© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 1
One WORLD One Brand One Strategy One Focus One Team One KEMET
Benets
• -55°C to +125°C operating temperature range
• Saves both circuit board and inventory space
• Reduces placement costs and increases throughput
• RoHS compliant
• EIA 0508 (2-element) and 0612 (4-element) case sizes
• DC voltage ratings of 10V, 16V, 25V, 50V, 100V and 200V
• Capacitance offerings ranging from 10pF to 2200pF
• Available capacitance tolerances of ±5%, ±10% and ±20%
• Non-polar device, minimizing installation concerns
• Flexible termination option is standard on 0508 case size arrays
• 100% pure matte tin-plated termination nish allowing for
excellent solderability
• SnPb termination nish option available upon request (5% min)
• Commercial and Automotive (AEC-Q200) grades available
Overview
KEMET’s Ceramic Chip Capacitor Array in C0G dielectric is an
advanced passive technology where multiple capacitor elements
are integrated into one common monolithic structure. Array
technology promotes reduced placement costs and increased
throughput. This is achieved by alternatively placing one device
rather than two or four discrete devices. Use of capacitor arrays
also saves board space which translates into increased board
density and more functions per board. Arrays consume only
a portion of the space required for standard chips resulting in
savings in inventory and pick/place machine positions.
KEMET’s C0G dielectric features a 125°C maximum operating
temperature and is considered “stable.”The Electronics
Components, Assemblies & Materials Association (EIA)
characterizes C0G dielectric as a Class I material. Components
of this classication are temperature compensating and are suited
for resonant circuit applications or those where Q and stability of
capacitance characteristics are required. C0G exhibits no change
in capacitance with respect to time and voltage and boasts a
negligible change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±30ppm/ºC from
-55°C to +125°C.
KEMET automotive grade array capacitors meet the demanding
Automotive Electronics Council's AEC-Q200 qualication
requirements and are manufactured in state of the art ISO/TS
16949:2002 certied facilities.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10VDC-200VDC
(Commercial & Automotive Grade)
Ordering Information
CA 06 4 C 104 K 4 G A CTU
Ceramic
Array
Case Size
(L" x W")1
Number of
Capacitors Specication/
Series2
Capacitance
Code (pF)
Capacitance
Tolerance Voltage Dielectric Failure Rate/
Design
Termination
Finish3
Packaging/Grade
(C-Spec)4
05 = 0508
06 = 0612
2 = 2
4 = 4
C = Standard
X = Flexible
Termination
2 Sig. Digits
+ Number of
Zeros
J = ±5%
K = ±10%
M = ±20%
8 = 10V
4 = 16V
3 = 25V
5 = 50V
1 = 100V
2 = 200V
G = C0G A = N/A C = 100%
Matte Sn
Blank = Bulk
TU = 7" Reel
Unmarked
AUTO = Automotive
Grade
1 All previous reference to metric case dimension "1632" has been replaced with an inch standard reference of "0612". Please reference all new designs using the
"0612" nomenclature. "CA064" replaces "C1632" in the ordering code.
2 0508 case size is only available with the exible termination option. "X" must be used in the 6th character position when ordering this case size. 0612 (1632) case
size is not currently available with the exible termination option."C" must be used in the 6th character position when ordering this case size.
3 Additional termination nish options may be available. Contact KEMET for details.
4 Additional reeling or packaging options may be available. Contact KEMET for details.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 22
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
Applications
Typical applications include those that can benet from board area savings, cost savings and overall volumetric reduction such as
telecommunications, computers, handheld devices and automotive.
Qualication/Certication
Commercial grade products are subject to internal qualication. Details regarding test methods and conditions are referenced in Table
4, Performance and Reliability.
Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test
methods and conditions are referenced in document AEC-Q200, Stress Test Qualication for Passive Components. For additional
information regarding the Automotive Electronics Council and AEC-Q200, please visit their website @www.aecouncil.com.
Environmental Compliance
RoHS compliant.
