Revision Date: Mar. 18, 2009
16 H8S/2368 Group
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer
H8S Family/H8S/2300 Series
H8S/2368F HD64F2368
H8S/2367F HD64F2367
H8S/2365 HD6432365
H8S/2364F HD64F2364
H8S/2363 HD6412363
H8S/2362F HD64F2362
H8S/2361F HD64F2361
H8S/2360F HD64F2360
Rev.6.00
REJ09B0050-0600
The revision list can be viewed directly by clicking the title page.
The revision list summarizes the locations of revisions and
additions. Details should always be checked by referring to the
relevant text.
Rev.6.00 Mar. 18, 2009 Page ii of lviii
REJ09B0050-0600
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
Renesas products for their use. Renesas neither makes warranties or representations with respect to the
accuracy or completeness of the information contained in this document nor grants any license to any
intellectual property rights or any other rights of Renesas or any third party with respect to the information in
this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising
out of the use of any information in this document, including, but not limited to, product data, diagrams, charts,
programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military
applications such as the development of weapons of mass destruction or for the purpose of any other military
use. When exporting the products or technology described herein, you should follow the applicable export
control laws and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and
application circuit examples, is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas products listed in this
document, please confirm the latest product information with a Renesas sales office. Also, please pay regular
and careful attention to additional and different information to be disclosed by Renesas such as that disclosed
through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas
assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information
included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in
light of the total system before deciding about the applicability of such information to the intended application.
Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any
particular application and specifically disclaims any liability arising out of the application and use of the
information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas
products are not designed, manufactured or tested for applications or otherwise in systems the failure or
malfunction of which may cause a direct threat to human life or create a risk of human injury or which require
especially high quality and reliability such as safety systems, or equipment or systems for transportation and
traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication
transmission. If you are considering the use of our products for such purposes, please contact a Renesas
sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who
elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas
Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect
to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or
damages arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific
characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use
conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and
injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for
hardware and software including but not limited to redundancy, fire control and malfunction prevention,
appropriate treatment for aging degradation or any other applicable measures. Among others, since the
evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or
system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas
products are attached or affixed, the risk of accident such as swallowing by infants and small children is very
high. You should implement safety measures so that Renesas products may not be easily detached from your
products. Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written
approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this
document, Renesas semiconductor products, or if you have any other inquiries.
Notes regarding these materials
Rev.6.00 Mar. 18, 2009 Page iii of lviii
REJ09B0050-0600
General Precautions in the Handling of MPU/MCU Products
The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes
on the products covered by this manual, refer to the relevant sections of the manual. If the descriptions under
General Precautions in the Handling of MPU/MCU Products and in the body of the manual differ from each
other, the description in the body of the manual takes precedence.
1. Handling of Unused Pins
Handle unused pins in accord with the directions given under Handling of Unused Pins in
the manual.
⎯ The input pins of CMOS products are generally in the high-impedance state. In
operation with an unused pin in the open-circuit state, extra electromagnetic noise is
induced in the vicinity of LSI, an associated shoot-through current flows internally, and
malfunctions may occur due to the false recognition of the pin state as an input signal.
Unused pins should be handled as described under Handling of Unused Pins in the
manual.
2. Processing at Power-on
The state of the product is undefined at the moment when power is supplied.
⎯ The states of internal circuits in the LSI are indeterminate and the states of register
settings and pins are undefined at the moment when power is supplied.
In a finished product where the reset signal is applied to the external reset pin, the
states of pins are not guaranteed from the moment when power is supplied until the
reset process is completed.
In a similar way, the states of pins in a product that is reset by an on-chip power-on
reset function are not guaranteed from the moment when power is supplied until the
power reaches the level at which resetting has been specified.
3. Prohibition of Access to Reserved Addresses
Access to reserved addresses is prohibited.
⎯ The reserved addresses are provided for the possible future expansion of functions. Do
not access these addresses; the correct operation of LSI is not guaranteed if they are
accessed.
4. Clock Signals
After applying a reset, only release the reset line after the operating clock signal has
become stable. When switching the clock signal during program execution, wait until the
target clock signal has stabilized.
⎯ When the clock signal is generated with an external resonator (or from an external
oscillator) during a reset, ensure that the reset line is only released after full stabilization
of the clock signal. Moreover, when switching to a clock signal produced with an
external resonator (or by an external oscillator) while program execution is in progress,
wait until the target clock signal is stable.
5. Differences between Products
Before changing from one product to another, i.e. to one with a different type number,
confirm that the change will not lead to problems.
⎯ The characteristics of MPU/MCU in the same group but having different type numbers
may differ because of the differences in internal memory capacity and layout pattern.
When changing to products of different type numbers, implement a system-evaluation
test for each of the products.
Rev.6.00 Mar. 18, 2009 Page iv of lviii
REJ09B0050-0600
Configuration of This Manual
This manual comprises the following items:
1. General Precautions in the Handling of MPU/MCU Products
2. Configuration of This Manual
3. Preface
4. Main Revisions for This Edition
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
5. Contents
6. Overview
7. Description of Functional Modules
• CPU and System-Control Modules
• On-Chip Peripheral Modules
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
8. List of Registers
9. Electrical Characteristics
10. Appendix
11. Index
Rev.6.00 Mar. 18, 2009 Page v of lviii
REJ09B0050-0600
Preface
The H8S/2368 Group are microcomputers (MCU) made up of the H8S/2600 CPU employing
Renesas Technology’s original architecture as their cores, and the peripheral functions required to
configure a system.
The H8S/2600 CPU has an internal 32-bit configuration, sixteen 16-bit general registers, and a
simple and optimized instruction set for high-speed operation. The H8S/2600 CPU can handle a
16-Mbyte linear address space.
This LSI is equipped with direct memory access controller (DMAC) and data transfer controller
(DTC) bus masters, ROM and RAM, a 16-bit timer pulse unit (TPU), a programmable pulse
generator (PPG), 8-bit timers (TMR), a watchdog timer (WDT), serial communication interfaces
(SCI and IrDA), a 10-bit A/D converter, an 8-bit D/A converter, and I/O ports as on-chip
peripheral modules required for system configuration. I2C bus interface 2 (IIC2) can also be
included as an optional interface.
A high-functionality bus controller is also provided, enabling fast and easy connection of DRAM
and other kinds of memory.
A single-power flash memory (F-ZTAT™) version is available for this LSI's ROM. This provides
flexibility as it can be reprogrammed in no time to cope with all situations from the early stages of
mass production to full-scale mass production. This is particularly applicable to application
devices with specifications that will most probably change.
Note: F-ZTAT is a trademark of Renesas Technology Corp.
Target Users: This manual was written for users who will be using the H8S/2368 Group in the
design of application systems. Target users are expected to understand the
fundamentals of electrical circuits, logical circuits, and microcomputers.
Objective: This manual was written to explain the hardware functions and electrical
characteristics of the H8S/2368 Group to the target users.
Refer to the H8S/2600 Series, H8S/2000 Series Software Manual for a detailed
description of the instruction set.
Notes on reading this manual:
• In order to understand the overall functions of the chip
Read the manual according to the contents. This manual can be roughly categorized into parts
on the CPU, system control functions, peripheral functions and electrical characteristics.
Rev.6.00 Mar. 18, 2009 Page vi of lviii
REJ09B0050-0600
• In order to understand the details of the CPU's functions
Read the H8S/2600 Series, H8S/2000 Series Software Manual.
For the execution state of each instruction in this LSI, see appendix D, Bus State during
Execution of Instructions.
• In order to understand the details of a register when its name is known
Read the index that is the final part of the manual to find the page number of the entry on the
register. The addresses, bits, and initial values of the registers are summarized in section 24,
List of Registers.
Examples: Register name: The following notation is used for cases when the same or a
similar function, e.g. 16-bit timer pulse unit or serial
communication, is implemented on more than one channel:
XXX_N (XXX is the register name and N is the channel
number)
Bit order: The MSB is on the left and the LSB is on the right.
Number notation: Binary is B'xxxx, hexadecimal is H'xxxx, decimal is xxxx
Signal notation: An overbar is added to a low-active signal: xxxx
Related Manuals: The latest versions of all related manuals are available from our web site.
Please ensure you have the latest versions of all documents you require.
http://www.renesas.com/
H8S/2368 Group Manuals:
Document Title Document No.
H8S/2368 Group Hardware Manual This manual
H8S/2600 Series, H8S/2000 Series Software Manual REJ09B0139
User's Manuals for Development Tools:
Document Title Document No.
H8S, H8/300 Series C/C++ Compiler, Assembler, Optimizing Linkage
Editor Compiler Package Ver.6.01 User's Manual
REJ10B0161
H8S, H8/300 Series Simulator/Debugger User's Manual REJ10B0211
H8S, H8/300 Series High-performance Embedded Workshop, V.3 Tutorial REJ10B0024
High-performance Embedded Workshop V.4.04 User's Manual REJ10J1737
Rev.6.00 Mar. 18, 2009 Page vii of lviii
REJ09B0050-0600
Main Revisions for This Edition
Item Page Revision (See Manual for Details)
1.3.3 Pin Functions
Table 1.2 Pin Functions
14 Table amended
Pin No.
Type
Symbol TFP-120 QFP-128*
1
I/O
Function
V
cc
2, 33*
2
, 60,
83, 84
6,39,66,
91,92
Input Power supply pins. V
CC
pins should
be connected to the system power
supply.
V
ss
8, 17, 22,
58, 80, 87
3,4,12,21,
26,35,36,
64,68,88,
95,99,100
Input Ground pins. V
SS
pins should be
connected to the system power
supply (0 V).
PLLV
CC
76 84 Input Power supply pin for the on-chip PLL
oscillator.
Power Supply
PLLV
SS
78 86 Input Ground pin for the on-chip PLL
oscillator.
VCL 33*
3
Input Connect to V
SS
via a 0.1 µF
(recommended value) capacitor
(placed close to the pin).
20 Note 1 amended and Notes 2 and 3 added
Notes: 1. Not supported by the H8S/2368 0.18 μm F-ZTAT
Group.
2. VCL on the H8S/2368 0.18 µm F-ZTAT Group. Do not
connect to VCL.
3. H8S/2368 0.18 µm F-ZTAT Group only.
Rev.6.00 Mar. 18, 2009 Page viii of lviii
REJ09B0050-0600
Item Page Revision (See Manual for Details)
3.4 Memory Map in Each
Operating Mode
Figure 3.2 H8S/2368F
Memory Map (2)
64 Figure amended
ROM: 512 kbytes
RAM: 32 kbytes
Mode 5
(User boot mode)
H'000000
H'FFFC00
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000H'080000
External address
space/
reserved area*
2
*
4
H'FF4000
H'FFC000
H'FFD000
*
5
Reserved area*
4
External address space/
reserved area
*
2
*
4
External address space/
reserved area
*
2
*
4
Internal I/O registers
Internal I/O registers
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. When EXPE = 1, external address space with RAME = 0, on-chip RAM with RAME = 1.
When EXPE = 0, on-chip RAM.
H'FF4000
H'FFC000
H'FFD000
Reserved area*
4
ROM: 512 kbytes
RAM: 32 kbytes
Mode 4
(Expanded mode with
on-chip ROM enabled)
H'000000
H'FFFC00
On-chip ROM On-chip ROM
H'FFFFFF
H'FFFF00
H'FFFF20
External address
space
Internal I/O registers
Internal I/O registers
External address space
External address space
On-chip RAM/
external address
space*
1
On-chip RAM
4. A reserved area should not be accessed.
5. The on-chip RAM is used to program the flash memory. The RAME bit in SYSCR should not be cleared to 0.
ROM: 512 kbytes
RAM: 32 kbytes
Mode 7
(Single-chip activation
expanded mode,
with on-chip ROM enabled)
H'000000
H'FFFC00
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000
External address
space/
reserved area*
2
*
4
H'FF4000
H'FFC000
H'FFD000
*
3
Reserved area*
4
External address space/
reserved area
*
2
*
4
External address space/
reserved area
*
2
*
4
Internal I/O registers
Internal I/O registers
On-chip ROM
On-chip RAM/
external address
space
Rev.6.00 Mar. 18, 2009 Page ix of lviii
REJ09B0050-0600
Item Page Revision (See Manual for Details)
3.4 Memory Map in Each
Operating Mode
Figure 3.5 H8S/2364F
Memory Map (1)
67 Figure amended
RAM: 32 kbytes
Modes 1 and 2
(Expanded mode with
on-chip ROM disabled)
ROM: 384 kbytes
RAM: 32 kbytes
Mode 3
(Boot mode)
H'000000
H'FF4000
H'FFC000
H'FFD000
H'000000
H'FFFC00
External address
space
On-chip RAM/
external address
space*
1
On-chip RAM*
3
External address space
External address space
Internal I/O registers
On-chip ROM
Reserved area*
4
H'FFFFFF
H'FFFC00
H'FFFF00
H'FFFF20
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000
H'060000
External address
space/
reserved area*
2
*
4
Reserved area*
4
H'FF4000
H'FFC000
H'FFD000
Reserved area*
4
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. On-chip RAM is used for flash memory programming. The RAME bit in SYSCR should not be cleared to 0.
4. A reserved area should not be accessed.
Internal I/O registers
Internal I/O registers
Internal I/O registers
External address space/
reserved area*
2
*
4
External address space/
reserved area*
2
*
4
7.3.7 DMA Terminal
Control Register
(DMATCR)
240 Description amended
In short address mode, the TEND pin is only available for
channel B.
8.8.5 Chain Transfer 321 Description amended
When chain transfer is used, clearing of the activation source or
DTCER is performed when the last of the chain of data transfers
is executed. SCI and A/D converter
interrupt/activation sources, on the other hand, are cleared when
the DTC reads or writes to the prescribed register.
Rev.6.00 Mar. 18, 2009 Page x of lviii
REJ09B0050-0600
Item Page Revision (See Manual for Details)
9.8.8 Pin Functions 370 Table amended
• PA7/A23/CS7/IRQ7
PA7DDR 0 1 0 1 0 1 0 1 0 1 0 1
PA7
input
PA7
output
PA7
input
CS7
output
PA7
output
Address
output
PA7
input
PA7
output
PA7
input
PA7
output
PA7
input
CS7
output
PA7
input
Address
output
Pin function
IRQ7 interrupt input*
371
• PA6/A22/IRQ6, PA5/A21/IRQ5
PAnDDR 0 0 0 0 0
PAn
input
PAn
output
PAn
input
Address
output
PAn
input
PAn
output
PAn
input
PAn
output
PAn
input
Address
output
Pin function
IRQn interrupt input*
11 111
372
• PA3/A19, PA2/A18, PA1/A17, PA0/A16
Pin function Address
output
PAn
input
PAn
output
PAn
input
Address
output
PAn
input
PAn
output
PAn
input
PAn
output
PAn
input
Address
output
9.9.5 Pin Functions 375 Table amended
• PB7/A15, PB6/A14, PB5/A13, PB4/A12, PB3/A11, PB2/A10,
PB1/A9, PB0/A8
PBnDDR — 0 01011
Pin function Address
output
PBn input Address
output
PBn input PBn output PBn input Address
output
9.10.5 Pin Functions 379 Table amended
• PC7/A7, PC6/A6, PC5/A5, PC4/A4, PC3/A3, PC2/A2,
PC1/A1, PC0/A0
PCnDDR — 0 1 0 1 10
Pin function Address
output
PCn input Address
output
PCn input PCn output PCn input Address
output
9.11.5 Pin Functions 383 Table amended
• PD7/D15, PD6/D14, PD5/D13, PD4/D12, PD3/D11, PD2/D10,
PD1/D9, PD0/D8
PDnDDR — 10—
Pin function Data I/O PDn input PDn output Data I/O
9.12.5 Pin Functions 387 Table amended
• PE7/D7, PE6/D6, PE5/D5, PE4/D4, PE3/D3, PE2/D2,
PE1/D1, PE0/D0
PEnDDR 0 1 — 0 1 0 1 —
Pin function PEn input PEn
output
Data I/O PEn input PEn
output
PEn input PEn
output
Data I/O
Rev.6.00 Mar. 18, 2009 Page xi of lviii
REJ09B0050-0600
Item Page Revision (See Manual for Details)
9.13.4 Pin Functions 391 Table amended
• PF7/φ
(Before) PFDDR → (After) PF7DDR
393 Table amended
• PF1/CS5/UCAS
PF1DDR — 0 1 0 1 0 1 — 0101
Pin function UCAS
output
PF1
input
CS5
output
PF1
input
PF1
output
PF1
input
PF1
output
UCAS
output
PF1
input
CS5
output
PF1
input
PF1
output
14.3.7 Serial Status
Register (SSR)
Normal Serial
Communication Interface
Mode (When SMIF in
SCMR is 0)
558 Note amended
Note: * Only 0 can be written, to clear the flag. Alternately,
use the bit clear instruction to clear the flag.
Smart Card Interface
Mode (When SMIF in
SCMR is 1)
562 Note amended
Notes: 1. Only 0 can be written, to clear the flag. Alternately,
use the bit clear instruction to clear the flag.
2. etu: Elementary Time Unit: (time for transfer of 1
bit)
14.3.9 Bit Rate Register
(BRR)
Table 14.3 BRR Settings
for Various Bit Rates
(Asynchronous Mode)
565 Table amended
Operating Frequency φ
φ
(MHz)
8 9.8304 10 12
Bit Rate
(bit/s) n N
Error
(%) n N
Error
(%) n N
Error
(%) n N
Error
(%)
9600 0 25 0.16 0 31 0.00 0 32 –1.36 0 38 0.16
19200 0 12 0.16 0 15 0.00 0 15 –1.73 0 19 –2.34
31250 0 7 0.00 0 9 –1.70 0 9 0.00 0 11 0.00
38400 — — — 0 7 0.00 0 7 –1.73 0 9 –2.34
Operating Frequency
φ
(MHz)
12.288 14 14.7456 16
Bit Rate
(bit/s) n N
Error
(%) n N
Error
(%) n N
Error
(%) n N
Error
(%)
9600 0 39 0.00 0 45 –0.93 0 47 0.00 0 51 0.16
19200 0 19 0.00 0 22 –0.93 0 23 0.00 0 25 0.16
31250 0 11 2.40 0 13 0.00 0 14 –1.70 0 15 0.00
38400 0 9 0.00 — — — 0 11 0.00 0 12 0.16
Rev.6.00 Mar. 18, 2009 Page xii of lviii
REJ09B0050-0600
Item Page Revision (See Manual for Details)
14.3.9 Bit Rate Register
(BRR)
Table 14.3 BRR Settings
for Various Bit Rates
(Asynchronous Mode)
566 Table amended
Operating Frequency φ
φ
(MHz)
17.2032 18 19.6608 20
Bit Rate
(bit/s) n N
Error
(%) n N
Error
(%) n N
Error
(%) n N
Error
(%)
19200 0 27 0.00 0 28 1.02 0 31 0.00 0 32 –1.36
31250 0 16 1.20 0 17 0.00 0 19 –1.70 0 19 0.00
38400 0 13 0.00 0 14 –2.34 0 15 0.00 0 15 1.73
Operating Frequency
φ
(MHz)
25 30 33 34*
Bit Rate
(bit/s) n N
Error
(%) n N
Error
(%) n N
Error
(%) n N
Error
(%)
19200 0 40 –0.76 0 48 –0.35 0 53 –0.54 0 54 0.62
31250 0 24 0.00 0 29 0 0 32 0 0 33 0.00
38400 0 19 1.73 0 23 1.73 0 26 –0.54 0 27 –1.18
14.4.4 SCI Initialization
(Asynchronous Mode)
580 Description amended
... Do not write to SMR, SCMR, IrCR, or SEMR while the SCI is
operating. This also applies to writing the same data as the
current register contents. ...
14.6.2 SCI Initialization
(Clocked Synchronous
Mode)
596 Description amended
... Do not write to SMR, SCMR, IrCR, or SEMR while the SCI is
operating. This also applies to writing the same data as the
current register contents. ...
Section 15 I2C Bus
Interface2 (IIC2) (Option)
629 Description amended
The I2C bus interface conforms to and provides a subset of the
NXP Semiconductors I2C bus (inter-IC bus) interface (Rev.03)
standard and fast mode functions. The register configuration that
controls the I2C bus differs partly from the NXP Semiconductors
configuration, however.
Rev.6.00 Mar. 18, 2009 Page xiii of lviii
REJ09B0050-0600
Item Page Revision (See Manual for Details)
15.3.1 I2C Bus Control
Register A (ICCRA)
Table 15.2 Transfer Rate
634 Note amended
Notes: 2. Does not conform to the I2C bus interface
specification (standard mode: max. 100 kHz, fast
mode: max. 400 kHz).
15.3.5 I2C Bus Status
Register (ICSR)
639 Table amended
Bit Bit Name Initial Value R/W Description
7 TDRE 0 R/W Transmit Data Register Empty
[Setting conditions]
• When data is transferred from ICDRT to ICDRS and
ICDRT becomes empty
• When TRS is set
• When a transition from receive mode to transmit mode is
made in slave mode
[Clearing conditions]
• When 0 is written in TDRE after reading TDRE = 1
• When data is written to ICDRT
15.4.5 Slave Receive
Operation
Figure 15.12 Slave
Receive Mode Operation
Timing 2
652 Figure amended
ICDRS
ICDRR
12345678 99
A
A
RDRF
SCL
(master output)
SDA
(master output)
SDA
(slave output)
SCL
(slave output)
User
processing
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Data 1
[7] Set ACKBT [8] Read ICDRR,
and clear RDRF.
[10] Read ICDRR,
and clear RDRF.
Data 2
Data 1
15.4.7 Example of Use
Figure 15.14 Sample
Flowchart for Master
Transmit Mode
654 Figure amended
BBSY=0 ?
No
Yes
Start
[1]
[2]
[3]
Initialize
Set MST = 1 and TRS
= 1 in ICCRA.
Write BBSY = 1
and SCP = 0.
Read BBSY in ICCRB [1] Test the status of the SCL and SDA lines.*
[2] Select master transmit mode.*
[3] Start condition issuance.*
[4] Select transmit data for the first byte (slave address + R/W),
and clear TDRE to 0.
Note: * Ensure that no interrupts occur between
when BBSY is cleared to 0 and start condition [3].
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15.4.7 Example of Use
Figure 15.15 Sample
Flowchart for Master
Receive Mode
655 Figure amended
RDRF=1 ?
No
Yes
Read ICDRR
Read RDRF in ICSR
Write BBSY = 0
and SCP = 0
Read STOP of ICSR
Read ICDRR
Set RCVD = 0 (ICCRA)
Set MST = 0 (ICCRA)
End
STOP=1 ?
No
Yes
[15] Clear ACKBT.
[16] Set slave receive mode.
[8]
Clear STOP of ICSR
[10]
[9]
[11]
[12]
[13]
[14]
[16]
Note: * Prevent any interrupts while steps [1] to [3] are executed.
Additional information: When receiving one-byte data, execute step [1], and then step [7] omitting steps [2] to [6].
In step [8], dummy read ICDRR.
Clear ACKBT of ICIER
[15]
Figure 15.17 Sample
Flowchart for Slave
Receive Mode
657 Figure amended
Yes
Yes
RDRF=1 ?
Slave receive mode
Clear AAS in ICSR
Set ACKBT=0 in ICIER
Dummy read ICDRR
Read RDRF in ICSR
No
No
No
[1]
[2]
[3]
[4]
TDRE=0 ?
RDRF= 1?
Slave transmit mode
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15.7 Usage Notes
3. I2C bus interface 2
(IIC2) master receive
mode
4. Limitations on transfer
rate setting values when
using I2C bus interface 2
(IIC2) in multi-master
mode
5. Limitations on use of
bit manipulation
instructions to set MST
and TRS when using I2C
bus interface 2 (IIC2) in
multi-master mode
660 Description added
16.1 Features
Figure 16.1 Block
Diagram of A/D Converter
662 Figure amended
10-bit D/A
AVCC
Vref
AVSS
20.3.2 Programming/
Erasing Interface
Parameter
735 Description amended
… The return value of the processing result is written in ER0,
ER1. Since the stack area is used for storing the registers except
for ER0, ER1, the stack area must be saved at the processing
start.
20.3.3 Flash Vector
Address Control Register
(FVACR)
747 Description amended
… Normally the vector table data is read from the address
spaces from H'00001C to H'00001F.
20.4.2 User Program
Mode
(2) Programming
Procedure in User
Program Mode
757 Description amended
The notes on download are as follows.
⎯ In the download processing, the values of CPU general
registers other than ER0 and ER1 are retained.
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20.8 Serial
Communication Interface
Specification for Boot
Mode
(4) Inquiry and Selection
States
788 Description amended
(b) Device Selection
…
• Size (one byte): Amount of device-code data
This is fixed at 4
Figure 20.21
Programming Sequence
801 Description deleted
(Before) Programming selection (H'42, H'43, H'44)
(After) Programming selection (H'42, H'43)
(9) Programming
/
Erasing
State
• Programming
(b) 128-byte
programming
802 Description amended
• Programming Address (four bytes): Start address for
programming
Multiple of the size specified in response to the programming
unit inquiry
(i.e. H'00, H'01, H'00, H'00 : H'00010000)
24.2 Register Bits 855 Table amended
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3
DRACCR DRMI — TPC1 TPC0 —
25.1.2 DC
Characteristics
Table 25.2 DC
Characteristics (1)
874 Table amended
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
VT
–
V
CC
× 0.2 — — V
VT
+
—— V
CC
× 0.7 V
Schmitt
trigger input
voltage
Ports 1, 2, and 4*
2
,
P50 to P53*
2
,
PA4 to PA7*
2
VT
+
– VT
–
V
CC
× 0.07 — — V
Input high
voltage
STBY,
MD2 to MD0
V
IH
V
CC
× 0.9 — V
CC
+0.3 V
RES, NMI, EMLE V
CC
× 0.9 — V
CC
+0.3 V
EXTAL V
CC
× 0.7 — V
CC
+0.3 V
Port 3,
P50 to P53*
3
, port
8, ports A to G*
3
2.2V — V
CC
+0.3 V
Ports 4 and 9 2.2V — V
CC
+0.3 V
Input low
voltage
RES, STBY,
MD2 to MD0,
EMLE
V
IL
–0.3 — V
CC
× 0.1 V
NMI, EXTAL –0.3 — V
CC
× 0.2 V
Ports 3 to 5*
3
, 8, 9,
A to G*
3
–0.3 — V
CC
× 0.2 V
Output high All output pins V
OH
V
CC
–0.5 — — V I
OH
= –200 µA
voltage V
CC
–1.0 — — V I
OH
= –1 mA
All output pins V
OL
— — 0.4 V I
OL
= 1.6 mA Output low
voltage P32 to P35*
4
— — 0.5 V I
OL
= 8.0 mA
Note added
Notes: 4. When used as SCL0 to SCL1, SDA0 to SDA1.
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25.1.2 DC
Characteristics
Table 25.4 Permissible
Output Currents
876 Table amended
Item Symbol Min Typ Max Unit
SCL0, 1, SDA0, 1 ⎯⎯8.0
Permissible output low
current (per pin) Output pins other
than the above
I
OL
⎯2.0
mA
⎯
25.2.2 DC
Characteristics
Table 25.14 DC
Characteristics (1)
912 Table amended
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
VT
–
V
CC
× 0.2 — — V
VT
+
—— V
CC
× 0.7 V
Schmitt
trigger input
voltage
Ports 1, 2, and 4*
2
,
P50 to P53*
2
,
PA4 to PA7*
2
VT
+
– VT
–
V
CC
× 0.07 — — V
Input high
voltage
STBY,
MD2 to MD0
V
IH
V
CC
× 0.9 — V
CC
+0.3 V
RES, NMI, EMLE V
CC
× 0.9 — V
CC
+0.3 V
EXTAL V
CC
× 0.7 — V
CC
+0.3 V
Port 3,
P50 to P53*
3
, port
8, ports A to G*
3
V
CC
× 0.7 — V
CC
+0.3 V
Ports 4 and 9 AV
CC
× 0.7 — AV
CC
+0.3 V
Input low
voltage
RES, STBY,
MD2 to MD0,
EMLE
V
IL
–0.3 — V
CC
× 0.1 V
NMI, EXTAL –0.3 — V
CC
× 0.2 V
Ports 3 to 5*
3
, 8, 9,
A to G*
3
–0.3 — V
CC
× 0.2 V
Output high
voltage
All output pins V
OH
V
CC
–0.5 — — V I
OH
= –200 μA
V
CC
–1.0 — — V I
OH
= –1 mA
All output pins — — 0.4 V I
OL
= 1.6 mA Output low
voltage P32 to P35*
4
V
OL
— — 0.5 V I
OL
= 8.0 mA
Note added
Notes: 4. When used as SCL0 to SCL1, SDA0 to SDA1.
Table 25.16 Permissible
Output Currents
914 Table amended
Item Symbol Min Typ Max Unit
SCL0 to SCL1, SDA0 to SDA1 — — 8.0
Permissible output low
current (per pin) Output pins other than the above
IOL
— — 2.0
mA
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25.3.2 DC
Characteristics
Table 25.27 DC
Characteristics
927 Table amended
Item Symbol
VT
−
VT
+
Schmitt
trigger input
voltage
Port 1, 2, 4*
2
, P50
to P53*
2
, PA4 to
PA7*
2
VT
+
−
VT
−
Input high
voltage
STBY,
MD2 to MD0
V
IH
RES, NMI, FWE
EXTAL
Port 3,
P50 to P53*
3
, port
8*
3
, ports A to G*
3
Port 4, Port 9
Input low
voltage
RES, STBY,
MD2 to MD0,
EMLE
V
IL
NMI, EXTAL
Ports 3 to 5*
3
,
port 8, port 9,
ports A to G*
3
All output pins V
OH
Output high
voltage
All output pins V
OL
Output low
voltage P32 to P35*
4
Note amended
Notes: 2. When used as IRQ0 to IRQ7.
3. When used as other than IRQ0 to IRQ7
Table 25.28 DC
Characteristics
928 Table amended
Item
RES
STBY, NMI,
MD2 to MD0
Input
leakage
current
Port 4, Port 9
Three-state
leakage
current
(off state)
Ports 1 to 3,
P50 to P53,
port 8,
ports A to G
Table 25.29 Permissible
Output Currents
929 Table amended
Item
SCL0 to SCL1, SDA0 to SDA1
Permissible output low
current (per pin) Output pins other than the above
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25.3.3 AC
Characteristics
930 Description deleted
(Before) The clock, control signal, bus, DMAC, and …
(After) The clock, control signal, bus, DMAC, and …
25.3.3 AC
Characteristics
Table 25.33 Bus Timing
(2)
935 Table amended
Item Symbol Min.
WAIT hold time t
WTH
5
Rev.6.00 Mar. 18, 2009 Page xx of lviii
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All trademarks and registered trademarks are the property of their respective owners.
Rev.6.00 Mar. 18, 2009 Page xxi of lviii
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Contents
Section 1 Overview............................................................................................................. 1
1.1 Features............................................................................................................................. 1
1.2 Block Diagram .................................................................................................................. 3
1.3 Pin Description.................................................................................................................. 5
1.3.1 Pin Arrangement .................................................................................................. 5
1.3.2 Pin Arrangement in Each Operating Mode.......................................................... 8
1.3.3 Pin Functions ....................................................................................................... 14
Section 2 CPU ...................................................................................................................... 21
2.1 Features............................................................................................................................. 21
2.1.1 Differences between H8S/2600 CPU and H8S/2000 CPU .................................. 22
2.1.2 Differences from H8/300 CPU............................................................................. 23
2.1.3 Differences from H8/300H CPU.......................................................................... 23
2.2 CPU Operating Modes...................................................................................................... 24
2.2.1 Normal Mode....................................................................................................... 24
2.2.2 Advanced Mode................................................................................................... 26
2.3 Address Space................................................................................................................... 28
2.4 Register Configuration...................................................................................................... 29
2.4.1 General Registers................................................................................................. 30
2.4.2 Program Counter (PC) ......................................................................................... 31
2.4.3 Extended Control Register (EXR) ....................................................................... 31
2.4.4 Condition-Code Register (CCR).......................................................................... 32
2.4.5 Initial Register Values.......................................................................................... 34
2.5 Data Formats..................................................................................................................... 34
2.5.1 General Register Data Formats ............................................................................ 34
2.5.2 Memory Data Formats ......................................................................................... 36
2.6 Instruction Set ................................................................................................................... 37
2.6.1 Table of Instructions Classified by Function ....................................................... 38
2.6.2 Basic Instruction Formats .................................................................................... 47
2.7 Addressing Modes and Effective Address Calculation..................................................... 49
2.7.1 Register Direct—Rn............................................................................................. 49
2.7.2 Register Indirect—@ERn .................................................................................... 49
2.7.3 Register Indirect with Displacement—@(d:16, ERn) or @(d:32, ERn).............. 50
2.7.4 Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @-ERn .. 50
2.7.5 Absolute Address—@aa:8, @aa:16, @aa:24, or @aa:32.................................... 50
2.7.6 Immediate—#xx:8, #xx:16, or #xx:32................................................................. 51
2.7.7 Program-Counter Relative—@(d:8, PC) or @(d:16, PC).................................... 51
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2.7.8 Memory Indirect—@@aa:8 ................................................................................ 51
2.7.9 Effective Address Calculation ............................................................................. 52
2.8 Processing States............................................................................................................... 55
2.9 Usage Note........................................................................................................................ 56
2.9.1 Note on Bit Manipulation Instructions................................................................. 56
Section 3 MCU Operating Modes .................................................................................. 57
3.1 Operating Mode Selection ................................................................................................ 57
3.2 Register Descriptions........................................................................................................ 58
3.2.1 Mode Control Register (MDCR) ......................................................................... 58
3.2.2 System Control Register (SYSCR)...................................................................... 58
3.3 Operating Mode Descriptions ........................................................................................... 60
3.3.1 Mode 1................................................................................................................. 60
3.3.2 Mode 2................................................................................................................. 60
3.3.3 Mode 3................................................................................................................. 60
3.3.4 Mode 4................................................................................................................. 60
3.3.5 Mode 5................................................................................................................. 61
3.3.6 Mode 7................................................................................................................. 61
3.3.7 Pin Functions ....................................................................................................... 62
3.4 Memory Map in Each Operating Mode ............................................................................ 63
Section 4 Exception Handling ......................................................................................... 79
4.1 Exception Handling Types and Priority............................................................................ 79
4.2 Exception Sources and Exception Vector Table ............................................................... 79
4.3 Reset.................................................................................................................................. 81
4.3.1 Reset Exception Handling.................................................................................... 81
4.3.2 Interrupts after Reset............................................................................................ 83
4.3.3 On-Chip Peripheral Functions after Reset Release.............................................. 83
4.4 Traces................................................................................................................................ 84
4.5 Interrupts........................................................................................................................... 84
4.6 Trap Instruction................................................................................................................. 85
4.7 Stack Status after Exception Handling.............................................................................. 86
4.8 Usage Notes ...................................................................................................................... 87
Section 5 Interrupt Controller .......................................................................................... 89
5.1 Features............................................................................................................................. 89
5.2 Input/Output Pins.............................................................................................................. 91
5.3 Register Descriptions........................................................................................................ 91
5.3.1 Interrupt Control Register (INTCR) .................................................................... 92
5.3.2 Interrupt Priority Registers A to K (IPRA to IPRK)............................................ 93
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5.3.3 IRQ Enable Register (IER) .................................................................................. 95
5.3.4 IRQ Sense Control Register L (ISCRL)............................................................... 96
5.3.5 IRQ Status Register (ISR).................................................................................... 99
5.3.6 IRQ Pin Select Register (ITSR) ........................................................................... 100
5.3.7 Software Standby Release IRQ Enable Register (SSIER) ................................... 101
5.4 Interrupt Sources............................................................................................................... 101
5.4.1 External Interrupts ............................................................................................... 101
5.4.2 Internal Interrupts................................................................................................. 102
5.5 Interrupt Exception Handling Vector Table...................................................................... 103
5.6 Interrupt Control Modes and Interrupt Operation ............................................................. 108
5.6.1 Interrupt Control Mode 0 ..................................................................................... 108
5.6.2 Interrupt Control Mode 2 ..................................................................................... 110
5.6.3 Interrupt Exception Handling Sequence .............................................................. 112
5.6.4 Interrupt Response Times .................................................................................... 114
5.6.5 DTC and DMAC Activation by Interrupt ............................................................ 115
5.7 Usage Notes ...................................................................................................................... 116
5.7.1 Contention between Interrupt Generation and Disabling..................................... 116
5.7.2 Instructions that Disable Interrupts ...................................................................... 117
5.7.3 Times when Interrupts Are Disabled ................................................................... 117
5.7.4 Interrupts during Execution of EEPMOV Instruction.......................................... 117
5.7.5 Change of IRQ Pin Select Register (ITSR) Setting ............................................. 117
5.7.6 Note on IRQ Status Register (ISR) ...................................................................... 118
Section 6 Bus Controller (BSC) ...................................................................................... 119
6.1 Features............................................................................................................................. 119
6.2 Input/Output Pins .............................................................................................................. 121
6.3 Register Descriptions ........................................................................................................ 122
6.3.1 Bus Width Control Register (ABWCR)............................................................... 123
6.3.2 Access State Control Register (ASTCR) ............................................................. 123
6.3.3 Wait Control Registers AH, AL, BH, and BL (WTCRAH, WTCRAL,
WTCRBH, and WTCRBL).................................................................................. 124
6.3.4 Read Strobe Timing Control Register (RDNCR)................................................. 129
6.3.5 CS Assertion Period Control Registers H, L (CSACRH, CSACRL)................... 130
6.3.6 Area 0 Burst ROM Interface Control Register (BROMCRH) Area 1
Burst ROM Interface Control Register (BROMCRL) ......................................... 132
6.3.7 Bus Control Register (BCR) ................................................................................ 133
6.3.8 DRAM Control Register (DRAMCR) ................................................................. 135
6.3.9 DRAM Access Control Register (DRACCR)...................................................... 140
6.3.10 Refresh Control Register (REFCR) ..................................................................... 141
6.3.11 Refresh Timer Counter (RTCNT)........................................................................ 144
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6.3.12 Refresh Time Constant Register (RTCOR) ......................................................... 144
6.4 Operation .......................................................................................................................... 144
6.4.1 Area Division....................................................................................................... 144
6.4.2 Bus Specifications................................................................................................ 146
6.4.3 Memory Interfaces............................................................................................... 148
6.4.4 Chip Select Signals .............................................................................................. 149
6.5 Basic Bus Interface ........................................................................................................... 150
6.5.1 Data Size and Data Alignment............................................................................. 150
6.5.2 Valid Strobes........................................................................................................ 152
6.5.3 Basic Timing........................................................................................................ 153
6.5.4 Wait Control ........................................................................................................ 161
6.5.5 Read Strobe (RD) Timing.................................................................................... 162
6.5.6 Extension of Chip Select (CS) Assertion Period.................................................. 163
6.6 DRAM Interface ............................................................................................................... 165
6.6.1 Setting DRAM Space........................................................................................... 165
6.6.2 Address Multiplexing........................................................................................... 165
6.6.3 Data Bus............................................................................................................... 166
6.6.4 Pins Used for DRAM Interface............................................................................ 167
6.6.5 Basic Timing........................................................................................................ 168
6.6.6 Column Address Output Cycle Control ............................................................... 169
6.6.7 Row Address Output State Control...................................................................... 170
6.6.8 Precharge State Control ....................................................................................... 172
6.6.9 Wait Control ........................................................................................................ 173
6.6.10 Byte Access Control ............................................................................................ 176
6.6.11 Burst Operation.................................................................................................... 177
6.6.12 Refresh Control.................................................................................................... 182
6.6.13 DMAC Single Address Transfer Mode and DRAM Interface............................. 187
6.7 Burst ROM Interface......................................................................................................... 190
6.7.1 Basic Timing........................................................................................................ 190
6.7.2 Wait Control ........................................................................................................ 192
6.7.3 Write Access........................................................................................................ 192
6.8 Idle Cycle.......................................................................................................................... 193
6.8.1 Operation ............................................................................................................. 193
6.8.2 Pin States in Idle Cycle........................................................................................ 204
6.9 Write Data Buffer Function .............................................................................................. 204
6.10 Bus Release....................................................................................................................... 206
6.10.1 Operation ............................................................................................................. 206
6.10.2 Pin States in External Bus Released State............................................................ 207
6.10.3 Transition Timing ................................................................................................ 208
6.11 Bus Arbitration.................................................................................................................. 209
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6.11.1 Operation ............................................................................................................. 209
6.11.2 Bus Transfer Timing............................................................................................ 210
6.12 Bus Controller Operation in Reset .................................................................................... 211
6.13 Usage Notes ...................................................................................................................... 211
6.13.1 External Bus Release Function and All-Module-Clocks-Stopped Mode............. 211
6.13.2 External Bus Release Function and Software Standby ........................................ 211
6.13.3 External Bus Release Function and CBR Refreshing .......................................... 211
6.13.4 BREQO Output Timing ....................................................................................... 212
Section 7 DMA Controller (DMAC) ............................................................................. 213
7.1 Features............................................................................................................................. 213
7.2 Input/Output Pins .............................................................................................................. 215
7.3 Register Descriptions ........................................................................................................ 215
7.3.1 Memory Address Registers (MARA and MARB)............................................... 217
7.3.2 I/O Address Registers (IOARA and IOARB)...................................................... 217
7.3.3 Execute Transfer Count Registers (ETCRA and ETCRB)................................... 218
7.3.4 DMA Control Registers (DMACRA and DMACRB) ......................................... 219
7.3.5 DMA Band Control Registers H and L (DMABCRH and DMABCRL)............. 226
7.3.6 DMA Write Enable Register (DMAWER) .......................................................... 238
7.3.7 DMA Terminal Control Register (DMATCR)..................................................... 240
7.4 Activation Sources ............................................................................................................ 241
7.4.1 Activation by Internal Interrupt Request.............................................................. 242
7.4.2 Activation by External Request ........................................................................... 242
7.4.3 Activation by Auto-Request................................................................................. 243
7.5 Operation........................................................................................................................... 244
7.5.1 Transfer Modes .................................................................................................... 244
7.5.2 Sequential Mode .................................................................................................. 246
7.5.3 Idle Mode............................................................................................................. 249
7.5.4 Repeat Mode........................................................................................................ 252
7.5.5 Single Address Mode........................................................................................... 256
7.5.6 Normal Mode....................................................................................................... 259
7.5.7 Block Transfer Mode ........................................................................................... 262
7.5.8 Basic Bus Cycles.................................................................................................. 267
7.5.9 DMA Transfer (Dual Address Mode) Bus Cycles ............................................... 267
7.5.10 DMA Transfer (Single Address Mode) Bus Cycles............................................. 275
7.5.11 Write Data Buffer Function ................................................................................. 281
7.5.12 Multi-Channel Operation ..................................................................................... 282
7.5.13 Relation between DMAC and External Bus Requests and Refresh Cycles ......... 283
7.5.14 DMAC and NMI Interrupts.................................................................................. 284
7.5.15 Forced Termination of DMAC Operation............................................................ 285
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7.5.16 Clearing Full Address Mode................................................................................ 286
7.6 Interrupt Sources............................................................................................................... 287
7.7 Usage Notes ...................................................................................................................... 288
7.7.1 DMAC Register Access during Operation........................................................... 288
7.7.2 Module Stop......................................................................................................... 289
7.7.3 Write Data Buffer Function ................................................................................. 289
7.7.4 TEND Output....................................................................................................... 290
7.7.5 Activation by Falling Edge on DREQ Pin ........................................................... 291
7.7.6 Activation Source Acceptance............................................................................. 291
7.7.7 Internal Interrupt after End of Transfer................................................................ 292
7.7.8 Channel Re-Setting .............................................................................................. 292
Section 8 Data Transfer Controller (DTC)................................................................... 293
8.1 Features............................................................................................................................. 293
8.2 Register Descriptions........................................................................................................ 295
8.2.1 DTC Mode Register A (MRA) ............................................................................ 295
8.2.2 DTC Mode Register B (MRB)............................................................................. 297
8.2.3 DTC Source Address Register (SAR).................................................................. 297
8.2.4 DTC Destination Address Register (DAR).......................................................... 297
8.2.5 DTC Transfer Count Register A (CRA) .............................................................. 298
8.2.6 DTC Transfer Count Register B (CRB)............................................................... 298
8.2.7 DTC Enable Registers A to G (DTCERA to DTCERG) ..................................... 299
8.2.8 DTC Vector Register (DTVECR)........................................................................ 300
8.3 Activation Sources............................................................................................................ 301
8.4 Location of Register Information and DTC Vector Table ................................................ 302
8.5 Operation .......................................................................................................................... 306
8.5.1 Normal Mode....................................................................................................... 308
8.5.2 Repeat Mode........................................................................................................ 309
8.5.3 Block Transfer Mode ........................................................................................... 310
8.5.4 Chain Transfer ..................................................................................................... 311
8.5.5 Interrupts.............................................................................................................. 312
8.5.6 Operation Timing................................................................................................. 313
8.5.7 Number of DTC Execution States ....................................................................... 314
8.6 Procedures for Using DTC................................................................................................ 316
8.6.1 Activation by Interrupt......................................................................................... 316
8.6.2 Activation by Software ........................................................................................ 316
8.7 Examples of Use of the DTC ............................................................................................ 317
8.7.1 Normal Mode....................................................................................................... 317
8.7.2 Chain Transfer ..................................................................................................... 317
8.7.3 Chain Transfer when Counter = 0........................................................................ 318
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8.7.4 Software Activation ............................................................................................. 320
8.8 Usage Notes ...................................................................................................................... 321
8.8.1 Module Stop Mode Setting .................................................................................. 321
8.8.2 On-Chip RAM ..................................................................................................... 321
8.8.3 DTCE Bit Setting................................................................................................. 321
8.8.4 DMAC Transfer End Interrupt............................................................................. 321
8.8.5 Chain Transfer ..................................................................................................... 321
Section 9 I/O Ports .............................................................................................................. 323
9.1 Port 1................................................................................................................................. 327
9.1.1 Port 1 Data Direction Register (P1DDR)............................................................. 327
9.1.2 Port 1 Data Register (P1DR)................................................................................ 328
9.1.3 Port 1 Register (PORT1)...................................................................................... 328
9.1.4 Pin Functions ....................................................................................................... 329
9.2 Port 2................................................................................................................................. 337
9.2.1 Port 2 Data Direction Register (P2DDR)............................................................. 337
9.2.2 Port 2 Data Register (P2DR)................................................................................ 338
9.2.3 Port 2 Register (PORT2)...................................................................................... 338
9.2.4 Pin Functions ....................................................................................................... 339
9.3 Port 3................................................................................................................................. 347
9.3.1 Port 3 Data Direction Register (P3DDR)............................................................. 347
9.3.2 Port 3 Data Register (P3DR)................................................................................ 348
9.3.3 Port 3 Register (PORT3)...................................................................................... 348
9.3.4 Port 3 Open Drain Control Register (P3ODR)..................................................... 349
9.3.5 Port Function Control Register 2 (PFCR2).......................................................... 350
9.3.6 Pin Functions ....................................................................................................... 351
9.4 Port 4................................................................................................................................. 354
9.4.1 Port 4 Register (PORT4)...................................................................................... 354
9.4.2 Pin Functions ....................................................................................................... 355
9.5 Port 5................................................................................................................................. 357
9.5.1 Port 5 Data Direction Register (P5DDR)............................................................. 357
9.5.2 Port 5 Data Register (P5DR)................................................................................ 357
9.5.3 Port 5 Register (PORT5)...................................................................................... 358
9.5.4 Pin Functions ....................................................................................................... 358
9.6 Port 8................................................................................................................................. 360
9.6.1 Port 8 Data Direction Register (P8DDR)............................................................. 360
9.6.2 Port 8 Data Register (P8DR)................................................................................ 361
9.6.3 Port 8 Register (PORT8)...................................................................................... 361
9.6.4 Pin Functions ....................................................................................................... 362
9.7 Port 9................................................................................................................................. 363
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9.7.1 Port 9 Register (PORT9)...................................................................................... 363
9.7.2 Pin Functions ....................................................................................................... 363
9.8 Port A................................................................................................................................ 364
9.8.1 Port A Data Direction Register (PADDR)........................................................... 365
9.8.2 Port A Data Register (PADR).............................................................................. 366
9.8.3 Port A Register (PORTA).................................................................................... 366
9.8.4 Port A MOS Pull-Up Control Register (PAPCR) ................................................ 367
9.8.5 Port A Open Drain Control Register (PAODR)................................................... 367
9.8.6 Port Function Control Register 0 (PFCR0).......................................................... 368
9.8.7 Port Function Control Register 1 (PFCR1).......................................................... 369
9.8.8 Pin Functions ....................................................................................................... 370
9.8.9 Port A MOS Input Pull-Up States........................................................................ 372
9.9 Port B ................................................................................................................................ 373
9.9.1 Port B Data Direction Register (PBDDR) ........................................................... 373
9.9.2 Port B Data Register (PBDR) .............................................................................. 374
9.9.3 Port B Register (PORTB) .................................................................................... 374
9.9.4 Port B MOS Pull-Up Control Register (PBPCR) ................................................ 375
9.9.5 Pin Functions ....................................................................................................... 375
9.9.6 Port B MOS Input Pull-Up States........................................................................ 376
9.10 Port C ................................................................................................................................ 377
9.10.1 Port C Data Direction Register (PCDDR) ........................................................... 377
9.10.2 Port C Data Register (PCDR) .............................................................................. 378
9.10.3 Port C Register (PORTC) .................................................................................... 378
9.10.4 Port C MOS Pull-Up Control Register (PCPCR) ................................................ 379
9.10.5 Pin Functions ....................................................................................................... 379
9.10.6 Port C MOS Input Pull-Up States........................................................................ 380
9.11 Port D................................................................................................................................ 381
9.11.1 Port D Data Direction Register (PDDDR)........................................................... 381
9.11.2 Port D Data Register (PDDR).............................................................................. 382
9.11.3 Port D Register (PORTD).................................................................................... 382
9.11.4 Port D Pull-up Control Register (PDPCR)........................................................... 383
9.11.5 Pin Functions ....................................................................................................... 383
9.11.6 Port D MOS Input Pull-Up States........................................................................ 384
9.12 Port E ................................................................................................................................ 385
9.12.1 Port E Data Direction Register (PEDDR)............................................................ 385
9.12.2 Port E Data Register (PEDR)............................................................................... 386
9.12.3 Port E Register (PORTE)..................................................................................... 386
9.12.4 Port E Pull-up Control Register (PEPCR) ........................................................... 387
9.12.5 Pin Functions ....................................................................................................... 387
9.12.6 Port E MOS Input Pull-Up States ........................................................................ 388
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9.13 Port F................................................................................................................................. 388
9.13.1 Port F Data Direction Register (PFDDR) ............................................................ 389
9.13.2 Port F Data Register (PFDR) ............................................................................... 390
9.13.3 Port F Register (PORTF) ..................................................................................... 390
9.13.4 Pin Functions ....................................................................................................... 391
9.14 Port G................................................................................................................................ 395
9.14.1 Port G Data Direction Register (PGDDR) ........................................................... 395
9.14.2 Port G Data Register (PGDR).............................................................................. 396
9.14.3 Port G Register (PORTG).................................................................................... 396
9.14.4 Pin Functions ....................................................................................................... 397
Section 10 16-Bit Timer Pulse Unit (TPU).................................................................. 401
10.1 Features............................................................................................................................. 401
10.2 Input/Output Pins .............................................................................................................. 405
10.3 Register Descriptions ........................................................................................................ 406
10.3.1 Timer Control Register (TCR)............................................................................. 408
10.3.2 Timer Mode Register (TMDR) ............................................................................ 413
10.3.3 Timer I/O Control Register (TIOR) ..................................................................... 414
10.3.4 Timer Interrupt Enable Register (TIER) .............................................................. 432
10.3.5 Timer Status Register (TSR)................................................................................ 434
10.3.6 Timer Counter (TCNT)........................................................................................ 437
10.3.7 Timer General Register (TGR) ............................................................................ 437
10.3.8 Timer Start Register (TSTR)................................................................................ 437
10.3.9 Timer Synchronous Register (TSYR).................................................................. 438
10.4 Operation........................................................................................................................... 439
10.4.1 Basic Functions.................................................................................................... 439
10.4.2 Synchronous Operation........................................................................................ 445
10.4.3 Buffer Operation .................................................................................................. 447
10.4.4 Cascaded Operation ............................................................................................. 452
10.4.5 PWM Modes........................................................................................................ 454
10.4.6 Phase Counting Mode.......................................................................................... 459
10.5 Interrupts........................................................................................................................... 466
10.6 DTC Activation................................................................................................................. 468
10.7 DMAC Activation............................................................................................................. 468
10.8 A/D Converter Activation................................................................................................. 468
10.9 Operation Timing.............................................................................................................. 469
10.9.1 Input/Output Timing ............................................................................................ 469
10.9.2 Interrupt Signal Timing........................................................................................ 473
10.10 Usage Notes ...................................................................................................................... 477
10.10.1 Module Stop Mode Setting .................................................................................. 477
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10.10.2 Input Clock Restrictions ...................................................................................... 477
10.10.3 Caution on Cycle Setting ..................................................................................... 478
10.10.4 Contention between TCNT Write and Clear Operations ..................................... 478
10.10.5 Contention between TCNT Write and Increment Operations.............................. 479
10.10.6 Contention between TGR Write and Compare Match ......................................... 479
10.10.7 Contention between Buffer Register Write and Compare Match ........................ 480
10.10.8 Contention between TGR Read and Input Capture.............................................. 481
10.10.9 Contention between TGR Write and Input Capture............................................. 482
10.10.10 Contention between Buffer Register Write and Input Capture .......................... 482
10.10.11 Contention between Overflow/Underflow and Counter Clearing...................... 483
10.10.12 Contention between TCNT Write and Overflow/Underflow............................. 484
10.10.13 Multiplexing of I/O Pins.................................................................................... 484
10.10.14 Interrupts and Module Stop Mode ..................................................................... 484
Section 11 Programmable Pulse Generator (PPG) .................................................... 485
11.1 Features............................................................................................................................. 485
11.2 Input/Output Pins .............................................................................................................. 487
11.3 Register Descriptions........................................................................................................ 487
11.3.1 Next Data Enable Registers H, L (NDERH, NDERL) ........................................ 488
11.3.2 Output Data Registers H, L (PODRH, PODRL).................................................. 489
11.3.3 Next Data Registers H, L (NDRH, NDRL) ......................................................... 490
11.3.4 PPG Output Control Register (PCR) ................................................................... 492
11.3.5 PPG Output Mode Register (PMR) ..................................................................... 493
11.4 Operation .......................................................................................................................... 495
11.4.1 Output Timing...................................................................................................... 496
11.4.2 Sample Setup Procedure for Normal Pulse Output.............................................. 497
11.4.3 Example of Normal Pulse Output (Example of Five-Phase Pulse Output).......... 498
11.4.4 Non-Overlapping Pulse Output............................................................................ 499
11.4.5 Sample Setup Procedure for Non-Overlapping Pulse Output .............................. 501
11.4.6 Example of Non-Overlapping Pulse Output (Example of Four-Phase
Complementary Non-Overlapping Output) ......................................................... 502
11.4.7 Inverted Pulse Output .......................................................................................... 504
11.4.8 Pulse Output Triggered by Input Capture ............................................................ 505
11.5 Usage Notes ...................................................................................................................... 505
11.5.1 Module Stop Mode Setting .................................................................................. 505
11.5.2 Operation of Pulse Output Pins............................................................................ 505
Section 12 8-Bit Timers (TMR) ...................................................................................... 507
12.1 Features............................................................................................................................. 507
12.2 Input/Output Pins .............................................................................................................. 509
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12.3 Register Descriptions ........................................................................................................ 509
12.3.1 Timer Counter (TCNT)........................................................................................ 509
12.3.2 Time Constant Register A (TCORA)................................................................... 510
12.3.3 Time Constant Register B (TCORB) ................................................................... 510
12.3.4 Timer Control Register (TCR)............................................................................ 510
12.3.5 Timer Control/Status Register (TCSR)................................................................ 512
12.4 Operation........................................................................................................................... 515
12.4.1 Pulse Output......................................................................................................... 515
12.5 Operation Timing.............................................................................................................. 516
12.5.1 TCNT Incrementation Timing ............................................................................. 516
12.5.2 Timing of CMFA and CMFB Setting when Compare-Match Occurs ................. 517
12.5.3 Timing of Timer Output when Compare-Match Occurs...................................... 518
12.5.4 Timing of Compare Match Clear ......................................................................... 518
12.5.5 Timing of TCNT External Reset.......................................................................... 519
12.5.6 Timing of Overflow Flag (OVF) Setting ............................................................. 519
12.6 Operation with Cascaded Connection ............................................................................... 520
12.6.1 16-Bit Counter Mode ........................................................................................... 520
12.6.2 Compare Match Count Mode............................................................................... 520
12.7 Interrupts........................................................................................................................... 521
12.7.1 Interrupt Sources and DTC Activation ................................................................ 521
12.7.2 A/D Converter Activation.................................................................................... 521
12.8 Usage Notes ...................................................................................................................... 522
12.8.1 Contention between TCNT Write and Clear........................................................ 522
12.8.2 Contention between TCNT Write and Increment ................................................ 523
12.8.3 Contention between TCOR Write and Compare Match ...................................... 524
12.8.4 Contention between Compare Matches A and B ................................................. 525
12.8.5 Switching of Internal Clocks and TCNT Operation............................................. 525
12.8.6 Mode Setting with Cascaded Connection ............................................................ 527
12.8.7 Interrupts in Module Stop Mode.......................................................................... 527
Section 13 Watchdog Timer............................................................................................. 529
13.1 Features............................................................................................................................. 529
13.2 Input/Output Pin................................................................................................................ 530
13.3 Register Descriptions ........................................................................................................ 531
13.3.1 Timer Counter (TCNT)........................................................................................ 531
13.3.2 Timer Control/Status Register (TCSR)................................................................ 531
13.3.3 Reset Control/Status Register (RSTCSR)............................................................ 533
13.4 Operation........................................................................................................................... 534
13.4.1 Watchdog Timer Mode ........................................................................................ 534
13.4.2 Interval Timer Mode............................................................................................ 535
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13.5 Interrupts........................................................................................................................... 536
13.6 Usage Notes ...................................................................................................................... 536
13.6.1 Notes on Register Access..................................................................................... 536
13.6.2 Contention between Timer Counter (TCNT) Write and Increment ..................... 538
13.6.3 Changing Value of CKS2 to CKS0...................................................................... 538
13.6.4 Switching between Watchdog Timer Mode and Interval Timer Mode................ 538
13.6.5 Internal Reset in Watchdog Timer Mode............................................................. 539
13.6.6 System Reset by WDTOVF Signal...................................................................... 539
Section 14 Serial Communication Interface (SCI, IrDA)........................................ 541
14.1 Features............................................................................................................................. 541
14.2 Input/Output Pins .............................................................................................................. 544
14.3 Register Descriptions........................................................................................................ 545
14.3.1 Receive Shift Register (RSR) .............................................................................. 546
14.3.2 Receive Data Register (RDR).............................................................................. 546
14.3.3 Transmit Data Register (TDR)............................................................................. 546
14.3.4 Transmit Shift Register (TSR) ............................................................................. 547
14.3.5 Serial Mode Register (SMR) ............................................................................... 547
14.3.6 Serial Control Register (SCR).............................................................................. 551
14.3.7 Serial Status Register (SSR) ................................................................................ 556
14.3.8 Smart Card Mode Register (SCMR).................................................................... 563
14.3.9 Bit Rate Register (BRR) ...................................................................................... 564
14.3.10 IrDA Control Register (IrCR).............................................................................. 573
14.3.11 Serial Extension Mode Register (SEMR) ............................................................ 574
14.4 Operation in Asynchronous Mode .................................................................................... 576
14.4.1 Data Transfer Format........................................................................................... 576
14.4.2 Receive Data Sampling Timing and Reception Margin in
Asynchronous Mode ............................................................................................ 578
14.4.3 Clock.................................................................................................................... 579
14.4.4 SCI Initialization (Asynchronous Mode)............................................................. 580
14.4.5 Data Transmission (Asynchronous Mode)........................................................... 581
14.4.6 Serial Data Reception (Asynchronous Mode)...................................................... 584
14.5 Multiprocessor Communication Function......................................................................... 588
14.5.1 Multiprocessor Serial Data Transmission ............................................................ 589
14.5.2 Multiprocessor Serial Data Reception ................................................................. 591
14.6 Operation in Clocked Synchronous Mode ........................................................................ 595
14.6.1 Clock.................................................................................................................... 595
14.6.2 SCI Initialization (Clocked Synchronous Mode)................................................. 596
14.6.3 Serial Data Transmission (Clocked Synchronous Mode) .................................... 597
14.6.4 Serial Data Reception (Clocked Synchronous Mode).......................................... 600
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14.6.5 Simultaneous Serial Data Transmission and Reception
(Clocked Synchronous Mode) ............................................................................. 602
14.7 Operation in Smart Card Interface Mode.......................................................................... 604
14.7.1 Pin Connection Example...................................................................................... 604
14.7.2 Data Format (Except for Block Transfer Mode).................................................. 605
14.7.3 Block Transfer Mode ........................................................................................... 606
14.7.4 Receive Data Sampling Timing and Reception Margin....................................... 606
14.7.5 Initialization ......................................................................................................... 608
14.7.6 Data Transmission (Except for Block Transfer Mode) ........................................ 608
14.7.7 Serial Data Reception (Except for Block Transfer Mode) ................................... 612
14.7.8 Clock Output Control........................................................................................... 613
14.8 IrDA Operation ................................................................................................................. 616
14.9 SCI Interrupts.................................................................................................................... 619
14.9.1 Interrupts in Normal Serial Communication Interface Mode............................... 619
14.9.2 Interrupts in Smart Card Interface Mode ............................................................. 621
14.10 Usage Notes ...................................................................................................................... 622
14.10.1 Module Stop Mode Setting .................................................................................. 622
14.10.2 Break Detection and Processing........................................................................... 622
14.10.3 Mark State and Break Sending............................................................................. 622
14.10.4 Receive Error Flags and Transmit Operations
(Clocked Synchronous Mode Only)..................................................................... 623
14.10.5 Relation between Writes to TDR and the TDRE Flag ......................................... 623
14.10.6 Restrictions on Use of DMAC or DTC................................................................ 623
14.10.7 Operation in Case of Mode Transition................................................................. 624
Section 15 I2C Bus Interface2 (IIC2) (Option)............................................................ 629
15.1 Features............................................................................................................................. 629
15.2 Input/Output Pins .............................................................................................................. 631
15.3 Register Descriptions ........................................................................................................ 632
15.3.1 I2C Bus Control Register A (ICCRA) .................................................................. 633
15.3.2 I2C Bus Control Register B (ICCRB)................................................................... 635
15.3.3 I2C Bus Mode Register (ICMR)........................................................................... 636
15.3.4 I2C Bus Interrupt Enable Register (ICIER) .......................................................... 637
15.3.5 I2C Bus Status Register (ICSR)............................................................................ 639
15.3.6 Slave Address Register (SAR)............................................................................. 641
15.3.7 I2C Bus Transmit Data Register (ICDRT)............................................................ 642
15.3.8 I2C Bus Receive Data Register (ICDRR)............................................................. 642
15.3.9 I2C Bus Shift Register (ICDRS)........................................................................... 642
15.4 Operation........................................................................................................................... 643
15.4.1 I2C Bus Format..................................................................................................... 643
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15.4.2 Master Transmit Operation.................................................................................. 644
15.4.3 Master Receive Operation.................................................................................... 646
15.4.4 Slave Transmit Operation .................................................................................... 648
15.4.5 Slave Receive Operation...................................................................................... 650
15.4.6 Noise Canceler..................................................................................................... 653
15.4.7 Example of Use.................................................................................................... 653
15.5 Interrupt Request............................................................................................................... 658
15.6 Bit Synchronous Circuit.................................................................................................... 658
15.7 Usage Notes ...................................................................................................................... 659
Section 16 A/D Converter................................................................................................. 661
16.1 Features............................................................................................................................. 661
16.2 Input/Output Pins .............................................................................................................. 663
16.3 Register Descriptions........................................................................................................ 664
16.3.1 A/D Data Registers A to H (ADDRA to ADDRH) ............................................. 664
16.3.2 A/D Control/Status Register (ADCSR) ............................................................... 666
16.3.3 A/D Control Register (ADCR) ............................................................................ 668
16.4 Operation .......................................................................................................................... 669
16.4.1 Single Mode......................................................................................................... 669
16.4.2 Scan Mode ........................................................................................................... 669
16.4.3 Input Sampling and A/D Conversion Time ......................................................... 670
16.4.4 External Trigger Input Timing............................................................................. 673
16.5 Interrupts........................................................................................................................... 673
