EVALUATION KIT AVAILABLE MAX2667/MAX2669 GPS/GNSS Ultra-Low-Noise-Figure LNAs General Description Features The MAX2667/MAX2669 high-gain, low-noise amplifiers (LNAs) are designed for GPS L1, Galileo, and GLONASS applications. Designed in Maxim's advanced SiGe process, the devices achieve a high gain and our lowest noise figure, while maximizing the input-referred 1dB compression point and the 3rd-order intercept point. S 19dB High-Power Gain (MAX2667) S Ultra-Low Noise Figure: 0.65dB S Integrated 50 Output Matching Circuit S Low 4.1mA Supply Current (MAX2667) S Wide 1.6V to 3.3V Supply Voltage Range The devices operate from a +1.6V to +3.3V single supply. The MAX2667 is optimized for low current. The MAX2669 is optimized for high linearity. The shutdown feature in the device reduces the supply current to be less than 10A. The devices are available in a very small, lead-free, RoHS-compliant, 0.86mm x 1.26mm x 0.65mm wafer-level package (WLP). S Low Bill of Materials: Two Inductors, Three Capacitors, and One Resistor S Small Footprint: 0.86mm x 1.26mm S Thin Profile: 0.65mm S 0.4mm-Pitch Wafer-Level Package (WLP) Ordering Information Applications Automotive Navigation PART Location-Enabled Mobile Devices Telematics (Asset Tracking and Management) Personal Navigation Devices (PNDs) TEMP RANGE PIN-PACKAGE MAX2667EWT+T -40C to +85C 6 WLP MAX2669EWT+T -40C to +85C 6 WLP +Denotes a lead(Pb)-free/RoHS-compliant package. T = Tape and reel. Cellular Phones with GPS Notebook PCs/Ultra-Mobile PCs Recreational, Marine Navigation Avionics Watches Typical Application Circuit SHDN + C3 MAX2667 MAX2669 A1 BIAS A2 RF INPUT L1 RF OUTPUT BIAS L2 C1 25k RFOUT VCC RFIN B1 B2 VCC C2 GNDAC L2 = 100nH C3 = 39pF C1 L1 = 6.2nH (MAX2667) C1 = 100nF (MAX2667) C2 = 39pF C2 GNDDC L1 = 3.3nH (MAX2669) C1 = 100nF (MAX2669) For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim's website at www.maximintegrated.com. 19-5518; Rev 1; 9/12 MAX2667/MAX2669 GPS/GNSS Ultra-Low-Noise-Figure LNAs ABSOLUTE MAXIMUM RATINGS VCC to GND_.........................................................-0.3V to +3.6V RFOUT and BIAS to GND_...... -0.3V to (Operating VCC + 0.3V) Maximum RF Input Power................................................ +5dBm Continuous Power Dissipation (TA = +70C) WLP (derates 10.5mW/C above +70C).....................840mW Maximum Current into RF Input..........................................10mA Operating Temperature Range........................... -40C to +85C Junction Temperature......................................................+150C Storage Temperature Range............................. -65C to +160C Soldering Temperature (reflow) (Note 1).........................+260C Note 1: Refer to Application Note 1891: Wafer-level packaging (WLP) and its applications. CAUTION! ESD SENSITIVE DEVICE Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 2) Junction-to-Ambient Thermal Resistance (qJA)...........95C/W Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. DC ELECTRICAL CHARACTERISTICS (MAX2667/MAX2669 EV kit. VCC = 1.6V to 3.3V, no RF signals are applied, TA = -40C to +85C. Typical values are at VCC = 2.85V and TA = +25C, unless otherwise noted.) (Note 2) PARAMETER CONDITIONS Supply Voltage Supply Current SHDN = high MIN TYP MAX UNITS 1.6 2.85 3.3 V MAX2667 