EIA
Size
Code
Metric
Size
Code
L
Length
W
Width
BW
Bandwidth
BL
Bandlength T
Thickness
P
Pitch
P/2
Reference
0508 1220 1.30 (.051) ±
0.15 (.006)
2.10 (.083) ±
0.15 (.006)
0.53 (.021) ±
0.08 (.003)
0.30 (.012) ±
0.20 (.008) See Table 2 for
Thickness
1.00 (.039) 0.50 (.020) ±
0.10 (.004)
0612 1632 1.60 (.063) ±
0.20 (.008)
3.20 (.126) ±
0.20 (.008)
0.40 (0.06) ±
0.20 (.008)
0.30 (.012) ±
0.20 (.008) 0.80 (.031) 0.40 (.031) ±
0.05 (.002)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 33
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range -55°C to +125°C
Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC) ±30PPM/ºC
Aging Rate (Max % Cap Loss/Decade Hour) 0%
Dielectric Withstanding Voltage 250% of rated voltage
(5 ± 1 seconds and charge/discharge not exceeding 50mA)
Dissipation Factor (DF) Maximum Limit @ 25ºC 0.1%
Insulation Resistance (IR) Limit @ 25°C 1000 megohm microfarads or 100GΩ
(Rated voltage applied for 120 ± 5 secs @ 25°C)
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and Dissipation Factor (DF) measured under the following conditions:
1MHz ± 100kHz and 1.0Vrms ± 0.2V if capacitance ≤1000pF
1kHz ± 50Hz and 1.0Vrms ± 0.2V if capacitance >1000pF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic
Level Control (ALC). The ALC feature should be switched to "ON".
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC Voltage Capacitance Value DF (%) Cap Shift IR
C0G All All 0.5 0.3% or ± 0.25 pF 10% of Initial Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 44
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
Table 2 – Chip Thickness / Packaging Quantities
Thickness
Code
Chip
Size Thickness ±
Range (mm)
Qty per Reel
7" Plastic
Qty per Reel
13" Plastic
Qty per Reel
7" Paper Qty per Reel
13" Paper
Qty per Bulk
Cassette
PA 0508 0.80 ± 0.10 4000 10000 N/A N/A N/A
MA 0612 0.80 ± 0.10 4000 10000 N/A N/A N/A
Table 1 – (0508 - 0612 Case Sizes)
Cap Cap
Code
Series CA052 (0508 Case Size) CA064 (0612 Case Size)
Voltage Code 8 4 3 5 1 8 4 3 5 1 2
Voltage DC 10 16 25 50 100 10 16 25 50 100 200
Cap Tolerance Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
10 pF 100 J K M MA MA MA MA MA MA
12 pF 120 J K M MA MA MA MA MA MA
15 pF 150 J K M MA MA MA MA MA MA
18 pF 180 J K M MA MA MA MA MA MA
22 pF 220 J K M MA MA MA MA MA MA
27 pF 270 J K M MA MA MA MA MA MA
33 pF 330 J K M MA MA MA MA MA MA
39 pF 390 J K M MA MA MA MA MA MA
47 pF 470 J K M MA MA MA MA MA MA
56 pF 560 JK M MA MA MA MA MA MA
68 pF 680 J K M MA MA MA MA MA MA
82 pF 820 J K M MA MA MA MA MA MA
100 pF 101 J K M PA PA PA PA PA MA MA MA MA MA
120 pF 121 J K M PA PA PA PA PA MA MA MA MA MA
150 pF 151 J K M PA PA PA PA PA MA MA MA MA MA
180 pF 181 J K M PA PA PA PA PA MA MA MA MA MA
220 pF 221 J K M PA PA PA PA PA MA MA MA MA
270 pF 271 J K M PA PA PA PA PA MA MA MA MA
330 pF 331 J K M PA PA PA PA PA MA MA MA MA
390 pF 391 J K M PA PA PA PA PA MA MA MA MA
470 pF 471 J K M PA PA PA PA PA MA MA MA MA
560 pF 561 J K M PA PA PA PA PA
680 pF 681 J K M PA PA PA PA PA
820 pF 821 J K M PA PA PA PA PA
1,000 pF 102 J K M PA PA PA PA PA
1,100 pF 112 J K M PA PA PA PA PA
1,200 pF 122 J K M PA PA PA PA PA
1,300 pF 132 J K M PA PA PA PA PA
1,500 pF 152 J K M PA PA PA PA PA
1,600 pF 162 J K M PA PA PA PA PA
1,800 pF 182 J K M PA PA PA PA PA
2,000 pF 202 J K M PA PA PA PA PA
2,200 pF 222 J K M PA PA PA PA PA
Cap Cap
Code
Voltage DC 10 16 25 50 100 10 16 25 50 100 200
Voltage Code 8 4 3 5 1 8 4 3 5 1 2
Series CA052 (0508 Case Size) CA064 (0612 Case Size)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (conguration and dimensions).
