October 2005 / B
Page 1
SEMICONDUCTOR
TAK CHEONG
®
500 mW DO-35 Hermetically
Sealed Glass Fast Switching
Diodes
Absolute Ma ximum Ra ti ng s TA = 25°C unless otherwise noted
Symbol Parameter Value Units
PD Power Dissipation 500 mW
TSTG Storage Temperature Range -65 to +200 °C
TJ Operating Junction Temperature +175 °C
WIV Working Inverse Voltage 75 V
IO Average Rectified Current 150 mA
IFM Non-repetitive Peak Forward Current 450 mA
IFSURGE Peak Forward Surge Current 2 A
These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
Fast Switching Device (TRR <4.0 nS)
DO-35 Package (JEDEC)
Through-Hole Device Type Mounting
Hermetically Sealed Glass
Compression Bonded Construction
All external surfaces are corrosion resistant and leads are readily solderable
Cathode indicated by polarity band
Electrical Characteristics TA = 25°C unless otherwise noted Limits
Symbol Parameter Test Condition
Min Max Unit
BV Breakdown Voltage IR=100µA
IR=5µA
100
75
Volts
IR Reverse Leakage Current VR=20V
VR=75V
25
5
nA
µA
VF Forward Voltage TC1N4448, TC1N914B
TC1N4148
TC1N4448, TC1N914B
IF=5mA
IF=10mA
IF=100mA
0.62 0.72
1.0
1.0
Volts
TRR Reverse Recovery Time IF=10mA, VR=6V
RL=100Ω
IRR=1mA
4 nS
C Capacitance VR=0V, f=1MHZ 4 pF
Cathode Anode
ELECTRICAL SYMBOL
TC1N4148/TC1N4448/TC1N914B
L
xx
xx
DEVICE MARKING DIAGRAM
L : Logo
TC1Nxxxx : Device Code
AXIAL LEAD
DO35
October 2005 / B
Page 2
SEMICONDUCTOR
TAK CHEONG
®
Electrical Symbol Definition Typical Characteristics
Symbol Parameter
BV Breakdown Voltage @ IR
IR Reverse Leakage Current @ VR
VR Reverse Voltage
IF Forward Current
VF Forward Voltage @ IF
Ordering Information
Device Package Quantity
TC1Nxxxx Bulk 10,000
TC1Nxxxx.TB Tape and Ammo 5,000
TC1Nxxxx.TR Tape and Reel 10,000
TC1Nxxxx Others (…contact Tak Cheong sales representatives)
Axial-Lead Tape Packaging Standards
This axial-lead component’s packaging requirements use in automatic testing and assembly equipment. And this standard practices for
lead-tape packaging of axial-lead components meets the require ments of EIA Stan dard RS-296-D “Lead-taping of C omponents on A xial
Lead Configuration for Automatic Insertion”.
V
I
(mV)
(V)
(mA)
(µA)
VF
IF
BV
IR
IR
VR
(nA)
October 2005 / B
Page 3
SEMICONDUCTOR
TAK CHEONG
®
Tape & Reel Packaging Information
Tape & Reel Outline
Reel Dimensions
DIM Millimeters
D1 356
D2 30
D3 84
W1 77.5
Quantity Per Reel
PKG Type Quantity Per Reel
DO-35 10,000
October 2005 / B
Page 4
SEMICONDUCTOR
TAK CHEONG
®
Tape & Ammo Packaging Information
Tape & Ammo
Outline
Quantity Per Ammo
Box
PKG Type Quantity Per Box
DO-35 5,000
Taping Dimensions
Description Millimeters
Standard Width 52 26
Tape Spacing (B) 52 ± 0.69 26 +0.5 / -0
Component Pitch (C) 5.08 ± 0.4 5.08 ± 0.4
Untaped Lead (L1 – L2) ± 0.69 ± 0.69
Glass Offset (F ) ± 0.69 ± 0. 69
Bent (D) 1.2 Max 1.2 Max
Tape Width (G) 6.138 ± 0.576 6.138 ± 0.576
Tape Mismatch (E) 0.55 Max 0.55 Max
Taped Lead (G) 3.2 Min 3.2 Min
Lead Beyond Tape (H) 0 0
250mm x 80mm x 80mm
October 2005 / B
Page 5
SEMICONDUCTOR
TAK CHEONG
®
Bulk Packaging Information
Bulk Outline
Quantity Per Box
PKG Type Quantity Per Box
DO-35 10,000
Plastic Bag
250mm x 80mm x 80mm
DO-35 1000 x 10 Plastic Bag
Quantity Per Plastic Bag
October 2005 / B
Page 6
SEMICONDUCTOR
TAK CHEONG
®
Package Outline
Package Case Outline
DO-35 DO-35
Millimeters Inches
DIM
Min Max Min Max
A 0.46 0.55 0.018 0.022
B 3.05 5.08 0.120 0.200
C 25.40 38.10 1.000 1.500
D 1.53 2.28 0.060 0.090
Notes: 1. All dimensions are within JEDEC standard.
2. DO35 polarity denoted by cathode band.