4.1 MAX2669 7.7 Digital Input Logic-High Shutdown mode, SHDN = low TA = +25C Digital Input Logic-Low TA = +25C mA 10 1.2 FA V 0.45 V AC ELECTRICAL CHARACTERISTICS (MAX2667/MAX2669 EV kit. VCC = 1.6V to 3.3V, fRFIN = 1575.42MHz, TA = -40C to +85C. Typical values are at VCC = 2.85V and TA = +25C, unless otherwise noted.) (Note 2) PARAMETER RF Frequency CONDITIONS VCC = 2.85V Power Gain VCC = 1.6V Noise Figure 2 MIN L1 band TYP 1575.42 MAX2667 15.0 19.5 MAX2669 14.6 17.7 MAX2667 14.8 19.4 MAX2669 14.3 17.6 VCC = 1.8V 0.65 VCC = 3.3V 0.65 MAX UNITS MHz dB dB Maxim Integrated MAX2667/MAX2669 GPS/GNSS Ultra-Low-Noise-Figure LNAs AC ELECTRICAL CHARACTERISTICS (continued) (MAX2667/MAX2669 EV kit. VCC = 1.6V to 3.3V, fRFIN = 1575.42MHz, TA = -40C to +85C. Typical values are at VCC = 2.85V and TA = +25C, unless otherwise noted.) (Note 2) PARAMETER CONDITIONS In-Band 3rd-Order Input Intercept Point (Note 3) Out-of-Band 3rd-Order Input Intercept Point (Note 4) Input 1dB Compression Point (Note 5) MIN TYP MAX2667 -3.5 MAX2669 +4.5 MAX2667 +2.5 MAX2669 +8 MAX2667 -12.5 MAX2669 -10 MAX UNITS dBm dBm dBm Input Return Loss 10 dB Output Return Loss 15 dB Reverse Isolation 30 dB Note 2: M in and max limits guaranteed by test at TA = +25C and guaranteed by design and characterization at TA = -40C and TA = +85C. Note 3: Measured with the two tones located at 1MHz and 2MHz offset from the center of the GPS band with -30dBm/tone for MAX2667 and -27dBm/tone for MAX2669. Note 4: Measured with input tones at 1713MHz (-25dBm) and 1851MHz (-49dBm). Note 5: Measured with a tone located at 5MHz offset from the center of the GPS band. Maxim Integrated 3 MAX2667/MAX2669 GPS/GNSS Ultra-Low-Noise-Figure LNAs Typical Operating Characteristics (MAX2667/MAX2669 EV kit. Typical values are at VCC = 2.85V, fRFIN = 1575.42MHz, TA = +25C, unless otherwise noted.) MAX2669 MAX2667 20 MAX2669 -30 -20 MAX2667 |S12| (dB) -15 -25 10 5 -35 1500 MAX2667 -70 -10 1000 -50 -60 -5 500 -40 0 -30 2000 2500 1000 500 1500 2000 500 2500 1500 2500 2000 FREQUENCY (MHz) FREQUENCY (MHz) OUTPUT RETURN LOSS vs. FREQUENCY MAX2667 IN-BAND IIP3 vs. SUPPLY VOLTAGE AND TEMPERATURE (TWO TONES LOCATED AT 1MHz AND 2MHz OFFSET WITH -35dBm/TONE) MAX2669 IN-BAND IIP3 vs. SUPPLY VOLTAGE AND TEMPERATURE (TWO TONES LOCATED AT 1MHz AND 2MHz OFFSET WITH -30dBm/TONE) IIP3 (dBm) -10 MAX2669 -15 6 -2 -40NC -3 -40NC 4 +25NC +25NC 2 -4 -20 MAX2667 toc06 -1 IIP3 (dBm) MAX2667 8 MAX2667 toc05 0 MAX2667 toc04 -5 +85NC +85NC -5 -25 500 1000 1500 FREQUENCY (MHz) 4 1000 FREQUENCY (MHz) 0 |S22| (dB) MAX2669 15 GAIN (dB) |S11| (dB) -10 -20 MAX2667 toc02 MAX2667 toc01 -5 REVERSE ISOLATION vs. FREQUENCY GAIN vs. FREQUENCY 25 MAX2667 toc03 INPUT RETURN LOSS vs. FREQUENCY 0 2000 2500 1.6 1.8 2.0 2.2 2.4 2.6 SUPPLY VOLTAGE (V) 2.8 3.0 3.2 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 SUPPLY VOLTAGE (V) Maxim Integrated MAX2667/MAX2669 GPS/GNSS Ultra-Low-Noise-Figure LNAs Typical Operating Characteristics (continued) (MAX2667/MAX2669 EV kit. Typical values are at VCC = 2.85V, fRFIN = 1575.42MHz, TA = +25C, unless otherwise noted.) MAX2667 OUT-OF-BAND IIP3 vs. SUPPLY VOLTAGE AND TEMPERATURE (TONE 1 AT 1713MHz, -25dBm; TONE 2 AT 1851MHz, -49dBm) MAX2667 toc08 10 MAX2667 toc07 3 MAX2669 OUT-OF-BAND IIP3 vs. SUPPLY VOLTAGE AND