July 2016
DocID028465 Rev 3
1/17
This is information on a product in full production.
www.st.com
STGWT40HP65FB
Trench gate field-stop IGBT, HB series 650 V, 40 A high speed
Datasheet - production data
Figure 1: Internal schematic diagram
Features
Maximum junction temperature: TJ = 175 °C
Minimized tail current
VCE(sat) = 1.6 V (typ.) @ IC = 40 A
Tight parameter distribution
Co-packed diode for protection
Safe paralleling
Low thermal resistance
Applications
Power factor corrector (PFC)
Description
This device is an IGBT developed using an
advanced proprietary trench gate field-stop
structure. The device is part of the new HB series
of IGBTs, which represents an optimum
compromise between conduction and switching
loss to maximize the efficiency of any frequency
converter. Furthermore, the slightly positive
VCE(sat) temperature coefficient and very tight
parameter distribution result in safer paralleling
operation.
Table 1: Device summary
Order code
Package
Packing
STGWT40HP65FB
GWT40HP65FB
TO-3P
Tube
123
TAB
TO-3P
Contents
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Contents
1 Electrical ratings ............................................................................. 3
2 Electrical characteristics ................................................................ 4
2.1 Electrical characteristics (curves) ...................................................... 6
3 Test circuits ................................................................................... 12
4 Package information ..................................................................... 13
4.1 TO-3P package information ............................................................ 14
5 Revision history ............................................................................ 16
STGWT40HP65FB
Electrical ratings
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1 Electrical ratings
Table 2: Absolute maximum ratings
Symbol
Parameter
Value
Unit
VCES
Collector-emitter voltage (VGE = 0 V)
650
V
IC
Continuous collector current at TC = 25 °C
80
A
Continuous collector current at TC = 100 °C
40
ICP(1)
Pulsed collector current
160
A
VGE
Gate-emitter voltage
± 30
V
IF(2)
Continuous forward current at TC = 25 °C
5
A
Continuous forward current at TC = 100 °C
5
IFP(3)
Pulsed forward current
10
A
PTOT
Total dissipation at TC = 25 °C
283
W
TSTG
Storage temperature range
- 55 to 150
°C
TJ
Operating junction temperature range
- 55 to 175
Notes:
(1)Pulse width limited by maximum junction temperature.
(2)Limited by wires.
(3)Pulsed forward current.
Table 3: Thermal data
Symbol
Parameter
Value
Unit
RthJC
Thermal resistance junction-case IGBT
0.53
°C/W
RthJC
Thermal resistance junction-case diode
5
RthJA
Thermal resistance junction-ambient
50
Electrical characteristics
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2 Electrical characteristics
TJ = 25 °C unless otherwise specified
Table 4: Static characteristics
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
V(BR)CES
Collector-emitter breakdown
voltage
VGE = 0 V, IC = 2 mA
650
V
VCE(sat)
Collector-emitter saturation
voltage
VGE = 15 V, IC = 40 A
1.6
2.0
V
VGE = 15 V, IC = 40 A,
TJ = 125 °C
1.7
VGE = 15 V, IC = 40 A,
TJ = 175 °C
1.8
VF
Forward on-voltage
IF = 5 A
2
V
IF = 5 A, TJ = 125 °C
1.85
IF = 5 A, TJ = 175 °C
1.75
VGE(th)
Gate threshold voltage
VCE = VGE, IC = 1 mA
5
6
7
V
ICES
Collector cut-off current
VGE = 0 V, VCE = 650 V
25
µA
IGES
Gate-emitter leakage current
VCE = 0 V, VGE = ±20 V
±250
nA
Table 5: Dynamic characteristics
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Cies
Input capacitance
VCE = 25 V, f = 1 MHz,
VGE = 0 V
-
5412
-
pF
Coes
Output capacitance
-
198
-
Cres
Reverse transfer capacitance
-
107
-
Qg
Total gate charge
VCC = 520 V, IC = 40 A,
VGE = 15 V (see Figure 29:
"Gate charge test circuit")
-
210
-
nC
Qge
Gate-emitter charge
-
39
-
Qgc
Gate-collector charge
-
82
-
Table 6: IGBT switching characteristics (inductive load)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
td(off)
Turn-off-delay time
VCE = 400 V, IC = 40 A,
VGE = 15 V, RG = 5 Ω (see
Figure 28: "Test circuit for
inductive load switching")
-
142
-
ns
tf
Current fall time
-
27
-
ns
Eoff(1)
Turn-off switching energy
-
363
-
µJ
td(off)
Turn-off-delay time
VCE = 400 V, IC = 40 A,
VGE = 15 V, RG = 5 Ω
TJ = 175 °C (see Figure 28:
"Test circuit for inductive
load switching")
-
141
-
ns
tf
Current fall time
-
61
-
ns
Eoff
Turn-off switching energy
-
764
-
µJ
Notes:
(1)Including the tail of the collector current.
