Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LM567, LM567C SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 LM567x Tone Decoder 1 Features 3 Description * The LM567 and LM567C are general purpose tone decoders designed to provide a saturated transistor switch to ground when an input signal is present within the passband. The circuit consists of an I and Q detector driven by a voltage controlled oscillator which determines the center frequency of the decoder. External components are used to independently set center frequency, bandwidth and output delay. 1 * * * * * * 20 to 1 Frequency Range With an External Resistor Logic Compatible Output With 100-mA Current Sinking Capability Bandwidth Adjustable From 0 to 14% High Rejection of Out of Band Signals and Noise Immunity to False Signals Highly Stable Center Frequency Center Frequency Adjustable from 0.01 Hz to 500 kHz Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) SOIC (8) 4.90 mm x 3.91 mm PDIP (8) 9.81 mm x 6.35 mm 2 Applications LM567C * * * * * * * (1) For all available packages, see the orderable addendum at the end of the datasheet. Touch Tone Decoding Precision Oscillator Frequency Monitoring and Control Wide Band FSK Demodulation Ultrasonic Controls Carrier Current Remote Controls Communications Paging Decoders 4 Simplified Diagram 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM567, LM567C SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Simplified Diagram ................................................ Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 1 2 3 3 4 8.1 8.2 8.3 8.4 8.5 4 4 4 5 6 Absolute Maximum Ratings ...................................... Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. 9 Parameter Measurement Information .................. 8 10 Detailed Description ............................................. 8 10.1 Overview ................................................................. 8 10.2 Functional Block Diagram ....................................... 8 10.3 Feature Description................................................. 9 10.4 Device Functional Modes...................................... 10 11 Application and Implementation........................ 12 11.1 Application Information.......................................... 12 11.2 Typical Applications .............................................. 13 12 Power Supply Recommendations ..................... 19 13 Layout................................................................... 19 13.1 Layout Guidelines ................................................. 19 13.2 Layout Example .................................................... 19 14 Device and Documentation Support ................. 20 14.1 14.2 14.3 14.4 Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 20 20 20 20 15 Mechanical, Packaging, and Orderable Information ........................................................... 20 5 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (March 2013) to Revision E * Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 Changes from Revision C (March 2013) to Revision D * 2 Page Page Changed layout of National Data Sheet to TI format ............................................................................................................. 9 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 6 Device Comparison Table DEVICE NAME LM567, LM567C LMC567 DESCRIPTION General Purpose Tone Decoder Same as LM567C, but lower power supply current consumption and double oscillator frequency 7 Pin Configuration and Functions 8-Pin PDIP (P) and SOIC (D) Package Top View Pin Functions PIN NAME NO. TYPE DESCRIPTION GND 7 P Circuit ground. IN 3 I Device input. LF_CAP 2 I Loop filter capacitor pin (LPF of the PLL). OUT 8 O Device output. OF_CAP 1 I Output filter capacitor pin. T_CAP 5 I Timing capacitor connection pin. T_RES 6 I Timing resistor connection pin. VCC 4 P Voltage supply pin. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 3 LM567, LM567C SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings (1) (2) (3) MIN MAX UNIT Supply Voltage Pin 9 V Power Dissipation (4) 1100 mW 15 V V3 -10 V V3 V4 + 0.5 V 70 C Soldering (10 s) 260 C Vapor Phase (60 s) 215 C Infrared (15 s) 220 C 150 C V8 LM567CM, LM567CN PDIP Package Operating Temperature Range SOIC Package 0 -65 Storage temperature range, Tstg (1) (2) (3) (4) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Recommended Operating Conditions. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication of device performance. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. See http://www.ti.com for other methods of soldering surface mount devices. The maximum junction temperature of the LM567 and LM567C is 150C. For operating at elevated temperatures, devices in the DIP package must be derated based on a thermal resistance of 110C/W, junction to ambient. For the SOIC package, the device must be derated based on a thermal resistance of 160C/W, junction to ambient. 8.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX 3.5 8.5 V Input Voltage Level -8.5 8.5 V Operating Temperature Range -20 120 C VCC Supply Voltage VIN TA UNIT 8.3 Thermal Information LM567C THERMAL METRIC (1) D P UNIT 8 PINS RJA Junction-to-ambient thermal resistance 107.5 53.0 RJC(top) Junction-to-case (top) thermal resistance 54.6 42.3 RJB Junction-to-board thermal resistance 47.5 30.2 JT Junction-to-top characterization parameter 10.0 19.6 JB Junction-to-board characterization parameter 47.0 30.1 (1) 4 C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 8.4 Electrical Characteristics AC Test Circuit, TA = 25C, V+ = 5 V PARAMETER TEST CONDITIONS Power Supply Voltage Range LM567 LM567C/LM567CM MIN TYP MAX MIN TYP MAX 4.75 4.75 UNIT 5.0 9.0 5.0 9.0 V Power Supply Current Quiescent RL = 20k 6 8 7 10 mA Power Supply Current Activated RL = 20k 11 13 12 15 mA 25 mVrms Input Resistance 18 Smallest Detectable Input Voltage IL = 100 mA, fi = fo Largest No Output Input Voltage IC = 100 mA, fi = fo 20 10 Largest Simultaneous Outband Signal to Inband Signal Ratio Minimum Input Signal to Wideband Noise Ratio Bn = 140 kHz Largest Detection Bandwidth 12 Largest Detection Bandwidth Skew Largest Detection Bandwidth Variation with Temperature Largest Detection Bandwidth Variation with Supply Voltage 15 25 15 4.75 - 6.75 V 10 0 < TA < 70 -55 < TA < +125 Center Frequency Shift with Supply Voltage 4.75 V - 6.75 V 4.75 V - 9 V Fastest ON-OFF Cycling Rate k 15 mVrms 6 6 dB -6 -6 dB 14 16 1 2 1 100 20 20 10 0.1 Highest Center Frequency Center Frequency Stability (4.75 - 5.75 V) 20 18 % of fo 2 3 % of fo 0.1 2 500 1 100 35 60 35 140 0.5 14 1.0 2.0 fo/20 %/C 5 %V 500 kHz 35 60 35 140 ppm/C ppm/C 0.4 2.0 2.0 %/V %/V fo/20 Output Leakage Current V8 = 15 V 0.01 25 0.01 25 A Output Saturation Voltage ei = 25 mV, I8 = 30 mA ei = 25 mV, I8 = 100 mA 0.2 0.6 0.4 1.0 0.2 0.6 0.4 1.0 V Output Fall Time 30 30 ns Output Rise Time 150 150 ns Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 5 LM567, LM567C SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 www.ti.com 8.5 Typical Characteristics 6 Figure 1. Typical Frequency Drift Figure 2. Typical Bandwidth Variation Figure 3. Typical Frequency Drift Figure 4. Typical Frequency Drift Figure 5. Bandwidth vs Input Signal Amplitude Figure 6. Largest Detection Bandwidth Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 Typical Characteristics (continued) Figure 7. Detection Bandwidth as a Function of C2 and C3 Figure 8. Typical Supply Current vs Supply Voltage Figure 9. Greatest Number of Cycles Before Output Figure 10. Typical Output Voltage vs Temperature Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 7 LM567, LM567C SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 www.ti.com 9 Parameter Measurement Information All parameters are measured according to the conditions described in the Specifications section. 10 Detailed Description 10.1 Overview The LM567C is a general purpose tone decoder. The circuit consists of I and Q detectors driven by a voltage controlled oscillator which determines the center frequency of the decoder. This device is designed to provide a transistor switch to ground output when the input signal frequency matches the center frequency pass band. Center frequency is set by an external timing circuit composed by a capacitor and a resistor. Bandwidth and output delay are set by external capacitors. 10.2 Functional Block Diagram 8 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 10.3 Feature Description 10.3.1 Center Frequency The center frequency of the LM567 tone decoder is equal to the free running frequency of the voltage controlled oscillator. In order to set this frequency, external components should be placed externally. The component values are given by: 1.1 fo R1 C1 where * * R1 = Timing Resistor C1 = Timing Capacitor (1) 10.3.2 Output Filter To eliminate undesired signals that could trigger the output stage, a post detection filter is featured in the LM567C. This filter consists of an internal resistor (4.7K-) and an external capacitor. Although typically external capacitor value is not critical, it is recommended to be at least twice the value of the loop filter capacitor. If the output filter capacitor value is too large, the turn-on and turn off-time of the output will present a delay until the voltage across this capacitor reaches the threshold level. 