MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069B – FEBRUARY 1971 – REVISED SEPTEMBER 2002
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Short-Circuit Protection
D
Wide Common-Mode and Differential
Voltage Ranges
D
No Frequency Compensation Required
D
Low Power Consumption
D
No Latch-Up
D
Designed to Be Interchangeable With
Motorola MC1558/MC1458 and Signetics
S5558/N5558
description/ordering information
The MC1458 and MC1558 are dual
general-purpose operational amplifiers, with each
half electrically similar to the µA741, except that
offset null capability is not provided.
The high-common-mode input voltage range and
the absence of latch-up make these amplifiers
ideal for voltage-follower applications. The
devices are short-circuit protected and the
internal frequency compensation ensures stability
without external components.
ORDERING INFORMATION
TAVIOmax
AT 25°CPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP (P) Tube MC1458P MC1458P
0°Cto70°C
6mV
SOIC (D)
Tube MC1458D
MC1458
0°C
to
70°C
6
mV
SOIC
(D)
Tape and reel MC1458DR
MC1458
SOP (PS) Tape and reel MC1458PSR M1458
CDIP (JG) Tube MC1558JG MC1558JG
–55°C to 125°C5 mV CDIP (JGB) Tube MC1558JGB MC1558JGB
LCCC (FK) Tube MC1558FK MC1558FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Copyright 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
1
2
3
4
8
7
6
5
1OUT
1IN–
1IN+
VCC–
VCC+
2OUT
2IN–
2IN+
(TOP VIEW)
MC1458 . . . D, P, OR PS PACKAGE
MC1558 . . . JG PACKAGE
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
NC
2OUT
NC
2IN–
NC
NC
1IN–
NC
1IN+
NC
MC1558 . . . FK PACKAGE
NC
1OUT
NC
NC NC
NC
VNC
NC – No internal connection
CC+
V
2IN+
CC–
(TOP VIEW)
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069B – FEBRUARY 1971 – REVISED SEPTEMBER 2002
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
symbol (each amplifier)
–
+
IN+ OUT
IN–
schematic (each amplifier)
IN –
IN + OUT
VCC +
VCC –
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069B – FEBRUARY 1971 – REVISED SEPTEMBER 2002
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC+ (see Note 1): MC1458 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC1558 22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage, VCC– (see Note 1): MC1458 –18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC1558 –22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2) ±30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI (either input, see Notes 1 and 3) ±15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short circuit (see Note 4) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 5 and 6): D package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
P package 85°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
PS package 95°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJC (see Notes 7 and 8): FK package 5.61°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
JG package 14.5°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
Case temperature for 60 seconds: FK package 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: JG package 300°C. . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, P, or PS package 260°C. . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC–.
2. Differential voltages are at IN+ with respect to IN–.
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
4. The output can be shorted to ground or either power supply . For the MC1558 only , the unlimited duration of the short circuit applies
at (or below) 125°C case temperature or 70°C free-air temperature.
5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
7. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) – TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
8. The package thermal impedance is calculated in accordance with MIL-STD-883.
recommended operating conditions
MIN MAX UNIT
VCC±Supply voltage ±5±15 V
TA
O
p
erating free air tem
p
erature range
MC1458 0 70
°C
T
A
Operating
free
-
air
temperature
range
MC1558 –55 125
°C
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069B – FEBRUARY 1971 – REVISED SEPTEMBER 2002
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, VCC± = ±15 V
PARAMETER
MC1458 MC1558
UNIT
PARAMETER
MIN TYP MAX MIN TYP MAX
UNIT
VIO
In
p
ut offset voltage
VO=0
25°C 1 6 1 5
mV
V
IO
Input
offset
voltage
V
O =
0
Full range 7.5 6
mV
IIO
In
p
ut offset current
VO=0
25°C 20 200 20 200
nA
I
IO
Input
offset
current
V
O =
0
Full range 300 500
nA
IIB
In
p
ut bias current
VO=0
25°C 80 500 80 500
nA
I
IB
Input
bias
current
V
O =
0
Full range 800 1500
nA
VICR
Common-mode input 25°C±12 ±13 ±12 ±13
V
V
ICR voltage range Full range ±12 ±12
V
RL = 10 kΩ25°C±12 ±14 ±12 ±14
VOM
Maximum peak output RL ≥ 10 kΩFull range ±12 ±12
V
V
OM voltage swing RL = 2 kΩ25°C±10 ±13 ±10 ±13
V
RL≥ 2 kΩFull range ±10 ±10
AVD
Lar
g
e-si
g
nal differential
RL≥2kΩVO=±10 V
25°C 20 200 50 200
V/mV
A
VD
gg
voltage amplification
R
L
≥
2
kΩ
,
V
O =
±10
V
Full range 15 25
V/mV
