TACmicrochip The world's smallest surface mount Tantalum capacitor, small enough to create space providing room for ideas to grow. TACmicrochip is a major breakthrough in miniaturization without reduction in performance. L It offers you the highest energy store in an 0603 or 0805 case size; enhanced high frequency operation through unique ESR performance with temperature and voltage stability. CASE DIMENSIONS: millimeters (inches) POLARITY BAND NOT TO EXCEED CENTER LINE Code EIA Code W +0.20 (0.008) -0.10 (0.004) L +0.25 (0.010) -0.15 (0.006) H +0.20 (0.008) -0.10 (0.004) t (min.) D (min.) L 0603 0.85 (0.033) 1.6 (0.063) 0.85 (0.033) 0.15 (0.006) 0.70 (0.028) R 0805 1.35 (0.053) 2.0 (0.079) 1.35 (0.053) 0.15 (0.006) 0.90 (0.035) NOTE: Terminations are plated 100% Su. H t W D STANDARD CAPACITANCE RANGE (LETTER DENOTES CASE SIZE) Capacitance F 0.47 0.68 1.0 1.5 2.2 3.3 4.7 6.8 10.0 15.0 22.0 33.0 47.0 68.0 * 18 = In Development 2.0V L L L L R R R 3.0V L L L L L R /R R R R Rated voltage to 85C 4.0V L L L L L L/R R /R /R 6.3V L L L L L R L/R /R R 10V L L L L L L/R L/R R R R 16V L TACmicrochip HOW TO ORDER TAC L 225 M 003 R Type TACmicrochip Case Code 0603=L 0805=R Capacitance Code pF code: 1st two digits represent significant figures, 3rd digit represents multiplier (number of zeros to follow) Tolerance K=10% M=20% Rated DC Voltage 002=2Vdc 003=3Vdc 004=4Vdc 006=6.3Vdc 010=10Vdc 016=16Vdc ** Packaging Additional X=8mm 4-1/4" characters may be Tape & Reel add for special requirements R=7" Tape & Reel (see page 49) RATINGS AND PART NUMBER REFERENCE 0603 / CASE CODE L AVX Style 0805 / CASE CODE R Case Capacitance Size F@120Hz Leakage A (Max) DF % Max ESR Max @100kHz AVX Style Case Capacitance Size F@120Hz 2 v @ 85C TACL335*002# TACL475*002# TACL685*002# 0603 0603 0603 3.3 4.7 6.8 0.5 0.5 0.5 0603 0603 0603 0603 0603 2.2 3.3 4.7 6.8 10 0.5 0.5 0.5 0.5 0.5 6 6 6 10 10 10 0603 0603 0603 0603 0603 1.5 2.2 3.3 4.7 6.8 0.5 0.5 0.5 0.5 0.5 6 6 6 10 10 10 10 10 10 10 6 6 6 6 6 10 10 10 10 10 6.3 v @ 85C TACL105*006# TACL155*006# TACL225*006# TACL335*006# TACL475*006# TACL106*006# 0603 0603 0603 0603 0603 0603 TACL474*010# TACL684*010# TACL105*010# TACL155*010# TACL225*010# TACL335*010# 0603 0603 0603 0603 0603 0603 TACL105*016# 0603 1.0 1.5 2.2 3.3 4.7 10 0.5 0.5 0.5 0.5 0.5 0.6 6 6 6 6 6 10 10 10 10 10 10 6 6 6 6 6 6 6 12 10 10 10 10 10 6 10 10 v @ 85C 0.47 0.68 1.0 1.5 2.2 3.3 0.5 0.5 0.5 0.5 0.5 0.5 ESR Max @100kHz TACR226*002# TACR336*002# TACR476*002# 0805 0805 0805 22 33 47 0.5 0.7 1.0 8 8 10 6 6 6 8 8 8 10 6 6 6 6 8 8 8 10 6 6 6 6 8 8 8 6 6 6 8 8 8 8 6 6 6 6 3 v @ 85C 4 v @ 85C TACL155*004# TACL225*004# TACL335*004# TACL475*004# TACL685*004# DF % Max 2 v @ 85C 3 v @ 85C TACL225*003# TACL335*003# TACL475*003# TACL685*003# TACL106*003# Leakage A (Max) TACR156*003# TACR226*003# TACR336*003# TACR476*003# 0805 0805 0805 0805 15 22 33 47 0.5 0.7 1.0 1.5 4 v @ 85C TACR106*004# TACR156*004# TACR226*004# TACR336*004# 0805 0805 0805 0805 10 15 22 33 0.5 0.6 0.9 1.3 6.3 v @ 85C TACR685*006# TACR106*006# TACR156*006# 0805 0805 0805 6.8 10 15 0.5 0.6 0.9 10 v @ 85C TACR475*010# TACR685*010# TACR106*010# TACR156*010# 0805 0805 0805 0805 4.7 6.8 10 15 0.5 0.7 1.0 1.5 For parametric information on development codes, please contact your local AVX sales office. 16 v @ 85C 1.0 0.5 All technical data relates to an ambient temperature of +25C. Capacitance and DF are measured at 120Hz, 0.5V RMS with a maximum DC bias of 2.2 volts. DCL is measured at rated voltage after 5 minutes. * Insert K for 10% and M for 20% # Insert R for 7" reel and S for 13" reel NOTE: AVX reserves the right to supply a higher voltage rating or tighter tolerance part in the same case size, to the same reliability standards. 19 Introduction AVX Tantalum APPLICATIONS 2-16 Volt 50 Volt @ 85C 2-35 Volt Low ESR 33 Volt @ 125C Low ESR Low Profile Case Automotive Range Low Profile Case 0603 available High Reliability 0603 available Low Failure Rate Temperature Stability Low Failure Rate High Volumetric Efficiency QS9000 Approved High Volumetric Efficiency Temperature Stability Up to 150C Temperature Stability Stable over Time Stable over Time QUALITY STATEMENTS AVX's focus is CUSTOMER satisfaction - customer satisfaction in the broadest sense: product quality, technical support, product availability and all at a competitive price. In pursuance of the established goals of our corporate wide QV2000 program, it is the stated objective of AVX Tantalum to supply our customers with a world class service in the manufacturing and supplying of electronic components which will result in an adequate return on investment. This world class service shall be defined as consistently supplying product and services of the highest quality and reliability. This should encompass, but not be restricted to all aspects of the customer supply chain. In addition any new or changed products, processes or services will be qualified to established standards of quality and reliability. 2 The objectives and guidelines listed above shall be achieved by the following codes of practice: 1. Continual objective evaluation of customer needs and expectations for the future and the leverage of all AVX resources to meet this challenge. 2. By continually fostering and promoting culture of continuous improvement through ongoing training and empowered participation of employees at all levels of the company. 3. By Continuous Process Improvement using sound engineering principles to enhance existing equipment, material and processes. This includes the application of the science of S.P.C. focused on improving the Process Capability Index, Cpk. All AVX Tantalum manufacturing locations are approved to ISO9001/ISO9002 and QS9000 - Automotive Quality System Requirements. Introduction AVX Tantalum AVX Paignton is the Divisional Headquarters for the Tantalum division which has manufacturing locations in Paignton in the UK, Biddeford in Maine, USA, Juarez in Mexico, Lanskroun in the Czech Republic and El Salvador. The Division takes its name from the raw material used to make its main products, Tantalum Capacitors. Tantalum is an element extracted from ores found alongside tin and niobium deposits; the major sources of supply are Canada, Brazil and Australasia. So for high volume tantalum capacitors with leading edge technology call us first - AVX your global partner. TECHNOLOGY TRENDS Tantalum Powder CV/gm CV/g ('000s) The amount of capacitance possible in a tantalum capacitor is directly related to the type of tantalum powder used to manufacture the anode. The graph following shows how the (capacitance) x (voltage) per gram (CV/g) has steadily increased over time, thus allowing the production of larger and larger capacitances with the same physical volume. CV/g is the measure used to define the volumetric efficiency of a powder, a high CV/g means a higher capacitance from the same volume. These improvements in the powder have been achieved through close development with the material suppliers. AVX Tantalum is committed to driving the available technology forwards as is clearly identified by the new TACmicrochip technology and the standard codes under development. If you have any specific requirements, please contact your local AVX sales office for details on how AVX Tantalum can assist you in addressing your future requirements. 80 70 60 50 40 30 20 10 0 1975 1980 1985 1990 Year 1995 2000 WORKING WITH THE CUSTOMER - ONE STOP SHOPPING In line with our desire to become the number one supplier in the world for passive and interconnection components, AVX is constantly looking forward and innovating. It is not good enough to market the best products; the customer must have access to a service system which suits their needs and benefits their business. The AVX `one stop shopping' concept is already beneficial in meeting the needs of major OEMs while worldwide partnerships with only the premier division of distributors aids the smaller user. Helping to market the breadth and depth of our electronic component line card and support our customers are a dedicated team of commercial sales people, applications engineers and product marketing managers. Their qualifica- tions are hopefully always appropriate to your commercial need, but as higher levels of technical expertise are required, access directly to the appropriate department is seamless and transparent. Total quality starts and finishes with our customer service, and where cost and quality are perceived as given quantities the AVX service invariably has us selected as the preferred supplier. Facilities are equipped with instant worldwide computer and telecommunication links connected to every sales and production site worldwide. That ensures that our customers delivery requirements are consistently met wherever in the world they may be. 3 Technical Summary and Application Guidelines INTRODUCTION Tantalum capacitors are manufactured from a powder of pure tantalum metal. The typical particle size is between 2 and 10 m. Figure