HD74HC75FP-EL - Renesas Electronics

HD74HC75

Quad. Bistable Latches

Description

This latch is ideally suited for use as temporary storage for binary information processing, input/output, and

indicator units. Information present at the data (D) input is transferred to the Q output when the latch

enable (LE) is high. The Q output will follow the data input as long as the enable remains high. when the

enable goes low, the information that was present at the data input at the time the transition occurred is

retained at thte Q output unit the enable is permitted to go high again.

Features

• High Speed Operation: tpd (D to Q) = 12.5 ns typ (CL = 50 pF)

• High Output Current: Fanout of 10 LSTTL Loads

• Wide Operating Voltage: VCC = 2 to 6 V

• Low Input Current: 1 µA max

• Low Quiescent Supply Current: ICC (static) = 2 µA max (Ta = 25°C)

Function Table

Inputs Outputs

D Latch Enable Q Q

LH L H

HH H L

XL Q

HD74HC75

Pin Arrangement

Q0a

D0a

D1a

LEb

VCC

D0b

D1b

Q1b

Q0a

Q1a

Q1a

LEa

GND

Q0b

Q1b

(Top view)

Block Diagram

Data Q

Latch

Enable

HD74HC75

DC Characteristics

Ta = 25°CTa = –40 to

+85°C

Item Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions

Input voltage VIH 2.0 1.5 — — 1.5 — V

4.5 3.15 — — 3.15 —

6.0 4.2 — — 4.2 —

VIL 2.0 — — 0.5 — 0.5 V

4.5 — — 1.35 — 1.35

6.0 — — 1.8 — 1.8

Output voltage VOH 2.0 1.9 2.0 — 1.9 — V Vin = VIH or VIL IOH = –20 µA

4.5 4.4 4.5 — 4.4 —

6.0 5.9 6.0 — 5.9 —

4.5 4.18 — — 4.13 — IOH = –4 mA

6.0 5.68 — — 5.63 — IOH = –5.2 mA

VOL 2.0 — 0.0 0.1 — 0.1 V Vin = VIH or VIL IOL = 20 µA

4.5 — 0.0 0.1 — 0.1

6.0 — 0.0 0.1 — 0.1

4.5 — — 0.26 — 0.33 IOL = 4 mA

6.0 — — 0.26 — 0.33 IOL = 5.2 mA

Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND

Quiescent supply

current ICC 6.0 — — 2.0 — 20 µA Vin = VCC or GND, Iout = 0 µA

HD74HC75

AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)

Ta = 25°CTa = –40 to

+85°C

Item Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions

Propagation delay tPLH 2.0 — — 125 — 155 ns D to Q

time tPHL 4.5 — 12 25 — 31

6.0 — — 21 — 26

2.0 — — 110 — 140 D to Q

4.5 — 13 22 — 28

6.0 — — 19 — 24

2.0 — — 145 — 180 Latch Enable to Q

4.5 — 12 29 — 36

6.0 — — 25 — 31

2.0 — — 125 — 155 Latch Enable to Q

4.5 — 13 25 — 31

6.0 — — 21 — 26

Output rise/fall tTLH 2.0 — — 75 — 95 ns

time tTHL 4.5 — 5 15 — 19

6.0 — — 13 — 16

Setup time tsu 2.0 100 — — 125 — ns Data to Latch Enable

4.5 20 4 — 25 —

6.0 17 — — 21 —

Hold time th2.0 5 — — 5 — ns Latch Enable to Data

4.5 5 0 — 5 —

6.0 5 — — 5 —

Pulse width tw2.0 80 — — 100 — ns Latch Enable

4.5 16 5 — 20 —

6.0 14 — — 17 —

Input capacitance Cin — — 5 10 — 10 pF

Hitachi Code

JEDEC

EIAJ

Weight

(reference value)

DP-16

Conforms

1.07 g

Unit: mm

6.30

19.20

16 9

81 1.3

20.00 Max

7.40 Max

7.62

0.25+ 0.13

– 0.05

2.54 ± 0.25 0.48 ± 0.10

0.51 Min

2.54 Min 5.06 Max

0° – 15°

1.11 Max

Hitachi Code

JEDEC

EIAJ

Weight

(reference value)

FP-16DA

—

Conforms

0.24 g

Unit: mm

*Dimension including the plating thickness

Base material dimension

*0.22 ± 0.05

*0.42 ± 0.08

0.12

0.15

2.20 Max 5.5

10.06

0.80 Max

16 9

10.5 Max

+ 0.20

– 0.30

7.80

0.70 ± 0.20

0° – 8°

0.10 ± 0.10

1.15

1.27

0.40 ± 0.06

0.20 ± 0.04

Hitachi Code

JEDEC

EIAJ

Weight

(reference value)

FP-16DN

Conforms

0.15 g

Unit: mm

*Dimension including the plating thickness

Base material dimension

1.27

16 9

0.15

0.25 M

1.75 Max 3.95

*0.22 ± 0.03

9.9

0° – 8°

10.3 Max

+ 0.10

– 0.30

6.10

+ 0.67

– 0.20

0.60

+ 0.11

– 0.04

0.14

*0.42 ± 0.08

0.635 Max

0.40 ± 0.06

0.20 ± 0.03

1.08

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,

Hitachi bears no responsibility for problems that may arise with third party’s rights, including

intellectual property rights, in connection with use of the information contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you have

received the latest product standards or specifications before final design, purchase or use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,

contact Hitachi’s sales office before using the product in an application that demands especially high

quality and reliability or where its failure or malfunction may directly threaten human life or cause risk

of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,

traffic, safety equipment or medical equipment for life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly

for maximum rating, operating supply voltage range, heat radiation characteristics, installation

conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used

beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable

failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-

safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other

consequential damage due to operation of the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without

written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor

products.

Hitachi, Ltd.

Semiconductor & Integrated Circuits.

Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109

Hitachi Asia Pte. Ltd.

16 Collyer Quay #20-00

Hitachi Tower

Singapore 049318

Tel: 535-2100

Fax: 535-1533

URL NorthAmerica : http:semiconductor.hitachi.com/

Europe : http://www.hitachi-eu.com/hel/ecg

Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm

Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm

Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm

Japan : http://www.hitachi.co.jp/Sicd/indx.htm

Hitachi Asia Ltd.

Taipei Branch Office

3F, Hung Kuo Building. No.167,

Tun-Hwa North Road, Taipei (105)

Tel: <886> (2) 2718-3666

Fax: <886> (2) 2718-8180

Hitachi Asia (Hong Kong) Ltd.

Group III (Electronic Components)

7/F., North Tower, World Finance Centre,

Harbour City, Canton Road, Tsim Sha Tsui,

Kowloon, Hong Kong

Tel: <852> (2) 735 9218

Fax: <852> (2) 730 0281

Telex: 40815 HITEC HX

Hitachi Europe Ltd.

Electronic Components Group.

Whitebrook Park

Lower Cookham Road

Maidenhead

Berkshire SL6 8YA, United Kingdom

Tel: <44> (1628) 585000

Fax: <44> (1628) 778322

Hitachi Europe GmbH

Electronic components Group

Dornacher Stra§e 3

D-85622 Feldkirchen, Munich

Germany

Tel: <49> (89) 9 9180-0

Fax: <49> (89) 9 29 30 00

Hitachi Semiconductor

(America) Inc.

179 East Tasman Drive,

San Jose,CA 95134

Tel: <1> (408) 433-1990

Fax: <1>(408) 433-0223

For further information write to: