532CB000347DG - Silicon Labs - Datasheet.Directory

Si532

DUAL FREQUENCY CRYSTAL OSCILLATOR (XO)

(10 MHZ TO 1.4 GHZ)

Features

Applications

Description

The Si532 dual frequency XO utilizes Silicon Laboratories’ advanced

DSPLL

circuitry to provide a low jitter clock at high frequencies. The Si532 is

available with any-frequency output frequency from 10 to 945 MHz and select

frequencies to 1400 MHz. Unlike a traditional XO where a different crystal is

required for each output frequency, the Si532 uses one fixed crystal

frequency to provide a wide range of output frequencies. This IC based

approach allows the crystal resonator to provide exceptional frequency

stability and reliability. In addition, DSPLL clock synthesis provides superior

supply noise rejection, simplifying the task of generating low jitter clocks in

noisy environments typically found in communication systems. The Si532 IC

based XO is factory configurable for a wide variety of user specifications

including frequency, supply voltage, output format, and temperature stability.

Specific configurations are factory programmed at time of shipment, thereby

eliminating long lead times associated with custom oscillators.

Functional Block Diagram

Available with any-frequency output

frequencies from 10 MHz to 945 MHz

and select frequencies to 1.4 GHz

Two selectable output frequencies

3rd generation DSPLL® with superior

jitter performance

3x better frequency stability than

SAW-based oscillators

Internal fixed crystal frequency

ensures high reliability and low

aging

Available CMOS, LVPECL,

LVDS, and CML outputs

3.3, 2.5, and 1.8 V supply options

Industry-standard 5 x 7 mm

package and pinout

Pb-free/RoHS-compliant

SONET/SDH

Networking

SD/HD video

Test and measurement

Clock and data recovery

FPGA/ASIC clock generation

Fixed

Frequency

Any-frequency

10–1400 MHz

DSPLL®

Clock

Synthesis

VDD CLK+CLK–

FS GND

Ordering Information:

See page 7.

Pin Assignments:

See page 6.

(Top View)

Si5602

4GND

VDD

CLK+

CLK–

4GND

VDD

CLK

(LVDS/LVPECL/CML)

(CMOS)

REVISION D

Si532

2 Rev. 1.4

1. Electrical Specifications

Table 1. Recommended Operating Conditions

Parameter Symbol Test Condition Min Typ Max Units

Supply Voltage1VDD 3.3 V option 2.97 3.3 3.63 V

2.5 V option 2.25 2.5 2.75 V

1.8 V option 1.71 1.8 1.89 V

Supply Current IDD Output enabled

LVPECL

CML

LVDS

CMOS

—

111

121

108

Tristate mode — 60 75 mA

Output Enable (OE)

and Frequency Select (FS)2VIH 0.75 x VDD ——V

VIL ——0.5V

Operating Temperature Range TA–40 — 85 ºC

Notes:

1. Selectable parameter specified by part number. See Section 3. "Ordering Information" on page 7 for further details.

2. OE and FS pins include a 17 k pullup resistor to VDD. Pulling OE to ground causes outputs to tristate.

Table 2. CLK± Output Frequency Characteristics

Parameter Symbol Test Condition Min Typ Max Units

Nominal Frequency1,2 fOLVPECL/LVDS/CML 10 — 945 MHz

CMOS 10 — 160 MHz

Initial Accuracy fi

Measured at +25 °C at time of

shipping —±1.5—ppm

Temperature Stability1,3 –7

–20

–50

—

+20

+50

ppm

Aging

Frequency drift over first year — — ±3 ppm

Frequency drift over 20 year life — — ±10 ppm

Total Stability Temp stability = ±7 ppm — — ±20 ppm

Temp stability = ±20 ppm — — ±31.5 ppm

Temp stability = ±50 ppm — — ±61.5 ppm

Notes:

