SAG00003CEM 1
Microcomputer Peripheral LSIs
MN1380 Series
CMOS LSIs for Voltage Detection
Overview
The MN1380 series are elements that monitor the power
supply voltage supplied to microcomputers and other LSI
systems and issue reset signals for initializing the system
after the power is first applied or for preventing runaway
operation when the supply voltage fluctuates.
There is a choice of three output types: CMOS output,
N-channel open drain output, and inverted CMOS out-
put. There are also three package types: M, TO-92, and a
mini type for surface mounting.
Choose the ideal element for your application from the
series' wide selection of detection ranks (17 ranks between
2.0 and 4.9 volts), output types, and package types.
Features
Three-pin element requiring no adjustment
Wide selection of detection ranks (17 ranks between
2.0 and 4.9 volts)
Highly precise detection voltage
Detection voltage with hysteresis characteristic
∆VD = 50 mV for ranks C to K
∆VD = 100 mV for ranks L to U
Low current consumption: IDD = 1µA (typ.) for VDD
= 5 V
Low fluctuation in detection voltage with tempera-
ture (typ. 1 mV/˚C)
Wide selection of output types: CMOS output, N-
channel open drain output, and inverted CMOS
output
Wide selection of package types: M, TO-92, and a
mini type for surface mounting.
Applications
Battery checkers
Power outage detectors
Level discriminators
Memory backup systems
Microcomputer reset circuits
Reset circuits for other electronic circuits
Pin Assignment
M type package
321
23
MN1380 - R
1381
23R
123
1
2
3
LCR
TO-92 type package
Mini type package
1=OUT
2=VDD
3=VSS
Maintenance/
Discontinued
Maintenance/Discontinued includes following four Product lifecycle stage.
planed maintenance type
maintenance type
planed discontinued typed
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2
MN1380 Series Microcomputer Peripheral LSIs
MN1380 Series Naming Conventions
The MN1380 series offers a wide selection of detection ranks, output types, package types, and packaging. All
combinations use the following naming conventions. When ordering, be sure to give the correct part number using
these naming conventions.
Winding direction for tape packaging
(TA) ...... Tape packaging for TO-92 type package
(TX)...... Embossed tape packing for mini type package
(TW)..... Embossed tape packing for mini type package
For further details, see the package specifications.
Detection voltage rank (C to U)
Output type:
Blank ········ CMOS output
1 ················ N-channel open drain output
2 ················ inverted CMOS output
Package:
0 ················ M type package
1 ················ TO-92 type package
2 ················ Mini type package
Matsushita Electronics Corporation MN1380 series of voltage detection CMOS
LSIs with low current consumptions
MN13821–R (TW)
(Example)
Embossed tape packaging
R rank (detection voltage of 4.0 to 4.3 V)
N-channel open drain output
Mini type package
MN1380 series of voltage detection CMOS LSIs with low current consumption
MN13801–R (TA)
Minimum Packaging Unit
Bulk (M and TO-92 types) ·············· 1,000
Magazine (Mini type) ······················ 50
Taping (Mini and TO-92 types)······· 3,000
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3
Microcomputer Peripheral LSIs MN1380 Series
Series Lineup
Output Package M type Package TO-92 type Package Mini type Package
CMOS output MN1380 MN1381 MN1382
N-channel open drain output MN13801 MN13811 MN13821
Inverted CMOS output MN13802 MN13812 MN13822
Detection Ranks (on Voltage)
Rank Detection V oltage for Drop in Power Supply Voltage (VDL)Unit Detection Voltage Hysteresis Width (∆VD) Unit
min max min max
C 2.0 2.2
D 2.1 2.3
E 2.2 2.4 V 50 300 mV
F 2.3 2.5
G 2.4 2.6
H 2.5 2.7
J 2.6 2.9 V 50 300 mV
K 2.8 3.1
L 3.0 3.3
M 3.2 3.5
N 3.4 3.7
P 3.6 3.9
Q 3.8 4.1 V 100 300 mV
R 4.0 4.3
S 4.2 4.5
T 4.4 4.7
U 4.6 4.9
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4
MN1380 Series Microcomputer Peripheral LSIs
Block Diagram
Pin Descriptions
Pin No. Symbol Function Description
1 OUT Reset signal output pin
2V
DD Power supply pin
3V
SS Ground pin
Note *1: Circuits vary slightly depending on the output type (CMOS output, N-channel open drain output, or inverted CMOS
output)
Voltage
Reference 1
Voltage
Reference 2
Level Converter
Comparator
Comparator
Output Circuit
*1
V
DD
OUT
V
SS
2
1
3
+
–
+
–
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5
Microcomputer Peripheral LSIs MN1380 Series
Electrical Characteristics
1) DC Characteristics VSS=0V, Ta=–20˚C to +70˚C
Parameter Symbol Conditions min typ max Unit
Power supply current IDD VDD = 5 V *1 15µA
Load resistance = 10 kW
Detection voltage for drop VDL Ta=25˚C*2*2V
in power supply voltage *2
See Figures 1 and 4.