TEMPERATURE (TONE 1 AT 1713MHz, -25dBm; TONE 2 AT 1851MHz, -49dBm) 9 +85NC 8 +25NC +85NC 1 IIP3 (dBm) IIP3 (dBm) 2 -40NC 7 +25NC 6 0 -40NC 5 4 -1 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 1.8 2.0 2.4 2.6 2.8 3.0 3.2 SUPPLY VOLTAGE (V) MAX2667 INPUT P1dB COMPRESSION vs. SUPPLY VOLTAGE AND TEMPERATURE MAX2669 INPUT P1dB COMPRESSION vs. SUPPLY VOLTAGE AND TEMPERATURE +85NC -14 +25NC -15 +85NC -10 INPUT P1dB (dBm) -13 -11 -12 +25NC -16 -13 -40NC -17 MAX2667 toc10 -9 MAX2667 toc09 -12 -40NC -18 -14 1.6 1.8 2.0 2.2 2.4 2.6 SUPPLY VOLTAGE (V) Maxim Integrated 2.2 SUPPLY VOLTAGE (V) -11 INPUT P1dB (dBm) 1.6 3.2 2.8 3.0 3.2 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 SUPPLY VOLTAGE (V) 5 MAX2667/MAX2669 GPS/GNSS Ultra-Low-Noise-Figure LNAs Bump Configuration TOP VIEW BUMP SIDE DOWN MAX2667/MAX2669 1 2 A BIAS RFOUT/ SHDN B RFIN VCC C GNDAC GNDDC + WLP Bump Description BUMP NAME FUNCTION A1 BIAS Provides Bias for LNA Input. Connect to B1 (RFIN) through a high-value inductor (100nH), and bypass to ground close to the pin. A2 RFOUT/SHDN RF Output and SHDN Logic Input. RFOUT is internally matched to 50I and has an internal DC-blocking capacitor. The SHDN logic requires an external 25k resistor to the logic control. B1 RFIN RF Input. Connect to A1 through bias choke, and connect matching network and DC-blocking capacitor. B2 VCC Supply Voltage. Bypass to ground with a capacitor close to the IC. C1 GNDAC Ground of the RF Path. Connect to the 2nd-layer PCB ground plane with a via next to the pin pad. C2 GNDDC Ground of Bias Circuit. Connect to the 2nd-layer PCB ground plane with a separate via from pin C1. Sharing a ground via with pin C1 might cause stability problems. Detailed Description The MAX2667/MAX2669 are LNAs designed for GPS L1, Galileo, and GLONASS applications. The devices feature a power-shutdown control mode to eliminate the need for an external supply switch. The devices achieve a high gain and an ultra-low noise figure. Input and Output Matching The devices require an off-chip input matching. Only an inductor in series with a DC-blocking capacitor is 6 needed to form the input matching circuit. The Typical Application Circuit shows the recommended inputmatching network. These values are optimized for the best simultaneous gain, noise figure, and return loss performance. Tables 1 and 2 list typical device S parameters and Kf values. The devices integrate an on-chip output matching to 50 at the output, eliminating the need for external matching components. The value of the input coupling capacitor affects IIP3. A smaller coupling capacitor results in lower IIP3. Maxim Integrated MAX2667/MAX2669 GPS/GNSS Ultra-Low-Noise-Figure LNAs Shutdown The devices include a shutdown feature to turn off the entire chip. A logic-high must be applied to the RFOUT/ (SHDN) pin using a 25k external resistor to place the part in active mode, and a logic-low to place the part in shutdown mode. Applications Information A properly designed PCB is essential to any RF microwave circuit. Use controlled-impedance lines on all high-frequency inputs and outputs. Bypass VCC with decoupling capacitors located close to the device. For long VCC lines, it may be necessary to add decoupling capacitors. Locate these additional capacitors further away from