5962-85131092A - INTERSIL - Datasheet.Directory

REVISIONS

LTR DESCRIPTION DATE (YR-MO-DA) APPROVED

A

Add case outlines, terminal connections and thermal resistance values for case

outlines 2 and 3. For device type 01, 02, and 03, add subgroup 3 to IIH and IIL

test, add RDS1 test, add VISO test, delete VCT test, change RL and CL test

conditions for tON(A) and tOFF(A) tests, change CL test condition for tON(EN)

and tOFF(EN) tests, change value of ID for RDS1 test, change value of ID and

VS for RDS2 test, add test condition circuits. Editorial changes throughout.

88-08-26 D. A. DiCENZO

B Add device types 07, 08, and 09. Table I changes. Editorial changes

throughout. 93-06-28 M. A. FRYE

C Changes in accordance with NOR 5962-R061-95. 95-01-25 M. A. FRYE

D Changes in accordance with NOR 5962-R032-96. 96-01-09 M. A. FRYE

E Incorporate NOR’s and current requirements.

Editorial changes throughout. - drw 02-12-30 R. MONNIN

F Make change to the tON(A) and tOFF(A) subgroup 9 test limit for devices 01, 02,

and 03 as specified under Table I. - ro 07-09-13 R. HEBER

REV F F F

SHEET 35 36 37

REV F F F F F F F F F F F F F F F F F F F F

SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34

REV STATUS REV F F F F F F F F F F F F F F

OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14

PMIC N/A PREPARED BY

MARCIA B. KELLEHER

DEFENSE SUPPLY CENTER COLUMBUS

STANDARD

MICROCIRCUIT

DRAWING

CHECKED BY

RAY MONNIN

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

APPROVED BY

D. A. DiCENZO

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

DRAWING APPROVAL DATE

86-06-30

MICROCIRCUIT, LINEAR, CMOS, MULTIPLEXER /

DEMULTIPLEXER, MONOLITHIC SILICON

AMSC N/A

REVISION LEVEL

F

SIZE

A

CAGE CODE

67268

5962-85131

SHEET

1 OF

37

DSCC FORM 2233

APR 97 5962-E563-07

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

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DSCC FORM 2234

APR 97

1. SCOPE

1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in

accordance with MIL-PRF-38535, appendix A.

1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:

5962-85131 01 E A

Drawing number Device type

(see 1.2.1)

Case outline

(see 1.2.2)

Lead finish

(see 1.2.3)

1.2.1 Device type(s). The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function

01 HI546 Single 16-channel MUX/DEMUX with overvoltage protection

02 HI547 Differential 8-channel MUX/DEMUX with overvoltage protection

03 HI549 Differential 4-channel MUX/DEMUX with overvoltage protection

04 HI5116 Single 16-channel MUX/DEMUX with overvoltage protection

05 HI5216 Differential 8-channel MUX/DEMUX with overvoltage protection

06 HI5208 Differential 4-channel MUX/DEMUX with overvoltage protection

07 HI506 Single 16-channel MUX/DEMUX

08 HI507 Differential 8-channel MUX/DEMUX

09 HI509 Differential 4-channel MUX/DEMUX

1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style

E GDIP-T16 or CDIP-T16 16 Dual-in-line

X GDIP-T28 or CDIP-T28 28 Dual-in-line

2 CQCC1-N20 20 Square leadless chip carrier

3 CQCC1-N28 28 Square leadless chip carrier

1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.

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REVISION LEVEL

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1.3 Absolute maximum ratings.