Detection voltage hysteresis ∆VD *2*2mV
width *2
"H" level output voltage VOH CMOS output IOH=– 40µA 0.8VDD VDD
Inverted VDD=1.8V 0.8 VDD V
CMOS output IOH=– 0.5mA –1.5
"L" level output voltage VOL N-channel open VDD=1.8V VSS 0.4
drain output IOL=0.7mA V
Inverted VDD=6.0V VSS 0.6
CMOS output IOH=0.3mA
Absolute Maximum Ratings VSS=0V, Ta=25˚C
Parameter Symbol Rating Unit
Power supply voltage VDD 7.0 V
Output voltage VO– 0.3 to VDD +0.3 V
Operating ambient temperature Ta –20 to +70 ˚C
Storage temperature Tstg –55 to +125 ˚C
Recommended Operating Conditions
VSS=0V, Ta=25˚C
Parameter Symbol Conditions min typ max Unit
Power supply VDD See Figures 1 and 4. 1.5 6.0 V
voltage
Notes
*1: This includes the output pin's leakage current.
*2: For particulars, see the detection voltage rank table.
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6
MN1380 Series Microcomputer Peripheral LSIs
2) AC Characteristics VSS=0V, Ta=25˚C
Parameter Symbol Conditions Allowable Value (typ) Unit
MN1380 MN13801 MN13802
MN1381 MN13811 MN13812
Rank MN1382 MN13821 MN13822
C
D
E 3.0 2.5 230.0
F
G
See H
Reset release time tOH Figures J 3.0 3.0 100.0 µs
2 and 3. K
L
M
N
P
Q 2.0 4.0 30.0
R
S
T
C
D
E 250.0 160.0 3.0
F
G
See H
Reset time tOL Figures J 115.0 100.0 3.0 µs
2 and 3. K
L
M
N
P
Q 15.0 35.0 3.0
R
S
T
Electrical Characteristics (continued)
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7
Microcomputer Peripheral LSIs MN1380 Series
Description of Operation
Notes
1: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range.
2: VDL: Detection voltage for drop in power supply voltage
VDH: Detection voltage for rise in power supply voltage
tOL : Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that the
output pin (OUT) goes to "L" level.
tOH : Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that
the output pin (OUT) goes to "H" level.
3: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and VDD
pins.
Figure 1. Description of Operation
VDD
VDH
VDL
1.5V
0V
0V
0V
VOUT
VOUT
CMOS output, N-channel
open drain output MN1380/1381/1382
MN13801/13811/13821
MN13802/13812/13822
Inverted CMOS
output Figure
tOH
tOH tOH
tOH
tOL tOL
tOL
tOL
t
t
t
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8
MN1380 Series Microcomputer Peripheral LSIs
Description for Measuring the Output Characteristics
Figure 2. Description chart of Measuring the Output Characteristics
Figure 3. Circuit for Measuring the Output Characteristics
VDD
1.6V
0V
6.0V
1.5V
1.0V
0V
6.0V
1.6V
1.5V
1.0V
0V
tOH
tOH
tOL
tOH
6.0V
CMOS output, N-channel
open drain output
MN1380/1381/1382
MN13801/13811/13821
MN13802/13812/13822
Inverted CMOS output
VDD
VOUT
MN1380 Series
100kΩ
100pF
Switch: Connect when measuring
N-channel open drain output
(MN13801/MN13811/MN13821)
t
t
t
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9
Microcomputer Peripheral LSIs MN1380 Series
Description for Measuring the I/O Characteristics
Notes
1: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range.
