CPC1590 Optically Isolated Gate Driver INTEGRATED CIRCUITS DIVISION Driver Characteristics Description Parameter Rating Units Input Current 2.5 mA Switching Speed (IF=5mA, MOS Input Capacitance=4nF) td(on) 12 td(off1) (VGS=2V) 125 td(off2) (VGS=1V) 210 s The CPC1590 accomplishes very fast MOSFET turn-on by supplying stored charge, from an external capacitor, to the MOSFET gate when input control current is applied to the device's LED. After the MOSFET is turned on, photocurrent from the input optocoupler keeps it on for as long as sufficient input control current flows, so there is no low-frequency operating limit. When the MOSFET is turned off, the storage capacitor charges from the device's regulated internal voltage in preparation for the next turn-on. Features * * * * * * * * * * 3750Vrms Input-to-Output Isolation Drives External Power MOSFET Low LED Current (2.5mA) Requires No External Power Supply Load Voltages up to 200V High Reliability Small 8-pin Surface Mount Flatpack Package Machine Insertable, Wave Solderable Tape and Reel Version Available Flammability Rating UL 94 V-0 Because it is provided in a small, 8-pin Flatpack package and requires no separate power supply, the CPC1590 provides a flexible design solution that consumes the least amount of PCB land area. Applications * * * * * The CPC1590 is a MOSFET Gate Driver that requires no external power supply: it regulates the input voltage drawn from the load (up to 200V), down to 12.2V for internal use. It is specifically designed for low duty cycle switching applications that drive up to 4nF of gate capacitance. Approvals Industrial Controls Instrumentation Medical Equipment Isolation Electronic Switching I/O Subsystems * UL Recognized Component: File E76270 Ordering Information * Appliances Part Description CPC1590P 8-Pin Flatpack (50/Tube) CPC1590PTR 8-Pin Flatpack (1000/Reel) Figure 1. CPC1590 Block Diagram 8 1 4 CAP 7 NC A NC 5 LED + LED - G 2 3 6 B DS-CPC1590-R02 www.ixysic.com 1 CPC1590 INTEGRATED CIRCUITS DIVISION 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 General Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8 Performance Data* . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 3 4 4 5 2. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4. Device Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 LED resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 Storage Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3 Transistor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 7 8 5. CPC1590 Used as an AC Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6. Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2 www.ixysic.com R02 CPC1590 INTEGRATED CIRCUITS DIVISION 1. Specifications 1.1 Package Pinout N/C LED + LED N/C 1 1.2 Pin Description 8 2 7 3 6 4 5 CAP A B G 1.3 Absolute Maximum Ratings Parameter Units Blocking Voltage (VDS) 200 VP Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation Total Package Dissipation 5 50 1 20 200 V mA A mW mW Vrms 3750 -40 to +110 -40 to +125 C C Absolute maximum electrical ratings are at 25C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. R02 Name Description 1 2 3 4 5 LED + LED VG 6 VL2 -Load Voltage DC, Load Voltage AC 7 VL1 +Load Voltage DC, Load Voltage AC 8 VCAP Not connected Positive input to LED Negative input to LED Not connected Output, MOSFET Gate Control Storage Capacitor Voltage 1.4 ESD Rating Rating Isolation Voltage (Input to Output) Operational Temperature Storage Temperature Pin# ESD Rating (Human Body Model) 1000 V 1.5 Recommended Operating Conditions Parameter Symbol Min Max Units Load Voltage VL 15 200 V Input Control Current IF 2.5 10 mA Forward Voltage Drop VF 1 1.5 V Operating Temperature TA -40 +110 C www.ixysic.com 3 CPC1590 INTEGRATED CIRCUITS DIVISION 1.6 General Conditions Unless otherwise specified, minimum and maximum values are guaranteed by production testing. Typical values are characteristic of the device at 25C and are the result of engineering evaluations. They are provided for informational purposes only and are not part of the manufacturing testing requirements. Unless otherwise noted, all electrical specifications are listed for TA=25C. 1.7 Electrical Specifications Parameter Conditions Symbol Min Typ 7.0 7.3 Max Units Load Side Characteristics Gate Voltage IF=2.5mA IF=5mA IF=10mA 8.0 VGS 12 7.5 8.4 4.2 - 14.4 V IF=2.5mA -40C<TA<110C Capacitor Voltage Gate Drive Capability 10V<VDS<200V VCAP 10 12.2 16 IF=2.5mA, VGS=0V, VCAP=15V IG_source 2 3.3 7 4.0 9.0 14 1.5 3.3 6 0.5 1.2 2 40 140 12 40 5 20 IF=0mA, VGS=8V, VCAP=8V IF=0mA, VGS=4V, VCAP=4V IG_sink IF=0mA, VGS=2V, VCAP=2V Turn-On Delay mA VDS=48V, VGS=4V, CVG=4nF IF=2.5mA IF=5mA ton 1 IF=10mA Turn-Off Delay V s VDS=48V, VGS=2V, CVG=4nF IF=2.5mA IF=5mA 110 toff1 40 IF=10mA 400 s 600 s - 1 A 125 130 VDS=48V, VGS=1V, CVG=4nF IF=2.5mA IF=5mA 200 toff2 40 IF=10mA Off-State Leakage