Supply voltage between +V and -V .............................................................. +44 V

Supply voltage between +V and ground:

Device types 01-03, 07-09 ....................................................................... +22 V

Device types 04-06 .................................................................................. +20 V

Supply voltage between -V and ground:

Device types 01-03, 07-09 ....................................................................... -25 V

Device types 04-06 .................................................................................. -20 V

Digital input voltage range (VA, VEN):

Device types 01-03, 07-09 ....................................................................... [ (-V) -4 V) to (+V) +4 V ]

or 20 mA whichever comes first

Device types 04-06 .................................................................................. -V to +V or 20 mA whichever comes first

Analog input voltage range (VS):

Device types 01-03 .................................................................................. [ (-V) -20 V) to (+V) +20 V ]

Device types 04-06 .................................................................................. [ (-V) -25 V) to (+V) +25 V ]

Device types 07-09 .................................................................................. [ (-V) -2 V) to (+V) +2 V ]

Continuous current, source or drain ............................................................ 20 mA

Peak current, source or drain, pulsed, 1 ms,

10 percent duty cycle max ........................................................................... 40 mA

Storage temperature range ......................................................................... -65°C to +150°C

Maximum power dissipation (PD):

Case E ..................................................................................................... 1.25 W

Case X ..................................................................................................... 2 W

Case 2 ..................................................................................................... 1.32 W

Case 3 ..................................................................................................... 1.23 W

Derating factor:

Case E ..................................................................................................... 12.5 mW/°C above TA = +75°C

Case X ..................................................................................................... 20 mW/°C above TA = +75°C

Case 2 ..................................................................................................... 13.2 mW/°C above TA = +75°C

Case 3 ..................................................................................................... 12.3 mW/°C above TA = +75°C

Thermal resistance, junction-to-case (θJC):

Cases E, X, 2, and 3................................................................................. See MIL-STD-1835

Thermal resistance, junction-to-ambient (θJA):

Case E ..................................................................................................... 80°C/W

Case X ..................................................................................................... 50°C/W

Case 2 ..................................................................................................... 76°C/W

Case 3 ..................................................................................................... 81°C/W

Lead temperature (soldering, 10 seconds) .................................................. +275°C

Junction temperature (TJ) ........................................................................... +175°C

1.4 Recommended operating conditions.

Supply voltage between +V and ground ...................................................... +15 V

Supply voltage between -V and ground ....................................................... -15 V

V

REF (device types 01 and 02 only) ............................................................ open

V

AL(max) ..................................................................................................... 0.8 V

V

AH(min):

Device types 01-03 .................................................................................. 4.0 V

Device types 04-09 .................................................................................. 2.4 V

V

EN:

Device types 01-03 .................................................................................. 4.0 V

Device types 04-09 .................................................................................. 2.4 V

Ambient operating temperature range (TA) ................................................. -55°C to +125°C

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REVISION LEVEL

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2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or

from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-

PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying

activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan

may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.

These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-

PRF-38535 is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535, appendix A and herein.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth tables. The truth tables shall be as specified on figure 2.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

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TABLE I. Electrical performance characteristics.

Test

Symbol

Conditions 1/

-55°C ≤ TA ≤ +125°C

-V = -15 V, +V = +15 V

Group A

subgroups

Device

type

Limits

Unit

unless otherwise specified Min Max

Input leakage current 2/ IIH Measure inputs sequentially, 1, 2, 3 01, 02,

03, 04, 1.0 µA

connect all unused inputs to

GND 05, 07,

08, 09

1, 3 06 -1.0 1.0

2 -10.0 10.0

IIL 1, 2, 3 01, 02,

03, 04, 1.0

05, 07,

08, 09

1, 3 06 -1.0 1.0

2 -10.0 10.0

Leakage current into the

source terminal of an

“OFF” switch

+IS(OFF) VS = +10 V, VEN = 0.8 V,

all unused inputs = -10 V, 1

01, 02,

03, 07,

08, 09

-10 +10 nA

VD = -10 V 04, 05,

06 -1 +1

2, 3 All -50 +50

-IS(OFF) VS = -10 V, VEN = 0.8 V,

all unused inputs = +10 V, 1

01, 02,

03, 07,

08, 09

-10 +10

VD = +10 V 04, 05,

06 -1 +1

2, 3 All -50 +50

Leakage current into the

drain terminal of an

“OFF” switch

+ID(OFF) VD = +10 V, VEN = 0.8 V,

all unused inputs = -10 V 1

01, 02,

03, 07,

08, 09

-10 +10 nA

04, 05 -2 +2

06 -1 +1

2, 3

01, 04,

07 -300 +300

02, 08 -200 +200

03, 06,

09 -100 +100

05 -150 +150

See footnotes at end of table.