2: VDL: Detection voltage for drop in power supply voltage
VDH: Detection voltage for rise in power supply voltage
3: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and VDD pins.
Figure 4. Description chart for Measuring the I/O Characteristics
CMOS output, N-channel
open drain output
MN1380/1381/1382
MN13801/13811/13821
Inverted CMOS output
MN13802/13812/13822
V
OUT
V
OUT
00 1.5V V
DD
V
DL
V
DH
00 1.5V V
DD
V
DL
V
DH
Operation indeterminate
Operation
indeterminate
∆VD
∆VD
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MN1380 Series Microcomputer Peripheral LSIs
Application Circuit Example
Connect resistors, capacitors, and the like only to the output pin on the MN1380 series element. Note that connect-
ing them to the Power source pins changes VDH, VDL, and ∆VD.
Sample Circuit 1 Sample Circuit 2
Select the values of R and C to match the application.
VDD
OUT
C
MN1380
Series
VDD
OUT
C
MN1380
Series
R
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11
Microcomputer Peripheral LSIs MN1380 Series
Package Dimensions (Unit: mm)
12
6.9
2.5
1.0
2.5±0.5 2.5±0.5
1.5
1.5
0.7R
0.85 0.55±0.1 0.45±0.1
1.25
0.41.25 1.25
1.0
4.54.1
3
M type package
Note) The package will be changed to lead-free type (M3A). See the new package dimensions section later of this datasheet.
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12
MN1380 Series Microcomputer Peripheral LSIs
Note) The package will be changed to lead-free type (SSIP003-P-0000S). See the new package dimensions section later of this
datasheet.
Package Dimensions (Unit: mm)(continued)
12
2.54±0.15
0.45 +0.2
-
0.1
3
2.3±0.2
5.0±0.2 4.0±0.2
5.1±0.213.5±0.5
TO-92 type package
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13
Microcomputer Peripheral LSIs MN1380 Series
Package Dimensions (Unit: mm)(continued)
Mini type package
0.95 0.95 0.50.5
1.9±0.2
1.45
2.9
+0.2
-
0.05
1.5
0.65±0.15 0.65±0.15
0.4±0.2 0.1 to 0.3
+0.25
-
0.05
1.10 to 0.1
+0.2
-
0.1
0.8
2.8
+0.2
-
0.3
0.16
+0.1
-
0.05
0.4
+0.1
-
0.05
Note) The package will be changed to lead-free type (MINI-3DC). See the new package dimensions section later of this
datasheet.
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14
MN1380 Series Microcomputer Peripheral LSIs
1.4
1.2
1.0
0.8
0.6
0.4
0.2
00 1.0 2.0 3.0 4.0 5.0 6.0 7.0
I
DD
(µA)
I
DD
(µA)
VDD(V)
2.0
1.5
1.0
0.5
–40 –20 0 20 40 60 80
A
V
V
SS
OUT
V
DD
A
V
SS
OUT
V
DD
5V
Ambient temperature, Ta (˚C)
Reference Characteristics
The following characteristics curves represent results from a specific sample therefore they do not guarantee the
characteristics for the final product.
