© Semiconductor Components Industries, LLC, 2015
April, 2017 − Rev. 9 1Publication Order Number:
NCP707/D
NCP707
200 mA, Very-Low
Quiescent Current, IQ 25 mA,
Low Noise, Low Dropout
Regulator
The NCP707 is 200 mA LDO that provides the engineer with a very
stable, accurate voltage with very low noise suitable for space
constrained, noise sensitive applications. In order to optimize
performance for battery operated portable applications, the NCP707
employs the dynamic quiescent current adjustment for very low IQ
consumption at no−load.
Features
•Operating Input Voltage Range: 1.8 V to 5.5 V
•Available in Fixed Voltage Options: 1.5 V to 3.3 V
Contact Factory for Other Voltage Options
•Very Low Quiescent Current of Typ. 25 mA
•Very Low Noise: 22 mVRMS from 100 Hz to 100 kHz
•Very Low Dropout: 100 mV Typical at 200 mA
•±2% Accuracy Over Load/Line/Temperature
•High Power Supply Ripple Rejection: 70 dB at 1 kHz
•Thermal Shutdown and Current Limit Protections
•Stable with a 1 mF Ceramic Output Capacitor
•Available in XDFN 1.0 x 1.0 mm Package
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applicaitons
•PDAs, Mobile phones, GPS, Smartphones
•Wireless Handsets, Wireless LAN, Bluetooth®, Zigbee®
•Portable Medical Equipment
•Other Battery Powered Applications
Figure 1. Typical Application Schematic
NCP707
IN
EN
OUT
GND
OFF ON
VOUT
COUT
1 mF
Ceramic
CIN
VIN
XDFN4
MX SUFFIX
CASE 711AJ
MARKING
DIAGRAM
www.onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 18 of this data sheet.
ORDERING INFORMATION
PIN CONNECTIONS
1
XX = Specific Device Code
M = Date Code
XX M
1
43
21
OUT GND
IN EN
(Top View)
EPAD
NCP707
www.onsemi.com
2
IN
OUT
VOLTAGE
REFERENCE
ACTIVE
DISCHARGE*
MOSFET
DRIVER WITH
CURRENT LIMIT
THERMAL
SHUTDOWN
ENABLE
LOGIC
GND
AUTO LOW
POWER MODE
EN
EN
Figure 2. Simplified Schematic Block Diagram
*Active output discharge function is present only in NCP707AMXyyyTCG and NCP707CMXyyyTCG devices.
yyy denotes the particular VOUT option.
PIN FUNCTION DESCRIPTION
Pin No. Pin Name Description
1 OUT Regulated output voltage pin. A small ceramic capacitor with minimum value of 1 mF is needed from this
pin to ground to assure stability.
2 GND Power supply ground.
3 EN Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown
mode.
4 IN Input pin. A small 1 mF capacitor is needed from this pin to ground to assure stability.
− EPAD Exposed pad should be connected directly to the GND pin. Soldered to a large ground copper plane allows
for effective heat removal.
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) VIN −0.3 V to 6 V V
Output Voltage VOUT −0.3 V to VIN + 0.3 V V
Enable Input VEN −0.3 V to VIN + 0.3 V V
Output Short Circuit Duration tSC ∞s
Maximum Junction Temperature TJ(MAX) 150 °C
Storage Temperature TSTG −55 to 150 °C
ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V
ESD Capability, Machine Model (Note 2) ESDMM 200 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latchup Current Rating tested per JEDEC standard: JESD78
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, XDFN4 1x1 mm
Thermal Resistance, Junction−to−Air RqJA 250 °C/W
3. Single component mounted on 2 oz, FR4 PCB with 100 mm2 Cu area.
NCP707
www.onsemi.com
3
ELECTRICAL CHARACTERISTICS
−40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.5 V or 1.9 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 1 mF, unless otherwise noted.
VEN = 0.9 V. Typical values are at TJ = +25°C. Min./Max. are for TJ = −40°C and TJ = +125°C respectively (Note 4).
