU 16K + 4K 1K 2K
ATxmega16A4U-AUR(4) 16K + 4K 1K 2K
ATxmega128A4U-MH 128K + 8K 2K 8K
PW
ATxmega128A4U-MHR(4) 128K + 8K 2K 8K
ATxmega64A4U-MH 64K + 4K 2K 4K
ATxmega64A4U-MHR(4) 64K + 4K 2K 4K
ATxmega32A4U-MH 32K + 4K 1K 4K
44M1
ATxmega32A4U-MHR(4) 32K + 4K 1K 4K
ATxmega16A4U-MH 16K + 4K 1K 2K
ATxmega16A4U-MHR(4) 16K + 4K 1K 2K
ATxmega128A4U-CU 128K + 8K 2K 8K
49C2
ATxmega128A4U-CUR(4) 128K + 8K 2K 8K
ATxmega64A4U-CU 64K + 4K 2K 4K
ATxmega64A4U-CUR(4) 64K + 4K 2K 4K
ATxmega32A4U-CU 32K + 4K 1K 4K
ATxmega32A4U-CUR(4) 32K + 4K 1K 4K
ATxmega16A4U-CU 16K + 4K 1K 2K
ATxmega16A4U-CUR(4) 16K + 4K 1K 2K
ATxmega32A4U-AN 32K + 4K 1K 4K
32 1.6 - 3.6V
44A
PW
0C - 105C
ATxmega32A4U-ANR(4) 32K + 4K 1K 4K
ATxmega16A4U-AN 16K + 4K 1K 2K
ATxmega16A4U-ANR(4) 16K + 4K 1K 2K
Package Type
44A 44-Lead, 10 x 10mm body size, 1.0mm body thickness, 0.8mm lead pitch, thin profile plastic quad flat package (TQFP)
44M1 44-Lead, 7x7x1mm body, lead pitch 0.50mm, 5.20mm exposed pad, thermally enhanced plastic very thin quad no lead package (VQFN)
PW 44-Lead, 7x7x1mm body, lead pitch 0.50mm, 5.20mm exposed pad, thermally enhanced plastic very thin quad no lead package (VQFN)
49C2 49-Ball (7 x 7 Array), 0.65mm Pitch, 5.0 x 5.0 x 1.0mm, very thin, fine-pitch ball grid array package (VFBGA)
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Typical Applications
Industrial control Climate control Low power battery applications
Factory automation RF and ZigBee®Power tools
Building control USB connectivity HVAC
Board control Sensor control Utility metering
White goods Optical Medical applications
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2. Pinout/Block Diagram
Figure 2-1. Block Diagram and VQFN/TQFP pinout
Notes: 1. For full details on pinout and pin functions refer to “Pinout and Pin Functions” on page 61.
2. The large center pad underneath the VQFN packages should be soldered to ground on the board to ensure good mechanical stability.
1
2
3
4
44
43
42
41
40
39
38
5
6
7
8
9
10
11
33
32
31
30
29
28
27
26
25
24
23
37
36
35
34
12
13
14
15
16
17
18
19
20
21
22
PA0
PA1
PA2
PA3
PA4
PB0
PB1
PB3
PB2
PA7
PA6
PA5
GND
VCC
PC0
VCC
GND
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PD0
PD1
PD2
PD3
PD4
PD5
PD6
VCC
GND
PD7
PE0
PE1
PE2
PE3
RESET/PDI
PDI
PR0
PR1
AVCC
GND
Power
Supervision
Port A
EVENT ROUTING NETWORK
DMA
Controller
BUS
matrix
SRAMFLASH
ADC
AC0:1
OCD
Port EPort D
Prog/Debug
Interface
EEPROM
Port C
TC0:1
Event System
Controller
Watchdog
Timer
Watchdog
OSC/CLK
Control
Real Time
Counter
Interrupt
Controller
DATA BUS
DATA BUS
Port R
USART0:1
TWI
SPI
TC0:1
USART0:1
SPI
TC0
USART0
TWI
Port B
DAC
AREF
AREF
Sleep
Controller
Reset
Controller
IRCOM
Crypto /
CRC
USB
CPU
Internal
references
Internal
oscillators
XOSC TOSC
Digital function
Analog function / Oscillators
Programming, debug, test
External clock / Crystal pins
General Purpose I /O
Ground
Power
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Figure 2-2. VFBGA pinout
Table 2-1. VFBGA pinout
1 2 3 4 5 6 7
APA3 AVCC GND PR1 PR0 PDI_DATA PE3
BPA4 PA1 PA0 GND RESET/
PDI_CLK PE2 VCC
CPA5 PA2 PA6 PA7 GND PE1 GND
DPB1 PB2 PB3 PB0 GND PD7 PE0
E GND GND PC3 GND PD4 PD5 PD6
FVCC PC0 PC4 PC6 PD0 PD1 PD3
GPC1 PC2 PC5 PC7 GND VCC PD2
A
B
C
D
E
F
G
1234567
A
B
C
D
E
F
G
7654321
Top view Bottom view
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3. Overview
The Microchip AVR XMEGA is a family of low power, high performance, and peripheral rich 8/16-bit microcontrollers
based on the AVR enhanced RISC architecture. By executing instructions in a single clock cycle, the AVR XMEGA
devices achieve CPU throughput approaching one million instructions per second (MIPS) per megahertz, allowing the
system designer to optimize power consumption versus processing speed.
The AVR CPU combines a rich instruction set with 32 general purpose working registers. All 32 registers are directly
connected to the arithmetic logic unit (ALU), allowing two independent registers to be accessed in a single instruction,
executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs many times
faster than conventional single-accumulator or CISC based microcontrollers.
The AVR XMEGA® A4U devices provide the following features: in-system programmable flash with read-while-write
capabilities; internal EEPROM and SRAM; four-channel DMA controller, eight-channel event system and programmable
multilevel interrupt controller, 34 general purpose I/O lines, 16-bit real-time counter (RTC); five flexible, 16-bit
timer/counters with compare and PWM channels; five USARTs; two two-wire serial interfaces (TWIs); one full speed
USB 2.0 interface; two serial peripheral interfaces (SPIs); AES and DES cryptographic engine; one twelve-channel, 12-
bit ADC with programmable gain; one 2-channel 12-bit DAC; two analog comparators (ACs) with window mode;
programmable watchdog timer with separate internal oscillator; accurate internal oscillators with PLL and prescaler; and
programmable brown-out detection.
The program and debug interface (PDI), a fast, two-pin interface for programming and debugging, is available.
The ATx devices have five software selectable power saving modes. The idle mode stops the CPU while allowing the
SRAM, DMA controller, event system, interrupt controller, and all peripherals to continue functioning. The power-down
mode saves the SRAM and register contents, but stops the oscillators, disabling all other functions until the next TWI,
USB resume, or pin-change interrupt, or reset. In power-save mode, the asynchronous real-time counter continues to
run, allowing the application to maintain a timer base while the rest of the device is sleeping. In standby mode, the
external crystal oscillator keeps running while the rest of the device is sleeping. This allows very fast startup from the
external crystal, combined with low power consumption. In extended standby mode, both the main oscillator and the
asynchronous timer continue to run. To further reduce power consumption, the peripheral clock to each individual
peripheral can optionally be stopped in active mode and idle sleep mode.
Microchip offers a free QTouch library for embedding capacitive touch buttons, sliders and wheels functionality into AVR
microcontrollers.
The devices are manufactured using Microchip high-density, nonvolatile memory technology. The program flash memory
can be reprogrammed in-system through the PDI. A boot loader running in the device can use any interface to download
the application program to the flash memory. The boot loader software in the boot flash section will continue to run while
the application flash section is updated, providing true read-while-write operation. By combining an 8/16-bit RISC CPU
with in-system, self-programmable flash, the AVR XMEGA is a powerful microcontroller family that provides a highly
flexible and cost effective solution for many embedded applications.
All Microchip AVR XMEGA devices are supported with a full suite of program and system development tools, including C
compilers, macro assemblers, program debugger/simulators, programmers, and evaluation kits.
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3.1 Block Diagram
Figure 3-1. XMEGA® A4U Block Diagram
Power
Supervision
POR/BOD &
RESET
PORT A (8)
PORT B (8)
DMA
Controller
SRAM
ADCA
ACA
DACB
OCD
Int. Refs.
PDI
PA[0..7]
PB[0..7]
Watchdog
Timer
Watchdog
Oscillator
Interrupt
Controller
DATA BUS
Prog/Debug
Controller
VCC
GND
Oscillator
Circuits/
Clock
Generation
Oscillator
Control
Real Time
Counter
Event System
Controller
AREFA
AREFB
PDI_DATA
RESET/
PDI_CLK
Sleep
Controller
DES
CRC
PORT C (8)
PC[0..7]
TCC0:1
USARTC0:1
TWIC
SPIC
PD[0..7] PE[0..3]
PORT D (8)
TCD0:1
USARTD0:1
SPID
TCE0
USARTE0
TWIE
PORT E (4)
Tempref AES
USB
PORT R (2)
DATA BUS
NVM Controller
MORPEEhsalF
IRCOM
BUS Matrix
CPU
EVENT ROUTING NETWORK
XTAL1/
TOSC1
XTAL2/
TOSC2
PR[0..1]
TOSC1 (optional)
TOSC2
(optional)
Digital function
Analog function
Programming, debug, test
Oscillator/Crystal/Clock
General Purpose I/O
®
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4. Resources
A comprehensive set of development tools, application notes and datasheets are available for download on
http://www.microchip.com.
4.1 Recommended reading
Microchip AVR XMEGA AU manual
XMEGA application notes
This device data sheet only contains part specific information with a short description of each peripheral and module. The
XMEGA AU manual describes the modules and peripherals in depth. The XMEGA application notes contain example
code and show applied use of the modules and peripherals.
All documentation are available from http://www.microchip.com.
5. Capacitive touch sensing
The Microchip QTouch library provides a simple to use solution to realize touch sensitive interfaces on most Microchip
AVR microcontrollers. The patented charge-transfer signal acquisition offers robust sensing and includes fully
debounced reporting of touch keys and includes Adjacent Key Suppression™ (AKS™) technology for unambiguous
detection of key events. The QTouch library includes support for the QTouch and QMatrix™ acquisition methods.
Touch sensing can be added to any application by linking the appropriate Microchip QTouch library for the AVR
microcontroller. This is done by using a simple set of APIs to define the touch channels and sensors, and then calling the
touch sensing API’s to retrieve the channel information and determine the touch sensor states.
The QTouch library is FREE and downloadable from the Microchip website at the following location:
http://www.microchip.com. For implementation details and other information, refer to the QTouch library user guide - also
available for download from the Microchip website.
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6. AVR® CPU
6.1 Features
8/16-bit, high-performance Microchip AVR RISC CPU
142 instructions
Hardware multiplier
32x8-bit registers directly connected to the ALU
Stack in RAM
Stack pointer accessible in I/O memory space
Direct addressing of up to 16MB of program memory and 16MB of data memory
True 16/24-bit access to 16/24-bit I/O registers
Efficient support for 8-, 16-, and 32-bit arithmetic
Configuration change protection of system-critical features
6.2 Overview
All Microchip AVR XMEGA devices use the 8/16-bit AVR CPU. The main function of the CPU is to execute the code and
perform all calculations. The CPU is able to access memories, perform calculations, control peripherals, and execute the
program in the flash memory. Interrupt handling is described in a separate section, refer to “Interrupts and Programmable
Multilevel Interrupt Controller” on page 35.
6.3 Architectural Overview
In order to maximize performance and parallelism, the AVR CPU uses a Harvard architecture with separate memories
and buses for program and data. Instructions in the program memory are executed with single-level pipelining. While one
instruction is being executed, the next instruction is pre-fetched from the program memory. This enables instructions to
be executed on every clock cycle. For details of all AVR instructions, refer to http://www.microchip.com.
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Figure 6-1. Block diagram of the AVR® CPU architecture.
The arithmetic logic unit (ALU) supports arithmetic and logic operations between registers or between a constant and a
register. Single-register operations can also be executed in the ALU. After an arithmetic operation, the status register is
updated to reflect information about the result of the operation.
The ALU is directly connected to the fast-access register file. The 32 x 8-bit general purpose working registers all have
single clock cycle access time allowing single-cycle arithmetic logic unit (ALU) operation between registers or between a
register and an immediate. Six of the 32 registers can be used as three 16-bit address pointers for program and data
space addressing, enabling efficient address calculations.
The memory spaces are linear. The data memory space and the program memory space are two different memory
spaces.
The data memory space is divided into I/O registers, SRAM, and external RAM. In addition, the EEPROM can be
memory mapped in the data memory.
All I/O status and control registers reside in the lowest 4KB addresses of the data memory. This is referred to as the I/O
memory space. The lowest 64 addresses can be accessed directly, or as the data space locations from 0x00 to 0x3F.
The rest is the extended I/O memory space, ranging from 0x0040 to 0x0FFF. I/O registers here must be accessed as
data space locations using load (LD/LDS/LDD) and store (ST/STS/STD) instructions.
The SRAM holds data. Code execution from SRAM is not supported. It can easily be accessed through the five different
addressing modes supported in the AVR architecture. The first SRAM address is 0x2000.
Data addresses 0x1000 to 0x1FFF are reserved for memory mapping of EEPROM.
The program memory is divided in two sections, the application program section and the boot program section. Both
sections have dedicated lock bits for write and read/write protection. The SPM instruction that is used for self-
programming of the application flash memory must reside in the boot program section. The application section contains
an application table section with separate lock bits for write and read/write protection. The application table section can
be used for safe storing of nonvolatile data in the program memory.
6.4 ALU - Arithmetic Logic Unit
The arithmetic logic unit (ALU) supports arithmetic and logic operations between registers or between a constant and a
register. Single-register operations can also be executed. The ALU operates in direct connection with all 32 general
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purpose registers. In a single clock cycle, arithmetic operations between general purpose registers or between a register
and an immediate are executed and the result is stored in the register file. After an arithmetic or logic operation, the
status register is updated to reflect information about the result of the operation.
ALU operations are divided into three main categories – arithmetic, logical, and bit functions. Both 8- and 16-bit
arithmetic is supported, and the instruction set allows for efficient implementation of 32-bit aritmetic. The hardware
multiplier supports signed and unsigned multiplication and fractional format.
6.4.1 Hardware Multiplier
The multiplier is capable of multiplying two 8-bit numbers into a 16-bit result. The hardware multiplier supports different
variations of signed and unsigned integer and fractional numbers:
Multiplication of unsigned integers
Multiplication of signed integers
Multiplication of a signed integer with an unsigned integer
Multiplication of unsigned fractional numbers
Multiplication of signed fractional numbers
Multiplication of a signed fractional number with an unsigned one
A multiplication takes two CPU clock cycles.
6.5 Program Flow
After reset, the CPU starts to execute instructions from the lowest address in the flash programmemory ‘0.’ The program
counter (PC) addresses the next instruction to be fetched.
Program flow is provided by conditional and unconditional jump and call instructions capable of addressing the whole
address space directly. Most AVR instructions use a 16-bit word format, while a limited number use a 32-bit format.
During interrupts and subroutine calls, the return address PC is stored on the stack. The stack is allocated in the general
data SRAM, and consequently the stack size is only limited by the total SRAM size and the usage of the SRAM. After
reset, the stack pointer (SP) points to the highest address in the internal SRAM. The SP is read/write accessible in the
I/O memory space, enabling easy implementation of multiple stacks or stack areas. The data SRAM can easily be
accessed through the five different addressing modes supported in the AVR CPU.
6.6 Status Register
The status register (SREG) contains information about the result of the most recently executed arithmetic or logic
instruction. This information can be used for altering program flow in order to perform conditional operations. Note that
the status register is updated after all ALU operations, as specified in the instruction set reference. This will in many
cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code.
The status register is not automatically stored when entering an interrupt routine nor restored when returning from an
interrupt. This must be handled by software.
The status register is accessible in the I/O memory space.
6.7 Stack and Stack Pointer
The stack is used for storing return addresses after interrupts and subroutine calls. It can also be used for storing
temporary data. The stack pointer (SP) register always points to the top of the stack. It is implemented as two 8-bit
registers that are accessible in the I/O memory space. Data are pushed and popped from the stack using the PUSH and
POP instructions. The stack grows from a higher memory location to a lower memory location. This implies that pushing
data onto the stack decreases the SP, and popping data off the stack increases the SP. The SP is automatically loaded
after reset, and the initial value is the highest address of the internal SRAM. If the SP is changed, it must be set to point
above address 0x2000, and it must be defined before any subroutine calls are executed or before interrupts are enabled.
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During interrupts or subroutine calls, the return address is automatically pushed on the stack. The return address can be
two or three bytes, depending on program memory size of the device. For devices with 128KB or less of program
memory, the return address is two bytes, and hence the stack pointer is decremented/incremented by two. For devices
with more than 128KB of program memory, the return address is three bytes, and hence the SP is
decremented/incremented by three. The return address is popped off the stack when returning from interrupts using the
RETI instruction, and from subroutine calls using the RET instruction.
The SP is decremented by one when data are pushed on the stack with the PUSH instruction, and incremented by one
when data is popped off the stack using the POP instruction.
To prevent corruption when updating the stack pointer from software, a write to SPL will automatically disable interrupts
for up to four instructions or until the next I/O memory write.
After reset the stack pointer is initialized to the highest address of the SRAM. See Figure 7-1 on page 22.
6.8 Register File
The register file consists of 32 x 8-bit general purpose working registers with single clock cycle access time. The register
file supports the following input/output schemes:
One 8-bit output operand and one 8-bit result input
Two 8-bit output operands and one 8-bit result input
Two 8-bit output operands and one 16-bit result input
One 16-bit output operand and one 16-bit result input
Six of the 32 registers can be used as three 16-bit address register pointers for data space addressing, enabling efficient
address calculations. One of these address pointers can also be used as an address pointer for lookup tables in flash
program memory.
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7. Memories
7.1 Features
Flash program memory
One linear address space
In-system programmable
Self-programming and boot loader support
Application section for application code
Application table section for application code or data storage
Boot section for application code or boot loader code
Separate read/write protection lock bits for all sections
Built in fast CRC check of a selectable flash program memory section
Data memory
One linear address space
Single-cycle access from CPU
SRAM
EEPROM
Byte and page accessible
Optional memory mapping for direct load and store
I/O memory
Configuration and status registers for all peripherals and modules
16 bit-accessible general purpose registers for global variables or flags
Bus arbitration
Deterministic priority handling between CPU, DMA controller, and other bus masters
Separate buses for SRAM, EEPROM and I/O memory
Simultaneous bus access for CPU and DMA controller
Production signature row memory for factory programmed data
ID for each microcontroller device type
Serial number for each device
Calibration bytes for factory calibrated peripherals
User signature row
One flash page in size
Can be read and written from software
Content is kept after chip erase
7.2 Overview
The Microchip AVR architecture has two main memory spaces, the program memory and the data memory. Executable
code can reside only in the program memory, while data can be stored in the program memory and the data memory.
The data memory includes the internal SRAM, and EEPROM for nonvolatile data storage. All memory spaces are linear
and require no memory bank switching. Nonvolatile memory (NVM) spaces can be locked for further write and read/write
operations. This prevents unrestricted access to the application software.
A separate memory section contains the fuse bytes. These are used for configuring important system functions, and can
only be written by an external programmer.
The available memory size configurations are shown in “Ordering Information” on page 8. In addition, each device has a
Flash memory signature row for calibration data, device identification, serial number etc.
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7.3 Flash Program Memory
The Microchip AVR XMEGA devices contain on-chip, in-system reprogrammable flash memory for program storage. The
flash memory can be accessed for read and write from an external programmer through the PDI or from application
software running in the device.
All AVR CPU instructions are 16 or 32 bits wide, and each flash location is 16 bits wide. The flash memory is organized
in two main sections, the application section and the boot loader section. The sizes of the different sections are fixed, but
device-dependent. These two sections have separate lock bits, and can have different levels of protection. The store
program memory (SPM) instruction, which is used to write to the flash from the application software, will only operate
when executed from the boot loader section.
The application section contains an application table section with separate lock settings. This enables safe storage of
nonvolatile data in the program memory.
Table 7-1. Flash Program Memory (Hexadecimal address).
7.3.1 Application Section
The Application section is the section of the flash that is used for storing the executable application code. The protection
level for the application section can be selected by the boot lock bits for this section. The application section can not store
any boot loader code since the SPM instruction cannot be executed from the application section.
7.3.2 Application Table Section
The application table section is a part of the application section of the flash memory that can be used for storing data.
The size is identical to the boot loader section. The protection level for the application table section can be selected by
the boot lock bits for this section. The possibilities for different protection levels on the application section and the
application table section enable safe parameter storage in the program memory. If this section is not used for data,
application code can reside here.
7.3.3 Boot Loader Section
While the application section is used for storing the application code, the boot loader software must be located in the boot
loader section because the SPM instruction can only initiate programming when executing from this section. The SPM
instruction can access the entire flash, including the boot loader section itself. The protection level for the boot loader
section can be selected by the boot loader lock bits. If this section is not used for boot loader software, application code
can be stored here.
Word Address
ATxmega128A4U ATxmega64A4U ATxmega32A4U ATxmega16A4U
0000
Application Section
(128K/64K/32K/16K)
...
EFFF / 77FF / 37FF / 17FF
F000 / 7800 / 3800 / 1800 Application Table Section
(8K/4K/4K/4K)
FFFF / 7FFF / 3FFF / 1FFF
10000 / 8000 / 4000 / 2000 Boot Section
(8K/4K/4K/4K)
10FFF / 87FF / 47FF / 27FF
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7.3.4 Production Signature Row
The production signature row is a separate memory section for factory programmed data. It contains calibration data for
functions such as oscillators and analog modules. Some of the calibration values will be automatically loaded to the
corresponding module or peripheral unit during reset. Other values must be loaded from the signature row and written to
the corresponding peripheral registers from software. For details on calibration conditions, refer to “Electrical
Characteristics” on page 85.
The production signature row also contains an ID that identifies each microcontroller device type and a serial number for
each manufactured device. The serial number consists of the production lot number, wafer number, and wafer
coordinates for the device. The device ID for the available devices is shown in Table 7-2.
The production signature row cannot be written or erased, but it can be read from application software and external
programmers.
Table 7-2. Device ID bytes for Microchip AVR® XMEGA® A4U devices.
7.3.5 User Signature Row
The user signature row is a separate memory section that is fully accessible (read and write) from application software
and external programmers. It is one flash page in size, and is meant for static user parameter storage, such as calibration
data, custom serial number, identification numbers, random number seeds, etc. This section is not erased by chip erase
commands that erase the flash, and requires a dedicated erase command. This ensures parameter storage during
multiple program/erase operations and on-chip debug sessions.
7.4 Fuses and Lock bits
The fuses are used to configure important system functions, and can only be written from an external programmer. The
application software can read the fuses. The fuses are used to configure reset sources such as brownout detector and
watchdog, and startup configuration.
The lock bits are used to set protection levels for the different flash sections (that is, if read and/or write access should be
blocked). Lock bits can be written by external programmers and application software, but only to stricter protection levels.
Chip erase is the only way to erase the lock bits. To ensure that flash contents are protected even during chip erase, the
lock bits are erased after the rest of the flash memory has been erased.
An unprogrammed fuse or lock bit will have the value one, while a programmed fuse or lock bit will have the value zero.
Both fuses and lock bits are reprogrammable like the flash program memory.
7.5 Data Memory
The data memory contains the I/O memory, internal SRAM, optionally memory mapped EEPROM, and external memory
if available. The data memory is organized as one continuous memory section, see Figure 7-1. To simplify development,
I/O Memory, EEPROM and SRAM will always have the same start addresses for all Microchip AVR XMEGA devices.
Device Device ID bytes
Byte 2 Byte 1 Byte 0
ATxmega16A4U 41 94 1E
ATxmega32A4U 41 95 1E
ATxmega64A4U 46 96 1E
ATxmega128A4U 46 97 1E
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Figure 7-1. Data memory map (Hexadecimal address).
7.6 EEPROM
All devices have EEPROM for nonvolatile data storage. It is either addressable in a separate data space (default) or
memory mapped and accessed in normal data space. The EEPROM supports both byte and page access. Memory
mapped EEPROM allows highly efficient EEPROM reading and EEPROM buffer loading. When doing this, EEPROM is
accessible using load and store instructions. Memory mapped EEPROM will always start at hexadecimal address
0x1000.
7.7 I/O Memory
The status and configuration registers for peripherals and modules, including the CPU, are addressable through I/O
memory locations. All I/O locations can be accessed by the load (LD/LDS/LDD) and store (ST/STS/STD) instructions,
which are used to transfer data between the 32 registers in the register file and the I/O memory. The IN and OUT
instructions can address I/O memory locations in the range of 0x00 to 0x3F directly. In the address range 0x00 - 0x1F,
single-cycle instructions for manipulation and checking of individual bits are available.
The I/O memory address for all peripherals and modules in XMEGA® A4U is shown in the “Peripheral Module Address
Map” on page 67.
7.7.1 General Purpose I/O Registers
The lowest 16 I/O memory addresses are reserved as general purpose I/O registers. These registers can be used for
storing global variables and flags, as they are directly bit-accessible using the SBI, CBI, SBIS, and SBIC instructions.
Byte Address ATxmega64A4U Byte Address ATxmega32A4U Byte Address ATxmega16A4U
0
I/O Registers (4K)
0
I/O Registers (4K)
0
I/O Registers (4K)
FFF FFF FFF
1000
EEPROM (2K)
1000
EEPROM (1K)
1000
EEPROM (1K)
17FF 13FF 13FF
RESERVED RESERVED RESERVED
2000
Internal SRAM (4K)
2000
Internal SRAM (4K)
2000
Internal SRAM (2K)
2FFF 2FFF 27FF
Byte Address ATxmega128A4U
0
I/O Registers (4K)
FFF
1000
EEPROM (2K)
17FF
RESERVED
2000
Internal SRAM (8K)
3FFF
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7.8 Data Memory and Bus Arbitration
Since the data memory is organized as four separate sets of memories, the different bus masters (CPU, DMA controller
read and DMA controller write, etc.) can access different memory sections at the same time.
7.9 Memory Timing
Read and write access to the I/O memory takes one CPU clock cycle. A write to SRAM takes one cycle, and a read from
SRAM takes two cycles. For burst read (DMA), new data are available every cycle. EEPROM page load (write) takes one
cycle, and three cycles are required for read. For burst read, new data are available every second cycle. Refer to the
instruction summary for more details on instructions and instruction timing.
7.10 Device ID and Revision
Each device has a three-byte device ID. This ID identifies Microchip as the manufacturer of the device and the device
type. A separate register contains the revision number of the device.
7.11 I/O Memory Protection
Some features in the device are regarded as critical for safety in some applications. Due to this, it is possible to lock the
I/O register related to the clock system, the event system, and the advanced waveform extensions. As long as the lock is
enabled, all related I/O registers are locked and they can not be written from the application software. The lock registers
themselves are protected by the configuration change protection mechanism.
7.12 Flash and EEPROM Page Size
The flash program memory and EEPROM data memory are organized in pages. The pages are word accessible for the
flash and byte accessible for the EEPROM.
Table 7-3 on page 23 shows the Flash Program Memory organization and Program Counter (PC) size. Flash write and
erase operations are performed on one page at a time, while reading the Flash is done one byte at a time. For Flash
access the Z-pointer (Z[m:n]) is used for addressing. The most significant bits in the address (FPAGE) give the page
number and the least significant address bits (FWORD) give the word in the page.
Table 7-3. Number of words and pages in the flash.
Table 7-4 shows EEPROM memory organization for the Microchip AVR XMEGA® A4U devices. EEEPROM write and
erase operations can be performed one page or one byte at a time, while reading the EEPROM is done one byte at a
time. For EEPROM access the NVM address register (ADDR[m:n]) is used for addressing. The most significant bits in
the address (E2PAGE) give the page number and the least significant address bits (E2BYTE) give the byte in the page.
Devices PC size Flash size Page Size FWORD FPAGE Application Boot
bits bytes words Size No of
pages Size No of
pages
ATxmega16A4U 14 16K + 4K 128 Z[6:0] Z[13:7] 16K 64 4K 16
ATxmega32A4U 15 32K + 4K 128 Z[6:0] Z[14:7] 32K 128 4K 16
ATxmega64A4U 16 64K + 4K 128 Z[6:0] Z[15:7] 64K 256 4K 16
ATxmega128A4U 17 128K + 8K 128 Z[6:0] Z[16:7] 128K 512 8K 32
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Table 7-4. Number of bytes and pages in the EEPROM.
Devices EEPROM Page Size E2BYTE E2PAGE No of Pages
Size bytes
ATxmega16A4U 1K 32 ADDR[4:0] ADDR[10:5] 32
ATxmega32A4U 1K 32 ADDR[4:0] ADDR[10:5] 32
ATxmega64A4U 2K 32 ADDR[4:0] ADDR[10:5] 64
ATxmega128A4U 2K 32 ADDR[4:0] ADDR[10:5] 64
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8. DMAC – Direct Memory Access Controller
8.1 Features
Allows high speed data transfers with minimal CPU intervention
from data memory to data memory
from data memory to peripheral
from peripheral to data memory
from peripheral to peripheral
Four DMA channels with separate
transfer triggers
interrupt vectors
addressing modes
Programmable channel priority
From 1 byte to 16MB of data in a single transaction
Up to 64KB block transfers with repeat
1, 2, 4, or 8 byte burst transfers
Multiple addressing modes
Static
Incremental
Decremental
Optional reload of source and destination addresses at the end of each
Burst
Block
Transaction
Optional interrupt on end of transaction
Optional connection to CRC generator for CRC on DMA data
8.2 Overview
The four-channel direct memory access (DMA) controller can transfer data between memories and peripherals, and thus
offload these tasks from the CPU. It enables high data transfer rates with minimum CPU intervention, and frees up CPU
time. The four DMA channels enable up to four independent and parallel transfers.
The DMA controller can move data between SRAM and peripherals, between SRAM locations and directly between
peripheral registers. With access to all peripherals, the DMA controller can handle automatic transfer of data to/from
communication modules. The DMA controller can also read from memory mapped EEPROM.
Data transfers are done in continuous bursts of 1, 2, 4, or 8 bytes. They build block transfers of configurable size from 1
byte to 64KB. A repeat counter can be used to repeat each block transfer for single transactions up to 16MB. Source and
destination addressing can be static, incremental or decremental. Automatic reload of source and/or destination
addresses can be done after each burst or block transfer, or when a transaction is complete. Application software,
peripherals, and events can trigger DMA transfers.
The four DMA channels have individual configuration and control settings. This include source, destination, transfer
triggers, and transaction sizes. They have individual interrupt settings. Interrupt requests can be generated when a
transaction is complete or when the DMA controller detects an error on a DMA channel.
To allow for continuous transfers, two channels can be interlinked so that the second takes over the transfer when the
first is finished, and vice versa.
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9. Event System
9.1 Features
System for direct peripheral-to-peripheral communication and signaling
Peripherals can directly send, receive, and react to peripheral events
CPU and DMA controller independent operation
100% predictable signal timing
Short and guaranteed response time
Eight event channels for up to eight different and parallel signal routing configurations
Events can be sent and/or used by most peripherals, clock system, and software
Additional functions include
Quadrature decoders
Digital filtering of I/O pin state
Works in active mode and idle sleep mode
9.2 Overview
The event system enables direct peripheral-to-peripheral communication and signaling. It allows a change in one
peripheral’s state to automatically trigger actions in other peripherals. It is designed to provide a predictable system for
short and predictable response times between peripherals. It allows for autonomous peripheral control and interaction
without the use of interrupts, CPU, or DMA controller resources, and is thus a powerful tool for reducing the complexity,
size and execution time of application code. It also allows for synchronized timing of actions in several peripheral
modules.
A change in a peripheral’s state is referred to as an event, and usually corresponds to the peripheral’s interrupt
conditions. Events can be directly passed to other peripherals using a dedicated routing network called the event routing
network. How events are routed and used by the peripherals is configured in software.
Figure 9-1 on page 26 shows a basic diagram of all connected peripherals. The event system can directly connect
together analog and digital converters, analog comparators, I/O port pins, the real-time counter, timer/counters, IR
communication module (IRCOM), and USB interface. It can also be used to trigger DMA transactions (DMA controller).
Events can also be generated from software and the peripheral clock.
Figure 9-1. Event system overview and connected peripherals.
The event routing network consists of eight software-configurable multiplexers that control how events are routed and
used. These are called event channels, and allow for up to eight parallel event routing configurations. The maximum
routing latency is two peripheral clock cycles. The event system works in both active mode and idle sleep mode.
DAC
Timer /
Counters
USB
ADC
Real Time
Counter
Port pins
CPU /
Software
DMA
Controller
IRCOM
Event Routing Network
Event
System
Controller
clk
PER
Prescaler
AC
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10. System Clock and Clock options
10.1 Features
Fast start-up time
Safe run-time clock switching
Internal oscillators:
32MHz run-time calibrated and tuneable oscillator
2MHz run-time calibrated oscillator
32.768kHz calibrated oscillator
32kHz ultra low power (ULP) oscillator with 1kHz output
External clock options
0.4MHz - 16MHz crystal oscillator
32.768kHz crystal oscillator
External clock
PLL with 20MHz - 128MHz output frequency
Internal and external clock options and 1x to 31x multiplication
Lock detector
Clock prescalers with 1x to 2048x division
Fast peripheral clocks running at two and four times the CPU clock
Automatic run-time calibration of internal oscillators
External oscillator and PLL lock failure detection with optional non-maskable interrupt
10.2 Overview
Microchip AVR XMEGA® A4U devices have a flexible clock system supporting a large number of clock sources. It
incorporates both accurate internal oscillators and external crystal oscillator and resonator support. A high-frequency
phase locked loop (PLL) and clock prescalers can be used to generate a wide range of clock frequencies. A calibration
feature (DFLL) is available, and can be used for automatic run-time calibration of the internal oscillators to remove
frequency drift over voltage and temperature. An oscillator failure monitor can be enabled to issue a non-maskable
interrupt and switch to the internal oscillator if the external oscillator or PLL fails.
When a reset occurs, all clock sources except the 32kHz ultra low power oscillator are disabled. After reset, the device
will always start up running from the 2MHz internal oscillator. During normal operation, the system clock source and
prescalers can be changed from software at any time.
Figure 10-1 on page 28 presents the principal clock system in the XMEGA® A4U family of devices. Not all of the clocks
need to be active at a given time. The clocks for the CPU and peripherals can be stopped using sleep modes and power
reduction registers, as described in “Power Management and Sleep Modes” on page 30.
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Figure 10-1. The clock system, clock sources and clock distribution.
10.3 Clock Sources
The clock sources are divided in two main groups: internal oscillators and external clock sources. Most of the clock
sources can be directly enabled and disabled from software, while others are automatically enabled or disabled,
depending on peripheral settings. After reset, the device starts up running from the 2MHz internal oscillator. The other
clock sources, DFLLs and PLL, are turned off by default.
The internal oscillators do not require any external components to run. For details on characteristics and accuracy of the
internal oscillators, refer to the device datasheet.
10.3.1 32kHz Ultra Low Power Internal Oscillator
This oscillator provides an approximate 32kHz clock. The 32kHz ultra low power (ULP) internal oscillator is a very low
power clock source, and it is not designed for high accuracy. The oscillator employs a built-in prescaler that provides a
Real Time
Counter Peripherals RAM
AVR®AVR®AVR®AVR®AVR®
AVR® CPU
AVR®
Non-Volatile
Memory
Watchdog
Timer
Brown-out
Detector
System Clock Prescalers
USB
Prescaler
System Clock Multiplexer
(SCLKSEL)
PLLSRC
RTCSRC
DIV32
32 kHz
Int. ULP
32.768 kHz
Int. OSC
32.768 kHz
TOSC
2 MHz
Int. Osc
32 MHz
Int. Osc
0.4 – 16 MHz
XTAL
DIV32
DIV32
DIV4
XOSCSEL
PLL
USBSRC
TOSC1
TOSC2
XTAL1
XTAL2
clk
SYS
clk
RTC
clk
PER2
clk
PER
clk
CPU
clk
PER4
clk
USB
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1kHz output. The oscillator is automatically enabled/disabled when it is used as clock source for any part of the device.
This oscillator can be selected as the clock source for the RTC.
10.3.2 32.768kHz Calibrated Internal Oscillator
This oscillator provides an approximate 32.768kHz clock. It is calibrated during production to provide a default frequency
close to its nominal frequency. The calibration register can also be written from software for run-time calibration of the
oscillator frequency. The oscillator employs a built-in prescaler, which provides both a 32.768kHz output and a 1.024kHz
output.
10.3.3 32.768kHz Crystal Oscillator
A 32.768kHz crystal oscillator can be connected between the TOSC1 and TOSC2 pins and enables a dedicated low
frequency oscillator input circuit. A low power mode with reduced voltage swing on TOSC2 is available. This oscillator
can be used as a clock source for the system clock and RTC, and as the DFLL reference clock.
10.3.4 0.4 - 16MHz Crystal Oscillator
This oscillator can operate in four different modes optimized for different frequency ranges, all within 0.4 - 16MHz.
10.3.5 2MHz Run-time Calibrated Internal Oscillator
The 2MHz run-time calibrated internal oscillator is the default system clock source after reset. It is calibrated during
production to provide a default frequency close to its nominal frequency. A DFLL can be enabled for automatic run-time
calibration of the oscillator to compensate for temperature and voltage drift and optimize the oscillator accuracy.
10.3.6 32MHz Run-time Calibrated Internal Oscillator
The 32MHz run-time calibrated internal oscillator is a high-frequency oscillator. It is calibrated during production to
provide a default frequency close to its nominal frequency. A digital frequency looked loop (DFLL) can be enabled for
automatic run-time calibration of the oscillator to compensate for temperature and voltage drift and optimize the oscillator
accuracy. This oscillator can also be adjusted and calibrated to any frequency between 30MHz and 55MHz. The
production signature row contains 48MHz calibration values intended used when the oscillator is used a full-speed USB
clock source.
10.3.7 External Clock Sources
The XTAL1 and XTAL2 pins can be used to drive an external oscillator, either a quartz crystal or a ceramic resonator.
XTAL1 can be used as input for an external clock signal. The TOSC1 and TOSC2 pins is dedicated to driving a
32.768kHz crystal oscillator.
10.3.8 PLL with 1x-31x Multiplication Factor
The built-in phase locked loop (PLL) can be used to generate a high-frequency system clock. The PLL has a user-
selectable multiplication factor of from 1 to 31. In combination with the prescalers, this gives a wide range of output
frequencies from all clock sources.
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11. Power Management and Sleep Modes
11.1 Features
Power management for adjusting power consumption and functions
Five sleep modes
Idle
Power down
Power save
Standby
Extended standby
Power reduction register to disable clock and turn off unused peripherals in active and idle modes
11.2 Overview
Various sleep modes and clock gating are provided in order to tailor power consumption to application requirements.
This enables the Microchip AVR XMEGA microcontroller to stop unused modules to save power.
All sleep modes are available and can be entered from active mode. In active mode, the CPU is executing application
code. When the device enters sleep mode, program execution is stopped and interrupts or a reset is used to wake the
device again. The application code decides which sleep mode to enter and when. Interrupts from enabled peripherals
and all enabled reset sources can restore the microcontroller from sleep to active mode.
In addition, power reduction registers provide a method to stop the clock to individual peripherals from software. When
this is done, the current state of the peripheral is frozen, and there is no power consumption from that peripheral. This
reduces the power consumption in active mode and idle sleep modes and enables much more fine-tuned power
management than sleep modes alone.
11.3 Sleep Modes
Sleep modes are used to shut down modules and clock domains in the microcontroller in order to save power. XMEGA
microcontrollers have five different sleep modes tuned to match the typical functional stages during application
execution. A dedicated sleep instruction (SLEEP) is available to enter sleep mode. Interrupts are used to wake the
device from sleep, and the available interrupt wake-up sources are dependent on the configured sleep mode. When an
enabled interrupt occurs, the device will wake up and execute the interrupt service routine before continuing normal
program execution from the first instruction after the SLEEP instruction. If other, higher priority interrupts are pending
when the wake-up occurs, their interrupt service routines will be executed according to their priority before the interrupt
service routine for the wake-up interrupt is executed. After wake-up, the CPU is halted for four cycles before execution
starts.
The content of the register file, SRAM and registers are kept during sleep. If a reset occurs during sleep, the device will
reset, start up, and execute from the reset vector.
11.3.1 Idle Mode
In idle mode the CPU and nonvolatile memory are stopped (note that any ongoing programming will be completed), but
all peripherals, including the interrupt controller, event system and DMA controller are kept running. Any enabled
interrupt will wake the device.
11.3.2 Power-down Mode
In power-down mode, all clocks, including the real-time counter clock source, are stopped. This allows operation only of
asynchronous modules that do not require a running clock. The only interrupts that can wake up the MCU are the two-
wire interface address match interrupt, asynchronous port interrupts, and the USB resume interrupt.
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11.3.3 Power-save Mode
Power-save mode is identical to power down, with one exception. If the real-time counter (RTC) is enabled, it will keep
running during sleep, and the device can also wake up from either an RTC overflow or compare match interrupt.
11.3.4 Standby Mode
Standby mode is identical to power down, with the exception that the enabled system clock sources are kept running
while the CPU, peripheral, and RTC clocks are stopped. This reduces the wake-up time.
11.3.5 Extended Standby Mode
Extended standby mode is identical to power-save mode, with the exception that the enabled system clock sources are
kept running while the CPU and peripheral clocks are stopped. This reduces the wake-up time.
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12. System Control and Reset
12.1 Features
Reset the microcontroller and set it to initial state when a reset source goes active
Multiple reset sources that cover different situations
Power-on reset
External reset
Watchdog reset
Brownout reset
PDI reset
Software reset
Asynchronous operation
No running system clock in the device is required for reset
Reset status register for reading the reset source from the application code
12.2 Overview
The reset system issues a microcontroller reset and sets the device to its initial state. This is for situations where
operation should not start or continue, such as when the microcontroller operates below its power supply rating. If a reset
source goes active, the device enters and is kept in reset until all reset sources have released their reset. The I/O pins
are immediately tri-stated. The program counter is set to the reset vector location, and all I/O registers are set to their
initial values. The SRAM content is kept. However, if the device accesses the SRAM when a reset occurs, the content of
the accessed location can not be guaranteed.
After reset is released from all reset sources, the default oscillator is started and calibrated before the device starts
running from the reset vector address. By default, this is the lowest program memory address, 0, but it is possible to
move the reset vector to the lowest address in the boot section.
The reset functionality is asynchronous, and so no running system clock is required to reset the device. The software
reset feature makes it possible to issue a controlled system reset from the user software.
The reset status register has individual status flags for each reset source. It is cleared at power-on reset, and shows
which sources have issued a reset since the last power-on.
