HLMP-RD11/SD11/RG10/SG10/RL10/SL10
4 mm Super Oval Precision Optical Performance
AlInGaP LEDs
Data Sheet
Features
• Well dened spatial radiation pattern
• Viewing angle:
major axis 120°
minor axis 60°
• High luminous output
• Two red and amber intensity levels:
AlInGaP (bright) and AlInGaP II (brightest)
• Colors:
626/630 nm red
590/592 nm amber
• Superior resistance to moisture
• UV resistant epoxy
Applications
• Full color signs
Benets
• Viewing angle designed for wide eld of view
applications
• Superior performance for outdoor environments
Description
These Precision Optical Performance Oval LEDs are speci-
cally designed for Full Color/Video and Passenger Informa-
tion signs. The oval shaped radiation pattern (60° x 120°)
and high luminous intensity ensure that these devices
are excellent for wide eld of view outdoor applications
where a wide viewing angle and readability in sunlight
are essential. These lamps have very smooth, matched
radiation patterns ensuring consistent color mixing in full
color applications, message uniformity across the viewing
angle of the sign.
High eciency LED materials are used in these lamps:
Aluminum Indium Gallium Phosphide (AlInGaP) for Red
and Amber color. There are two families of red and amber
lamps, AlInGaP and the higher performance AlInGaP II.
Each lamp is made with an advanced optical grade epoxy
oering superior high temperature and high moisture
resistance in outdoor applications. The package epoxy
contains both uv-a and uv-b inhibitors to reduce the
eects of long term exposure to direct sunlight.
Designers can select parallel (where the axis of the leads
is parallel to the wide axis of the oval radiation pattern)
or perpendicular orientation. Both lamps are available in
tinted version.
2
Package Dimensions
4.0 ± 0.20
(0.157 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.80
(0.016) MAX. EPOXY MENISCUS
9.50 ± 0.50
(0.374 ± 0.007)
0.44 ± 0.20
(0.017 ± 0.008)
CATHODE
LEAD
A
∅
6.30 ± 0.20
(0.248 ± 0.008)
2.54 ± 0.30
(0.100 ± 0.012)
21.0
(0.827) MIN.
1.0
(0.039) MIN.
0.40 +0.10
–0
(0.016 +0.004
–0.000)
0.45 +0.10
–0.04
(0.018 +0.004
–0.002)
4.0 ± 0.20
(0.157 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.80
(0.016) MAX. EPOXY MENISCUS
9.50 ± 0.50
(0.374 ± 0.007)
0.44 ± 0.20
(0.017 ± 0.008)
CATHODE
LEAD
B
∅
6.30 ± 0.20
(0.248 ± 0.008)
2.54 ± 0.30
(0.100 ± 0.012)
21.0
(0.827) MIN.
1.0
(0.039) MIN.
0.40 +0.10
–0
(0.016 +0.004
–0.000)
0.45 +0.10
–0.04
(0.018 +0.004
–0.002)
Dimensions are in millimeters (inches).
3
Device Selection Guide for AlInGaP II
Color and
Dominant Luminous Intensity
Wavelength IV (mcd) at 20 mA Leads with Leadframe Package
Part Number λd (nm) Typ. Min. Max. Stand-Os Orientation Drawing
HLMP-RD11-J0000 Red 630 240 - Yes Parallel B
HLMP-RD11-LP0xx Red 630 40 1150 Yes Parallel B
HLMP-RD11-LPTxx Red 630 400 1150 Yes Parallel B
HLMP-SD11-J0000 Red 630 240 - Yes Perpendicular A
HLMP-SD11-LP000 Red 630 400 1150 Yes Perpendicular A
HLMP-SD11-LPTxx Red 630 400 1150 Yes Perpendicular A
HLMP-SD11-MN0xx Red 630 520 880 Yes Perpendicular A
HLMP-SD11-MNTxx Red 630 520 880 Yes Perpendicular A
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
Device Selection Guide for AlInGaP
Part Number
Color and
Dominant
Wavelength
λd (nm) Typ.
