LM5072
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LM5072 Integrated 100V Power Over Ethernet PD Interface and PWM Controller with Aux
Support
Check for Samples: LM5072
1FEATURES DESCRIPTION
The LM5072 Powered Device (PD) interface and
2• PD Interface Pulse-Width-Modulation (PWM) controller provides a
– Fully Compliant IEEE 802.3af PD Interface complete power solution, fully compliant to IEEE
– Versatile Auxiliary Power Options 802.3af, for the PD connecting into Power over
Ethernet (PoE) networks. This controller integrates all
– 9V Minimum Auxiliary Power Operating functions necessary to implement both a PD powered
Range interface and DC-DC converter with a minimum
– 100V Maximum Input Voltage Rating number of external components. The LM5072
– Programmable DC Current Limit Up To provides the flexibility for the PD to also accept power
800mA from auxiliary sources such as AC adapters in a
variety of configurations. The low RDS(ON) PD
– 100V, 0.7ΩHot Swap MOSFET interface hot swap MOSFET and programmable DC
– Integrated PD Signature Resistor current limit extend the range of LM5072 applications
– Integrated PoE Input UVLO up to twice the power level of 802.3af compliant PD
devices. The 100V maximum voltage rating simplifies
– Programmable Inrush Current Limit selection of the transient voltage suppressor that
– PD Classification Capability protects the PD from network transients. The LM5072
– Power Good Indicator includes an easy-to-use PWM controller that
facilitates the various single-ended power supply
– Thermal Shutdown Protection topologies including the flyback, forward and buck.
• PWM Controller The PWM control scheme is based on peak current
– Current Mode PWM Controller mode control, which provides inherent advantages
including line feed-forward, cycle-by-cycle current
– 100V Start-Up Regulator limit, and simplified feedback loop compensation.
– Error Amplifier with 2% Voltage Reference Two versions of the LM5072 provide either an 80%
– Supports Isolated and Non-Isolated maximum duty cycle (-80 suffix), or a 50% maximum
Applications duty cycle (-50 suffix).
– Programmable Oscillator Frequency PACKAGES
– Programmable Soft-Start • TSSOP-16 EP (Exposed Pad)
– 800 mA Peak Gate Driver
– 80% Maximum Duty Cycle with Built-in
Slope Compensation (-80 Device)
– 50% Maximum Duty Cycle, No Slope
Compensation (-50 Device)
APPLICATIONS
• IEEE 802.3af Compliant PoE Powered Devices
• Non-Compliant, Application Specific Devices
• Higher Power Ethernet Powered Devices
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2006–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
VIN
RCLASS
VEE VCC
OUT
RT
FB
CS
COMP
RAUX
SS
RTN
ARTN
nPGOOD
LM5072
ICL_FAUX
DCCL
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VIN
RAUX
VEE
OUT
RT
CS
FB
COMP
SS
RTN
ARTN
DCCL
RCLASS
nPGOOD
VCC
+PoE
+FAUX
-FAUX
-PoE
LM5072
+VOUT
ICL_FAUX
LM5072
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Simplified Application Diagram
Connection Diagram
Figure 1. 16 Lead TSSOP-EP
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PIN DESCRIPTIONS
Pin Number Name Description
1 RT PWM controller oscillator frequency programming pin.
2 SS Soft-start programming pin.
3 VIN Positive supply pin for the PD interface and the internal PWM controller start-up regulator.
4 RCLASS PD classification programming pin.
5 ICL_FAUX Inrush current limit programming pin; also the front auxiliary power enable pin.
6 DCCL PD interface DC current limit programming pin.
7 VEE Negative supply pin for PD interface; connected to PoE and/or front auxiliary power return path.
8 RTN PWM controller power return; connected to the drain of the internal PD interface hot swap
MOSFET; should be externally connected to the reference ground of the PWM controller.
9 OUT PWM controller gate driver output pin.
10 VCC PWM controller start-up regulator output pin.
11 nPGOOD PD interface Power Good indicator and delay timer pin; active low state indicates PoE interface is in
normal operation.
12 CS PWM controller current sense input pin.
13 RAUX Rear auxiliary power enable pin; can be programmed for auxiliary power dominance over PoE
power.
14 FB PWM controller voltage feedback pin and inverting input of the internal error amplifier; connect to
ARTN to disable the error amplifier in isolated dc-dc converter applications.
15 COMP Output of the internal error amplifier and control input to the PWM comparator. In isolated
applications, COMP is controlled by the secondary side error amplifier via an opto-coupler.
16 ARTN PWM controller reference ground pin; should be shorted externally to the RTN pin as a single point
ground connection to improve noise immunity.
EP Exposed metal pad on the underside of the device. It is recommended to connect this pad to a PC
Board plane connected to the VEE pin to improve heat dissipation.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings(1)(2)
VIN , RTN to VEE(3) -0.3V to 100V
RAUX to ARTN -0.3V to 100V
ICL_FAUX to VEE -0.3V to 100V
DCCL, RCLASS to VEE -0.3V to 7V
nPGOOD to ARTN -0.3V to 16V
ARTN to RTN -0.3V to 0.3V
VCC, OUT to ARTN -0.3V to 16V
CS, FB, RT to ARTN -0.3V to 7V
COMP, SS to ARTN -0.3V to 5.5V
ESD Rating Human Body Model(4) 2000V
Lead Soldering Wave (4 seconds) 260°C
Temp.(5) Infrared (10 seconds) 240°C
Vapor Phase (75 seconds) 219°C
Storage Temperature -55°C to 150°C
Junction Temperature 150°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) During rear auxiliary operation, the RTN pin can be approximately -0.4V with respect to VEE. This is caused by normal internal bias
currents, and will not harm the device. Application of external voltage or current must not cause the absolute maximum rating to be
exceeded.
(4) The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin.
(5) For detailed information on soldering the plastic TSSOP package, refer to the Packaging Databook available from Texas Instruments.
Operating Ratings
VIN voltage 9V to 70V
External voltage applied to VCC 8V to 15V
Operating Junction Temperature -40°C to 125°C
Electrical Characteristics(1)
Specifications in standard type face are for TJ= +25°C and those in boldface type apply over the full operating junction
temperature range. Unless otherwise specified: VIN = 48V, FOSC = 250kHz.
Symbol Parameter Conditions Min Typ Max Units
Detection and Classification
VIN Signature Startup Voltage 1.5 V
Signature Resistance 23.25 24.5 26 kΩ
Signature Resistor Disengage/ VIN Rising 11.0 12.0 12.6 V
Classification Engage
Hysteresis 1.9 V
Classification Current Turn Off VIN Rising 22 23.5 25 V
Classification Voltage 1.213 1.25 1.287 V
Supply Current During Classification VIN = 17V 0.7 1.1 mA
Line Under Voltage Lock-Out
UVLO Release VIN Rising 36 38.5 40 V
UVLO Lock out VIN Falling 29.5 31.0 32.5 V
UVLO Hysteresis 6V
UVLO Filter 300 µs
(1) Minimum and Maximum limits are ensured through test, design, or statistical correlation using Statistical Quality Control (SQC) methods.
Typical values represent the most likely parametric norm at TJ= 25°C, and are provided for reference purpose only. Limits are used to
calculate Texas Instruments' Average Outgoing Quality Level (AOQL).
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Electrical Characteristics(1) (continued)
Specifications in standard type face are for TJ= +25°C and those in boldface type apply over the full operating junction
temperature range. Unless otherwise specified: VIN = 48V, FOSC = 250kHz.