below shows typical powders. Note the very great difference in particle size between the powder CVs. 4000FV 20000FV 50000FV Figure 1. The powder is compressed under high pressure around a Tantalum wire (known as the Riser Wire) to form a "pellet". The riser wire is the anode connection to the capacitor. This is subsequently vacuum sintered at high temperature (typically 1400 - 1800C). This helps to drive off any impurities within the powder by migration to the surface. During sintering the powder becomes a sponge like structure with all the particles interconnected in a huge lattice. This structure is of high mechanical strength and density, but is also highly porous giving a large internal surface area (see Figure 2). The larger the surface area the larger the capacitance. Thus high CV (capacitance/voltage product) powders, which have a low average particle size, are used for low voltage, high capacitance parts. By choosing which powder is used to produce each capacitance/voltage rating the surface area can be controlled. The following example uses a 220F 10V capacitor to illustrate the point. A C= o r d where o is the dielectric constant of free space (8.855 x 10-12 Farads/m) r is the relative dielectric constant for Tantalum Pentoxide (27) and d is the dielectric thickness in meters C is the capacitance in Farads A is the surface area in meters Rearranging this equation gives: A= Cd or thus for a 220F 10V capacitor the surface area is 550 square centimeters, or nearly twice the size of this page. The dielectric is then formed over all the tantalum surfaces by the electrochemical process of anodization. To achieve this, the "pellet" is dipped into a very weak solution of phosphoric acid. The dielectric thickness is controlled by the voltage applied during the forming process. Initially the power supply is kept in a constant current mode until the correct thickness of dielectric has been reached (that is the voltage reaches the `forming voltage'), it then switches to constant voltage mode and the current decays to close to zero. Figure 2. Sintered Tantalum The chemical equations describing the process are as follows: Anode: Cathode: 2 Ta 2 Ta5+ + 10 e 2 Ta5+ + 10 OH- Ta2O5 + 5 H2O 10 H2O - 10 e 5H2 + 10 OH- The oxide forms on the surface of the Tantalum but it also grows into the metal. For each unit of oxide two thirds grows out and one third grows in. It is for this reason that there is a limit on the maximum voltage rating of Tantalum capacitors with present technology powders (see Figure 3). The dielectric operates under high electrical stress. Consider a 220F 10V part: Formation voltage = Formation Ratio x Working Voltage = 3.5 x 10 = 35 Volts 35 Technical Summary and Application Guidelines The pentoxide (Ta2O5) dielectric grows at a rate of 1.7 x 10-9 m/V Dielectric thickness (d) = 35 x 1.7 x 10-9 = 0.06 m Electric Field strength = Working Voltage / d = 167 KV/mm Tantalum Dielectric Oxide Film Manganese Dioxide Tantalum Figure 4. Manganese Dioxide Layer Dielectric Oxide Film Figure 3. Dielectric Layer The next stage is the production of the cathode plate. This is achieved by pyrolysis of Manganese Nitrate into Manganese Dioxide. The "pellet" is dipped into an aqueous solution of nitrate and then baked in an oven at approximately 250C to produce the dioxide coat. The chemical equation is: Mn (NO3)2 Mn O2 + 2NO2 This process is repeated several times through varying specific densities of nitrate to build up a thick coat over all internal and external surfaces of the "pellet", as shown in Figure 4. The "pellet" is then dipped into graphite and silver to provide a good connection to the Manganese Dioxide cathode plate. Electrical contact is established by deposition of carbon onto the surface of the cathode. The carbon is then coated with a conductive material to facilitate connection to the cathode termination (see Figure 5). Packaging is carried out to meet individual specifications and customer requirements. This manufacturing technique is adhered to for the whole range of AVX tantalum capacitors, which can be sub-divided into four basic groups: Chip / Resin dipped / Rectangular boxed / Axial. Further information on the production of Tantalum Capacitors can be obtained from the technical paper "Basic Tantalum Technology", by John Gill, available from your local AVX representative. Figure 5. Anode 36 Manganese Dioxide Graphite Outer Silver Layer Silver Epoxy Cathode Connection Technical Summary and Application Guidelines SECTION 1 ELECTRICAL CHARACTERISTICS AND EXPLANATION OF TERMS 1.1 CAPACITANCE 1.2 VOLTAGE 1.1.1 Rated capacitance (CR). This is the nominal rated capacitance. For tantalum capacitors it is measured as the capacitance of the equivalent series circuit at 20C using a measuring bridge supplied by a 0.5Vpk-pk 120Hz sinusoidal signal, free of harmonics with a maximum bias of 2.2Vd.c. 1.1.2 Capacitance tolerance. This is the permissible variation of the actual value of the capacitance from the rated value. For additional reading, please consult the AVX technical publication "Capacitance Tolerances for Solid Tantalum Capacitors". 1.2.1 Rated d.c. voltage (VR) This is the rated d.c. voltage for continuous operation at 85C. 1.2.2 Category voltage (VC) This is the maximum voltage that may be applied continuously to a capacitor. It is equal to the rated voltage up to +85C, beyond which it is subject to a linear derating, to 2/3 VR at 125C. MAXIMUM CATEGORY VOLTAGE vs. TEMPERATURE 1.1.3 Temperature dependence of capacitance. 100 % Rated Voltage The capacitance of a tantalum capacitor varies with temperature. This variation itself is dependent to a small extent on the rated voltage and capacitor size. TYPICAL CAPACITANCE vs. TEMPERATURE 15 % Capacitance 10 80 70 60 50 75 5 85 95 105 115 125 Temperature (C) 0 1.2.3 Surge voltage (VS) -5 -10 -15 -55 -25 0 25 50 75 100 125 Temperature (C) 1.1.4 Frequency dependence of the capacitance. The effective capacitance decreases as frequency increases. Beyond 100KHz the capacitance continues to drop until resonance is reached (typically between 0.5 - 5MHz depending on the rating). Beyond the resonant frequency the device becomes inductive. TAJE227K010 CAPACITANCE vs. FREQUENCY 250 200 Capacitance (F) 90 This is the highest voltage that may be applied to a capacitor for short periods of time in circuits with minimum series resistance of 1Kohm. The surge voltage may be applied up to 10 times in an hour for periods of up to 30 seconds at a time. The surge voltage must not be used as a parameter in the design of circuits in which, in the normal course of operation, the capacitor is periodically charged and discharged. 85C 125C Rated Voltage (Vdc.) Surge Voltage (Vdc.) Category Voltage (Vdc.) Surge Voltage (Vdc.) 4 6.3 10 16 20 25 35 50 5.2 8 13 20 26 32 46 65 2.7 4 7.0 10 13 17 23 33 3.2 5 8 12 16 20 28 40 150 1.2.4 Effect of surges 100 50 0 100 1000 10000 100000 1000000 The solid Tantalum capacitor has a limited ability to withstand voltage and current surges. This is in common with all other electrolytic capacitors and is due to the fact that they operate under very high electrical stress across the dielectric. For example a 25 volt capacitor has an Electrical Field of 147 KV/mm when operated at rated voltage. Frequency (Hz) 37 Technical Summary and Application Guidelines NOTE: While testing a circuit (e.g. at ICT or functional) it is likely that the capacitors will be subjected to large voltage and current transients, which will not be seen in normal use. These conditions should be borne in mind when considering the capacitor's rated voltage for use. These can be controlled by ensuring a correct test resistance is used. 1.2.5 Reverse voltage and Non-Polar operation. The values quoted are the maximum levels of reverse voltage which should appear on the capacitors at any time. These limits are based on the assumption that the capacitors are polarized in the correct direction for the majority of their working life. They are intended to cover short term reversals of polarity such as those occurring during switching transients of during a minor portion of an impressed waveform. Continuous application of reverse voltage without normal polarization will result in a degradation of leakage current. In conditions under which continuous application of a reverse voltage could occur two similar capacitors should be used in a back-to-back configuration with the negative terminations connected together. Under most conditions this combination will have a capacitance one half of the nominal capacitance of either capacitor. Under conditions of isolated pulses or during the first few cycles, the capacitance may approach the full nominal value. The reverse voltage ratings are designed to cover exceptional conditions of small level excursions into incorrect polarity. The values quoted are not intended to cover continuous reverse operation. The peak reverse voltage applied to the capacitor must not exceed: 38 10% of the rated