Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 1 of 4 April 2008
WJA1021
+5V Active-Bias InGaP HBT Gain Block
Product Features
• 50 – 4000 MHz
• 17.5 dB Gain @ 1.9GHz
• +19 dBm P1dB @ 1.9GHz
• +37.5 dBm OIP3 @ 1.9GHz
• +5V Single Supply
• Low current draw (90mA)
• Unconditionally stable
• Internally matched to 50 Ω
• Robust 1000V ESD, Class 1C
• Lead-free/green/RoHS-compliant
SOT-89 package
Applications
• GSM, PCS, CDMA, WCDMA
• WiMAX, WiBro
• Repeaters, BTS Transceivers
• RFID
Product Description
The WJA1021 is a cascadable gain block that offers high
linearity in a low-cost surface-mount package. At 1.9 GHz,
the WJA1021 typically provides 17.5 dB gain, +37.5 dBm
OIP3, and +19 dBm P1dB. The device is housed in a lead-
free/green/RoHS-compliant industry-standard SOT-89
SMT package using a NiPdAu plating to eliminate the
possibility of tin whiskering.
The WJA1021 consists of Darlington pair amplifier using a
high reliability InGaP/GaAs HBT process technology.
The amplifier has been optimized internally to offer very
high linearity performance at 1.9 GHz while drawing very
low current. The MMIC amplifier is internally matched to
50Ω and only requires DC-blocking capacitors and a bias
inductor for operation. An internal active bias is designed
to enable stable performance over temperature and allow
for operation directly from a +5V supply voltage.
The broadband amplifier can be directly applied to various
current and next generation wireless technologies such as
GSM, CDMA, W-CDMA, WiBro, and WiMAX. The
WJA1021 is ideal for general purpose applications such as
LO buffering or amplification and pre-driver stages within
the 50 to 4000 MHz frequency range.
Functional Diagram
RF IN GND
RF OUT
GND
1
2
3
4
Function Pin No.
Input 1
Output/Bias 3
Ground 2, 4
Specifications (1)
Parameter Units Min Typ Max
Operational Bandwidth MHz 50 4000
Test Frequency MHz 1900
Gain dB 17.5
Input Return Loss dB -15
Output Return Loss dB -10
Output P1dB dBm +19
Output IP3 (2) dBm +37.4
Noise Figure dB 6.3
Device Voltage V 5
Device Current mA 90.5
1. Test conditions: 25 ºC, Supply Voltage = +5 V, 50 Ω System. S-parameters and 3OIP measured at
device pins. All other specifications measured on evaluation board.
2. 3OIP measured with two tones at an output power of 3 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter Rating
Storage Temperature -55 to +150 °C
Supply Voltage +6.5 V
Thermal Resistance, Rth 78.8 °C / W
Junction Temperature 150 °C
Input Power +24 dBm
Operation of this device above any of these parameters may cause permanent damage.
Typical Performance (3)
Parameter Units Typical
Frequency MHz 200 900 1900 2100
S21 dB 19.5 18.4 16.7 16.4
S11 dB -12 -19 -29 -25
S22 dB -20 -13 -10 -10
Output P1dB dBm +20.2 +20.1 +19 +18
Output IP3 (2) dBm +37.8 +39.8 +37.5 +36.9
Noise Figure dB 5.3 5.6 6.3 6.6
3. Listed typical performance parameters measured on evaluation board.
Ordering Information
Part No. Description
WJA1021 +5V Active Bias InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Package)
WJA1021-PCB 50 – 4000 MHz Fully Assembled Eval. Board
Standard tape / reel size = 1000 pieces on a 7” reel
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 2 of 4 April 2008
WJA1021
+5V Active-Bias InGaP HBT Gain Block
Typical Evaluation Board RF Performance
Supply Bias = +5V, Icc = 90 mA
Gain vs. Frequency
0
5
10
15
20
25
0 1000 2000 3000
Frequency (MHz)
Gain (dB)
-40C +25C +85C
Return Loss vs. Frequency
-35
-30
-25
-20
-15
-10
-5
0
0 1000 2000 3000 4000
Frequency (MHz)
S11, S22 (dB)
S11 S22
NF vs. Frequency
0
2
4
6
8
10
0 1000 2000 3000
Frequency (MHz)
NF (dB)
-40C +25C
OIP3 vs. Frequency
Pout = 3dBm/tone
25
30
35
40
45
0 500 1000 1500 2000
Frequency (MHz)
OIP3 (dBm)
-40C +25C +85C
P1dB vs. Frequency
12
14
16
18
20
22
0 1000 2000 3000
Frequency (MHz)
P1dB (dBm)
-40C +25C +85C
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 3 of 4 April 2008
WJA1021
+5V Active-Bias InGaP HBT Gain Block
Application Circuit
C1
Blocking
Capacitor
RF OUT
L1
RF Choke
C3
Bypass
Capacitor
R4
0
Ω
RF IN
C2
Blocking
Capacitor
Vcc =+5.00V
Icc = 90 mA
WJA1021
For optimal OIP3 performance, the ground plane to the left and right side around the backside paddle of the WJA1021 should be removed as shown in the above PCB layout.