BOM Maximum-output-swing
bandwidth
(closed loop)
RL = 2 kΩ,VO ≥ ±10 V,
AVD = 1, THD ≥ 5% 25°C 14 14 kHz
B1Unity-gain bandwidth 25°C 1 1 MHz
φmPhase margin AVD = 1 25°C 65 65 deg
Gain margin 25°C11 11 dB
riInput resistance 25°C 0.3 2 0.3* 2 MΩ
roOutput resistance VO = 0, See Note 9 25°C 75 75 Ω
CiInput capacitance 25°C 1.4 1.4 pF
zic Common-mode input
impedance f = 20 Hz 25°C 200 200 MΩ
CMRR
Common-mode V
IC
= V
ICR
min, 25°C 70 90 70 90
dB
CMRR
rejection ratio
IC ICR ,
VO = 0 Full range 70 70
dB
kSVS
Supply-voltage
sensitivity
V
CC
= ±9 V to ±15 V, 25°C 30 150 30 150
µV/V
k
SVS sens
iti
v
it
y
(∆VIO/∆VCC)
CC ,
VO = 0 Full range 150 150 µ
V/V
VnEquivalent input noise
voltage (closed loop) AVD = 100, RS = 0,
f = 1 kHz, BW = 1 Hz 25°C 45 45 nV/√Hz
IOS Short-circuit output
current 25°C±25 ±40 ±25 ±40 mA
ICC
Suppl
y
current
VO= 0 No load
25°C 3.4 5.6 3.4 5
mA
I
CC
y
(both amplifiers)
V
O =
0
,
No
load
Full range 6.6 6.6
mA
PD
Total power dissipation
VO= 0 No load
25°C 100 170 100 150
mW
P
D(both amplifiers)
V
O =
0
,
No
load
Full range 200 200
mW
VO1/VO2 Crosstalk attenuation 25°C 120 120 dB
*On products compliant to MIL-PRF-38535, this parameter is not production tested.
†All characteristics are specified under open-loop operating conditions with zero common-mode input voltage, unless otherwise specified. Full
range for MC1458 is 0°C to 70°C and for MC1558 is –55°C to 125°C.
NOTE 9: This typical value applies only at frequencies above a few hundred hertz because of the effect of drift and thermal feedback.
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069B – FEBRUARY 1971 – REVISED SEPTEMBER 2002
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
operating characteristics, VCC± = ±15 V, CL = 100 pF, TA = 25°C (see Figure 1)
PARAMETER
TEST CONDITIONS
MC1458 MC1558
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYP MAX MIN TYP MAX
UNIT
t
Rise time VI = 20 mV, RL = 2 kΩ, 0.3 0.3 µs
t
rOvershoot factor VI = 20 mV, RL = 2 kΩ5 5 %
SR Slew rate at unity gain VI = 10 V, RL = 2 kΩ0.5 0.5 V/µs
PARAMETER MEASUREMENT INFORMATION
+
–
VI
0 V
Input
Output
RL = 2 kΩ
CL = 100 pF
Test Circuit
Input Voltage
Waveform
Figure 1. Rise-Time, Overshoot, and Slew-Rate Waveform and Test Circuit
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarilyperformed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, maskwork right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or servicesare used. Information published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party underthe patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is anunfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice. TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreementspecifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding anyapplications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use anynon-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandInterface interface.ti.com Digital Control www.ti.com/digitalcontrolLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityLow Power www.ti.com/lpw Telephony www.ti.com/telephonyWireless
Video & Imaging www.ti.com/videoWireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
5962-9760301Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-9760301QPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
MC1458D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458DE4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458DRE4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458P ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
MC1458PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
MC1458PSR ACTIVE SO PS 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458PSRE4 ACTIVE SO PS 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458PSRG4 ACTIVE SO PS 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1558FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
MC1558JG ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
MC1558JGB ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
MC1558P OBSOLETE PDIP P 8 TBD Call TI Call TI
SN98212P OBSOLETE PDIP P 8 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
MC1458DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
MC1458DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
MC1458PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MC1458DR SOIC D 8 2500 346.0 346.0 29.0
MC1458DR SOIC D 8 2500 340.5 338.1 20.6
MC1458PSR SO PS 8 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
P (R-PDIP-T8) PLASTIC DUAL-IN-LINE
8
4
0.015 (0,38)
Gage Plane
0.325 (8,26)
0.300 (7,62)
0.010 (0,25) NOM
MAX
0.430 (10,92)
4040082/D 05/98
0.200 (5,08) MAX
0.125 (3,18) MIN
5
0.355 (9,02)
0.020 (0,51) MIN
0.070 (1,78) MAX
0.240 (6,10)
0.260 (6,60)
0.400 (10,60)
1
0.015 (0,38)
0.021 (0,53)
Seating Plane
M
0.010 (0,25)
0.100 (2,54)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
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