STANDARD

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REVISION LEVEL

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TABLE I. Electrical performance characteristics - continued.

Test

Symbol

Conditions 1/

-55°C ≤ TA ≤ +125°C

-V = -15 V, +V = +15 V

Group A

subgroups

Device

type

Limits

Unit

unless otherwise specified Min Max

Leakage current into the

drain terminal of an

“OFF” switch

-ID(OFF) VD = -10 V, VEN = 0.8 V,

all unused inputs = +10 V 1

01, 02,

03, 07,

08, 09

-10 +10 nA

04, 05 -2 +2

06 -1 +1

2, 3

01, 04,

07 -300 +300

02, 08 -200 +200

03, 06,

09 -100 +100

05 -150 +150

Leakage current from an

“ON” driver into the

switch (drain)

+ID(ON) VD = +10 V, VS = +10 V,

all unused inputs = -10 V 1

01, 02,

03, 07,

08, 09

-10 +10 nA

04, 05,

06 -2 +2

2, 3

01, 04,

07 -300 +300

02, 08 -200 +200

03, 06,

09 -100 +100

05 -150 +150

-ID(ON) VD = -10 V, VS = -10 V,

all unused inputs = +10 V 1

01, 02,

03, 07,

08, 09

-10 +10

04, 05,

06 -2 +2

2, 3

01, 04,

07 -300 +300

02, 08 -200 +200

03, 06,

09 -100 +100

05 -150 +150

See footnotes at end of table.

STANDARD

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DEFENSE SUPPLY CENTER COLUMBUS

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REVISION LEVEL

F

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APR 97

TABLE I. Electrical performance characteristics - continued.

Test

Symbol

Conditions 1/

-55°C ≤ TA ≤ +125°C

-V = -15 V, +V = +15 V

Group A

subgroups

Device

type

Limits

Unit

unless otherwise specified Min Max

Overvoltage protected,

leakage current into

the drain terminal of

an “OFF” switch

+ID(OFF)

overvoltage

VS =+33 V, VD = 0 V,

VEN = 0.8 V, VS applied

at ≤ 25% duty cycle

1, 2, 3 01, 02,

03, -2.0 +2.0 µA

VS =+25 V, VD = 0 V, 1, 3 04, 05,

06 -2.0 +2.0

VEN = 0.8 V 2 -5 +5

-ID(OFF)

overvoltage

VS =-33 V, VD = 0 V,

VEN = 0.8 V, VS applied

at ≤ 25% duty cycle

1, 2, 3 01, 02,

03, -2.0 +2.0

VS =-25 V, VD = 0 V, 1, 3 04, 05,

06 -2.0 +2.0

VEN = 0.8 V 2 -5 +5

Positive supply current +I VA = 0 V, VEN = 4.0 V 1, 2, 3 01, 02,

03 2.0 mA

VA = 0 V, VEN = 2.4 V 04, 05 2.0

07, 08 3.0

09 2.4

VA = 5 V, VEN = 2.4 V 06 2.0

Negative supply current -I VA = 0 V, VEN = 4.0 V 1, 2, 3 01, 02,

03 -1.0 mA

VA = 0 V, VEN = 2.4 V

04, 05,

07, 08,

09

-1.0

VA = 5 V, VEN = 2.4 V 06 -1.0

Standby positive

supply current +ISBY V

A = 0 V, VEN = 0 V 1, 2, 3

01, 02,

03, 04,

05, 06

2.0 mA

07, 08 3.0

09 2.4

Standby negative

supply current -ISBY V

A = 0 V, VEN = 0 V 1, 2, 3 All -1.0 mA

See footnotes at end of table.

STANDARD

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REVISION LEVEL

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TABLE I. Electrical performance characteristics - continued.

