MCP2210 Evaluation Kit User's Guide (c) 2012 Microchip Technology Inc. DS52057A Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62076-118-2 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS52057A-page 2 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2012 Microchip Technology Inc. MCP2210 EVALUATION KIT USER'S GUIDE Table of Contents Preface ........................................................................................................................... 5 Introduction............................................................................................................ 5 Document Layout .................................................................................................. 5 Conventions Used in this Guide ............................................................................ 6 Recommended Reading........................................................................................ 7 The Microchip Web Site ........................................................................................ 7 Customer Support ................................................................................................. 7 Document Revision History ................................................................................... 7 Chapter 1. Product Overview 1.1 Introduction ..................................................................................................... 9 1.2 MCP2210 Evaluation Kit General Description ................................................ 9 1.3 What The MCP2210 Evaluation Kit Includes ................................................. 9 Chapter 2. Installation and Operation 2.1 Introduction ................................................................................................... 11 2.2 Kit Setup ....................................................................................................... 11 2.3 Board Operation ........................................................................................... 12 2.4 MCP2210 Typical Usage Scenarios ............................................................. 17 Appendix A. Schematic and Layouts A.1 Introduction .................................................................................................. 19 A.2 MCP2210 Breakout Board Schematic and Layouts ..................................... 20 A.3 MCP2210 SPI Slave Motherboard Schematic and Layouts ........................ 27 Appendix B. Bill of Materials Worldwide Sales and Service .................................................................................... 36 (c) 2012 Microchip Technology Inc. DS52057A-page 3 MCP2210 Evaluation Kit User's Guide NOTES: DS52057A-page 4 (c) 2012 Microchip Technology Inc. MCP2210 EVALUATION KIT USER'S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a "DS" number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is "DSXXXXXA", where "XXXXX" is the document number and "A" is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB(R) IDE online help. Select the Help menu, and then Topics to open a list of available online help files. INTRODUCTION This chapter contains general information that will be useful to know before using the MCP2210 Evaluation Kit. Items discussed in this chapter include: * * * * * * Document Layout Conventions Used in this Guide Recommended Reading The Microchip Web Site Customer Support Document Revision History DOCUMENT LAYOUT This document describes how to use the MCP2210 Evaluation Kit as a development tool. The manual layout is as follows: * Chapter 1. "Product Overview" - Important information about the MCP2210 Evaluation Kit * Chapter 2. "Installation