SN74CBTS3384 10-BIT FET BUS SWITCH WITH SCHOTTKY DIODE CLAMPING SCDS024M - MAY 1995 - REVISED JULY 2003 D D DB, DBQ, DGV, DW, OR PW PACKAGE (TOP VIEW) 5- Switch Connection Between Two Ports TTL-Compatible Input Levels 1OE 1B1 1A1 1A2 1B2 1B3 1A3 1A4 1B4 1B5 1A5 GND description/ordering information The SN74CBTS3384 provides ten bits of high-speed TTL-compatible bus switching with Schottky diodes on the I/Os to clamp undershoot. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The device is organized as two 5-bit bus switches with separate output-enable (OE) inputs. When OE is low, the switch is on, and port A is connected to port B. When OE is high, the switch is open, and the high-impedance state exists between the two ports. 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC 2B5 2A5 2A4 2B4 2B3 2A3 2A2 2B2 2B1 2A1 2OE ORDERING INFORMATION TOP-SIDE MARKING Tube SN74CBTS3384DW Tape and reel SN74CBTS3384DWR SSOP - DB Tape and reel SN74CBTS3384DBR CR384 SSOP (QSOP) - DBQ Tape and reel SN74CBTS3384DBQR CBTS3384 Tube SN74CBTS3384PW Tape and reel SN74CBTS3384PWR SOIC - DW -40C to 85C ORDERABLE PART NUMBER PACKAGE TA TSSOP - PW CBTS3384 CR384 TVSOP - DGV Tape and reel SN74CBTS3384DGVR CR384 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each 5-bit bus switch) INPUTS INPUTS/OUTPUTS 1OE 2OE 1B1-1B5 2B1-2B5 L L 1A1-1A5 2A1-2A5 L H 1A1-1A5 Z H L Z 2A1-2A5 H H Z Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN74CBTS3384 10-BIT FET BUS SWITCH WITH SCHOTTKY DIODE CLAMPING SCDS024M - MAY 1995 - REVISED JULY 2003 logic diagram (positive logic) 1A1 1A5 1OE 2A1 2A5 2OE 3 2 11 10 1B1 1B5 1 14 15 22 23 2B1 2B5 13 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA Package thermal impedance, JA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63C/W DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) MIN MAX VCC VIH Supply voltage 4 5.5 High-level control input voltage 2 VIL TA Low-level control input voltage Operating free-air temperature -40 UNIT V V 0.8 V 85 C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN74CBTS3384 10-BIT FET BUS SWITCH WITH SCHOTTKY DIODE CLAMPING SCDS024M - MAY 1995 - REVISED JULY 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER A or B inputs VIK TEST CONDITIONS II = -18 18 mA IIL IIH VCC = 5.5 V, VCC = 5.5 V, VI = GND VI = 5.5 V ICC ICC Control inputs VCC = 5.5 V, VCC = 5.5 V, IO = 0, One input at 3.4 V, Ci Control inputs II Cio(OFF) VI = 3 V or 0 VO = 3 V or 0, ron VCC = 4.5 V MAX -1.2 -1 150 VI = VCC or GND Other inputs at VCC or GND OE = VCC VCC = 4 V, TYP at VCC = 4 V TYP -0.6 VCC = 4 4.5 5V V, Control inputs MIN UNIT V A 3 A 2.5 mA 6 pF 6.5 pF VI = 2.4 V, II = 15 mA 14 20 VI = 0 II = 64 mA II = 30 mA 5 7 5 7 VI = 2.4 V, II = 15 mA 10 15 All typical values are at VCC = 5 V (unless otherwise noted), TA = 25C. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lowest voltage of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) VCC = 4 V VCC = 5 V 0.5 V MIN MIN FROM (INPUT) TO (OUTPUT) tpd A or B B or A 0.35 ten OE A or B 6.2 tdis OE A or B 5.5 PARAMETER MAX UNIT MAX 0.25 ns 1.9 5.7 ns 2.1 5.2 ns The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN74CBTS3384 10-BIT FET BUS SWITCH WITH SCHOTTKY DIODE CLAMPING SCDS024M - MAY 1995 - REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION 7V 500 From Output Under Test S1 Open GND CL = 50 pF (see Note A) 500 TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 7V Open Output Control (low-level enabling) LOAD CIRCUIT 3V 1.5 V 1.5 V 0V tPZL 3V Input 1.5 V 1.5 V 0V tPLH 1.5 V tPLZ 3.5 V 1.5 V tPZH tPHL VOH Output Output Waveform 1 S1 at 7 V (see Note B) 1.5 V VOL Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOL + 0.3 V VOL tPHZ 1.5 V VOH VOH - 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 28-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74CBTS3384DBQRE4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 74CBTS3384DBQRG4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 74CBTS3384DGVRE4 ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74CBTS3384DGVRG4 ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384DBLE OBSOLETE SSOP DB 24 SN74CBTS3384DBQR ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74CBTS3384DBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384DBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384DBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384DGVR ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384DW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384DWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384DWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384DWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384PW ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384PWE4 ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384PWG4 ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384PWLE OBSOLETE TSSOP PW 24 SN74CBTS3384PWR ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384PWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTS3384PWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD TBD (1) Lead/Ball Finish Call TI Call TI MSL Peak Temp (3) Call TI Call TI The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 28-May-2007 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74CBTS3384DBQR Package Package Pins Type Drawing SSOP/ QSOP SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DBQ 24 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74CBTS3384DBR SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1 SN74CBTS3384DGVR TVSOP DGV 24 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 SN74CBTS3384DWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 SN74CBTS3384PWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74CBTS3384DBQR SSOP/QSOP DBQ 24 2500 346.0 346.0 33.0 SN74CBTS3384DBR SSOP DB 24 2000 346.0 346.0 33.0 SN74CBTS3384DGVR TVSOP DGV 24 2000 346.0 346.0 29.0 SN74CBTS3384DWR SOIC DW 24 2000 346.0 346.0 41.0 SN74CBTS3384PWR TSSOP PW 24 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C - FEBRUARY 1996 - REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0-8 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. 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