12.3 Reset Sequence
A reset request from any reset source will immediately reset the device and keep it in reset as long as the request is
active. When all reset requests are released, the device will go through three stages before the device starts running
again:
Reset counter delay
Oscillator startup
Oscillator calibration
If another reset requests occurs during this process, the reset sequence will start over again.
12.4 Reset Sources
12.4.1 Power-on Reset
A power-on reset (POR) is generated by an on-chip detection circuit. The POR is activated when the VCC rises and
reaches the POR threshold voltage (VPOT), and this will start the reset sequence.
The POR is also activated to power down the device properly when the VCC falls and drops below the VPOT level.
The VPOT level is higher for falling VCC than for rising VCC. Consult the datasheet for POR characteristics data.
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12.4.2 Brownout Detection
The on-chip brownout detection (BOD) circuit monitors the VCC level during operation by comparing it to a fixed,
programmable level that is selected by the BODLEVEL fuses. If disabled, BOD is forced on at the lowest level during chip
erase and when the PDI is enabled.
12.4.3 External Reset
The external reset circuit is connected to the external RESET pin. The external reset will trigger when the RESET pin is
driven below the RESET pin threshold voltage, VRST, for longer than the minimum pulse period, tEXT. The reset will be
held as long as the pin is kept low. The RESET pin includes an internal pull-up resistor.
12.4.4 Watchdog Reset
The watchdog timer (WDT) is a system function for monitoring correct program operation. If the WDT is not reset from
the software within a programmable timeout period, a watchdog reset will be given. The watchdog reset is active for one
to two clock cycles of the 2MHz internal oscillator. For more details see “WDT – Watchdog Timer” on page 34.
12.4.5 Software Reset
The software reset makes it possible to issue a system reset from software by writing to the software reset bit in the reset
control register.The reset will be issued within two CPU clock cycles after writing the bit. It is not possible to execute any
instruction from when a software reset is requested until it is issued.
12.4.6 Program and Debug Interface Reset
The program and debug interface reset contains a separate reset source that is used to reset the device during external
programming and debugging. This reset source is accessible only from external debuggers and programmers.
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13. WDT – Watchdog Timer
13.1 Features
Issues a device reset if the timer is not reset before its timeout period
Asynchronous operation from dedicated oscillator
1kHz output of the 32kHz ultra low power oscillator
11 selectable timeout periods, from 8ms to 8s
Two operation modes:
Normal mode
Window mode
Configuration lock to prevent unwanted changes
13.2 Overview
The watchdog timer (WDT) is a system function for monitoring correct program operation. It makes it possible to recover
from error situations such as runaway or deadlocked code. The WDT is a timer, configured to a predefined timeout
period, and is constantly running when enabled. If the WDT is not reset within the timeout period, it will issue a
microcontroller reset. The WDT is reset by executing the WDR (watchdog timer reset) instruction from the application
code.
The window mode makes it possible to define a time slot or window inside the total timeout period during which WDT
must be reset. If the WDT is reset outside this window, either too early or too late, a system reset will be issued.
Compared to the normal mode, this can also catch situations where a code error causes constant WDR execution.
The WDT will run in active mode and all sleep modes, if enabled. It is asynchronous, runs from a CPU-independent clock
source, and will continue to operate to issue a system reset even if the main clocks fail.
The configuration change protection mechanism ensures that the WDT settings cannot be changed by accident. For
increased safety, a fuse for locking the WDT settings is also available.
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14. Interrupts and Programmable Multilevel Interrupt Controller
14.1 Features
Short and predictable interrupt response time
Separate interrupt configuration and vector address for each interrupt
Programmable multilevel interrupt controller
Interrupt prioritizing according to level and vector address
Three selectable interrupt levels for all interrupts: low, medium and high
Selectable, round-robin priority scheme within low-level interrupts
Non-maskable interrupts for critical functions
Interrupt vectors optionally placed in the application section or the boot loader section
14.2 Overview
Interrupts signal a change of state in peripherals, and this can be used to alter program execution. Peripherals can have
one or more interrupts, and all are individually enabled and configured. When an interrupt is enabled and configured, it
will generate an interrupt request when the interrupt condition is present. The programmable multilevel interrupt
controller (PMIC) controls the handling and prioritizing of interrupt requests. When an interrupt request is acknowledged
by the PMIC, the program counter is set to point to the interrupt vector, and the interrupt handler can be executed.
All peripherals can select between three different priority levels for their interrupts: low, medium, and high. Interrupts are
prioritized according to their level and their interrupt vector address. Medium-level interrupts will interrupt low-level
interrupt handlers. High-level interrupts will interrupt both medium- and low-level interrupt handlers. Within each level, the
interrupt priority is decided from the interrupt vector address, where the lowest interrupt vector address has the highest
interrupt priority. Low-level interrupts have an optional round-robin scheduling scheme to ensure that all interrupts are
serviced within a certain amount of time.
Non-maskable interrupts (NMI) are also supported, and can be used for system critical functions.
14.3 Interrupt vectors
The interrupt vector is the sum of the peripheral’s base interrupt address and the offset address for specific interrupts in
each peripheral. The base addresses for the Microchip AVR XMEGA® A4U devices are shown in Table 14-1 on page 36.
Offset addresses for each interrupt available in the peripheral are described for each peripheral in the XMEGA AU
manual. For peripherals or modules that have only one interrupt, the interrupt vector is shown in Table 14-1 on page 36.
The program address is the word address.
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Table 14-1. Reset and interrupt vectors
Program address
(base address) Source Interrupt description
0x000 RESET
0x002 OSCF_INT_vect Crystal oscillator failure interrupt vector (NMI)
0x004 PORTC_INT_base Port C interrupt base
0x008 PORTR_INT_base Port R interrupt base
0x00C DMA_INT_base DMA controller interrupt base
0x014 RTC_INT_base Real time counter interrupt base
0x018 TWIC_INT_base Two-Wire Interface on Port C interrupt base
0x01C TCC0_INT_base Timer/counter 0 on port C interrupt base
0x028 TCC1_INT_base Timer/counter 1 on port C interrupt base
0x030 SPIC_INT_vect SPI on port C interrupt vector
0x032 USARTC0_INT_base USART 0 on port C interrupt base
0x038 USARTC1_INT_base USART 1 on port C interrupt base
0x03E AES_INT_vect AES interrupt vector
0x040 NVM_INT_base Nonvolatile Memory interrupt base
0x044 PORTB_INT_base Port B interrupt base
0x056 PORTE_INT_base Port E interrupt base
0x05A TWIE_INT_base Two-wire Interface on Port E interrupt base
0x05E TCE0_INT_base Timer/counter 0 on port E interrupt base
0x06A TCE1_INT_base Timer/counter 1 on port E interrupt base
0x074 USARTE0_INT_base USART 0 on port E interrupt base
0x080 PORTD_INT_base Port D interrupt base
0x084 PORTA_INT_base Port A interrupt base
0x088 ACA_INT_base Analog Comparator on Port A interrupt base
0x08E ADCA_INT_base Analog to Digital Converter on Port A interrupt base
0x09A TCD0_INT_base Timer/counter 0 on port D interrupt base
0x0A6 TCD1_INT_base Timer/counter 1 on port D interrupt base
0x0AE SPID_INT_vector SPI on port D interrupt vector
0x0B0 USARTD0_INT_base USART 0 on port D interrupt base
0x0B6 USARTD1_INT_base USART 1 on port D interrupt base
0x0FA USB_INT_base USB on port D interrupt base
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15. I/O Ports
15.1 Features
34 general purpose input and output pins with individual configuration
Output driver with configurable driver and pull settings:
Totem-pole
Wired-AND
Wired-OR
Bus-keeper
Inverted I/O
Input with synchronous and/or asynchronous sensing with interrupts and events
Sense both edges
Sense rising edges
Sense falling edges
Sense low level
Optional pull-up and pull-down resistor on input and Wired-OR/AND configurations
Optional slew rate control
Asynchronous pin change sensing that can wake the device from all sleep modes
Two port interrupts with pin masking per I/O port
Efficient and safe access to port pins
Hardware read-modify-write through dedicated toggle/clear/set registers
Configuration of multiple pins in a single operation
Mapping of port registers into bit-accessible I/O memory space
Peripheral clocks output on port pin
Real-time counter clock output to port pin
Event channels can be output on port pin
Remapping of digital peripheral pin functions
Selectable USART, SPI, and timer/counter input/output pin locations
15.2 Overview
One port consists of up to eight port pins: pin 0 to 7. Each port pin can be configured as input or output with configurable
driver and pull settings. They also implement synchronous and asynchronous input sensing with interrupts and events for
selectable pin change conditions. Asynchronous pin-change sensing means that a pin change can wake the device from
all sleep modes, included the modes where no clocks are running.
All functions are individual and configurable per pin, but several pins can be configured in a single operation. The pins
have hardware read-modify-write (RMW) functionality for safe and correct change of drive value and/or pull resistor
configuration. The direction of one port pin can be changed without unintentionally changing the direction of any other
pin.
The port pin configuration also controls input and output selection of other device functions. It is possible to have both the
peripheral clock and the real-time clock output to a port pin, and available for external use. The same applies to events
from the event system that can be used to synchronize and control external functions. Other digital peripherals, such as
USART, SPI, and timer/counters, can be remapped to selectable pin locations in order to optimize pin-out versus
application needs.
The notation of the ports are PORTA, PORTB, PORTC, PORTD, PORTE, and PORTR.
15.3 Output Driver
All port pins (Pn) have programmable output configuration. The port pins also have configurable slew rate limitation to
reduce electromagnetic emission.
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15.3.1 Push-pull
Figure 15-1. I/O configuration - Totem-pole.
15.3.2 Pull-down
Figure 15-2. I/O configuration - Totem-pole with pull-down (on input).
15.3.3 Pull-up
Figure 15-3. I/O configuration - Totem-pole with pull-up (on input).
15.3.4 Bus-keeper
The bus-keeper’s weak output produces the same logical level as the last output level. It acts as a pull-up if the last level
was ‘1’, and pull-down if the last level was ‘0’.
INn
OUTn
DIRn
Pn
INn
OUTn
DIRn
Pn
INn
OUTn
DIRn
Pn
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Figure 15-4. I/O configuration - Totem-pole with bus-keeper.
15.3.5 Others
Figure 15-5. Output configuration - Wired-OR with optional pull-down.
Figure 15-6. I/O configuration - Wired-AND with optional pull-up.
INn
OUTn
DIRn
Pn
INn
OUTn
Pn
INn
OUTn
Pn
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15.4 Input sensing
Input sensing is synchronous or asynchronous depending on the enabled clock for the ports, and the configuration is
shown in Figure 15-7.
Figure 15-7. Input sensing system overview.
When a pin is configured with inverted I/O, the pin value is inverted before the input sensing.
15.5 Alternate Port Functions
Most port pins have alternate pin functions in addition to being a general purpose I/O pin. When an alternate function is
enabled, it might override the normal port pin function or pin value. This happens when other peripherals that require pins
are enabled or configured to use pins. If and how a peripheral will override and use pins is described in the section for
that peripheral. “Pinout and Pin Functions” on page 61 shows which modules on peripherals that enable alternate
functions on a pin, and which alternate functions that are available on a pin.
INVERTED I/O
Interrupt
Control IREQ
Event
Pn
DQ
R
DQ
R
Synchronizer
INn
EDGE
DETECT
Asynchronous sensing
Synchronous sensing
EDGE
DETECT
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16. TC0/1 – 16-bit Timer/Counter Type 0 and 1
16.1 Features
Five 16-bit timer/counters
Three timer/counters of type 0
Two timer/counters of type 1
Split-mode enabling two 8-bit timer/counter from each timer/counter type 0
32-bit timer/counter support by cascading two timer/counters
Up to four compare or capture (CC) channels
Four CC channels for timer/counters of type 0
Two CC channels for timer/counters of type 1
Double buffered timer period setting
Double buffered capture or compare channels
Waveform generation:
Frequency generation
Single-slope pulse width modulation
Dual-slope pulse width modulation
Input capture:
Input capture with noise cancelling
Frequency capture
Pulse width capture
32-bit input capture
Timer overflow and error interrupts/events
One compare match or input capture interrupt/event per CC channel
Can be used with event system for:
Quadrature decoding
Count and direction control
Capture
Can be used with DMA and to trigger DMA transactions
High-resolution extension
Increases frequency and waveform resolution by 4x (2-bit) or 8x (3-bit)
Advanced waveform extension:
Low- and high-side output with programmable dead-time insertion (DTI)
Event controlled fault protection for safe disabling of drivers
16.2 Overview
Microchip AVR XMEGA devices have a set of five flexible 16-bit Timer/Counters (TC). Their capabilities include accurate
program execution timing, frequency and waveform generation, and input capture with time and frequency measurement
of digital signals. Two timer/counters can be cascaded to create a 32-bit timer/counter with optional 32-bit capture.
A timer/counter consists of a base counter and a set of compare or capture (CC) channels. The base counter can be
used to count clock cycles or events. It has direction control and period setting that can be used for timing. The CC
channels can be used together with the base counter to do compare match control, frequency generation, and pulse
width waveform modulation, as well as various input capture operations. A timer/counter can be configured for either
capture or compare functions, but cannot perform both at the same time.
A timer/counter can be clocked and timed from the peripheral clock with optional prescaling or from the event system.
The event system can also be used for direction control and capture trigger or to synchronize operations.
There are two differences between timer/counter type 0 and type 1. Timer/counter 0 has four CC channels, and
timer/counter 1 has two CC channels. All information related to CC channels 3 and 4 is valid only for timer/counter 0.
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Only Timer/Counter 0 has the split mode feature that split it into two 8-bit Timer/Counters with four compare channels
each.
Some timer/counters have extensions to enable more specialized waveform and frequency generation. The advanced
waveform extension (AWeX) is intended for motor control and other power control applications. It enables low- and high-
side output with dead-time insertion, as well as fault protection for disabling and shutting down external drivers. It can
also generate a synchronized bit pattern across the port pins.
The advanced waveform extension can be enabled to provide extra and more advanced features for the Timer/Counter.
This are only available for Timer/Counter 0. See “AWeX – Advanced Waveform Extension” on page 44 for more details.
The high-resolution (hi-res) extension can be used to increase the waveform output resolution by four or eight times by
using an internal clock source running up to four times faster than the peripheral clock. See “Hi-Res – High Resolution
Extension” on page 45 for more details.
Figure 16-1. Overview of a Timer/Counter and closely related peripherals.
PORTC and PORTD each has one Timer/Counter 0 and one Timer/Counter1. PORTE has one Timer/Conter0. Notation
of these are TCC0 (Time/Counter C0), TCC1, TCD0, TCD1 and TCE0, respectively.
AWeX
Compare/Capture Channel D
Compare/Capture Channel C
Compare/Capture Channel B
Compare/Capture Channel A
Waveform
Generation
Buffer
Comparator
Fault
Protection
Capture
Control
Base Counter
Counter
Control Logic
Timer Period
Prescaler
Dead-Time
Insertion
Pattern
Generation
clk
PER4
Event
System
clk
PER
Timer/Counter
PORT
Hi-Res
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17. TC2 - Timer/Counter Type 2
17.1 Features
Six eight-bit timer/counters
Three Low-byte timer/counter
Three High-byte timer/counter
Up to eight compare channels in each Timer/Counter 2
Four compare channels for the low-byte timer/counter
Four compare channels for the high-byte timer/counter
Waveform generation
Single slope pulse width modulation
Timer underflow interrupts/events
One compare match interrupt/event per compare channel for the low-byte timer/counter
Can be used with the event system for count control
Can be used to trigger DMA transactions
17.2 Overview
There are four Timer/Counter 2. These are realized when a Timer/Counter 0 is set in split mode. It is then a system of
two eight-bit timer/counters, each with four compare channels. This results in eight configurable pulse width modulation
(PWM) channels with individually controlled duty cycles, and is intended for applications that require a high number of
PWM channels.
The two eight-bit timer/counters in this system are referred to as the low-byte timer/counter and high-byte timer/counter,
respectively. The difference between them is that only the low-byte timer/counter can be used to generate compare
match interrupts, events and DMA triggers. The two eight-bit timer/counters have a shared clock source and separate
period and compare settings. They can be clocked and timed from the peripheral clock, with optional prescaling, or from
the event system. The counters are always counting down.
PORTC, and PORTD each has one Timer/Counter 2.
Notation of these are TCC2 (Time/Counter C2) and TCD2, respectively.
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18. AWeX – Advanced Waveform Extension
18.1 Features
Waveform output with complementary output from each compare channel
Four dead-time insertion (DTI) units
8-bit resolution
Separate high and low side dead-time setting
Double buffered dead time
Optionally halts timer during dead-time insertion
Pattern generation unit creating synchronised bit pattern across the port pins
Double buffered pattern generation
Optional distribution of one compare channel output across the port pins
Event controlled fault protection for instant and predictable fault triggering
18.2 Overview
The advanced waveform extension (AWeX) provides extra functions to the timer/counter in waveform generation (WG)
modes. It is primarily intended for use with different types of motor control and other power control applications. It
enables low- and high side output with dead-time insertion and fault protection for disabling and shutting down external
drivers. It can also generate a synchronized bit pattern across the port pins.
Each of the waveform generator outputs from the timer/counter 0 are split into a complimentary pair of outputs when any
AWeX features are enabled. These output pairs go through a dead-time insertion (DTI) unit that generates the non-
inverted low side (LS) and inverted high side (HS) of the WG output with dead-time insertion between LS and HS
switching. The DTI output will override the normal port value according to the port override setting.
The pattern generation unit can be used to generate a synchronized bit pattern on the port it is connected to. In addition,
the WG output from compare channel A can be distributed to and override all the port pins. When the pattern generator
unit is enabled, the DTI unit is bypassed.
The fault protection unit is connected to the event system, enabling any event to trigger a fault condition that will disable
the AWeX output. The event system ensures predictable and instant fault reaction, and gives flexibility in the selection of
fault triggers.
The AWeX is available for TCC0. The notation of this is AWEXC.
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19. Hi-Res – High Resolution Extension
19.1 Features
Increases waveform generator resolution up to 8x (three bits)
Supports frequency, single-slope PWM, and dual-slope PWM generation
Supports the AWeX when this is used for the same timer/counter
19.2 Overview
The high-resolution (hi-res) extension can be used to increase the resolution of the waveform generation output from a
timer/counter by four or eight. It can be used for a timer/counter doing frequency, single-slope PWM, or dual-slope PWM
generation. It can also be used with the AWeX if this is used for the same timer/counter.
The hi-res extension uses the peripheral 4x clock (ClkPER4). The system clock prescalers must be configured so the
peripheral 4x clock frequency is four times higher than the peripheral and CPU clock frequency when the hi-res extension
is enabled.
There are three hi-res extensions that each can be enabled for each timer/counters pair on PORTC, PORTD and
PORTE. The notation of these are HIRESC, HIRESD and HIRESE, respectively.
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20. RTC – 16-bit Real-Time Counter
20.1 Features
16-bit resolution
Selectable clock source
32.768kHz external crystal
External clock
32.768kHz internal oscillator
32kHz internal ULP oscillator
Programmable 10-bit clock prescaling
One compare register
One period register
Clear counter on period overflow
Optional interrupt/event on overflow and compare match
20.2 Overview
The 16-bit real-time counter (RTC) is a counter that typically runs continuously, including in low-power sleep modes, to
keep track of time. It can wake up the device from sleep modes and/or interrupt the device at regular intervals.
The reference clock is typically the 1.024kHz output from a high-accuracy crystal of 32.768kHz, and this is the
configuration most optimized for low power consumption. The faster 32.768kHz output can be selected if the RTC needs
a resolution higher than 1ms. The RTC can also be clocked from an external clock signal, the 32.768kHz internal
oscillator or the 32kHz internal ULP oscillator.
The RTC includes a 10-bit programmable prescaler that can scale down the reference clock before it reaches the
counter. A wide range of resolutions and time-out periods can be configured. With a 32.768kHz clock source, the
maximum resolution is 30.5µs, and time-out periods can range up to 2000 seconds. With a resolution of 1s, the
maximum timeout period is more than18 hours (65536 seconds). The RTC can give a compare interrupt and/or event
when the counter equals the compare register value, and an overflow interrupt and/or event when it equals the period
register value.
Figure 20-1. Real-time counter overview.
32.768kHz Crystal Osc
32.768kHz Int. Osc
TOSC1
TOSC2
External Clock
DIV32
DIV32
32kHz int ULP (DIV32)
RTCSRC
10-bit
prescaler
clkRTC
CNT
PER
COMP
=
=
”match”/
Compare
TOP/
Overflow
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21. USB – Universal Serial Bus Interface
21.1 Features
One USB 2.0 full speed (12Mbps) and low speed (1.5Mbps) device compliant interface
Integrated on-chip USB transceiver, no external components needed
16 endpoint addresses with full endpoint flexibility for up to 31 endpoints
One input endpoint per endpoint address
One output endpoint per endpoint address
Endpoint address transfer type selectable to
Control transfers
Interrupt transfers
Bulk transfers
Isochronous transfers
Configurable data payload size per endpoint, up to 1023 bytes
Endpoint configuration and data buffers located in internal SRAM
Configurable location for endpoint configuration data
Configurable location for each endpoint's data buffer
Built-in direct memory access (DMA) to internal SRAM for:
Endpoint configurations
Reading and writing endpoint data
Ping-pong operation for higher throughput and double buffered operation
Input and output endpoint data buffers used in a single direction
CPU/DMA controller can update data buffer during transfer
Multipacket transfer for reduced interrupt load and software intervention
Data payload exceeding maximum packet size is transferred in one continuous transfer
No interrupts or software interaction on packet transaction level
Transaction complete FIFO for workflow management when using multiple endpoints
Tracks all completed transactions in a first-come, first-served work queue
Clock selection independent of system clock source and selection
Minimum 1.5MHz CPU clock required for low speed USB operation
Minimum 12MHz CPU clock required for full speed operation
Connection to event system
On chip debug possibilities during USB transactions
21.2 Overview
The USB module is a USB 2.0 full speed (12Mbps) and low speed (1.5Mbps) device compliant interface.
The USB supports 16 endpoint addresses. All endpoint addresses have one input and one output endpoint, for a total of
31 configurable endpoints and one control endpoint. Each endpoint address is fully configurable and can be configured
for any of the four transfer types; control, interrupt, bulk, or isochronous. The data payload size is also selectable, and it
supports data payloads up to 1023 bytes.
No dedicated memory is allocated for or included in the USB module. Internal SRAM is used to keep the configuration for
each endpoint address and the data buffer for each endpoint. The memory locations used for endpoint configurations
and data buffers are fully configurable. The amount of memory allocated is fully dynamic, according to the number of
endpoints in use and the configuration of these. The USB module has built-in direct memory access (DMA), and will
read/write data from/to the SRAM when a USB transaction takes place.
To maximize throughput, an endpoint address can be configured for ping-pong operation. When done, the input and
output endpoints are both used in the same direction. The CPU or DMA controller can then read/write one data buffer
while the USB module writes/reads the others, and vice versa. This gives double buffered communication.
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Multipacket transfer enables a data payload exceeding the maximum packet size of an endpoint to be transferred as
multiple packets without software intervention. This reduces the CPU intervention and the interrupts needed for USB
transfers.
For low-power operation, the USB module can put the microcontroller into any sleep mode when the USB bus is idle and
a suspend condition is given. Upon bus resumes, the USB module can wake up the microcontroller from any sleep
mode.
PORTD has one USB. Notation of this is USB.
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22. TWI – Two-Wire Interface
22.1 Features
Two Identical two-wire interface peripherals
Bidirectional, two-wire communication interface
Phillips I2C compatible
System Management Bus (SMBus) compatible
Bus master and slave operation supported
Slave operation
Single bus master operation
Bus master in multi-master bus environment
Multi-master arbitration
Flexible slave address match functions
7-bit and general call address recognition in hardware
10-bit addressing supported
Address mask register for dual address match or address range masking
Optional software address recognition for unlimited number of addresses
Slave can operate in all sleep modes, including power-down
Slave address match can wake device from all sleep modes
100kHz and 400kHz bus frequency support
Slew-rate limited output drivers
Input filter for bus noise and spike suppression
Support arbitration between start/repeated start and data bit (SMBus)
Slave arbitration allows support for address resolve protocol (ARP) (SMBus)
22.2 Overview
The two-wire interface (TWI) is a bidirectional, two-wire communication interface. It is I2C and System Management Bus
(SMBus) compatible. The only external hardware needed to implement the bus is one pull-up resistor on each bus line.
A device connected to the bus must act as a master or a slave. The master initiates a data transaction by addressing a
slave on the bus and telling whether it wants to transmit or receive data. One bus can have many slaves and one or
several masters that can take control of the bus. An arbitration process handles priority if more than one master tries to
transmit data at the same time. Mechanisms for resolving bus contention are inherent in the protocol.
The TWI module supports master and slave functionality. The master and slave functionality are separated from each
other, and can be enabled and configured separately. The master module supports multi-master bus operation and
arbitration. It contains the baud rate generator. Both 100kHz and 400kHz bus frequency is supported. Quick command
and smart mode can be enabled to auto-trigger operations and reduce software complexity.
The slave module implements 7-bit address match and general address call recognition in hardware. 10-bit addressing is
also supported. A dedicated address mask register can act as a second address match register or as a register for
address range masking. The slave continues to operate in all sleep modes, including power-down mode. This enables
the slave to wake up the device from all sleep modes on TWI address match. It is possible to disable the address
matching to let this be handled in software instead.
The TWI module will detect START and STOP conditions, bus collisions, and bus errors. Arbitration lost, errors, collision,
and clock hold on the bus are also detected and indicated in separate status flags available in both master and slave
modes.
It is possible to disable the TWI drivers in the device, and enable a four-wire digital interface for connecting to an external
TWI bus driver. This can be used for applications where the device operates from a different VCC voltage than used by
the TWI bus.
PORTC and PORTE each has one TWI. Notation of these peripherals are TWIC and TWIE.
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23. SPI – Serial Peripheral Interface
23.1 Features
Two Identical SPI peripherals
Full-duplex, three-wire synchronous data transfer
Master or slave operation
Lsb first or msb first data transfer
Eight programmable bit rates
Interrupt flag at the end of transmission
Write collision flag to indicate data collision
Wake up from idle sleep mode
Double speed master mode
23.2 Overview
The Serial Peripheral Interface (SPI) is a high-speed synchronous data transfer interface using three or four pins. It
allows fast communication between an Microchip AVR XMEGA device and peripheral devices or between several
microcontrollers. The SPI supports full-duplex communication.
A device connected to the bus must act as a master or slave. The master initiates and controls all data transactions.
PORTC and PORTD each has one SPI. Notation of these peripherals are SPIC and SPID.
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24. USART
24.1 Features
Five identical USART peripherals
Full-duplex operation
Asynchronous or synchronous operation
Synchronous clock rates up to 1/2 of the device clock frequency
Asynchronous clock rates up to 1/8 of the device clock frequency
Supports serial frames with 5, 6, 7, 8, or 9 data bits and 1 or 2 stop bits
Fractional baud rate generator
Can generate desired baud rate from any system clock frequency
No need for external oscillator with certain frequencies
Built-in error detection and correction schemes
Odd or even parity generation and parity check
Data overrun and framing error detection
Noise filtering includes false start bit detection and digital low-pass filter
Separate interrupts for
Transmit complete
Transmit data register empty
Receive complete
Multiprocessor communication mode
Addressing scheme to address a specific devices on a multidevice bus
Enable unaddressed devices to automatically ignore all frames
Master SPI mode
Double buffered operation
Operation up to 1/2 of the peripheral clock frequency
IRCOM module for IrDA compliant pulse modulation/demodulation
24.2 Overview
The universal synchronous and asynchronous serial receiver and transmitter (USART) is a fast and flexible serial
communication module. The USART supports full-duplex communication and asynchronous and synchronous operation.
The USART can be configured to operate in SPI master mode and used for SPI communication.
Communication is frame based, and the frame format can be customized to support a wide range of standards. The
USART is buffered in both directions, enabling continued data transmission without any delay between frames. Separate
interrupts for receive and transmit complete enable fully interrupt driven communication. Frame error and buffer overflow
are detected in hardware and indicated with separate status flags. Even or odd parity generation and parity check can
also be enabled.
The clock generator includes a fractional baud rate generator that is able to generate a wide range of USART baud rates
from any system clock frequencies. This removes the need to use an external crystal oscillator with a specific frequency
to achieve a required baud rate. It also supports external clock input in synchronous slave operation.
When the USART is set in master SPI mode, all USART-specific logic is disabled, leaving the transmit and receive
buffers, shift registers, and baud rate generator enabled. Pin control and interrupt generation are identical in both modes.
The registers are used in both modes, but their functionality differs for some control settings.
An IRCOM module can be enabled for one USART to support IrDA 1.4 physical compliant pulse modulation and
demodulation for baud rates up to 115.2Kbps.
PORTC and PORTD each has two USARTs. PORTE has one USART. Notation of these peripherals are USARTC0,
USARTC1, USARTD0, USARTD1 and USARTE0, respectively.
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25. IRCOM – IR Communication Module
25.1 Features
Pulse modulation/demodulation for infrared communication
IrDA compatible for baud rates up to 115.2Kbps
Selectable pulse modulation scheme
3/16 of the baud rate period
Fixed pulse period, 8-bit programmable
Pulse modulation disabled
Built-in filtering
Can be connected to and used by any USART
25.2 Overview
Microchip AVR XMEGA devices contain an infrared communication module (IRCOM) that is IrDA compatible for baud
rates up to 115.2Kbps. It can be connected to any USART to enable infrared pulse encoding/decoding for that USART.
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26. AES and DES Crypto Engine
26.1 Features
Data Encryption Standard (DES) CPU instruction
Advanced Encryption Standard (AES) crypto module
DES Instruction
Encryption and decryption
DES supported
Encryption/decryption in 16 CPU clock cycles per 8-byte block
AES crypto module
Encryption and decryption
Supports 128-bit keys
Supports XOR data load mode to the state memory
Encryption/decryption in 375 clock cycles per 16-byte block
26.2 Overview
The Advanced Encryption Standard (AES) and Data Encryption Standard (DES) are two commonly used standards for
cryptography. These are supported through an AES peripheral module and a DES CPU instruction, and the
communication interfaces and the CPU can use these for fast, encrypted communication and secure data storage.
DES is supported by an instruction in the AVR CPU. The 8-byte key and 8-byte data blocks must be loaded into the
register file, and then the DES instruction must be executed 16 times to encrypt/decrypt the data block.
The AES crypto module encrypts and decrypts 128-bit data blocks with the use of a 128-bit key. The key and data must
be loaded into the key and state memory in the module before encryption/decryption is started. It takes 375 peripheral
clock cycles before the encryption/decryption is done. The encrypted/encrypted data can then be read out, and an
optional interrupt can be generated. The AES crypto module also has DMA support with transfer triggers when
encryption/decryption is done and optional auto-start of encryption/decryption when the state memory is fully loaded.
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27. CRC – Cyclic Redundancy Check Generator
27.1 Features
Cyclic redundancy check (CRC) generation and checking for
Communication data
Program or data in flash memory
Data in SRAM and I/O memory space
Integrated with flash memory, DMA controller and CPU
Continuous CRC on data going through a DMA channel
Automatic CRC of the complete or a selectable range of the flash memory
CPU can load data to the CRC generator through the I/O interface
CRC polynomial software selectable to
CRC-16 (CRC-CCITT)
CRC-32 (IEEE 802.3)
Zero remainder detection
27.2 Overview
A cyclic redundancy check (CRC) is an error detection technique test algorithm used to find accidental errors in data, and
it is commonly used to determine the correctness of a data transmission, and data present in the data and program
memories. A CRC takes a data stream or a block of data as input and generates a 16- or 32-bit output that can be
appended to the data and used as a checksum. When the same data are later received or read, the device or application
repeats the calculation. If the new CRC result does not match the one calculated earlier, the block contains a data error.
The application will then detect this and may take a corrective action, such as requesting the data to be sent again or
simply not using the incorrect data.
Typically, an n-bit CRC applied to a data block of arbitrary length will detect any single error burst not longer than n bits
(any single alteration that spans no more than n bits of the data), and will detect the fraction 1-2-n of all longer error
bursts. The CRC module in Microchip AVR XMEGA devices supports two commonly used CRC polynomials; CRC-16
(CRC-CCITT) and CRC-32 (IEEE 802.3).
CRC-16:
CRC-32:
Polynomial: x16+x12+x5+1
Hex value: 0x1021
Polynomial: x32+x26+x23+x22+x16+x12+x11+x10+x8+x7+x5+x4+x2+x+1
Hex value: 0x04C11DB7
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28. ADC – 12-bit Analog to Digital Converter
28.1 Features
One Analog to Digital Converter (ADC)
12-bit resolution
Up to two million samples per second
Two inputs can be sampled simultaneously using ADC and 1x gain stage
Four inputs can be sampled within 1.5µs
Down to 2.5µs conversion time with 8-bit resolution
Down to 3.5µs conversion time with 12-bit resolution
Differential and single-ended input
Up to 12 single-ended inputs
12x4 differential inputs without gain
8x4 differential inputs with gain
Built-in differential gain stage
1/2x, 1x, 2x, 4x, 8x, 16x, 32x, and 64x gain options
Single, continuous and scan conversion options
Four internal inputs
Internal temperature sensor
DAC output
AVCC voltage divided by 10
1.1V bandgap voltage
Four conversion channels with individual input control and result registers
Enable four parallel configurations and results
Internal and external reference options
Compare function for accurate monitoring of user defined thresholds
Optional event triggered conversion for accurate timing
Optional DMA transfer of conversion results
Optional interrupt/event on compare result
28.2 Overview
The ADC converts analog signals to digital values. The ADC has 12-bit resolution and is capable of converting up to two
million samples per second (msps). The input selection is flexible, and both single-ended and differential measurements
can be done. For differential measurements, an optional gain stage is available to increase the dynamic range. In
addition, several internal signal inputs are available. The ADC can provide both signed and unsigned results.
This is a pipelined ADC that consists of several consecutive stages. The pipelined design allows a high sample rate at a
low system clock frequency. It also means that a new input can be sampled and a new ADC conversion started while
other ADC conversions are still ongoing. This removes dependencies between sample rate and propagation delay.
The ADC has four conversion channels (0-3) with individual input selection, result registers, and conversion start control.
The ADC can then keep and use four parallel configurations and results, and this will ease use for applications with high
data throughput or for multiple modules using the ADC independently. It is possible to use DMA to move ADC results
directly to memory or peripherals when conversions are done.
Both internal and external reference voltages can be used. An integrated temperature sensor is available for use with the
ADC. The output from the DAC, AVCC/10 and the bandgap voltage can also be measured by the ADC.
The ADC has a compare function for accurate monitoring of user defined thresholds with minimum software intervention
required.
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Figure 28-1. ADC overview.
Two inputs can be sampled simultaneously as both the ADC and the gain stage include sample and hold circuits, and the
gain stage has 1x gain setting. Four inputs can be sampled within 1.5µs without any intervention by the application.
The ADC may be configured for 8- or 12-bit result, reducing the minimum conversion time (propagation delay) from 3.5µs
for 12-bit to 2.5µs for 8-bit result.
ADC conversion results are provided left- or right adjusted with optional ‘1’ or ‘0’ padding. This eases calculation when
the result is represented as a signed integer (signed 16-bit number).
PORTA has one ADC. Notation of this peripheral is ADCA.
CH1 Result
CH0 Result
CH2 Result
Compare
<
>Threshold
(Int Req)
Internal 1.00V
Internal AVCC/1.6V
AREFA
AREFB
V
INP
V
INN
Internal
signals
Internal AVCC/2
Internal
signals
CH3 Result
ADC0
ADC7
ADC4
ADC7
ADC0
ADC3
•
•
•
Int. signals
Int. signals
Reference
Voltage
½x - 64x
•
•
•
•
•
•
ADC0
ADC11
•
•
•
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29. DAC – 12-bit Digital to Analog Converter
29.1 Features
One Digital to Analog Converter (DAC)
12-bit resolution
Two independent, continuous-drive output channels
Up to one million samples per second conversion rate per DAC channel
Built-in calibration that removes:
Offset error
Gain error
Multiple conversion trigger sources
On new available data
Events from the event system
High drive capabilities and support for
Resistive loads
Capacitive loads
Combined resistive and capacitive loads
Internal and external reference options
DAC output available as input to analog comparator and ADC
Low-power mode, with reduced drive strength
Optional DMA transfer of data
29.2 Overview
The digital-to-analog converter (DAC) converts digital values to voltages. The DAC has two channels, each with 12-bit
resolution, and is capable of converting up to one million samples per second (msps) on each channel. The built-in
calibration system can remove offset and gain error when loaded with calibration values from software.
Figure 29-1. DAC overview.
DAC0
DAC1
CTRLA
CH1DATA
CH0DATA
Trigger
Trigger
Internal Output
enable
Enable
Internal 1.00V
AREFA
AREFB
Reference
selection
AVCC
Output
Driver
Output
Driver
D
A
T
A
Int.
driver
D
A
T
A
CTRLB
DMA req
(Data Empty)
DMA req
(Data Empty)
Select
12
12
Select
Enable
To
AC/ADC
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A DAC conversion is automatically started when new data to be converted are available. Events from the event system
can also be used to trigger a conversion, and this enables synchronized and timed conversions between the DAC and
other peripherals, such as a timer/counter. The DMA controller can be used to transfer data to the DAC.
The DAC has high drive strength, and is capable of driving both resistive and capacitive loads, aswell as loads which
combine both. A low-power mode is available, which will reduce the drive strength of the output. Internal and external
voltage references can be used. The DAC output is also internally available for use as input to the analog comparator or
ADC.
PORTB has one DAC. Notation of this peripheral is DACB.
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30. AC – Analog Comparator
30.1 Features
Two Analog Comparators (ACs)
Selectable propagation delay versus current consumption
Selectable hysteresis
No
Small
Large
Analog comparator output available on pin
Flexible input selection
All pins on the port
Output from the DAC
Bandgap reference voltage
A 64-level programmable voltage scaler of the internal AVCC voltage
Interrupt and event generation on:
Rising edge
Falling edge
Toggle
Window function interrupt and event generation on:
Signal above window
Signal inside window
Signal below window
Constant current source with configurable output pin selection
30.2 Overview
The analog comparator (AC) compares the voltage levels on two inputs and gives a digital output based on this
comparison. The analog comparator may be configured to generate interrupt requests and/or events upon several
different combinations of input change.
Two important properties of the analog comparator’s dynamic behavior are: hysteresis and propagation delay. Both of
these parameters may be adjusted in order to achieve the optimal operation for each application.
The input selection includes analog port pins, several internal signals, and a 64-level programmable voltage scaler. The
analog comparator output state can also be output on a pin for use by external devices.
A constant current source can be enabled and output on a selectable pin. This can be used to replace, for example,
external resistors used to charge capacitors in capacitive touch sensing applications.
The analog comparators are always grouped in pairs on each port. These are called analog comparator 0 (AC0) and
analog comparator 1 (AC1). They have identical behavior, but separate control registers. Used as pair, they can be set in
window mode to compare a signal to a voltage range instead of a voltage level.
PORTA has one AC pair. Notation is ACA.
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Figure 30-1. Analog comparator overview.
The window function is realized by connecting the external inputs of the two analog comparators in a pair as shown in
Figure 30-2.
Figure 30-2. Analog comparator window function.
ACnMUXCTRL ACnCTRL
Interrupt
Mode
Enable
Enable
Hysteresis
Hysteresis
AC1OUT
WINCTRL
Interrupt
Sensititivity
Control
&
Window
Function
Events
Interrupts
AC0OUT
Pin Input
Pin Input
Pin Input
Pin Input
Voltage
Scaler
DAC
Bandgap
AC0
+
-
AC1
+
-
Input signal
Upper limit of window
Lower limit of window
Interrupt
sensitivity
control
Interrupts
Events
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31. Programming and Debugging
31.1 Features
Programming
External programming through PDI interface
Minimal protocol overhead for fast operation
Built-in error detection and handling for reliable operation
Boot loader support for programming through any communication interface
Debugging
Nonintrusive, real-time, on-chip debug system
No software or hardware resources required from device except pin connection
Program flow control
Go, Stop, Reset, Step Into, Step Over, Step Out, Run-to-Cursor
Unlimited number of user program breakpoints
Unlimited number of user data breakpoints, break on:
Data location read, write, or both read and write
Data location content equal or not equal to a value
Data location content is greater or smaller than a value
Data location content is within or outside a range
No limitation on device clock frequency
Program and Debug Interface (PDI)
Two-pin interface for external programming and debugging
Uses the Reset pin and a dedicated pin
No I/O pins required during programming or debugging
31.2 Overview
The Program and Debug Interface (PDI) is an Microchip proprietary interface for external programming and on-chip
debugging of a device.
The PDI supports fast programming of nonvolatile memory (NVM) spaces; flash, EEPOM, fuses, lock bits, and the user
signature row.
Debug is supported through an on-chip debug system that offers nonintrusive, real-time debug. It does not require any
software or hardware resources except for the device pin connection. Using the Microchip tool chain, it offers complete
program flow control and support for an unlimited number of program and complex data breakpoints. Application debug
can be done from a C or other high-level language source code level, as well as from an assembler and disassembler
level.
Programming and debugging can be done through the PDI physical layer. This is a two-pin interface that uses the Reset
pin for the clock input (PDI_CLK) and one other dedicated pin for data input and output (PDI_DATA). Any external
programmer or on-chip debugger/emulator can be directly connected to this interface.
32. Pinout and Pin Functions
The device pinout is shown in “Pinout/Block Diagram” on page 10. In addition to general purpose I/O functionality, each
pin can have several alternate functions. This will depend on which peripheral is enabled and connected to the actual pin.
Only one of the pin functions can be used at time.
32.1 Alternate Pin Function Description
The tables below show the notation for all pin functions available and describe its function.
