DS-IXD_609-R00D PRELIMINARY 1
RoHS
2002/95/EC e
3
Pb
Features
•9A Peak Source/Sink Drive Current
•Wide Operating Voltage Range: 4.5V to 35V
•-40°C to +125°C Extended Operating Temperature
Range
•Logic Input Withstands Negative Swing of up to 5V
•Matched Rise and Fall Times
•Low Propagation Delay Time
•Low, 10μA Supply Current
•Low Output Impedance
Applications
•Efficient Power MOSFET and IGBT Switching
•Switch Mode Power Supplies
•Motor Controls
•DC to DC Converters
•Class-D Switching Amplifiers
•Pulse Transformer Driver
Description
The IXDD609/IXDI609/IXDN609 high-speed gate
drivers are especially well suited for driving the latest
IXYS MOSFETs and IGBTs. The IXD_609
high-current output can source and sink 9A of peak
current while producing voltage rise and fall times of
less than 25ns. The input is CMOS compatible, and is
virtually immune to latch up. Proprietary circuitry
eliminates cross-conduction and current
“shoot-through.” Low propagation delay and fast,
matched rise and fall times make the IXD_609 family
ideal for high-frequency and high-power applications.
The IXDD609 is configured as a non-inverting driver
with an enable, the IXDN609 is configured as a
non-inverting driver, and the IXDI609 is configured as
an inverting driver.
The IXD_609 family is available in a standard 8-pin
DIP (PI); 8-lead SOIC (SIA); 8-lead SOIC with an
exposed, grounded metal back (SI); an 8-lead DFN
(D2) package; and a 5-pin TO-263 package.
Ordering Information
Part Number Logic
Configuration Package Type Packing
Method Quantity
IXDD609D2TR 8-Lead DFN Tape & Reel 2000
IXDD609SI 8-Lead SOIC with Exposed Grounded Metal Back Tube 100
IXDD609SITR 8-Lead SOIC with Exposed Grounded Metal Back Tape & Reel 2000
IXDD609SIA 8-Lead SOIC Tube 100
IXDD609SIATR 8-Lead SOIC Tape & Reel 2000
IXDD609PI 8-Pin DIP Tube 50
IXDD609YI 5-Pin TO-263 Tube 50
IXDI609SI 8-Lead SOIC with Exposed Grounded Metal Back Tube 100
IXDI609SITR 8-Lead SOIC with Exposed Grounded Metal Back Tape & Reel 2000
IXDI609SIA 8-Lead SOIC Tube 100
IXDI609SIATR 8-Lead SOIC Tape & Reel 2000
IXDI609PI 8-Pin DIP Tube 50
IXDI609YI 5-Pin TO-263 Tube 50
IXDN609SI 8-Lead SOIC with Exposed Grounded Metal Back Tube 100
IXDN609SITR 8-Lead SOIC with Exposed Grounded Metal Back Tape & Reel 2000
IXDN609SIA 8-Lead SOIC Tube 100
IXDN609SIATR 8-Lead SOIC Tape & Reel 2000
IXDN609PI 8-Pin DIP Tube 50
IXDN609YI 5-Pin TO-263 Tube 50
IN
EN
OUT
INOUT
INOUT
IXD_609
9-Ampere Low-Side
Ultrafast MOSFET Drivers
IXD_609
R00D PRELIMINARY 2
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 IXDD609 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 IXDI609 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3 IXDN609 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.4 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.5 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
IXD_609
R00D PRELIMINARY 3
1 Specifications
1.1 Pin Configurations 1.2 Pin Definitions
1.3 Absolute Maximum Ratings
Unless stated otherwise, absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1
4
3
2
8
5
6
7
VCC
IN
EN
GND
VCC
OUT
OUT
GND
1
4
3
2
5
VCC
OUT
GND
IN
EN
1
4
3
2
8
5
6
7
VCC
IN
NC
GND
VCC
OUT
OUT
GND
1
4
3
2
5
VCC
OUT
GND
IN
NC
1
4
3
2
8
5
6
7
VCC
IN
NC
GND
VCC
OUT
OUT
GND
1
4
3
2
5
VCC
OUT
GND
IN
NC
IXDD609 D2 / PI / SI / SIA
IXDI609 PI / SI / SIA
IXDN609 PI / SI / SIA
IXDD609 YI
IXDI609 YI
IXDN609 YI
Pin Name Description
IN Logic Input
EN Output Enable - Drive pin low to disable output,
and force output to a high impedance state
OUT Output - Sources or sinks current to turn-on or
turn-off a discrete MOSFET or IGBT
OUT Inverted Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC Supply Voltage - Provides power to the device
GND Ground - Common ground reference for the
device
NC Not connected
Parameter Symbol Minimum Maximum Units
Supply Voltage VCC -40V
All Other Pins - -0.3 VCC+0.3 V
Output Current IOUT -±9A
Junction Temperature TJ-55 +150 °C
Storage Temperature TSTG -65 +150 °C
IXD_609
4PRELIMINARY R00D
1.4 Recommended Operating Conditions
1.5 Electrical Characteristics
Test Conditions: TA=25°C, 4.5V < VCC < 35V.
Parameter Symbol Minimum Maximum Units
Supply Voltage VCC 4.5 35 V
Operating Temperature Range T
A-40 +125 °C
Parameter Conditions Symbol Minimum Typical Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - -
VInput Voltage, Low 4.5V < VCC < 18V VIL --0.8
Input Voltage Range - VIN -5 - VCC+0.3
Input Current 0V < VIN < VCC IIN -10 - 10 μA
EN Input Voltage, High IXDD609 only VENH 2/3VCC --
V
EN Input Voltage, Low IXDD609 only VENL --
1/3VCC
Output Voltage, High - VOH VCC-0.025 --
V
Output Voltage, Low - VOL - - 0.025
Output Resistance, High State VCC=18V, IOUT=-10mA ROH -0.61
Ω
Output Resistance, Low State VCC=18V, IOUT=10mA ROL -0.40.8
Output Current, Continuous Limited by package power
dissipation IDC --±2A
Rise Time CLOAD=10nF, VCC=18V tR-2245
ns
Fall Time CLOAD=10nF, VCC=18V tF-1540
On-Time Propagation Delay CLOAD=10nF, VCC=18V tONDLY -3750
Off-Time Propagation Delay CLOAD=10nF, VCC=18V tOFFDLY -3850
Enable to Output-High Delay Time IXDD609 only tENOH -3550
Disable to High Impedance State Delay Time IXDD609 only tDOLD -7080
Enable Pull-Up Resistor - REN -200-kΩ
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-13mA
VCC=18V, VIN=0V --10
μA
VCC=18V, VIN=VCC --10
IXD_609
R00D PRELIMINARY 5
1.6 Electrical Characteristics
Test Conditions: TA=-40°C to +125°C, 4.5V < VCC < 35V, TJ<150°C.
