Round-type contact mount LEDs (for automatic insertion) 0.80.2 23.0min 4.50.5 (1.6) 2.50.1 1.0min Cathode 4.00.2 0.450.1 0.40.1 0.65max 0.450.1 4.00.2 (P.2.54) o3.10.1 Cathode 3.5 0.40.1 Resin heap 0.8max 4.4 23.0min 5.50.5 (1.7) 3.50.1 1.0min 4.4 0.80.2 3.5 Outline drawing B SEL6414E o3.5 Outline drawing A (P.2.54) SEL6210R SEL6014 series (Wide viewing angle) 0.65max SEL6010 series (Standard type) Resin heap 0.8max SEL6015 series (Narrow viewing angle) 23.0min (1.7) 0.1 o3.1 (P.2.54) Cathode 0.40.1 Recommended dimensions of insertion holes on printed circuit boards 3.50.1 Resin burr 0.3max 4.4 1.0min 4.00.2 0.8 0.2 3.5 0.450.1 SEL6000 series LEDs packaged on tapes can withstand shocks caused by insertion machines; Thus, they can be contact-mounted automatically on circuit boards. Outline drawing C SEL6915A 0.65max Absolute maximum ratings (Ta=25C) Symbol Unit Ratings IF mA 30 IFP mA 100 VR V 3 Top C -30 to +85 Tstg C -30 to +100 Resin heap 0.8max Cathode mark o0.91.0 External dimensions: Unit: mm Tolerance: 0.3 2.54mm Viewing angle SEL6010 series SEL6014 series 0 0 30 30 60 90 100% 0 50 90 100% Viewing angle of a non-diffused lens 0 30 30 60 90 100% 60 50 0 50 90 100% Viewing angle of a diffused lens 18 0 30 30 60 50 SEL6015 series 60 60 90 100% 30 50 0 50 90 100% Viewing angle of a non-diffused lens 30 60 90 100% 60 50 0 50 90 100% Viewing angle of a non-diffused lens Type No. SEL6210R SEL6210S SEL6410G SEL6410E SEL6510G SEL6510C SEL6710Y SEL6710K SEL6810D SEL6810A SEL6910D SEL6910A SEL6214S SEL6414E SEL6514C SEL6814A SEL6914A SEL6215S SEL6415E SEL6515C SEL6815A SEL6915A Electro-optical characteristics (Ta=25C) Display form (o: mm) 3.1 3.1 3.1 3.1 3.1 3.1 3.1 3.1 3.1 3.1 3.1 3.1 3.5 3.5 3.5 3.5 3.5 3.1 3.1 3.1 3.1 3.1 Type of lens Emitting color VF (V) typ Red tinted, diffused High intensity red Red tinted, non-diffused Green tinted, diffused Green Green tinted, non-diffused Green tinted, diffused Pure green Un-tinted, non-diffused Yellow tinted, diffused Yellow Yellow tinted, non-diffused Orange tinted, diffused Amber Orange tinted, non-diffused Orange tinted, diffused Orange Orange tinted, non-diffused Red tinted, non-diffused High intensity red Green tinted, non-diffused Green Un-tinted, non-diffused Pure green Orange tinted, non-diffused Amber Orange tinted, non-diffused Orange Red tinted, non-diffused High intensity red Green tinted, non-diffused Green Un-tinted, non-diffused Pure green Orange tinted, non-diffused Amber Orange tinted, non-diffused Orange 1.9 2.0 1.9 1.9 2.0 1.9 1.9 2.0 1.9 IR IV Condition (A) Condition (mcd) Condition IF VR IF max (mA) max typ (mA) (V) 12 25 15 20 45 5 16 2.5 10 50 3 5 15 4 10 10 6.5 14 10 12 20 6 2.5 10 50 3 5 10 5 30 50 18 20 2.5 10 50 3 30 40 p Outline drawing (nm) typ 630 35 560 20 555 A 570 40 610 35 587 33 630 560 555 610 587 630 560 555 610 587 35 20 B 35 33 35 20 C 35 33 Using contact mount LEDs packaged on tapes 1. Printed circuit board 2. Insertion conditions 3. Soldering conditions One-side printed circuit board is recommended. If there are several SMD parts on the same printed circuit board, insert the LEDs after the adhesive for other SMD parts hardened. Use low insertion pusher pressure, as much as possible. Cut and clinch: Panasert T pattern is recommended. For N pattern, make the clinching angle of the LED's anode as small as possible. Preheating must be less than 90C (temperature on printed circuit board's bottom surface) for no more than two minutes Solder dipping must be made at a temperature of 250C for no more than 3 seconds. 19