d.c. working voltage to a maximum of 1.0v at 25C 3% of the rated d.c. working voltage to a maximum of 0.5v at 85C 1% of the category d.c. working voltage to a maximum of 0.1v at 125C LEAKAGE CURRENT vs. BIAS VOLTAGE 10 8 Leakage Current (A) It is important to ensure that the voltage across the terminals of the capacitor never exceeds the specified surge voltage rating. Solid tantalum capacitors have a self healing ability provided by the Manganese Dioxide semiconducting layer used as the negative plate. However, this is limited in low impedance applications. In the case of low impedance circuits, the capacitor is likely to be stressed by current surges. Derating the capacitor by 50% or more increases the reliability of the component. (See Figure 2 page 45). The "AVX Recommended Derating Table" (page 46) summarizes voltage rating for use on common voltage rails, in low impedance applications. In circuits which undergo rapid charge or discharge a protective resistor of 1/V is recommended. If this is impossible, a derating factor of up to 70% should be used. In such situations a higher voltage may be needed than is available as a single capacitor. A series combination should be used to increase the working voltage of the equivalent capacitor: For example two 22F 25V parts in series is equivalent to one 11F 50V part. For further details refer to J.A. Gill's paper "Investigation into the effects of connecting Tantalum capacitors in series", available from AVX offices worldwide. 6 4 2 0 -2 -4 -6 -8 -10 -20 0 20 40 60 80 100 Applied Voltage (Volts) TAJD336M006 TAJD476M010 TAJD336M016 TAJC685M020 1.2.6 Superimposed A.C. Voltage (Vr.m.s.) Ripple Voltage. This is the maximum r.m.s. alternating voltage; superimposed on a d.c. voltage, that may be applied to a capacitor. The sum of the d.c. voltage and peak value of the super-imposed a.c. voltage must not exceed the category voltage, Vc. Full details are given in Section 2. 1.2.7 Forming voltage. This is the voltage at which the anode oxide is formed. The thickness of this oxide layer is proportional to the formation voltage for a tantalum capacitor and is a factor in setting the rated voltage. 1.3 DISSIPATION FACTOR AND TANGENT OF LOSS ANGLE (TAN ) 1.3.1 Dissipation factor (D.F.). Dissipation factor is the measurement of the tangent of the loss angle (tan ) expressed as a percentage. The measurement of DF is carried out using a measuring bridge which supplies a 0.5Vpk-pk 120Hz sinusoidal signal, free of harmonics with a maximum bias of 2.2Vdc. The value of DF is temperature and frequency dependent. Note: For surface mounted products the maximum allowed DF values are indicated in the ratings table and it is important to note that these are the limits met by the component AFTER soldering onto the substrate. Technical Summary and Application Guidelines 1.3.2 Tangent of Loss Angle (tan ). This is a measurement of the energy loss in the capacitor. It is expressed as tan and is the power loss of the capacitor divided by its reactive power at a sinusoidal voltage of specified frequency. Terms also used are power factor, loss factor and dielectric loss. Cos (90 - ) is the true power factor. The measurement of tan is carried out using a measuring bridge which supplies a 0.5Vpk-pk 120Hz sinusoidal signal, free of harmonics with a maximum bias of 2.2Vdc. 1.3.3 Frequency dependence of Dissipation Factor. Dissipation Factor increases with frequency as shown in the typical curves: Typical DF vs Frequency 50 DF Multiplier 5 1 of the impedance Z. The impedance is measured at 20C and 100kHz. 1.4.2 Equivalent Series Resistance, ESR. Resistance losses occur in all practical forms of capacitors. These are made up from several different mechanisms, including resistance in components and contacts, viscous forces within the dielectric and defects producing bypass current paths. To express the effect of these losses they are considered as the ESR of the capacitor. The ESR is frequency dependent and can be found by using the relationship; tan ESR = 2fC Where f is the frequency in Hz, and C is the capacitance in farads. The ESR is measured at 20C and 100kHz. ESR is one of the contributing factors to impedance, and at high frequencies (100kHz and above) it becomes the dominant factor. Thus ESR and impedance become almost identical, impedance being only marginally higher. 1.4.3 Frequency dependence of Impedance and ESR. 0.1 0.1 1 10 100 Frequency (kHz) 1.3.4 Temperature dependence of Dissipation Factor. ESR and Impedance both increase with decreasing frequency. At lower frequencies the values diverge as the extra contributions to impedance (due to the reactance of the capacitor) become more significant. Beyond 1MHz (and beyond the resonant point of the capacitor) impedance again increases due to the inductance of the capacitor. Typical ESR vs Frequency Dissipation factor varies with temperature as the typical curves show. For maximum limits please refer to ratings tables. ESR Multiplier Typical DF vs Temperature DF Multiplier 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 -55 -5 45 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 0.1 95 This is the ratio of voltage to current at a specified frequency. Three factors contribute to the impedance of a tantalum capacitor; the resistance of the semiconductor layer; the capacitance value and the inductance of the electrodes and leads. At high frequencies the inductance of the leads becomes a limiting factor. The temperature and frequency behavior of these three factors of impedance determine the behavior 100 1000 100 Impedance Multiplier 1.4.1 Impedance, Z. 10 Frequency (kHz) Typical Impedance vs Frequency Temperature (Celcius) 1.4 IMPEDANCE, (Z) AND EQUIVALENT SERIES RESISTANCE (ESR) 1 10 1 0.1 0.1 1 10 100 1000 Frequency (kHz) 39 Technical Summary and Application Guidelines 1.4.4 Temperature dependence of the Impedance and ESR. At 100kHz, impedance and ESR behave identically and decrease with increasing temperature as the typical curves show. Typical 100kHz ESR vs Temperature 1.5.3 Voltage dependence of the leakage current. The leakage current drops rapidly below the value corresponding to the rated voltage VR when reduced voltages are applied. The effect of voltage derating on the leakage current is shown in the graph. This will also give a significant increase in the reliability for any application. See Section 3.1 for details. Change in ESR 1.8 LEAKAGE CURRENT vs. RATED VOLTAGE 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 Leakage Current ratio I/IVR Typical Range 0.1 1 0.9 0.8 -55 -40 -20 0 20 40 60 80 100 125 Temperature (Celcius) 1.5 D.C. LEAKAGE CURRENT 0.01 0 20 40 60 80 100 Rated Voltage (VR) % 1.5.1 Leakage current. The leakage current is dependent on the voltage applied, the elapsed time since the voltage was applied and the component temperature. It is measured at +20C with the rated voltage applied. A protective resistance of 1000 is connected in series with the capacitor in the measuring circuit. Three to five minutes after application of the rated voltage the leakage current must not exceed the maximum values indicated in the ratings table. These are based on the formulae 0.01CV or 0.5A (whichever is the greater). Reforming of tantalum capacitors is unnecessary even after prolonged storage periods without the application of voltage. 1.5.2 Temperature dependence of the leakage current. The leakage current increases with higher temperatures, typical values are shown in the graph. For operation between 85C and 125C, the maximum working voltage must be derated and can be found from the following formula. Vmax = 1- (T - 85) x VR volts, where T is the required 125 operating temperature. LEAKAGE CURRENT vs. TEMPERATURE 10 Leakage current 1 ratio I/IR20 0.1 -55 -40 -20 40 0 20 40 60 80 100 +125 Temperature (C) For additional information on Leakage Current, please consult the AVX technical publication "Analysis of Solid Tantalum Capacitor Leakage Current" by R. W. Franklin. 1.5.4 Ripple current. The maximum ripple current allowed is derived from the power dissipation limits for a given temperature rise above ambient temperature (please refer to Section 2). Technical Summary and Application Guidelines SECTION 2 A.C. OPERATION, RIPPLE VOLTAGE AND RIPPLE CURRENT 2.1 RIPPLE RATINGS (A.C.) In an a.c. application heat is generated within the capacitor by both the a.c. component of the signal (which will depend upon the signal form, amplitude and frequency), and by the d.c. leakage. For practical purposes the second factor is insignificant. The actual power dissipated in the capacitor is calculated using the formula: P= I2 R and rearranged to I = (PR) .....(Eq. 1) and substituting where I R E P Z P= E R Z2 = rms ripple current, amperes = equivalent series resistance, ohms = rms ripple voltage, volts = power dissipated, watts = impedance, ohms, at frequency under consideration Where P is the maximum permissible power dissipated as listed for the product under consideration (see tables). However care must be taken to ensure that: 1. The d.c. working voltage of the capacitor must not be exceeded by the sum of the positive peak of the applied a.c. voltage and the d.c. bias voltage. 