These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 55
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
Table 3 – Chip Capacitor Array Land Pattern Design Recommendations per IPC-7351
EIA SIZE
CODE
METRIC
SIZE
CODE
Density Level A:
Maximum (Most) Land
Protrusion (mm)
Density Level B:
Median (Nominal) Land
Protrusion (mm)
Density Level C:
Minimum (Least) Land
Protrusion (mm)
C Y X P V1 V2 C Y X P V1 V2 C Y X P V1 V2
0508/CA052 1220 1.60 1.00 0.55 1.00 3.50 3.30 1.50 0.90 0.50 1.00 2.90 2.80 1.40 0.75 0.45 1.00 2.40 2.50
0612/CA064 1632 1.80 1.10 0.50 0.80 3.90 4.40 1.80 0.95 0.50 0.80 3.30 3.90 1.70 0.85 0.40 0.80 2.80 3.60
Density Level A: For low-density Product applications. Provides a wider process window for reow solder processes. Soldering processes for array type
capacitors.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication
testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
Grid Placem ent Courtyard
V1 Y
C
V2
X
P
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 66
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder reow only
Recommended Soldering Prole:
• KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS-C-6429 Appendix 1, Note: Force of 1.8kg for 60 seconds.
Board Flex JIS-C-6429 Appendix 2, Note: 2mm (min) for all except 3mm for C0G.
Solderability J-STD-002
Magnication 50 X. Conditions:
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
c) Method D, category 3 @ 260°C
Temperature Cycling JESD22 Method JA-104 1000 cycles (-55°C to +125°C), Measurement at 24 hours. +/- 2 hours after test conclusion.
Biased Humidity MIL-STD-202 Method 103
Load Humidity: 1000 hours 85°C/85%RH and Rated Voltage. Add 100K ohm resistor. Measurement
at 24 hours. +/- 2 hours after test conclusion.
Low Volt Humidity: 1000 hours 85°C/85%RH and 1.5V. Add 100K ohm resistor.
Measurement at 24 hours. +/- 2 hours after test conclusion.
Moisture Resistance MIL-STD-202 Method 106
t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered.
Measurement at 24 hours. +/- 2 hours after test conclusion.
Thermal Shock MIL-STD-202 Method 107
-55°C/+125°C. Note: Number of cycles required-300, maximum transfer time-20 seconds, dwell
time-15 minutes. Air-Air.
High Temperature Life
MIL-STD-202 Method 108
/ EIA -198
1000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
Storage Life MIL-STD-202 Method 108 150°C, 0VDC, for 1000 hours.
Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical - OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp, and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC, and maximum storage humidity not exceed
70% relative humidity. In addition, temperature uctuations should be minimized to avoid condensation on the parts, and atmospheres
should be free of chlorine and sulfur bearing compounds. For optimized solderability, chip stock should be used promptly, preferably
within 1.5 years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 77
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers Multilayer Ceramic Chip Capacitors packaged in
8mm, 12mm and 16mm tape on 7" and 13" reels in accordance
with EIA standard 481. This packaging system is compatible with
all tape fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Table 5 – Carrier Tape Con guration (mm)
EIA Case Size Tape size (W)* Pitch (P1)*
01005 - 0402 8 2
0603 - 1210 8 4
1805 - 1808 12 4
≥ 1812 12 8
KPS 1210 12 8
KPS 1812 & 2220 16 12
Array 0508 & 0612 8 4
*Refer to Figure 1 for W and P1 carrier tape reference locations.
*Refer to Table 6 for tolerance speci cations.
8mm, 12mm
or 16mm Carrier Tape
178mm (7.00")
or
330mm (13.00")
Anti-Static Reel
Embossed Plastic* or
Punched Paper Carrier.
Embossment or Punched Cavity
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar Code Label
Sprocket Holes
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 88
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Min.
Note 1 E1P0 P2
R Ref.
Note 2
1
Note 3 T Max. T1 Max.
8mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.0
(0.039)
1.75 ± 0.10
(0.069 ± 0.004)
4.0 ± 0.10
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12mm 1.5
(0.059)
30
(1.181)
16mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Max.
