1. General description
The 74HC154; 74HCT154 is a high-speed Si-gate CMOS device and is pin compatible
with Low-power Schottky TTL (LSTTL).
The 74HC154; 74HCT154 decoders accept four active HIGH binary address inputs and
provide 16 mutually-exclusiveactive LOW outputs. The two-input enable gate can be used
to strobe the decoder to eliminate the normal decoding ‘glitches’ on the outputs, or can be
used for the expansion of the decoder.
The enable gate has two ANDed inputs which must be LOW to enable the outputs.
The 74HC154; 74HCT154 can be used as a 1-to-16 demultiplexer by using one of the
enable inputs as the multiplexed data input.
When the other enable input is LOW, the addressed output will follow the state of the
applied data.
2. Features
n16-line demultiplexing capability
nDecodes 4 binary-coded inputs into 16 mutually-exclusive outputs
nComplies with JEDEC standard no. 7A
nSpecified from −40 °C to +85 °C and −40 °C to +125 °C
nESD protection:
uHBM EIA/JESD22-A114D exceeds 2000 V
uMM EIA/JESD22-A115-A exceeds 200 V
3. Ordering information
74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
Rev. 06 — 12 February 2007 Product data sheet
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74HC154
74HC154N −40 °C to +125 °C DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1
74HC154D −40 °C to +125 °C SO24 plastic small outline package; 24 leads; body width
7.5 mm SOT137-1
74HC154DB −40 °C to +125 °C SSOP24 plastic shrink small outline package; 24 leads; body width
5.3 mm SOT340-1
74HC154PW −40 °C to +125 °C TSSOP24 plastic thin shrink small outline package; 24 leads; body
width 4.4 mm SOT355-1
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 2 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
4. Functional diagram
74HC154BQ −40 °C to +125 °C DHVQFN24 plastic dual in-line compatible thermal enhanced very thin
quad flat package; no leads; 24 terminals; body
3.5 ×5.5 ×0.85 mm
SOT815-1
74HCT154
74HCT154N −40 °C to +125 °C DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1
74HCT154D −40 °C to +125 °C SO24 plastic small outline package; 24 leads; body width
7.5 mm SOT137-1
74HCT154DB −40 °C to +125 °C SSOP24 plastic shrink small outline package; 24 leads; body width
5.3 mm SOT340-1
74HCT154PW −40 °C to +125 °C TSSOP24 plastic thin shrink small outline package; 24 leads; body
width 4.4 mm SOT355-1
74HCT154BQ −40 °C to +125 °C DHVQFN24 plastic dual in-line compatible thermal enhanced very thin
quad flat package; no leads; 24 terminals; body
3.5 ×5.5 ×0.85 mm
SOT815-1
Table 1. Ordering information
…continued
Type number Package
Temperature range Name Description Version
Fig 1. Functional diagram
001aab071
202122
DECODER
23
7
A3A2A1A0
E0
Y6
6
Y5
5
Y4
4
Y3
3
Y2
2
Y1
1
18
19
Y0
E1
8
Y7
9
Y8
10
Y9
11
Y10
13
Y11
14
Y12
15
Y13
16
Y14
17
Y15
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 3 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
Fig 2. Logic symbol Fig 3. IEC logic symbol
001aab069
A3
Y15
20
17
Y14 16
Y1 2
Y0 1
A221
A122
A023
18
19 E0
E1
001aab070
22
21
3
0
15
DX
20
00
G
23
2
3
4
1
2
3
1
54
65
76
87
98
109
1110
1311
1412
1513
1614
1715
18 &
EN
19
22
21
8
X/Y
20
1
2
4
023
2
3
4
1
2
3
1
54
65
76
87
98
109
1110
1311
1412
1513
1614
1715
18 &
EN
19
Fig 4. Logic diagram
001aab072
Y0 Y1 Y2 Y3
A0E0 E1 A1 A2 A3
Y4 Y5 Y6 Y7 Y8 Y9 Y10 Y11 Y12 Y13 Y14 Y15
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 4 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
5. Pinning information
5.1 Pinning
5.2 Pin description
(1) The die substrate is attached to this pad using
conductive die attach material. It cannot be used as
a supply pin or input.
Fig 5. Pin configuration for SO24, DIP24, SSOP24 and
TSSOP24 Fig 6. Pin configuration for DHVQFN24
74HC154D
74HCT154D
74HC154DB
74HCT154DB
74HC154N
74HCT154N
74HC154PW
74HCT154PW
Y0 VCC
Y1 A0
Y2 A1
Y3 A2
Y4 A3
Y5 E1
Y6 E0
Y7 Y15
Y8 Y14
Y9 Y13
Y10 Y12
GND Y11
001aab067
1
2
3
4
5
6
7
8
9
10
11
12
14
13
16
15
18
17
20
19
22
21
24
23
001aab068
74HC154BQ
74HCT154BQ
Y12
Y9
Y10
Y13
Y8 Y14
Y7 Y15
Y6 E0
Y5 E1
Y4 A3
Y3 A2
Y2 A1
Y1 A0
GND
Y11
Y0
VCC
11 14
10 15
9 16
817
7 18
6
VCC(1)
19
5 20
4 21
3 22
2 23
12
13
1
24
terminal 1
index area
Transparent top view
Table 2. Pin description
Symbol Pin Description
Y0 1 data output (active LOW)
Y1 2 data output (active LOW)
Y2 3 data output (active LOW)
Y3 4 data output (active LOW)
Y4 5 data output (active LOW)
Y5 6 data output (active LOW)
Y6 7 data output (active LOW)
Y7 8 data output (active LOW)
Y8 9 data output (active LOW)
Y9 10 data output (active LOW)
Y10 11 data output (active LOW)
GND 12 ground (0 V)
Y11 13 data output (active LOW)
Y12 14 data output (active LOW)
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 5 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
6. Functional description
[1] H = HIGH voltage level
L = LOW voltage level
X = don’t care.
Y13 15 data output (active LOW)
Y14 16 data output (active LOW)
Y15 17 data output (active LOW)
E0 18 enable input (active LOW)
E1 19 enable input (active LOW)
A3 20 address input
A2 21 address input
A1 22 address input
A0 23 address input
VCC 24 supply voltage
Table 2. Pin description
…continued
Symbol Pin Description
Table 3. Function table[1]
Input Output
E0 E1 A0 A1 A2 A3 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 Y11 Y12 Y13 Y14 Y15
HHXXXXHHHHHHHHHHHHHHHH
HLXXXXHHHHHHHHHHHHHHHH
LHXXXXHHHHHHHHHHHHHHHH
LLLLLLLHHHHHHHHHHHHHHH
HLLLHLHHHHHHHHHHHHHH
LHLLHHLHHHHHHHHHHHHH
HHLLHHHLHHHHHHHHHHHH
LLHLHHHHLHHHHHHHHHHH
HLHLHHHHHL HHHHHHHHHH
LHHLHHHHHH L HHHHHHHHH
HHHLHHHHHH H L HHHHHHHH
LLLHHHHHHHHHLHHHHHHH
HLLHHHHHHHHHHLHHHHHH
LHLHHHHHHHHHHHLHHHHH
HHLHHHHHHHHHHHHLHHHH
LLHHHHHHHHHHHHHHLHHH
HLHHHHHHHHHHHHHHHLHH
LHHHHHHHHHHHHHHHHHLH
HHHHHHHHHHHHHHHHHHHL
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 6 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
7. Limiting values
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For DIP24 packages: Ptot derates linearly at 12 mW/K above 70 °C.
For SO24 packages: Ptot derates linearly at 8 mW/K above 70 °C.
For SSOP24 and TSSOP24 packages: Ptot derates linearly at 5.5 mW/K above 60 °C.
For DHVQFN24 packages: Ptot derates linearly at 4.5 mW/K above 60 °C.