Figure 5.a. IDD vs. VDD Characteristic (Rank Q) Figure 5.b. Measurement Circuit
Figure 6.a. IDD Temperature Characteristic (Rank Q) Figure 6.b. Measurement Circuit
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15
Microcomputer Peripheral LSIs MN1380 Series
V
V
V
SS
OUT
V
DD
V
V
V
SS
OUT
V
DD
4.8
4.6
4.4
4.2
4.0
3.8
3.6
3.4
–40 –20020 40 60 80
V
DL
,V
DH
(V)
Temperature Ta(˚C)
Ambient temperature, Ta (˚C)
∆VD(V)
0.3
0.25
0.2
0.15
0.1
0.05
0
–40 –20020406080
VDH
VDL
Reference Characteristics (continued)
Figure 7.a. VDL/VDH Temperature Characteristic (Rank Q) Figure 7.b. Measurement Circuit
Figure 8.a. ∆VD Temperature Characteristic (Rank Q) Figure 8.b. Measurement Circuit
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16
MN1380 Series Microcomputer Peripheral LSIs
3
2
1
000.5 1.0 1.5 2.0 2.5 3.0
I
OL
(mA)
V
OL
(V)
20
15
10
5
0012345
V
OL
(V)
| I
OH
| (mA)
–30˚C
80˚C
–30˚C
80˚C
A
V
V
SS
OUT
V
DD
1.8V
A
V
V
SS
OUT
V
DD
5V
Room temperature
Room temperature
Reference Characteristics (continued)
Figure 9.a. IOL vs. VOL Characteristic Figure 9.b. Measurement Circuit
Figure 10.a. IOH vs. VOH Characteristic Figure 10.b. Measurement Circuit
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Microcomputer Peripheral LSIs MN1380 Series
A
V
V
SS
OUT
V
DD
1.8V
A
V
V
SS
OUT
V
DD
5V
2.5
2.0
1.5
1.0
0.5
0
–40 –20 020
40 60 80
IOL(mA)
| IOH | (mA)
–40 –20 020
40 60 80
7.0
6.5
6.0
5.5
5.0
4.5
Ambient temperature, Ta (˚C)
Ambient temperature, Ta (˚C)
Reference Characteristics (continued)
Figure 11.a. IOL vs. Temperature Characteristic Figure 11.b. Measurement Circuit
Figure 12.a. IOH vs. Temperature Characteristic Figure 12.b. Measurement Circuit
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18
MN1380 Series Microcomputer Peripheral LSIs
TO-92 Type Package Taping-Specifications (MN1381/MN13811/MN13812)
Name Symbol Length (mm)
Adhesive tape width W0 6.0±0.5
Feed hole position W1 9.0±0.5
Adhesive tape position W2 0.5 max
Distance to top of product H 25.0 max
Distance to H0 19.0±0.5
bottom of product
Lead clinch height H1 16.0±0.5
Feed hole diameter D0 4.0±0.2
Tape thickness t1 0.7±0.2
Total tape thickness t2 1.5 max
TO-92 Type Package Taping Dimensions (Ammunition pack)
Name Symbol Length (mm)
Product height* A 5.3 max
Product width* A1 5.2 max
Product thickness* T 4.2 max
Lead width* d 0.45
Taped lead length l1 2.0 max
Product pitch P 12.7±1.0
Feed hole pitch P0 12.7±0.3
Feed hole position P1 6.35±0.5
Lead spacing F1, F2 2.5
Product deflection angle ∆h1, ∆h2 2.0 max
Tape width W 18.0 +1.0
– 0.5
+0.15
– 0.1
+0.5
– 0.2
Figure 13. TO-92 Type Package Taping-Dimensions (Ammunition pack)
Figure 14. Box Dimensions for TO-92 Type Packages with Ammunition pack
WHD
330 250 41
Unit: mm
P1PA1
F1F2
d
P0øD0
H0H
l1H1
W2
W0
W
∆h1∆h2
0
t
2
t
1
A
T
Drawing direction
25 elements (example)
B
E
H
W
D
Leave the space for at
least three elements
Note*1: For further details, see the specifications issued separately.
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19
Microcomputer Peripheral LSIs MN1380 Series
Embossed Taping Specifications for Mini Type Package (MN1382/MN13821/MN13822)
There is a choice of two orientations, TW and TX, for the product relative to the tape.
Figure 15. TW Orientation Figure 16. TX Orientation
Figure 17. Embossed Taping Dimensions for Mini Type Package
Figure 18. Embossed Taping Reel Dimensions for Mini Type Package
Unit: mm
Unit: mm
3,000 packages per reel
Product orientation A is labeled TW; orientation B, TX.