and Operation" - Covers the initial set-up of this board and Graphical User Interface (GUI) * Appendix A. "Schematic and Layouts" - Shows the schematic and board layouts for the MCP2210 Evaluation Kit User's Guide * Appendix B. "Bill of Materials" - Lists the parts used to populate the MCP2210 Evaluation Kit (c) 2012 Microchip Technology Inc. DS52057A-page 5 MCP2210 Evaluation Kit User's Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Initial caps Quotes Underlined, italic text with right angle bracket Bold characters N`Rnnnn Text in angle brackets < > Courier New font: Plain Courier New Represents Referenced books Emphasized text A window A dialog A menu selection A field name in a window or dialog A menu path MPLAB(R) IDE User's Guide ...is the only compiler... the Output window the Settings dialog select Enable Programmer "Save project before build" A dialog button A tab A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. A key on the keyboard Click OK Click the Power tab 4`b0010, 2`hF1 Italic Courier New Sample source code Filenames File paths Keywords Command-line options Bit values Constants A variable argument Square brackets [ ] Optional arguments Curly brackets and pipe character: { | } Ellipses... Choice of mutually exclusive arguments; an OR selection Replaces repeated text Represents code supplied by user DS52057A-page 6 Examples File>Save Press <Enter>, <F1> #define START autoexec.bat c:\mcc18\h _asm, _endasm, static -Opa+, -Opa0, 1 0xFF, `A' file.o, where file can be any valid filename mcc18 [options] file [options] errorlevel {0|1} var_name [, var_name...] void main (void) { ... } (c) 2012 Microchip Technology Inc. Preface RECOMMENDED READING This user's guide describes how to use MCP2210 Evaluation Kit. Other useful documents are listed below. The following Microchip documents are available and recommended as supplemental reference resources. * MCP2210 Data Sheet - "USB-to-SPI Protocol Converter with GPIO (Master Mode)" (DS22288) THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: .http://www.microchip.com/support. DOCUMENT REVISION HISTORY Revision A (March 2012) * Initial Release of this Document. (c) 2012 Microchip Technology Inc. DS52057A-page 7 MCP2210 Evaluation Kit User's Guide NOTES: DS52057A-page 8 (c) 2012 Microchip Technology Inc. MCP2210 EVALUATION KIT USER'S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the MCP2210 Evaluation Kit and covers the following topics: * MCP2210 Evaluation Kit General Description * What The MCP2210 Evaluation Kit Includes 1.2 MCP2210 EVALUATION KIT GENERAL DESCRIPTION The MCP2210 Evaluation Kit (ADM00421) is a development and evaluation platform for the MCP2210 device. The kit is comprised of two connected boards: * MCP2210 Breakout Board (ADM00419) * MCP2210 SPI Slave Motherboard (ADM00420) The MCP2210 SPI Slave Motherboard is designed to work together with the MCP2210 Breakout Board (ADM00419). The motherboard provides the test-points required for measurements. It also contains the following SPI slave devices: * * * * MCP23S08 - 8-bit I/O expander MCP3204 - 4 channel, 12-bit ADC 25LC02 - 2 kbit EEPROM TC77 - Temperature sensor All devices are SPI slaves, controlled by the MCP2210. Windows(R)-based PC software is used to evaluate/demonstrate the MCP2210 as a USB-to-SPI (Master) device. It allows I/O control and custom device configuration. The software is downloadable from the board web page on www.microchip.com. A DLL package is also available for development of custom PC applications using the MCP2210. The DLL package is downloadable from the board's web page. 1.3 WHAT THE MCP2210 EVALUATION KIT INCLUDES The MCP2210 Evaluation Kit