Test

Symbol

Conditions 1/

-55°C ≤ TA ≤ +125°C

-V = -15 V, +V = +15 V

Group A

subgroups

Device

type

Limits

Unit

unless otherwise specified Min Max

Switch “ON” resistance +RDS1 V

S = +10 V, ID = -100 µA 1 01, 02,

03 1.5

kΩ

2, 3 1.8

VS = +10 V, ID = +100 µA 1 04, 05,

06 1.5

2, 3 2.0

VS = +10 V, ID = -1 mA 1 07, 08,

09 300

Ω

2, 3 400

-RDS1 V

S = -10 V, ID = +100 µA 1 01, 02,

03 1.5

kΩ

2, 3 1.8

VS = -10 V, ID = -100 µA 1 04, 05,

06 1.5

2, 3 2.0

VS = -10 V, ID = +1 mA 1 07, 08,

09 300

Ω

2, 3 400

+RDS2 +V = +10 V, -V = -10 V, 1, 3 04, 05,

06 2.2

kΩ

3/ VS = +5.0 V, ID = +100 µA 2 2.4

-RDS2 +V = +10 V, -V = -10 V, 1, 3 04, 05,

06 2.2

3/ VS = -5.0 V, ID = -100 µA 2 2.4

Difference in switch

“ON” resistance

between channels

ΔRDS1 (+RDS1 max) – (+RDS1 min) x

100 +RDS1 Ave, TA = +25°C 1 01. 02,

03 7 %

(-RDS1 max) – (-RDS1 min) x

100 -RDS1 Ave, TA = +25°C 7

Capacitance: CA +V = -V = 0 V, f = 1 MHz, 4 01, 02,

03 15 pF

Address TA = +25°C, see 4.3.1c 04, 05,

06 3/ 10

07, 08 12

09 10

See footnotes at end of table.

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TABLE I. Electrical performance characteristics - continued.

Test

Symbol

Conditions 1/

-55°C ≤ TA ≤ +125°C

-V = -15 V, +V = +15 V

Group A

subgroups

Device

type

Limits

Unit

unless otherwise specified Min Max

Capacitance: COS +V = -V = 0 V, f = 1 MHz, 4 01 85 pF

Output switch TA = +25°C, see 4.3.1c 02, 08 50

03, 09 25

04, 05,

06 3/ 85

07 90

Capacitance: CIS +V = -V = 0 V, f = 1 MHz, 4 01, 02,

03 15 pF

Input switch TA = +25°C, see 4.3.1c 04, 05,

06 3/ 10

07, 08,

09 12

Charge transfer error VCTE VS = GND, TA = +25°C, 3/

VGEN = 0 V to 5 V

7 All 10 mV

Off isolation VISO

VEN = 0.8 V, VS = 7 Vrms,

RL = 1 kΩ, CL = 15 pF,

f = 100 kHz, TA = +25°C 3/

7

01, 02,

03, 07,

08, 09

-50 dB

Single channel isolation VISO

VEN = 0 V, VGEN = 1 Vp-p,

RL = 200 Ω, f = 200 kHz,

TA = +25°C 3/

7 04, 05,

06 -50 dB

Crosstalk between

channels VCT VGEN = 1 Vp-p, f = 200 kHz,

TA = +25°C 3/

7 04, 05,

06 -50 dB

Break-before-make

time delay tD T

A = +25°C, see figure 3 9 01, 02,

03, 5 ns

04, 05,

06 3/ 5

RL = 1 kΩ, CL = 50 pF,

TA = +25°C, see figure 3

07, 08,

09 25

See footnotes at end of table.

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TABLE I. Electrical performance characteristics - continued.

Test

Symbol

Conditions 1/

-55°C ≤ TA ≤ +125°C

-V = -15 V, +V = +15 V

Group A

subgroups

Device

type

Limits

Unit

unless otherwise specified Min Max

tON(A), RL = 10 kΩ, CL = 50 pF, 9 01, 02,

03 750 ns

Propagation delay times:

Address inputs to I/O

channels times: tOFF(A)

07,08,

09 500

see figure 4

10, 11

01, 02,

03, 07,

08, 09

1,000

RL = 1 kΩ, CL = 100 pF, 9 04, 05,

06 1,000

see figure 4 10, 11 1,500

Enable to I/O tON(EN), RL = 1 kΩ, CL = 50 pF, 9 01,02,

03, 07, 500 ns

tOFF(EN) see figure 4 10, 11 08, 09 1,000

RL = 1 kΩ, CL = 100 pF, 9 04, 05,

06 700

See figure 4 10, 11 1,000

1/ For device types 01 and 02, VREF = open. For device types 01, 02, and 03, VEN = 4.0 V unless otherwise specified. For

device types 04, 05, 06, 07, 08 and 09, VEN = 2.4 V unless otherwise specified. For device types 04, 05, and 06, current

flowing in either direction between any associated input and output terminals of the switch shall be 30 mA.