Luminous Intensity
Iv (mcd) at 20 mA Leads with
Stand-O
Leadframe
Orientation
Package
DrawingMin. Max.
HLMP-SG10-JM0xx Red 626 240 680 Yes Perpendicular A
HLMP-RG10-JM000 Red 626 240 680 Yes Parallel B
HLMP-SL10-HL0DD Amber 590 180 520 Yes Perpendicular A
HLMP-SL10-LM0DD Amber 590 400 680 Yes Perpendicular A
HLMP-SL10-LMKDD Amber 590 400 680 Yes Perpendicular A
HLMP-SL10-LMLDD Amber 590 400 680 Yes Perpendicular A
HLMP-SL10-LP0xx Amber 590 400 1150 Yes Perpendicular A
HLMP-SL10-LPKDD Amber 590 400 1150 Yes Perpendicular A
HLMP-SL10-MNKxx Amber 590 520 880 Yes Perpendicular A
HLMP-SL10-MP0DD Amber 590 520 1150 Yes Perpendicular A
HLMP-SL10-MQ0DD Amber 590 520 1500 Yes Perpendicular A
HLMP-SL10-MQLDD Amber 590 520 1500 Yes Perpendicular A
HLMP-RL10-LMLDD Amber 590 400 680 Yes Parallel B
HLMP-RL10-LP0xx Amber 590 400 1150 Yes Parallel B
HLMP-RL10-MP0DD Amber 590 520 1150 Yes Parallel B
HLMP-RL10-MQLDD Amber 590 520 1500 Yes Parallel B
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4
Absolute Maximum Ratings
TA = 25°C
Parameter Amber and Red
DC Forward Current1 50 mA
Peak Pulsed Forward Current 100 mA
Average Forward Current 30 mA
Reverse Voltage (IR = 100 µA) 5 V
Power Dissipation 120 mW
LED Junction Temperature 130°C
Operating Temperature Range –40°C to +100°C
Storage Temperature Range –40°C to +100°C
Note:
1. Derate linearly as shown in Figures 4.
Part Numbering System
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin; Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin & VF Selections
0: No Color Bin Limitation
T: Red Color with VF Maximum of 2.6 V
K: Amber Color Bins 2 and 4
L: Amber Color BIns 4 and 6
Maximum Intensity Bin
0: No Iv Bin Limitation
Minimum Intensity Bin
Refer to Device Selection Guide
Color
D: 630 nm Red
G: 626 nm Red
L: 590 nm Amber
Package
R: 4 mm 60° x 120°Oval, Parallel
S: 4 mm 60° x 120°Oval, Perpendicular
HLMP - x x xx - x x x xx
5
Electrical/Optical Characteristics
TA = 25°C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Typical Viewing Angle[1] 2θ½ deg
Major 120
Minor 60
Forward Voltage VF V IF = 20 mA
Red (λd = 626 nm) 1.9 2.4
Red (λd = 630 nm) 2.0 2.4[2]
Amber (λd = 590 nm) 2.02 2.4
Reverse Voltage VR V IR = 100 µA
Amber and Red 5 20
Peak Wavelength λPEAK nm Peak of Wavelength of
Red (λd = 626 nm) 635 Spectral Distribution
Red (λd = 630 nm) 639 at IF = 20 mA
Amber (λd = 590 nm) 592
Spectral Halfwidth Δλ½ nm Wavelength Width at
Red (λd = 626/630 nm) 17 Spectral Distribution
Amber (λd = 590 nm) 17 ½ Power Point at IF = 20 mA
Capacitance C pF VF = 0, F = 1 MHz
All Colors 40
Thermal Resistance RθJ-PIN °C/W LED Junction-to-Cathode
All Colors 240 Lead
Luminous Ecacy[3] ηv lm/W Emitted Luminous Power/
Red (λd = 626 nm) 150 Emitted Radiant Power
Red (λd = 630 nm) 155
Amber (λd = 590 nm) 480
Notes:
1. 2θ½ is the o-axis angle where the luminous intensity is the on-axis intensity.