16.6 A/D Conversion Precision Definitions.............................................................................. 674
16.7 Usage Notes ...................................................................................................................... 676
16.7.1 Module Stop Mode Setting .................................................................................. 676
16.7.2 Permissible Signal Source Impedance ................................................................. 676
16.7.3 Influences on Absolute Precision......................................................................... 677
16.7.4 Setting Range of Analog Power Supply and Other Pins...................................... 677
16.7.5 Notes on Board Design ........................................................................................ 677
16.7.6 Notes on Noise Countermeasures ........................................................................ 678
Section 17 D/A Converter................................................................................................. 681
17.1 Features............................................................................................................................. 681
17.2 Input/Output Pins .............................................................................................................. 683
17.3 Register Descriptions........................................................................................................ 683
17.3.1 D/A Data Registers 2 and 3 (DADR2 and DADR3)............................................ 683
17.3.2 D/A Control Register 23 (DACR23) ................................................................... 684
17.4 Operation .......................................................................................................................... 685
17.5 Usage Notes ...................................................................................................................... 686
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17.5.1 Setting for Module Stop Mode............................................................................. 686
17.5.2 D/A Output Hold Function in Software Standby Mode....................................... 686
Section 18 RAM .................................................................................................................. 687
Section 19 Flash Memory (0.35-μm F-ZTAT Version)........................................... 689
19.1 Features............................................................................................................................. 689
19.2 Mode Transitions .............................................................................................................. 691
19.3 Block Configuration.......................................................................................................... 695
19.4 Input/Output Pins .............................................................................................................. 697
19.5 Register Descriptions ........................................................................................................ 697
19.5.1 Flash Memory Control Register 1 (FLMCR1)..................................................... 698
19.5.2 Flash Memory Control Register 2 (FLMCR2)..................................................... 699
19.5.3 Erase Block Register 1 (EBR1) ........................................................................... 700
19.5.4 Erase Block Register 2 (EBR2) ........................................................................... 700
19.6 On-Board Programming Modes........................................................................................ 702
19.6.1 Boot Mode ........................................................................................................... 702
19.6.2 User Program Mode............................................................................................. 705
19.7 Flash Memory Programming/Erasing ............................................................................... 706
19.7.1 Program/Program-Verify ..................................................................................... 706
19.7.2 Erase/Erase-Verify............................................................................................... 708
19.7.3 Interrupt Handling when Programming/Erasing Flash Memory.......................... 708
19.8 Program/Erase Protection.................................................................................................. 710
19.8.1 Hardware Protection ............................................................................................ 710
19.8.2 Software Protection.............................................................................................. 710
19.8.3 Error Protection.................................................................................................... 710
19.9 Programmer Mode ............................................................................................................ 711
19.10 Power-Down States for Flash Memory............................................................................. 711
19.11 Usage Notes ...................................................................................................................... 712
Section 20 Flash Memory (0.18-μm F-ZTAT Version)........................................... 717
20.1 Features............................................................................................................................. 717
20.1.1 Operating Mode ................................................................................................... 720
20.1.2 Mode Comparison................................................................................................ 721
20.1.3 Flash MAT Configuration.................................................................................... 722
20.1.4 Block Division ..................................................................................................... 723
20.1.5 Programming/Erasing Interface ........................................................................... 724
20.2 Input/Output Pins .............................................................................................................. 726
20.3 Register Descriptions ........................................................................................................ 726
20.3.1 Programming/Erasing Interface Register............................................................. 728
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20.3.2 Programming/Erasing Interface Parameter .......................................................... 735
20.3.3 Flash Vector Address Control Register (FVACR)............................................... 747
20.4 On-Board Programming Mode ......................................................................................... 748
20.4.1 Boot Mode ........................................................................................................... 748
20.4.2 User Program Mode............................................................................................. 753
20.4.3 User Boot Mode................................................................................................... 764
20.4.4 Procedure Program and Storable Area for Programming Data............................ 768
20.5 Protection .......................................................................................................................... 778
20.5.1 Hardware Protection ............................................................................................ 778
20.5.2 Software Protection.............................................................................................. 779
20.5.3 Error Protection.................................................................................................... 779
20.6 Switching between User MAT and User Boot MAT........................................................ 781
20.7 Programmer Mode ............................................................................................................ 782
20.8 Serial Communication Interface Specification for Boot Mode......................................... 782
20.9 Usage Notes ...................................................................................................................... 810
Section 21 Mask ROM....................................................................................................... 811
Section 22 Clock Pulse Generator .................................................................................. 813
22.1 Register Descriptions........................................................................................................ 813
22.1.1 System Clock Control Register (SCKCR) ........................................................... 814
22.1.2 PLL Control Register (PLLCR)........................................................................... 815
22.2 Oscillator........................................................................................................................... 816
22.2.1 Connecting a Crystal Oscillator ........................................................................... 816
22.2.2 External Clock Input............................................................................................ 817
22.3 PLL Circuit ....................................................................................................................... 818
22.4 Frequency Divider ............................................................................................................ 819
22.5 Usage Notes ...................................................................................................................... 819
22.5.1 Notes on Clock Pulse Generator .......................................................................... 819
22.5.2 Notes on Oscillator .............................................................................................. 820
22.5.3 Notes on Board Design ........................................................................................ 820
Section 23 Power-Down Modes...................................................................................... 823
23.1 Register Descriptions........................................................................................................ 826
23.1.1 Standby Control Register (SBYCR) .................................................................... 826
23.1.2 Module Stop Control Registers H and L (MSTPCRH, MSTPCRL).................... 828
23.1.3 Extension Module Stop Control Registers H and L
(EXMSTPCRH, EXMSTPCRL) ......................................................................... 829
23.2 Operation .......................................................................................................................... 830
23.2.1 Clock Division Mode........................................................................................... 830
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23.2.2 Sleep Mode .......................................................................................................... 830
23.2.3 Software Standby Mode....................................................................................... 831
23.2.4 Hardware Standby Mode ..................................................................................... 834
23.2.5 Module Stop Mode .............................................................................................. 835
23.2.6 All-Module-Clocks-Stop Mode ........................................................................... 836
23.3 φ Clock Output Control..................................................................................................... 836
23.4 Usage Notes ...................................................................................................................... 837
23.4.1 I/O Port Status...................................................................................................... 837
23.4.2 Current Dissipation during Oscillation Stabilization Standby Period.................. 837
23.4.3 DMAC/DTC Module Stop................................................................................... 837
23.4.4 On-Chip Peripheral Module Interrupts ................................................................ 837
23.4.5 Writing to MSTPCR, EXMSTPCR ..................................................................... 837
23.4.6 Notes on Clock Division Mode............................................................................ 838
Section 24 List of Registers.............................................................................................. 839
24.1 Register Addresses (Address Order)................................................................................. 840
24.2 Register Bits...................................................................................................................... 850
24.3 Register States in Each Operating Mode........................................................................... 863
Section 25 Electrical Characteristics.............................................................................. 873
25.1 Electrical Characteristics of Masked ROM and ROMless Versions................................. 873
25.1.1 Absolute Maximum Ratings ................................................................................ 873
25.1.2 DC Characteristics ............................................................................................... 874
25.1.3 AC Characteristics ............................................................................................... 877
25.1.4 A/D Conversion Characteristics........................................................................... 910
25.1.5 D/A Conversion Characteristics........................................................................... 910
25.2 Electrical Characteristics of 0.35 μm F-ZTAT Version.................................................... 911
25.2.1 Absolute Maximum Ratings ................................................................................ 911
25.2.2 DC Characteristics ............................................................................................... 912
25.2.3 A/D Conversion Characteristics........................................................................... 923
25.2.4 D/A Conversion Characteristics........................................................................... 923
25.2.5 Flash Memory Characteristics.............................................................................. 924
25.3 Electrical Characteristics for 0.18 μm F-ZTAT Version................................................... 926
25.3.1 Absolute Maximum Ratings ................................................................................ 926
25.3.2 DC Characteristics ............................................................................................... 927
25.3.3 AC Characteristics ............................................................................................... 930
25.3.4 A/D Conversion Characteristics........................................................................... 938
25.3.5 D/A Conversion Characteristics........................................................................... 938
25.3.6 Flash Memory Characteristics.............................................................................. 939
25.4 Usage Note........................................................................................................................ 940
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Appendix ............................................................................................................................. 941
A. I/O Port States in Each Pin State....................................................................................... 941
B. Product Lineup.................................................................................................................. 949
C. Package Dimensions ......................................................................................................... 950
D. Bus State during Execution of Instructions....................................................................... 952
Index ............................................................................................................................. 975
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Figures
Section 1 Overview
Figure 1.1 Internal Block Diagram of H8S/2367F, H8S/2365, and H8S/2363........................ 3
Figure 1.2 Internal Block Diagram of H8S/2368 0.18 μm F-ZTAT Group............................. 4
Figure 1.3 Pin Arrangement of H8S/2367F, H8S/2365, and H8S/2363 .................................. 5
Figure 1.4 Pin Arrangement of H8S/2368 0.18 μm F-ZTAT Group....................................... 6
Figure 1.5 Pin Arrangement of H8S/2367F, H8S/2365, and H8S/2363 .................................. 7
Section 2 CPU
Figure 2.1 Exception Vector Table (Normal Mode)................................................................ 25
Figure 2.2 Stack Structure in Normal Mode............................................................................ 25
Figure 2.3 Exception Vector Table (Advanced Mode)............................................................ 26
Figure 2.4 Stack Structure in Advanced Mode........................................................................ 27
Figure 2.5 Memory Map.......................................................................................................... 28
Figure 2.6 CPU Internal Registers........................................................................................... 29
Figure 2.7 Usage of General Registers .................................................................................... 30
Figure 2.8 Stack....................................................................................................................... 31
Figure 2.9 General Register Data Formats (1)......................................................................... 34
Figure 2.9 General Register Data Formats (2)......................................................................... 35
Figure 2.10 Memory Data Formats............................................................................................ 36
Figure 2.11 Instruction Formats (Examples) ............................................................................. 48
Figure 2.12 Branch Address Specification in Memory Indirect Addressing Mode................... 52
Figure 2.13 State Transitions..................................................................................................... 56
Section 3 MCU Operating Modes
Figure 3.1 H8S/2368F Memory Map (1)................................................................................. 63
Figure 3.2 H8S/2368F Memory Map (2)................................................................................. 64
Figure 3.3 H8S/2367F Memory Map (1)................................................................................. 65
Figure 3.4 H8S/2367F Memory Map (2)................................................................................. 66
Figure 3.5 H8S/2364F Memory Map (1)................................................................................. 67
Figure 3.6 H8S/2364F Memory Map (2)................................................................................. 68
Figure 3.7 H8S/2362F Memory Map (1)................................................................................. 69
Figure 3.8 H8S/2362F Memory Map (2)................................................................................. 70
Figure 3.9 H8S/2361F Memory Map (1)................................................................................. 71
Figure 3.10 H8S/2361F Memory Map (2)................................................................................. 72
Figure 3.11 H8S/2360F Memory Map (1)................................................................................. 73
Figure 3.12 H8S/2360F Memory Map (2)................................................................................. 74
Figure 3.13 H8S/2365 Memory Map (1) ................................................................................... 75
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Figure 3.14 H8S/2365 Memory Map (2)................................................................................... 76
Figure 3.15 H8S/2363 Memory Map......................................................................................... 77
Section 4 Exception Handling
Figure 4.1 Reset Sequence (Advanced Mode with On-Chip ROM Enabled).......................... 82
Figure 4.2 Reset Sequence (Advanced Mode with On-Chip ROM Disabled)......................... 83
Figure 4.3 Stack Status after Exception Handling ................................................................... 86
Figure 4.4 Operation when SP Value Is Odd........................................................................... 87
Section 5 Interrupt Controller
Figure 5.1 Block Diagram of Interrupt Controller................................................................... 90
Figure 5.2 Block Diagram of Interrupts IRQ15 to IRQ0......................................................... 102
Figure 5.3 Flowchart of Procedure Up to Interrupt Acceptance
in Interrupt Control Mode 0 ................................................................................... 109
Figure 5.4 Flowchart of Procedure Up to Interrupt Acceptance
in Interrupt Control Mode 2 ................................................................................... 111
Figure 5.5 Interrupt Exception Handling................................................................................. 113
Figure 5.6 Contention between Interrupt Generation and Disabling ....................................... 116
Section 6 Bus Controller (BSC)
Figure 6.1 Block Diagram of Bus Controller .......................................................................... 120
Figure 6.2 Read Strobe Negation Timing (Example of 3-State Access Space)....................... 129
Figure 6.3 CS and Address Assertion Period Extension (Example of 3-State Access Space
and RDNn = 0) ....................................................................................................... 131
Figure 6.4 RAS Signal Assertion Timing (2-State Column Address Output Cycle,
Full Access)............................................................................................................ 139
Figure 6.5 Area Divisions........................................................................................................ 145
Figure 6.6 CSn Signal Output Timing (n = 0 to 7) .................................................................. 150
Figure 6.7 Access Sizes and Data Alignment Control (8-Bit Access Space) .......................... 151
Figure 6.8 Access Sizes and Data Alignment Control (16-bit Access Space)......................... 151
Figure 6.9 Bus Timing for 8-Bit, 2-State Access Space .......................................................... 153
Figure 6.10 Bus Timing for 8-Bit, 3-State Access Space .......................................................... 154
Figure 6.11 Bus Timing for 16-Bit, 2-State Access Space (Even Address Byte Access).......... 155
Figure 6.12 Bus Timing for 16-Bit, 2-State Access Space (Odd Address Byte Access)........... 156
Figure 6.13 Bus Timing for 16-Bit, 2-State Access Space (Word Access) ............................... 157
Figure 6.14 Bus Timing for 16-Bit, 3-State Access Space (Even Address Byte Access).......... 158
Figure 6.15 Bus Timing for 16-Bit, 3-State Access Space (Odd Address Byte Access)........... 159
Figure 6.16 Bus Timing for 16-Bit, 3-State Access Space (Word Access) ............................... 160
Figure 6.17 Example of Wait State Insertion Timing................................................................ 162
Figure 6.18 Example of Read Strobe Timing ............................................................................ 163
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Figure 6.19 Example of Timing when Chip Select Assertion Period is Extended .................... 164
Figure 6.20 DRAM Basic Access Timing (RAST = 0, CAST = 0)........................................... 168
Figure 6.21 Example of Access Timing with 3-State Column Address Output Cycle
(RAST = 0)............................................................................................................. 169
Figure 6.22 Example of Access Timing when RAS Signal Goes Low from Beginning
of Tr State (CAST = 0) ........................................................................................... 170
Figure 6.23 Example of Timing with One Row Address Output Maintenance State
(RAST = 0, CAST = 0) .......................................................................................... 171
Figure 6.24 Example of Timing with Two-State Precharge Cycle (RAST = 0, CAST = 0)...... 172
Figure 6.25 Example of Wait State Insertion Timing (2-State Column Address Output) ........ 174
Figure 6.26 Example of Wait State Insertion Timing (3-State Column Address Output) ......... 175
Figure 6.27 2-CAS Control Timing (Upper Byte Write Access: RAST = 0, CAST = 0)......... 176
Figure 6.28 Example of 2-CAS DRAM Connection ................................................................. 177
Figure 6.29 Operation Timing in Fast Page Mode (RAST = 0, CAST = 0) .............................. 178
Figure 6.30 Operation Timing in Fast Page Mode (RAST = 0, CAST = 1) .............................. 179
Figure 6.31 Example of Operation Timing in RAS Down Mode (RAST = 0, CAST = 0)........ 180
Figure 6.32 Example of Operation Timing in RAS Up Mode (RAST = 0, CAST = 0)............. 181
Figure 6.33 RTCNT Operation.................................................................................................. 182
Figure 6.34 Compare Match Timing ......................................................................................... 183
Figure 6.35 CBR Refresh Timing.............................................................................................. 183
Figure 6.36 CBR Refresh Timing (RCW1 = 0, RCW0 = 1, RLW1 = 0, RLW0 = 0)................ 184
Figure 6.37 Example of CBR Refresh Timing (CBRM = 1) ..................................................... 185
Figure 6.38 Self-Refresh Timing............................................................................................... 186
Figure 6.39 Example of Timing when Precharge Time after Self-Refreshing Is Extended
by 2 States .............................................................................................................. 187
Figure 6.40 Example of DACK Output Timing when DDS = 1 (RAST = 0, CAST = 0) ......... 188
Figure 6.41 Example of DACK Output Timing when DDS = 0 (RAST = 0, CAST = 1) ......... 189
Figure 6.42 Example of Burst ROM Access Timing (ASTn = 1, 2-State Burst Cycle) ............ 191
Figure 6.43 Example of Burst ROM Access Timing (ASTn = 0, 1-State Burst Cycle) ............ 192
Figure 6.44 xample of Idle Cycle Operation (Consecutive Reads in Different Areas).............. 193
Figure 6.45 Example of Idle Cycle Operation (Write after Read)............................................. 194
Figure 6.46 Example of Idle Cycle Operation (Read after Write)............................................. 195
Figure 6.47 Relationship between Chip Select (CS) and Read (RD)......................................... 196
Figure 6.48 Example of DRAM Full Access after External Read (CAST = 0)......................... 196
Figure 6.49 Example of Idle Cycle Operation in RAS Down Mode (Consecutive Reads
in Different Areas) (IDLC = 0, RAST = 0, CAST = 0).......................................... 197
Figure 6.50 Example of Idle Cycle Operation in RAS Down Mode (Write after Read)
(IDLC = 0, RAST = 0, CAST = 0)......................................................................... 198
Figure 6.51 Example of Idle Cycle Operation after DRAM Access (Consecutive Reads in
Different Areas) (IDLC = 0, RAST = 0, CAST = 0).............................................. 199
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Figure 6.52 Example of Idle Cycle Operation after DRAM Access (Write after Read)
(IDLC = 0, RAST = 0, CAST = 0)......................................................................... 199
Figure 6.53 Example of Idle Cycle Operation after DRAM Write Access
(IDLC = 0, ICIS1 = 0, RAST = 0, CAST = 0) ....................................................... 200
Figure 6.54 Example of Timing for Idle Cycle Insertion in Case of Consecutive Read
and Write Accesses to DRAM Space in RAS Down Mode ................................... 203
Figure 6.55 Example of Timing when Write Data Buffer Function is Used ............................. 205
Figure 6.56 Bus Released State Transition Timing ................................................................... 208
Section 7 DMA Controller (DMAC)
Figure 7.1 Block Diagram of DMAC ...................................................................................... 214
Figure 7.2 Areas for Register Re-Setting by DTC (Channel 0A)............................................ 239
Figure 7.3 Operation in Sequential Mode................................................................................ 247
Figure 7.4 Example of Sequential Mode Setting Procedure.................................................... 248
Figure 7.5 Operation in Idle Mode .......................................................................................... 249
Figure 7.6 Example of Idle Mode Setting Procedure .............................................................. 251
Figure 7.7 Operation in Repeat mode...................................................................................... 254
Figure 7.8 Example of Repeat Mode Setting Procedure.......................................................... 255
Figure 7.9 Operation in Single Address Mode (When Sequential Mode is Specified)............ 257
Figure 7.10 Example of Single Address Mode Setting Procedure
(When Sequential Mode is Specified).................................................................... 258
Figure 7.11 Operation in Normal Mode .................................................................................... 260
Figure 7.12 Example of Normal Mode Setting Procedure......................................................... 261
Figure 7.13 Operation in Block Transfer Mode (BLKDIR = 0)................................................ 263
Figure 7.14 Operation in Block Transfer Mode (BLKDIR = 1)................................................ 264
Figure 7.15 Operation Flow in Block Transfer Mode ............................................................... 265
Figure 7.16 Example of Block Transfer Mode Setting Procedure............................................. 266
Figure 7.17 Example of DMA Transfer Bus Timing................................................................. 267
Figure 7.18 Example of Short Address Mode Transfer............................................................. 268
Figure 7.19 Example of Full Address Mode Transfer (Cycle Steal) ......................................... 269
Figure 7.20 Example of Full Address Mode Transfer (Burst Mode)......................................... 270
Figure 7.21 Example of Full Address Mode Transfer (Block Transfer Mode) ......................... 271
Figure 7.22 Example of DREQ Pin Falling Edge Activated Normal Mode Transfer................ 272
Figure 7.23 Example of DREQ Pin Falling Edge Activated Block Transfer Mode Transfer.... 273
Figure 7.24 Example of DREQ Pin Low Level Activated Normal Mode Transfer................... 274
Figure 7.25 Example of DREQ Pin Low Level Activated Block Transfer Mode Transfer....... 275
Figure 7.26 Example of Single Address Mode Transfer (Byte Read) ....................................... 276
Figure 7.27 Example of Single Address Mode (Word Read) Transfer...................................... 276
Figure 7.28 Example of Single Address Mode Transfer (Byte Write) ...................................... 277
Figure 7.29 Example of Single Address Mode Transfer (Word Write)..................................... 278
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Figure 7.30 Example of DREQ Pin Falling Edge Activated Single Address Mode Transfer.... 279
Figure 7.31 Example of DREQ Pin Low Level Activated Single Address Mode Transfer....... 280
Figure 7.32 Example of Dual Address Transfer Using Write Data Buffer Function................. 281
Figure 7.33 Example of Single Address Transfer Using Write Data Buffer Function .............. 282
Figure 7.34 Example of Multi-Channel Transfer ...................................................................... 283
Figure 7.35 Example of Procedure for Continuing Transfer on Channel Interrupted
by NMI Interrupt .................................................................................................... 284
Figure 7.36 Example of Procedure for Forcibly Terminating DMAC Operation...................... 285
Figure 7.37 Example of Procedure for Clearing Full Address Mode ........................................ 286
Figure 7.38 Block Diagram of Transfer End/Transfer Break Interrupt ..................................... 287
Figure 7.39 DMAC Register Update Timing ............................................................................ 288
Figure 7.40 Contention between DMAC Register Update and CPU Read................................ 289
Figure 7.41 Example in which Low Level is Not Output at TEND Pin .................................... 291
Section 8 Data Transfer Controller (DTC)
Figure 8.1 Block Diagram of DTC .......................................................................................... 294
Figure 8.2 Block Diagram of DTC Activation Source Control ............................................... 302
Figure 8.3 Correspondence between DTC Vector Address and Register Information ............ 303
Figure 8.4 Correspondence between DTC Vector Address and Register Information ............ 303
Figure 8.5 Flowchart of DTC Operation.................................................................................. 307
Figure 8.6 Memory Mapping in Normal Mode ....................................................................... 309
Figure 8.7 Memory Mapping in Repeat Mode ........................................................................ 310
Figure 8.8 Memory Mapping in Block Transfer Mode ........................................................... 311
Figure 8.9 Operation of Chain Transfer................................................................................... 312
Figure 8.10 DTC Operation Timing (Example in Normal Mode or Repeat Mode)................... 313
Figure 8.11 DTC Operation Timing (Example of Block Transfer Mode,
with Block Size of 2).............................................................................................. 313
Figure 8.12 DTC Operation Timing (Example of Chain Transfer) ........................................... 314
Figure 8.13 Chain Transfer when Counter = 0 .......................................................................... 319
Section 10 16-Bit Timer Pulse Unit (TPU)
Figure 10.1 Block Diagram of TPU........................................................................................... 404
Figure 10.2 Example of Counter Operation Setting Procedure ................................................. 439
Figure 10.3 Free-Running Counter Operation ........................................................................... 440
Figure 10.4 Periodic Counter Operation.................................................................................... 441
Figure 10.5 Example of Setting Procedure for Waveform Output by Compare Match............. 442
Figure 10.6 Example of 0 Output/1 Output Operation .............................................................. 443
Figure 10.7 Example of Toggle Output Operation .................................................................... 443
Figure 10.8 Example of Setting Procedure for Input Capture Operation................................... 444
Figure 10.9 Example of Input Capture Operation...................................................................... 445
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Figure 10.10 Example of Synchronous Operation Setting Procedure ......................................... 446
Figure 10.11 Example of Synchronous Operation....................................................................... 447
Figure 10.12 Compare Match Buffer Operation.......................................................................... 448
Figure 10.13 Input Capture Buffer Operation ............................................................................. 448
Figure 10.14 Example of Buffer Operation Setting Procedure.................................................... 449
Figure 10.15 Example of Buffer Operation (1) ........................................................................... 450
Figure 10.16 Example of Buffer Operation (2) ........................................................................... 451
Figure 10.17 Cascaded Operation Setting Procedure .................................................................. 452
Figure 10.18 Example of Cascaded Operation (1)....................................................................... 453
Figure 10.19 Example of Cascaded Operation (2)....................................................................... 453
Figure 10.20 Example of PWM Mode Setting Procedure ........................................................... 456
Figure 10.21 Example of PWM Mode Operation (1) .................................................................. 457
Figure 10.22 Example of PWM Mode Operation (2) .................................................................. 457
Figure 10.23 Example of PWM Mode Operation (3) .................................................................. 458
Figure 10.24 Example of Phase Counting Mode Setting Procedure............................................ 460
Figure 10.25 Example of Phase Counting Mode 1 Operation ..................................................... 461
Figure 10.26 Example of Phase Counting Mode 2 Operation ..................................................... 462
Figure 10.27 Example of Phase Counting Mode 3 Operation ..................................................... 463
Figure 10.28 Example of Phase Counting Mode 4 Operation ..................................................... 464
Figure 10.29 Phase Counting Mode Application Example.......................................................... 465
Figure 10.30 Count Timing in Internal Clock Operation ............................................................ 469
Figure 10.31 Count Timing in External Clock Operation ........................................................... 469
Figure 10.32 Output Compare Output Timing ............................................................................ 470
Figure 10.33 Input Capture Input Signal Timing ........................................................................ 470
Figure 10.34 Counter Clear Timing (Compare Match) ............................................................... 471
Figure 10.35 Counter Clear Timing (Input Capture) ................................................................... 471
Figure 10.36 Buffer Operation Timing (Compare Match) .......................................................... 472
Figure 10.37 Buffer Operation Timing (Input Capture) .............................................................. 472
Figure 10.38 TGI Interrupt Timing (Compare Match) ................................................................ 473
Figure 10.39 TGI Interrupt Timing (Input Capture).................................................................... 474
Figure 10.40 TCIV Interrupt Setting Timing............................................................................... 475
Figure 10.41 TCIU Interrupt Setting Timing............................................................................... 475
Figure 10.42 Timing for Status Flag Clearing by CPU ............................................................... 476
Figure 10.43 Timing for Status Flag Clearing by DTC/DMAC* Activation .............................. 476
Figure 10.44 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode ................. 477
Figure 10.45 Contention between TCNT Write and Clear Operations........................................ 478
Figure 10.46 Contention between TCNT Write and Increment Operations ................................ 479
Figure 10.47 Contention between TGR Write and Compare Match ........................................... 480
Figure 10.48 Contention between Buffer Register Write and Compare Match........................... 480
Figure 10.49 Contention between TGR Read and Input Capture ................................................ 481
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Figure 10.50 Contention between TGR Write and Input Capture ............................................... 482
Figure 10.51 Contention between Buffer Register Write and Input Capture............................... 483
Figure 10.52 Contention between Overflow and Counter Clearing ............................................ 483
Figure 10.53 Contention between TCNT Write and Overflow.................................................... 484
Section 11 Programmable Pulse Generator (PPG)
Figure 11.1 Block Diagram of PPG........................................................................................... 486
Figure 11.2 Overview Diagram of PPG..................................................................................... 495
Figure 11.3 Timing of Transfer and Output of NDR Contents (Example) ................................ 496
Figure 11.4 Setup Procedure for Normal Pulse Output (Example)............................................ 497
Figure 11.5 Normal Pulse Output Example (Five-Phase Pulse Output) .................................... 498
Figure 11.6 Non-Overlapping Pulse Output .............................................................................. 499
Figure 11.7 Non-Overlapping Operation and NDR Write Timing ............................................ 500
Figure 11.8 Setup Procedure for Non-Overlapping Pulse Output (Example)............................ 501
Figure 11.9 Non-Overlapping Pulse Output Example (Four-Phase Complementary)............... 502
Figure 11.10 Inverted Pulse Output (Example) ........................................................................... 504
Figure 11.11 Pulse Output Triggered by Input Capture (Example)............................................. 505
Section 12 8-Bit Timers (TMR)
Figure 12.1 Block Diagram of 8-Bit Timer Module.................................................................. 508
Figure 12.2 Example of Pulse Output........................................................................................ 516
Figure 12.3 Count Timing for Internal Clock Input................................................................... 516
Figure 12.4 Count Timing for External Clock Input ................................................................. 517
Figure 12.5 Timing of CMF Setting .......................................................................................... 517
Figure 12.6 Timing of Timer Output......................................................................................... 518
Figure 12.7 Timing of Compare Match Clear ........................................................................... 518
Figure 12.8 Timing of Clearance by External Reset.................................................................. 519
Figure 12.9 Timing of OVF Setting........................................................................................... 519
Figure 12.10 Contention between TCNT Write and Clear .......................................................... 522
Figure 12.11 Contention between TCNT Write and Increment................................................... 523
Figure 12.12 Contention between TCOR Write and Compare Match......................................... 524
Section 13 Watchdog Timer
Figure 13.1 Block Diagram of WDT ......................................................................................... 530
Figure 13.2 Operation in Watchdog Timer Mode...................................................................... 535
Figure 13.3 Operation in Interval Timer Mode ......................................................................... 536
Figure 13.4 Writing to TCNT, TCSR, and RSTCSR................................................................. 537
Figure 13.5 Contention between TCNT Write and Increment................................................... 538
Figure 13.6 Circuit for System Reset by WDTOVF Signal (Example)..................................... 539
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Section 14 Serial Communication Interface (SCI, IrDA)
Figure 14.1 Block Diagram of SCI............................................................................................ 543
Figure 14.2 Data Format in Asynchronous Communication (Example with 8-Bit Data,
Parity, Two Stop Bits)............................................................................................ 576
Figure 14.3 Receive Data Sampling Timing in Asynchronous Mode ....................................... 578
Figure 14.4 Relation between Output Clock and Transfer Data Phase
(Asynchronous Mode)............................................................................................ 579
Figure 14.5 Sample SCI Initialization Flowchart ...................................................................... 580
Figure 14.6 Example of Operation in Transmission in Asynchronous Mode
(Example with 8-Bit Data, Parity, One Stop Bit) ................................................... 582
Figure 14.7 Sample Serial Transmission Flowchart.................................................................. 583
Figure 14.8 Example of SCI Operation in Reception (Example with 8-Bit Data, Parity,
One Stop Bit).......................................................................................................... 584
Figure 14.9 Sample Serial Reception Data Flowchart (1) ......................................................... 586
Figure 14.9 Sample Serial Reception Data Flowchart (2) ......................................................... 587
Figure 14.10 Example of Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A) ........................................... 589
Figure 14.11 Sample Multiprocessor Serial Transmission Flowchart......................................... 590
Figure 14.12 Example of SCI Operation in Reception (Example with 8-Bit Data,
Multiprocessor Bit, One Stop Bit).......................................................................... 592
Figure 14.13 Sample Multiprocessor Serial Reception Flowchart (1)......................................... 593
Figure 14.13 Sample Multiprocessor Serial Reception Flowchart (2)......................................... 594
Figure 14.14 Data Format in Clocked Synchronous Communication (For LSB-First) ............... 595
Figure 14.15 Sample SCI Initialization Flowchart ...................................................................... 596
Figure 14.16 Sample SCI Transmission Operation in Clocked Synchronous Mode ................... 598
Figure 14.17 Sample Serial Transmission Flowchart .................................................................. 599
Figure 14.18 Example of SCI Operation in Reception ................................................................ 600
Figure 14.19 Sample Serial Reception Flowchart ....................................................................... 601
Figure 14.20 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations ....... 603
Figure 14.21 Schematic Diagram of Smart Card Interface Pin Connections............................... 604
Figure 14.22 Normal Smart Card Interface Data Format ............................................................ 605
Figure 14.23 Direct Convention (SDIR = SINV = O/E = 0) ....................................................... 605
Figure 14.24 Inverse Convention (SDIR = SINV = O/E = 1) ..................................................... 606
Figure 14.25 Receive Data Sampling Timing in Smart Card Mode
(Using Clock of 372 Times the Bit Rate)............................................................... 607
Figure 14.26 Retransfer Operation in SCI Transmit Mode ......................................................... 609
Figure 14.27 TEND Flag Generation Timing in Transmission Operation .................................. 610
Figure 14.28 Example of Transmission Processing Flow ........................................................... 611
Figure 14.29 Retransfer Operation in SCI Receive Mode........................................................... 612
Figure 14.30 Example of Reception Processing Flow................................................................. 613
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Figure 14.31 Timing for Fixing Clock Output Level................................................................... 614
Figure 14.32 Clock Halt and Restart Procedure .......................................................................... 615
Figure 14.33 Block Diagram of IrDA.......................................................................................... 616
Figure 14.34 IrDA Transmit/Receive Operations........................................................................ 617
Figure 14.35 Example of Synchronous Transmission Using DTC.............................................. 623
Figure 14.36 Sample Flowchart for Mode Transition during Transmission................................ 625
Figure 14.37 Port Pin States during Mode Transition (Internal Clock, Asynchronous
Transmission)........................................................................................................ 626
Figure 14.38 Port Pin States during Mode Transition (Internal Clock,
Synchronous Transmission) ................................................................................... 626
Figure 14.39 Sample Flowchart for Mode Transition during Reception ..................................... 627
Section 15 I2C Bus Interface2 (IIC2) (Option)
Figure 15.1 Block Diagram of I2C Bus Interface2..................................................................... 630
Figure 15.2 External Circuit Connections of I/O Pins ............................................................... 631
Figure 15.3 I2C Bus Formats...................................................................................................... 643
Figure 15.4 I2C Bus Timing....................................................................................................... 643
Figure 15.5 Master Transmit Mode Operation Timing 1........................................................... 645
Figure 15.6 Master Transmit Mode Operation Timing 2........................................................... 646
Figure 15.7 Master Receive Mode Operation Timing 1 ............................................................ 647
Figure 15.8 Master Receive Mode Operation Timing 2 ............................................................ 648
Figure 15.9 Slave Transmit Mode Operation Timing 1............................................................. 649
Figure 15.10 Slave Transmit Mode Operation Timing 2............................................................. 650
Figure 15.11 Slave Receive Mode Operation Timing 1 .............................................................. 651
Figure 15.12 Slave Receive Mode Operation Timing 2 .............................................................. 652
Figure 15.13 Block Diagram of Noise Canceler.......................................................................... 653
Figure 15.14 Sample Flowchart for Master Transmit Mode........................................................ 654
Figure 15.15 Sample Flowchart for Master Receive Mode ......................................................... 655
Figure 15.16 Sample Flowchart for Slave Transmit Mode.......................................................... 656
Figure 15.17 Sample Flowchart for Slave Receive Mode ........................................................... 657
Figure 15.18 Timing of the Bit Synchronous Circuit .................................................................. 659
Section 16 A/D Converter................................................................................. 661
Figure 16.1 Block Diagram of A/D Converter ..........................................................................662
Figure 16.2 A/D Conversion Timing.........................................................................................671
Figure 16.3 External Trigger Input Timing ...............................................................................673
Figure 16.4 A/D Conversion Precision Definitions................................................................... 675
Figure 16.5 A/D Conversion Precision Definitions................................................................... 675
Figure 16.6 Example of Analog Input Circuit ...........................................................................676
Figure 16.7 Example of Analog Input Protection Circuit.......................................................... 678
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Section 17 D/A Converter
Figure 17.1 Block Diagram of D/A Converter .......................................................................... 682
Figure 17.2 Example of D/A Converter Operation.................................................................... 686
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Figure 19.1 Block Diagram of Flash Memory........................................................................... 690
Figure 19.2 Flash Memory State Transitions............................................................................. 691
Figure 19.3 Boot Mode.............................................................................................................. 693
Figure 19.4 User Program Mode ............................................................................................... 694
Figure 19.5 384-kbyte Flash Memory Block Configuration (Modes 3, 4, and 7)...................... 696
Figure 19.6 Programming/Erasing Flowchart Example in User Program Mode....................... 705
Figure 19.7 Program/Program-Verify Flowchart ...................................................................... 707
Figure 19.8 Erase/Erase-Verify Flowchart ................................................................................ 709
Figure 19.9 Power-On/Off Timing ............................................................................................ 714
Figure 19.10 Mode Transition Timing (Example: Boot Mode → User Mode ↔
User Program Mode).............................................................................................. 715
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Figure 20.1 Block Diagram of Flash Memory........................................................................... 719
Figure 20.2 Mode Transition of Flash Memory ........................................................................ 720
Figure 20.3 Flash Memory Configuration ................................................................................. 722
Figure 20.4 Block Division of User MAT................................................................................. 723
Figure 20.5 Overview of User Procedure Program ................................................................... 724
Figure 20.6 System Configuration in Boot Mode...................................................................... 749
Figure 20.7 Automatic-Bit-Rate Adjustment Operation of SCI ................................................ 749
Figure 20.8 Overview of Boot Mode State Transition Diagram................................................ 752
Figure 20.9 Programming/Erasing Overview Flow................................................................... 753
Figure 20.10 RAM Map when Programming/Erasing Is Executed ............................................. 754
Figure 20.11 Programming Procedure......................................................................................... 755
Figure 20.12 Erasing Procedure .................................................................................................. 762
Figure 20.13 Procedure for Programming User MAT in User Boot Mode ................................. 765
Figure 20.14 Procedure for Erasing User MAT in User Boot Mode........................................... 767
Figure 20.15 Transitions to Error-Protection State...................................................................... 780
Figure 20.16 Switching between the User MAT and User Boot MAT ....................................... 781
Figure 20.17 Boot Program States............................................................................................... 783
Figure 20.18 Bit-Rate-Adjustment Sequence .............................................................................. 784
Figure 20.19 Communication Protocol Format ........................................................................... 785
Figure 20.20 New Bit-Rate Selection Sequence.......................................................................... 796
Figure 20.21 Programming Sequence.......................................................................................... 801
Figure 20.22 Erasure Sequence ................................................................................................... 804
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Section 21 Mask ROM
Figure 21.1 Block Diagram of 256-kbyte Mask ROM (HD6432365)....................................... 811
Section 22 Clock Pulse Generator
Figure 22.1 Block Diagram of Clock Pulse Generator .............................................................. 813
Figure 22.2 Connection of Crystal Oscillator (Example) .......................................................... 816
Figure 22.3 Crystal Oscillator Equivalent Circuit ..................................................................... 816
Figure 22.4 External Clock Input (Examples) ........................................................................... 817
Figure 22.5 External Clock Input Timing.................................................................................. 818
Figure 22.6 Note on Oscillator Board Design ........................................................................... 820
Figure 22.7 Recommended External Circuitry for PLL Circuit ................................................ 821
Section 23 Power-Down Modes
Figure 23.1 Mode Transitions.................................................................................................... 825
Figure 23.2 Software Standby Mode Application Example ...................................................... 833
Figure 23.3 Hardware Standby Mode Timing ........................................................................... 834
Figure 23.4 Hardware Standby Mode Timing when Power Is Supplied ................................... 835
Section 25 Electrical Characteristics
Figure 25.1 Output Load Circuit................................................................................................ 877
Figure 25.2 System Clock Timing............................................................................................. 878
Figure 25.3 Oscillation Stabilization Timing (1)....................................................................... 879
Figure 25.3 Oscillation Stabilization Timing (2)....................................................................... 879
Figure 25.4 Reset Input Timing................................................................................................. 880
Figure 25.5 Interrupt Input Timing............................................................................................ 881
Figure 25.6 Basic Bus Timing: Two-State Access .................................................................... 886
Figure 25.7 Basic Bus Timing: Three-State Access .................................................................. 887
Figure 25.8 Basic Bus Timing: Three-State Access, One Wait................................................. 888
Figure 25.9 Basic Bus Timing: Two-State Access (CS Assertion Period Extended) ................ 889
Figure 25.10 Basic Bus Timing: Three-State Access (CS Assertion Period Extended) .............. 890
Figure 25.11 Burst ROM Access Timing: One-State Burst Access ............................................ 891
Figure 25.12 Burst ROM Access Timing: Two-State Burst Access............................................ 892
Figure 25.13 DRAM Access Timing: Two-State Access ............................................................ 893
Figure 25.14 DRAM Access Timing: Two-State Access, One Wait........................................... 894
Figure 25.15 DRAM Access Timing: Two-State Burst Access .................................................. 895
Figure 25.16 DRAM Access Timing: Three-State Access (RAST = 1) ...................................... 896
Figure 25.17 DRAM Access Timing: Three-State Burst Access ................................................ 897
Figure 25.18 CAS-Before-RAS Refresh Timing......................................................................... 898
Figure 25.19 CAS-Before-RAS Refresh Timing (with Wait Cycle Insertion)............................ 898
Figure 25.20 Self-Refresh Timing (Return from Software Standby Mode: RAST = 0).............. 899
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REJ09B0050-0600
Figure 25.21 Self-Refresh Timing (Return from Software Standby Mode: RAST = 1).............. 899
Figure 25.22 External Bus Release Timing................................................................................. 900
Figure 25.23 External Bus Request Output Timing..................................................................... 900
Figure 25.24 DMAC Single Address Transfer Timing: Two-State Access................................. 902
Figure 25.25 DMAC Single Address Transfer Timing: Three-State Access............................... 903
Figure 25.26 DMAC TEND Output Timing ............................................................................... 903
Figure 25.27 DMAC DREQ Input Timing.................................................................................. 904
Figure 25.28 I/O Port Input/Output Timing................................................................................. 906
Figure 25.29 PPG Output Timing................................................................................................ 906
Figure 25.30 TPU Input/Output Timing...................................................................................... 906
Figure 25.31 TPU Clock Input Timing........................................................................................ 907
Figure 25.32 8-Bit Timer Output Timing .................................................................................... 907
Figure 25.33 8-Bit Timer Clock Input Timing ............................................................................ 907
Figure 25.34 8-Bit Timer Reset Input Timing............................................................................. 907
Figure 25.35 WDT Output Timing.............................................................................................. 908
Figure 25.36 SCK Clock Input Timing ....................................................................................... 908
Figure 25.37 SCI Input/Output Timing: Synchronous Mode ...................................................... 908
Figure 25.38 A/D Converter External Trigger Input Timing....................................................... 908
Figure 25.39 I2C Bus Interface Input/Output Timing (Option).................................................... 909
Appendix
Figure C.1 Package Dimensions (TFP-120)............................................................................. 950
Figure C.2 Package Dimensions (FP-128B) ............................................................................ 951
Figure D.1 Timing of Address Bus, RD, HWR, and LWR
(8-bit bus, 3-state access, no wait).......................................................................... 953
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Tables
Section 1 Overview
Table 1.1 Pin Arrangement in Each Operating Mode ............................................................ 8
Table 1.2 Pin Functions.......................................................................................................... 14
Section 2 CPU
Table 2.1 Instruction Classification........................................................................................ 37
Table 2.2 Operation Notation................................................................................................. 38
Table 2.3 Data Transfer Instructions ...................................................................................... 39
Table 2.4 Arithmetic Operations Instructions ........................................................................ 40
Table 2.5 Logic Operations Instructions ................................................................................ 42
Table 2.6 Shift Instructions .................................................................................................... 42
Table 2.7 Bit Manipulation Instructions................................................................................. 43
Table 2.8 Branch Instructions................................................................................................. 45
Table 2.9 System Control Instructions ................................................................................... 46
Table 2.10 Block Data Transfer Instructions............................................................................ 47
Table 2.11 Addressing Modes.................................................................................................. 49
Table 2.12 Absolute Address Access Ranges .......................................................................... 51
Table 2.13 Effective Address Calculation................................................................................ 53
Section 3 MCU Operating Modes
Table 3.1 MCU Operating Mode Selection............................................................................ 57
Table 3.2 Pin Functions in Each Operating Mode.................................................................. 62
Section 4 Exception Handling
Table 4.1 Exception Types and Priority ................................................................................. 79
Table 4.2 Exception Handling Vector Table.......................................................................... 80
Table 4.3 Status of CCR and EXR after Trace Exception Handling...................................... 84
Table 4.4 Status of CCR and EXR after Trap Instruction Exception Handling ..................... 85
Section 5 Interrupt Controller
Table 5.1 Pin Configuration ................................................................................................... 91
Table 5.2 Interrupt Sources, Vector Addresses, and Interrupt Priorities ................................ 103
Table 5.3 Interrupt Control Modes......................................................................................... 108
Table 5.4 Interrupt Response Times....................................................................................... 114
Table 5.5 Number of States in Interrupt Handling Routine Execution Statuses..................... 115
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Section 6 Bus Controller (BSC)
Table 6.1 Pin Configuration ................................................................................................... 121
Table 6.2 Bus Specifications for Each Area (Basic Bus Interface)........................................ 147
Table 6.3 Data Buses Used and Valid Strobes ....................................................................... 152
Table 6.4 Relation between Settings of Bits RMTS2 to RMTS0 and DRAM Space............. 165
Table 6.5 Relation between Settings of Bits MXC2 to MXC0 and Address Multiplexing.... 166
Table 6.6 DRAM Interface Pins............................................................................................. 167
Table 6.7 Idle Cycles in Mixed Accesses to Normal Space and DRAM ............................... 201
Table 6.8 Pin States in Idle Cycle .......................................................................................... 204
Table 6.9 Pin States in Bus Released State ............................................................................ 207
Section 7 DMA Controller (DMAC)
Table 7.1 Pin Configuration ................................................................................................... 215
Table 7.3 DMAC Activation Sources .................................................................................... 241
Table 7.4 DMAC Transfer Modes ......................................................................................... 244
Table 7.5 Register Functions in Sequential Mode.................................................................. 246
Table 7.6 Register Functions in Idle Mode ............................................................................ 249
Table 7.7 Register Functions in Repeat Mode ....................................................................... 252
Table 7.8 Register Functions in Single Address Mode .......................................................... 256
Table 7.9 Register Functions in Normal Mode ...................................................................... 259
Table 7.10 Register Functions in Block Transfer Mode........................................................... 262
Table 7.11 DMAC Channel Priority Order .............................................................................. 282
Table 7.12 Interrupt Sources and Priority Order ...................................................................... 287
Section 8 Data Transfer Controller (DTC)
Table 8.1 Relationship between Activation Sources and DTCER Clearing........................... 301
Table 8.2 Interrupt Sources, DTC Vector Addresses, and Corresponding DTCEs................ 304
Table 8.3 Chain Transfer Conditions ..................................................................................... 308
Table 8.4 Register Function in Normal Mode........................................................................ 308
Table 8.5 Register Function in Repeat Mode......................................................................... 309
Table 8.6 Register Function in Block Transfer Mode ............................................................ 310
Table 8.7 DTC Execution Status............................................................................................ 314
Table 8.8 Number of States Required for Each Execution Status.......................................... 315
Section 9 I/O Ports
Table 9.1 Port Functions ........................................................................................................ 324
Table 9.2 MOS Input Pull-Up States (Port A)........................................................................ 372
Table 9.3 MOS Input Pull-Up States (Port B)........................................................................ 376
Table 9.4 MOS Input Pull-Up States (Port C)........................................................................ 380
Table 9.5 MOS Input Pull-Up States (Port D)........................................................................ 384
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Table 9.6 MOS Input Pull-Up States (Port E) ........................................................................ 388
Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.1 TPU Functions........................................................................................................ 402
Table 10.2 Pin Configuration ................................................................................................... 405
Table 10.3 CCLR2 to CCLR0 (Channels 0 and 3)................................................................... 409
Table 10.4 CCLR2 to CCLR0 (Channels 1, 2, 4, and 5).......................................................... 409
Table 10.5 TPSC2 to TPSC0 (Channel 0)................................................................................ 410
Table 10.6 TPSC2 to TPSC0 (Channel 1)................................................................................ 410
Table 10.7 TPSC2 to TPSC0 (Channel 2)................................................................................ 411
Table 10.8 TPSC2 to TPSC0 (Channel 3)................................................................................ 411
Table 10.9 TPSC2 to TPSC0 (Channel 4)................................................................................ 412
Table 10.10 TPSC2 to TPSC0 (Channel 5)................................................................................ 412
Table 10.11 MD3 to MD0.......................................................................................................... 414
Table 10.12 TIORH_0................................................................................................................ 416
Table 10.13 TIORL_0 ................................................................................................................ 417
Table 10.14 TIOR_1 .................................................................................................................. 418
Table 10.15 TIOR_2 .................................................................................................................. 419
Table 10.16 TIORH_3................................................................................................................ 420
Table 10.17 TIORL_3 ................................................................................................................ 421
Table 10.18 TIOR_4 .................................................................................................................. 422
Table 10.19 TIOR_5 .................................................................................................................. 423
Table 10.20 TIORH_0................................................................................................................ 424
Table 10.21 TIORL_0 ................................................................................................................ 425
Table 10.22 TIOR_1 .................................................................................................................. 426
Table 10.23 TIOR_2 .................................................................................................................. 427
Table 10.24 TIORH_3................................................................................................................ 428
Table 10.25 TIORL_3 ................................................................................................................ 429
Table 10.26 TIOR_4 .................................................................................................................. 430
Table 10.27 TIOR_5 .................................................................................................................. 431
Table 10.28 Register Combinations in Buffer Operation........................................................... 448
Table 10.29 Cascaded Combinations ......................................................................................... 452
Table 10.30 PWM Output Registers and Output Pins................................................................ 455
Table 10.31 Clock Input Pins in Phase Counting Mode............................................................. 459
Table 10.32 Up/Down-Count Conditions in Phase Counting Mode 1 ....................................... 461
Table 10.33 Up/Down-Count Conditions in Phase Counting Mode 2 ....................................... 462
Table 10.34 Up/Down-Count Conditions in Phase Counting Mode 3 ...................................... 463
Table 10.35 Up/Down-Count Conditions in Phase Counting Mode 4 ....................................... 464
Table 10.36 TPU Interrupts........................................................................................................ 467
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Section 11 Programmable Pulse Generator (PPG)
Table 11.1 Pin Configuration ................................................................................................... 487
Section 12 8-Bit Timers (TMR)
Table 12.1 Pin Configuration ................................................................................................... 509
Table 12.2 Clock Input to TCNT and Count Condition ........................................................... 512
Table 12.3 8-Bit Timer Interrupt Sources ................................................................................ 521
Table 12.4 Timer Output Priorities .......................................................................................... 525
Table 12.5 Switching of Internal Clock and TCNT Operation ................................................ 526
Section 13 Watchdog Timer
Table 13.1 Pin Configuration ................................................................................................... 530
Table 13.2 WDT Interrupt Source............................................................................................ 536
Section 14 Serial Communication Interface (SCI, IrDA)
Table 14.1 Pin Configuration ................................................................................................... 544
Table 14.2 Relationships between N Setting in BRR and Bit Rate B ...................................... 564
Table 14.3 BRR Settings for Various Bit Rates (Asynchronous Mode) .................................. 565
Table 14.4 Maximum Bit Rate for Each Frequency (Asynchronous Mode)............................ 567
Table 14.5 Maximum Bit Rate with External Clock Input (Asynchronous Mode).................. 568
Table 14.6 BRR Settings for Various Bit Rates (Clocked Synchronous Mode) ...................... 569
Table 14.7 Maximum Bit Rate with External Clock Input (Clocked Synchronous Mode)...... 570
Table 14.8 Examples of Bit Rate for Various BRR Settings (Smart Card Interface Mode)
(when n = 0 and S = 372) ....................................................................................... 571
Table 14.9 Maximum Bit Rate at Various Frequencies (Smart Card Interface Mode)
(when S = 372)....................................................................................................... 572
Table 14.10 Serial Transfer Formats (Asynchronous Mode) ..................................................... 577
Table 14.11 SSR Status Flags and Receive Data Handling........................................................ 585
Table 14.12 Settings of Bits IrCKS2 to IrCKS0 ........................................................................ 618
Table 14.13 SCI Interrupt Sources............................................................................................. 620
Table 14.14 Interrupt Sources .................................................................................................... 621
Section 15 I2C Bus Interface2 (IIC2) (Option)
Table 15.1 Pin Configuration ................................................................................................... 631
Table 15.2 Transfer Rate.......................................................................................................... 634
Table 15.3 Interrupt Requests .................................................................................................. 658
Table 15.4 Time for monitoring SCL....................................................................................... 659
Section 16 A/D Converter
Table 16.1 Pin Configuration ................................................................................................... 663
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Table 16.2 Analog Input Channels and Corresponding ADDR Registers................................ 665
Table 16.3 A/D Conversion Time (Single Mode) .................................................................... 672
Table 16.4 A/D Conversion Time (Scan Mode)....................................................................... 672
Table 16.5 A/D Converter Interrupt Source ............................................................................. 673
Table 16.6 Analog Pin Specifications ...................................................................................... 679
Section 17 D/A Converter
Table 17.1 Pin Configuration ................................................................................................... 683
Table 17.2 Control of D/A Conversion .................................................................................... 685
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Table 19.1 Differences between Boot Mode and User Program Mode.................................... 692
Table 19.2 Pin Configuration ................................................................................................... 697
Table 19.3 Erase Blocks........................................................................................................... 701
Table 19.4 Setting On-Board Programming Mode................................................................... 702
Table 19.5 Boot Mode Operation............................................................................................. 704
Table 19.6 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate
is Possible............................................................................................................... 705
Table 19.7 Flash Memory Operating States ............................................................................. 711
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Table 20.1 Comparison of Programming Modes ..................................................................... 721
Table 20.2 Pin Configuration ................................................................................................... 726
Table 20.3 Register/Parameter and Target Mode..................................................................... 727
Table 20.4 Parameters and Target Modes ................................................................................ 736
Table 20.5 Setting On-Board Programming Mode................................................................... 748
Table 20.6 System Clock Frequency for Automatic-Bit-Rate Adjustment by This LSI .......... 750
Table 20.7 Executable MAT .................................................................................................... 769
Table 20.8 (1) Useable Area for Programming in User Program Mode ...................................... 770
Table 20.8 (2) Useable Area for Erasure in User Program Mode................................................ 772
Table 20.8 (3) Useable Area for Programming in User Boot Mode ............................................ 774
Table 20.8 (4) Useable Area for Erasure in User Boot Mode...................................................... 776
Table 20.9 Hardware Protection............................................................................................... 778
Table 20.10 Software Protection ................................................................................................ 779
Table 20.11 Inquiry and Selection Commands .......................................................................... 786
Table 20.12 Programming/Erasing Command ........................................................................... 799
Table 20.13 Status Code............................................................................................................. 808
Table 20.14 Error Code.............................................................................................................. 809
Table 20.15 User Branch Processing Start Intervals .................................................................. 810
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Section 22 Clock Pulse Generator
Table 22.1 Damping Resistance Value .................................................................................... 816
Table 22.2 Crystal Oscillator Characteristics........................................................................... 817
Table 22.3 External Clock Input Conditions............................................................................ 818
Section 23 Power-Down Modes
Table 23.1 Operating Modes and Internal States of the LSI .................................................... 824
Table 23.2 Oscillation Stabilization Time Settings.................................................................. 832
Table 23.3 φ Pin State in Each Processing State ...................................................................... 836
Section 25 Electrical Characteristics
Table 25.1 Absolute Maximum Ratings................................................................................... 873
Table 25.2 DC Characteristics (1)............................................................................................ 874
Table 25.3 DC Characteristics (2)............................................................................................ 875
Table 25.4 Permissible Output Currents .................................................................................. 876
Table 25.5 Clock Timing ......................................................................................................... 878
Table 25.6 Control Signal Timing............................................................................................ 880
Table 25.7 Bus Timing (1) ....................................................................................................... 882
Table 25.8 Bus Timing (2) ....................................................................................................... 884
Table 25.9 DMAC Timing....................................................................................................... 901
Table 25.10 Timing of On-Chip Peripheral Modules................................................................. 904
Table 25.11 A/D Conversion Characteristics............................................................................. 910
Table 25.12 D/A Conversion Characteristics............................................................................. 910
Table 25.13 Absolute Maximum Ratings................................................................................... 911
Table 25.14 DC Characteristics (1)............................................................................................ 912
Table 25.15 DC Characteristics (2)............................................................................................ 913
Table 25.16 Permissible Output Currents .................................................................................. 914
Table 25.17 Clock Timing ......................................................................................................... 915
Table 25.18 Control Signal Timing............................................................................................ 916
Table 25.19 Bus Timing (1) ....................................................................................................... 917
Table 25.20 Bus Timing (2) ....................................................................................................... 919
Table 25.21 DMAC Timing....................................................................................................... 920
Table 25.22 Timing of On-Chip Peripheral Modules................................................................. 921
Table 25.23 A/D Conversion Characteristics............................................................................. 923
Table 25.24 D/A Conversion Characteristics............................................................................. 923
Table 25.25 Flash Memory Characteristics................................................................................ 924
Table 25.26 Absolute Maximum Ratings................................................................................... 926
Table 25.27 DC Characteristics.................................................................................................. 927
Table 25.28 DC Characteristics.................................................................................................. 928
Table 25.29 Permissible Output Currents .................................................................................. 929
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REJ09B0050-0600
Table 25.30 Clock Timing.......................................................................................................... 930
Table 25.31 Control Signal Timing............................................................................................ 931
Table 25.32 Bus Timing (1) ....................................................................................................... 932
Table 25.33 Bus Timing (2) ....................................................................................................... 934
Table 25.34 DMAC Timing ....................................................................................................... 935
Table 25.35 Timing of On-Chip Peripheral Modules................................................................. 936
Table 25.36 A/D Conversion Characteristics ............................................................................. 938
Table 25.37 D/A Conversion Characteristics ............................................................................. 938
Table 25.38 Flash Memory Characteristics (0.18-μm F-ZTAT Version) .................................. 939
Appendix
Table D.1 Execution State of Instructions............................................................................... 954
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Section 1 Overview
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REJ09B0050-0600
Section 1 Overview
1.1 Features
• High-speed H8S/2000 central processing unit with an internal 16-bit architecture
Upward-compatible with H8/300 and H8/300H CPUs on an object level
Sixteen 16-bit general registers
65 basic instructions
• Various peripheral functions
DMA controller (DMAC)
Data transfer controller (DTC)
16-bit timer-pulse unit (TPU)
Programmable pulse generator (PPG)
8-bit timer (TMR)
Watchdog timer (WDT)
Asynchronous or clocked synchronous serial communication interface (SCI)
I2C bus interface 2 (IIC2)
10-bit A/D converter
8-bit D/A converter
Clock pulse generator
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 2 of 980
REJ09B0050-0600
• On-chip memory
ROM Type Model ROM RAM Remarks
Flash memory version HD64F2368F 512 kbytes 32 kbytes H8S/2368
0.18 μm F-ZTAT Group
HD64F2367F 384 kbytes 24 kbytes
HD64F2364 384 kbytes 32 kbytes H8S/2368
0.18 μm F-ZTAT Group
HD64F2362F 256 kbytes 32 kbytes H8S/2368
0.18 μm F-ZTAT Group
HD64F2361 256 kbytes 24 kbytes H8S/2368
0.18 μm F-ZTAT Group
HD64F2360 256 kbytes 16 kbytes H8S/2368
0.18 μm F-ZTAT Group
Masked ROM version HD6432365 256 kbytes 16 kbytes
ROMless version HD6412363 ⎯ 16 kbytes
• General I/O ports
I/O pins: 83
Input-only pins: 11
• Supports various power-down states
• Compact package
Package Code Body Size Pin Pitch
TFP-120 TFP-120 (TFP-120V*1) 14.0 × 14.0 mm 0.4 mm
QFP-128*2 FP-128B (FP-128BV*1) 14.0 × 20.0 mm 0.5 mm
Notes: 1. Pb free version
2. Not supported by the H8S/2368 0.18 μm F-ZTAT Group.
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 3 of 980
REJ09B0050-0600
1.2 Block Diagram
Figures 1.1 and 1.2 show the internal block diagrams of this LSI.