the device package. Proper grounding of the GND_ pins is essential. If the PCB uses a topside RF ground, connect it directly to the GND_ pins. For a board where the ground is not on the component layer, connect the GND_ pins to the board with multiple vias close to the package. Table 1. MAX2667 Typical Device S-Parameter Values and K-Factor FREQ. (MHz) S11 MAG (dB) S11 PHASE (Degrees) S21 MAG (dB) S21 PHASE (Degrees) S12 MAG (dB) S12 PHASE (Degrees) S22 MAG (dB) S22 PHASE (Degrees) Kf 1000 -2.0 -47.7 6.0 -100.0 -47.5 -148.0 -1.0 -55.0 5.1 1100 -2.1 -48.6 7.4 -100.6 -45.7 -150.0 -1.0 -58.1 3.8 1200 -2.2 -51.6 9.6 -107.3 -42.9 -153.5 -1.4 -65.4 3.1 1300 -2.4 -55.0 12.0 -117.2 -39.6 -160.2 -2.1 -74.1 2.5 1400 -2.7 -58.6 14.0 -129.5 -37.0 -168.5 -3.6 -85.5 2.3 1500 -6.5 -61.9 16.2 -146.5 -34.1 178.5 -7.4 -100.0 2.8 1575 -4.3 -62.3 17.1 -164.2 -32.9 162.8 -15.3 -100.8 2.1 1600 -4.6 -61.6 17.3 -170.6 -32.8 156.6 -20.6 -78.9 2.0 1700 -5.4 -55.3 17.1 165.5 -32.5 136.5 -9.5 10.0 1.8 1800 -5.2 -49.8 15.7 145.8 -33.8 121.6 -4.5 -2.4 1.6 1900 -4.8 -47.3 13.9 135.2 -35.2 113.8 -2.7 -13.2 1.6 2000 -4.5 -46.7 12.7 127.3 -36.7 109.6 -1.8 -21.2 1.5 Table 2. MAX2669 Typical Device S-Parameter Values and K-Factor FREQ. (MHz) S11 MAG (dB) S11 PHASE (Degrees) S21 MAG (dB) S21 PHASE (Degrees) S12 MAG (dB) S12 PHASE (Degrees) S22 MAG (dB) S22 PHASE (Degrees) Kf 1000 -3.0 -57.0 10.8 -120.0 -43.0 -154.0 -1.3 -65.0 3.2 1100 -3.3 -58.2 11.6 -124.5 -42.1 -155.0 -1.6 -70.2 3.3 1200 -3.5 -60.0 13.4 -134.6 -39.3 -160.5 -2.4 -79.6 2.8 1300 -3.8 -62.3 14.9 -148.0 -37.2 -168.3 -4.0 -90.0 2.7 1400 -4.3 -63.3 15.9 -162.3 -35.4 -178.2 -7.3 -101.0 2.7 1500 -4.9 -62.0 16.6 -178.9 -33.9 171.0 -14.5 -100.6 2.6 1575 -5.3 -59.7 16.6 168.0 -33.5 161.7 -19.6 -26.0 2.5 1600 -5.4 -58.5 16.5 163.9 -33.6 157.5 -16.7 -6.0 2.5 1700 -5.5 -53.7 15.8 149.3 -33.6 148.3 -9.0 3.6 2.3 1800 -5.3 -50.3 14.7 136.8 -34.2 142.5 -5.7 -2.8 2.2 1900 -5.1 -48.0 13.4 130.0 -35.1 139.6 -4.0 -9.6 2.3 2000 -4.9 -46.3 12.7 123.9 -35.8 138.6 -3.0 -15.0 2.1 Maxim Integrated 7 MAX2667/MAX2669 GPS/GNSS Ultra-Low-Noise-Figure LNAs Table 3. MAX2667 Typical Noise Parameters (VCC = 2.85V, TA = +25C) FREQUENCY (MHz) FMIN (dB) |GOPT| |GOPT| ANGLE 1550 0.54 0.48 39.9 RN (I) 8.43 1560 0.55 0.48 40.2 8.42 1570 0.55 0.48 40.5 8.41 1575 0.55 0.48 40.7 8.41 1580 0.55 0.48 40.9 8.40 1590 0.55 0.48 41.2 8.39 1600 0.55 0.48 41.5 8.38 Table 4. MAX2669 Typical Noise Parameters (VCC = 2.85V, TA = +25C) FREQUENCY (MHz) FMIN (dB) |GOPT| |GOPT| ANGLE 1550 0.57 0.29 76.1 4.53 1560 0.57 0.29 76.6 4.53 1570 0.57 0.29 77.0 4.53 1575 0.57 0.29 77.3 4.52 1580 0.57 0.29 77.5 4.52 1590 0.57 0.29 78.0 4.52 1600 0.57 0.29 78.5 4.52 Chip Information PROCESS: SiGe BiCMOS 8 RN (I) Package Information For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 6 WLP W61B1+1 21-0217 Refer to Application 1891 Maxim Integrated MAX2667/MAX2669 GPS/GNSS Ultra-Low-Noise-Figure LNAs Revision History REVISION NUMBER REVISION DATE 0 9/10 Initial release 1 9/12 Updated Bump Description, updated Shutdown section DESCRIPTION PAGES CHANGED -- 5, 6 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 (c) 2012 Maxim Integrated 9 The Maxim logo and Maxim Integrated are trademarks of Maxim Integrated Products, Inc. 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