Symbol Parameter Conditions Min Typ Max Units
Power Good
VDS Required for Power Good Status 1.3 1.5 1.7 V
VDS Hysteresis of Power Good Status 0.8 1.0 1.2 V
VGS Required for Power Good Status 4.5 5.5 6.5 V
Default Delay Time of Loss-of Power Good 30 µs
Status
nPGOOD current Source 45 55 65 µA
nPGOOD Pull Down Resistance 130 250 Ω
nPGOOD Threshold 2.3 2.5 2.7 V
Hot Swap
RDS(ON) Hot Swap MOSFET Resistance 0.7 1.2 Ω
Hot Swap MOSFET Leakage 110 µA
Default Inrush Current Limit VDS = 4.0V 120 150 180 mA
Default DC Current Limit VDS = 4.0V 380 440 510 mA
Front Auxiliary DC Current Limit VDS = 4.0V 470 540 610 mA
Inrush Current Limit Programming Accuracy VDS = 4.0V -15 15 %
DC Current Limit Programming Accuracy VDS = 4.0V -12 12 %
Auxiliary Power Option
ICL_FAUX Threshold ICL_FAUX Pin Rising 8.1 8.7 9.3 V
ICL_FAUX Pull Down Current 50 µA
RAUX Lower Threshold (I = 22 µA) RAUX Pin Rising 2.3 2.5 3.0 V
RAUX Lower Threshold Hysteresis 0.8 V
RAUX Upper Threshold (I = 250 µA) RAUX Pin Rising 5.4 6.0 6.9 V
RAUX Lower Threshold Current 16 22 28 µA
RAUX Upper Threshold Current 187 250 313 µA
VCC Regulator
VccReg VCC Regulation (VccReg) 7.4 7.7 8V
VCC Current Limit 15 mA
VCC UVLO (Rising) VccReg VccReg mV
– 210 – 100 mV
mV
VCC UVLO (Falling) 5.9 6.2 6.5 V
VIN Supply Current VCC = 10V 2.0 mA
Supply Current (Icc) VCC = 10V 3mA
VCC Regulator Dropout VIN – VCC(2) 6.5 V
Error Amplifier
Gain Bandwidth 3 MHz
DC Gain 67 dB
Input Voltage 1.225 1.275 V
COMP Sink Capability 510 mA
Current Limit
ILIM Delay to Output 30 ns
Cycle by Cycle Current Limit Threshold 0.45 0.5 0.55 V
Voltage
Leading Edge Blanking Time 65 ns
CS Sink Impedance (clocked) 35 55 Ω
(2) The VCC regulator is intended for use solely as a bias supply for the LM5072, dropout assumes 3mA of external VCC current.
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Electrical Characteristics(1) (continued)
Specifications in standard type face are for TJ= +25°C and those in boldface type apply over the full operating junction
temperature range. Unless otherwise specified: VIN = 48V, FOSC = 250kHz.
Symbol Parameter Conditions Min Typ Max Units
Soft-start
Soft-start Current Source 810 12 µA
Oscillator
Frequency1 (RT= 26.1 kΩ)175 200 225 KHz
Frequency2 (RT= 8.7 kΩ)515 580 645 KHz
Sync threshold 2.6 3.2 3.8 V
PWM Comparator
Delay to Output 25 ns
Min Duty Cycle 0%
Max Duty Cycle (-80 Device) 75 80 85 %
Max Duty Cycle (-50 Device) 47 50 53 %
COMP to PWM Comparator Gain 0.33
COMP Open Circuit Voltage 4.3 5.2 6.1 V
COMP Short Circuit Current 0.6 1.0 1.4 mA
Slope Compensation (LM5072-80 Device Only)
Slope Comp Amplitude 70 90 110 mV
Output Section
Output High Saturation 0.25 0.75 V
Output Low Saturation 0.25 0.75 V
trRise time CLOAD = 1nF 18 ns
tfFall time CLOAD = 1nF 15 ns
PDI Thermal Shutdown(3)
Thermal Shutdown Temp. 165 °C
Thermal Shutdown Hysteresis 25 °C
Thermal Resistance
θJA Junction to Ambient PWP package 40 °C/W
(3) Device thermal limitations may limit usable range.
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-40 -20 0 20 40 60 80 100 120
TEMPERATURE (ºC)
PROGRAMMED DC CURRENT LIMIT (mA)
350
355
360
365
370
375
380
385
390
395
400
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (ºC)
OSCILLATOR FREQUENCY (kHz)
250
252
254
256
258
260
262
264
CURRENT LIMIT (mA)
15 25 35 45 55 65 75 85 115
PROGRAMMING RESISTANCE (k:)
95 105
100
200
300
400
500
600
700
800
CURRENT LIMIT (mA)
15 25 35 45 55 65 75 85 115
PROGRAMMING RESISTANCE (k:)
95 105
100
200
300
400
500
600
700
800
UVLO THRESHOLD (V)
30.0
30.5
31.0
31.5
32.0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (ºC)
DC CURRENT LIMIT (mA)
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (ºC)
425
430
435
440
445
450
455
460
465
470
475
LM5072
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Typical Performance Characteristics
UVLO Threshold vs Temperature Default Current Limit vs Temperature
Figure 2. Figure 3.
Inrush Current Limit vs ICL_FAUX Resistor DC Current Limit vs DCCL Resistor
Figure 4. Figure 5.
Programmed DC Current Limit vs Temperature Oscillator Frequency vs Temperature
Figure 6. Figure 7.
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-40 -20 0 20 40 60 80 100 120
TEMPERATURE (ºC)
MAX DUTY CYCLE (%)
78
79
80
81
82
83
84
SOFTSTART CURRENT (PA)
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (ºC)
10.0
10.1
10.2
10.3
10.4
10.5
010 20 30 40 50 60
VIN (V)
IIN (mA)
0.00E+00
5.00E-01
1.00E+00
1.50E+00
2.00E+00
2.50E+00
3.00E+00
5 15 25 35 45 55 65 75 85 95 105
0
100
200
300
400
500
600
700
800
900
1000
OSCILLATOR FREQUENCY (kHz)
RT RESISTANCE (k:)
E/A REFERENCE VOLTAGE (V)
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (ºC)
1.2250
1.2350
1.2450
1.2550
1.2650
1.2750
LM5072
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Typical Performance Characteristics (continued)
Oscillator Frequency vs RT Resistance Error Amplifier Reference Voltage vs Temperature
Figure 8. Figure 9.
VCC vs ICC Input Current vs Input Voltage
Figure 10. Figure 11.
Maximum Duty Cycle vs Temperature Soft-start Current vs Temperature
Figure 12. Figure 13.
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3
VIN
7
VEE
4
RCLASS
8RTN
PWM Controller
2SS
16 ARTN
9OUT
10 VCC
Gate
Controller
EN
+
-
+
-
+
-
+
-
5
+
-
+
-
6
DCCL
+
-
UVLO
+
-
+
-
S
R
Q
+
-
1RT
12 CS
15 COMP
14 FB
+
-
11 nPGOOD
13 RAUX
+
-
Auxiliary
Controller
signature
VCC
Hot Swap
MOSFET
EN
5V
1.5V
ICL_FAUX
24.5 k:
50 PA
50 PA
p o dg o
.
25V
V2.4
2.0V
1 25. V
1 25. V
thermal_limit
1 25. V
1 25. V
1 .02 V
.
25V
.
25V
Threshold VIN =25V
Threshold VIN=38V
VIN Hysteresis=6V
1 25. V
front_aux
Disable
5V_PDI
Disable_PDI
LM5072
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Specialized Block Diagrams
Figure 14. Top Level Block Diagram
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CS
LOGIC
OUT
DRIVER
PWM
SS to Error
Amplifier
CLK
SS
(
Q
Q
SET
S
R
CURRENT
LIMIT
OSC RT
1
FB
Slope
Compensation
Generator
0
SS
ARTN
COMP
current sense 16
12
9
2
15
14 50k
100k
1.4V
5k
V1.25
2k
0.5V
5V
45PA
Slope
Compensation
disabled for
-50 Device
10 PA
CLR
CLK + LEB
65ns blanking
50% MAX
80% MAX
-DUTY LIMIT ( 50)
-)
DUTY LIMIT 80
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Figure 15. PWM Controller Block Diagram
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DESCRIPTION OF OPERATION AND APPLICATIONS INFORMATION
The LM5072 integrates a fully IEEE 802.3af compliant PD interface and PWM controller in a single integrated
circuit, providing a complete and low cost power solution for devices that connect to PoE systems. The
implementation requires a minimal number of external components.
