SN74CBTS3384
10-BIT FET BUS SWITCH
WITH SCHOTTKY DIODE CLAMPING
SCDS024M – MAY 1995 – REVISED JULY 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
5-Ω Switch Connection Between Two Ports
D
TTL-Compatible Input Levels
description/ordering information
The SN74CBTS3384 provides ten bits of
high-speed TTL-compatible bus switching with
Schottky diodes on the I/Os to clamp undershoot.
The low on-state resistance of the switch allows
connections to be made with minimal propagation
delay.
The device is organized as two 5-bit bus switches
with separate output-enable (OE) inputs. When
OE is low, the switch is on, and port A is connected
to port B. When OE is high, the switch is open, and
the high-impedance state exists between the two
ports.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
SOIC DW
Tube SN74CBTS3384DW
CBTS3384
SOIC
–
DW
Tape and reel SN74CBTS3384DWR
CBTS3384
SSOP – DB Tape and reel SN74CBTS3384DBR CR384
–40°C to 85°CSSOP (QSOP) – DBQ Tape and reel SN74CBTS3384DBQR CBTS3384
TSSOP – PW
Tube SN74CBTS3384PW
CR384
TSSOP
–
PW
Tape and reel SN74CBTS3384PWR
CR384
TVSOP – DGV Tape and reel SN74CBTS3384DGVR CR384
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
FUNCTION TABLE
(each 5-bit bus switch)
INPUTS INPUTS/OUTPUTS
1OE 2OE 1B1–1B5 2B1–2B5
L L 1A1–1A5 2A1–2A5
L H 1A1–1A5 Z
HLZ2A1–2A5
H H Z Z
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DB, DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
1B5
1A5
GND
VCC
2B5
2A5
2A4
2B4
2B3
2A3
2A2
2B2
2B1
2A1
2OE
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
SN74CBTS3384
10-BIT FET BUS SWITCH
WITH SCHOTTKY DIODE CLAMPING
SCDS024M – MAY 1995 – REVISED JULY 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram (positive logic)
32
1A1 1B1
11
1A5
1
1OE
10 1B5
14 15
2A1 2B1
22
2A5
13
2OE
23 2B5
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous channel current 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI/O < 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DB package 63°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DBQ package 61°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 46°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 88°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN MAX UNIT
VCC Supply voltage 4 5.5 V
VIH High-level control input voltage 2 V
VIL Low-level control input voltage 0.8 V
TAOperating free-air temperature –40 85 °C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74CBTS3384
10-BIT FET BUS SWITCH
WITH SCHOTTKY DIODE CLAMPING
SCDS024M – MAY 1995 – REVISED JULY 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VIK
A or B inputs
VCC =45V
II= 18 mA
–0.6
V
V
IK Control inputs
V
CC =
4
.
5
V
,
I
I = –
18
mA
–1.2
V
II
IIL VCC = 5.5 V, VI = GND –1
µA
I
IIIH VCC = 5.5 V, VI = 5.5 V 150 µ
A
ICC VCC = 5.5 V, IO = 0, VI = VCC or GND 3µA
∆ICC‡Control inputs VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND 2.5 mA
CiControl inputs VI = 3 V or 0 6 pF
Cio(OFF) VO = 3 V or 0, OE = VCC 6.5 pF
§
VCC = 4 V,
TYP at VCC = 4 V VI = 2.4 V, II = 15 mA 14 20
r
on§
VI=0
II = 64 mA 5 7 Ω
on
VCC = 4.5 V
V
I =
0
II = 30 mA 5 7
VI = 2.4 V, II = 15 mA 10 15
†All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
‡This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
§Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lowest voltage of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER FROM
TO
VCC = 4 V VCC = 5 V
± 0.5 V UNIT
MIN MAX MIN MAX
tpdA or B B or A 0.35 0.25 ns
ten OE A or B 6.2 1.9 5.7 ns
tdis OE A or B 5.5 2.1 5.2 ns
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
SN74CBTS3384
10-BIT FET BUS SWITCH
WITH SCHOTTKY DIODE CLAMPING
SCDS024M – MAY 1995 – REVISED JULY 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOH
VOL
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1 7 V
Open
GND
500 Ω
500 Ω
tPLH tPHL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
W aveform 2
S1 at Open
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
3 V
0 V
VOH
VOL
0 V
VOL + 0.3 V
VOH – 0.3 V
0 V
Input
3 V
3.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
7 V
Open
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V
1.5 V
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74CBTS3384DBQRE4 ACTIVE SSOP/
QSOP DBQ 24 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
74CBTS3384DBQRG4 ACTIVE SSOP/
QSOP DBQ 24 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
74CBTS3384DGVRE4 ACTIVE TVSOP DGV 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBTS3384DGVRG4 ACTIVE TVSOP DGV 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384DBLE OBSOLETE SSOP DB 24 TBD Call TI Call TI
SN74CBTS3384DBQR ACTIVE SSOP/
QSOP DBQ 24 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74CBTS3384DBR ACTIVE SSOP DB 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384DBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384DBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384DGVR ACTIVE TVSOP DGV 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384DW ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384DWE4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384DWG4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384DWR ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384PW ACTIVE TSSOP PW 24 60 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384PWE4 ACTIVE TSSOP PW 24 60 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384PWG4 ACTIVE TSSOP PW 24 60 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384PWLE OBSOLETE TSSOP PW 24 TBD Call TI Call TI
SN74CBTS3384PWR ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384PWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTS3384PWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PACKAGE OPTION ADDENDUM
www.ti.com 28-May-2007
Addendum-Page 1
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 28-May-2007
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74CBTS3384DBQR SSOP/
QSOP DBQ 24 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74CBTS3384DBR SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1
SN74CBTS3384DGVR TVSOP DGV 24 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
SN74CBTS3384DWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1
SN74CBTS3384PWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74CBTS3384DBQR SSOP/QSOP DBQ 24 2500 346.0 346.0 33.0
SN74CBTS3384DBR SSOP DB 24 2000 346.0 346.0 33.0
SN74CBTS3384DGVR TVSOP DGV 24 2000 346.0 346.0 29.0
SN74CBTS3384DWR SOIC DW 24 2000 346.0 346.0 41.0
SN74CBTS3384PWR TSSOP PW 24 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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