2. The sum of the applied d.c. bias voltage and the negative peak of the a.c. voltage must not allow a voltage reversal in excess of the "Reverse Voltage". 2 Maximum a.c. ripple voltage (Emax). From the previous equation: E max = Z (PR) Historical ripple calculations. Previous ripple current and voltage values were calculated using an empirically derived power dissipation required to give a 10C rise of the capacitors body temperature from room temperature, usually in free air. These values are shown in Table I. Equation 1 then allows the maximum ripple current to be established, and Equation 2, the maximum ripple voltage. But as has been shown in the AVX article on thermal management by I. Salisbury, the thermal conductivity of a Tantalum chip capacitor varies considerably depending upon how it is mounted. .....(Eq. 2) Table I: Power Dissipation Ratings (In Free Air) TAJ/TPS/CWR11/THJ Series Molded Chip Case size A B C D E R S T V W Y Max. power dissipation (W) 0.075 0.085 0.110 0.150 0.165 0.055 0.065 0.080 0.250 0.090 0.125 TAZ/CWR09 Series Molded Chip Case size A B C D E F G H Max. power dissipation (W) 0.050 0.070 0.075 0.080 0.090 0.100 0.125 0.150 TAJ/TPS/CWR11/THJ TAZ/CWR09 Series Molded Chip Temperature correction factor for ripple current Temp. C Factor +25 1.0 +55 0.95 +85 0.90 +125 0.40 41 Technical Summary and Application Guidelines A piece of equipment was designed which would pass sine and square wave currents of varying amplitudes through a biased capacitor. The temperature rise seen on the body for the capacitor was then measured using an infra-red probe. This ensured that there was no heat loss through any thermocouple attached to the capacitor's surface. Results for the C, D and E case sizes 70 Temperature rise (C) 60 50 40 100KHz 1 MHz 30 20 0 0.00 C case 60 50 D case 40 30 20 10 0 0 0.20 0.40 0.60 0.80 RMS current (Amps) 1.00 1.20 If I 2R is then plotted it can be seen that the two lines are in fact coincident, as shown in figure below. E case 70.00 60.00 0.1 0.2 0.3 0.4 0.5 Power (Watts) Several capacitors were tested and the combined results are shown above. All these capacitors were measured on FR4 board, with no other heatsinking. The ripple was supplied at various frequencies from 1KHz to 1MHz. As can be seen in the figure above, the average Pmax value for the C case capacitors was 0.11 Watts. This is the same as that quoted in Table I. The D case capacitors gave an average Pmax value 0.125 Watts. This is lower than the value quoted in the Table I by 0.025 Watts. The E case capacitors gave an average Pmax of 0.200 Watts which was much higher than the 0.165 Watts from Table I. If a typical capacitor's ESR with frequency is considered, e.g. figure below, it can be seen that there is variation. Thus for a set ripple current, the amount of power to be dissipated by the capacitor will vary with frequency. This is clearly shown in figure in top of next column, which shows that the surface temperature of the unit rises less for a given value of ripple current at 1MHz than at 100KHz. The graph below shows a typical ESR variation with frequency. Typical ripple current versus temperature rise for 100KHz and 1MHz sine wave inputs. ESR vs. FREQUENCY Temperature Rise (C) Temperature rise ( o C) 10 100 90 80 70 50.00 40.00 100KHz 30.00 1 MHz 20.00 10.00 0.00 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 FR 0.45 0.50 Example A Tantalum capacitor is being used in a filtering application, where it will be required to handle a 2 Amp peak-to-peak, 200KHz square wave current. A square wave is the sum of an infinite series of sine waves at all the odd harmonics of the square waves fundamental frequency. The equation which relates is: ISquare = Ipksin (2) + Ipk sin (6) + Ipk sin (10) + Ipk sin (14) +... Thus the special components are: Frequency 200 KHz 600 KHz 1 MHz 1.4 MHz Peak-to-peak current (Amps) 2.000 0.667 0.400 0.286 RMS current (Amps) 0.707 0.236 0.141 0.101 Let us assume the capacitor is a TAJD686M006 Typical ESR measurements would yield. (TPSE107M016R0100) ESR (Ohms) 1 Frequency 200 KHz 600 KHz 1 MHz 1.4 MHz 0.1 0.01 100 1000 10000 Frequency (Hz) 42 100000 1000000 Typical ESR (Ohms) 0.120 0.115 0.090 0.100 Power (Watts) Irms2 x ESR 0.060 0.006 0.002 0.001 Thus the total power dissipation would be 0.069 Watts. From the D case results shown in figure top of previous column, it can be seen that this power would cause the capacitors surface temperature to rise by about 5C. For additional information, please refer to the AVX technical publication "Ripple Rating of Tantalum Chip Capacitors" by R.W. Franklin. Technical Summary and Application Guidelines 2.2 Thermal Management The heat generated inside a tantalum capacitor in a.c. operation comes from the power dissipation due to ripple current. It is equal to I2R, where I is the rms value of the current at a given frequency, and R is the ESR at the same frequency with an additional contribution due to the leakage current. The heat will be transferred from the outer surface by conduction. How efficiently it is transferred from this point is dependent on the thermal management of the board. The power dissipation ratings given in Section 2.1 are based on free-air calculations. These ratings can be approached if efficient heat sinking and/or forced cooling is used. In practice, in a high density assembly with no specific thermal management, the power dissipation required to give a 10C rise above ambient may be up to a factor of 10 less. In these cases, the actual capacitor temperature should be established (either by thermocouple probe or infra-red scanner) and if it is seen to be above this limit it may be necessary to specify a lower ESR part or a higher voltage rating. Please contact application engineering for details or contact the AVX technical publication entitled "Thermal Management of Surface Mounted Tantalum Capacitors" by Ian Salisbury. Thermal Dissipation from the Mounted Chip ENCAPSULANT LEAD FRAME TANTALUM ANODE COPPER SOLDER PRINTED CIRCUIT BOARD Thermal Impedance Graph with Ripple Current THERMAL IMPEDANCE GRAPH C CASE SIZE CAPACITOR BODY 140 TEMPERATURE DEG C 121 C\WATT 120 100 236 C\WATT 80 60 40 20 0 0 73 C\WATT X X X X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 POWER IN UNIT CASE, DC WATTS = PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP = CAP IN FREE AIR 43 Technical Summary and Application Guidelines SECTION 3 RELIABILITY AND CALCULATION OF FAILURE RATE 3.1 STEADY-STATE Figure 1. Tantalum Reliability Curve Infant Mortalities Figure 2a. Correction factor to failure rate F for voltage derating of a typical component (60% con. level). 1.0000 Correction Factor Tantalum Dielectric has essentially no wear out mechanism and in certain circumstances is capable of limited self healing. However, random failures can occur in operation. The failure rate of Tantalum capacitors will decrease with time and not increase as with other electrolytic capacitors and other electronic components. 0.1000 0.0100 0.0010 0.0001 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Applied Voltage / Rated Voltage Infinite Useful Life Figure 2b. Gives our recommendation for voltage derating to be used in typical applications. Useful life reliability can be altered by voltage derating, temperature or series resistance where FU is a correction factor due to operating voltage/voltage derating FT is a correction factor due to operating temperature FR is a correction factor due to circuit series resistance FB is the basic failure rate level. For standard Tantalum product this is 1%/1000 hours Operating Voltage (V) The useful life reliability of the Tantalum capacitor is affected by three factors. The equation from which the failure rate can be calculated is: F = FU x FT x FR x FB 40 If a capacitor with a higher voltage rating than the maximum line voltage is used, then the operating reliability will be improved. This is known as voltage derating. The graph, Figure 2a, shows the relationship between voltage derating (the ratio between applied and rated voltage) and the failure rate. The graph gives the correction factor FU for any operating voltage. 