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32.1.1 Operation/Power Supply
32.1.2 Port Interrupt functions
32.1.3 Analog functions
32.1.4 Timer/Counter and AWEX functions
VCC Digital supply voltage
AVCC Analog supply voltage
GND Ground
SYNC Port pin with full synchronous and limited asynchronous interrupt function
ASYNC Port pin with full synchronous and full asynchronous interrupt function
ACn Analog Comparator input pin n
ACnOUT Analog Comparator n Output
ADCn Analog to Digital Converter input pin n
DACn Digital to Analog Converter output pin n
AREF Analog Reference input pin
OCnxLS Output Compare Channel x Low Side for Timer/Counter n
OCnxHS Output Compare Channel x High Side for Timer/Counter n
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32.1.5 Communication functions
32.1.6 Oscillators, Clock and Event
32.1.7 Debug/System functions
SCL Serial Clock for TWI
SDA Serial Data for TWI
SCLIN Serial Clock In for TWI when external driver interface is enabled
SCLOUT Serial Clock Out for TWI when external driver interface is enabled
SDAIN Serial Data In for TWI when external driver interface is enabled
SDAOUT Serial Data Out for TWI when external driver interface is enabled
XCKn Transfer Clock for USART n
RXDn Receiver Data for USART n
TXDn Transmitter Data for USART n
SS Slave Select for SPI
MOSI Master Out Slave In for SPI
MISO Master In Slave Out for SPI
SCK Serial Clock for SPI
D- Data- for USB
D+ Data+ for USB
TOSCn Timer Oscillator pin n
XTALn Input/Output for Oscillator pin n
CLKOUT Peripheral Clock Output
EVOUT Event Channel Output
RTCOUT RTC Clock Source Output
RESET Reset pin
PDI_CLK Program and Debug Interface Clock pin
PDI_DATA Program and Debug Interface Data pin
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32.2 Alternate Pin Functions
The tables below show the primary/default function for each pin on a port in the first column, the pin number in the
second column, and then all alternate pin functions in the remaining columns. The head row shows what peripheral that
enable and use the alternate pin functions.
For better flexibility, some alternate functions also have selectable pin locations for their functions, this is noted under the
first table where this apply.
Table 32-1. Port A - alternate functions.
Table 32-2. Port B - alternate functions.
PORT A PIN # INTERRUPT ADCA POS/
GAINPOS
ADCA NEG ADCA
GAINNEG
ACA POS ACA NEG ACAOUT REFA
GND 38
AVCC 39
PA0 40 SYNC ADC0 ADC0 AC0 AC0 AREF
PA1 41 SYNC ADC1 ADC1 AC1 AC1
PA2 42 SYNC/ASYNC ADC2 ADC2 AC2
PA3 43 SYNC ADC3 ADC3 AC3 AC3
PA4 44 SYNC ADC4 ADC4 AC4
PA5 1SYNC ADC5 ADC5 AC5 AC5
PA6 2SYNC ADC6 ADC6 AC6 AC1OUT
PA7 3SYNC ADC7 ADC7 AC7 AC0OUT
PORT B PIN # INTERRUPT ADCA POS DACB REFB
PB0 4SYNC ADC8 AREF
PB1 5SYNC ADC9
PB2 6SYNC/ASYNC ADC10 DAC0
PB3 7SYNC ADC11 DAC1
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Table 32-3. Port C - alternate functions.
Notes: 1. Pin mapping of all TC0 can optionally be moved to high nibble of port
2. If TC0 is configured as TC2 all eight pins can be used for PWM output.
3. Pin mapping of all USART0 can optionally be moved to high nibble of port.
4. Pins MOSI and SCK for all SPI can optionally be swapped.
5. CLKOUT can optionally be moved between port C, D and E and between pin 4 and 7.
6. EVOUT can optionally be moved between port C, D and E and between pin 4 and 7.
Table 32-4. Port D - alternate functions.
PORT C PIN # INTERRUPT TCC0
(1)(2)
AWEXC TCC1 USART
C0(3)
USART
C1
SPIC(4) TWIC TWIC
w/ext
driver
CLOCKOUT
(5)
EVENTOUT
(6)
GND 8
VCC 9
PC0 10 SYNC OC0A OC0ALS SDA SDAIN
PC1 11 SYNC OC0B OC0AHS XCK0 SCL SCLIN
PC2 12 SYNC/
ASYNC OC0C OC0BLS RXD0 SDAOUT
PC3 13 SYNC OC0D OC0BHS TXD0 SCLOUT
PC4 14 SYNC OC0CLS OC1A SS
PC5 15 SYNC OC0CHS OC1B XCK1 MOSI
PC6 16 SYNC OC0DLS RXD1 MISO clkRTC
PC7 17 SYNC OC0DHS TXD1 SCK clkPER EVOUT
PORT D PIN # INTERRUPT TCD0 TCD1 USB USARTD0 USARTD1 SPID CLOCKOUT EVENTOUT
GND 18
VCC 19
PD0 20 SYNC OC0A
PD1 21 SYNC OC0B XCK0
PD2 22 SYNC/ASYNC OC0C RXD0
PD3 23 SYNC OC0D TXD0
PD4 24 SYNC OC1A SS
PD5 25 SYNC OC1B XCK1 MOSI
PD6 26 SYNC D- RXD1 MISO
PD7 27 SYNC D+ TXD1 SCK clkPER EVOUT
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Table 32-5. Port E - alternate functions.
Table 32-6. Port R - alternate functions.
Note: 1. TOSC pins can optionally be moved to PE2/PE3.
PORT E PIN # INTERRUPT TCE0 USARTE0 TWIE
PE0 28 SYNC OC0A SDA
PE1 29 SYNC OC0B XCK0 SCL
GND 30
VCC 31
PE2 32 SYNC/ASYNC OC0C RXD0
PE3 33 SYNC OC0D TXD0
PORT R PIN # INTERRUPT PDI XTAL TOSC(1)
PDI 34 PDI_DATA
RESET 35 PDI_CLOCK
PR0 36 SYNC XTAL2 TOSC2
PR1 37 SYNC XTAL1 TOSC1
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33. Peripheral Module Address Map
The address maps show the base address for each peripheral and module in Microchip AVR XMEGA® A4U. For
complete register description and summary for each peripheral module, refer to the XMEGA AU manual.
Table 33-1. Peripheral module address map.
Base address Name Description
0x0000 GPIO General Purpose IO Registers
0x0010 VPORT0 Virtual Port 0
0x0014 VPORT1 Virtual Port 1
0x0018 VPORT2 Virtual Port 2
0x001C VPORT3 Virtual Port 2
0x0030 CPU CPU
0x0040 CLK Clock Control
0x0048 SLEEP Sleep Controller
0x0050 OSC Oscillator Control
0x0060 DFLLRC32M DFLL for the 32MHz Internal RC Oscillator
0x0068 DFLLRC2M DFLL for the 2MHz RC Oscillator
0x0070 PR Power Reduction
0x0078 RST Reset Controller
0x0080 WDT Watch-Dog Timer
0x0090 MCU MCU Control
0x00A0 PMIC Programmable MUltilevel Interrupt Controller
0x00B0 PORTCFG Port Configuration
0x00C0 AES AES Module
0x00D0 CRC CRC Module
0x0100 DMA DMA Module
0x0180 EVSYS Event System
0x01C0 NVM Non Volatile Memory (NVM) Controller
0x0200 ADCA Analog to Digital Converter on port A
0x0380 ACA Analog Comparator pair on port A
0x0400 RTC Real Time Counter
0x0480 TWIC Two Wire Interface on port C
0x04A0 TWIE Two Wire Interface on port E
0x04C0 USB Universal Serial Bus Interface
0x0600 PORTA Port A
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0x0620 PORTB Port B
0x0640 PORTC Port C
0x0660 PORTD Port D
0x0680 PORTE Port E
0x07E0 PORTR Port R
0x0800 TCC0 Timer/Counter 0 on port C
0x0840 TCC1 Timer/Counter 1 on port C
0x0880 AWEXC Advanced Waveform Extension on port C
0x0890 HIRESC High Resolution Extension on port C
0x08A0 USARTC0 USART 0 on port C
0x08B0 USARTC1 USART 1 on port C
0x08C0 SPIC Serial Peripheral Interface on port C
0x08F8 IRCOM Infrared Communication Module
0x0900 TCD0 Timer/Counter 0 on port D
0x0940 TCD1 Timer/Counter 1 on port D
0x0990 HIRESD High Resolution Extension on port D
0x09A0 USARTD0 USART 0 on port D
0x09B0 USARTD1 USART 1 on port D
0x09C0 SPID Serial Peripheral Interface on port D
0x0A00 TCE0 Timer/Counter 0 on port E
0x0A80 AWEXE Advanced Waveform Extensionon port E
0x0A90 HIRESE High Resolution Extension on port E
0x0AA0 USARTE0 USART 0 on port E
Base address Name Description
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 69
34. Instruction Set Summary
Mnemonic
s
Operand
sDescription Operation Flags
#Clock
s
Arithmetic and Logic Instructions
ADD Rd, Rr Add without Carry Rd Rd + Rr Z,C,N,V,S,H 1
ADC Rd, Rr Add with Carry Rd Rd + Rr + C Z,C,N,V,S,H 1
ADIW Rd, K Add Immediate to Word Rd Rd + 1:Rd + K Z,C,N,V,S 2
SUB Rd, Rr Subtract without Carry Rd Rd - Rr Z,C,N,V,S,H 1
SUBI Rd, K Subtract Immediate Rd Rd - K Z,C,N,V,S,H 1
SBC Rd, Rr Subtract with Carry Rd Rd - Rr - C Z,C,N,V,S,H 1
SBCI Rd, K Subtract Immediate with Carry Rd Rd - K - C Z,C,N,V,S,H 1
SBIW Rd, K Subtract Immediate from Word Rd + 1:Rd Rd + 1:Rd - K Z,C,N,V,S 2
AND Rd, Rr Logical AND Rd Rd Rr Z,N,V,S 1
ANDI Rd, K Logical AND with Immediate Rd Rd K Z,N,V,S 1
OR Rd, Rr Logical OR Rd Rd v Rr Z,N,V,S 1
ORI Rd, K Logical OR with Immediate Rd Rd v K Z,N,V,S 1
EOR Rd, Rr Exclusive OR Rd Rd Rr Z,N,V,S 1
COM Rd One’s Complement Rd $FF - Rd Z,C,N,V,S 1
NEG Rd Two’s Complement Rd $00 - Rd Z,C,N,V,S,H 1
SBR Rd,K Set Bit(s) in Register Rd Rd v K Z,N,V,S 1
CBR Rd,K Clear Bit(s) in Register Rd Rd ($FFh - K) Z,N,V,S 1
INC Rd Increment Rd Rd + 1 Z,N,V,S 1
DEC Rd Decrement Rd Rd - 1 Z,N,V,S 1
TST Rd Test for Zero or Minus Rd Rd Rd Z,N,V,S 1
CLR Rd Clear Register Rd Rd Rd Z,N,V,S 1
SER Rd Set Register Rd $FF None 1
MUL Rd,Rr Multiply Unsigned R1:R0 Rd x Rr (UU) Z,C 2
MULS Rd,Rr Multiply Signed R1:R0 Rd x Rr (SS) Z,C 2
MULSU Rd,Rr Multiply Signed with Unsigned R1:R0 Rd x Rr (SU) Z,C 2
FMUL Rd,Rr Fractional Multiply Unsigned R1:R0 Rd x Rr<<1 (UU) Z,C 2
FMULS Rd,Rr Fractional Multiply Signed R1:R0 Rd x Rr<<1 (SS) Z,C 2
FMULSU Rd,Rr Fractional Multiply Signed with Unsigned R1:R0 Rd x Rr<<1 (SU) Z,C 2
DES KData Encryption if (H = 0) then R15:R0
else if (H = 1) then R15:R0
Encrypt(R15:R0, K)
Decrypt(R15:R0, K)
1/2
Branch instructions
RJMP kRelative Jump PC PC + k + 1 None 2
IJMP Indirect Jump to (Z) PC(15:0)
PC(21:16)
Z,
0
None 2
EIJMP Extended Indirect Jump to (Z) PC(15:0)
PC(21:16)
Z,
EIND
None 2
JMP kJump PC kNone 3
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 70
RCALL kRelative Call Subroutine PC PC + k + 1 None 2 / 3 (1)
ICALL Indirect Call to (Z) PC(15:0)
PC(21:16)
Z,
0
None 2 / 3 (1)
EICALL Extended Indirect Call to (Z) PC(15:0)
PC(21:16)
Z,
EIND
None 3 (1)
CALL kcall Subroutine PC kNone 3 / 4 (1)
RET Subroutine Return PC STACK None 4 / 5 (1)
RETI Interrupt Return PC STACK I4 / 5 (1)
CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC PC + 2 or 3 None 1 / 2 / 3
CP Rd,Rr Compare Rd - Rr Z,C,N,V,S,H 1
CPC Rd,Rr Compare with Carry Rd - Rr - C Z,C,N,V,S,H 1
CPI Rd,K Compare with Immediate Rd - K Z,C,N,V,S,H 1
SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b) = 0) PC PC + 2 or 3 None 1 / 2 / 3
SBRS Rr, b Skip if Bit in Register Set if (Rr(b) = 1) PC PC + 2 or 3 None 1 / 2 / 3
SBIC A, b Skip if Bit in I/O Register Cleared if (I/O(A,b) = 0) PC PC + 2 or 3 None 2 / 3 / 4
SBIS A, b Skip if Bit in I/O Register Set If (I/O(A,b) =1) PC PC + 2 or 3 None 2 / 3 / 4
BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC PC + k + 1 None 1 / 2
BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC PC + k + 1 None 1 / 2
BREQ k Branch if Equal if (Z = 1) then PC PC + k + 1 None 1 / 2
BRNE k Branch if Not Equal if (Z = 0) then PC PC + k + 1 None 1 / 2
BRCS k Branch if Carry Set if (C = 1) then PC PC + k + 1 None 1 / 2
BRCC k Branch if Carry Cleared if (C = 0) then PC PC + k + 1 None 1 / 2
BRSH k Branch if Same or Higher if (C = 0) then PC PC + k + 1 None 1 / 2
BRLO k Branch if Lower if (C = 1) then PC PC + k + 1 None 1 / 2
BRMI k Branch if Minus if (N = 1) then PC PC + k + 1 None 1 / 2
BRPL k Branch if Plus if (N = 0) then PC PC + k + 1 None 1 / 2
BRGE k Branch if Greater or Equal, Signed if (N V= 0) then PC PC + k + 1 None 1 / 2
BRLT k Branch if Less Than, Signed if (N V= 1) then PC PC + k + 1 None 1 / 2
BRHS k Branch if Half Carry Flag Set if (H = 1) then PC PC + k + 1 None 1 / 2
BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC PC + k + 1 None 1 / 2
BRTS k Branch if T Flag Set if (T = 1) then PC PC + k + 1 None 1 / 2
BRTC k Branch if T Flag Cleared if (T = 0) then PC PC + k + 1 None 1 / 2
BRVS k Branch if Overflow Flag is Set if (V = 1) then PC PC + k + 1 None 1 / 2
BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC PC + k + 1 None 1 / 2
BRIE k Branch if Interrupt Enabled if (I = 1) then PC PC + k + 1 None 1 / 2
BRID k Branch if Interrupt Disabled if (I = 0) then PC PC + k + 1 None 1 / 2
Data transfer instructions
MOV Rd, Rr Copy Register Rd Rr None 1
Mnemonic
s
Operand
sDescription Operation Flags
#Clock
s
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 71
MOVW Rd, Rr Copy Register Pair Rd+1:Rd Rr+1:Rr None 1
LDI Rd, K Load Immediate Rd KNone 1
LDS Rd, k Load Direct from data space Rd (k) None 2 (1)(2)
LD Rd, X Load Indirect Rd (X) None 1 (1)(2)
LD Rd, X+ Load Indirect and Post-Increment Rd
X
(X)
X + 1
None 1 (1)(2)
LD Rd, -X Load Indirect and Pre-Decrement X X - 1,
Rd (X)
X - 1
(X)
None 2 (1)(2)
LD Rd, Y Load Indirect Rd (Y) (Y) None 1 (1)(2)
LD Rd, Y+ Load Indirect and Post-Increment Rd
Y
(Y)
Y + 1
None 1 (1)(2)
LD Rd, -Y Load Indirect and Pre-Decrement Y
Rd
Y - 1
(Y)
None 2 (1)(2)
LDD Rd, Y+q Load Indirect with Displacement Rd (Y + q) None 2 (1)(2)
LD Rd, Z Load Indirect Rd (Z) None 1 (1)(2)
LD Rd, Z+ Load Indirect and Post-Increment Rd
Z
(Z),
Z+1
None 1 (1)(2)
LD Rd, -Z Load Indirect and Pre-Decrement Z
Rd
Z - 1,
(Z)
None 2 (1)(2)
LDD Rd, Z+q Load Indirect with Displacement Rd (Z + q) None 2 (1)(2)
STS k, Rr Store Direct to Data Space (k) Rd None 2 (1)
ST X, Rr Store Indirect (X) Rr None 1 (1)
ST X+, Rr Store Indirect and Post-Increment (X)
X
Rr,
X + 1
None 1 (1)
ST -X, Rr Store Indirect and Pre-Decrement X
(X)
X - 1,
Rr
None 2 (1)
ST Y, Rr Store Indirect (Y) Rr None 1 (1)
ST Y+, Rr Store Indirect and Post-Increment (Y)
Y
Rr,
Y + 1
None 1 (1)
ST -Y, Rr Store Indirect and Pre-Decrement Y
(Y)
Y - 1,
Rr
None 2 (1)
STD Y+q, Rr Store Indirect with Displacement (Y + q) Rr None 2 (1)
ST Z, Rr Store Indirect (Z) Rr None 1 (1)
ST Z+, Rr Store Indirect and Post-Increment (Z)
Z
Rr
Z + 1
None 1 (1)
ST -Z, Rr Store Indirect and Pre-Decrement ZZ - 1 None 2 (1)
STD Z+q,Rr Store Indirect with Displacement (Z + q) Rr None 2 (1)
LPM Load Program Memory R0 (Z) None 3
LPM Rd, Z Load Program Memory Rd (Z) None 3
LPM Rd, Z+ Load Program Memory and Post-Increment Rd
Z
(Z),
Z + 1
None 3
ELPM Extended Load Program Memory R0 (RAMPZ:Z) None 3
ELPM Rd, Z Extended Load Program Memory Rd (RAMPZ:Z) None 3
Mnemonic
s
Operand
sDescription Operation Flags
#Clock
s
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 72
ELPM Rd, Z+ Extended Load Program Memory and Post-
Increment
Rd
Z
(RAMPZ:Z),
Z + 1
None 3
SPM Store Program Memory (RAMPZ:Z) R1:R0 None -
SPM Z+ Store Program Memory and Post-Increment
by 2
(RAMPZ:Z)
Z
R1:R0,
Z + 2
None -
IN Rd, A In From I/O Location Rd I/O(A) None 1
OUT A, Rr Out To I/O Location I/O(A) Rr None 1
PUSH Rr Push Register on Stack STACK Rr None 1 (1)
POP Rd Pop Register from Stack Rd STACK None 2 (1)
XCH Z, Rd Exchange RAM location Temp
Rd
(Z)
Rd,
(Z),
Temp
None 2
LAS Z, Rd Load and Set RAM location Temp
Rd
(Z)
Rd,
(Z),
Temp v (Z)
None 2
LAC Z, Rd Load and Clear RAM location Temp
Rd
(Z)
Rd,
(Z),
($FFh – Rd) (Z)
None 2
LAT Z, Rd Load and Toggle RAM location Temp
Rd
(Z)
Rd,
(Z),
Temp (Z)
None 2
Bit and bit-test instructions
LSL Rd Logical Shift Left Rd(n+1)
Rd(0)
C
Rd(n),
0,
Rd(7)
Z,C,N,V,H 1
LSR Rd Logical Shift Right Rd(n)
Rd(7)
C
Rd(n+1),
0,
Rd(0)
Z,C,N,V 1
ROL Rd Rotate Left Through Carry Rd(0)
Rd(n+1)
C
C,
Rd(n),
Rd(7)
Z,C,N,V,H 1
ROR Rd Rotate Right Through Carry Rd(7)
Rd(n)
C
C,
Rd(n+1),
Rd(0)
Z,C,N,V 1
ASR Rd Arithmetic Shift Right Rd(n) Rd(n+1), n=0..6 Z,C,N,V 1
SWAP Rd Swap Nibbles Rd(3..0) Rd(7..4) None 1
BSET sFlag Set SREG(s) 1SREG(s) 1
BCLR sFlag Clear SREG(s) 0SREG(s) 1
SBI A, b Set Bit in I/O Register I/O(A, b) 1None 1
CBI A, b Clear Bit in I/O Register I/O(A, b) 0None 1
BST Rr, b Bit Store from Register to T TRr(b) T 1
BLD Rd, b Bit load from T to Register Rd(b) TNone 1
SEC Set Carry C1 C 1
CLC Clear Carry C0 C 1
SEN Set Negative Flag N1 N 1
CLN Clear Negative Flag N0 N 1
SEZ Set Zero Flag Z1 Z 1
Mnemonic
s
Operand
sDescription Operation Flags
#Clock
s
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 73
Notes: 1. Cycle times for Data memory accesses assume internal memory accesses, and are not valid for accesses via the external RAM interface.
2. One extra cycle must be added when accessing Internal SRAM.
CLZ Clear Zero Flag Z0 Z 1
SEI Global Interrupt Enable I1 I 1
CLI Global Interrupt Disable I0 I 1
SES Set Signed Test Flag S1 S 1
CLS Clear Signed Test Flag S0 S 1
SEV Set Two’s Complement Overflow V1 V 1
CLV Clear Two’s Complement Overflow V0 V 1
SET Set T in SREG T1 T 1
CLT Clear T in SREG T0 T 1
SEH Set Half Carry Flag in SREG H1 H 1
CLH Clear Half Carry Flag in SREG H0 H 1
MCU control instructions
BREAK Break (See specific descr. for BREAK) None 1
NOP No Operation None 1
SLEEP Sleep (see specific descr. for Sleep) None 1
WDR Watchdog Reset (see specific descr. for WDR) None 1
Mnemonic
s
Operand
sDescription Operation Flags
#Clock
s
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 74
35. Packaging information
35.1 44A
B
A
0.20 H A B
0.20 H A B
44 X b
0.20 C A B
(DATUM B)
(DATUM A)
C
SEATING PLANE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Microchip Technology Drawing C04-076C Sheet 1 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
e
NOTE 1
12
N
D
D1
EE1
2X
A2
A1
A
0.10 C
3
N
AA
0.20 C A B
4X 11 TIPS
123
44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [TQFP]
NOTE 1
NOTE 2
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 75
Microchip Technology Drawing C04-076C Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
L
(L1)
c
θ
SECTION A-A
H
Number of Leads
Overall Height
Lead Width
Overall Width
Overall Length
Lead Length
Molded Package Width
Molded Package Length
Molded Package Thickness
Lead Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E1
D1
A2
e
L
E
N
0.80 BSC
0.45
0.30
-
0.05
0.37
12.00 BSC
0.60
10.00 BSC
10.00 BSC
-
-
12.00 BSC
MILLIMETERS
MIN NOM
44
0.75
0.45
1.20
0.15
MAX
0.95 1.00 1.05
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Exact shape of each corner is optional.
Dimensioning and tolerancing per ASME Y14.5M
Footprint L1 1.00 REF
θ3.5°0° 7°Foot Angle
Lead Thickness c0.09 - 0.20
44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [TQFP]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 76
35.2 PW
B
A
0.10 C
0.10 C
0.10 C A B
0.05 C
C
SEATING
PLANE
NOTE 1
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
1
2
N
0.10 C A B
0.10 C A B
0.10 C
0.08 C
2X
44X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
(DATUM B)
(DATUM A)
D
E
1
2
N
e
44X b
L
E2
D2
K
A
(A3)
A1
Microchip Technology Drawing C04-21421-2 Rev A Sheet 1 of 2
44-Lead Very Thin Plastic Quad Flat, No Lead Package (SXB) - 7x7 mm Body [VQFN]
With 5.2x5.2 mm Exposed Pad and 0.55 mm Terminals (Atmel legacy ZCP)
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 77
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Terminals
Overall Height
Terminal Width
Overall Width
Terminal Length
Exposed Pad Width
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E2
A3
e
L
E
N
0.50 BSC
0.20 REF
0.45
0.18
0.80
0.00
0.23
0.55
0.90
0.02
7.00 BSC
MILLIMETERS
MIN NOM
44
0.65
0.30
1.00
0.05
MAX
K0.350.20 -Terminal-to-Exposed-Pad
Overall Length
Exposed Pad Length
D
D2 5.00
7.00 BSC
5.20 5.40
5.00 5.20 5.40
Microchip Technology Drawing C04-21421-2 Rev A Sheet 2 of 2
44-Lead Very Thin Plastic Quad Flat, No Lead Package (SXB) - 7x7 mm Body [VQFN]
With 5.2x5.2 mm Exposed Pad and 0.55 mm Terminals (Atmel legacy ZCP)
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 78
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
5.40
5.40
MILLIMETERS
0.50 BSC
MIN
E
MAX
6.80
Contact Pad Length (X44)
Contact Pad Width (X44)
Y1
X1
0.95
0.30
NOM
1
2
44
C1Contact Pad Spacing 6.80
Contact Pad to Center Pad (X44) G1 0.23
Thermal Via Diameter V
Thermal Via Pitch EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
C1
EV
C2
EV
X2
Y2
E
X1
Y1
G1
G2
ØV
Contact Pad to Contact Pad (X40) G2 0.20
SILK SCREEN
Microchip Technology Drawing C04-23421-2 Rev A Sheet
44-Lead Very Thin Plastic Quad Flat, No Lead Package (SXB) - 7x7 mm Body [VQFN]
With 5.2x5.2 mm Exposed Pad and 0.55 mm Terminals (Atmel legacy ZCP)
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 79
35.3 44M1
B
A
0.10 C
0.10 C
0.10 C A B
0.05 C
C
SEATING
PLANE
NOTE 1
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
1
2
N
0.10 C A B
0.10 C A B
0.10 C
0.08 C
2X
44X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
(DATUM B)
(DATUM A)
D
E
1
2
N
e
44X b
L
E2
D2
K
A
(A3)
A1
Microchip Technology Drawing C04-21419-STB Rev A Sheet 1 of 2
44-Lead Very Thin Plastic Quad Flat, No Lead Package (STB) - 7x7 mm Body [VQFN]
With 5.2x5.2 mm Exposed Pad and 0.64 mm Terminals (Atmel legacy ZWS)
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 80
Microchip Technology Drawing C04-21419-STB Rev A Sheet 2 of 2
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
44-Lead Very Thin Plastic Quad Flat, No Lead Package (STB) - 7x7 mm Body [VQFN]
With 5.2x5.2 mm Exposed Pad and 0.64 mm Terminals (Atmel legacy ZWS)
Number of Terminals
Overall Height
Terminal Width
Overall Width
Terminal Length
Exposed Pad Width
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E2
A3
e
L
E
N
0.50 BSC
0.20 REF
0.59
0.18
0.80
0.00
0.23
0.64
0.90
0.02
7.00 BSC
MILLIMETERS
MIN NOM
44
0.69
0.30
1.00
0.05
MAX
K0.260.20 0.41Terminal-to-Exposed-Pad
Overall Length
Exposed Pad Length
D
D2 5.00
7.00 BSC
5.20 5.40
5.00 5.20 5.40
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 81
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
5.40
5.40
MILLIMETERS
0.50 BSC
MIN
E
MAX
6.80
Contact Pad Length (X44)
Contact Pad Width (X44)
Y1
X1
1.00
0.30
NOM
1
2
44
C1Contact Pad Spacing 6.80
Contact Pad to Center Pad (X44) G1 0.20
Thermal Via Diameter V
Thermal Via Pitch EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
C1
EV
C2
EV
X2
Y2
E
X1
Y1
G1
G2
ØV
Contact Pad to Contact Pad (X40) G2 0.20
SILK SCREEN
Microchip Technology Drawing C04-23419-STB Rev A Sheet
44-Lead Very Thin Plastic Quad Flat, No Lead Package (STB) - 7x7 mm Body [VQFN]
With 5.2x5.2 mm Exposed Pad and 0.64 mm Terminals (Atmel legacy ZWS)
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 82
35.4 49C2
B
A
0.10 C
0.10 C
0.10 C A B
0.05 C
C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
0.10 C
0.10 C
Sheet 1 of 2
2X
49X
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
49-Ball Very Thin Fine Pitch Ball Grid Array (C7B) - 5x5x1.0 mm Body [VFBGA]
Atmel Legacy Global Package Code CBD
Microchip Technology Drawing C04-21168-C7B Rev A
NOTE1
(DATUM B)
(DATUM A)
NOTE 1
SEATING
PLANE
D
E
e
49X Øb
A
B
C
D
E
F
G
1234567
A1
A2
A
A
B
C
D
E
F
G
eE
eD
1234567
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 83
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1.
2.
Pin 1 visual index feature may vary, but must be located within the hatched area.
Dimensioning and tolerancing per ASME Y14.5M
Sheet 2 of 2
Number of Terminals
Overall Height
Terminal Width
Overall Width
Mold Cap Height
Pitch
Standoff
Units
Dimension Limits
A1
A
b
A2
e
E
N
0.65 BSC
0.30
–
0.20
0.35
–
–
5.00 BSC
MILLIMETERS
MIN NOM
49
0.40
1.00
–
MAX
Overall Length D 5.00 BSC
0.65 – –
Overall Terminal Spacing eD 3.90 BSC
Overall Terminal Spacing eE 3.90 BSC
49-Ball Very Thin Fine Pitch Ball Grid Array (C7B) - 5x5x1.0 mm Body [VFBGA]
Atmel Legacy Global Package Code CBD
Microchip Technology Drawing C04-21168-C7B Rev A
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 84
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2Contact Pad Spacing
Contact Pitch
MILLIMETERS
0.65 BSC
MIN
E
MAX
3.90 BSC
Contact Pad Diameter (X49) X 0.35
NOM
C1Contact Pad Spacing 3.90 BSC
Contact Pad to Contact Pad G 0.30
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M1.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-23168-C7B Rev A
C1
C2
E
ØX
G
SILK SCREEN
A
B
C
D
E
F
G
1234567
49-Ball Very Thin Fine Pitch Ball Grid Array (C7B) - 5x5x1.0 mm Body [VFBGA]
Atmel Legacy Global Package Code CBD
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 85
36. Electrical Characteristics
All typical values are measured at T = 25C unless other temperature condition is given. All minimum and maximum
values are valid across operating temperature and voltage unless other conditions are given.
36.1 ATxmega16A4U
36.1.1 Absolute Maximum Ratings
Stresses beyond those listed in Table 36-1 may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Table 36-1. Absolute maximum ratings.
36.1.2 General Operating Ratings
The device must operate within the ratings listed in Table 36-2 in order for all other electrical characteristics and typical
characteristics of the device to be valid.
Table 36-2. General operating conditions.
Symbol Parameter Condition Min. Typ. Max. Units
VCC Power supply voltage -0.3 4 V
IVCC Current into a VCC pin 200 mA
IGND Current out of a Gnd pin 200 mA
VPIN Pin voltage with respect to Gnd and VCC -0.5 VCC+0.5 V
IPIN I/O pin sink/source current -25 25 mA
TAStorage temperature -65 150 °C
TjJunction temperature 150 °C
Symbol Parameter Condition Min. Typ. Max. Units
VCC Power supply voltage 1.60 3.6 V
AVCC Analog supply voltage 1.60 3.6 V
TATemperature range -40 85 °C
TjJunction temperature -40 105 °C
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2011-2020 Microchip Technology Inc. DS40002166A-page 86
Table 36-3. Operating voltage and frequency.
The maximum CPU clock frequency depends on VCC. As shown in Figure 36-1 the Frequency vs. VCC curve is linear
between 1.8V < VCC <2.7V.
Figure 36-1. Maximum Frequency vs. VCC.
Symbol Parameter Condition Min. Typ. Max. Units
ClkCPU CPU clock frequency
VCC = 1.6V 012
MHz
VCC = 1.8V 012
VCC = 2.7V 032
VCC = 3.6V 032
1.8
12
32
MHz
V
2.7 3.6
1.6
Safe Operating Area
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2011-2020 Microchip Technology Inc. DS40002166A-page 87
36.1.3 Current consumption
Table 36-4. Current consumption for Active mode and sleep modes.
Notes: 1. All Power Reduction Registers set.
2. Maximum limits are based on characterization, and not tested in production.
Symbol Parameter Condition Min. Typ. Max. Units
ICC
Active power
consumption (1)
32kHz, Ext. Clk
VCC = 1.8V 40
µA
VCC = 3.0V 80
1MHz, Ext. Clk
VCC = 1.8V 230
VCC = 3.0V 480
2MHz, Ext. Clk
VCC = 1.8V 430 600
VCC = 3.0V
0.9 1.4
mA
32MHz, Ext. Clk 9.6 12
Idle power
consumption (1)
32kHz, Ext. Clk
VCC = 1.8V 2.4
µA
VCC = 3.0V 3.9
1MHz, Ext. Clk
VCC = 1.8V 62
VCC = 3.0V 118
2MHz, Ext. Clk
VCC = 1.8V 125 225
VCC = 3.0V
240 350
32MHz, Ext. Clk 3.8 5.5 mA
Power-down power
consumption
T=25°C
VCC = 3.0V
0.1 1.0
µA
T=85°C 1.2 4.5
T = 105°C 3.5 6.0
WDT and Sampled BOD enabled,
T=25°C
VCC = 3.0V
1.3 3.0
WDT and Sampled BOD enabled,
T = 85°C 2.4 6.0
WDT and Sampled BOD enabled,
T = 105°C 4.5 8.0
Power-save power
consumption (2)
RTC from ULP clock, WDT and sampled
BOD enabled, T = 25°C
VCC = 1.8V 1.2
µA
VCC = 3.0V 1.3
RTC from 1.024kHz low power
32.768kHz TOSC, T = 25°C
VCC = 1.8V 0.6 2.0
VCC = 3.0V 0.7 2.0
RTC from low power 32.768kHz TOSC,
T=25°C
VCC = 1.8V 0.8 3.0
VCC = 3.0V 1.0 3.0
Reset power consumption Current through RESET pin substracted VCC = 3.0V 320 µA
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2011-2020 Microchip Technology Inc. DS40002166A-page 88
Table 36-5. Current consumption for modules and peripherals.
Note: 1. All parameters measured as the difference in current consumption between module enabled and disabled. All data at VCC =3.0V, Clk
SYS = 1MHz external clock
without prescaling, T = 25°C unless other conditions are given.
Symbol Parameter Condition (1) Min. Typ. Max. Units
ICC
ULP oscillator 1.0 µA
32.768kHz int. oscillator 27 µA
2MHz int. oscillator
85
µA
DFLL enabled with 32.768kHz int. osc. as reference 115
32MHz int. oscillator
270
µA
DFLL enabled with 32.768kHz int. osc. as reference 460
PLL 20x multiplication factor,
32MHz int. osc. DIV4 as reference 220 µA
Watchdog timer 1.0 µA
BOD
Continuous mode 138
µA
Sampled mode, includes ULP oscillator 1.2
Internal 1.0V reference 100 µA
Temperature sensor 95 µA
ADC 250ksps
VREF = Ext ref
3.0
mA
CURRLIMIT = LOW 2.6
CURRLIMIT = MEDIUM 2.1
CURRLIMIT = HIGH 1.6
DAC
250ksps
VREF = Ext ref
No load
Normal mode 1.9
mA
Low Power mode 1.1
AC
High speed mode 330
µA
Low power mode 130
DMA 615kbps between I/O registers and SRAM 108 µA
Timer/counter 16 µA
USART Rx and Tx enabled, 9600 BAUD 2.5 µA
Flash memory and EEPROM programming 4.0 8.0 mA
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36.1.4 Wake-up time from sleep modes
Table 36-6. Device wake-up time from sleep modes with various system clock sources.
Note: 1. The wake-up time is the time from the wake-up request is given until the peripheral clock is available on pin, see Figure 36-2. All peripherals and modules start
execution from the first clock cycle, expect the CPU that is halted for four clock cycles before program execution starts.
Figure 36-2. Wake-up time definition.
Symbol Parameter Condition Min. Typ. (1) Max. Units
twakeup
Wake-up time from idle,
standby, and extended standby
mode
External 2MHz clock 2.0
µs
32.768kHz internal oscillator 120
2MHz internal oscillator 2.0
32MHz internal oscillator 0.2
Wake-up time from power-save
and power-down mode
External 2MHz clock 4.5
32.768kHz internal oscillator 320
2MHz internal oscillator 9.0
32MHz internal oscillator 5.0
Wakeup request
Clock output
Wakeup time
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 90
36.1.5 I/O Pin Characteristics
The I/O pins comply with the JEDEC LVTTL and LVCMOS specification and the high- and low level input and output
voltage limits reflect or exceed this specification.
Table 36-7. I/O pin characteristics.
Notes: 1. The sum of all IOH for PORTA and PORTB must not exceed 100mA.
The sum of all IOH for PORTC must not exceed 200mA.
The sum of all IOH for PORTD and pins PE[0-1] on PORTE must not exceed 200mA.
The sum of all IOH for PE[2-3] on PORTE, PORTR and PDI must not exceed 100mA.
2. The sum of all IOL for PORTA and PORTB must not exceed 100mA.
The sum of all IOL for PORTC must not exceed 200mA.
The sum of all IOL for PORTD and pins PE[0-1] on PORTE must not exceed 200mA.
The sum of all IOL for PE[2-3] on PORTE, PORTR and PDI must not exceed 100mA.
Symbol Parameter Condition Min. Typ. Max. Units
IOH (1)/
IOL (2) I/O pin source/sink current -20 20 mA
VIH High level input voltage
VCC = 2.7 - 3.6V 2.0 VCC+0.3
VVCC = 2.0 - 2.7V 0.7*VCC VCC+0.3
VCC = 1.6 - 2.0V 0.8*VCC VCC+0.3
VIL Low level input voltage
VCC = 2.7- 3.6V -0.3 0.8
VVCC = 2.0 - 2.7V -0.3 0.3*VCC
VCC = 1.6 - 2.0V -0.3 0.2*VCC
VOH High level output voltage
VCC = 3.0 - 3.6V IOH = -2mA 2.4 0.94*VCC
V
VCC = 2.3 - 2.7V
IOH = -1mA 2.0 0.96*VCC
IOH = -2mA 1.7 0.92*VCC
VCC = 3.3V IOH = -8mA 2.6 2.9
VCC = 3.0V IOH = -6mA 2.1 2.6
VCC = 1.8V IOH = -2mA 1.4 1.6
VOL Low level output voltage
VCC = 3.0 - 3.6V IOL = 2mA 0.05*VCC 0.4
V
VCC = 2.3 - 2.7V
IOL = 1mA 0.03*VCC 0.4
IOL = 2mA 0.06*VCC 0.7
VCC = 3.3V IOL = 15mA 0.4 0.76
VCC = 3.0V IOL = 10mA 0.3 0.64
VCC = 1.8V IOL = 5mA 0.2 0.46
IIN Input leakage current T = 25°C <0.01 0.1 µA
RPPull/buss keeper resistor 24 k
trRise time No load
4.0
ns
slew rate limitation 7.0
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36.1.6 ADC characteristics
Table 36-8. Power supply, reference and input range.
Table 36-9. Clock and timing.
Symbol Parameter Condition Min. Typ. Max. Units
AVCC Analog supply voltage VCC- 0.3 VCC+ 0.3 V
VREF Reference voltage 1.0 AVCC- 0.6 V
Rin Input resistance Switched 4.0 k
Csample Input capacitance Switched 4.4 pF
RAREF Reference input resistance (leakage only) >10 M
CAREF Reference input capacitance Static load 7.0 pF
VIN Input range -0.1 AVCC+0.1 V
Conversion range Differential mode, Vinp - Vinn -VREF VREF V
Conversion range Single ended unsigned mode, Vinp -V VREF-V V
ΔV Fixed offset voltage 190 LSB
Symbol Parameter Condition Min. Typ. Max. Units
ClkADC ADC Clock frequency
Maximum is 1/4 of peripheral clock
frequency 100 2000
kHz
Measuring internal signals 100 125
fADC Sample rate
Current limitation (CURRLIMIT) off 100 2000
ksps
CURRLIMIT = LOW 100 1500
CURRLIMIT = MEDIUM 100 1000
CURRLIMIT = HIGH 100 500
Sampling time 1/2 ClkADC cycle 0.25 5µs
Conversion time (latency) (RES+2)/2+(GAIN !=0)
RES (Resolution) = 8 or 12 5 8 ClkADC
cycles
Start-up time ADC clock cycles 12 24 ClkADC
cycles
ADC settling time
After changing reference or input mode 7 7 ClkADC
cycles
After ADC flush 1 1
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Table 36-10. Accuracy characteristics.
Notes: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% input voltage range.
2. Unless otherwise noted all linearity, offset and gain error numbers are valid under the condition that external VREF is used.
Table 36-11. Gain stage characteristics.
Symbol Parameter Condition (2) Min. Typ. Max. Units
RES Resolution Programmable to 8 or 12 bit 812 12 Bits
INL (1) Integral non-linearity
500ksps
VCC-1.0V < VREF< VCC-0.6V ±1.2 ±2.0
lsb
All VREF ±1.5 ±3.0
2000ksps
VCC-1.0V < VREF< VCC-0.6V ±1.0 ±2.0
All VREF ±1.5 ±3.0
DNL (1) Differential non-linearity guaranteed monotonic <±0.8 <±1.0 lsb
Offset error
-1.0 mV
Temperature drift <0.01 mV/K
Operating voltage drift <0.6 mV/V
Gain error
Differential
mode
External reference -1.0
mV
AVCC/1.6 10
AVCC/2.0 8.0
Bandgap ±5.0
Temperature drift <0.02 mV/K
Operating voltage drift <0.5 mV/V
Noise Differential mode, shorted input
2msps, VCC = 3.6V, ClkPER = 16MHz 0.4 mV
rms
Symbol Parameter Condition Min. Typ. Max. Units
Rin Input resistance Switched in normal mode 4.0 k
Csample Input capacitance Switched in normal mode 4.4 pF
Signal range Gain stage output 0 VCC- 0.6 V
Propagation delay ADC conversion rate 1.0 ClkADC
cycles
Sample rate Same as ADC 100 1000 kHz
INL (1) Integral non-linearity 500ksps All gain
settings ±1.5 ±4 lsb
Gain error
1x gain, normal mode -0.8
%8x gain, normal mode -2.5
64x gain, normal mode -3.5
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2011-2020 Microchip Technology Inc. DS40002166A-page 93
Note: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% input voltage range.
36.1.7 DAC Characteristics
Table 36-12. Power supply, reference and output range.
Offset error,
input referred
1x gain, normal mode -2
mV8x gain, normal mode -5
64x gain, normal mode -4
Noise
1x gain, normal mode
VCC = 3.6V
Ext. VREF
0.5
mV
rms
8x gain, normal mode 1.5
64x gain, normal mode 11
Symbol Parameter Condition Min. Typ. Max. Units
Symbol Parameter Condition Min. Typ. Max. Units
AVCC Analog supply voltage VCC-
0.3 VCC+ 0.3 V
AVREF External reference voltage 1.0 VCC- 0.6 V
Rchannel DC output impedance 50
Linear output voltage range 0.15 AVCC-0.15 V
RAREF Reference input resistance >10 M
CAREF Reference input capacitance Static load 7pF
Minimum resistance load 1.0 k
Maximum capacitance load
100 pF
1000 serial resistance 1.0 nF
Output sink/source
Operating within accuracy specification AVCC/1000
mA
Safe operation 10
ATxmega128/64/32/16A4U
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Table 36-13. Clock and timing.