STGWT40HP65FB
Electrical characteristics
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Table 7: Diode switching characteristics (inductive load)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
trr
Reverse recovery time
IF = 5 A, VR = 400 V,
VGE = 15 V (see Figure
28: "Test circuit for
inductive load switching")
di/dt = 1000 A/µs
-
140
ns
Qrr
Reverse recovery charge
-
21
nC
Irrm
Reverse recovery current
-
6.6
A
dIrr/dt
Peak rate of fall of reverse
recovery current during tb
-
430
A/µs
Err
Reverse recovery energy
-
1.6
µJ
trr
Reverse recovery time
IF = 5 A, VR = 400 V,
VGE = 15 V TJ = 175 °C
(see Figure 28: "Test
circuit for inductive load
switching")
di/dt = 1000 A/µs
-
200
ns
Qrr
Reverse recovery charge
-
47.3
nC
Irrm
Reverse recovery current
-
9.6
A
dIrr/dt
Peak rate of fall of reverse
recovery current during tb
-
428
A/µs
Err
Reverse recovery energy
-
3.2
µJ
Electrical characteristics
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2.1 Electrical characteristics (curves)
Figure 2: Power dissipation vs. case
temperature
Figure 3: Collector current vs. case
temperature
Figure 4: Output characteristics (TJ = 25°C)
Figure 5: Output characteristics (TJ = 175°C)
Figure 6: VCE(sat) vs. junction temperature
Figure 7: VCE(sat) vs. collector current
STGWT40HP65FB
Electrical characteristics
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Figure 8: Collector current vs. switching
frequency
Figure 9: Forward bias safe operating area
Figure 10: Transfer characteristics
Figure 11: Diode VF vs. forward current
Figure 12: Normalized VGE(th) vs junction
temperature
Figure 13: Normalized V(BR)CES vs. junction
temperature
Electrical characteristics
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Figure 14: Capacitance variations
Figure 15: Gate charge vs. gate-emitter
voltage
Figure 16: Switching energy vs collector
current
Figure 17: Switching energy vs gate
resistance
Figure 18: Switching energy vs temperature
Figure 19: Switching energy vs. collector
emitter voltage
STGWT40HP65FB
Electrical characteristics
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Figure 20: Switching times vs. collector
current
Figure 21: Switching times vs. gate
resistance
Figure 22: Reverse recovery current vs. diode
current slope
Figure 23: Reverse recovery time vs. diode
current slope
Figure 24: Reverse recovery charge vs. diode
current slope
Figure 25: Reverse recovery energy vs. diode
current slope
Electrical characteristics
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Figure 26: Thermal impedance
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Electrical characteristics
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Figure 27: Thermal impedance for diode
Test circuits
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3 Test circuits
Figure 28: Test circuit for inductive load
switching
Figure 29: Gate charge test circuit
Figure 30: Switching waveform
A A
C
E
G
B
RG
+
-
G
C3.3
µF 1000
µF
L=100 µH
VCC
E
D.U.T
B
AM01504v1
AM01505v1
Vi≤ VGMAX
PW
IG=CONST
VCC
12 V 47 kΩ 1 kΩ
100 Ω
2.7 kΩ
47 kΩ
1 kΩ
2200
µF
D.U.T.
100 nF
VG
STGWT40HP65FB
Package information
DocID028465 Rev 3
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4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Package information
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4.1 TO-3P package information
Figure 31: TO-3P package outline
8045950_B
STGWT40HP65FB
Package information
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Table 8: TO-3P package mechanical data
Dim.
mm
Min.
Typ.
Max.
A
4.60
4.80
5.00
A1
1.45
1.50
1.65
A2
1.20
1.40
1.60
b
0.80
1.00
1.20
b1
1.80
2.00
2.20
b2
2.80
3.00
3.20
c
0.55
0.60
0.75
D
19.70
19.90
20.10
D1
13.70
13.90
14.10
E
15.40
15.60
15.80
E1
13.40
13.60
13.80
E2
9.40
9.60
9.90
e
5.15
5.45
5.75
L
19.80
20.00
20.20
L1
3.30
3.50
3.70
L2
18.20
18.40
18.60
ØP
3.30
3.40
3.50
ØP1
3.10
3.20
3.30
Q
4.80
5.00
5.20
Q1
3.60
3.80
4
Revision history
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5 Revision history
Table 9: Document revision history
Date
Revision
Changes
20-Oct-2015
1
First release.
01-Mar-2016
2
Updated features in cover page.
Inserted Section 2.1: "Electrical characteristics (curves)".
Minor text changes
13-Jul-2016
3
Document status promoted from preliminary to production data.
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