PE7/D7
PE6/D6
PE5/D5
PE4/D4
PE3/D3
PE2/D2
PE1/D1
PE0/D0
PD7/D15
PD6/D14
PD5/D13
PD4/D12
PD3/D11
PD2/D10
PD1/D9
PD0/D8
V
CC
V
CC
V
CC
V
CC
V
CC
PLLV
CC
PLLV
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
PB7/A15
PB6/A14
PB5/A13
PB4/A12
PB3/A11
PB2/A10
PB1/A9
PB0/A8
PC7/A7
PC6/A6
PC5/A5
PC4/A4
PC3/A3
PC2/A2
PC1/A1
PC0/A0
P47/AN7/(IRQ7)
P46/AN6/(IRQ6)
P45/AN5/(IRQ5)
P44/AN4/(IRQ4)
P43/AN3/(IRQ3)
P42/AN2/(IRQ2)
P41/AN1/(IRQ1)
P40/AN0/(IRQ0)
Vref
AV
CC
AV
SS
P10/PO8/TIOCA0/DREQ0
P11/PO9/TIOCB0/DREQ1
P12/PO10/TIOCC0/TCLKA/TEND0
P13/PO11/TIOCD0/TCLKB/TEND1
P14/PO12/TIOCA1/DACK0
P15/PO13/TIOCB1/TCLKC/DACK1
P16/PO14/TIOCA2
P17/PO15/TIOCB2/TCLKD
P85/SCK3
P83/RxD3
P81/TxD3
PG6/BREQ
PG5/BACK
PG4/CS4/BREQO
PG3/CS3/RAS3
PG2/CS2/RAS2
PG1/CS1
PG0/CS0
PF7/
φ
PF6/AS
PF5/RD
PF4/HWR
PF3/LWR
PF2/CS6/LCAS
PF1
/
CS5/UCAS
PF0/WAIT/OE
RAM
WDT
H8S/2000 CPU
DTC
DMAC
PLL
PA7/A23/CS7/IRQ7
PA6/A22/IRQ6
PA5/A21/IRQ5
PA4/A20/IRQ4
PA3/A19
PA2/A18
PA1/A17
PA0/A16
P20/PO0/TIOCA3/TMRI0
P21/PO1/TIOCB3/TMRI1
P22/PO2/TIOCC3/TMCI0
P23/PO3/TIOCD3/TxD4/TMCI1
P24/PO4/TIOCA4/RxD4/TMO0
P25/PO5/TIOCB4/TMO1
P26/PO6/TIOCA5
P27/PO7/TIOCB5
MD2
MD1
MD0
EXTAL
XTAL
EMLE
STBY
RES
WDTOVF
NMI
P95/AN13/DA3
P94/AN12/DA2
P35/SCK1/SCL0/(OE)
P34/SCK0/SCK4/SDA0
P33/RxD1/SCL1
P32/RxD0/IrRxD/SDA1
P31/TxD1
P30/TxD0/IrTxD
P53/ADTRG//IRQ3
P52/SCK2/IRQ2
P51/RxD2/IRQ1
P50/TxD2/IRQ0
Port D Port E
Port 1
Note: * The ROMless version has no on-chip ROM.
Port 2 Port 4 Port 9
Port APort BPort CPort 5 Port 3
Port FPort GPort 8
Clock
pulse
generator
Interrupt controller
ROM
(Flash memory
Mask ROM)
*
TPU × 6 channels
PPG
TMR × 2 channels
SCI
× 5 channels
I
2
C bus interface 2 (option)
8-bit D/A converter
10-bit A/D converter
Bus controller
Internal data bus
Internal address bus
Peripheral data bus
Peripheral address bus
Figure 1.1 Internal Block Diagram of H8S/2367F, H8S/2365, and H8S/2363
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 4 of 980
REJ09B0050-0600
PE7/D7
PE6/D6
PE5/D5
PE4/D4
PE3/D3
PE2/D2
PE1/D1
PE0/D0
PD7/D15
PD6/D14
PD5/D13
PD4/D12
PD3/D11
PD2/D10
PD1/D9
PD0/D8
V
CC
V
CC
V
CC
V
CC
PLLV
CC
PLLV
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
PB7/A15
PB6/A14
PB5/A13
PB4/A12
PB3/A11
PB2/A10
PB1/A9
PB0/A8
PC7/A7
PC6/A6
PC5/A5
PC4/A4
PC3/A3
PC2/A2
PC1/A1
PC0/A0
P47/AN7/(IRQ7)
P46/AN6/(IRQ6)
P45/AN5/(IRQ5)
P44/AN4/(IRQ4)
P43/AN3/(IRQ3)
P42/AN2/(IRQ2)
P41/AN1/(IRQ1)
P40/AN0/(IRQ0)
Vref
AV
CC
AV
SS
P10/PO8/TIOCA0/DREQ0
P11/PO9/TIOCB0/DREQ1
P12/PO10/TIOCC0/TCLKA/TEND0
P13/PO11/TIOCD0/TCLKB/TEND1
P14/PO12/TIOCA1/DACK0
P15/PO13/TIOCB1/TCLKC/DACK1
P16/PO14/TIOCA2
P17/PO15/TIOCB2/TCLKD
P85/SCK3
P83/RxD3
P81/TxD3
PG6/BREQ
PG5/BACK
PG4/CS4/BREQO
PG3/CS3/RAS3
PG2/CS2/RAS2
PG1/CS1
PG0/CS0
PF7/
φ
PF6/AS
PF5/RD
PF4/HWR
PF3/LWR
PF2/CS6/LCAS
PF1
/
CS5/UCAS
PF0/WAIT/OE
RAM
WDT
H8S/2000 CPU
DTC
DMAC
PLL
PA7/A23/CS7/IRQ7
PA6/A22/IRQ6
PA5/A21/IRQ5
PA4/A20/IRQ4
PA3/A19
PA2/A18
PA1/A17
PA0/A16
P20/PO0/TIOCA3/TMRI0
P21/PO1/TIOCB3/TMRI1
P22/PO2/TIOCC3/TMCI0
P23/PO3/TIOCD3/TxD4/TMCI1
P24/PO4/TIOCA4/RxD4/TMO0
P25/PO5/TIOCB4/TMO1
P26/PO6/TIOCA5
P27/PO7/TIOCB5
MD2
MD1
MD0
EXTAL
XTAL
EMLE
STBY
RES
WDTOVF
NMI
P95/AN13/DA3
P94/AN12/DA2
P35/SCK1/SCL0/(OE)
P34/SCK0/SCK4/SDA0
P33/RxD1/SCL1
P32/RxD0/IrRxD/SDA1
P31/TxD1
P30/TxD0/IrTxD
P53/ADTRG//IRQ3
P52/SCK2/IRQ2
P51/RxD2/IRQ1
P50/TxD2/IRQ0
Port D Port E
Port 1 Port 2 Port 4 Port 9
Port APort BPort CPort 5 Port 3
Port FPort GPort 8
Clock
pulse
generator
Interrupt controller
ROM
(Flash memory)
TPU × 6 channels
PPG
TMR × 2 channels
SCI × 5 channels
I
2
C bus interface 2 (option)
8-bit D/A converter
10-bit A/D converter
Bus controller
Internal data bus
Internal address bus
Peripheral data bus
Peripheral address bus
V
CL
Figure 1.2 Internal Block Diagram of H8S/2368 0.18 μm F-ZTAT Group
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 5 of 980
REJ09B0050-0600
1.3 Pin Description
1.3.1 Pin Arrangement
Figures 1.3 to 1.5 show the pin arrangements of this LSI.
TFP-120
(Top view)
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120
1
2
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53
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65
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63
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61
PG2/CS2/RAS2
PG3/CS3/RAS3
AVCC
Vref
P40/AN0/(IRQ0)
P41/AN1/(IRQ1)
P42/AN2/(IRQ2)
P43/AN3/(IRQ3)
P44/AN4/(IRQ4)
P45/AN5/(IRQ5)
P46/AN6/(IRQ6)
P47/AN7/(IRQ7)
P94/AN12/DA2
P95/AN13/DA3
AVSS
PG4/CS4/BREQO
PG5/BACK
PG6/BREQ
P50/TxD2/IRQ0
P51/RxD2/IRQ1
P52/SCK2/IRQ2
P53/ADTRG/IRQ3
P35/SCK1/SCL0/(OE)
P34/SCK0/SCK4/SDA0
P33/RxD1/SCL1
P32/RxD0/IrRxD/SDA1
P31/TxD1
P30/TxD0/IrTxD
MD0
MD1
VCC
PE7/D7
VSS
PE6/D6
PE5/D5
PE4/D4
PE3/D3
PE2/D2
PE1/D1
PE0/D0
P85/SCK3
P27/PO7/TIOCB5
P26/PO6/TIOCA5
P25/PO5/TIOCB4/TMO1
P24/PO4/TIOCA4/TMO0/RxD4
P23/PO3/TIOCD3/TMCI1/TxD4
P22/PO2/TIOCC3/TMCI0
P21/PO1/TIOCB3/TMRI1
P20/PO0/TIOCA3/TMRI0
P17/PO15/TIOCB2/TCLKD
P16/PO14/TIOCA2
P15/PO13/TIOCB1/TCLKC/DACK
1
P14/PO12/TIOCA1/DACK0
P13/PO11/TIOCD0/TCLKB/TEND
1
P12/PO10/TIOCC0/TCLKA/TEND
0
P11/PO9/TIOCB0/DREQ1
P10/PO8/TIOCA0/DREQ0
VCC
NMI
WDTOVF
MD2
VCC
PC0/A0
PC1/A1
PC2/A2
PC3/A3
PC4/A4
VSS
PC5/A5
PC6/A6
PC7/A7
PB0/A8
PB1/A9
PB2/A10
PB3/A11
PB4/A12
VSS
PB5/A13
PB6/A14
PB7/A15
PA0/A16
VSS
PA1/A17
PA2/A18
PA3/A19
PA4/A20/IRQ4
PA5/A21/IRQ5
PA6/A22/IRQ6
PA7/A23/CS7/IRQ7
EMLE*
PG1/CS1
PG0/CS0
STBY
VSS
P81/TxD3
P83/RxD3
VCC
VCC
EXTAL
XTAL
VSS
PF7/φ
PLLVSS
RES
PLLVCC
PF6/AS
PF5/RD
PF4/HWR
PF3/LWR
PF2/CS6/LCAS
PF1/CS5/UCA
S
PF0/WAIT/OE
PD7/D15
PD6/D14
PD5/D13
PD4/D12
PD3/D11
PD2/D10
PD1/D9
PD0/D8
Note: * This is an emulator enable pin. Normally, this pin should be set to low. If this pin goes high in the flash memory version,
the on-chip emulator function is enabled. At this time, pins P53, PG4, PG5, PG6, and WDTOVF function only for the on-chip emulator.
Figure 1.3 Pin Arrangement of H8S/2367F, H8S/2365, and H8S/2363
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 6 of 980
REJ09B0050-0600
TFP-120
(Top view)
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
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55
54
53
52
51
50
49
48
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44
43
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40
39
38
37
36
35
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31
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79
78
77
76
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73
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71
70
69
68
67
66
65
64
63
62
61
PG2/CS2/RAS2
PG3/CS3/RAS3
AV
CC
Vref
P40/AN0/(IRQ0)
P41/AN1/(IRQ1)
P42/AN2/(IRQ2)
P43/AN3/(IRQ3)
P44/AN4/(IRQ4)
P45/AN5/(IRQ5)
P46/AN6/(IRQ6)
P47/AN7/(IRQ7)
P94/AN12/DA2
P95/AN13/DA3
AV
SS
PG4/CS4/BREQO
PG5/BACK
PG6/BREQ
P50/TxD2/IRQ0
P51/RxD2/IRQ1
P52/SCK2/IRQ2
P53/ADTRG/IRQ3
P35/SCK1/SCL0/(OE)
P34/SCK0/SCK4/SDA0
P33/RxD1/SCL1
P32/RxD0/IrRxD/SDA1
P31/TxD1
P30/TxD0/IrTxD
MD0
MD1
V
CC
PE7/D7
V
SS
PE6/D6
PE5/D5
PE4/D4
PE3/D3
PE2/D2
PE1/D1
PE0/D0
P85/SCK3
P27/PO7/TIOCB5
P26/PO6/TIOCA5
P25/PO5/TIOCB4/TMO1
P24/PO4/TIOCA4/TMO0/RxD4
P23/PO3/TIOCD3/TMCI1/TxD4
P22/PO2/TIOCC3/TMCI0
P21/PO1/TIOCB3/TMRI1
P20/PO0/TIOCA3/TMRI0
P17/PO15/TIOCB2/TCLKD
P16/PO14/TIOCA2
P15/PO13/TIOCB1/TCLKC/DACK
1
P14/PO12/TIOCA1/DACK0
P13/PO11/TIOCD0/TCLKB/TEND
1
P12/PO10/TIOCC0/TCLKA/TEND
0
P11/PO9/TIOCB0/DREQ1
P10/PO8/TIOCA0/DREQ0
V
CL
*
2
NMI
WDTOVF
MD2
V
CC
PC0/A0
PC1/A1
PC2/A2
PC3/A3
PC4/A4
V
SS
PC5/A5
PC6/A6
PC7/A7
PB0/A8
PB1/A9
PB2/A10
PB3/A11
PB4/A12
V
SS
PB5/A13
PB6/A14
PB7/A15
PA0/A16
V
SS
PA1/A17
PA2/A18
PA3/A19
PA4/A20/IRQ4
PA5/A21/IRQ5
PA6/A22/IRQ6
PA7/A23/CS7/IRQ7
EMLE*
1
PG1/CS1
PG0/CS0
STBY
V
SS
P81/TxD3
P83/RxD3
V
CC
V
CC
EXTAL
XTAL
V
SS
PF7/φ
PLLV
SS
RES
PLLV
CC
PF6/AS
PF5/RD
PF4/HWR
PF3/LWR
PF2/CS6/LCAS
PF1/CS5/UCA
S
PF0/WAIT/OE
PD7/D15
PD6/D14
PD5/D13
PD4/D12
PD3/D11
PD2/D10
PD1/D9
PD0/D8
Notes: 1. This is an emulator enable pin. Normally, this pin should be set to low. If this pin goes high in the flash memory version,
the on-chip emulator function is enabled. At this time, pins P53, PG4, PG5, PG6, and WDTOVF function only for the on-chip emulator.
2. A capacitor should be externally connected to the V
CL
pin.
0.1 μF (Recommended value)
33
Figure 1.4 Pin Arrangement of H8S/2368 0.18 μm F-ZTAT Group
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 7 of 980
REJ09B0050-0600
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104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
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49
48
47
46
45
44
43
42
41
40
39
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63
64
61
60
59
58
57
56
55
54
53
52
51
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74
76
77
78
79
80
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72
71
70
69
68
67
66
65
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90
92
93
94
95
96
97
98
99
100
101
102
89
88
87
86
85
84
83
82
81
V
SS
PE6/D6
PE5/D5
PE4/D4
PE3/D3
PE2/D2
PE1/D1
PE0/D0
P85/SCK3
P27/PO7/TIOCB5
P26/PO6/TIOCA5
P25/PO5/TIOCB4/TMO1
P24/PO4/TIOCA4/TMO0/RxD4
P23/PO3/TIOCD3/TMCI1/TxD4
P22/PO2/TIOCC3/TMCI0
P21/PO1/TIOCB3/TMRI1
P20/PO0/TIOCA3/TMRI0
P17/PO15/TIOCB2/TCLKD
P16/PO14/TIOCA2
P15/PO13/TIOCB1/TCLKC/DACK
1
P14/PO12/TIOCA1/DACK0
P13/PO11/TIOCD0/TCLKB/TEND
1
P12/PO10/TIOCC0/TCLKA/TEND
0
P11/PO9/TIOCB0/DREQ1
P10/PO8/TIOCA0/DREQ0
V
CC
PG3/CS3/RAS
3
PG2/CS2/RAS
2
V
SS
V
SS
PG1/CS1
PG0/CS0
STBY
V
SS
P81/TxD3
P83/RxD3
V
CC
V
CC
EXTAL
XTAL
V
SS
PF7/
φ
PLLV
SS
RES
PLLV
CC
PF6/AS
PF5/RD
PF4/HWR
PF3/LWR
PF2/CS6/LCAS
PF1/CS5/UCA
S
PF0/WAIT/OE
PD7/D15
PD6/D14
PD5/D13
PD4/D12
PD3/D11
PD2/D10
PD1/D9
PD0/D8
V
SS
NC*
1
V
CC
PE7/D7
AV
CC
Vref
P40/AN0/(IRQ0)
P41/AN1/(IRQ1)
P42/AN2/(IRQ2)
P43/AN3/(IRQ3)
P44/AN4/(IRQ4)
P45/AN5/(IRQ5)
P46/AN6/(IRQ6)
P47/AN7/(IRQ7)
P94/AN12/DA2
P95/AN13/DA3
AV
SS
PG4/CS4/BREQO
PG5/BACK
PG6/BREQ
P50/TxD2/IRQ0
P51/RxD2/IRQ1
P52/SCK2/IRQ2
P53/ADTRG/IRQ3
P35/SCK1/SCL0/(OE)
P34/SCK0/SCK4/SDA0
P33/RxD1/SCL1
P32/RxD0/IrRxD/SDA1
P31/TxD1
P30/TxD0/IrTxD
Notes: FP-128B is not supported by the H8S/2368 0.18 μm F-ZTAT Group.
1. The NC pin should be fixed to Vss or should be open.
2. This is an emulator enable pin. Normally, this pin should be set to low. If this pin goes high in the flash memory version, the on-chip emulator function is
enabled. At this time, pins P53, PG4, PG5, PG6, and WDTOVF function only for the on-chip emulator.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
MD0
MD1
V
SS
V
SS
MD2
V
CC
PC0/A0
PC1/A1
PC2/A2
PC3/A3
PC4/A4
V
SS
PC5/A5
PC6/A6
PC7/A7
PB0/A8
PB1/A9
PB2/A10
PB3/A11
PB4/A12
V
SS
PB5/A13
PB6/A14
PB7/A15
PA0/A16
V
SS
PA1/A17
PA2/A18
PA3/A19
PA4/A20/IRQ4
PA5/A21/IRQ5
PA6/A22/IRQ6
PA7/A23/CS7/IRQ7
EMLE*
2
V
SS
V
SS
WDTOVF
NMI
FP-128B
(Top view)
Figure 1.5 Pin Arrangement of H8S/2367F, H8S/2365, and H8S/2363
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 8 of 980
REJ09B0050-0600
1.3.2 Pin Arrangement in Each Operating Mode
Table 1.1 Pin Arrangement in Each Operating Mode
Pin No. Pin Name
Mode 7
TFP-120 QFP-128*1 Mode 1 Mode 2 Mode 4 EXPE = 1 EXPE = 0
Flash Memory
Programmer
Mode
1 5 MD2 MD2 MD2 MD2 MD2 Vss
2 6 Vcc Vcc Vcc Vcc Vcc Vcc
3 7 A0 A0 PC0/A0 PC0/A0 PC0 A0
4 8 A1 A1 PC1/A1 PC1/A1 PC1 A1
5 9 A2 A2 PC2/A2 PC2/A2 PC2 A2
6 10 A3 A3 PC3/A3 PC3/A3 PC3 A3
7 11 A4 A4 PC4/A4 PC4/A4 PC4 A4
8 12 Vss Vss Vss Vss Vss Vss
9 13 A5 A5 PC5/A5 PC5/A5 PC5 A5
10 14 A6 A6 PC6/A6 PC6/A6 PC6 A6
11 15 A7 A7 PC7/A7 PC7/A7 PC7 A7
12 16 A8 A8 PB0/A8 PB0/A8 PB0 A8
13 17 A9 A9 PB1/A9 PB1/A9 PB1 A9
14 18 A10 A10 PB2/A10 PB2/A10 PB2 A10
15 19 A11 A11 PB3/A11 PB3/A11 PB3 A11
16 20 A12 A12 PB4/A12 PB4/A12 PB4 A12
17 21 Vss Vss Vss Vss Vss Vss
18 22 A13 A13 PB5/A13 PB5/A13 PB5 A13
19 23 A14 A14 PB6/A14 PB6/A14 PB6 A14
20 24 A15 A15 PB7/A15 PB7/A15 PB7 A15
21 25 A16 A16 PA0/A16 PA0/A16 PA0 A16
22 26 Vss Vss Vss Vss Vss Vss
23 27 A17 A17 PA1/A17 PA1/A17 PA1 A17
24 28 A18 A18 PA2/A18 PA2/A18 PA2 A18
25 29 A19 A19 PA3/A19 PA3/A19 PA3 NC
26 30 A20/IRQ4 A20/IRQ4 PA4/A20/IRQ4 PA4/A20/IRQ4 PA4/IRQ4 NC
27 31 PA5/A21/IRQ5 PA5/A21/IRQ5 PA5/A21/IRQ5 PA5/IRQ5 PA5/IRQ5 NC
28 32 PA6/A22/IRQ6 PA6/A22/IRQ6 PA6/A22/IRQ6 PA6/IRQ6 PA6/IRQ6 NC
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 9 of 980
REJ09B0050-0600
Pin No. Pin Name
Mode 7
TFP-120 QFP-128*1 Mode 1 Mode 2 Mode 4 EXPE = 1 EXPE = 0
Flash Memory
Programmer
Mode
29 33 PA7/A23/CS7/
IRQ7
PA7/A23/CS7/
IRQ7
PA7/A23/CS7/
IRQ7
PA7/CS7/
IRQ7
PA7/IRQ7 NC
30 34 EMLE EMLE EMLE EMLE EMLE EMLE
⎯ 35 Vss Vss Vss Vss Vss Vss
⎯ 36 Vss Vss Vss Vss Vss Vss
31 37 WDTOVF WDTOVF WDTOVF WDTOVF WDTOVF NC
32 38 NMI NMI NMI NMI NMI Vcc
33 39 VCC (VCL*2) VCC (VCL*2) VCC (VCL*2) VCC (VCL*2) VCC (VCL*2) VCC (VCL*2)
34 40 P10/PO8/
TIOCA0/
DREQ0
P10/PO8/
TIOCA0/
DREQ0
P10/PO8/
TIOCA0/
DREQ0
P10/PO8/
TIOCA0/
DREQ0
P10/PO8/
TIOCA0/
DREQ0
NC
35 41 P11/PO9/
TIOCB0/
DREQ1
P11/PO9/
TIOCB0/
DREQ1
P11/PO9/
TIOCB0/
DREQ1
P11/PO9/
TIOCB0/
DREQ1
P11/PO9/
TIOCB0/
DREQ1
NC
36 42 P12/PO10/
TIOCC0/TCLKA/
TEND0
P12/PO10/
TIOCC0/TCLKA/
TEND0
P12/PO10/
TIOCC0/TCLKA/
TEND0
P12/PO10/
TIOCC0/TCLKA/
TEND0
P12/PO10/
TIOCC0/TCLKA/
TEND0
NC
37 43 P13/PO11/
TIOCD0/TCLKB/
TEND1
P13/PO11/
TIOCD0/TCLKB/
TEND1
P13/PO11/
TIOCD0/TCLKB/
TEND1
P13/PO11/
TIOCD0/TCLKB/
TEND1
P13/PO11/
TIOCD0/TCLKB/
TEND1
NC
38 44 P14/PO12/
TIOCA1/
DACK0
P14/PO12/
TIOCA1/
DACK0
P14/PO12/
TIOCA1/
DACK0
P14/PO12/
TIOCA1/
DACK0
P14/PO12/
TIOCA1/
DACK0
NC
39 45 P15/PO13/
TIOCB1/TCLKC/
DACK1
P15/PO13/
TIOCB1/TCLKC/
DACK1
P15/PO13/
TIOCB1/TCLKC/
DACK1
P15/PO13/
TIOCB1/TCLKC/
DACK1
P15/PO13/
TIOCB1/TCLKC/
DACK1
NC
40 46 P16/PO14/
TIOCA2
P16/PO14/
TIOCA2
P16/PO14/
TIOCA2
P16/PO14/
TIOCA2
P16/PO14/
TIOCA2
NC
41 47 P17/PO15/
TIOCB2/TCLKD
P17/PO15/
TIOCB2/TCLKD
P17/PO15/
TIOCB2/TCLKD
P17/PO15/
TIOCB2/TCLKD
P17/PO15/
TIOCB2/TCLKD
NC
42 48 P20/PO0/
TIOCA3/TMRI0
P20/PO0/
TIOCA3/(TMRI0)
P20/PO0/
TIOCA3/(TMRI0)
P20/PO0/
TIOCA3/(TMRI0)
P20/PO0/
TIOCA3/(TMRI0)
NC
43 49 P21/PO1/
TIOCB3/TMRI1
P21/PO1/
TIOCB3/TMRI1
P21/PO1/
TIOCB3/TMRI1
P21/PO1/
TIOCB3/TMRI1
P21/PO1/
TIOCB3/TMRI1
NC
44 50 P22/PO2/
TIOCC3/TMCI0
P22/PO2/
TIOCC3/TMCI0
P22/PO2/
TIOCC3/TMCI0
P22/PO2/
TIOCC3/TMCI0
P22/PO2/
TIOCC3/TMCI0
OE
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 10 of 980
REJ09B0050-0600
Pin No. Pin Name
Mode 7
TFP-120 QFP-128*1 Mode 1 Mode 2 Mode 4 EXPE = 1 EXPE = 0
Flash Memory
Programmer
Mode
45 51 P23/PO3/
TIOCD3/TMCI1/
TxD4
P23/PO3/
TIOCD3/TMCI1/
TxD4
P23/PO3/
TIOCD3/TMCI1/
TxD4
P23/PO3/
TIOCD3/TMCI1/
TxD4
P23/PO3/
TIOCD3/TMCI1/
TxD4
CE
46 52 P24/PO4/
TIOCA4/TMO0/
RxD4
P24/PO4/
TIOCA4/TMO0/
RxD4
P24/PO4/
TIOCA4/TMO0/
RxD4
P24/PO4/
TIOCA4/TMO0/
RxD4
P24/PO4/
TIOCA4/TMO0/
RxD4
WE
47 53 P25/PO5/
TIOCB4/TMO1
P25/PO5/
TIOCB4/TMO1
P25/PO5/
TIOCB4/TMO1
P25/PO5/
TIOCB4/TMO1
P25/PO5/
TIOCB4/TMO1
Vss
48 54 P26/PO6/
TIOCA5
P26/PO6/
TIOCA5
P26/PO6/
TIOCA5
P26/PO6/
TIOCA5
P26/PO6/
TIOCA5
NC
49 55 P27/PO7/
TIOCB5
P27/PO7/
TIOCB5
P27/PO7/
TIOCB5
P27/PO7/
TIOCB5
P27/PO7/
TIOCB5
NC
50 56 P85/SCK3 P85/SCK3 P85/SCK3 P85/SCK3 P85/SCK3 NC
51 57 D0 PE0/D0 PE0/D0 PE0/D0 PE0 NC
52 58 D1 PE1/D1 PE1/D1 PE1/D1 PE1 NC
53 59 D2 PE2/D2 PE2/D2 PE2/D2 PE2 NC
54 60 D3 PE3/D3 PE3/D3 PE3/D3 PE3 NC
55 61 D4 PE4/D4 PE4/D4 PE4/D4 PE4 NC
56 62 D5 PE5/D5 PE5/D5 PE5/D5 PE5 NC
57 63 D6 PE6/D6 PE6/D6 PE6/D6 PE6 NC
58 64 Vss Vss Vss Vss Vss Vss
59 65 D7 PE7/D7 PE7/D7 PE7/D7 PE7 NC
60 66 Vcc Vcc Vcc Vcc Vcc Vcc
⎯ 67 NC NC NC NC NC NC
⎯ 68 Vss Vss Vss Vss Vss Vss
61 69 D8 D8 D8 D8 PD0 I/O0
62 70 D9 D9 D9 D9 PD1 I/O1
63 71 D10 D10 D10 D10 PD2 I/O2
64 72 D11 D11 D11 D11 PD3 I/O3
65 73 D12 D12 D12 D12 PD4 I/O4
66 74 D13 D13 D13 D13 PD5 I/O5
67 75 D14 D14 D14 D14 PD6 I/O6
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 11 of 980
REJ09B0050-0600
Pin No. Pin Name
Mode 7
TFP-120 QFP-128*1 Mode 1 Mode 2 Mode 4 EXPE = 1 EXPE = 0
Flash Memory
Programmer
Mode
68 76 D15 D15 D15 D15 PD7 I/O7
69 77 PF0/WAIT/OE PF0/WAIT/OE PF0/WAIT/OE PF0/WAIT/OE PF0 NC
70 78 PF1/CS5/
UCAS
PF1/CS5/
UCAS
PF1/CS5/
UCAS
PF1/CS5/
UCAS
PF1 NC
71 79 PF2/CS6/
LCAS
PF2/CS6/
LCAS
PF2/CS6/
LCAS
PF2/CS6/
LCAS
PF2 NC
72 80 PF3/LWR PF3/LWR PF3/LWR PF3/LWR PF3 NC
73 81 HWR HWR HWR HWR PF4 NC
74 82 RD RD RD RD PF5 NC
75 83 PF6/AS PF6/AS PF6/AS PF6/AS PF6 NC
76 84 PLLVcc PLLVcc PLLVcc PLLVcc PLLVcc Vcc
77 85 RES RES RES RES RES RES
78 86 PLLVss PLLVss PLLVss PLLVss PLLVss Vss
79 87 PF7/φ PF7/φ PF7/φ PF7/φ PF7/φ NC
80 88 Vss Vss Vss Vss Vss Vss
81 89 XTAL XTAL XTAL XTAL XTAL XTAL
82 90 EXTAL EXTAL EXTAL EXTAL EXTAL EXTAL
83 91 Vcc Vcc Vcc Vcc Vcc Vcc
84 92 Vcc Vcc Vcc Vcc Vcc Vcc
85 93 P83/RxD3 P83/RxD3 P83/RxD3 P83/RxD3 P83/RxD3 NC
86 94 P81/TxD3 P81/TxD3 P81/TxD3 P81/TxD3 P81/TxD3 NC
87 95 Vss Vss Vss Vss Vss Vss
88 96 STBY STBY STBY STBY STBY Vcc
89 97 PG0/CS0 PG0/CS0 PG0/CS0 PG0/CS0 PG0 NC
90 98 PG1/CS1 PG1/CS1 PG1/CS1 PG1/CS1 PG1 NC
⎯ 99 Vss Vss Vss Vss Vss Vss
⎯ 100 Vss Vss Vss Vss Vss Vss
91 101 PG2/CS2/
RAS2
PG2/CS2/
RAS2
PG2/CS2/
RAS2
PG2/CS2/
RAS2
PG2 NC
92 102 PG3/CS3/
RAS3
PG3/CS3/
RAS3
PG3/CS3/
RAS3
PG3/CS3/
RAS3
PG3 NC
93 103 AVcc AVcc AVcc AVcc AVcc Vcc
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 12 of 980
REJ09B0050-0600
Pin No. Pin Name
Mode 7
TFP-120 QFP-128*1 Mode 1 Mode 2 Mode 4 EXPE = 1 EXPE = 0
Flash Memory
Programmer
Mode
94 104 Vref Vref Vref Vref Vref NC
95 105 P40/AN0/(IRQ0) P40/AN0/(IRQ0) P40/AN0/(IRQ0) P40/AN0/(IRQ0) P40/AN0/(IRQ0) NC
96 106 P41/AN1/(IRQ1) P41/AN1/(IRQ1) P41/AN1/(IRQ1) P41/AN1/(IRQ1) P41/AN1/(IRQ1) NC
97 107 P42/AN2/(IRQ2) P42/AN2/(IRQ2) P42/AN2/(IRQ2) P42/AN2/(IRQ2) P42/AN2/(IRQ2) NC
98 108 P43/AN3/(IRQ3) P43/AN3/(IRQ3) P43/AN3/(IRQ3) P43/AN3/(IRQ3) P43/AN3/(IRQ3) NC
99 109 P44/AN4/(IRQ4) P44/AN4/(IRQ4) P44/AN4/(IRQ4) P44/AN4/(IRQ4) P44/AN4/(IRQ4) NC
100 110 P45/AN5/(IRQ5) P45/AN5/(IRQ5) P45/AN5/(IRQ5) P45/AN5/(IRQ5) P45/AN5/(IRQ5) NC
101 111 P46/AN6/(IRQ6) P46/AN6/(IRQ6) P46/AN6/(IRQ6) P46/AN6/(IRQ6) P46/AN6/(IRQ6) NC
102 112 P47/AN7/(IRQ7) P47/AN7/(IRQ7) P47/AN7/(IRQ7) P47/AN7/(IRQ7) P47/AN7/(IRQ7) NC
103 113 P94/AN12/DA2 P94/AN12/DA2 P94/AN12/DA2 P94/AN12/DA2 P94/AN12/DA2 NC
104 114 P95/AN13/DA3 P95/AN13/DA3 P95/AN13/DA3 P95/AN13/DA3 P95/AN13/DA3 NC
105 115 AVss AVss AVss AVss AVss Vss
106 116 PG4/CS4/
BREQO
PG4/CS4/
BREQO
PG4/CS4/
BREQO
PG4/CS4/
BREQO
PG4 NC
107 117 PG5/BACK PG5/BACK PG5/BACK PG5/BACK PG5 NC
108 118 PG6/BREQ PG6/BREQ PG6/BREQ PG6/BREQ PG6 NC
109 119 P50/TxD2/IRQ0 P50/TxD2/IRQ0 P50/TxD2/IRQ0 P50/TxD2/IRQ0 P50/TxD2/IRQ0 Vss
110 120 P51/RxD2/IRQ1 P51/RxD2/IRQ1 P51/RxD2/IRQ1 P51/RxD2/IRQ1 P51/RxD2/IRQ1 Vss
111 121 P52/SCK2/IRQ2 P52/SCK2/IRQ2 P52/SCK2/IRQ2 P52/SCK2/IRQ2 P52/SCK2/IRQ2 Vcc
112 122 P53/ADTRG/
IRQ3
P53/ADTRG/
IRQ3
P53/ADTRG/
IRQ3
P53/ADTRG/
IRQ3
P53/ADTRG/
IRQ3
NC
113 123 P35/SCK1/
SCL0/(OE)
P35/SCK1/
SCL0/(OE)
P35/SCK1/
SCL0/(OE)
P35/SCK1/
SCL0/(OE)
P35/SCK1/SCL0 NC
114 124 P34/SCK0/
SCK4/SDA0
P34/SCK0/
SCK4/SDA0
P34/SCK0/
SCK4/SDA0
P34/SCK0/
SCK4/SDA0
P34/SCK0/
SCK4/SDA0
NC
115 125 P33/RxD1/SCL1 P33/RxD1/SCL1 P33/RxD1/SCL1 P33/RxD1/SCL1 P33/RxD1/SCL1 NC
116 126 P32/RxD0/
IrRxD/SDA1
P32/RxD0/
IrRxD/SDA1
P32/RxD0/
IrRxD/SDA1
P32/RxD0/
IrRxD/SDA1
P32/RxD0/
IrRxD/SDA1
Vcc
117 127 P31/TxD1 P31/TxD1 P31/TxD1 P31/TxD1 P31/TxD1 NC
118 128 P30/TxD0/IrTxD P30/TxD0/IrTxD P30/TxD0/IrTxD P30/TxD0/IrTxD P30/TxD0/IrTxD NC
119 1 MD0 MD0 MD0 MD0 MD0 Vss
120 2 MD1 MD1 MD1 MD1 MD1 Vss
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 13 of 980
REJ09B0050-0600
Pin No. Pin Name
Mode 7
TFP-120 QFP-128*1 Mode 1 Mode 2 Mode 4 EXPE = 1 EXPE = 0
Flash Memory
Programmer
Mode
⎯ 3 Vss Vss Vss Vss Vss Vss
⎯ 4 Vss Vss Vss Vss Vss Vss
Notes: 1. Not supported by the H8S/2368 0.18 μm F-ZTAT Group.
2. Used as the VCL pin in the H8S/2368 0.18 μm F-ZTAT Group.
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 14 of 980
REJ09B0050-0600
1.3.3 Pin Functions
Table 1.2 Pin Functions
Pin No.
Type
Symbol TFP-120 QFP-128*1
I/O
Function
Vcc 2, 33*2, 60,
83, 84
6,39,66,
91,92
Input Power supply pins. VCC pins should
be connected to the system power
supply.
Vss 8, 17, 22,
58, 80, 87
3,4,12,21,
26,35,36,
64,68,88,
95,99,100
Input Ground pins. VSS pins should be
connected to the system power
supply (0 V).
PLLVCC 76 84 Input Power supply pin for the on-chip PLL
oscillator.
Power Supply
PLLVSS 78 86 Input Ground pin for the on-chip PLL
oscillator.
VCL 33*3 Input Connect to VSS via a 0.1 µF
(recommended value) capacitor
(placed close to the pin).
XTAL 81 89 Input For connection to a crystal oscillator.
See section 22, Clock Pulse
Generator for typical connection
diagrams for a crystal oscillator and
external clock input.
EXTAL 82 90 Input For connection to a crystal oscillator.
The EXTAL pin can also input an
external clock. See section 22, Clock
Pulse Generator for typical
connection diagrams for a crystal
oscillator and external clock input.
Clock
0 79 87 Output Supplies the system clock to external
devices.
Operating
mode control
MD2
MD1
MD0
1,
120,
119
5,
2,
1
Input These pins set the operating mode.
These pins should not be changed
while the MCU is operating.
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 15 of 980
REJ09B0050-0600
Pin No.
Type
Symbol TFP-120 QFP-128*1
I/O
Function
System control RES 77 85 Input Reset pin. When this pin is driven
low, the chip is reset.
STBY 88 96 Input When this pin is driven low, a
transition is made to hardware
standby mode.
EMLE 30 34 Input Enables emulator. This pin should
be connected to the power supply
(0 V).
Address bus A23 to
A0
29 to 23,
21 to 18,
16 to 9,
7 to 3
33 to 27,
25 to 22,
20 to 13,
11 to 7
Output Address output pins.
Data bus D15 to
D0
68 to 61,
59,
57 to 51
76 to 69,
65,
63 to 57
Input/
output
These pins constitute a bidirectional
data bus.
Bus control CS7 to
CS0
29,71,70,
106,
92 to 89
33,79,78,
116,102,
101,98,97
Output Signals that select division areas 7
to 0 in the external address space.
AS 75 83 Output When this pin is low, it indicates
that address output on the address
bus is valid.
RD 74 82 Output When this pin is low, it indicates
that the external address space is
being read.
HWR 73 81 Output Strobe signal indicating that
external address space is to be
written, and the upper half (D15 to
D8) of the data bus is enabled.
Write enable signal for accessing
the DRAM space.
LWR 72 80 Output Strobe signal indicating that
external address space is to be
written, and the lower half (D7 to
D0) of the data bus is enabled.
BREQ 108 118 Input The external bus master requests
the bus to this LSI.
BREQO 106 116 Input External bus request signal when
the internal bus master accesses
the external space in external bus
release state.
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 16 of 980
REJ09B0050-0600
Pin No.
Type
Symbol TFP-120 QFP-128*1
I/O
Function
Bus control BACK 107 117 Output Indicates the bus is released to the
external bus master.
UCAS 70 78 Output Upper column address strobe
signal for accessing the 16-bit
DRAM space.
Column address strobe signal for
accessing the 8-bit DRAM space.
LCAS 71 79 Output Lower column address strobe
signal for accessing the 16-bit
DRAM space.
RAS2
RAS3
91
92
101
102
Output Row address strobe signal for the
DRAM interface.
WAIT 69 77 Input Requests insertion of a wait state in
the bus cycle when accessing
external 3-state address space.
OE
(OE)
69,
113
77,
123
Output Output enable signal for accessing
the DRAM space.
The output pins of OE and (OE) are
selected by the port function control
register 2 (PFCR2) of port 3.
NMI 32 38 Input Nonmaskable interrupt reques t pin.
Fix high when not used.
Interrupt
signals
IRQ7 to
IRQ0
(IRQ7) to
(IRQ0)
29 to 26,
112 to 109,
102 to 95
33 to 30,
122 to 119,
112 to 105
Input These pins request a maskable
interrupt.
The input pins of IRQn and (IRQn)
are selected by the IRQ pin select
register (ITSR) of the interrupt
controller. (n = 0 to 7)
DMA controller
(DMAC)
DREQ1
DREQ0
35,
34
41,
40
Input These signals request DMAC
activation.
TEND1,
TEND0
37,
36
43,
42
Output These signals indicate the end of
DMAC data transfer.
DACK1,
DACK0
39,
38
45,
44
Output DMAC single address transfer
acknowledge signals.
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 17 of 980
REJ09B0050-0600
Pin No.
Type
Symbol TFP-120 QFP-128*1
I/O
Function
16-bit timer
pulse unit (TPU)
TCLKD
TCLKC
TCLKB
TCLKA
41,
39,
37,
36
47,
45,
43,
42
Input External clock input pins for the
timer.
TIOCA0
TIOCB0
TIOCC0
TIOCD0
34,
35,
36,
37
40,
41,
42,
43
Input/
output
TGRA_0 to TGRD_0 input capture
input/output compare output/PWM
output pins.
TIOCA1
TIOCB1
38,
39
44,
45
Input/
output
TGRA_1 and TGRB_1 input
capture input/output compare
output/PWM output pins.
TIOCA2
TIOCB2
40,
41
46,
47
Input/
output
TGRA_2 and TGRB_2 input
capture input/output compare
output/PWM output pins.
TIOCA3
TIOCB3
TIOCC3
TIOCD3
42,
43,
44,
45
48,
49,
50,
51
Input/
output
TGRA_3 to TGRD_3 input capture
input/output compare output/PWM
output pins.
TIOCA4
TIOCB4
46,
47
52,
53
Input/
output
TGRA_4 and TGRB_4 input
capture input/output compare
output/PWM output pins.
TIOCA5
TIOCB5
48,
49
54,
55
Input/
output
TGRA_5 and TGRB_5 input
capture input/output compare
output/PWM output pins.
Programmable
pulse generator
(PPG)
PO15 to
PO0
41 to 34,
49 to42
47 to 40,
55 to 48
Output Pulse output pins.
8-bit timer
(TMR)
TMO0
TMO1
46,
47
52,
53
Output Waveform output pins with output
compare function.
TMCI0
TMCI1
44,
45
50,
51
Input External event input pins.
TMRI0
TMRI1
42,
43
48,
49
Input Counter reset input pins.
Watchdog
Timer (WDT)
WDTOVF 31 37 Output Counter overflow signal output pin
in watchdog timer mode.
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 18 of 980
REJ09B0050-0600
Pin No.
Type
Symbol TFP-120 QFP-128*1
I/O
Function
TxD4
TxD3
TxD2
TxD1
TxD0/
IrTxD
45,
86,
109,
117,
118
51,
94,
119,
127,
128
Output Data output pins.
Serial
communication
interface(SCI)/
smart card
interface (SCI_0
with IrDA
function) RxD4
RxD3
RxD2
RxD1
RxD0/
IrRxD
46,
85,
110,
115,
116
52,
93,
120
125,
126
Input Data input pins.
SCK4
SCK3
SCK2
SCK1
SCK0
114,
50,
111,
113,
114
124,
56,
121,
123,
124
Input/
output
Clock input/output pins.
IIC bus
interface2 (IIC2)
SCL1
SCL0
115,
113
125,
123
Input/
output
IIC clock input/output pins.
SDA1
SDA0
116,
114
126,
124
Input/
output
IIC data input/output pins.
AN13,
AN12,
AN7 to
AN0
104 to 95 114 to 105 Input Analog input pins. A/D converter
ADTRG 112 122 Input Pin for input of an external trigger to
start A/D conversion.
D/A converter DA3,
DA2
104,
103
114,
113
Output Analog output pins.
A/D converter,
D/A converter
AVcc 93 103 Input The analog power-supply pin for the
A/D converter and D/A converter.
When the A/D converter and D/A
converter are not used, this pin
should be connected to the system
power supply (+3 V).
AVss 105 115 Input The ground pin for the A/D
converter and D/A converter.
This pin should be connected to the
system power supply (0 V).
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 19 of 980
REJ09B0050-0600
Pin No.
Type
Symbol TFP-120 QFP-128*1
I/O
Function
A/D converter,
D/A converter
Vref 94 104 Input The reference voltage input pin for
the A/D converter and D/A
converter.
When the A/D converter and D/A
converter are not used, this pin
should be connected to the system
power supply (+3 V).
I/O ports P17 to P1041 to 34 47 to 40 Input/
output
Eight-bit input/output pins.
P27 to P2049 to 42 55 to 48 Input/
output
Eight-bit input/output pins.
P35 to P30113 to 118 123 to 128 Input/
output
Six-bit input/output pins.
P47 to P40102 to 95 112 to 105 Input Eight-bit input pins.
P53 to P50112 to 109 122 to 119 Input/
output
Four-bit input/output pins.
P85,
P83,
P81
50,
85,
86
56,
93,
94
Input/
output
Three-bit input/output pins.
P95,
P94
104,
103
114,
113
Input Two-bit input pins.
PA7 to
PA0
29 to 23,
21
33 to 27,
25
Input/
output
Eight-bit input/output pins.
PB7 to
PB0
20 to 18,
16 to 12
24 to 22,
20 to 16
Input/
output
Eight-bit input/output pins.
PC7 to
PC0
11 to 9,
7 to 3
15 to 13,
11 to 7
Input/
output
Eight-bit input/output pins.
PD7 to
PD0
68 to 61 76 to 69 Input/
output
Eight-bit input/output pins.
PE7 to
PE0
59,
57 to 51
65,
63 to 57
Input/
output
Eight-bit input/output pins.
PF7 to
PF0
79,
75 to 69
87,
83 to 77
Input/
output
Eight-bit input/output pins.
Section 1 Overview
Rev.6.00 Mar. 18, 2009 Page 20 of 980
REJ09B0050-0600
Pin No.
Type
Symbol TFP-120 QFP-128*1
I/O
Function
I/O ports PG6 to
PG0
108 to 106,
92 to 89
118 to 116,
102,101,
98,97
Input/
output
Seven-bit input/output pins.
Notes: 1. Not supported by the H8S/2368 0.18 μm F-ZTAT Group.
2. VCL on the H8S/2368 0.18 µm F-ZTAT Group. Do not connect to VCL.
3. H8S/2368 0.18 µm F-ZTAT Group only.
Section 2 CPU
Rev.6.00 Mar. 18, 2009 Page 21 of 980
REJ09B0050-0600
Section 2 CPU
The H8S/2000 CPU is a high-speed central processing unit with an internal 32-bit architecture that
is upward-compatible with the H8/300 and H8/300H CPUs. The H8S/2000 CPU has sixteen 16-bit
general registers, can address a 16-Mbyte linear address space, and is ideal for realtime control.
This section describes the H8S/2000 CPU. The usable modes and address spaces differ depending
on the product. For details on each product, refer to section 3, MCU Operating Modes.
2.1 Features
• Upward-compatibility with H8/300 and H8/300H CPUs
⎯ Can execute H8/300 and H8/300H CPU object programs
• General-register architecture
⎯ Sixteen 16-bit general registers also usable as sixteen 8-bit registers or eight 32-bit registers
• Sixty-five basic instructions
⎯ 8/16/32-bit arithmetic and logic instructions
⎯ Multiply and divide instructions
⎯ Powerful bit-manipulation instructions
• Eight addressing modes
⎯ Register direct [Rn]
⎯ Register indirect [@ERn]
⎯ Register indirect with displacement [@(d:16,ERn) or @(d:32,ERn)]
⎯ Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn]
⎯ Absolute address [@aa:8, @aa:16, @aa:24, or @aa:32]
⎯ Immediate [#xx:8, #xx:16, or #xx:32]
⎯ Program-counter relative [@(d:8,PC) or @(d:16,PC)]
⎯ Memory indirect [@@aa:8]
• 16-Mbyte address space
⎯ Program: 16 Mbytes
⎯ Data: 16 Mbytes
• High-speed operation
⎯ All frequently-used instructions are executed in one or two states
⎯ 8/16/32-bit register-register add/subtract: 1 state
⎯ 8 × 8-bit register-register multiply: 12 states (MULXU.B), 13 states (MULXS.B)
⎯ 16 ÷ 8-bit register-register divide: 12 states (DIVXU.B)
CPUS211A_000020020100
Section 2 CPU
Rev.6.00 Mar. 18, 2009 Page 22 of 980
REJ09B0050-0600
⎯ 16 × 16-bit register-register multiply: 20 states (MULXU.W), 21 states (MULXS.W)
⎯ 32 ÷ 16-bit register-register divide: 20 states (DIVXU.W)
• Two CPU operating modes
⎯ Normal mode*
⎯ Advanced mode
Note: * For this LSI, normal mode is not available.
• Power-down state
⎯ Transition to power-down state by SLEEP instruction
⎯ Selectable CPU clock speed
2.1.1 Differences between H8S/2600 CPU and H8S/2000 CPU
The differences between the H8S/2600 CPU and the H8S/2000 CPU are as shown below.
• Register configuration
The MAC register is supported only by the H8S/2600 CPU.
• Basic instructions
The four instructions MAC, CLRMAC, LDMAC, and STMAC are supported only by the
H8S/2600 CPU.
• The number of execution states of the MULXU and MULXS instructions
Execution States
Instruction Mnemonic H8S/2600 H8S/2000
MULXU MULXU.B Rs, Rd 3 12
MULXU.W Rs, ERd 4 20
MULXS MULXS.B Rs, Rd 4 13
MULXS.W Rs, ERd 5 21
In addition, there are differences in address space, CCR and EXR register functions, power-down
modes, etc., depending on the model.
Section 2 CPU
Rev.6.00 Mar. 18, 2009 Page 23 of 980
REJ09B0050-0600
2.1.2 Differences from H8/300 CPU
In comparison to the H8/300 CPU, the H8S/2000 CPU has the following enhancements.
• More general registers and control registers
⎯ Eight 16-bit extended registers, and one 8-bit and two 32-bit control registers, have been
added.
• Expanded address space
⎯ Normal mode supports the same 64-kbyte address space as the H8/300 CPU.
⎯ Advanced mode supports a maximum 16-Mbyte address space.
• Enhanced addressing
⎯ The addressing modes have been enhanced to make effective use of the 16-Mbyte address
space.
• Enhanced instructions
⎯ Addressing modes of bit-manipulation instructions have been enhanced.
⎯ Signed multiply and divide instructions have been added.
⎯ Two-bit shift and two-bit rotate instructions have been added.
⎯ Instructions for saving and restoring multiple registers have been added.
⎯ A test and set instruction has been added.
• Higher speed
⎯ Basic instructions are executed twice as fast.
2.1.3 Differences from H8/300H CPU
In comparison to the H8/300H CPU, the H8S/2000 CPU has the following enhancements.
• Additional control register
⎯ One 8-bit control register has been added.
• Enhanced instructions
⎯ Addressing modes of bit-manipulation instructions have been enhanced.
⎯ Two-bit shift and two-bit rotate instructions have been added.
⎯ Instructions for saving and restoring multiple registers have been added.
⎯ A test and set instruction has been added.
• Higher speed
⎯ Basic instructions are executed twice as fast.
Section 2 CPU
Rev.6.00 Mar. 18, 2009 Page 24 of 980
REJ09B0050-0600
2.2 CPU Operating Modes
The H8S/2000 CPU has two operating modes: normal and advanced. Normal mode supports a
maximum 64-kbyte address space. Advanced mode supports a maximum 16-Mbyte address space.
The mode is selected by the LSI's mode pins.
2.2.1 Normal Mode
The exception vector table and stack have the same structure as in the H8/300 CPU in normal
mode.
• Address space
Linear access to a maximum address space of 64 kbytes is possible.
• Extended registers (En)
The extended registers (E0 to E7) can be used as 16-bit registers, or as the upper 16-bit
segments of 32-bit registers.
When extended register En is used as a 16-bit register it can contain any value, even when the
corresponding general register (Rn) is used as an address register. (If general register Rn is
referenced in the register indirect addressing mode with pre-decrement (@–Rn) or post-
increment (@Rn+) and a carry or borrow occurs, the value in the corresponding extended
register (En) will be affected.)
• Instruction set
All instructions and addressing modes can be used. Only the lower 16 bits of effective
addresses (EA) are valid.
• Exception vector table and memory indirect branch addresses
In normal mode, the top area starting at H'0000 is allocated to the exception vector table. One
branch address is stored per 16 bits. The exception vector table in normal mode is shown in
figure 2.1. For details of the exception vector table, see section 4, Exception Handling.
The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions
uses an 8-bit absolute address included in the instruction code to specify a memory operand
that contains a branch address. In normal mode, the operand is a 16-bit (word) operand,
providing a 16-bit branch address. Branch addresses can be stored in the top area from H'0000
to H'00FF. Note that this area is also used for the exception vector table.
• Stack structure
When the program counter (PC) is pushed onto the stack in a subroutine call, and the PC,
condition-code register (CCR), and extended control register (EXR) are pushed onto the stack
in exception handling, they are stored as shown in figure 2.2. EXR is not pushed onto the stack
in interrupt control mode 0. For details, see section 4, Exception Handling.
Section 2 CPU
Rev.6.00 Mar. 18, 2009 Page 25 of 980
REJ09B0050-0600
Note: For this LSI, normal mode is not available.
H'0000
H'0001
H'0002
H'0003
H'0004
H'0005
H'0006
H'0007
H'0008
H'0009
H'000A
H'000B
Reset exception vector
(Reserved for system use)
(Reserved for system use)
Exception vector 1
Exception vector 2
Exception
vector table
Figure 2.1 Exception Vector Table (Normal Mode)
PC
(16 bits) EXR*
1
Reserved*
1
*
3
CCR
CCR*
3
PC
(16 bits)
SP SP
(SP*
2
1. When EXR is not used, it is not stored on the stack.
2. SP when EXR is not used.
3. lgnored when returning.
Notes:
(b) Exception Handling(a) Subroutine Branch
)
Figure 2.2 Stack Structure in Normal Mode
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2.2.2 Advanced Mode
• Address space
Linear access to a maximum address space of 16 Mbytes is possible.
• Extended registers (En)
The extended registers (E0 to E7) can be used as 16-bit registers. They can also be used as the
upper 16-bit segments of 32-bit registers or address registers.
• Instruction set
All instructions and addressing modes can be used.
• Exception vector table and memory indirect branch addresses
In advanced mode, the top area starting at H'00000000 is allocated to the exception vector
table in 32-bit units. In each 32 bits, the upper 8 bits are ignored and a branch address is stored
in the lower 24 bits (see figure 2.3). For details of the exception vector table, see section 4,
Exception Handling.
H'00000000
H'00000003
H'00000004
H'0000000B
H'0000000C
H'00000010
H'00000008
H'00000007
Reserved
Reserved
Reserved
Reset exception vector
(Reserved for system use)
Exception vector table
Exception vector 1
(Reserved for system use)
Figure 2.3 Exception Vector Table (Advanced Mode)
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The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions
uses an 8-bit absolute address included in the instruction code to specify a memory operand
that contains a branch address. In advanced mode, the operand is a 32-bit longword operand,
providing a 32-bit branch address. The upper 8 bits of these 32 bits are a reserved area that is
regarded as H'00. Branch addresses can be stored in the area from H'00000000 to H'000000FF.
Note that the top area of this range is also used for the exception vector table.
• Stack structure
In advanced mode, when the program counter (PC) is pushed onto the stack in a subroutine
call, and the PC, condition-code register (CCR), and extended control register (EXR) are
pushed onto the stack in exception handling, they are stored as shown in figure 2.4. EXR is not
pushed onto the stack in interrupt control mode 0. For details, see section 4, Exception
Handling.
PC
(24 bits)
EXR*1
Reserved*1*3
CCR
PC
(24 bits)
SP SP
(SP*2
Reserved
(a) Subroutine Branch (b) Exception Handling
Notes: 1. When EXR is not used, it is not stored on the stack.
2. SP when EXR is not used.
3. Ignored when returning.
)
Figure 2.4 Stack Structure in Advanced Mode
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2.3 Address Space
Figure 2.5 shows a memory map of the H8S/2000 CPU. The H8S/2000 CPU provides linear
access to a maximum 64-kbyte address space in normal mode, and a maximum 16-Mbyte
(architecturally 4-Gbyte) address space in advanced mode. The usable modes and address spaces
differ depending on the product. For details on each product, refer to section 3, MCU Operating
Modes.
H'0000
H'FFFF
Note: * For this LSI, normal mode is not available.
H'00000000
H'FFFFFFFF
H'00FFFFFF
64 kbyte 16 Mbyte
Not available
in this LSI
Program area
Data area
(b) Advanced Mode(a) Normal Mode*
Figure 2.5 Memory Map
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2.4 Register Configuration
The H8S/2000 CPU has the internal registers shown in figure 2.6. There are two types of registers:
general registers and control registers. Control registers are a 24-bit program counter (PC), an 8-
bit extended control register (EXR), and an 8-bit condition code register (CCR).
TI2I1I0
EXR
76543210
PC
23 0
15 0 7 0 7 0
E0
E1
E2
E3
E4
E5
E6
E7
R0H
R1H
R2H
R3H
R4H
R5H
R6H
R7H
R0L
R1L
R2L
R3L
R4L
R5L
R6L
R7L
SP:
PC:
EXR:
T:
I2 to I0:
CCR:
I:
UI:
Stack pointer
Program counter
Extended control register
Trace bit
Interrupt mask bits
Condition-code register
Interrupt mask bit
User bit or interrupt mask bit*
Half-carry flag
User bit
Negative flag
Zero flag
Overflow flag
Carry flag
ER0
ER1
ER2
ER3
ER4
ER5
ER6
ER7 (SP)
IUIHUNZVC
CCR
76543210
H:
U:
N:
Z:
V:
C:
General Registers (Rn) and Extended Registers (En)
Control Registers
Legend:
----
Note: * For this LSI, the interrupt mask bit is not available.
Figure 2.6 CPU Internal Registers
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2.4.1 General Registers
The H8S/2000 CPU has eight 32-bit general registers. These general registers are all functionally
alike and can be used as both address registers and data registers. When a general register is used
as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. Figure 2.7 illustrates the
usage of the general registers. When the general registers are used as 32-bit registers or address
registers, they are designated by the letters ER (ER0 to ER7).
When the general registers are used as 16-bit registers, the ER registers are divided into 16-bit
general registers designated by the letters E (E0 to E7) and R (R0 to R7). These registers are
functionally equivalent, providing a maximum sixteen 16-bit registers. The E registers (E0 to E7)
are also referred to as extended registers.
When the general registers are used as 8-bit registers, the R registers are divided into 8-bit general
registers designated by the letters RH (R0H to R7H) and RL (R0L to R7L). These registers are
functionally equivalent, providing a maximum sixteen 8-bit registers.
The usage of each register can be selected independently.
General register ER7 has the function of the stack pointer (SP) in addition to its general-register
function, and is used implicitly in exception handling and subroutine calls. Figure 2.8 shows the
stack.
• Address registers
• 32-bit registers • 16-bit registers • 8-bit registers
ER registers
(ER0 to ER7)
E registers (extended registers)
(E0 to E7)
R registers
(R0 to R7)
RH registers
(R0H to R7H)
RL registers
(R0L to R7L)
Figure 2.7 Usage of General Registers
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SP (ER7)
Free area
Stack area
Figure 2.8 Stack
2.4.2 Program Counter (PC)
This 24-bit counter indicates the address of the next instruction the CPU will execute. The length
of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. (When an
instruction is fetched for read, the least significant PC bit is regarded as 0.)
2.4.3 Extended Control Register (EXR)
EXR is an 8-bit register that can be operated by the LDC, STC, ANDC, ORC, and XORC
instructions. When an instruction other than STC is executed, all interrupts including NMI are
masked in three states after the instruction is completed.
Bit Bit Name Initial Value R/W Description
7 T 0 R/W Trace Bit
When this bit is set to 1, trace exception processing
starts every when an instruction is executed. When
this bit is cleared to 0, instructions are consecutively
executed.
6 to
3
– All 1 – Reserved
These bits are always read as 1.
2 to 0 I2
I1
I0
1 R/W Interrupt Mask Bits 2 to 0
Specify interrupt request mask levels (0 to 7). For
details, see section 5, Interrupt Controller.
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2.4.4 Condition-Code Register (CCR)
This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and
half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags.
Operations can be performed on the CCR bits by the LDC, STC, ANDC, ORC, and XORC
instructions. The N, Z, V, and C flags are used as branching conditions for conditional branch
(Bcc) instructions.
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Bit Bit Name Initial Value R/W Description
7 I 1 R/W Interrupt Mask Bit
Masks interrupts other than NMI when set to 1. NMI is
accepted regardless of the I bit setting. The I bit is set to 1
at the start of an exception-handling sequence. For details,
refer to section 5, Interrupt Controller.
6 UI Undefined R/W User Bit or Interrupt Mask Bit
Can be written to and read from by software using the
LDC, STC, ANDC, ORC, and XORC instructions.
For this LSI, Interrupt Mask Bit is not available.
5 H Undefined R/W Half-Carry Flag
When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or
NEG.B instruction is executed, this flag is set to 1 if there is
a carry or borrow at bit 3, and cleared to 0 otherwise. When
the ADD.W, SUB.W, CMP.W, or NEG.W instruction is
executed, the H flag is set to 1 if there is a carry or borrow
at bit 11, and cleared to 0 otherwise. When the ADD.L,
SUB.L, CMP.L, or NEG.L instruction is executed, the H flag
is set to 1 if there is a carry or borrow at bit 27, and cleared
to 0 otherwise.
4 U Undefined R/W User Bit
Can be written to and read from by software using the
LDC, STC, ANDC, ORC, and XORC instructions.
3 N Undefined R/W Negative Flag
Stores the value of the most significant bit of data as a sign
bit.
2 Z Undefined R/W Zero Flag
Set to 1 to indicate zero data, and cleared to 0 to indicate
non-zero data.
1 V Undefined R/W Overflow Flag
Set to 1 when an arithmetic overflow occurs, and cleared to
0 otherwise.
0 C Undefined R/W Carry Flag
Set to 1 when a carry occurs, and cleared to 0 otherwise.
Used by:
• Add instructions, to indicate a carry
• Subtract instructions, to indicate a borrow
• Shift and rotate instructions, to indicate a carry
The carry flag is also used as a bit accumulator by bit
manipulation instructions.
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2.4.5 Initial Register Values
Reset exception handling loads the CPU's program counter (PC) from the vector table, clears the
trace (T) bit in EXR to 0, and sets the interrupt mask (I) bits in CCR and EXR to 1. The other
CCR bits and the general registers are not initialized. Note that the stack pointer (ER7) is
undefined. The stack pointer should therefore be initialized by an MOV.L instruction executed
immediately after a reset.
2.5 Data Formats
The H8S/2000 CPU can process 1-bit, 4-bit BCD, 8-bit (byte), 16-bit (word), and 32-bit
(longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2,
…, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two
digits of 4-bit BCD data.
2.5.1 General Register Data Formats
Figure 2.9 shows the data formats of general registers.
70
70
MSB LSB
MSB LSB
7043
Don't care
Don't care
Don't care
7043
70
Don't care
65432710
70
Don't care 65432710
Don't care
RnH
RnL
RnH
RnL
RnH
RnL
Data Type Register Number Data Format
Byte data
Byte data
4-bit BCD data
4-bit BCD data
1-bit data
1-bit data
Upper Lower
Upper Lower
Figure 2.9 General Register Data Formats (1)
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15 0
MSB LSB
15 0
MSB LSB
31 16
MSB
15 0
LSB
En Rn
ERn:
En:
Rn:
RnH:
RnL:
MSB:
LSB:
General register ER
General register E
General register R
General register RH
General register RL
Most significant bit
Least significant bit
Data Type Data FormatRegister Number
Word data
Word data
Rn
En
Longword data
Legend:
ERn
Figure 2.9 General Register Data Formats (2)
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2.5.2 Memory Data Formats
Figure 2.10 shows the data formats in memory. The H8S/2000 CPU can access word data and
longword data in memory, but word or longword data must begin at an even address. If an attempt
is made to access word or longword data at an odd address, no address error occurs but the least
significant bit of the address is regarded as 0, so the access starts at the preceding address. This
also applies to instruction fetches.
When SP (ER7) is used as an address register to access the stack, the operand size should be word
size or longword size.
70
76 543210
MSB LSB
MSB
MSB
LSB
LSB
Data Type Address
1-bit data
Byte data
Word data
Address L
Address L
Address 2M
Address 2M+1
Longword data Address 2N
Address 2N+1
Address 2N+2
Address 2N+3
Data Format
Figure 2.10 Memory Data Formats
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2.6 Instruction Set
The H8S/2000 CPU has 65 types of instructions. The instructions are classified by function as
shown in table 2.1.
Table 2.1 Instruction Classification
Function Instructions Size Types
MOV B/W/L 5
POP*1, PUSH*1 W/L
LDM, STM L
Data transfer
MOVFPE*3, MOVTPE*3 B
ADD, SUB, CMP, NEG B/W/L 19
ADDX, SUBX, DAA, DAS B
INC, DEC B/W/L
ADDS, SUBS L
MULXU, DIVXU, MULXS, DIVXS B/W
EXTU, EXTS W/L
Arithmetic
operations
TAS*4 B
Logic operations AND, OR, XOR, NOT B/W/L 4
Shift SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL,
ROTXR
B/W/L 8
Bit manipulation BSET, BCLR, BNOT, BTST, BLD, BILD, BST, BIST, BAND,
BIAND, BOR, BIOR, BXOR, BIXOR
B 14
Branch BCC*2, JMP, BSR, JSR, RTS – 5
System control TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC,
NOP
– 9
Block data transfer EEPMOV – 1
Total: 65
Notes: B: Byte size; W: Word size; L: Longword size.
1. POP.W Rn and PUSH.W Rn are identical to MOV.W @SP+, Rn and MOV.W Rn, @-
SP. POP.L ERn and PUSH.L ERn are identical to MOV.L @SP+, ERn and MOV.L ERn,
@-SP.
2. BCC is the general name for conditional branch instructions.
3. Cannot be used in this LSI.
4. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
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2.6.1 Table of Instructions Classified by Function
Tables 2.3 to 2.10 summarize the instructions in each functional category. The notation used in
tables 2.3 to 2.10 is defined below.
Table 2.2 Operation Notation
Symbol Description
Rd General register (destination)*
Rs General register (source)*
Rn General register*
ERn General register (32-bit register)
(EAd) Destination operand
(EAs) Source operand
EXR Extended control register
CCR Condition-code register
N N (negative) flag in CCR
Z Z (zero) flag in CCR
V V (overflow) flag in CCR
C C (carry) flag in CCR
PC Program counter
SP Stack pointer
#IMM Immediate data
disp Displacement
+ Addition
– Subtraction
× Multiplication
÷ Division
∧ Logical AND
∨ Logical OR
⊕ Logical exclusive OR
→ Move
∼ NOT (logical complement)
:8/:16/:24/:32 8-, 16-, 24-, or 32-bit length
Note: * General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0
to R7, E0 to E7), and 32-bit registers (ER0 to ER7).
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Table 2.3 Data Transfer Instructions
Instruction Size* Function
MOV B/W/L (EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
MOVFPE B Cannot be used in this LSI.
MOVTPE B Cannot be used in this LSI.
POP W/L @SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn
PUSH W/L Rn → @-SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @-SP. PUSH.L ERn is identical to MOV.L ERn, @-SP.
LDM L @SP+ → Rn (register list)
Pops two or more general registers from the stack.
STM L Rn (register list) → @-SP
Pushes two or more general registers onto the stack.
Note: * Size refers to the operand size.
B: Byte
W: Word
L: Longword
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Table 2.4 Arithmetic Operations Instructions
Instruction Size*1 Function
ADD
SUB
B/W/L Rd ± Rs → Rd, Rd ± #IMM → Rd
Performs addition or subtraction on data in two general registers, or on
immediate data and data in a general register. (Subtraction on
immediate data and data in a general register cannot be performed in
bytes. Use the SUBX or ADD instruction.)
ADDX
SUBX
B Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Performs addition or subtraction with carry on data in two general
registers, or on immediate data and data in a general register.
INC
DEC
B/W/L Rd ± 1 → Rd, Rd ± 2 → Rd
Adds or subtracts the value 1 or 2 to or from data in a general register.
(Only the value 1 can be added to or subtracted from byte operands.)
ADDS
SUBS
L Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd
Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register.
DAA
DAS
B Rd (decimal adjust) → Rd
Decimal-adjusts an addition or subtraction result in a general register by
referring to CCR to produce 4-bit BCD data.
MULXU B/W Rd × Rs → Rd
Performs unsigned multiplication on data in two general registers: either
8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
MULXS B/W Rd × Rs → Rd
Performs signed multiplication on data in two general registers: either 8
bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
DIVXU B/W Rd ÷ Rs → Rd
Performs unsigned division on data in two general registers: either 16
bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits →
16-bit quotient and 16-bit remainder.
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Instruction Size*1 Function
DIVXS B/W Rd ÷ Rs → Rd
Performs signed division on data in two general registers: either 16 bits ÷
8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit
quotient and 16-bit remainder.
CMP B/W/L Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general register
or with immediate data, and sets the CCR bits according to the result.
NEG B/W/L 0 – Rd → Rd
Takes the two's complement (arithmetic complement) of data in a
general register.
EXTU W/L Rd (zero extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by padding with zeros on the
left.
EXTS W/L Rd (sign extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by extending the sign bit.
TAS*2 B @ERd – 0, 1 → (<bit 7> of @ERd)
Tests memory contents, and sets the most significant bit (bit 7) to 1.
Notes: 1. Size refers to the operand size.
B: Byte
W: Word
L: Longword
2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
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Table 2.5 Logic Operations Instructions
Instruction Size* Function
AND B/W/L Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register and another
general register or immediate data.
OR B/W/L Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another
general register or immediate data.
XOR B/W/L Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register and
another general register or immediate data.
NOT B/W/L ∼ Rd → Rd
Takes the one's complement (logical complement) of data in a general
register.
Note: * Size refers to the operand size.
B: Byte
W: Word
L: Longword
Table 2.6 Shift Instructions
Instruction Size* Function
SHAL
SHAR
B/W/L Rd (shift) → Rd
Performs an arithmetic shift on data in a general register. 1-bit or 2 bit
shift is possible.
SHLL
SHLR
B/W/L Rd (shift) → Rd
Performs a logical shift on data in a general register. 1-bit or 2 bit shift is
possible.
ROTL
ROTR
B/W/L Rd (rotate) → Rd
Rotates data in a general register. 1-bit or 2 bit rotation is possible.
ROTXL
ROTXR
B/W/L Rd (rotate) → Rd
Rotates data including the carry flag in a general register. 1-bit or 2 bit
rotation is possible.
Note: * Size refers to the operand size.
B: Byte
W: Word
L: Longword
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Table 2.7 Bit Manipulation Instructions
Instruction Size* Function
BSET B 1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory operand to 1. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BCLR B 0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory operand to 0. The
bit number is specified by 3-bit immediate data or the lower three bits of
a general register.
BNOT B ∼ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory operand. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BTST B ∼ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory operand and sets or
clears the Z flag accordingly. The bit number is specified by 3-bit
immediate data or the lower three bits of a general register.
BAND B C ∧ (<bit-No.> of <EAd>) → C
Logically ANDs the carry flag with a specified bit in a general register or
memory operand and stores the result in the carry flag.
BIAND B C ∧ (<bit-No.> of <EAd>) → C
Logically ANDs the carry flag with the inverse of a specified bit in a
general register or memory operand and stores the result in the carry
flag. The bit number is specified by 3-bit immediate data.
BOR B C ∨ (<bit-No.> of <EAd>) → C
Logically ORs the carry flag with a specified bit in a general register or
memory operand and stores the result in the carry flag.
BIOR B C ∨ (∼ <bit-No.> of <EAd>) → C
Logically ORs the carry flag with the inverse of a specified bit in a
general register or memory operand and stores the result in the carry
flag. The bit number is specified by 3-bit immediate data.
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Instruction Size* Function
BXOR B C ⊕ (<bit-No.> of <EAd>) → C
Logically exclusive-ORs the carry flag with a specified bit in a general
register or memory operand and stores the result in the carry flag.
BIXOR B C ⊕ ∼ (<bit-No.> of <EAd>) → C
Logically exclusive-ORs the carry flag with the inverse of a specified bit
in a general register or memory operand and stores the result in the
carry flag. The bit number is specified by 3-bit immediate data.
BLD B (<bit-No.> of <EAd>) → C
Transfers a specified bit in a general register or memory operand to the
carry flag.
BILD B ∼ (<bit-No.> of <EAd>) → C
Transfers the inverse of a specified bit in a general register or memory
operand to the carry flag. The bit number is specified by 3-bit immediate
data.
BST B C → (<bit-No.> of <EAd>)
Transfers the carry flag value to a specified bit in a general register or
memory operand.
BIST B ∼ C → (<bit-No.>. of <EAd>)
Transfers the inverse of the carry flag value to a specified bit in a
general register or memory operand. The bit number is specified by 3-
bit immediate data.
Note: * Size refers to the operand size.
B: Byte
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Table 2.8 Branch Instructions
Instruction Size Function
Bcc – Branches to a specified address if a specified condition is true. The
branching conditions are listed below.
Mnemonic Description Condition
BRA (BT) Always (true) Always
BRN (BF) Never (false) Never
BHI High C ∨ Z = 0
BLS Low or same C ∨ Z = 1
BCC (BHS) Carry clear
(high or same)
C = 0
BCS (BLO) Carry set (low) C = 1
BNE Not equal Z = 0
BEQ Equal Z = 1
BVC Overflow clear V = 0
BVS Overflow set V = 1
BPL Plus N = 0
BMI Minus N = 1
BGE Greater or equal N ⊕ V = 0
BLT Less than N ⊕ V = 1
BGT Greater than Z ∨ (N ⊕ V) = 0
BLE Less or equal Z ∨ (N ⊕ V) = 1
JMP – Branches unconditionally to a specified address.
BSR – Branches to a subroutine at a specified address.
JSR – Branches to a subroutine at a specified address.
RTS – Returns from a subroutine.
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Table 2.9 System Control Instructions
Instruction Size* Function
TRAPA – Starts trap-instruction exception handling.
RTE – Returns from an exception-handling routine.
SLEEP – Causes a transition to a power-down state.
LDC B/W (EAs) → CCR, (EAs) → EXR
Moves the memory operand contents or immediate data to CCR or
EXR. Although CCR and EXR are 8-bit registers, word-size transfers
are performed between them and memory. The upper 8 bits are valid.
STC B/W CCR → (EAd), EXR → (EAd)
Transfers CCR or EXR contents to a general register or memory
operand. Although CCR and EXR are 8-bit registers, word-size
transfers are performed between them and memory. The upper 8 bits
are valid.
ANDC B CCR ∧ #IMM → CCR, EXR ∧ #IMM → EXR
Logically ANDs the CCR or EXR contents with immediate data.
ORC B CCR ∨ #IMM → CCR, EXR ∨ #IMM → EXR
Logically ORs the CCR or EXR contents with immediate data.
XORC B CCR ⊕ #IMM → CCR, EXR ⊕ #IMM → EXR
Logically exclusive-ORs the CCR or EXR contents with immediate
data.
NOP – PC + 2 → PC
Only increments the program counter.
Note: * Size refers to the operand size.
B: Byte
W: Word
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Table 2.10 Block Data Transfer Instructions
Instruction Size Function
EEPMOV.B – if R4L ≠ 0 then
Repeat @ER5+ → @ER6+
R4L–1 → R4L
Until R4L = 0
else next:
EEPMOV.W – if R4 ≠ 0 then
Repeat @ER5+ → @ER6+
R4–1 → R4
Until R4 = 0
else next:
Transfers a data block. Starting from the address set in ER5, transfers
data for the number of bytes set in R4L or R4 to the address location
set in ER6.
Execution of the next instruction begins as soon as the transfer is
completed.
2.6.2 Basic Instruction Formats
The H8S/2000 CPU instructions consist of 2-byte (1-word) units. An instruction consists of an
operation field (op), a register field (r), an effective address extension (EA), and a condition field
(cc).
Figure 2.11 shows examples of instruction formats.
• Operation field
Indicates the function of the instruction, the addressing mode, and the operation to be carried
out on the operand. The operation field always includes the first four bits of the instruction.
Some instructions have two operation fields.
• Register field
Specifies a general register. Address registers are specified by 3 bits, and data registers by 3
bits or 4 bits. Some instructions have two register fields, and some have no register field.
• Effective address extension
8, 16, or 32 bits specifying immediate data, an absolute address, or a displacement.
• Condition field
Specifies the branching condition of Bcc instructions.
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op
op rn rm
NOP, RTS, etc.
ADD.B Rn, Rm, etc.
MOV.B @(d:16, Rn), Rm, etc.
rn rm
op
EA (disp)
op cc EA (disp) BRA d:16, etc.
(1) Operation field only
(2) Operation field and register fields
(3) Operation field, register fields, and effective address extension
(4) Operation field, effective address extension, and condition field
Figure 2.11 Instruction Formats (Examples)
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2.7 Addressing Modes and Effective Address Calculation
The H8S/2000 CPU supports the eight addressing modes listed in table 2.11. Each instruction uses
a subset of these addressing modes.
Arithmetic and logic operations instructions can use the register direct and immediate addressing
modes. Data transfer instructions can use all addressing modes except program-counter relative
and memory indirect. Bit manipulation instructions can use register direct, register indirect, or
absolute addressing mode to specify an operand, and register direct (BSET, BCLR, BNOT, and
BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in the operand.
Table 2.11 Addressing Modes
No. Addressing Mode Symbol
1 Register direct Rn
2 Register indirect @ERn
3 Register indirect with displacement @(d:16,ERn)/@(d:32,ERn)
4 Register indirect with post-increment
Register indirect with pre-decrement
@ERn+
@–ERn
5 Absolute address @aa:8/@aa:16/@aa:24/@aa:32
6 Immediate #xx:8/#xx:16/#xx:32
7 Program-counter relative @(d:8,PC)/@(d:16,PC)
8 Memory indirect @@aa:8
2.7.1 Register Direct—Rn
The register field of the instruction code specifies an 8-, 16-, or 32-bit general register which
contains the operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7
and E0 to E7 can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers.
2.7.2 Register Indirect—@ERn
The register field of the instruction code specifies an address register (ERn) which contains the
address of a memory operand. If the address is a program instruction address, the lower 24 bits are
valid and the upper 8 bits are all assumed to be 0 (H'00).
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2.7.3 Register Indirect with Displacement—@(d:16, ERn) or @(d:32, ERn)
A 16-bit or 32-bit displacement contained in the instruction code is added to an address register
(ERn) specified by the register field of the instruction, and the sum gives the address of a memory
operand. A 16-bit displacement is sign-extended when added.
2.7.4 Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @-ERn
Register Indirect with Post-Increment—@ERn+: The register field of the instruction code
specifies an address register (ERn) which contains the address of a memory operand. After the
operand is accessed, 1, 2, or 4 is added to the address register contents and the sum is stored in the
address register. The value added is 1 for byte access, 2 for word access, and 4 for longword
access. For word or longword transfer instructions, the register value should be even.
Register Indirect with Pre-Decrement—@-ERn: The value 1, 2, or 4 is subtracted from an
address register (ERn) specified by the register field in the instruction code, and the result
becomes the address of a memory operand. The result is also stored in the address register. The
value subtracted is 1 for byte access, 2 for word access, and 4 for longword access. For word or
longword transfer instructions, the register value should be even.
2.7.5 Absolute Address—@aa:8, @aa:16, @aa:24, or @aa:32
The instruction code contains the absolute address of a memory operand. The absolute address
may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24), or 32 bits long
(@aa:32). Table 2.12 indicates the accessible absolute address ranges.
To access data, the absolute address should be 8 bits (@aa:8), 16 bits (@aa:16), or 32 bits
(@aa:32) long. For an 8-bit absolute address, the upper 24 bits are all assumed to be 1 (H'FFFF).
For a 16-bit absolute address, the upper 16 bits are a sign extension. For a 32-bit absolute address,
the entire address space is accessed.
A 24-bit absolute address (@aa:24) indicates the address of a program instruction. The upper 8
bits are all assumed to be 0 (H'00).
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Table 2.12 Absolute Address Access Ranges
Absolute Address Normal Mode Advanced Mode
Data address 8 bits (@aa:8) H'FF00 to H'FFFF H'FFFF00 to H'FFFFFF
16 bits (@aa:16) H'0000 to H'FFFF H'000000 to H'007FFF,
H'FF8000 to H'FFFFFF
32 bits (@aa:32) H'000000 to H'FFFFFF
Program instruction
address
24 bits (@aa:24)
2.7.6 Immediate—#xx:8, #xx:16, or #xx:32
The 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data contained in a instruction
code can be used directly as an operand.
The ADDS, SUBS, INC, and DEC instructions implicitly contain immediate data in their
instruction codes. Some bit manipulation instructions contain 3-bit immediate data in the
instruction code, specifying a bit number. The TRAPA instruction contains 2-bit immediate data
in its instruction code, specifying a vector address.
2.7.7 Program-Counter Relative—@(d:8, PC) or @(d:16, PC)
This mode can be used by the Bcc and BSR instructions. An 8-bit or 16-bit displacement
contained in the instruction code is sign-extended to 24 bits and added to the 24-bit address
indicated by the PC value to generate a 24-bit branch address. Only the lower 24 bits of this
branch address are valid; the upper 8 bits are all assumed to be 0 (H'00). The PC value to which
the displacement is added is the address of the first byte of the next instruction, so the possible
branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to +32768 bytes (–16383 to
+16384 words) from the branch instruction. The resulting value should be an even number.
2.7.8 Memory Indirect—@@aa:8
This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit
absolute address specifying a memory operand which contains a branch address. The upper bits of
the 8-bit absolute address are all assumed to be 0, so the address range is 0 to 255 (H'0000 to
H'00FF in normal mode, H'000000 to H'0000FF in advanced mode).
In normal mode, the memory operand is a word operand and the branch address is 16 bits long. In
advanced mode, the memory operand is a longword operand, the first byte of which is assumed to
be 0 (H'00).
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Note that the top area of the address range in which the branch address is stored is also used for
the exception vector area. For further details, refer to section 4, Exception Handling.
If an odd address is specified in word or longword memory access, or as a branch address, the
least significant bit is regarded as 0, causing data to be accessed or the instruction code to be
fetched at the address preceding the specified address. (For further information, see section 2.5.2,
Memory Data Formats.)
Specified
by @aa:8 Specified
by @aa:8
Branch address
Branch address
Reserved
(a) Normal Mode
*
(b) Advanced Mode
Note: * For this LSI, normal mode is not available.
Figure 2.12 Branch Address Specification in Memory Indirect Addressing Mode
2.7.9 Effective Address Calculation
Table 2.13 indicates how effective addresses are calculated in each addressing mode. In normal
mode, the upper 8 bits of the effective address are ignored in order to generate a 16-bit address.
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Table 2.13 Effective Address Calculation
No
1
Offset
1
2
4
r
op
31 0
31 23
2
3Register indirect with displacement
@(d:16,ERn) or @(d:32,ERn)
4
r
op disp
r
op
rm
op rn
31 0
31 0
r
op
Don't care
31 23
31 0
Don't care
31 0
disp
31 0
31 0
31 23
31 0
Don't care
31 23
31 0
Don't care
24
24
24
24
Addressing Mode and Instruction Format Effective Address Calculation Effective Address (EA)
Register direct (Rn)
General register contents
General register contents
General register contents
General register contents
Sign extension
Register indirect (@ERn)
Register indirect with post-increment or
pre-decrement
•Register indirect with post-increment @ERn+
•Register indirect with pre-decrement @-ERn
1, 2, or 4
1, 2, or 4
Operand Size
Byte
Word
Longword
Operand is general register contents.
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No
5
op 31 23
31 0
Don't care
abs
@aa:8 7
H'FFFF
op 31 23
31 0
Don't care
@aa:16
op
@aa:24
@aa:32
abs 15
16
31 23
31 0
Don't care
31 23
31 0
Don't care
abs
op
abs
6
op IMM
#xx:8/#xx:16/#xx:32
8
24
24
24
24
Addressing Mode and Instruction Format
Absolute address
Immediate
Effective Address Calculation Effective Address (EA)
Sign extension
Operand is immediate data.
31 23
7
Program-counter relative
@(d:8,PC)/@(d:16,PC)
Memory indirect @@aa:8
•*
•
31 0
Don't care
23 0
disp
0
31 23
31 0
Don't care
disp
op
23
op
8
abs 31 0
abs
H'000000 7
8
0
15 31 23
31 0
Don't care 15
H'0016
op abs 31 0
abs
H'000000 7
8
0
31
24
24
24
PC contents
Sign
extension
Memory contents
Memory contents
Note: * For this LSI, normal mode is not available.
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2.8 Processing States
The H8S/2000 CPU has five main processing states: the reset state, exception handling state,
program execution state, bus-released state, and program stop state. Figure 2.13 indicates the state
transitions.
• Reset state
In this state the CPU and internal peripheral modules are all initialized and stopped. When the
RES input goes low, all current processing stops and the CPU enters the reset state. All
interrupts are masked in the reset state. Reset exception handling starts when the RES signal
changes from low to high. For details, refer to section 4, Exception Handling.
The reset state can also be entered by a watchdog timer overflow.
• Exception-handling state
The exception-handling state is a transient state that occurs when the CPU alters the normal
processing flow due to an exception source, such as, a reset, trace, interrupt, or trap instruction.
The CPU fetches a start address (vector) from the exception vector table and branches to that
address. For further details, refer to section 4, Exception Handling.
• Program execution state
In this state the CPU executes program instructions in sequence.
• Bus-released state
In a product which has a DMA controller and a data transfer controller (DTC), the bus-released
state occurs when the bus has been released in response to a bus request from a bus master
other than the CPU. While the bus is released, the CPU halts operations.
• Program stop state
This is a power-down state in which the CPU stops operating. The program stop state occurs
when a SLEEP instruction is executed or the CPU enters hardware standby mode. For details,
refer to section 23, Power-Down Modes.
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Exception
handling state
Bus-released state
Software standby
mode
Reset state*
1
Sleep mode
Power down state*
3
Program execution state
End of bus request
Bus request
RES = High
STBY = High,
RES = Low
Reset state
Hardware standby
mode*
2
End of bus request
Bus request
Request for exception handling
Interrupt request
External interrupt request
SSBY = 0
SLEEP
instruction
SSBY = 1
SLEEP instruction
End of exception handling
Notes: 1. From any state except hardware standby mode, a transition to the reset state occurs whenever RES goes low.
A transition can also be made to the reset state when the watchdog timer overflows.
2. In every state, when the STBY pin becomes low, the hardware standby mode is entered.
3. For details, refer to section 23, Power-Down Modes.
Figure 2.13 State Transitions
2.9 Usage Note
2.9.1 Note on Bit Manipulation Instructions
Bit manipulation instructions such as BSET, BCLR, BNOT, BST, and BIST read data in byte
units, perform bit manipulation, and write data in byte units. Thus, care must be taken when these
bit manipulation instructions are executed for a register or port including write-only bits.
In addition, the BCLR instruction can be used to clear the flag of an internal I/O register. In this
case, if the flag to be cleared has been set by an interrupt processing routine, the flag need not be
read before executing the BCLR instruction.
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Section 3 MCU Operating Modes
3.1 Operating Mode Selection
This LSI has six operating modes (modes 1 to 5 and 7). Modes 1 to 5 and 7 are available in the
H8S/2368 0.18 μm F-ZTAT Group flash memory version. Modes 1 to 4 and 7 are available in the
H8S/2367F. Modes 1, 2, 4, and 7 are available in the masked ROM version. Modes 1 and 2 are
available in the ROMless version. The operating mode is selected by the setting of mode pins
(MD2 to MD0).
Modes 1, 2, and 4 are externally expanded modes in which the CPU can access an external
memory and peripheral devices. In the externally expanded mode, each area can be switched to 8-
bit or 16-bit address space by the bus controller. If any one of the areas is set to 16-bit address
space, the bus mode is 16 bits. If all areas are set to 8-bit address space, the bus mode is 8 bits.
Mode 7 is a single-chip activation externally expanded mode in which the CPU can switch to
access an external memory and peripheral devices at the beginning of a program execution.
Modes 3 and 5 are a boot mode/user boot mode in which the flash memory can be programmed or
erased. For details on the boot mode/user boot mode, refer to section 19, Flash Memory (0.35-μm
F-ZTAT Version), or section 20, Flash Memory (0.18-μm F-ZTAT Version).
Do not change the MD2 to MD0 pin settings during operation.
Table 3.1 MCU Operating Mode Selection
External Data Bus
MCU
Operating
Mode MD2 MD1 MD0
CPU
Operating
Mode Description On-Chip ROM
Initial
Width
Max.
Value
1 0 0 1 Advanced Expanded mode with on-
chip ROM disabled
Disabled 16 bits 16 bits
2 0 1 0 Advanced Expanded mode with on-
chip ROM disabled
Disabled 8 bits 16 bits
3 0 1 1 Advanced Boot mode Enabled — 16 bits
4 1 0 0 Advanced Expanded mode with on-
chip ROM enabled
Enabled 8 bits 16 bits
5* 1 0 1 Advanced User boot mode Enabled — 16 bits
7 1 1 1 Advanced Single-chip mode Enabled — 16 bits
Note: * Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
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3.2 Register Descriptions
The following registers are related to the operating mode.
• Mode control register (MDCR)
• System control register (SYSCR)
3.2.1 Mode Control Register (MDCR)
MDCR monitors the current operating mode of this LSI.
Bit Bit Name Initial Value R/W Descriptions
7 to
3
− All 0 −
Reserved
These bits are always read as 0 and cannot be
modified.
2
1
0
MDS2
MDS1
MDS0
−*
−*
−*
R
R
R
Mode Select 2 to 0
These bits indicate the input levels at pins MD2 to
MD0 (the current operating mode). Bits MDS2 to
MDS0 correspond to MD2 to MD0. MDS2 to MDS0
are read-only bits and they cannot be written to. The
mode pin (MD2 to MD0) input levels are latched into
these bits when MDCR is read. These latches are
canceled by a reset.
Note: * Determined by pins MD2 to MD0.
3.2.2 System Control Register (SYSCR)
SYSCR controls CPU access to the flash memory control registers, sets external bus mode, and
enables or disables on-chip RAM.
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Bit Bit Name Initial Value R/W Descriptions
7, 6 −
All 1
R/W
R/W
Reserved
The initial value should not be modified.
5, 4 − All 0 R/W
R/W
Reserved
The initial value should not be modified.
3 FLSHE 0 R/W Flash Memory Control Register Enable
Controls CPU access to the flash memory control
registers (FLMCR1, FLMCR2, EBR1, and EBR2). If
this bit is set to 1, the flash memory control registers
can be read/written to. If this bit is cleared to 0, the
flash memory control registers are not selected. At
this time, the contents of the flash memory control
registers are maintained. This bit should be written
to 0 in other than flash memory version.
0: Flash memory control registers are not selected
for area H'FFFFC8 to H'FFFFCB
1: Flash memory control registers are selected for
area H'FFFFC8 to H'FFFFCB
2 − 0 − Reserved
This bit is always read as 0 and cannot be modified.
1 EXPE − R/W External Bus Mode Enable
Sets external bus mode.
In modes 1, 2, and 4, this bit is fixed at 1 and cannot
be modified. In mode 3 and 7, this bit has an initial
value of 0, and can be read and written.
Writing of 0 to EXPE when its value is 1 should only
be carried out when an external bus cycle is not
being executed.
0: External bus disabled
1: External bus enabled
0 RAME 1 R/W RAM Enable
Enables or disables the on-chip RAM. The RAME
bit is initialized when the reset status is released.
0: On-chip RAM is disabled
1: On-chip RAM is enabled
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3.3 Operating Mode Descriptions
3.3.1 Mode 1
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is disabled.
Ports A, B, and C function as an address bus, ports D and E function as a data bus, and parts of
ports F, and G, carry bus control signals.
The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. However, if 8-bit access
is designated for all areas by the bus controller, the bus mode switches to 8 bits.
3.3.2 Mode 2
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is disabled.
Ports A, B, and C function as an address bus, ports D and E function as a data bus, and parts of
ports F, and G carry bus control signals.
The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. However, if 16-bit access
is designated for any one of the areas by the bus controller, the bus mode switches to 16 bits and
port E functions as a data bus.
3.3.3 Mode 3
This mode is a boot mode of the flash memory. This mode is the same as mode 7, except for the
programming and erasure on the flash memory. Mode 3 is only available in the H8S/2368 Group
flash memory version.
3.3.4 Mode 4
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled.
The program in the on-chip ROM connected to the first half of area 0 is executed.
Ports A, B, and C function as input ports immediately after a reset, but can be set to function as an
address bus. Ports D and E function as a data bus, and parts of ports F, and G, carry bus control
signals. For details, see section 9, I/O Ports.
The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. However, if 16-bit access
is designated for any area by the bus controller, the bus mode switches to 16 bits and port E
functions as a data bus.
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In the flash memory version, user program mode is entered by setting the SWE bit of FLMCR1 to
1.
3.3.5 Mode 5
This mode is a user boot mode of the flash memory. This mode is the same as mode 7, except for
the programming and erasure on the flash memory. Mode 5 is only available in the H8S/2368 0.18
μm F-ZTAT Group.
3.3.6 Mode 7
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled,
and the chip starts up in single-chip mode. External address space cannot be used in single-chip
mode.
The initial mode after a reset is single-chip mode, with all I/O ports available for use as
input/output ports. However, the mode can be switched to externally expanded mode by setting 1
to the EXPE bit of SYSCR and then the external address space is enabled. When externally
expanded mode is selected, all areas are initially designated as 16-bit access space. The functions
of pins in ports A to G are the same as in externally expanded mode with on-chip ROM enabled.
In the flash memory version, user program mode is entered by setting the SWE bit of FLMCR1 to
1.
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3.3.7 Pin Functions
Table 3.2 shows the pin functions in each operating mode.
Table 3.2 Pin Functions in Each Operating Mode
Port Mode 1 Mode 2 Mode 3*2 Mode 4*2 Mode 5*2*3 Mode 7*2
PA7 to PA5 P*1/A P*1/A Port A
PA4 to PA0 A A
P*1/A P*1/A P*1/A P*1/A
Port B A A P*1/A P*1/A P*1/A P*1/A
Port C A A P*1/A P*1/A P*1/A P*1/A
Port D D D P*1/D D P*1/D P*1/D
Port E P/D*1 P
*1/D P*1/D P*1/D P*1/D P*1/D
PF7, PF6 P/C*1 P
*1/C P/C*1
PF5, PF4 C C C
PF3 P/C*1 P/C*1 P/C*1
Port F
PF2 to PF0 P*1/C P*1/C
P*1/C
P*1/C
P*1/C P*1/C
Port G PG6 to PG1 P*1/C P*1/C P*1/C P*1/C P*1/C P*1/C
PG0 P/C*1 P/C*1 P
*1/C
Legend:
P: I/O port
A: Address bus output
D: Data bus input/output
C: Control signals, clock input/output
Notes: 1. After reset
2. Setting not allowed on ROMless versions.
3. Mode 5 is available only in the H8S/2368 0.18 μm F-ZTAT Group.
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3.4 Memory Map in Each Operating Mode
Figures 3.1 to 3.15 show memory maps for each product.
RAM: 32 kbytes
Modes 1 and 2
(Expanded mode with
on-chip ROM disabled)
ROM: 512 kbytes
RAM: 32 kbytes
Mode 3
(Boot mode)
H'000000
H'FF4000
H'FFC000
H'FFD000
H'000000
H'FFFC00
External address
space
On-chip RAM/
external address
space*1
External address space
External address space
Internal I/O registers
On-chip ROM
H'FFFFFF
H'FFFC00
H'FFFF00
H'FFFF20
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000
External address
space/
reserved area*2*4
Reserved area*4
H'FF4000
H'FFC000
H'FFD000
Reserved area*4
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. On-chip RAM is used for flash memory programming. The RAME bit in SYSCR should not be cleared to 0.
4. A reserved area should not be accessed.
Internal I/O registers
Internal I/O registers
Internal I/O registers
External address space/
reserved area
*2*4
On-chip RAM*3
External address space/
reserved area
*2*4
Figure 3.1 H8S/2368F Memory Map (1)
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ROM: 512 kbytes
RAM: 32 kbytes
Mode 5
(User boot mode)
H'000000
H'FFFC00
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000H'080000
External address
space/
reserved area*
2
*
4
H'FF4000
H'FFC000
H'FFD000
*
5
Reserved area*
4
External address space/
reserved area
*
2
*
4
External address space/
reserved area
*
2
*
4
Internal I/O registers
Internal I/O registers
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. When EXPE = 1, external address space with RAME = 0, on-chip RAM with RAME = 1.
When EXPE = 0, on-chip RAM.
H'FF4000
H'FFC000
H'FFD000
Reserved area*
4
ROM: 512 kbytes
RAM: 32 kbytes
Mode 4
(Expanded mode with
on-chip ROM enabled)
H'000000
H'FFFC00
On-chip ROM On-chip ROM
H'FFFFFF
H'FFFF00
H'FFFF20
External address
space
Internal I/O registers
Internal I/O registers
External address space
External address space
On-chip RAM/
external address
space*
1
On-chip RAM
4. A reserved area should not be accessed.
5. The on-chip RAM is used to program the flash memory. The RAME bit in SYSCR should not be cleared to 0.
ROM: 512 kbytes
RAM: 32 kbytes
Mode 7
(Single-chip activation
expanded mode,
with on-chip ROM enabled)
H'000000
H'FFFC00
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000
External address
space/
reserved area*
2
*
4
H'FF4000
H'FFC000
H'FFD000
*
3
Reserved area*
4
External address space/
reserved area
*
2
*
4
External address space/
reserved area
*
2
*
4
Internal I/O registers
Internal I/O registers
On-chip ROM
On-chip RAM/
external address
space
Figure 3.2 H8S/2368F Memory Map (2)
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 65 of 980
REJ09B0050-0600
RAM: 24 kbytes
Modes 1 and 2
(Expanded mode with
on-chip ROM disabled)
ROM: 384 kbytes
RAM: 24 kbytes
Mode 3
(Boot mode)
H'000000
H'FF4000
H'FF6000
H'FFC000
H'FFC800
H'000000
H'FFFC00
External address
space
On-chip RAM/
external address
space*1
External address space
External address space
Internal I/O registers
On-chip ROM
H'FFFFFF
H'FFFC00
H'FFFF00
H'FFFF20
H'FFFFFF
H'FFFF00
H'FFFF20
H'060000
External address
space/
reserved area*2*4
Reserved area*4
Reserved area*4
H'FF4000
H'FF6000
H'FFC000
H'FFC800
Reserved area*4
Reserved area*4
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. On-chip RAM is used for flash memory programming. Do not clear the RAME bit in SYSCR to 0.
4. Do not access a reserved area.
Internal I/O registers
Internal I/O registers
Internal I/O registers
External address space/
reserved area
*2*4
On-chip RAM*3
External address space/
reserved area
*2*4
Figure 3.3 H8S/2367F Memory Map (1)
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 66 of 980
REJ09B0050-0600
ROM: 384 kbytes
RAM: 24 kbytes
Mode 7
(Single-chip activation
expanded mode,
with on-chip ROM enabled)
H'000000
H'FFFC00
H'FFFFFF
H'FFFF00
H'FFFF20
H'060000H'060000
External address
space/
reserved area*2*4
H'FF4000
H'FF6000
H'FFC000
H'FFC800
Reserved area*4
*
3
Reserved area*4
External address space/
reserved area
*
2
*4
External address space/
reserved area
*
2
*4
Internal I/O registers
Internal I/O registers
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. When EXPE = 1, external address space with RAME = 0, on-chip RAM with RAME = 1.
When EXPE = 0, on-chip RAM.
H'FF4000
H'FF6000
H'FFC000
H'FFC800
Reserved area
Reserved area
ROM: 384 kbytes
RAM: 24 kbytes
Mode 4
(Expanded mode with
on-chip ROM enabled)
H'000000
H'FFFC00
On-chip ROM On-chip ROM
H'FFFFFF
H'FFFF00
H'FFFF20
External address
space
Internal I/O registers
Internal I/O registers
External address space
External address space
On-chip RAM/
external address
space*1
On-chip RAM/
external address
space
4. Do not access a reserved area.
Figure 3.4 H8S/2367F Memory Map (2)
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 67 of 980
REJ09B0050-0600
RAM: 32 kbytes
Modes 1 and 2
(Expanded mode with
on-chip ROM disabled)
ROM: 384 kbytes
RAM: 32 kbytes
Mode 3
(Boot mode)
H'000000
H'FF4000
H'FFC000
H'FFD000
H'000000
H'FFFC00
External address
space
On-chip RAM/
external address
space*
1
On-chip RAM*
3
External address space
External address space
Internal I/O registers
On-chip ROM
Reserved area*
4
H'FFFFFF
H'FFFC00
H'FFFF00
H'FFFF20
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000
H'060000
External address
space/
reserved area*
2
*
4
Reserved area*
4
H'FF4000
H'FFC000
H'FFD000
Reserved area*
4
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. On-chip RAM is used for flash memory programming. The RAME bit in SYSCR should not be cleared to 0.
4. A reserved area should not be accessed.
Internal I/O registers
Internal I/O registers
Internal I/O registers
External address space
/
reserved area
*
2
*
4
External address space
/
reserved area
*
2
*
4
Figure 3.5 H8S/2364F Memory Map (1)
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 68 of 980
REJ09B0050-0600
ROM:
384
kbytes
RAM: 32 kbytes
Mode 5
(User boot mode)
H'000000
H'FFFC00
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000H'080000
External address
space/
reserved area*2*4
H'FF4000
H'FFC000
H'FFD000
*
5
Reserved area *4
External address space/
reserved area
*
2
*4
External address space/
reserved area
*
2
*4
Internal I/O registers
Internal I/O registers
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. When EXPE = 1, external address space with RAME = 0, on-chip RAM with RAME = 1.
When EXPE = 0, on-chip RAM.
H'FF4000
H'FFC000
H'FFD000
Reserved area*4
ROM: 384 kbytes
RAM: 32 kbytes
Mode 4
(Expanded mode with
on-chip ROM enabled)
H'000000
H'FFFC00
On-chip ROM On-chip ROM
H'FFFFFF
H'FFFF00
H'FFFF20
External address
space
Internal I/O registers
Internal I/O registers
External address space
External address space
On-chip RAM/
external address
space*1
On-chip RAM
4. A reserved area should not be accessed.
5. The on-chip RAM is used to program the flash memory. The RAME bit in SYSCR should not be cleared to 0.
ROM:
384
kbytes
RAM: 32 kbytes
Mode 7
(Single-chip activation
expanded mode,
with on-chip ROM enabled)
H'000000
H'FFFC00
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000
H'060000H'060000 H'060000
External address
space/
reserved area*2*4
H'FF4000
H'FFC000
H'FFD000
*
3
Reserved area*4
External address space
/
reserved area
*2*4
External address space
/
reserved area
*2*4
Internal I/O registers
Internal I/O registers
On-chip ROM
Reserved area*4Reserved area*4Reserved area*4
On-chip RAM/
external address
space
Figure 3.6 H8S/2364F Memory Map (2)
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 69 of 980
REJ09B0050-0600
RAM: 32 kbytes
Modes 1 and 2
(Expanded mode with
on-chip ROM disabled)
ROM: 256 kbytes
RAM: 32 kbytes
Mode 3
(Boot mode)
H'000000
H'FF4000
H'FFC000
H'FFD000
H'000000
H'FFFC00
External address
space
On-chip RAM/
external address
space*1
External address space
External address space
Internal I/O registers
On-chip ROM
Reserved area*4
H'FFFFFF
H'FFFC00
H'FFFF00
H'FFFF20
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000
H'040000
External address
space/
reserved area*2*4
Reserved area*4
H'FF4000
H'FFC000
H'FFD000
Reserved area*4
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. On-chip RAM is used for flash memory programming. The RAME bit in SYSCR should not be cleared to 0.
4. A reserved area should not be accessed.
Internal I/O registers
Internal I/O registers
Internal I/O registers
External address space/
reserved area
*2*4
On-chip RAM*3
External address space/
reserved area
*2*4
Figure 3.7 H8S/2362F Memory Map (1)
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 70 of 980
REJ09B0050-0600
ROM: 256 kbytes
RAM: 32 kbytes
Mode 5
(User boot mode)
H'000000
H'FFFC00
H'FFFFFF
H'FFFF00
H'FFFF20
H'060000H'060000
External address
space/
reserved area*2*4
H'FF4000
H'FFC000
H'FFD000
*
5
Reserved area*4
External address space/
reserved area
*
2
*4
External address space/
reserved area
*
2
*4
Internal I/O registers
Internal I/O registers
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. When EXPE = 1, external address space with RAME = 0, on-chip RAM with RAME = 1.
When EXPE = 0, on-chip RAM.
H'FF4000
H'FFC000
H'FFD000
Reserved area
ROM: 256 kbytes
RAM: 32 kbytes
Mode 4
(Expanded mode with
on-chip ROM enabled)
H'000000
H'FFFC00
On-chip ROM On-chip ROM
H'FFFFFF
H'FFFF00
H'FFFF20
External address
space
Internal I/O registers
Internal I/O registers
External address space
External address space
On-chip RAM/
external address
space*1
On-chip RAM
4. A reserved area should not be accessed.
5. The on-chip RAM is used to program the flash memory. The RAME bit in SYSCR should not be cleared to 0.
ROM: 256 kbytes
RAM: 32 kbytes
Mode 7
(Single-chip activation
expanded mode,
with on-chip ROM enabled)
H'000000
H'FFFC00
H'FFFFFF
H'FFFF00
H'FFFF20
H'060000
H'040000H'040000 H'040000
External address
space/
reserved area*2*4
H'FF4000
H'FFC000
H'FFD000
*
3
Reserved area*4
External address space/
reserved area
*
2
*4
External address space/
reserved area
*
2
*4
Internal I/O registers
Internal I/O registers
On-chip ROM
Reserved area*4Reserved area*4Reserved area*4
On-chip RAM/
external address
space
Figure 3.8 H8S/2362F Memory Map (2)
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 71 of 980
REJ09B0050-0600
RAM: 24 kbytes
Modes 1 and 2
(Expanded mode with
on-chip ROM disabled)
ROM: 256 kbytes
RAM: 24 kbytes
Mode 3
(Boot mode)
H'000000
H'FF6000
H'FFC000
H'FFD000
H'000000
H'FFFC00
External address
space
On-chip RAM/
external address
space*1
On-chip RAM*3
External address space
External address space
Internal I/O registers
On-chip ROM
Reserved area*4
H'FFFFFF
H'FFFC00
H'FFFF00
H'FFFF20
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000
H'040000
External address
space/
reserved area*2*4
Reserved area*4
H'FF6000
H'FF4000 H'FF4000
H'FFC000
H'FFD000
Reserved area*4
Reserved area*4Reserved area*4
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. On-chip RAM is used for flash memory programming. The RAME bit in SYSCR should not be cleared to 0.
4. A reserved area should not be accessed.
Internal I/O registers
Internal I/O registers
Internal I/O registers
External address space/
reserved area
*2*4
External address space/
reserved area
*2*4
Figure 3.9 H8S/2361F Memory Map (1)
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 72 of 980
REJ09B0050-0600
ROM: 256 kbytes
RAM: 24 kbytes
Mode 5
(User boot mode)
H'000000
H'FFFC00
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000H'080000
External address
space/
reserved area*2*4
External address
space/
reserved area*2*4
H'FF6000
H'FFC000
H'FFD000
*
5
Reserved area*4
External address space/
reserved area
*
2
*4
External address space/
reserved area
*
2
*4
Internal I/O registers
Internal I/O registers
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. When EXPE = 1, external address space with RAME = 0, on-chip RAM with RAME = 1.
When EXPE = 0, on-chip RAM.
H'FF6000
H'FFC000
H'FFD000
Reserved area*4
ROM: 256 kbytes
RAM: 24 kbytes
Mode 4
(Expanded mode with
on-chip ROM enabled)
H'000000
H'FFFC00
On-chip ROM On-chip ROM
H'FFFFFF
H'FFFF00
H'FFFF20
External address
space
Internal I/O registers
Internal I/O registers
External address space
External address space
On-chip RAM/
external address
space*1
On-chip RAM
4. A reserved area should not be accessed.
5. The on-chip RAM is used to program the flash memory. The RAME bit in SYSCR should not be cleared to 0.
ROM: 256 kbytes
RAM: 24 kbytes
Mode 7
(Single-chip activation
expanded mode,
with on-chip ROM enabled)
H'000000
H'FFFC00
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000
H'040000H'040000 H'040000
H'FF6000
H'FF4000
H'FF4000 H'FF4000
H'FFC000
H'FFD000
*
3
Reserved area*4
Internal I/O registers
Internal I/O registers
Reserved area*4
Reserved area*4Reserved area*4
On-chip ROM
Reserved area*4Reserved area*4Reserved area*4
On-chip RAM/
external address
space
External address space/
reserved area
*
2
*
4
External address space/
reserved area
*
2
*
4
Figure 3.10 H8S/2361F Memory Map (2)
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 73 of 980
REJ09B0050-0600
RAM: 16 kbytes
Modes 1 and 2
(Expanded mode with
on-chip ROM disabled)
ROM: 256 kbytes
RAM: 16 kbytes
Mode 3
(Boot mode)
H'000000
H'FF8000
H'FFC000
H'FFD000
H'000000
H'FFFC00
External address
space
On-chip RAM/
external address
space*1
On-chip RAM*3
External address space
External address space
Internal I/O registers
On-chip ROM
Reserved area*4
H'FFFFFF
H'FFFC00
H'FFFF00
H'FFFF20
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000
H'040000
External address
space
Reserved area*4
H'FF8000
H'FF4000 H'FF4000
H'FFC000
H'FFD000
Reserved area*4
Reserved area*4Reserved area*4
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. On-chip RAM is used for flash memory programming. The RAME bit in SYSCR should not be cleared to 0.
4. A reserved area should not be accessed.
Internal I/O registers
Internal I/O registers
Internal I/O registers
External address space/
reserved area
*2*4
External address space/
reserved area
*2*4
Figure 3.11 H8S/2360F Memory Map (1)
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 74 of 980
REJ09B0050-0600
ROM: 256 kbytes
RAM: 16 kbytes
Mode 5
(User boot mode)
H'000000
H'FFFC00
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000H'080000
External address
space/
reserved area*2*4
External address
space/
reserved area*2*4
H'FF8000
H'FFC000
H'FFD000
*
5
Reserved area*4
External address space/
reserved area
*
2
*4
External address space/
reserved area
*
2
*4
Internal I/O registers
Internal I/O registers
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. When EXPE = 1, external address space; when EXPE = 0, reserved area.
3. When EXPE = 1, external address space with RAME = 0, on-chip RAM with RAME = 1.
When EXPE = 0, on-chip RAM.
H'FF8000
H'FFC000
H'FFD000
Reserved area*4
ROM: 256 kbytes
RAM: 16 kbytes
Mode 4
(Expanded mode with
on-chip ROM enabled)
H'000000
H'FFFC00
On-chip ROM On-chip ROM
H'FFFFFF
H'FFFF00
H'FFFF20
External address
space
Internal I/O registers
Internal I/O registers
External address space
External address space
On-chip RAM/
external address
space*1
On-chip RAM
4. A reserved area should not be accessed.
5. The on-chip RAM is used to program the flash memory. The RAME bit in SYSCR should not be cleared to 0.
ROM: 256 kbytes
RAM: 16 kbytes
Mode 7
(Single-chip activation
expanded mode,
with on-chip ROM enabled)
H'000000
H'FFFC00
H'FFFFFF
H'FFFF00
H'FFFF20
H'080000
H'040000H'040000 H'040000
H'FF8000
H'FF4000
H'FF4000 H'FF4000
H'FFC000
H'FFD000
*
3
Reserved area*4
Internal I/O registers
Internal I/O registers
Reserved area*4
Reserved area*4Reserved area*4
On-chip ROM
Reserved area*4Reserved area*4Reserved area*4
On-chip RAM/
external address
space
External address space/
reserved area
*
2
*
4
External address space/
reserved area
*
2
*
4
Figure 3.12 H8S/2360F Memory Map (2)
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 75 of 980
REJ09B0050-0600
RAM: 16 kbytes
Modes 1 and 2
(Expanded mode with
on-chip ROM disabled)
H'000000
H'FF8000
H'FFC000
H'FFC800
External address
space
On-chip RAM/
external address
space*1
External address space
External address space
Internal I/O registers
H'FFFFFF
H'FFFC00
H'FFFF00
H'FFFF20
Reserved area*2
H'FF8000
H'FF4000 H'FF4000
H'FFC000
H'FFC800
Reserved area*2
Reserved area*2
Reserved area*2Reserved area*2
ROM: 256 kbytes
RAM: 16 kbytes
Mode 4
(Expanded mode with
on-chip ROM enabled)
H'000000
H'FFFC00
On-chip ROM
H'FFFFFF
H'FFFF00
H'FFFF20
H'060000
H'040000
External address
space
Notes: 1. This area is specified as external address space by clearing the RAME bit in SYSCR to 0.
2. Do not access a reserved area.
Internal I/O registers
Internal I/O registers
Internal I/O registers
External address space
External address space
On-chip RAM/
external address
space*1
Figure 3.13 H8S/2365 Memory Map (1)
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 76 of 980
REJ09B0050-0600
H'000000
H'FFFC00
H'FF8000
H'FFC800
H'FFC000
Reserved area
*
3
On-chip ROM
ROM: 258 kbytes
RAM: 16 kbytes
Mode 7
(Single-chip activation expanded mode,
with on-chip ROM enabled)
H'FFFFFF
H'FFFF00
H'FFFF20
H'060000
H'040000
External address
space/
reserved area
*
1
*
3
On-chip RAM/
external address
space
*
2
Internal I/O registers
Internal I/O registers
External address space/
reserved area
*
1
*
3
External address space/
reserved area
*
1
*
3
Notes: 1. When EXPE = 1, external address space; when EXPE = 0, reserved area.
2. When EXPE = 1, external address space with RAME = 0, on-chip RAM with RAME = 1.
When EXPE = 0, on-chip RAM.
H'FF4000
Reserved area
*
3
Reserved area
*
3
3. Do not access a reserved area.
Figure 3.14 H8S/2365 Memory Map (2)
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 77 of 980
REJ09B0050-0600
RAM: 16 kbytes
Modes 1 and 2
(Expanded mode with
on-chip ROM disabled)
H'000000
H'FF8000
H'FFC000
H'FFC800
External address
space
On-chip RAM/
external address
space*
1
External address space
External address space
Internal I/O registers
H'FFFFFF
H'FFFC00
H'FFFF00
H'FFFF20
Reserved area*
2
Notes: 1. This area is specified as the external address space by clearing the RAME bit in SYSCR to 0.
2. Do not access a reserved area.
Internal I/O registers
Figure 3.15 H8S/2363 Memory Map
Section 3 MCU Operating Modes
Rev.6.00 Mar. 18, 2009 Page 78 of 980
REJ09B0050-0600
Section 4 Exception Handling
Rev.6.00 Mar. 18, 2009 Page 79 of 980
REJ09B0050-0600
Section 4 Exception Handling
4.1 Exception Handling Types and Priority
As table 4.1 indicates, exception handling may be caused by a reset, trace, interrupt, or trap
instruction. Exception handling is prioritized as shown in table 4.1. If two or more exceptions
occur simultaneously, they are accepted and processed in order of priority. Exception sources, the
stack structure, and operation of the CPU vary depending on the interrupt control mode. For
details on the interrupt control mode, refer to section 5, Interrupt Controller.
Table 4.1 Exception Types and Priority
Priority Exception Type Start of Exception Handling
High Reset Starts immediately after a low-to-high transition at the RES
pin, or when the watchdog timer overflows. The CPU enters
the reset state when the RES pin is low.
Trace*1 Starts when execution of the current instruction or exception
handling ends, if the trace (T) bit in the EXR is set to 1.
Direct transition*2 Starts when the direct transition occurs by execution of the
SLEEP instruction.