Table 36-14. Accuracy characteristics.
Note: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% output voltage range.
Symbol Parameter Condition Min. Typ. Max. Units
fDAC Conversion rate Cload=100pF,
maximum step size
Normal mode 01000
ksps
Low power mode 500
Symbol Parameter Condition Min. Typ. Max. Units
RES Input resolution 12 Bits
INL (1) Integral non-linearity
VREF= Ext 1.0V
VCC = 1.6V ±2.0 ±3
lsb
VCC = 3.6V ±1.5 ±2.5
VREF=AVCC
VCC = 1.6V ±2.0 ±4
VCC = 3.6V ±1.5 ±4
VREF=INT1V
VCC = 1.6V ±5.0
VCC = 3.6V ±5.0
DNL (1) Differential non-linearity
VREF=Ext 1.0V
VCC = 1.6V ±1.5 3.0
lsb
VCC = 3.6V ±0.6 1.5
VREF=AVCC
VCC = 1.6V ±1.0 3.5
VCC = 3.6V ±0.6 1.5
VREF=INT1V
VCC = 1.6V ±4.5
VCC = 3.6V ±4.5
Gain error After calibration <4.0 lsb
Gain calibration step size 4.0 lsb
Gain calibration drift VREF= Ext 1.0V <0.2 mV/K
Offset error After calibration <1.0 lsb
Offset calibration step size 1.0
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36.1.8 Analog Comparator Characteristics
Table 36-15. Analog Comparator characteristics.
36.1.9 Bandgap and Internal 1.0V Reference Characteristics
Table 36-16. Bandgap and Internal 1.0V reference characteristics.
Symbol Parameter Condition Min. Typ. Max. Units
Voff Input offset voltage <±10 mV
Ilk Input leakage current <1.0 nA
Input voltage range -0.1 AVCC V
AC startup time 100 µs
Vhys1 Hysteresis, none 0mV
Vhys2 Hysteresis, small
mode = High Speed (HS) 13
mV
mode = Low Power (LP) 30
Vhys3 Hysteresis, large
mode = HS 30
mV
mode = LP 60
tdelay Propagation delay
VCC = 3.0V, T= 85°C mode = HS 30 90
ns
mode = HS 30
VCC = 3.0V, T= 85°C mode = LP 130 500
mode = LP 130
64-level voltage scaler Integral non-linearity (INL) 0.3 0.5 lsb
Symbol Parameter Condition Min. Typ. Max. Units
Startup time
As reference for ADC or DAC 1 ClkPER + 2.5µs
µs
As input voltage to ADC and AC 1.5
Bandgap voltage 1.1 V
INT1V Internal 1.00V reference T= 85°C, after calibration 0.99 1.0 1.01 V
Variation over voltage and temperature Relative to T= 85°C, VCC = 3.0V ±1.5 %
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 96
36.1.10 Brownout Detection Characteristics
Table 36-17. Brownout detection characteristics.
36.1.11 External Reset Characteristics
Table 36-18. External reset characteristics.
36.1.12 Power-on Reset Characteristics
Table 36-19. Power-on reset characteristics.
Note: 1. VPOT- values are only valid when BOD is disabled. When BOD is enabled VPOT- = VPOT+.
Symbol Parameter Condition Min. Typ. Max. Units
VBOT
BOD level 0 falling VCC 1.60 1.62 1.72
V
BOD level 1 falling VCC 1.8
BOD level 2 falling VCC 2.0
BOD level 3 falling VCC 2.2
BOD level 4 falling VCC 2.4
BOD level 5 falling VCC 2.6
BOD level 6 falling VCC 2.8
BOD level 7 falling VCC 3.0
tBOD Detection time
Continuous mode 0.4
µs
Sampled mode 1000
VHYST Hysteresis 1.2 %
Symbol Parameter Condition Min. Typ. Max. Units
tEXT Minimum reset pulse width 95 1000 ns
VRST
Reset threshold voltage (VIH)
VCC = 2.7 - 3.6V 0.60×VCC
V
VCC = 1.6 - 2.7V 0.60×VCC
Reset threshold voltage (VIL)
VCC = 2.7 - 3.6V 0.50×VCC
VCC = 1.6 - 2.7V 0.40×VCC
RRST Reset pin Pull-up Resistor 25 k
Symbol Parameter Condition Min. Typ. Max. Units
VPOT- (1) POR threshold voltage falling VCC
VCC falls faster than 1V/ms 0.4 1.0
V
VCC falls at 1V/ms or slower 0.8 1.0
VPOT+ POR threshold voltage rising VCC 1.3 1.59 V
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36.1.13 Flash and EEPROM Memory Characteristics
Table 36-20. Endurance and data retention.
Table 36-21. Programming time.
Notes: 1. Programming is timed from the 2MHz internal oscillator.
2. EEPROM is not erased if the EESAVE fuse is programmed.
Symbol Parameter Condition Min. Typ. Max. Units
Flash
Write/Erase cycles
25°C 10K
Cycle85°C 10K
105°C 2K
Data retention
25°C 100
Year85°C 25
105°C 10
EEPROM
Write/Erase cycles
25°C 100K
Cycle85°C 100K
105°C 30K
Data retention
25°C 100
Year85°C 25
105°C 10
Symbol Parameter Condition Min. Typ.(1) Max. Units
Chip Erase 16KB Flash, EEPROM(2) and
SRAM Erase 45 ms
Application Erase Section erase 6ms
Flash
Page erase 4
msPage write 4
Atomic page erase and write 8
EEPROM
Page erase 4
msPage write 4
Atomic page erase and write 8
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36.1.14 Clock and Oscillator Characteristics
36.1.14.1 Calibrated 32.768kHz Internal Oscillator characteristics
Table 36-22. 32.768kHz internal oscillator characteristics.
36.1.14.2 Calibrated 2MHz RC Internal Oscillator characteristics
Table 36-23. 2MHz internal oscillator characteristics.
36.1.14.3 Calibrated and tunable 32MHz internal oscillator characteristics
Table 36-24. 32MHz internal oscillator characteristics.
36.1.14.4 32kHz Internal ULP Oscillator characteristics
Table 36-25. 32kHz internal ULP oscillator characteristics.
Symbol Parameter Condition Min. Typ. Max. Units
Frequency 32.768 kHz
Factory calibration accuracy T = 85C, VCC = 3.0V -0.5 0.5 %
User calibration accuracy -0.5 0.5 %
Symbol Parameter Condition Min. Typ. Max. Units
Frequency range DFLL can tune to this frequency over
voltage and temperature 1.8 2.2 MHz
Factory calibrated frequency 2.0 MHz
Factory calibration accuracy T = 85C, VCC= 3.0V -1.5 1.5 %
User calibration accuracy -0.2 0.2 %
DFLL calibration stepsize 0.21 %
Symbol Parameter Condition Min. Typ. Max. Units
Frequency range DFLL can tune to this frequency over
voltage and temperature 30 55 MHz
Factory calibrated frequency 32 MHz
Factory calibration accuracy T = 85C, VCC= 3.0V -1.5 1.5 %
User calibration accuracy -0.2 0.2 %
DFLL calibration step size 0.22 %
Symbol Parameter Condition Min. Typ. Max. Units
Output frequency 32 kHz
Accuracy -30 30 %
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36.1.14.5 Internal Phase Locked Loop (PLL) characteristics
Table 36-26. Internal PLL characteristics.
Note: 1. The maximum output frequency vs. supply voltage is linear between 1.8V and 2.7V, and can never be higher than four times the maximum CPU frequency.
36.1.14.6 External clock characteristics
Figure 36-3. External clock drive waveform
Table 36-27. External clock used as system clock without prescaling.
Note: 1. The maximum frequency vs. supply voltage is linear between 1.6V and 2.7V, and the same applies for all other parameters with supply voltage conditions.
Symbo
lParameter Condition Min. Typ. Max. Units
fIN Input frequency Output frequency must be within fOUT 0.4 64 MHz
fOUT Output frequency (1)
VCC= 1.6 - 1.8V 20 48
MHz
VCC= 2.7 - 3.6V 20 128
Start-up time 25 µs
Re-lock time 25 µs
tCH
tCL
tCK
tCH
VIL1
VIH1
tCR tCF
Symbol Parameter Condition Min. Typ. Max. Units
1/tCK Clock Frequency (1)
VCC = 1.6 - 1.8V 012
MHz
VCC = 2.7 - 3.6V 032
tCK Clock Period
VCC = 1.6 - 1.8V 83.3
ns
VCC = 2.7 - 3.6V 31.5
tCH Clock High Time
VCC = 1.6 - 1.8V 30.0
ns
VCC = 2.7 - 3.6V 12.5
tCL Clock Low Time
VCC = 1.6 - 1.8V 30.0
ns
VCC = 2.7 - 3.6V 12.5
tCR Rise Time (for maximum frequency)
VCC = 1.6 - 1.8V 10
ns
VCC = 2.7 - 3.6V 3
tCF Fall Time (for maximum frequency)
VCC = 1.6 - 1.8V 10
ns
VCC = 2.7 - 3.6V 3
tCK Change in period from one clock cycle to the next 10 %
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Table 36-28. External clock with prescaler (1)for system clock.
Notes: 1. System Clock Prescalers must be set so that maximum CPU clock frequency for device is not exceeded.
2. The maximum frequency vs. supply voltage is linear between 1.6V and 2.7V, and the same applies for all other parameters with supply voltage conditions.
36.1.14.7 External 16MHz crystal oscillator and XOSC characteristic
Table 36-29. External 16MHz crystal oscillator and XOSC characteristics.
Symbol Parameter Condition Min. Typ. Max. Units
1/tCK Clock Frequency (2)
VCC = 1.6 - 1.8V 090
MHz
VCC = 2.7 - 3.6V 0142
tCK Clock Period
VCC = 1.6 - 1.8V 11
ns
VCC = 2.7 - 3.6V 7
tCH Clock High Time
VCC = 1.6 - 1.8V 4.5
ns
VCC = 2.7 - 3.6V 2.4
tCL Clock Low Time
VCC = 1.6 - 1.8V 4.5
ns
VCC = 2.7 - 3.6V 2.4
tCR Rise Time (for maximum frequency)
VCC = 1.6 - 1.8V 1.5
ns
VCC = 2.7 - 3.6V 1.0
tCF Fall Time (for maximum frequency)
VCC = 1.6 - 1.8V 1.5
ns
VCC = 2.7 - 3.6V 1.0
tCK Change in period from one clock cycle to the next 10 %
Symbol Parameter Condition Min. Typ. Max. Units
Cycle to cycle jitter
XOSCPWR=0
FRQRANGE=0 <10
nsFRQRANGE=1, 2, or 3 <1.0
XOSCPWR=1 <1.0
Long term jitter
XOSCPWR=0
FRQRANGE=0 <6.0
nsFRQRANGE=1, 2, or 3 <0.5
XOSCPWR=1 <0.5
Frequency error
XOSCPWR=0
FRQRANGE=0 <0.1
%
FRQRANGE=1 <0.05
FRQRANGE=2 or 3 <0.005
XOSCPWR=1 <0.005
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Note: 1. Numbers for negative impedance are not tested in production but guaranteed from design and characterization.
Duty cycle
XOSCPWR=0
FRQRANGE=0 40
%
FRQRANGE=1 42
FRQRANGE=2 or 3 45
XOSCPWR=1 48
RQNegative impedance (1)
XOSCPWR=0,
FRQRANGE=0
0.4MHz resonator,
CL=100pF 2.4k
1MHz crystal, CL=20pF 8.7k
2MHz crystal, CL=20pF 2.1k
XOSCPWR=0,
FRQRANGE=1,
CL=20pF
2MHz crystal 4.2k
8MHz crystal 250
9MHz crystal 195
XOSCPWR=0,
FRQRANGE=2,
CL=20pF
8MHz crystal 360
9MHz crystal 285
12MHz crystal 155
XOSCPWR=0,
FRQRANGE=3,
CL=20pF
9MHz crystal 365
12MHz crystal 200
16MHz crystal 105
XOSCPWR=1,
FRQRANGE=0,
CL=20pF
9MHz crystal 435
12MHz crystal 235
16MHz crystal 125
XOSCPWR=1,
FRQRANGE=1,
CL=20pF
9MHz crystal 495
12MHz crystal 270
16MHz crystal 145
XOSCPWR=1,
FRQRANGE=2,
CL=20pF
12MHz crystal 305
16MHz crystal 160
XOSCPWR=1,
FRQRANGE=3,
CL=20pF
12MHz crystal 380
16MHz crystal 205
ESR SF = Safety factor min(RQ)/SF k
CXTAL1
Parasitic capacitance
XTAL1 pin 5.4 pF
CXTAL2
Parasitic capacitance
XTAL2 pin 7.1 pF
CLOAD
Parasitic capacitance
load 3.07 pF
Symbol Parameter Condition Min. Typ. Max. Units
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36.1.14.8 External 32.768kHz crystal oscillator and TOSC characteristics
Table 36-30. External 32.768kHz crystal oscillator and TOSC characteristics.
Note: 1. See Figure 36-4 for definition.
Figure 36-4. TOSC input capacitance.
The parasitic capacitance between the TOSC pins is CL1 + CL2 in series as seen from the crystal when oscillating without
external capacitors.
Symbol Parameter Condition Min. Typ. Max. Units
ESR/R1 Recommended crystal equivalent
series resistance (ESR)
Crystal load capacitance 6.5pF 60
k
Crystal load capacitance 9.0pF 35
CTOSC1 Parasitic capacitance TOSC1 pin
5.4
pF
Alternate TOSC location 4.0
CTOSC2 Parasitic capacitance TOSC2 pin
7.1
pF
Alternate TOSC location 4.0
Recommended safety factor capacitance load matched to
crystal specification 3
C
L1
C
L2
2CS
O
T
1
CS
O
TDevice internal
External
32.768kHz crystal
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36.1.15 SPI Characteristics
Figure 36-5. SPI timing requirements in master mode.
Figure 36-6. SPI timing requirements in slave mode.
MOS
MIS MIH
SCKW
SCK
MOH MOH
SCKFSCKR
SCKW
SIS SIH
SSCKW
SSCKW
SSCK
SSH
SOSSH
SCKR SCKF
SOS
SSS
SOSSS
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2011-2020 Microchip Technology Inc. DS40002166A-page 104
Table 36-31. SPI timing characteristics and requirements.
36.1.16 Two-Wire Interface Characteristics
Table 36-32 on page 105 describes the requirements for devices connected to the Two-Wire Interface Bus. The
Microchip AVR XMEGA Two-Wire Interface meets or exceeds these requirements under the noted conditions. Timing
symbols refer to Figure 36-7 on page 104.
Figure 36-7. Two-wire interface bus timing.
Symbol Parameter Condition Min. Typ. Max. Units
tSCK SCK period Master (See Table 21-4 in
XMEGA AU Manual)
ns
tSCKW SCK high/low width Master 0.5*SCK
tSCKR SCK rise time Master 2.7
tSCKF SCK fall time Master 2.7
tMIS MISO setup to SCK Master 10
tMIH MISO hold after SCK Master 10
tMOS MOSI setup SCK Master 0.5*SCK
tMOH MOSI hold after SCK Master 1
tSSCK Slave SCK Period Slave 4*t ClkPER
tSSCKW SCK high/low width Slave 2*t ClkPER
tSSCKR SCK rise time Slave 1600
tSSCKF SCK fall time Slave 1600
tSIS MOSI setup to SCK Slave 3
tSIH MOSI hold after SCK Slave tClk
PER
tSSS SS setup to SCK Slave 21
tSSH SS hold after SCK Slave 20
tSOS MISO setup SCK Slave 8
tSOH MISO hold after SCK Slave 13
tSOSS MISO setup after SS low Slave 11
tSOSH MISO hold after SS high Slave 8
HD;STA
of
LOW
HIGH
SU;STA
BUF
r
HD;DAT
SU;DAT SU;STO
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Table 36-32. Two-wire interface characteristics.
Notes: 1. Required only for fSCL > 100kHz.
2. Cb = Capacitance of one bus line in pF.
3. fPER = Peripheral clock frequency.
Symbol Parameter Condition Min. Typ. Max. Units
VIH Input high voltage 0.7*VCC VCC+0.5 V
VIL Input low voltage 0.5 0.3*VCC V
Vhys Hysteresis of Schmitt trigger inputs 0.05*VCC (1) V
VOL Output low voltage 3mA, sink current 00.4 V
trRise time for both SDA and SCL 20+0.1Cb (1)(2) 300 ns
tof Output fall time from VIHmin to VILmax 10pF < Cb < 400pF (2) 20+0.1Cb (1)(2) 250 ns
tSP Spikes suppressed by input filter 050 ns
IIInput current for each I/O Pin 0.1VCC < VI < 0.9VCC -10 10 µA
CICapacitance for each I/O Pin 10 pF
fSCL SCL clock frequency fPER (3)>max(10fSCL, 250kHz) 0400 kHz
RPValue of pull-up resistor
fSCL 100kHz
fSCL > 100kHz
tHD;STA Hold time (repeated) START condition
fSCL 100kHz 4.0
µs
fSCL > 100kHz 0.6
tLOW Low period of SCL clock
fSCL 100kHz 4.7
µs
fSCL > 100kHz 1.3
tHIGH High period of SCL clock
fSCL 100kHz 4.0
µs
fSCL > 100kHz 0.6
tSU;STA
Set-up time for a repeated START
condition
fSCL 100kHz 4.7
µs
fSCL > 100kHz 0.6
tHD;DAT Data hold time
fSCL 100kHz 03.45
µs
fSCL > 100kHz 00.9
tSU;DAT Data setup time
fSCL 100kHz 250
ns
fSCL > 100kHz 100
tSU;STO Setup time for STOP condition
fSCL 100kHz 4.0
µs
fSCL > 100kHz 0.6
tBUF
Bus free time between a STOP and
START condition
fSCL 100kHz 4.7
µs
fSCL > 100kHz 1.3
VCC 0.4V–
3mA
----------------------------
100ns
Cb
---------------
300ns
Cb
---------------
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36.2 ATxmega32A4U
36.2.1 Absolute Maximum Ratings
Stresses beyond those listed in Table 36-33 may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Table 36-33. Absolute maximum ratings.
36.2.2 General Operating Ratings
The device must operate within the ratings listed in Table 36-34 in order for all other electrical characteristics and typical
characteristics of the device to be valid.
Table 36-34. General operating conditions.
Table 36-35. Operating voltage and frequency.
The maximum CPU clock frequency depends on VCC. As shown in Figure 36-8 the Frequency vs. VCC curve is linear
between 1.8V < VCC <2.7V.
Symbol Parameter Condition Min. Typ. Max. Units
VCC Power supply voltage -0.3 4 V
IVCC Current into a VCC pin 200 mA
IGND Current out of a Gnd pin 200 mA
VPIN Pin voltage with respect to Gnd and VCC -0.5 VCC+0.5 V
IPIN I/O pin sink/source current -25 25 mA
TAStorage temperature -65 150 °C
TjJunction temperature 150 °C
Symbol Parameter Condition Min. Typ. Max. Units
VCC Power supply voltage 1.60 3.6 V
AVCC Analog supply voltage 1.60 3.6 V
TATemperature range -40 85 °C
TjJunction temperature -40 105 °C
Symbol Parameter Condition Min. Typ. Max. Units
ClkCPU CPU clock frequency
VCC = 1.6V 012
MHz
VCC = 1.8V 012
VCC = 2.7V 032
VCC = 3.6V 032
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 107
Figure 36-8. Maximum Frequency vs. VCC.
1.8
12
32
MHz
V
2.7 3.6
1.6
Safe Operating Area
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36.2.3 Current consumption
Table 36-36. Current consumption for Active mode and sleep modes.
Notes: 1. All Power Reduction Registers set.
2. Maximum limits are based on characterization, and not tested in production.
Symbol Parameter Condition Min. Typ. Max. Units
ICC
Active power
consumption(1)
32kHz, Ext. Clk
VCC = 1.8V 40
µA
VCC = 3.0V 80
1MHz, Ext. Clk
VCC = 1.8V 230
VCC = 3.0V 480
2MHz, Ext. Clk
VCC = 1.8V 430 600
VCC = 3.0V
0.9 1.4
mA
32MHz, Ext. Clk 9.6 12
Idle power
consumption(1)
32kHz, Ext. Clk
VCC = 1.8V 2.4
µA
VCC = 3.0V 3.9
1MHz, Ext. Clk
VCC = 1.8V 62
VCC = 3.0V 118
2MHz, Ext. Clk
VCC = 1.8V 125 225
VCC = 3.0V
240 350
32MHz, Ext. Clk 3.8 5.5 mA
Power-down power
consumption
T=25°C
VCC = 3.0V
0.1 1.0
µA
T=85°C 1.2 4.5
T = 105°C 3.5 6.0
WDT and sampled BOD enabled,
T=25°C
VCC = 3.0V
1.3 3.0
WDT and sampled BOD enabled,
T = 85°C 2.4 6.0
WDT and sampled BOD enabled,
T = 105°C 4.5 8.0
Power-save power
consumption(2)
RTC from ULP clock, WDT and
sampled BOD enabled, T = 25°C
VCC = 1.8V 1.2
µA
VCC = 3.0V 1.3
RTC from 1.024kHz low power
32.768kHz TOSC, T = 25°C
VCC = 1.8V 0.6 2.0
VCC = 3.0V 0.7 2.0
RTC from low power 32.768kHz
TOSC, T = 25°C
VCC = 1.8V 0.8 3.0
VCC = 3.0V 1.0 3.0
Reset power consumption Current through RESET pin
substracted VCC = 3.0V 320
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Table 36-37. Current consumption for modules and peripherals.
Note: 1. All parameters measured as the difference in current consumption between module enabled and disabled. All data at VCC =3.0V, Clk
SYS = 1MHz external clock
without prescaling, T = 25°C unless other conditions are given.
Symbol Parameter Condition (1) Min. Typ. Max. Units
ICC
ULP oscillator 1.0 µA
32.768kHz int. oscillator 27 µA
2MHz int. oscillator
85
µA
DFLL enabled with 32.768kHz int. osc. as reference 115
32MHz int. oscillator
270
µA
DFLL enabled with 32.768kHz int. osc. as reference 460
PLL 20x multiplication factor,
32MHz int. osc. DIV4 as reference 220 µA
Watchdog timer 1.0 µA
BOD
Continuous mode 138
µA
Sampled mode, includes ULP oscillator 1.2
Internal 1.0V reference 100 µA
Temperature sensor 95 µA
ADC 250ksps
VREF = Ext ref
3.0
mA
CURRLIMIT = LOW 2.6
CURRLIMIT = MEDIUM 2.1
CURRLIMIT = HIGH 1.6
DAC
250ksps
VREF = Ext ref
No load
Normal mode 1.9
mA
Low power mode 1.1
AC
High speed mode 330
µA
Low power mode 130
DMA 615kbps between I/O registers and SRAM 108 µA
Timer/counter 16 µA
USART Rx and Tx enabled, 9600 BAUD 2.5 µA
Flash memory and EEPROM programming 4.0 8.0 mA
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36.2.4 Wake-up time from sleep modes
Table 36-38. Device wake-up time from sleep modes with various system clock sources.
Note: 1. The wake-up time is the time from the wake-up request is given until the peripheral clock is available on pin, see Figure 36-9. All peripherals and modules start
execution from the first clock cycle, expect the CPU that is halted for four clock cycles before program execution starts.
Figure 36-9. Wake-up time definition.
Symbol Parameter Condition Min. Typ. (1) Max. Units
twakeup
Wake-up time from idle,
standby, and extended standby
mode
External 2MHz clock 2.0
µs
32.768kHz internal oscillator 120
2MHz internal oscillator 2.0
32MHz internal oscillator 0.2
Wake-up time from power-save
and power-down mode
External 2MHz clock 4.5
µs
32.768kHz internal oscillator 320
2MHz internal oscillator 9.0
32MHz internal oscillator 5.0
Wakeup request
Clock output
Wakeup time
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36.2.5 I/O Pin Characteristics
The I/O pins comply with the JEDEC LVTTL and LVCMOS specification and the high- and low level input and output
voltage limits reflect or exceed this specification.
Table 36-39. I/O pin characteristics.
Notes: 1. The sum of all IOH for PORTA and PORTB must not exceed 100mA.
The sum of all IOH for PORTC must not exceed 200mA.
The sum of all IOH for PORTD and pins PE[0-1] on PORTE must not exceed 200mA.
The sum of all IOH for PE[2-3] on PORTE, PORTR and PDI must not exceed 100mA.
2. The sum of all IOL for PORTA and PORTB must not exceed 100mA.
The sum of all IOL for PORTC must not exceed 200mA.
The sum of all IOL for PORTD and pins PE[0-1] on PORTE must not exceed 200mA.
The sum of all IOL for PE[2-3] on PORTE, PORTR and PDI must not exceed 100mA.
Symbol Parameter Condition Min. Typ. Max. Units
IOH (1)/
IOL (2) I/O pin source/sink current -20 20 mA
VIH High level input voltage
VCC = 2.7 - 3.6V 2.0 VCC+0.3
VVCC = 2.0 - 2.7V 0.7*VCC VCC+0.3
VCC = 1.6 - 2.0V 0.8*VCC VCC+0.3
VIL Low level input voltage
VCC = 2.7- 3.6V -0.3 0.8
VVCC = 2.0 - 2.7V -0.3 0.3*VCC
VCC = 1.6 - 2.0V -0.3 0.2*VCC
VOH High level output voltage
VCC = 3.0 - 3.6V IOH = -2mA 2.4 0.94*VCC
V
VCC = 2.3 - 2.7V
IOH = -1mA 2.0 0.96*VCC
IOH = -2mA 1.7 0.92*VCC
VCC = 3.3V IOH = -8mA 2.6 2.9
VCC = 3.0V IOH = -6mA 2.1 2.6
VCC = 1.8V IOH = -2mA 1.4 1.6
VOL Low level output voltage
VCC = 3.0 - 3.6V IOL = 2mA 0.05*VCC 0.4
V
VCC = 2.3 - 2.7V
IOL = 1mA 0.03*VCC 0.4
IOL = 2mA 0.06*VCC 0.7
VCC = 3.3V IOL = 15mA 0.4 0.76
VCC = 3.0V IOL = 10mA 0.3 0.64
VCC = 1.8V IOL = 5mA 0.2 0.46
IIN Input leakage current T = 25°C <0.01 0.1 µA
RPPull/buss keeper resistor 24 k
trRise time No load
4.0
ns
slew rate limitation 7.0
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36.2.6 ADC characteristics
Table 36-40. Power supply, reference and input range.
Table 36-41. Clock and timing.
Symbol Parameter Condition Min. Typ. Max. Units
AVCC Analog supply voltage VCC- 0.3 VCC+ 0.3 V
VREF Reference voltage 1AVCC- 0.6 V
Rin Input resistance Switched 4.0 k
Csample Input capacitance Switched 4.4 pF
RAREF Reference input resistance (leakage only) >10 M
CAREF Reference input capacitance Static load 7pF
VIN Input range -0.1 AVCC+0.1 V
Conversion range Differential mode, Vinp - Vinn -VREF VREF V
Conversion range Single ended unsigned mode, Vinp -V VREF-V V
ΔV Fixed offset voltage 190 LSB
Symbol Parameter Condition Min. Typ. Max. Units
ClkADC ADC clock frequency
Maximum is 1/4 of peripheral clock
frequency 100 2000
kHz
Measuring internal signals 100 125
fADC Sample rate
Current limitation (CURRLIMIT) off 100 2000
ksps
CURRLIMIT = LOW 100 1500
CURRLIMIT = MEDIUM 100 1000
CURRLIMIT = HIGH 100 500
Sampling time 1/2 ClkADC cycle 0.25 5µs
Conversion time (latency) (RES+2)/2+(GAIN !=0)
RES (Resolution) = 8 or 12 5 8 ClkADC
cycles
Start-up time ADC clock cycles 12 24 ClkADC
cycles
ADC settling time
After changing reference or input mode 7 7 ClkADC
cycles
After ADC flush 1 1
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Table 36-42. Accuracy characteristics.
Notes: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% input voltage range.
2. Unless otherwise noted all linearity, offset and gain error numbers are valid under the condition that external VREF is used.
Table 36-43. Gain stage characteristics.
Symbol Parameter Condition (2) Min. Typ. Max. Units
RES Resolution Programmable to 8 or 12 bit 812 12 Bits
INL(1) Integral non-linearity
500ksps
VCC-1.0V < VREF< VCC-0.6V ±1.2 ±2.0
lsb
All VREF ±1.5 ±3.0
2000ksps
VCC-1.0V < VREF< VCC-0.6V ±1.0 ±2.0
All VREF ±1.5 ±3.0
DNL(1) Differential non-linearity guaranteed monotonic <±0.8 <±1.0 lsb
Offset error
-1.0 mV
Temperature drift <0.01 mV/K
Operating voltage drift <0.6 mV/V
Gain error
Differential
mode
External reference -1.0
mV
AVCC/1.6 10
AVCC/2.0 8.0
Bandgap ±5.0
Temperature drift <0.02 mV/K
Operating voltage drift <0.5 mV/V
Noise Differential mode, shorted input
2msps, VCC = 3.6V, ClkPER = 16MHz 0.4 mV
rms
Symbol Parameter Condition Min. Typ. Max. Units
Rin Input resistance Switched in normal mode 4.0 k
Csample Input capacitance Switched in normal mode 4.4 pF
Signal range Gain stage output 0 VCC- 0.6 V
Propagation delay ADC conversion rate 1.0 ClkADC
cycles
Sample rate Same as ADC 100 1000 kHz
INL (1) Integral non-linearity 500ksps All gain
settings ±1.5 ±4.0 lsb
Gain error
1x gain, normal mode -0.8
%8x gain, normal mode -2.5
64x gain, normal mode -3.5
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Note: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% input voltage range.
36.2.7 DAC Characteristics
Table 36-44. Power supply, reference and output range.
Table 36-45. Clock and timing.
Offset error,
input referred
1x gain, normal mode -2.0
mV8x gain, normal mode -5.0
64x gain, normal mode -4.0
Noise
1x gain, normal mode
VCC = 3.6V
Ext. VREF
0.5
mV
rms
8x gain, normal mode 1.5
64x gain, normal mode 11
Symbol Parameter Condition Min. Typ. Max. Units
Symbol Parameter Condition Min. Typ. Max. Units
AVCC Analog supply voltage VCC- 0.3 VCC+ 0.3 V
AVREF External reference voltage 1.0 VCC- 0.6 V
Rchannel DC output impedance 50
Linear output voltage range 0.15 AVCC-0.15 V
RAREF Reference input resistance >10 M
CAREF Reference input capacitance Static load 7.0 pF
Minimum Resistance load 1.0 k
Maximum capacitance load
100 pF
1000 serial resistance 1.0 nF
Output sink/source
Operating within accuracy specification AVCC/1000
mA
Safe operation 10
Symbol Parameter Condition Min. Typ. Max. Units
fDAC Conversion rate Cload=100pF,
maximum step size
Normal mode 01000
ksps
Low power mode 500
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Table 36-46. Accuracy characteristics.
Note: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% output voltage range.
Symbol Parameter Condition Min. Typ. Max. Units
RES Input resolution 12 Bits
INL (1) Integral non-linearity
VREF= Ext 1.0V
VCC = 1.6V ±2.0 ±3.0
lsb
VCC = 3.6V ±1.5 ±2.5
VREF=AVCC
VCC = 1.6V ±2.0 ±4.0
VCC = 3.6V ±1.5 ±4.0
VREF=INT1V
VCC = 1.6V ±5.0
VCC = 3.6V ±5.0
DNL (1) Differential non-linearity
VREF=Ext 1.0V
VCC = 1.6V ±1.5 3.0
lsb
VCC = 3.6V ±0.6 1.5
VREF=AVCC
VCC = 1.6V ±1.0 3.5
VCC = 3.6V ±0.6 1.5
VREF=INT1V
VCC = 1.6V ±4.5
VCC = 3.6V ±4.5
Gain error After calibration <4.0 lsb
Gain calibration step size 4.0 lsb
Gain calibration drift VREF= Ext 1.0V <0.2 mV/K
Offset error After calibration <1.0 lsb
Offset calibration step size 1.0
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36.2.8 Analog Comparator Characteristics
Table 36-47. Analog Comparator characteristics.
36.2.9 Bandgap and Internal 1.0V Reference Characteristics
Table 36-48. Bandgap and Internal 1.0V reference characteristics.
Symbol Parameter Condition Min. Typ. Max. Units
Voff Input offset voltage <±10 mV
Ilk Input leakage current <1 nA
Input voltage range -0.1 AVCC V
AC startup time 100 µs
Vhys1 Hysteresis, none 0mV
Vhys2 Hysteresis, small
mode = High Speed (HS) 13
mV
mode = Low Power (LP) 30
Vhys3 Hysteresis, large
mode = HS 30
mV
mode = LP 60
tdelay Propagation delay
VCC = 3.0V, T= 85°C mode = HS 30 90
ns
mode = HS 30
VCC = 3.0V, T= 85°C mode = LP 130 500
mode = LP 130
64-level voltage scaler Integral non-linearity (INL) 0.3 0.5 lsb
Symbol Parameter Condition Min. Typ. Max. Units
Startup time
As reference for ADC or DAC 1 ClkPER + 2.5µs
µs
As input voltage to ADC and AC 1.5
Bandgap voltage 1.1 V
INT1V Internal 1.00V reference T= 85°C, after calibration 0.99 1.0 1.01 V
Variation over voltage and temperature Relative to T= 85°C, VCC = 3.0V ±1.5 %
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36.2.10 Brownout Detection Characteristics
Table 36-49. Brownout detection characteristics.
36.2.11 External Reset Characteristics
Table 36-50. External reset characteristics.
36.2.12 Power-on Reset Characteristics
Table 36-51. Power-on reset characteristics.
Note: 1. VPOT- values are only valid when BOD is disabled. When BOD is enabled VPOT- = VPOT+.
Symbol Parameter Condition Min. Typ. Max. Units
VBOT
BOD level 0 falling VCC 1.60 1.62 1.72
V
BOD level 1 falling VCC 1.8
BOD level 2 falling VCC 2.0
BOD level 3 falling VCC 2.2
BOD level 4 falling VCC 2.4
BOD level 5 falling VCC 2.6
BOD level 6 falling VCC 2.8
BOD level 7 falling VCC 3.0
tBOD Detection time
Continuous mode 0.4
µs
Sampled mode 1000
VHYST Hysteresis 1.2 %
Symbol Parameter Condition Min. Typ. Max. Units
tEXT Minimum reset pulse width 95 1000 ns
VRST
Reset threshold voltage (VIH)
VCC = 2.7 - 3.6V 0.60*VCC
V
VCC = 1.6 - 2.7V 0.60*VCC
Reset threshold voltage (VIL)
VCC = 2.7 - 3.6V 0.50*VCC
VCC = 1.6 - 2.7V 0.40*VCC
RRST Reset pin Pull-up Resistor 25 k
Symbol Parameter Condition Min. Typ. Max. Units
VPOT- (1) POR threshold voltage falling VCC
VCC falls faster than 1V/ms 0.4 1.0
V
VCC falls at 1V/ms or slower 0.8 1.0
VPOT+ POR threshold voltage rising VCC 1.3 1.59 V
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36.2.13 Flash and EEPROM Memory Characteristics
Table 36-52. Endurance and data retention.
Table 36-53. Programming time.
Notes: 1. Programming is timed from the 2MHz internal oscillator.
2. EEPROM is not erased if the EESAVE fuse is programmed.
Symbol Parameter Condition Min. Typ. Max. Units
Flash
Write/Erase cycles
25°C 10K
Cycle85°C 10K
105°C 2K
Data retention
25°C 100
Year85°C 25
105°C 10
EEPROM
Write/Erase cycles
25°C 100K
Cycle85°C 100K
105°C 30K
Data retention
25°C 100
Year85°C 25
105°C 10
Symbol Parameter Condition Min. Typ.(1) Max. Units
Chip Erase 32KB Flash, EEPROM(2) and SRAM erase 50 ms
Application Erase Section erase 6ms
Flash
Page erase 4
msPage write 4
Atomic page erase and write 8
EEPROM
Page erase 4
msPage write 4
Atomic page erase and write 8
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36.2.14 Clock and Oscillator Characteristics
36.2.14.1 Calibrated 32.768kHz Internal Oscillator characteristics
Table 36-54. 32.768kHz internal oscillator characteristics.
36.2.14.2 Calibrated 2MHz RC Internal Oscillator characteristics
Table 36-55. 2MHz internal oscillator characteristics.
36.2.14.3 Calibrated and tunable 32MHz internal oscillator characteristics
Table 36-56. 32MHz internal oscillator characteristics.
36.2.14.4 32kHz Internal ULP Oscillator characteristics
Table 36-57. 32kHz internal ULP oscillator characteristics.
Symbol Parameter Condition Min. Typ. Max. Units
Frequency 32.768 kHz
Factory calibration accuracy T = 85C, VCC = 3.0V -0.5 0.5 %
User calibration accuracy -0.5 0.5 %
Symbol Parameter Condition Min. Typ. Max. Units
Frequency range DFLL can tune to this frequency over
voltage and temperature 1.8 2.2 MHz
Factory calibrated frequency 2.0 MHz
Factory calibration accuracy T = 85C, VCC= 3.0V -1.5 1.5 %
User calibration accuracy -0.2 0.2 %
DFLL calibration stepsize 0.21 %
Symbol Parameter Condition Min. Typ. Max. Units
Frequency range DFLL can tune to this frequency over
voltage and temperature 30 55 MHz
Factory calibrated frequency 32 MHz
Factory calibration accuracy T = 85C, VCC= 3.0V -1.5 1.5 %
User calibration accuracy -0.2 0.2 %
DFLL calibration step size 0.22 %
Symbol Parameter Condition Min. Typ. Max. Units
Output frequency 32 kHz
Accuracy -30 30 %
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36.2.14.5 Internal Phase Locked Loop (PLL) characteristics
Table 36-58. Internal PLL characteristics.
Note: 1. The maximum output frequency vs. supply voltage is linear between 1.8V and 2.7V, and can never be higher than four times the maximum CPU frequency.
36.2.14.6 External clock characteristics
Figure 36-10. External clock drive waveform
Table 36-59. External clock used as system clock without prescaling.
Note: 1. The maximum frequency vs. supply voltage is linear between 1.6V and 2.7V, and the same applies for all other parameters with supply voltage conditions.
Symbo
lParameter Condition Min. Typ. Max. Units
fIN Input frequency Output frequency must be within fOUT 0.4 64 MHz
fOUT Output frequency (1) VCC= 1.6 - 1.8V 20 48
MHz
VCC= 2.7 - 3.6V 20 128
Start-up time 25 µs
Re-lock time 25 µs
tCH
tCL
tCK
tCH
VIL1
VIH1
tCR tCF
Symbol Parameter Condition Min. Typ. Max. Units
1/tCK Clock Frequency (1) VCC = 1.6 - 1.8V 012
MHz
VCC = 2.7 - 3.6V 032
tCK Clock Period
VCC = 1.6 - 1.8V 83.3
ns
VCC = 2.7 - 3.6V 31.5
tCH Clock High Time
VCC = 1.6 - 1.8V 30.0
ns
VCC = 2.7 - 3.6V 12.5
tCL Clock Low Time
VCC = 1.6 - 1.8V 30.0
ns
VCC = 2.7 - 3.6V 12.5
tCR Rise Time (for maximum frequency)
VCC = 1.6 - 1.8V 10
ns
VCC = 2.7 - 3.6V 3
tCF Fall Time (for maximum frequency)
VCC = 1.6 - 1.8V 10
ns
VCC = 2.7 - 3.6V 3
tCK Change in period from one clock cycle to the next 10 %
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Table 36-60. External clock with prescaler (1)for system clock.
Notes: 1. System Clock Prescalers must be set so that maximum CPU clock frequency for device is not exceeded.
2. The maximum frequency vs. supply voltage is linear between 1.6V and 2.7V, and the same applies for all other parameters with supply voltage conditions.
36.2.14.7 External 16MHz crystal oscillator and XOSC characteristic
Table 36-61. External 16MHz crystal oscillator and XOSC characteristics.
Symbol Parameter Condition Min. Typ. Max. Units
1/tCK Clock Frequency (2) VCC = 1.6 - 1.8V 090
MHz
VCC = 2.7 - 3.6V 0142
tCK Clock Period
VCC = 1.6 - 1.8V 11
ns
VCC = 2.7 - 3.6V 7
tCH Clock High Time
VCC = 1.6 - 1.8V 4.5
ns
VCC = 2.7 - 3.6V 2.4
tCL Clock Low Time
VCC = 1.6 - 1.8V 4.5
ns
VCC = 2.7 - 3.6V 2.4
tCR Rise Time (for maximum frequency)
VCC = 1.6 - 1.8V 1.5
ns
VCC = 2.7 - 3.6V 1.0
tCF Fall Time (for maximum frequency)
VCC = 1.6 - 1.8V 1.5
ns
VCC = 2.7 - 3.6V 1.0
tCK Change in period from one clock cycle to the next 10 %
Symbol Parameter Condition Min. Typ. Max. Units
Cycle to cycle jitter
XOSCPWR=0
FRQRANGE=0 <10
nsFRQRANGE=1, 2, or 3 <1
XOSCPWR=1 <1
Long term jitter
XOSCPWR=0
FRQRANGE=0 <6
nsFRQRANGE=1, 2, or 3 <0.5
XOSCPWR=1 <0.5
Frequency error
XOSCPWR=0
FRQRANGE=0 <0.1
%
FRQRANGE=1 <0.05
FRQRANGE=2 or 3 <0.005
XOSCPWR=1 <0.005
Duty cycle
XOSCPWR=0
FRQRANGE=0 40
%
FRQRANGE=1 42
FRQRANGE=2 or 3 45
XOSCPWR=1 48
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Note: 1. Numbers for negative impedance are not tested in production but guaranteed from design and characterization.
