KIT ATION EVALU E L B A IL AVA 19-3605; Rev 0; 2/05 SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch Features The MAX9986 high-linearity downconversion mixer provides 10dB gain, +23.6dBm IIP3, and 9.3dB NF for 815MHz to 995MHz base-station receiver applications. With a 960MHz to 1180MHz LO frequency range, this particular mixer is ideal for high-side LO injection receiver architectures. Low-side LO injection is supported by the MAX9984, which is pin-for-pin and functionally compatible with the MAX9986. In addition to offering excellent linearity and noise performance, the MAX9986 also yields a high level of component integration. This device includes a double-balanced passive mixer core, an IF amplifier, a dual-input LO selectable switch, and an LO buffer. On-chip baluns are also integrated to allow for single-ended RF and LO inputs. The MAX9986 requires a nominal LO drive of 0dBm, and supply current is guaranteed to be below 265mA. The MAX9984/MAX9986 are pin compatible with the MAX9994/MAX9996 1700MHz to 2200MHz mixers, making this entire family of downconverters ideal for applications where a common PC board layout is used for both frequency bands. The MAX9986 is also functionally compatible with the MAX9993. The MAX9986 is available in a compact, 20-pin, thin QFN package (5mm x 5mm) with an exposed paddle. Electrical performance is guaranteed over the extended -40C to +85C temperature range. 815MHz to 995MHz RF Frequency Range 960MHz to 1180MHz LO Frequency Range (MAX9986) 570MHz to 850MHz LO Frequency Range (MAX9984) 50MHz to 250MHz IF Frequency Range 10dB Conversion Gain +23.6dBm Input IP3 +12dBm Input 1dB Compression Point 9.3dB Noise Figure 67dBc 2LO-2RF Spurious Rejection at PRF = -10dBm Integrated LO Buffer Integrated RF and LO Baluns for Single-Ended Inputs Low -3dBm to +3dBm LO Drive Built-In SPDT LO Switch with 49dB LO1 to LO2 Isolation and 50ns Switching Time Pin Compatible with MAX9994/MAX9996 1700MHz to 2200MHz Mixers Functionally Compatible with MAX9993 External Current-Setting Resistors Provide Option for Operating Mixer in Reduced Power/Reduced Performance Mode Lead-Free Package Available Applications 850MHz W-CDMA Base Stations GSM 850/GSM 900 2G and 2.5G EDGE Base Stations Ordering Information PART TEMP RANGE PIN-PACKAGE cdmaOneTM and cdma2000(R) Base Stations iDEN(R) Base Stations Predistortion Receivers MAX9986ETP -40C to +85C 20 Thin QFN-EP* T2055-3 5mm x 5mm MAX9986ETP-T -40C to +85C 20 Thin QFN-EP* T2055-3 5mm x 5mm MAX9986ETP+D -40C to +85C 20 Thin QFN-EP* T2055-3 5mm x 5mm MAX9986ETP+TD -40C to +85C 20 Thin QFN-EP* T2055-3 5mm x 5mm Fixed Broadband Wireless Access Wireless Local Loop Private Mobile Radios Military Systems Microwave Links Digital and Spread-Spectrum Communication Systems cdma2000 is a registered trademark of the Telecommunications Industry Association. cdmaOne is a trademark of CDMA Development Group. iDEN is a registered trademark of Motorola, Inc. PKG CODE *EP = Exposed paddle. + = Lead free. D = Dry pack. T = Tape-and-reel. Pin Configuration/Functional Diagram and Typical Application Circuit appear at end of data sheet. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. 1 MAX9986 General Description MAX9986 SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS VCC to GND ...........................................................-0.3V to +5.5V IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (VCC + 0.3V) TAP ........................................................................-0.3V to +1.4V LO1, LO2, LEXT to GND........................................