The LM5072’s Hot Swap PD interface provides four major advantages:
1. An input voltage rating up to 100V that allows greater flexibility when selecting a transient surge suppressor
to protect the PD from voltage transients encountered in PoE applications.
2. The integration of the PD signature resistor and other functions including programmable inrush current limit,
input voltage under-voltage lock-out (UVLO), PD classification, and thermal shutdown simplifies PD
implementation.
3. The PD interface and PWM controller accept power from auxiliary sources including AC adapters and solar
cells in various configurations and over a wide range of input voltages. Auxiliary power input can be
programmed to be dominant over PoE power.
4. DC current limit is programmable and adjustable to support PoE applications requiring input currents up to
700 mA.
The LM5072 includes an easy to use PWM controller based on the peak current mode control technique. Current
mode control provides inherent advantages such as line voltage feed-forward, cycle-by-cycle current limit, and
simplified closed-loop compensation. The controller’s PWM gate driver is capable of sourcing and sinking peak
currents of 800 mA to directly drive the power MOSFET switch of the DC-DC converter. The PWM controller also
contains a high gain, high bandwidth error amplifier, a high voltage startup bias regulator, a programmable
oscillator for a switching frequency between 50 kHz to 500 kHz, a bias supply (VCC) under-voltage lock-out
circuit, and a programmable soft-start circuit. These features greatly simplify the design and implementation of
single ended topologies like the flyback, forward and buck.
The LM5072 is available in two versions, the LM5072-50 and LM5072-80. As indicated in the suffix of the part
number, the maximum duty cycle of each device is limited to 50% and 80%, respectively. Internal PWM controller
slope compensation is provided in the LM5072-80 version.
Modes of Operation
Per the IEEE 802.3af specification, when a PD is connected to a PoE system it transitions through several
operating modes in sequence including detection, classification (optional), turn on, normal operation, and power
removal. Each operating mode corresponds to a specific PoE voltage range fed through the Ethernet cable.
Figure 16 shows the IEEE 802.3af specified sequence of operating modes and the corresponding PD input
voltages.
Current steering diode-bridges are required for the PD interface to accept all allowable connections and polarities
of PoE voltage from the RJ-45 connector (see the example application circuits in Figure 31,Figure 32,Figure 33
and Figure 34). The bridge will cause some reduction of the input voltage sensed by the LM5072. To ensure full
compliance to the specification in all operating modes, the LM5072 takes into account the voltage drop across
the bridge diodes and responds appropriately to the voltage received from the PoE cable. Table 1 presents the
response in each operating mode to voltages across the VIN and VEE pins.
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VEE
+
-
12V
LM5072
3
7
VIN
24.5k
PoE Line
Input
PoE Line
Return
2.7V
10V
14.5V
Voltage
Discovery Classification
Classification
Time
42V
30V
Full Power Application Power Removal
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Figure 16. Sequence of PoE Operating Modes
Table 1. Operating Modes With Respect To Input Voltage
Mode of Operation Voltage from PoE Cable per LM5072 Input Voltage
IEEE 802.3af (VIN pin to VEE pin)
Detection (Signature) 2.7V to 10.0V 1.5V to 10.0V
Classification 14.5V to 20.5V 12V to 23.5V
Startup 42V max 38V (UVLO Release, VIN Rising)
Normal Operation 57V to 36V 70V to 32V (UVLO, VIN Falling)
Detection Signature
During detection mode, a PD must present a signature resistance between 23.75 kΩand 26.25 kΩto the PoE
power sourcing equipment. This signature impedance distinguishes the PD from non-PoE capable equipment to
protect the latter from being accidentally damaged by inadvertent application of PoE voltage levels. To simplify
the circuit implementation, the LM5072 integrates the 24.5 kΩsignature resistor, as shown in Figure 17.
Figure 17. Detection Circuit With Integrated PD Signature Resistor
During detection mode, the voltage across the VIN and VEE pins is less than 10V. Once signature mode is
complete, the LM5072 will disengage the signature resistor to reduce power loss in all other modes.
Classification
Classification is an optional feature of the IEEE802.3af specification. It is primarily used to identify the power
requirements of a particular PD device. This feature will allow the PSE to allocate the appropriate available
power to each device on the network. Classification is performed by measuring the current flowing into the PD
during this mode. IEEE 802.3af specifies five power classes, each corresponding to a unique range of
classification current, as presented in Table 2. The LM5072 simplifies the classification implementation by
requiring a single external resistor connected between the RCLASS and VEE pins to program the classification
current. The resistor value required for each class is also given in Table 2.
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3
VIN
4
RCLASS EN
+
-
7
+
-
Threshold
VEE
to UVLO
PoE Line
Input
PoE Line
Return
VIN = 23.5V
LM5072
RCLASS
1.25V
1.25V
front_aux
rear_aux
thermal_limit
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Table 2. Classification Levels and Required External Resistor Value
Class PD Max Power Level ICLASS Range LM5072
RCLASS Value
From To From To
0 (Default) 0.44W 12.95W 0 mA 4 mA Open
1 0.44W 3.84W 9 mA 12 mA 130Ω
2 3.84W 6.49W 17 mA 20 mA 71.5Ω
3 6.49W 12.95W 26 mA 30 mA 46.4Ω
4 Reserved Reserved 36 mA 44 mA 31.6Ω
Figure 18. PD Classification – Fulfilled With a Single External Resistor
Figure 18 shows the LM5072’s implementation of PD classification using an external resistor connected to the
RCLASS pin. During classification, the voltage across the VIN and VEE pins is between 13V and 23.5V. In this
voltage range, the class resistor RCLASS is engaged by enabling the 1.25V buffer amplifier and MOSFET. After
classification is complete, the voltage from the PSE will increase to the normal operating voltage of the PoE
system (48V nominal). When VIN rises above 23.5V, the LM5072 will disengage the RCLASS resistor to reduce
on-chip power dissipation.
The classification feature is disabled when either the front or rear auxiliary power options are selected, as the
classification function is not required when power is supplied from an auxiliary source. The classification function
is also disabled when the LM5072 reaches the thermal shutdown temperature threshold (nominally 165°C). This
may occur if the LM5072 is operated at elevated ambient temperatures and the classification time exceeds the
IEEE802.3af limit of 75 ms.
When the classification option is not required, simply leave the RCLASS pin open to set the PD to the default
Class 0 state. Class 0 requires that the PSE allocate the maximum IEEE802.3af specified power of 15.4 W
(12.95 W at the PD input terminals) to the PD.
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VIN
7
VEE
Gate
Controller
To Signature
and Startup Regulator
+
-
UVLO VIN Threshold =38V
Hysteresis = 7V
To Classification
PoE Line
Input
PoE Line
Return
3
1.25V
LM5072
Converter
Return
To DC/DC
Hot Swap
MOSFET
front_aux
thermal_limit
EN
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Undervoltage Lockout (UVLO)
The LM5072’s internal preset UVLO circuit continuously monitors the PoE input voltage between the VIN and
VEE pins. When the VIN voltage rises above 38V nominal, the UVLO circuit will release the hot swap MOSFET
and initiate the startup inrush sequence. When the VIN voltage falls below 31V nominal during normal operating
mode, the LM5072 disables the PD by shutting off the hot swap MOSFET.