Current 210 220 VDS=200V IDS - LED Characteristics Forward Voltage Drop IF=5mA VF 1 1.27 1.5 V Input Dropout Current VGS=1V IF 0.2 0.75 1 mA Reverse Bias Leakage Current VR=5V IR - - 10 A - CIO - 3 - pF Common Characteristics Input to Output Capacitance 4 www.ixysic.com R02 CPC1590 INTEGRATED CIRCUITS DIVISION 1.8 Performance Data* td(on) vs. Temperature (VGS=4V) 180 IF=2.5mA 140 IF=5mA 120 IF=2.5mA IF=5mA 20 IF=10mA 1.40 -20 0 20 40 60 Temperature (C) 100 60 -40 100 LED Forward Voltage Drop vs. Temperature (IF=5mA) 120 1.35 110 1.30 100 -20 0 20 40 60 Temperature (C) 80 (s) 1.20 1.15 Time Constant () vs. Temperature (IF=5mA) 60 1.05 40 1.00 -40 30 -40 -20 0 20 40 60 80 Temperature (C) 100 120 3.5 0 20 40 60 Temperature (C) 80 100 Gate Source Current vs. Temperature (IF=5mA, VCAP=15V) 4.5 VGS=4V 4.0 3.5 3.0 -20 0 20 40 60 Temperature (C) 80 100 2.5 -40 -20 0 20 40 60 Temperature (C) 80 100 Gate Sink Current vs. Temperature (IF=0mA, VGS=VCAP) 3.0 IG_sink (mA) 5.5 -20 VGS=2V 70 50 200 5.0 80 1.10 220 160 -40 100 90 1.25 mA I F=5 A .5m I F=2 240 180 80 80 A 10m I F= 260 IG_source (mA) 40 0 -40 LED VF (V) td(off1) (s) 80 td(on) (s) 160 60 td(off2) vs. Temperature (VGS=1V) 280 IF=10mA 100 td(off2) (s) 120 td(off1) vs. Temperature (VGS=2V) VGS=4V 2.5 2.0 1.5 VGS=2V 1.0 0.5 -40 -20 0 20 40 60 Temperature (C) 80 100 * Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 5 CPC1590 INTEGRATED CIRCUITS DIVISION 2. Introduction The CPC1590 is a MOSFET Gate Driver that requires no external power supply. It can regulate an input voltage, up to 200V, down to 12.2V for internal use. It is specifically designed for low-duty-cycle switching frequencies that drive 4nF of gate capacitance. 3. Functional Description The CPC1590 is used in conjunction with a single MOSFET transistor for remote switching of DC loads (Figure 2), and two MOSFETS and a diode for remote switching of low-frequency AC loads (Figure 3) where isolated power is unavailable. The device uses external components, most notably a charge storage capacitor, to satisfy design switching and over-voltage protection requirements. Because of this design flexibility, the designer may choose a great number of MOSFETs for use in a wide variety of applications. The designer simply needs to know the MOSFET total gate charge (QG), and with this information a capacitor can be chosen. The capacitance of the storage capacitor should be greater than, or equal to, QG/0.5V. The CPC1590 has two states of operation: (1) sufficient input control current is flowing, the LED is turned on, and the gate current is being applied. The light from the LED is being reflected onto the photovoltaic, which then produces a photocurrent that turns on the NPN bipolar transistor and provides the charge (I x t = Q), or the gate current that is being applied to turn on the MOSFET. (2) Sufficient input control current is not flowing, the LED is turned off, and gate current is not flowing. The LED is off because VF << the minimum forward voltage required, and not enough current is being applied. This turns on the PNP bipolar transistor, providing a path for gate current to discharge to VL2. When VLOAD is first applied, the external storage capacitor begins to charge. The charge is sent through a bootstrap diode to prevent the charge from escaping and discharging through a turned-on MOSFET. The J-FET then regulates the voltage between 10V and 16V. The input control current is applied, then the charge is transferred from the storage capacitor through the NPN bipolar transistor, along with the charge from the photovoltaic, to the MOSFET gate to accomplish a rapid turn-on. After the capacitor has discharged and the MOSFET has turned on, the photocurrent from the input optocoupler continues to flow into the gate to keep the MOSFET turned on. When the input control current is removed, the gate current stops flowing and the PNP bipolar transistor is on and is discharging the MOSFET gate. The MOSFET is now off. At this point the capacitor begins to recharge for the next turn on cycle. The circuit below does not include over-voltage protection. Figure 2. CPC1590 DC Application Circuit CPC1590 8 1 4 7 A NC LOAD NC CST 5 LED + LED - 6 CAP +VLOAD G 2 3 6 B www.ixysic.com -VLOAD R02 CPC1590 INTEGRATED CIRCUITS DIVISION 4. Device Configuration CPC1590 8 VIN 1 4 CAP 7 A NC LOAD NC +VLOAD CST RLED 5 G 2 3 6 B 4.1 LED resistor The input resistor is required to limit LED current to a value set by Recommended Operating Conditions in "Recommended Operating Conditions" on page 3. In some cases, higher LED operating current would improve driver speed; however, this higher current could also reduce LED lifespan, which would cause reliability issues. The general equation used to calculate the resistor value is: RLED = When the LED resistor value is selected by the above formula, the RLED power dissipation, PD, can be obtained from the