Interrupt Starts when execution of the current instruction or exception
handling ends, if an interrupt request has been issued.*3
Low Trap instruction*4 Started by execution of a trap instruction (TRAPA)
Notes: 1. Traces are enabled only in interrupt control mode 2. Trace exception handling is not
executed after execution of an RTE instruction.
2. Not available in this LSI.
3. Interrupt detection is not performed on completion of ANDC, ORC, XORC, or LDC
instruction execution, or on completion of reset exception handling.
4. Trap instruction exception handling requests are accepted at all times in program
execution state.
4.2 Exception Sources and Exception Vector Table
Different vector addresses are assigned to different exception sources. Table 4.2 lists the exception
sources and their vector addresses. Since the usable modes differ depending on the product, for
details on each product, refer to section 3, MCU Operating Modes.
Section 4 Exception Handling
Rev.6.00 Mar. 18, 2009 Page 80 of 980
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Table 4.2 Exception Handling Vector Table
Vector Address*1
Exception Source Vector Number Normal Mode*2 Advanced Mode
Power-on reset 0 H'0000 to H'0001 H'0000 to H'0003
Manual reset*3 1 H'0002 to H'0003 H'0004 to H'0007
Reserved for system use 2 H'0004 to H'0005 H'0008 to H'000B
3 H'0006 to H'0007 H'000C to H'000F
4 H'0008 to H'0019 H'0010 to H'0013
Trace 5 H'000A to H'000B H'0014 to H'0017
Interrupt (direct transition)*3 6 H'000C to H'000D H'0018 to H'001B
Interrupt (NMI) 7 H'000E to H'000F H'001C to H'001F
Trap instruction (#0) 8 H'0010 to H'0011 H'0020 to H'0023
(#1) 9 H'0012 to H'0013 H'0024 to H'0027
(#2) 10 H'0014 to H'0015 H'0028 to H'002B
(#3) 11 H'0016 to H'0017 H'002C to H'002F
Reserved for system use 12 H'0018 to H'0019 H'0030 to H'0033
13 H'001A to H'001B H'0034 to H'0037
14 H'001C to H'001D H'0038 to H'003B
15 H'001E to H'001F H'003C to H'003F
External interrupt IRQ0 16 H'0020 to H'0021 H'0040 to H'0043
IRQ1 17 H'0022 to H'0023 H'0044 to H'0047
IRQ2 18 H'0024 to H'0025 H'0048 to H'004B
IRQ3 19 H'0026 to H'0027 H'004C to H'004F
IRQ4 20 H'0028 to H'0029 H'0050 to H'0053
IRQ5 21 H'002A to H'002B H'0054 to H'0057
IRQ6 22 H'002C to H'002D H'0058 to H'005B
IRQ7 23 H'002E to H'002F H'005C to H'005F
Reserved for system use 24 H'0030 to H'0031 H'0060 to H'0063
25 H'0032 to H'0033 H'0064 to H'0067
26 H'0034 to H'0035 H'0068 to H'006B
27 H'0036 to H'0037 H'006C to H'006F
28 H'0038 to H'0039 H'0070 to H'0073
29 H'003A to H'003B H'0074 to H'0077
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Vector Address*1
Exception Source Vector Number Normal Mode*2 Advanced Mode
Reserved for system use 30 H'003C to H'003D H'0078 to H'007B
31 H'003E to H'003F H'007C to H'007F
Internal interrupt*4 32
⎜
118
H'0040 to H'0041
⎜
H'00EC to H'00ED
H'0080 to H'0083
⎜
H'01D8 to H'01DB
Notes: 1. Lower 16 bits of the address.
2. Not available in this LSI.
3. Not available in this LSI. It is reserved for system use.
4. For details of internal interrupt vectors, see section 5.5, Interrupt Exception Handling
Vector Table.
4.3 Reset
A reset has the highest exception priority. When the RES pin goes low, all processing halts and
this LSI enters the reset. To ensure that this LSI is reset, hold the RES pin low for at least 20 ms at
power-up. To reset the chip during operation, hold the RES pin low for at least 20 states. A reset
initializes the internal state of the CPU and the registers of on-chip peripheral modules.
The chip can also be reset by overflow of the watchdog timer. For details see section 13,
Watchdog Timer.
The interrupt control mode is 0 immediately after reset.
4.3.1 Reset Exception Handling
When the RES pin goes high after being held low for the necessary time, this LSI starts reset
exception handling as follows:
1. The internal state of the CPU and the registers of the on-chip peripheral modules are
initialized, the T bit is cleared to 0 in EXR, and the I bit is set to 1 in EXR and CCR.
2. The reset exception handling vector address is read and transferred to the PC, and program
execution starts from the address indicated by the PC.
Figures 4.1 and 4.2 show examples of the reset sequence.
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High
Vector fetch Internal
processing Prefetch of first
program instruction
(1)(3) Reset exception handling vector address (when reset, (1)=H'000000, (3)=H'000002)
(2)(4) Start address (contents of reset exception handling vector address)
(5) Start address ((5)=(2)(4))
(6) First program instruction
φ
Internal
address bus
Internal read
signal
Internal write
signal
Internal data
bus
(1)
(2) (4) (6)
(3) (5)
Figure 4.1 Reset Sequence (Advanced Mode with On-Chip ROM Enabled)
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,
D15 to D0
High
* * *
Address bus
Vector fetch Internal
processing Prefetch of first
program instruction
(1)
(2) (4) (6)
(3) (5)
(1)(3) Reset exception handling vector address (when reset, (1)=H'000000, (3)=H'000002)
(2)(4) Start address (contents of reset exception handling vector address)
(5) Start address ((5)=(2)(4))
(6) First program instruction
Note: * Seven program wait states are inserted.
Figure 4.2 Reset Sequence (Advanced Mode with On-Chip ROM Disabled)
4.3.2 Interrupts after Reset
If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, the PC and
CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests,
including NMI, are disabled immediately after a reset. Since the first instruction of a program is
always executed immediately after the reset state ends, make sure that this instruction initializes
the stack pointer (example: MOV.L #xx: 32, SP).
4.3.3 On-Chip Peripheral Functions after Reset Release
After reset release, MSTPCR is initialized to H'0FFF and EXMSTPCR is to H'FFFD, all modules
except the DMAC and the DTC enter module stop mode.
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Consequently, on-chip peripheral module registers cannot be read from or written to. Register
reading and writing is enabled when module stop mode is exited.
4.4 Traces
Traces are enabled in interrupt control mode 2. Trace mode is not activated in interrupt control
mode 0, irrespective of the state of the T bit. For details on interrupt control modes, see section 5,
Interrupt Controller.
If the T bit in EXR is set to 1, trace mode is activated. In trace mode, a trace exception occurs on
completion of each instruction. Trace mode is not affected by interrupt masking. Table 4.3 shows
the state of CCR and EXR after execution of trace exception handling. Trace mode is canceled by
clearing the T bit in EXR to 0. The T bit saved on the stack retains its value of 1, and when control
is returned from the trace exception handling routine by the RTE instruction, trace mode resumes.
Trace exception handling is not carried out after execution of the RTE instruction.
Interrupts are accepted even within the trace exception handling routine.
Table 4.3 Status of CCR and EXR after Trace Exception Handling
CCR EXR
Interrupt Control Mode I UI I2 to I0 T
0 Trace exception handling cannot be used.
2 1 — — 0
Legend:
1: Set to 1
0: Cleared to 0
—: Retains value prior to execution.
4.5 Interrupts
Interrupts are controlled by the interrupt controller. The interrupt controller has two interrupt
control modes and can assign interrupts other than NMI to eight priority/mask levels to enable
multiplexed interrupt control. The source to start interrupt exception handling and the vector
address differ depending on the product. For details, refer to section 5, Interrupt Controller.
The interrupt exception handling is as follows:
1. The values in the program counter (PC), condition code register (CCR), and extended register
(EXR) are saved in the stack.
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2. The interrupt mask bit is updated and the T bit is cleared to 0.
3. A vector address corresponding to the interrupt source is generated, the start address is loaded
from the vector table to the PC, and program execution starts from that address.
4.6 Trap Instruction
Trap instruction exception handling starts when a TRAPA instruction is executed. Trap instruction
exception handling can be executed at all times in the program execution state.
The trap instruction exception handling is as follows:
1. The values in the program counter (PC), condition code register (CCR), and extended register
(EXR) are saved in the stack.
2. The interrupt mask bit is updated and the T bit is cleared to 0.
3. A vector address corresponding to the interrupt source is generated, the start address is loaded
from the vector table to the PC, and program execution starts from that address.
The TRAPA instruction fetches a start address from a vector table entry corresponding to a vector
number from 0 to 3, as specified in the instruction code.
Table 4.4 shows the status of CCR and EXR after execution of trap instruction exception handling.
Table 4.4 Status of CCR and EXR after Trap Instruction Exception Handling
CCR EXR
Interrupt Control Mode I UI I2 to I0 T
0 1 — — —
2 1 — — 0
Legend:
1: Set to 1
0: Cleared to 0
—: Retains value prior to execution.
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4.7 Stack Status after Exception Handling
Figure 4.3 shows the stack after completion of trap instruction exception handling and interrupt
exception handling.
CCR
CCR*
1
PC (16 bits)
SP
EXR
Reserved*
1
CCR
CCR*
1
PC (16 bits)
SP
CCR
PC (24 bits)
SP
EXR
Reserved*
1
CCR
PC (24 bits)
SP
(a) Normal Modes
*
2
(b) Advanced Modes
Interrupt control mode 0 Interrupt control mode 2
Interrupt control mode 0 Interrupt control mode 2
Notes: 1.
2. Ignored on return.
Normal modes are not available in this LSI.
Figure 4.3 Stack Status after Exception Handling
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4.8 Usage Notes
When accessing word data or longword data, this LSI assumes that the lowest address bit is 0. The
stack should always be accessed by word transfer instruction or longword transfer instruction, and
the value of the stack pointer (SP, ER7) should always be kept even. Use the following
instructions to save registers:
PUSH.W Rn (or MOV.W Rn, @-SP)
PUSH.L ERn (or MOV.L ERn, @-SP)
Use the following instructions to restore registers:
POP.W Rn (or MOV.W @SP+, Rn)
POP.L ERn (or MOV.L @SP+, ERn)
Setting SP to an odd value may lead to a malfunction. Figure 4.4 shows an example of operation
when the SP value is odd.
SP
CCR :
PC :
R1L :
SP :
Condition code register
Program counter
General register R1L
Stack pointer
CCR
SP SP R1L H'FFFEFA
H'FFFEFB
H'FFFEFC
H'FFFEFD
H'FFFEFE
H'FFFEFF
PC PC
TRAP instruction executed
SP set to H'FFFEFF Data saved above SP
MOV.B R1L, @-ER7
Contents of CCR lost
Address
[Legend]
Note: This diagram illustrates an example in which the interrupt control mode is 0, in advanced mode.
Figure 4.4 Operation when SP Value Is Odd
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Section 5 Interrupt Controller
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Section 5 Interrupt Controller
5.1 Features
• Two interrupt control modes
Any of two interrupt control modes can be set by means of the INTM1 and INTM0 bits in the
interrupt control register (INTCR).
• Priorities settable with IPR
An interrupt priority register (IPR) is provided for setting interrupt priorities. Eight priority
levels can be set for each module for all interrupts except NMI. NMI is assigned the highest
priority level of 8, and can be accepted at all times.
• Independent vector addresses
All interrupt sources are assigned independent vector addresses, making it unnecessary for the
source to be identified in the interrupt handling routine.
• Nine external interrupts
NMI is the highest-priority interrupt, and is accepted at all times. Rising edge or falling edge
can be selected for NMI. Falling-edge, rising-edge, or both-edge detection, or level sensing,
can be selected for IRQ7 to IRQ0.
• DTC and DMAC control
DTC and DMAC activations are performed by means of interrupts.
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A block diagram of the interrupt controller is shown in figure 5.1.
INTCR
NMI input
IRQ input
Internal
interrupt
sources
SWDTEND
to IICI1
INTM1 INTM0
NMIEG
NMI input unit
IRQ input unit
ISR
ISCRLITSR IER
IPR
Interrupt controller
Priority
determination
Interrupt
request
Vector
number
I
I2 to I0
CCR
EXR
CPU
Legend:
ISCRL: IRQ sense control register
IER: IRQ enable register
ISR: IRQ status register
IPR: Interrupt priority register
INTCR: Interrupt control register
ITSR: IRQ pin select register
SSIER: Software standby release IRQ enable register
SSIER
Figure 5.1 Block Diagram of Interrupt Controller
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5.2 Input/Output Pins
Table 5.1 summarizes the pins of the interrupt controller.
Table 5.1 Pin Configuration
Name I/O Function
NMI Input Nonmaskable external interrupt
Rising or falling edge can be selected.
IRQ7 to IRQ0
Input
Maskable external interrupts
Rising edge, falling edge, both edges, or level sensing, can be
selected.
5.3 Register Descriptions
The interrupt controller has the following registers.
• Interrupt control register (INTCR)
• IRQ sense control register L (ISCRL)
• IRQ enable register (IER)
• IRQ status register (ISR)
• IRQ pin select register (ITSR)
• Software standby release IRQ enable register (SSIER)
• Interrupt priority register A (IPRA)
• Interrupt priority register B (IPRB)
• Interrupt priority register C (IPRC)
• Interrupt priority register D (IPRD)
• Interrupt priority register E (IPRE)
• Interrupt priority register F (IPRF)
• Interrupt priority register G (IPRG)
• Interrupt priority register H (IPRH)
• Interrupt priority register I (IPRI)
• Interrupt priority register J (IPRJ)
• Interrupt priority register K (IPRK)
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5.3.1 Interrupt Control Register (INTCR)
INTCR selects the interrupt control mode, and the detected edge for NMI.
Bit Bit Name Initial Value R/W Description
7, 6 − All 0 −
Reserved
These bits are always read as 0 and cannot be
modified.
5
4
INTM1
INTM0
0
0
R/W
R/W
Interrupt Control Select Mode 1 and 0
These bits select either of two interrupt control
modes for the interrupt controller.
00: Interrupt control mode 0
Interrupts are controlled by I bit.
01: Setting prohibited.
10: Interrupt control mode 2
Interrupts are controlled by bits I2 to I0, and
IPR.
11: Setting prohibited.
3
NMIEG 0 R/W NMI Edge Select
Selects the input edge for the NMI pin.
0: Interrupt request generated at falling edge of
NMI input
1: Interrupt request generated at rising edge of
NMI input
2 to
0
−
0
−
Reserved
These bits are always read as 0 and cannot be
modified.
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5.3.2 Interrupt Priority Registers A to K (IPRA to IPRK)
IPR are eleven 16-bit readable/writable registers that set priorities (levels 7 to 0) for interrupts
other than NMI.
The correspondence between interrupt sources and IPR settings is shown in table 5.2. Setting a
value in the range from H'0 to H'7 in the 3-bit groups of bits 14 to 12, 10 to 8, 6 to 4, and 2 to 0
sets the priority of the corresponding interrupt. IPR should be read in word size.
Bit Bit Name Initial Value R/W Description
15 − 0 − Reserved
This bit is always read as 0 and cannot be
modified.
14
13
12
IPR14
IPR13
IPR12
1
1
1
R/W
R/W
R/W
Sets the priority of the corresponding interrupt
source.
000: Priority level 0 (Lowest)
001: Priority level 1
010: Priority level 2
011: Priority level 3
100: Priority level 4
101: Priority level 5
110: Priority level 6
111: Priority level 7 (Highest)
11
− 0 − Reserved
This bit is always read as 0 and cannot be
modified.
10
9
8
IPR10
IPR9
IPR8
1
1
1
R/W
R/W
R/W
Sets the priority of the corresponding interrupt
source.
000: Priority level 0 (Lowest)
001: Priority level 1
010: Priority level 2
011: Priority level 3
100: Priority level 4
101: Priority level 5
110: Priority level 6
111: Priority level 7 (Highest)
7 − 0 − Reserved
This bit is always read as 0 and cannot be
modified.
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Bit Bit Name Initial Value R/W Description
6
5
4
IPR6
IPR5
IPR4
1
1
1
R/W
R/W
R/W
Sets the priority of the corresponding interrupt
source.
000: Priority level 0 (Lowest)
001: Priority level 1
010: Priority level 2
011: Priority level 3
100: Priority level 4
101: Priority level 5
110: Priority level 6
111: Priority level 7 (Highest)
3
− 0 − Reserved
This bit is always read as 0 and cannot be
modified.
2
1
0
IPR2
IPR1
IPR0
1
1
1
R/W
R/W
R/W
Sets the priority of the corresponding interrupt
source.
000: Priority level 0 (Lowest)
001: Priority level 1
010: Priority level 2
011: Priority level 3
100: Priority level 4
101: Priority level 5
110: Priority level 6
111: Priority level 7 (Highest)
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5.3.3 IRQ Enable Register (IER)
IER controls enabling and disabling of interrupt requests IRQ7 to IRQ0.
Bit Bit Name Initial Value R/W Description
15 to
8
− All 0 R/W Reserved
The write value should always be 0.
7 IRQ7E 0 R/W IRQ7 Enable
The IRQ7 interrupt request is enabled when this
bit is 1.
6 IRQ6E 0 R/W IRQ6 Enable
The IRQ6 interrupt request is enabled when this
bit is 1.
5 IRQ5E 0 R/W IRQ5 Enable
The IRQ5 interrupt request is enabled when this
bit is 1.
4 IRQ4E 0 R/W IRQ4 Enable
The IRQ4 interrupt request is enabled when this
bit is 1.
3 IRQ3E 0 R/W IRQ3 Enable
The IRQ3 interrupt request is enabled when this
bit is 1.
2 IRQ2E 0 R/W IRQ2 Enable
The IRQ2 interrupt request is enabled when this
bit is 1.
1 IRQ1E 0 R/W IRQ1 Enable
The IRQ1 interrupt request is enabled when this
bit is 1.
0 IRQ0E 0 R/W IRQ0 Enable
The IRQ0 interrupt request is enabled when this
bit is 1.
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5.3.4 IRQ Sense Control Register L (ISCRL)
ISCRL select the source that generates an interrupt request at pins IRQ7 to IRQ0.
Bit Bit Name Initial Value R/W Description
15
14
IRQ7SCB
IRQ7SCA
0
0
R/W
R/W
IRQ7 Sense Control B
IRQ7 Sense Control A
00: Interrupt request generated at IRQ7 input
low level
01: Interrupt request generated at falling edge of
IRQ7 input
10: Interrupt request generated at rising edge of
IRQ7 input
11: Interrupt request generated at both falling
and rising edges of IRQ7 input
13
12
IRQ6SCB
IRQ6SCA
0
0
R/W
R/W
IRQ6 Sense Control B
IRQ6 Sense Control A
00: Interrupt request generated at IRQ6 input
low level
01: Interrupt request generated at falling edge of
IRQ6 input
10: Interrupt request generated at rising edge of
IRQ6 input
11: Interrupt request generated at both falling
and rising edges of IRQ6 input
11
10
IRQ5SCB
IRQ5SCA
0
0
R/W
R/W
IRQ5 Sense Control B
IRQ5 Sense Control A
00: Interrupt request generated at IRQ5 input
low level
01: Interrupt request generated at falling edge of
IRQ5 input
10: Interrupt request generated at rising edge of
IRQ5 input
11: Interrupt request generated at both falling
and rising edges of IRQ5 input
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Bit Bit Name Initial Value R/W Description
9
8
IRQ4SCB
IRQ4SCA
0
0
R/W
R/W
IRQ4 Sense Control B
IRQ4 Sense Control A
00: Interrupt request generated at IRQ4 input
low level
01: Interrupt request generated at falling edge of
IRQ4 input
10: Interrupt request generated at rising edge of
IRQ4 input
11: Interrupt request generated at both falling
and rising edges of IRQ4 input
7
6
IRQ3SCB
IRQ3SCA
0
0
R/W
R/W
IRQ3 Sense Control B
IRQ3 Sense Control A
00: Interrupt request generated at IRQ3 input
low level
01: Interrupt request generated at falling edge of
IRQ3 input
10: Interrupt request generated at rising edge of
IRQ3 input
11: Interrupt request generated at both falling
and rising edges of IRQ3 input
5
4
IRQ2SCB
IRQ2SCA
0
0
R/W
R/W
IRQ2 Sense Control B
IRQ2 Sense Control A
00: Interrupt request generated at IRQ2 input
low level
01: Interrupt request generated at falling edge of
IRQ2 input
10: Interrupt request generated at rising edge of
IRQ2 input
11: Interrupt request generated at both falling
and rising edges of IRQ2 input
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Bit Bit Name Initial Value R/W Description
3
2
IRQ1SCB
IRQ1SCA
0
0
R/W
R/W
IRQ1 Sense Control B
IRQ1 Sense Control A
00: Interrupt request generated at IRQ1 input
low level
01: Interrupt request generated at falling edge of
IRQ1 input
10: Interrupt request generated at rising edge of
IRQ1 input
11: Interrupt request generated at both falling
and rising edges of IRQ1 input
1
0
IRQ0SCB
IRQ0SCA
0
0
R/W
R/W
IRQ0 Sense Control B
IRQ0 Sense Control A
00: Interrupt request generated at IRQ0 input
low level
01: Interrupt request generated at falling edge of
IRQ0 input
10: Interrupt request generated at rising edge of
IRQ0 input
11: Interrupt request generated at both falling
and rising edges of IRQ0 input
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5.3.5 IRQ Status Register (ISR)
ISR is an IRQ7 to IRQ0 interrupt request flag register.
Bit
Bit
Name Initial Value R/W Description
15 to 8 − All 0 R/W Reserved
The write value should always be 0.
7
6
5
4
3
2
1
0
IRQ7F
IRQ6F
IRQ5F
IRQ4F
IRQ3F
IRQ2F
IRQ1F
IRQ0F
0
0
0
0
0
0
0
0
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
[Setting condition]
When the interrupt source selected by ISCR
occurs
[Clearing conditions]
• Cleared by reading IRQnF flag when
IRQnF = 1, then writing 0 to IRQnF flag
• When interrupt exception handling is
executed when low-level detection is set
and IRQn input is high
• When IRQn interrupt exception handling is
executed when falling, rising, or both-edge
detection is set
• When the DTC is activated by an IRQn
interrupt, and the DISEL bit in MRB of the
DTC is cleared to 0
Note: * Only 0 can be written, to clear the flag.
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5.3.6 IRQ Pin Select Register (ITSR)
ITSR selects input pins IRQ7 to IRQ0.
Bit Bit Name Initial Value R/W Description
15 to 8 − All 0 R/W Reserved
The write value should always be 0.
7 ITS7 0 R/W Selects IRQ7 input pin.
0: PA7
1: P47
6 ITS6 0 R/W Selects IRQ6 input pin.
0: PA6
1: P46
5 ITS5 0 R/W Selects IRQ5 input pin.
0: PA5
1: P45
4 ITS4 0 R/W Selects IRQ4 input pin.
0: PA4
1: P44
3 ITS3 0 R/W Selects IRQ3 input pin.
0: P53
1: P43
2 ITS2 0 R/W Selects IRQ2 input pin.
0: P52
1: P42
1 ITS1 0 R/W Selects IRQ1 input pin.
0: P51
1: P41
0 ITS0 0 R/W Selects IRQ0 input pin.
0: P50
1: P40
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5.3.7 Software Standby Release IRQ Enable Register (SSIER)
SSIER selects the IRQ pins used to recover from the software standby state.
Bit Bit Name Initial Value R/W Description
15 to 8 — All 0 R/W Reserved
The write value should always be 0.
7
6
5
4
3
2
1
0
SSI7
SSI6
SSI5
SSI4
SSI3
SSI2
SSI1
SSI0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Software Standby Release IRQ Setting
These bits select the IRQn pins used to
recover from the software standby state.
0: IRQn requests are not sampled in the
software standby state (Initial value when n
= 7 to 3)
1: When an IRQn request occurs in the
software standby state, the chip recovers
from the software standby state after the
elapse of the oscillation settling time (Initial
value when n = 2 to 0)
5.4 Interrupt Sources
5.4.1 External Interrupts
There are nine external interrupts: NMI and IRQ7 to IRQ0. These interrupts can be used to restore
the chip from software standby mode.
NMI Interrupt: Nonmaskable interrupt request (NMI) is the highest-priority interrupt, and is
always accepted by the CPU regardless of the interrupt control mode or the status of the CPU
interrupt mask bits. The NMIEG bit in INTCR can be used to select whether an interrupt is
requested at a rising edge or a falling edge on the NMI pin.
IRQ7 to IRQ0 Interrupts: Interrupts IRQ7 to IRQ0 are requested by an input signal at pins IRQ7
to IRQ0. Interrupts IRQ7 to IRQ0 have the following features:
• Using ISCRL, it is possible to select whether an interrupt is generated by a low level, falling
edge, rising edge, or both edges, at pins IRQ7 to IRQ0.
• Enabling or disabling of interrupt requests IRQ7 to IRQ0 can be selected with IER.
• The interrupt priority level can be set with IPR.
• The status of interrupt requests IRQ7 to IRQ0 is indicated in ISR. ISR flags can be cleared to 0
by software.
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When IRQ7 to IRQ0 interrupt requests occur at low level of IRQn, the corresponding IRQ should
be held low until an interrupt handling starts. Then the corresponding IRQ should be set to high in
the interrupt handling routine and clear the IRQnF bit (n = 0 to 7) in ISR to 0. Interrupts may not
be executed when the corresponding IRQ is set to high before the interrupt handling starts.
Detection of IRQ7 to IRQ0 interrupts does not depend on whether the relevant pin has been set for
input or output. However, when a pin is used as an external interrupt input pin, do not clear the
corresponding DDR to 0 and use the pin as an I/O pin for another function.
A block diagram of interrupts IRQ7 to IRQ0 is shown in figure 5.2.
IRQn interrupt
request
IRQnE
IRQnF
S
R
Q
Clear signal
Edge/
level detection
circuit
IRQnSCB, IRQnSCA
input
Note: n = 7 to 0
Figure 5.2 Block Diagram of Interrupts IRQ15 to IRQ0
5.4.2 Internal Interrupts
The sources for internal interrupts from on-chip peripheral modules have the following features:
• For each on-chip peripheral module there are flags that indicate the interrupt request status,
and enable bits that select enabling or disabling of these interrupts. They can be controlled
independently. When the enable bit is set to 1, an interrupt request is issued to the interrupt
controller.
• The interrupt priority level can be set by means of IPR.
• The DMAC and DTC can be activated by a TPU, SCI, or other interrupt request.
• When the DMAC or DTC is activated by an interrupt request, it is not affected by the interrupt
control mode or CPU interrupt mask bit.
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5.5 Interrupt Exception Handling Vector Table
Table 5.2 shows interrupt exception handling sources, vector addresses, and interrupt priorities.
For default priorities, the lower the vector number, the higher the priority. When interrupt control
mode 2 is set, priorities among modules can be set by means of the IPR. Modules set at the same
priority will conform to their default priorities. Priorities within a module are fixed.
Table 5.2 Interrupt Sources, Vector Addresses, and Interrupt Priorities
Vector
Address*
Interrupt
Source
Origin of
Interrupt
Source
Vector
Number
Advanced
Mode
IPR
Priority
DTC
Activation
DMAC
Activation
External NMI 7 H'001C — High — —
pin IRQ0 16 H'0040 IPRA14 to IPRA12 O —
IRQ1 17 H'0044 IPRA10 to IPRA8 O —
IRQ2 18 H'0048 IPRA6 to IPRA4 O —
IRQ3 19 H'004C IPRA2 to IPRA0 O —
IRQ4 20 H'0050 IPRB14 to IPRB12 O —
IRQ5 21 H'0054 IPRB10 to IPRB8 O —
IRQ6 22 H'0058 IPRB6 to IPRB4 O —
IRQ7 23 H'005C IPRB2 to IPRB0 O —
— Reserved for
system use
24 H'0060 IPRC14 to IPRC12 — —
25 H'0064 IPRC10 to IPRC8 — —
26 H'0068 IPRC6 to IPRC4 — —
27 H'006C IPRC2 to IPRC0 — —
28 H'0070 IPRD14 to IPRD12 — —
29 H'0074 IPRD10 to IPRD8 — —
30 H'0078 IPRD6 to IPRD4 — —
31 H'007C IPRD2 to IPRD0 — —
DTC SWDTEND 32 H'0080 IPRE14 to IPRE12 O —
WDT WOVI 33 H'0084 IPRE10 to IPRE8 — —
— Reserved for
system use
34 H'0088 IPRE6 to IPRE4 Low — —
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Vector
Address*
Interrupt
Source
Origin of
Interrupt
Source
Vector
Number
Advanced
Mode
IPR
Priority
DTC
Activation
DMAC
Activation
Refresh
controller
CMI 35 H'008C IPRE2 to IPRE0 High — —
36 H'0090 — — — Reserved for
system use 37 H'0094
IPRF14 to IPRF12
— —
A/D ADI 38 H'0098 IPRF10 to IPRF8 O O
— Reserved for
system use
39 H'009C
— —
TPU_0 TGI0A 40 H'00A0 IPRF6 to IPRF4 O O
TGI0B 41 H'00A4
O —
TGI0C 42 H'00A8
O —
TGI0D 43 H'00AC
IPRF6 to IPRF4 O —
TCI0V 44 H'00B0
— —
45 H'00B4 — —
46 H'00B8 — —
— Reserved for
system use
47 H'00BC
— —
TPU_1 TGI1A 48 H'00C0 IPRF2 to IPRF0 O O
TGI1B 49 H'00C4
O
—
TCI1V 50 H'00C8
— —
TCI1U 51 H'00CC
— —
TPU_2 TGI2A 52 H'00D0 IPRG14 to IPRG12 O O
TGI2B 53 H'00D4
O
—
TCI2V 54 H'00D8
— —
TCI2U 55 H'00DC
— —
TPU_3 TGI3A 56 H'00E0 IPRG10 to IPRG8 O O
TGI3B 57 H'00E4
O —
TGI3C 58 H'00E8
O —
TGI3D 59 H'00EC
O —
TCI3V 60 H'00F0
— —
61 H'00F4 — —
62 H'00F8 — —
— Reserved for
system use
63 H'00FC
Low — —
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Vector
Address*
Interrupt
Source
Origin of
Interrupt
Source
Vector
Number
Advanced
Mode
IPR
Priority
DTC
Activation
DMAC
Activation
TPU_4 TGI4A 64 H'0100 IPRG6 to IPRG4 High O O
TGI4B 65 H'0104
O —
TCI4V 66 H'0108
— —
TCI4U 67 H'010C
— —
TPU_5 TGI5A 68 H'0110 IPRG2 to IPRG0 O O
TGI5B 69 H'0114
O —
TCI5V 70 H'0118
— —
TCI5U 71 H'011C
— —
TMR_0 CMIA0 72 H'0120 IPRH14 to IPRH12 O —
CMIB0 73 H'0124
O —
OVI0 74 H'0128
— —
— Reserved for
system use
75 H'012C
IPRH14 to IPRH12 — —
TMR_1 CMIA1 76 H'0130 IPRH10 to IPRH8 O —
CMIB1 77 H'0134
O —
OVI1 78 H'0138
— —
— Reserved for
system use
79 H'013C
— —
DMAC DMTEND0A 80 H'0140 IPRH6 to IPRH4 O —
DMTEND0B 81 H'0144 O —
DMTEND1A 82 H'0148
O —
DMTEND1B 83 H'014C O —
84 H'0150 IPRH0 to IPRH0 — —
Reserved for
system use 85 H'0154 IPRI14 to IPRI12 — —
86 H'0158 IPRI10 to IPRI8 — —
87 H'015C IPRI6 to IPRI4 — —
SCI_0 ERI0 88 H'0160 IPRI2 to IPRI0 — —
RXI0 89 H'0164
O O
TXI0 90 H'0168
O O
TEI0 91 H'016C
Low — —
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Vector
Address*
Interrupt
Source
Origin of
Interrupt
Source
Vector
Number
Advanced
Mode
IPR
Priority
DTC
Activation
DMAC
Activation
SCI_1 ERI1 92 H'0170 IPRJ14 to IPRJ12 High
— —
RXI1 93 H'0174
O O
TXI1 94 H'0178
O O
TEI1 95 H'017C — —
SCI_2 ERI2 96 H'0180 IPRJ10 to IPRJ8 — —
RXI2 97 H'0184
O —
TXI2 98 H'0188
O —
TEI2 99 H'018C — —
SCI_3 ERI3 100 H'0190 IPRJ6 to IPRJ4 — —
RXI3 101 H'0194
— —
TXI3 102 H'0198
— —
TEI3 103 H'019C
— —
SCI_4 ERI4 104 H'01A0 IPRJ2 to IPRJ0 — —
RXI4 105 H'01A4
O —
TXI4 106 H'01A8
O —
TEI4 107 H'01AC
— —
— 108 H'01B0 IPRK14 to IPRK12 — —
109 H'01B4
— —
110 H'01B8
— —
Reserved for
system use
111 H'01BC
— —
— 112 H'01C0 IPRK10 to IPRK8 — —
113 H'01C4
— —
114 H'01C8
— —
Reserved for
system use
115 H'01CC
— —
IIC2 IICI0 116 H'01D0 IPRK6 to IPRK4 — —
Reserved for
system use
117 H'01D4
— —
IICI1 118 H'01D8
— —
Reserved for
system use
119 H'01DC
Low — —
Section 5 Interrupt Controller
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Vector
Address*
Interrupt
Source
Origin of
Interrupt
Source
Vector
Number
Advanced
Mode
IPR
Priority
DTC
Activation
DMAC
Activation
— 120 H'01E0 IPRK2 to IPRK0 High — —
121 H'01E4
— —
122 H'01E8
— —
Reserved for
system use
123 H'01EC
— —
124 H'01F0
— —
125 H'01F4
— —
126 H'01F8
— —
127 H'01EC
Low — —
Note: * Lower 16 bits of the start address.
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5.6 Interrupt Control Modes and Interrupt Operation
The interrupt controller has two modes: interrupt control mode 0 and interrupt control mode 2.
Interrupt operations differ depending on the interrupt control mode. The interrupt control mode is
selected by INTCR. Table 5.3 shows the differences between interrupt control mode 0 and
interrupt control mode 2.
Table 5.3 Interrupt Control Modes
Interrupt Priority Setting Interrupt
Control Mode Registers Mask Bits Description
0 Default I The priorities of interrupt sources are fixed at the
default settings.
Interrupt sources except for NMI is masked by
the I bit.
2 IPR I2 to I0 8 priority levels except for NMI can be set with
IPR.
8-level interrupt mask control is performed by
bits I2 to I0.
5.6.1 Interrupt Control Mode 0
In interrupt control mode 0, interrupt requests except for NMI is masked by the I bit of CCR in the
CPU. Figure 5.3 shows a flowchart of the interrupt acceptance operation in this case.
1. If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an
interrupt request is sent to the interrupt controller.
2. If the I bit is set to 1, only an NMI interrupt is accepted, and other interrupt requests are held
pending. If the I bit is cleared, an interrupt request is accepted.
3. Interrupt requests are sent to the interrupt controller, the highest-ranked interrupt according to
the priority system is accepted, and other interrupt requests are held pending.
4. When the CPU accepts an interrupt request, it starts interrupt exception handling after
execution of the current instruction has been completed.
5. The PC and CCR are saved to the stack area by interrupt exception handling. The PC saved on
the stack shows the address of the first instruction to be executed after returning from the
interrupt handling routine.
6. Next, the I bit in CCR is set to 1. This masks all interrupts except NMI.
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7. The CPU generates a vector address for the accepted interrupt and starts execution of the
interrupt handling routine at the address indicated by the contents of the vector address in the
vector table.
Program execution status
Interrupt generated?
NMI
IRQ0
IRQ1
IICI1
I = 0
Save PC and CCR
I ← 1
Read vector address
Branch to interrupt handling routine
Yes
No
Yes
Yes
Yes No
No
No
Yes
Yes
No
Hold
pending
Figure 5.3 Flowchart of Procedure Up to Interrupt Acceptance
in Interrupt Control Mode 0
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5.6.2 Interrupt Control Mode 2
In interrupt control mode 2, mask control is done in eight levels for interrupt requests except for
NMI by comparing the EXR interrupt mask level (I2 to I0 bits) in the CPU and the IPR setting.
Figure 5.4 shows a flowchart of the interrupt acceptance operation in this case.
1. If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an
interrupt request is sent to the interrupt controller.
2. When interrupt requests are sent to the interrupt controller, the interrupt with the highest
priority according to the interrupt priority levels set in IPR is selected, and lower-priority
interrupt requests are held pending. If a number of interrupt requests with the same priority are
generated at the same time, the interrupt request with the highest priority according to the
priority system shown in table 5.2 is selected.
3. Next, the priority of the selected interrupt request is compared with the interrupt mask level set
in EXR. An interrupt request with a priority no higher than the mask level set at that time is
held pending, and only an interrupt request with a priority higher than the interrupt mask level
is accepted.
4. When the CPU accepts an interrupt request, it starts interrupt exception handling after
execution of the current instruction has been completed.
5. The PC, CCR, and EXR are saved to the stack area by interrupt exception handling. The PC
saved on the stack shows the address of the first instruction to be executed after returning from
the interrupt handling routine.
6. The T bit in EXR is cleared to 0. The interrupt mask level is rewritten with the priority level of
the accepted interrupt.
If the accepted interrupt is NMI, the interrupt mask level is set to H'7.
7. The CPU generates a vector address for the accepted interrupt and starts execution of the
interrupt handling routine at the address indicated by the contents of the vector address in the
vector table.
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Yes
Program execution status
Interrupt generated?
NMI
Level 6 interrupt?
Mask level 5
or below?
Level 7 interrupt?
Mask level 6
or below?
Save PC, CCR, and EXR
Clear T bit to 0
Update mask level
Read vector address
Branch to interrupt handling routine
Hold
pending
Level 1 interrupt?
Mask level 0?
Yes
Yes
No Yes
Yes
Yes
No
Yes
Yes
No
No
No
No
No
No
Figure 5.4 Flowchart of Procedure Up to Interrupt Acceptance
in Interrupt Control Mode 2
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5.6.3 Interrupt Exception Handling Sequence
Figure 5.5 shows the interrupt exception handling sequence. The example shown is for the case
where interrupt control mode 0 is set in advanced mode, and the program area and stack area are
in on-chip memory.
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(14)(12)(10)(6)(4)(2)
(1) (5) (7) (9) (11) (13)
Interrupt handling
routine instruction
prefetch
Internal
operation
Vector fetch
stack
Instruction
prefetch Internal
operation
Interrupt
acceptance
Interrupt level determination
Wait for end of instruction
Interrupt
request signal
Internal
address bus
Internal
read signal
Internal
write signal
Internal
data bus
φ
(3)
(1)
(2) (4)
(3)
(5)
(7)
Instruction prefetch address (Not executed.
This is the contents of the saved PC, the return address)
Instruction code (Not executed)
Instruction prefetch address (Not executed)
SP-2
SP-4
Saved PC and saved CCR
Vector address
Interrupt handling routine start address (Vector address contents)
Interrupt handling routine start address ((13) = (10)(12))
First instruction of interrupt handling routine
(6) (8)
(9) (11)
(10) (12)
(13)
(14)
(8)
Figure 5.5 Interrupt Exception Handling
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5.6.4 Interrupt Response Times
Table 5.4 shows interrupt response times - the interval between generation of an interrupt request
and execution of the first instruction in the interrupt handling routine. The execution status
symbols used in table 5.4 are explained in table 5.5.
This LSI is capable of fast word transfer to on-chip memory, and have the program area in on-chip
ROM and the stack area in on-chip RAM, enabling high-speed processing.
Table 5.4 Interrupt Response Times
Normal Mode*5 Advanced Mode
No.
Execution Status
Interrupt
control
mode 0
Interrupt
control
mode 2
Interrupt
control
mode 0
Interrupt
control
mode 2
1 Interrupt priority determination*1 3 3 3 3
2 Number of wait states until executing
instruction ends*2
1 to 19 +2·SI1 to 19+2·SI 1 to 19+2·SI 1 to 19+2·SI
3 PC, CCR, EXR stack save 2·SK 3·SK 2·SK 3·SK
4 Vector fetch SI S
I 2·SI 2·SI
5 Instruction fetch*3 2·SI 2·SI 2·SI 2·SI
6 Internal processing*4 2 2 2 2
Total (using on-chip memory) 11 to 31 12 to 32 12 to 32 13 to 33
Notes: 1. Two states in case of internal interrupt.
2. Refers to MULXS and DIVXS instructions.
3. Prefetch after interrupt acceptance and interrupt handling routine prefetch.
4. Internal processing after interrupt acceptance and internal processing after vector fetch.
5. Not available in this LSI.
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Table 5.5 Number of States in Interrupt Handling Routine Execution Statuses
Object of Access
External Device
8-Bit Bus 16-Bit Bus
Symbol
Internal
Memory
2-State
Access
3-State
Access
2-State
Access
3-State
Access
Instruction fetch SI 1 4 6 + 2 m 2 3 + m
Branch address read SJ
Stack manipulation SK
Legend:
m: Number of wait states in an external device access.
5.6.5 DTC and DMAC Activation by Interrupt
The DTC and DMAC can be activated by an interrupt. In this case, the following options are
available:
• Interrupt request to CPU
• Activation request to DTC
• Activation request to DMAC
• Selection of a number of the above
For details of interrupt requests that can be used to activate the DTC and DMAC, see table 5.2 and
section 8, Data Transfer Controller (DTC) and section 7, DMA Controller (DMAC).
Section 5 Interrupt Controller
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5.7 Usage Notes
5.7.1 Contention between Interrupt Generation and Disabling
When an interrupt enable bit is cleared to 0 to mask interrupts, the masking becomes effective
after execution of the instruction.
When an interrupt enable bit is cleared to 0 by an instruction such as BCLR or MOV, if an
interrupt is generated during execution of the instruction, the interrupt concerned will still be
enabled on completion of the instruction, and so interrupt exception handling for that interrupt will
be executed on completion of the instruction. However, if there is an interrupt request of higher
priority than that interrupt, interrupt exception handling will be executed for the higher-priority
interrupt, and the lower-priority interrupt will be ignored. The same also applies when an interrupt
source flag is cleared to 0. Figure 5.6 shows an example in which the TCIEV bit in the TPU’s
TIER_0 register is cleared to 0. The above contention will not occur if an enable bit or interrupt
source flag is cleared to 0 while the interrupt is masked.
Internal
address bus
Internal
write signal
φ
TCIEV
TCFV
TCIV
interrupt signal
TIER_0 write cycle by CPU TCIV exception handling
TIER_0 address
Figure 5.6 Contention between Interrupt Generation and Disabling
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5.7.2 Instructions that Disable Interrupts
Instructions that disable interrupts are LDC, ANDC, ORC, and XORC. After any of these
instructions is executed, all interrupts including NMI are disabled and the next instruction is
always executed. When the I bit is set by one of these instructions, the new value becomes valid
two states after execution of the instruction ends.
5.7.3 Times when Interrupts Are Disabled
There are times when interrupt acceptance is disabled by the interrupt controller.
The interrupt controller disables interrupt acceptance for a 3-state period after the CPU has
updated the mask level with an LDC, ANDC, ORC, or XORC instruction.
5.7.4 Interrupts during Execution of EEPMOV Instruction
Interrupt operation differs between the EEPMOV.B instruction and the EEPMOV.W instruction.
With the EEPMOV.B instruction, an interrupt request (including NMI) issued during the transfer
is not accepted until the transfer is completed.
With the EEPMOV.W instruction, if an interrupt request is issued during the transfer, interrupt
exception handling starts at a break in the transfer cycle. The PC value saved on the stack in this
case is the address of the next instruction. Therefore, if an interrupt is generated during execution
of an EEPMOV.W instruction, the following coding should be used.
L1: EEPMOV.W
MOV.W R4,R4
BNE L1
5.7.5 Change of IRQ Pin Select Register (ITSR) Setting
When the ITSR setting is changed, an edge occurs internally and the IRQnF bit (n = 0 to 7) of ISR
may be set to 1 at the unintended timing if the selected pin level before the change is different
from the selected pin level after the change. If the IRQn interrupt request (n = 0 to 7) is enabled,
the interrupt exception handling is executed. To prevent the unintended interrupt, ITSR setting
should be changed while the IRQn interrupt request is disabled, then the IRQnF bit should be
cleared to 0.
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5.7.6 Note on IRQ Status Register (ISR)
Since IRQnF flags may be set to 1 depending on the pin states after a reset, be sure to read from
ISR after a reset and then write 0 to clear the IRQnF flags.
Section 6 Bus Controller (BSC)
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Section 6 Bus Controller (BSC)
This LSI has an on-chip bus controller (BSC) that manages the external space divided into eight
areas.
The bus controller also has a bus arbitration function, and controls the operation of the bus
masters—the CPU, DMA controller (DMAC) and data transfer controller (DTC).
6.1 Features
• Manages external space in area units
Manages the external space divided into eight areas of 2 Mbytes
Bus specifications can be set independently for each area
Burst ROM, or DRAM, interface can be set
• Basic bus interface
Chip select signals (CS0 to CS7) can be output for areas 0 to 7
8-bit access or 16-bit access can be selected for each area
2-state access or 3-state access can be selected for each area
Program wait states can be inserted for each area
• Burst ROM interface
Burst ROM interface can be set independently for areas 0 and 1
• DRAM interface
DRAM interface can be set for areas 2 to 5
• Bus arbitration function
Includes a bus arbiter that arbitrates bus right between the CPU, DMAC, and DTC
BSCS201A_000020020100
Section 6 Bus Controller (BSC)
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A block diagram of the bus controller is shown in figure 6.1.
Area decoder
Internal address bus CS7 to CS0
WAIT
BREQ
BACK
BREQO
External bus
control signals
Internal bus control signals
Internal data bus
Control registers
External bus
arbiter
External bus controller
Internal bus
arbiter
Internal bus controller
Internal bus master bus request signal
Internal bus master bus acknowledge signal
CPU bus request signal
DTC bus request signal
DMAC bus request signal
CPU bus acknowledge signal
DTC bus acknowledge signal
DMAC bus acknowledge signal
ABWCR ASTCR
WTCRAH WTCRAL
WTCRBH WTCRBL
RDNCR
DRAMCR
Legend:
ABWCR: Bus width control register
ASTCR: Access state control register
WTCRAH, WTCRAL,
WTCRBH, and WTCRBL: Wait control registers AH, AL, BH, and BL
RDNCR: Read strobe timing control register
CSACRH and CSACRL: CS assertion period control registers H and L
BROMCRH: Area 0 burst ROM interface control register
BROMCRL: Area 1 burst ROM interface control register
BCR: Bus control register
DRAMCR: DRAM control register
DRACCR: DRAM access control register
REFCR: Refresh control register
RTCNT: Refresh timer counter
RTCOR: Refresh time constant register
REFCR
RTCNT RTCOR
CSACRH CSACRL
BROMCRH BROMCRL
BCR
DRACCR
Figure 6.1 Block Diagram of Bus Controller
Section 6 Bus Controller (BSC)
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6.2 Input/Output Pins
Table 6.1 summarizes the pin configuration of the bus controller.
Table 6.1 Pin Configuration
Name Symbol I/O Function
Address strobe AS Output Strobe signal indicating that normal space
is accessed and address output on
address bus is enabled.
Read RD Output Strobe signal indicating that normal space
is being read.
High write HWR Output Strobe signal indicating that normal space
is written to, and upper half (D15 to D8) of
data bus is enabled or DRAM space write
enable signal.
Low write LWR Output Strobe signal indicating that normal space
is written to, and lower half (D7 to D0) of
data bus is enabled.
Chip select 0 CS0 Output Strobe signal indicating that area 0 is
selected.
Chip select 1 CS1 Output Strobe signal indicating that area 1 is
selected
Chip select 2/row address
strobe 2
CS2/
RAS2
Output Strobe signal indicating that area 2 is
selected, DRAM row address strobe signal
when area 2 is DRAM space or areas 2 to
5 are set as continuous DRAM space.
Chip select 3/row address
strobe 3
CS3/
RAS3
Output Strobe signal indicating that area 3 is
selected, DRAM row address strobe signal
when area 3 is DRAM space.
Chip select 4 CS4 Output Strobe signal indicating that area 4 is
selected.
Chip select 5 CS5 Output Strobe signal indicating that area 5 is
selected.
Chip select 6 CS6 Output Strobe signal indicating that area 6 is
selected.
Chip select 7 CS7 Output Strobe signal indicating that area 7 is
selected.
Upper column address strobe UCAS Output 16-bit DRAM space upper column address
strobe signal, 8-bit DRAM space column
address strobe signal.
Section 6 Bus Controller (BSC)
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Name Symbol I/O Function
Lower column address strobe LCAS Output 16-bit DRAM space lower column address
strobe signal.
Output enable OE Output Output enable signal for the DRAM space.
Wait WAIT Input Wait request signal when accessing
external address space.
Bus request BREQ Input Request signal for release of bus to
external bus master.
Bus request acknowledge BACK Output Acknowledge signal indicating that bus has
been released to external bus master.
Bus request output BREQO Output External bus request signal used when
internal bus master accesses external
address space when external bus is
released.
Data transfer acknowledge
1 (DMAC)
DACK1 Output Data transfer acknowledge signal for single
address transfer by DMAC channel 1.
Data transfer acknowledge
0 (DMAC)
DACK0 Output Data transfer acknowledge signal for single
address transfer by DMAC channel 0.
6.3 Register Descriptions
The bus controller has the following registers.
• Bus width control register (ABWCR)
• Access state control register (ASTCR)
• Wait control register AH (WTCRAH)
• Wait control register AL (WTCRAL)
• Wait control register BH (WTCRBH)
• Wait control register BL (WTCRBL)
• Read strobe timing control register (RDNCR)
• CS assertion period control register H (CSACRH)
• CS assertion period control register L (CSACRL)
• Area 0 burst ROM interface control register (BROMCRH)
• Area 1 burst ROM interface control register (BROMCRL)
• Bus control register (BCR)
• DRAM control register (DRAMCR)
• DRAM access control register (DRACCR)
Section 6 Bus Controller (BSC)
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• Refresh control register (REFCR)
• Refresh timer counter (RTCNT)
• Refresh time constant register (RTCOR)
6.3.1 Bus Width Control Register (ABWCR)
ABWCR designates each area in the external address space as either 8-bit access space or 16-bit
access space.
Bit Bit Name Initial Value* R/W Description
7
6
5
4
3
2
1
0
ABW7
ABW6
ABW5
ABW4
ABW3
ABW2
ABW1
ABW0
1/0
1/0
1/0
1/0
1/0
1/0
1/0
1/0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Area 7 to 0 Bus Width Control
These bits select whether the corresponding
area is to be designated as 8-bit access space
or 16-bit access space.
0: Area n is designated as 16-bit access space
1: Area n is designated as 8-bit access space
(n = 7 to 0)
Note: * In modes 2 and 4, ABWCR is initialized to 1. In modes 1 and 7, ABWCR is initialized to
0.
6.3.2 Access State Control Register (ASTCR)
ASTCR designates each area in the external address space as either 2-state access space or 3-state
access space.
Bit Bit Name Initial Value R/W Description
7
6
5
4
3
2
1
0
AST7
AST6
AST5
AST4
AST3
AST2
AST1
AST0
1
1
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Area 7 to 0 Access State Control
These bits select whether the corresponding
area is to be designated as 2-state access
space or 3-state access space. Wait state
insertion is enabled or disabled at the same
time.
0: Area n is designated as 2-state access space
Wait state insertion in area n access is
disabled
1: Area n is designated as 3-state access space
Wait state insertion in area n access is
enabled
(n = 7 to 0)
Section 6 Bus Controller (BSC)
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6.3.3 Wait Control Registers AH, AL, BH, and BL (WTCRAH, WTCRAL, WTCRBH,
and WTCRBL)
WTCRA and WTCRB select the number of program wait states for each area in the external
address space.
• WTCRAH
Bit Bit Name Initial Value R/W Description
15 − 0 R Reserved
This bit is always read as 0 and cannot be
modified.
14
13
12
W72
W71
W70
1
1
1
R/W
R/W
R/W
Area 7 Wait Control 2 to 0
These bits select the number of program wait
states when accessing area 7 while AST7 bit in
ASTCR = 1.
000: Program wait not inserted
001: 1 program wait state inserted
010: 2 program wait states inserted
011: 3 program wait states inserted
100: 4 program wait states inserted
101: 5 program wait states inserted
110: 6 program wait states inserted
111: 7 program wait states inserted
11
− 0 R Reserved
This bit is always read as 0 and cannot be
modified.
Section 6 Bus Controller (BSC)
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Bit Bit Name Initial Value R/W Description
10
9
8
W62
W61
W60
1
1
1
R/W
R/W
R/W
Area 6 Wait Control 2 to 0
These bits select the number of program wait
states when accessing area 6 while AST6 bit in
ASTCR = 1.
000: Program wait not inserted
001: 1 program wait state inserted
010: 2 program wait states inserted
011: 3 program wait states inserted
100: 4 program wait states inserted
101: 5 program wait states inserted
110: 6 program wait states inserted
111: 7 program wait states inserted
• WTARAL
Bit Bit Name Initial Value R/W Description
7 − 0 R Reserved
This bit is always read as 0 and cannot be
modified.
6
5
4
W52
W51
W50
1
1
1
R/W
R/W
R/W
Area 5 Wait Control 2 to 0
These bits select the number of program wait
states when accessing area 5 while AST5 bit in
ASTCR = 1.
000: Program wait not inserted
001: 1 program wait state inserted
010: 2 program wait states inserted
011: 3 program wait states inserted
100: 4 program wait states inserted
101: 5 program wait states inserted
110: 6 program wait states inserted
111: 7 program wait states inserted
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Bit Bit Name Initial Value R/W Description
3
− 0 R Reserved
This bit is always read as 0 and cannot be
modified.
2
1
0
W42
W41
W40
1
1
1
R/W
R/W
R/W
Area 4 Wait Control 2 to 0
These bits select the number of program wait
states when accessing area 4 while AST4 bit in
ASTCR = 1.
000: Program wait not inserted
001: 1 program wait state inserted
010: 2 program wait states inserted
011: 3 program wait states inserted
100: 4 program wait states inserted
101: 5 program wait states inserted
110: 6 program wait states inserted
111: 7 program wait states inserted
Section 6 Bus Controller (BSC)
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• WTCRBH
Bit Bit Name Initial Value R/W Description
15 − 0 R Reserved
This bit is always read as 0 and cannot be
modified.
14
13
12
W32
W31
W30
1
1
1
R/W
R/W
R/W
Area 3 Wait Control 2 to 0
These bits select the number of program wait
states when accessing area 3 while AST3 bit in
ASTCR = 1.
000: Program wait not inserted
001: 1 program wait state inserted
010: 2 program wait states inserted
011: 3 program wait states inserted
100: 4 program wait states inserted
101: 5 program wait states inserted
110: 6 program wait states inserted
111: 7 program wait states inserted
11
− 0 R Reserved
This bit is always read as 0 and cannot be
modified.
10
9
8
W22
W21
W20
1
1
1
R/W
R/W
R/W
Area 2 Wait Control 2 to 0
These bits select the number of program wait
states when accessing area 2 while AST2 bit in
ASTCR = 1.
000: Program wait not inserted
001: 1 program wait state inserted
010: 2 program wait states inserted
011: 3 program wait states inserted
100: 4 program wait states inserted
101: 5 program wait states inserted
110: 6 program wait states inserted
111: 7 program wait states inserted
Section 6 Bus Controller (BSC)
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• WTCRBL
Bit Bit Name Initial Value R/W Description
7 − 0 R Reserved
This bit is always read as 0 and cannot be
modified.
6
5
4
W12
W11
W10
1
1
1
R/W
R/W
R/W
Area 1 Wait Control 2 to 0
These bits select the number of program wait
states when accessing area 1 while AST1 bit in
ASTCR = 1.
000: Program wait not inserted
001: 1 program wait state inserted
010: 2 program wait states inserted
011: 3 program wait states inserted
100: 4 program wait states inserted
101: 5 program wait states inserted
110: 6 program wait states inserted
111: 7 program wait states inserted
3
− 0 R Reserved
This bit is always read as 0 and cannot be
modified.
2
1
0
W02
W01
W00
1
1
1
R/W
R/W
R/W
Area 0 Wait Control 2 to 0
These bits select the number of program wait
states when accessing area 0 while AST0 bit in
ASTCR = 1.
000: Program wait not inserted
001: 1 program wait state inserted
010: 2 program wait states inserted
011: 3 program wait states inserted
100: 4 program wait states inserted
101: 5 program wait states inserted
110: 6 program wait states inserted
111: 7 program wait states inserted
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6.3.4 Read Strobe Timing Control Register (RDNCR)
RDNCR selects the read strobe signal (RD) negation timing in a basic bus interface read access.
Bit Bit Name Initial Value R/W Description
7
6
5
4
3
2
1
0
RDN7
RDN6
RDN5
RDN4
RDN3
RDN2
RDN1
RDN0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Read Strobe Timing Control 7 to 0
These bits set the negation timing of the read
strobe in a corresponding area read access.
As shown in figure 6.2, the read strobe for an
area for which the RDNn bit is set to 1 is
negated one half-state earlier than that for an
area for which the RDNn bit is cleared to 0. The
read data setup and hold time specifications are
also one half-state earlier.
0: In an area n read access, the RD is negated
at the end of the read cycle
1: In an area n read access, the RD is negated
one half-state before the end of the read cycle
(n = 7 to 0)
Bus cycle
T
1
T
2
RD
Data
φ
RD
Data
RDNn = 0
RDNn = 1
T
3
Figure 6.2 Read Strobe Negation Timing (Example of 3-State Access Space)
Section 6 Bus Controller (BSC)
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6.3.5 CS Assertion Period Control Registers H, L (CSACRH, CSACRL)
CSACRH and CSACRL select whether or not the assertion period of the basic bus interface chip
select signals (CSn) and address signals is to be extended. Extending the assertion period of the
CSn and address signals allows flexible interfacing to external I/O devices.
• CSACRH
Bit Bit Name Initial Value R/W Description
7
6
5
4
3
2
1
0
CSXH7
CSXH6
CSXH5
CSXH4
CSXH3
CSXH2
CSXH1
CSXH0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CS and Address Signal Assertion Period Control
1
These bits specify whether or not the Th cycle is
to be inserted (see figure 6.3). When an area for
which the CSXHn bit is set to 1 is accessed, a
one-state Th cycle, in which only the CSn and
address signals are asserted, is inserted before
the normal access cycle.
0: In area n basic bus interface access, the CSn
and address assertion period (Th) is not
extended
1: In area n basic bus interface access, the CSn
and address assertion period (Th) is extended
(n = 7 to 0)
• CSACRL
Bit Bit Name Initial Value R/W Description
7
6
5
4
3
2
1
0
CSXT7
CSXT6
CSXT5
CSXT4
CSXT3
CSXT2
CSXT1
CSXT0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CS and Address Signal Assertion Period Control
2
These bits specify whether or not the Tt cycle
shown in figure 6.3 is to be inserted. When an
area for which the CSXTn bit is set to 1 is
accessed, a one-state Tt cycle, in which only the
CSn and address signals are asserted, is
inserted after the normal access cycle.
0: In area n basic bus interface access, the CSn
and address assertion period (Tt) is not
extended
1: In area n basic bus interface access, the CSn
and address assertion period (Tt) is extended
(n = 7 to 0)
Section 6 Bus Controller (BSC)
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T
h
Address
φ
T
1
T
2
T
3
T
t
Bus cycle
Data
HWR, LWR
Write
Data
RD
CS
Read
Figure 6.3 CS and Address Assertion Period Extension (Example of 3-State Access Space
and RDNn = 0)
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6.3.6 Area 0 Burst ROM Interface Control Register (BROMCRH)
Area 1 Burst ROM Interface Control Register (BROMCRL)
BROMCRH and BROMCRL are used to make burst ROM interface settings. Area 0 and area 1
burst ROM interface settings can be made independently in BROMCRH and BROMCRL,
respectively.
Bit Bit Name Initial Value R/W Description
7 BSRMn 0 R/W Burst ROM Interface Select
Selects the basic bus interface or burst ROM
interface.