44 10 Specified Range in Low Impedance Circuit 4 6.3 10 16 20 25 Rated Voltage (V) 35 50 Figure 2c. Gives voltage derating recommendations as a function of circuit impedance. Working Voltage/Rated Voltage Operating voltage/voltage derating. Specified Range in General Circuit 20 0 Base failure rate. Standard tantalum product conforms to Level M reliability (i.e., 1%/1000 hrs.) at rated voltage, rated temperature, and 0.1/volt circuit impedance. This is known as the base failure rate, FB, which is used for calculating operating reliability. The effect of varying the operating conditions on failure rate is shown on this page. 30 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.01 Recommended Range 0.1 100 1.0 10 Circuit Resistance (Ohm/V) 1000 10000 Technical Summary and Application Guidelines Operating Temperature. Example calculation If the operating temperature is below the rated temperature for the capacitor then the operating reliability will be improved as shown in Figure 3. This graph gives a correction factor FT for any temperature of operation. Consider a 12 volt power line. The designer needs about 10F of capacitance to act as a decoupling capacitor near a video bandwidth amplifier. Thus the circuit impedance will be limited only by the output impedance of the board's power unit and the track resistance. Let us assume it to be about 2 Ohms minimum, i.e. 0.167 Ohms/Volt. The operating temperature range is -25C to +85C. If a 10F 16 Volt capacitor was designed in the operating failure rate would be as follows. a) FT = 1.0 @ 85C b) FR = 0.85 @ 0.167 Ohms/Volt c) FU = 0.08 @ applied voltage/rated voltage = 75% d) FB = 1%/1000 hours, basic failure rate level Thus F = 1.0 x 0.85 x 0.08 x 1 = 0.068%/1000 Hours If the capacitor was changed for a 20 volt capacitor, the operating failure rate will change as shown. FU = 0.018 @ applied voltage/rated voltage = 60% F = 1.0 x 0.85 x 0.018 x 1 = 0.0153%/1000 Hours Figure 3: Correction factor to failure rate F for ambient temperature T for typical component (60% con. level). Correction Factor 100.0 10.0 1.0 0.10 0.01 20 30 40 50 60 70 80 90 100 110 120 Temperature Circuit Impedance. All solid tantalum capacitors require current limiting resistance to protect the dielectric from surges. A series resistor is recommended for this purpose. A lower circuit impedance may cause an increase in failure rate, especially at temperatures higher than 20C. An inductive low impedance circuit may apply voltage surges to the capacitor and similarly a non-inductive circuit may apply current surges to the capacitor, causing localized over-heating and failure. The recommended impedance is 1 per volt. Where this is not feasible, equivalent voltage derating should be used (See MIL HANDBOOK 217E). The graph, Figure 4, shows the correction factor, FR, for increasing series resistance. 3.2 Dynamic. As stated in Section 1.2.4, the solid Tantalum capacitor has a limited ability to withstand voltage and current surges. Such current surges can cause a capacitor to fail. The expected failure rate cannot be calculated by a simple formula as in the case of steady-state reliability. The two parameters under the control of the circuit design engineer known to reduce the incidence of failures are derating and series resistance. The table below summarizes the results of trials carried out at AVX with a piece of equipment which has very low series resistance with no voltage derating applied. That is the capacitor was tested at its rated voltage. Results of production scale derating experiment Figure 4. Correction factor to failure rate F for series resistance R on basic failure rate FB for a typical component (60% con. level). Circuit resistance ohms/volt 3.0 2.0 1.0 0.8 0.6 0.4 0.2 0.1 Capacitance and Voltage 47F 16V 100F 10V 22F 25V Number of units tested 1,547,587 632,876 2,256,258 50% derating applied 0.03% 0.01% 0.05% No derating applied 1.1% 0.5% 0.3% FR 0.07 0.1 0.2 0.3 0.4 0.6 0.8 1.0 For circuit impedances below 0.1 ohms per volt, or for any mission critical application, circuit protection should be considered. An ideal solution would be to employ an AVX SMT thin-film fuse in series. As can clearly be seen from the results of this experiment, the more derating applied by the user, the less likely the probability of a surge failure occurring. It must be remembered that these results were derived from a highly accelerated surge test machine, and failure rates in the low ppm are more likely with the end customer. A commonly held misconception is that the leakage current of a Tantalum capacitor can predict the number of failures which will be seen on a surge screen. This can be disproved by the results of an experiment carried out at AVX on 47F 10V surface mount capacitors with different leakage currents. The results are summarized in the table on the following page. 45 Technical Summary and Application Guidelines Leakage current vs number of surge failures Standard leakage range 0.1 A to 1A Over Catalog limit 5A to 50A Classified Short Circuit 50A to 500A Number tested 10,000 Number failed surge 25 10,000 26 10,000 25 Again, it must be remembered that these results were derived from a highly accelerated surge test machine, and failure rates in the low ppm are more likely with the end customer. AVX recommended derating table Voltage Rail 3.3 5 10 12 15 24 Working Cap Voltage 6.3 10 20 25 35 Series Combinations (11) For further details on surge in Tantalum capacitors refer to J.A. Gill's paper "Surge in solid Tantalum capacitors", available from AVX offices worldwide. An added bonus of increasing the derating applied in a circuit, to improve the ability of the capacitor to withstand surge conditions, is that the steady-state reliability is improved by up to an order. Consider the example of a 6.3 volt capacitor being used on a 5 volt rail. The steady-state reliability of a Tantalum capacitor is affected by three parameters; temperature, series resistance and voltage derating. Assume 40C operation and 0.1 Ohms/Volt series resistance. The capacitors reliability will therefore be: Failure rate = FU x FT x FR x 1%/1000 hours = 0.15 x 0.1 x 1 x 1%/1000 hours = 0.015%/1000 hours If a 10 volt capacitor was used instead, the new scaling factor would be 0.006, thus the steady-state reliability would be: Failure rate = FU x FT x FR x 1%/1000 hours = 0.006 x 0.1 x 1 x 1%/1000 hours = 6 x 10-4 %/1000 hours SECTION 4 APPLICATION GUIDELINES FOR TANTALUM CAPACITORS So there is an order improvement in the capacitors steadystate reliability. Soldering Conditions and Board Attachment. The soldering temperature and time should be the minimum for a good connection. A suitable combination for wavesoldering is 230 - 250C for 3 - 5 seconds. For vapor phase or infra-red reflow soldering the profile below shows allowable and dangerous time/temperature combinations. The profile refers to the peak reflow tempera- Allowable range of peak temp./time combination for wave soldering Allowable range of peak temp./time combination for IR reflow 270 260 260 Temperature ( oC) DANGEROUS RANGE 250 ALLOWABLE RANGE WITH CARE 240 Dangerous Range 250 Temperature 240 ( o C) 230 Allowable Range with Care 220 230 Allowable Range with Preheat 210 RECOMMENDED RANGE 220 200 0 210 0 15 30 TIME IN SECONDS Under the CECC 00 802 International Specification, AVX Tantalum capacitors are a Class A component. 46 ture and is designed to ensure that the temperature of the internal construction of the capacitor does not exceed 220C. Preheat conditions vary according to the reflow system used, maximum time and temperature would be 10 minutes at 150C. Small parametric shifts may be noted immediately after reflow, components should be allowed to stabilize at room temperature prior to electrical testing. Both TAJ and TAZ series are designed for reflow and wave soldering operations. In addition TAZ is available with gold terminations compatible with conductive epoxy or gold wire bonding for hybrid assemblies. 45 2 60 The capacitors can therefore be subjected to one IR reflow, one wave solder and one soldering iron cycle. 4 6 8 Soldering Time (secs.) 10 12 If more aggressive mounting techniques are to be used please consult AVX Tantalum for guidance. Technical Summary and Application Guidelines SECTION 4 APPLICATION GUIDELINES FOR TANTALUM CAPACITORS Recommended soldering profiles for surface mounting of tantalum capacitors is provided in figure below. IR REFLOW LEAD FREE PROGRAM AVX will implement a change to the termination finish on its TAJ, THJ and TPS series surface mount tantalum capacitors effective January 1, 2001. After that date all products manufactured will utilize lead free terminations. The termination is compatible with the following lead free solder pastes; SnCu, SnCuAg and SnCuAgBi. It is also compatible with existing SnPb solder pastes / systems in use today. The recommended IR reflow profile is shown below. LEAD FREE REFLOW PROFILE Recommended Ramp Rate Less than 2C/sec. WAVE SOLDERING 300 250 200 150 100 50 0 0 50 100 150 200 250 300 * Pre-heating: 150 15C / 60-90s * Max. Peak Gradient 2.5C/s * Peak Temperature: 240 5C * Time at >230C: 40s Max. The following should be noted by customers changing from lead based systems to the new lead free pastes. a) The visual standards used for evaluation of solder joints will need to be modified as lead free joints are not as bright as with tin-lead pastes and the fillet may not be as large. b) Resin color may darken slightly due to the increase in temperature required for the new pastes. c) Lead free solder pastes do not allow the same self alignment as lead containing systems. Standard mounting pads are acceptable, but machine set up may need to be modified. 