Parameter Test Conditions Symbol Min Typ Max Unit
Operating Input Voltage VIN 1.8 5.5 V
Output Voltage Accuracy VOUT + 0.5 V ≤ VIN ≤ 5.5 V, IOUT = 0 − 200 mA VOUT −2 +2 %
Line Regulation VOUT + 0.5 V ≤ VIN ≤ 5.5 V, IOUT = 10 mA RegLINE 400 mV/V
Load Regulation IOUT = 0 mA to 200 mA RegLOAD 10 mV/mA
Load Transient IOUT = 1 mA to 200 mA or 200 mA to 1 mA in
1 ms, COUT = 1 mFTranLOAD 75 mV
Dropout Voltage (Note 5) IOUT = 200 mA
VOUT = 1.5 V
VDO
415 490
mV
VOUT = 1.8 V 221 380
VOUT = 1.85 V 218 370
VOUT = 2.5 V 135 225
VOUT = 2.8 V 118 175
VOUT = 2.85 V 114 170
VOUT = 3.0 V 111 165
VOUT = 3.1 V 107 160
VOUT = 3.2 V 105 155
VOUT = 3.3 V 100 150
Output Current Limit VOUT = 90% VOUT(nom) ICL 250 379 500 mA
Ground Current
IOUT = 0 mA IQ25 35 mA
IOUT = 2 mA IGND 105 mA
IOUT = 200 mA IGND 240 mA
Shutdown Current VEN ≤ 0.4 V, VIN = 5.5 V IDIS 0.01 1 mA
EN Pin Threshold Voltage
High Threshold
Low Threshold VEN Voltage increasing
VEN Voltage decreasing VEN_HI
VEN_LO 0.9 0.4
V
EN Pin Input Current VEN = 5.5 V IEN 180 500 nA
Turn−on Time COUT = 1.0 mF, From assertion of VEN to 98%
VOUT(NOM) tON 200 ms
Power Supply Rejection Ratio VIN = 3.6 V, VOUT = 3.1 V
IOUT = 150 mA f = 100 Hz
f = 1 kHz
f = 10 kHz
PSRR 58
70
55
dB
Output Noise Voltage VOUT = 3.1 V, VIN = 3.6 V, IOUT = 200 mA
f = 100 Hz to 100 kHz VN22 mVrms
Thermal Shutdown Temperature Temperature increasing from TJ = +25°C TSD 160 °C
Thermal Shutdown Hysteresis Temperature falling from TSD TSDH 20 °C
Active Output Discharge Resist-
ance VEN < 0.4 V, Version A only
VEN < 0.4 V, Version C only RDIS 1.2
120 kW
W
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at
TJ = T A = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 0.5 V.
NCP707
www.onsemi.com
4
Figure 3. Output Voltage vs. Temperature
VOUT = 1.5 V Figure 4. Output Voltage vs. Temperature
VOUT = 1.85 V
Figure 5. Output Voltage vs. Temperature
VOUT = 2.85 V Figure 6. Output Voltage vs. Temperature
VOUT = 3.0 V
Figure 7. Output Voltage vs. Temperature
VOUT = 3.1 V Figure 8. Output Voltage vs. Temperature
VOUT = 3.3 V
1.510
1.505
1.500
1.495
1.490
1.485
1.480
−40 −20 0 14012010020 40 60 80
JUNCTION TEMPERATURE (°C)
OUTPUT VOLTAGE (V)
IOUT = 10 mA
IOUT
CIN = COUT = 1 mF
VIN = 2.0 V
VOUT(NOM) = 1.5 V
JUNCTION TEMPERATURE (°C)
OUTPUT VOLTAGE (V)
1.860
−40 −20 0 14012010020 40 60 80
1.855
1.850
1.845
1.840
1.835
1.830
CIN = COUT = 1 mF
VIN = 2.35 V
VOUT(NOM) = 1.85 V
IOUT = 10 mA
IOUT = 200 mA
2.870
−40 −20 0 14012010020 40 60 80
JUNCTION TEMPERATURE (°C)
OUTPUT VOLTAGE (V)
2.865
2.860
2.855
2.850
2.845
2.840
IOUT = 10 mA
IOUT = 200 mA
CIN = COUT = 1 mF
VIN = 3.35 V
VOUT(NOM) = 2.85 V
JUNCTION TEMPERATURE (°C)
OUTPUT VOLTAGE (V)
3.000
−40 −20 0 14012010020 40 60 80
2.995
2.990
2.985
2.980
2.975
2.970
IOUT = 10 mA
IOUT = 200 mA
CIN = COUT = 1 mF
VIN = 3.5 V
VOUT(NOM) = 3.0 V
3.110
−40 −20 0 14012010020 40 60 80
JUNCTION TEMPERATURE (°C)
OUTPUT VOLTAGE (V)
3.105
3.100
3.095
3.090
3.085
3.080
CIN = COUT = 1 mF
VIN = 3.6 V
VOUT(NOM) = 3.1 V IOUT = 10 mA
IOUT = 200 mA
JUNCTION TEMPERATURE (°C)
OUTPUT VOLTAGE (V)
3.300
−40 −20 0 14012010020 40 60 80
3.295
3.290
3.285
3.280
3.275
3.270
IOUT = 10 mA
IOUT = 200 mA
CIN = COUT = 1 mF
VIN = 3.8 V
VOUT(NOM) = 3.3 V
NCP707
www.onsemi.com
5
Figure 9. Quiescent Current vs. Input Voltage
VOUT = 1.5 V Figure 10. Quiescent Current vs. Input Voltage
VOUT = 1.8 V
Figure 11. Quiescent Current vs. Input Voltage
VOUT = 2.8 V Figure 12. Quiescent Current vs. Input Voltage
VOUT = 3.0 V
Figure 13. Quiescent Current vs. Input Voltage
VOUT = 3.1 V Figure 14. Quiescent Current vs. Input Voltage
VOUT = 3.3 V
35
