© Semiconductor Components Industries, LLC, 2014
July, 2018 Rev. 18
1Publication Order Number:
MC33201/D
MC33201, MC33202,
MC33204, NCV33201,
NCV33202, NCV33204
Low Voltage, Rail-to-Rail
Operational Amplifiers
The MC33201/2/4 family of operational amplifiers provide
railtorail operation on both the input and output. The inputs can be
driven as high as 200 mV beyond the supply rails without phase
reversal on the outputs, and the output can swing within 50 mV of each
rail. This railtorail operation enables the user to make full use of the
supply voltage range available. It is designed to work at very low
supply voltages (±0.9 V) yet can operate with a supply of up to +12 V
and ground. Output current boosting techniques provide a high output
current capability while keeping the drain current of the amplifier to a
minimum. Also, the combination of low noise and distortion with a
high slew rate and drive capability make this an ideal amplifier for
audio applications.
Features
Low Voltage, Single Supply Operation
(+1.8 V and Ground to +12 V and Ground)
Input Voltage Range Includes both Supply Rails
Output Voltage Swings within 50 mV of both Rails
No Phase Reversal on the Output for Overdriven Input Signals
High Output Current (ISC = 80 mA, Typ)
Low Supply Current (ID = 0.9 mA, Typ)
600 W Output Drive Capability
Extended Operating Temperature Ranges
(40° to +105°C and 55° to +125°C)
Typical Gain Bandwidth Product = 2.2 MHz
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ100
Qualified and PPAP Capable
These Devices are PbFree and are RoHS Compliant
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
ORDERING INFORMATION
PDIP8
P, VP SUFFIX
CASE 626
8
1
SOIC8
D, VD SUFFIX
CASE 751
PDIP14
P, VP SUFFIX
CASE 646
14
1
SOIC14
D, VD SUFFIX
CASE 751A
14 1
TSSOP14
DTB SUFFIX
CASE 948G
14
1
Micro8]
DM SUFFIX
CASE 846A
8
1
See general marking information in the device marking
section on page 11 of this data sheet.
DEVICE MARKING INFORMATION
www.onsemi.com
1
8
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
2
PIN CONNECTIONS
6
7
8
5
3
2
1
4
NC
Inputs
VEE
NC
VCC
NC
Output
(Top View)
MC33201
All Case Styles
MC33202
All Case Styles
Output 1
Inputs 1
VEE
VCC
Output 2
Inputs 2
1
2
6
7
8
5
3
2
1
4
(Top View)
MC33204
All Case Styles
(Top View)
Output 1
Inputs 1
VCC
Output 4
Inputs 4
1
12
13
14
11
3
2
1
4
105
96
Output 2 87
Inputs 2 2
4
3
VEE
Inputs 3
Output 3
Vin- Vout
Figure 1. Circuit Schematic
(Each Amplifier)
VEE
VCC
VCC
VCC
VCC
Vin+
VEE This device contains 70 active transistors (each amplifier).
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
3
MAXIMUM RATINGS
Rating Symbol Value Unit
Supply Voltage (VCC to VEE) VS+13 V
Input Differential Voltage Range VIDR Note 1 V
Common Mode Input Voltage Range (Note 2) VCM VCC + 0.5 V to
VEE 0.5 V
V
Output Short Circuit Duration tsNote 3 sec
Maximum Junction Temperature TJ+150 °C
Storage Temperature Tstg 65 to +150 °C
Maximum Power Dissipation PDNote 3 mW
DC ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic VCC = 2.0 V VCC = 3.3 V VCC = 5.0 V Unit
Input Offset Voltage
VIO (max)
MC33201, NCV33201V
MC33202, NCV33202, V
MC33204, NCV33204, V
±8.0
±10
±12
±8.0
±10
±12
±6.0
±8.0
±10
mV
Output Voltage Swing
VOH (RL = 10 kW)
VOL (RL = 10 kW)
1.9
0.10
3.15
0.15
4.85
0.15
Vmin
Vmax
Power Supply Current
per Amplifier (ID)1.125 1.125 1.125
mA
Specifications at VCC = 3.3 V are guaranteed by the 2.0 V and 5.0 V tests. VEE = GND.