RQ
Negative
impedance (1)
XOSCPWR=0,
FRQRANGE=0
0.4MHz resonator,
CL=100pF 2.4k
1MHz crystal, CL=20pF 8.7k
2MHz crystal, CL=20pF 2.1k
XOSCPWR=0,
FRQRANGE=1,
CL=20pF
2MHz crystal 4.2k
8MHz crystal 250
9MHz crystal 195
XOSCPWR=0,
FRQRANGE=2,
CL=20pF
8MHz crystal 360
9MHz crystal 285
12MHz crystal 155
XOSCPWR=0,
FRQRANGE=3,
CL=20pF
9MHz crystal 365
12MHz crystal 200
16MHz crystal 105
XOSCPWR=1,
FRQRANGE=0,
CL=20pF
9MHz crystal 435
12MHz crystal 235
16MHz crystal 125
XOSCPWR=1,
FRQRANGE=1,
CL=20pF
9MHz crystal 495
12MHz crystal 270
16MHz crystal 145
XOSCPWR=1,
FRQRANGE=2,
CL=20pF
12MHz crystal 305
16MHz crystal 160
XOSCPWR=1,
FRQRANGE=3,
CL=20pF
12MHz crystal 380
16MHz crystal 205
ESR SF = Safety factor min(RQ)/SF k
CXTAL1
Parasitic
capacitance XTAL1
pin
5.4 pF
CXTAL2
Parasitic
capacitance XTAL2
pin
7.1 pF
CLOAD
Parasitic
capacitance load 3.07 pF
Symbol Parameter Condition Min. Typ. Max. Units
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36.2.14.8 External 32.768kHz crystal oscillator and TOSC characteristics
Table 36-62. External 32.768kHz crystal oscillator and TOSC characteristics.
Note: 1. See Figure 36-11 for definition.
Figure 36-11.TOSC input capacitance.
The parasitic capacitance between the TOSC pins is CL1 + CL2 in series as seen from the crystal when oscillating without
external capacitors.
Symbol Parameter Condition Min. Typ. Max. Units
ESR/R1 Recommended crystal equivalent
series resistance (ESR)
Crystal load capacitance 6.5pF 60
k
Crystal load capacitance 9.0pF 35
CTOSC1 Parasitic capacitance TOSC1 pin
5.4
pF
Alternate TOSC location 4.0
CTOSC2 Parasitic capacitance TOSC2 pin
7.1
pF
Alternate TOSC location 4.0
Recommended safety factor capacitance load matched to
crystal specification 3.0
C
L1
C
L2
2CS
O
T
1
CS
O
TDevice internal
External
32.768kHz crystal
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36.2.15 SPI Characteristics
Figure 36-12. SPI timing requirements in master mode.
Figure 36-13. SPI timing requirements in slave mode.
MOS
MIS MIH
SCKW
SCK
MOH MOH
SCKFSCKR
SCKW
SIS SIH
SSCKW
SSCKW
SSCK
SSH
SOSSH
SCKR SCKF
SOS
SSS
SOSSS
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Table 36-63. SPI timing characteristics and requirements.
Symbol Parameter Condition Min. Typ. Max. Units
tSCK SCK period Master (See Table 21-4 in
XMEGA AU Manual)
ns
tSCKW SCK high/low width Master 0.5×SCK
tSCKR SCK rise time Master 2.7
tSCKF SCK fall time Master 2.7
tMIS MISO setup to SCK Master 10
tMIH MISO hold after SCK Master 10
tMOS MOSI setup SCK Master 0.5×SCK
tMOH MOSI hold after SCK Master 1.0
tSSCK Slave SCK Period Slave 4×t ClkPER
tSSCKW SCK high/low width Slave 2×t ClkPER
tSSCKR SCK rise time Slave 1600
tSSCKF SCK fall time Slave 1600
tSIS MOSI setup to SCK Slave 3.0
tSIH MOSI hold after SCK Slave tClk
PER
tSSS SS setup to SCK Slave 21
tSSH SS hold after SCK Slave 20
tSOS MISO setup SCK Slave 8.0
tSOH MISO hold after SCK Slave 13
tSOSS MISO setup after SS low Slave 11
tSOSH MISO hold after SS high Slave 8.0
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36.2.16 Two-Wire Interface Characteristics
Table 36-64 describes the requirements for devices connected to the Two-Wire Interface Bus. The Microchip AVR
XMEGA Two-Wire Interface meets or exceeds these requirements under the noted conditions. Timing symbols refer to
Figure 36-14.
Figure 36-14. Two-wire interface bus timing.
Table 36-64. Two-wire interface characteristics.
HD;STA
of
LOW
HIGH
SU;STA
BUF
r
HD;DAT
SU;DAT SU;STO
Symbol Parameter Condition Min. Typ. Max. Units
VIH Input high voltage 0.7VCC VCC+0.5 V
VIL Input low voltage 0.5 0.3×VCC V
Vhys Hysteresis of Schmitt trigger inputs 0.05VCC (1) V
VOL Output low voltage 3mA, sink current 00.4 V
trRise time for both SDA and SCL 20+0.1Cb (1)(2) 300 ns
tof Output fall time from VIHmin to VILmax 10pF < Cb < 400pF (2) 20+0.1Cb (1)(2) 250 ns
tSP Spikes suppressed by Input filter 050 ns
IIInput current for each I/O Pin 0.1VCC < VI < 0.9VCC -10 10 µA
CICapacitance for each I/O Pin 10 pF
fSCL SCL clock frequency fPER (3)>max(10fSCL, 250kHz) 0400 kHz
RPValue of pull-up resistor
fSCL 100kHz
fSCL > 100kHz
tHD;STA Hold time (repeated) START condition
fSCL 100kHz 4.0
µs
fSCL > 100kHz 0.6
tLOW Low period of SCL Clock
fSCL 100kHz 4.7
µs
fSCL > 100kHz 1.3
tHIGH High period of SCL Clock
fSCL 100kHz 4.0
µs
fSCL > 100kHz 0.6
tSU;STA
Set-up time for a repeated START
condition
fSCL 100kHz 4.7
µs
fSCL > 100kHz 0.6
VCC 0.4V–
3mA
----------------------------
100ns
Cb
---------------
300ns
Cb
---------------
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Notes: 1. Required only for fSCL > 100kHz.
2. Cb = Capacitance of one bus line in pF.
3. fPER = Peripheral clock frequency.
tHD;DAT Data hold time
fSCL 100kHz 03.45
µs
fSCL > 100kHz 00.9
tSU;DAT Data setup time
fSCL 100kHz 250
ns
fSCL > 100kHz 100
tSU;STO Setup time for STOP condition
fSCL 100kHz 4.0
µs
fSCL > 100kHz 0.6
tBUF
Bus free time between a STOP and
START condition
fSCL 100kHz 4.7
µs
fSCL > 100kHz 1.3
Symbol Parameter Condition Min. Typ. Max. Units
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36.3 ATxmega64A4U
36.3.1 Absolute Maximum Ratings
Stresses beyond those listed in Table 36-65 may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Table 36-65. Absolute maximum ratings.
36.3.2 General Operating Ratings
The device must operate within the ratings listed in Table 36-66 in order for all other electrical characteristics and typical
characteristics of the device to be valid.
Table 36-66. General operating conditions.
Table 36-67. Operating voltage and frequency.
The maximum CPU clock frequency depends on VCC. As shown in Figure 36-15 the Frequency vs. VCC curve is linear
between 1.8V < VCC <2.7V.
Symbol Parameter Condition Min. Typ. Max. Units
VCC Power supply voltage -0.3 4.0 V
IVCC Current into a VCC pin 200 mA
IGND Current out of a Gnd pin 200 mA
VPIN Pin voltage with respect to Gnd and VCC -0.5 VCC+0.5 V
IPIN I/O pin sink/source current -25 25 mA
TAStorage temperature -65 150 °C
TjJunction temperature 150 °C
Symbol Parameter Condition Min. Typ. Max. Units
VCC Power supply voltage 1.60 3.6 V
AVCC Analog supply voltage 1.60 3.6 V
TATemperature range -40 85 °C
TjJunction temperature -40 105 °C
Symbol Parameter Condition Min. Typ. Max. Units
ClkCPU CPU clock frequency
VCC = 1.6V 012
MHz
VCC = 1.8V 012
VCC = 2.7V 032
VCC = 3.6V 032
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Figure 36-15.Maximum Frequency vs. VCC.
1.8
12
32
MHz
V
2.7 3.6
1.6
Safe Operating Area
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36.3.3 Current consumption
Table 36-68. Current consumption for Active mode and sleep modes.
Notes: 1. All Power Reduction Registers set.
2. Maximum limits are based on characterization, and not tested in production.
Symbol Parameter Condition Min. Typ. Max. Units
ICC
Active power
consumption (1)
32kHz, Ext. Clk
VCC = 1.8V 52
µA
VCC = 3.0V 132
1MHz, Ext. Clk
VCC = 1.8V 223
VCC = 3.0V 476
2MHz, Ext. Clk
VCC = 1.8V 400 600
VCC = 3.0V
0.8 1.4
mA
32MHz, Ext. Clk 8.2 12
Idle power
consumption (1)
32kHz, Ext. Clk
VCC = 1.8V 2.4
µA
VCC = 3.0V 3.5
1MHz, Ext. Clk
VCC = 1.8V 57
VCC = 3.0V 110
2MHz, Ext. Clk
VCC = 1.8V 115 225
VCC = 3.0V
216 350
32MHz, Ext. Clk 3.5 5.5 mA
Power-down power
consumption
T=25°C
VCC = 3.0V
0.1 1.0
µA
T=85°C 1.2 4.5
T = 105°C 2.4 6.0
WDT and Sampled BOD enabled,
T=25°C
VCC = 3.0V
1.4 3.0
WDT and Sampled BOD enabled,
T = 85°C 2.4 6.0
WDT and Sampled BOD enabled,
T = 105°C 3.5 8.0
Power-save power
consumption (2)
RTC from ULP clock, WDT and
sampled BOD enabled, T = 25°C
VCC = 1.8V 1.2
µA
VCC = 3.0V 1.5
RTC from 1.024kHz low power
32.768kHz TOSC, T = 25°C
VCC = 1.8V 0.6 2.0
VCC = 3.0V 0.7 2.0
RTC from low power 32.768kHz TOSC,
T=25°C
VCC = 1.8V 0.8 3.0
VCC = 3.0V 1.0 3.0
Reset power consumption Current through RESET pin substracted VCC = 3.0V 140
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Table 36-69. Current consumption for modules and peripherals.
Note: 1. All parameters measured as the difference in current consumption between module enabled and disabled. All data at VCC =3.0V, Clk
SYS = 1MHz external clock
without prescaling, T = 25°C unless other conditions are given.
Symbol Parameter Condition (1) Min. Typ. Max. Units
ICC
ULP oscillator 1.0 µA
32.768kHz int. oscillator 29 µA
2MHz int. oscillator
85
µA
DFLL enabled with 32.768kHz int. osc. as reference 120
32MHz int. oscillator
300
µA
DFLL enabled with 32.768kHz int. osc. as reference 465
PLL 20x multiplication factor,
32MHz int. osc. DIV4 as reference 320 µA
Watchdog timer 1.0 µA
BOD
Continuous mode 138
µA
Sampled mode, includes ULP oscillator 1.0
Internal 1.0V reference 103 µA
Temperature sensor 100 µA
ADC 250ksps
VREF = Ext ref
3.0
mA
CURRLIMIT = LOW 2.6
CURRLIMIT = MEDIUM 2.1
CURRLIMIT = HIGH 1.6
DAC
250ksps
VREF = Ext ref
No load
Normal mode 1.9
mA
Low power mode 1.1
AC
High speed mode 330
µA
Low pPower mode 130
DMA 615KBps between I/O registers and SRAM 108 µA
Timer/counter 16 µA
USART Rx and Tx enabled, 9600 BAUD 2.5 µA
Flash memory and EEPROM programming 8.0 mA
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36.3.4 Wake-up time from sleep modes
Table 36-70. Device wake-up time from sleep modes with various system clock sources.
Note: 1. The wake-up time is the time from the wake-up request is given until the peripheral clock is available on pin, see Figure 36-16. All peripherals and modules start
execution from the first clock cycle, expect the CPU that is halted for four clock cycles before program execution starts.
Figure 36-16.Wake-up time definition.
Symbol Parameter Condition Min. Typ. (1) Max. Units
twakeup
Wake-up time from idle,
standby, and extended standby
mode
External 2MHz clock 2.0
µs
32.768kHz internal oscillator 120
2MHz internal oscillator 2.0
32MHz internal oscillator 0.2
Wake-up time from power-save
and power-down mode
External 2MHz clock 4.5
µs
32.768kHz internal oscillator 320
2MHz internal oscillator 9.0
32MHz internal oscillator 4.0
Wakeup request
Clock output
Wakeup time
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36.3.5 I/O Pin Characteristics
The I/O pins comply with the JEDEC LVTTL and LVCMOS specification and the high- and low level input and output
voltage limits reflect or exceed this specification.
Table 36-71. I/O pin characteristics.
Notes: 1. The sum of all IOH for PORTA and PORTB must not exceed 100mA.
The sum of all IOH for PORTC must not exceed 200mA.
The sum of all IOH for PORTD and pins PE[0-1] on PORTE must not exceed 200mA.
The sum of all IOH for PE[2-3] on PORTE, PORTR and PDI must not exceed 100mA.
2. The sum of all IOL for PORTA and PORTB must not exceed 100mA.
The sum of all IOL for PORTC must not exceed 200mA.
The sum of all IOL for PORTD and pins PE[0-1] on PORTE must not exceed 200mA.
The sum of all IOL for PE[2-3] on PORTE, PORTR and PDI must not exceed 100mA.
Symbol Parameter Condition Min. Typ. Max. Units
IOH (1)/
IOL (2) I/O pin source/sink current -20 20 mA
VIH High level input voltage
VCC = 2.7- 3.6V 2.0 VCC+0.3
VVCC = 2.0 - 2.7V 0.7*VCC VCC+0.3
VCC = 1.6 - 2.0V 0.8*VCC VCC+0.3
VIL Low level input voltage
VCC = 2.7- 3.6V -0.3 0.8
VVCC = 2.0 - 2.7V -0.3 0.3*VCC
VCC = 1.6 - 2.0V -0.3 0.2*VCC
VOH High level output voltage
VCC = 3.0 - 3.6V IOH = -2mA 2.4 0.94*VCC
V
VCC = 2.3 - 2.7V
IOH = -1mA 2.0 0.96*VCC
IOH = -2mA 1.7 0.92*VCC
VCC = 3.3V IOH = -8mA 2.6 2.9
VCC = 3.0V IOH = -6mA 2.1 2.6
VCC = 1.8V IOH = -2mA 1.4 1.6
VOL Low level output voltage
VCC = 3.0 - 3.6V IOL = 2mA 0.02*VCC 0.4
V
VCC = 2.3 - 2.7V
IOL = 1mA 0.01*VCC 0.4
IOL = 2mA 0.02*VCC 0.7
VCC = 3.3V IOL = 15mA 0.4 0.76
VCC = 3.0V IOL = 10mA 0.3 0.64
VCC = 1.8V IOL = 5mA 0.2 0.46
IIN Input leakage current
T = 25°C <0.01 0.1
µA
XOSC and
TOSC pins <0.02 1.1
RPPull/buss keeper resistor 24 k
trRise time No load
4.0
ns
slew rate limitation 7.0
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36.3.6 ADC characteristics
Table 36-72. Power supply, reference and input range.
Table 36-73. Clock and timing.
Symbol Parameter Condition Min. Typ. Max. Units
AVCC Analog supply voltage VCC- 0.3 VCC+ 0.3 V
VREF Reference voltage 1.0 AVCC- 0.6 V
Rin Input resistance Switched 4.0 k
Csample Input capacitance Switched 4.4 pF
RAREF Reference input resistance (leakage only) >10 M
CAREF Reference input capacitance Static load 7.0 pF
VIN Input range -0.1 AVCC+0.1 V
Conversion range Differential mode, Vinp - Vinn -VREF VREF V
Conversion range Single ended unsigned mode, Vinp -V VREF-V V
ΔV Fixed offset voltage 190 lsb
Symbol Parameter Condition Min. Typ. Max. Units
ClkADC ADC clock frequency
Maximum is 1/4 of peripheral clock
frequency 100 2000
kHz
Measuring internal signals 100 125
fADC Sample rate
Current limitation (CURRLIMIT) off 100 2000
ksps
CURRLIMIT = LOW 100 1500
CURRLIMIT = MEDIUM 100 1000
CURRLIMIT = HIGH 100 500
Sampling time 1/2 ClkADC cycle 0.25 5µs
Conversion time (latency) (RES+2)/2+(GAIN !=0)
RES (Resolution) = 8 or 12 5 8 ClkADC
cycles
Start-up time ADC clock cycles 12 24 ClkADC
cycles
ADC settling time
After changing reference or input mode 7 7 ClkADC
cycles
After ADC flush 1 1
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Table 36-74. Accuracy characteristics.
Notes: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% input voltage range.
2. Unless otherwise noted all linearity, offset and gain error numbers are valid under the condition that external VREF is used.
Table 36-75. Gain stage characteristics.
Symbol Parameter Condition (2) Min. Typ. Max. Units
RES Resolution Programmable to 8 or 12 bit 812 12 Bits
INL (1) Integral non-linearity
500ksps
VCC-1.0V < VREF< VCC-0.6V ±1.2 ±2
lsb
All VREF ±1.5 ±3
2000ksps
VCC-1.0V < VREF< VCC-0.6V ±1.0 ±2
All VREF ±1.5 ±3
DNL (1) Differential non-linearity guaranteed monotonic <±0.8 <±1 lsb
Offset error
-1 mV
Temperature drift <0.01 mV/K
Operating voltage drift <0.6 mV/V
Gain error
Differential
mode
External reference -1
mV
AVCC/1.6 10
AVCC/2.0 8
Bandgap ±5
Temperature drift <0.02 mV/K
Operating voltage drift <0.5 mV/V
Noise Differential mode, shorted input
2msps, VCC = 3.6V, ClkPER = 16MHz 0.4 mV
rms
Symbol Parameter Condition Min. Typ. Max. Units
Rin Input resistance Switched in normal mode 4.0 k
Csample Input capacitance Switched in normal mode 4.4 pF
Signal range Gain stage output 0 VCC- 0.6 V
Propagation delay ADC conversion rate 1.0 ClkADC
cycles
Sample rate Same as ADC 100 1000 kHz
INL (1) Integral non-linearity 500ksps All gain
settings ±1.5 ±4.0 lsb
Gain error
1x gain, normal mode -0.8
%8x gain, normal mode -2.5
64x gain, normal mode -3.5
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Note: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% input voltage range.
36.3.7 DAC Characteristics
Table 36-76. Power supply, reference and output range.
Table 36-77. Clock and timing.
Offset error,
input referred
1x gain, normal mode -2
mV8x gain, normal mode -5
64x gain, normal mode -4
Noise
1x gain, normal mode
VCC = 3.6V
Ext. VREF
0.5
mV
rms
8x gain, normal mode 1.5
64x gain, normal mode 11
Symbol Parameter Condition Min. Typ. Max. Units
Symbol Parameter Condition Min. Typ. Max. Units
AVCC Analog supply voltage VCC- 0.3 VCC+ 0.3 V
AVREF External reference voltage 1.0 VCC- 0.6 V
Rchannel DC output impedance 50
Linear output voltage range 0.15 AVCC-0.15 V
RAREF Reference input resistance >10 M
CAREF Reference input capacitance Static load 7pF
Minimum resistance load 1.0 k
Maximum capacitance load
100 pF
1000 serial resistance 1.0 nF
Output sink/source
Operating within accuracy specification AVCC/1000
mA
Safe operation 10
Symbol Parameter Condition Min. Typ. Max. Units
fDAC Conversion rate Cload=100pF,
maximum step size
Normal mode 01000
ksps
Low power mode 500
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Table 36-78. Accuracy characteristics.
Note: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% output voltage range.
Symbol Parameter Condition Min. Typ. Max. Units
RES Input resolution 12 Bits
INL (1) Integral non-linearity
VREF= Ext 1.0V
VCC = 1.6V ±2.0 ±3.0
lsb
VCC = 3.6V ±1.5 ±2.5
VREF=AVCC
VCC = 1.6V ±2.0 ±4.0
VCC = 3.6V ±1.5 ±4.0
VREF=INT1V
VCC = 1.6V ±5.0
VCC = 3.6V ±5.0
DNL (1) Differential non-linearity
VREF=Ext 1.0V
VCC = 1.6V ±1.5 3.0
lsb
VCC = 3.6V ±0.6 1.5
VREF=AVCC
VCC = 1.6V ±1.0 3.5
VCC = 3.6V ±0.6 1.5
VREF=INT1V
VCC = 1.6V ±4.5
VCC = 3.6V ±4.5
Gain error After calibration <4.0 lsb
Gain calibration step size 4.0 lsb
Gain calibration drift VREF= Ext 1.0V <0.2 mV/K
Offset error After calibration <1.0 lsb
Offset calibration step size 1.0
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36.3.8 Analog Comparator Characteristics
Table 36-79. Analog Comparator characteristics.
36.3.9 Bandgap and Internal 1.0V Reference Characteristics
Table 36-80. Bandgap and Internal 1.0V reference characteristics.
Symbol Parameter Condition Min. Typ. Max. Units
Voff Input offset voltage <±10 mV
Ilk Input leakage current <1 nA
Input voltage range -0.1 AVCC V
AC startup time 100 µs
Vhys1 Hysteresis, none 0mV
Vhys2 Hysteresis, small
mode = High Speed (HS) 20
mV
mode = Low Power (LP) 30
Vhys3 Hysteresis, large
mode = HS 35
mV
mode = LP 60
tdelay Propagation delay
VCC = 3.0V, T= 85°C mode = HS 30 90
ns
mode = HS 30
VCC = 3.0V, T= 85°C mode = LP 130 500
mode = LP 130
64-level voltage scaler Integral non-linearity (INL) 0.3 0.5 lsb
Symbol Parameter Condition Min. Typ. Max. Units
Startup time
As reference for ADC or DAC 1 ClkPER + 2.5µs
µs
As input voltage to ADC and AC 1.5
Bandgap voltage 1.1 V
INT1V Internal 1.00V reference T= 85°C, after calibration 0.99 11.01 V
Variation over voltage and temperature Relative to T= 85°C, VCC = 3.0V ±1.5 %
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36.3.10 Brownout Detection Characteristics
Table 36-81. Brownout detection characteristics.
36.3.11 External Reset Characteristics
Table 36-82. External reset characteristics.
36.3.12 Power-on Reset Characteristics
Table 36-83. Power-on reset characteristics.
Note: 1. VPOT- values are only valid when BOD is disabled. When BOD is enabled VPOT- = VPOT+.
Symbol Parameter Condition Min. Typ. Max. Units
VBOT
BOD level 0 falling VCC 1.50 1.62 1.72
V
BOD level 1 falling VCC 1.8
BOD level 2 falling VCC 2.0
BOD level 3 falling VCC 2.2
BOD level 4 falling VCC 2.4
BOD level 5 falling VCC 2.6
BOD level 6 falling VCC 2.8
BOD level 7 falling VCC 3.0
tBOD Detection time
Continuous mode 0.4
µs
Sampled mode 1000
VHYST Hysteresis 1.2 %
Symbol Parameter Condition Min. Typ. Max. Units
tEXT Minimum reset pulse width 1000 95 ns
VRST
Reset threshold voltage (VIH)
VCC = 2.7 - 3.6V 0.60×VCC
V
VCC = 1.6 - 2.7V 0.60×VCC
Reset threshold voltage (VIL)
VCC = 2.7 - 3.6V 0.50×VCC
VCC = 1.6 - 2.7V 0.40×VCC
RRST Reset pin Pull-up Resistor 25 k
Symbol Parameter Condition Min. Typ. Max. Units
VPOT- (1) POR threshold voltage falling VCC
VCC falls faster than 1V/ms 0.4 1.0
V
VCC falls at 1V/ms or slower 0.8 1.0
VPOT+ POR threshold voltage rising VCC 1.3 1.59
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36.3.13 Flash and EEPROM Memory Characteristics
Table 36-84. Endurance and data retention.
Table 36-85. Programming time.
Notes: 1. Programming is timed from the 2MHz internal oscillator.
2. EEPROM is not erased if the EESAVE fuse is programmed.
Symbol Parameter Condition Min. Typ. Max. Units
Flash
Write/Erase cycles
25°C 10K
Cycle85°C 10K
105°C 2K
Data retention
25°C 100
Year85°C 25
105°C 10
EEPROM
Write/Erase cycles
25°C 100K
Cycle85°C 100K
105°C 30K
Data retention
25°C 100
Year85°C 25
105°C 10
Symbol Parameter Condition Min. Typ.(1) Max. Units
Chip Erase 64KB Flash, EEPROM(2) and SRAM Erase 55 ms
Application Erase Section erase 6ms
Flash
Page erase 4
msPage write 4
Atomic page erase and write 8
EEPROM
Page erase 4
msPage write 4
Atomic page erase and write 8
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36.3.14 Clock and Oscillator Characteristics
36.3.14.1 Calibrated 32.768kHz Internal Oscillator characteristics
Table 36-86. 32.768kHz internal oscillator characteristics.
36.3.14.2 Calibrated 2MHz RC Internal Oscillator characteristics
Table 36-87. 2MHz internal oscillator characteristics.
36.3.14.3 Calibrated and tunable 32MHz internal oscillator characteristics
Table 36-88. 32MHz internal oscillator characteristics.
Symbol Parameter Condition Min. Typ. Max. Units
Frequency 32.768 kHz
Factory calibration accuracy T = 85C, VCC = 3.0V -0.5 0.5 %
User calibration accuracy -0.5 0.5 %
Symbol Parameter Condition Min. Typ. Max. Units
Frequency range DFLL can tune to this frequency over
voltage and temperature 1.8 2.2 MHz
Factory calibrated frequency 2.0 MHz
Factory calibration accuracy T = 85C, VCC= 3.0V -1.5 1.5 %
User calibration accuracy -0.2 0.2 %
DFLL calibration stepsize 0.21 %
Symbol Parameter Condition Min. Typ. Max. Units
Frequency range DFLL can tune to this frequency over
voltage and temperature 30 55 MHz
Factory calibrated frequency 32 MHz
Factory calibration accuracy T = 85C, VCC= 3.0V -1.5 1.5 %
User calibration accuracy -0.2 0.2 %
DFLL calibration step size 0.22 %
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36.3.14.4 32kHz Internal ULP Oscillator characteristics
Table 36-89. 32kHz internal ULP oscillator characteristics.
36.3.14.5 Internal Phase Locked Loop (PLL) characteristics
Table 36-90. Internal PLL characteristics.
Note: 1. The maximum output frequency vs. supply voltage is linear between 1.8V and 2.7V, and can never be higher than four times the maximum CPU frequency.
36.3.14.6 External clock characteristics
Figure 36-17. External clock drive waveform
Table 36-91. External clock used as system clock without prescaling.
Symbol Parameter Condition Min. Typ. Max. Units
Factory calibrated frequency 32 kHz
Factory calibrated accuracy T = 85°C, VCC = 3.0V -12 12 %
Accuracy -30 30 %
Symbo
lParameter Condition Min. Typ. Max. Units
fIN Input frequency Output frequency must be within fOUT 0.4 64 MHz
fOUT Output frequency (1) VCC= 1.6 - 1.8V 20 48
MHz
VCC= 2.7 - 3.6V 20 128
Start-up time 25 µs
Re-lock time 25 µs
tCH
tCL
tCK
tCH
VIL1
VIH1
tCR tCF
Symbol Parameter Condition Min. Typ. Max. Units
1/tCK Clock Frequency (1) VCC = 1.6 - 1.8V 012
MHz
VCC = 2.7 - 3.6V 032
tCK Clock Period
VCC = 1.6 - 1.8V 83.3
ns
VCC = 2.7 - 3.6V 31.5
tCH Clock High Time
VCC = 1.6 - 1.8V 30.0
ns
VCC = 2.7 - 3.6V 12.5
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Note: 1. The maximum frequency vs. supply voltage is linear between 1.6V and 2.7V, and the same applies for all other parameters with supply voltage conditions.
Table 36-92. External clock with prescaler (1)for system clock.
Notes: 1. System Clock Prescalers must be set so that maximum CPU clock frequency for device is not exceeded.
2. The maximum frequency vs. supply voltage is linear between 1.6V and 2.7V, and the same applies for all other parameters with supply voltage conditions.
36.3.14.7 External 16MHz crystal oscillator and XOSC characteristic
Table 36-93. External 16MHz crystal oscillator and XOSC characteristics.
tCL Clock Low Time
VCC = 1.6 - 1.8V 30.0
ns
VCC = 2.7 - 3.6V 12.5
tCR Rise Time (for maximum frequency)
VCC = 1.6 - 1.8V 10
ns
VCC = 2.7 - 3.6V 3
tCF Fall Time (for maximum frequency)
VCC = 1.6 - 1.8V 10
ns
VCC = 2.7 - 3.6V 3
tCK Change in period from one clock cycle to the next 10 %
Symbol Parameter Condition Min. Typ. Max. Units
Symbol Parameter Condition Min. Typ. Max. Units
1/tCK Clock Frequency (2) VCC = 1.6 - 1.8V 090
MHz
VCC = 2.7 - 3.6V 0142
tCK Clock Period
VCC = 1.6 - 1.8V 11
ns
VCC = 2.7 - 3.6V 7
tCH Clock High Time
VCC = 1.6 - 1.8V 4.5
ns
VCC = 2.7 - 3.6V 2.4
tCL Clock Low Time
VCC = 1.6 - 1.8V 4.5
ns
VCC = 2.7 - 3.6V 2.4
tCR Rise Time (for maximum frequency)
VCC = 1.6 - 1.8V 1.5
ns
VCC = 2.7 - 3.6V 1.0
tCF Fall Time (for maximum frequency)
VCC = 1.6 - 1.8V 1.5 ns
VCC = 2.7 - 3.6V 1.0
tCK Change in period from one clock cycle to the next 10 %
Symbol Parameter Condition Min. Typ. Max. Units
Cycle to cycle jitter
XOSCPWR=0
FRQRANGE=0 <10
nsFRQRANGE=1, 2, or 3 <1
XOSCPWR=1 <1
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Long term jitter
XOSCPWR=0
FRQRANGE=0 <6
nsFRQRANGE=1, 2, or 3 <0.5
XOSCPWR=1 <0.5
Frequency error
XOSCPWR=0
FRQRANGE=0 <0.1
%
FRQRANGE=1 <0.05
FRQRANGE=2 or 3 <0.005
XOSCPWR=1 <0.005
Duty cycle
XOSCPWR=0
FRQRANGE=0 40
%
FRQRANGE=1 42
FRQRANGE=2 or 3 45
XOSCPWR=1 48
RQNegative impedance (1)
XOSCPWR=0,
FRQRANGE=0
0.4MHz resonator,
CL=100pF 2.4k
1MHz crystal, CL=20pF 8.7k
2MHz crystal, CL=20pF 2.1k
XOSCPWR=0,
FRQRANGE=1,
CL=20pF
2MHz crystal 4.2k
8MHz crystal 250
9MHz crystal 195
XOSCPWR=0,
FRQRANGE=2,
CL=20pF
8MHz crystal 360
9MHz crystal 285
12MHz crystal 155
XOSCPWR=0,
FRQRANGE=3,
CL=20pF
9MHz crystal 365
12MHz crystal 200
16MHz crystal 105
XOSCPWR=1,
FRQRANGE=0,
CL=20pF
9MHz crystal 435
12MHz crystal 235
16MHz crystal 125
XOSCPWR=1,
FRQRANGE=1,
CL=20pF
9MHz crystal 495
12MHz crystal 270
16MHz crystal 145
XOSCPWR=1,
FRQRANGE=2,
CL=20pF
12MHz crystal 305
16MHz crystal 160
XOSCPWR=1,
FRQRANGE=3,
CL=20pF
12MHz crystal 380
16MHz crystal 205
Symbol Parameter Condition Min. Typ. Max. Units
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Note: 1. Numbers for negative impedance are not tested in production but guaranteed from design and characterization
36.3.14.8 External 32.768kHz crystal oscillator and TOSC characteristics
Table 36-94. External 32.768kHz crystal oscillator and TOSC characteristics.
Note: 1. See Figure 36-18 for definition.
Figure 36-18. TOSC input capacitance.
The parasitic capacitance between the TOSC pins is CL1 + CL2 in series as seen from the crystal when oscillating without
external capacitors.
ESR SF = Safety factor min(RQ)/SF k
CXTAL1
Parasitic capacitance
XTAL1 pin 5.60 pF
CXTAL2
Parasitic capacitance
XTAL2 pin 7.62 pF
CLOAD
Parasitic capacitance
load 3.23 pF
Symbol Parameter Condition Min. Typ. Max. Units
Symbol Parameter Condition Min. Typ. Max. Units
ESR/R1 Recommended crystal equivalent
series resistance (ESR)
Crystal load capacitance 6.5pF 60
k
Crystal load capacitance 9.0pF 35
CTOSC1 Parasitic capacitance TOSC1 pin
5.4 pF
Alternate TOSC location 4.0
CTOSC2 Parasitic capacitance TOSC2 pin
7.1 pF
Alternate TOSC location 4.0
Recommended safety factor capacitance load matched to
crystal specification 3
C
L1
C
L2
2CS
O
T
1
CS
O
TDevice internal
External
32.768kHz crystal
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36.3.15 SPI Characteristics
Figure 36-19.SPI timing requirements in master mode.
Figure 36-20.SPI timing requirements in slave mode.
MOS
MIS MIH
SCKW
SCK
MOH MOH
SCKFSCKR
SCKW
SIS SIH
SSCKW
SSCKW
SSCK
SSH
SOSSH
SCKR SCKF
SOS
SSS
SOSSS
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Table 36-95. SPI timing characteristics and requirements.
Symbol Parameter Condition Min. Typ. Max. Units
tSCK SCK period Master (See Table 21-4 in
XMEGA AU Manual)
ns
tSCKW SCK high/low width Master 0.5*SCK
tSCKR SCK rise time Master 2.7
tSCKF SCK fall time Master 2.7
tMIS MISO setup to SCK Master 11
tMIH MISO hold after SCK Master 0
tMOS MOSI setup SCK Master 0.5*SCK
tMOH MOSI hold after SCK Master 1.0
tSSCK Slave SCK Period Slave 4*t ClkPER
tSSCKW SCK high/low width Slave 2*t ClkPER
tSSCKR SCK rise time Slave 1600
tSSCKF SCK fall time Slave 1600
tSIS MOSI setup to SCK Slave 3.0
tSIH MOSI hold after SCK Slave tPER
tSSS SS setup to SCK Slave 20
tSSH SS hold after SCK Slave 20
tSOS MISO setup SCK Slave 8.0
tSOH MISO hold after SCK Slave 13.0
tSOSS MISO setup after SS low Slave 11.0
tSOSH MISO hold after SS high Slave 8.0
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36.3.16 Two-Wire Interface Characteristics
Table 36-96 describes the requirements for devices connected to the Two-Wire Interface Bus. The Microchip AVR
XMEGA Two-Wire Interface meets or exceeds these requirements under the noted conditions. Timing symbols refer to
Figure 36-21.
Figure 36-21.Two-wire interface bus timing.
Table 36-96. Two-wire interface characteristics.
HD;STA
of
LOW
HIGH
SU;STA
BUF
r
HD;DAT
SU;DAT SU;STO
Symbol Parameter Condition Min. Typ. Max. Units
VIH Input high voltage 0.7*VCC VCC+0.5 V
VIL Input low voltage -0.5 0.3*VCC V
Vhys Hysteresis of Schmitt trigger inputs 0.05*VCC (1) 0 V
VOL Output low voltage 3mA, sink current 00.4 V
trRise time for both SDA and SCL 20+0.1Cb (1)(2) 0ns
tof Output fall time from VIHmin to VILmax 10pF < Cb < 400pF(2) 20+0.1Cb (1)(2) 300 ns
tSP Spikes suppressed by input filter 050 ns
IIInput current for each I/O pin 0.1VCC < VI < 0.9VCC -10 10 µA
CICapacitance for each I/O pin 010 pF
fSCL SCL clock frequency fPER (3)>max(10fSCL, 250kHz) 0400 kHz
RPValue of pull-up resistor
fSCL 100kHz
fSCL > 100kHz
tHD;STA Hold time (repeated) START condition
fSCL 100kHz 4.0
µs
fSCL > 100kHz 0.6
tLOW Low period of SCL clock
fSCL 100kHz 4.7
µs
fSCL > 100kHz 1.3
tHIGH High period of SCL clock
fSCL 100kHz 4.0
µs
fSCL > 100kHz 0.6
tSU;STA
Set-up time for a repeated START
condition
fSCL 100kHz 4.7
µs
fSCL > 100kHz 0.6
VCC 0.4V–
3mA
----------------------------
100ns
Cb
---------------
300ns
Cb
---------------
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Notes: 1. Required only for fSCL > 100kHz.
2. Cb = Capacitance of one bus line in pF.
3. fPER = Peripheral clock frequency.
tHD;DAT Data hold time
fSCL 100kHz 03.45
µs
fSCL > 100kHz 00.9
tSU;DAT Data setup time
fSCL 100kHz 250
ns
fSCL > 100kHz 100
tSU;STO Setup time for STOP condition
fSCL 100kHz 4.0
µs
fSCL > 100kHz 0.6
tBUF
Bus free time between a STOP and
START condition
fSCL 100kHz 4.7
µs
fSCL > 100kHz 1.3
Symbol Parameter Condition Min. Typ. Max. Units
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36.4 ATxmega128A4U
36.4.1 Absolute Maximum Ratings
Stresses beyond those listed in Table 36-97 may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Table 36-97. Absolute maximum ratings.
36.4.2 General Operating Ratings
The device must operate within the ratings listed in Table 36-98 in order for all other electrical characteristics and typical
characteristics of the device to be valid.
Table 36-98. General operating conditions.
Table 36-99. Operating voltage and frequency.
The maximum CPU clock frequency depends on VCC. As shown in Figure 36-22 the Frequency vs. VCC curve is linear
between 1.8V < VCC <2.7V.
Symbol Parameter Condition Min. Typ. Max. Units
VCC Power supply voltage -0.3 4 V
IVCC Current into a VCC pin 200 mA
IGND Current out of a Gnd pin 200 mA
VPIN Pin voltage with respect to Gnd and VCC -0.5 VCC+0.5 V
IPIN I/O pin sink/source current -25 25 mA
TAStorage temperature -65 150 °C
TjJunction temperature 150 °C
Symbol Parameter Condition Min. Typ. Max. Units
VCC Power supply voltage 1.60 3.6 V
AVCC Analog supply voltage 1.60 3.6 V
TATemperature range -40 85 °C
TjJunction temperature -40 105 °C
Symbol Parameter Condition Min. Typ. Max. Units
ClkCPU CPU clock frequency
VCC = 1.6V 012
MHz
VCC = 1.8V 012
VCC = 2.7V 032
VCC = 3.6V 032
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Figure 36-22.Maximum Frequency vs. VCC.
1.8
12
32
MHz
V
2.7 3.6
1.6
Safe Operating Area
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36.4.3 Current consumption
Table 36-100.Current consumption for Active mode and sleep modes.
Notes: 1. All Power Reduction Registers set.
2. Maximum limits are based on characterization, and not tested in production.
Symbol Parameter Condition Min. Typ. Max. Units
ICC
Active power
consumption (1)
32kHz, Ext. Clk
VCC = 1.8V 55
µA
VCC = 3.0V 135
1MHz, Ext. Clk
VCC = 1.8V 255
VCC = 3.0V 535
2MHz, Ext. Clk
VCC = 1.8V 460 600
VCC = 3.0V
1.0 1.4
mA
32MHz, Ext. Clk 9.5 12
Idle power
consumption (1)
32kHz, Ext. Clk
VCC = 1.8V 2.9
µA
VCC = 3.0V 3.9
1MHz, Ext. Clk
VCC = 1.8V 62
VCC = 3.0V 118
2MHz, Ext. Clk
VCC = 1.8V 125 225
VCC = 3.0V
240 350
32MHz, Ext. Clk 3.8 5.5 mA
Power-down power
consumption
T=25°C
VCC = 3.0V
0.1 1.0
µA
T=85°C 1.5 4.5
T = 105°C 0.1 8.6
WDT and Sampled BOD enabled,
T=25°C
VCC = 3.0V
1.4 3.0
WDT and Sampled BOD enabled,
T = 85°C 2.8 6.0
WDT and Sampled BOD enabled,
T = 105°C 1.4 8.8
Power-save power
consumption (2)
RTC from ULP clock, WDT and
sampled BOD enabled, T = 25°C
VCC = 1.8V 1.2
µA
VCC = 3.0V 1.5
RTC from 1.024kHz low power
32.768kHz TOSC, T = 25°C
VCC = 1.8V 0.6 2.0
VCC = 3.0V 0.7 2.0
RTC from low power 32.768kHz
TOSC, T = 25°C
VCC = 1.8V 0.8 3.0
VCC = 3.0V 1.0 3.0
Reset power consumption Current through RESET pin
substracted VCC = 3.0V 300 µA
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Table 36-101.Current consumption for modules and peripherals.
Note: 1. All parameters measured as the difference in current consumption between module enabled and disabled. All data at VCC =3.0V, Clk
SYS = 1MHz external clock
without prescaling, T = 25°C unless other conditions are given.
Symbol Parameter Condition (1) Min. Typ. Max. Units
ICC
ULP oscillator 1.0 µA
32.768kHz int. oscillator 29 µA
2MHz int. oscillator
85
µA
DFLL enabled with 32.768kHz int. osc. as reference 115
32MHz int. oscillator
270
µA
DFLL enabled with 32.768kHz int. osc. as reference 440
PLL 20x multiplication factor,
32MHz int. osc. DIV4 as reference 320 µA
Watchdog timer 1.0 µA
BOD
Continuous mode 138
µA
Sampled mode, includes ULP oscillator 1.2
Internal 1.0V reference 260 µA
Temperature sensor 250 µA
ADC 250ksps
VREF = Ext ref
3.0 mA
CURRLIMIT = LOW 2.6
CURRLIMIT = MEDIUM 2.1
CURRLIMIT = HIGH 1.6
DAC
250ksps
VREF = Ext ref
No load
Normal mode 1.9
mA
Low power mode 1.1
AC
High speed mode 330
µA
Low power mode 130
DMA 615kbps between I/O registers and SRAM 108 µA
Timer/counter 16 µA
USART Rx and Tx enabled, 9600 BAUD 2.5 µA
Flash memory and EEPROM programming 4.0 8.0 mA
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36.4.4 Wake-up time from sleep modes
Table 36-102. Device wake-up time from sleep modes with various system clock sources.
Note: 1. The wake-up time is the time from the wake-up request is given until the peripheral clock is available on pin, see Figure 36-23. All peripherals and modules start
execution from the first clock cycle, expect the CPU that is halted for four clock cycles before program execution starts.
Figure 36-23.Wake-up time definition.
Symbol Parameter Condition Min. Typ. (1) Max. Units
twakeup
Wake-up time from idle,
standby, and extended standby
mode
External 2MHz clock 2.0
µs
32.768kHz internal oscillator 120
2MHz internal oscillator 2.0
32MHz internal oscillator 0.2
Wake-up time from power-save
and power-down mode
External 2MHz clock 4.5
µs
32.768kHz internal oscillator 320
2MHz internal oscillator 9.0
32MHz internal oscillator 5.0
Wakeup request
Clock output
Wakeup time
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36.4.5 I/O Pin Characteristics
The I/O pins comply with the JEDEC LVTTL and LVCMOS specification and the high- and low level input and output
voltage limits reflect or exceed this specification.
Table 36-103.I/O pin characteristics.
Notes: 1. The sum of all IOH for PORTA and PORTB must not exceed 100mA.
The sum of all IOH for PORTC must not exceed 200mA.
The sum of all IOH for PORTD and pins PE[0-1] on PORTE must not exceed 200mA.
The sum of all IOH for PE[2-3] on PORTE, PORTR and PDI must not exceed 100mA.
2. The sum of all IOL for PORTA and PORTB must not exceed 100mA.
The sum of all IOL for PORTC must not exceed 200mA.
The sum of all IOL for PORTD and pins PE[0-1] on PORTE must not exceed 200mA.
The sum of all IOL for PE[2-3] on PORTE, PORTR and PDI must not exceed 100mA.
Symbol Parameter Condition Min. Typ. Max. Units
IOH (1)/
IOL (2) I/O pin source/sink current -20 20 mA
VIH High level input voltage
VCC = 2.7 - 3.6V 2.0 VCC+0.3
VVCC = 2.0 - 2.7V 0.7*VCC VCC+0.3
VCC = 1.6 - 2.0V 0.8*VCC VCC+0.3
VIL Low level input voltage
VCC = 2.7- 3.6V -0.3 0.8
VVCC = 2.0 - 2.7V -0.3 0.3*VCC
VCC = 1.6 - 2.0V -0.3 0.2*VCC
VOH High level output voltage
VCC = 3.0 - 3.6V IOH = -2mA 2.4 0.94*VCC
V
VCC = 2.3 - 2.7V
IOH = -1mA 2.0 0.96*VCC
IOH = -2mA 1.7 0.92*VCC
VCC = 3.3V IOH = -8mA 2.6 2.9
VCC = 3.0V IOH = -6mA 2.1 2.6
VCC = 1.8V IOH = -2mA 1.4 1.6
VOL Low level output voltage
VCC = 3.0 - 3.6V IOL = 2mA 0.05 0.4
V
VCC = 2.3 - 2.7V
IOL = 1mA 0.03 0.4
IOL = 2mA 0.06 0.7
VCC = 3.3V IOL = 15mA 0.4 0.76
VCC = 3.0V IOL = 10mA 0.3 0.64
VCC = 1.8V IOL = 5mA 0.2 0.46
IIN Input leakage current T = 25°C <0.01 0.1 µA
RPPull/buss keeper resistor 24 k
trRise time No load
4.0
ns
slew rate limitation 7.0
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36.4.6 ADC characteristics
Table 36-104.Power supply, reference and input range.
Table 36-105.Clock and timing.
Symbol Parameter Condition Min. Typ. Max. Units
AVCC Analog supply voltage VCC- 0.3 VCC+ 0.3 V
VREF Reference voltage 1AVCC- 0.6 V
Rin Input resistance Switched 4.0 k
Csample Input capacitance Switched 4.4 pF
RAREF Reference input resistance (leakage only) >10 M
CAREF Reference input capacitance Static load 7pF
VIN Input range -0.1 AVCC+0.1 V
Conversion range Differential mode, Vinp - Vinn -VREF VREF V
Conversion range Single ended unsigned mode, Vinp -V VREF-V V
ΔV Fixed offset voltage 190 lsb
Symbol Parameter Condition Min. Typ. Max. Units
ClkADC ADC Clock frequency
Maximum is 1/4 of Peripheral clock
frequency 100 2000
kHz
Measuring internal signals 100 125
fADC Sample rate
Current limitation (CURRLIMIT) off 100 2000
ksps
CURRLIMIT = LOW 100 1500
CURRLIMIT = MEDIUM 100 1000
CURRLIMIT = HIGH 100 500
Sampling time 1/2 ClkADC cycle 0.25 5µs
Conversion time (latency) (RES+2)/2+(GAIN !=0)
RES (Resolution) = 8 or 12 5 8 ClkADC
cycles
Start-up time ADC clock cycles 12 24 ClkADC
cycles
ADC settling time
After changing reference or input mode 7 7 ClkADC
cycles
After ADC flush 1 1
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Table 36-106. Accuracy characteristics.
Notes: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% input voltage range.
2. Unless otherwise noted all linearity, offset and gain error numbers are valid under the condition that external VREF is used.
Table 36-107. Gain stage characteristics.
Symbol Parameter Condition (2) Min. Typ. Max. Units
RES Resolution Programmable to 8 or 12 bit 812 12 Bits
INL (1) Integral non-linearity
500ksps
VCC-1.0V < VREF< VCC-0.6V ±1.2 ±2 lsb
All VREF ±1.5 ±3
2000ksps
VCC-1.0V < VREF< VCC-0.6V ±1.0 ±2
All VREF ±1.5 ±3
DNL (1) Differential non-linearity guaranteed monotonic <±0.8 <±1 lsb
Offset error
-1.0 mV
Temperature drift <0.01 mV/K
Operating voltage drift <0.6 mV/V
Gain error
Differential
mode
External reference -1
mV
AVCC/1.6 10
AVCC/2.0 8.0
Bandgap ±5
Temperature drift <0.02 mV/K
Operating voltage drift <0.5 mV/V
Noise Differential mode, shorted input
2msps, VCC = 3.6V, ClkPER = 16MHz 0.4 mV
rms
Symbol Parameter Condition Min. Typ. Max. Units
Rin Input resistance Switched in normal mode 4.0 k
Csample Input capacitance Switched in normal mode 4.4 pF
Signal range Gain stage output 0 VCC- 0.6 V
Propagation delay ADC conversion rate 1.0 ClkADC
cycles
Sample rate Same as ADC 100 1000 kHz
INL (1) Integral Non-Linearity 500ksps All gain
settings ±1.5 ±4.0 lsb
Gain error
1x gain, normal mode -0.8
%8x gain, normal mode -2.5
64x gain, normal mode -3.5
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Note: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% input voltage range.
36.4.7 DAC Characteristics
Table 36-108. Power supply, reference and output range.
Table 36-109. Clock and timing.
Offset error,
input referred
1x gain, normal mode -2.0
mV8x gain, normal mode -5.0
64x gain, normal mode -4.0
Noise
1x gain, normal mode
VCC = 3.6V
Ext. VREF
0.5
mV
rms
8x gain, normal mode 1.5
64x gain, normal mode 11
Symbol Parameter Condition Min. Typ. Max. Units
Symbol Parameter Condition Min. Typ. Max. Units
AVCC Analog supply voltage VCC- 0.3 VCC+ 0.3
AVREF External reference voltage 1.0 VCC- 0.6 V
Rchannel DC output impedance 50
Linear output voltage range 0.15 AVCC-0.15 V
RAREF Reference input resistance >10 M
CAREF Reference input capacitance Static load 7.0 pF
Minimum Resistance load 1 k
Maximum capacitance load
100 pF
1000 serial resistance 1nF
Output sink/source
Operating within accuracy specification AVCC/1000
mA
Safe operation 10
Symbol Parameter Condition Min. Typ. Max. Units
fDAC Conversion rate Cload=100pF,
maximum step size
Normal mode 01000
ksps
Low power mode 500
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Table 36-110.Accuracy characteristics.
Note: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% output voltage range.
Symbol Parameter Condition Min. Typ. Max. Units
RES Input resolution 12 Bits
INL (1) Integral non-linearity
VREF= Ext 1.0V
VCC = 1.6V ±2.0 ±3.0
lsb
VCC = 3.6V ±1.5 ±2.5
VREF=AVCC
VCC = 1.6V ±2.0 ±4.0
VCC = 3.6V ±1.5 ±4.0
VREF=INT1V
VCC = 1.6V ±5.0
VCC = 3.6V ±5.0
DNL (1) Differential non-linearity
VREF=Ext 1.0V
VCC = 1.6V ±1.5 3.0
lsb
VCC = 3.6V ±0.6 1.5
VREF=AVCC
VCC = 1.6V ±1.0 3.5
VCC = 3.6V ±0.6 1.5
VREF=INT1V
VCC = 1.6V ±4.5
VCC = 3.6V ±4.5
Gain error After calibration <4.0 lsb
Gain calibration step size 4.0 lsb
Gain calibration drift VREF= Ext 1.0V <0.2 mV/K
Offset error After calibration <1.0 lsb
Offset calibration step size 1.0
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36.4.8 Analog Comparator Characteristics
Table 36-111. Analog Comparator characteristics.
36.4.9 Bandgap and Internal 1.0V Reference Characteristics
Table 36-112. Bandgap and Internal 1.0V reference characteristics.
Symbol Parameter Condition Min. Typ. Max. Units
Voff Input offset voltage <±10 mV
Ilk Input leakage current <1 nA
Input voltage range -0.1 AVCC V
AC startup time 100 µs
Vhys1 Hysteresis, none 0mV
Vhys2 Hysteresis, small
mode = High Speed (HS) 13
mV
mode = Low Power (LP) 30
Vhys3 Hysteresis, large
mode = HS 30
mV
mode = LP 60
tdelay Propagation delay
VCC = 3.0V, T= 85°C mode = HS 30 90
ns
mode = HS 30
VCC = 3.0V, T= 85°C mode = LP 130 500
mode = LP 130
64-level voltage scaler Integral non-linearity (INL) 0.3 0.5 lsb
Symbol Parameter Condition Min. Typ. Max. Units
Startup time
As reference for ADC or DAC 1 ClkPER + 2.5µs
µs
As input voltage to ADC and AC 1.5
Bandgap voltage 1.1 V
INT1V Internal 1.00V reference T= 85°C, after calibration 0.99 1.0 1.01 V
Variation over voltage and temperature Relative to T= 85°C, VCC = 3.0V ±1.5 %
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36.4.10 Brownout Detection Characteristics
Table 36-113. Brownout detection characteristics.
36.4.11 External Reset Characteristics
Table 36-114. External reset characteristics.
36.4.12 Power-on Reset Characteristics
Table 36-115. Power-on reset characteristics.
Note: 1. VPOT- values are only valid when BOD is disabled. When BOD is enabled VPOT- = VPOT+.
Symbol Parameter Condition Min. Typ. Max. Units
VBOT
BOD level 0 falling VCC 1.50 1.62 1.72
V
BOD level 1 falling VCC 1.8
BOD level 2 falling VCC 2.0
BOD level 3 falling VCC 2.2
BOD level 4 falling VCC 2.4
BOD level 5 falling VCC 2.6
BOD level 6 falling VCC 2.8
BOD level 7 falling VCC 3.0
tBOD Detection time
Continuous mode 0.4
µs
Sampled mode 1000
VHYST Hysteresis 1.2 %
Symbol Parameter Condition Min. Typ. Max. Units
tEXT Minimum reset pulse width 1000 95 ns
VRST
Reset threshold voltage (VIH)
VCC = 2.7 - 3.6V 0.60×VCC
V
VCC = 1.6 - 2.7V 0.60×VCC
Reset threshold voltage (VIL)
VCC = 2.7 - 3.6V 0.50×VCC
VCC = 1.6 - 2.7V 0.40×VCC
RRST Reset pin Pull-up Resistor 25 k
Symbol Parameter Condition Min. Typ. Max. Units
VPOT- (1) POR threshold voltage falling VCC
VCC falls faster than 1V/ms 0.4 1.0
V
VCC falls at 1V/ms or slower 0.8 1.0
VPOT+ POR threshold voltage rising VCC 1.3 1.59 mV
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36.4.13 Flash and EEPROM Memory Characteristics
Table 36-116. Endurance and data retention.
Table 36-117. Programming time.
Notes: 1. Programming is timed from the 2MHz internal oscillator.
2. EEPROM is not erased if the EESAVE fuse is programmed.
Symbol Parameter Condition Min. Typ. Max. Units
Flash
Write/Erase cycles
25°C 10K
Cycle85°C 10K
105°C 2K
Data retention
25°C 100
Year85°C 25
105°C 10
EEPROM
Write/Erase cycles
25°C 100K
Cycle85°C 100K
105°C 30K
Data retention
25°C 100
Year85°C 25
105°C 10
Symbol Parameter Condition Min. Typ.(1) Max. Units
Chip Erase 128KB Flash, EEPROM(2) and SRAM Erase 75 ms
Application Erase Section erase 6ms
Flash
Page erase 4
msPage write 4
Atomic page erase and write 8
EEPROM
Page erase 4
msPage write 4
Atomic page erase and write 8
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36.4.14 Clock and Oscillator Characteristics
36.4.14.1 Calibrated 32.768kHz Internal Oscillator characteristics
Table 36-118. 32.768kHz internal oscillator characteristics.
36.4.14.2 Calibrated 2MHz RC Internal Oscillator characteristics
Table 36-119. 2MHz internal oscillator characteristics.
36.4.14.3 Calibrated and tunable 32MHz internal oscillator characteristics
Table 36-120. 32MHz internal oscillator characteristics.
36.4.14.4 32kHz Internal ULP Oscillator characteristics
Table 36-121. 32kHz internal ULP oscillator characteristics.
Symbol Parameter Condition Min. Typ. Max. Units
Frequency 32.768 kHz
Factory calibration accuracy T = 85C, VCC = 3.0V -0.5 0.5 %
User calibration accuracy -0.5 0.5 %
Symbol Parameter Condition Min. Typ. Max. Units
Frequency range DFLL can tune to this frequency over
voltage and temperature 1.8 2.2 MHz
Factory calibrated frequency 2.0 MHz
Factory calibration accuracy T = 85C, VCC= 3.0V -1.5 1.5 %
User calibration accuracy -0.2 0.2 %
DFLL calibration stepsize 0.21 %
Symbol Parameter Condition Min. Typ. Max. Units
Frequency range DFLL can tune to this frequency over
voltage and temperature 30 55 MHz
Factory calibrated frequency 32 MHz
Factory calibration accuracy T = 85C, VCC= 3.0V -1.5 1.5 %
User calibration accuracy -0.2 0.2 %
DFLL calibration step size 0.22 %
Symbol Parameter Condition Min. Typ. Max. Units
Output frequency 32 kHz
Accuracy -30 30 %
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36.4.14.5 Internal Phase Locked Loop (PLL) characteristics
Table 36-122. Internal PLL characteristics.
Note: 1. The maximum output frequency vs. supply voltage is linear between 1.8V and 2.7V, and can never be higher than four times the maximum CPU frequency.
36.4.14.6 External clock characteristics
Figure 36-24. External clock drive waveform
Table 36-123.External clock used as system clock without prescaling.
Note: 1. The maximum frequency vs. supply voltage is linear between 1.6V and 2.7V, and the same applies for all other parameters with supply voltage conditions.
Symbo
lParameter Condition Min. Typ. Max. Units
fIN Input frequency Output frequency must be within fOUT 0.4 64 MHz
fOUT Output frequency (1) VCC= 1.6 - 1.8V 20 48
MHz
VCC= 2.7 - 3.6V 20 128
Start-up time 25 µs
Re-lock time 25 µs
tCH
tCL
tCK
tCH
VIL1
VIH1
tCR tCF
Symbol Parameter Condition Min. Typ. Max. Units
1/tCK Clock Frequency (1) VCC = 1.6 - 1.8V 012
MHz
VCC = 2.7 - 3.6V 032
tCK Clock Period
VCC = 1.6 - 1.8V 83.3
ns
VCC = 2.7 - 3.6V 31.5
tCH Clock High Time
VCC = 1.6 - 1.8V 30.0
ns
VCC = 2.7 - 3.6V 12.5
tCL Clock Low Time
VCC = 1.6 - 1.8V 30.0
ns
VCC = 2.7 - 3.6V 12.5
tCR Rise Time (for maximum frequency)
VCC = 1.6 - 1.8V 10
ns
VCC = 2.7 - 3.6V 3
tCF Fall Time (for maximum frequency)
VCC = 1.6 - 1.8V 10
ns
VCC = 2.7 - 3.6V 3
tCK Change in period from one clock cycle to the next 10 %
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Table 36-124. External clock with prescaler (1)for system clock.
Notes: 1. System Clock Prescalers must be set so that maximum CPU clock frequency for device is not exceeded.
2. The maximum frequency vs. supply voltage is linear between 1.6V and 2.7V, and the same applies for all other parameters with supply voltage conditions.
36.4.14.7 External 16MHz crystal oscillator and XOSC characteristic
Table 36-125. External 16MHz crystal oscillator and XOSC characteristics.
Symbol Parameter Condition Min. Typ. Max. Units
1/tCK Clock Frequency (2) VCC = 1.6 - 1.8V 090
MHz
VCC = 2.7 - 3.6V 0142
tCK Clock Period
VCC = 1.6 - 1.8V 11
ns
VCC = 2.7 - 3.6V 7
tCH Clock High Time
VCC = 1.6 - 1.8V 4.5
ns
VCC = 2.7 - 3.6V 2.4
tCL Clock Low Time
VCC = 1.6 - 1.8V 4.5
ns
VCC = 2.7 - 3.6V 2.4
tCR Rise Time (for maximum frequency)
VCC = 1.6 - 1.8V 1.5
ns
VCC = 2.7 - 3.6V 1.0
tCF Fall Time (for maximum frequency)
VCC = 1.6 - 1.8V 1.5
ns
VCC = 2.7 - 3.6V 1.0
tCK Change in period from one clock cycle to the next 10 %
Symbol Parameter Condition Min. Typ. Max. Units
Cycle to cycle jitter
XOSCPWR=0
FRQRANGE=0 <10
nsFRQRANGE=1, 2, or 3 <1
XOSCPWR=1 <1
Long term jitter
XOSCPWR=0
FRQRANGE=0 <6
nsFRQRANGE=1, 2, or 3 <0.5
XOSCPWR=1 <0.5
Frequency error
XOSCPWR=0
FRQRANGE=0 <0.1
%
FRQRANGE=1 <0.05
FRQRANGE=2 or 3 <0.005
XOSCPWR=1 <0.005
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Note: 1. Numbers for negative impedance are not tested in production but guaranteed from design and characterization.
Duty cycle
XOSCPWR=0
FRQRANGE=0 40
%
FRQRANGE=1 42
FRQRANGE=2 or 3 45
XOSCPWR=1 48
RQNegative impedance (1)
XOSCPWR=0,
FRQRANGE=0
0.4MHz resonator,
CL=100pF 2.4k
1MHz crystal, CL=20pF 8.7k
2MHz crystal, CL=20pF 2.1k
XOSCPWR=0,
FRQRANGE=1,
CL=20pF
2MHz crystal 4.2k
8MHz crystal 250
9MHz crystal 195
XOSCPWR=0,
FRQRANGE=2,
CL=20pF
8MHz crystal 360
9MHz crystal 285
12MHz crystal 155
XOSCPWR=0,
FRQRANGE=3,
CL=20pF
9MHz crystal 365
12MHz crystal 200
16MHz crystal 105
XOSCPWR=1,
FRQRANGE=0,
CL=20pF
9MHz crystal 435
12MHz crystal 235
16MHz crystal 125
XOSCPWR=1,
FRQRANGE=1,
CL=20pF
9MHz crystal 495
12MHz crystal 270
16MHz crystal 145
XOSCPWR=1,
FRQRANGE=2,
CL=20pF
12MHz crystal 305
16MHz crystal 160
XOSCPWR=1,
FRQRANGE=3,
CL=20pF
12MHz crystal 380
16MHz crystal 205
ESR SF = Safety factor min(RQ)/SF k
CXTAL1
Parasitic capacitance
XTAL1 pin 5.45 pF
CXTAL2
Parasitic capacitance
XTAL2 pin 7.51 pF
CLOAD
Parasitic capacitance
load 3.16 pF
Symbol Parameter Condition Min. Typ. Max. Units
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36.4.14.8 External 32.768kHz crystal oscillator and TOSC characteristics
Table 36-126. External 32.768kHz crystal oscillator and TOSC characteristics.
Note: 1. See Figure 36-25 for definition.
Figure 36-25. TOSC input capacitance.
The parasitic capacitance between the TOSC pins is CL1 + CL2 in series as seen from the crystal when oscillating without
external capacitors.
Symbol Parameter Condition Min. Typ. Max. Units
ESR/R1 Recommended crystal equivalent
series resistance (ESR)
Crystal load capacitance 6.5pF 60
k
Crystal load capacitance 9.0pF 35
CTOSC1 Parasitic capacitance TOSC1 pin
5.4
pF
Alternate TOSC location 4.0
CTOSC2 Parasitic capacitance TOSC2 pin
7.1
pF
Alternate TOSC location 4.0
Recommended safety factor capacitance load matched to
crystal specification 3
C
L1
C
L2
2CS
O
T
1
CS
O
TDevice internal
External
32.768kHz crystal
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36.4.15 SPI Characteristics
Figure 36-26. SPI timing requirements in master mode.
Figure 36-27. SPI timing requirements in slave mode.
MOS
MIS MIH
SCKW
SCK
MOH MOH
SCKFSCKR
SCKW
SIS SIH
SSCKW
SSCKW
SSCK
SSH
SOSSH
SCKR SCKF
SOS
SSS
SOSSS
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Table 36-127. SPI timing characteristics and requirements.
Symbol Parameter Condition Min. Typ. Max. Units
tSCK SCK Period Master (See Table 21-4 in
XMEGA AU Manual)
ns
tSCKW SCK high/low width Master 0.5×SCK
tSCKR SCK Rise time Master 2.7
tSCKF SCK Fall time Master 2.7
tMIS MISO setup to SCK Master 10
tMIH MISO hold after SCK Master 10
tMOS MOSI setup SCK Master 0.5×SCK
tMOH MOSI hold after SCK Master 1
tSSCK Slave SCK Period Slave 4×t ClkPER
tSSCKW SCK high/low width Slave 2×t ClkPER
tSSCKR SCK Rise time Slave 1600
tSSCKF SCK Fall time Slave 1600
tSIS MOSI setup to SCK Slave 3
tSIH MOSI hold after SCK Slave t ClkPER
tSSS SS setup to SCK Slave 21
tSSH SS hold after SCK Slave 20
tSOS MISO setup SCK Slave 8
tSOH MISO hold after SCK Slave 13
tSOSS MISO setup after SS low Slave 11
tSOSH MISO hold after SS high Slave 8
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36.4.16 Two-Wire Interface Characteristics
Table 36-128 describes the requirements for devices connected to the Two-Wire Interface Bus. The Microchip AVR
XMEGA Two-Wire Interface meets or exceeds these requirements under the noted conditions. Timing symbols refer to
Figure 36-28.
Figure 36-28. Two-wire interface bus timing.
Table 36-128. Two-wire interface characteristics.
HD;STA
of
LOW
HIGH
SU;STA
BUF
r
HD;DAT
SU;DAT SU;STO
Symbol Parameter Condition Min. Typ. Max. Units
VIH Input High Voltage 0.7VCC VCC+0.5 V
VIL Input Low Voltage 0.5 0.3×VCC V
Vhys Hysteresis of Schmitt Trigger Inputs 0.05VCC (1) V
VOL Output Low Voltage 3mA, sink current 00.4 V
trRise Time for both SDA and SCL 20+0.1Cb (1)(2) 300 ns
tof Output Fall Time from VIHmin to VILmax 10pF < Cb < 400pF (2) 20+0.1Cb (1)(2) 250 ns
tSP Spikes Suppressed by Input Filter 050 ns
IIInput Current for each I/O Pin 0.1VCC < VI < 0.9VCC -10 10 µA
CICapacitance for each I/O Pin 10 pF
fSCL SCL Clock Frequency fPER (3)>max(10fSCL, 250kHz) 0400 kHz
RPValue of Pull-up resistor
fSCL 100kHz
fSCL > 100kHz
tHD;STA Hold Time (repeated) START condition
fSCL 100kHz 4.0
µs
fSCL > 100kHz 0.6
tLOW Low Period of SCL Clock
fSCL 100kHz 4.7
µs
fSCL > 100kHz 1.3
tHIGH High Period of SCL Clock
fSCL 100kHz 4.0
µs
fSCL > 100kHz 0.6
tSU;STA
Set-up time for a repeated START
condition
fSCL 100kHz 4.7
µs
fSCL > 100kHz 0.6
VCC 0.4V–
3mA
----------------------------
100ns
Cb
---------------
300ns
Cb
---------------
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Notes: 1. Required only for fSCL > 100kHz.
2. Cb = Capacitance of one bus line in pF.
3. fPER = Peripheral clock frequency.
tHD;DAT Data hold time
fSCL 100kHz 03.45
µs
fSCL > 100kHz 00.9
tSU;DAT Data setup time
fSCL 100kHz 250
ns
fSCL > 100kHz 100
tSU;STO Setup time for STOP condition
fSCL 100kHz 4.0
µs
fSCL > 100kHz 0.6
tBUF
Bus free time between a STOP and
START condition
fSCL 100kHz 4.7
µs
fSCL > 100kHz 1.3
Symbol Parameter Condition Min. Typ. Max. Units
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 172
37. Typical Characteristics
37.1 ATxmega16A4U
37.1.1 Current consumption
37.1.1.1 Active mode supply current
Figure 37-1. Active supply current vs. frequency.
fSYS = 0 - 1MHz external clock, T = 25°C.
Figure 37-2. Active supply current vs. frequency.
fSYS = 1 - 32MHz external clock, T = 25°C.
3.3V
3.0V
2.7V
2.2V
1.8V
0
60
120
180
240
300
360
420
480
540
600
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency [MHz]
I
CC
[µA]
3.3V
3.0V
2.7V
0
2
4
6
8
10
12
0 4 8 121620242832
Frequency [MHz]
I
CC
[mA]
2.2V
1.8V
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 173
Figure 37-3. Active mode supply current vs. VCC.
fSYS = 32.768kHz internal oscillator.
Figure 37-4. Active mode supply current vs. VCC.
fSYS = 1MHz external clock.
105 °C
85 °C
25 °C
-40 °C
70
90
110
130
150
170
190
210
230
250
270
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
200
300
400
500
600
700
800
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 174
Figure 37-5. Active mode supply current vs. VCC.
fSYS = 2MHz internal oscillator.
Figure 37-6. Active mode supply current vs. VCC.
fSYS = 32MHz internal oscillator prescaled to 8MHz.
105 °C
85 °C
25 °C
-40 °C
400
600
800
1000
1200
1400
1600
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
1400
1900
2400
2900
3400
3900
4400
4900
5400
5900
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 175
Figure 37-7. Active mode supply current vs. VCC.
fSYS = 32MHz internal oscillator.
37.1.1.2 Idle mode supply current
Figure 37-8. Idle mode supply current vs. frequency.
fSYS = 0 - 1MHz external clock, T = 25°C.
105 °C
85 °C
25 °C
-40 °C
3400
3625
3850
4075
4300
4525
4750
4975
5200
5425
5650
2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6
I
CC
[uA]
V
CC
[V]
3.3V
3.0V
2.7V
2.2V
1.8V
0
20
40
60
80
100
120
140
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Frequency [MHz]
I
CC
[µA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 176
Figure 37-9. Idle mode supply current vs. frequency.
fSYS = 1 - 32MHz external clock, T = 25°C.
Figure 37-10. Idle mode supply current vs. VCC.
fSYS = 32.768kHz internal oscillator.
3.3V
3.0V
2.7V
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0 4 8 121620242832
Frequency [MHz]
I
CC
[mA]
2.2V
1.8V
105 °C
85 °C
25 °C
-40 °C
27
28
29
30
31
32
33
34
35
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 177
Figure 37-11. Idle mode supply current vs. VCC.
fSYS = 1MHz external clock.
Figure 37-12. Idle mode supply current vs. VCC.
fSYS = 2MHz internal oscillator.
105 °C
85 °C
25 °C
-40 °C
50
62
74
86
98
110
122
134
146
158
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
160
185
210
235
260
285
310
335
360
385
410
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 178
Figure 37-13. Idle mode supply current vs. VCC.
fSYS = 32MHz internal oscillator prescaled to 8MHz.
Figure 37-14. Idle mode current vs. VCC.
fSYS = 32MHz internal oscillator.
105 °C
85 °C
25 °C
-40 °C
600
800
1000
1200
1400
1600
1800
2000
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
3400
3625
3850
4075
4300
4525
4750
4975
5200
5425
5650
2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6
I
CC
[uA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 179
37.1.1.3 Power-down mode supply current
Figure 37-15. Power-down mode supply current vs. temperature.
All functions disabled.
Figure 37-16. Power-down mode supply current vs. VCC.
All functions disabled.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
-40 -25 -10 5 20 35 50 65 80 95 110
I
CC
[uA]
Temperature [°C]
105 °C
85 °C
25 °C
-40 °C
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
ICC [uA]
VCC [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 180
Figure 37-17. Power-down mode supply current vs. VCC.
Watchdog and sampled BOD enabled.
37.1.1.4 Power-save mode supply current
Figure 37-18. Power-save mode supply current vs.VCC.
Real Time Counter enabled and running from 1.024kHz output of 32.768kHz TOSC.
105 °C
85
°
C
25 °C
-40 °C
1.1
1.6
2.1
2.6
3.1
3.6
4.1
4.6
5.1
1.61.82.02.22.42.62.83.03.23.43.6
I
CC
[µA]
V
CC
[V]
Normal mode
Low-power mode
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
V
CC
[V]
I
CC
[µA]
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 181
37.1.1.5 Standby mode supply current
Figure 37-19. Standby supply current vs. VCC.
Standby, fSYS =1MHz.
Figure 37-20. Standby supply current vs. VCC.
25°C, running from different crystal oscillators.
105 °C
85 °C
25 °C
-40 °C
2.5
3.5
4.5
5.5
6.5
7.5
8.5
9.5
10.5
11.5
12.5
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
16MHz
12MHz
8MHz
2MHz
0.454MHz
160
200
240
280
320
360
400
440
480
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
CC
[V]
I
CC
[µA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 182
37.1.2 I/O Pin Characteristics
37.1.2.1 Pull-up
Figure 37-21. I/O pin pull-up resistor current vs. input voltage.
VCC = 1.8V.
Figure 37-22. I/O pin pull-up resistor current vs. input voltage.
VCC = 3.0V.
105 °C
85 °C
25 °C
- 40 °C
0
8
16
24
32
40
48
56
64
72
0.00.20.40.60.81.01.21.41.61.8
I [µA]
V
PIN
[V]
105 °C
85 °C
25 °C
-40 °C
0
15
30
45
60
75
90
105
120
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0
I [µA]
V
PIN
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 183
Figure 37-23. I/O pin pull-up resistor current vs. input voltage.
VCC = 3.3V.
37.1.2.2 Output Voltage vs. Sink/Source Current
Figure 37-24. I/O pin output voltage vs. source current.
VCC = 1.8V.
105 °C
85 °C
25 °C
-40 °C
0
15
30
45
60
75
90
105
120
135
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
I [µA]
V
PIN
[V]
105 °C
85 °C
25 °C-40 °C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
-10-9-8-7-6-5-4-3-2-1 0
V
PIN
[V]
I
PIN
[mA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 184
Figure 37-25. I/O pin output voltage vs. source current.
VCC = 3.0V.
Figure 37-26. I/O pin output voltage vs. source current.
VCC = 3.3V.
105 °C
85 °C
25 °C
-40 °C
0.0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
-32-28-24-20-16-12 -8 -4 0
V
PIN
[V]
I
PIN
[mA]
105 °C
85 °C
25 °C
-40 °C
0.0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
3.3
-32-28-24-20-16-12 -8 -4 0
V
PIN
[V]
I
PIN
[mA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 185
Figure 37-27. I/O pin output voltage vs. source current.
Figure 37-28. I/O pin output voltage vs. sink current.
VCC = 1.8V.
3.6V
3.3V
3.0V
2.7V
2.3V
1.8V
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-24 -21 -18 -15 -12 -9 -6 -3 0
I
PIN
[mA]
V
PIN
[V]
105
°
C
85 °C
25 °C
-40 °C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0246810121416
V
PIN
[V]
I
PIN
[mA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 186
Figure 37-29. I/O pin output voltage vs. sink current.
VCC = 3.0V.
Figure 37-30. I/O pin output voltage vs. sink current.
VCC = 3.3V.
Figure 37-31. I/O pin output voltage vs. sink current.
105 °C
85 °C
25 °C
-40 °C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
02468101214161820
V
PIN
[V]
I
PIN
[mA]
105 °C
85 °C
25 °C
-40 °C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 4 8 121620242832
V
PIN
[V]
I
PIN
[mA]
0
0.3
0.6
0.9
1.2
1.5
0 5 10 15 20 25 30
I
PIN
[mA]
V
PIN
[V]
1.8V
3.6V
3.3V
3.0V
2.7V
2.3V
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 187
37.1.2.3 Thresholds and Hysteresis
Figure 37-32. I/O pin input threshold voltage vs. VCC.
T = 25°C.
Figure 37-33. I/O pin input threshold voltage vs. VCC.
VIH I/O pin read as “1”.
VIL
VIH
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
Vcc [V]
Vthreshold [V]
105 °C
85 °C
25 °C
-40 °C
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.61.82.02.22.42.62.83.03.23.43.6
V
threshold
[V]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 188
Figure 37-34. I/O pin input threshold voltage vs. VCC.
VIL I/O pin read as “0”.
Figure 37-35. I/O pin input hysteresis vs. VCC.
105 °C
85 °C
25 °C
-40 °C
0.55
0.70
0.85
1.00
1.15
1.30
1.45
1.60
1.75
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
threshold
[V]
V
CC
[V]
105 °C
85 °C
25 °C -40 °C
0.08
0.11
0.14
0.17
0.20
0.23
0.26
0.29
0.32
1.61.82.02.22.42.62.83.03.23.43.6
V
threshold
[V]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 189
37.1.3 ADC Characteristics
Figure 37-36. INL error vs. external VREF.
T = 25
C, VCC = 3.6V, external reference.
Figure 37-37. INL error vs. sample rate.
T = 25
C, VCC = 3.6V, VREF = 3.0V external.
Single-ended Unsigned
Single-ended Signed
Differential Signed
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
V [V]
INL [LSB]
REF
Single-ended Unsigned
Single-ended Signed
Differential Mode
0.9
0.95
1
1.05
1.1
1.15
1.2
1.25
1.3
1.35
1.4
500 650 800 950 1100 1250 1400 1550 1700 1850 2000
ADC Sample Rate [kSPS]
INL [LSB]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 190
Figure 37-38. INL error vs. input code
Figure 37-39. DNL error vs. external VREF.
T = 25
C, VCC = 3.6V, external reference.
-2.0
-1.5
-1.0
-0.5
0
0.5
1.0
1.5
2.0
0 512 1024 1536 2048 2560 3072 3584 4096
ADC input code
INL [LSB]
Single-ended Unsigned
Single-ended Signed
Differential Mode
0.72
0.74
0.76
0.78
0.8
0.82
0.84
0.86
0.88
0.9
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
DNL [LSB]
V [V]
REF
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 191
Figure 37-40. DNL error vs. sample rate.
T = 25
C, VCC = 3.6V, VREF = 3.0V external.
Figure 37-41. DNL error vs. input code.
Single-ended Unsigned
Single-ended Signed
Differential Signed
0.79
0.8
0.81
0.82
0.83
0.84
0.85
0.86
0.87
0.88
0.89
0.9
500 650 800 950 1100 1250 1400 1550 1700 1850 2000
ADC Sample Rate [kSPS]
DNL [LSB]
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
0 512 1024 1536 2048 2560 3072 3584 4096
ADC Input Code
DNL [LSB]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 192
Figure 37-42. Gain error vs. VREF.
T = 25
C, VCC = 3.6V, ADC sampling speed = 500ksps.
Figure 37-43. Gain error vs. VCC.
T = 25
C, VREF = external 1.0V, ADC sampling speed = 500ksps.
Single-ended Unsigned
Single-ended Signed
Differential Mode
-4
-3
-2
-1
0
1
2
3
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
V
Gain Error [mV]
REF [V]
Single-ended Unsigned
Single-ended Signed
Differential Mode
-0.5
-0.2
0.1
0.4
0.7
1
1.3
1.6
1.9
2.2
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
VCC [V]
Gain Error [mV]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 193
Figure 37-44. Offset error vs. VREF.
T = 25
C, VCC = 3.6V, ADC sampling speed = 500ksps.
Figure 37-45. Gain error vs. temperature.
VCC = 3.0V, VREF = external 2.0V.
Differential Mode
-2
-1.9
-1.8
-1.7
-1.6
-1.5
-1.4
-1.3
-1.2
-1.1
-1
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
Offset Error [mV]
VREF
[V]
Single-ended unsigned mode
Single-ended signed mode
Diff erential mode
-4
-3
-2
-1
0
1
2
3
4
-45-35-25-15-5 5 152535455565758595105
Gain Error [mV]
Temp erature [ºC]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 194
Figure 37-46. Offset error vs. VCC.
T = 25
C, VREF = external 1.0V, ADC sampling speed = 500ksps.
Figure 37-47. Noise vs. VREF.
T = 25
C, VCC = 3.6V, ADC sampling speed = 500ksps.
Differential Signed
-1.2
-1.1
-1
-0.9
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
CC
[V]
Offset Error [mV]
Single-ended Unsigned
Single-ended Signed
Differential Signed
0.4
0.55
0.7
0.85
1
1.15
1.3
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
VREF [V]
Noise [mV RMS]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 195
Figure 37-48. Noise vs. VCC.
T = 25
C, VREF = external 1.0V, ADC sampling speed = 500ksps.
37.1.4 DAC Characteristics
Figure 37-49. DAC INL error vs. VREF.
VCC = 3.6V.
Single-ended Unsigned
Single-ended Signed
Differential Signed
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
VCC [V]
Noise [mV RMS]
25°C
105°C
85°C
-40°C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
INL [LSB]
Vref [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 196
Figure 37-50. DNL error vs. VREF.
VCC = 3.6V.
Figure 37-51. DAC noise vs. temperature.
VCC = 3.0V, VREF = 2.4V .
25ºC
105°C
85°C
-40°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
DNL[LSB]
Vref [V]
0.150
0.155
0.160
0.165
0.170
0.175
0.180
0.185
-45-35-25-15-5 5 152535455565758595105
Noise [mV RMS]
Temp erature [ºC]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 197
37.1.5 Analog Comparator Characteristics
Figure 37-52. Analog comparator hysteresis vs. VCC.
High-speed, small hysteresis.
Figure 37-53. Analog comparator hysteresis vs. VCC.
Low power, small hysteresis.
105 °C
85 °C
25
°C
-40 °
C
7
8
9
10
11
12
13
14
15
16
17
18
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
25
26
27
28
29
30
31
32
33
34
35
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 198
Figure 37-54. Analog comparator hysteresis vs. VCC.
High-speed mode, large hysteresis.
Figure 37-55. Analog comparator hysteresis vs. VCC.
Low power, large hysteresis.
105 °C
85 °C
25 °C
-40 °C
20
22
24
26
28
30
32
34
36
38
40
42
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
50
53
56
59
62
65
68
71
74
77
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 199
Figure 37-56. Analog comparator current source vs. calibration value.
Temperature = 25°C.
Figure 37-57. Analog comparator current source vs. calibration value.
VCC = 3.0V.
3.3 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
2.0
2.6
3.2
3.8
4.4
5.0
5.6
6.2
6.8
7.4
0 1 2 3 4 5 6 7 8 9 101112131415
I
CURRENTSOURCE
[µA]
CURRCALIBA[3..0]
105 °C
85 °C
25 °C
-40 °C
3
3.5
4
4.5
5
5.5
6
6.5
7
0 1 2 3 4 5 6 7 8 9 101112131415
I
CURRENTSOURCE
[uA]
CURRCALIBA[3..0]
V
CC
3.0V
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 200
Figure 37-58. Voltage scaler INL vs. SCALEFAC.
T = 25
C, VCC = 3.0V.
37.1.6 Internal 1.0V reference Characteristics
Figure 37-59. ADC/DAC Internal 1.0V reference vs. temperature.
25°C
-0.150
-0.125
-0.100
-0.075
-0.050
-0.025
0
0.025
0.050
0 10203040506070
SCALEFAC
INL [LSB]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
0.986
0.988
0.990
0.992
0.994
0.996
0.998
1.000
1.002
1.004
-40 -25 -10 5 20 35 50 65 80 95 110
Bandgap Voltage [V]
Temperature [°C]
Calibrated at T 85 C
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 201
37.1.7 BOD Characteristics
Figure 37-60. BOD thresholds vs. temperature.
BOD level = 1.6V.
Figure 37-61. BOD thresholds vs. temperature.
BOD level = 3.0V.
Rising Vcc
Falling Vcc
1.600
1.605
1.610
1.615
1.620
1.625
1.630
1.635
-40 -25 -10 5 20 35 50 65 80 95 110
V
BOT
[V]
Temperature [°C]
Rising Vcc
Falling Vcc
2.97
2.98
2.99
3.00
3.01
3.02
3.03
3.04
3.05
3.06
-40 -25 -10 5 20 35 50 65 80 95 110
V
BOT
[V]
Temperature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 202
37.1.8 External Reset Characteristics
Figure 37-62. Minimum Reset pin pulse width vs. VCC.
Figure 37-63. Reset pin pull-up resistor current vs. reset pin voltage.
VCC = 1.8V.
105 °C
85 °C
25 °C
-40 °C
80
85
90
95
100
105
110
115
120
125
130
1.61.82.02.22.42.62.83.03.23.43.6
t
RST
[ns]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
0
8
16
24
32
40
48
56
64
72
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
I
RESET
[uA]
V
RESET
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 203
Figure 37-64. Reset pin pull-up resistor current vs. reset pin voltage.
VCC = 3.0V.
Figure 37-65. Reset pin pull-up resistor current vs. reset pin voltage.
VCC = 3.3V.
105 °C
85 °C
25 °C
-40 °C
0
15
30
45
60
75
90
105
120
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0
I
RESET
[µA]
V
RESET
[V]
105 °C
85 °C
25 °C
-40 °C
0
20
40
60
80
100
120
140
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
I
RESET
[uA]
V
RESET
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 204
Figure 37-66. Reset pin input threshold voltage vs. VCC.
VIH - Reset pin read as “1”.
Figure 37-67. Reset pin input threshold voltage vs. VCC.
VIL - Reset pin read as “0”.
105 °C
85 °C
25 °C
-40 °C
1.00
1.15
1.30
1.45
1.60
1.75
1.90
2.05
2.20
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
threshold
[V]
V
CC
[V]
105 °C
85 °C
25 °C
-40
°
C
0.40
0.55
0.70
0.85
1.00
1.15
1.30
1.45
1.60
1.75
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
threshold
[V]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 205
37.1.9 Power-on Reset Characteristics
Figure 37-68. Power-on reset current consumption vs. VCC.
BOD level = 3.0V, enabled in continuous mode.
Figure 37-69. Power-on reset current consumption vs. VCC.
BOD level = 3.0V, enabled in sampled mode.
105 °C
85 °C
25 °C
-
40
°C
0
100
200
300
400
500
600
700
0.4 0.7 1.0 1.3 1.6 1.9 2.2 2.5 2.8
I
CC
[µA]
V
CC
[V]
105
°
°C
85
°
°C
25 °C
-40 °C
0
65
130
195
260
325
390
455
520
585
650
0.4 0.7 1 1.3 1.6 1.9 2.2 2.5 2.8
I
CC
[µA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 206
37.1.10 Oscillator Characteristics
37.1.10.1 Ultra Low-Power internal oscillator
Figure 37-70. Ultra Low-Power internal oscillator frequency vs. temperature.
37.1.10.2 32.768kHz Internal Oscillator
Figure 37-71. 32.768kHz internal oscillator frequency vs. temperature.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
29.6
30.0
30.4
30.8
31.2
31.6
32.0
32.4
32.8
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [kHz]
Temperature [°C]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
32.650
32.675
32.700
32.725
32.750
32.775
32.800
32.825
32.850
32.875
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [kHz]
Temperature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 207
Figure 37-72. 32.768kHz internal oscillator frequency vs. calibration value.
VCC = 3.0V, T = 25°C.
37.1.10.3 2MHz Internal Oscillator
Figure 37-73. 2MHz internal oscillator frequency vs. temperature.
DFLL disabled.
20
25
30
35
40
45
50
55
0 26 52 78 104 130 156 182 208 234 260
Frequency [kHz]
RC32KCAL[7..0]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
1.96
1.98
2.00
2.02
2.04
2.06
2.08
2.10
2.12
2.14
2.16
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [MHz]
Temperature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 208
Figure 37-74. 2MHz internal oscillator frequency vs. temperature.
DFLL enabled, from the 32.768kHz internal oscillator .
Figure 37-75. 2MHz internal oscillator CALA calibration step size.
VCC = 3V.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
1.9950
1.9965
1.9980
1.9995
2.0010
2.0025
2.0040
2.0055
2.0070
2.0085
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [MHz]
Temperature [°C]
105 °C
85 °C
25 °C
-40 °C
0.15 %
0.17 %
0.19 %
0.21 %
0.23 %
0.25 %
0.27 %
0.29 %
0.31 %
0 163248648096112128
Frequency Step size [%]
CALA
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 209
37.1.10.4 32MHz Internal Oscillator
Figure 37-76. 32MHz internal oscillator frequency vs. temperature.
DFLL disabled.
Figure 37-77. 32MHz internal oscillator frequency vs. temperature.
DFLL enabled, from the 32.768kHz internal oscillator.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
31.0
31.5
32.0
32.5
33.0
33.5
34.0
34.5
35.0
35.5
36.0
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [MHz]
Temperature [°C]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
31.920
31.945
31.970
31.995
32.020
32.045
32.070
32.095
32.120
32.145
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [MHz]
Temperature [°C]
1.6 V
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 210
Figure 37-78. 32MHz internal oscillator CALA calibration step size.
VCC = 3.0V.
Figure 37-79. 32MHz internal oscillator frequency vs. CALB calibration value.
VCC = 3.0V.
105 °C
85 °C
25 °C
-40 °C
0.10 %
0.14 %
0.18 %
0.22 %
0.26 %
0.30 %
0.34 %
0.38 %
0163248648096112128
Frequency Step size [%]
CALA
105°C
85°C
25°C
-40°C
25
30
35
40
45
50
55
60
65
70
75
0 8 16 24 32 40 48 56 64
Frequency [MHz]
CALB
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 211
37.1.10.5 32MHz internal oscillator calibrated to 48MHz
Figure 37-80. 48MHz internal oscillator frequency vs. temperature.
DFLL disabled.
Figure 37-81. 48MHz internal oscillator frequency vs. temperature.
DFLL enabled, from the 32.768kHz internal oscillator.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
46
47
48
49
50
51
52
53
54
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [MHz]
Temperature [°C]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
47.80
47.85
47.90
47.95
48.00
48.05
48.10
48.15
48.20
48.25
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [MHz]
Temperature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 212
Figure 37-82. 48MHz internal oscillator CALA calibration step size.
VCC = 3.0V.
37.1.11 Two-Wire Interface characteristics
Figure 37-83. SDA hold time vs. supply voltage.
105 °C
85 °C
25 °C
-40 °C
0.10 %
0.13 %
0.16 %
0.19 %
0.22 %
0.25 %
0.28 %
0.31 %
0.34 %
0 16 32 48 64 80 96 112 128
Frequency Step size [%]
CALA
V
CC
3.0 V
105°C
85°C
25°C
-40°C
260
265
270
275
280
285
290
295
300
2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
Holdtime [ns]
Vcc [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 213
37.1.12 PDI characteristics
Figure 37-84. Maximum PDI frequency vs. VCC.
105 °C
85 °C
25 °C
-40 °C
10
13
16
19
22
25
28
31
34
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
f
MAX
[MHz]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 214
37.2 ATxmega32A4U
37.2.1 Current consumption
37.2.1.1 Active mode supply current
Figure 37-85.Active supply current vs. frequency.
fSYS = 0 - 1MHz external clock, T = 25°C.
Figure 37-86.Active supply current vs. frequency.
fSYS = 1 - 32MHz external clock, T = 25°C.
3.3V
3.0V
2.7V
2.2V
1.8V
0
60
120
180
240
300
360
420
480
540
600
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency [MHz]
I
CC
[µA]
3.3V
3.0V
2.7V
0
2
4
6
8
10
12
0 4 8 121620242832
Frequency [MHz]
I
CC
[mA]
2.2V
1.8V
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 215
Figure 37-87.Active mode supply current vs. VCC.
fSYS = 32.768kHz internal oscillator.
Figure 37-88.Active mode supply current vs. VCC.
fSYS = 1MHz external clock.
105 °C
85 °C
25 °C
-40 °C
70
90
110
130
150
170
190
210
230
250
270
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
200
300
400
500
600
700
800
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 216
Figure 37-89.Active mode supply current vs. VCC.
fSYS = 2MHz internal oscillator.
Figure 37-90.Active mode supply current vs. VCC.
fSYS = 32MHz internal oscillator prescaled to 8MHz.
105 °C
85 °C
25 °C
-40 °C
400
600
800
1000
1200
1400
1600
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
1400
1900
2400
2900
3400
3900
4400
4900
5400
5900
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 217
Figure 37-91.Active mode supply current vs. VCC.
fSYS = 32MHz internal oscillator.
37.2.1.2 Idle mode supply current
Figure 37-92.Idle mode supply current vs. frequency.
fSYS = 0 - 1MHz external clock, T = 25°C.
105 °C
85 °C
25 °C
-40 °C
3400
3625
3850
4075
4300
4525
4750
4975
5200
5425
5650
2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6
I
CC
[uA]
V
CC
[V]
3.3V
3.0V
2.7V
2.2V
1.8V
0
20
40
60
80
100
120
140
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Frequency [MHz]
I
CC
[µA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 218
Figure 37-93.Idle mode supply current vs. frequency.
fSYS = 1 - 32MHz external clock, T = 25°C.
Figure 37-94. Idle mode supply current vs. VCC.
fSYS = 32.768kHz internal oscillator.
3.3V
3.0V
2.7V
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0 4 8 121620242832
Frequency [MHz]
I
CC
[mA]
2.2V
1.8V
105 °C
85 °C
25 °C
-40 °C
27
28
29
30
31
32
33
34
35
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 219
Figure 37-95. Idle mode supply current vs. VCC.
fSYS = 1MHz external clock.
Figure 37-96. Idle mode supply current vs. VCC.
fSYS = 2MHz internal oscillator.
105 °C
85 °C
25 °C
-40 °C
50
62
74
86
98
110
122
134
146
158
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
160
185
210
235
260
285
310
335
360
385
410
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 220
Figure 37-97. Idle mode supply current vs. VCC.
fSYS = 32MHz internal oscillator prescaled to 8MHz.
Figure 37-98. Idle mode current vs. VCC.
fSYS = 32MHz internal oscillator.
105 °C
85 °C
25 °C
-40 °C
600
800
1000
1200
1400
1600
1800
2000
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
3400
3625
3850
4075
4300
4525
4750
4975
5200
5425
5650
2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6
I
CC
[uA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 221
37.2.1.3 Power-down mode supply current
Figure 37-99. Power-down mode supply current vs. temperature.
All functions disabled.
Figure 37-100. Power-down mode supply current vs. VCC.
All functions disabled.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
-40 -25 -10 5 20 35 50 65 80 95 110
I
CC
[uA]
Temperature [°C]
105 °C
85 °C
25 °C
-40 °C
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
ICC [uA]
VCC [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 222
Figure 37-101. Power-down mode supply current vs. VCC.
Watchdog and sampled BOD enabled.
37.2.1.4 Power-save mode supply current
Figure 37-102. Power-save mode supply current vs.VCC.
Real Time Counter enabled and running from 1.024kHz output of 32.768kHz TOSC.
105 °C
85
°
C
25 °C
-40 °C
1.1
1.6
2.1
2.6
3.1
3.6
4.1
4.6
5.1
1.61.82.02.22.42.62.83.03.23.43.6
I
CC
[µA]
V
CC
[V]
Normal mode
Low-power mode
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
V
CC
[V]
I
CC
[µA]
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 223
37.2.1.5 Standby mode supply current
Figure 37-103. Standby supply current vs. VCC.
Standby, fSYS =1MHz.
Figure 37-104. Standby supply current vs. VCC.
25°C, running from different crystal oscillators.
105 °C
85 °C
25 °C
-40 °C
2.5
3.5
4.5
5.5
6.5
7.5
8.5
9.5
10.5
11.5
12.5
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
16MHz
12MHz
8MHz
2MHz
0.454MHz
160
200
240
280
320
360
400
440
480
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
CC
[V]
I
CC
[µA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 224
37.2.2 I/O Pin Characteristics
37.2.2.1 Pull-up
Figure 37-105. I/O pin pull-up resistor current vs. input voltage.
VCC = 1.8V.
Figure 37-106. I/O pin pull-up resistor current vs. input voltage.
VCC = 3.0V.
105 °C
85 °C
25 °C
- 40 °C
0
8
16
24
32
40
48
56
64
72
0.00.20.40.60.81.01.21.41.61.8
I [µA]
V
PIN
[V]
105 °C
85 °C
25 °C
-40 °C
0
15
30
45
60
75
90
105
120
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0
I [µA]
V
PIN
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 225
Figure 37-107. I/O pin pull-up resistor current vs. input voltage.
VCC = 3.3V.
37.2.2.2 Output Voltage vs. Sink/Source Current
Figure 37-108. I/O pin output voltage vs. source current.
VCC = 1.8V.
105 °C
85 °C
25 °C
-40 °C
0
15
30
45
60
75
90
105
120
135
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
I [µA]
V
PIN
[V]
105 °C
85 °C
25 °C-40 °C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
-10-9-8-7-6-5-4-3-2-1 0
V
PIN
[V]
I
PIN
[mA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 226
Figure 37-109. I/O pin output voltage vs. source current.
VCC = 3.0V.
Figure 37-110. I/O pin output voltage vs. source current.
VCC = 3.3V.
105 °C
85 °C
25 °C
-40 °C
0.0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
-32-28-24-20-16-12 -8 -4 0
V
PIN
[V]
I
PIN
[mA]
105 °C
85 °C
25 °C
-40 °C
0.0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
3.3
-32-28-24-20-16-12 -8 -4 0
V
PIN
[V]
I
PIN
[mA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 227
Figure 37-111. I/O pin output voltage vs. source current.
Figure 37-112. I/O pin output voltage vs. sink current.
VCC = 1.8V.
3.6V
3.3V
3.0V
2.7V
2.3V
1.8V
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-24 -21 -18 -15 -12 -9 -6 -3 0
I
PIN
[mA]
V
PIN
[V]
105
°
C
85 °C
25 °C
-40 °C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0246810121416
V
PIN
[V]
I
PIN
[mA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 228
Figure 37-113. I/O pin output voltage vs. sink current.
VCC = 3.0V.
Figure 37-114. I/O pin output voltage vs. sink current.
VCC = 3.3V.
Figure 37-115. I/O pin output voltage vs. sink current.
105 °C
85 °C
25 °C
-40 °C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
02468101214161820
V
PIN
[V]
I
PIN
[mA]
105 °C
85 °C
25 °C
-40 °C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 4 8 121620242832
V
PIN
[V]
I
PIN
[mA]
0
0.3
0.6
0.9
1.2
1.5
0 5 10 15 20 25 30
I
PIN
[mA]
V
PIN
[V]
1.8V
3.6V
3.3V
3.0V
2.7V
2.3V
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 229
37.2.2.3 Thresholds and Hysteresis
Figure 37-116. I/O pin input threshold voltage vs. VCC.
T = 25°C.
Figure 37-117. I/O pin input threshold voltage vs. VCC.
VIH I/O pin read as “1”.
VIL
VIH
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
Vcc [V]
Vthreshold [V]
105 °C
85 °C
25 °C
-40 °C
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.61.82.02.22.42.62.83.03.23.43.6
V
threshold
[V]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 230
Figure 37-118. I/O pin input threshold voltage vs. VCC.
VIL I/O pin read as “0”.
Figure 37-119. I/O pin input hysteresis vs. VCC.
105 °C
85 °C
25 °C
-40 °C
0.55
0.70
0.85
1.00
1.15
1.30
1.45
1.60
1.75
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
threshold
[V]
V
CC
[V]
105 °C
85 °C
25 °C -40 °C
0.08
0.11
0.14
0.17
0.20
0.23
0.26
0.29
0.32
1.61.82.02.22.42.62.83.03.23.43.6
V
threshold
[V]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 231
37.2.3 ADC Characteristics
Figure 37-120. INL error vs. external VREF.
T = 25
C, VCC = 3.6V, external reference.
Figure 37-121. INL error vs. sample rate.
T = 25
C, VCC = 3.6V, VREF = 3.0V external.
Single-ended Unsigned
Single-ended Signed
Differential Signed
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
V [V]
INL [LSB]
REF
Single-ended Unsigned
Single-ended Signed
Differential Mode
0.9
0.95
1
1.05
1.1
1.15
1.2
1.25
1.3
1.35
1.4
500 650 800 950 1100 1250 1400 1550 1700 1850 2000
ADC Sample Rate [kSPS]
INL [LSB]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 232
Figure 37-122. INL error vs. input code
Figure 37-123. DNL error vs. external VREF.
T = 25
C, VCC = 3.6V, external reference.
-2.0
-1.5
-1.0
-0.5
0
0.5
1.0
1.5
2.0
0 512 1024 1536 2048 2560 3072 3584 4096
ADC input code
INL [LSB]
Single-ended Unsigned
Single-ended Signed
Differential Mode
0.72
0.74
0.76
0.78
0.8
0.82
0.84
0.86
0.88
0.9
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
DNL [LSB]
V [V]
REF
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 233
Figure 37-124. DNL error vs. sample rate.
T = 25
C, VCC = 3.6V, VREF = 3.0V external.
Figure 37-125. DNL error vs. input code.
Single-ended Unsigned
Single-ended Signed
Differential Signed
0.79
0.8
0.81
0.82
0.83
0.84
0.85
0.86
0.87
0.88
0.89
0.9
500 650 800 950 1100 1250 1400 1550 1700 1850 2000
ADC Sample Rate [kSPS]
DNL [LSB]
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
0 512 1024 1536 2048 2560 3072 3584 4096
ADC Input Code
DNL [LSB]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 234
Figure 37-126. Gain error vs. VREF.
T = 25
C, VCC = 3.6V, ADC sampling speed = 500ksps.
Figure 37-127. Gain error vs. VCC.
T = 25
C, VREF = external 1.0V, ADC sampling speed = 500ksps.
Single-ended Unsigned
Single-ended Signed
Differential Mode
-4
-3
-2
-1
0
1
2
3
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
V
Gain Error [mV]
REF [V]
Single-ended Unsigned
Single-ended Signed
Differential Mode
-0.5
-0.2
0.1
0.4
0.7
1
1.3
1.6
1.9
2.2
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
VCC [V]
Gain Error [mV]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 235
Figure 37-128. Offset error vs. VREF.
T = 25
C, VCC = 3.6V, ADC sampling speed = 500ksps.
Figure 37-129. Gain error vs. temperature.
VCC = 3.0V, VREF = external 2.0V.
Differential Mode
-2
-1.9
-1.8
-1.7
-1.6
-1.5
-1.4
-1.3
-1.2
-1.1
-1
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
Offset Error [mV]
VREF
[V]
Single-ended unsigned mode
Single-ended signed mode
Differential mode
-4
-3
-2
-1
0
1
2
3
4
-45-35-25-15-5 5 152535455565758595105
Gain Error [mV]
Temp erature [ºC]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 236
Figure 37-130. Offset error vs. VCC.
T = 25
C, VREF = external 1.0V, ADC sampling speed = 500ksps.
Figure 37-131. Noise vs. VREF.
T = 25
C, VCC = 3.6V, ADC sampling speed = 500ksps.
Differential Signed
-1.2
-1.1
-1
-0.9
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
CC
[V]
Offset Error [mV]
Single-ended Unsigned
Single-ended Signed
Differential Signed
0.4
0.55
0.7
0.85
1
1.15
1.3
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
VREF [V]
Noise [mV RMS]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 237
Figure 37-132. Noise vs. VCC.
T = 25
C, VREF = external 1.0V, ADC sampling speed = 500ksps.
37.2.4 DAC Characteristics
Figure 37-133. DAC INL error vs. VREF.
VCC = 3.6V.
Single-ended Unsigned
Single-ended Signed
Differential Signed
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
VCC [V]
Noise [mV RMS]
25°C
105°C
85°C
-40°C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
INL [LSB]
Vref [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 238
Figure 37-134. DNL error vs. VREF.
VCC = 3.6V.
Figure 37-135. DAC noise vs. temperature.
VCC = 3.0V, VREF = 2.4V .
25ºC
105°C
85°C
-40°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
DNL[LSB]
Vref [V]
0.150
0.155
0.160
0.165
0.170
0.175
0.180
0.185
-45-35-25-15-5 5 152535455565758595105
Noise [mV RMS]
Temp erature [ºC]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 239
37.2.5 Analog Comparator Characteristics
Figure 37-136. Analog comparator hysteresis vs. VCC.
High-speed, small hysteresis.
Figure 37-137. Analog comparator hysteresis vs. VCC.
Low power, small hysteresis.
105 °C
85 °C
25
°C
-40 °
C
7
8
9
10
11
12
13
14
15
16
17
18
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
25
26
27
28
29
30
31
32
33
34
35
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 240
Figure 37-138. Analog comparator hysteresis vs. VCC.
High-speed mode, large hysteresis.
Figure 37-139. Analog comparator hysteresis vs. VCC.
Low power, large hysteresis.
105 °C
85 °C
25 °C
-40 °C
20
22
24
26
28
30
32
34
36
38
40
42
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
50
53
56
59
62
65
68
71
74
77
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 241
Figure 37-140. Analog comparator current source vs. calibration value.
Temperature = 25°C.
Figure 37-141. Analog comparator current source vs. calibration value.
VCC = 3.0V.
3.3 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
2.0
2.6
3.2
3.8
4.4
5.0
5.6
6.2
6.8
7.4
0 1 2 3 4 5 6 7 8 9 101112131415
I
CURRENTSOURCE
[µA]
CURRCALIBA[3..0]
105 °C
85 °C
25 °C
-40 °C
3
3.5
4
4.5
5
5.5
6
6.5
7
0 1 2 3 4 5 6 7 8 9 101112131415
I
CURRENTSOURCE
[uA]
CURRCALIBA[3..0]
V
CC
3.0V
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 242
Figure 37-142. Voltage scaler INL vs. SCALEFAC.
T = 25
C, VCC = 3.0V.
37.2.6 Internal 1.0V reference Characteristics
Figure 37-143. ADC/DAC Internal 1.0V reference vs. temperature.
25°C
-0.150
-0.125
-0.100
-0.075
-0.050
-0.025
0
0.025
0.050
0 10203040506070
SCALEFAC
INL [LSB]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
0.986
0.988
0.990
0.992
0.994
0.996
0.998
1.000
1.002
1.004
-40 -25 -10 5 20 35 50 65 80 95 110
Bandgap Voltage [V]
Temperature [°C]
Calibrated at T 85 C
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 243
37.2.7 BOD Characteristics
Figure 37-144. BOD thresholds vs. temperature.
BOD level = 1.6V.
Figure 37-145. BOD thresholds vs. temperature.
BOD level = 3.0V.
Rising Vcc
Falling Vcc
1.600
1.605
1.610
1.615
1.620
1.625
1.630
1.635
-40 -25 -10 5 20 35 50 65 80 95 110
V
BOT
[V]
Temperature [°C]
Rising Vcc
Falling Vcc
2.97
2.98
2.99
3.00
3.01
3.02
3.03
3.04
3.05
3.06
-40 -25 -10 5 20 35 50 65 80 95 110
V
BOT
[V]
Temperature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 244
37.2.8 External Reset Characteristics
Figure 37-146. Minimum Reset pin pulse width vs. VCC.
Figure 37-147. Reset pin pull-up resistor current vs. reset pin voltage.
VCC = 1.8V.
105 °C
85 °C
25 °C
-40 °C
80
85
90
95
100
105
110
115
120
125
130
1.61.82.02.22.42.62.83.03.23.43.6
t
RST
[ns]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
0
8
16
24
32
40
48
56
64
72
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
I
RESET
[uA]
V
RESET
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 245
Figure 37-148. Reset pin pull-up resistor current vs. reset pin voltage.
VCC = 3.0V.
Figure 37-149. Reset pin pull-up resistor current vs. reset pin voltage.
VCC = 3.3V.
105 °C
85 °C
25 °C
-40 °C
0
15
30
45
60
75
90
105
120
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0
I
RESET
[µA]
V
RESET
[V]
105 °C
85 °C
25 °C
-40 °C
0
20
40
60
80
100
120
140
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
I
RESET
[uA]
V
RESET
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 246
Figure 37-150. Reset pin input threshold voltage vs. VCC.
VIH - Reset pin read as “1”.
Figure 37-151. Reset pin input threshold voltage vs. VCC.
VIL - Reset pin read as “0”.
105 °C
85 °C
25 °C
-40 °C
1.00
1.15
1.30
1.45
1.60
1.75
1.90
2.05
2.20
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
threshold
[V]
V
CC
[V]
105 °C
85 °C
25 °C
-40
°
C
0.40
0.55
0.70
0.85
1.00
1.15
1.30
1.45
1.60
1.75
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
threshold
[V]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 247
37.2.9 Power-on Reset Characteristics
Figure 37-152. Power-on reset current consumption vs. VCC.
BOD level = 3.0V, enabled in continuous mode.
Figure 37-153. Power-on reset current consumption vs. VCC.
BOD level = 3.0V, enabled in sampled mode.
105 °C
85 °C
25 °C
-
40
°C
0
100
200
300
400
500
600
700
0.4 0.7 1.0 1.3 1.6 1.9 2.2 2.5 2.8
I
CC
[µA]
V
CC
[V]
105
°
°C
85
°
°C
25 °C
-40 °C
0
65
130
195
260
325
390
455
520
585
650
0.4 0.7 1 1.3 1.6 1.9 2.2 2.5 2.8
I
CC
[µA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 248
37.2.10 Oscillator Characteristics
37.2.10.1 Ultra Low-Power internal oscillator
Figure 37-154. Ultra Low-Power internal oscillator frequency vs. temperature.
37.2.10.2 32.768kHz Internal Oscillator
Figure 37-155. 32.768kHz internal oscillator frequency vs. temperature.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
29.6
30.0
30.4
30.8
31.2
31.6
32.0
32.4
32.8
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [kHz]
Temperature [°C]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
32.650
32.675
32.700
32.725
32.750
32.775
32.800
32.825
32.850
32.875
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [kHz]
Temperature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 249
Figure 37-156. 32.768kHz internal oscillator frequency vs. calibration value.
VCC = 3.0V, T = 25°C.
37.2.10.3 2MHz Internal Oscillator
Figure 37-157. 2MHz internal oscillator frequency vs. temperature.
DFLL disabled.
20
25
30
35
40
45
50
55
0 26 52 78 104 130 156 182 208 234 260
Frequency [kHz]
RC32KCAL[7..0]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
1.96
1.98
2.00
2.02
2.04
2.06
2.08
2.10
2.12
2.14
2.16
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [MHz]
Temperature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 250
Figure 37-158. 2MHz internal oscillator frequency vs. temperature.
DFLL enabled, from the 32.768kHz internal oscillator .
Figure 37-159. 2MHz internal oscillator CALA calibration step size.
VCC = 3V.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
1.9950
1.9965
1.9980
1.9995
2.0010
2.0025
2.0040
2.0055
2.0070
2.0085
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [MHz]
Temperature [°C]
105 °C
85 °C
25 °C
-40 °C
0.15 %
0.17 %
0.19 %
0.21 %
0.23 %
0.25 %
0.27 %
0.29 %
0.31 %
0 163248648096112128
Frequency Step size [%]
CALA
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 251
37.2.10.4 32MHz Internal Oscillator
Figure 37-160. 32MHz internal oscillator frequency vs. temperature.
DFLL disabled.
Figure 37-161. 32MHz internal oscillator frequency vs. temperature.
DFLL enabled, from the 32.768kHz internal oscillator.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
31.0
31.5
32.0
32.5
33.0
33.5
34.0
34.5
35.0
35.5
36.0
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [MHz]
Temperature [°C]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
31.920
31.945
31.970
31.995
32.020
32.045
32.070
32.095
32.120
32.145
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [MHz]
Temperature [°C]
1.6 V
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 252
Figure 37-162. 32MHz internal oscillator CALA calibration step size.
VCC = 3.0V.
Figure 37-163. 32MHz internal oscillator frequency vs. CALB calibration value.
VCC = 3.0V.
105 °C
85 °C
25 °C
-40 °C
0.10 %
0.14 %
0.18 %
0.22 %
0.26 %
0.30 %
0.34 %
0.38 %
0163248648096112128
Frequency Step size [%]
CALA
105°C
85°C
25°C
-40°C
25
30
35
40
45
50
55
60
65
70
75
0 8 16 24 32 40 48 56 64
Frequency [MHz]
CALB
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 253
37.2.10.5 32MHz internal oscillator calibrated to 48MHz
Figure 37-164. 48MHz internal oscillator frequency vs. temperature.
DFLL disabled.
Figure 37-165. 48MHz internal oscillator frequency vs. temperature.
DFLL enabled, from the 32.768kHz internal oscillator.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
46
47
48
49
50
51
52
53
54
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [MHz]
Temperature [°C]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
47.80
47.85
47.90
47.95
48.00
48.05
48.10
48.15
48.20
48.25
-40 -25 -10 5 20 35 50 65 80 95 110
Frequency [MHz]
Temperature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 254
Figure 37-166. 48MHz internal oscillator CALA calibration step size.
VCC = 3.0V.
37.2.11 Two-Wire Interface characteristics
Figure 37-167. SDA hold time vs. supply voltage.
105 °C
85 °C
25 °C
-40 °C
0.10 %
0.13 %
0.16 %
0.19 %
0.22 %
0.25 %
0.28 %
0.31 %
0.34 %
0 16 32 48 64 80 96 112 128
Frequency Step size [%]
CALA
105°C
85°C
25°C
-40°C
260
265
270
275
280
285
290
295
300
2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
Holdtime [ns]
Vcc [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 255
37.2.12 PDI characteristics
Figure 37-168. Maximum PDI frequency vs. VCC.
105 °C
85 °C
25 °C
-40 °C
10
13
16
19
22
25
28
31
34
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
f
MAX
[MHz]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 256
37.3 ATxmega64A4U
37.3.1 Current consumption
37.3.1.1 Active mode supply current
Figure 37-169. Active supply current vs. frequency.
fSYS = 0 - 1MHz external clock, T = 25°C.
Figure 37-170. Active supply current vs. frequency.
fSYS = 1 - 32MHz external clock, T = 25°C.
3.6V
3.0V
2.7V
2.2V
1.8V
1.6V
0
100
200
300
400
500
600
700
0 0.10.20.30.40.50.60.70.80.9 1
I
CC
[µA]
Frequency [MHz]
3.6V
3.0V
2.7V
1.8V
1.6V
0
2
4
6
8
10
12
0 4 8 121620242832
I
CC
[mA]
Frequency [MHz]
2.2V
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 257
Figure 37-171. Active mode supply current vs. VCC.
fSYS = 32.768kHz internal oscillator.
Figure 37-172. Active mode supply current vs. VCC.
fSYS = 1MHz external clock.
105°C
85°C
25°C
- 40°C
50
70
90
110
130
150
170
190
210
230
250
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
I
CC
[µA]
VCC [V]
105°C
85°C
25°C
- 40°C
180
230
280
330
380
430
480
530
580
630
680
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
I
CC
[µA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 258
Figure 37-173. Active mode supply current vs. VCC.
fSYS = 2MHz internal oscillator.
Figure 37-174. Active mode supply current vs. VCC.
fSYS = 32MHz internal oscillator prescaled to 8MHz.
105°C
85°C
25°C
- 40°C
400
500
600
700
800
900
1000
1100
1200
1300
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
I
CC
[µA]
VCC [V]
105°C
85°C
25°C
- 40°C
1.2
1.6
2.0
2.4
2.8
3.2
3.6
4.0
4.4
4.8
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
I
CC
[mA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 259
Figure 37-175. Active mode supply current vs. VCC.
fSYS = 32MHz internal oscillator.
37.3.1.2 Idle mode supply current
Figure 37-176. Idle mode supply current vs. frequency.
fSYS = 0 - 1MHz external clock, T = 25°C.
105°C
85°C
25°C
- 40°C
7.0
7.5
8.0
8.5
9.0
9.5
10.0
10.5
11.0
11.5
12.0
2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
I
CC
[mA]
VCC [V]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
0
15
30
45
60
75
90
105
120
135
150
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
ICC [µA]
Frequency [MHz]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 260
Figure 37-177. Idle mode supply current vs. frequency.
fSYS = 1 - 32MHz external clock, T = 25°C.
Figure 37-178. Idle mode supply current vs. VCC.
fSYS = 32.768kHz internal oscillator.
3.6 V
3.0 V
2.7 V
1.8 V
1.6 V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0 4 8 121620242832
ICC [mA]
F[MH]
2.2 V
105°C
85°C
25°C
- 40°C
28.00
28.75
29.50
30.25
31.00
31.75
32.50
33.25
34.00
34.75
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
I
CC
[µA]
V
CC
[V]
f
SYS
32.768kHz Internal Oscillator
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 261
Figure 37-179. Idle mode supply current vs. VCC.
fSYS = 1MHz external clock.
Figure 37-180. Idle mode supply current vs. VCC.
fSYS = 2MHz internal oscillator.
105°C
85°C
25°C
- 40°C
45
57
69
81
93
105
117
129
141
153
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
I
CC
[µA]
V
CC
[V]
105°C
85°C
25°C
- 40°C
150
175
200
225
250
275
300
325
350
375
400
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
I
CC
[µA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 262
Figure 37-181. Idle mode supply current vs. VCC.
fSYS = 32MHz internal oscillator prescaled to 8MHz.
Figure 37-182. Idle mode current vs. VCC.
fSYS = 32MHz internal oscillator.
105°C
85°C
25°C
- 40°C
650
800
950
1100
1250
1400
1550
1700
1850
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
I
CC
[µA]
V
CC
[V]
105°C
85°C
25°C
- 40°C
3.1
3.3
3.5
3.7
3.9
4.1
4.3
4.5
4.7
4.9
5.1
2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
I
CC
[mA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 263
37.3.1.3 Power-down mode supply current
Figure 37-183. Power-down mode supply current vs. temperature.
All functions disabled.
Figure 37-184. Power-down mode supply current vs. VCC.
All functions disabled.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
0.0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
-45 -30 -15 0 15 30 45 60 75 90 105
I
CC
[µA]
Temperature [°C]
105°C
85°C
25°C
- 40°C
0.0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
I
CC
[µA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 264
Figure 37-185. Power-down mode supply current vs. VCC.
Watchdog and sampled BOD enabled.
37.3.1.4 Power-save mode supply current
Figure 37-186. Power-save mode supply current vs.VCC.
Real Time Counter enabled and running from 1.024kHz output of 32.768kHz TOSC.
105°C
85°C
25°C
- 40°C
1.10
1.40
1.70
2.00
2.30
2.60
2.90
3.20
3.50
3.80
4.10
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
I
CC
[µA]
V
CC
[V]
Normal mode
Low-power mode
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
V
CC
[V]
I
CC
[µA]
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 265
37.3.1.5 Standby mode supply current
Figure 37-187. Standby supply current vs. VCC.
Standby, fSYS =1MHz.
Figure 37-188. Standby supply current vs. VCC.
25°C, running from different crystal oscillators.
105 °C
85 °C
25 °C
-40 °C
2.5
3.5
4.5
5.5
6.5
7.5
8.5
9.5
10.5
11.5
12.5
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
16MHz
12MHz
8MHz
2MHz
0.454MHz
160
200
240
280
320
360
400
440
480
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
CC [V]
ICC [µA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 266
37.3.2 I/O Pin Characteristics
37.3.2.1 Pull-up
Figure 37-189. I/O pin pull-up resistor current vs. input voltage.
VCC = 1.8V.
Figure 37-190. I/O pin pull-up resistor current vs. input voltage.
VCC = 3.0V.
105°C
85°C
25°C
- 40°C
0
10
20
30
40
50
60
70
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
I
PIN
[uA]
V
PIN
[V]
105°C
85°C
25°C
- 40°C
0
15
30
45
60
75
90
105
120
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0
I
PIN
[µA]
V
PIN
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 267
Figure 37-191. I/O pin pull-up resistor current vs. input voltage.
VCC = 3.3V.
37.3.2.2 Output Voltage vs. Sink/Source Current
Figure 37-192. I/O pin output voltage vs. source current.
VCC = 1.8V.
105°C
85°C
25°C
- 40°C
0
15
30
45
60
75
90
105
120
135
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
I
PIN
[µA]
V
PIN
[V]
105°C
85°C
25°C
- 40°C
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
-9 -8 -7 -6 -5 -4 -3 -2 -1 0
V
PIN
[V]
I
PIN
[mA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 268
Figure 37-193. I/O pin output voltage vs. source current.
VCC = 3.0V.
Figure 37-194. I/O pin output voltage vs. source current.
VCC = 3.3V.
105°C
85°C25°C
- 40°C
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
-30 -27 -24 -21 -18 -15 -12 -9 -6 -3 0
V
PIN
[V]
I
PIN
[mA]
105°C
85°C
25°C
- 40°C
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
-30 -27 -24 -21 -18 -15 -12 -9 -6 -3 0
V
PIN
[V]
I
PIN
[mA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 269
Figure 37-195. I/O pin output voltage vs. source current.
Figure 37-196. I/O pin output voltage vs. sink current.
VCC = 1.8V.
3.6 V
3.3 V
3.0 V
2.7 V
1.8 V
1.6 V
0.5
0.9
1.3
1.7
2.1
2.5
2.9
3.3
3.7
-24 -21 -18 -15 -12 -9 -6 -3 0
V
PIN
[V]
I
PIN
[mA]
- 40°C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
02468101214161820
V
PIN
[V]
I
PIN
[mA]
25°C
85°C
105°C
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 270
Figure 37-197. I/O pin output voltage vs. sink current.
VCC = 3.0V.
Figure 37-198. I/O pin output voltage vs. sink current.
VCC = 3.3V.
105°C
85°C
25°C
- 40°C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 3 6 9 12 15 18 21 24 27 30
V
PIN
[V]
I
PIN
[mA]
105°C
85°C
25°C
- 40°C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 3 6 9 12 15 18 21 24 27 30
V
PIN
[V]
I
PIN
[mA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 271
Figure 37-199. I/O pin output voltage vs. sink current.
37.3.2.3 Thresholds and Hysteresis
Figure 37-200. I/O pin input threshold voltage vs. VCC.
T = 25°C.
3.6 V
3.3 V
3.0 V
2.7 V
0.00
0.15
0.30
0.45
0.60
0.75
0.90
1.05
1.20
1.35
1.50
0 3 6 9 12 15 18 21 24 27 30
V
PIN
[V]
I
PIN
[mA]
1.6 V 1.8 V
VIL
VIH
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
Vcc [V]
Vthreshold [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 272
Figure 37-201. I/O pin input threshold voltage vs. VCC.
VIH I/O pin read as “1”.
Figure 37-202. I/O pin input threshold voltage vs. VCC.
VIL I/O pin read as “0”.
105 °C
85 °C
25 °C
-40 °C
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.61.82.02.22.42.62.83.03.23.43.6
V
threshold
[V]
V
CC
[V]
105 °C
85 °C
25 °C
-40 °C
0.55
0.70
0.85
1.00
1.15
1.30
1.45
1.60
1.75
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
threshold
[V]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 273
Figure 37-203. I/O pin input hysteresis vs. VCC.
37.3.3 ADC Characteristics
Figure 37-204. INL error vs. external VREF.
T = 25
C, VCC = 3.6V, external reference.
105 °C
85 °C
25 °C -40 °C
0.08
0.11
0.14
0.17
0.20
0.23
0.26
0.29
0.32
1.61.82.02.22.42.62.83.03.23.43.6
V
threshold
[V]
V
CC
[V]
Single-ended unsigned mode
Single-ended signed mode
Diff erential mode
0.0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
INL [LSB]
Vref [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 274
Figure 37-205. INL error vs. sample rate.
T = 25
C, VCC = 2.7V, VREF = 1.0V external.
Figure 37-206. INL error vs. input code
Single-ended signed mode
Single-ended signed mode
Diff erential mode
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
500 650 800 950 1100 1250 1400 1550 1700 1850 2000
INL [LSB]
ADC sample rate [kSps]
0 512 1024 1536 2048 2560 3072 3584 4096
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
-1.5
-2.0
INL [LSB]
ADC input code
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 275
Figure 37-207. DNL error vs. external VREF.
T = 25
C, VCC = 3.6V, external reference.
Figure 37-208. DNL error vs. sample rate.
T = 25
C, VCC = 2.7V, VREF = 1.0V external.
Single-ended unsigned mode
Single-ended signed mode
Diff erential mode
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
DNL [LSB]
Vref [V]
Single-ended unsigned mode
Single-ended signed mode
Diff erential mode
0.23
0.26
0.28
0.31
0.33
0.36
0.38
0.41
0.43
500 650 800 950 1100 1250 1400 1550 1700 1850 2000
DNL [LSB]
ADC sample rate [kSps]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 276
Figure 37-209. DNL error vs. input code.
Figure 37-210. Gain error vs. VREF.
T = 25
C, VCC = 3.6V, ADC sampling speed = 500ksps.
0 512 1024 1536 2048 2560 3072 3584 4096
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
DNL [LSB]
ADC input code
Single-ended unsigned mode
Single-ended signed mode
Diff erential mode
0
2
4
6
8
10
12
1.01.21.41.61.82.02.22.42.62.83.0
Gain Error [mV]
Vref [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 277
Figure 37-211. Gain error vs. VCC.
T = 25
C, VREF = external 1.0V, ADC sampling speed = 500ksps.
Figure 37-212. Offset error vs. VREF.
T = 25
C, VCC = 3.6V, ADC sampling speed = 500ksps.
Single-ended unsigned mode
Single-ended signed mode
Dif f erential mode
0
1
2
3
4
5
6
7
1.61.82.02.22.42.62.83.03.23.43.6
Gain Erro r [mV]
Vcc [V]
Differential mode
-1.5
-1.5
-1.4
-1.4
-1.3
-1.3
-1.2
-1.2
-1.1
-1.1
-1.0
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Offset Error [mV]
Vref [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 278
Figure 37-213. Gain error vs. temperature.
VCC = 2.7V, VREF = external 1.0V.
Figure 37-214. Offset error vs. VCC.
T = 25
C, VREF = external 1.0V, ADC sampling speed = 500ksps.
Single-ended unsigned mode
Single-ended signed mode
Dif f erential mode
0
1
2
3
4
5
6
7
8
-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85 95 105
Gain Error [mV]
Temp erature [oC]
Diff erential mode
-1.1
-1.0
-0.9
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Offset Error [mV]
Vcc [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 279
Figure 37-215. Noise vs. VREF.
T = 25
C, VCC = 3.6V, ADC sampling speed = 500ksps.
Figure 37-216. Noise vs. VCC.
T = 25
C, VREF = external 1.0V, ADC sampling speed = 500ksps.
Single-ended unsigend mode
Single-ended signed mode
Dif f erential mode
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Noise [mV RMS]
Vref [V]
Single-ended unsigned mode
Single-ended signed mode
Dif f erential mode
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
No ise [mV RMS]
Vcc [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 280
37.3.4 DAC Characteristics
Figure 37-217. DAC INL error vs. VREF.
VCC = 3.6V.
Figure 37-218. DNL error vs. VREF.
VCC = 3.6V.
105°C
85°C
25°C
- 40°C
0.0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
DACINL [LSB]
Vref [V]
105°C
85°C
25°C
- 40°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
DAC DNL [LSB]
Vref [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 281
Figure 37-219. DAC noise vs. temperature.
VCC = 2.7V, VREF = 1.0V .
37.3.5 Analog Comparator Characteristics
Figure 37-220. Analog comparator hysteresis vs. VCC.
High-speed, small hysteresis.
0.160
0.162
0.164
0.166
0.168
0.170
0.172
0.174
0.176
0.178
-45-35-25-15-5 5 152535455565758595105
Noise[mV RMS]
Temp erature [oC]
105°C
85°C
25°C
- 40°C
15
16
17
18
19
20
21
22
23
24
25
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 282
Figure 37-221. Analog comparator hysteresis vs. VCC.
Low power, small hysteresis.
Figure 37-222. Analog comparator hysteresis vs. VCC.
High-speed mode, large hysteresis.
105°C
85°C
25°C
- 40°C
20
22
24
26
28
30
32
34
36
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
105°C
85°C
25°C
- 40°C
27
29
31
33
35
37
39
41
43
45
47
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 283
Figure 37-223. Analog comparator hysteresis vs. VCC.
Low power, large hysteresis.
Figure 37-224. Analog comparator current source vs. calibration value.
Temperature = 25°C.
105°C
85°C
25°C
- 40°C
46
49
52
55
58
61
64
67
70
73
76
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
2
3
4
5
6
7
8
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
I
CURRENTSOURCE
[µA]
CURRCALIBA[3..0]
3.6V
3.0V
2.7V
2.2V
1.8V
1.6V
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 284
Figure 37-225. Analog comparator current source vs. calibration value.
VCC = 3.0V.
Figure 37-226. Voltage scaler INL vs. SCALEFAC.
T = 25
C, VCC = 3.0V.