-0.3V to +0.3V RF, LO1, LO2 Input Power .............................................+12dBm RF (RF is DC shorted to GND through a balun) .................50mA Continuous Power Dissipation (TA = +70C) 20-Pin Thin QFN-EP (derate 26.3mW/C above +70C)...........2.1W JA .................................................................................+38C/W JC .................................................................................+13C/W Operating Temperature Range (Note A) ....TC = -40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C Note A: TC is the temperature on the exposed paddle of the package. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (MAX9986 Typical Application Circuit, VCC = +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to VCC through inductive chokes, R1 = 953, R2 = 619, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, TC = +25C, unless otherwise noted.) PARAMETER SYMBOL Supply Voltage VCC Supply Current ICC LO_SEL Input-Logic Low VIL LO_SEL Input-Logic High VIH CONDITIONS MIN TYP MAX UNITS 4.75 5.00 5.25 V 222 265 mA 0.8 V 2 V AC ELECTRICAL CHARACTERISTICS (MAX9986 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 815MHz to 995MHz, fLO = 960MHz to 1180MHz, fIF = 160MHz, fLO > fRF, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 910MHz, fLO = 1070MHz, fIF = 160MHz, TC = +25C, unless otherwise noted.) (Note 1) PARAMETER RF Frequency Range LO Frequency Range SYMBOL fRF fLO CONDITIONS MIN TYP MAX UNITS MHz (Note 2) 815 995 (Note 2) 960 1180 MAX9984 570 850 IF Frequency Range fIF (Note 2) 50 Conversion Gain GC TC = +25C 9 250 10 11 MHz MHz dB Gain Variation Over Temperature TC = -40C to +85C -0.007 dB/C Conversion Gain Flatness Flatness over any one of three frequency bands: fRF = 824MHz to 849MHz fRF = 869MHz to 894MHz fRF = 880MHz to 915MHz 0.15 dB 12 dBm 23.6 dBm Input Compression Point Input Third-Order Intercept Point Input IP3 Variation Over Temperature 2 P1dB (Note 3) IIP3 Two tones: fRF1 = 910MHz, fRF2 = 911MHz, PRF = -5dBm/tone, fLO = 1070MHz, PLO = 0dBm, TA = +25C 21 TC = +25C to -40C -1.7 TC = +25C to +85C +1.0 _______________________________________________________________________________________ dB SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch (MAX9986 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50 sources, +3dBm, PRF = -5dBm, fRF = 815MHz to 995MHz, fLO = 960MHz to 1180MHz, fIF = 160MHz, fLO > fRF, TC = -40C otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 910MHz, fLO = 1070MHz, fIF +25C, unless otherwise noted.) (Note 1) PARAMETER Noise Figure SYMBOL NF CONDITIONS Single sideband, fIF = 190MHz fRF = 900MHz (no signal) fLO = 1090MHz fBLOCKER = 990MHz fIF = 190MHz (Note 4) Noise Figure Under-Blocking MIN PBLOCKER = +8dBm 2LO-2RF 3x3 3LO-3RF dB dB 24 0.3 dB 2 -3 2x2 UNITS 19 PBLOCKER = +11dBm LO Drive Spurious Response at IF MAX 9.3 PBLOCKER = PFUNDAMENTAL = -5dBm +8dBm fFUNDAMENTAL = 910MHz PBLOCKER = fBLOCKER = 911MHz +11dBm Small-Signal Compression Under-Blocking Condition TYP PLO = -3dBm to to +85C, unless = 160MHz, TC = +3 PRF = -10dBm 67 PRF = -5dBm 62 PRF = -10dBm 87 PRF = -5dBm 77 LO2 selected 42 49 LO1 selected 42 50 dBm dBc LO1 to LO2 Isolation PLO = +3dBm TC = +25C (Note 5) LO Leakage at RF Port PLO = +3dBm -47 dBm LO Leakage at IF Port PLO = +3dBm -30 dBm 46 dB 50 ns 20 dB RF-to-IF Isolation LO Switching Time 50% of LOSEL to IF settled to within 2 RF Port Return Loss LO1/2 port selected, LO2/1 and IF terminated 27 LO1/2 port unselected, LO2/1 and IF terminated 26 LO driven at 0dBm, RF terminated into 50, differential 200 22 LO Port Return Loss IF Port Return Loss dB dB dB Note 1: Note 2: Note 3: Note 4: All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit. Operation outside this range is possible, but with degraded performance of some parameters. Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm. Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 2021. Note 5: Guaranteed by design and characterization. _______________________________________________________________________________________ 3 MAX9986 AC ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (MAX9986 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 160MHz, unless otherwise noted.) 10 9 TC = +25C TC = +85C 8 10 PLO = -3dBm, 0dBm, +3dBm 9 7 740 790 840 890 940 990 1040 MAX9986 toc03 VCC = 4.75V, 5.0V, 5.25V 790 840 890 940 990 740 1040 790 840 RF FREQUENCY (MHz) INPUT IP3 vs. RF FREQUENCY INPUT IP3 vs. RF FREQUENCY 25 24 TC = +25C VCC = 4.75V 25 1040 24 INPUT IP3 (dBm) INPUT IP3 (dBm) 22 990 INPUT IP3 vs. RF FREQUENCY 24 23 940 26 MAX9986 toc05 TC = +85C 25 890 RF FREQUENCY (MHz) 26 MAX9986 toc04 26 TC = -25C 9 7 740 RF FREQUENCY (MHz) 21 10 8 8 7 INPUT IP3 (dBm) 11 CONVERSION GAIN (dB) 11 CONVERSION GAIN (dB) CONVERSION GAIN (dB) TC = -25C CONVERSION GAIN vs. RF FREQUENCY 12 MAX9986 toc02 MAX9986 toc01 TC = -40C 11 CONVERSION GAIN vs. RF FREQUENCY 12 MAX9986 toc06 CONVERSION GAIN vs. RF FREQUENCY 12 23 PLO = +3dBm, 0dBm, -3dBm 22 23 22 21 21 20 20 VCC = 5.25V VCC = 5.0V TC = -40C 19 19 19 840 890 940 990 1040 740 RF FREQUENCY (MHz) TC = +85C TC = +25C 940 990 1040 740 790 840 IF = 190MHz NOISE FIGURE (dB) 11 9 TC = -40C 890 940 990 1040 RF FREQUENCY (MHz) NOISE FIGURE vs. RF FREQUENCY 10 8 890 12 MAX9986 toc07 IF = 190MHz 11 840 RF FREQUENCY (MHz) NOISE FIGURE vs. RF FREQUENCY 12 790 NOISE FIGURE vs. RF FREQUENCY 12 10 IF = 190MHz 11 NOISE FIGURE (dB) 790 MAX9986 toc08 740 9 PLO = +3dBm, 0dBm, -3dBm 8 MAX9986 toc09 20 NOISE FIGURE (dB) MAX9986 SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch 10 9 VCC = 4.75V, 5.0V, 5.25V 8 TC = -25C 7 7 6 6 760 820 880 940 RF FREQUENCY (MHz) 4 7 1000 6 760 820 880 940 RF FREQUENCY (MHz) 1000 760 820 880 940 RF FREQUENCY (MHz) _______________________________________________________________________________________ 1000 SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch 2LO-2RF RESPONSE vs. RF FREQUENCY 60 TC = +25C 55 65 PLO = -3dBm 60 55 790 840 890 940 990 790 3LO-3RF RESPONSE vs. RF FREQUENCY TC = +25C 80 75 70 TC = -25C 65 940 990 1040 740 55 940 990 85 80 75 70 PLO = -3dBm, 0dBm, +3dBm 65 1040 PRF = -5dBm 790 840 890 940 990 TC = -25C 9 8 840 890 940 RF FREQUENCY (MHz) VCC = 4.75V, 5.0V, 5.25V 65 740 790 990 1040 890 940 990 1040 14 MAX9986 toc17 13 12 PLO = -3dBm, 0dBm, +3dBm 11 840 INPUT P1dB vs. RF FREQUENCY 10 VCC = 5.25V 13 12 11 VCC = 4.75V VCC = 5.0V 10 9 8 790 70 1040 9 740 75 RF FREQUENCY (MHz) 14 INPUT P1dB (dBm) TC = +85C 11 10 80 INPUT P1dB vs. RF FREQUENCY 12 TC = -40C 85 RF FREQUENCY (MHz) MAX9986 toc16 TC = +25C 1040 55 740 INPUT P1dB vs. RF FREQUENCY 13 990 60 RF FREQUENCY (MHz) 14 940 90 INPUT P1dB (dBm) 890 890 3LO-3RF RESPONSE vs. RF FREQUENCY 55 840 840 95 60 790 790 RF FREQUENCY (MHz) PRF = -5dBm 60 INPUT P1dB (dBm) 890 90 TC = -40C 740 VCC = 5.0V 3LO-3RF RESPONSE vs. RF FREQUENCY 3LO-3RF RESPONSE (dBc) 3LO-3RF RESPONSE (dBc) TC = +85C 840 95 MAX9986 toc13 PRF = -5dBm 90 85 VCC = 4.75V 55 RF FREQUENCY (MHz) RF FREQUENCY (MHz) 95 60 45 740 1040 3LO-3RF RESPONSE (dBc) 740 65 50 45 45 VCC = 5.25V 70 50 50 MAX9986 toc12 PLO = +3dBm 70 PRF = -5dBm MAX9986 toc15 TC = -40C, -25C PLO = 0dBm MAX9986 toc18 65 PRF = -5dBm MAX9986 toc14 2LO-2RF RESPONSE (dBc) 70 2LO-2RF RESPONSE (dBc) TC = +85C 2LO-2RF RESPONSE vs. RF