DC ELECTRICAL CHARACTERISTICS (VCC = + 5.0 V, VEE = Ground, TA = 25°C, unless otherwise noted.)
Characteristic Figure Symbol Min Typ Max Unit
Input Offset Voltage (VCM 0 V to 0.5 V, VCM 1.0 V to 5.0 V)
MC33201/NCV33201V: TA = + 25°C
MC33201: TA = 40° to +105°C
MC33201V/NCV33201V: TA = 55° to +125°C
MC33202/NCV33202, V: TA = + 25°C
MC33202/NCV33202: TA = 40° to +105°C
MC33202V/NCV33202V: TA = 55° to +125°C (Note 4)
MC33204/NCV33204V: TA = + 25°C
MC33204: TA = 40° to +105°C
MC33204V/NCV33204V: TA = 55° to +125°C (Note 4)
3VIO
6.0
9.0
13
8.0
11
14
10
13
17
mV
Input Offset Voltage Temperature Coefficient (RS = 50 W)
TA = 40° to +105°C
TA = 55° to +125°C
4DVIO/DT
2.0
2.0
mV/°C
Input Bias Current (VCM = 0 V to 0.5 V, VCM = 1.0 V to 5.0 V)
TA = + 25°C
TA = 40° to +105°C
TA = 55° to +125°C
5, 6 IIB
80
100
200
250
500
nA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The differential input voltage of each amplifier is limited by two internal parallel backtoback diodes. For additional differential input voltage
range, use current limiting resistors in series with the input pins.
2. The input common mode voltage range is limited by internal diodes connected from the inputs to both supply rails. Therefore, the voltage
on either input must not exceed either supply rail by more than 500 mV.
3. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded. (See Figure 2)
4. All NCV devices are qualified for Automotive use.
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
4
DC ELECTRICAL CHARACTERISTICS (cont.) (VCC = + 5.0 V, VEE = Ground, TA = 25°C, unless otherwise noted.)
Characteristic Figure Symbol Min Typ Max Unit
Input Offset Current (VCM = 0 V to 0.5 V, VCM = 1.0 V to 5.0 V)
TA = + 25°C
TA = 40° to +105°C
TA = 55° to +125°C
IIO
5.0
10
50
100
200
nA
Common Mode Input Voltage Range VICR VEE VCC V
Large Signal Voltage Gain (VCC = + 5.0 V, VEE = 5.0 V)
RL = 10 kW
RL = 600 W
7 AVOL
50
25
300
250
kV/V
Output Voltage Swing (VID = ±0.2 V)
RL = 10 kW
RL = 10 kW
RL = 600 W
RL = 600 W
8, 9, 10
VOH
VOL
VOH
VOL
4.85
4.75
4.95
0.05
4.85
0.15
0.15
0.25
V
Common Mode Rejection (Vin = 0 V to 5.0 V) 11 CMR 60 90 dB
Power Supply Rejection Ratio
VCC/VEE = 5.0 V/GND to 3.0 V/GND
12 PSRR
500 25
mV/V
Output Short Circuit Current (Source and Sink) 13, 14 ISC 50 80 mA
Power Supply Current per Amplifier (VO = 0 V)
TA = 40° to +105°C
TA = 55° to +125°C
15 ID
0.9
0.9
1.125
1.125
mA
AC ELECTRICAL CHARACTERISTICS (VCC = + 5.0 V, VEE = Ground, TA = 25°C, unless otherwise noted.)
