RE (ARE)
NOTES
1-(2). High frequency characteristics (Impedance 50Ω) (Standard PC board terminal)
• V.S.W.R. characteristics • Insertion loss characteristics • Isolation characteristics
1
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
900MHz 3GHz
COM-NC
COM-NO
V.S.W.R.
Frequency
1.0
0.1
0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
900MHz 3GHz
COM-NC
COM-NO
Insertion loss, dB
Frequency
100
10
0
20
30
40
50
60
70
80
90
900MHz 3GHz
COM-NO
COM-NC
Isolation, dB
Frequency
1. Coil operating power
Pure DC current should be applied to the
coil. The wave form should be
rectangular. If it includes ripple, the ripple
factor should be less than 5%.
However, check it with the actual circuit
since the characteristics may be slightly
different.
2. Cleaning
For automatic cleaning, the boiling
method is recommended. Avoid
ultrasonic cleaning which subjects the
relays to high frequency vibrations, which
may cause the contacts to stick.
It is recommended that alcoholic solvents
be used.
3. Soldering
1) The manual soldering shall be
performed under following condition.
Max. 260°C 500°F 10s
Max. 350°C 662°F 3s
The affect of the PCB on the relay will
differ depending on the type of PCB
used. Please verify the type of PCB to be
used.
Preheat according to the following
conditions.
Soldering should be done at 260±5°C
500±5°F within 6 s.
2) In case of automatic soldering, the
following conditions should be observed
(Surface-mount terminal)
(1) Position of measuring temperature
(2) IR (infrared reflow) soldering method
Temperature rise of relay itself may vary
according to the mounting level or the
heating method of reflow equipment.
Therefore, please set the temperature of
soldering portion of relay terminal and
the top surface of the relay case not to
exceed the above mentioned soldering
condition.
It is recommended to check the
temperature rise of each portion under
actual mounting condition before use.
4. Packing style
1) Tape dimensions
2) Dimensions of plastic reel
5. Conditions for operation, transport
and storage conditions
1) Ambient temperature, humidity, and
atmospheric pressure during usage,
transport, and storage of the relay:
(1) Temperature:
–40 to +70°C –40 to +158°F
(2) Humidity: 5 to 85% RH
(Avoid freezing and condensation.)
The humidity range varies with the
temperature. Use within the range
indicated in the graph below.
(3) Atmospheric pressure: 86 to 106 kPa
Temperature and humidity range for
usage, transport, and storage:
2) Condensation
Condensation forms when there is a
sudden change in temperature under
high temperature and high humidity
conditions. Condensation will cause
deterioration of the relay insulation.
3) Freezing
Condensation or other moisture may
freeze on the relay when the temperature
is lower than 0°C 32°F. This causes
problems such as sticking of movable
parts or operational time lags.
4) Low temperature, low humidity
environments
The plastic becomes brittle if the relay is
exposed to a low temperature, low
humidity environment for long periods of
time.
Temperature 120°C 248°F or less
Time Within 2 minute
B
1.0mm .039inch
A: Surface of PC board where relay is mounted.
B: Above the PC board surface.
A
T1
T2
T3
T4
T5
t1t3t4t5t2
A: B:
t2 - t1 = 80 to 120 s
t5 - t3 = 30 to 40 s
t4 = 170 to 190 s
T1=150°C 302°F
T2=160°C 320°F
T3=183°C 361°F
T4=245°C 473°F
T5=270°C 518°F
Tape coming out direction
Relay polarity bar
44±0.3
1.732±.012
2.0±0.15
.079±.006
40.4
1.591
20.2
.795
1.75
.069 0.4
.016
4
.157
13.85
.545
20.0
.787
1.5 .059
1.7
.067
R0.75
.030
20.75
.817
10.6+0.2
−0.3
.417+.008
−.012
RE Relay
1.5+0.1
−0 dia..059+.004
−0
380±0.2
14.961±.008
21±0.8 dia.
.827±.031 dia.
13±0.2 dia.
.512±.008 dia.
2.0±0.5
.079±.020
80±0.1
3.150±.004
Max. 50.5
1.988
44.4+0.2
−0
1.748+.008
−0
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Humidity, %RH
Temperature, °C °F
Tolerance range
85
5
0
+32
70
+158
–40
–40
(Avoid freezing
when used at
temperatures lower
than 0°C 32°F
(Avoid
condensation
when used at
temperatures higher
than 0°C 32°F
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