2. For options -xxRxx, -xxTxx, and -xxVxx, maximum forward voltage, VF, is 2.6 V. Please refer to VF Bin Table below.
3. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is
the luminous ecacy in lumens/watt.
6
Figure 4. Amber, Red maximum forward current vs. ambient temperature.
Figure 1. Relative intensity vs. wavelength. Figure 2. Amber, Red forward current vs. forward voltage.
Figure 3. Amber, Red relative luminous intensity vs. forward current.
0
40
20
IF– FORWARD CURRENT – mA
VF– FORWARD VOLTAGE – V
1.0 3.0
AMBER
1.5 2.0 2.5
10
30
50
RED
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
0
IF– FORWARD CURRENT – mA
20 40
2.0
1.0
50
0.5
1.5
2.5
3010
IF– FORWARD CURRENT – mA
0
0
TA– AMBIENT TEMPERATURE – °C
40 80
50
40
30
20
10
20 60 100
Rθj-a = 585° C/W
60
Rθj-a = 780° C/W
120
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
500 550 600 650 700
WAVELENGTH - nm
RELATIVE INTENSITY
RED
AMBER
Figure 5b. Representative spatial radiation pattern for minor axis.
Figure 5a. Representative spatial radiation pattern for major axis.
RELATIVE INTENSITY
1.0
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.2
-90
0.4
-60 0-30 15 45 90-45 -15 30 60-75 75
RELATIVE INTENSITY
1.0
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.2
-90
0.4
-60 0-30 15 45 90-45 -15 30 60-75 75
7
Intensity Bin Limits
(mcd at 20 mA)
Bin Name Min. Max.
H 180 240
J 240 310
K 310 400
L 400 520
M 520 680
N 680 880
P 880 1150
Tolerance for each bin limit is ± 15%.
VF Bin Table2
Bin Name Min. Max.
VA 2.0 2.2
VB 2.2 2.4
VC 2.4 2.6
Tolerance for each bin is ±0.05 V.
Note:
1. Bin categories are established for classication of products. Products
may not be available in all bin categories.
2. VF binning is applicable for part numbers with option -xxTxx.
Note:
1. All bin categories are established for classication of products.
Products may not be available in all bin categories. Please contact
your Avago representatives for further information.
Color Bin Limits
(nm at 20 mA)
Amber Colour Range (nm)
Bin ID Min. Max.
1 584.5 587.0
2 587.0 589.5
4 589.5 592.0
6 592.0 594.5
Tolerance for each bin limit is ±0.5 nm.
8
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be eectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
Note:
1. PCB with dierent size and design (component density) will have
dierent heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
prole again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high eciency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
Avago Technologies LED conguration
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 60 sec Max -
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering prole to ensure that it is always conforming
to recommended soldering conditions.
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment xture that is being applied during
wave soldering should be loosely tted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment xture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause diculty inserting the TH LED.
AllnGaP Device
CATHODE
9
Example of Wave Soldering Temperature Prole for TH LED
0 10 20 30 40 50 60 70 80 90 100
250
200
150
100
50
TIME (MINUTES)
PREHEAT
TURBULENT WAVE LAMINAR WAVE
HOT AIR KNIFE
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless stando or non-stando
Ammo Packs Drawing
6.35±1.30
0.25±0.0512
9.125±0.625
0.3593±0.025
18.00±0.50
0.7087±0.0197
12.70±0.30
0.50±0.0118
20.5±1.00
0.8071±0.0394
12.70±1.00
0.50±0.0394
CATHODE
VIEW A - A
0.70±0.20
0.276±0.0079
4.00±0.20
0.1575±0.0079
ØTYP.
10
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
p
p
y
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Box for Ammo Packs
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4174EN
AV02-1544EN - September 18, 2008
Acronyms and Denition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but without
VF bin OR part number with VF bins and no color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
(ii) Avago Baby Label (Only available on bulk packaging)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT
OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY
RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS,
DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label