© Semiconductor Components Industries, LLC, 2007
March, 2007 − Rev. 3 1Publication Order Number:
MBD101/D
MBD101, MMBD101LT1
Preferred Device
Schottky Barrier Diodes
Designed primarily for UHF mixer applications but suitable also for
use in detector and ultra−fast switching circuits. Supplied in an
inexpensive plastic package for low−cost, high−volume consumer
requirements. Also available in Surface Mount package.
Features
•Low Noise Figure − 6.0 dB Typ @ 1.0 GHz
•Very Low Capacitance − Less Than 1.0 pF
•High Forward Conductance − 0.5 V (Typ) @ IF = 10 mA
•Pb−Free Packages are Available
MAXIMUM RATINGS
Rating Symbol Value Unit
Reverse Voltage VR7.0 V
Forward Power Dissipation
TA = 25°C MBD101
MMBD101LT1
Derate above 25°C MBD101
MMBD101LT1
PF280
225
2.2
1.8
mW
mW/°C
Junction Temperature TJ+150 °C
Storage Temperature Range Tstg −55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless ot herwise noted)
Characteristic Symbol Min Typ Max Unit
Reverse Breakdown Voltage
(IR = 10 mA) V(BR)R 7.0 10 − V
Diode Capacitance
(VR = 0, f = 1.0 MHz,
Note 1, page 2)
CD− 0.88 1.0 pF
Forward Voltage
(IF = 10 mA) VF− 0.5 0.6 V
Reverse Leakage
(VR = 3.0 V) IR− 0.02 0.25 mA
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SOT−23 (TO−236)
CASE 318
STYLE 8
Preferred devices are recommended choices for future use
and best overall value.
1
2
3
Device Package Shipping†
ORDERING INFORMATION
MBD101 TO−92 5000 Units / Box
† For information on tape and reel specifications,
including part orientation and tape sizes, please
refer t o our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
MBD101G TO−92
(Pb−Free) 5000 Units / Box
MMBD101LT1 SOT−23 3000 / Tape & Ree
l
MMBD101LT1G SOT−23
(Pb−Free) 3000 / Tape & Ree
l
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
1
4M M G
G
A = Assembly Location
Y = Year
WW = Work Week
4M = Device Code (SOT−23)
M = Date Code*
G= Pb−Free Package
(Note: Microdot may be in either location)
MARKING
DIAGRAMS
3
CATHODE
1
ANODE
2
CATHODE
1
ANODE
(Pin 2 Not Connected)
TO−92 2−Lead
CASE 182
STYLE 1
12
SILICON SCHOTTKY
BARRIER DIODES
MBD
101
AYWW G
G
MBD101, MMBD101LT1
http://onsemi.com
2
TYPICAL CHARACTERISTICS
(TA = 25°C unless noted)
Figure 1. Reverse Leakage
TA, AMBIENT TEMPERATURE (°C)
Figure 2. Forward Voltage
VF, FORWARD VOLTAGE (VOLTS)
Figure 3. Capacitance
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Noise Figure
PLO, LOCAL OSCILLATOR POWER (mW)
, FORWARD CURRENT (mA)IF
, REVERSE LEAKAGE ( A)IRm
0.1 0.2 0.5 2.01.0 10
11
3.0
0 1.0 2.0 3.0 4.0
1.0
0.9
0.8
0.7
0.6
0.3 0.4
100
0.1
30 40 50 60 70 80 100
0.1
130110 12090
0.07
0.05
0.02
1.0
2.0
0.5 0.6 0.7
0.01
1.0
0.7
0.5
10
1.0
Figure 5. Noise Figure Test Circuit
UHF
NOISE SOURCE
H.P. 349A
DIODE IN
TUNED
MOUNT
LOCAL
OSCILLATOR
IF AMPLIFIER
NF = 1.5 dB
f = 30 MHz
NOISE
FIGURE METER
H.P. 342A
NOTES ON TESTING AND SPECIFICATIONS
Note 1 — CD is measured using a capacitance bridge (Boonton
Electronics Model 75A or equivalent).
Note 2 — Noise figure measured with diode under test in tuned
diode mount using UHF noise source and local oscillator
(LO) frequency of 1.0 GHz. The LO power is adjusted
for 1.0 mW. IF amplifier NF = 1.5 dB, f = 30 MHz, see
Figure 5.
Note 3 — LS is measured on a package having a short instead of a
die, using an impedance bridge (Boonton Radio Model
250A RX Meter).
0.2
VR = 3.0 V
5.0
4.0
7.0
6.0
9.0
8.0
10 LOCAL OSCILLATOR FREQUENCY = 1.0 GHz
(TEST CIRCUIT IN FIGURE 5)
5.0
TA = 25°C
TA = −40°C
TA = 85°C
NF, NOISE FIGURE (dB)
CD,CAPACITANCE (pF)
MBD101, MMBD101LT1
http://onsemi.com
3
PACKAGE DIMENSIONS
ÉÉ
ÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND ZONE R IS
UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
A
L
K
B
R
P
D
HG
XX
SEATING
PLANE
12
V
N
C
N
SECTION X−X
D
J
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.175 0.205 4.45 5.21
B0.170 0.210 4.32 5.33
C0.125 0.165 3.18 4.19
D0.016 0.021 0.407 0.533
G0.050 BSC 1.27 BSC
H0.100 BSC 2.54 BSC
J0.014 0.016 0.36 0.41
K0.500 −−− 12.70 −−−
L0.250 −−− 6.35 −−−
N0.080 0.105 2.03 2.66
P−−− 0.050 −−− 1.27
R0.115 −−− 2.93 −−−
V0.135 −−− 3.43 −−−
STYLE 1:
PIN 1. ANODE
2. CATHODE
TO−92 TWO LEAD
TO−226AC
CASE 182−06
ISSUE L
MBD101, MMBD101LT1
http://onsemi.com
4
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
D
A1
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
ǒmm
inchesǓ
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
VIEW C
L
0.25
L1
q
e
EE
b
A
SEE VIEW C
DIM
AMIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b0.37 0.44 0.50 0.015
c0.09 0.13 0.18 0.003
D2.80 2.90 3.04 0.110
E1.20 1.30 1.40 0.047
e1.78 1.90 2.04 0.070
L0.10 0.20 0.30 0.004
0.040 0.044
0.002 0.004
0.018 0.020
0.005 0.007
0.114 0.120
0.051 0.055
0.075 0.081
0.008 0.012
NOM MAX
L1
H
2.10 2.40 2.64 0.083 0.094 0.104
HE0.35 0.54 0.69 0.014 0.021 0.029
c
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its of ficers, employees, subsidiaries, affiliates,
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MBD101/D
PUBLICATION ORDERING INFORMATION
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Phone: 81−3−5773−3850
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