1.7 Thermal Characteristics
Parameter Conditions Symbol Minimum Typical Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - -
VInput Voltage, Low 4.5V < VCC < 18V VIL --0.8
Input Voltage Range - VIN -5 - VCC+0.3
Input Current 0V < VIN < VCC IIN -10 - 10 μA
Output Voltage, High - VOH VCC-0.025 --
V
Output Voltage, Low - VOL - - 0.025
Output Resistance, High State VCC=18V, IOUT=-10mA ROH --2
Ω
Output Resistance, Low State VCC=18V, IOUT=10mA ROL --1.5
Output Current, Continuous Limited by package power
dissipation IDC --±1A
Rise Time CLOAD=10nF, VCC=18V tR--60
ns
Fall Time CLOAD=10nF, VCC=18V tF--60
On-Time Propagation Delay CLOAD=10nF, VCC=18V tONDLY --55
Off-Time Propagation Delay CLOAD=10nF, VCC=18V tOFFDLY --40
Enable to Output-High Delay Time IXDD609 only tENOH --60
Disable to High Impedance State Delay Time IXDD609 only tDOLD --100
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-13mA
VCC=18V, VIN=0V --10
μA
VCC=18V, VIN=VCC --10
Package Parameter Rating Units
D2 (8-Lead DFN)
θJA
35
°C/W
PI (8-Lead DIP) 125
SI (8-Lead SOIC with Exposed Metal Back) 85
SIA (8-Lead SOIC) 120
YI (5-Lead TO-263) 46
IXD_609
6PRELIMINARY R00D
2 Functional Description
2.1 IXDD609 Functional Block Diagram
2.2 IXDI609 Functional Block Diagram
2.3 IXDN609 Functional Block Diagram
IN EN OUT
0 1 or open 0
1 1 or open 1
00
Z
10
Z
IN OUT
01
10
GND
IN
EN
IXDD609
VCC
OUT
IN
VCC
IXDI609
GND
OUT
IN OUT
00
11
IN
VCC
IXDN609
GND
OUT
IXD_609
R00D PRELIMINARY 7
2.4 Timing Diagrams
2.5 Characteristics Test Diagram
10%
90%
t
ONDELAY
t
OFFDELAY
t
R
t
F
V
IH
V
IL
IN
OUT
EN
IN
OUT
GND
VCC
VCC
+
-
VIN
0.1μF10μF
Tektronix
Current Probe
6302
CLOAD
IXD_609
8PRELIMINARY R00D
3 Performance Data
Supply Voltage (V)
0 5 10 15 20 25 30 35
Rise Time (ns)
0
10
20
30
40
50
60
70
Rise Time vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
CL=10nF
CL=5.4nF
CL=1.5nF
Supply Voltage (V)
0 5 10 15 20 25 30 35
Fall Time (ns)
0
10
20
30
40
50
60
Fall Time vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
C
L
=10nF
C
L
=5.4nF
C
L
=1.5nF
Temperature (ºC)
-40-200 20406080 100 120 140
Rise & Fall Times (ns)
5
6
7
8
9
10
11
Rise and Fall Times vs. Temperature
(Input=0-5V, f=10kHz, CL=2.5nF, VCC=18V)
t
R
t
F
Load Capacitance (pF)
0 2000 4000 6000 8000 10000
Rise Time (ns)
0
10
20
30
40
50
60
70
Rise Time vs. Load Capacitance
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
Load Capacitance (pF)
0 2000 4000 6000 8000 10000
Fall Time (ns)
0
10
20
30
40
50
60
Fall Time vs. Load Capacitance
V
CC
=4.5V
V
CC
=8V
V
CC
=12V
V
CC
=18V
V
CC
=25V
V
CC
=30V
V
CC
=35V
Supply Voltage (V)
0 5 10 15 20 25 30 35
Propagation Delay (ns)
0
50
100
150
200
Propagation Delay vs. Supply Voltage
(Input=0-5V, f=1kHz, CL=5.4nF)
t
OFFDLY
t
ONDLY
Input Voltage (V)
246810 12
Propagation Delay (ns)
0
20
40
60
80
100
120
140
160
180
Propagation Delay vs. Input Voltage
(VIN=5V, f=1kHz, CL=5.4nF, VCC=12V)
tONDLY
tOFFDLY
Temperature (ºC)
-40-200 20406080 100 120 140
Propagation Delay (ns)
30
35
40
45
50
55
Propagation Delay
vs. Junction Temperature
(f=1kHz, CL=5.4nF, VCC=18V)
tONDLY
tOFFDLY
Temperature (ºC)
-40-200 20406080 100 120 140
Input Threshold Voltage (V)
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Input Threshold Voltage
vs. Temperature
(CL=2.5nF, VCC=18V)
Min V
