Features 1. A small o3.5mm jack that was developed for small, mobile equipment. 2. A wide selection is available including surface mounting, DIP, spring terminal, and mid mount types. 1. o3.5mm Specification 1.Electric Performance Rating : 1A, 12V DC Contact Resistance : 30m max, 50m max. Insulation Resistance : 100M min.500V DC Withstanding Voltage : 500V AC(for one minute) 2.Mechanical Performance Insertion Force : 35N max. at 3.5mm Dia.gauge Withdrawal Force : 3 to 35N at 3.5mm Dia.gauge 1. DC12V 1A 30m50m DC500V 100M AC500V1 2. o3.5mm 35N o3.5mm 3 35N Application Smart phones, mobile phones, tablet PCs, portable audio, other small AV equipment. PC AV (LGY2209-0101F) 2.75 3 SMD Type 2 4 1 2 3.5 1.8 le) 2(Ho . 2-o1 1.8 12 0 1 0.4 Without With P.C. Board Dimension (Top View) 2 12 o5 o3. 4.4 2 3 4 1 o1 .2 2.2 Circuits / 2 4 2.4 7.5 1 3 3.5 2- 1.9 5.35 9 12 Reflow Soldering 4-2 F 4-1.5x0.7 2 3 4 1 (500pcs/reel) DIP Type Circuits / Metal Sleeve 3 2 1.8 LGY2209-03 1.8 7.5 2 2 3 2 2.75 4.4 2.2 0.05 0.1 (Terminal position range) o5 o3. 9-0101F 2. DIP 5.35 LGY22 9 Mini Jacks 3.5mm Dia. Jacks 2.4 P.C. Board Dimension (Bottom View) [t=0.8] 00 40 Housing Color Black Yellow Manual Soldering 3.5mm Dia. Jacks LGY2209-0800F Circuits / 3 4-1.x0.8 2.4 2.4 3 0.4 Shading Type 2-o1.2 [t=0.8] LGY2109-0200F o5.5 2 2.6 4.2 2.1 o3.6 12 2 6 2xo1 2.5 3 4 5 2 1 P.C. Board Dimension Bottom View [[ [ 1RSULQWHGWKLVDUHD &RPSRQHQW6LGH Manual Soldering [t=1.0] LGY2109-1701F 6 2 12 Circuits / 0.6 2.6 4.2 2.1 o5.5 o3.6 0.5 DIP Type Circuits / 4.5 Reflow Soldering Manual Soldering 0.5 DIP Type 8 -R 4 P.C. Board Dimension (Bottom View) 3.1 1 2 7.5 0.4 2.2 Mini Jacks 3 4 5 2 1 3 2 4 2.5 5.4 1 8.5 9.2 5.2 1.9 2.2 5 DIP Type 1.5x0.8 2xo1.15 2.4 2.4 (Land) [t=0.8] P.C. Board Dimension (Top View) Reflow Soldering Manual Soldering 13 3.5mm Dia. Jacks LGY2109-3301F 6 2.6 1 0.5 4.2 2.1 o5.5 o3.6 Mini Jacks [ [[ [[ DIP / SMD Type 2 4 5 3 1 Circuits / P.C. Board Dimension (Top View) /DQG Reflow Soldering [t=0.8] LGY2109-1801F 5 Circuits / 2 4 5 3 1 6 2.5 2.5 3.2 2.2 3 3.4 4 Two 2.5x1.9 6x1.8 2.9 6 1 5 SMD Type 6.9 10.6 13.4 13.4 9.4 6.3 2 2.5 5.2 3.7 5.9 P.C. Board Dimension (Top View) (Land) Reflow Soldering (800pcs/reel) LGY3509-0400F o5.5 o3.6 2 12 0.5 0.65 5.55 3.45 6 2.5 8.7 Circuits / 2xo1 2.4 2.2 