8 7 6 5 4 3 2 S S IL/\ 6 WAFER N ' r | ai ta 2 | 4 on Zz 16.9 2 6:9 gy | = (14) fa = E [1 (0.86) <| 4 ITC ~~ ; is0_NOTES RATES 2 544 620N-2% MATE WITH : 54462 SERIES | IT/\-OBHLA IP Sitio WLI-FIUM ZALgld, KAO. 1MAX. . RAG D O. 2BMAX. CL, Siw FBOVILI-FIL HOALSId0. 25MAX. 9, MISALIGNMENT OF SOLDER TAILS FROM UPPER DIRECTION : @.| MAX., LOWER DIRECTION :@.2 MAX. OFFSET BETWEEN UPPER AND LOWER : 0.25 MAX. Fy MaIC/ NUE E CUTTING AREA MUST BE FREE OF BURRS. 3. AA |.5+0.4 _, (4.8) 540.4 MATERIALS JL/\ 3: PBT,ULS4HB(BLACK) Cc WAFER ey 2 J Ueid (t=O. 2) ~m PIN > PHOSPHOR BRONZE NN 4. Ay tthe 2 PLATING SPEC. mo) serve CUITRED PIN : Au PLATED (CONTACT AREA) BX CILI-F)LED N = TIN-PLATED PLATING ~ (SOLDER TAIL AREA) 5, ANBII553923**1 10D J-GCHSD, B THIS PRODUCT IS LEAD FREE OF 55323 -**/I, 55323-1519 I5 aes REY MATERIAL NO. [|CKT MODEL _NO. 55323-**|9 _ |DIMENSIONS: SHT | REV ===) J MATERIAL GENERAL TOLERANCES: SCALE | DESIGN UNITS THIRD ANGLE [GMM ;JINCH 5 MM) Revise oN g meee ue SHEpBHe Uae SPECIFIED) #| mm Cincy C] provecrion Cincy [mm ony CAD ONLY = ass sz NOTH UNDER DRAWN BY & DATE TITLE: , = mM ool8 SEE NOTES ID Se 0.2) Y WADA ea/03/i7 .@ B/FPC CONN. WAFER ASSY a < S855 a 1 OVER 4g UNDER [ag pa [CHECKED BY & DATE (PANEL DETACHABLE TYPE) uw 4 6 << | EN-O2,K097) MXJ-54