includes (ADM00421): * * * * MCP2210 Breakout Board (ADM00419) MCP2210 SPI Slave Motherboard (ADM00420) Mini-USB cable Important Information Sheet (c) 2012 Microchip Technology Inc. DS52057A-page 9 MCP2210 Evaluation Kit User's Guide NOTES: DS52057A-page 10 (c) 2012 Microchip Technology Inc. MCP2210 EVALUATION KIT USER'S GUIDE Chapter 2. Installation and Operation 2.1 INTRODUCTION The MCP2210 Evaluation Kit is designed to demonstrate the device as a USB-to-SPI (Master) bridge solution. The Evaluation Kit is comprised of two boards that have the following features: * MCP2210 Breakout Board: - Small plug-in board with DIP form factor (0.6 inches overall row spacing between pins) - Mini-USB connector - Access to the SPI bus and all GP signals - PICkitTM Serial Analyzer compatible header - 3.3 or 5V jumper selectable VDD; the Breakout Board can be used to supply up to 500 mA to the rest of the system * MCP2210 SPI Slave Motherboard: - Socket for plugging in the MCP2210 Breakout Board - Test-points for the SPI bus and GP signals - PICkitTM Serial Analyzer header (it can be used to access only one of the SPI slave chips present on this board - MCP23S08) - 8-bit I/O expander (MCP23S08) with eight LEDs - Four channel, 12-bit ADC (MCP3204) - a potentiometer is used to vary the voltage on the Channel 1 ADC input - 2 kbit EEPROM - 25LC02 - Temperature sensor - TC77 2.2 KIT SETUP Follow these steps to set up the MCP2210 Evaluation Kit: 1. Download the support material (PC applications and DLL libraries) that can be found on the board's page (www.microchip.com/mcp2210evaluationkit). 2. Plug the MCP2210 Breakout Board into the MCP2210 SPI Slave Motherboard. 3. Connect the MCP2210 Breakout Board to a PC via a USB port. 4. The system will automatically install the driver for this board. When the installation is complete, the board is ready for operation. 5. Install the downloaded PC software. 6. Start the demo application and exercise the SPI slave chip's features. (c) 2012 Microchip Technology Inc. DS52057A-page 11 MCP2210 Evaluation Kit User's Guide 2.3 BOARD OPERATION The MCP2210 device is detected by a Windows(R)-based PC host as a Human Interface Device (HID). The accompanying software can be used to exercise the Evaluation Kit's features. It also provides a reference point for users that want to create custom applications based on the MCP2210. 2.3.1 MCP2210 Breakout Board Operation The MCP2210 Breakout Board can be used with either the provided motherboard, or as a stand-alone USB-to-SPI (Master) bridge module. The breakout board provides all the required signals in order to assist the user in building customized boards using the MCP2210. The breakout board has the following features: * SPI bus signals (MOSI, MISO, SCK) * 9 GP signals configurable for: - GPIO functionality (digital input or output pins) - Chip Select functionality (working with the SPI bus signals) - Dedicated function pins * Jumper selectable power supply: 3.3 or 5V (up to 500 mA). The board has a default connection trace between VDD and 3.3V rail, making the voltage header mounting unnecessary when powering the board with 3.3V. For 5V operation, a 3-pin header must be mounted on the board. * PICkitTM Serial Analyzer header using GP4 as the Chip Select signal Note: This function is available only on SPI operations, it does not work on I2C or UART signals. * Dip form-factor (0.6 inches overall row spacing between pins) By using the provided software and libraries, the user can create personalized PC applications using the breakout board as a USB-to-SPI (Master) bridge adapter. 