10.3.3 Loop Filter The phase locked loop (PLL) included in the LM567 has a pin for connecting the low pass loop filter capacitor. The selection of the capacitor for the filter depends on the desired bandwidth. The device bandwidth selection is different according to the input voltage level. Refer to the Operation With Vi < 200m - VRMS section and the Operation With Vi > 200m - VRMS section for more information about the loop filter capacitor selection. 10.3.4 Logic Output The LM567 is designed to provide a transistor switch to ground output when the input signal frequency matches the center frequency pass band. The logic output is an open collector power transistor that requires an external load resistor that is used to regulate the output current level. 10.3.5 Die Characteristics Figure 11. Die Layout (C - Step) Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 9 LM567, LM567C SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 www.ti.com Feature Description (continued) Table 1. Die and Wafer Characteristics Fabrication Attributes General Die Information Physical Die Identification LM567C Bond Pad Opening Size (min) 91m x 91m Die Step C Bond Pad Metalization 0.5% COPPER_BAL. ALUMINUM Passivation VOM NITRIDE Wafer Diameter Physical Attributes 150mm Back Side Metal BARE BACK Dise Size (Drawn) 1600m x 1626m 63.0mils x 64.0mils Back Side Connection Floating Thickness 406m Nominal Min Pitch 198m Nominal Special Assembly Requirements: Note: Actual die size is rounded to the nearest micron. Die Bond Pad Coordinate Locations (C - Step) (Referenced to die center, coordinates in m) NC = No Connection, N.U. = Not Used SIGNAL NAME PAD# NUMBER X/Y COORDINATES PAD SIZE X Y X Y OUTPUT FILTER 1 -673 686 91 x 91 LOOP FILTER 2 -673 -419 91 x 91 INPUT 3 -673 -686 91 x 91 V+ 4 -356 -686 91 x 91 TIMING RES 5 673 -122 91 x 91 TIMING CAP 6 673 76 91 x 91 GND 7 178 686 117 x 91 OUTPUT 8 -318 679 117 x 104 10.4 Device Functional Modes 10.4.1 Operation With Vi < 200m - VRMS When the input signal is below a threshold voltage, typically 200m-VRMS, the bandwidth of the detection band should be calculated . where * * 10 Vi = Input voltage (volts rms), Vi 200mV C2 = Capacitance at Pin 2(F) Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 Device Functional Modes (continued) 10.4.2 Operation With Vi > 200m - VRMS For input voltages greater than 200m-VRMS, the bandwidth depends directly from the loop filter capacitance and free running frequency product. Bandwidth is represented as a percentage of the free running frequency, and according to the product of f0C2, it can have a variation from 2 to 14%. Table 2 shows the approximate values for bandwidth in function of the product result. Table 2. Detection Bandwidth in Function of fo x C2 fo x C2 (kHzF) Bandwidth (% of fo) 62 2 16 4 7.3 6 4.1 8 2.6 10 1.8 12 1.3 14 < 1.3 14 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 11 LM567, LM567C SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 www.ti.com 11 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 11.1 Application Information The LM567 tone decoder is a device capable of detecting if an input signal is inside a selectable range of detection. The device has an open collector transistor output, so an external resistor is required to achieve proper logic levels. When the input signal is inside the detection band, the device output will go to a LOW state. The internal VCO free running frequency establishes the detection band central frequency. An external RC filter is required to set this frequency. The bandwidth in which the device will detect the desired frequency depends on the capacitance of loop filter terminal. Typically a 1F capacitor is connected to this pin. The device detection band has a different behavior for low and high input voltage levels. Refer to the Operation With Vi < 200m - VRMS section and the Operation With Vi > 200m - VRMS section for more information. 12 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 11.2 Typical Applications 11.2.1 Touch-Tone Decoder Component values (typ) R1 6.8 to 15k R2 4.7k R3 20k C1 0.10 mfd C2 1.0 mfd 6V C3 2.2 mfd 6V C4 250 mfd 6V Figure 12. Touch-Tone Decoder 11.2.1.1 Design Requirements PARAMETERS VALUES Supply Voltage Range 3.5 V to 8.5 V Input Voltage Range 20 mVRMS to VCC + 0.5 Input Frequency 1 Hz to 500 kHz Output Current Max. 15 mA Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 13 LM567, LM567C SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 www.ti.com 11.2.1.2 Detailed Design Procedure 11.2.1.2.1 Timing Components To calculate the timing components for an approximated desired central detection frequency (f0), the timing capacitor value (C1) should be stated in order to calculate the timing resistor value (R1). Typically for most applications, a 0.1-F capacitor is used. 1.1 fo R1 C1 (2) 11.2.1.2.2 Bandwidth Detection bandwidth is represented as a percentage of f0. It can be selected based on the input voltage levels (Vi). For Vi < 200 mVRMS, (3) For Vi > 200 mVRMS, refer to Table 2 or Figure 5. 