FREQUENCY 75 2LO-2RF RESPONSE (dBc) MAX9986 toc10 PRF = -5dBm 75 MAX9986 toc11 2LO-2RF RESPONSE vs. RF FREQUENCY 75 8 740 790 840 890 940 RF FREQUENCY (MHz) 990 1040 740 790 840 890 940 990 1040 RF FREQUENCY (MHz) _______________________________________________________________________________________ 5 MAX9986 Typical Operating Characteristics (continued) (MAX9986 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 160MHz, unless otherwise noted.) Typical Operating Characteristics (continued) (MAX9986 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 160MHz, unless otherwise noted.) LO SWITCH ISOLATION vs. LO FREQUENCY 55 TC = -40C, -25C 50 45 TC = +85C 55 50 PLO = -3dBm, 0dBm, +3dBm 45 60 MAX9986 toc21 MAX9986 toc20 60 LO SWITCH ISOLATION (dB) MAX9986 toc19 LO SWITCH ISOLATION (dB) 60 LO SWITCH ISOLATION vs. LO FREQUENCY LO SWITCH ISOLATION (dB) LO SWITCH ISOLATION vs. LO FREQUENCY 55 50 VCC = 4.75V, 5.0V, 5.25V 45 TC = +25C 40 40 950 1000 1050 1100 1150 1000 1050 1100 1150 1200 900 1050 1100 1150 LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT vs. LO FREQUENCY -30 TC = +85C -20 -25 PLO = -3dBm -30 -35 1000 1050 1100 PLO = +3dBm 1150 1200 -15 -20 VCC = 5.25V -25 VCC = 5.0V -30 -35 TC = +25C VCC = 4.75V PLO = 0dBm -40 950 -40 900 950 1000 1050 1100 1150 1200 900 950 1000 1050 1100 1150 LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO LEAKAGE AT RF PORT vs. LO FREQUENCY TC = -40C, -25C -50 TC = +25C TC = +85C -60 -50 -60 950 1000 1050 1100 LO FREQUENCY (MHz) 1150 1200 1200 MAX9986 toc27 MAX9986 toc26 PLO = -3dBm, 0dBm, +3dBm -40 -30 LO LEAKAGE AT RF PORT (dBm) -40 -30 LO LEAKAGE AT RF PORT (dBm) MAX9986 toc25 -30 1200 MAX9986 toc24 -15 -10 LO LEAKAGE AT IF PORT (dBm) TC = -40C, -25C -10 MAX9986 toc23 MAX9986 toc22 -25 900 1000 LO LEAKAGE AT IF PORT vs. LO FREQUENCY -20 900 950 LO FREQUENCY (MHz) -40 6 950 LO FREQUENCY (MHz) -15 -35 40 900 LO FREQUENCY (MHz) -10 LO LEAKAGE AT IF PORT (dBm) 1200 LO LEAKAGE AT IF PORT (dBm) 900 LO LEAKAGE AT RF PORT (dBm) MAX9986 SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch VCC = 4.75V, 5.0V, 5.25V -40 -50 -60 900 950 1000 1050 1100 LO FREQUENCY (MHz) 1150 1200 900 950 1000 1050 1100 LO FREQUENCY (MHz) _______________________________________________________________________________________ 1150 1200 SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch RF-TO-IF ISOLATION vs. RF FREQUENCY 45 40 TC = -40C, -25C 35 45 PLO = +3dBm 40 35 30 790 840 890 940 990 1040 40 30 740 790 840 890 940 990 1040 740 790 840 890 940 990 RF FREQUENCY (MHz) RF FREQUENCY (MHz) RF PORT RETURN LOSS vs. RF FREQUENCY IF PORT RETURN LOSS vs. IF FREQUENCY LO SELECTED RETURN LOSS vs. LO FREQUENCY 15 20 25 30 35 10 15 20 25 30 VCC = 4.75V, 5.0V, 5.25V 35 40 860 920 980 1040 1100 50 100 150 RF FREQUENCY (MHz) 200 250 300 MAX9986 toc33 PLO = -3dBm PLO = 0dBm 40 700 350 800 240 VCC = 5.25V SUPPLY CURRENT (mA) 10 900 1000 1100 1200 1300 LO FREQUENCY (MHz) SUPPLY CURRENT vs. TEMPERATURE (TC) MAX9986 toc34 0 LO UNSELECTED RETURN LOSS (dB) 30 IF FREQUENCY (MHz) LO UNSELECTED RETURN LOSS vs. LO FREQUENCY PLO = -3dBm, 0dBm, +3dBm 20 PLO = +3dBm 20 50 40 800 10 30 MAX9986 toc35 PLO = -3dBm, 0dBm, +3dBm LO SELECTED RETURN LOSS (dB) IF PORT RETURN LOSS (dB) 5 1040 0 MAX9986 toc32 0 MAX9986 toc31 5 740 45 RF FREQUENCY (MHz) 0 10 50 35 30 740 RF PORT RETURN LOSS (dB) PLO = -3dBm 50 VCC = 4.75V, 5.0V, 5.25V 55 RF-TO-IF ISOLATION (dB) TC = +25C 50 PLO = 0dBm 55 60 MAX9986 toc29 TC = +85C RF-TO-IF ISOLATION (dB) 55 RF-TO-IF ISOLATION (dB) 60 MAX9986 toc28 60 RF-TO-IF ISOLATION vs. RF FREQUENCY MAX9986 toc30 RF-TO-IF ISOLATION vs. RF FREQUENCY 