0 0.5 1 5.554.51.5 2 2.5 4
INPUT VOLTAGE (V)
QUIESCENT CURRENT (mA)
30
25
20
15
10
5
03.53
TA = 125°C
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 1.5 V
TA = 25°C
TA = −40°C
35
0 0.5 1 5.554.51.5 2 2.5 4
INPUT VOLTAGE (V)
QUIESCENT CURRENT (mA)
30
25
20
15
10
5
03.53
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 1.8 V
TA = 125°C
TA = 25°C
TA = −40°C
35
0 0.5 1 5.554.51.5 2 2.5 4
INPUT VOLTAGE (V)
QUIESCENT CURRENT (mA)
30
25
20
15
10
5
03.53
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 2.8 V
TA = 125°C
TA = 25°C
TA = −40°C
35
0 0.5 1 5.554.51.5 2 2.5 4
INPUT VOLTAGE (V)
QUIESCENT CURRENT (mA)
30
25
20
15
10
5
03.53
TA = 125°C
TA = 25°C
TA = −40°C
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 3.0 V
35
0 0.5 1 5.554.51.5 2 2.5 4
INPUT VOLTAGE (V)
QUIESCENT CURRENT (mA)
30
25
20
15
10
5
03.53
TA = 125°C
TA = 25°C
TA = −40°C
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 3.1 V
35
0 0.5 1 5.554.51.5 2 2.5 4
INPUT VOLTAGE (V)
QUIESCENT CURRENT (mA)
30
25
20
15
10
5
03.53
TA = 125°C
TA = 25°C
TA = −40°C
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 3.3 V
NCP707
www.onsemi.com
6
Figure 15. Output Voltage vs. Input Voltage
VOUT = 1.5 V Figure 16. Output Voltage vs. Input Voltage
VOUT = 1.8 V
Figure 17. Output Voltage vs. Input Voltage
VOUT = 2.8 V Figure 18. Output Voltage vs. Input Voltage
VOUT = 3.0 V
Figure 19. Output Voltage vs. Input Voltage
VOUT = 3.1 V Figure 20. Output Voltage vs. Input Voltage
VOUT = 3.3 V
2.00
0 0.5 1 5.554.51.5 2 2.5 4
INPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
3.53
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 1.5 V
TA = 125°C
TA = 25°C
TA = −40°C
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 1.8 V
TA = 125°C
TA = 25°C
TA = −40°C
2.00
0 0.5 1 5.554.51.5 2 2.5 4
INPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
3.53
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 2.8 V
3.50
0 0.5 1 5.554.51.5 2 2.5 4
INPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
3.53
TA = 125°C
TA = 25°C
TA = −40°C
TA = 125°C
TA = 25°C
TA = −40°C
0 0.5 1 5.554.51.5 2 2.5 43.53
OUTPUT VOLTAGE (V)
3.00
2.50
2.00
1.50
1.00
0.50
0.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 3.0 V
INPUT VOLTAGE (V)
3.50
0 0.5 1 5.554.51.5 2 2.5 4
INPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
3.53
3.00
2.50
2.00
1.50
1.00
0.50
0.00
TA = 125°C
TA = 25°C
TA = −40°C
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 3.1 V
0 0.5 1 5.554.51.5 2 2.5 43.53
OUTPUT VOLTAGE (V)
4.00
INPUT VOLTAGE (V)
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 3.3 V
TA = 125°C
TA = 25°C
TA = −40°C
NCP707
www.onsemi.com
7
Figure 21. Dropout Voltage vs. Output Current
VOUT = 1.5 V Figure 22. Dropout Voltage vs. Output Current
VOUT = 1.85 V
Figure 23. Dropout Voltage vs. Output Current
VOUT = 2.8 V Figure 24. Dropout Voltage vs. Output Current
VOUT = 3.0 V
Figure 25. Dropout Voltage vs. Output Current
VOUT = 3.1 V Figure 26. Dropout Voltage vs. Output Current
VOUT = 3.3 V
0
DROPOUT VOLTAGE (V)
0.7
OUTPUT CURRENT (A)
0.04 0.20.160.120.08
0.6
0.5
0.4
0.3
0.2
0.1
0
TA = 125°C
CIN = COUT = 1 mF
VOUT(NOM) = 1.5 V
TA = 25°C
TA = −40°C
0
DROPOUT VOLTAGE (V)
0.45
OUTPUT CURRENT (A)
0.04 0.20.160.120.08
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0
DROPOUT VOLTAGE (V)
0.200
OUTPUT CURRENT (A)
0.04 0.20.160.120.08
0.175
0.150
0.125
0.100
0.075
0.050
0.025
0.000
TA = 125°C
TA = 25°C
TA = −40°C
CIN = COUT = 1 mF
VOUT(NOM) = 1.85 V
TA = 125°C
TA = 25°C
TA = −40°C
CIN = COUT = 1 mF
VOUT(NOM) = 2.8 V
0OUTPUT CURRENT (A)
0.04 0.20.160.120.08
0.200
0.175
0.150
0.125
0.100