Figure 19. Preset Input UVLO Function
Figure 19 illustrates the block diagram of the LM5072 UVLO circuit. This function requires no external
components. The UVLO signal can be over-ridden by the front auxiliary power option (see details in the RAUX
Option section) to allow the hot swap MOSFET of the LM5072 to pass power from front auxiliary power sources
at voltage levels below the PoE operating voltage. In the rear auxiliary power application (see RAUX Option
section), the auxiliary power source bypasses the hot swap MOSFET and is applied directly to the input of the
DC-DC converter. The UVLO function does not need to be over-ridden in this configuration.
The PD can draw a maximum current of 400 mA during standard 802.3af PoE operation. This current will cause
a voltage drop of up to 8V over a 100m long Ethernet cable. The PD front-end current steering diode bridges
may introduce an additional 2V drop. In order to ensure successful startup at the minimum PoE voltage of 42V,
and to continue operation at the minimum requirement of 36V as specified by IEEE 802.3af, these voltage drops
must be taken into account. Therefore, the LM5072 UVLO thresholds have been set to 38V on the rising edge of
VIN, and 31V on the falling edge of VIN. The 7V nominal hysteresis of the UVLO function, in addition to the
inrush current limit (discussed in the next section), prevents false starts and chattering during startup.
Inrush Current Limit Programming
According to IEEE 802.3af, the input capacitance of the PD power supply must be at least 5 µF (between the
VIN and RTN pins). Considering the capacitor tolerance and the effects of voltage and temperature, a nominal
capacitor value of at least 10 µF is recommended to ensure 5 µF minimum under all conditions. A greater
amount of capacitance may be needed to filter the input ripple of the DC-DC converter. The input capacitors
remain discharged during detection and classification modes of the PD interface. The hot swap MOSFET is
turned on after the VIN minus VEE voltage difference rises above the UVLO release threshold of 38V nominal.
When enabled, the hot swap MOSFET delivers a regulated inrush current to charge the input capacitors of the
DC-DC converter. To prevent excessive inrush current, the LM5072 will turn on the hot swap MOSFET in a
constant current mode. The default, pre-programmed inrush current of 150 mA can be selected by simply leaving
the ICL_FAUX pin open.
14 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM5072
VEE
+
-
to dc current limit
LM5072
6
7
DCCL
1.25V
RDCCL
RDCCL(k:) = x 127.5 k:
IDC (mA)
100 mA
VEE
+
-
to inrush current limit
LM5072
5
7
50 PA
to FAUX
1.25V
ICL_FAUX
RICL
RICL(k:) = 100 mA
IINRUSH (mA) x 127.5 k:
LM5072
www.ti.com
SNVS437D –MARCH 2006–REVISED APRIL 2013
To adjust the capacitor charging time for a particular application requirement, the inrush limit can be programmed
to any value between 150 and 400 mA with an external resistor (RICL) between the ICL_FAUX and VEE pins, as
shown in Figure 20. The relationship between the RICL value and the desired inrush current limit IINRUSH satisfies
the following equation:
(1)
Figure 20. Input Inrush Limit Programming via RICL
The inrush current causes a voltage drop along the PoE Ethernet cable (20Ωmaximum) that reduces the input
voltage sensed by the LM5072. To avoid erratic turn-on (hiccups), IINRUSH should be programmed such that the
input voltage drop due to cable resistance does not exceed the VIN-UVLO hysteresis (6V minimum).
DC Current Limit Programming
The LM5072 provides a default DC current limit of 440 mA nominal. This default limit can be selected by leaving
the DCCL pin open.
The LM5072 allows the DC current limit to be programmed within the range from 150 mA to 800 mA. Figure 21
shows the method to program the DC current limit with an external resistor, RDCCL. The relationship between the
RDCCL value and the desired DC current limit IDC satisfies the following equation:
(2)
Figure 21. Input DC Current Limit Programming via RDCCL
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LM5072
+
-
11
10 VCC
nPGOOD
16
PWM
DISABLE
LED to indicate
ARTN
50PA"Powered from PoE"
LM5072
130:
PGOOD
2.5V CPGOOD
RLED
LM5072
SNVS437D –MARCH 2006–REVISED APRIL 2013
www.ti.com
The maximum recommended DC current limit is 800 mA. While thermal analysis should be a standard part of the
module development process, it may warrant additional attention if the DC current limit is programmed to values
in excess of 400 mA. This analysis should include evaluations of the dissipation capability of LM5072 package,
heat sinking properties of the PC Board, ambient temperature, and other heat dissipation factors of the operating
environment.
Power Good and Regulator Startup
The Power Good status indicates that the circuit is ready for PWM controller startup to occur. It is established
when the input capacitors are fully charged through the hot swap MOSFET. Since the hot swap MOSFET is in
series with the input capacitors of the DC-DC converter, its drain-to-source voltage decreases as the charging
occurs. Power Good is indicated when the following two conditions are met: the MOSFET drain-to-source voltage
drops below 1.5V (with 1V hysteresis), and the gate-to-source voltage is greater than 5V. Circuitry internal to the
LM5072 monitors both the drain and gate voltages (see Figure 14), and issues the Power Good status flag by
pulling down the nPGOOD pin to a logic low level relative to the ARTN pin.
The nPGOOD circuitry consists of a 2.5V comparator, a 130Ωpull down MOSFET, and a 50 µA pull up current
source, as shown in Figure 22. Once the Power Good status is established, the nPGOOD pin voltage will be
pulled down quickly by the MOSFET, and the PWM controller will start as soon as the nPGOOD pin voltage
drops below the 2.5V threshold.
Figure 22. "Powered-from-PoE" Indictor and Power Good Delay Timer
The nPGOOD pin can be configured to perform multiple functions. As shown in Figure 22, it can be used to
implement a “Powered from PoE” indicator using an LED with a series current limiting resistor connected to the
VCC pin. This may be useful when the auxiliary power source is directly connected to the DC-DC converter
stage, a situation known as “RAUX” (see Auxiliary Power Options below). In such a configuration, the nPGOOD
pin will be active when the PD is operating from PoE power but not when it is powered from the auxiliary source.
However, the “Powered from PoE” indicator is not applicable in systems implementing the front auxiliary power
configuration “FAUX” (see Auxiliary Power Options below) because both PoE and auxiliary supply current pass
through the hot swap MOSFET. In this configuration, the nPGOOD pin is active when either PoE power or
auxiliary power is applied. The designer should ensure that the current drawn by the LED is not more than a few
milliamps, as the VCC regulator’s output current is limited to 15 mA and must also supply the LM5072’s bias
current and external MOSFET’s gate charging current. Supplying an external VCC that is higher than the
regulated level with a bench supply is an easy way to measure VCC load during normal operation. It should also
be noted that an external load on the VCC line will increase the dropout voltage of the VCC regulator. This may be
a concern when operating from a low voltage rear auxiliary supply.
The nPGOOD pin can also be used to implement a delay timer by adding a capacitor from the nPGOOD pin to
the ARTN pin. This delay timer will prevent the interruption of the PWM controller’s operation in the event of an
intermittent loss of Power Good status. This can be caused by PoE line voltage transients that may occur when
switching between normal PoE power and a backup supply system (e.g. a battery or UPS). This condition will
create a new “hot swap” event if there is a voltage difference between the backup supply and PoE supply. Since
the hot swap MOSFET will likely limit current during such a sudden input voltage change, the nPGOOD pin will
momentarily switch to the ”pull up” state. A capacitor on this pin will delay the transition of the nPGOOD pin state
in order to provide continuous operation of the PWM controller during such transients. The Power Good filter
delay time and capacitor value can be selected with the following equation:
16 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM5072
VIN
RAUX
VEE
OUT
RT
CS
FB
COMP
SS
RTN
ARTN
DCCL
RCLASS
nPGOOD
VCC
+PoE
+FAUX
-FAUX
-PoE
ICL_FAUX
+VOUT
LM5072
0.1 PF
CPGOOD(nF) = 0.05mA + ILED (mA)
1mA 0.25 ms
xtPG_Delay (ms) x 100 nF
LM5072
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SNVS437D –MARCH 2006–REVISED APRIL 2013
(3)
For example, selecting 1000 nF for CPGOOD, the delay time will be 50 ms if no LED is used and about 0.83 ms
when an LED, drawing 3 mA, is used. The delay required for continued operation will depend on the amplitude of
the transient, the DC current limit, the load, and the total amount of input capacitance. Note that this delay does
not ensure continued operation. If the hot swap MOSFET is in current limit for an extended period, it may cause
a thermal limit condition. This will result in a complete shutdown of the switching regulator, though no elements in
the system will be permanently damaged and normal operation will resume momentarily.
The Power Good status will also affect the default DC current limit. Should the sensed drain to source voltage of
the hot swap MOSFET (from ARTN to VEE) exceed 2.5V, the LM5072 will increase the DC current limit from the
default 440 mA to 540 mA, thus allowing the PD to continue operation through the transient event. This higher
current limit will remain in effect until one of the following events occur:
1. the duration of loss of Power Good status exceeds tPG_Delay, at which time the PWM controller will be
disabled,
2. the increased power dissipation in the hot swap MOSFET causes a thermal limit condition as previously
discussed, or
3. the MOSFET drain to source voltage falls below 1.5V to re-establish Power Good status. Under this
condition, the LM5072 will revert back to the default 440 mA DC current limit once Power Good status is
restored. Note that if the DC current limit has been programmed externally with RDCCL (see the DC Current
Limit Programming section), the DC current limit will remain at the programmed level even when the Power
Good status is lost.
Auxiliary Power Options
The LM5072 based PD can receive power from auxiliary sources like AC adapters and solar cells in addition to
the PoE enabled network. This is a desirable feature when the total system power requirements exceed the
PSE’s load capacity. Furthermore, with the auxiliary power option the PD can be used in a standard Ethernet
(non-PoE) system.
For maximum versatility, the LM5072 accepts two different auxiliary power configurations. The first one, shown in
Figure 23, is the front auxiliary (FAUX) configuration in which the auxiliary source is “diode OR’d” with the PoE
potential received from the Ethernet connector. The second configuration, shown in Figure 24, is the rear
auxiliary (RAUX) option in which the auxiliary power bypasses the PoE interface and is connected directly to the
input of the DC-DC converter through a diode. The FAUX option is desirable if the auxiliary power voltage is
similar to the PoE input voltage. However, when the auxiliary supply voltage is much lower than the PoE input
voltage, the RAUX option is more favorable because the current from the auxiliary supply is not limited by the hot
swap MOSFET DC current limit. A comparison of the FAUX and RAUX options is presented in Table 3. Note the
ICL_FAUX and RAUX pins are not reverse voltage protected. If complete reverse protection is desired, series
blocking diodes are necessary.
Figure 23. The FAUX Configuration
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LM5072
VIN
RAUX
VEE
OUT
RT
CS
FB
COMP
SS
RTN
ARTN
ICL_FAUX
DCCL
RCLASS
nPGOOD
VCC
+PoE
-RAUX
+RAUX
0.1 PF
LM5072
-PoE
+VOUT
LM5072
SNVS437D –MARCH 2006–REVISED APRIL 2013
www.ti.com
Figure 24. The RAUX Configuration
Table 3. Comparison Between FAUX and RAUX Operation
Tradeoff FAUX Operation RAUX Operation
Hot Swap Protection / Current Limit Automatically provided by the hot swap Requires a series resistor to limit the inrush current
Protection MOSFET. during hot swap.
Minimum Auxiliary Voltage Limited to 18V by the signature detection Only limited by 9V minimum input requirement.
(at the IC pins) mode, or by the power requirement
(current limit).
Auxiliary Dominance Over PoE Cannot be forced without external Can be forced with appropriate RAUX pin
components. configuration.
Use of nPGOOD Pin as “Powered from Not applicable as power is delivered Supported.
PoE” Indicator through the hot swap interface in both
PoE and FAUX modes.
Transient Protection Excellent due to active MOSFET current Fair due to passive resistor current limit.
limit.
The term “Auxiliary Dominance” mentioned in Table 3 means that when the auxiliary power source is connected,
it will always power the PD regardless of the state of PoE power. “Aux dominance” is achievable only with the
RAUX option, as noted in the table.
If the PD is not designed for aux dominance, either the FAUX or RAUX power sources will deliver power to the
PD only under the following two conditions:
1. If auxiliary power is applied before PoE power, it will prevent the PD’s detection by the PSE and will supply
power indefinitely. This occurs because the PoE input bridge rectifiers will be reverse biased, so no detection
signature will be observed. Under this condition, when the auxiliary supply is removed, power will not be
maintained because it will take some time for the PSE to perform signature detection and classification
before it will supply power.
2. If auxiliary power is applied after PoE power is already present but has a higher voltage than PoE, it may
assume power delivery responsibility. Under the second case, if the supplied voltages are comparable, the
load current may be shared inversely proportional to the respective output impedances of each supply. (The
output impedance of the PSE supply is increased by the cable series resistance).
If PoE power is applied first and has a higher voltage than the non-dominant aux power source, it will continue
powering the PD even when the aux power source becomes available. In this case, should PoE power be
removed, the auxiliary source will assume power delivery and supply the DC-DC loads without interruption.
18 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM5072
=18V - 4V
100 PA
VAUX - VRAUX
100 PA= 140 k:
LM5072
www.ti.com
SNVS437D –MARCH 2006–REVISED APRIL 2013
If either FAUX or RAUX power is supplied prior to PoE power, it will prevent the recognition of the PD by the
PSE. Consequently, continuity of power delivery cannot be ensured because the PoE supply will not be present
when auxiliary power is removed.
FAUX Option
With the FAUX option, the LM5072 hot swap MOSFET provides inrush and DC current limit protection for the
auxiliary power source. To select the FAUX configuration for an auxiliary voltage lower than nominal PoE
voltages, the ICL_FAUX pin must be forced above its high threshold to override the VIN UVLO function. Note
that when the ICL_FAUX pin is pulled high to override VIN UVLO, it also overrides the inrush current limit
programmed by RICL, if present. In this case, the inrush current will revert back to the default 150 mA limit.
Pulling up the ICL_FAUX pin will increase the default DC current limit to 540 mA. This increase in DC current
limit is necessary because higher current is required to support the PD output power at the lower input potentials
observed with auxiliary sources. In cases where the auxiliary supply voltage is comparable to the PoE voltage,
there is no need to pull-up the ICL_FAUX pin to override VIN UVLO, and the default DC current limit remains at
440 mA. However, if the DC current limit is externally programmed with RDCCL, the condition of the ICL_FAUX pin
will not affect the programmed DC current limit. In other words, programmed DC current limit can be considered
a “hard limit” that will not vary in any configuration.
RAUX Option
The RAUX option is desirable when the auxiliary supply voltage is significantly lower than the PoE voltage or
when aux dominance is desired. The inrush and DC current limits of the LM5072 do not protect or limit the RAUX
power source, and an additional resistor in the RAUX input path will be needed to provide transient protection.
To select the RAUX option without aux dominance, simply pull up the RAUX pin to the auxiliary power supply
voltage through a high value resistor. Depending on the auxiliary supply voltage, the resistor value should be
selected such that the current flowing into the RAUX pin is approximately 100 µA when the pin is mid-way
between the lower and upper RAUX thresholds (approximately 4V). For example, with an 18V non-dominant rear
auxiliary supply, the pull up resistor should be:
(4)
If the PSE load capacity is limited and insufficient, aux dominance will be a desired feature to off load PoE power
for other PDs that do not have auxiliary power available. Aux dominance is achieved by pulling the RAUX pin up
to the auxiliary supply voltage through a lower value (~5 kΩ) resistor that delivers at least 250 µA into the RAUX
pin. When this higher RAUX current level is detected, the LM5072 shuts down the PD interface. In aux dominant
mode, the auxiliary power source will supply the PD system as soon as it is applied. PD operation will not be
interrupted when the aux power source is connected. The PoE source may or may not actually be removed by
the PSE, although the DC current from the network cable is effectively reduced to zero (< 150 µA). IEEE 802.3af
requires the AC input impedance to be greater than 2 MΩto ensure PoE power removal. This condition is not
satisfied when the auxiliary power source is applied. The PSE may remove power from a port based on the
reduction in DC current. This is commonly known as DC Maintain Power Signature (DC MPS), a common feature
in many PSE systems.