.
Recommended Component Values (1)
Ref. Name Value / Type Size
L1 470 nH ferrite core wire wound inductor (2) 0805
C1, C2 1000 pF NPO chip capacitor 0603
C3 0.018 µF chip capacitor 0603
R4 0 Ω(3) 0603
C4, C5, C6,
R3, R5, R6,
R7, R8
Do Not Place (3)
1. The listed values are contained on the evaluation board to achieve optimal broadband performance
2. For lower cost and performance (500 – 2000 MHz) option use 39 nH ceramic core wire wound inductor.
3. Place holders for the 0Ω resistors and “Do Not Place” references are not needed for final design.
Typical Device Data
S-Parameters (Vdevice = +5 V, ICC = 90 mA, T = 25 °C, calibrated to device leads)
Freq (GHz) S11 (dB) S11(ang) S21 (dB) S21 (ang) S12(dB) S12 (ang) S22 (dB) S22 (ang)
10 -15.27 -76.97 22.78 168.92 -25.80 14.54 -10.81 -41.48
50 -13.47 -152.73 20.29 167.37 -23.38 5.70 -17.02 -114.67
100 -13.32 -167.56 19.92 167.89 -23.14 2.35 -18.91 -138.72
200 -13.32 -176.11 19.69 162.64 -23.15 -0.19 -19.27 -150.77
400 -12.94 178.15 19.56 149.53 -23.10 -3.54 -19.05 -153.38
600 -12.38 175.26 19.41 135.79 -23.07 -6.98 -18.22 -155.49
800 -12.32 168.40 19.13 122.10 -23.01 -10.41 -16.64 -155.88
1000 -12.56 158.65 18.92 108.57 -22.96 -12.83 -14.40 -155.90
1200 -12.94 146.78 18.58 94.17 -23.04 -16.41 -12.71 -156.76
1400 -12.96 137.52 18.24 81.46 -22.89 -20.13 -11.63 -159.26
1590 -13.24 130.56 17.96 68.23 -22.87 -23.01 -11.35 -165.00
1600 -13.26 130.42 17.95 67.69 -22.87 -22.74 -11.36 -165.60
1800 -14.12 124.89 17.61 54.09 -22.79 -25.91 -11.04 -173.55
2000 -16.59 115.57 17.26 40.63 -22.96 -29.81 -10.18 178.28
2200 -21.32 95.97 16.79 27.03 -22.94 -33.39 -8.81 171.50
2400 -29.00 44.53 16.18 13.53 -23.04 -36.47 -7.80 167.47
2600 -31.47 -55.07 15.66 0.14 -23.06 -39.44 -7.42 162.95
2800 -22.56 -119.27 15.05 -13.34 -23.06 -42.87 -7.44 157.56
3000 -16.22 -137.02 14.35 -27.33 -23.15 -46.10 -7.52 149.16
3200 -12.35 -143.92 13.50 -40.56 -23.27 -49.30 -7.26 140.55
3400 -10.00 -148.38 12.51 -53.24 -23.47 -51.83 -6.61 132.18
3600 -8.71 -155.84 11.58 -65.24 -23.53 -54.62 -5.87 127.43
3800 -7.94 -168.09 10.79 -76.83 -23.40 -57.36 -5.50 124.79
4000 -7.03 175.94 9.72 -89.13 -23.29 -61.41 -5.62 120.23
Device S-parameters are available for download from the website at: http://www.wj.com
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 4 of 4 April 2008
WJA1021
+5V Active-Bias InGaP HBT Gain Block
Mechanical Information
This package is Lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Product Marking
The WJA1021 will be marked with an “A1021”
designator with an alphanumeric lot code
marked below the part designator.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value: Passes ≥ 1000V min.
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value: Passes ≥ 1000V min.
Test: Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
A1021
XXXX
-
X