Characteristic Figure Symbol Min Typ Max Unit
Slew Rate
(VS = ±2.5 V, VO = 2.0 V to + 2.0 V, RL = 2.0 kW, AV = +1.0)
16, 26 SR
0.5 1.0
V/ms
Gain Bandwidth Product (f = 100 kHz) 17 GBW 2.2 MHz
Gain Margin (RL = 600 W, CL = 0 pF) 20, 21, 22 AM12 dB
Phase Margin (RL = 600 W, CL = 0 pF) 20, 21, 22 OM65 Deg
Channel Separation (f = 1.0 Hz to 20 kHz, AV = 100) 23 CS 90 dB
Power Bandwidth (VO = 4.0 Vpp, RL = 600 W, THD 1 %) BWP28 kHz
Total Harmonic Distortion (RL = 600 W, VO = 1.0 Vpp, AV = 1.0)
f = 1.0 kHz
f = 10 kHz
24 THD
0.002
0.008
%
Open Loop Output Impedance
(VO = 0 V, f = 2.0 MHz, AV = 10)
ZO
100
W
Differential Input Resistance (VCM = 0 V) Rin 200 kW
Differential Input Capacitance (VCM = 0 V) Cin 8.0 pF
Equivalent Input Noise Voltage (RS = 100 W)
f = 10 Hz
f = 1.0 kHz
25 en
25
20
Hz
nV/
Equivalent Input Noise Current
f = 10 Hz
f = 1.0 kHz
25 in
0.8
0.2
pA/
Hz
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
5
300
260
220
180
TA, AMBIENT TEMPERATURE (°C)
100
140
PERCENTAGE OF AMPLIFIERS (%)
TCVIO, INPUT OFFSET VOLTAGE TEMPERATURE COEFFICIENT (mV/°C)
50
30
0
40
10
20
AVOL , OPEN LOOP VOLTAGE GAIN (kV/V)
Figure 2. Maximum Power Dissipation
versus Temperature
Figure 3. Input Offset Voltage Distribution
PERCENTAGE OF AMPLIFIERS (%)
40
35
VIO, INPUT OFFSET VOLTAGE (mV)
30
25
15
0
20
Figure 4. Input Offset Voltage
Temperature Coefficient Distribution
2500
2000
1000
500
0
TA, AMBIENT TEMPERATURE (°C)
Figure 5. Input Bias Current
versus Temperature
Figure 6. Input Bias Current
versus Common Mode Voltage
Figure 7. Open Loop Voltage Gain versus
Temperature
150
50
0
-50
VCM, INPUT COMMON MODE VOLTAGE (V)
1500
PD(max), MAXIMUM POWER DISSIPATION (mW)
200
160
120
80
TA, AMBIENT TEMPERATURE (°C)
0
IIB , INPUT BIAS CURRENT (nA)
40
5.0
10
VCC = +5.0 V
VEE = Gnd
VCM > 1.0 V
VCM = 0 V to 0.5 V
IIB , INPUT BIAS CURRENT (nA)
100
-100
-150
-200
-250 -55 -40 -25 0 25 70 85 125
-50 0 20 40 50-10 10 30-30-40 -20
-10 0 4.0 8.0 10-55 -40 -25 0 25 50 85 125
2.0 4.0
-2.0 2.0 6.0-6.0-8.0 -4.0
-55 -40 -25 0 25 70 85 125
0 6.0 8.0 10 12 105
8 and 14 Pin DIP Pkg
SO-14 Pkg
SOIC-8
Pkg
360 amplifiers tested from
3 (MC33204) wafer lots
VCC = +5.0 V
VEE = Gnd
TA = 25°C
DIP Package
360 amplifiers tested from
3 (MC33204) wafer lots
VCC = +5.0 V
VEE = Gnd
TA = 25°C
DIP Package
VCC = +5.0 V
VEE = Gnd
RL = 600 W
DVO = 0.5 V to 4.5 V
VCC = 12 V
VEE = Gnd
TA = 25°C
TSSOP-14 Pkg
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
6
VO, OUTPUT VOLTAGE (V )
pp VO, OUTPUT VOLTAGE (V )
pp
40
20
100
80
60
Vout, OUTPUT VOLTAGE (V)
0
f, FREQUENCY (Hz)
12
0
9.0
3.0
6.0
VCC = +6.0 V
VEE = -6.0 V
RL = 600 W
AV = +1.0
TA = 25°C
Figure 8. Output Voltage Swing
versus Supply Voltage
Figure 9. Output Saturation Voltage
versus Load Current
V
IL, LOAD CURRENT (mA)
VEE
Figure 10. Output Voltage
versus Frequency
12
10
6.0
2.0
0
VCC,VEE SUPPLY VOLTAGE (V)
