Microwave Ceramics and Modules Filter for WLAN [5470-5725] MHz Filter B69842N5597A255 Preliminary data Features l SMD filter consisting of coupled resonators with stepped impedances l MgTiO3-CaTiO3 (r = 21 / TCf =010 ppm/K) with a coating of copper (10m) and tin (>5m) l Excellent reflow solderability, no migration effect due to copper/tin metallization Index Page 2 l Component drawing l Recommended footprint Page 3 l Characteristics l Maximum ratings l Typical passband characteristic Page 4 l Processing information l Soldering requirements l Delivery mode ISSUE DATE 16.09.03 ISSUE P2 PUBLISHER MWK M PE PAGE 1/4 Microwave Ceramics and Modules Filter for WLAN [5470-5725] MHz Filter B69842N5597A255 Preliminary data Component drawing S2H11_010601.DWGWMF Recommended footprint I/O G I/O G G FOOTPR_240502.DWGaWMF ISSUE DATE 16.09.03 ISSUE P2 PUBLISHER MWK M PE PAGE 2/4 Microwave Ceramics and Modules Filter for WLAN [5470-5725] MHz Filter B69842N5597A255 Preliminary data Characteristics min. Center frequency fc - Passband IL B 255 Amplitude ripple (peak - peak) Insertion loss Standing wave ratio Impedance Power at DC to 4500 MHz at 5300 MHz at 5900 MHz max. 5597.5 - MHz 1.3 1.6 dB MHz dB SWR 1.5 Z P 50 Attenuation typ. 2.0 W 1.0 35 8 5 40 dB dB dB Maximum ratings IEC climatic category (IEC 68-1) - 40/+ 90/56 Operating temperature Top -40 / + 85 C Typical passband characteristic ISSUE DATE 16.09.03 ISSUE P2 PUBLISHER MWK M PE PAGE 3/4 Microwave Ceramics and Modules Filter for WLAN [5470-5725] MHz Filter B69842N5597A255 Preliminary data Processing information ZNr.: 577 (FILT95_2) l Wettability to IEC 68-2-58: 75% (after aging) Soldering requirements Profile for eutectic SnPb solder paste Profile for leadfree solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) reflow 260 (max. 2 sec.) C 250 (max. 10 sec.) C Recommended soldering conditions (infrared): within 10 sec. Temp. [C] within 10 sec. Temp. [C] 245C5C 215C10C 20-40 sec. 30 sec. Time [sec.] 2.5 C/s 40-80 sec. eutectic SnPb solder paste profile 2-3 min. Time [sec.] > - 5 C/s leadfree solder paste profile Delivery mode l Blister tape acc. to IEC 286-3, PS, grey l Pieces/tape: 4000 t.b.d. EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 16.09.03 ISSUE P2 PUBLISHER MWK M PE PAGE 4/4