ISO-9001
Registered
• •
• •
• Qualified DESC 87017 and 87018
• •
• •
• Increased component density
• •
• •
• Ideal f or all reflo w soldering techniques
• •
• •
• Best tolerances: ±0.02% absolute ±0.01% ratio
• •
• •
• Custom schematics readily available
• •
• •
• Meet JEDEC standard f or type 'C' package
• •
• •
• Superior temperature perf ormance:
Absolute T.C . to ±10 ppm/°C
Trac king ±5 ppm/°C standard
(±2% ppm/°C available)
Gold over nickel
over copper
termination
(solder coating
av ailab le)
Ultra stable
Tantalum Nitride
SPECIFICATIONS
The IRC TaNFilm® Chip Carrier Network offers higher
lead density, increased component count, lower in-
stalled resistor cost, better reliability, and is ideal for
use with all surface mount solder techniques. In ad-
dition, the TaNFilm® leadless Chip Carrier Network
provides all the unique qualities of our other TaNFilm®
package configurations. Testing has demonstrated
performance exceeding MIL-PRF-83401 Character-
istic H.
Precise state-of-the-art laser trimming provides close
tolerances and tight ratios. The TaNFilm® process
enables IRC to manufacture custom circuit configu-
rations and multiple resistance values without sacri-
ficing the tightest tolerance and trac king characteris-
tics of precision networks. The Tantalum Nitride
resistor material is passivated f or en vironmental pro-
tection surpassing military requirements and guar-
anteeing exceptional ratio stability.
For applications requiring a high deg ree of reliability,
stability, accuracy and low noise , plus advantages of
new resistor configuration, specify the IRC Leadless
Chip Carrier Configuration Resistor Network.
ADVANCED FILM DIVISION
4222 South Staples Street • •
• •
• Corpus Christi, Texas 78411 • •
• •
• Tel: 512-992-7900 • •
• •
• Fax: 512-992-3377 • •
• •
• www.irctt.com
TANFILM® CHIP CARRIER
RESISTOR NETWORK
CCN SERIES
Resistance Ranges (S
SS
S)10 t o 300K
Resistance Tolerances (±%) 0.05, 0.1, 0.25, 0.5, 1, 2
(0.02 availabl e)
Ratio Accuracy when
specified to ±0.01%
Power Rating @ 70° C 0.1 watt/resistor,
1.0 watt/network
Temp erat ur e Ran g e -55°C to +150°C
Temp erat ur e Co ef fi ci ent
of Resistance (ppm/°C) ±15, ±25, ±50, ±100
TCR Tracking (R>200S
SS
S) ±5 ppm/°C
Noise Less than -25 db
Terminations Gold over nickel over copper.
So l d e r t i n n e d av a i l a bl e.
Lead Mat er ial Gold plated copper alloy
Sold er t in availabl e
Substrate Material 99.5% pure alumina substrate
Construction Ceramic chip/epoxy/ceramic
Meets JEDEC Standard for Type "C" Package
Custom circuits and Special Testing Available
Contact factor y for any special features required
Lid and ceramic
substrate totally
filled with epoxy
adhesive
STANDARD CIRCUIT
45678
9
10
11
12
13
18 17 16 15 14
3
2
1
20
19
45678
9
10
11
12
13
18 17 16 15 14
3
2
1
20
19
45678
9
10
11
12
13
18 17 16 15 14
3
2
1
20
19
45678
9
10
11
12
13
18 17 16 15 14
3
2
1
20
19
7900
ONE PIN COMMON 7907
ISOLATED 7908
ISOLATED 7909
ISOLATED
110398