Figure 11. Common Mode Rejection
versus Frequency
Figure 12. Power Supply Rejection
versus Frequency
Figure 13. Output Short Circuit Current
versus Output Voltage
120
80
60
f, FREQUENCY (Hz)
8.0
100
80
60
40
f, FREQUENCY (Hz)
0
CMR, COMMON MODE REJECTION (dB)
20
VCC = +6.0 V
VEE = -6.0 V
TA = -55° to +125°C
PSR, POWER SUPPLY REJECTION (dB)
100
40
20
0
VCC = +6.0 V
VEE = -6.0 V
TA = -55° to +125°C
VCC = +6.0 V
VEE = -6.0 V
TA = 25°C
4.0
SAT, OUTPUT SATURATION VOLTAGE (V)
TA = 25°C
TA = -55°C
PSR+
PSR-
ISC , OUTPUT SHORT CIRCUIT CURRENT (mA)
Source
Sink
VCC = +5.0 V
VEE = -5.0 V
TA = 125°C
TA = 125°C
TA = -55°C
TA = 25°C
10 100 1.0 k 10 k 100 k 1.0 M 0 1.0 2.0 3.0 4.0 5.0 6.0
1.0 k 100 k 1.0 M10 k
01520±1.0 ±2.0 105.0
10 100 1.0 k 10 k 100 k 1.0 M
±3.0 ±4.0 ±5.0 ±6.0
RL = 600 W
TA = 25°C
VCC
VCC - 0.2 V
VCC - 0.4 V
VEE + 0.4 V
VEE + 0.2 V
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
7
, EXCESS PHASE (DEGREES)
VCC, VEE, SUPPLY VOLTAGE (V)
ISC , OUTPUT SHORT CIRCUIT CURRENT (mA)SR, SLEW RATE (V/ s)μ
TA, AMBIENT TEMPERATURE (°C)
VCC = +2.5 V
VEE = -2.5 V
VO = ±2.0 V
Figure 14. Output Short Circuit Current
versus Temperature
Figure 15. Supply Current per Amplifier
versus Supply Voltage with No Load
I
Figure 16. Slew Rate
versus Temperature
TA, AMBIENT TEMPERATURE (°C)
Figure 17. Gain Bandwidth Product
versus Temperature
Figure 18. Voltage Gain and Phase
versus Frequency
Figure 19. Voltage Gain and Phase
versus Frequency
f, FREQUENCY (Hz)
GBW, GAIN BANDWIDTH PRODUCT (MHz)
A , OPEN LOOP VOLTAGE GAIN (dB)
VCC = +5.0 V
VEE = Gnd
CC , SUPPLY CURRENT PER AMPLIFIER (mA)
TA = 125°C
TA = -55°C
Source
Sink
TA = 25°C
+Slew Rate
-Slew Rate
TA, AMBIENT TEMPERATURE (°C)
VCC = +2.5 V
VEE = -2.5 V
f = 100 kHz
VOL
, EXCESS PHASE (DEGREES)
f, FREQUENCY (Hz)
O
O
70
50
30
10
-10
-30
2.0
0
1.5
0.5
1.0
2.0
1.6
0
150
125
75
25
0
70
50
30
100
4.0
3.0
2.0
0
1.0
10
-10
-30
50
1.2
0.8
0.4
±1.0 ±2.0 ±3.0 ±4.0 ±5.0 ±6.0
10 k 100 k 1.0 M 10 M
-55 -40 -25 25 70 1250 85 105 ±0
-55 -40 -25 25 70 1250 85 105 -55 -40 -25 25 70 1250 85 105
10 k 100 k 1.0 M 10 M
240
40
80
120
160
200
40
80
120
160
200
240
A , OPEN LOOP VOLTAGE GAIN (dB)
VOL
1A - Phase, CL = 0 pF
1B - Gain, CL = 0 pF
2A - Phase, CL = 300 pF
2B - Gain, CL = 300 pF
1A - Phase, VS = ±6.0 V
1B - Gain, VS = ±6.0 V
2A - Phase, VS = ±1.0 V
2B - Gain, VS = ±1.0 V
VS = ±6.0 V
TA = 25°C
RL = 600 W
CL = 0 pF
TA = 25°C
RL = 600 W
1A
2A
2B
1B
1A
2A
2B
1B
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
8
M, PHASE MARGIN (DEGREES)
i , INPUT REFERRED NOISE CURRENT (pA/ Hz)
n
50
40
30
e , EQUIVALENT INPUT NOISE VOLTAGE (nV/ Hz)
20
10
0
n
RT, DIFFERENTIAL SOURCE RESISTANCE (W)
CL, CAPACITIVE LOAD (pF)
80
0
70
40
Figure 20. Gain and Phase Margin
versus Temperature
Figure 21. Gain and Phase Margin
versus Differential Source Resistance
75
60
0
Figure 22. Gain and Phase Margin