3 4 5 2 1 1.9 2xo1.2 1 2 3 4 5.4 9.2 8.7 2.5 5.2 2x1.6x0.8 Through hole 5 DIP / SMD Type 14 2x2.4 2.1 (Land) [t=0.7] 2.1 P.C. Board Dimension (Top View) Reflow Soldering 3.5mm Dia. Jacks LGY2609-0101F Plug standard position 5 1.6 1.7 13.5 0.3 4.4 2.6 o3.6 4.6 2.95 2 4 5 3 1 1 4.6 6.25 3 4.5 4 Mini Jacks 12.3 6.95 3.2 2.2 2.2 2 Circuits / 4.5 4x1.2x0.6 5 DIP Type 2xo1.1 P.C. Board Dimension (Top View) 0.6x1.4 (Land) [t=0.3] (1,000pcs/reel) LGY3209-0400F o5 1.4 13.8 5.4 3.2 Circuits / o3. 3 1 2 2.4 5.2 4 12. 4.1 7.4 2 4 5 3 1 5 3 3 Spring Contact Type Reflow Soldering P.C. Board Dimension (Top View) 5 (Land) LGY2409-0200F 1.4 7.8 6.8 o3.6 2 4 5 3 1 2 3 3.3 1 4 1.5 5 3.1 (Land) Circuits / 2.9 2.5 13.7 3 8.9 11.4 4.9 1.7 2.9 Spring Contact Type 5 0.6 3 4.6 2.4 o5.5 P.C. Board Dimension (Top View) 15 3.5mm Dia. Jacks LGY6502-0900F 16.5 8 6.5 9 o7 o3.6 4.5 0.5 4 Circuits / 3 2 1 DIP Type 1 6.25 11.25 16 1.2 1.7 Mini Jacks 5.9 8.2 1x2.5 2 0.8x2 1x2.5 P.C. Board Dimension (Bottom View) 3 Flow Soldering [t=1.6] LGY6502-0800F Noise-Resistant Designed (With Earth Plate) ( ) Circuits / 3 2 DIP Type [ [ [ LGY6509-0100F 1 P.C. Board Dimension (Bottom View) Flow Soldering [t=1.6] 18 11 .5 11 o7 o3. 3 1.5 4 Circuits / .1 DIP Type 16 12 17.8 14 8 o2 9.3 2 4 3 1 3 1 4 2 2-1.9x1 0.8x1.9 [t=1.6] 1x2.4 P.C. Board Dimension (Bottom View) Flow Soldering 3.5mm Dia. Jacks LGS2318-0100F 9.15 14.5 3 o3. 2x1 4.5 o.4 3.55 2.5 Circuits / 5.4 4.5 DIP Type 3 5 4 P.C. Board Dimension x 0.8x1.4 (Hole) (Bottom View) 1.95 2.7 4.8 2 Mini Jacks 2xo1.3 (Hole) 1 1 3 5 4 3 2 1 11 11.4 5.4 2.4 11 5.45 2.15 3.5 0.1 3.4 Manual Soldering [t=1.0] LGS6506-0700F 11 2.5 o7 o3. Circuits / 1.5 4 17.8 15.3 12 o2 .1 5 4 3 2 7 8 1 8 7.5 9.3 18 .5 11 3.5 7 4 3 1 DIP Type 4.1 2-1.9x1 5 8 2-1.9x0.8 2-0.8x1.4 1-1x2.4 2 P.C. Board Dimension (Bottom View) Flow Soldering [t=1.6] LGS6507-1300F Circuits / 5 4 3 2 7 8 9 1 DIP Type [ [ [ P.C. Board Dimension [ [ (Bottom View) Flow Soldering [t=1.6] 17 3.5mm Dia. Jacks LGS6509-1000F 11 18 o3. o7 2.5 .5 13 3.5 1.5 4 Circuits / 17.8 1.7 15.3 12 4 3 1 8 1.9x0.8 5 1.9x0.8 1.9x1 9 0.8x1.4 2 4.1 11.3 1x2.4 P.C. Board Dimension (Bottom View) Flow Soldering [t=1.6] LGY2502-0200F 3 .5 2.5 1.8 11.5 0.2 8.3 Circuits / 1.2 3 1 2.5 5 1.5 o o3. Mini Jacks 7 7 5 4 3 2 8 9 1 8 7.5 9.3 DIP Type .1 o2 3 2 LGY2512-0100F 3.5 2 3 3-1.7x0.8 2-o1.4 P.C. Board Dimension (Bottom View) 2.2 2. [t=1.2/1.6] 3 .5 2.5 1.8 11.5 8.3 0.2 Circuits / 3 1 2.5 5 1.5 o o3. DIP Type Flow Soldering (Please contact about soldering condition) Manual Soldering 9 .9 1 4.5 2. 1 1.2 3 2 DIP Type 18 3-1.7x0.8 2-o1.4 3 2 2.2 2. [t=1.2/1.6] 9 3.5 1 4.5 .9 2. 1 P.C. Board Dimension (Bottom View) Flow Soldering (Please contact about soldering condition) Manual Soldering 3.5mm Dia. Jacks LGT10 2-0100F 8 (15) 5 3.25 1 10 1.5 12 o7.5 o3. Mini Jacks 3 3.9 3-1x2(Hole) DIP Type P.C. Board Dimension (Bottom View) 5.4 4.85 2 3.9 3 2 1 2-o1.1 (Hole) .8 1 Circuits / Metal Sleeve [t=1.6] Pattern compatible with LGM10 9 LGM10 9 Without With 0 1 Manual Soldering LGT8002-0100F 3:%3RVLWLRQ 3:% 3OXJ7RS 3RVLWLRQ Circuits / 3 2 1 $SSOLFDEOHSOXJPD[ 1.6mm min. 4.15 4.15 DIP Type 3.9 2 2xo1.3 3 2x1x2 1 3.25 3.5 3.5 o3.5 P.C. Board Dimension (Bottom View) 2x0.9 [t=1.6] LGT8502-0200F 3:%3RVLWLRQ 3:% 3 4 1 3.9 4 4.15 4.15 4.2 2xo1.3 Circuits / 2x1.2 DIP Type Manual Soldering 3 1 .5 [t=1.6] 2x0.9 P.C. Board Dimension (Bottom View) Flow Soldering Manual Soldering 19 3.5mm Dia. Jacks LGT1509-0200F o3.6 o7 8 3 15 4 8 Circuits / 1.5 2 4 3 1 3.1 3.1 4-1x2 3.15 3.1 Mini Jacks 3.15 4 2 P.C. Board Dimension (Bottom View) 3 1 o1.3 6.5 DIP Type Flow Soldering [t=1.6] Manual Soldering LGT8509-0300F P.W.B position P.W.B Circuits / 1.6mm min. DIP Type LGM10 P.C. Board Dimension (Bottom View) [t=1.6] 9-0100F 8 (15) 5 10 Manual Soldering 3.25 1 12 o7.5 o3.6 Circuits / 6.8 20 3.9 Metal Sleeve 4 2.4 2.4 3.8 3 5 DIP Type 2-o1.1 5.4 3.9 5 4 3 2 1 2 1 5 4.85 3x1x2 (Hole) 2-1x1.6 (Hole) [t=1.6] Pattern compatible with LGT102 LGT102 0 1 Without With P.C. Board Dimension (Bottom View) Manual Soldering 3.5mm Dia. Jacks LGY0402-0111F 2 13 0.5 o5 0.4 o3. 0.5 0.9 Circuits / 7. 3 2 1 Mid Mount Type 3 1 2 2-2.4x1.7 4. 2.5x2.5 P.C. Board Dimension (Top View) Mini Jacks 14.25 13 .2 Manual Soldering [t=0.8] LGY0609-0100F 14 4.3 5.1 4.3 (4.1) (3.3) 1.4x0.5 11.5 2.25 6x2.2 1 Mid Mount Type Circuits / 0.6 1.1 2.1 4.2 3.8 6.8 5.1 2 4.5 2 A metal panel etc. should not be installed near this area. 2 4 5 3 1 1.85 6x1.3 5.3 4.95 8.05 10.4 1.1 0.6 o3.6 o5.5 3 4 (Land) [t=0.8] 5 P.C. Board Dimension (Top View) Reflow Soldering Manual Soldering 21