230 220 210 40 VCC = 4.75V 50 VCC = 5.0V 200 700 800 900 1000 1100 LO FREQUENCY (MHz) 1200 1300 -40 -15 10 35 60 85 TEMPERATURE (C) _______________________________________________________________________________________ 7 MAX9986 Typical Operating Characteristics (continued) (MAX9986 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 160MHz, unless otherwise noted.) SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch MAX9986 Pin Description PIN NAME FUNCTION Power-Supply Connection. Bypass each VCC pin to GND with capacitors as shown in the Typical Application Circuit. 1, 6, 8, 14 VCC 2 RF Single-Ended 50 RF Input. This port is internally matched and DC shorted to GND through a balun. Requires an external DC-blocking capacitor. 3 TAP Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the Typical Application Circuit. 4, 5, 10, 12, 13, 17 GND Ground 7 LOBIAS Bias Resistor for Internal LO Buffer. Connect a 619 1% resistor from LOBIAS to the power supply. 9 LOSEL Local Oscillator Select. Logic control input for selecting LO1 or LO2. 11 LO1 15 LO2 Local Oscillator Input 2. Drive LOSEL high to select LO2. 16 LEXT External Inductor Connection. Connect a low-ESR, 30nH inductor from LEXT to GND. This inductor carries approximately 140mA DC current. 18, 19 IF-, IF+ Differential IF Outputs. Each output requires external bias to VCC through an RF choke (see the Typical Application Circuit). 20 IFBIAS IF Bias Resistor Connection for IF Amplifier. Connect a 953 1% resistor from IFBIAS to GND. EP GND Local Oscillator Input 1. Drive LOSEL low to select LO1. Exposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias. Detailed Description The MAX9986 high-linearity downconversion mixer provides 10dB of conversion gain and +23.6dBm of IIP3, with a typical 9.3dB noise figure. The integrated baluns and matching circuitry allow for 50 singleended interfaces to the RF and the two LO ports. A single-pole, double-throw (SPDT) switch provides 50ns switching time between the two LO inputs with 49dB of LO-to-LO isolation. Furthermore, the integrated LO buffer provides a high drive level to the mixer core, reducing the LO drive required at the MAX9986's inputs to a -3dBm to +3dBm range. The IF port incorporates a differential output, which is ideal for providing enhanced IIP2 performance. Specifications are guaranteed over broad frequency ranges to allow for use in cellular band GSM, cdma2000, iDEN, and W-CDMA 2G/2.5G/3G base stations. The MAX9986 is specified to operate over a 815MHz to 995MHz RF frequency range, a 960MHz to 1180MHz LO frequency range, and a 50MHz to 250MHz IF frequency range. Operation beyond these ranges is possible; see the Typical Operating Characteristics for additional details. 8 RF Input and Balun The MAX9986 RF input is internally matched to 50, requiring no external matching components. A DCblocking capacitor is required because the input is internally DC shorted to ground through the on-chip balun. LO Inputs, Buffer, and Balun The MAX9986 is ideally suited for high-side LO injection applications with a 960MHz to 1180MHz LO frequency range. For a device with a 570MHz to 850MHz LO frequency range, refer to the MAX9984 data sheet. As an added feature, the MAX9986 includes an internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is switched in. LO switching time is typically less than 50ns, which is more than adequate for virtually all GSM applications. If frequency hopping is not employed, set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logic-high selects LO2, logic-low selects LO1. To avoid damage to the part, voltage must be applied