0: Basic bus interface space
1: Burst ROM interface space
6
5
4
BSTSn2
BSTSn1
BSTSn0
0
0
0
R/W
R/W
R/W
Burst Cycle Select
These bits select the number of burst cycle
states.
000: 1 state
001: 2 states
010: 3 states
011: 4 states
100: 5 states
101: 6 states
110: 7 states
111: 8 states
3
and
2
− All 0 R/W Reserved
Though these bits can be read from or written to,
the write value should always be 0.
1
0
BSWDn1
BSWDn0
0
0
R/W
R/W
Burst Word Number Select
These bits select the number of words that can
be burst-accessed on the burst ROM interface.
00: Maximum 4 words
01: Maximum 8 words
10: Maximum 16 words
11: Maximum 32 words
(n = 1 or 0)
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6.3.7 Bus Control Register (BCR)
BCR is used for idle cycle settings, selection of the external bus released state protocol, enabling
or disabling of the write data buffer function, and enabling or disabling of WAIT pin input.
Bit Bit Name Initial Value R/W Description
15 BRLE 0 R/W External Bus Release Enable
Enables or disables external bus release.
0: External bus release disabled
BREQ, BACK, and BREQO pins can be used
as I/O ports
1: External bus release enabled
14 BREQOE 0 R/W BREQO Pin Enable
Controls outputting the bus request signal
(BREQO) to the external bus master in the
external bus released state, when an internal
bus master performs an external address space
access, or when a refresh request is generated.
0: BREQO output disabled
BREQO pin can be used as I/O port
1: BREQO output enabled
13 − 0 R/W Reserved
Though this bit can be read from or written to,
the write value should always be 0.
12 IDLC 1 R/W Idle Cycle State Number Select
Specifies the number of states in the idle cycle
set by ICIS2, ICIS1, and ICIS0.
0: Idle cycle comprises 1 state
1: Idle cycle comprises 2 states
11 ICIS1 1 R/W Idle Cycle Insert 1
When consecutive external read cycles are
performed in different areas, an idle cycle can be
inserted between the bus cycles.
0: Idle cycle not inserted
1: Idle cycle inserted
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Bit Bit Name Initial Value R/W Description
10 ICIS0 1 R/W Idle Cycle Insert 0
When an external read cycle and external write
cycle are performed consecutively, an idle cycle
can be inserted between the bus cycles.
0: Idle cycle not inserted
1: Idle cycle inserted
9 WDBE 0 R/W Write Data Buffer Enable
The write data buffer function can be used for an
external write cycle or DMAC single address
transfer cycle.
0: Write data buffer function not used
1: Write data buffer function used
8 WAITE 0 R/W WAIT Pin Enable
Selects enabling or disabling of wait input by the
WAIT pin.
0: Wait input by WAIT pin disabled
WAIT pin can be used as I/O port
1: Wait input by WAIT pin enabled
7 to 3 − All 0 R/W Reserved
Though these bits can be read from or written to,
the write value should always be 0.
2 ICIS2 0 R/W Idle Cycle Insert 2
When an external write cycle and external read
cycle are performed consecutively, an idle cycle
can be inserted between the bus cycles.
0: Idle cycle not inserted
1: Idle cycle inserted
1 and 0 − 0 R/W Reserved
Though these bits can be read from or written to,
the write value should always be 0.
Section 6 Bus Controller (BSC)
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6.3.8 DRAM Control Register (DRAMCR)
DRAMCR is used to make DRAM/synchronous DRAM interface settings.
Bit Bit Name Initial Value R/W Description
15 OEE 0 R/W OE Output Enable
The OE signal used when EDO page mode
DRAM is connected can be output from the
(OE) pin. The OE signal is common to all
areas designated as DRAM space.
0: OE signal output disabled
(OE) pin can be used as I/O port
1: OE signal output enabled
14 RAST 0 R/W RAS Assertion Timing Select
Selects whether, in DRAM access, the RAS
signal is asserted from the start of the Tr cycle
(rising edge of φ) or from the falling edge of φ.
Figure 6.4 shows the relationship between the
RAST bit setting and the RAS assertion timing.
The setting of this bit applies to all areas
designated as DRAM space.
0: RAS is asserted from φ falling edge in Tr
cycle
1: RAS is asserted from start of Tr cycle
13 − 0 R/W Reserved
Though this bit can be read from or written to,
the write value should always be 0.
12 CAST 0 R/W Column Address Output Cycle Number Select
Selects whether the column address output
cycle in DRAM access comprises 3 states or 2
states. The setting of this bit applies to all
areas designated as DRAM space.
0: 2-state column address output cycle
1: 3-state column address output cycle
11 − 0 R/W Reserved
Though this bit can be read from or written to,
the write value should always be 0.
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Bit Bit Name Initial Value R/W Description
10
9
8
RMTS2
RMTS1
RMTS0
0
0
0
R/W
R/W
R/W
DRAM Space Select
These bits designate DRAM space for areas 2
to 5.
When continuous DRAM space is set, it is
possible to connect large-capacity DRAM
exceeding 2 Mbytes per area. In this case, the
RAS signal is output from the CS2 pin.
000: Normal space
001: Normal space in areas 3 to 5
DRAM space in area 2
010: Normal space in areas 4 and 5
DRAM space in areas 2 and 3
011: Reserved (setting prohibited)
100: Reserved (setting prohibited)
101: Reserved (setting prohibited)
110: Reserved (setting prohibited)
111: Continuous DRAM space in areas 2 to 5
7 BE 0 R/W Burst Access Enable
Selects enabling or disabling of burst access to
areas designated as DRAM space. DRAM
space burst access is performed in fast page
mode. When using EDO page mode DRAM, the
OE signal must be connected.
0: Full access
1: Access in fast page mode
Section 6 Bus Controller (BSC)
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Bit Bit Name Initial Value R/W Description
6 RCDM 0 R/W RAS Down Mode
When access to DRAM space is interrupted by
an access to normal space, an access to an
internal I/O register, etc., this bit selects whether
the RAS signal is held low while waiting for the
next DRAM access (RAS down mode), or is
driven high again (RAS up mode). The setting
of this bit is valid only when the BE bit is set to
1.
If this bit is cleared to 0 when set to 1 in the
RAS down state, the RAS down state is cleared
at that point, and RAS goes high.
0: RAS up mode selected for DRAM space
access
1: RAS down mode selected for DRAM space
access
5 DDS 0 R/W DMAC Single Address Transfer Option
Selects whether full access is always performed
or burst access is enabled when DMAC single
address transfer is performed on the DRAM
When the BE bit is cleared to 0 in DRAMCR,
disabling DRAM burst access, DMAC single
address transfer is performed in full access
mode regardless of the setting of this bit.
This bit has no effect on other bus master
external accesses or DMAC dual address
transfers.
0: Full access is always executed
1: Burst access is enabled
4 and
3
− All 0 R/W Reserved
Though these bits can be read from or written
to, the write value should always be 0.
Section 6 Bus Controller (BSC)
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Bit Bit Name Initial Value R/W Description
2
1
0
MXC2
MXC1
MXC0
0
0
0
R/W
R/W
R/W
Address Multiplex Select
These bits select the size of the shift toward the
lower half of the row address in row
address/column address multiplexing. In burst
operation on the DRAM interface, these bits also
select the row address bits to be used for
comparison.
For details, refer to section 6.6.2, Address
Multiplexing.
000: 8-bit shift
• When 8-bit access space is designated:
Row address bits A23 to A8 used for
comparison
• When 16-bit access space is designated:
Row address bits A23 to A9 used for
comparison
001: 9-bit shift
• When 8-bit access space is designated:
Row address bits A23 to A9 used for
comparison
• When 16-bit access space is designated:
Row address bits A23 to A10 used for
comparison
010: 10-bit shift
• When 8-bit access space is designated:
Row address bits A23 to A10 used for
comparison
• When 16-bit access space is designated:
Row address bits A23 to A11 used for
comparison
011: 11-bit shift
• When 8-bit access space is designated:
Row address bits A23 to A11 used for
comparison
• When 16-bit access space is designated:
Row address bits A23 to A12 used for
comparison
1××: Setting prohibited
Legend:
×: Don't care
Section 6 Bus Controller (BSC)
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Tp
Address
φ
RAST = 0 RAS
RAST = 1 RAS
TrTc1 Tc2
UCAS, LCAS
Bus cycle
Row address Column address
Figure 6.4 RAS Signal Assertion Timing
(2-State Column Address Output Cycle, Full Access)
Section 6 Bus Controller (BSC)
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6.3.9 DRAM Access Control Register (DRACCR)
DRACCR is used to set the DRAM interface bus specifications.
Bit Bit Name Initial Value R/W Description
7 DRMI 0 R/W Idle Cycle Insertion
An idle cycle can be inserted after a DRAM
access cycle when a continuous normal space
access cycle follows a DRAM access cycle. Idle
cycle insertion conditions, setting of number of
states, etc., comply with settings of bits ICIS2,
ICIS1, ICIS0, and IDLC in BCR register
0: Idle cycle not inserted
1: Idle cycle inserted
6 − 0 R/W Reserved
Though this bit can be read from or written to,
the write value should always be 0.
5
4
TPC1
TPC0
0
0
R/W
R/W
Precharge State Control
These bits select the number of states in the
RAS precharge cycle in normal access and
refreshing.
00: 1-state RAS precharge cycle
01: 2-state RAS precharge cycle
10: 3-state RAS precharge cycle
11: 4-state RAS precharge cycle
3, 2 — All 0 R/W Reserved
Though these bits can be read from or written to,
the write value should always be 0.
1
0
RCD1
RCD0
0
0
R/W
R/W
RAS-CAS Wait Control
These bits select a wait cycle to be inserted
between the RAS assert cycle and CAS assert
cycle. A 1- to 4-state wait cycle can be inserted.
00: Wait cycle not inserted
01: 1-state wait cycle inserted
10: 2-state wait cycle inserted
11: 3-state wait cycle inserted
Section 6 Bus Controller (BSC)
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6.3.10 Refresh Control Register (REFCR)
REFCR specifies DRAM interface refresh control.
Bit Bit Name Initial Value R/W Description
15 CMF 0 R/(W)* Compare Match Flag
Status flag that indicates a match between the
values of RTCNT and RTCOR.
[Clearing conditions]
• When 0 is written to CMF after reading CMF
= 1 while the RFSHE bit is cleared to 0
• When CBR refreshing is executed while the
RFSHE bit is set to 1
[Setting condition]
When RTCOR = RTCNT
14 CMIE 0 R/W Compare Match Interrupt Enable
Enables or disables interrupt requests (CMI) by
the CMF flag when the CMF flag is set to 1.
This bit is valid when refresh control is not
performed. When the refresh control is
performed, this bit is always cleared to 0 and
cannot be modified.
0: Interrupt request by CMF flag disabled
1: Interrupt request by CMF flag enabled
13
12
RCW1
RCW0
0
0
R/W
R/W
CAS-RAS Wait Control
These bits select the number of wait cycles to be
inserted between the CAS assert cycle and RAS
assert cycle in a DRAM refresh cycle.
00: Wait state not inserted
01: 1 wait state inserted
10: 2 wait states inserted
11: 3 wait states inserted
11 − 0 R/W Reserved
Though this bit can be read from or written to,
the write value should always be 0.
Note: * Only 0 can be written, to clear the flag.
Section 6 Bus Controller (BSC)
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Bit Bit Name Initial Value R/W Description
10
9
8
RTCK2
RTCK1
RTCK0
0
0
0
R/W
R/W
R/W
Refresh Counter Clock Select
These bits select the clock to be used to
increment the refresh counter. When the input
clock is selected with bits RTCK2 to RTCK0,
the refresh counter begins counting up.
000: Count operation halted
001: Count on φ/2
010: Count on φ/8
011: Count on φ/32
100: Count on φ/128
101: Count on φ/512
110: Count on φ/2048
111: Count on φ/4096
7 RFSHE 0 R/W Refresh Control
Refresh control can be performed. When
refresh control is not performed, the refresh
timer can be used as an interval timer.
0: Refresh control is not performed
1: Refresh control is performed
6 CBRM 0 R/W CBR Refresh Control Mode
Selects CBR refreshing performed in parallel
with other external accesses, or execution of
CBR refreshing alone.
0: External access during CAS-before-RAS
refreshing is enabled
1: External access during CAS-before-RAS
refreshing is disabled
5
4
RLW1
RLW0
0
0
R/W
R/W
Refresh Cycle Wait Control
These bits select the number of wait states to
be inserted in a DRAM interface CAS-before-
RAS refresh cycle. This setting applies to all
areas designated as DRAM space.
00: No wait state inserted
01: 1 wait state inserted
10: 2 wait states inserted
11: 3 wait states inserted
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Bit Bit Name Initial Value R/W Description
3 SLFRF 0 R/W Self-Refresh Enable
If this bit is set to 1, DRAM self-refresh mode is
selected when a transition is made to the
software standby state. This bit is valid when
the RFSHE bit is set to 1, enabling refresh
operations. It is cleared after recovery from
software standby mode.
0: Self-refreshing is disabled
1: Self-refreshing is enabled
2
1
0
TPCS2
TPCS1
TPCS0
0
0
0
R/W
R/W
R/W
Self-Refresh Precharge Cycle Control
These bits select the number of states in the
precharge cycle immediately after self-
refreshing.
The number of states in the precharge cycle
immediately after self-refreshing are added to
the number of states set by bits TPC1 and
TPC0 in DRACCR.
000: [TPC set value] states
001: [TPC set value + 1] states
010: [TPC set value + 2] states
011: [TPC set value + 3] states
100: [TPC set value + 4] states
101: [TPC set value + 5] states
110: [TPC set value + 6] states
111: [TPC set value + 7] states
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6.3.11 Refresh Timer Counter (RTCNT)
RTCNT is an 8-bit readable/writable up-counter. RTCNT counts up using the internal clock
selected by bits RTCK2 to RTCK0 in REFCR.
When RTCNT matches RTCOR (compare match), the CMF flag in REFCR is set to 1 and
RTCNT is cleared to H'00. If the RFSHE bit in REFCR is set to 1 at this time, a refresh cycle is
started. If the RFSHE bit is cleared to 0 and the CMIE bit in REFCR is set to 1, a compare match
interrupt (CMI) is generated.
RTCNT is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
6.3.12 Refresh Time Constant Register (RTCOR)
RTCOR is an 8-bit readable/writable register that sets the period for compare match operations
with RTCNT.
The values of RTCOR and RTCNT are constantly compared, and if they match, the CMF flag in
REFCR is set to 1 and RTCNT is cleared to H'00.
RTCOR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
6.4 Operation
6.4.1 Area Division
The bus controller divides the 16-Mbyte address space into eight areas, 0 to 7, in 2-Mbyte units,
and performs bus control for external address space in area units. Chip select signals (CS0 to CS7)
can be output for each area. Figure 6.5 shows an outline of the memory map.
Section 6 Bus Controller (BSC)
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Area 0
(2 Mbytes)
H'000000
H'FFFFFF
H'1FFFFF
H'200000 Area 1
(2 Mbytes)
H'3FFFFF
H'400000 Area 2
(2 Mbytes)
H'5FFFFF
H'600000 Area 3
(2 Mbytes)
H'7FFFFF
H'800000 Area 4
(2 Mbytes)
H'9FFFFF
H'A00000 Area 5
(2 Mbytes)
H'BFFFFF
H'C00000 Area 6
(2 Mbytes)
H'DFFFFF
H'E00000 Area 7
(2 Mbytes)
Figure 6.5 Area Divisions
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6.4.2 Bus Specifications
The external space bus specifications consist of five elements: bus width, number of access states,
number of program wait states, read strobe timing, and chip select (CS) assertion period extension
states. The bus width and number of access states for on-chip memory and internal I/O registers
are fixed, and are not affected by the bus controller.
Bus Width: A bus width of 8 or 16 bits can be selected with ABWCR. An area for which an 8-bit
bus is selected functions as an 8-bit access space, and an area for which a 16-bit bus is selected
functions as a 16-bit access space. If all areas are designated as 8-bit access space, 8-bit bus mode
is set; if any area is designated as 16-bit access space, 16-bit bus mode is set.
Number of Access States: Two or three access states can be selected with ASTCR. An area for
which 2-state access is selected functions as a 2-state access space, and an area for which 3-state
access is selected functions as a 3-state access space. With the DRAM interface and burst ROM
interface, the number of access states may be determined without regard to the setting of ASTCR.
When 2-state access space is designated, wait insertion is disabled. When 3-state access space is
designated, it is possible to insert program waits by means of the WTCRA and WTCRB, and
external waits by means of the WAIT pin.
Number of Program Wait States: When 3-state access space is designated by ASTCR, the
number of program wait states to be inserted automatically is selected with WTCRA and WTCRB.
From 0 to 7 program wait states can be selected. Table 6.2 shows the bus specifications (bus
width, and number of access states and program wait states) for each basic bus interface area.
Section 6 Bus Controller (BSC)
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Table 6.2 Bus Specifications for Each Area (Basic Bus Interface)
ABWCR ASTCR WTCRA, WTCRB Bus Specifications (Basic Bus Interface)
ABWn
ASTn
Wn2
Wn1
Wn0
Bus Width
Access
States
Program Wait
States
0 0 — — — 16 2 0
1 0 0 0 3 0
1 1
1 0 2
1 3
1 0 0 4
1 5
1 0 6
1 7
1 0 — — — 8 2 0
1 0 0 0 3 0
1 1
1 0 2
1 3
1 0 0 4
1 5
1 0 6
1 7
(n = 0 to 7)
Read Strobe Timing: RDNCR can be used to select either of two negation timings (at the end of
the read cycle or one half-state before the end of the read cycle) for the read strobe (RD) used in
the basic bus interface space.
Chip Select (CS) Assertion Period Extension States: Some external I/O devices require a setup
time and hold time between address and CS signals and strobe signals such as RD, HWR, and
LWR. CSACR can be used to insert states in which only the CS, AS, and address signals are
asserted before and after a basic bus space access cycle.
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6.4.3 Memory Interfaces
The memory interfaces in this LSI comprise a basic bus interface that allows direct connection of
ROM, SRAM, and so on a synchronous DRAM interface that allows direct connection of
synchronous DRAM; and a burst ROM interface that allows direct connection of burst ROM. The
interface can be selected independently for each area.
An area for which the basic bus interface is designated functions as normal space, an area for
which the DRAM interface is designated functions as DRAM space, and an area for which the
burst ROM interface is designated functions as burst ROM space.
The initial state of each area is basic bus interface, 3-state access space. The initial bus width is
selected according to the operating mode.
Area 0: Area 0 includes on-chip ROM in expanded mode with on-chip ROM enabled and the
space excluding on-chip ROM is external space, and in expanded mode with on-chip ROM
disabled, all of area 0 is external space.
When area 0 external space is accessed, the CS0 signal can be output.
Either basic bus interface or burst ROM interface can be selected for area 0.
Area 1: In externally expanded mode, all of area 1 is external space.
When area 1 external space is accessed, the CS1 signal can be output.
Either basic bus interface or burst ROM interface can be selected for area 1.
Areas 2 to 5: In externally expanded mode, areas 2 to 5 are all external space.
When area 2 to 5 external space is accessed, signals CS2 to CS5 can be output.
Basic bus interface, or DRAM interface can be selected for areas 2 to 5. With the DRAM
interface, signals CS2 and CS3 are used as RAS signals.
If areas 2 to 5 are designated as continuous DRAM space, large-capacity (e.g. 64-Mbit) DRAM
can be connected. In this case, the CS2 signal is used as the RAS signal for the continuous DRAM
space.
Area 6: In externally expanded mode, all of area 6 is external space.
When area 6 external space is accessed, the CS6 signal can be output.
Section 6 Bus Controller (BSC)
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Only the basic bus interface can be used for area 6.
Area 7: Area 7 includes the on-chip RAM and internal I/O registers. In externally expanded
mode, the space excluding the on-chip RAM and internal I/O registers is external space. The on-
chip RAM is enabled when the RAME bit is set to 1 in the system control register (SYSCR); when
the RAME bit is cleared to 0, the on-chip RAM is disabled and the corresponding addresses are in
external space.
When area 7 external space is accessed, the CS7 signal can be output.
Only the basic bus interface can be used for the area 7 memory interface.
6.4.4 Chip Select Signals
This LSI can output chip select signals (CS0 to CS7) for areas 0 to 7. The signal outputs low when
the corresponding external space area is accessed. Figure 6.6 shows an example of CS0 to CS7
signals output timing.
Enabling or disabling of CS0 to CS7 signals output is set by the data direction register (DDR) bit
for the port corresponding to the CS0 to CS7 pins.
In expanded mode with on-chip ROM disabled, the CS0 pin is placed in the output state after a
reset. Pins CS1 to CS7 are placed in the input state after a reset and so the corresponding DDR bits
should be set to 1 when outputting signals CS1 to CS7.
In expanded mode with on-chip ROM enabled, pins CS0 to CS7 are all placed in the input state
after a reset and so the corresponding DDR bits should be set to 1 when outputting signals CS0 to
CS7.
When areas 2 to 5 are designated as DRAM space, outputs CS2 is used as RAS signals.
Section 6 Bus Controller (BSC)
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Bus cycle
T1T2T3
Area n external address
Address bus
Figure 6.6 CSn Signal Output Timing (n = 0 to 7)
6.5 Basic Bus Interface
The basic bus interface enables direct connection of ROM, SRAM, and so on.
6.5.1 Data Size and Data Alignment
Data sizes for the CPU and other internal bus masters are byte, word, and longword. The bus
controller has a data alignment function, and when accessing external space, controls whether the
upper data bus (D15 to D8) or lower data bus (D7 to D0) is used according to the bus
specifications for the area being accessed (8-bit access space or 16-bit access space) and the data
size.
8-Bit Access Space: Figure 6.7 illustrates data alignment control for the 8-bit access space. With
the 8-bit access space, the upper data bus (D15 to D8) is always used for accesses. The amount of
data that can be accessed at one time is one byte: a word access is performed as two byte accesses,
and a longword access, as four byte accesses.
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D15 D8 D7 D0
Upper data bus Lower data bus
Byte size
Word size 1st bus cycle
2nd bus cycle
Longword
size
1st bus cycle
2nd bus cycle
3rd bus cycle
4th bus cycle
Figure 6.7 Access Sizes and Data Alignment Control (8-Bit Access Space)
16-Bit Access Space: Figure 6.8 illustrates data alignment control for the 16-bit access space.
With the 16-bit access space, the upper data bus (D15 to D8) and lower data bus (D7 to D0) are
used for accesses. The amount of data that can be accessed at one time is one byte or one word,
and a longword access is executed as two word accesses.
In byte access, whether the upper or lower data bus is used is determined by whether the address is
even or odd. The upper data bus is used for an even address, and the lower data bus for an odd
address.
D15 D8 D7 D0
Upper data bus Lower data bus
Byte size
Word size
1st bus cycle
2nd bus cycle
Longword
size
• Even address
Byte size • Odd address
Figure 6.8 Access Sizes and Data Alignment Control (16-bit Access Space)
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6.5.2 Valid Strobes
Table 6.3 shows the data buses used and valid strobes for the access spaces.
In a read, the RD signal is valid for both the upper and the lower half of the data bus. In a write,
the HWR signal is valid for the upper half of the data bus, and the LWR signal for the lower half.
Table 6.3 Data Buses Used and Valid Strobes
Area
Access
Size
Read/
Write
Address
Valid
Strobe
Upper Data Bus
(D15 to D8)
Lower Data Bus
(D7 to D0)
8-bit access Byte Read — RD Valid Invalid
space Write — HWR Hi-Z
16-bit access Byte Read Even RD Valid Invalid
space Odd Invalid Valid
Write Even HWR Valid Hi-Z
Odd LWR Hi-Z Valid
Word Read — RD Valid Valid
Write — HWR, LWR Valid Valid
Notes: Hi-Z: High-impedance state
Invalid: Input state; input value is ignored.
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6.5.3 Basic Timing
8-Bit, 2-State Access Space: Figure 6.9 shows the bus timing for an 8-bit, 2-state access space.
When an 8-bit access space is accessed, the upper half (D15 to D8) of the data bus is used. The
LWR pin is always fixed high. Wait states can be inserted.
Bus cycle
T
1
T
2
Address bus
φ
CSn
AS
RD
D15 to D8 Valid
D7 to D0 Invalid
Read
HWR
LWR
D15 to D8 Valid
D7 to D0 High impedance
Write
High
Notes: 1. n = 0 to 7
2. When RDNn = 0
Figure 6.9 Bus Timing for 8-Bit, 2-State Access Space
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8-Bit, 3-State Access Space: Figure 6.10 shows the bus timing for an 8-bit, 3-state access space.
When an 8-bit access space is accessed, the upper half (D15 to D8) of the data bus is used. The
LWR pin is always fixed high. Wait states can be inserted.
Bus cycle
T1T2
Address bus
φ
CSn
AS
RD
D15 to D8 Valid
D7 to D0 Invalid
Read
HWR
LWR
D15 to D8 Valid
D7 to D0
Write
High
T3
High impedance
Notes: 1. n = 0 to 7
2. When RDNn = 0
Figure 6.10 Bus Timing for 8-Bit, 3-State Access Space
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16-Bit, 2-State Access Space: Figures 6.11 to 6.13 show bus timings for a 16-bit, 2-state access
space. When a 16-bit access space is accessed, the upper half (D15 to D8) of the data bus is used
for odd addresses, and the lower half (D7 to D0) for even addresses. Wait states cannot be
inserted.
Bus cycle
T1T2
Address bus
φ
CSn
AS
RD
D15 to D8 Valid
D7 to D0 Invalid
Read
HWR
LWR
D15 to D8 Valid
D7 to D0
Write
High
High impedance
Notes: 1. n = 0 to 7
2. When RDNn = 0
Figure 6.11 Bus Timing for 16-Bit, 2-State Access Space (Even Address Byte Access)
Section 6 Bus Controller (BSC)
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Bus cycle
T
1
T
2
Address bus
φ
CSn
AS
RD
D15 to D8 Invalid
D7 to D0 Valid
Read
HWR
LWR
D15 to D8
D7 to D0 Valid
Write
High
High impedance
Notes: 1. n = 0 to 7
2. When RDNn = 0
Figure 6.12 Bus Timing for 16-Bit, 2-State Access Space (Odd Address Byte Access)
Section 6 Bus Controller (BSC)
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Bus cycle
T
1
T
2
Address bus
φ
CSn
AS
RD
D15 to D8 Valid
D7 to D0 Valid
Read
HWR
LWR
D15 to D8 Valid
D7 to D0 Valid
Write
Notes: 1. n = 0 to 7
2. When RDNn = 0
Figure 6.13 Bus Timing for 16-Bit, 2-State Access Space (Word Access)
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16-Bit, 3-State Access Space: Figures 6.14 to 6.16 show bus timings for a 16-bit, 3-state access
space. When a 16-bit access space is accessed, the upper half (D15 to D8) of the data bus is used
for the even address, and the lower half (D7 to D0) for the odd address. Wait states can be
inserted.
Bus cycle
T
1
T
2
Address bus
φ
CSn
AS
RD
D15 to D8 Valid
D7 to D0 Invalid
Read
HWR
LWR
D15 to D8 Valid
D7 to D0
Write
High
T
3
High impedance
Notes: 1. n = 0 to 7
2. When RDNn = 0
Figure 6.14 Bus Timing for 16-Bit, 3-State Access Space (Even Address Byte Access)
Section 6 Bus Controller (BSC)
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Bus cycle
T
1
T
2
Address bus
φ
CSn
AS
RD
D15 to D8 Invalid
D7 to D0 Valid
Read
HWR
LWR
D15 to D8
D7 to D0 Valid
Write
High
T
3
High impedance
Notes: 1. n = 0 to 7
2. When RDNn = 0
Figure 6.15 Bus Timing for 16-Bit, 3-State Access Space (Odd Address Byte Access)
Section 6 Bus Controller (BSC)
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Bus cycle
T
1
T
2
Address bus
φ
CSn
AS
RD
D15 to D8 Valid
D7 to D0 Valid
Read
HWR
LWR
D15 to D8 Valid
D7 to D0 Valid
Write
T
3
Notes: 1. n = 0 to 7
2. When RDNn = 0
Figure 6.16 Bus Timing for 16-Bit, 3-State Access Space (Word Access)
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6.5.4 Wait Control
When accessing external space, this LSI can extend the bus cycle by inserting one or more wait
states (Tw). There are two ways of inserting wait states: program wait insertion and pin wait
insertion using the WAIT pin.
Program Wait Insertion: From 0 to 7 wait states can be inserted automatically between the T2
state and T3 state on an individual area basis in 3-state access space, according to the settings in
WTCRA and WTCRB.
Pin Wait Insertion: Setting the WAITE bit to 1 in BCR enables wait input by means of the
WAIT pin. When external space is accessed in this state, a program wait is first inserted in
accordance with the settings in WTCRA and WTCRB. If the WAIT pin is low at the falling edge
of φ in the last T2 or Tw state, another Tw state is inserted. If the WAIT pin is held low, Tw states are
inserted until it goes high. This is useful when inserting seven or more Tw states, or when changing
the number of Tw states to be inserted for different external devices. The WAITE bit setting
applies to all areas. Figure 6.17 shows an example of wait state insertion timing.
The settings after a reset are: 3-state access, insertion of 7 program wait states, and WAIT input
disabled.
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By program wait
T1
Address bus
φ
AS
RD
Data bus Read data
Read
HWR, LWR
Write data
Write
WAIT
Data bus
T2TwTwTwT3
By WAIT pin
Notes: 1. Downward arrows indicate the timing of WAIT pin sampling.
2. When RDN = 0
Figure 6.17 Example of Wait State Insertion Timing
6.5.5 Read Strobe (RD) Timing
The read strobe (RD) timing can be changed for individual areas by setting bits RDN7 to RDN0 to
1 in RDNCR. Figure 6.18 shows an example of the timing when the read strobe timing is changed
in basic bus 3-state access space.
When the DMAC is used in single address mode, note that if the RD timing is changed by setting
RDNn to 1, the RD timing will change relative to the rise of DACK.
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Bus cycle
T
1
T
2
Address bus
φ
CSn
AS
RD
T
3
Data bus
RD
DACK
Data bus
RDNn = 0
RDNn = 1
Figure 6.18 Example of Read Strobe Timing
6.5.6 Extension of Chip Select (CS) Assertion Period
Some external I/O devices require a setup time and hold time between address and CS signals and
strobe signals such as RD, HWR, and LWR. Settings can be made in the CSACR register to insert
states in which only the CS, AS, and address signals are asserted before and after a basic bus space
access cycle. Extension of the CS assertion period can be set for individual areas. With the CS
assertion extension period in write access, the data setup and hold times are less stringent since the
write data is output to the data bus.
Figure 6.19 shows an example of the timing when the CS assertion period is extended in basic bus
3-state access space.
Section 6 Bus Controller (BSC)
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T
h
Address bus
φ
T
1
T
2
T
3
T
t
Bus cycle
Data bus
HWR, LWR
Write
Data bus
RD
CSn
AS
Read
(when
RDNn = 0) Read data
Write data
Figure 6.19 Example of Timing when Chip Select Assertion Period is Extended
Both extension state Th inserted before the basic bus cycle and extension state Tt inserted after the
basic bus cycle, or only one of these, can be specified for individual areas. Insertion or non-
insertion can be specified for the Th state with the upper 8 bits (CSXH7 to CSXH0) in the CSACR
register, and for the Tt state with the lower 8 bits (CSXT7 to CSXT0).
Section 6 Bus Controller (BSC)
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6.6 DRAM Interface
In this LSI, external space areas 2 to 5 can be designated as DRAM space, and DRAM interfacing
performed. The DRAM interface allows DRAM to be directly connected to this LSI. A DRAM
space of 2, 4, or 8 Mbytes can be set by means of bits RMTS2 to RMTS0 in DRAMCR. Burst
operation is also possible, using fast page mode.
6.6.1 Setting DRAM Space
Areas 2 to 5 are designated as DRAM space by setting bits RMTS2 to RMTS0 in DRAMCR. The
relation between the settings of bits RMTS2 to RMTS0 and DRAM space is shown in table 6.4.
Possible DRAM space settings are: one area (area 2), two areas (areas 2 and 3), and continuous
area (areas 2 to 5).
Table 6.4 Relation between Settings of Bits RMTS2 to RMTS0 and DRAM Space
RMTS2 RMTS1 RMTS0 Area 5 Area 4 Area 3 Area 2
0 0 1 Normal space Normal space Normal space DRAM space
1 0 Normal space Normal space DRAM space DRAM space
1 Reserved (setting prohibited)
1 0 Reserved (setting prohibited)
0
1 Reserved (setting prohibited)
1 0 Reserved (setting prohibited)
1 Continuous
DRAM space
Continuous
DRAM space
Continuous
DRAM space
Continuous
DRAM space
With continuous DRAM space, RAS2 is valid. The bus specifications (bus width, number of wait
states, etc.) for continuous DRAM space conform to the settings for area 2.
6.6.2 Address Multiplexing
With DRAM space, the row address and column address are multiplexed. In address multiplexing,
the size of the shift of the row address is selected with bits MXC2 to MXC0 in DRAMCR. Table
6.5 shows the relation between the settings of MXC2 to MXC0 and the shift size.
The MXC2 bit should be cleared to 0 when the DRAM interface is used.
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Table 6.5 Relation between Settings of Bits MXC2 to MXC0 and Address Multiplexing
DRAMCR Address Pins
MXC2
MXC1
MXC0
Shift Size
A23
to
A16
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
Row
address
0 0 0 8 bits A23
to
A16
A23 A22 A21 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8
1 9 bits A23
to
A16
A15 A23 A22 A21 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9
1 0 10 bits A23
to
A16
A15 A14 A23 A22 A21 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10
1 11 bits A23
to
A16
A15 A14 A13 A23 A22 A21 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11
1 × × Reserved (setting prohibited)
Column
address
0 × × — A23
to
A16
A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
1 × × Reserved (setting prohibited)
Legend:
×: Don’t care.
6.6.3 Data Bus
If a bit in ABWCR corresponding to an area designated as DRAM space is set to 1, that area is
designated as 8-bit DRAM space; if the bit is cleared to 0, the area is designated as 16-bit DRAM
space. In 16-bit DRAM space, ×16-bit configuration DRAM can be connected directly.
In 8-bit DRAM space the upper half of the data bus, D15 to D8, is enabled, while in 16-bit DRAM
space both the upper and lower halves of the data bus, D15 to D0, are enabled.
Access sizes and data alignment are the same as for the basic bus interface: see section 6.5.1, Data
Size and Data Alignment.
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6.6.4 Pins Used for DRAM Interface
Table 6.6 shows the pins used for DRAM interfacing and their functions. Since the CS2, CS5 pins
are in the input state after a reset, set the corresponding DDR to 1 when RAS2, RAS5 signals are
output.
Table 6.6 DRAM Interface Pins
Pin
With DRAM
Setting
Name
I/O
Function
HWR WE Write enable Output Write enable for DRAM space
access
CS2 RAS2 Row address strobe 2/
row address strobe
Output Row address strobe when area
2 is designated as DRAM space
or row address strobe when
areas 2 to 5 are designated as
continuous DRAM space
CS3 RAS3 Row address strobe 3 Output Row address strobe when area
3 is designated as DRAM space
UCAS UCAS Upper column address
strobe
Output Upper column address strobe for
16-bit DRAM space access or
column address strobe for 8-bit
DRAM space access
LCAS LCAS Lower column address
strobe
Output Lower column address strobe
signal for 16-bit DRAM space
access
RD, OE OE Output enable Output Output enable signal for DRAM
space access
WAIT WAIT Wait Input Wait request signal
A15 to A0 A15 to A0 Address pins Output Row address/column address
multiplexed output
D15 to D0 D15 to D0 Data pins I/O Data input/output pins
Section 6 Bus Controller (BSC)
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6.6.5 Basic Timing
Figure 6.20 shows the basic access timing for DRAM space.
The four states of the basic timing consist of one Tp (precharge cycle) state, one Tr (row address
output cycle) state, and the Tc1 and two Tc2 (column address output cycle) states.
Tp
φ
RASn (CSn)
Read
Write
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
Address bus
TrTc1 Tc2
Row address
High
High
Column address
Note: n = 2, 3
Figure 6.20 DRAM Basic Access Timing (RAST = 0, CAST = 0)
When DRAM space is accessed, the RD signal is output as the OE signal for DRAM. When
connecting DRAM provided with an EDO page mode, the OE signal should be connected to the
(OE ) pin of the DRAM. Setting the OEE bit to 1 in DRAMCR enables the OE signal for DRAM
space to be output from a dedicated OE pin. In this case, the OE signal for DRAM space is output
Section 6 Bus Controller (BSC)
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from both the RD pin and the (OE) pin, but in external read cycles for other than DRAM space,
the signal is output only from the RD pin.
6.6.6 Column Address Output Cycle Control
The column address output cycle can be changed from 2 states to 3 states by setting the CAST bit
to 1 in DRAMCR. Use the setting that gives the optimum specification values (CAS pulse width,
etc.) according to the DRAM connected and the operating frequency of this LSI. Figure 6.21
shows an example of the timing when a 3-state column address output cycle is selected.
T
p
φ
RASn (CSn)
Read
Write
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
Address bus
T
r
T
c1
T
c2
Tc3
Row address Column address
High
High
Note: n = 2, 3
Figure 6.21 Example of Access Timing with 3-State Column Address Output Cycle
(RAST = 0)
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6.6.7 Row Address Output State Control
If the RAST bit is set to 1 in DRAMCR, the RAS signal goes low from the beginning of the Tr
state, and the row address hold time and DRAM read access time are changed relative to the fall of
the RAS signal. Use the optimum setting according to the DRAM connected and the operating
frequency of this LSI. Figure 6.22 shows an example of the timing when the RAS signal goes low
from the beginning of the Tr state.
Tp
φ
RASn (CSn)
Read
Write
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
Address bus
TrTc1 Tc2
Row address Column address
High
High
Note: n = 2, 3
Figure 6.22 Example of Access Timing when RAS Signal Goes Low from Beginning
of Tr State (CAST = 0)
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If a row address hold time or read access time is necessary, making a setting in bits RCD1 and
RCD0 in DRACCR allows from one to three Trw states, in which row address output is maintained,
to be inserted between the Tr cycle, in which the RAS signal goes low, and the Tc1 cycle, in which
the column address is output. Use the setting that gives the optimum row address signal hold time
relative to the falling edge of the RAS signal according to the DRAM connected and the operating
frequency of this LSI. Figure 6.23 shows an example of the timing when one Trw state is set.
T
p
φ
RASn (CSn)
Read
Write
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
Address bus
T
r
T
rw
T
c1
T
c2
Row address Column address
High
High
Note: n = 2, 3
Figure 6.23 Example of Timing with One Row Address Output Maintenance State
(RAST = 0, CAST = 0)
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6.6.8 Precharge State Control
When DRAM is accessed, a RAS precharge time must be secured. With this LSI, one Tp state is
always inserted when DRAM space is accessed. From one to four Tp states can be selected by
setting bits TPC1 and TPC0 in DRACCR. Set the optimum number of Tp cycles according to the
DRAM connected and the operating frequency of this LSI. Figure 6.24 shows the timing when
two Tp states are inserted. The setting of bits TPC1 and TPC0 is also valid for Tp states in refresh
cycles.
T
p1
φ
RASn (CSn)
Read
Write
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
Address bus
T
p2
T
r
T
c1
T
c2
Row address Column address
High
High
Note: n = 2, 3
Figure 6.24 Example of Timing with Two-State Precharge Cycle
(RAST = 0, CAST = 0)
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6.6.9 Wait Control
There are two ways of inserting wait states in a DRAM access cycle: program wait insertion and
pin wait insertion using the WAIT pin.
Wait states are inserted to extend the CAS assertion period in a read access to DRAM space, and
to extend the write data setup time relative to the falling edge of CAS in a write access.
Program Wait Insertion: When the bit in ASTCR corresponding to an area designated as DRAM
space is set to 1, from 0 to 7 wait states can be inserted automatically between the Tc1 state and Tc2
state, according to the WTCR setting.
Pin Wait Insertion: When the WAITE bit in BCR is set to 1 and the ASTCR bit is set to 1, wait
input by means of the WAIT pin is enabled. When DRAM space is accessed in this state, a
program wait (Tw) is first inserted. If the WAIT pin is low at the falling edge of φ in the last Tc1 or
Tw state, another Tw state is inserted. If the WAIT pin is held low, Tw states are inserted until it
goes high.
Figures 6.25 and 6.26 show examples of wait cycle insertion timing in the case of 2-state and 3-
state column address output cycles.
Section 6 Bus Controller (BSC)
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By program wait
Tp
Address bus
φ
WAIT
TrTc1 TwTwTc2
By WAIT pin
RASn (CSn)
Read
Write
UCAS, LCAS
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
Row address Column address
High
High
Notes: Downward arrows indicate the timing of WAIT pin sampling.
n = 2, 3
Figure 6.25 Example of Wait State Insertion Timing
(2-State Column Address Output)
Section 6 Bus Controller (BSC)
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By program wait
Tp
Address bus
φ
WAIT
TrTc1 TwTwTc2 Tc3
By WAIT pin
RASn (CSn)
Read
Write
UCAS, LCAS
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
Row address Column address
High
High
Notes: Downward arrows indicate the timing of WAIT pin sampling.
n = 2, 3
Figure 6.26 Example of Wait State Insertion Timing
(3-State Column Address Output)
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6.6.10 Byte Access Control
When DRAM with a ×16-bit configuration is connected, the 2-CAS access method is used for the
control signals needed for byte access. Figure 6.27 shows the control timing for 2-CAS access,
and figure 6.28 shows an example of 2-CAS DRAM connection.
T
p
φ
RASn (CSn)
UCAS
LCAS
WE (HWR)
OE (RD)
Upper data bus
Lower data bus
Address bus
T
r
T
c1
T
c2
Note: n = 2, 3
Row address Column address
Write data
High
High
High impedance
Figure 6.27 2-CAS Control Timing
(Upper Byte Write Access: RAST = 0, CAST = 0)
Section 6 Bus Controller (BSC)
Rev.6.00 Mar. 18, 2009 Page 177 of 980
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This LSI
(Address shift size
set to 10 bits)
RASn (CSn)
2-CAS type 16-Mbit DRAM
1-Mbyte × 16-bit configuration
10-bit column address
RAS
UCAS UCAS
LCAS LCAS
HWR (WE)WE
RD (OE)OE
A9A8
A10 A9
A8 A7
A7 A6
A6 A5
A5 A4
A4 A3
A3 A2
A2 A1
A1 A0
D15 to D0 D15 to D0
Row address input:
A9 to A0
Column address input:
A9 to A0
Figure 6.28 Example of 2-CAS DRAM Connection
6.6.11 Burst Operation
With DRAM, in addition to full access (normal access) in which data is accessed by outputting a
row address for each access, a fast page mode is also provided which can be used when making
consecutive accesses to the same row address. This mode enables fast (burst) access of data by
simply changing the column address after the row address has been output. Burst access can be
selected by setting the BE bit to 1 in DRAMCR.
Burst Access (Fast Page Mode): Figures 6.29 and 6.30 show the operation timing for burst
access. When there are consecutive access cycles for DRAM space, the CAS signal and column
address output cycles (two states) continue as long as the row address is the same for consecutive
access cycles. The row address used for the comparison is set with bits MXC2 to MXC0 in
DRAMCR.
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T
p
φ
T
r
T
c1
T
c2
T
c1
T
c2
RASn (CSn)
Read
Write
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
Address bus
Note: n = 2, 3
Row address Column address 1 Column address 2
High
High
Figure 6.29 Operation Timing in Fast Page Mode
(RAST = 0, CAST = 0)
Section 6 Bus Controller (BSC)
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Tp
φ
TrTc1 Tc2 Tc3 Tc1 Tc2 Tc3
RASn (CSn)
Read
Write
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
Address bus
Note: n = 2, 3
Row address Column address 1 Column address 2
High
High
Figure 6.30 Operation Timing in Fast Page Mode
(RAST = 0, CAST = 1)
The bus cycle can also be extended in burst access by inserting wait states. The wait state insertion
method and timing are the same as for full access. For details see section 6.6.9, Wait Control.
RAS Down Mode and RAS Up Mode: Even when burst operation is selected, it may happen that
access to DRAM space is not continuous, but is interrupted by access to another space. In this
case, if the RAS signal is held low during the access to the other space, burst operation can be
resumed when the same row address in DRAM space is accessed again.
• RAS Down Mode
To select RAS down mode, set both the RCDM bit and the BE bit to 1 in DRAMCR. If access
to DRAM space is interrupted and another space is accessed, the RAS signal is held low
during the access to the other space, and burst access is performed when the row address of the
next DRAM space access is the same as the row address of the previous DRAM space access.
Figure 6.31 shows an example of the timing in RAS down mode.
Note, however, that the RAS signal will go high if:
⎯ a refresh operation is initiated in the RAS down state
⎯ self-refreshing is performed
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⎯ the chip enters software standby mode
⎯ the external bus is released
⎯ the RCDM bit or BE bit is cleared to 0
If a transition is made to the all-module-clocks-stopped mode in the RAS down state, the clock
will stop with RAS low. To enter the all-module-clocks-stopped mode with RAS high, the
RCDM bit must be cleared to 0 before executing the SLEEP instruction.
Normal space
read DRAM space
read
T
p
T
r
T
c1
T
c2
T
1
T
2
DRAM space read
T
c1
T
c2
Note: n = 2, 3
φ
RASn (CSn)
UCAS, LCAS
RD
OE
Data bus
Address bus Row address Column address 1 Column address 2External address
Figure 6.31 Example of Operation Timing in RAS Down Mode
(RAST = 0, CAST = 0)
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• RAS Up Mode
To select RAS up mode, clear the RCDM bit to 0 in DRAMCR. Each time access to DRAM
space is interrupted and another space is accessed, the RAS signal goes high again. Burst
operation is only performed if DRAM space is continuous. Figure 6.32 shows an example of
the timing in RAS up mode.
Normal space
read
DRAM space
read
T
p
T
r
T
c1
T
c2
T
c1
T
c2
DRAM space read
T
1
T
2
Note: n = 2, 3
φ
RASn (CSn)
UCAS, LCAS
RD
OE
Data bus
Address bus Row address Column address 1 Column address 2 External address
Figure 6.32 Example of Operation Timing in RAS Up Mode
(RAST = 0, CAST = 0)
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6.6.12 Refresh Control
This LSI is provided with a DRAM refresh control function. CAS-before-RAS (CBR) refreshing
is used. In addition, self-refreshing can be executed when the chip enters the software standby
state.
Refresh control is enabled when any area is designated as DRAM space in accordance with the
setting of bits RMTS2 to RMTS0 in DRAMCR.
CAS-before-RAS (CBR) Refreshing: To select CBR refreshing, set the RFSHE bit to 1 in
REFCR.
With CBR refreshing, RTCNT counts up using the input clock selected by bits RTCK2 to RTCK0
in REFCR, and when the count matches the value set in RTCOR (compare match), refresh control
is performed. At the same time, RTCNT is reset and starts counting up again from H'00.
Refreshing is thus repeated at fixed intervals determined by RTCOR and bits RTCK2 to RTCK0.
Set a value in RTCOR and bits RTCK2 to RTCK0 that will meet the refreshing interval
specification for the DRAM used.
When bits RTCK2 to RTCK0 in REFCR are set, RTCNT starts counting up. RTCNT and RTCOR
settings should therefore be completed before setting bits RTCK2 to RTCK0. RTCNT operation is
shown in figure 6.33, compare match timing in figure 6.34, and CBR refresh timing in figure 6.35.
When the CBRM bit in REFCR is cleared to 0, access to external space other than DRAM space is
performed in parallel during the CBR refresh period.
RTCOR
H'00
Refresh request
RTCNT
Figure 6.33 RTCNT Operation
Section 6 Bus Controller (BSC)
Rev.6.00 Mar. 18, 2009 Page 183 of 980
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RTCNT N
RTCOR N
H'00
Refresh request
signal and CMF bit
setting signal
Figure 6.34 Compare Match Timing
T
Rp
φ
CSn (RASn)
T
Rr
T
Rc1
T
Rc2
UCAS, LCAS
Note: n = 2, 3
Figure 6.35 CBR Refresh Timing
A setting can be made in bits RCW1 and RCW0 in REFCR to delay RAS signal output by one to
three cycles. Use bits RLW1 and RLW0 in REFCR to adjust the width of the RAS signal. The
settings of bits RCW1, RCW0, RLW1, and RLW0 are valid only in refresh operations.
Figure 6.36 shows the timing when bits RCW1 and RCW0 are set.
Section 6 Bus Controller (BSC)
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T
Rp
φ
CSn (RASn)
T
Rrw
T
Rr
T
Rc1
UCAS, LCAS
T
Rc2
Note: n = 2, 3
Figure 6.36 CBR Refresh Timing
(RCW1 = 0, RCW0 = 1, RLW1 = 0, RLW0 = 0)
Depending on the DRAM used, modification of the WE signal may not be permitted during the
refresh period. In this case, the CBRM bit in REFCR should be set to 1. The bus controller will
then insert refresh cycles in appropriate breaks between bus cycles. Figure 6.37 shows an example
of the timing when the CBRM bit is set to 1. In this case the CS signal is not controlled, and
retains its value prior to the start of the refresh period.
Section 6 Bus Controller (BSC)
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A23 to A0
CS
φ
AS
RD
HWR (WE)
CAS
Normal space access request
RAS
Refresh period
Figure 6.37 Example of CBR Refresh Timing (CBRM = 1)
Self-Refreshing: A self-refresh mode (battery backup mode) is provided for DRAM as a kind of
standby mode. In this mode, refresh timing and refresh addresses are generated within the DRAM.
To select self-refreshing, set the RFSHE bit and SLFRF bit to 1 in REFCR. When a SLEEP
instruction is executed to enter software standby mode, the CAS and RAS signals are output and
DRAM enters self-refresh mode, as shown in figure 6.38.
When software standby mode is exited, the SLFRF bit is cleared to 0 and self-refresh mode is
exited automatically. If a CBR refresh request occurs when making a transition to software
standby mode, CBR refreshing is executed, and then self-refresh mode is entered.
When using self-refresh mode, the OPE bit must not be cleared to 0 in the SBYCR register.
Section 6 Bus Controller (BSC)
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TRp
φ
TRr
UCAS, LCAS
Software
standby TRc3
HWR (WE)
CSn (RASn)
Note: n = 2, 3
High
Figure 6.38 Self-Refresh Timing
In some DRAMs provided with a self-refresh mode, the RAS signal precharge time immediately
after self-refreshing is longer than the normal precharge time. A setting can be made in bits
TPCS2 to TPCS0 in REFCR to make the precharge time immediately after self-refreshing from 1
to 7 states longer than the normal precharge time. In this case, too, normal precharging is
performed according to the setting of bits TPC1 and TPC0 in DRACCR, and therefore a setting
should be made to give the optimum post-self-refresh precharge time, including this time. Figure
6.39 shows an example of the timing when the precharge time immediately after self-refreshing is
extended by 2 states.
Section 6 Bus Controller (BSC)
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DRAM space write
T
rc3
T
rp1
T
rp2
T
p
T
r
Software
standby
T
c1
T
c2
Note: n = 2, 3
φ
RASn (CSn)
UCAS, LCAS
OE (RD)
HWR
(WE)
Data bus
Address bus
Figure 6.39 Example of Timing when Precharge Time after Self-Refreshing Is Extended
by 2 States
Refreshing and All-Module-Clocks-Stopped Mode: In this LSI, if the ACSE bit is set to 1 in
MSTPCRH, and then a SLEEP instruction is executed with the setting for all peripheral module
clocks to be stopped (MSTPCR = H'FFFF, EXMSTPCR = H'FFFF) or for operation of the 8-bit
timer module alone (MSTPCR = H'FFFE, EXMSTPCR = H'FFFF), and a transition is made to the
sleep state, the all-module-clocks-stopped mode is entered, in which the bus controller and I/O
port clocks are also stopped. As the bus controller clock is also stopped in this mode, CBR
refreshing is not executed. If DRAM is connected externally and DRAM data is to be retained in
sleep mode, the ACSE bit must be cleared to 0 in MSTPCRH.
6.6.13 DMAC Single Address Transfer Mode and DRAM Interface
When burst mode is selected on the DRAM interface, the DACK output timing can be selected
with the DDS bit in DRAMCR. When DRAM space is accessed in DMAC single address mode at
the same time, these bits select whether or not burst access is to be performed.
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When DDS = 1 : Burst access is performed by determining the address only, irrespective of the
bus master. With the DRAM interface, the DACK output goes low from the Tc1 state.
Figure 6.40 shows the DACK output timing for the DRAM interface when DDS = 1.
T
p
φ
RASn (CSn)
Read
Write
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
DACK
Address bus
T
r
T
c1
T
c2
Note: n = 2, 3
Row address Column address
High
High
Figure 6.40 Example of DACK Output Timing when DDS = 1 (RAST = 0, CAST = 0)
Section 6 Bus Controller (BSC)
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When DDS = 0 : When DRAM space is accessed in DMAC single address transfer mode, full
access (normal access) is always performed. With the DRAM interface, the DACK output goes
low from the Tr state.
In modes other than DMAC single address transfer mode, burst access can be used when
accessing DRAM space.
Figure 6.41 shows the DACK output timing for the DRAM interface when DDS = 0.
Tp
φ
RASn (CSn)
Read
Write
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
DACK
Address bus
TrTc1 Tc2
Note: n = 2, 3
Tc3
Row address Column address
High
High
Figure 6.41 Example of DACK Output Timing when DDS = 0 (RAST = 0, CAST = 1)
Section 6 Bus Controller (BSC)
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6.7 Burst ROM Interface
In this LSI, external address space areas 0 and 1 can be designated as burst ROM space, and burst
ROM interfacing performed. The burst ROM space enables ROM with burst access capability to
be accessed at high speed.
Areas 1 and 0 can be designated as burst ROM space by means of bits BSRM1 and BSRM0 in
BROMCR. Continuous burst accesses of 4, 8, 16, or 32 words can be performed, according to the
setting of the BSWD11 and BSWD10 bits in BROMCR. From 1 to 8 states can be selected for
burst access.
Settings can be made independently for area 0 and area 1.
In burst ROM space, burst access covers only CPU read accesses.
6.7.1 Basic Timing
The number of access states in the initial cycle (full access) on the burst ROM interface is
determined by the basic bus interface settings in ASTCR, ABWCR, WTCRA, WTCRB, and
CSACRH. When area 0 or area 1 is designated as burst ROM space, the settings in RDNCR and
CSACRL are ignored.
From 1 to 8 states can be selected for the burst cycle, according to the settings of bits BSTS02 to
BSTS00 and BSTS12 to BSTS10 in BROMCR. Wait states cannot be inserted. Burst access of up
to 32 words is performed, according to the settings of bits BSTS01, BSTS00, BSTS11, and
BSTS10 in BROMCR.
The basic access timing for burst ROM space is shown in figures 6.42 and 6.43.
Section 6 Bus Controller (BSC)
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T
1
Upper address bus
Lower address bus
φ
CSn
AS
Data bus
T
2
T
3
T
1
T
2
T
1
Full access
T
2
RD
Burst access
Note: n = 1, 0
Figure 6.42 Example of Burst ROM Access Timing
(ASTn = 1, 2-State Burst Cycle)
Section 6 Bus Controller (BSC)
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T
1
Upper address bus
Lower address bus
φ
CSn
AS
Data bus
T
2
T
1
T
1
Full access
RD
Burst access
Note: n = 1, 0
Figure 6.43 Example of Burst ROM Access Timing
(ASTn = 0, 1-State Burst Cycle)
6.7.2 Wait Control
As with the basic bus interface, either program wait insertion or pin wait insertion using the WAIT
pin can be used in the initial cycle (full access) on the burst ROM interface. See section 6.5.4,
Wait Control. Wait states cannot be inserted in a burst cycle.
6.7.3 Write Access
When a write access to burst ROM space is executed, burst access is interrupted at that point and
the write access is executed in line with the basic bus interface settings. Write accesses are not
performed in burst mode even though burst ROM space is designated.
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6.8 Idle Cycle
6.8.1 Operation
When this LSI accesses external address space, it can insert an idle cycle (Ti) between bus cycles
in the following three cases: (1) when read accesses in different areas occur consecutively, (2)
when a write cycle occurs immediately after a read cycle, and (3) when a read cycle occurs
immediately after a write cycle. Insertion of a 1-state or 2-state idle cycle can be selected with the
IDLC bit in BCR. By inserting an idle cycle it is possible, for example, to avoid data collisions
between ROM, etc., with a long output floating time, and high-speed memory, I/O interfaces, and
so on.
Consecutive Reads in Different Areas: If consecutive reads in different areas occur while the
ICIS1 bit is set to 1 in BCR, an idle cycle is inserted at the start of the second read cycle.
Figure 6.44 shows an example of the operation in this case. In this example, bus cycle A is a read
cycle for ROM with a long output floating time, and bus cycle B is a read cycle for SRAM, each
being located in a different area. In (a), an idle cycle is not inserted, and a collision occurs in bus
cycle B between the read data from ROM and that from SRAM. In (b), an idle cycle is inserted,
and a data collision is prevented.
T1
Address bus
φ
RD
Bus cycle A
Data bus
T2T3T1T2
Bus cycle B
Long output floating time Data collision
(a) No idle cycle insertion
(ICIS1 = 0)
T1
Address bus
φ
RD
Bus cycle A
Data bus
T2T3TiT1
Bus cycle B
(b) Idle cycle insertion
(ICIS1 = 1, initial value)
T2
CS (area A)
CS (area B)
CS (area A)
CS (area B)
Idle cycle
Figure 6.44 xample of Idle Cycle Operation
(Consecutive Reads in Different Areas)
Section 6 Bus Controller (BSC)
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Write after Read: If an external write occurs after an external read while the ICIS0 bit is set to 1
in BCR, an idle cycle is inserted at the start of the write cycle.
Figure 6.45 shows an example of the operation in this case. In this example, bus cycle A is a read
cycle for ROM with a long output floating time, and bus cycle B is a CPU write cycle. In (a), an
idle cycle is not inserted, and a collision occurs in bus cycle B between the read data from ROM
and the CPU write data. In (b), an idle cycle is inserted, and a data collision is prevented.
T1
Address bus
φ
RD
Bus cycle A
Data bus
T2T3T1T2
Bus cycle B
Long output floating time Data collision
(a) No idle cycle insertion
(ICIS0 = 0)
T1
Address bus
φ
RD
Bus cycle A
Data bus
T2T3T1
Bus cycle B
(b) Idle cycle insertion
(ICIS0 = 1, initial value)
T2
HWR
HWR
CS (area A)
CS (area B)
CS (area A)
CS (area B)
Idle cycle
Ti
Figure 6.45 Example of Idle Cycle Operation (Write after Read)
Read after Write: If an external read occurs after an external write while the ICIS2 bit is set to 1
in BCR, an idle cycle is inserted at the start of the read cycle.
Figure 6.46 shows an example of the operation in this case. In this example, bus cycle A is a CPU
write cycle and bus cycle B is a read cycle from an external device. In (a), an idle cycle is not
inserted, and a collision occurs in bus cycle B between the CPU write data and read data from an
external device. In (b), an idle cycle is inserted, and a data collision is prevented.
Section 6 Bus Controller (BSC)
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T
1
Address bus
φ
RD
Bus cycle A
Data bus
T
2
T
3
T
1
T
2
Bus cycle B
Long output floating time Data collision
(a) No idle cycle insertion
(ICIS2 = 0)
T
1
Address bus
φ
RD
Bus cycle A
Data bus
T
2
T
3
T
1
Bus cycle B
(b) Idle cycle insertion
(ICIS2 = 1, initial value)
T
2
HWR
HWR, LWR
CS (area A)
CS (area B)
CS (area A)
CS (area B)
Idle cycle
T
i
Figure 6.46 Example of Idle Cycle Operation (Read after Write)
Relationship between Chip Select (CS) Signal and Read (RD) Signal: Depending on the
system’s load conditions, the RD signal may lag behind the CS signal. An example is shown in
figure 6.47. In this case, with the setting for no idle cycle insertion (a), there may be a period of
overlap between the bus cycle A RD signal and the bus cycle B CS signal. Setting idle cycle
insertion, as in (b), however, will prevent any overlap between the RD and CS signals. In the
initial state after reset release, idle cycle insertion (b) is set.