2/ Input current of one input mode.

3/ Guaranteed, if not tested, to the limits specified.

3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed

in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN

number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.

3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance

to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in

accordance with MIL-PRF-38535 to identify when the QML flow option is used.

3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an

approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to

listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,

appendix A and the requirements herein.

3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided

with each lot of microcircuits delivered to this drawing.

3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.

3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's

facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the

reviewer.

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Case

outlines E X X X X 2 3 3 3 3

Device

types

03, 06,

09 01 02 04, 07 05, 08 03, 06,

09 01 02 07 08

Terminal

number Terminal symbol

1 A0 V+ V+ V+ V+ NC V+ V+ V+ V+

2 Enable NC OUT B NC OUT B A0 NC OUT B NC OUT B

3 V- NC NC NC NC Enable NC NC NC NC

4 IN 1A IN 16 IN 8B IN 16 IN 8B V- IN 16 IN 8B IN 16 IN 8B

5 IN 2A IN 15 IN 7B IN 15 IN 7B IN 1A IN 15 IN 7B IN 15 IN 7B

6 IN 3A IN 14 IN 6B IN 14 IN 6B NC IN 14 IN 6B IN 14 IN 6B

7 IN 4A IN 13 IN 5B IN 13 IN 5B IN 2A IN 13 IN 5B IN 13 IN 5B

8 OUT A IN 12 IN 4B IN 12 IN 4B IN 3A IN 12 IN 4B IN 12 IN 4B

9 OUT B IN 11 IN 3B IN 11 IN 3B IN 4A IN 11 IN 3B IN 11 IN 3B

10 IN 4B IN 10 IN 2B IN 10 IN 2B OUT A IN 10 IN 2B IN 10 IN 2B

11 IN 3B IN 9 IN 1B IN 9 IN 1B NC IN 9 IN 1B IN 9 IN 1B

12 IN 2B GND GND GND GND OUT B GND GND GND GND

13 IN 1B

VREF V

REF NC NC IN 4B

VREF V

REF NC NC

14 V+ A3 NC A3 NC IN 3B A3 NC A3 NC

15 GND A2 A2 A2 A2 IN 2B A2 A2 A2 A2

16 A1 A1 A1 A1 A1 NC A1 A1 A1 A1

17 --- A0 A0 A0 A0 IN 1B A0 A0 A0 A0

18 --- Enable Enable Enable Enable V+ Enable Enable Enable Enable

19 --- IN 1 IN 1A IN 1 IN 1A GND IN 1 IN 1A IN 1 IN 1A

20 --- IN 2 IN 2A IN 2 IN 2A A1 IN 2 IN 2A IN 2 IN 2A

21 --- IN 3 IN 3A IN 3 IN 3A --- IN 3 IN 3A IN 3 IN 3A

22 --- IN 4 IN 4A IN 4 IN 4A --- IN 4 IN 4A IN 4 IN 4A

23 --- IN 5 IN 5A IN 5 IN 5A --- IN 5 IN 5A IN 5 IN 5A

24 --- IN 6 IN 6A IN 6 IN 6A --- IN 6 IN 6A IN 6 IN 6A

25 --- IN 7 IN 7A IN 7 IN 7A --- IN 7 IN 7A IN 7 IN 7A

26 --- IN 8 IN 8A IN 8 IN 8A --- IN 8 IN 8A IN 8 IN 8A

27 --- V- V- V- V- --- V- V- V- V-

28 --- OUT OUT A OUT OUT A --- OUT OUT A OUT OUT A

FIGURE 1. Terminal connections.