The high voltage startup regulator of the PWM controller does not have low dropout capability and will not be
able to provide VCC when the potential from VIN to RTN is less than 14.5V (no external VCC load). In this case,
the auxiliary voltage should supply VCC directly via diode OR-ing to ensure successful startup.
When using the RAUX configuration, the positive potential connection of the 0.1 µF signature capacitor should be
moved from VIN to RTN/ARTN as shown in Figure 24. This provides a high frequency, low impedance path for
the IC's substrate during rear auxiliary operation. Placing the capacitor here will not affect signature mode.
It should be noted that rear auxiliary non-dominance does not imply PoE dominance. PoE dominance is difficult
to achieve in any PoE system if continuity of power is desired. When the PoE voltage appears, the PSE and PD
interface must continue delivering load current in addition to charging the input capacitor bank from the auxiliary
voltage to the PoE voltage. The situation is further complicated by the fact that for a given delivered power level,
the load current is much higher at the lower input voltages typically used in auxiliary supplies. As is the case
during any inrush sequence, very high power is dissipated in the hot swap MOSFET. Consequently, attempting
to achieve inrush completion while delivering load current is highly ill advised. Lastly, current delivered to the
system may be limited by the PSE, the PD, or both.
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: LM5072
I_leak
Rpd ICL_FAUX or
RAUX Pin
VEE or RTN
AUX Input VIN
Front or Rear
LM5072
SNVS437D –MARCH 2006–REVISED APRIL 2013
www.ti.com
A Note About FAUX and RAUX Pin False Input State Detection
The ICL_FAUX and RAUX pins are used to sense the presence of auxiliary power sources. The input voltage of
each pin must remain low when the auxiliary power sources are absent. However, the Or-ing diodes feeding the
auxiliary power are not ideal and leak reverse current that can flow from the PoE input to both the ICL_FAUX
and RAUX pins. When PoE power is applied, these leakage currents may elevate the potentials of the
ICL_FAUX and RAUX pins to false logic states.
One of two failure modes may be observed when the power diode feeding the front auxiliary input leaks
excessively. First, the current may corrupt the inrush current limit programming, if that feature has been
implemented. Second, the leakage current may elevate the voltage on the pin to the ICL_FAUX input threshold,
which will force UVLO release. This would certainly interrupt any attempt by the LM5072 PD interface to perform
the signature or classification functions.
When the power diode that feeds the rear auxiliary input leaks, the false signal could imply a rear auxiliary supply
is present. In this case, the internal hot swap MOSFET will be turned off. This would of course block PoE power
flow and cause the circuit to prevent startup.
This leakage problem at the control input pins can be easily solved. As shown in Figure 25, an additional pull-
down resistor (Rpd) across each auxiliary power control input provides a path for the diode leakage current so
that it will not create false states on the ICL_FAUX or RAUX pins.
Figure 25. Bypassing Resistor – Prevents False ICL_FAUX and RAUX Pin Signaling
High Voltage Startup Regulator
The LM5072 contains a startup bias regulator that allows the VIN pin to be connected directly to PoE network
voltages as high as 100V. The regulator output is connected to the VCC pin, providing an initial DC bias voltage
of 7.7V nominal to start the PWM controller. The regulator is internally current limited to no less than 15 mA to
prevent excessive power dissipation. For VCC voltage stability and noise immunity, a capacitor ranging between
0.1 µF to 10 µF is required between the VCC and ARTN pins. Though the current capability of the regulator
exceeds the requirements of the IC, no external DC load drawing more than 3 mA should be applied to the
output. A small amount of current for a “Powered from PoE” indicator LED (see Power Good and Regulator
Startup section) is acceptable. After the DC-DC converter reaches steady state operation, the VCC voltage is
typically elevated by an auxiliary winding of the power transformer. The sustained VCC voltage should be greater
than 8.1V to ensure the current supplied by the startup regulator is reduced to zero. Increasing the VCC pin
voltage above the regulation level of the startup regulator automatically disables the regulator, thus reducing the
power dissipation inside the LM5072. The power savings can be significant as many high voltage MOSFETs
require a relatively large amount of gate charge and the gate drive current adds directly to the VCC current draw.
A VCC under-voltage lock-out circuit monitors the VCC voltage to prevent the PWM controller from operating as
the VCC voltage rises during startup or falls during shutdown. The PWM controller is enabled when the VCC
voltage rising edge exceeds 7.6V and disabled when the VCC voltage falling edge drops below 6.25V.
Error Amplifier
The LM5072 contains a wide-bandwidth, high-gain error amplifier to regulate the output voltage in non-isolated
applications. The amplifier’s non-inverting input is set to a fixed reference voltage of 1.25V, while the inverting
input is connected to the FB pin. The open-drain output of the amplifier is connected to the COMP pin, which is
pulled up internally through a 5 kΩresistor to an internal 5V bias voltage. Feedback loop compensation can be
easily implemented by placing the compensation network, represented by “Zcomp”, between the FB and COMP
pins as shown in Figure 26.
20 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM5072
CS
ARTN
RTN
OUT
RSENSE
1 nF
100:
LM5072
+ CLK LEB
current sense
65 ns blanking
To PWM
Comparator
To Drain of Hot
Swap MOSFET
12
9
16
8
Isolation
5k
COMP15
14
FB
SS
to PWM
16
ARTN
From
Secondary
Error-
Amplifier
5V
.1 25V
LM5072
Boundary
5k
COMP
15
14
FB
SS
to PWM
R2
16
ARTN
R1
Vo
Zcomp
5V
.125V
LM5072
LM5072
www.ti.com
SNVS437D –MARCH 2006–REVISED APRIL 2013
Figure 26. Internal Error Amplifier – Used for Non-isolated Output Applications
For isolated applications, the error amplifier function is located on the isolated secondary side. The LM5072’s
error amplifier can be disabled by connecting the FB pin to the ARTN pin. As shown in Figure 27, an opto-
coupler is normally used to send the feedback signal across the isolation boundary to the COMP pin. The
internal pull-up resistor on the COMP pin now serves as the pull-up bias for the opto-coupler transistor.
Figure 27. The Internal Error Amplifier – Bypassed in Isolated Output Applications
Current Sense and Limit
The LM5072 CS pin senses the transformer primary current signal for current mode control and current limiting of
the supply. As shown in Figure 28, the current sense function can be fulfilled by a simple sense resistor RSENSE
inserted between the RTN and the source of the primary MOSFET switch.
The RSENSE resistor should be non-inductive, and a low pass filter should be used to reject the switching noise on
the sensed signal. A simple RC filter using 100Ωand 1 nF is typically sufficient. The filter capacitor must be
located close to the CS and ARTN pins. In order to prevent noise propagation and to improve the noise immunity
of the current sense, it is very important to minimize the return path of the current sense signal. This is
accomplished with direct connection to the ARTN pin and a single point connection to the RTN pin on the PC
Board layout.
Figure 28. Current Sense Schemes
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Links: LM5072
FOSC (kHz) x 26.2 k:RT(k:) = 200 kHz
Leading Edge
Narrow Spike
LM5072
SNVS437D –MARCH 2006–REVISED APRIL 2013
www.ti.com
Figure 29. Typical Current Sense Waveform Having a Leading Edge Spike
The current sense signal is also used for cycle-by-cycle over-current protection. When the CS pin signal exceeds
0.5V, the PWM pulse of that cycle will be immediately terminated. The desired cycle-by-cycle over-current
protection level is achieved by selecting the proper value of current sense resistor that produces 0.5V at the CS
pin. For the LM5072-80, the slope compensation reduces the current limit threshold by about 20% maximum at
the 80% maximum duty cycle.