Note 4
E2 Min. F P1 T2 Max W Max A0,B0 & K0
8mm Single (4mm) 4.35
(0.171)
6.25
(0.246)
3.5 ± 0.05
(0.138 ± 0.002)
4.0 ± 0.10
(0.157 ± 0.004)
2.5
(0.098)
8.3
(0.327)
Note 512mm Single (4mm) &
Double (8mm)
8.2
(0.323)
10.25
(0.404)
5.5 ± 0.05
(0.217 ± 0.002)
8.0 ± 0.10
(0.315 ± 0.004)
4.6
(0.181)
12.3
(0.484)
16mm Triple (12mm) 12.1
(0.476)
14.25
(0.561)
5.5 ± 0.05
(0.217 ± 0.002)
8.0 ± 0.10
(0.315 ± 0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 5).
3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A0, B0 and K0 shall surround the component with suf cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4).
(e) for KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket.
(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B
1
is for tape feeder reference only,
including draft concentric about B
o
.
T
2
ØD
1
ØDo
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 5
[10 pitches cumulative
tolerance on tape ±0.2 mm]
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 99
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P
1
ØDo Po
P
2
E
1
F
E
2
W
G
A
0
B
0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T
1
T
1
Bottom Cover Tape
[10 pitches cumulative
tolerance on tape ±0.2 mm]
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0E1P0P2T1Max G Min
R Ref.
Note 2
8mm 1.5 +0.10-0.0
(0.059 +0.004, -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(.004) Max.
0.75
(.030)
25
(.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Min F P1 T Max W Max A0 B0
8mm Half (2mm) 6.25
(0.246)
3.5 ± 0.05
(0.138 ± 0.002)
2.0 ± 0.05
(0.079 ± 0.002)
1.1
(0.098)
8.3
(0.327)
Note 5
8mm Single (4mm)
4.0 ± 0.10
(0.157 ± 0.004)
8.3
(0.327)
1. The cavity de ned by A0, B0 and T shall surround the component with suf cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 5).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 10
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg Minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the
carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16-200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16-56 10
72-200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8mm & 12mm Tape
1.0 mm maximum
1.0 mm maximum
16mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier Punched
Carrier
Tape Width Peel Strength
8mm 0.1 Newton to 1.0 Newton (10gf to 100gf)
12mm & 16mm 0.1 Newton to 1.3 Newton (10gf to 130gf)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 1111
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Min C D Min
8mm 178 ± 0.20
(7.008 ± 0.008)
or
330 ± 0.20
(13.000 ± 0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12mm
16mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Min W1 W2 Max W3
8mm
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
Shall accommodate tape width
without interference
12mm 12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
18.4
(0.724)
16mm 16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm min.)
If present,
tape slot in core
for tape start:
2.5 mm min. width x
10.0 mm min. depth
W3(Includes
flange distortion
at outer edge)
W2(Measured at hub)
W1(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
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SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum,
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm Min.
Leader
400 mm Minimum,
Figure 8 – Maximum Camber
Carrier Tape Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated sprocket holes
(32 mm & wider tapes)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 1313
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
Figure 9 – Bulk Cassette Packaging (Ceramic Chips Only)
Meets Dimensional Requirements IEC-286 and EIAJ 7201
Unit mm *Reference
Table 9 – Capacitor Dimensions for Bulk Cassette
Cassette Packaging – Millimeters
Table 10 – Capacitor Marking
Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to
identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any
Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional – Not Available for 0402 Size)
Example shown is 1,000 pF capacitor
EIA Size
Code
Metric Size
Code
L Length W Width B Bandwidth
S Separation
minimum
T Thickness
Number of
Pcs/Cassette
0402 1005 1.0 ± 0.05 0.5 ± 0.05 0.2 to 0.4 0.3 0.5 ± .05 50,000
0603 1608 1.6 ± 0.07 0.8 ± 0.07 0.2 to 0.5 0.7 0.8 ± .07 15,000
110 ± 0.7
31.5 ± 0
0.2
36 ± 0
0.2
19.0*
5 0*
10*
53 3*
68 ± 0.1
88 ± 0.1
12.0 ± 0.1
3.0 ± 0
0.2
2.0 ± 0.1
0
1.5 ± 0
0.1
N u m e r a l
Alpha
Character
Capacitance (pF) For Various Numeral Identiers
9
0
1
2
3
4
5
6
7
A
0.1
1
10
100
1000
10000
100000
1000000
10000000
B
0.11
1.1
11
110
1100
11000
110000
1100000
11000000
C
0.12
1.2