47 Technical Summary and Application Guidelines SECTION 5 MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS 5.1 Acceleration Dimensions PS (Pad Separation) and PW (Pad Width) are calculated using dimensions x and z. Dimension y may vary, depending on whether reflow or wave soldering is to be performed. For reflow soldering, dimensions PL (Pad Length), PW (Pad Width), and PSL (Pad Set Length) have been calculated. For wave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up while ensuring that a good joint can be produced. 98.1m/s2 (10g) 5.2 Vibration Severity 10 to 2000Hz, 0.75mm of 98.1m/s2 (10g) 5.3 Shock Trapezoidal Pulse, 98.1m/s2 for 6ms. 5.4 Adhesion to Substrate IEC 384-3. minimum of 5N. 5.5 Resistance to Substrate Bending The component has compliant leads which reduces the risk of stress on the capacitor due to substrate bending. 5.6 Soldering Conditions Dip soldering is permissible provided the solder bath temperature is 270C, the solder time < 3 seconds and the circuit board thickness 1.0mm. NOTE: These recommendations (also in compliance with EIA) are guidelines only. With care and control, smaller footprints may be considered for reflow soldering. Nominal footprint and pad dimensions for each case size are given in the following tables: PAD DIMENSIONS: CASE TAJ 5.7 Installation Instructions The upper temperature limit (maximum capacitor surface temperature) must not be exceeded even under the most unfavorable conditions when the capacitor is installed. This must be considered particularly when it is positioned near components which radiate heat strongly (e.g. valves and power transistors). Furthermore, care must be taken, when bending the wires, that the bending forces do not strain the capacitor housing. 5.8 Installation Position No restriction. 5.9 Soldering Instructions Fluxes containing acids must not be used. 5.9.1 Guidelines for Surface Mount Footprints Component footprint and reflow pad design for AVX capacitors. The component footprint is defined as the maximum board area taken up by the terminators. The footprint dimensions are given by A, B, C and D in the diagram, which corresponds to W, max., A max., S min. and L max. for the component. The footprint is symmetric about the center lines. The dimensions x, y and z should be kept to a minimum to reduce rotational tendencies while allowing for visual inspection of the component and its solder fillet. D C z B A PL 48 PS PSL TAZ PL PS PW PWw 4.0 (0.157) 4.0 (0.157) 6.5 (0.256) 8.0 (0.315) 8.3 (0.325) 8.0 (0.315) 2.7 (0.100) 4.0 (0.160) 4.0 (0.160) 6.5 (0.256) 8.0 (0.315) 2.4 (0.095) 3.0 (0.120) 3.3 (0.126) 4.5 (0.178) 4.5 (0.178) 5.8 (0.228) 6.3 (0.248) 7.4 (0.293) 8.0 (0.313) 1.4 (0.054) 1.4 (0.054) 2.0 (0.079) 2.0 (0.079) 2.3 (0.090) 2.0 (0.079) 1.0 (0.040) 1.4 (0.050) 1.4 (0.050) 2.0 (0.079) 2.0 (0.079) 0.7 (0.027) 0.7 (0.027) 1.4 (0.054) 1.4 (0.054) 1.4 (0.054) 1.4 (0.054) 1.4 (0.054) 1.9 (0.074) 1.9 (0.074) 1.2 (0.047) 1.2 (0.047) 2.5 (0.098) 4.0 (0.157) 3.7 (0.145) 4.0 (0.157) 1.0 (0.040) 1.0 (0.040) 1.0 (0.040) 2.5 (0.098) 4.0 (0.157) 0.9 (0.035) 1.6 (0.063) 0.5 (0.020) 1.8 (0.070) 1.8 (0.070) 3.0 (0.120) 3.6 (0.140) 3.7 (0.145) 4.2 (0.165) 1.8 (0.071) 2.8 (0.110) 2.8 (0.110) 3.0 (0.119) 3.7 (0.145) 3.0 (0.119) 1.6 (0.060) 1.8 (0.070) 2.8 (0.110) 2.8 (0.110) 3.0 (0.119) 1.0 (0.039) 1.5 (0.059) 2.5 (0.098) 2.5 (0.098) 3.6 (0.143) 3.6 (0.143) 4.5 (0.178) 4.0 (0.157) 5.0 (0.197) 0.9 (0.035) 1.6 (0.063) 1.6 (0.063) 1.7 (0.068) 1.7 (0.068) 1.7 (0.068) 0.8 (0.030) 0.8 (0.030) 0.8 (0.030) 1.6 (0.063) 1.7 (0.068) 1.0 (0.039) 1.0 (0.039) 2.0 (0.079) 2.2 (0.085) 3.0 (0.119) 2.4 (0.095) 3.4 (0.135) 5.10 PCB Cleaning Ta chip capacitors are compatible with most PCB board cleaning systems. If aqueous cleaning is performed, parts must be allowed to dry prior to test. In the event ultrasonics are used power levels should be less than 10 watts per/litre, and care must be taken to avoid vibrational nodes in the cleaning bath. SECTION 6 EPOXY FLAMMABILITY EPOXY TAJ TPS TAZ THJ UL RATING UL94 V-0 UL94 V-0 UL94 V-0 UL94 V-0 OXYGEN INDEX 35% 35% 35% 35% Y x PW TAC A B C D V E R S T W Y L R A B D E F G H millimeters (inches) PSL SECTION 7 QUALIFICATION APPROVAL STATUS DESCRIPTION STYLE Surface mount capacitors TAJ TAZ SPECIFICATION CECC 30801 - 005 Issue 2 CECC 30801 - 011 Issue 1 MIL-C-55365/8 (CWR11) MIL-C-55365/4 (CWR09) TAJ, TPS, THJ & TAC Series Tape and Reel Packaging Tape and reel packaging for automatic component placement. Please enter required Suffix on order. Bulk packaging is not available. TAJ, TPS AND TAC TAPING SUFFIX TABLE Case Size Tape width reference mm A 8 B 8 C 12 D 12 E 12 V 12 R 8 S 8 T 8 W 12 Y 12 X 12 TACR 8 TACL 8 P mm 4 4 8 8 8 8 4 4 4 8 8 8 4 4 TAPE SPECIFICATION 100mm (4") reel 180mm (7") reel 330mm (13") reel Suffix Qty. Qty. 8000 8000 3000 2500 1500 1500 10000 10000 10000 5000 4000 5000 500 500 Qty. 2000 2000 500 500 400 400 2500 2500 2500 1000 1000 1000 2500 3500 Suffix S S S S S S S S S S S S X X Suffix R R R R R R R R R R R R R R Tape dimensions comply to EIA 481-1 Dimensions A0 and B0 of the pocket and the tape thickness, K, are dependent on the component size. Tape materials do not affect component solderability during storage. Carrier Tape Thickness <0.4mm. PLASTIC TAPE DIMENSIONS Code Ao Bo K W E F G P P2 Po D D1 A B C D E V W X Y R S T TACR TACL 1.830.1 3.150.1 3.450.1 4.480.1 4.500.1 6.430.1 3.570.1 4.670.1 4.670.1 1.650.1 1.950.1 3.200.1 1.650.1 1.100.1 3.570.1 3.770.1 6.40.1 7.620.1 7.50.1 7.440.1 6.40.1 7.620.1 7.620.1 2.450.1 3.550.1 3.80.1 2.450.1 20.1 1.870.1 2.220.1 2.920.1 3.220.1 4.50.1 3.840.1 1.650.1 1.650.1 2.150.1 1.30.1 1.30.1 1.350.1 1.30.1 1.10.1 80.3 80.3 120.3 120.3 120.3 120.3 120.3 120.3 120.3 80.3 80.3 80.3 80.3 80.3 1.750.1 1.750.1 1.750.1 1.750.1 1.750.1 1.750.1 1.750.1 1.750.1 1.750.1 1.750.1 1.750.1 1.750.1 1.750.1 1.750.1 3.50.05 3.50.05 5.50.05 5.50.05 5.50.05 5.50.05 5.50.05 5.50.05 5.50.05 3.50.05 3.50.05 3.50.05 3.50.05 3.50.05 0.75 min 0.75 min 0.75 min 0.75 min 0.75 min 0.75 min 0.75 min 0.75 min 0.75 min 0.75 min 0.75 min 0.75 min 0.75 min 0.75 min 40.1 40.1 80.1 80.1 80.1 80.1 80.1 80.1 80.1 40.1 40.1 40.1 40.1 40.1 20.05 20.05 20.05 20.05 20.05 20.05 20.05 20.05 20.05 20.05 20.05 20.05 20.05 20.05 40.1 40.1 40.1 40.1 40.1 40.1 40.1 40.1 40.1 40.1 40.1 40.1 40.1 40.1 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1+0.2-0.0 1+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1.5+0.2-0.0 1+0.2-0.0 1+0.2-0.0 1+0.2-0.0 1+0.2-0.0 1+0.2-0.0 t P P2 D P0 C E F B W G D1 A A0 +ve capacitor orientation W K REEL DIMENSIONS Code Tape R R S S X 12mm 8mm 12mm 8mm 8mm A 1802.0 1802.0 3302.0 3302.0 1002.0 B C W t 50 min 50 min 50 min 50 min 130.5 130.5 130.5 130.5 130.5 12.41.5,-0 8.41.5,-0 12.41.5,-0 8.41.5,-0 8.41.5,-0 1.50.5 1.50.5 1.50.5 1.50.5 1.50.5 Cover Tape Dimensions Thickness: 7525m Width of tape: 5.5mm + 0.2mm (8mm tape) 9.5mm + 0.2mm (12mm tape) 49 TAJ, THJ & TPS Marking For TAJ & TPS & THJ, the positive end of body has videcon readable polarity marking as shown in the diagram. Bodies are marked by indelible laser marking on top surface with capacitance value, voltage and date of manufacture and batch ID number. R case is an exception due to the small size in which only the voltage and capacitance values are printed. Year 1999 2000 2001 2002 Voltage Code F G J A C D E V T Year Code L M N P TAJ & TPS - A, B, C, D, E, S, T, V, W, Y AND X CASE: AVX LOGO Polarity Code (Anode) Capacitance Value in pF 227 = 220F 227 A M 1 5 B3 Rated Voltage Code A = 10V 2 Digit Batch ID Number Year Code M = 2000 Week Number TAJ - R CASE: Capacitance Value in pF 106 = 10F Polarity Code (Anode) 106 J Rated Voltage Code J = 6.3V THJ - A, B, C, D AND E CASE: AVX LOGO Polarity Code (Anode) Capacitance Value in pF 227 = 220F 227 A M 1 5 B4 Rated Voltage Code A = 10V 2 Digit Batch ID Number Year Code M = 2000 50 Week Number Rated Voltage at 85C 2 4 6.3 10 16 20 25 35 50 TAZ, CWR09, CWR11 Series Tape and Reel Packaging Solid Tantalum Chip TAZ Tape and reel packaging for automatic component placement. Please enter required Suffix on order. Bulk packaging is standard. TAZ TAPING SUFFIX TABLE Case Size reference Tape width mm P mm Suffix Qty. Suffix Qty. A 8 4 R 2500 S 9000 7" (180mm) reel B 12 4 R 2500 S 9000 D 12 4 R 2500 S 8000 E 12 4 R 2500 S 8000 F 12 8 R 1000 S 3000 G 12 8 R 500 S 2500 H 12 8 R 500 S 2500 40.1 or 80.1 (0.1570.004) Code P* Total Tape Thickness -- K max TAZ Case size Millimeters (Inches) reference DIM 13" reel (330mm) reel 8mm Tape (0.3150.004) A B D 2.0 (0.079) 4.0 (0.157) 4.0 (0.157) E F G H 4.0 (0.157) 4.0 (0.157) 4.0 (0.157) 4.0 (0.157) 12mm Tape 40.1 or 80.1 (0.1570.004) (0.3150.004) G 0.75 min (0.03 min) 0.75 min (0.03 min) F 3.50.05 (0.1380.002) 5.50.05 (0.220.002) E 1.750.1 (0.0690.004) 1.750.1 (0.0690.004) W 80.3 (0.3150.012) 120.3 (0.4720.012) P2 20.05 (0.0790.002) 20.05 (0.0790.002) P0 40.1 (0.1570.004) 40.1 (0.1570.004) D 1.50.1 -0 (0.0590.004) (-0) 1.50.1 -0 (0.0590.004) (-0) D1 1.0 min (0.039 min) 1.5 min (0.059 min) *See taping suffix tables for actual P dimension (component pitch). TAPE SPECIFICATION Tape dimensions comply to EIA RS 481 A Dimensions A0 and B0 of the pocket and the tape thickness, K, are dependent on the component size. Tape materials do not affect component solderability during storage. Carrier Tape Thickness <0.4mm 51 TAZ, CWR09, CWR11 Series Tape and Reel Packaging PLASTIC TAPE REEL DIMENSIONS T: 9.5mm (8mm tape) 13.0mm (12mm tape) A: See page 49 A max Standard Dimensions mm 50 min 20.2 min 12.8mm minimum diameter Cover Tape Dimensions Thickness: 7525 Width of tape: 5.5mm + 0.2mm (8mm tape) 9.5mm + 0.2mm (12mm tape) 2 0.5 T 1.0 Waffle Packaging - 2" x 2" hard plastic waffle trays. To order Waffle packaging use a "W" in part numbers packaging position. TAZ A Maximum Quantity Per Waffle 160 TAZ B 112 TAZ D 88 TAZ E 60 Case Size 52 TAZ F 48 TAZ G 50 TAZ H 28 CWR11 A 96 CWR11 B 72 CWR11 C 54 CWR11 D 28 NOTE: Orientation of parts in waffle packs varies by case size. Product Safety Information Sheet Material Data and Handling This should be read in conjunction with the Product Data Sheet. Failure to observe the ratings and the information on this sheet may result in a safety hazard. 