Microwave Ceramics and Modules Filter
Filter for WLAN [5470-5725] MHz B69842N5597A255
Prelimi n ary data
ISSUE DATE 16.09.03 ISSUE P2 PUBLISHER MWK M PE PAGE 1/4
Features
lSMD filter consisting of coupled resonators with stepped impedances
lMgTiO3-CaTiO3 (εr = 21 / TCf =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm)
lExcellent reflow solderability, no migrat ion effect due to copper/tin metallization
Index
Page 2 lComponent drawing
lRecommended footprint
Page 3 lCharacteristics
lMaxi mum ra tings
lTypical passband characteristic
Page 4 lProcessing information
lSoldering requirements
lDelivery mode
Microwave Ceramics and Modules Filter
Filter for WLAN [5470-5725] MHz B69842N5597A255
Prelimi n ary data
ISSUE DATE 16.09.03 ISSUE P2 PUBLISHER MWK M PE PAGE 2/4
Component drawing
S2H11_010601.DWG→WMF
Recommended footprint
I/O I/O
G
GG
FOOTPR_240502.DWGàWMF
Microwave Ceramics and Modules Filter
Filter for WLAN [5470-5725] MHz B69842N5597A255
Prelimi n ary data
ISSUE DATE 16.09.03 ISSUE P2 PUBLISHER MWK M PE PAGE 3/4
Characteristics min. typ. max.
Center frequency fc- 5597.5 - MHz
Insertion loss αIL 1.3 1.6 dB
Passband B255 MHz
Amplitude ripple (peak - peak) ∆α dB
Standing wave ratio SWR 1.5 2.0
Impedance
Power Z
P50 1.0 Ω
W
Attenuation
α
at DC to 4500 MHz
at 5300 MHz
at 5900 MHz
35
8
5
40 dB
dB
dB
Maximum ratings
IEC climatic category (IEC 68-1) - 40/+ 90/56
Operating temperature Top -40 / + 85 °C
Typical passband characteristic
Microwave Ceramics and Modules Filter
Filter for WLAN [5470-5725] MHz B69842N5597A255
Prelimi n ary data
ISSUE DATE 16.09.03 ISSUE P2 PUBLISHER MWK M PE PAGE 4/4
Processing information ZNr.: 577 (FILT95_2)
lW ettability t o IEC 68-2-58: ≥ 75% (after aging)
Soldering requirements Profile for eutectic
SnPb solder paste Profile for leadfree
solder paste
Soldering type reflow reflow
Maximum solderin
g
tem
p
erature 235
(
max. 2 sec.
)
260
(
max. 2 sec.
)
°C
(measuring point on top surface of the component) 225 (max. 10 sec.) 250 (max. 10 sec.) °C
Recommended soldering conditions (infrared):
20-40 sec.
40-80 sec.
within 10 sec.
Time [sec.]
Temp. [°C]
215°C±10°C
30 sec.
2-3 min.
within 10 sec.
Time [sec.]
Temp. [°C]
245°C±5°C
2.5 °C/s > - 5 °C/s
eutectic SnPb solder paste profile leadfr ee solder paste profile
Deliver y mode
lBlister t ape acc. to IEC 286-3, PS, grey
lPieces/tape: 4000
t.b.d.
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto
and the inform ation contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed
characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the
Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers'
Association), unless otherwise agreed.