IH
Max V
IL
Supply Voltage (V)
0 5 10 15 20 25 30 35
Input Threshold (V)
1.0
1.5
2.0
2.5
3.0
3.5
Input Threshold vs. Supply Voltage
Min V
IH
Max V
IL
Supply Voltage (V)
0 5 10 15 20 25 30 35
Enable Threshold (V)
0
5
10
15
20
25
Enable Threshold vs. Supply Voltage
Min V
ENH
Max V
ENL
IXD_609
R00D PRELIMINARY 9
Load Capacitance (pF)
1000 10000
Supply Current (mA)
0
100
200
300
400
500
Supply Current vs. Load Capacitance
(VCC=18V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
Load Capacitance (pF)
1000 10000
Supply Current (mA)
0
50
100
150
200
250
300
Supply Current vs. Load Capacitance
(VCC=12V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
Load Capacitance (pF)
1000 10000
Supply Current (mA)
0
50
100
150
200
Supply Current vs. Load Capacitance
(VCC=8V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Frequency
(VCC=18V)
C
L
=10nF
C
L
=5.4nF
C
L
=1.5nF
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Frequency
(VCC=12V)
CL=10nF
CL=5.4nF
CL=1.5nF
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
(VCC=8V)
CL=10nF
CL=5.4nF
CL=1.5nF
Temperature (ºC)
-40-200 20406080 100 120 140
Supply Current (mA)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Quiescent Supply Current
vs. Temperature
V
IN
=3.5V
V
IN
=5V
V
IN
=10V
V
IN
=0V & 18V
Temperature (ºC)
-40-200 20406080 100 120 140
Supply Current (mA)
0.35
0.40
0.45
0.50
0.55
0.60
0.65
Dynamic Supply Current
vs. Temperature
(VIN=5V, f=1kHz, CL=1.5nF, VCC=18V)
Supply Voltage (V)
0 5 10 15 20 25 30 35
Source Current (A)
-30
-25
-20
-15
-10
-5
0
Output Source Current
vs. Supply Voltage
(f=422Hz, CL=66nF)
Supply Voltage (V)
0 5 10 15 20 25 30 35
Output Sink Current (A)
0
5
10
15
20
25
30
Output Sink Current
vs. Supply Voltage
(f=422Hz, CL=66nF)
IXD_609
10 PRELIMINARY R00D
Supply Voltage (V)
0 5 10 15 20 25 30 35
Output Resistance (Ω)
0.0
0.5
1.0
1.5
High State Output Resistance
at -10mA vs. Supply Voltage
Supply Voltage (V)
0 5 10 15 20 25 30 35
Output Resistance (Ω)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
Low State Output Resistance
at +10mA vs. Supply Voltage
Temperature (ºC)
-40-200 20406080 100 120 140
Output Source Current (A)
-12.0
-11.5
-11.0
-10.5
-10.0
-9.5
-9.0
Output Source Current
vs. Temperature
(f=422Hz, CL=66nF, VCC=18V)
Temperature (ºC)
-40-200 20406080 100 120 140
Output Sink Current (A)
10.0
10.5
11.0
11.5
12.0
12.5
13.0
13.5
14.0
Output Sink Current
vs. Temperature
(f=422Hz, CL=66nF, VCC=18V)
IXD_609
R00D PRELIMINARY 11
4 Manufacturing Information
4.1 Mechanical Dimensions
4.1.1 8-Pin SOIC - IXD_609SIA
4.1.2 8-Pin SOIC - IXD_609SI
Recommended PCB Land Pattern
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
1.30 / 1.75
(0.051 / 0.069)
0.10 / 0.25
(0.004 / 0.010)
4.80 / 5.00
(0.190 / 0.197)
PIN 1
0.31 / 0.51
(0.012 / 0.020)
5.80 / 6.20
(0.228 / 0.244)
3.80 / 4.00
(0.150 / 0.157)
1.27 BSC
(0.05 BSC)
0.40 / 1.27
(0.016 / 0.050)
0.10 / 0.25
(0.004 / 0.010)
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0º / 8º
1.27
(0.050)
5.40
(0.213) 1.55
(0.061)
0.60
(0.024)
NOTE: Molded package conforms to JEDEC standard configuration
MS-012 variation AA.
Recommended PCB Land Pattern
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
NOTE: Molded package conforms to JEDEC standard configuration
MS-012 variation BA.