1. Material Content Solid tantalum capacitors do not contain liquid hazardous materials. The operating section contains: Tantalum Graphite/carbon Tantalum oxide Conducting paint/resins Manganese dioxide Fluoropolymers (not TAC) The encapsulation contains: TAA - solder, metal case, solder coated terminal wires, glass seal and plastic sleeve TAC - epoxy molding compound, tin coated terminal pads TAJ - epoxy molding compound, solder coated terminal pads TAP - solder, solder coated terminal wires, epoxy dipped resin THJ - epoxy molding compound, solder coated terminal pads TPS - epoxy molding compound, solder coated terminal pads The epoxy resins may contain Antimony trioxide and Bromine compounds as fire retardants. The capacitors do not contain PBB or PBBO/PBBE. The solder alloys may contain lead. 2. Physical Form These capacitors are physically small and are either rectangular with solderable terminal pads, or cylindrical or bead shaped with solderable terminal wires. 3. Intrinsic Properties Operating Solid tantalum capacitors are polarized devices and operate satisfactorily in the correct d.c. mode. They will withstand a limited application of reverse voltage as stated in the data sheets. However, a reverse application of the rated voltage will result in early short circuit failure and may result in fire or explosion. Consequential failure of other associated components in the circuit e.g. diodes, transformers, etc. may also occur. When operated in the correct polarity, a long period of satisfactory operation will be obtained but failure may occur for any of the following reasons: * normal failure rate * temperature too high * surge voltage exceeded * ripple rating exceeded * reverse voltage exceeded If this failure mode is a short circuit, the previous conditions apply. If the adjacent circuit impedance is low, voltage or current surges may exceed the power handling capability of the capacitor. For this reason capacitors in circuits of below 3/V should be derated by 50% and precautions taken to prevent reverse voltage spikes. Where capacitors may be subjected to fast switched, low impedance source voltages, the manufacturers advice should be sought to determine the most suitable capacitors for such applications. Non-operating Solid tantalum capacitors contain no liquids or noxious gases to leak out. However, cracking or damage to the encapsulation may lead to premature failure due to ingress of material such as cleaning fluids or to stresses transmitted to the tantalum anode. 4. Fire Characteristics Primary Any component subject to abnormal power dissipation may * self ignite * become red hot * break open or explode emitting flaming or red hot material, solid, molten or gaseous. Fumes from burning components will vary in composition depending on the temperature, and should be considered to be hazardous, although fumes from a single component in a well ventilated area are unlikely to cause problems. Secondary Induced ignition may occur from an adjacent burning or red hot component. Epoxy resins used in the manufacture of capacitors give off noxious fumes when burning as stated above. Wherever possible, capacitors comply with the following: BS EN 60065 UL 492.60A/280 LOI (ASTM D2863-70) as stated in the data sheets. 5. Storage Solid tantalum capacitors exhibit a very low random failure rate after long periods of storage and apart from this there are no known modes of failure under normal storage conditions. All capacitors will withstand any environmental conditions within their ratings for the periods given in the detail specifications. Storage for longer periods under high humidity conditions may affect the leakage current of resin protected capacitors. Solderability of solder coated surfaces may be affected by storage of excess of one year under high temperatures (>40C) or humidity (>80%RH). 6. Disposal Incineration of epoxy coated capacitors will cause emission of noxious fumes and metal cased capacitors may explode due to build up of internal gas pressure. Disposal by any other means normally involves no special hazards. Large quantities may have salvage value. 7. Unsafe Use Most failures are of a passive nature and do not represent a safety hazard. A hazard may, however, arise if this failure causes a dangerous malfunction of the equipment in which the capacitor is employed. Circuits should be designed to fail safe under the normal modes of failure. The usual failure mode is an increase in leakage current or short circuit. Other possible modes are decrease of capacitance, increase in dissipation factor (and impedance) or an open-circuit. Operations outside the ratings quoted in the data sheets represents unsafe use. 8. Handling Careless handling of the cut terminal leads could result in scratches and/or skin punctures. Hands should be washed after handling solder coated terminals before eating or smoking, to avoid ingestion of lead. Capacitors must be kept out of the reach of small children. Care must be taken to discharge capacitors before handling as capacitors may retain a residual charge even after equipment in which they are being used has been switched off. Sparks from the discharge could ignite a flammable vapor. 53 Product Safety Information Sheet Environmental Information AVX has always sought to minimize the environmental impact of its manufacturing operations and of its tantalum capacitors supplied to customers throughout the world. We have a policy of preventing and minimizing waste streams during manufacture, and recycling materials wherever possible. We actively avoid or minimize environmentally hazardous materials in our production processes. 1. Material Content 3. Future Proposals Lead TAJ, TPS and THJ series supplied today are electroplated over the terminal contact area with 90:10 tin:lead alloy. Although the lead comprises much less than 0.2% of the component weight, TAC series currently have lead free (100% tin) terminations. Parts will be converted to 100% tin in 2001. For customers wishing to assess the environmental impact of AVX's capacitors contained in waste electrical and electronic equipment, the following information is provided: Surface mount tantalum capacitors contain: Tantalum and Tantalum oxide Manganese dioxide Carbon/graphite Silver Nickel-iron alloy or Copper alloy depending on design (consult factory for details) Tin-lead alloy plating Polymers including fluorinated polymers Epoxide resin encapsulant The encapsulant is made fire retardant to UL 94 V-0 by the inclusion of inert mineral filler, antimony trioxide and an organic bromine compound. 4. Fire Retardants 2. AVX capacitors do not contain any Poly Brominated Biphenyl (PBB) or PBBE/PBBO. 6. Recycling The approximate content of some materials is given in the table below: Case Size Typical Weight mg Lead % Antimony Trioxide % A B C D E 25 65 137 330 460 0.13 0.11 0.04 0.023 0.017 1.7 1.4 2.3 1.5 1.2 Organic Bromine Compound % 2.5 2.1 3.4 2.2 1.8 The specific weight of other materials contained in the various case sizes is available on written request. The component packing tape is either recyclable Polycarbonate or PVC (depending on case size), and the sealing tape is a laminate of halogen-free polymers. The reels are recyclable polystyrene, and marked with the recycling symbol. The reels are over-packed in recyclable fiber board boxes. None of the packing contains heavy metals. 54 Currently the only known way of supplying a fire retardant encapsulant which meets all our performance requirements, is to incorporate antimony trioxide and an organic bromine compound. These materials are commonly used in many plastic items in the home and industry. We expect to be able to offer an alternative fire retardant encapsulant, free of these materials, by 2004. A combustible encapsulant free of these materials could be supplied today, but AVX believes that the health and safety benefits of using these materials to provide fire retardancy during the life of the product, far outweigh the possible risks to the environment and human health. 