12
120
1200
12000
120000
1200000
12000000
D
0.13
1.3
13
130
1300
13000
130000
1300000
13000000
E
0.15
1.5
15
150
1500
15000
150000
1500000
15000000
F
0.16
1.6
16
160
1600
16000
160000
1600000
16000000
G
0.18
1.8
18
180
1800
18000
180000
1800000
18000000
H
0.2
2
20
200
2000
20000
200000
2000000
20000000
J
0.22
2.2
22
220
2200
22000
220000
2200000
22000000
K
0.24
2.4
24
240
2400
24000
240000
2400000
24000000
L
0.27
2.7
27
270
2700
27000
270000
2700000
27000000
M
0.3
3
30
300
3000
30000
300000
3000000
30000000
N
0.33
3.3
33
330
3300
33000
330000
3300000
33000000
P
0.36
3.6
36
360
3600
36000
360000
3600000
36000000
Q
0.39
3.9
39
390
3900
39000
390000
3900000
39000000
R
0.43
4.3
43
430
4300
43000
430000
4300000
43000000
S
0.47
4.7
47
470
4700
47000
470000
4700000
47000000
T
0.51
5.1
51
510
5100
51000
510000
5100000
51000000
U
0.56
5.6
56
560
5600
56000
560000
5600000
56000000
V
0.62
6.2
62
620
6200
62000
620000
6200000
62000000
W
0.68
6.8
68
680
6800
68000
680000
6800000
68000000
X
0.75
7.5
75
750
7500
75000
750000
7500000
75000000
Y
0.82
8.2
82
820
8200
82000
820000
8200000
82000000
Z
0.91
9.1
91
910
9100
91000
910000
9100000
91000000
a
0.25
2.5
25
250
2500
25000
250000
2500000
25000000
b
0.35
3.5
35
350
3500
35000
350000
3500000
35000000
d
0.4
4
40
400
4000
40000
400000
4000000
40000000
e
0.45
4.5
45
450
4500
45000
450000
4500000
45000000
f
0.5
5
50
500
5000
50000
500000
5000000
50000000
m
0.6
6
60
600
6000
60000
600000
6000000
60000000
n
0.7
7
70
700
7000
70000
700000
7000000
70000000
t
0.8
8
80
800
8000
80000
800000
8000000
80000000
y
0.9
9
90
900
9000
90000
900000
9000000
90000000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 1414
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
KEMET Corporation
World Headquarters
2835 KEMET Way
Simpsonville, SC 29681
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Corporate Of ces
Fort Lauderdale, FL
Tel: 954-766-2800
North America
Southeast
Lake Mary, FL
Tel: 407-855-8886
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Tel: 978-658-1663
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Tel: 408-433-9950
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Tel: 52-33-3123-2141
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Tel: 41-22-715-0100
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Tel: 33-1-4646-1009
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Tel: 39 -051-939111
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Tel: 39-02-57518176
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Tel: 34-91-804-4303
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Tel: 44-1279-757201
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Tel: 44-1305-830747
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Tel: 44-1236-434455
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Tel: 46-485-563934
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Tel: 358-9-5406-5000
Asia
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Tel: 852-2305-1168
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Tel: 86-755-2518-1306
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Tel: 86-10-5829-1711
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Tel: 86-21-6447-0707
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Tel: 886-2-27528585
Southeast Asia
Singapore
Tel: 65-6586-1900
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Tel: 60-4-6430200
Bangalore, India
Tel: 91-806-53-76817
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 1515
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)
Other KEMET Resources
Disclaimer
All product speci cations, statements, information and data (collectively, the “Information”) are subject to change without notice.
All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we
speci cally disclaim – any warranty concerning suitability for a speci c customer application or use. This Information is intended for use only by customers who have the requisite
experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the
use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.
Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.
Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or
redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not
be required.
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Resource Location
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Search Our FAQs: KnowledgeEdge http://www.kemet.com/keask
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Resource Location
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 8/10/2011 1616
SMD MLCCs – Capacitor Array, C0G Dielectric, 10VDC-200VDC, (Commercial & Automotive Grade)