11.2.1.2.3 Output Filter The output filter selection is made considering the capacitor value to be at least twice the Loop filter capacitor. C3 2C2 (4) 11.2.1.3 Application Curve IN (PIN 3) OUT (PIN 8) Figure 13. Frequency Detection 14 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 11.2.2 Oscillator with Quadrature Output Connect Pin 3 to 2.8V to Invert Output Figure 14. Oscillator with Quadrature Output 11.2.2.1 Design Requirements Refer to the previous Design Requirements section. 11.2.2.2 Detailed Design Procedure Refer to the previous Detailed Design Procedure section. 11.2.2.3 Application Curve OUT 1 (PIN 3) OUT 2 (PIN 8) Figure 15. Quadrature Output Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 15 LM567, LM567C SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 www.ti.com 11.2.3 Oscillator with Double Frequency Output Figure 16. Oscillator with Double Frequency Output 11.2.3.1 Design Requirements Refer to the previous Design Requirements section. 11.2.3.2 Detailed Design Procedure Refer to the previous Detailed Design Procedure section. 11.2.3.3 Application Curve OUT 1 (PIN 5) OUT 2 (PIN 8) Figure 17. Double Frequency Output 16 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 11.2.4 Precision Oscillator Drive 100-mA Loads Figure 18. Precision Oscillator Drive 100-mA Loads 11.2.4.1 Design Requirements Refer to the previous Design Requirements section. 11.2.4.2 Detailed Design Procedure Refer to the previous Detailed Design Procedure section. 11.2.4.3 Application Curve OUT (PIN 8) Figure 19. Output for 100-mA Load Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 17 LM567, LM567C SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 www.ti.com 11.2.5 AC Test Circuit fi = 100 kHz + 5 V *Note: Adjust for fo = 100 kHz. 11.2.5.1 Design Requirements Refer to the previous Design Requirements section. 11.2.5.2 Detailed Design Procedure Refer to the previous Detailed Design Procedure section. 11.2.5.3 Application Curve Refer to the previous Application Curve section. 18 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 12 Power Supply Recommendations The LM567C is designed to operate with a power supply up to 9 V. It is recommended to have a well regulated power supply. As the operating frequency of the device could be very high for some applications, the decoupling of power supply becomes critical, so is required to place a proper decoupling capacitor as close as possible to VCC pin. 13 Layout 13.1 Layout Guidelines The VCC pin of the LM567 should be decoupled to ground plane as the device can work with high switching speeds. The decoupling capacitor should be placed as close as possible to the device. Traces length for the timing and external filter components should be kept at minimum in order to avoid any possible interference from other close traces. 13.2 Layout Example Figure 20. LM567 Layout Example Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 19 LM567, LM567C SNOSBQ4E - MAY 1999 - REVISED DECEMBER 2014 www.ti.com 14 Device and Documentation Support 14.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 3. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM567 Click here Click here Click here Click here Click here LM567C Click here Click here Click here Click here Click here 14.2 Trademarks All trademarks are the property of their respective owners. 14.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 14.4 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 15 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 20 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM567 LM567C PACKAGE OPTION ADDENDUM www.ti.com 14-Nov-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM567CM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 567CM LM567CMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 567CM LM567CN/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM 567CN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 14-Nov-2017 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Nov-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM567CMX/NOPB Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 5.4 2.0 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Nov-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM567CMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2017, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LM567CM LM567CM/NOPB LM567CMX LM567CMX/NOPB LM567CN/NOPB NE567V