5. Nickel alloy It is intended that all case sizes will be made with a high copper alloy termination. Some case sizes are supplied now with this termination, and other sizes may be available. Please contact AVX if you prefer this. Surface mount tantalum capacitors have a very long service life with no known wear-out mechanism, and a low failure rate. However, parts contained in equipment which is of no further use will have some residual value mainly because of the tantalum metal contained. This can be recovered and recycled by specialist companies. The silver and nickel or copper alloy will also have some value. Please contact AVX if you require assistance with the disposal of parts. Packaging can by recycled as described above. 7. Disposal Surface mount tantalum capacitors do not contain any liquids and no part of the devices is normally soluble in water at neutral pH values. Incineration will cause the emission of noxious fumes and is not recommended except by specialists. Land fill may be considered for disposal, bearing in mind the small lead content. Questions & Answers Some commonly asked questions regarding Tantalum Capacitors: Question: If I use several tantalum capacitors in serial/parallel combinations, how can I ensure equal current and voltage sharing? Answer: Connecting two or more capacitors in series and parallel combinations allows almost any value and rating to be constructed for use in an application. For example, a capacitance of more than 60F is required in a circuit for stable operation. The working voltage rail is 24 volts dc with a superimposed ripple of 1.5 volts at 120 Hz. The maximum voltage seen by the capacitor is Vdc + Vac=25.5V Applying the 50% derating rule tells us that a 50V capacitor is required. Connecting two 25V rated capacitors in series will give the required capacitance voltage rating, but the The two resistors are used to ensure that the leakage currents of the capacitors does not affect the circuit reliability, by ensuring that all the capacitors have half the working voltage across them. Question: What are the advantages of tantalum over other capacitor technologies? Answer: 1. Tantalum capacitors have high volumetric efficiency. 2. Electrical performance over temperature is very stable. 3. They have a wide operating temperature range -55 degrees C to +125 degrees C. 4. They have better frequency characteristics than aluminum electrolytics. 5. No wear out mechanism. Because of their construction, solid tantalum capacitors do not degrade in performance or reliability over time. Question: How does TPS differ from your standard 33F product? 16.5F 25V Answer: TPS has been designed from the initial anode 50V production stages for power supply applications. Special 33F manufacturing processes provide the most robust capacitor 25V dielectric by maximizing the volumetric efficiency of the package. After manufacturing, parts are conditioned by effective capacitance will be halved, so for greater than 60F, being subjected to elevated temperature overvoltage burn in four such series combinations are required, as shown. applied for a minimum of two hours. Parts are monitored on a 100% basis for their direct current leakage performance at elevated temperatures. Parts are then subjected to a low impedance current surge. This current surge is performed on a 100% basis with each capacitor individually monitored. 33F 66F At this stage, the capacitor undergoes 100% test for 25V capacitance, Dissipation Factor, leakage current, and 50V 100 KHz ESR to TPS requirements. Question: If the part is rated as a 25 volt part and you have current surged it, why can't I use it at 25 volts in a low In order to ensure reliable operation, the capacitors should impedance circuit? be connected as shown below to allow current sharing of Answer: The high volumetric efficiency obtained using the ac noise and ripple signals. This prevents any one tantalum technology is accomplished by using an extremely capacitor heating more than its neighbors and thus being thin film of tantalum pentoxide as the dielectric. Even the weak link in the chain. an application of the relatively low voltage of 25 volts will + produce a large field strength as seen by the dielectric. As a * * result of this, derating has a significant impact on reliability as 100K described under the reliability section. The following example uses a 22 microfarad capacitor rated at 25 volts to illustrate * * ** the point. The equation for determining the amount of 100K surface area for a capacitor is as follows: * ** * 100K 55 Questions & Answers C = ( (E) (E) (A) ) / d A = ( (C) (d) ) /( (E)(E) ) A = ( (22 x 10-6) (170 x 10-9) ) / ( (8.85 x 10-12) (27) ) A = 0.015 square meters (150 square centimeters) Where C = Capacitance in farads A = Dielectric (Electrode) Surface Area (m2) d = Dielectric thickness (Space between dielectric) (m) E = Dielectric constant (27 for tantalum) E = Dielectric Constant relative to a vacuum (8.855 x 10-12 Farads x m-1) To compute the field voltage potential felt by the dielectric we use the following logic. Dielectric formation potential = Formation Ratio x Working Voltage = 4 x 25 Formation Potential = 100 volts Dielectric (Ta2O5) Thickness (d) is 1.7 x 10-9 Meters Per Volt d = 0.17 meters Electric Field Strength = Working Voltage / d = (25 / 0.17 meters) = 147 Kilovolts per millimeter = 147 Megavolts per meter No matter how pure the raw tantalum powder or the precision of processing, there will always be impurity sites in the dielectric. We attempt to stress these sites in the factory with overvoltage surges, and elevated temperature burn in so that components will fail in the factory and not in your product. Unfortunately, within this large area of tantalum pentoxide, impurity sites will exist in all capacitors. To minimize the possibility of providing enough activation energy for these impurity sites to turn from an amorphous state to a crystalline state that will conduct energy, series resistance and derating is recommended. By reducing the electric field within the anode at these sites, the tantalum capacitor has increased reliability. Tantalums differ from other electrolytics in that charge transients are carried by electronic conduction rather than absorption of ions. 56 Question: What negative transients can Solid Tantalum Capacitors operate under? Answer: The reverse voltage ratings are designed to cover exceptional conditions of small level excursions into incorrect polarity. The values quoted are not intended to cover continuous reverse operation. The peak reverse voltage applied to the capacitor must not exceed: 10% of rated DC working voltage to a maximum of 1 volt at 25C. 3% of rated DC working voltage to a maximum of 0.5 volt at 85C. 1% of category DC working voltage to a maximum of 0.1 volt at 125C. Question: I have read that manufacturers recommend a series resistance of 0.1 ohm per working volt. You suggest we use 1 ohm per volt in a low impedance circuit. Why? Answer: We are talking about two very different sets of circuit conditions for those recommendations. The 0.1 ohm per volt recommendation is for steady-state conditions. This level of resistance is used as a basis for the series resistance variable in a 1% / 1000 hours 60% confidence level reference. This is what steady-state life tests are based on. The 1 ohm per volt is recommended for dynamic conditions which include current in-rush applications such as inputs to power supply circuits. In many power supply topologies where the di/dt through the capacitor(s) is limited, (such as most implementations of buck (current mode), forward converter, and flyback), the requirement for series resistance is decreased. Question: How long is the shelf life for a tantalum capacitor? Answer: Solid tantalum capacitors have no limitation on shelf life. The dielectric is stable and no reformation is required. The only factors that affect future performance of the capacitors would be high humidity conditions and extreme storage temperatures. Solderability of solder coated surfaces may be affected by storage in excess of one year under temperatures greater than 40C or humidities greater than 80% relative humidity. Terminations should be checked for solderability in the event an oxidation develops on the solder plating. Question: Do you recommend the use of tantalum capacitors on the input side of DC-DC converters? Answer: No. Typically the input side of a converter is fed from the voltage sources which are not regulated and are of nominally low impedance. Examples would be Nickel-MetalHydride batteries, Nickel-Cadmium batteries, etc., whose internal resistance is typically in the low milliohm range.