Section 6 Bus Controller (BSC)
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T
1
Address bus
φ
RD
Bus cycle A
T
2
T
3
T
1
T
2
Bus cycle B
Overlap period between CS (area B)
and RD may occur
(a) No idle cycle insertion
(ICIS1 = 0)
T
1
Address bus
Idle cycle
φ
Bus cycle A
T
2
T
3
T
i
T
1
Bus cycle B
(b) Idle cycle insertion
(ICIS1 = 1, initial value)
T
2
CS (area A)
CS (area B)
RD
CS (area A)
CS (area B)
Figure 6.47 Relationship between Chip Select (CS) and Read (RD)
Idle Cycle in Case of DRAM Space Access after Normal Space Access: In a DRAM space
access following a normal space access, the settings of bits ICIS2, ICIS1, ICIS0, and IDLC in
BCR are valid. However, in the case of consecutive reads in different areas, for example, if the
second read is a full access to DRAM space, only a Tp cycle is inserted, and a Ti cycle is not. The
timing in this case is shown in figure 6.48.
T1
Address bus
φ
RD
External read
Data bus
T2T3TpTr
DRAM space read
Tc1 Tc2
Figure 6.48 Example of DRAM Full Access after External Read
(CAST = 0)
Section 6 Bus Controller (BSC)
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In burst access in RAS down mode, the settings of bits ICIS2, ICIS1, ICIS0, and IDLC are valid
and an idle cycle is inserted. The timing in this case is illustrated in figures 6.49 and 6.50.
Tp
Address bus
φ
RD
RAS
UCAS, LCAS
External read
Idle cycle
Data bus
TrTc1 Tc2 T1
DRAM space readDRAM space read
T2Tc2
T3TiTc1
Figure 6.49 Example of Idle Cycle Operation in RAS Down Mode
(Consecutive Reads in Different Areas) (IDLC = 0, RAST = 0, CAST = 0)
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T
p
Address bus
φ
RD
RAS
HWR
UCAS, LCAS
External read
Idle cycle
Data bus
T
r
T
c1
T
c2
T
1
DRAM space writeDRAM space read
T
2
T
c2
T
3
T
i
T
c1
Figure 6.50 Example of Idle Cycle Operation in RAS Down Mode
(Write after Read) (IDLC = 0, RAST = 0, CAST = 0)
Idle Cycle in Case of Normal Space Access after DRAM Space Access:
• Normal space access after DRAM space read access
While the DRMI bit is cleared to 0 in DRACCR, idle cycle insertion after DRAM space access
is disabled. Idle cycle insertion after DRAM space access can be enabled by setting the DRMI
bit to 1. The conditions and number of states of the idle cycle to be inserted are in accordance
with the settings of bits ICIS1, ICIS0, and IDLC in BCR are valid. Figures 6.51 and 6.52 show
examples of idle cycle operation when the DRMI bit is set to 1.
When the DRMI bit is cleared to 0, an idle cycle is not inserted after DRAM space access even
if bits ICIS1 and ICIS0 are set to 1.
Section 6 Bus Controller (BSC)
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T
p
Address bus
φ
RD
RAS
UCAS, LCAS
External address space read
Idle cycle
Data bus
T
r
T
c1
T
c2
T
1
DRAM space readDRAM space read
T
2
T
c2
T
3
T
i
T
i
T
c1
Figure 6.51 Example of Idle Cycle Operation after DRAM Access
(Consecutive Reads in Different Areas) (IDLC = 0, RAST = 0, CAST = 0)
T
p
Address bus
φ
RD
RAS
HWR, LWR
UCAS, LCAS
External address space write
Idle cycle
Data bus
T
r
T
c1
T
c2
T
1
DRAM space readDRAM space read
T
2
T
c2
T
3
T
i
T
c1
Figure 6.52 Example of Idle Cycle Operation after DRAM Access
(Write after Read) (IDLC = 0, RAST = 0, CAST = 0)
Section 6 Bus Controller (BSC)
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• Normal space access after DRAM space write access
While the ICIS2 bit is set to 1 in BCR and a normal space read access occurs after DRAM
space write access, idle cycle is inserted in the first read cycle. The number of states of the idle
cycle to be inserted is in accordance with the setting of the IDLC bit. It does not depend on the
DRMI bit in DRACCR. Figure 6.53 shows an example of idle cycle operation when the ICIS2
bit is set to 1.
T
p
Address bus
φ
RD
RAS
HWR, LWR
UCAS, LCAS
External space read
Idle cycle
Data bus
T
r
T
c1
T
c2
T
1
DRAM space readDRAM space read
T
2
T
c2
T
3
T
i
T
c1
Figure 6.53 Example of Idle Cycle Operation after DRAM Write Access
(IDLC = 0, ICIS1 = 0, RAST = 0, CAST = 0)
Section 6 Bus Controller (BSC)
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Table 6.7 shows whether an idle cycle is inserted or not in mixed access to normal space and
DRAM.
Table 6.7 Idle Cycles in Mixed Accesses to Normal Space and DRAM
Previous Access Next Access ICIS2 ICIS1 ICIS0 DRMI IDLC Idle cycle
— 0 — — — Disabled
— 1 — — 0 1 state inserted
Normal space read
(different area)
1 2 states inserted
— 0 — — — Disabled
— 1 — — 0 1 state inserted
DRAM/ space read
1 2 states inserted
— — 0 — — Disabled
— — 1 — 0 1 state inserted
Normal space write
1 2 states inserted
— — 0 — — Disabled
— — 1 — 0 1 state inserted
Normal space read
DRAM/ space write
1 2 states inserted
DRAM/ space read — 0 — — — Disabled
— 1 — 0 — Disabled
1 0 1 state inserted
Normal space read
1 2 states inserted
— 0 — — — Disabled
— 1 — 0 — Disabled
1 0 1 state inserted
DRAM/ space read
1 2 states inserted
— — 0 — — Disabled
— — 1 0 — Disabled
1 0 1 state inserted
Normal space write
1 2 states inserted
DRAM/ space write — — 0 — — Disabled
— — 1 0 — Disabled
1 0 1 state inserted
1 2 states inserted
Section 6 Bus Controller (BSC)
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Previous Access Next Access ICIS2 ICIS1 ICIS0 DRMI IDLC Idle cycle
0 — — — — Disabled
1 — — — 0 1 state inserted
Normal space read
1 2 states inserted
0 — — — — Disabled
1 — — — 0 1 state inserted
Normal space write
DRAM/ space read
1 2 states inserted
DRAM/ space write 0 — — — — Disabled
1 — — — 0 1 state inserted
Normal space read
1 2 states inserted
DRAM/ space read 0 — — — — Disabled
1 — — — 0 1 state inserted
1 2 states inserted
Setting the DRMI bit in DRACCR to 1 enables an idle cycle to be inserted in the case of
consecutive read and write operations in DRAM/ space burst access. Figures 6.54 shows an
example of the timing for idle cycle insertion in the case of consecutive read and write accesses to
DRAM/continuous synchronous DRAM space.
Section 6 Bus Controller (BSC)
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T
p
Address bus
Idle cycle
Data bus
T
r
T
c1
T
c2
DRAM space writeDRAM space read
T
c2
T
i
T
c1
RASn (CSn)
UCAS, LCAS
HWR
OE (RD)
Note: n = 2, 3
φ
Figure 6.54 Example of Timing for Idle Cycle Insertion in Case of Consecutive Read and
Write Accesses to DRAM Space in RAS Down Mode
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6.8.2 Pin States in Idle Cycle
Table 6.8 shows the pin states in an idle cycle.
Table 6.8 Pin States in Idle Cycle
Pins Pin State
A23 to A0 Contents of following bus cycle
D15 to D0 High impedance
CSn (n = 7 to 0) High*1*2
UCAS, LCAS High*2
AS High
RD High
OE High
HWR, LWR High
DACKn (n = 1, 0) High
Notes: 1. Remains low in DRAM space RAS down mode.
2. Remains low in a DRAM space refresh cycle.
6.9 Write Data Buffer Function
This LSI has a write data buffer function for the external data bus. Using the write data buffer
function enables external writes and DMA single address mode transfers to be executed in parallel
with internal accesses. The write data buffer function is made available by setting the WDBE bit
to 1 in BCR.
Figure 6.55 shows an example of the timing when the write data buffer function is used. When this
function is used, if an external address space write or DMA single address mode transfer continues
for two states or longer, and there is an internal access next, an external write only is executed in
the first state, but from the next state onward an internal access (on-chip memory or internal I/O
register read/write) is executed in parallel with the external address space write rather than waiting
until it ends.
Section 6 Bus Controller (BSC)
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T1
Internal address bus
A23 to A0
φ
External write cycle
HWR, LWR
T2TWTWT3
On-chip memory read Internal I/O register read
Internal read signal
CSn
D15 to D0
External address
Internal memory
External space
write
Internal I/O register address
Figure 6.55 Example of Timing when Write Data Buffer Function is Used
Section 6 Bus Controller (BSC)
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6.10 Bus Release
This LSI can release the external bus in response to a bus request from an external device. In the
external bus released state, internal bus masters continue to operate as long as there is no external
access. If any of the following requests are issued in the external bus released state, the BREQO
signal can be driven low to output a bus request externally.
• When an internal bus master wants to perform an external access
• When a refresh request is generated
• When a SLEEP instruction is executed to place the chip in software standby mode or all-
module-clocks-stopped mode
6.10.1 Operation
In externally expanded mode, the bus can be released to an external device by setting the BRLE
bit to 1 in BCR. Driving the BREQ pin low issues an external bus request to this LSI. When the
BREQ pin is sampled, at the prescribed timing the BACK pin is driven low, and the address bus,
data bus, and bus control signals are placed in the high-impedance state, establishing the external
bus released state.
In the external bus released state, internal bus masters can perform accesses using the internal bus.
When an internal bus master wants to make an external access, it temporarily defers initiation of
the bus cycle, and waits for the bus request from the external bus master to be canceled. If a
refresh request is generated in the external bus released state, or if a SLEEP instruction is executed
to place the chip in software standby mode or all-module-clocks-stopped mode, refresh control
and software standby or all-module-clocks-stopped control is deferred until the bus request from
the external bus master is canceled.
If the BREQOE bit is set to 1 in BCR, the BREQO pin can be driven low when any of the
following requests are issued, to request cancellation of the bus request externally.
• When an internal bus master wants to perform an external access
• When a refresh request is generated
• When a SLEEP instruction is executed to place the chip in software standby mode or all-
module-clocks-stopped mode
When the BREQ pin is driven high, the BACK pin is driven high at the prescribed timing and the
external bus released state is terminated.
If an external bus release request and external access occur simultaneously, the order of priority is
as follows:
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(High) External bus release > External access by internal bus master (Low)
If a refresh request and external bus release request occur simultaneously, the order of priority is
as follows:
(High) Refresh > External bus release (Low)
6.10.2 Pin States in External Bus Released State
Table 6.9 shows pin states in the external bus released state.
Table 6.9 Pin States in Bus Released State
Pins Pin State
A23 to A0 High impedance
D15 to D0 High impedance
CSn (n = 7 to 0) High impedance
UCAS, LCAS High impedance
AS High impedance
RD High impedance
OE High impedance
HWR, LWR High impedance
DACKn (n = 1, 0) High
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6.10.3 Transition Timing
Figure 6.56 shows the timing for transition to the bus released state.
CPU
cycle
External bus released state
External space
access cycle
T
1
T
2
φ
Address bus
HWR, LWR
BREQ
BACK
BREQO
High impedance
High impedance
High impedance
High impedance
High impedance
[1] [2] [3] [5][4] [6] [7] [8]
[1] Low level of BREQ signal is sampled at rise of φ.
[2] Bus control signal returns to be high at end of external space access cycle.
At least one state from sampling of BREQ signal.
[3] BACK signal is driven low, releasing bus to external bus master.
[4] BREQ signal state is also sampled in external bus released state.
[5] High level of BREQ signal is sampled.
[6] BACK signal is driven high, ending external bus release cycle.
[7] When there is external access or refresh request of internal bus master during external
bus release while BREQOE bit is set to 1, BREQO signal goes low.
[8] Normally BREQO signal goes high 1.5 states after rising edge of BACK signal.
Note: However that if BREQO is asserted by a CBR refresh request, BREQO signal is
kept low until a CBR refresh cycle starts.
Data bus
AS
RD
Figure 6.56 Bus Released State Transition Timing
Section 6 Bus Controller (BSC)
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6.11 Bus Arbitration
This LSI has a bus arbiter that arbitrates bus master operations (bus arbitration).
There are three bus masters—the CPU, DTC, and DMAC—which perform read/write operations
when they have possession of the bus. Each bus master requests the bus by means of a bus request
signal. The bus arbiter determines priorities at the prescribed timing, and permits use of the bus by
means of a bus request acknowledge signal. The selected bus master then takes possession of the
bus and begins its operation.
6.11.1 Operation
The bus arbiter detects the bus masters’ bus request signals, and if the bus is requested, sends a
bus request acknowledge signal to the bus master. If there are bus requests from more than one
bus master, the bus request acknowledge signal is sent to the one with the highest priority. When a
bus master receives the bus request acknowledge signal, it takes possession of the bus until that
signal is canceled.
The order of priority of the bus masters is as follows:
(High) DMAC > DTC > CPU (Low)
An internal bus access by internal bus masters and external bus release, a refresh when the CBRM
bit is 0 can be executed in parallel.
If an external bus release request, a refresh request, and an external access by an internal bus
master occur simultaneously, the order of priority is as follows:
(High) Refresh > External bus release (Low)
(High) External bus release > External access by internal bus master (Low)
As a refresh when the CBRM bit in REFCR is cleared to 0 and an external access other than to
DRAM space by an internal bus master can be executed simultaneously, there is no relative order
of priority for these two operations.
Section 6 Bus Controller (BSC)
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6.11.2 Bus Transfer Timing
Even if a bus request is received from a bus master with a higher priority than that of the bus
master that has acquired the bus and is currently operating, the bus is not necessarily transferred
immediately. There are specific timings at which each bus master can relinquish the bus.
CPU: The CPU is the lowest-priority bus master, and if a bus request is received from the DTC,
or DMAC, the bus arbiter transfers the bus to the bus master that issued the request. The timing
for transfer of the bus is as follows:
• The bus is transferred at a break between bus cycles. However, if a bus cycle is executed in
discrete operations, as in the case of a longword-size access, the bus is not transferred between
the component operations.
• With bit manipulation instructions such as BSET and BCLR, the sequence of operations is:
data read (read), relevant bit manipulation operation (modify), write-back (write). The bus is
not transferred during this read-modify-write cycle, which is executed as a series of bus cycles.
• If the CPU is in sleep mode, the bus is transferred immediately.
DTC: The DTC sends the bus arbiter a request for the bus when an activation request is generated.
The DTC can release the bus after a vector read, a register information read (3 states), a single data
transfer, or a register information write (3 states). It does not release the bus during a register
information read (3 states), a single data transfer, or a register information write (3 states).
DMAC: The DMAC sends the bus arbiter a request for the bus when an activation request is
generated.
In the case of an external request in short address mode or normal mode, and in cycle steal mode,
the DMAC releases the bus after a single transfer.
In block transfer mode, it releases the bus after transfer of one block, and in burst mode, after
completion of the transfer. However, in the event of external bus release request, which have a
higher priority than the DMAC, the bus may be transferred to the bus master even if block or burst
transfer is in progress.
External Bus Release: When the BREQ pin goes low and an external bus release request is
issued while the BRLE bit is set to 1 in BCR, a bus request is sent to the bus arbiter.
External bus release can be performed on completion of an external bus cycle.
Section 6 Bus Controller (BSC)
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6.12 Bus Controller Operation in Reset
In a reset, this LSI, including the bus controller, enters the reset state immediately, and any
executing bus cycle is aborted.
6.13 Usage Notes
6.13.1 External Bus Release Function and All-Module-Clocks-Stopped Mode
In this LSI, if the ACSE bit is set to 1 in MSTPCR, and then a SLEEP instruction is executed with
the setting for all peripheral module clocks to be stopped (MSTPCR = H'FFFF, EXMSTPCR =
H'FFFF) or for operation of the 8-bit timer module alone (MSTPCR = H'FFFE, EXMSTPCR =
H'FFFF), and a transition is made to the sleep state, the all-module-clocks-stopped mode is entered
in which the clock is also stopped for the bus controller and I/O ports. In this state, the external
bus release function is halted. To use the external bus release function in sleep mode, the ACSE
bit in MSTPCR must be cleared to 0. Conversely, if a SLEEP instruction to place the chip in all-
module-clocks-stopped mode is executed in the external bus released state, the transition to all-
module-clocks-stopped mode is deferred and performed until after the bus is recovered.
6.13.2 External Bus Release Function and Software Standby
In this LSI, internal bus master operation does not stop even while the bus is released, as long as
the program is running in on-chip ROM, etc., and no external access occurs. If a SLEEP
instruction to place the chip in software standby mode is executed while the external bus is
released, the transition to software standby mode is deferred and performed after the bus is
recovered.
Also, since clock oscillation halts in software standby mode, if BREQ goes low in this mode,
indicating an external bus release request, the request cannot be answered until the chip has
recovered from the software standby state.
6.13.3 External Bus Release Function and CBR Refreshing
CBR refreshing cannot be executed while the external bus is released. Setting the BREQOE bit to
1 in BCR beforehand enables the BREQO signal to be output when a CBR refresh request is
issued.
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6.13.4 BREQO Output Timing
When the BREQOE bit is set to 1 and the BREQO signal is output, BREQO may go low before
the BACK signal.
This will occur if the next external access request or CBR refresh request occurs while internal bus
arbitration is in progress after the chip samples a low level of BREQ.
Section 7 DMA Controller (DMAC)
Rev.6.00 Mar. 18, 2009 Page 213 of 980
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Section 7 DMA Controller (DMAC)
This LSI has a built-in DMA controller (DMAC) which can carry out data transfer on up to 4
channels.
7.1 Features
• Choice of short address mode or full address mode
⎯ Short address mode
Maximum of 4 channels can be used
Dual address mode or single address mode can be selected
In dual address mode, one of the two addresses, transfer source and transfer destination, is
specified as 24 bits and the other as 16 bits
In single address mode, transfer source or transfer destination address only is specified as
24 bits
In single address mode, transfer can be performed in one bus cycle
Choice of sequential mode, idle mode, or repeat mode for dual address mode and single
address mode
⎯ Full address mode
Maximum of 2 channels can be used
Transfer source and transfer destination addresses as specified as 24 bits
Choice of normal mode or block transfer mode
• 16-Mbyte address space can be specified directly
• Byte or word can be set as the transfer unit
• Activation sources: internal interrupt, external request, auto-request (depending on transfer
mode)
Six 16-bit timer-pulse unit (TPU) compare match/input capture interrupts
Serial communication interface (SCI_0, SCI_1) transmission complete interrupt, reception
complete interrupt
A/D converter conversion end interrupt
External request
Auto-request
• Module stop mode can be set
DMAS260A_010020020100
Section 7 DMA Controller (DMAC)
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A block diagram of the DMAC is shown in figure 7.1.
Internal address bus
Address buffer
Processor
Internal interrupts
TGI0A
TGI1A
TGI2A
TGI3A
TGI4A
TGI5A
TXI0
RXI0
TXI1
RXI1
ADI
External pins
DREQ0
DREQ1
TEND0
TEND1
DACK0
DACK1
Interrupt signals
DMTEND0A
DMTEND0B
DMTEND1A
DMTEND1B
Control logic
DMAWER
DMACR1B
DMACR1A
DMACR0B
DMACR0A
DMATCR
DMABCR
Data buffer
Internal data bus
MAR_0AH
IOAR_0A
ETCR_0A
MAR_0BH
IOAR_0B
ETCR_0B
MAR_1AH
IOAR_1A
ETCR_1A
MAR_1BH
MAR_0AL
MAR_0BL
MAR_1AL
MAR_1BL
IOAR_1B
ETCR_1B
Legend:
DMAWER: DMA write enable register
DMATCR: DMA terminal control register
DMABCR: DMA band control register (for all channels)
DMACR: DMA control register
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer count register
Channel 0Channel 1
Channel 0AChannel 0BChannel 1AChannel 1B
Module data bus
Figure 7.1 Block Diagram of DMAC
Section 7 DMA Controller (DMAC)
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7.2 Input/Output Pins
Table 7.1 summarizes the pins of the interrupt controller.
Table 7.1 Pin Configuration
Channel Pin Name Symbol I/O Function
0 DMA request 0 DREQ0 Input Channel 0 external request
DMA transfer acknowledge 0 DACK0 Output Channel 0 single address
transfer acknowledge
DMA transfer end 0 TEND0 Output Channel 0 transfer end
1 DMA request 1 DREQ1 Input Channel 1 external request
DMA transfer acknowledge 1 DACK1 Output Channel 1 single address
transfer acknowledge
DMA transfer end 1 TEND1 Output Channel 1 transfer end
7.3 Register Descriptions
• Memory address register_0AH (MAR_0AH)
• Memory address register_0AL (MAR_0AL)
• I/O address register_0A (IOAR_0A)
• Transfer count register_0A (ECTR_0A)
• Memory address register_0BH (MAR_0BH)
• Memory address register_0BL (MAR_0BL)
• I/O address register_0B (IOAR_0B)
• Transfer count register_0B (ECTR_0B)
• Memory address register_1AH (MAR_1AH)
• Memory address register_1AL (MAR_1AL)
• I/O address register_1A (IOAR_1A)
• Transfer count register_1A (ETCR_1B)
• Memory address register_1BH (MAR_1BH)
• Memory address register_1BL (MAR_1BL)
• I/O address register_1B (IOAR_1B)
• Transfer count register_1B (ETCR_1B)
• DMA control register_0A (DMACR_0A)
• DMA control register_0B (DMACR_0B)
• DMA control register_1A (DMACR_1A)
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• DMA control register_1B (DMACR_1B)
• DMA band control register H (DMABCRH)
• DMA band control register L (DMABCRL)
• DMA write enable register (DMAWER)
• DMA terminal control register (DMATCR)
The functions of MAR, IOAR, ETCR, DMACR, and DMABCR differ according to the transfer
mode (short address mode or full address mode). The transfer mode can be selected by means of
the FAE1 and FAE0 bits in DMABCRH. The register configurations for short address mode and
full address mode of channel 0 are shown in table 7.2.
Table 7.2 Short Address Mode and Full Address Mode (Channel 0)
FAE0 Description
0 Short address mode specified (channels 0A and 0B operate independently)
Channel 0A
MAR_0AH Specifies transfer source/transfer destination address
Specifies transfer destination/transfer source address
Specifies number of transfers
Specifies transfer size, mode, activation source
Specifies transfer source/transfer destination address
Specifies transfer destination/transfer source address
Specifies number of transfers
Specifies transfer size, mode, activation source
IOAR_0A
ETCR_0A
DMACR_0A
Channel 0B
MAR_0BH
MAR_0AL
MAR_0BL
IOAR_0B
ETCR_0B
DMACR_0B
1 Full address mode specified (channels 0A and 0B operate in combination as channel 0)
Channel 0
MAR_0AH Specifies transfer source address
Specifies transfer destination address
Not used
Not used
Specifies number of transfers
Specifies number of transfers (used in block transfer
mode only)
Specifies transfer size, mode, activation source, etc.
IOAR_0A
ETCR_0A
DMACR_0A
MAR_0BH
MAR_0AL
MAR_0BL
IOAR_0B
ETCR_0B
DMACR_0B
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7.3.1 Memory Address Registers (MARA and MARB)
MAR is a 32-bit readable/writable register that specifies the source address (transfer source
address) or destination address (transfer destination address). MAR consists of two 16-bit registers
MARH and MARL. The upper 8 bits of MARH are reserved: they are always read as 0, and
cannot be modified.
The DMA has four MAR registers: MAR_0A in channel 0 (channel 0A), MAR_0B in channel 0
(channel 0B), MAR_1A in channel 1 (channel 1A), and MAR_1B in channel 1 (channel 1B).
MAR is not initialized by a reset or in standby mode.
Short Address Mode: In short address mode, MARA and MARB operate independently.
Whether MAR functions as the source address register or as the destination address register can be
selected by means of the DTDIR bit in DMACR.
MAR is incremented or decremented each time a byte or word transfer is executed, so that the
address specified by MAR is constantly updated.
Full Address Mode: In full address mode, MARA functions as the source address register, and
MARB as the destination address register.
MAR is incremented or decremented each time a byte or word transfer is executed, so that the
source or destination address is constantly updated.
7.3.2 I/O Address Registers (IOARA and IOARB)
IOAR is a 16-bit readable/writable register that specifies the lower 16 bits of the source address
(transfer source address) or destination address (transfer destination address). The upper 8 bits of
the transfer address are automatically set to H'FF.
The DMA has four IOAR registers: IOAR_0A in channel 0 (channel 0A), IOAR_0B in channel 0
(channel 0B), IOAR_1A in channel 1 (channel 1A), and IOAR_1B in channel 1 (channel 1B).
Whether IOAR functions as the source address register or as the destination address register can
be selected by means of the DTDIR bit in DMACR.
IOAR is not incremented or decremented each time a data transfer is executed, so the address
specified by IOAR is fixed.
IOAR is not initialized by a reset or in standby mode.
IOAR can be used in short address mode but not in full address mode.
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7.3.3 Execute Transfer Count Registers (ETCRA and ETCRB)
ETCR is a 16-bit readable/writable register that specifies the number of transfers.
The DMA has four ETCR registers: ETCR_0A in channel 0 (channel 0A), ETCR_0B in channel 0
(channel 0B), ETCR_1A in channel 1 (channel 1A), and ETCR_1B in channel 1 (channel 1B).
ETCR is not initialized by a reset or in standby mode.
Short Address Mode: The function of ETCR in sequential mode and idle mode differs from that
in repeat mode.
In sequential mode and idle mode, ETCR functions as a 16-bit transfer counter. ETCR is
decremented by 1 each time a transfer is performed, and when the count reaches H'00, the DTE bit
in DMABCRL is cleared, and transfer ends.
In repeat mode, ETCRL functions as an 8-bit transfer counter and ETCRH functions as a transfer
count holding register. ETCRL is decremented by 1 each time a transfer is performed, and when
the count reaches H'00, ETCRL is loaded with the value in ETCRH. At this point, MAR is
automatically restored to the value it had when the count was started. The DTE bit in DMABCRL
is not cleared, and so transfers can be performed repeatedly until the DTE bit is cleared by the
user.
Full Address Mode: The function of ETCR in normal mode differs from that in block transfer
mode.
In normal mode, ETCRA functions as a 16-bit transfer counter. ETCRA is decremented by 1 each
time a data transfer is performed, and transfer ends when the count reaches H'0000. ETCRB is not
used in normal mode.
In block transfer mode, ETCRAL functions as an 8-bit block size counter and ETCRAH functions
as a block size holding register. ETCRAL is decremented by 1 each time a 1-byte or 1-word
transfer is performed, and when the count reaches H'00, ETCRAL is loaded with the value in
ETCRAH. So by setting the block size in ETCRAH and ETCRAL, it is possible to repeatedly
transfer blocks consisting of any desired number of bytes or words.
In block transfer mode, ETCRB functions as a 16-bit block transfer counter. ETCRB is
decremented by 1 each time a block is transferred, and transfer ends when the count reaches
H'0000.
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7.3.4 DMA Control Registers (DMACRA and DMACRB)
DMACR controls the operation of each DMAC channel.
The DMA has four DMACR registers: DMACR_0A in channel 0 (channel 0A), DMACR_0B in
channel 0 (channel 0B), DMACR_1A in channel 1 (channel 1A), and DMACR_1B in channel 1
(channel 1B).
In short address mode, channels A and B operate independently, and in full address mode,
channels A and B operate together. The bit functions in the DMACR registers differ according to
the transfer mode.
Short Address Mode:
• DMACR_0A, DMACR_0B, DMACR_1A, and DMARC_1B
Bit Bit Name Initial Value R/W Description
7 DTSZ 0 R/W Data Transfer Size
Selects the size of data to be transferred at one
time.
0: Byte-size transfer
1: Word-size transfer
6 DTID 0 R/W Data Transfer Increment/Decrement
Selects incrementing or decrementing of MAR
after every data transfer in sequential mode or
repeat mode. In idle mode, MAR is neither
incremented nor decremented.
0: MAR is incremented after a data transfer
• When DTSZ = 0, MAR is incremented by 1
• When DTSZ = 1, MAR is incremented by 2
1: MAR is decremented after a data transfer
• When DTSZ = 0, MAR is decremented by 1
• When DTSZ = 1, MAR is decremented by 2
5 RPE 0 R/W Repeat Enable
Used in combination with the DTIE bit in
DMABCR to select the mode (sequential, idle, or
repeat) in which transfer is to be performed.
• When DTIE = 0 (no transfer end interrupt)
0: Transfer in sequential mode
1: Transfer in repeat mode
• When DTIE = 1 (with transfer end interrupt)
0: Transfer in sequential mode
1: Transfer in idle mode
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Bit Bit Name Initial Value R/W Description
4 DTDIR 0 R/W Data Transfer Direction
Used in combination with the SAE bit in
DMABCR to specify the data transfer direction
(source or destination). The function of this bit is
therefore different in dual address mode and
single address mode.
• When SAE = 0
0: Transfer with MAR as source address and
IOAR as destination address
1: Transfer with IOAR as source address and
MAR as destination address
• When SAE = 1
0: Transfer with MAR as source address and
DACK pin as write strobe
1: Transfer with DACK pin as read strobe and
MAR as destination address
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Bit Bit Name Initial Value R/W Description
3
2
1
0
DTF3
DTF2
DTF1
DTF0
0
0
0
0
R/W
R/W
R/W
R/W
Data Transfer Factor 3 to 0
These bits select the data transfer factor
(activation source). There are some
differences in activation sources for channel A
and channel B.
• Channel A
0000: Setting prohibited
0001: Activated by A/D converter conversion
end interrupt
0010: Setting prohibited
0011: Setting prohibited
0100: Activated by SCI channel 0 transmission
complete interrupt
0101: Activated by SCI channel 0 reception
complete interrupt
0110: Activated by SCI channel 1 transmission
complete interrupt
0111: Activated by SCI channel 1 reception
complete interrupt
1000: Activated by TPU channel 0 compare
match/input capture A interrupt
1001: Activated by TPU channel 1 compare
match/input capture A interrupt
1010: Activated by TPU channel 2 compare
match/input capture A interrupt
1011: Activated by TPU channel 3 compare
match/input capture A interrupt
1100: Activated by TPU channel 4 compare
match/input capture A interrupt
1101: Activated by TPU channel 5 compare
match/input capture A interrupt
1110: Setting prohibited
1111: Setting prohibited
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Bit Bit Name Initial Value R/W Description
3
2
1
0
DTF3
DTF2
DTF1
DTF0
0
0
0
0
R/W
R/W
R/W
R/W
• Channel B
0000: Setting prohibited
0001: Activated by A/D converter conversion
end interrupt
0010: Activated by DREQ pin falling edge input
(detected as a low level in the first transfer
after transfer is enabled)
0011: Activated by DREQ pin low-level input
0100: Activated by SCI channel 0 transmission
complete interrupt
0101: Activated by SCI channel 0 reception
complete interrupt
0110: Activated by SCI channel 1 transmission
complete interrupt
0111: Activated by SCI channel 1 reception
complete interrupt
1000: Activated by TPU channel 0 compare
match/input capture A interrupt
1001: Activated by TPU channel 1 compare
match/input capture A interrupt
1010: Activated by TPU channel 2 compare
match/input capture A interrupt
1011: Activated by TPU channel 3 compare
match/input capture A interrupt
1100: Activated by TPU channel 4 compare
match/input capture A interrupt
1101: Activated by TPU channel 5 compare
match/input capture A interrupt
1110: Setting prohibited
1111: Setting prohibited
The same factor can be selected for more than
one channel. In this case, activation starts with
the highest-priority channel according to the
relative channel priorities. For relative channel
priorities, see section 7.5.12, Multi-Channel
Operation.
Section 7 DMA Controller (DMAC)
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Full Address Mode:
• DMACR_0A and DMACR_1A
Bit Bit Name Initial Value R/W Description
15 DTSZ 0 R/W Data Transfer Size
Selects the size of data to be transferred at one
time.
0: Byte-size transfer
1: Word-size transfer
14
13
SAID
SAIDE
0
0
R/W
R/W
Source Address Increment/Decrement
Source Address Increment/Decrement Enable
These bits specify whether source address
register MARA is to be incremented,
decremented, or left unchanged, when data
transfer is performed.
00: MARA is fixed
01: MARA is incremented after a data transfer
• When DTSZ = 0, MARA is incremented by 1
• When DTSZ = 1, MARA is incremented by 2
10: MARA is fixed
11: MARA is decremented after a data transfer
• When DTSZ = 0, MARA is decremented by 1
• When DTSZ = 1, MARA is decremented by 2
12
11
BLKDIR
BLKE
0
0
R/W
R/W
Block Direction
Block Enable
These bits specify whether normal mode or
block transfer mode is to be used for data
transfer. If block transfer mode is specified, the
BLKDIR bit specifies whether the source side or
the destination side is to be the block area.
×0: Transfer in normal mode
01: Transfer in block transfer mode (destination
side is block area)
11: Transfer in block transfer mode (source side
is block area)
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Bit Bit Name Initial Value R/W Description
10
to
8
⎯ All 0 R/W Reserved
Though these bits can be read from or written to,
the write value should always be 0.
Legend:
×: Don't care
• DMACR_0B and DMACR_1B
Bit Bit Name Initial Value R/W Description
7 ⎯ 0 R/W Reserved
Though this bit can be read from or written to,
the write value should always be 0.
6
5
DAID
DAIDE
0
0
R/W
R/W
Destination Address Increment/Decrement
Destination Address Increment/Decrement
Enable
These bits specify whether destination address
register MARB is to be incremented,
decremented, or left unchanged, when data
transfer is performed.
00: MARB is fixed
01: MARB is incremented after a data transfer
• When DTSZ = 0, MARB is incremented by 1
• When DTSZ = 1, MARB is incremented by 2
10: MARB is fixed
11: MARB is decremented after a data transfer
• When DTSZ = 0, MARB is decremented by 1
• When DTSZ = 1, MARB is decremented by 2
4 — 0 R/W Reserved
Though this bit can be read from or written to,
the write value should always be 0.
3
2
1
0
DTF3
DTF2
DTF1
DTF0
0
0
0
0
R/W
R/W
R/W
R/W
Data Transfer Factor 3 to 0
These bits select the data transfer factor
(activation source). The factors that can be
specified differ between normal mode and block
transfer mode.
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Bit Bit Name Initial Value R/W Description
3
2
1
0
DTF3
DTF2
DTF1
DTF0
0
0
0
0
R/W
R/W
R/W
R/W
• Normal Mode
0000: Setting prohibited
0001: Setting prohibited
0010: Activated by DREQ pin falling edge input
(for the first transfer after data transfer is
enabled, activated by DREQ pin low-level
input)
0011: Activated by DREQ pin low-level input
010×: Setting prohibited
0110: Auto-request (cycle steal)
0111: Auto-request (burst)
1×××: Setting prohibited
• Block Transfer Mode
0000: Setting prohibited
0001: Activated by A/D converter conversion
end interrupt
0010: Activated by DREQ pin falling edge input
(for the first transfer after data transfer is
enabled, activated by DREQ pin low-level
input)
0011: Activated by DREQ pin low-level input
0100: Activated by SCI channel 0 transmission
complete interrupt
0101: Activated by SCI channel 0 reception
complete interrupt
0110: Activated by SCI channel 1 transmission
complete interrupt
0111: Activated by SCI channel 1 reception
complete interrupt
1000: Activated by TPU channel 0 compare
match/input capture A interrupt
1001: Activated by TPU channel 1 compare
match/input capture A interrupt
1010: Activated by TPU channel 2 compare
match/input capture A interrupt
1011: Activated by TPU channel 3 compare
match/input capture A interrupt
1100: Activated by TPU channel 4 compare
match/input capture A interrupt
1101: Activated by TPU channel 5 compare
match/input capture A interrupt
1110: Setting prohibited
1111: Setting prohibited
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Bit Bit Name Initial Value R/W Description
3
2
1
0
DTF3
DTF2
DTF1
DTF0
0
0
0
0
R/W
R/W
R/W
R/W
The same factor can be selected for more than
one channel. In this case, activation starts with
the highest-priority channel according to the
relative channel priorities. For relative channel
priorities, see section 7.5.12, Multi-Channel
Operation.
Legend:
×: Don't care
7.3.5 DMA Band Control Registers H and L (DMABCRH and DMABCRL)
DMABCR controls the operation of each DMAC channel. The bit functions in the DMACR
registers differ according to the transfer mode.
Short Address Mode:
• DMABCRH
Bit Bit Name Initial Value R/W Description
15 FAE1 0 R/W Full Address Enable 1
Specifies whether channel 1 is to be used in
short address mode or full address mode. In
short address mode, channels 1A and 1B can be
used as independent channels.
0: Short address mode
1: Full address mode
14 FAE0 0 R/W Full Address Enable 0
Specifies whether channel 0 is to be used in
short address mode or full address mode. In
short address mode, channels 0A and 0B can be
used as independent channels.
0: Short address mode
1: Full address mode
13 SAE1 0 R/W Single Address Enable 1
Specifies whether channel 1B is to be used for
transfer in dual address mode or single address
mode. This bit is invalid in full address mode.
0: Dual address mode
1: Single address mode
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Bit Bit Name Initial Value R/W Description
12 SAE0 0 R/W Single Address Enable 0
Specifies whether channel 0B is to be used for
transfer in dual address mode or single address
mode. This bit is invalid in full address mode.
0: Dual address mode
1: Single address mode
11
10
9
8
DTA1B
DTA1A
DTA0B
DTA0A
0
0
0
0
R/W
R/W
R/W
R/W
Data Transfer Acknowledge 1B
Data Transfer Acknowledge 1A
Data Transfer Acknowledge 0B
Data Transfer Acknowledge 0A
These bits enable or disable clearing when DMA
transfer is performed for the internal interrupt
source selected by the DTF3 to DTF0 bits in
DMACR.
It the DTA bit is set to 1 when DTE = 1, the
internal interrupt source is cleared automatically
by DMA transfer. When DTE = 1 and DTA = 1,
the internal interrupt source does not issue an
interrupt request to the CPU or DTC.
If the DTA bit is cleared to 0 when DTE = 1, the
internal interrupt source is not cleared when a
transfer is performed, and can issue an interrupt
request to the CPU or DTC in parallel. In this
case, the interrupt source should be cleared by
the CPU or DTC transfer.
When DTE = 0, the internal interrupt source
issues an interrupt request to the CPU or DTC
regardless of the DTA bit setting.
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• DMABCRL
Bit Bit Name Initial Value R/W Description
7
6
5
4
DTE1B
DTE1A
DTE0B
DTE0A
0
0
0
0
R/W
R/W
R/W
R/W
Data Transfer Enable 1B
Data Transfer Enable 1A
Data Transfer Enable 0B
Data Transfer Enable 0A
If the DTIE bit is set to 1 when DTE = 0, the
DMAC regards this as indicating the end of a
transfer, and issues a transfer end interrupt
request to the CPU or DTC.
When DTE = 0, data transfer is enabled and the
DMAC ignores the activation source selected by
the DTF3 to DTF0 bits in DMACR.
When DTE = 1, data transfer is enabled and the
DMAC waits for a request by the activation
source selected by the DTF3 to DTF0 bits in
DMACR. When a request is issued by the
activation source, DMA transfer is executed.
[Clearing conditions]
• When initialization is performed
• When the specified number of transfers have
been completed in a transfer mode other
than repeat mode
• When 0 is written to the DTE bit to forcibly
suspend the transfer, or for a similar reason
[Setting condition]
When 1 is written to the DTE bit after reading
DTE = 0
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Bit Bit Name Initial Value R/W Description
3
2
1
0
DTIE1B
DTIE1A
DTIE0B
DTIE0A
0
0
0
0
R/W
R/W
R/W
R/W
Data Transfer End Interrupt Enable 1B
Data Transfer End Interrupt Enable 1A
Data Transfer End Interrupt Enable 0B
Data Transfer End Interrupt Enable 0A
These bits enable or disable an interrupt to the
CPU or DTC when transfer ends. If the DTIE bit
is set to 1 when DTE = 0, the DMAC regards this
as indicating the end of a transfer, and issues a
transfer end interrupt request to the CPU or
DTC.
A transfer end interrupt can be canceled either
by clearing the DTIE bit to 0 in the interrupt
handling routine, or by performing processing to
continue transfer by setting the transfer counter
and address register again, and then setting the
DTE bit to 1.
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Full Address Mode:
• DMABCRH
Bit Bit Name Initial Value R/W Description
15 FAE1 0 R/W Full Address Enable 1
Specifies whether channel 1 is to be used in
short address mode or full address mode.
In full address mode, channels 1A and 1B are
used together as channel 1.
0: Short address mode
1: Full address mode
14 FAE0 0 R/W Full Address Enable 0
Specifies whether channel 0 is to be used in
short address mode or full address mode.
In full address mode, channels 0A and 0B are
used together as channel 0.
0: Short address mode
1: Full address mode
13,
12
— All 0 R/W
R/W
Reserved
Though these bits can be read from or written to,
the write value should always be 0.
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Bit Bit Name Initial Value R/W Description
11 DTA1 0 R/W Data Transfer Acknowledge 1
These bits enable or disable clearing when DMA
transfer is performed for the internal interrupt
source selected by the DTF3 to DTF0 bits in
DMACR of channel 1.
It the DTA1 bit is set to 1 when DTE1 = 1, the
internal interrupt source is cleared automatically
by DMA transfer. When DTE1 = 1 and DTA1 =
1, the internal interrupt source does not issue an
interrupt request to the CPU or DTC.
It the DTA1 bit is cleared to 0 when DTE1 = 1,
the internal interrupt source is not cleared when
a transfer is performed, and can issue an
interrupt request to the CPU or DTC in parallel.
In this case, the interrupt source should be
cleared by the CPU or DTC transfer.
When DTE1 = 0, the internal interrupt source
issues an interrupt request to the CPU or DTC
regardless of the DTA1 bit setting.
The state of the DTME1 bit does not affect the
above operations.
10 — 0 R/W Reserved
Though this bit can be read from or written to,
the write value should always be 0.
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Bit Bit Name Initial Value R/W Description
9 DTA0 0 R/W Data Transfer Acknowledge 0
These bits enable or disable clearing when DMA
transfer is performed for the internal interrupt
source selected by the DTF3 to DTF0 bits in
DMACR of channel 0.
It the DTA0 bit is set to 1 when DTE0 = 1, the
internal interrupt source is cleared automatically
by DMA transfer. When DTE0 = 1 and DTA0 =
1, the internal interrupt source does not issue an
interrupt request to the CPU or DTC.
It the DTA0 bit is cleared to 0 when DTE0 = 1,
the internal interrupt source is not cleared when
a transfer is performed, and can issue an
interrupt request to the CPU or DTC in parallel.
In this case, the interrupt source should be
cleared by the CPU or DTC transfer.
When DTE0 = 0, the internal interrupt source
issues an interrupt request to the CPU or DTC
regardless of the DTA0 bit setting.
The state of the DTME0 bit does not affect the
above operations.
8 — 0 R/W Reserved
Though this bit can be read from or written to,
the write value should always be 0.
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• DMABCRL
Bit Bit Name Initial Value R/W Description
7 DTME1 0 R/W Data Transfer Master Enable 1
Together with the DTE1 bit, this bit controls
enabling or disabling of data transfer on channel
1. When both the DTME1 bit and DTE1 bit are
set to 1, transfer is enabled for channel 1.
If channel 1 is in the middle of a burst mode
transfer when an NMI interrupt is generated, the
DTME1 bit is cleared, the transfer is interrupted,
and bus mastership passes to the CPU. When
the DTME1 bit is subsequently set to 1 again,
the interrupted transfer is resumed. In block
transfer mode, however, the DTME1 bit is not
cleared by an NMI interrupt, and transfer is not
interrupted.
[Clearing conditions]
• When initialization is performed
• When NMI is input in burst mode
• When 0 is written to the DTME1 bit
[Setting condition]
When 1 is written to DTME1 after reading
DTME1 = 0
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Bit Bit Name Initial Value R/W Description
6 DTE1 0 R/W Data Transfer Enable 1
Enables or disables DMA transfer for the
activation source selected by the DTF3 to DTF0
bits in DMACR of channel 1.
When DTE1 = 0, data transfer is disabled and
the activation source is ignored. If the activation
source is an internal interrupt, an interrupt
request is issued to the CPU or DTC. If the
DTIE1 bit is set to 1 when DTE1 = 0, the DMAC
regards this as indicating the end of a transfer,
and issues a transfer end interrupt request to the
CPU.
When DTE1 = 1 and DTME1 = 1, data transfer is
enabled and the DMAC waits for a request by
the activation source. When a request is issued
by the activation source, DMA transfer is
executed.
[Clearing conditions]
• When initialization is performed
• When the specified number of transfers have
been completed
• When 0 is written to the DTE1 bit to forcibly
suspend the transfer, or for a similar reason
[Setting condition]
When 1 is written to the DTE1 bit after reading
DTE1 = 0
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Bit Bit Name Initial Value R/W Description
5 DTME0 0 R/W Data Transfer Master Enable 0
Together with the DTE0 bit, this bit controls
enabling or disabling of data transfer on channel
0. When both the DTME0 bit and DTE0 bit are
set to 1, transfer is enabled for channel 0.
If channel 0 is in the middle of a burst mode
transfer when an NMI interrupt is generated, the
DTME0 bit is cleared, the transfer is interrupted,
and bus mastership passes to the CPU. When
the DTME0 bit is subsequently set to 1 again,
the interrupted transfer is resumed. In block
transfer mode, however, the DTME0 bit is not
cleared by an NMI interrupt, and transfer is not
interrupted.
[Clearing conditions]
• When initialization is performed
• When NMI is input in burst mode
• When 0 is written to the DTME0 bit
[Setting condition]
When 1 is written to DTME0 after reading
DTME0 = 0
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Bit Bit Name Initial Value R/W Description
4 DTE0 0 R/W Data Transfer Enable 0
Enables or disables DMA transfer for the
activation source selected by the DTF3 to DTF0
bits in DMACR of channel 0.
When DTE0 = 0, data transfer is disabled and
the activation source is ignored. If the activation
source is an internal interrupt, an interrupt
request is issued to the CPU or DTC. If the
DTIE0 bit is set to 1 when DTE0 = 0, the DMAC
regards this as indicating the end of a transfer,
and issues a transfer end interrupt request to the
CPU.
When DTE0 = 1 and DTME0 = 1, data transfer is
enabled and the DMAC waits for a request by
the activation source. When a request is issued
by the activation source, DMA transfer is
executed.
[Clearing conditions]
• When initialization is performed
• When the specified number of transfers have
been completed
• When 0 is written to the DTE0 bit to forcibly
suspend the transfer, or for a similar reason
[Setting condition]
When 1 is written to the DTE0 bit after reading
DTE0 = 0
3 DTIE1B 0 R/W Data Transfer Interrupt Enable 1B
Enables or disables an interrupt to the CPU or
DTC when transfer on channel 1 is interrupted.
When DTME1 is cleared to 0 while this bit is set
to 1, the DMAC regards this as indicating a
break in the transfer, and issues a transfer break
interrupt request to the CPU or DTC.
A transfer break interrupt can be canceled either
by clearing the DTIE1B bit to 0 in the interrupt
handling routine, or by performing processing to
continue transfer by setting the DTME1 bit to 1.
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Bit Bit Name Initial Value R/W Description
2 DTIE1A 0 R/W Data Transfer End Interrupt Enable 1A
Enables or disables an interrupt to the CPU or
DTC when transfer ends. When DTE1 is cleared
to 0 while this bit is set to 1, the DMAC regards
this as indicating the end of a transfer, and
issues a transfer end interrupt request to the
CPU or DTC.
A transfer end interrupt can be canceled either
by clearing the DTIE1A bit to 0 in the interrupt
handling routine, or by performing processing to
continue transfer by setting the transfer counter
and address register again, and then setting the
DTE1 bit to 1.
1 DTIE0B 0 R/W Data Transfer Interrupt Enable 0B
Enables or disables an interrupt to the CPU or
DTC when transfer on channel 1 is interrupted.
When DTME0 is cleared to 0 while this bit is set
to 1, the DMAC regards this as indicating a
break in the transfer, and issues a transfer break
interrupt request to the CPU or DTC.
A transfer break interrupt can be canceled either
by clearing the DTIE0B bit to 0 in the interrupt
handling routine, or by performing processing to
continue transfer by setting the DTME0 bit to 1.
0 DTIE0A 0 R/W Data Transfer End Interrupt Enable 0A
Enables or disables an interrupt to the CPU or
DTC when transfer ends. When DTE0 is cleared
to 0 while this bit is set to 1, the DMAC regards
this as indicating the end of a transfer, and
issues a transfer end interrupt request to the
CPU or DTC.
A transfer end interrupt can be canceled either
by clearing the DTIE0A bit to 0 in the interrupt
handling routine, or by performing processing to
continue transfer by setting the transfer counter
and address register again, and then setting the
DTE0 bit to 1.
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7.3.6 DMA Write Enable Register (DMAWER)
The DMAC can activate the DTC with a transfer end interrupt, rewrite the channel on which the
transfer ended using a DTC chain transfer, and then reactivate the DTC. DMAWER applies
restrictions for changing all bits of DMACR, and specific bits for DMATCR and DMABCR for
the specific channel, to prevent inadvertent rewriting of registers other than those for the channel
concerned. The restrictions applied by DMAWER are valid for the DTC.
Bit Bit Name Initial Value R/W Description
7
to
4
⎯ All 0 R Reserved
These bits are always read as 0 and cannot be
modified.
3 WE1B 0 R/W Write Enable 1B
Enables or disables writes to all bits in
DMACR1B, bits 11, 7, and 3 in DMABCR, and
bit 5 in DMATCR.
0: Writes are disabled
1: Writes are enabled
2 WE1A 0 R/W Write Enable 1A
Enables or disables writes to all bits in
DMACR1A, and bits 10, 6, and 2 in DMABCR.
0: Writes are disabled
1: Writes are enabled
1 WE0B 0 R/W Write Enable 0B
Enables or disables writes to all bits in
DMACR0B, bits 9, 5, and 1 in DMABCR, and
bit 4 in DMATCR.
0: Writes are disabled
1: Writes are enabled
0 WE0A 0 R/W Write Enable 0A
Enables or disables writes to all bits in
DMACR0A, and bits 8, 4, and 0 in DMABCR.
0: Writes are disabled
1: Writes are enabled
Figure 7.2 shows the transfer areas for activating the DTC with a channel 0A transfer end interrupt
request, and reactivating channel 0A. The address register and count register areas are set again
during the first DTC transfer, then the control register area is set again during the second DTC
Section 7 DMA Controller (DMAC)
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chain transfer. When re-setting the control register area, perform masking by setting bits in
DMAWER to prevent modification of the contents of other channels.
DTC
MAR_0A
IOAR_0A
ETCR_0A
MAR_0B
IOAR_0B
ETCR_0B
MAR_1A
IOAR_1A
ETCR_1A
MAR_1B
IOAR_1B
ETCR_1B
DMATCR
DMACR_0B
DMACR_1B
DMAWER
DMACR_0A
DMACR_1A
DMABCR
Second transfer area
using chain transfer
First transfer area
Figure 7.2 Areas for Register Re-Setting by DTC (Channel 0A)
Writes by the DTC to bits 15 to 12 (FAE and SAE) in DMABCR are invalid regardless of the
DMAWER settings. These bits should be changed, if necessary, by CPU processing.
In writes by the DTC to bits 7 to 4 (DTE) in DMABCR, 1 can be written without first reading 0.
To reactivate a channel set to full address mode, write 1 to both Write Enable A and Write Enable
B for the channel to be reactivated.
MAR, IOAR, and ETCR can always be written to regardless of the DMAWER settings. When
modifying these registers, the channel to be modified should be halted.
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7.3.7 DMA Terminal Control Register (DMATCR)
DMATCR controls enabling or disabling of output from the DMAC transfer end pin. A port can
be set for output automatically, and a transfer end signal output, by setting the appropriate bit.
In short address mode, the TEND pin is only available for channel B. The transfer end signal
indicates the transfer cycle in which the transfer counter has become 0 regardless of the transfer
source. Note however that the transfer end signal exceptionally indicates the transfer cycle in
which the block counter has become 0 in block transfer mode.
Bit Bit Name Initial Value R/W Description
7, 6 ⎯ All 0 ⎯ Reserved
These bits are always read as 0 and cannot be
modified.
5 TEE1 0 R/W Transfer End Enable 1
Enables or disables transfer end pin 1
(TEND1) output.
0: TEND1 pin output disabled
1: TEND1 pin output enabled
4 TEE0 0 R/W Transfer End Enable 0
Enables or disables transfer end pin 0
(TEND0) output.
0: TEND0 pin output disabled
1: TEND0 pin output enabled
3
to
0
⎯ 0 ⎯ Reserved
These bits are always read as 0 and cannot be
modified.
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7.4 Activation Sources
DMAC activation sources consist of internal interrupt requests, external requests, and auto-
requests. The DMAC activation sources that can be specified depend on the transfer mode and
channel, as shown in table 7.3.
Table 7.3 DMAC Activation Sources
Short Address Mode Full Address Mode
Activation Source
Channels
0A and 1A
Channels
0B and 1B
Normal
Mode
Block
Transfer
Mode
ADI Ο Ο X Ο
TXI0 Ο Ο X Ο
RXI0 Ο Ο X Ο
TXI1 Ο Ο X Ο
RXI1 Ο Ο X Ο
TGI0A Ο Ο X Ο
TGI1A Ο Ο X Ο
TGI2A Ο Ο X Ο
TGI3A Ο Ο X Ο
TGI4A Ο Ο X Ο
Internal
interrupts
TGI5A Ο Ο X Ο
DREQ pin falling edge input X Ο Ο Ο External
requests DREQ pin low-level input X Ο Ο Ο
Auto-request X X Ο X
Legend:
Ο: Can be specified
X: Cannot be specified
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7.4.1 Activation by Internal Interrupt Request
An interrupt request selected as a DMAC activation source can also simultaneously generate an
interrupt request for the CPU or DTC. For details, see section 5, Interrupt Controller.
With activation by an internal interrupt request, the DMAC accepts the interrupt request
independently of the interrupt controller. Consequently, interrupt controller priority settings are
irrelevant.
If the DMAC is activated by a CPU interrupt source or an interrupt request that is not used as a
DTC activation source (DTA = 1), the interrupt request flag is cleared automatically by the DMA
transfer. With ADI, TXI and RXI interrupts, however, the interrupt source flag is not cleared
unless the relevant register is accessed in a DMA transfer. If the same interrupt is used as an
activation source for more than one channel, the interrupt request flag is cleared when the highest-
priority channel is activated. Transfer requests for other channels are held pending in the DMAC,
and activation is carried out in order of priority.
When DTE = 0 after completion of a transfer, an interrupt request from the selected activation
source is not sent to the DMAC, regardless of the DTA bit setting. In this case, the relevant
interrupt request is sent to the CPU or DTC.
In case of overlap with a CPU interrupt source or DTC activation source (DTA = 0), the interrupt
request flag is not cleared by the DMAC.
7.4.2 Activation by External Request
If an external request (DREQ pin) is specified as a DMAC activation source, the relevant port
should be set to input mode in advance*. Level sensing or edge sensing can be used for external
requests.
External request operation in normal mode of short address mode or full address mode is
described below.
When edge sensing is selected, a byte or word is transferred each time a high-to-low transition is
detected on the DREQ pin. The next data transfer may not be performed if the next edge is input
before data transfer is completed.
When level sensing is selected, the DMAC stands by for a transfer request while the DREQ pin is
held high. While the DREQ pin is held low, transfers continue in succession, with the bus being
released each time a byte or word is transferred. If the DREQ pin goes high in the middle of a
transfer, the transfer is interrupted and the DMAC stands by for a transfer request.
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Note: * If the relevant port is set as an output pin for another function, DMA transfers using the
channel in question cannot be guaranteed.
7.4.3 Activation by Auto-Request
Auto-request is activated by register setting only, and transfer continues to the end. With auto-
request activation, cycle steal mode or burst mode can be selected.
In cycle steal mode, the DMAC releases the bus to another bus master each time a byte or word is
transferred. DMA and CPU cycles are usually repeated alternately. In burst mode, the DMAC
keeps possession of the bus until the end of the transfer so that transfer is performed continuously.
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7.5 Operation
7.5.1 Transfer Modes
Table 7.4 lists the DMAC transfer modes.
Table 7.4 DMAC Transfer Modes
Transfer Mode Transfer Source Remarks
Short
address
mode
Dual address mode
• 1-byte or 1-word transfer
for a single transfer
request
• Specifies the transfer
destination/source
address and performs
transfer in 2 bus cycles
(1) Sequential mode
• Memory address
incremented or
decremented by 1 or 2
• Number of transfers: 1 to
65,536
(2) Idle mode
• Memory address fixed
• Number of transfers: 1 to
65,536
(3) Repeat mode
• 1-byte or 1-word transfer
for a single transfer
request
• Memory address
incremented or
decremented by 1 or 2
• Continues transfer after
sending number of
transfers (1 to 256) and
restoring the initial value
• TPU channel 0 to 5
compare match/input
capture A interrupt
• SCI transmission
complete interrupt
• SCI reception
complete interrupt
• A/D converter
conversion end
interrupt
• External request
• Up to 4 channels can
operate independently
• External request
applies to channel B
only
• Single address mode
applies to channel B
only
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Transfer Mode Transfer Source Remarks
Short
address
mode
Single address mode
• 1-byte or 1-word transfer
for a single transfer
request
• 1-bus cycle transfer by
means of DACK pin
instead of using address
for specifying I/O
• Sequential mode, idle
mode, or repeat mode
can be specified
• TPU channel 0 to 5
compare match/input
capture A interrupt
• SCI transmission
complete interrupt
• SCI reception
complete interrupt
• A/D converter
conversion end
interrupt
• External request
• Up to 4 channels can
operate independently
• External request
applies to channel B
only
• Single address mode
applies to channel B
only
Normal mode
(1) Auto-request
• Transfer request is
internally held
• Number of transfers (1 to
65,536) is continuously
sent
• Burst/cycle steal transfer
can be selected
• Auto-request • Max. 2-channel
operation, combining
channels A and B
Full
address
mode
(2) External request
• 1-byte or 1-word transfer
for a single transfer
request
• Number of transfers: 1 to
65,536
• External request •
Block transfer mode
• Transfer of 1-block, size
selected for a single
transfer request
• Number of transfers: 1 to
65,536
• Source or destination can
be selected as block area
• Block size: 1 to 256 bytes
or word
• TPU channel 0 to 5
compare match/input
capture A interrupt
• SCI transmission
complete interrupt
• SCI reception
complete interrupt
• A/D converter
conversion end
interrupt
• External request
•
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7.5.2 Sequential Mode
Sequential mode can be specified by clearing the RPE bit in DMACR to 0. In sequential mode,
MAR is updated after each byte or word transfer in response to a single transfer request, and this is
executed the number of times specified in ETCR. One address is specified by MAR, and the other
by IOAR. The transfer direction can be specified by the DTDIR bit in DMACR.
Table 7.5 summarizes register functions in sequential mode.
Table 7.5 Register Functions in Sequential Mode
Function
Register DTDIR = 0 DTDIR = 1 Initial Setting Operation
23 0
MAR
Source
address
register
Destination
address
register
Start address of
transfer destination
or transfer source
Incremented/
decremented every
transfer
23 0
IOAR
15
H'FF
Destination
address
register
Source
address
register
Start address of
transfer source or
transfer destination
Fixed
015 ETCR
Transfer counter Number of transfers Decremented every
transfer; transfer
ends when count
reaches H'0000
MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is
incremented or decremented by 1 or 2 each time a byte or word is transferred. IOAR specifies the
lower 16 bits of the other address. The 8 bits above IOAR have a value of H'FF.
Figure 7.3 illustrates operation in sequential mode.