1. See Section 3. "Ordering Information" on page 7 for further details.

2. Specified at time of order by part number. Also available in frequencies from 970 to 1134 MHz and 1213 to 1417 MHz.

3. Selectable parameter specified by part number.

4. Time from powerup or tristate mode to fO.

Si532

Rev. 1.4 3

Powerup Time4tOSC ——10ms

Settling Time After FS Change tFRQ ——10ms

Table 3. CLK± Output Levels and Symmetry

Parameter Symbol Test Condition Min Typ Max Units

LVPECL Output Option1VOmid-level VDD – 1.42 — VDD – 1.25 V

VOD swing (diff) 1.1 —1.9 VPP

VSE swing (single-ended) 0.55 —0.95 VPP

LVDS Output Option2VOmid-level 1.125 1.20 1.275 V

VOD swing (diff) 0.5 0.7 0.9 VPP

CML Output Option2

2.5/3.3 V option mid-level — VDD – 1.30 — V

1.8 V option mid-level — VDD – 0.36 — V

VOD

2.5/3.3 V option swing (diff) 1.10 1.50 1.90 VPP

1.8 V option swing (diff) 0.35 0.425 0.50 VPP

CMOS Output Option3VOH IOH =32mA 0.8 x VDD —VDD V

VOL IOL =32mA — — 0.4

Rise/Fall time (20/80%) tR, tFLVPECL/LVDS/CML — — 350 ps

CMOS with CL=15pF — 1 — ns

Symmetry (duty cycle) SYM LVPECL: VDD – 1.3 V

(diff)

LVDS: 1.25 V (diff)

CMOS: VDD/2

45 — 55 %

Notes:

1. 50  to VDD – 2.0 V.

2. Rterm = 100  (differential).

3. CL = 15 pF

Table 2. CLK± Output Frequency Characteristics (Continued)

Parameter Symbol Test Condition Min Typ Max Units

Notes:

1. See Section 3. "Ordering Information" on page 7 for further details.

2. Specified at time of order by part number. Also available in frequencies from 970 to 1134 MHz and 1213 to 1417 MHz.

3. Selectable parameter specified by part number.

4. Time from powerup or tristate mode to fO.

Si532

4 Rev. 1.4

Table 4. CLK± Output Phase Jitter

Parameter Symbol Test Condition Min Typ Max Units

Phase Jitter (RMS)1

for FOUT > 500 MHz

J12 kHz to 20 MHz (OC-48) — 0.25 0.40 ps

50 kHz to 80 MHz (OC-192) — 0.26 0.37 ps

Phase Jitter (RMS)1

for FOUT of 125 to 500 MHz

J12 kHz to 20 MHz (OC-48) — 0.36 0.50 ps

50 kHz to 80 MHz (OC-192)2— 0.34 0.42 ps

Phase Jitter (RMS)1

for FOUT of 125 and 156.25 MHz Only J12 kHz to 20 MHz (Brickwall) — 0.25 0.40 ps

Phase Jitter (RMS)

for FOUT of 10 to 160 MHz

CMOS Output Only

J12 kHz to 20 MHz (OC-48)2—0.62 — ps

50 kHz to 20 MHz2—0.61 — ps

Notes:

1. Refer to AN256 for further information.

2. Max offset frequencies: 80 MHz for FOUT > 250 MHz, 20 MHz for 50 MHz < FOUT <250 MHz,

2MHz for 10MHz < FOUT <50 MHz.

Table 5. CLK± Output Period Jitter

Parameter Symbol Test Condition Min Typ Max Units

Period Jitter* JPER RMS — 2 — ps

Peak-to-Peak — 14 — ps

*Note: Any output mode, including CMOS, LVPECL, LVDS, CML. N = 1000 cycles. Refer to AN279 for further information.

Table 6. CLK± Output Phase Noise (Typical)

Offset Frequency (f) 120.00 MHz

LVDS

156.25 MHz

LVPECL

622.08 MHz

LVPECL

Units

100 Hz

1kHz

10 kHz

100 kHz

1MHz

10 MHz

100 MHz

–112

–122

–132

–137

–144

–150

n/a

–105

–122

–128

–135

–144

–147

n/a

–97

–107

–116

–121

–134

–146

–148

dBc/Hz

Si532

Rev. 1.4 5

Table 7. Environmental Compliance

The Si532 meets the following qualification test requirements.

Parameter Conditions/Test Method

Mechanical Shock MIL-STD-883, Method 2002

Mechanical Vibration MIL-STD-883, Method 2007

Solderability MIL-STD-883, Method 2003

Gross & Fine Leak MIL-STD-883, Method 1014

Resistance to Solder Heat MIL-STD-883, Method 2036

Moisture Sensitivity Level J-STD_020, MSL1

Contact Pads Gold over Nickel

Table 8. Thermal Characteristics

(Typical values TA = 25 ºC, VDD =3.3V)

Parameter Symbol Test Condition Min Typ Max Unit

Thermal Resistance Junction to Ambient JA Still Air — 84.6 — °C/W

Thermal Resistance Junction to Case JC Still Air — 38.8 — °C/W

Ambient Temperature TA–40 — 85 °C

Junction Temperature TJ——125°C

Table 9. Absolute Maximum Ratings1

Parameter Symbol Rating Units

Maximum Operating Temperature TAMAX 85 ºC

Supply Voltage, 1.8 V Option VDD –0.5 to +1.9 V

Supply Voltage, 2.5/3.3 V Option VDD –0.5 to +3.8 V

Input Voltage (any input pin) VI–0.5 to VDD + 0.3 V

Storage Temperature TS–55 to +125 ºC

ESD Sensitivity (HBM, per JESD22-A114) ESD 2500 V

Soldering Temperature (Pb-free profile)2TPEAK 260 ºC

Soldering Temperature Time @ TPEAK (Pb-free profile)2tP20–40 seconds

Notes:

1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional

operation or specification compliance is not implied at these conditions.