A
B
ø1.5
+0.1
-0
4.0±0.1
8.0±0.3
3.5±0.05 1.75±0.1
3.2±0.1
3.3±0.1 1.75±0.1
4.0±0.1
t+0.3±0.1
2±0.5
ø21±0.8
ø13±0.5
ø80±1.0
ø178±2.0
10±1.5
2±0.5
TW
Tape feed hole
Drawing
direction
(Marking surface on top)
TX
Tape feed hole
Drawing
direction
(Marking surface on top)
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MN1380 Series Microcomputer Peripheral LSIs
Reliability Testing Results for MN1380 Series
(1) M type package (MN1380/MN13801/MN13802) and TO-92 type package (MN1381/MN13811/MN13812)
Test Subjects Test Conditions Results
Operating lifetime test VDD=5.5V, Ta=125˚C, t=1000hrs 0/15
High-temperature storage test T a=150˚C, t=1000hrs 0/15
Low-temperature storage test Ta=–65˚C, t=1000hrs 0/15
High-temperature, Ta=85˚C, RH=85%, t=1000hrs 0/15
high-humidity storage test
High-temperature, VDD=5.5V, Ta=85˚C, RH=85%, t=1000hrs 0/15
high-humidity bias test
Thermal shock test Ta=150˚C and –65˚C. 0/15
Five minutes at each temperature for ten cycles
Temperature cycle test Ta=150˚C and –65˚C. 0/15
Thirty minutes at each temperature for ten cycles
Pressure cooker test Two atmospheres for 50 hours at ambient temperature (Ta) of 121˚C0/15
Soldering test Ambient temperature (Ta) of 230˚C for five seconds 0/15
Solder heat resistance test Ambient temperature (Ta) of 270˚C for ten seconds 0/15
(2) Mini type package (MN1382/MN13821/MN13822)
Test Subjects Test Conditions Results
Operating lifetime test VDD=5.5V, Ta=125˚C, t=1000hrs 0/15
High-temperature storage test T a=150˚C, t=1000hrs 0/15
Low-temperature storage test Ta=–65˚C, t=1000hrs 0/15
High-temperature, Ta=85˚C, RH=85%, t=1000hrs 0/15
high-humidity storage test
High-temperature, VDD=5.5V, Ta=85˚C, RH=85%, t=1000hrs 0/15
high-humidity bias test
Thermal shock test Ta=150˚C and –65˚C. 0/15
Five minutes at each temperature for ten cycles
Temperature cycle test Ta=150˚C and –65˚C. 0/15
Thirty minutes at each temperature for ten cycles
Pressure cooker test *1Two atmospheres for 24 hours at ambient temperature (T a) of 121˚C0/15
Soldering test Ambient temperature (Ta) of 230˚C for five seconds 0/15
Solder heat resistance test *1Ambient temperature (Ta) of 260˚C for five seconds 0/15
Note*1: Note that the testing conditions for the mini package differ from those for the other two packages.
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21
Microcomputer Peripheral LSIs MN1380 Series
13
R0.90
2−R0.70
6.90±0.10 2.50±0.10
0.55±0.10
(0.85)
3.50±0.10
4.50±0.10
(1.00)
(1.00)
4.10±0.20
1.00±0.10
2.85±0.20
2.25±0.20
(1.50)
(1.50)
(0.40)
0.40+0.10
-
0.05
2.50 2.50
New Package Dimensions (Unit: mm)
• M3A (Lead-free package)
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MN1380 Series Microcomputer Peripheral LSIs
New Package Dimensions (Unit: mm)(continued)
• SSIP003-P-0000S (Lead-free package)
(1.00) (1.00)
31
5.00±0.20
4.00±0.20
2.30±0.20
0.60±0.15
0.40±0.10
5.00±0.20
13.30±0.50
0.40+0.10
-
0.05
1.27 1.27
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planed maintenance type
maintenance type
planed discontinued typed
discontinued type
Please visit following URL about latest information.
http://www.semicon.panasonic.co.jp/en/
23
Microcomputer Peripheral LSIs MN1380 Series
New Package Dimensions (Unit: mm)(continued)
• MINI-3DC (Lead-free package)
3
2
1
(1.45)
2.80+0.20
-
0.30
1.50+0.25
-
0.05
(0.65)(0.65)
2.90+0.20
-
0.05
1.10+0.20
-
0.10
0 to 0.10
1.20+0.30
-
0.10
0.16+0.10
-
0.06
0.40+0.10
-
0.05
0.40±0.20 0.10 to 0.30
1.90+0.20
Seating plane
0.950.95
Maintenance/
Discontinued
Maintenance/Discontinued includes following four Product lifecycle stage.
planed maintenance type
maintenance type
planed discontinued typed
discontinued type
Please visit following URL about latest information.
http://www.semicon.panasonic.co.jp/en/
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
Maintenance/
Discontinued
Maintenance/Discontinued includes following four Product lifecycle stage.
planed maintenance type
maintenance type
planed discontinued typed
discontinued type
Please visit following URL about latest information.
http://www.semicon.panasonic.co.jp/en/