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Device types 01, 04, and 07 Device types 02, 05, and 08

A3 A2 A1 A0 EN CHANNEL

SELECTED A2 A1 A0 EN CHANNEL

SELECTED

X X X X L NONE X X X L NONE

L L L L H 1 L L L H 1A, 1B

L L L H H 2 L L H H 2A, 2B

L L H L H 3 L H L H 3A, 3B

L L H H H 4 L H H H 4A, 4B

L H L L H 5 H L L H 5A, 5B

L H L H H 6 H L H H 6A, 6B

L H H L H 7 H H L H 7A, 7B

L H H H H 8 H H H H 8A, 8B

H L L L H 9

H L L H H 10

H L H L H 11

H L H H H 12

H H L L H 13

H H L H H 14

H H H L H 15

H H H H H 16

Device types 03, 06, and 09

A1 A0 EN CHANNEL

SELECTED

X X L NONE

L L H 1A, 1B

L H H 2A, 2B

H L H 3A, 3B

H H H 4A, 4B

FIGURE 2. Truth tables.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 13

DSCC FORM 2234

APR 97

FIGURE 3. Break-before-make test circuit and waveforms.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 14

DSCC FORM 2234

APR 97

FIGURE 3. Break-before-make test circuit and waveforms – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 15

DSCC FORM 2234

APR 97

FIGURE 3. Break-before-make test circuit and waveforms – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 16

DSCC FORM 2234

APR 97

FIGURE 3. Break-before-make test circuit and waveforms – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 17

DSCC FORM 2234

APR 97

FIGURE 3. Break-before-make test circuit and waveforms – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 18

DSCC FORM 2234

APR 97

FIGURE 3. Break-before-make test circuit and waveforms – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 19

DSCC FORM 2234

APR 97

FIGURE 3. Break-before-make test circuit and waveforms – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 20

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 21

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 22

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 23

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 24

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 25

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 26

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 27

DSCC FORM 2234

APR 97

28

27

26

25

24

23

22

21

20

19

18

17

16

15

2

3

4

5

6

7

8

9

10

11

12

13

14

1+V

NC

OUT B

IN 8B

IN 6B

IN 5B

IN 4B

IN 3B

IN 2B

IN 1B

GND

NC

OUT A

-V

IN 8A

IN 7A

IN 6A

IN 5A

IN 4A

IN 3A

IN 2A

IN 1A

A0

A1

A2

EN

+15 V -15 V

+5 V

PULSE GEN

(ADDRESS INPUTS TO I/O)

100

pF

(ENABLE TO I/O)

I/O

GND

+10 V

-10 V

+10 V

GND

1k 100

pF

-10 V

+10 V

GND

.

-10 V

+10 V

GND

28

27

26

25

24

23

22

21

20

19

18

17

16

15

2

3

4

5

6

7

8

9

10

11

12

13

14

1+V

NC

OUT B

IN 8B

IN 7B

IN 6B

IN 5B

IN 4B

IN 3B

IN 2B

IN 1B

GND

NC

OUT A

-V

IN 8A

IN 7A

IN 6A

IN 5A

IN 4A

IN 3A

IN 2A

IN 1A

A0

A1

A2

EN

+15 V -15 V

100

pF

I/O

-10 V

+10 V

GND

1k 100

pF

-10 V

+10 V

GND

PULSE

GEN

+5 V

IN 7B

1 k

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 28

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 29

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 30

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 31

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 32

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 33

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 34

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 35

DSCC FORM 2234

APR 97

FIGURE 4. Switching times test circuits – continued.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 36

DSCC FORM 2234

APR 97

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,

appendix A.

4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices

prior to quality conformance inspection. The following additional criteria shall apply:

a. Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method

1015 of MIL-STD-883.

(2) TA = +125°C, minimum.

b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter

tests prior to burn-in are optional at the discretion of the manufacturer.

4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-

883 including groups A, B, C, and D inspections. The following additional criteria shall apply.