versus Capacitive Load
70
60
40
10
0
TA, AMBIENT TEMPERATURE (°C)
Figure 23. Channel Separation
versus Frequency
Figure 24. Total Harmonic Distortion
versus Frequency
Figure 25. Equivalent Input Noise Voltage
and Current versus Frequency
10
1.0
0.1
f, FREQUENCY (Hz)
50
150
90
60
0
CS, CHANNEL SEPARATION (dB)
30
THD, TOTAL HARMONIC DISTORTION (%)
0.01
0.001
20
45
30
15
Phase Margin
Gain Margin
f, FREQUENCY (Hz)
f, FREQUENCY (Hz)
M, PHASE MARGIN (DEGREES)
30
AM, GAIN MARGIN (dB)
AM, GAIN MARGIN (dB)
60
10
20
30
50
AM, GAIN MARGIN (dB)
AV = 10
120
AV = 100
AV = 10
AV = 1.0
AV = 100
M, PHASE MARGIN (DEGREES) O
O
O
100 1.0 k 10 k 100 k
10 100 1.0 k 100 k
-55 -40 -25 25 70 1250 85 105 10
10 100 1.0 k 100 1.0 k 10 k
10 100 10 k 100 k10 k 1.0 k
5.0
4.0
3.0
2.0
1.0
0
70
60
40
10
0
50
20
30
75
60
0
45
30
15
16
0
14
8.0
12
2.0
4.0
6.0
10
VCC = +6.0 V
VEE = -6.0 V
RL = 600 W
CL = 100 pF
VCC = +6.0 V
VEE = -6.0 V
TA = 25°C
Phase Margin
Phase Margin
Gain Margin
VCC = +6.0 V
VEE = -6.0 V
RL = 600 W
AV = 100
TA = 25°C
Gain Margin
VCC = +6.0 V
VEE = -6.0 V
VO = 8.0 Vpp
TA = 25°C
VCC = +5.0 V
TA = 25°C
VO = 2.0 Vpp
VEE = -5.0 V
RL = 600 WVCC = +6.0 V
VEE = -6.0 V
TA = 25°C
Noise Voltage
Noise Current
AV = 1000
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
9
DETAILED OPERATING DESCRIPTION
General Information
The MC33201/2/4 family of operational amplifiers are
unique in their ability to swing railtorail on both the input
and the output with a completely bipolar design. This offers
low noise, high output current capability and a wide
common mode input voltage range even with low supply
voltages. Operation is guaranteed over an extended
temperature range and at supply voltages of 2.0 V, 3.3 V and
5.0 V and ground.
Since the common mode input voltage range extends from
VCC to VEE, it can be operated with either single or split
voltage supplies. The MC33201/2/4 are guaranteed not to
latch or phase reverse over the entire common mode range,
however, the inputs should not be allowed to exceed
maximum ratings.
Circuit Information
Railtorail performance is achieved at the input of the
amplifiers by using parallel NPNPNP differential input
stages. When the inputs are within 800 mV of the negative
rail, the PNP stage is on. When the inputs are more than 800
mV greater than VEE, the NPN stage is on. This switching of
input pairs will cause a reversal of input bias currents (see
Figure 6). Also, slight differences in offset voltage may be
noted between the NPN and PNP pairs. Crosscoupling
techniques have been used to keep this change to a minimum.
In addition to its railtorail performance, the output stage
is current boosted to provide 80 mA of output current,
enabling the op amp to drive 600 W loads. Because of this
high output current capability, care should be taken not to
exceed the 150°C maximum junction temperature.