2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at

www.silabs.com/VCXO for further information, including soldering profiles.

Si532

6 Rev. 1.4

2. Pin Descriptions

Table 10. Pin Descriptions

Pin Symbol LVDS/LVPECL/CML Function CMOS Function

1FS*

Frequency Select

0 = First frequency selected

1 = Second frequency selected

Frequency Select

0 = First frequency selected

1 = Second frequency selected

2OE*

Output enable

0 = clock output disabled (outputs tristated)

1 = clock output enabled

Output enable

0 = clock output disabled (outputs tristated)

1 = clock output enabled

3 GND Electrical and Case Ground Electrical and Case Ground

4 CLK+ Oscillator Output Oscillator Output

5 CLK– Complementary Output No connection

DD Power Supply Voltage Power Supply Voltage

*Note: FS and OE include a 17 k pullup resistor to VDD. See Section 3. “Ordering Information” for details on frequency value

ordering.

4GND

VDD

CLK

(Top View)

4GND

VDD

CLK+

CLK–

LVDS/LVPECL/CML CMOS

Si532

Rev. 1.4 7

3. Ordering Information

The Si532 XO supports a variety of options including frequency, temperature stability, output format, and VDD.

Specific device configurations are programmed into the Si532 at time of shipment. Configurations can be specified

using the Part Number Configuration chart below. Silicon Laboratories provides a web browser-based part number

configuration utility to simplify this process. Refer to www.silabs.com/VCXOPartNumber to access this tool and for

further ordering instructions. The Si532 is supplied in an industry-standard, RoHS-compliant, 6-pad, 5 x 7 mm

package.

Figure 1. Part Number Convention

Example Part Number: 532AB000108DGR is a 5 x 7 mm Dual XO in a 6 pad package. Since the six digit code (000108) is > 000100,

f0 is 644.53125 MHz (lower frequency) and f1 is 693.48299 (higher frequency), with a 3.3 V supply, LVPECL output, and Output

Enable active high polarity. Temperature stability is specified as ±20 ppm. The part is specified for a –40 to +85 C° ambient

temperature range operation and is shipped in tape and reel format.

Operating Temp Range (°C)

G –40 to +85 °C

Device Revision Letter

2nd Option Code

Code Temperature Stability (ppm, max, ±) Total Stablility (ppm, max, ±)

A 50 61 .5

B 20 31 .5

C 7 20

532 Dual XO

Product Family

6-digit Frequency Designator Code

Two unique frequencies can be specified within the following bands of

frequencies: 10 to 945 MHz, 970 to 1134 MHz, and 1213 to 1417 MHz. A

six digit code will be assigned for the specified combination of frequencies.

Codes > 000100 refer to dual XOs programmed with the lower frequency

value selected when FS = 0, and the higher value when FS = 1. Six digit

codes < 000100 refer to dual XOs programmed with the higher frequency

value selected when FS = 0, and the lower value when FS = 1.

532 X X XXXXXX D G R

1st Option Code

VDD Output Format Output Enable Polarity

A 3.3 LVPECL High

B 3.3 LVDS High

C 3.3 CMOS High

D3.3CML High

E 2.5 LVPECL High

F 2.5 LVDS High

G 2.5 CMOS High

H2.5CML High

J 1.8 CMOS High

K1.8CML High

M 3.3 LVPECL Low

N 3.3 LVDS Low

P 3.3 CMOS Low

Q 3.3 CML Low

R 2.5 LVPECL Low

S 2.5 LVDS Low

T 2.5 CMOS Low

U 2.5 CML Low

V 1.8 CMOS Low

W 1.8 CML Low

Note:

CMOS available to 160 MHz.

R = Tape & Reel

Blank = Coil Tape

Si532

8 Rev. 1.4

4. Outline Diagram and Suggested Pad Layout

Figure 2 illustrates the package details for the Si532. Table 11 lists the values for the dimensions shown in the

illustration.

