BGA Heat Sink
Model :
No.5, Ming Lung Road ,Yang
Mei
, Taiwan 32663 website : http://
www.malico.com.tw
Specification
Performance
CMBA022929 Series
For
29x29
Chip set
CMBA022929 Series
1.Material : Al 6063
2.Dimension :
Foot print : 29x29mm
Height : 12,15,18,21,23,28,33 mm
Base (thickness) : 2.6mm
3.Finish: Black Anodize
4. Chip set package thickness and clip color
3.3+/
-
0.25mm
-
Yellow clip
1.7+/
-
0.25mm
-
Blue clip
0.8+/
-
0.25mm
-
Orange clip
5.Accessory :
Clip : Plastic (UL94
-
V0)
Thermal pad : T710 or others
15x15
Heat Source (
LxW
)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
100
200
300
400
500
600
700
800
Air Velocity (LFM)
Thermal resistance
Rca (oC/ W)
0.00
0.04
0.08
0.12
0.16
0.20
0.24
0.28
Pressure drop (in-H2O)
H=25
H=20
H=12
H=25
MBH29002 Series=CMBA022929
MBH29002-H12 = 1373258
MBH29002-H25 = 1373259
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