O, OUTPUT VOLTAGE (50 mV/DIV)V
t, TIME (10 ms/DIV)
Figure 26. Noninverting Amplifier Slew Rate Figure 27. Small Signal Transient Response
t, TIME (5.0 ms/DIV)
Figure 28. Large Signal Transient Response
VCC = +6.0 V
VEE = -6.0 V
RL = 600 W
CL = 100 pF
TA = 25°C
O, OUTPUT VOLTAGE (2.0 mV/DIV)
VCC = +6.0 V
VEE = -6.0 V
RL = 600 W
CL = 100 pF
AV = 1.0
TA = 25°C
V
VCC = +6.0 V
VEE = -6.0 V
RL = 600 W
CL = 100 pF
TA = 25°C
t, TIME (10 ms/DIV)
O, OUTPUT VOLTAGE (2.0 V/DIV)V
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will selfalign when subjected to a
solder reflow process.
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
10
ORDERING INFORMATION
Operational
Amplifier Function
Device Operating
Temperature Range
Package Shipping
Single
MC33201DG
TA= 40° to +105°C
SOIC8
(PbFree)
98 Units / Rail
MC33201DR2G 2500 / Tape & Reel
MC33201VDG
TA = 55° to 125°C
98 Units / Rail
MC33201VDR2G 2500 / Tape & Reel
NCV33201VDR2G 2500 / Tape & Reel
Dual
MC33202DG
TA= 40 ° to +105°C
SOIC8
(PbFree)
98 Units / Rail
MC33202DR2G 2500 / Tape & Reel
MC33202DMR2G Micro8
(PbFree) 4000 / Tape & Reel
NCV33202DMR2G*
MC33202VDG
TA = 55° to 125°C
SOIC8
(PbFree)
98 Units / Rail
MC33202VDR2G
2500 / Tape & Reel
NCV33202VDR2G*
Quad
MC33204DG
TA= 40 ° to +105°C
SO14
(PbFree)
55 Units / Rail
MC33204DR2G 2500 Units / Tape & Reel
MC33204DTBG TSSOP14
(PbFree)
96 Units / Rail
MC33204DTBR2G 2500 Units / Tape & Reel
MC33204VDG
TA = 55° to 125°C
SO14
(PbFree)
55 Units / Rail
MC33204VDR2G
2500 Units / Tape & Reel
NCV33204DR2G*
NCV33204DTBR2G* TSSOP14
(PbFree) 2500 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP
Capable.
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
11
SOIC8
D SUFFIX
CASE 751
PDIP8
P SUFFIX
CASE 626
SOIC8
VD SUFFIX
CASE 751
x = 1 or 2
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = PbFree Package
G= PbFree Package
(Note: Microdot may be in either location)
PDIP8
VP SUFFIX
CASE 626
SO14
D SUFFIX
CASE 751A
TSSOP14
DTB SUFFIX
CASE 948G
PDIP14
P SUFFIX
CASE 646
SO14
VD SUFFIX
CASE 751A
PDIP14
VP SUFFIX
CASE 646
MARKING DIAGRAMS
Micro8
DM SUFFIX
CASE 846A
1
8
MC3320xP
AWL
YYWWG
1
8
MC33202VP
AWL
YYWWG
1
14
MC33204DG
AWLYWW
1
14
MC33204VDG
AWLYWW
1
14
MC33204P
AWLYYWWG
1
14
MC33204VP
AWLYYWWG
1
14
MC33
204
ALYWG
G
*
*This marking diagram applies to NCV3320xV
**This marking diagram applies to NCV33202DMR2G
*
*
3320x
ALYW
G
1
8
320xV
ALYW
G
1
8
3202
AYWG
G
1
8
1
14
MC33
204V
ALYWG
G
**
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
12
PACKAGE DIMENSIONS
PDIP8
P, VP SUFFIX
CASE 62605
ISSUE N
14
58
b2
NOTE 8
D
b
L
A1
A
eB
E
A
TOP VIEW
C
SEATING
PLANE
0.010 CA
SIDE VIEW
END VIEW
END VIEW
WITH LEADS CONSTRAINED
DIM MIN MAX
INCHES
A−−−− 0.210
A1 0.015 −−−−
b0.014 0.022
C0.008 0.014
D0.355 0.400
D1 0.005 −−−−
e0.100 BSC
E0.300 0.325
M−−−− 10
−−− 5.33
0.38 −−−
0.35 0.56
0.20 0.36
9.02 10.16
0.13 −−−
2.54 BSC
7.62 8.26
−−− 10