to VCC before digital logic is applied to LOSEL. LO1 and LO2 inputs are internally matched to 50, requiring only a 82pF DCblocking capacitor. _______________________________________________________________________________________ SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch optimize the performance for a particular frequency band. Since approximately 140mA flows through this inductor, it is important to use a low-DCR wire-wound coil. If the LO-to-IF and RF-to-IF leakage are not critical parameters, the inductor can be replaced by a short circuit to ground. High-Linearity Mixer A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed pad MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lower level ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The MAX9986 Evaluation Kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com. The core of the MAX9986 is a double-balanced, highperformance passive mixer. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer. When combined with the integrated IF amplifiers, the cascaded IIP3, 2LO-2RF rejection, and NF performance is typically 23.6dBm, 67dBc, and 9.3dB, respectively. Differential IF Output Amplifier The MAX9986 mixer has a 50MHz to 250MHz IF frequency range. The differential, open-collector IF output ports require external pullup inductors to VCC. Note that these differential outputs are ideal for providing enhanced 2LO-2RF rejection performance. Singleended IF applications require a 4:1 balun to transform the 200 differential output impedance to a 50 singleended output. Applications Information Input and Output Matching The RF and LO inputs are internally matched to 50. No matching components are required. RF and LO inputs require only DC-blocking capacitors for interfacing. The IF output impedance is 200 (differential). For evaluation, an external low-loss 4:1 (impedance ratio) balun transforms this impedance down to a 50 singleended output (see the Typical Application Circuit). Bias Resistors Bias currents for the LO buffer and the IF amplifier are optimized by fine tuning resistors R1 and R2. If reduced current is required at the expense of performance, contact the factory for details. If the 1% bias resistor values are not readily available, substitute standard 5% values. Layout Considerations Power-Supply Bypassing Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin and TAP with the capacitors shown in the Typical Application Circuit; see Table 1. Place the TAP bypass capacitor to ground within 100 mils of the TAP pin. Exposed Pad RF/Thermal Considerations The exposed paddle (EP) of the MAX9986's 20-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the MAX9986 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a low-inductance path to electrical ground. The EP MUST be soldered to a ground plane on the PC board, either directly or through an array of plated via holes. Chip Information TRANSISTOR COUNT: 1017 PROCESS: SiGe BiCMOS LEXT Inductor LEXT serves to improve the LO-to-IF and RF-to-IF leakage. The inductance value can be adjusted by the user to _______________________________________________________________________________________ 9 MAX9986 A two-stage internal LO buffer allows a wide input power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +3dBm. The on-chip low-loss balun, along with an LO buffer, drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip. Table 1. Component List Referring to the Typical Application Circuit COMPONENT VALUE DESCRIPTION L1, L2 330nH Wire-wound high-Q inductors (0805) L3 30nH Wire-wound high-Q inductor (0603) Microwave capacitor (0603) C1 