2.3.2 MCP2210 Breakout Board Operation The MCP2210 Utility software was created for custom device setting requirements. A few of the settings that this utility can alter include VID, PID, power requirements, and string descriptors. A download link for this software can be found on the board web page. For instructions on the use of this software, refer to the software's supporting documentation included within the application install package. 2.3.3 SPI Terminal Utility The SPI Terminal Utility is a tool that allows low-level data exchange at the SPI bus level. This application is useful for low-level communication and troubleshooting between the MCP2210 and various SPI slave modules. The utility window has different sections for GP designation, SPI transfer parameters and user data area. DS52057A-page 12 (c) 2012 Microchip Technology Inc. Installation and Operation FIGURE 2-1: SPI TERMINAL UTILITY WINDOW SPI user data section GP Settings Section HEX/Decimal user data mode SPI Transfer Parameters Section Status messages Transfer Data button GP Direct Settings section After the application is started, the state of the connection with the MCP2210 is shown in the Status Messages bar (in the lower left corner of the screen). The user can establish the GP configuration. The GPs can be used as chip select pins. Each GP Active and Idle value can be established by selecting the appropriate checkboxes, or by directly supplying the correct value in the GP Direct Settings section. The same behavior applies to the GP designation (the GP designation can be established by clicking the appropriate radio-button, or by directly supplying the GP designation value in the GP settings Direct Values section). The SPI settings pertaining to the needed SPI transfer can be established in the SPI Parameters section. The data to be sent out is filled in the Tx Data field. To send the data to the SPI slave device, press the SPI Transfer Data button on the lower right area of the screen. The data received from the SPI slave device is displayed in the Rx Data field. The user data can be supplied in either HEX or Decimal mode. This can be accomplished by selecting the HEX mode checkbox. The data in the Tx and Rx Data fields will be displayed in HEX or Decimal. (c) 2012 Microchip Technology Inc. DS52057A-page 13 MCP2210 Evaluation Kit User's Guide A simple test using the SPI Terminal utility shows how the MCP23S08 (an 8-bit I/O expander) uses the GP4 pin of the MCP2210 device as a chip select line. This line should be active low. The GP4 must be set as in the Figure 2-1, with the IDLE option checked (IDLE value is logic `1') and the ACTIVE option unchecked (ACTIVE value is logic `0'). The SPI parameters are set as follows: * * * * Bit rate - 500000 bps SPI Mode - 0 Number of bytes to transfer - 3 All the SPI related delays are set to 0 The TX Data should contain the following HEX values: 40, 00, 00. Click on the SPI Transfer Data button to complete the procedure and set the MCP23S08's port as an output. After setting this port, a value can be sent out to the port to light the LEDs on the board. To make this happen, insert the following three HEX values: 40, 0A, FF. By clicking the SPI Transfer Data button again, the inserted values are sent out to the MCP23S08 device. This command will light all the LEDs on the board. If any other LED light pattern is desired, the third value (FF) can be changed to any other 8-bit value. To verify the value written to the MCP23S08's port, another set of data must be written into the TX Data area: 41, 0A and any other 8-bit value (a "Don't care" value for the third position is admissible, because the read value from the MCP23S08 is received on the third byte). In the RX Data field, the third value should be the identical to the one sent out previously (in the given example, FF). 