4.3.1 Group A inspection.

a. Tests shall be as specified in table II herein.

b. Subgroups 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.

c. Subgroup 4 capacitance measurements shall be measured only for the initial test and after process or design changes

which may affect capacitance.

d. Subgroups 7 shall include verification of the truth table.

4.3.2 Groups C and D inspections.

a. End-point electrical parameters shall be as specified in table II herein.

b. Steady-state life test conditions, method 1005 of MIL-STD-883.

(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision

level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in

method 1005 of MIL-STD-883.

(2) TA = +125°C, minimum.

(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-85131

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

F

SHEET 37

DSCC FORM 2234

APR 97

TABLE II. Electrical test requirements.

MIL-STD-883 test requirements Subgroups

(in accordance with

MIL-STD-883, method 5005,

table I)

Interim electrical parameters

(method 5004)

1

Final electrical test parameters

(method 5004)

1*,2,3,9

Group A test requirements

(method 5005)

1,2,3,4,7,9,10**,11**

Groups C and D end-point

electrical parameters

(method 5005)

1

* PDA applies to subgroup 1.

** Subgroups 10 and 11, if not tested, shall be guaranteed to the

specified limits in table I.

5. PACKAGING

5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.

6. NOTES

6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications

(original equipment), design applications, and logistics purposes.

6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-

prepared specification or drawing.

6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for

the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.

6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system

application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be

used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC

5962) should contact DSCC-VA, telephone (614) 692-0544.

6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone

(614) 692-0547.

6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-

HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by

DSCC-VA.

STANDARD MICROCIRCUIT DRAWING BULLETIN

DATE: 07-09-13

Approved sources of supply for SMD 5962-85131 are listed below for immediate acquisition information only and shall

be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised

to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate

of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next

dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of

supply at http://www.dscc.dla.mil/Programs/Smcr/.

Standard

microcircuit drawing

PIN 1/

Vendor

CAGE

number

Vendor

similar

PIN 2/

Reference

military specification

5962-85131013A 34371 HI4-546/883

5962-8513101XA 34371 HI1-546/883 M38510/19002BXA

5962-85131023A 34371 HI4-547/883

5962-8513102XA 34371 HI1-547/883 M38510/19004BXA

5962-85131032A 3/ HI4-549/883

5962-8513103EA 34371 HI1-549/883 M38510/19006BEA

5962-8513104XA 3/ IH5116MJI M38510/19002BXA

5962-8513105XA 3/ IH5216MJI M38510/19004BXA

5962-85131062C 1ES66 MAX359MLP/883B

1ES66 MAX359MJE/883B

5962-8513106EA

3/ IH5208MJE

M38510/19006BEA

5962-85131073A 34371 HI4-506/883

5962-85131073C 1ES66 DG506AAZ/883B

5962-8513107XA 34371 HI1-506/883 M38510/19001BXA

5962-85131083A 3/ HI4-507/883

5962-85131083C 1ES66 DG507AAZ/883B

5962-8513108XA 3/ HI1-507/883 M38510/19003BXA

5962-85131092A 34371 HI4-509/883

5962-85131092C 1ES66 DG509AAZ/883B

5962-8513109EA 3/ HI1-509/883 M38510/19008BEA

1/ The lead finish shown for each PIN representing a hermetic package is the

most readily available from the manufacturer listed for that part. If the

desired lead finish is not listed contact the vendor to determine its availability.

2/ Caution. Do not use this number for item acquisition. Items acquired to this

number may not satisfy the performance requirements of this drawing.

3/ Not available from an approved source of supply.

1 of 2

STANDARD MICROCIRCUIT DRAWING BULLETIN - CONTINUED

Vendor CAGE Vendor name

number and address

34371 Intersil Corporation

1001 Murphy Ranch Road

Milpitas, CA 95035-6803

Point of contact: 1650 Robert J. Conlan Blvd.

Palm Bay, FL 32905

1ES66 Maxim Integrated Products

120 San Gabriel Drive

Sunnyvale, CA 94086-5125

The information contained herein is disseminated for convenience only and the

Government assumes no liability whatsoever for any inaccuracies in the

information bulletin.

2 of 2