8. Recommended operating conditions
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage −0.5 +7.0 V
IIK input clamping current VI<−0.5 V or VI>V
CC + 0.5 V [1] -±20 mA
IOK output clamping current VO<−0.5 V or VO>V
CC + 0.5 V [1] -±20 mA
IOoutput current −0.5 V < VO<V
CC + 0.5 V [1] -±25 mA
ICC supply current [1] -50mA
IGND ground current [1] -−50 mA
Tstg storage temperature −65 +150 °C
Ptot total power dissipation Tamb =−40 °C to +125 °C[2] - 300 mW
Table 5. Operating conditions
Symbol Parameter Conditions Min Typ Max Unit
74HC154
VCC supply voltage 2.0 5.0 6.0 V
VIinput voltage 0 - VCC V
VOoutput voltage 0 - VCC V
Tamb ambient temperature −40 +25 +125 °C
trrise time VCC = 2.0 V - - 1000 ns
VCC = 4.5 V - 6.0 500 ns
VCC = 6.0 V - - 400 ns
tffall time VCC = 2.0 V - - 1000 ns
VCC = 4.5 V - 6.0 500 ns
VCC = 6.0 V - - 400 ns
74HCT154
VCC supply voltage 4.5 5.0 5.5 V
VIinput voltage 0 - VCC V
VOoutput voltage 0 - VCC V
Tamb ambient temperature −40 +25 +125 °C
trinput rise time VCC = 4.5 V - 6.0 500 ns
tfinput fall time VCC = 4.5 V - 6.0 500 ns
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 7 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
9. Static characteristics
Table 6. Static characteristics 74HC154
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Typ Max Unit
Tamb =25°C
VIH HIGH-level input voltage VCC = 2.0 V 1.5 1.2 - V
VCC = 4.5 V 3.15 2.4 - V
VCC = 6.0 V 4.2 3.2 - V
VIL LOW-level input voltage VCC = 2.0 V - 0.8 0.5 V
VCC = 4.5 V - 2.1 1.35 V
VCC = 6.0 V - 2.8 1.8 V
VOH HIGH-level output voltage VI=V
IH or VIL
VCC = 2.0 V; IO = −20 µA 1.9 2.0 - V
VCC = 4.5 V; IO = −20 µA 4.4 4.5 - V
VCC = 6.0 V; IO = −20 µA 5.9 6.0 - V
VCC = 4.5 V; IO = −4.0 mA 3.98 4.32 - V
VCC = 6.0 V; IO = −5.2 mA 5.48 5.81 - V
VOL LOW-level output voltage VI=V
IH or VIL
VCC = 2.0 V; IO = 20 µA - 0 0.1 V
VCC = 4.5 V; IO = 20 µA - 0 0.1 V
VCC = 6.0 V; IO = 20 µA - 0 0.1 V
VCC = 4.5 V; IO = 4.0 mA - 0.15 0.26 V
VCC = 6.0 V; IO = 5.2 mA - 0.16 0.26 V
IIinput leakage current VCC = 6.0 V; VI=V
CC or GND - - ±0.1 µA
ICC supply current VCC = 6.0 V; VI=V
CC or GND; IO=0A - - 8.0 µA
CIinput capacitance - 3.5 - pF
Tamb =−40 °C to +85 °C
VIH HIGH-level input voltage VCC = 2.0 V 1.5 - - V
VCC = 4.5 V 3.15 - - V
VCC = 6.0 V 4.2 - - V
VIL LOW-level input voltage VCC = 2.0 V - - 0.5 V
VCC = 4.5 V - - 1.35 V
VCC = 6.0 V - - 1.8 V
VOH HIGH-level output voltage VI=V
IH or VIL
VCC = 2.0 V; IO = −20 µA 1.9 - - V
VCC = 4.5 V; IO = −20 µA 4.4 - - V
VCC = 6.0 V; IO = −20 µA 5.9 - - V
VCC = 4.5 V; IO = −4.0 mA 3.84 - - V
VCC = 6.0 V; IO = −5.2 mA 5.34 - - V
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 8 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
VOL LOW-level output voltage VI=V
IH or VIL
VCC = 2.0 V; IO = 20 µA - - 0.1 V
VCC = 4.5 V; IO = 20 µA - - 0.1 V
VCC = 6.0 V; IO = 20 µA - - 0.1 V
VCC = 4.5 V; IO = 4.0 mA - - 0.33 V
VCC = 6.0 V; IO = 5.2 mA - - 0.33 V
IIinput leakage current VCC = 6.0 V; VI=V
CC or GND - - ±1.0 µA
ICC supply current VCC = 6.0 V; VI=V
CC or GND; IO=0A - - 80 µA
Tamb =−40 °C to +125 °C
VIH HIGH-level input voltage VCC = 2.0 V 1.5 - - V
VCC = 4.5 V 3.15 - - V
VCC = 6.0 V 4.2 - - V