MIN MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1 0.240 0.280 6.10 7.11
b2
eB −−−− 0.430 −−− 10.92
0.060 TYP 1.52 TYP
E1
M
8X
c
D1
B
A2 0.115 0.195 2.92 4.95
L0.115 0.150 2.92 3.81
°°
H
NOTE 5
e
e/2 A2
NOTE 3
MBMNOTE 6
M
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
13
PACKAGE DIMENSIONS
SOIC8 NB
CASE 75107
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45 _
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
14
PACKAGE DIMENSIONS
Micro8
DM SUFFIX
CASE 846A02
ISSUE H
8X 8X
6X ǒmm
inchesǓ
SCALE 8:1
1.04
0.041
0.38
0.015
5.28
0.208
4.24
0.167
3.20
0.126
0.65
0.0256
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
S
B
M
0.08 (0.003) A S
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
b
e
PIN 1 ID
8 PL
0.038 (0.0015)
T
SEATING
PLANE
A
A1 cL
DIM
A
MIN NOM MAX MIN
MILLIMETERS
−− −− 1.10 −−
INCHES
A1 0.05 0.08 0.15 0.002
b0.25 0.33 0.40 0.010
c0.13 0.18 0.23 0.005
D2.90 3.00 3.10 0.114
E2.90 3.00 3.10 0.114
e0.65 BSC
L0.40 0.55 0.70 0.016
−− 0.043
0.003 0.006
0.013 0.016
0.007 0.009
0.118 0.122
0.118 0.122
0.026 BSC
0.021 0.028
NOM MAX
4.75 4.90 5.05 0.187 0.193 0.199
HE
HE
DD
E
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
15
PACKAGE DIMENSIONS
PDIP14
CASE 64606
ISSUE R
17
14 8
b2
NOTE 8
DA
TOP VIEW
E1
B
b
L
A1
A
C
SEATING
PLANE
0.010 CA
SIDE VIEW M
14X
D1
e
A2
NOTE 3
MBM
eB
E
END VIEW
END VIEW
WITH LEADS CONSTRAINED
DIM MIN MAX
INCHES
A−−−− 0.210
A1 0.015 −−−−
b0.014 0.022
C0.008 0.014
D0.735 0.775
D1 0.005 −−−−
e0.100 BSC
E0.300 0.325
M−−−− 10
−−− 5.33
0.38 −−−
0.35 0.56
0.20 0.36
18.67 19.69
0.13 −−−
2.54 BSC
7.62 8.26
−−− 10
MIN MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1 0.240 0.280 6.10 7.11
b2
eB −−−− 0.430 −−− 10.92
0.060 TYP 1.52 TYP
c
A2 0.115 0.195 2.92 4.95
L0.115 0.150 2.92 3.81
°°
H
NOTE 5
NOTE 6
M
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
16
PACKAGE DIMENSIONS
SOIC14
CASE 751A03
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
H
14 8
71
M
0.25 B M
C
h
X 45
SEATING
PLANE
A1
A
M
_
S
A
M
0.25 B S
C
b
13X
B
A
E
D
e
DETAIL A
L
A3
DETAIL A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
D8.55 8.75 0.337 0.344
E3.80 4.00 0.150 0.157
A1.35 1.75 0.054 0.068
b0.35 0.49 0.014 0.019
L0.40 1.25 0.016 0.049
e1.27 BSC 0.050 BSC
A3 0.19 0.25 0.008 0.010
A1 0.10 0.25 0.004 0.010
M0 7 0 7
H5.80 6.20 0.228 0.244
h0.25 0.50 0.010 0.019
__ __
6.50
14X
0.58
14X
1.18
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
www.onsemi.com
17
PACKAGE DIMENSIONS
TSSOP14
CASE 948G
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
LU
SEATING
PLANE
0.10 (0.004)
T
ÇÇÇ
ÇÇÇ
ÇÇÇ
SECTION NN
DETAIL E
JJ1
K
K1
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
W
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
V
14X REFK
N
N
7.06
14X
0.36 14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
MC33201/D
Micro8 is a trademark of International Rectifier.
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative