Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Lineage
Power Board Mounted Power Modules: Soldering and
Cleaning Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
They are designed to be processed through single or dual
wave soldering machines. The pins have an RoHS-
compliant finish that is compatible with both Pb and Pb-free
wave soldering processes. A maximum preheat rate of 3C/s
is suggested. The wave preheat process should be such
that the temperature of the power module board is kept
below 210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is 270C
max. Not all RoHS-compliant through-hole products can be
processed with paste-through-hole Pb or Pb-free reflow
process. If additional information is needed, please consult
with your Lineage Power representative for more details.
Surface Mount Information
Pick and Place
The FLT007A0-SRZ SMT modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and place
operations. The label meets all the requirements for surface
mount processing, as well as safety standards, and is able to
withstand reflow temperatures of up to 300oC. The label also
carries product information such as product code, serial
number and location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style,
vacuum pressure and pick & placement speed should be
considered to optimize this process. The minimum
recommended nozzle diameter for reliable operation is 5mm.
The maximum nozzle outer diameter, which will safely fit
within the allowable component spacing, is 8 mm max.
Tin Lead Soldering
The FLT007A0-SRZ power modules are lead free modules
and can be soldered either in a lead-free solder process or in
a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in order
to customize the solder reflow profile for each application
board assembly. The following instructions must be
observed when soldering these units. Failure to observe
these instructions may result in the failure of or cause
damage to the modules, and can adversely affect long-term
reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235oC.
Typically, the eutectic solder melts at 183oC, wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection to
ensure a reliable solder joint. There are several types of
SMT reflow technologies currently used in the industry.
These surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For reliable
soldering the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.