VIL LOW-level input voltage VCC = 2.0 V - - 0.5 V
VCC = 4.5 V - - 1.35 V
VCC = 6.0 V - - 1.8 V
VOH HIGH-level output voltage VI=V
IH or VIL
VCC = 2.0 V; IO = −20 µA 1.9 - - V
VCC = 4.5 V; IO = −20 µA 4.4 - - V
VCC = 6.0 V; IO = −20 µA 5.9 - - V
VCC = 4.5 V; IO = −4.0 mA 3.7 - - V
VCC = 6.0 V; IO = −5.2 mA 5.2 - - V
VOL LOW-level output voltage VI=V
IH or VIL
VCC = 2.0 V; IO = 20 µA - - 0.1 V
VCC = 4.5 V; IO = 20 µA - - 0.1 V
VCC = 6.0 V; IO = 20 µA - - 0.1 V
VCC = 4.5 V; IO = 4.0 mA - - 0.4 V
VCC = 6.0 V; IO = 5.2 mA - - 0.4 V
IIinput leakage current VCC = 6.0 V; VI=V
CC or GND - - ±0.1 µA
ICC supply current VCC = 6.0 V; VI=V
CC or GND; IO=0A - - 160 µA
Table 6. Static characteristics 74HC154
…continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Typ Max Unit
Table 7. Static characteristics 74HCT154
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Typ Max Unit
Tamb =25°C
VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - V
VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 V
VOH HIGH-level output voltage VI=V
IH or VIL
VCC = 4.5 V; IO = −20 µA 4.4 4.5 - V
VCC = 4.5 V; IO = −4 mA 3.98 4.32 - V
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 9 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
VOL LOW-level output voltage VI=V
IH or VIL
VCC = 4.5 V; IO = 20 µA - 0 0.1 V
VCC = 4.5 V; IO = 4 mA - 0.15 0.25 V
IIinput leakage current VCC = 5.5 V; VI=V
CC or GND - - ±0.1 µA
ICC supply current VCC = 5.5 V; VI=V
CC or GND; IO=0A - - 8.0 µA
∆ICC additional supply current per input pin; VCC = 4.5 V to 5.5 V;
VI=V
CC −2.1 V; IO=0A - - 360 µA
CIinput capacitance - 3.5 - pF
Tamb =−40 °C to +85 °C
VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - V
VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 V
VOH HIGH-level output voltage VI=V
IH or VIL
VCC = 4.5 V; IO = −20 µA 4.4 - - V
VCC = 4.5 V; IO = −4 mA 3.84 - - V
VOL LOW-level output voltage VI=V
IH or VIL
VCC = 4.5 V; IO = 20 µA - - 0.1 V
VCC = 4.5 V; IO = 4 mA - - 0.33 V
IIinput leakage current VCC = 5.5 V; VI=V
CC or GND - - ±1.0 µA
ICC supply current VCC = 5.5 V; VI=V
CC or GND; IO=0A - - 80 µA
∆ICC additional supply current per input pin; VCC = 4.5 V to 5.5 V;
VI=V
CC −2.1 V; IO=0A - - 450 µA
Tamb =−40 °C to +125 °C
VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - V
VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 V
VOH HIGH-level output voltage VI=V
IH or VIL
VCC = 4.5 V; IO = −20 µA 4.4 - - V
VCC = 4.5 V; IO = −4 mA 3.7 - - V
VOL LOW-level output voltage VI=V
IH or VIL
VCC = 4.5 V; IO = 20 µA - - 0.1 V
VCC = 4.5 V; IO = 4 mA - - 0.4 V
IIinput leakage current VCC = 5.5 V; VI=V
CC or GND - - ±1.0 µA
ICC supply current VCC = 5.5 V; VI=V
CC or GND; IO=0A - - 160 µA
∆ICC additional supply current per input pin; VCC = 4.5 V to 5.5 V;
VI=V
CC −2.1 V; IO=0A - - 490 µA
Table 7. Static characteristics 74HCT154
…continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Typ Max Unit
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 10 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
10. Dynamic characteristics
[1] tpd is the same as tPLH and tPHL
[2] tt is the same as tTLH and tTHL
[3] CPD is used to determine the dynamic power dissipation (PD in µW).
PD=C
PD ×VCC2×fi×N+Σ(CL×VCC2×fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in V;
N = number of load switching outputs;
Σ(CL×VCC2×fo) = sum of the outputs.
Table 8. Dynamic characteristics
GND (ground = 0 V); C
L
= 50 pF unless otherwise specified; for test circuit, see Figure 9.
Symbol Parameter Conditions 25 °C−40 °C to +125 °C Unit
Min Typ Max Min Max
(85 °C) Max
(125 °C)
74HC154
tpd propagation delay An to Yn; see Figure 7 [1]
VCC = 2.0 V - 36 150 - 190 225 ns
VCC = 4.5 V - 13 30 - 38 45 ns
VCC = 5 V; CL = 15 pF - 11 - - - - ns
VCC = 6.0 V - 10 26 - 33 38 ns
En to Yn; see Figure 8
VCC = 2.0 V - 39 150 - 190 225 ns
VCC = 4.5 V - 14 30 - 38 45 ns
VCC = 5 V; CL = 15 pF - 11 - - - - ns
VCC = 6.0 V - 11 26 - 33 38 ns
tttransition time see Figure 7 and 8[2]
VCC = 2.0 V - 19 75 - 95 110 ns
VCC = 4.5 V - 7 15 - 19 22 ns
VCC = 6.0 V - 6 13 - 16 19 ns
CPD power dissipation
capacitance per gate; VI = GND to
VCC
[3] -60----pF
74HCT154
tpd propagation delay An to Yn; see Figure 7 [1]
VCC = 4.5 V - 16 35 - 44 53 ns
VCC = 5 V; CL = 15 pF - 13 - - - - ns
En to Yn; see Figure 8
VCC = 4.5 V - 15 32 - 40 48 ns
VCC = 5 V; CL = 15 pF - 13 - - - - ns
tttransition time see Figure 7 and 8[2]
VCC = 4.5 V - 7 15 - 19 22 ns
CPD power dissipation
capacitance per gate; VI = GND to
(VCC − 1.5 V) [3] -60----pF
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 11 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
11. Waveforms
Measurement points are given in Table 9. Measurement points are given in Table 9.
Fig 7. Propagation delay address input (An) to output
(Yn) and transition time output (Yn) Fig 8. Propagation delay enable input (En) to output
(Yn) and transition time output (Yn)
001aab073
tPLH
tPHL
tTLH
90 %
10 %
VM
tTHL
90 %
10 %
VM
VMVM
An input
Yn output
GND
VI
VOH
VOL
001aab074
tTHL
90 %
10 %
En input
Yn output
GND
VI
VOH
VOL
tPHL tPLH
VM
tTLH
90 %
10 %
VM
VMVM
Table 9. Measurement points
Type Input Output
VMVM
74HC154 0.5VCC 0.5VCC
74HCT154 1.3 V 1.3 V
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 12 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
Test data is given in Table 10.
Definitions for test circuit:
RT= Termination resistance; should be equal to output impedance Zo of the pulse generator.
CL= Load capacitance including jig and probe capacitance.
RL = Load resistor.
S1 = Test selection switch.
Fig 9. Load circuitry for measuring switching times
VMVM
tW
tW
10 %
90 %
0 V
VI
VI
negative
pulse
positive
pulse
0 V
VMVM
90 %
10 %
tf
tr
tr
tf
001aad983
DUT
VCC VCC
VIVO
RT
RLS1
CL
open
PULSE
GENERATOR
Table 10. Test data
Type Input Load S1 position
VItr, tfCLRLtPHL, tPLH
74HC154 VCC 6 ns 15 pF, 50 pF 1 kΩopen
74HCT154 3 V 6 ns 15 pF, 50 pF 1 kΩopen
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 13 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
12. Application information
Fig 10. 1-of-16 decoder; LOW level output selected Fig 11. 1-of-16 demultiplexer; logic level on selected
outputs follow the logic level on the data input
001aab075
Y15
A3
Y14
Y1
Y0
A2
A1
A0
strobe E0
E1
001aab076
Y15
A3
Y14
Y1
Y0
A2
A1
A0
data
input E0
E1
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 14 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
13. Package outline
Fig 12. Package outline SOT101-1 (DIP24)
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT101-1 99-12-27
03-02-13
A
min. A
max. bw
ME
e1
1.7
1.3 0.53
0.38 0.32
0.23 32.0
31.4 14.1
13.7 3.9
3.4 0.252.54 15.24 15.80
15.24 17.15
15.90 2.25.1 0.51 4
0.066
0.051 0.021
0.015 0.013
0.009 1.26
1.24 0.56
0.54 0.15
0.13 0.010.1 0.6 0.62
0.60 0.68
0.63 0.0870.2 0.02 0.16
051G02 MO-015 SC-509-24
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
24
1
13
12
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Z
max.
(1)
(1)(1)
DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 15 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
Fig 13. Package outline SOT137-1 (SO24)
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65 0.3
0.1 2.45
2.25 0.49
0.36 0.32
0.23 15.6
15.2 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT137-1
X
12
24
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
c
L
vMA
13
(A )
3
A
y
0.25
075E05 MS-013
pin 1 index
0.1 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.61
0.60 0.30
0.29 0.05
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
e
1
0 5 10 mm
scale
SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
99-12-27
03-02-19
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 16 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
Fig 14. Package outline SOT340-1 (SSOP24)
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 8.4
8.0 5.4
5.2 0.65 1.25
7.9
7.6 0.9
0.7 0.8
0.4 8
0
o
o
0.13 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT340-1 MO-150 99-12-27
03-02-19
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
112
24 13
0.25
y
pin 1 index
0 2.5 5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1
A
max.
2
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 17 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
Fig 15. Package outline SOT355-1 (TSSOP24)
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 7.9
7.7 4.5
4.3 0.65 6.6
6.2 0.4
0.3 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT355-1 MO-153 99-12-27
03-02-19
0.25 0.5
0.2
wM
bp
Z
e
112
24 13
pin 1 index
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
D
y
0 2.5 5 mm
scale
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1
A
max.
1.1
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 18 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
Fig 16. Package outline SOT815-1 (DHVQFN24)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
SOT815-1 - - - - - - - - - 03-04-29
SOT815-1
0 2.5 5 mm
scale
by
y1C
C
AC
CB
vM
wM
e1
e2
terminal 1
index area
terminal 1
index area
X
UNIT A(1)
max. A1bc eEhLe1ywv
mm 10.05
0.00 0.30
0.18 0.5 4.5
e2
1.50.2 2.25
1.95
Dh
4.25
3.95 0.05 0.05
y1
0.10.1
DIMENSIONS (mm are the original dimensions)
0.5
0.3
D(1)
5.6
5.4
E(1)
3.6
3.4
D
E
BA
e
DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm
AA1c
detail X
Eh
L
Dh
2
23
11
14
13
12
1
24
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 19 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
14. Abbreviations
15. Revision history
Table 11. Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
LSTTL Low-power Schottky Transistor-Transistor Logic
MM Machine Model
Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74HC_HCT154_6 20070212 Product data sheet - 74HC_HCT154_5
Modifications: •The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
•Table 3 on page 5: Corrected errors in output information.
74HC_HCT154_5 20041012 Product specification - 74HC_HCT154_4
74HC_HCT154_4 20041005 Product specification - 74HC_HCT154_3
74HC_HCT154_3 20040601 Product specification - 74HC_HCT154_CNV_2
74HC_HCT154_6 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 06 — 12 February 2007 20 of 21
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors 74HC154; 74HCT154
4-to-16 line decoder/demultiplexer
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 February 2007
Document identifier: 74HC_HCT154_6
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Functional description . . . . . . . . . . . . . . . . . . . 5
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Recommended operating conditions. . . . . . . . 6
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
10 Dynamic characteristics . . . . . . . . . . . . . . . . . 10
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
12 Application information. . . . . . . . . . . . . . . . . . 13
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 19
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
17 Contact information. . . . . . . . . . . . . . . . . . . . . 20
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