0.075
0.050
0.025
0.000
DROPOUT VOLTAGE (V)
CIN = COUT = 1 mF
VOUT(NOM) = 3.0 V
TA = 125°C
TA = 25°C
TA = −40°C
0
DROPOUT VOLTAGE (V)
0.200
OUTPUT CURRENT (A)
0.04 0.20.160.120.08
0.175
0.150
0.125
0.100
0.075
0.050
0.025
0.000 0OUTPUT CURRENT (A)
0.04 0.20.160.120.08
0.200
0.175
0.150
0.125
0.100
0.075
0.050
0.025
0.000
DROPOUT VOLTAGE (V)
TA = 125°C
TA = 25°C
TA = −40°C
CIN = COUT = 1 mF
VOUT(NOM) = 3.1 V
TA = 125°C
TA = 25°C
TA = −40°C
CIN = COUT = 1 mF
VOUT(NOM) = 3.3 V
NCP707
www.onsemi.com
8
Figure 27. Short−Circuit Limit vs. Temperature
VOUT = 1.5 V Figure 28. Short−Circuit Limit vs. Temperature
VOUT = 1.85 V
Figure 29. Short−Circuit Limit vs. Temperature
VOUT = 2.85 V Figure 30. Short−Circuit Limit vs. Temperature
VOUT = 3.0 V
Figure 31. Short−Circuit Limit vs. Temperature
VOUT = 3.1 V Figure 32. Short−Circuit Limit vs. Temperature
VOUT = 3.3 V
JUNCTION TEMPERATURE (°C)
440
OUTPUT CURRENT (mA)
−40 −20 0 14012010020 40 60 80
420
400
380
360
340
320
300
Short−Circuit Current:
IOUT for VOUT = 0 V
CIN = COUT = 1 mF
VIN = 2.0 V
VOUT(NOM) = 1.5 V
Current Limit: IOUT for
VOUT = VOUT(NOM) − 0.1 V
JUNCTION TEMPERATURE (°C)
440
OUTPUT CURRENT (mA)
−40 −20 0 14012010020 40 60 80
420
400
380
360
340
320
300
Short−Circuit Current:
IOUT for VOUT = 0 V
Current Limit: IOUT for
VOUT = VOUT(NOM) − 0.1 V
CIN = COUT = 1 mF
VIN = 2.35 V
VOUT(NOM) = 1.85 V
JUNCTION TEMPERATURE (°C)
440
OUTPUT CURRENT (mA)
−40 −20 0 14012010020 40 60 80
420
400
380
360
340
320
300
Short−Circuit Current:
IOUT for VOUT = 0 V
CIN = COUT = 1 mF
VIN = 3.35 V
VOUT(NOM) = 2.85 V
Current Limit: IOUT for
VOUT = VOUT(NOM) − 0.1 V
JUNCTION TEMPERATURE (°C)
440
OUTPUT CURRENT (mA)
−40 −20 0 14012010020 40 60 80
420
400
380
360
340
320
300
Short−Circuit Current:
IOUT for VOUT = 0 V
Current Limit: IOUT for
VOUT = VOUT(NOM) − 0.1 V
CIN = COUT = 1 mF
VIN = 3.5 V
VOUT(NOM) = 3.0 V
JUNCTION TEMPERATURE (°C)
440
OUTPUT CURRENT (mA)
−40 −20 0 14012010020 40 60 80
420
400
380
360
340
320
460
Short−Circuit Current:
IOUT for VOUT = 0 V
CIN = COUT = 1 mF
VIN = 3.6 V
VOUT(NOM) = 3.1 V
Current Limit: IOUT for
VOUT = VOUT(NOM) − 0.1 V
JUNCTION TEMPERATURE (°C)
−40 −20 0 14012010020 40 60 80
440
420
400
380
360
340
320
460
OUTPUT CURRENT (mA)
Short−Circuit Current:
IOUT for VOUT = 0 V
Current Limit: IOUT for
VOUT = VOUT(NOM) − 0.1 V
CIN = COUT = 1 mF
VIN = 3.8 V
VOUT(NOM) = 3.3 V
NCP707
www.onsemi.com
9
Figure 33. Line Regulation vs. Temperature
VOUT = 1.5 V Figure 34. Line Regulation vs. Temperature
VOUT = 1.85 V
Figure 35. Line Regulation vs. Temperature
VOUT = 2.85 V Figure 36. Line Regulation vs. Temperature
VOUT = 3.0 V
Figure 37. Line Regulation vs. Temperature
VOUT = 3.1 V Figure 38. Line Regulation vs. Temperature
VOUT = 3.3 V
JUNCTION TEMPERATURE (°C)
−40 −20 0 14012010020 40 60 80
5.0
LINE REGULATION (mV)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Line Regulation from VIN = 2 V to 5.5 V
CIN = COUT = 1 mF
VIN = 2.0 V to 5.5 V
VOUT(NOM) = 1.5 V
IOUT = 10 mA
−40 −20 0 14012010020 40 60 80
JUNCTION TEMPERATURE (°C)
5.0
LINE REGULATION (mV)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Line Regulation from VIN = 2.35 V to 5.5 V
CIN = COUT = 1 mF
VIN = 2.35 V to 5.5 V
VOUT(NOM) = 1.85 V
IOUT = 10 mA
JUNCTION TEMPERATURE (°C)
−40 −20 0 14012010020 40 60 80
5.0
LINE REGULATION (mV)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Line Regulation from VIN = 3.35 V to 5.5 V
CIN = COUT = 1 mF
VIN = 3.35 V to 5.5 V
VOUT(NOM) = 2.85 V
IOUT = 10 mA
−40 −20 0 14012010020 40 60 80
JUNCTION TEMPERATURE (°C)
5.0
LINE REGULATION (mV)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Line Regulation from VIN = 3.5 V to 5.5 V
CIN = COUT = 1 mF
VIN = 3.5 V to 5.5 V
VOUT(NOM) = 3.0 V
IOUT = 10 mA
JUNCTION TEMPERATURE (°C)
−40 −20 0 14012010020 40 60 80
5.0
LINE REGULATION (mV)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Line Regulation from VIN = 3.6 V to 5.5 V
CIN = COUT = 1 mF
VIN = 3.6 V to 5.5 V
VOUT(NOM) = 3.1 V
IOUT = 10 mA
−40 −20 0 14012010020 40 60 80
JUNCTION TEMPERATURE (°C)
5.0
LINE REGULATION (mV)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Line Regulation from VIN = 3.8 V to 5.5 V
CIN = COUT = 1 mF
VIN = 3.8 V to 5.5 V
VOUT(NOM) = 3.3 V
IOUT = 10 mA
NCP707
www.onsemi.com
10
Figure 39. Load Regulation vs. Temperature Figure 40. Ground Current vs. Output Current
Figure 41. Ground Current vs. Temperature Figure 42. Stability vs. Output Capacitor ESR
Figure 43. PSRR vs. Frequency
VOUT = 1.5 V Figure 44. PSRR vs. Frequency
VOUT = 1.85 V
JUNCTION TEMPERATURE (°C)
10
LOAD REGULATION (mV)
VOUT(NOM) = 1.5 V
CIN = COUT = 1 mF
VIN = VOUT(NOM) + 0.5 V
IOUT = 0 mA to 200 mA
9
8
7
6
5
4
3
2
1
0
−40 −20 0 14012010020 40 60 80
VOUT(NOM) = 1.8 V
VOUT(NOM) = 3.3 V
OUTPUT CURRENT (mA)
200
GROUND CURRENT (mA)
012 10983456
180
160
140
120
100
80
60
40
20
07
TA = 125°C
CIN = COUT = 1 mF
VIN = VOUT(NOM) + 0.5 V
TA = 25°C
TA = −40°C
JUNCTION TEMPERATURE (°C)
300
−40 −20 0 14012010020 40 60 80
GROUND CURRENT (mA)
280
260
240
220
200
CIN = COUT = 1 mF
VIN = VOUT(NOM) + 0.5 V
IOUT = 200 mA
VOUT(NOM) = 1.5 V
VOUT(NOM) = 1.85 V
VOUT(NOM) = 3.3 V
VOUT(NOM) = 2.85 V
OUTPUT CURRENT (mA)
100
CAPACITOR ESR (W)
0
10
1
0.1
0.01 100 200 300
UNSTABLE OPERATION
STABLE OPERATION
VOUT = 1.5 V
VOUT = 3.3 V
FREQUENCY (Hz)
90
10
PSRR (dB)
80
70
60
50
40
30
20
10
0100 1k 10k 100k 1M 10M
COUT = 1 mF
CIN = none,
VIN = 2.0 V ± 50 mVAC
VOUT(NOM) = 1.5 V
IOUT = 1 mA
IOUT = 10 mA
IOUT = 150 mA
FREQUENCY (Hz)
10 100 1k 10k 100k 1M 10M
90
PSRR (dB)
80
70
60
50
40
30
20
10
0
100
IOUT = 150 mA
IOUT = 10 mA
IOUT = 1 mA
COUT = 1 mF
CIN = none,
VIN = 2.35 V ± 50 mVAC
VOUT(NOM) = 1.85 V
NCP707
www.onsemi.com
11
Figure 45. PSRR vs. Frequency
VOUT = 3.0 V Figure 46. PSRR vs. Frequency
VOUT = 3.1 V
Figure 47. Output Noise Density vs. Frequency
VOUT = 1.5 V Figure 48. Output Noise Density vs. Frequency
VOUT = 3.1 V
Figure 49. Enable Input Current vs. Enable
Voltage Figure 50. Enable Threshold Voltage vs.
Temperature
FREQUENCY (Hz)
10 100 1k 10k 100k 1M 10M
90
PSRR (dB)
80
70
60
50
40
30
20
10
0
100
IOUT = 150 mA
IOUT = 10 mA
IOUT = 1 mA
COUT = 1 mF
CIN = none,
VIN = 3.5 V ± 50 mVAC
VOUT(NOM) = 3.0 V
FREQUENCY (Hz)
10 100 1k 10k 100k 1M 10M
90
PSRR (dB)
80
70
60
50
40
30
20
10
0
IOUT = 150 mA
IOUT = 1 mA
IOUT = 10 mA
COUT = 1 mF
CIN = none,
VIN = 3.6 V ± 50 mVAC
VOUT(NOM) = 3.1 V
FREQUENCY (Hz)
10 100 1k 10k 100k 1M
OUTPUT VOLTAGE NOISE (mV/rtHz)
1.000
0.100
0.010
0.001
IOUT = 200 mA
IOUT = 10 mA
IOUT = 1 mA
CIN = COUT = 1 mF
VIN = 2.0 V
VOUT = 1.5 V
MLCC, X7R
1206 size
FREQUENCY (Hz)
10 100 1k 10k 100k 1M
OUTPUT VOLTAGE NOISE (mV/rtHz)
1.000
0.100
0.010
0.001
CIN = COUT = 1 mF
VIN = 3.6 V
VOUT = 3.1 V
MLCC, X7R
1206 size
IOUT = 10 mA
IOUT = 1 mA
IOUT = 200 mA
ENABLE VOLTAGE (V)
0 0.5 1 3.5 4.5 5 5.5
ENABLE CURRENT (mA)
0.35
0.3
0.25
0.2
0.15
0.1
0.05
0431.5 2 2.5
TA = 125°C
TA = 25°C
TA = −40°C
CIN = COUT = 1 mF
VIN = 2 V
VOUT(NOM) = 1.5 V
ENABLE CURRENT (mA)
JUNCTION TEMPERATURE (°C)
−40 −20 100 120 140
0.9
806002040
0.85
0.8
0.75
0.7
0.65
0.6
0.55
0.5
VIN = 2 V
CIN = COUT = 1 mF
VOUT(NOM) = 1.5 V
VEN = Low to High
VEN = High to Low
NCP707
www.onsemi.com
12
Figure 51. Shutdown Current vs. Temperature Figure 52. VOUT Turn−on Time vs.
Temperature
SHUTDOWN CURRENT (mA)
JUNCTION TEMPERATURE (°C)
−40 −20 100 120 140
0.2
806002040
0.16
0.12
0.08
0.04
0
CIN = COUT = 1 mF
VIN = VOUT(NOM) + 0.5 V
VEN = 0 V
VOUT TURN−ON TIME (ms)
JUNCTION TEMPERATURE (°C)
−40 −20 100 120 140
300
806002040
280
260
240
220
200
180
160
140
120
100
CIN = COUT = 1 mF
VIN = VOUT(NOM) + 0.5 V
VEN = Step from 0 V to 1 V / 1 ms
VOUT = 3.3 V
VOUT = 1.5 V
NCP707
www.onsemi.com
13
50 mV/div 100 mA / div
30 mV/div 100 mA / div
50 mV/div 100 mA / div
30 mV/div 100 mA / div
100 mA/div 1 V/div
1 V/div
Figure 53. Load Transient Response
IOUT = 1 mA to 200 mA, COUT = 1 mF
20 ms / div
VOUT
IOUT
VIN = 3.6 V
VOUT(nom) = 3.1 V
CIN = COUT = 1 mF
200 mA
1 mA
Figure 54. Load Transient Response
IOUT = 1 mA to 200 mA, COUT = 4.7 mF
20 ms / div
VIN = 3.6 V
VOUT(nom) = 3.1 V
CIN = COUT = 4.7 mF
VOUT
IOUT
200 mA
1 mA
Figure 55. Load Transient Response
IOUT = 10 mA to 200 mA, COUT = 1 mF
10 ms / div
Figure 56. Load Transient Response
IOUT = 10 mA to 200 mA, COUT = 4.7 mF
20 ms / div
VIN = 3.6 V
VOUT(nom) = 3.1 V
CIN = COUT = 1 mF
VIN = 3.6 V
VOUT(nom) = 3.1 V
CIN = COUT = 4.7 mF
VOUT
IOUT
VOUT
IOUT
200 mA
10 mA
200 mA
10 mA
VOUT = 1.8 V
VIN = 2.3 V
VOUT(nom) = 1.8 V
CIN = COUT = 1 mF
IIN = 1 mA
VEN = 1 V
VOUT = 0 V
VEN = 0 V
IIN
Figure 57. Enable Turn−On Response
VOUT = 1.8 V, COUT = 1 mF
500 ms / div
Figure 58. Enable Turn−Off Response
VOUT = 1.8 V, COUT = 1 mF (A Version)
500 ms / div
VOUT = 0 V
VIN = 2.3 V
VOUT(nom) = 1.8 V
CIN = COUT = 1 mF
VEN = 0 V
VEN = 1 V
VOUT = 1.8 V RL = 1.8 kW
RL = 180 kW
NCP707
www.onsemi.com
14
100 mA/div 1 V/div
VOUT = 1.8 V
VIN = 3.8 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
IIN = 1 mA
VEN = 1 V
VEN = 0 V
IIN
Figure 59. Enable Turn−On Response
VOUT = 3.3 V, COUT = 1 mF
50 ms / div
VOUT = 0 V
1 V/div
VOUT = 0 V
VEN = 0 V
VEN = 1 V
VOUT = 1.8 V RL = 1.8 kW
RL = 180 kW
VIN = 3.8 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
Figure 60. Enable Turn−Off Response
VOUT = 3.3 V, COUT = 1 mF (A Version)
500 ms / div
500 mV/div
VOUT = 1.8 V
VIN = 2.3 V
IIN = 1 mA
VOUT = 0 V
VIN = 0 V
Figure 61. Enable Turn−On Response
VOUT = 1.8 V, COUT = 1 mF
500 ms / div
Figure 62. Enable Turn−Off Response
VOUT = 1.8 V, COUT = 1 mF (A Version)
2 ms / div
500 mV/div
VOUT = 1.8 V
VIN = 2.3 V
VIN = 3.8 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
VIN = 3.8 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
VOUT = 0 V
VIN = 0 V
100 mA/div 1 V/div
Figure 63. Enable Turn−On Response
VOUT = 3.3 V, COUT = 1 mF
VOUT = 0 V
VIN = 0 V
VOUT = 3.3 V
VIN = 3.8 V
IIN = 1 mA
VIN = 3.8 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
VIN = 3.8 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
1 V/div
VOUT = 3.3 V
VIN = 3.8 V
VOUT = 0 V
VIN = 0 V
Figure 64. Enable Turn−Off Response
VOUT = 3.3 V, COUT = 1 mF (A Version)
NCP707
www.onsemi.com
15
1 V/div
IOUT = 1 mA
VOUT = 1.5 V Output Short−Circuit
Figure 65. Short−Circuit Response
VOUT = 1.5 V, COUT = 1 mF
200 ms / div
200 mA/div
VIN = 5.5 V
VOUT(nom) = 1.5 V
CIN = COUT = 1 mF
IOUT = 402 mA
VOUT = 0 V
Figure 66. Short−Circuit Response
VOUT = 1.5 V, COUT = 1 mF
200 ms / div
VIN = 5.5 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
IOUT = 398 mA
Output Short−Circuit
VOUT = 3.3 V
VOUT = 0 V
1 V/div
Figure 67. Short−Circuit Response
VOUT = 1.5 V, COUT = 1 mF
5 ms / div
200 mA/div
2 V/div200 mA/div
VIN = 2.0 V
VOUT(nom) = 1.5 V
CIN = COUT = 1 mF
VOUT = 1.5 V
IOUT = 1 mA
Thermal Shutdown
VOUT = 0 V
IOUT = 398 mA
NCP707
www.onsemi.com
16
APPLICATIONS INFORMATION
The NCP707 is a high performance, small package size,
200 mA LDO voltage regulator. This device delivers very
good noise and dynamic performance. Thanks to its adaptive
ground current feature the device consumes only 25 mA of
quiescent current at no−load condition. The regulator
features very*low noise of 22 mVRMS, PSRR of typ. 70dB
at 1kHz and very good load/line transient response. The
device is an ideal choice for space constrained portable
applications.
A logic EN input provides ON/OFF control of the output
voltage. When the EN is low the device consumes as low as
typ. 10 nA from the IN pin.
The device is fully protected in case of output overload,
output short circuit condition and overheating, assuring a
very robust design.
Input Capacitor Selection (CIN)
It is recommended to connect a minimum of 1 μF Ceramic
X5R or X7R capacitor close to the IN pin of the device.
Larger input capacitors may be necessary if fast and large
load transients are encountered in the application. There is
no requirement for the min./max. ESR of the input capacitor
but it is recommended to use ceramic capacitors for their low
ESR and ESL.
Output Capacitor Selection (COUT)
The NCP707 is designed to be stable with small 1.0 mF and
larger ceramic capacitors on the output. The minimum
effective output capacitance for which the LDO remains
stable i s 100 nF. The safety margin is provided to account for
capacitance variations due to DC bias voltage, temperature,
initial tolerance. There is no requirement for the minimum
value of Equivalent Series Resistance (ESR) for the COUT
but the maximum value of ESR should be less than 700 mΩ.
Larger output capacitors could be used to improve the load
transient response or high frequency PSRR characteristics.
It is not recommended to use tantalum capacitors on the
output due to their large ESR. The equivalent series
resistance of tantalum capacitors is also strongly dependent
on the temperature, increasing at low temperature. The
tantalum capacitors are generally more costly than ceramic
capacitors.
No−load Operation
The regulator remains stable and regulates the output
voltage properly within the ±2% tolerance limits even with
no external load applied to the output.
Enable Operation
The NCP707 uses the EN pin to enable/disable its output
and to control the active discharge function. If the EN pin
voltage is < 0.4 V the device is guaranteed to be disabled.
The pass transistor is turned*off so that there is virtually no
current flow between the IN and OUT. In case of the option
equipped with active discharge − the active discharge
transistor i s turned−on and the output voltage VOUT is pulled
to GND through a 1.2 kW resistor for A options or 120 W
resistor for C options. In the disable state the device
consumes as low as typ. 10 nA from the VIN. If the EN pin
voltage > 0.9 V the device is guaranteed to be enabled. The
NCP707 regulates the output voltage and the active
discharge transistor is turned*off. The EN pin has an
internal pull−down current source with typ. value of 180 nA
which assures that the device is turned−of f when the EN pin
is not connected. A build in 56 mV of hysteresis and deglitch
time in the EN block prevents from periodic on/off
oscillations that can occur due to noise on EN line. In the
case that the EN function isn’t required the EN pin should be
tied directly to IN.
Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases where the extended reverse current
condition is anticipated the device may require additional
external protection.
Output Current Limit
Output Current is internally limited within the IC to a
typical 379 mA. The NCP707 will source this amount of
current measured with the output voltage 100 mV lower
than the nominal VOUT. If the Output Voltage is directly
shorted to ground (VOUT = 0 V), the short circuit protection
will limit the output current to 390 mA (typ). The current
limit and short circuit protection will work properly up to
VIN =5.5 V at TA = 25°C. There is no limitation for the short
circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD * 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU − 140°C
typical). Once the IC temperature falls below the 140°C the
LDO is enabled again. The thermal shutdown feature
provides protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Power Dissipation
As power dissipated in the NCP707 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. The maximum power dissipation the
NCP707 can handle is given by:
PD(MAX) +ƪ125 *TAƫ
qJA
(eq. 1)
NCP707
www.onsemi.com
17
For reliable operation junction temperature should be
limited to +125°C.
The power dissipated by the NCP707 for given
application conditions can be calculated as follows:
PD(MAX) +VINIGND )IOUTǒVIN *VOUTǓ(eq. 2)
Figure 68 shows the typical values of θJA vs. heat
spreading area.
Load Regulation
The NCP707 features very good load regulation of typical
2 mV in the 0 mA to 200 mA range. In order to achieve this
very good load regulation a special attention to PCB design
is necessary. The trace resistance from the OUT pin to the
point of load can easily approach 100 mW which will cause
a 20 mV voltage drop at full load current, deteriorating the
excellent load regulation.
Line Regulation
The IC features very good line regulation of 0.4 mV/V
measured from VIN = VOUT + 0.5 V to 5.5 V.
Power Supply Rejection Ratio
At low frequencies the PSRR is mainly determined by the
feedback open−loop gain. At higher frequencies in the range
100 kHz – 10 MHz it can be tuned by the selection of COUT
capacitor and proper PCB layout.
0
0,1
0,2
0,3
0,4
0,5
0,6
0,7
0,8
0,9
50
100
150
200
250
300
350
400
450
500
0 100 200 300 400 500 600
PD(MAX) (W)
qJA (oC/W)
COPPER AREA (mm
2)
Theta JA curve with PCB cu thk 1,0 oz
Theta JA curve with PCB cu thk 2,0 oz
Power curve with PCB cu thk 2,0 oz
Power curve with PCB cu thk 1,0 oz
Figure 68. Thermal Parameters vs. Copper Area
Output Noise
The IC is designed for very−low output voltage noise. The
typical noise performance of 22 mVRMS makes the device
suitable for noise sensitive applications.
Internal Soft Start
The Internal Soft*Start circuitry will limit the inrush
current during the LDO turn−on phase. Please refer to
typical characteristics section for typical inrush current
values. The soft*start function prevents from any output
voltage overshoots and assures monotonic ramp−up of the
output voltage.
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated by the formula given in Equation 2.
NCP707
www.onsemi.com
18
ORDERING INFORMATION
Device Voltage
Option Marking Marking
Rotation Option Package Shipping†
NCP707AMX150TCG 1.5 V A 0°
With active output
discharge function
(RDIS = 1.2 kW)
XDFN4
(Pb-Free) 3000 / Tape & Reel
NCP707AMX180TCG 1.8 V D 0°
NCP707AMX185TCG 1.85 V E 0°
NCP707AMX250TCG 2.5 V K 180°
NCP707AMX280TCG 2.8 V F 0°
NCP707AMX285TCG 2.85 V J 0°
NCP707AMX300TCG 3.0 V K 0°
NCP707AMX310TCG 3.1 V L 0°
NCP707AMX330TCG 3.3 V P 0°
NCP707BMX150TCG 1.5 V A 90°
Without active output
discharge function
NCP707BMX180TCG 1.8 V D 90°
NCP707BMX185TCG 1.85 V E 90°
NCP707BMX250TCG 2.5 V K 270°
NCP707BMX280TCG 2.8 V F 90°
NCP707BMX285TCG 2.85 V J 90°
NCP707BMX300TCG 3.0 V K 90°
NCP707BMX310TCG 3.1 V L 90°
NCP707BMX330TCG 3.3 V P 90°
NCP707CMX150TCG 1.5 V L 180°
With active output
discharge function
(RDIS = 120 W)
NCP707CMX180TBG 1.8 V P 180°
NCP707CMX180TCG 1.8 V P 180°
NCP707CMX185TCG 1.85 V Q 180°
NCP707CMX250TCG 2.5 V V 180°
NCP707CMX280TCG 2.8 V Y 180°
NCP707CMX285TCG 2.85 V 2 180°
NCP707CMX300TBG 3.0 V 3 180°
NCP707CMX300TCG 3.0 V 3 180°
NCP707CMX310TCG 3.1 V 4 180°
NCP707CMX320TCG 3.2 V 5 180°
NCP707CMX330TBG 3.3 V 6 180°
NCP707CMX330TCG 3.3 V 6 180°
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCP707
www.onsemi.com
19
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÉÉ
ÉÉ
A
B
E
D
D2
BOTTOM VIEW
b
e
4X
NOTE 3
2X 0.05 C
PIN ONE
REFERENCE
TOP VIEW
2X 0.05 C
A
A1
(A3)
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
L
4X
12
DIM MIN MAX
MILLIMETERS
A0.33 0.43
A1 0.00 0.05
A3 0.10 REF
b0.15 0.25
D1.00 BSC
D2 0.43 0.53
E1.00 BSC
e0.65 BSC
L0.20 0.30
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MOUNTING FOOTPRINT*
1.20
0.26
0.24 4X
DIMENSIONS: MILLIMETERS
0.39
RECOMMENDED
PACKAGE
OUTLINE
NOTE 4
e/2
D2
455
A
M
0.05 BC
43
0.65
PITCH
DET AIL A
4X
b2 0.02 0.12
L2 0.07 0.17
4X
0.52
2X
0.11
4X
L24X
DETAIL A
b24X
NCP707/D
Bluetooth is a registered trademark of Bluetooth SIG.
ZigBee is a registered trademark of ZigBee Alliance.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer ’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body . Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
P
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loc
al
Sales Representative
◊