2.3.4 MCP2210 Evaluation Kit demo application The provided demo application is designed to work with the MCP2210 SPI Slave Motherboard using the MCP2210 Breakout Board as a USB-to-SPI bridge. The application's source code is provided to facilitate the development of custom PC applications using the MCP2210 and the accompanying DLL package. This application was written in Visual Basic. DS52057A-page 14 (c) 2012 Microchip Technology Inc. Installation and Operation FIGURE 2-2: VISUAL BASIC APPLICATION WINDOW I/O Expander Section I/O Expander Section Temperature Sensor Section ADC Section Selected EEPROM Address The PC GUI shows typical sections for each of the SPI slave devices present on the MCP2210 SPI Slave Motherboard. 2.3.5 MCP23S08 GPIO Expander controls The GUI provides specific controls in order to assist the user in exploring the I/O expander features. The control for this chip shows eight color-coded buttons, each representing an I/O option. FIGURE 2-3: MCP23S08 GPIO EXPANDER SECTION I/O buttons Color coded reference table for I/O option By double-clicking on any of the buttons, the assigned I/O pin will toggle from being a digital input to digital output and back. For the I/Os designated as digital inputs, any change on the pins will be shown on the GUI in yellow (for a logic high value) or in blue (for a logic low value). For the I/Os designated as digital outputs, a single click on any of the I/O circles will toggle their output value from logic low (in red) to logic high (in green). When a digital output is set to logic high, the corresponding LED will be lit. 2.3.6 EEPROM 25LC02 Controls The EEPROM GUI section presents a data-grid control and three buttons (see Figure 2-4). The data-grid is organized in eight columns and sixty-four rows. The EEPROM addresses are read from left to right, top to bottom, starting at location 0 (in (c) 2012 Microchip Technology Inc. DS52057A-page 15 MCP2210 Evaluation Kit User's Guide the first line, first column on the left). When, a particular cell in the data grid control is highlighted, the corresponding EEPROM address is displayed in the bottom left corner of the application window. FIGURE 2-4: EEPROM 25LC02 SECTION Data-grid controls Control buttons The EEPROM section also shows three buttons: * Read EEPROM - Press this button to read the entire EEPROM memory. The content will show in the data-grid control. * Write EEPROM - The user can modify the data and add other hex-represented byte values in the cells. When all the modifications are done, press this button to write the modified data-grid content on the EEPROM. * Clear Mem - To verify the EEPROM content, press this button. This action clears only the data-grid control, not the EEPROM contents. Later, when the Read EEPROM button is pressed again, the actual EEPROM content will display in the data-grid control. 2.3.7 TC77 Temp Sensor Section The temperature sensor displays the temperature of the sensor device present on the motherboard in either Fahrenheit or Celsius scales. FIGURE 2-5: TC77 temperature DS52057A-page 16 TC77 TEMPERATURE SENSOR SECTION Temperature unit selection (c) 2012 Microchip Technology Inc. Installation and Operation 2.3.8 MCP3204 ADC Display Section The MCP3201 12-bit ADC section displays the board's measured VDD voltage and a voltage between 0 and VDD/2, corresponding to the voltage value set by the motherboard potentiometer. FIGURE 2-6: MCP3204 ADC VALUES DISPLAY Motherboard potentiometer settings display (between 0 and and VDD/2) VDD voltage value display Custom voltage value display The remaining channels (channels 2 and 3) can also display custom user measurements of voltages between 0V - 2.5V (maximum). 