following equation: PD = IF2 * RLED With power dissipation calculated, it is now possible to select an appropriate resistor size that can be used in the particular application circuit. It is recommended that a resistor with at least twice the calculated power rating should be selected. VIN - (VF + VOL) 4.2 Storage Capacitor IF * IF = Input Control Current * VOL = Low-level output of the driving logic gate or the collector-emitter voltage of the driving logic transistor. (This parameter is provided in the manufacturer's data sheet.) * VIN = Input Power Source * VF = Forward Voltage Drop of LED * RLED = Input Resistor When calculating the resistor value, the designer should take into consideration power-supply variations, which can range about 10%, temperature variations from -40C to +85C, LED forward voltage drop over the temperature range, and the resistor's tolerance and temperature stability rating. R02 -VLOAD The storage capacitor (CST) enables the gate driver to turn on a power MOSFET faster by delivering a reservoir of charge to the gate. Selection of the storage capacitor is given by the following equation: CST > QG / 0.5V This equation shows that the storage capacitor needs to deliver enough charge to the gate while only dropping 0.5V. The CPC1590 can deliver 32nC of charge at rated operating speed, and will operate with much larger loads, >4nF, with slower turn-on and turn-off times. The CPC1590 has an internal J-FET, which is used to regulate the voltage applied to the storage capacitor. The voltage applied to the storage capacitor will be www.ixysic.com 7 CPC1590 INTEGRATED CIRCUITS DIVISION between 10V and 16V. The capacitor's voltage rating should be two to three times this range. The designer should select the storage capacitor based on the particular application requirements. If the final product requires operating at a higher ambient temperature range of -40C to +110C, then it is better to select COG/NPO capacitors in order to meet minimum capacitance requirements. 4.3 Transistor Selection The CPC1590 charges and discharges an external MOSFET transistor. The selection of the MOSFET is determined by the user to meet the specific power requirements for the load. The CPC1590 output voltage is listed in the specification, but, as mentioned earlier, there must be little or no gate leakage. Another parameter that plays a significant role in the selection of the transistor is the gate drive voltage available from the part. The CPC1590 uses photovoltaic cells to collect the optical energy generated by the internal LED; to generate more voltage, the photovoltaic diodes are stacked. As such, the voltage of the photovoltaic stack reduces with increased temperature. The user must select a transistor that will maintain the load current at the maximum temperature, given the VGS in the CPC1590 specifications. 5. CPC1590 Used as an AC Switch The CPC1590 can be used in other configurations. One typical configuration is shown in Figure 3, which is called an AC Switch. This simply means that either terminal can be positive or negative. This configuration requires a second MOSFET (Q2) and two rectifying diodes (D1 and D2). The design considerations are identical for this application. Diodes D1 and D2 must have voltage ratings greater than the breakdown voltage of the MOSFETs. Figure 3. Application Circuit for Using the CPC1590 as an AC Switch CPC1590 8 VCAP 1 4 NC +/- VLOAD 7 VL1 NC LOAD D1 CST 5 LED + LED - VG Q1 2 3 D2 Q2 6 VL2 +/- VLOAD 6. Conclusion See IXYS Integrated Circuits' Application Note, AN-202, for a thorough discussion, and for examples of device usage, component selection, and over-voltage protection circuitry. 8 www.ixysic.com R02 CPC1590 INTEGRATED CIRCUITS DIVISION 7. Manufacturing Information 7.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1590P MSL 1 7.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 7.3 Reflow Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (TC) Dwell Time (tp) Max Reflow Cycles CPC1590P 260C 30 seconds 3 7.4 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R02 www.ixysic.com 9 CPC1590 INTEGRATED CIRCUITS DIVISION 7.5 Mechanical Dimensions 7.5.1 CPC1590P 8-Pin Flatpack Package 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 7.620 0.254 (0.300 0.010) 9.398 0.127 (0.370 0.005) Pin 1 2.286 MAX. (0.090 MAX.) PCB Land Pattern 2.54 (0.10) 0.635 0.127 (0.025 0.005) 0.203 0.013 (0.008 0.0005) 9.652 0.381 (0.380 0.015) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 0.025 (0.085 0.001) 0.457 0.076 (0.018 0.003) 0.864 0.120 (0.034 0.004) Dimensions mm (inches) 7.5.2 CPC1590PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) P1 = 12.00 (0.472) User Direction of Feed Ao = 10.30 (0.406) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1590-R02 (c)Copyright 2018, IXYS Integrated Circuits All rights reserved. Printed in USA. 6/18/2018 10 www.ixysic.com R02