10pF C2, C4, C7, C8, C10, C11, C12 82pF Microwave capacitors (0603) C3, C5, C6, C9, C13, C14 0.01F Microwave capacitors (0603) C15 220pF Microwave capacitor (0402) R1 953 1% resistor (0603) R2 619 1% resistor (0603) R3 3.57 1% resistor (1206) T1 4:1 balun IF balun U1 MAX9986 Maxim IC IFBIAS IF+ IF- GND LEXT Pin Configuration/Functional Diagram 20 19 18 17 16 VCC 1 15 LO2 RF 2 MAX9986 14 VCC GND 5 11 LO1 6 7 8 9 10 GND 12 GND LOSEL GND 4 VCC 13 GND LOBIAS TAP 3 VCC MAX9986 SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch THIN QFN 10 ______________________________________________________________________________________ SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch VCC T1 3 IF OUTPUT 6 R3 L1 2 L2 C14 C3 C2 GND IF- IF+ 19 20 VCC 18 17 RF C5 TAP C4 GND 16 C12 1 15 C1 RF INPUT 4 L3 IFBIAS VCC 1 C15 R1 LEXT C13 MAX9986 2 14 3 13 4 12 LO2 LO2 INPUT VCC VCC C11 GND GND C10 5 11 LOSEL LOBIAS VCC 9 LO1 LO1 INPUT 10 GND 8 7 6 VCC GND R2 VCC C6 LOSEL INPUT C7 C8 VCC C9 ______________________________________________________________________________________ 11 MAX9986 Typical Application Circuit Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) QFN THIN.EPS MAX9986 SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch D2 D MARKING b C L 0.10 M C A B D2/2 D/2 k L XXXXX E/2 E2/2 C L (NE-1) X e E DETAIL A PIN # 1 I.D. E2 PIN # 1 I.D. 0.35x45 e/2 e (ND-1) X e DETAIL B e L1 L C L C L L L e e 0.10 C A C 0.08 C A1 A3 PACKAGE OUTLINE, 16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm 21-0140 -DRAWING NOT TO SCALE- COMMON DIMENSIONS A1 A3 b D E e k L L1 N ND NE JEDEC 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0 0.02 0.05 0 0.02 0.05 0.20 REF. 0.20 REF. 0.25 0.30 0.35 0.25 0.30 0.35 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 0.80 BSC. 0.65 BSC. 0.25 - 0.25 - 0 0.02 0.05 0 0.02 0.05 0.20 REF. 0.20 REF. 0.20 0.25 0.30 0.20 0.25 0.30 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 0.50 BSC. 0.50 BSC. - 0.25 0.25 - 0 0.02 0.05 0.20 REF. 0.15 0.20 0.25 4.90 5.00 5.10 4.90 5.00 5.10 0.40 BSC. 0.25 0.35 0.45 0.30 0.40 0.50 0.45 0.55 0.65 0.45 0.55 0.65 0.30 0.40 0.50 0.40 0.50 0.60 - 0.30 0.40 0.50 16 4 4 20 5 5 WHHB WHHC 1 2 EXPOSED PAD VARIATIONS PKG. 16L 5x5 20L 5x5 28L 5x5 32L 5x5 40L 5x5 SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. A H 28 7 7 WHHD-1 32 8 8 40 10 10 WHHD-2 ----- NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. D2 L E2 PKG. CODES MIN. NOM. MAX. T1655-1 T1655-2 T1655N-1 3.00 3.00 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.10 3.10 3.20 3.20 3.20 T2055-2 T2055-3 T2055-4 3.00 3.00 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.10 3.10 3.20 3.20 3.20 T2055-5 T2855-1 T2855-2 T2855-3 T2855-4 T2855-5 T2855-6 T2855-7 T2855-8 T2855N-1 T3255-2 T3255-3 T3255-4 T3255N-1 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 T4055-1 3.20 3.30 3.40 3.20 3.30 3.40 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 MIN. NOM. MAX. 0.15 ** ** ** ** ** ** 0.40 DOWN BONDS ALLOWED NO YES NO NO YES NO YES ** NO NO YES YES NO ** ** 0.40 ** ** ** ** ** NO YES YES NO NO YES NO NO ** YES ** ** ** ** ** SEE COMMON DIMENSIONS TABLE 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1, T2855-3, AND T2855-6. 10. WARPAGE SHALL NOT EXCEED 0.10 mm. 11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY. 12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY. 13. LEAD CENTERLINES TO BE AT TRUE POSITION AS DEFINED BY BASIC DIMENSION "e", 0.05. PACKAGE OUTLINE, 16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm 21-0140 -DRAWING NOT TO SCALE- H 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.