2.4 MCP2210 TYPICAL USAGE SCENARIOS The MCP2210 can be used in systems where an SPI bus is available. The MCP2210 device can be either the single master on the bus, or one of the masters sharing the bus, if a proper master-access arbitration scheme is in place. In cases where the MCP2210 is the only master on the SPI bus, a typical usage scenario is shown in Figure 2-7. The SPI bus links the SPI slave chips to the system, while a few GPs (configured for chip select function) can be used as chip select lines. If SPI slave interrupt monitoring is required, the GP6 needs to be configured for its dedicated function, in order to monitor the interrupts coming from the SPI slave chips. The PC application will handle all the details necessary for data transfer between the MCP2210 and the SPI slave devices. (c) 2012 Microchip Technology Inc. DS52057A-page 17 MCP2210 Evaluation Kit User's Guide FIGURE 2-7: MCP2210 TYPICAL USAGE DIAGRAM MCP2210 USB USB-to-SPI bridge External Interrupt (GP6) SPI bus MOSI, MISO, SCK Chip-Select lines CS0-CS8 SPI slave chip #1 Interrupt ... SPI slave chip #n Interrupt When a system requires more than one SPI master sharing the same bus, an arbitration scheme needs to be developed, to prevent multiple SPI masters trying to access the bus at the same time. MCP2210 has support for such a mechanism, using GP7 and GP8 (configured for dedicated pin functionality) for this purpose. When GP8 is configured for its dedicated functionality, the pin can be used as a bus release request for MCP2210 coming from another master. GP7 (configured for its dedicated functionality) is used as an SPI bus release acknowledge signal towards the requesting master. When an external SPI master requests that the MCP2210 release the bus, the MCP2210 completes the current SPI transfer (or it can be cancelled by the PC application by sending the proper USB command). Then it releases the bus, and signals this event on the acknowledge pin (GP7). The second master now has ownership of the bus and can keep it as long as the SPI bus request pin (GP8) is kept asserted. In conclusion, when the dedicated functionality of the GP7 and GP8 are used, MCP2210 can be used in a multiple SPI master system. DS52057A-page 18 (c) 2012 Microchip Technology Inc. Installation and Operation FIGURE 2-8: MCP2210 TYPICAL USAGE DIAGRAM MCP2210 SPI Bus Release Request GP8 GP7 USB USB-toSPI bridge External Interrupt (GP6) SPI Bus Release Acknowledge SPI bus MOSI, MISO, SCK External Interrupt Chip-Select lines SPI slave chip #1 Interrupt (c) 2012 Microchip Technology Inc. SPI Master #2 ... SPI slave chip #n Interrupt DS52057A-page 19 MCP2210 Evaluation Kit User's Guide NOTES: DS52057A-page 20 (c) 2012 Microchip Technology Inc. MCP2210 EVALUATION KIT USER'S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the following schematics and layouts for the MCP2210 Evaluation Kit: * MCP2210 Breakout Board Schematic and Layouts - Board - Schematic - Board - Top Silk and Pads - Board - Top Silk, Pads and Copper - Board - Top Pads and Copper - Board - Bottom Silk and Pads - Board - Bottom Silk, Pads and Copper - Board - Bottom Pads and Copper * MCP2210 SPI Slave Motherboard Schematic and Layouts - Board - Schematic - Board - Top Silk - Board - Top Silk and Copper - Board - Top Copper - Board - Bottom Silk - Board - Bottom Silk and Copper (c) 2012 Microchip Technology Inc. DS52057A-page 19 0.1uF 0603 C4 GND D GND D 4.7uF 0603 C3 5V U2 GND D 1 2 3 4 5 6 7 J1 MCP1825S-3.3V 1 3 VIN VOUT GND DS52057A-page 20 2 C5 HDR M 1x7 VERT Left Side