The typical current sense waveform as shown in Figure 29 has a spike at the leading edge. This spike is mainly
caused by the large gate drive current that flows through the current sense resistor at turn-on (up to 0.8A). The
reverse recovery of the rectifier diode on the secondary side and the cross conduction of the primary MOSFET
and sync MOSFET (if used) may also contribute to this leading edge spike. With a relatively small external RC
filter, this spike can still cause a false over-current condition that terminates the PWM output pulse. To avoid this
problem, an internal blanking circuit is provided within the LM5072 as shown in Figure 28. An internal MOSFET
is turned on to short the CS pin to ARTN at the end of each cycle. This MOSFET switch remains on for an
additional 65ns after the beginning of the next PWM cycle, thus blanking out the leading edge spike on the
current sense signal.
Soft-Start
The LM5072 incorporates a soft-start feature which forces the PWM duty cycle to grow progressively during
startup such that the output voltage increases gradually to the steady state level. The soft-start process reduces
or prevents both the surge of inrush current and the associated overshoot of the output voltage during startup.
The LM5072 achieves soft-start using an internal 10 µA current source to charge an external capacitor
connected to the SS pin. The capacitor voltage limits the voltage at the COMP pin which directly controls the
PWM duty cycle. The rate of the soft-start ramp can be adjusted by varying the value of the external capacitor.
Note that the slope of the supply’s output voltage is influenced by the load condition and the total output
capacitance of the supply, as well as the soft-start programming. The supply should be started slowly enough
such that the input current is limited below the hot swap MOSFET DC current limit.
Gate Driver and Maximum Duty Cycle Limit
The LM5072’s gate drive (OUT) pin can source and sink a peak current of 800 mA directly to the gate of the DC-
DC converter’s power MOSFET switch. To serve a variety of applications, the LM5072 is available with two
options for maximum PWM duty cycle. The LM5072-80 operates at duty cycles up to 80% while the LM5072-50
limits the PWM duty cycle to 50%.
Oscillator, Shutdown and Sync Capability
The LM5072 requires a single external resistor connected between the RT and ARTN pins to set the oscillator
frequency (FOSC). The RTtiming resistor should be located very close to the IC and connected directly to the RT
and ARTN pins. The following equation describes the relationship between FOSC and the RTresistor value:
(5)
The LM5072 can also be synchronized to an external clock signal with a frequency higher than the programmed
oscillator frequency determined by the RTresistor. The clock signal should be coupled into the RT pin through a
100 pF capacitor, as shown in Figure 30. Successful synchronization requires the peak voltage of the sync pulse
signal to be greater than 3.7V at the RT pin, and pulse width between 15 and 150 ns (set by external
components). The RTresistor is always required, whether the oscillator is operated in “free-running” mode or with
external synchronization.
22 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
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LM5072
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SNVS437D –MARCH 2006–REVISED APRIL 2013
Figure 30. Oscillator Synchronization Implementation
Special attention should be paid to the relationship between the oscillator frequency and the PWM switching
frequency. For the LM5072-50 version, the programmed oscillator frequency is internally divided by two in order
to facilitate the 50% duty cycle limit. The PWM output switching frequency is therefore one half of the
programmed oscillator frequency. The frequency divider is not used in the LM5072-80 and therefore the PWM
output frequency is the same as the oscillator frequency. These relationships also apply to external
synchronization frequency versus PWM output frequency.
PWM Comparator / Slope Compensation
The PWM comparator produces the PWM duty cycle by comparing the current sense ramp signal with an error
voltage derived from the error amplifier output. The error amplifier output voltage at the COMP pin is offset by
1.4V and then further attenuated by a 3:1 resistor divider before it is presented to the PWM comparator input.
The PWM duty cycle increases with the voltage at the COMP pin. The controller output duty cycle reduces to
zero when the COMP pin voltage drops below approximately 1.4V.
For duty cycles greater than 50%, current mode control loops are subject to sub-harmonic oscillation. This
instability can be eliminated by adding an additional fixed slope voltage ramp signal to the current sense signal.
This technique is commonly known as “slope compensation”. For the LM5072-80 version with its maximum duty
cycle of 80%, slope compensation is integrated by injecting a 45 μA current ramp from the oscillator into the
current sense signal path (see Figure 15). The 45 μA peak ramping current flows through an internal 2 kΩ
resistor to produce a fixed voltage ramp at the PWM comparator input. Additional slope compensation may be
added by increasing the source impedance of the current sense signal with an external resistor between the CS
pin and the source of the current sense signal. The feature is disabled for the LM5072-50 version because the
duty cycle is limited to 50% and slope compensation is not required.
Thermal Protection
The LM5072 includes internal thermal shutdown circuitry to protect the IC in the event the maximum junction
temperature is exceeded. This circuit prevents catastrophic overheating due to accidental overload of the hot
swap MOSFET or other circuitry. Typically, thermal shutdown is activated at 165°C, causing the hot swap
MOSFET and classification regulator to be disabled. The PWM controller is disabled after the PGOOD timer has
expired. Thermal limit is not enabled unless the module is being powered through the front end and the hot swap
MOSFET is enhanced. VCC current limit provides an adequate level of protection for this 15 mA regulator. The
thermal protection is non-latching, therefore after the temperature drops by the 25°C nominal hysteresis, the hot
swap MOSFET is re-activated and a soft-start is initiated to restore the LM5072 to normal operation. If the cause
of overheating has not been eliminated, the circuit will hiccup in and out of the thermal shutdown mode.
PCB Layout Guidelines
Before processing the Printed Circuit Board (PCB) layout, the engineer should make all necessary adjustments
to the schematic to suite the application. The reader may notice that the LM5072 evaluation board is designed
with dual outputs, both FAUX and RAUX power options, and some re-configuration flexibility features (refer to
Figure 32). However, many devices can be removed for a particular application. Recommendations on
simplifying Figure 32 to suit a given application are as follows:
1. When selecting the FAUX power option only, delete C3, D1, D2, J3, P3, P4, R1, R2, R13, and R29.
2. When selecting the RAUX power option only, delete R30, D3, D7, J2, P1, P2 and R6.
3. When neither FAUX nor RAUX power options are selected, delete all the parts mentioned in (1) and (2)
above.
4. When only a single output is required, delete C11 through C14, C17, D8, J6, J7, L2, R10 and Z4. Modify T1
design to delete the unwanted second output winding and increase the copper used for the single output
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 23
Product Folder Links: LM5072
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winding. This re-configuration should make use of the spare pins of the transformer.
5. R24 should be deleted from the schematic completely, being replaced by a short connection for an isolated
application, or by an open for a non-isolated application.
6. Jumpers P5 and P6 (Figure 33) should be deleted from the schematic completely, being replaced by a short
connection for an isolated application, or by an open for a non-isolated application.
7. When the output is non-isolated, delete C20, C22, C25, R7, R11, R16, R17, R24, U2, and U3. Replace C28
with a short connection, and replace P5 and P6 with short connections.
8. One may also modify the number of input and output capacitors to achieve a more optimized design.
Consider the following when starting the PCB design:
1. Try to use both sides of the PCB for part placement to facilitate both layout and routing.
2. Place the power components in a pattern that minimizes the lengths of the high current paths on the PCB.
3. Place the LM5072 and its critical peripheral parts closely. Bypass capacitors and transient protection
elements should be near the LM5072.
4. Route the critical traces first, including both power and signal traces. Make the length of the trace as short as
possible, and avoid excessive use of via holes.