Figure 2. Si532 Outline Diagram

Table 11. Package Diagram Dimensions (mm)

Dimension Min Nom Max

A 1.50 1.65 1.80

b 1.30 1.40 1.50

c 0.50 0.60 0.70

D 5.00 BSC

D1 4.30 4.40 4.50

e 2.54 BSC

E 7.00 BSC

E1 6.10 6.20 6.30

H 0.55 0.65 0.75

L 1.17 1.27 1.37

p 1.80 — 2.60

R 0.70 REF

aaa 0.15

bbb 0.15

ccc 0.10

ddd 0.10

eee 0.05

Si532

Rev. 1.4 9

5. Si532 Mark Specification

Figure 3 illustrates the mark specification for the Si532. Table 12 lists the line information.

Figure 3. Mark Specification

Table 12. Si53x Top Mark Description

Line Position Description

1 1–10 “SiLabs 532”

2 1–10 Si532: Option1 + Option2 + ConfigNum(6) + Temp

3 Trace Code

Position 1 Pin 1 orientation mark (dot)

Position 2 Product Revision (D)

Position 3–6 Tiny Trace Code (4 alphanumeric characters per assembly release instructions)

Position 7 Year (least significant year digit), to be assigned by assembly site (ex: 2007 = 7)

Position 8–9 Calendar Work Week number (1–53), to be assigned by assembly site

Position 10 “+” to indicate Pb-Free and RoHS-compliant



Si532

10 Rev. 1.4

6. 6-Pin PCB Land Pattern

Figure 4 illustrates the 6-pin PCB land pattern for the Si532. Table 13 lists the values for the dimensions shown in

the illustration.

Figure 4. Si532 PCB Land Pattern

Table 13. PCB Land Pattern Dimensions (mm)

Dimension Min Max

D2 5.08 REF

e 2.54 BSC

E2 4.15 REF

GD 0.84 —

GE 2.00 —

VD 8.20 REF

VE 7.30 REF

X1.70 TYP

Y2.15 REF

ZD — 6.78

ZE — 6.30

Notes:

1. Dimensioning and tolerancing per the ANSI Y14.5M-1994 specification.

2. Land pattern design based on IPC-7351 guidelines.

3. All dimensions shown are at maximum material condition (MMC).

4. Controlling dimension is in millimeters (mm).

Si532

Rev. 1.4 11

DOCUMENT CHANGE LIST

Revision 1.0 to Revision 1.1

Updated Table 1, “Recommended Operating

Conditions,” on page 2.

Device maintains stable operation over –40 to +85 ºC

operating temperature range.

Supply current specifications updated for revision D.

Updated Table 2, “CLK± Output Frequency

Characteristics,” on page 2.

Added specification for ±20 ppm lifetime stability

(±7 ppm temperature stability) XO.

Updated Table 3, “CLK± Output Levels and

Symmetry,” on page 3.

Updated LVDS differential peak-peak swing

specifications.

Updated Table 4, “CLK± Output Phase Jitter,” on

page 4.

Updated Table 5, “CLK± Output Period Jitter,” on

page 4.

Revised period jitter specifications.

Updated Table 9, “Absolute Maximum Ratings1,” on

page 5 to reflect the soldering temperature time at

260 ºC is 20–40 sec per JEDEC J-STD-020C.

Updated 3. "Ordering Information" on page 7.

Changed ordering instructions to revision D.

Added 5. "Si532 Mark Specification" on page 9.

Revision 1.1 to Revision 1.2

Updated 2.5 V/3.3 V and 1.8 V CML output level

specifications for Table 3 on page 3.

Added footnotes clarifying max offset frequency test

conditions for Table 4 on page 4.

Removed the words "Differential Modes:

LVPECL/LVDS/CML" in the footnote referring to

AN256 in Table 4 on page 4.

Added CMOS phase jitter specs to Table 4 on

page 4.

Updated Table 7 on page 5 to include the "Moisture

Sensitivity Level" and "Contact Pads" rows.

Revised Figure 2 on page 8 to reflect current

package outline diagram.

Updated Figure 3 and Table 12 on page 9 to reflect

specific marking information. Previously, Figure 3

was generic.

Revision 1.2 to Revision 1.3

Added Table 8, “Thermal Characteristics,” on

page 5.

Revision 1.3 to Revision 1.31

May 2, 2016

Updated Table 4 to include 125 MHz and

156.25 MHz jitter measurements.

Revision 1.31 to Revision 1.4

June, 2018

Changed “Trays” to “Coil Tape” in section

3. “Ordering Information”.

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