Header GP0 GP1 GP2 GP3 GP4 MOSI SCK GND D 0.1uF 0603 VDD 1 2 3 4 5 6 PICkitTM Serial Analyzer Header HDR M 1x6 VERT VDD HDR M 1 x 7 VERT Right Side Header GP8 GP7 GP6 GP5 MI SO GND D Default connection between 1 - 2. User to cut the trace if 5V VDD is needed. GND D J3 J4 1 2 3 5V 22uF 1206 C1 GND D HDR M1 x 3 VERT NT1 3.3V VUSB VDD 1 2 3 4 5 6 7 J2 3 2 12MHz X1 GND D 1 TP1 Via_1.2x 0.7 GP0 GP1 GP2 GP3 MOSI GP4 R1 OSC1 OSC2 RST VDD 390 5% 0603 1 2 3 4 5 6 7 8 9 10 VSS D+ DVUSB GP8 GP7 GP6 MI SO GP5 SCK 20 19 18 17 16 15 14 13 12 11 GND D MCP2210 U1 0603 VDD OSC1 OSC2 RST GP0 GP1 GP2 GP3 MOSI GP4 0.1uF C2 USB_D+ USB_DVUSB GND D C6 0603 1uF J5 GND ID D+ D- VBUS USB-B-Mini SMD 5 4 3 2 1 GP8 GP7 GP6 MI SO GP5 SCK GND D GND D USB_D+ USB_D- 5V A.2.1 GP4 A.2 MISO SCK MOSI VDD MCP2210 Evaluation Kit User's Guide MCP2210 BREAKOUT BOARD SCHEMATIC AND LAYOUTS Board - Schematic (c) 2012 Microchip Technology Inc. Schematic and Layouts A.2.2 Board - Top Silk and Pads (c) 2012 Microchip Technology Inc. DS52057A-page 21 MCP2210 Evaluation Kit User's Guide A.2.3 Board - Top Silk, Pads and Copper DS52057A-page 22 (c) 2012 Microchip Technology Inc. Schematic and Layouts A.2.4 Board - Top Pads and Copper (c) 2012 Microchip Technology Inc. DS52057A-page 23 MCP2210 Evaluation Kit User's Guide A.2.5 Board - Bottom Silk and Pads DS52057A-page 24 (c) 2012 Microchip Technology Inc. Schematic and Layouts A.2.6 Board - Bottom Silk, Pads and Copper (c) 2012 Microchip Technology Inc. DS52057A-page 25 MCP2210 Evaluation Kit User's Guide A.2.7 Board - Bottom Pads and Copper DS52057A-page 26 (c) 2012 Microchip Technology Inc. GP4 GND GND MOSI MI SO SCK GP0 1 J7 1 J5 GP0 0603 GP4 0.1uF C6 2 5 6 1 1 GP6 VDD VDD SI SO 7 8 4 GND VDD 0603 4.7uF 0603 0.1uF C1 VREF 5% 0603 GND 1 2 3 4 5 6 7 8 9 VDD GP7 GP6 GP5 GP4 GP3 GP2 GP1 GP0 MCP23S08 SCK SI SO A1 A0 RESET CS INT VSS U1 I/O EXPANDER VSS 0603 1k 1% R1 10k R7 VCC 2 HOLD 3 WP SCK MOSI MI SO SSCK SC K CS U2 25LC020 EEPROM GND VSS 3 VOUT U5 MCP1525 VIN C5 18 17 16 15 14 13 12 11 10 C2 0.1uF VDD GND 0603 GND AGND MOSI MOSI J16 1 1k 2 R15 AGND 1 10k R17 3 0603 10k 1% R16 VDD 0603 1k 1% R2 GND L D2 GND L D1 0603 1k 1% R3 0603 GND L D3 1k 1% 5% 0603 CH3 J21 J18 CH2 1 0603 1k 1% R5 GND L D4 0603 1k 1% R6 GND L D5 GND 0603 1k 1% R8 SCK MISO 0603 1k 1% R12 1 0603 R13 1% 0603 1 J23 CH0 HDR M 2x8 VERT J12 33k R11 CH1 J22 1 1% R14 1k 0603 1k 1% R4 2 4 6 8 10 12 14 16 1 3 5 7 9 11 13 15 0603 4.7uF C7 1 2 1 1 2 J19 1 2 1 2 1 2 1 L D6 GND 2 1 0603 1k 1% R9 SCK L D7 GND L D8 0603 1k 1% C3 0603 VDD 0.1uF C4 SCK MI SO MOSI GP1 VREF 0.1uF 8 VDD 7 CS 6 NC 5 NC TC77 SPI 5V U4 J1 GP1 1 VDD 14 13 12 11 10 9 8 TEMP 1 SI /O 2 SCK 3 NC 4 VSS R10 GND 1 J20 MISO Vdd Vref AGND CLK Dout Din CS/SHDN U3 MCP3204 ADC CH0 CH1 CH2 CH3 NC NC DGND J17 1 1 2 3 4 5 6 7 GND 2 1 2 (c) 2012 Microchip Technology Inc. J4 GP7 1 0603 L1 GP7 GND GND Ferrite Bead 0603 AGND GND J11 MI SO SCK MOSI GP4 VDD GP0 GP1 GP2 GP3 GP4 MOSI SCK VDD GND 1 J15 GND J13 1 J3 GP5 HDR M 1x7 VERT GP8 GP7 GP6 GP5 MI SO GND 1 J9 GP8 GND Right Side Header VDD 1 1 J14 VDD GP6 J8 1 1 J2 GP3 GP2 J6 HDR M 1x6 RA PICkitTM Serial Analyzer Header HDR M 1x7 VERT GP6 GP2 GP3 GP8 GP5 J10 Left Side Header 7 6 5 4 3 2 1 A.3.1 6 5 4 3 2 1 A.3 7 6 5 4 3 2 1 VREF Schematic and Layouts MCP2210 SPI SLAVE MOTHERBOARD SCHEMATIC AND LAYOUTS Board - Schematic DS52057A-page 27 MCP2210 Evaluation Kit User's Guide A.3.2 Board - Top Silk DS52057A-page 28 (c) 2012 Microchip Technology Inc. Schematic and Layouts A.3.3 Board - Top Silk and Copper (c) 2012 Microchip Technology Inc. DS52057A-page 29 MCP2210 Evaluation Kit User's Guide A.3.4 Board - Top Copper DS52057A-page 30 (c) 2012 Microchip