5. Pay attention to grounding issues. Each reference ground should be a copper plane or island. Use via holes
if necessary for direct connections of devices to their appropriate return ground plane or island. Identify the
following ground returns:
– Primary power return COM: C4, C5, C6, R14, R15, R29, C3, P4, J3-pins 2 and 3, U1-pin 8, C28, and
C29 are all returned to the COM ground plane.
– Primary control signal return, a ground return island: C19, T1-pin 2, C23, U2-pin 3, R24, C26, C21, and
U1-pin 16 are all returned to this island, and the island should be single point connected to the COM
ground plane.
– Secondary power return IGND: T1-pins 6 and 7, C7 through C10, C12 through C17, C28, Z4, J5, and
J7 are all returned to the IGND ground plane.
– Secondary control signal return, a ground return island: R18, U3 and C20 are all returned to this island,
and the island should be single point connected to the IGND ground plane.
Also consider the following during PCB layout and routing.
1. Place the following power components in each group as close as possible:
– C4, C5 (if used), the primary winding of T1, Q1, and R14/R15. The high frequency switching current
(pulse current) flows through these parts in a loop. The physical area enclosed by the loop should be as
small as possible.
– D5, C7 through C10, and the secondary winding of T1 for the main output. The high frequency
switching current for the main output rail flows through these parts in a loop. The physical area enclosed
by the loop should be as small as possible.
– D8, C12 and C13, and the secondary winding of T1 for the second output, if used. The high frequency
switching current for the second output rail flows through these parts in a loop. The physical area
enclosed by the loop should be as small as possible.
– L3, C15, C16, J4 and J5 (if posts are used). L3 should also be as close as possible to the capacitor
bank consisting of C7 through C10 in order to minimize the conduction losses on the PCB. Ceramic
capacitor C15 should be placed directly at the output port.
– L2, C14, C17, Z4, J6 and J7 (if posts are used) for the second output rail. L2 should also be as close
as possible to C12 and C13 in order to minimize the conduction losses on the PCB. Ceramic capacitor
C14 should be directly placed at the output port
2. U1 (LM5072) should be placed close to Q1 in the orientation such that the gate drive output pin (OUT, Pin 9)
is close to Q1’s gate.
3. Z2 and C27 must be placed directly across the VIN and VEE pins for best protection against input transients.
In a rear auxiliary application, C27 should be removed and C29 should be installed very close to the RTN
and VEE pins.
4. C19 should be placed directly across the VCC and ARTN pins.
5. C23 should be placed directly across the CS and ARTN pins.
6. R21 should be placed directly across the RT and ARTN pins.
24 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM5072
LM5072
www.ti.com
SNVS437D –MARCH 2006–REVISED APRIL 2013
7. C26 should be placed directly across the SS and ARTN pins.
8. C21 should be placed directly across the nPGOOD and ARTN pins.
9. R25 should be directly routed from the output port.
10. R9 should be directly routed from R14/R15.
11. D6 and Z1 should be placed to achieve the shortest connection from C4 or C5 to the drain pad(s) of Q1 for
better snubbing.
12. C2 and R4 should be placed to achieve the shortest connection across D5.
13. Q1, D5, D8, and U1 (LM5072) should be installed on thermal pads having adequate thermal vias down
through all PCB Layers and an exposed thermal pad on the other side of the PCB.
14. Avoid spiral trace pattern.
15. Avoid placing switching traces near any traces in the regulator feedback loop.
16. Pay attention to trace width. Try to make the power traces as wide as possible. Conversely, do not make
signal traces wider than needed.
After the first placement and routing is completed, make necessary modifications to optimize the design.
Application Example #1
Figure 31 shows an application example of a single isolated output solution for the PD. Both front auxiliary
(FAUX) and rear auxiliary (RAUX) power options are given, although only one option may be needed in practice.
Note that for the RAUX option, D2 is only installed when the supply voltage of the auxiliary power source would
cause the VIN voltage to be below 14.5V.
Figure 31. PD with Isolated, Single Output Solution
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 25
Product Folder Links: LM5072
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Application Example #2
Figure 32 shows an example of an isolated, dual-output solution for the PD. The 3.3V output is tightly regulated
while the 5V output is cross-regulated. Both front auxiliary (FAUX) and rear auxiliary (RAUX) power options are
given, although only one option may be needed in practice. Note that for the RAUX option, D2 is only installed
when the supply voltage of the auxiliary power source is lower than 14.5V.
Figure 32. PD with Isolated, Dual Output Solution
26 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM5072
LM5072
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SNVS437D –MARCH 2006–REVISED APRIL 2013
Application Example #3:
Figure 33 shows an application example of the non-isolated version of Figure 31. This non-isolated version saves
many parts used in the isolated feedback example shown in Figure 31. Similar simplification also applies to the
non-isolated version of Figure 32.
Figure 33. PD Solution with Non-Isolated Flyback Topology
Application Example #4
Figure 34 shows an application example of a PD solution using the buck topology. Q2, a dual PNP transistor, is
employed in the output voltage sensing to achieve temperature compensation for the regulated output.
Figure 34. PD Solution with Buck Topology
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 27
Product Folder Links: LM5072
LM5072
SNVS437D –MARCH 2006–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision C (April 2013) to Revision D Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 27
28 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM5072
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM5072MH-80/NOPB ACTIVE HTSSOP PWP 16 92 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 LM5072
MH-80
LM5072MHX-80/NOPB ACTIVE HTSSOP PWP 16 2500 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 LM5072
MH-80
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM5072MHX-80/NOPB HTSSOP PWP 16 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Oct-2016
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM5072MHX-80/NOPB HTSSOP PWP 16 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Oct-2016
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
TYP
6.6
6.2
14X 0.65
16X 0.30
0.19
2X
4.55
(0.15) TYP
0 - 8 0.15
0.05
3.3
2.7
3.3
2.7
2X 1.34 MAX
NOTE 5
1.2 MAX
(1)
0.25
GAGE PLANE
0.75
0.50
A
NOTE 3
5.1
4.9
B4.5
4.3
4X 0.166 MAX
NOTE 5
4214868/A 02/2017
PowerPAD HTSSOP - 1.2 mm max heightPWP0016A
PLASTIC SMALL OUTLINE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may not be present.
PowerPAD is a trademark of Texas Instruments.
TM
116
0.1 C A B
9
8
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.400
THERMAL
PAD
17
www.ti.com
EXAMPLE BOARD LAYOUT
(5.8)
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
16X (1.5)
16X (0.45)
14X (0.65)
(3.4)
NOTE 9
(5)
NOTE 9
(3.3)
(3.3)
( 0.2) TYP
VIA (1.1) TYP
(1.1)
TYP
4214868/A 02/2017
PowerPAD HTSSOP - 1.2 mm max heightPWP0016A
PLASTIC SMALL OUTLINE
SYMM
SYMM
SEE DETAILS
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:10X
1
89
16
METAL COVERED
BY SOLDER MASK
SOLDER MASK
DEFINED PAD
17
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
TM
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
PADS 1-16
EXPOSED
METAL
SOLDER MASK
DEFINED
SOLDER MASK
METAL UNDER SOLDER MASK
OPENING
EXPOSED
METAL
www.ti.com
EXAMPLE STENCIL DESIGN
16X (1.5)
16X (0.45)
(3.3)
(3.3)
BASED ON
0.125 THICK
STENCIL
14X (0.65)
(R0.05) TYP
(5.8)
4214868/A 02/2017
PowerPAD HTSSOP - 1.2 mm max heightPWP0016A
PLASTIC SMALL OUTLINE
2.79 X 2.790.175 3.01 X 3.010.15 3.3 X 3.3 (SHOWN)0.125 3.69 X 3.690.1
SOLDER STENCIL
OPENING
STENCIL
THICKNESS
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
TM
SYMM
SYMM
1
89
16
BASED ON
0.125 THICK
STENCIL
BY SOLDER MASK
METAL COVERED SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:10X
17
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