1.30 / 1.75
(0.051 / 0.069)
0.03 / 0.10
(0.001 / 0.004)
4.80 / 5.00
(0.190 / 0.197)
PIN 1
0.31 / 0.51
(0.012 / 0.020)
5.80 / 6.20
(0.228 / 0.244)
3.80 / 4.00
(0.150 / 0.157)
1.27 BSC
(0.05 BSC)
0.40 / 1.27
(0.016 / 0.050)
0.10 / 0.25
(0.004 / 0.010)
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0º / 8º
2.29 / 2.79
(0.090 / 0.110)
3.30 / 3.81
(0.130 / 0.150)
1.27
(0.050)
5.40
(0.209)
1.55
(0.061)
0.60
(0.024)
2.75
(0.108)
3.80
(0.150)
IXD_609
12 PRELIMINARY R00D
4.1.3 8-Pin DFN - IXD_609D2
4.1.4 8-Pin DIP - IXD_609PI
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
5.00 BSC
(0.197 BSC)
4.00 BSC
(0.158 BSC)
0.80 / 1.00
(0.031 / 0.039)
0.00 / 0.05
(0.000 / 0.002)
0.95 BSC
(0.037 BSC)
0.76 / 0.81
(0.030 / 0.032)
0.30 / 0.45
(0.012 / 0.018)
3.04 / 3.09
(0.120 / 0.122)
2.54 / 2.59
(0.100 / 0.102)
0.35 / 0.45 x 45º
(0.014 / 0.018 x 45º)
Pin 1
Pin 1 Pin 8
0.20 REF
(0.008 REF)
Recommended PCB Land Pattern
4.50
(0.177)
0.45
(0.018)
1.20
(0.047)
3.05
(0.120)
2.55
(0.100)
0.95
(0.037)
0.35 x 45º
(0.014 x 45º)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
NOTE: Molded package conforms to JEDEC standard configuration
MS-001 variation BA.
PC Board Pattern
7.62 / 10.92
(0.300 / 0.430)
7.62 BSC
(0.300 BSC)
0.20 / 0.38
(0.008 / 0.015)
7.37 / 8.26
(0.290 / 0.325)
0.38 / 0.58
(0.015 / 0.023)
1.14 / 1.65
(0.045 / 0.065)
0.38 / 1.02
(0.015 / 0.040)
3.05 / 3.81
(0.120 / 0.150) 3.43 / 4.70
(0.135 / 0.185)
3.18 / 3.81
(0.125 / 0.150)
8-0.900 DIA.
(8-0.035 DIA.)
7.50
(0.295)
2.540
(0.100)
9.02 / 10.16
(0.355 / 0.400)
6.10 / 6.86
(0.240 / 0.270)
2.540 BSC
(0.100 BSC)
1.40
(0.055)
IXD_609
R00D PRELIMINARY 13
4.1.5 5-Pin TO-263 - IXD_609YI
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
NOTES:
1. All metal surfaces are solder solder-plated except trimmed area.
2. Short lead of No. 3 is optional to IXYS.
3. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally.
8.80 / 9.50
(0.346 / 0.374) 14.80 / 15.80
(0.583 / 0.622)
9.65 / 10.30
(0.380 / 0.406)
1.70 BSC
(0.067 BSC)
1 2 3 4 5
0.60 / 0.99
(0.024 / 0.039)
1.00 / 1.40
(0.039 / 0.055)
4.20 / 4.80
(0.165 / 0.189)
1.20 / 1.40
(0.047 / 0.055)
0.40 / 0.70
(0.016 / 0.028)
2.24 / 2.84
(0.088 / 0.112)
2.10 / 2.70
(0.083 / 0.106)
0º - 3º
6.60 / 7.20
(0.260 / 0.283)
7.50 / 8.20
(0.295 / 0.323)
1.20 / 1.70
(0.047 / 0.067)
6
Optional
3.85
(0.152)
3.65
(0.144)
6.35
(0.250)
1.05
(0.041)
1.70
(0.067)
10.40
(0.409)
9.15
(0.360)
Recommended PCB Pattern
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_609-R00D
©Copyright 2010, Clare, Inc.
All rights reserved. Printed in USA.
7/7/2010