Technology Inc. Schematic and Layouts A.3.5 Board - Bottom Silk (c) 2012 Microchip Technology Inc. DS52057A-page 31 MCP2210 Evaluation Kit User's Guide A.3.6 Board - Bottom Silk and Copper DS52057A-page 32 (c) 2012 Microchip Technology Inc. MCP2210 EVALUATION KIT USER'S GUIDE Appendix B. Bill of Materials TABLE B-1: Qty BILL OF MATERIALS - MCP2210 BREAKOUT BOARD Reference Description_ Manufacturer Part Number 1 C1 Cap. Cer. 22 uF 10V 20% Y5V 1206 TDK(R) 3 C2, C4, C5 Cap. Cer. 1 uF 10% 16V X7R 0603 AVX Corporation 0603YC104KAT2A 1 C3 Cap. Cer. 4.7 uF 6.3V 10% X5R 0603 TDK Corporation C1608X5R0J475K 1 C6 Cap. Cer. 1 uF 16V 10% X7R 0603 TDK Corporation C1608X7R1C105K 2 J1, J2 DO NOT POPULATE Conn. Hdr. Male .100 1x7 POS Vert. TE Connectivity Ltd. HDR M 1x7 Vertical 1 J3 DO NOT POPULATE Conn. Hdr. Male .100 1x6 POS Vert. TE Connectivity Ltd. HDR M 1x6 Vertical 1 J4 DO NOT POPULATE Conn. Hdr. Male .100 1x3 POS Vert. TE Connectivity Ltd. HDR M 1x3 Vertical 1 J5 Conn. Rcpt. USB Mini B R/A SMD Hirose Electric Co. Ltd. UX60SC-MB-5ST(80) 1 PCB RoHS compliant bare PCB, MCP2210 Breakout Board -- 104-00419 1 R1 Res. 390 Ohm 1/10W 5% 0603 SMD Panasonic(R) - ECG ERJ-3GEYJ391V 1 U1 IC USB-TO-SPI SSOP-20 Microchip Technology Inc. MCP2210-I/SS 1 U2 IC LDO Reg. 500 mA 3.3V SOT-223-3 Microchip Technology Inc. MCP1825S-3302E/DB 1 X1 Cer. Resonator 12.0 MHz SMD Murata Electronics(R) CSTCE12M0G55-R0 Note 1: 5 C3216Y5V1A226Z The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. TABLE B-2: Qty Corporation BILL OF MATERIALS - MCP2210 SPI SLAVE MOTHERBOARD Reference Description_ Manufacturer Part Number C1, C2, C3, C4, C6 Cap. Cer. 0.1 uF 50V X7R 10% 0603 TDK Corporation C1608X7R1H104K Cap. Cer. 4.7 uF 6.3V 10% X5R 0603 2 C5, C7 TDK Corporation C1608X5R0J475K 19 J1, J2, J3, J4, PC test point Tin SMD J5, J6, J7, J8, J9, J14, J15, J16, J17, J18, J19, J20, J21, J22, J23 Harwin Plc. S1751-46R 1 J10 Conn. Hdr. Male .100 1x6 Pos. RA TE Connectivity Ltd. HDR M 1x6 RA 2 J11, J13 Conn. Hdr. Male .100 1x7 Pos. Vert. TE Connectivity Ltd. HDR M 1x7 Vertical 1 J12 Conn. Hdr. Male .100 2x8 Pos. Vert. TE Connectivity Ltd. HDR M 2x8 Vertical Ferrite Chip 47 Ohms 500 mA 0603 (R) 1 L1 Note 1: Laird Technologies LI0603E470R-10 The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. (c) 2012 Microchip Technology Inc. DS52057A-page 33 MCP2210 Evaluation Kit User's Guide TABLE B-2: Qty BILL OF MATERIALS - MCP2210 SPI SLAVE MOTHERBOARD (CONTINUED) Reference Description_ Manufacturer Part Number 8 LD1, LD2, LD3, LD4, LD5, LD6, LD7, LD8 LED Smartled Red 630 nm 0603 OSRAM Opto Semiconductors GmbH. LS L29K-G1J2-1-0-2-R18-Z 1 PCB RoHS compliant bare PCB, MCP2210 SPI Slave Motherboard -- 104-00420 13 R1, R2, R3, R4, R5, R6, R8, R9, R10, R12, R13, R14, R15 Res. 1k Ohm 1/10W 1% 0603 SMD Panasonic - ECG ERJ-3EKF1001V 1 R7 Res. 10k Ohm 1/10W 5% 0603 SMD Panasonic - ECG ERJ-3GEYJ103V 1 R11 Res. 33k Ohm 1/10W 5% 0603 SMD Panasonic - ECG ERJ-3GEYJ333V 1 R16 Res. 10k Ohm 1/10W 1% 0603 SMD Panasonic - ECG ERJ-3EKF1002V 1 R17 Trimmer 10K OHM 0.5W TH Bourns(R), Inc. 3386F-1-103TLF 1 U1 IC I/O Expander SPI 8B SOIC-18 Microchip Technology Inc. MCP23S08-E/SO 1 U2 IC EEPROM 2k Bit 10 MHz SOIC-8 Microchip Technology Inc. 25LC020A-I/SN 1 U3 IC ADC 12 BIT 2.7V 4 Ch. SPI SOIC-14 Microchip Technology Inc. MCP3204T-CI/SL 1 U4 IC Sensor Thermal SPI 5V SOIC-8 Microchip Technology Inc. TC77-5.0MOA 1 U5 IC Volt. Ref. 2.5V SOT-23-3 Microchip Technology Inc. MCP1525T-I/TT Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. DS52057A-page 34 (c) 2012 Microchip Technology Inc. Bill of Materials NOTES: (c) 2012 Microchip Technology Inc. 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