105°C
85°C
25°C
- 40°C
3.6
4.0
4.4
4.8
5.2
5.6
6.0
6.4
6.8
7.2
0 1 2 3 4 5 6 7 8 9 101112131415
I
CURRENTSOURCE
[uA]
CURRCALIBA[3..0]
-0.15
-0.12
-0.09
-0.06
-0.03
0.00
0.03
0.06
0.09
0.12
0.15
0 8 16 24 32 40 48 56 64
INL [LSB]
SCALEFAC
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 285
37.3.6 Internal 1.0V reference Characteristics
Figure 37-227. ADC/DAC Internal 1.0V reference vs. temperature.
37.3.7 BOD Characteristics
Figure 37-228. BOD thresholds vs. temperature.
BOD level = 1.6V.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
0.992
0.994
0.996
0.998
1.000
1.002
1.004
-45 -30 -15 0 15 30 45 60 75 90 105
Bandgap Voltage [V]
Temperature [°C]
Rising Vcc
Falling Vcc
1.617
1.620
1.623
1.626
1.629
1.632
1.635
1.638
1.641
1.644
-45 -30 -15 0 15 30 45 60 75 90 105
V
BOT
[V]
Temperature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 286
Figure 37-229. BOD thresholds vs. temperature.
BOD level = 3.0V.
37.3.8 External Reset Characteristics
Figure 37-230. Minimum Reset pin pulse width vs. VCC.
Rising Vcc
Falling Vcc
3.00
3.01
3.02
3.03
3.04
3.05
3.06
3.07
3.08
-45 -30 -15 0 15 30 45 60 75 90 105
V
BOT
[V]
Temperature [°C]
105°C
85°C
25°C
- 40°C
85
90
95
100
105
110
115
120
125
130
135
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
t
RST
[ns]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 287
Figure 37-231. Reset pin pull-up resistor current vs. reset pin voltage.
VCC = 1.8V.
Figure 37-232. Reset pin pull-up resistor current vs. reset pin voltage.
VCC = 3.0V.
105°C
85°C
25°C
- 40°C
0
10
20
30
40
50
60
70
80
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
I
RESET
[µA]
V
RESET
[V]
105°C
85°C
25°C
- 40°C
0
15
30
45
60
75
90
105
120
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0
I
RESET
[µA]
V
RESET
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 288
Figure 37-233. Reset pin pull-up resistor current vs. reset pin voltage.
VCC = 3.3V.
Figure 37-234. Reset pin input threshold voltage vs. VCC.
VIH - Reset pin read as “1”.
105°C
85°C
25°C
- 40°C
0
15
30
45
60
75
90
105
120
135
150
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
I
RESET
[µA]
V
RESET
[V]
105°C
85°C
25°C
-
- 40°C
1.0
1.2
1.3
1.5
1.6
1.8
1.9
2.1
2.2
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
THRESHOLD
[V]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 289
Figure 37-235. Reset pin input threshold voltage vs. VCC.
VIL - Reset pin read as “0”.
37.3.9 Power-on Reset Characteristics
Figure 37-236. Power-on reset current consumption vs. VCC.
BOD level = 3.0V, enabled in continuous mode.
105°C
85°C
25°C
- 40°C
0.40
0.55
0.70
0.85
1.00
1.15
1.30
1.45
1.60
1.75
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
THRESHOLD
[V]
V
CC
[V]
105°C
85°C
25°C
- 40°C
0
50
100
150
200
250
300
0.4 0.7 1.0 1.3 1.6 1.9 2.2 2.5 2.8
ICC [µA]
VCC [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 290
Figure 37-237. Power-on reset current consumption vs. VCC.
BOD level = 3.0V, enabled in sampled mode.
37.3.10 Oscillator Characteristics
37.3.10.1 Ultra Low-Power internal oscillator
Figure 37-238. Ultra Low-Power internal oscillator frequency vs. temperature.
105°C
85°C
25°C
- 40°C
0
50
100
150
200
250
300
0.4 0.7 1.0 1.3 1.6 1.9 2.2 2.5 2.8
ICC [µA]
VCC [V]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
31.0
31.3
31.6
31.9
32.2
32.5
32.8
33.1
33.4
33.7
34.0
-45 -30 -15 0 15 30 45 60 75 90 105
Frequency [kHz]
Temperature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 291
37.3.10.2 32.768kHz Internal Oscillator
Figure 37-239. 32.768kHz internal oscillator frequency vs. temperature.
Figure 37-240. 32.768kHz internal oscillator frequency vs. calibration value.
VCC = 3.0V, T = 25°C.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
32.55
32.58
32.61
32.64
32.67
32.70
32.73
32.76
32.79
32.82
32.85
-45 -30 -15 0 15 30 45 60 75 90 105
Frequency [kHz]
Temperature [°C]
23
26
29
32
35
38
41
44
47
50
53
0 30 60 90 120 150 180 210 240 270
Frequency [kHz]
RC32KCAL[7..0]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 292
37.3.10.3 2MHz Internal Oscillator
Figure 37-241. 2MHz internal oscillator frequency vs. temperature.
DFLL disabled.
Figure 37-242. 2MHz internal oscillator frequency vs. temperature.
DFLL enabled, from the 32.768kHz internal oscillator .
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
1.94
1.96
1.98
2.00
2.02
2.04
2.06
2.08
2.10
2.12
-45 -30 -15 0 15 30 45 60 75 90 105
Frequency [MHz]
Temperature [°C]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
1.988
1.990
1.992
1.994
1.996
1.998
2.000
2.002
2.004
2.006
2.008
2.010
-45 -30 -15 0 15 30 45 60 75 90 105
Frequency [MHz]
Temperature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 293
Figure 37-243. 2MHz internal oscillator CALA calibration step size.
VCC = 3V.
37.3.10.4 32MHz Internal Oscillator
Figure 37-244. 32MHz internal oscillator frequency vs. temperature.
DFLL disabled.
105°C
85°C
25°C
- 40°C
0.12 %
0.14 %
0.16 %
0.18 %
0.20 %
0.22 %
0.24 %
0.26 %
0.28 %
0 163248648096112128
Frequency Step size [%]
CALA
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
31.0
31.5
32.0
32.5
33.0
33.5
34.0
34.5
35.0
35.5
-45 -30 -15 0 15 30 45 60 75 90 105
Frequency [MHz]
Temperature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 294
Figure 37-245. 32MHz internal oscillator frequency vs. temperature.
DFLL enabled, from the 32.768kHz internal oscillator.
Figure 37-246. 32MHz internal oscillator CALA calibration step size.
VCC = 3.0V.
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V 1.6 V
31.80
31.84
31.88
31.92
31.96
32.00
32.04
32.08
32.12
-45 -30 -15 0 15 30 45 60 75 90 105
Frequency [MHz]
Temperature [°C]
105°C
85°C
25°C
- 40°C
0.10 %
0.13 %
0.16 %
0.19 %
0.22 %
0.25 %
0.28 %
0.31 %
0.34 %
0 15 30 45 60 75 90 105 120 135
Frequency Step size[%]
CALA
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 295
Figure 37-247. 32MHz internal oscillator CALB calibration step size.
VCC = 3.0V
37.3.10.5 32MHz internal oscillator calibrated to 48MHz
Figure 37-248. 48MHz internal oscillator frequency vs. temperature.
DFLL disabled.
105°C
85°C
25°C
- 40°C
0.80 %
1.00 %
1.20 %
1.40 %
1.60 %
1.80 %
2.00 %
2.20 %
2.40 %
2.60 %
2.80 %
0 8 16 24 32 40 48 56 64
Frequency Step size [%]
CALB
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
46.2
47.0
47.8
48.6
49.4
50.2
51.0
51.8
52.6
53.4
-45 -30 -15 0 15 30 45 60 75 90 105
Frequency[MHz]
Temperature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 296
Figure 37-249. 48MHz internal oscillator frequency vs. temperature.
DFLL enabled, from the 32.768kHz internal oscillator.
Figure 37-250. 48MHz internal oscillator CALA calibration step size.
VCC = 3.0V
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
47.70
47.75
47.80
47.85
47.90
47.95
48.00
48.05
48.10
48.15
-45 -30 -15 0 15 30 45 60 75 90 105
Frequency[MHz]
Temperature [°C]
105°C
85°C
25°C
- 40°C
0.10 %
0.12 %
0.14 %
0.16 %
0.18 %
0.20 %
0.22 %
0.24 %
0.26 %
0.28 %
0.30 %
0 16 32 48 64 80 96 112 128
Frequency Step size [%]
CALA
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 297
37.3.11 Two-Wire Interface characteristics
Figure 37-251. SDA hold time vs. supply voltage.
37.3.12 PDI characteristics
Figure 37-252. Maximum PDI frequency vs. VCC.
105°C
85°C
25°C
-40°C
260
265
270
275
280
285
290
295
300
2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
Holdtime [ns]
Vcc [V]
105°C
85°C
25°C
-
- 40°C
10
12
14
16
18
20
22
24
26
28
30
1.61.82.02.22.42.62.83.03.23.43.6
Maximum Frequency [MHz]
VCC [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 298
37.4 ATxmega128A4U
37.4.1 Current consumption
37.4.1.1 Active mode supply current
Figure 37-253. Active supply current vs. frequency.
fSYS = 0 - 1MHz external clock, T = 25°C.
Figure 37-254. Active supply current vs. frequency.
fSYS = 1 - 32MHz external clock, T = 25°C.
3.6V
3.0V
2.7V
2.2V
1.8V
1.6V
0
100
200
300
400
500
600
700
800
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency [MHz]
Icc [µA]
3.6V
3.0V
2.7V
0
1.5
3.0
4.5
6.0
7.5
9.0
10.5
12.0
13.5
0 4 8 121620242832
Frequency [MHz]
Icc [mA]
2.2V
1.8V
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 299
Figure 37-255. Active mode supply current vs. VCC.
fSYS = 32.768kHz internal oscillator
Figure 37-256. Active mode supply current vs. VCC.
fSYS = 1MHz external clock.
105 °C
85 °C
25 °C
- 4 0 ° C
0
30
60
90
120
150
180
210
240
270
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
IccVcc [uA]
VCC [V]
105 °C
85 °C
25 °C
-40 °C
0
100
200
300
400
500
600
700
800
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Icc [uA]
Vcc [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 300
Figure 37-257. Active mode supply current vs. VCC.
fSYS = 2MHz internal oscillator
Figure 37-258. Active mode supply current vs. VCC.
fSYS = 32MHz internal oscillator prescaled to 8MHz.
105 °C
85 °C
25 °C
-40 °C
0
175
350
525
700
875
1050
1225
1400
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
Icc [uA]
Vcc [V]
105 °C
85 °C
25 °C
-40 °C
1000
1600
2200
2800
3400
4000
4600
5200
5800
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Icc [uA]
VCC [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 301
Figure 37-259. Active mode supply current vs. VCC.
fSYS = 32MHz internal oscillator.
37.4.1.2 Idle mode supply current
Figure 37-260. Idle mode supply current vs. frequency.
fSYS = 0 - 1MHz external clock, T = 25°C
105 °C
85 °C
25 °C
-40 °C
7.0
7.8
8.6
9.4
10.2
11.0
11.8
12.6
13.4
2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
Icc [mA]
VCC [V]
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
0
20
40
60
80
100
120
140
160
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency [MHz]
Icc [µA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 302
Figure 37-261. Idle mode supply current vs. frequency.
fSYS = 1 - 32MHz external clock, T = 25°C
Figure 37-262. Idle mode supply current vs. VCC.
fSYS = 32.768kHz internal oscillator.
3.6V
3.0V
2.7V
0
0.6
1.2
1.8
2.4
3.0
3.6
4.2
4.8
5.4
0 4 8 121620242832
Frenquecy [MHz]
Icc [mA]
2.2V
1.8V
105 °C
85 °C
25 °C
-40 °C
27
28
29
30
31
32
33
34
35
36
37
38
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Icc [uA]
Vcc [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 303
Figure 37-263. Idle mode supply current vs. VCC.
fSYS = 1MHz external clock
Figure 37-264. Idle mode supply current vs. VCC.
fSYS = 2MHz internal oscillator
105 °C
85 °C
25 °C
-40 °C
50
60
70
80
90
100
110
120
130
140
150
160
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Icc[uA]
VCC [V]
105 °C
85
°C
25
°
C
-
40 °C
90
110
130
150
170
190
210
230
250
270
290
310
330
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Icc [uA]
Vcc [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 304
Figure 37-265. Idle mode supply current vs. VCC.
fSYS = 32MHz internal oscillator prescaled to 8MHz
Figure 37-266. Idle mode current vs. VCC.
fSYS = 32MHz internal oscillator
105 °C
85 °C
25
°C
-40 °C
600
800
1000
1200
1400
1600
1800
2000
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Icc [uA]
Vcc [V]
105 °C
85 °C
25 °C
-40 °C
3000
3250
3500
3750
4000
4250
4500
4750
5000
2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
Icc [uA]
Vcc [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 305
37.4.1.3 Power-down mode supply current
Figure 37-267. Power-down mode supply current vs. temperature.
All functions disabled
Figure 37-268. Power-down mode supply current vs. VCC.
All functions disabled
3.6 V
3.0 V
2.7 V
2.2 V
1.8 V
1.6 V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
-45-35-25-15-5 5 152535455565758595105
Icc [uA]
Temp erature [°C]
105 °C
85 °C
25 °C
-40 °C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Icc [uA]
Vcc [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 306
Figure 37-269. Power-down mode supply current vs. VCC.
Watchdog and sampled BOD enabled
37.4.1.4 Power-save mode supply current
Figure 37-270. Power-save mode supply current vs.VCC.
Real Time Counter enabled and running from 1.024kHz output of 32.768kHz TOSC.
105
°
C
85 °C
25 °C
-40 °C
0.8
1.3
1.8
2.3
2.8
3.3
3.8
4.3
4.8
5.3
5.8
6.3
6.8
7.3
1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Icc [uA]
Vcc [V]
Normal mode
Low-power mode
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
V
CC
[V]
I
CC
[µA]
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 307
37.4.1.5 Standby mode supply current
Figure 37-271. Standby supply current vs. VCC.
Standby, fSYS =1MHz
Figure 37-272. Standby supply current vs. VCC.
T = 25°C, running from different crystal oscillators
105 °C
85 °C
25 °C
-40 °C
2.5
3.5
4.5
5.5
6.5
7.5
8.5
9.5
10.5
11.5
12.5
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
I
CC
[uA]
V
CC
[V]
16MHz
12MHz
8MHz
2MHz
0.454MHz
160
200
240
280
320
360
400
440
480
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
CC
[V]
I
CC
[µA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 308
37.4.2 I/O Pin Characteristics
37.4.2.1 Pull-up
Figure 37-273. I/O pin pull-up resistor current vs. input voltage.
VCC = 1.8V
Figure 37-274. I/O pin pull-up resistor current vs. input voltage.
VCC = 3.0V
105 °C
85 °C
25 °C
-40 °C
0
8
16
24
32
40
48
56
64
72
0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7
I [uA]
Vpin [V]
105 °C
85 °C
25 °C
-40 °C
0
15
30
45
60
75
90
105
120
0.1 0.4 0.7 1.0 1.3 1.6 1.9 2.2 2.5 2.8 3.1
I [uA]
Vpin [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 309
Figure 37-275. I/O pin pull-up resistor current vs. input voltage.
VCC = 3.3V.
37.4.2.2 Output Voltage vs. Sink/Source Current
Figure 37-276. I/O pin output voltage vs. source current.
VCC = 1.8V
105 °C
85 °C
25 °C
-40 °C
0
15
30
45
60
75
90
105
120
135
0.1 0.4 0.7 1.0 1.3 1.6 1.9 2.2 2.5 2.8 3.1 3.4
I [uA]
Vpin [V]
105 °C
85 °C
25 °C
-40 °C
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
-10-9-8-7-6-5-4-3-2-1 0
Vpin [V]
Ipin [mA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 310
Figure 37-277. I/O pin output voltage vs. source current.
VCC = 3.0V
Figure 37-278. I/O pin output voltage vs. source current.
VCC = 3.3V
105 °C
85 °C
25 °C
-40 °C
0.50
0.85
1.20
1.55
1.90
2.25
2.60
2.95
3.30
-30-27-24-21-18-15-12 -9 -6 -3 0
Vpin [V]
Ipin [mA]
105 °C
85 °C
25 °C
-40 °C
0.5
0.8
1.1
1.4
1.7
2.0
2.3
2.6
2.9
3.2
3.5
-30 -27 -24 -21 -18 -15 -12 -9 -6 -3 0
Vpin [V]
Ipin [mA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 311
Figure 37-279. I/O pin output voltage vs. source current
Figure 37-280. I/O pin output voltage vs. sink current.
VCC = 1.8V
3.6 V
3.3 V
3.0 V
2.7 V
1.8 V
1.6 V
0.50
0.85
1.20
1.55
1.90
2.25
2.60
2.95
3.30
3.65
-24 -21 -18 -15 -12 -9 -6 -3 0
Vpin [V]
Ipin [mA]
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 2 4 6 8 10 12 14 16 18 20
Vpin [V]
Ipin [mA]
-40 °C
25 °C
105 °C 85 °C
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 312
Figure 37-281. I/O pin output voltage vs. sink current.
VCC = 3.0V
Figure 37-282. I/O pin output voltage vs. sink current.
VCC = 3.3V
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
036912151821242730
Vpin [V]
Ipin [mA]
-40 °C
25 °C
85 °C
105 °C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
036912151821242730
Vpin [V]
Ipin [mA]
-40 °C
25 °C
85 °C
105 °C
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 313
Figure 37-283. I/O pin output voltage vs. sink current
37.4.2.3 Thresholds and Hysteresis
Figure 37-284. I/O pin input threshold voltage vs. VCC.
T = 25°C
3.6 V
3.3 V
3.0 V
2.7 V
0.00
0.15
0.30
0.45
0.60
0.75
0.90
1.05
1.20
1.35
1.50
036912151821242730
Vpin [V]
Ipin [mA]
1.6 V
1.8 V
VIL
VIH
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
Vcc [V]
Vthreshold [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 314
Figure 37-285. I/O pin input threshold voltage vs. VCC.
VIH I/O pin read as “1”
Figure 37-286. I/O pin input threshold voltage vs. VCC.
VIL I/O pin read as “0”
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vthreshold [V]
Vcc [V]
105 °C
85 °C
25 °C
-40 °C
0.40
0.55
0.70
0.85
1.00
1.15
1.30
1.45
1.60
1.75
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vthreshold [V]
Vcc [V]
105 °C
85 °C
-40 °C
25 °C
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 315
Figure 37-287. I/O pin input hysteresis vs. VCC
37.4.3 ADC Characteristics
Figure 37-288. INL error vs. external VREF
T = 25
C, VCC = 3.6V, external reference
0.17
0.19
0.21
0.23
0.25
0.27
0.29
0.31
0.33
0.35
0.37
0.39
0.41
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vthreshold [V]
Vcc [V]
25 °C
85 °C
105 °C
-40 °C
Single-ended Unsigned
Single-ended Signed
Differential Signed
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
V [V]
INL [LSB]
REF
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 316
Figure 37-289. INL error vs. sample rate
T = 25
C, VCC = 3.6V, VREF = 3.0V external
Figure 37-290. INL error vs. input code
Single-ended Unsigned
Single-ended Signed
Differential Mode
0.9
0.95
1
1.05
1.1
1.15
1.2
1.25
1.3
1.35
1.4
500 650 800 950 1100 1250 1400 1550 1700 1850 2000
ADC Sample Rate [kSPS]
INL [LSB]
-2.0
-1.5
-1.0
-0.5
0
0.5
1.0
1.5
2.0
0 512 1024 1536 2048 2560 3072 3584 4096
ADC input code
INL [LSB]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 317
Figure 37-291. DNL error vs. external VREF
T = 25
C, VCC = 3.6V, external reference
Figure 37-292. DNL error vs. sample rate
T = 25
C, VCC = 3.6V, VREF = 3.0V external
Single-ended Unsigned
Single-ended Signed
Differential Mode
0.72
0.74
0.76
0.78
0.8
0.82
0.84
0.86
0.88
0.9
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
DNL [LSB]
V [V]
REF
Single-ended Unsigned
Single-ended Signed
Differential Signed
0.79
0.8
0.81
0.82
0.83
0.84
0.85
0.86
0.87
0.88
0.89
0.9
500 650 800 950 1100 1250 1400 1550 1700 1850 2000
ADC Sample Rate [kSPS]
DNL [LSB]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 318
Figure 37-293. DNL error vs. input code
Figure 37-294. Gain error vs. VREF
T = 25
C, VCC = 3.6V, ADC sampling speed = 500ksps
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
0 512 1024 1536 2048 2560 3072 3584 4096
ADC Input Code
DNL [LSB]
Single-ended Unsigned
Single-ended Signed
Differential Mode
-4
-3
-2
-1
0
1
2
3
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
V
Gain Error [mV]
REF [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 319
Figure 37-295. Gain error vs. VCC
T = 25
C, VREF = external 1.0V, ADC sampling speed = 500ksps
Figure 37-296. Offset error vs. VREF
T = 25
C, VCC = 3.6V, ADC sampling speed = 500ksps
Single-ended Unsigned
Single-ended Signed
Differential Mode
-0.5
-0.2
0.1
0.4
0.7
1
1.3
1.6
1.9
2.2
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
VCC [V]
Gain Error [mV]
Differential Mode
-2
-1.9
-1.8
-1.7
-1.6
-1.5
-1.4
-1.3
-1.2
-1.1
-1
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
Offset Error [mV]
VREF
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 320
Figure 37-297. Gain error vs. temperature
VCC = 3.0V, VREF = external 2.0V
Figure 37-298. Offset error vs. VCC
T = 25
C, VREF = external 1.0V, ADC sampling speed = 500ksps
Single-ended Unsigned
Single-ended Signed
Differential Signed
-4
-3
-2
-1
0
1
2
3
-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85
Temperature [ºC]
Gain Error [mV]
Differential Signed
-1.2
-1.1
-1
-0.9
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
V
CC
[V]
Offset Error [mV]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 321
Figure 37-299. Noise vs. VREF
T = 25
C, VCC = 3.6V, ADC sampling speed = 500ksps
Figure 37-300. Noise vs. VCC
T = 25
C, VREF = external 1.0V, ADC sampling speed = 500ksps
Single-ended Unsigned
Single-ended Signed
Differential Signed
0.4
0.55
0.7
0.85
1
1.15
1.3
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
VREF [V]
Noise [mV RMS]
Single-ended Unsigned
Single-ended Signed
Differential Signed
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
VCC [V]
Noise [mV RMS]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 322
37.4.4 DAC Characteristics
Figure 37-301. DAC INL error vs. VREF
VCC = 3.6V
Figure 37-302. DNL error vs. VREF.
T = 25
C, VCC = 3.6V.
25°C
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
V
REF
[V]
INL [LSB]
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
25ºC
0.6
0.65
0.7
0.75
0.8
0.85
0.9
1.6 1.8 2 2.2 2.4 2.6 2.8 3
DNL [LSB]
V [V]
REF
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 323
Figure 37-303. DAC noise vs. temperature
VCC = 3.0V, VREF = 2.4V
37.4.5 Analog Comparator Characteristics
Figure 37-304. Analog comparator hysteresis vs. VCC.
High-speed, small hysteresis
0.150
0.155
0.160
0.165
0.170
0.175
0.180
0.185
-45-35-25-15-5 5 152535455565758595105
Noise [mV RMS]
Temp erature [ºC]
-40°
25°C
85°C
105°
4
5
6
7
8
9
10
11
12
13
14
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
C
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 324
Figure 37-305. Analog comparator hysteresis vs. VCC.
Low power, small hysteresis
Figure 37-306. Analog comparator hysteresis vs. VCC.
High-speed mode, large hysteresis
-40°C
25°C
85°C
105°C
12
14
16
18
20
22
24
26
28
30
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
-40°C
25°C
85°C
105°C
14
16
18
20
22
24
26
28
30
32
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
VHYST [mV]
VCC [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 325
Figure 37-307. Analog comparator hysteresis vs. VCC.
Low power, large hysteresis
Figure 37-308. Analog comparator current source vs. calibration value.
Temperature = 25°C
-40°C
25°C
85°C
105°C
32
36
40
44
48
52
56
60
64
68
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
HYST
[mV]
V
CC
[V]
3.6V
3.0V
2.2V
1.8V
2
2.5
3
3.5
4
4.5
5
5.5
6
6.5
7
7.5
8
0123456789101112131415
CURRCALIBA[3..0]
I
CURRENTSOURCE
[µA]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 326
Figure 37-309. Analog comparator current source vs. calibration value.
VCC = 3.0V.
Figure 37-310. Voltage scaler INL vs. SCALEFAC.
T = 25
C, VCC = 3.0V.
85°C
25°C
-40°C
3
3.5
4
4.5
5
5.5
6
6.5
7
0123456789101112131415
CURRCALIBA[3..0]
I
CURRENTSOURCE
[µA]
25°C
-0.150
-0.125
-0.100
-0.075
-0.050
-0.025
0
0.025
0.050
0 10203040506070
SCALEFAC
INL [LSB]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 327
37.4.6 Internal 1.0V reference Characteristics
Figure 37-311. ADC/DAC Internal 1.0V reference vs. temperature
37.4.7 BOD Characteristics
Figure 37-312. BOD thresholds vs. temperature.
BOD level = 1.6V
3.6V
3.0V
2.7V
1.8V
1.6V
0.9988
0.9992
0.9996
1.0000
1.0004
1.0008
1.0012
1.0016
1.0020
1.0024
-40-30-20-100 102030405060708090100
Ban dg ap Vo ltage [V]
Temp erature [°C]
Rising Vcc
Falling Vcc
1.572
1.575
1.578
1.581
1.584
1.587
1.590
1.593
1.596
-45-35-25-15-5 5 152535455565758595105
Vbo t [V]
Temp erature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 328
Figure 37-313. BOD thresholds vs. temperature.
BOD level = 3.0V
37.4.8 External Reset Characteristics
Figure 37-314. Minimum Reset pin pulse width vs. VCC
Rising Vcc
Falling Vcc
2.94
2.95
2.96
2.97
2.98
2.99
3.00
3.01
3.02
3.03
-45-35-25-15-5 5 152535455565758595105
Vbo t [V]
Temp erature [°C]
105 °C
85 °C
25 °C
-40 °C
80
85
90
95
100
105
110
115
120
125
130
135
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Trst [ns]
Vcc [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 329
Figure 37-315. Reset pin pull-up resistor current vs. reset pin voltage
VCC = 1.8V
Figure 37-316. Reset pin pull-up resistor current vs. reset pin voltage
VCC = 3.0V
105 °C
85 °C
25 °C
-40 °C
0
8
16
24
32
40
48
56
64
72
80
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Ireset [uA]
Vreset [V]
105 °C
85 °C
25 °C
-40 °C
0
15
30
45
60
75
90
105
120
135
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0
Ireset [uA]
Vreset [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 330
Figure 37-317. Reset pin pull-up resistor current vs. reset pin voltage
VCC = 3.3V
Figure 37-318. Reset pin input threshold voltage vs. VCC
VIH - Reset pin read as “1”
105 °C
85 °C
25 °C
-40 °C
0
15
30
45
60
75
90
105
120
135
150
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
Ireset [uA]
Vreset [V]
105 °C
85 °C
25 °C
-40 °C
1.00
1.15
1.30
1.45
1.60
1.75
1.90
2.05
2.20
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
V
threshold
[V]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 331
Figure 37-319. Reset pin input threshold voltage vs. VCC
VIL - Reset pin read as “0”
37.4.9 Power-on Reset Characteristics
Figure 37-320. Power-on reset current consumption vs. VCC
BOD level = 3.0V, enabled in continuous mode
105 °C
85 °C
25 °C
-40 °C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
VTHRESHOLD [V]
VCC [V]
105 °C
85 °C
25 °C
-
40
°C
0
100
200
300
400
500
600
700
0.4 0.7 1.0 1.3 1.6 1.9 2.2 2.5 2.8
I
CC
[µA]
V
CC
[V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 332
Figure 37-321. Power-on reset current consumption vs. VCC
BOD level = 3.0V, enabled in sampled mode
37.4.10 Oscillator Characteristics
37.4.10.1 Ultra Low-Power internal oscillator
Figure 37-322. Ultra Low-Power internal oscillator frequency vs. temperature.
105
°
°C
85
°
°C
25 °C
-40 °C
0
65
130
195
260
325
390
455
520
585
650
0.4 0.7 1 1.3 1.6 1.9 2.2 2.5 2.8
I
CC
[µA]
V
CC
[V]
3.6 V
3.3 V
3.0 V
2.7 V
1.8 V
1.6 V
30.75
31.00
31.25
31.50
31.75
32.00
32.25
32.50
32.75
33.00
33.25
33.50
33.75
-40-30-20-10 0 10 20 30 40 50 60 70 80 90100
Freq uen cy [kHz]
Temp erature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 333
37.4.10.2 32.768kHz Internal Oscillator
Figure 37-323. 32.768kHz internal oscillator frequency vs. temperature
Figure 37-324. 32.768kHz internal oscillator frequency vs. calibration value
VCC = 3.0V, T = 25°C
3.6 V
3.3 V
3.0 V
2.7 V
2.2 V
1.8 V
32.46
32.49
32.52
32.55
32.58
32.61
32.64
32.67
32.70
32.73
32.76
32.79
32.82
-40-30-20-100 102030405060708090100
Frequency [kHz]
Temp erature [°C]
3.0 V
22
25
28
31
34
37
40
43
46
49
52
0 24 48 72 96 120 144 168 192 216 240 264
Frequen cy [kHz]
RC32KCA L[7..0]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 334
37.4.10.3 2MHz Internal Oscillator
Figure 37-325. 2MHz internal oscillator frequency vs. temperature
DFLL disabled
Figure 37-326. 2MHz internal oscillator frequency vs. temperature
DFLL enabled, from the 32.768kHz internal oscillator
3.6 V
3.3 V
3.0 V
2.7 V
2.2 V
1.8 V
1.96
1.98
2.00
2.02
2.04
2.06
2.08
2.10
2.12
2.14
2.16
-40-30-20-100 102030405060708090100
Freq uen cy [MHz]
Temp erature [°C]
3.6 V
3.3 V
3.0 V
2.7 V
2.2 V
1.8 V
1.980
1.982
1.984
1.986
1.988
1.990
1.992
1.994
1.996
1.998
2.000
2.002
2.004
2.006
-40-30-20-100 102030405060708090100
Frequency [MHz]
Temp erature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 335
Figure 37-327. 2MHz internal oscillator CALA calibration step size
VCC = 3V
37.4.10.4 32MHz Internal Oscillator
Figure 37-328. 32MHz internal oscillator frequency vs. temperature
DFLL disabled
105 °C
85 °C
25 °C
-40 °C
0.14
0.16
0.18
0.20
0.22
0.24
0.26
0.28
0.30
0 102030405060708090100110120130
Step Size [%]
CALA
3.6 V
3.3 V
3.0 V
2.7 V
2.2 V
1.8 V
31.05
31.50
31.95
32.40
32.85
33.30
33.75
34.20
34.65
35.10
35.55
36.00
-40-30-20-100 102030405060708090100
Frequency [MHz]
Temp erature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 336
Figure 37-329. 32MHz internal oscillator frequency vs. temperature
DFLL enabled, from the 32.768kHz internal oscillator
Figure 37-330. 32MHz internal oscillator CALA calibration step size
VCC = 3.0V
3.6 V
3.3 V
3.0 V
2.7 V
2.2 V
1.8 V
31.66
31.69
31.72
31.75
31.78
31.81
31.84
31.87
31.90
31.93
31.96
31.99
32.02
32.05
-40-30-20-100 102030405060708090100
Frequency [MHz]
Temp erature [°C]
105 °C
85 °C
25 °C
-40 °C
0.14
0.17
0.20
0.23
0.26
0.29
0.32
0 102030405060708090100110120130
Step Size [%]
CALA
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 337
37.4.10.5 32MHz internal oscillator calibrated to 48MHz
Figure 37-331. 48MHz internal oscillator frequency vs. temperature
DFLL disabled
Figure 37-332. 48MHz internal oscillator frequency vs. temperature
DFLL enabled, from the 32.768kHz internal oscillator
3.6 V
3.3 V
3.0 V
2.7 V
2.2 V
1.8 V
46.2
46.9
47.6
48.3
49.0
49.7
50.4
51.1
51.8
52.5
53.2
53.9
-40-30-20-100 102030405060708090100
Freq uen cy [MHz]
Temp erature [°C]
3.6 V
3.3 V
3.0 V
2.7 V
2.2 V
1.8 V
47.5
47.6
47.7
47.8
47.9
48.0
48.1
48.2
48.3
-40-30-20-100 102030405060708090100
Frequency [MHz]
Temp erature [°C]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 338
Figure 37-333. 48MHz internal oscillator CALA calibration step size
VCC =3V
37.4.11 Two-Wire Interface characteristics
Figure 37-334. SDA hold time vs. supply voltage
105 °C
85 °C
25 °C
-40 °C
0.14
0.16
0.18
0.2
0.22
0.24
0.26
0.28
0 102030405060708090100110120130
Step Size [%]
CALA
105°C
85°C
25°C
-40°C
260
265
270
275
280
285
290
295
300
2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
Holdtime [ns]
Vcc [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 339
37.4.12 PDI characteristics
Figure 37-335. Maximum PDI frequency vs. VCC
105 °C
85 °C
25 °C
-40 °C
10
13
16
19
22
25
28
31
1.61.82.02.22.42.62.83.03.23.43.6
Frequency max [MHz]
Vcc [V]
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 341
39. Datasheet Revision History
Please note that the referring page numbers in this section are referred to this document. The referring revision in this
section are referring to the document revision.
39.1 Rev. A – 04/2020
39.2 8387H –09/2014
39.3 8387G – 03/2014
1. New Microchip document number. Previous version was Atmel data sheet rev. 8387H
2. Updated Package Information to Microchip style
3. Updated Ordering Information
4. Errata has been moved to a separate document
5. Added note to "Block Diagram and VQFN/TQFP pinout" figure.
1. Updated “Ordering Information” on page 8. Added ordering information for ATxmega16A4U/32A4U/64A4U/128A4U @
105C
2. Updated the Application Table Section from 4K/4K/4K/4K to 8K/4K/4K/4K in the Figure 7-1 on page 20
3. Updated Table 36-4 on page 87, Table 36-36 on page 108, Table 36-68 on page 130 and Table 36-100 on page 152.
Added Icc Power-down power consumption for T=105C for all functions disabled and for WDT and sampled BOD enabled
4. Updated Table 36-20 on page 97, Table 36-52 on page 118, Table 36-84 on page 140 and Table 36-116 on page 162.
Updated all tables to include values for T=85C and T=105C. Removed T=55C
5.
Added 105°C Typical Characterization plots for:
ATxmega16A4U
ATxmega32A4U
ATxmega64A4U
ATxmega128A4U
6. Changed Vcc to AVcc in Figure 28-1 on page 56 and in the text in Section 28. “ADC – 12-bit Analog to Digital Converter” on
page 55 and Section 30. “AC – Analog Comparator” on page 59.
7. Changed values for 128A4U in Table 7-3 on page 23. Page size = 128, FWORD = Z(6:0)
8. Changed unit notation for parameter tSU;DAT to ns in Table 36-32 on page 105, Table 36-64 on page 126, and Table 36-128
on page 170.
1. Removed “Preliminary” from the datasheet
2. Updated “Errata” on page 340: added ERRATA “Rev. D” and “Rev. C” for “ATxmega64A4U”
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 342
39.4 8387F – 01/2014
39.5 8387E – 11/2013
39.6 8387D – 02/2013
1. Removed JTAG references from the datasheet
2. Updated Figure 30-1 on page 60. The positive Mux has two “Input” while the negative Mux has four “Input”
1. Updated Flash size column in “Ordering Information” on page 8 for:
ATxmega128A4U-AU, ATxmega128A4U-AUR, ATxmega128A4U-MH and ATxmega128A4U-MHR
1. Updated typos in “Ordering Information” on page 8.
2. Updated PE2 and PE3 pins in “Pinout/Block Diagram” on page 10 to indicate that these can be used as TOSC pins.
3. Renamed pin 19 from VDD to VCC in Figure 2-1 on page 10.
4. Updated page size for ATxmega128A4U in Table 7-3 on page 23.
5. Added column for TWI using external driver interface in Table 32-3 on page 65.
6. Updated ATxmega16A4U leakage current in Table 36-7 on page 90.
7. Added application erase time for ATxmega16A4U in Table 36-21 on page 97.
8.
Updated limits for VIH and VIL:
ATxmega16A4U: Table 36-7 on page 90
ATxmega32A4U: Table 36-39 on page 111
ATxmega64A4U: Table 36-71 on page 133
ATxmega128A4U:Table 36-103 on page 155
9.
Updated DAC clock and timing characteristics:
ATxmega16A4U: Table 36-13 on page 94
ATxmega32A4U: Table 36-45 on page 114
ATxmega64A4U: Table 36-77 on page 136
ATxmega128A4U: Table 36-109 on page 158.
10. Updated ATxmega16A4U “ External clock characteristics” on page 99.
11.
Added ESR parameter to the External 16MHz crystal oscillator and XOSC characteristics:
ATxmega16A4U: Table 36-29 on page 100
ATxmega32A4U: Table 36-61 on page 121
ATxmega64A4U: Table 36-93 on page 143
ATxmega128A4U: Table 36-125 on page 165.
12. Updated ATxmega32A4U leakage current in Table 36-39 on page 111.
13. Added application erase time for ATxmega32A4U in Table 36-53 on page 118.
14. Updated ATxmega32A4U “ External clock characteristics” on page 120.
15. Updated ATxmega32A4U current consumption in electrical characteristics section, see “Current consumption” on
page 130.
16. Updated electrical characteristics for “ATxmega64A4U” on page 128.
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 343
39.7 8387C – 03/2012
39.8 8387B – 12/2011
17. Updated typical characteristics for “ATxmega64A4U” on page 256.
18. Added application erase time for ATxmega128A4U in Table 36-117 on page 162.
19. Updated ATxmega128A4U “ External clock characteristics” on page 164.
1. Updated “Ordering Information” on page 8. Added a new package PW.
2. Updated “Packaging information” on page 74. A new package PW added.
3. Updated the Table 36-4 on page 87 with new values for ICC active power consumption.
4. Updated all typical characteristics in “ Active mode supply current” on page 172.
5. Updated all typical characteristics in “Power-down mode supply current” on page 179.
6. Added electrical characteristics for “ATxmega32A4U” on page 106.
7. Added electrical characteristics for “ATxmega64A4U” on page 128.
8. Added electrical characteristics for “ATxmega128A4U” on page 150.
9. Added typical characteristics for “ATxmega64A4U” on page 256
10. Added typical characteristics for “ATxmega64A4U” on page 256.
12. Added typical characteristics for “ATxmega128A4U” on page 298.
13. Updated “Errata” on page 340.
14. Used Atmel new datasheet template that includes Atmel new addresses on the last page.
1. Updated Figure 2-1 on page 10: “Block Diagram and VQFN/TQFP pinout”
2. Updated Figure 3-1 on page 13: “XMEGA® A4U Block Diagram”
3. Updated “Overview” on page 19.
4. Updated “ADC – 12-bit Analog to Digital Converter” on page 55.
5. Updated Figure 28-1 on page 56: “ADC overview.”
6. Updated “Instruction Set Summary” on page 69.
7. Updated “Electrical Characteristics” on page 85.
8. Updated “Typical Characteristics” on page 172.
9. The order of several figures in the chapter “Typical Characteristics” has been changed
10. Several new figures have been added to and some figures have been removed from chapter “Typical Characteristics”
11. Several minor changes/corrections in text and figures have been performed
12. Table 32-2 on page 59 has been corrected
13. Table 32-4 on page 60 has been corrected
ATxmega128/64/32/16A4U
2011-2020 Microchip Technology Inc. DS40002166A-page 344
39.9 8387A – 07/2011
14. Table 36-29 on page 85 has been corrected
15. Table 36-30 on page 86 has been corrected
16. The heading ”I/O Pin Characteristics” on page 164 has been corrected (the text “and Reset” has been removed)
1. Initial revision.
2011-2020 Microchip Technology Inc. DS40002166A-page 345
ATxmega128/64/32/16A4U
DEVELOPMENT SUPPORT
Move a design from concept to production in record time with Microchip’s award-winning development tools. Microchip
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Providing the ultimate ease-of-use experience, Microchip’s line of programmers, debuggers and emulators work
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while our line of third party tools round out our comprehensive development tool solutions.
Microchip’s MPLAB X and Atmel Studio ecosystems provide a variety of embedded design tools to consider, which sup-
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Go to the following website for more information and details:
https://www.microchip.com/development-tools/
DS40002166A-page 346 2011-2020 Microchip Technology Inc.
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Customers should contact their distributor,
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Technical support is available through the website
at: http://microchip.com/support
2011-2020 Microchip Technology Inc. DS40002166A-page 1
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AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
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ISBN: 978-1-5224-5342-0
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• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
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• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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DS40002166A-page 348 2011-2020 Microchip Technology Inc.
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Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
ASIA/PACIFIC
Australia - Sydney
Tel: 61-2-9868-6733
China - Beijing
Tel: 86-10-8569-7000
China - Chengdu
Tel: 86-28-8665-5511
China - Chongqing
Tel: 86-23-8980-9588
China - Dongguan
Tel: 86-769-8702-9880
China - Guangzhou
Tel: 86-20-8755-8029
China - Hangzhou
Tel: 86-571-8792-8115
China - Hong Kong SAR
Tel: 852-2943-5100
China - Nanjing
Tel: 86-25-8473-2460
China - Qingdao
Tel: 86-532-8502-7355
China - Shanghai
Tel: 86-21-3326-8000
China - Shenyang
Tel: 86-24-2334-2829
China - Shenzhen
Tel: 86-755-8864-2200
China - Suzhou
Tel: 86-186-6233-1526
China - Wuhan
Tel: 86-27-5980-5300
China - Xian
Tel: 86-29-8833-7252
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
India - New Delhi
Tel: 91-11-4160-8631
India - Pune
Tel: 91-20-4121-0141
Japan - Osaka
Tel: 81-6-6152-7160
Japan - Tokyo
Tel: 81-3-6880- 3770
Korea - Daegu
Tel: 82-53-744-4301
Korea - Seoul
Tel: 82-2-554-7200
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
Malaysia - Penang
Tel: 60-4-227-8870
Philippines - Manila
Tel: 63-2-634-9065
Singapore
Tel: 65-6334-8870
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Thailand - Bangkok
Tel: 66-2-694-1351
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4485-5910
Fax: 45-4485-2829
Finland - Espoo
Tel: 358-9-4520-820
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-72400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7288-4388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
02/28/20