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Address T
Address B
Transfer IOAR
1 byte or word transfer performed in
response to 1 transfer request
Legend:
Address T = L
Address B = L + (–1)
DTID
· (2
DTSZ
· (N – 1))
Where : L = Value set in MAR
N = Value set in ETCR
Figure 7.3 Operation in Sequential Mode
The number of transfers is specified as 16 bits in ETCR. ETCR is decremented by 1 each time a
data transfer is executed, and when its value reaches H'0000, the DTE bit is cleared and data
transfer ends. If the DTIE bit is set to 1 at this time, an interrupt request is sent to the CPU or
DTC. The maximum number of transfers, when H'0000 is set in ETCR, is 65,536.
Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external
requests, SCI transmission complete and reception complete interrupts, and TPU channel 0 to 5
compare match/input capture A interrupts. External requests can only be specified for channel B.
Figure 7.4 shows an example of the setting procedure for sequential mode.
Section 7 DMA Controller (DMAC)
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Sequential mode setting
Set DMABCRH
Set transfer source
and transfer destination
addresses
Set number of transfers
Set DMACR
Read DMABCRL
Set DMABCRL
Sequential mode
[1]
[2]
[3]
[4]
[5]
[6]
[1] Set each bit in DMABCRH.
• Clear the FAE bit to 0 to select short address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address and transfer
destination address in MAR and IOAR.
[3] Set the number of transfers in ETCR.
[4] Set each bit in DMACR.
• Set the transfer data size with the DTSZ bit.
• Specify whether MAR is to be incremented or
decremented with the DTID bit.
• Clear the RPE bit to 0 to select sequential
mode.
• Specify the transfer direction with the DTDIR
bit.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
[6] Set each bit in DMABCRL.
• Specify enabling or disabling of transfer end
interrupts with the DTIE bit.
• Set the DTE bit to 1 to enable transfer.
Figure 7.4 Example of Sequential Mode Setting Procedure
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7.5.3 Idle Mode
Idle mode can be specified by setting the RPE bit in DMACR and DTIE bit in DMABCRL to 1. In
idle mode, one byte or word is transferred in response to a single transfer request, and this is
executed the number of times specified in ETCR. One address is specified by MAR, and the other
by IOAR. The transfer direction can be specified by the DTDIR bit in DMACR. Table 7.6
summarizes register functions in idle mode.
Table 7.6 Register Functions in Idle Mode
Function
Register DTDIR = 0 DTDIR = 1 Initial Setting Operation
23 0
MAR
Source
address
register
Destination
address
register
Start address of
transfer destination
or transfer source
Fixed
23 0
IOAR
15
H'FF
Destination
address
register
Source
address
register
Start address of
transfer source or
transfer destination
Fixed
015 ETCR
Transfer counter Number of transfers Decremented every
transfer; transfer
ends when count
reaches H'0000
MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is
neither incremented nor decremented by a data transfer. IOAR specifies the lower 16 bits of the
other address. The upper 8 bits of IOAR have a value of H'FF.
Figure 7.5 illustrates operation in idle mode.
Transfer IOAR
1 byte or word transfer performed in
response to 1 transfer request
MAR
Figure 7.5 Operation in Idle Mode
The number of transfers is specified as 16 bits in ETCR. ETCR is decremented by 1 each time a
transfer is executed, and when its value reaches H'0000, the DTE bit is cleared and data transfer
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ends. If the DTIE bit is set to 1 at this time, an interrupt request is sent to the CPU or DTC. The
maximum number of transfers, when H'0000 is set in ETCR, is 65,536.
Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external
requests, SCI transmission complete and reception complete interrupts, and TPU channel 0 to 5
compare match/input capture A interrupts. External requests can only be specified for channel B.
Figure 7.6 shows an example of the setting procedure for idle mode.
Section 7 DMA Controller (DMAC)
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Idle mode setting
Set DMABCRH
Set transfer source
and transfer destination
addresses
Set number of transfers
Set DMACR
Read DMABCRL
Set DMABCRL
Idle mode
[1]
[2]
[3]
[4]
[5]
[6]
[1] Set each bit in DMABCRH.
• Clear the FAE bit to 0 to select short address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address and transfer
destination address in MAR and IOAR.
[3] Set the number of transfers in ETCR.
[4] Set each bit in DMACR.
• Set the transfer data size with the DTSZ bit.
• Specify whether MAR is to be incremented or
decremented with the DTID bit.
• Set the RPE bit to 1.
• Specify the transfer direction with the DTDIR
bit.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
[6] Set each bit in DMABCRL.
• Set the DTIE bit to 1.
• Set the DTE bit to 1 to enable transfer.
Figure 7.6 Example of Idle Mode Setting Procedure
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7.5.4 Repeat Mode
Repeat mode can be specified by setting the RPE bit in DMACR to 1, and clearing the DTIE bit in
DMABCRL to 0. In repeat mode, MAR is updated after each byte or word transfer in response to
a single transfer request, and this is executed the number of times specified in ETCRL. On
completion of the specified number of transfers, MAR and ETCRL are automatically restored to
their original settings and operation continues. One address is specified by MAR, and the other by
IOAR. The transfer direction can be specified by the DTDIR bit in DMACR. Table 7.7
summarizes register functions in repeat mode.
Table 7.7 Register Functions in Repeat Mode
Function
Register DTDIR = 0 DTDIR = 1 Initial Setting Operation
23 0
MAR
Source
address
register
Destination
address
register
Start address of
transfer destination
or transfer source
Incremented/
decremented every
transfer.
Initial setting is
restored when value
reaches H'0000
23 0
IOAR
15
H'FF
Destination
address
register
Source
address
register
Start address of
transfer source or
transfer destination
Fixed
0
ETCRH
7
0
ETCRL
7
Holds number of
transfers
Transfer counter
Number of transfers
Number of transfers
Fixed
Decremented every
transfer.
Loaded with ETCRH
value when count
reaches H'00
MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is
incremented or decremented by 1 or 2 each time a byte or word is transferred. IOAR specifies the
lower 16 bits of the other address. The upper 8 bits of IOAR have a value of H'FF. The number of
transfers is specified as 8 bits by ETCRH and ETCRL. The maximum number of transfers, when
H'00 is set in both ETCRH and ETCRL, is 256.
In repeat mode, ETCRL functions as the transfer counter, and ETCRH is used to hold the number
of transfers. ETCRL is decremented by 1 each time a data transfer is executed, and when its value
reaches H'00, it is loaded with the value in ETCRH. At the same time, the value set in MAR is
Section 7 DMA Controller (DMAC)
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restored in accordance with the values of the DTSZ and DTID bits in DMACR. The MAR
restoration operation is as shown below.
MAR = MAR – (–1)DTID · 2DTSZ · ETCRH
The same value should be set in ETCRH and ETCRL.
In repeat mode, operation continues until the DTE bit in DMABCRL is cleared. To end the
transfer operation, therefore, the DTE bit should be cleared to 0. A transfer end interrupt request is
not sent to the CPU or DTC. By setting the DTE bit to 1 again after it has been cleared, the
operation can be restarted from the transfer after that terminated when the DTE bit was cleared.
Figure 7.7 illustrates operation in repeat mode.
Section 7 DMA Controller (DMAC)
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Address T
Address B
Transfer IOAR
1 byte or word transfer performed in
response to 1 transfer request
Legend:
Address T = L
Address B = L + (–1)
DTID
· (2
DTSZ
· (N – 1))
Where : L = Value set in MAR
N = Value set in ETCR
Figure 7.7 Operation in Repeat mode
Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external
requests, SCI transmission complete and reception complete interrupts, and TPU channel 0 to 5
compare match/input capture A interrupts. External requests can only be specified for channel B.
Figure 7.8 shows an example of the setting procedure for repeat mode.
Section 7 DMA Controller (DMAC)
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Repeat mode setting
Set DMABCRH
Set transfer source
and transfer destination
addresses
Set number of transfers
Set DMACR
Read DMABCRL
Set DMABCRL
Repeat mode
[1]
[2]
[3]
[4]
[5]
[6]
[1] Set each bit in DMABCRH.
• Clear the FAE bit to 0 to select short address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address and transfer
destination address in MAR and IOAR.
[3] Set the number of transfers in both ETCRH and
ETCRL.
[4] Set each bit in DMACR.
• Set the transfer data size with the DTSZ bit.
• Specify whether MAR is to be incremented or
decremented with the DTID bit.
• Set the RPE bit to 1.
• Specify the transfer direction with the DTDIR
bit.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
[6] Set each bit in DMABCRL.
• Clear the DTIE bit to 0.
• Set the DTE bit to 1 to enable transfer.
Figure 7.8 Example of Repeat Mode Setting Procedure
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7.5.5 Single Address Mode
Single address mode can only be specified for channel B. This mode can be specified by setting
the SAE bit in DMABCRH to 1 in short address mode.
One address is specified by MAR, and the other is set automatically to the data transfer
acknowledge pin (DACK). The transfer direction can be specified by the DTDIR bit in DMACR.
Table 7.8 summarizes register functions in single address mode.
Table 7.8 Register Functions in Single Address Mode
Function
Register DTDIR = 0 DTDIR = 1 Initial Setting Operation
23 0
MAR
Source
address
register
Destination
address
register
Start address of
transfer destination
or transfer source
See sections 7.5.2,
Sequential Mode,
7.5.3, Idle Mode, and
7.5.4, Repeat Mode.
DACK pin Write
strobe
Read
strobe
(Set automatically
by SAE bit; IOAR is
invalid)
Strobe for external
device
015 ETCR
Transfer counter Number of transfers See sections 7.5.2,
Sequential Mode,
7.5.3, Idle Mode, and
7.5.4, Repeat Mode.
MAR specifies the start address of the transfer source or transfer destination as 24 bits. IOAR is
invalid; in its place the strobe for external devices (DACK) is output.
Figure 7.9 illustrates operation in single address mode (when sequential mode is specified).
Section 7 DMA Controller (DMAC)
Rev.6.00 Mar. 18, 2009 Page 257 of 980
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Address T
Address B
Transfer DAC
K
1 byte or word transfer performed in
response to 1 transfer request
Legend:
Address T = L
Address B = L + (–1)DTID · (2DTSZ · (N – 1))
Where : L = Value set in MAR
N = Value set in ETCR
Figure 7.9 Operation in Single Address Mode (When Sequential Mode is Specified)
Figure 7.10 shows an example of the setting procedure for single address mode (when sequential
mode is specified).
Section 7 DMA Controller (DMAC)
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Single address
mode setting
Set DMABCRH
Set transfer source and
transfer destination
addresses
Set number of transfers
Set DMACR
Read DMABCRL
Set DMABCRL
Single address mode
[1]
[2]
[3]
[4]
[5]
[6]
[1] Set each bit in DMABCRH.
• Clear the FAE bit to 0 to select short address
mode.
• Set the SAE bit to 1 to select single address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address/transfer
destination address in MAR.
[3] Set the number of transfers in ETCR.
[4] Set each bit in DMACR.
• Set the transfer data size with the DTSZ bit.
• Specify whether MAR is to be incremented or
decremented with the DTID bit.
• Clear the RPE bit to 0 to select sequential
mode.
• Specify the transfer direction with the DTDIR
bit.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
[6] Set each bit in DMABCRL.
• Specify enabling or disabling of transfer end
interrupts with the DTIE bit.
• Set the DTE bit to 1 to enable transfer.
Figure 7.10 Example of Single Address Mode Setting Procedure (When Sequential Mode is
Specified)
Section 7 DMA Controller (DMAC)
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7.5.6 Normal Mode
In normal mode, transfer is performed with channels A and B used in combination. Normal mode
can be specified by setting the FAE bit in DMABCRH to 1 and clearing the BLKE bit in
DMACRA to 0. In normal mode, MAR is updated after data transfer of a byte or word in response
to a single transfer request, and this is executed the number of times specified in ETCRA. The
transfer source is specified by MARA, and the transfer destination by MARB. Table 7.9
summarizes register functions in normal mode.
Table 7.9 Register Functions in Normal Mode
Register Function Initial Setting Operation
23 0
MARA
Source address
register
Start address of
transfer source
Incremented/decremented
every transfer, or fixed
23 0
MARB
Destination
address register
Start address of
transfer destination
Incremented/decremented
every transfer, or fixed
015 ETCRA
Transfer counter Number of transfers Decremented every
transfer; transfer ends
when count reaches
H'0000
MARA and MARB specify the start addresses of the transfer source and transfer destination,
respectively, as 24 bits. MAR can be incremented or decremented by 1 or 2 each time a byte or
word is transferred, or can be fixed. Incrementing, decrementing, or holding a fixed value can be
set separately for MARA and MARB.
The number of transfers is specified by ETCRA as 16 bits. ETCRA is decremented by 1 each time
a transfer is performed, and when its value reaches H'0000 the DTE bit in DMABCRL is cleared
and transfer ends. If the DTIE bit in DMABCRL is set to 1 at this time, an interrupt request is sent
to the CPU or DTC. The maximum number of transfers, when H'0000 is set in ETCRA, is 65,536.
Figure 7.11 illustrates operation in normal mode.
Section 7 DMA Controller (DMAC)
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Address T
A
Address B
A
Transfer Address T
B
Legend:
Address
Address
Address
Address
Where :
Address B
B
= L
A
= L
B
= L
A
+ SAIDE · (–1)
SAID
· (2
DTSZ
· (N – 1))
= L
B
+ DAIDE · (–1)
DAID
· (2
DTSZ
· (N – 1))
= Value set in MARA
= Value set in MARB
= Value set in ETCRA
T
A
T
B
B
A
B
B
L
A
L
B
N
Figure 7.11 Operation in Normal Mode
Transfer requests (activation sources) are external requests and auto-requests. With auto-request,
the DMAC is only activated by register setting, and the specified number of transfers are
performed automatically. With auto-request, cycle steal mode or burst mode can be selected. In
cycle steal mode, the bus is released to another bus master each time a transfer is performed. In
burst mode, the bus is held continuously until transfer ends.
Figure 7.12 shows an example of the setting procedure for normal mode.
Section 7 DMA Controller (DMAC)
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Normal mode setting
Set DMABCRH
Set transfer source and
transfer destination
addresses
Set number of transfers
Set DMACR
Read DMABCRL
Set DMABCRL
Normal mode
[1]
[2]
[3]
[4]
[5]
[6]
[1] Set each bit in DMABCRH.
• Set the FAE bit to 1 to select full address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address in MARA, and
the transfer destination address in MARB.
[3] Set the number of transfers in ETCRA.
[4] Set each bit in DMACRA and DMACRB.
• Set the transfer data size with the DTSZ bit.
• Specify whether MARA is to be incremented,
decremented, or fixed, with the SAID and
SAIDE bits.
• Clear the BLKE bit to 0 to select normal
mode.
• Specify whether MARB is to be incremented,
decremented, or fixed, with the DAID and
DAIDE bits.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read DTE = 0 and DTME = 0 in DMABCRL.
[6] Set each bit in DMABCRL.
• Specify enabling or disabling of transfer end
interrupts with the DTIE bit.
• Set both the DTME bit and the DTE bit to 1 to
enable transfer.
Figure 7.12 Example of Normal Mode Setting Procedure
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7.5.7 Block Transfer Mode
In block transfer mode, data transfer is performed with channels A and B used in combination.
Block transfer mode can be specified by setting the FAE bit in DMABCRH and the BLKE bit in
DMACRA to 1. In block transfer mode, a data transfer of the specified block size is carried out in
response to a single transfer request, and this is executed for the number of times specified in
ETCRB. The transfer source is specified by MARA, and the transfer destination by MARB. Either
the transfer source or the transfer destination can be selected as a block area (an area composed of
a number of bytes or words). Table 7.10 summarizes register functions in block transfer mode.
Table 7.10 Register Functions in Block Transfer Mode
Register Function Initial Setting Operation
23 0
MARA
Source address
register
Start address of
transfer source
Incremented/decremented
every transfer, or fixed
23 0
MARB
Destination
address register
Start address of
transfer destination
Incremented/decremented
every transfer, or fixed
0
ETCRAH
7
0
ETCRAL
7
Holds block
size
Block size
counter
Block size
Block size
Fixed
Decremented every
transfer; ETCRH value
copied when count reaches
H'00
15 0
ETCRB
Block transfer
counter
Number of block
transfers
Decremented every block
transfer; transfer ends
when count reaches
H'0000
MARA and MARB specify the start addresses of the transfer source and transfer destination,
respectively, as 24 bits. MAR can be incremented or decremented by 1 or 2 each time a byte or
word is transferred, or can be fixed. Incrementing, decrementing, or holding a fixed value can be
set separately for MARA and MARB. Whether a block is to be designated for MARA or for
MARB is specified by the BLKDIR bit in DMACRA.
To specify the number of transfers, if M is the size of one block (where M = 1 to 256) and N
transfers are to be performed (where N = 1 to 65,536), M is set in both ETCRAH and ETCRAL,
and N in ETCRB.
Figure 7.13 illustrates operation in block transfer mode when MARB is designated as a block area.
Section 7 DMA Controller (DMAC)
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Address T
A
Address B
A
Transfer
Address T
B
Address B
B
1st block
2nd block
Nth block
Block area
Consecutive transfer
of M bytes or words
is performed in
response to one
request
Legend:
Address
Address
Address
Address
Where :
= L
A
= L
B
= L
A
+ SAIDE · (–1)
SAID
· (2
DTSZ
· (M·N – 1))
= L
B
+ DAIDE · (–1)
DAID
· (2
DTSZ
· (N – 1))
= Value set in MARA
= Value set in MARB
= Value set in ETCRB
= Value set in ETCRAH and ETCRAL
T
A
T
B
B
A
B
B
L
A
L
B
N
M
Figure 7.13 Operation in Block Transfer Mode (BLKDIR = 0)
Figure 7.14 illustrates operation in block transfer mode when MARA is designated as a block area.
Section 7 DMA Controller (DMAC)
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Address T
B
Address B
B
Transfer
Address T
A
Address B
A
1st block
2nd block
Nth block
Block area
Consecutive transfer
of M bytes or words
is performed in
response to one
request
Legend:
Address
Address
Address
Address
Where :
= L
A
= L
B
= L
A
+ SAIDE · (–1)
SAID
· (2
DTSZ
· (N – 1))
= L
B
+ DAIDE · (–1)
DAID
· (2
DTSZ
· (M·N – 1))
= Value set in MARA
= Value set in MARB
= Value set in ETCRB
= Value set in ETCRAH and ETCRAL
T
A
T
B
B
A
B
B
L
A
L
B
N
M
Figure 7.14 Operation in Block Transfer Mode (BLKDIR = 1)
ETCRAL is decremented by 1 each time a byte or word transfer is performed. In response to a
single transfer request, burst transfer is performed until the value in ETCRAL reaches H'00.
ETCRAL is then loaded with the value in ETCRAH. At this time, the value in the MAR register
for which a block designation has been given by the BLKDIR bit in DMACRA is restored in
accordance with the DTSZ, SAID/DAID, and SAIDE/DAIDE bits in DMACR.
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ETCRB is decremented by 1 after every block transfer, and when the count reaches H'0000 the
DTE bit in DMABCRL is cleared and transfer ends. If the DTIE bit in DMABCRL is set to 1 at
this point, an interrupt request is sent to the CPU or DTC.
Figure 7.15 shows the operation flow in block transfer mode.
Acquire bus
ETCRAL = ETCRAL – 1
Transfer request?
ETCRAL = H'00
Release bus
BLKDIR = 0
ETCRAL = ETCRAH
ETCRB = ETCRB – 1
ETCRB = H'0000
Start
(DTE = DTME = 1)
Read address specified by MARA
MARA = MARA + SAIDE·(–1)
SAID
·2
DTSZ
Write to address specified by MARB
MARB = MARB + DAIDE·(–1)
DAID
·2
DTSZ
MARB = MARB
–
DAIDE·(
–
1)
DAID
·2
DTSZ
·ETCRAH
MARA = MARA
–
SAIDE·(–1)
SAID
·2
DTSZ
·ETCRAH
No
Yes
No
Yes
No
Yes
No
Yes
Clear DTE bit to 0
to end transfer
Figure 7.15 Operation Flow in Block Transfer Mode
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Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external
requests, SCI transmission complete and reception complete interrupts, and TPU channel 0 to 5
compare match/input capture A interrupts.
Figure 7.16 shows an example of the setting procedure for block transfer mode.
Block transfer
mode setting
Set DMABCRH
Set transfer source
and transfer destination
addresses
Set number of transfers
Set DMACR
Read DMABCRL
Set DMABCRL
Block transfer mode
[1]
[2]
[3]
[4]
[5]
[6]
[1] Set each bit in DMABCRH.
• Set the FAE bit to 1 to select full address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address in MARA, and
the transfer destination address in MARB.
[3] Set the block size in both ETCRAH and
ETCRAL. Set the number of transfers in
ETCRB.
[4] Set each bit in DMACRA and DMACRB.
• Set the transfer data size with the DTSZ bit.
• Specify whether MARA is to be incremented,
decremented, or fixed, with the SAID and
SAIDE bits.
• Set the BLKE bit to 1 to select block transfer
mode.
• Specify whether the transfer source or the
transfer destination is a block area with the
BLKDIR bit.
• Specify whether MARB is to be incremented,
decremented, or fixed, with the DAID and
DAIDE bits.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read DTE = 0 and DTME = 0 in DMABCRL.
[6] Set each bit in DMABCRL.
• Specify enabling or disabling of transfer end
interrupts to the CPU with the DTIE bit.
• Set both the DTME bit and the DTE bit to 1 to
enable transfer.
Figure 7.16 Example of Block Transfer Mode Setting Procedure
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7.5.8 Basic Bus Cycles
An example of the basic DMAC bus cycle timing is shown in figure 7.17. In this example, word-
size transfer is performed from 16-bit, 2-state access space to 8-bit, 3-state access space. When
the bus is transferred from the CPU to the DMAC, a source address read and destination address
write are performed. The bus is not released in response to another bus request, etc., between
these read and write operations. As like CPU cycles, DMA cycles conform to the bus controller
settings.
The address is not output to the external address bus in an access to on-chip memory or an internal
I/O register.
Address bus
DMAC cycle (1-word transfer)
Source
address Destination address
CPU cycle CPU cycle
T
1
T
2
T
3
T
1
T
2
T
3
T
1
T
2
Figure 7.17 Example of DMA Transfer Bus Timing
7.5.9 DMA Transfer (Dual Address Mode) Bus Cycles
Short Address Mode: Figure 7.18 shows a transfer example in which TEND output is enabled
and byte-size short address mode transfer (sequential/idle/repeat mode) is performed from external
8-bit, 2-state access space to internal I/O space.
Section 7 DMA Controller (DMAC)
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DMA
read
φ
Address bus
RD
LWR
TEND
HWR
Bus release Last transfer
cycle
DMA
write DMA
dead
DMA
read DMA
write
DMA
read DMA
write
Bus release Bus release Bus
release
Figure 7.18 Example of Short Address Mode Transfer
A byte or word transfer is performed for a single transfer request, and after the transfer, the bus is
released. While the bus is released, one or more bus cycles are executed by the CPU or DTC.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
In repeat mode, when TEND output is enabled, TEND output goes low in the transfer end cycle.
Full Address Mode (Cycle Steal Mode): Figure 7.19 shows a transfer example in which TEND
output is enabled and word-size full address mode transfer (cycle steal mode) is performed from
external 16-bit, 2-state access space to external 16-bit, 2-state access space.
Section 7 DMA Controller (DMAC)
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DMA
read
φ
Address bus
RD
LWR
TEND
HWR
Bus release Last transfer
cycle
DMA
write DMA
read DMA
write DMA
read DMA
write DMA
dead
Bus release Bus release Bus
release
Figure 7.19 Example of Full Address Mode Transfer (Cycle Steal)
A byte or word transfer is performed for a single transfer request, and after the transfer, the bus is
released. While the bus is released, one bus cycle is executed by the CPU or DTC.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
Full Address Mode (Burst Mode): Figure 7.20 shows a transfer example in which TEND output
is enabled and word-size full address mode transfer (burst mode) is performed from external 16-
bit, 2-state access space to external 16-bit, 2-state access space.
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DMA
read
φ
Address bus
RD
LWR
TEND
HWR
Bus release
DMA
write DMA
dead
DMA
read DMA
write DMA
read DMA
write
Bus release
Burst transfer Last transfer cycle
Figure 7.20 Example of Full Address Mode Transfer (Burst Mode)
In burst mode, one-byte or one-word transfers are executed consecutively until transfer ends.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
If a request from another higher-priority channel is generated after burst transfer starts, that
channel has to wait until the burst transfer ends.
If an NMI interrupt is generated while a channel designated for burst transfer is in the transfer
enabled state, the DTME bit in DMABCRL is cleared and the channel is placed in the transfer
disabled state. If burst transfer has already been activated inside the DMAC, the bus is released on
completion of a one-byte or one-word transfer within the burst transfer, and burst transfer is
suspended. If the last transfer cycle of the burst transfer has already been activated inside the
DMAC, execution continues to the end of the transfer even if the DTME bit is cleared.
Full Address Mode (Block Transfer Mode): Figure 7.21 shows a transfer example in which
TEND output is enabled and word-size full address mode transfer (block transfer mode) is
performed from internal 16-bit, 1-state access space to external 16-bit, 2-state access space.
Section 7 DMA Controller (DMAC)
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DMA
read
φ
Address bus
RD
LWR
TEND
HWR
Bus release Block transfer Last block transfer
DMA
write DMA
read DMA
write DMA
dead DMA
read DMA
write DMA
read DMA
write DMA
dead
Bus
release
Bus release
Figure 7.21 Example of Full Address Mode Transfer (Block Transfer Mode)
A one-block transfer is performed for a single transfer request, and after the transfer the bus is
released. While the bus is released, one or more bus cycles are executed by the CPU or DTC.
In the transfer end cycle of each block (the cycle in which the transfer counter reaches 0), a one-
state DMA dead cycle is inserted after the DMA write cycle. Even if an NMI interrupt is
generated during data transfer, block transfer operation is not affected until data transfer for one
block has ended.
DREQ Pin Falling Edge Activation Timing: Set the DTA bit in DMABCRH to 1 for the channel
for which the DREQ pin is selected.
Figure 7.22 shows an example of normal mode transfer activated by the DREQ pin falling edge.
Section 7 DMA Controller (DMAC)
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DMA
read
φ
Address
bus
DREQ
Idle Write Idle
Bus release
DMA
control
Channel
Write Idle
Transfer source
Request
[1] [3][2] [4] [6][5] [7]
Acceptance resumes
Acceptance resumes
DMA
write Bus
release DMA
read DMA
write Bus
release
Request
Transfer destination
Transfer source
Transfer destination
Read Read
Request clear periodRequest clear period
Minimum
of 2 cycles Minimum
of 2 cycles
[1] Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of φ,
and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] Start of DMA cycle; DREQ pin high level sampling on the rising edge of φ starts.
[4] [7] When the DREQ pin high level has been sampled, acceptance is resumed after the write cycle
is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of φ, and the request is held.)
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7.22 Example of DREQ Pin Falling Edge Activated Normal Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the
request is cleared, and DREQ pin high level sampling for edge detection is started. If DREQ pin
high level sampling has been completed by the time the DMA write cycle ends, acceptance
resumes after the end of the write cycle, DREQ pin low level sampling is performed again, and
this operation is repeated until the transfer ends.
Figure 7.23 shows an example of block transfer mode transfer activated by the DREQ pin falling
edge.
Section 7 DMA Controller (DMAC)
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DMA
read
φ
Address
bus
DREQ
Idle Write
Bus release
DMA
control
Channel
Write
Transfer source
Request
[1] [3][2] [4] [6][5] [7]
Acceptance resumes
DMA
dead
1 block transfer
IdleDead Dead
DMA
write
Bus
release
DMA
read DMA
write DMA
dead Bus
release
Transfer source
Request
Acceptance resumes
1 block transfer
Transfer destinationTransfer destination
ReadIdleRead
Minimum
of 2 cycles Minimum
of 2 cycles
Request clear periodRequest clear period
[1] Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of φ,
and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] Start of DMA cycle; DREQ pin high level sampling on the rising edge of φ starts.
[4] [7] When the DREQ pin high level has been sampled, acceptance is resumed after the dead cycle
is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of φ, and the request is held.)
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7.23 Example of DREQ Pin Falling Edge Activated Block Transfer Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the
request is cleared, and DREQ pin high level sampling for edge detection is started. If DREQ pin
high level sampling has been completed by the time the DMA dead cycle ends, acceptance
resumes after the end of the dead cycle, DREQ pin low level sampling is performed again, and this
operation is repeated until the transfer ends.
DREQ Pin Low Level Activation Timing (Normal Mode): Set the DTA bit in DMABCRH to 1
for the channel for which the DREQ pin is selected.
Section 7 DMA Controller (DMAC)
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Figure 7.24 shows an example of normal mode transfer activated by the DREQ pin low level.
DMA
read DMA
write
φ
Address
bus
DREQ
Idle Write Idle
Bus
release
DMA
control
Channel
Write Idle
Transfer source
Bus
release DMA
read DMA
write Bus
release
Request
[1] [3][2] [4] [6][5] [7]
Acceptance resumes
Acceptance resumes
Transfer destination Transfer source Transfer destination
Request
Request clear periodRequest clear period
Read Read
Minimum
of 2 cycles Minimum
of 2 cycles
[1] Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of φ,
and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] The DMA cycle is started.
[4] [7] Acceptance is resumed after the write cycle is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of φ, and the request is held.)
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7.24 Example of DREQ Pin Low Level Activated Normal Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the
request is cleared. After the end of the write cycle, acceptance resumes, DREQ pin low level
sampling is performed again, and this operation is repeated until the transfer ends.
Figure 7.25 shows an example of block transfer mode transfer activated by DREQ pin low level.
Section 7 DMA Controller (DMAC)
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DMA
read DMA
write
φ
Address
bus
DREQ
Idle Write
Bus release
DMA
control
Channel
Write
Transfer source
Request
[1] [3][2] [4] [6][5] [7]
Acceptance resumes
DMA
dead
Bus
release
DMA
read DMA
write DMA
dead Bus
release
1 block transfer
IdleDead Dead
1 block transfer
Acceptance resumes
Request
Minimum
of 2 cycles Minimum
of 2 cycles
Transfer source
Read
Request clear period
Read
Request clear period
Transfer destination
Transfer destination
Idle
[1] Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of φ,
and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] The DMA cycle is started.
[4] [7] Acceptance is resumed after the dead cycle is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of φ, and the request is held.)
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7.25 Example of DREQ Pin Low Level Activated Block Transfer Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the
request is cleared. After the end of the dead cycle, acceptance resumes, DREQ pin low level
sampling is performed again, and this operation is repeated until the transfer ends.
7.5.10 DMA Transfer (Single Address Mode) Bus Cycles
Single Address Mode (Read): Figure 7.26 shows a transfer example in which TEND output is
enabled and byte-size single address mode transfer (read) is performed from external 8-bit, 2-state
access space to an external device.
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DMA read
φ
Address bus
DMA
dead
RD
DACK
TEND
Bus
release
DMA read DMA read DMA read
Bus
release Bus
release Bus
release Bus
release
Last transfer
cycle
Figure 7.26 Example of Single Address Mode Transfer (Byte Read)
Figure 7.27 shows a transfer example in which TEND output is enabled and word-size single
address mode transfer (read) is performed from external 8-bit, 2-state access space to an external
device.
DMA read
φ
Address bus
DMA read DMA read DMA
dead
RD
TEND
DACK
Bus
release Bus
release Bus
release Bus
release
Last transfer
cycle
Figure 7.27 Example of Single Address Mode (Word Read) Transfer
A byte or word transfer is performed for a single transfer request, and after the transfer, the bus is
released. While the bus is released, one or more bus cycles are executed by the CPU or DTC.
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In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
Single Address Mode (Write): Figure 7.28 shows a transfer example in which TEND output is
enabled and byte-size single address mode transfer (write) is performed from an external device to
external 8-bit, 2-state access space.
DMA write
φ
Address bus
DMA
dead
HWR
DACK
TEND
Bus
release
LWR
DMA write DMA write DMA write
Bus
release Bus
release Bus
release Bus
release
Last transfer
cycle
Figure 7.28 Example of Single Address Mode Transfer (Byte Write)
Figure 7.29 shows a transfer example in which TEND output is enabled and word-size single
address mode transfer (write) is performed from an external device to external 8-bit, 2-state access
space.
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DMA write
φ
Address bus
DMA write DMA write DMA
dead
HWR
TEND
DACK
Bus
release
LWR
Bus
release Bus
release Bus
release
Last transfer
cycle
Figure 7.29 Example of Single Address Mode Transfer (Word Write)
A byte or word transfer is performed for a single transfer request, and after the transfer, the bus is
released. While the bus is released, one or more bus cycles are executed by the CPU or DTC.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
DREQ Pin Falling Edge Activation Timing: Set the DTA bit in DMABCRH to 1 for the channel
for which the DREQ pin is selected.
Figure 7.30 shows an example of single address mode transfer activated by the DREQ pin falling
edge.
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φ
DREQ
Bus release DMA single DMA single
Address bus
DMA control
Channel
[2]
DACK
Transfer source/
destination
Idle Idle Idle
[1] [3] [5][4] [6] [7]
Acceptance resumesAcceptance resumes
Bus release Bus release
Transfer source/
destination
Request Request Request clear
period
Request clear
period
Minimum of
2 cycles Minimum of
2 cycles
SingleSingle
[1] Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of φ,
and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] Start of DMA cycle; DREQ pin high level sampling on the rising edge of φ starts.
[4] [7] When the DREQ pin high level has been sampled, acceptance is resumed after the single
cycle is completed. (As in [1], the DREQ pin low level is sampled on the rising edge of φ, and
the request is held.)
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7.30 Example of DREQ Pin Falling Edge Activated Single Address Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the
request is cleared, and DREQ pin high level sampling for edge detection is started. If DREQ pin
high level sampling has been completed by the time the DMA single cycle ends, acceptance
resumes after the end of the single cycle, DREQ pin low level sampling is performed again, and
this operation is repeated until the transfer ends.
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DREQ Pin Low Level Activation Timing: Set the DTA bit in DMABCRH to 1 for the channel
for which the DREQ pin is selected.
Figure 7.31 shows an example of single address mode transfer activated by the DREQ pin low
level.
φ
DREQ
Bus release DMA single
Address bus
DMA control
Channel
[2]
DACK
Transfer source/
destination
Idle Idle Idle
[1] [3] [5][4] [6] [7]
Acceptance resumesAcceptance resumes
Bus release DMA single Bus
release
Transfer source/
destination
Request Request Request clear
period
Request clear
period
Single Single
Minimum of
2 cycles
Minimum of
2 cycles
[1] Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of φ,
and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] The DMAC cycle is started.
[4] [7] Acceptance is resumed after the single cycle is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of φ, and the request is held.)
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7.31 Example of DREQ Pin Low Level Activated Single Address Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
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When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the
request is cleared. After the end of the single cycle, acceptance resumes, DREQ pin low level
sampling is performed again, and this operation is repeated until the transfer ends.
7.5.11 Write Data Buffer Function
DMAC internal-to-external dual address transfers and single address transfers can be executed at
high speed using the write data buffer function, enabling system throughput to be improved.
When the WDBE bit of BCR in the bus controller is set to 1, enabling the write data buffer
function, external write cycles in dual address transfers or single address transfers are executed in
parallel with internal accesses (on-chip memory or internal I/O registers). Internal accesses are
independent of the bus master, and DMAC dead cycles are regarded as internal accesses.
A low level can always be output from the TEND pin if the bus cycle in which a low level is to be
output from the TEND pin is an external bus cycle. However, a low level is not output from the
TEND pin if the bus cycle in which a low level is to be output from the TEND pin is an internal
bus cycle, and an external write cycle is executed in parallel with this cycle.
Figure 7.32 shows an example of dual address transfer using the write data buffer function. In this
example, burst mode transfer from on-chip RAM to external memory is performed.
φ
Internal address
Internal read signal
HWR, LWR
TEND
External address
DMA
read DMA
write DMA
read DMA
write DMA
read DMA
write DMA
read DMA
write DMA
dead
Figure 7.32 Example of Dual Address Transfer Using Write Data Buffer Function
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Figure 7.33 shows an example of single address transfer using the write data buffer function. In
this example, the CPU program area is in on-chip memory.
φ
Internal address
Internal read signal
RD
DACK
External address
DMA
read DMA
single CPU
read DMA
single CPU
read
Figure 7.33 Example of Single Address Transfer Using Write Data Buffer Function
When the write data buffer function is activated, the DMAC recognizes that the bus cycle
concerned has ended, and starts the next operation. Therefore, DREQ pin sampling is started one
state after the start of the DMA write cycle or single address transfer.
7.5.12 Multi-Channel Operation
The DMAC channel priority order is: channel 0 > channel 1, and channel A > channel B. Table
7.11 summarizes the priority order for DMAC channels.
Table 7.11 DMAC Channel Priority Order
Short Address Mode Full Address Mode Priority
Channel 0A Channel 0 High
Channel 0B
Channel 1A Channel 1
Channel 1B Low
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If transfer requests are issued simultaneously for more than one channel, or if a transfer request for
another channel is issued during a transfer, when the bus is released, the DMAC selects the
highest-priority channel from among those issuing a request according to the priority order shown
in table 7.11. During burst transfer, or when one block is being transferred in block transfer, the
channel will not be changed until the end of the transfer. Figure 7.34 shows a transfer example in
which transfer requests are issued simultaneously for channels 0A, 0B, and 1.
DMA read DMA write DMA read DMA write DMA read DMA write DMA
read
φ
Address bus
RD
HWR
LWR
DMA control
Channel 0A
Channel 0B
Channel 1
Idle Write Idle Read Write Idle Read Write Read
Request
hold
Request
hold
Bus
release Channel 0A
transfer Bus
release Channel 0B
transfer Channel 1 transfer
Bus
release
Request
hold
Read
Selection
Non-
selection Selection
Request clear
Request clear
Request clear
Figure 7.34 Example of Multi-Channel Transfer
7.5.13 Relation between DMAC and External Bus Requests and Refresh Cycles
When the DMAC accesses external space, conflict with a refresh cycle or external bus release
cycle may arise. In this case, the bus controller will suspend the transfer and insert a refresh cycle
or external bus release cycle, in accordance with the external bus priority order, even if the DMAC
is executing a burst transfer or block transfer. (An external access by the DTC or CPU, which has
a lower priority than the DMAC, is not executed until the DMAC releases the external bus.)
When the DMAC transfer mode is dual address mode, the DMAC releases the external bus after
an external write cycle. The external read cycle and external write cycle are inseparable, and so the
bus cannot be released between these two cycles.
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When the DMAC accesses internal space (on-chip memory or an internal I/O register), the DMAC
cycle may be executed at the same time as a refresh cycle or external bus release cycle.
7.5.14 DMAC and NMI Interrupts
When an NMI interrupt is requested, burst mode transfer in full address mode is interrupted. An
NMI interrupt does not affect the operation of the DMAC in other modes.
In full address mode, transfer is enabled for a channel when both the DTE bit and DTME bit are
set to 1. With burst mode setting, the DTME bit is cleared when an NMI interrupt is requested.
If the DTME bit is cleared during burst mode transfer, the DMAC discontinues transfer on
completion of the 1-byte or 1-word transfer in progress, then releases the bus, which passes to the
CPU.
The channel on which transfer was interrupted can be restarted by setting the DTME bit to 1
again. Figure 7.35 shows the procedure for continuing transfer when it has been interrupted by an
NMI interrupt on a channel designated for burst mode transfer.
Resumption of
transfer on interrupted
channel
Set DTME bit to 1
Transfer continues
[1]
[2]
DTE = 1
DTME = 0
Transfer ends
No
Yes
[1]
[2]
Check that DTE = 1 and
DTME = 0 in DMABCRL.
Write 1 to the DTME bit.
Figure 7.35 Example of Procedure for Continuing Transfer on Channel Interrupted by
NMI Interrupt
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7.5.15 Forced Termination of DMAC Operation
If the DTE bit in DMABCRL is cleared to 0 for the channel currently operating, the DMAC stops
on completion of the 1-byte or 1-word transfer in progress. DMAC operation resumes when the
DTE bit is set to 1 again. In full address mode, the same applies to the DTME bit in DMABCRL.
Figure 7.36 shows the procedure for forcibly terminating DMAC operation by software.
Forced termination
of DMAC
Clear DTE bit to 0
Forced termination
[1]
[1] Clear the DTE bit in DMABCRL to 0.
To prevent interrupt generation after forced
termination of DMAC operation, clear the DTIE bit
to 0 at the same time.
Figure 7.36 Example of Procedure for Forcibly Terminating DMAC Operation
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7.5.16 Clearing Full Address Mode
Figure 7.37 shows the procedure for releasing and initializing a channel designated for full address
mode. After full address mode has been cleared, the channel can be set to another transfer mode
using the appropriate setting procedure.
Clearing full
address mode
Stop the channel
Initialize DMACR
Clear FAE bit to 0
Initialization;
operation halted
[1]
[2]
[3]
[1] Clear both the DTE bit and DTME bit in
DMABCRL to 0, or wait until the transfer ends
and the DTE bit is cleared to 0, then clear the
DTME bit to 0. Also clear the corresponding
DTIE bit to 0 at the same time.
[2] Clear all bits in DMACRA and DMACRB to 0.
[3] Clear the FAE bit in DMABCRH to 0.
Figure 7.37 Example of Procedure for Clearing Full Address Mode
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7.6 Interrupt Sources
The sources of interrupts generated by the DMAC are transfer end and transfer break. Table 7.12
shows the interrupt sources and their priority order.
Table 7.12 Interrupt Sources and Priority Order
Interrupt Interrupt Source Interrupt
Name Short Address Mode Full Address Mode Priority Order
DMTEND0A Interrupt due to end of
transfer on channel 0A
Interrupt due to end of
transfer on channel 0
High
DMTEND0B Interrupt due to end of
transfer on channel 0B
Interrupt due to break in
transfer on channel 0
DMTEND1A Interrupt due to end of
transfer on channel 1A
Interrupt due to end of
transfer on channel 1
DMTEND1B Interrupt due to end of
transfer on channel 1B
Interrupt due to break in
transfer on channel 1
Low
Enabling or disabling of each interrupt source is set by means of the DTIE bit in DMABCRL for
the corresponding channel in DMABCRL, and interrupts from each source are sent to the interrupt
controller independently. The priority of transfer end interrupts on each channel is decided by the
interrupt controller, as shown in table 7.12.
Figure 7.38 shows a block diagram of a transfer end/transfer break interrupt. An interrupt is
always generated when the DTIE bit is set to 1 while the DTE bit in DMABCRL is cleared to 0.
DTE/
DTME
DTIE
Transfer end/transfer
break interrupt
Figure 7.38 Block Diagram of Transfer End/Transfer Break Interrupt
In full address mode, a transfer break interrupt is generated when the DTME bit is cleared to 0
while the DTIEB bit is set to 1. In both short address mode and full address mode, DMABCR
should be set so as to prevent the occurrence of a combination that constitutes a condition for
interrupt generation during setting.
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7.7 Usage Notes
7.7.1 DMAC Register Access during Operation
Except for forced termination of the DMAC, the operating (including transfer waiting state)
channel setting should not be changed. The operating channel setting should only be changed
when transfer is disabled. Also, DMAC registers should not be written to in a DMA transfer.
DMAC register reads during operation (including the transfer waiting state) are described below.
• DMAC control starts one cycle before the bus cycle, with output of the internal address.
Consequently, MAR is updated in the bus cycle before DMA transfer. Figure 7.39 shows an
example of the update timing for DMAC registers in dual address transfer mode.
[1] Transfer source address register MAR operation (incremented/decremented/fixed)
Transfer counter ETCR operation (decremented)
Block size counter ETCR operation (decremented in block transfer mode)
[2] Transfer destination address register MAR operation (incremented/decremented/fixed)
[2']Transfer destination address register MAR operation (incremented/decremented/fixed)
Block transfer counter ETCR operation (decremented, in last transfer cycle of
a block in block transfer mode)
[3] Transfer address register MAR restore operation (in block or repeat transfer mode)
Transfer counter ETCR restore (in repeat transfer mode)
Block size counter ETCR restore (in block transfer mode)
Note: In single address transfer mode, the update timing is the same as [1].
The MAR operation is post-incrementing/decrementing of the DMA internal address value.
[3]
[2'][2] [1]
[1]
DMA transfer cycle
DMA read DMA read
DMA write DMA write DMA
dead
DMA Internal
address
DMA control
DMA register
operation
DMA last transfer cycle
Transfer
destination Transfer
destination
Transfer
source
Transfer
source
Idle Idle IdleRead Read Dead
Write Write
Figure 7.39 DMAC Register Update Timing
Section 7 DMA Controller (DMAC)
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• If a DMAC transfer cycle occurs immediately after a DMAC register read cycle, the DMAC
register is read as shown in figure 7.40.
[2]
[1]
Note: The lower word of MAR is the updated value after the operation in [1].
CPU longword read DMA transfer cycle
MAR upper
word read MAR lower
word read DMA read DMA write
DMA internal
address
DMA control
DMA register
operation
Transfe
source Transfer
destination
Idle Read Write Idle
Figure 7.40 Contention between DMAC Register Update and CPU Read
7.7.2 Module Stop
When the MSTP13 bit in MSTPCRH is set to 1, the DMAC clock stops, and the module stop state
is entered. However, 1 cannot be written to the MSTP13 bit if any of the DMAC channels is
enabled. This setting should therefore be made when DMAC operation is stopped.
When the DMAC clock stops, DMAC register accesses can no longer be made. Since the
following DMAC register settings are valid even in the module stop state, they should be
invalidated, if necessary, before a module stop.
• Transfer end/break interrupt (DTE = 0 and DTIE = 1)
• TEND pin enable (TEE = 1)
• DACK pin enable (FAE = 0 and SAE = 1)
7.7.3 Write Data Buffer Function
When the WDBE bit of BCR in the bus controller is set to 1, enabling the write data buffer
function, external write cycles in dual address transfers or single address transfers are executed in
parallel with internal accesses (on-chip memory or internal I/O registers).
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• Write data buffer function and DMAC register setting
If the setting of a register that controls external accesses is changed during execution of an
external access by means of the write data buffer function, the external access may not be
performed normally. Registers that control external accesses should only be manipulated when
external reads, etc., are used with DMAC operation disabled, and the operation is not
performed in parallel with external access.
• Write data buffer function and DMAC operation timing
The DMAC can start its next operation during external access using the write data buffer
function. Consequently, the DREQ pin sampling timing, TEND output timing, etc., are
different from the case in which the write data buffer function is disabled. Also, internal bus
cycles maybe hidden, and not visible.
7.7.4 TEND Output
If the last transfer cycle is for an internal address, note that even if low-level output at the TEND
pin has been set, a low level may not be output at the TEND pin under the following external bus
conditions since the last transfer cycle (internal bus cycle) and the external bus cycle are executed
in parallel.
1. Write cycle with write buffer mode enabled
2. DMAC single address cycle for a different channel with write buffer mode enabled
3. Bus release cycle
4. CBR refresh cycle
Figure 7.41 shows an example in which a low level is not output from the TEND pin in case 2
above.
If the last transfer cycle is an external address cycle, a low level is output at the TEND pin in
synchronization with the bus cycle.
However, if the last transfer cycle and a CBR refresh occur simultaneously, note that although the
CBR refresh and the last transfer cycle may be executed consecutively, TEND may also go low in
this case for the refresh cycle.
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φ
Internal address
Internal read signal
External address
HWR, LWR
Internal write signal
TEND
Not output
DMA
read
External write by CPU, etc.
DMA
write
Figure 7.41 Example in which Low Level is Not Output at TEND Pin
7.7.5 Activation by Falling Edge on DREQ Pin
DREQ pin falling edge detection is performed in synchronization with DMAC internal operations.
The operation is as follows:
[1] Activation request wait state: Waits for detection of a low level on the DREQ pin, and
switches to [2].
[2] Transfer wait state: Waits for DMAC data transfer to become possible, and switches to [3].
[3] Activation request disabled state: Waits for detection of a high level on the DREQ pin, and
switches to [1].
After DMAC transfer is enabled, a transition is made to [1]. Thus, initial activation after transfer
is enabled is performed on detection of a low level.
7.7.6 Activation Source Acceptance
At the start of activation source acceptance, a low level is detected in both DREQ pin falling edge
sensing and low level sensing. Similarly, in the case of an internal interrupt, the interrupt request
is detected. Therefore, a request is accepted from an internal interrupt or DREQ pin low level that
occurs before write to DMABCRL to enable transfer.
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When the DMAC is activated, take any necessary steps to prevent an internal interrupt or DREQ
pin low level remaining from the end of the previous transfer, etc.
7.7.7 Internal Interrupt after End of Transfer
When the DTE bit in DMABCRL is cleared to 0 at the end of a transfer or by a forcible
termination, the selected internal interrupt request will be sent to the CPU or DTC even if the
DTA bit in DMABCRH is set to 1.
Also, if internal DMAC activation has already been initiated when operation is forcibly
terminated, the transfer is executed but flag clearing is not performed for the selected internal
interrupt even if the DTA bit is set to 1.
An internal interrupt request following the end of transfer or a forcible termination should be
handled by the CPU as necessary.
7.7.8 Channel Re-Setting
To reactivate a number of channels when multiple channels are enabled, use exclusive handling of
transfer end interrupts, and perform DMABCR control bit operations exclusively.
Note, in particular, that in cases where multiple interrupts are generated between reading and
writing of DMABCR, and a DMABCR operation is performed during new interrupt handling, the
DMABCR write data in the original interrupt handling routine will be incorrect, and the write may
invalidate the results of the operations by the multiple interrupts. Ensure that overlapping
DMABCR operations are not performed by multiple interrupts, and that there is no separation
between read and write operations by the use of a bit-manipulation instruction.
Also, when the DTE and DTME bits are cleared by the DMAC or are written with 0, they must
first be read while cleared to 0 before the CPU can write 1 to them.
Section 8 Data Transfer Controller (DTC)
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Section 8 Data Transfer Controller (DTC)
This LSI includes a data transfer controller (DTC). The DTC can be activated by an interrupt or
software, to transfer data.
Figure 8.1 shows a block diagram of the DTC.
8.1 Features
• Transfer possible over any number of channels
• Three transfer modes
⎯ Normal mode
One operation transfers one byte or one word of data.
Memory address is incremented or decremented by 1 or 2.
From 1 to 65,536 transfers can be specified.
⎯ Repeat mode
One operation transfers one byte or one word of data.
Memory address is incremented or decremented by 1 or 2.
Once the specified number of transfers (1 to 256) has ended, the initial state is restored, and
transfer is repeated.
⎯ Block transfer mode
One operation transfers one block of data.
The block size is 1 to 256 bytes or words.
From 1 to 65,536 transfers can be specified.
Either the transfer source or the transfer destination is designated as a block area.
• One activation source can trigger a number of data transfers (chain transfer)
• Direct specification of 16-Mbyte address space possible
• Activation by software is possible
• Transfer can be set in byte or word units
• A CPU interrupt can be requested for the interrupt that activated the DTC
• Module stop mode can be set
The DTC’s register information is stored in the on-chip RAM. When the DTC is used, the RAME
bit in SYSCR must be set to 1. A 32-bit bus connects the DTC to the on-chip RAM (1 kbyte),
enabling 32-bit/1-state reading and writing of the DTC register information.
DTCH803A_000020020100
Section 8 Data Transfer Controller (DTC)
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Interrupt
request
Interrupt controller DTC
Internal address bus
DTC activation
request
Control logic
Register information
MRA MRB
CRA
CRB
DAR
SAR
CPU interrupt
request
On-chip
RAM
Internal data bus
Legend:
MRA, MRB:
CRA, CRB:
SAR:
DAR:
DTCERA to DTCERG:
DTVECR:
DTCERA
to
DTCERG
DTVECR
DTC mode registers A and B
DTC transfer count registers A and B
DTC source address register
DTC destination address register
DTC enable registers A to G
DTC vector register
Figure 8.1 Block Diagram of DTC
Section 8 Data Transfer Controller (DTC)
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8.2 Register Descriptions
DTC has the following registers.
• DTC mode register A (MRA)
• DTC mode register B (MRB)
• DTC source address register (SAR)
• DTC destination address register (DAR)
• DTC transfer count register A (CRA)
• DTC transfer count register B (CRB)
These six registers cannot be directly accessed from the CPU. When activated, the DTC reads a
set of register information that is stored in an on-chip RAM to the corresponding DTC registers
and transfers data. After the data transfer, it writes a set of updated register information back to the
RAM.
• DTC enable registers A to G (DTCERA to DTCERG)
• DTC vector register (DTVECR)
8.2.1 DTC Mode Register A (MRA)
MRA selects the DTC operating mode.
Bit Bit Name Initial Value R/W Description
7
6
SM1
SM0
Undefined
Undefined
−
−
Source Address Mode 1 and 0
These bits specify an SAR operation after a data
transfer.
0×: SAR is fixed
10: SAR is incremented after a transfer
(by +1 when Sz = 0; by +2 when Sz = 1)
11: SAR is decremented after a transfer
(by –1 when Sz = 0; by –2 when Sz = 1)
5
4
DM1
DM0
Undefined
Undefined
−
−
Destination Address Mode 1 and 0
These bits specify a DAR operation after a data
transfer.
0×: DAR is fixed
10: DAR is incremented after a transfer
(by +1 when Sz = 0; by +2 when Sz = 1)
11: DAR is decremented after a transfer
(by –1 when Sz = 0; by –2 when Sz = 1)
Section 8 Data Transfer Controller (DTC)
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Bit Bit Name Initial Value R/W Description
3
2
MD1
MD0
Undefined
Undefined
−
−
DTC Mode
These bits specify the DTC transfer mode.
00: Normal mode
01: Repeat mode
10: Block transfer mode
11: Setting prohibited
1 DTS Undefined − DTC Transfer Mode Select
Specifies whether the source side or the destination
side is set to be a repeat area or block area, in
repeat mode or block transfer mode.
0: Destination side is repeat area or block area
1: Source side is repeat area or block area
0 Sz Undefined − DTC Data Transfer Size
Specifies the size of data to be transferred.
0: Byte-size transfer
1: Word-size transfer
Legend:
×: Don’t care
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8.2.2 DTC Mode Register B (MRB)
MRB selects the DTC operating mode.
Bit Bit Name Initial Value R/W Description
7 CHNE Undefined − DTC Chain Transfer Enable
When this bit is set to 1, a chain transfer will be
performed. For details, refer to section 8.5.4, Chain
Transfer.
In data transfer with CHNE set to 1, determination of
the end of the specified number of transfers,
clearing of the activation source flag, and clearing of
DTCER is not performed.
6 DISEL Undefined − DTC Interrupt Select
When this bit is set to 1, a CPU interrupt request is
generated every time after a data transfer ends.
When this bit is set to 0, a CPU interrupt request is
generated at the time when the specified number of
data transfer ends.
5 CHNS Undefined − DTC Chain Transfer Select
Specifies the chain transfer condition.
0: Chain transfer every time
1: Chain transfer only when transfer counter = 0
4
to
0
− Undefined − Reserved
These bits have no effect on DTC operation, and
should always be written with 0.
8.2.3 DTC Source Address Register (SAR)
SAR is a 24-bit register that designates the source address of data to be transferred by the DTC.
For word-size transfer, specify an even source address.
8.2.4 DTC Destination Address Register (DAR)
DAR is a 24-bit register that designates the destination address of data to be transferred by the
DTC. For word-size transfer, specify an even destination address.
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8.2.5 DTC Transfer Count Register A (CRA)
CRA is a 16-bit register that designates the number of times data is to be transferred by the DTC.
In normal mode, the entire CRA functions as a 16-bit transfer counter (1 to 65,536). It is
decremented by 1 every time data is transferred, and transfer ends when the count reaches H'0000.
In repeat mode or block transfer mode, the CRA is divided into two parts: the upper 8 bits
(CRAH) and the lower 8 bits (CRAL). CRAH holds the number of transfers while CRAL
functions as an 8-bit transfer counter (1 to 256). CRAL is decremented by 1 every time data is
transferred, and the contents of CRAH are sent when the count reaches H'00.
8.2.6 DTC Transfer Count Register B (CRB)
CRB is a 16-bit register that designates the number of times data is to be transferred by the DTC in
block transfer mode. It functions as a 16-bit transfer counter (1 to 65,536) that is decremented by 1
every time data is transferred, and transfer ends when the count reaches H'0000.
This register is not used in normal mode or repeat mode.
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8.2.7 DTC Enable Registers A to G (DTCERA to DTCERG)
DTCER which is comprised of seven registers, DTCERA to DTCERG, is a register that specifies
DTC activation interrupt sources. The correspondence between interrupt sources and DTCE bits is
shown in table 8.2. For DTCE bit setting, use bit manipulation instructions such as BSET and
BCLR for reading and writing. If all interrupts are masked, multiple activation sources can be set
at one time (only at the initial setting) by writing data after executing a dummy read on the
relevant register.
Bit Bit Name Initial Value R/W Description
7
6
5
4
3
2
1
0
DTCE7
DTCE6
DTCE5
DTCE4
DTCE3
DTCE2
DTCE1
DTCE0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
DTC Activation Enable
Setting this bit to 1 specifies a relevant interrupt
source to a DTC activation source.
[Clearing conditions]
• When the DISEL bit is 1 and the data transfer
has ended
• When the specified number of transfers have
ended
These bits are not automatically cleared when the
DISEL bit is 0 and the specified number of
transfers have not ended
• When 0 is written to the DTCE bit after reading
DTCE = 1
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8.2.8 DTC Vector Register (DTVECR)
DTVECR enables or disables DTC activation by software, and sets a vector number for the
software activation interrupt.
Bit Bit Name Initial Value R/W Description
7 SWDTE 0 R/W DTC Software Activation Enable
Setting this bit to 1 activates DTC. Only 1 can be
written to this bit.
[Clearing conditions]
• When the DISEL bit is 0 and the specified
number of transfers have not ended
• When 0 is written to the DISEL bit after a
software-activated data transfer end interrupt
(SWDTEND) request has been sent to the CPU.
When the DISEL bit is 1 and data transfer has
ended or when the specified number of transfers
have ended, this bit will not be cleared.
6
5
4
3
2
1
0
DTVEC6
DTVEC5
DTVEC4
DTVEC3
DTVEC2
DTVEC1
DTVEC0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
DTC Software Activation Vectors 6 to 0
These bits specify a vector number for DTC
software activation.
The vector address is expressed as H'0400 +
(vector number × 2). For example, when DTVEC6 to
DTVEC0 = H'10, the vector address is H'0420.
When the bit SWDTE is 0, these bits can be written.
Section 8 Data Transfer Controller (DTC)
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8.3 Activation Sources
The DTC operates when activated by an interrupt or by a write to DTVECR by software. An
interrupt request can be directed to the CPU or DTC, as designated by the corresponding DTCER
bit. At the end of a data transfer (or the last consecutive transfer in the case of chain transfer), the
activation source or corresponding DTCER bit is cleared. The activation source flag, in the case
of RXI0, for example, is the RDRF flag of SCI_0.
When an interrupt has been designated a DTC activation source, existing CPU mask level and
interrupt controller priorities have no effect. If there is more than one activation source at the same
time, the DTC operates in accordance with the default priorities.
Table 8.1 shows the relationship between the activation sources and DTCER clearing, and figure
8.2 shows a block diagram of activation source control. For details see section 5, Interrupt
Controller.
Table 8.1 Relationship between Activation Sources and DTCER Clearing
Activation Source
DISEL = 0 and Specified
Number of Transfers Has
Not Ended
DISEL = 1 or Specified Number
of Transfers Has Ended
Activation by software SWDTE bit is cleared to 0 • SWDTE bit remains set to 1
• Interrupt request to CPU
Activation by an interrupt • Corresponding DTCER bit
remains set to 1.
• Activation source flag is
cleared to 0.
• Corresponding DTCER bit is
cleared to 0.
• Activation source flag remains
set to 1.
• Interrupt that became the
activation source is requested
to the CPU.
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CPU
DTC
DTCER
Source flag cleared
On-chip
supporting
module
IRQ interrupt Interrupt
request
Clear
Clear
controller
Clear request
Interrupt controller
Selection circuit
Interrupt mask
Select
DTVECR
Figure 8.2 Block Diagram of DTC Activation Source Control
8.4 Location of Register Information and DTC Vector Table
Locate the register information in the on-chip RAM (addresses: H'FFBC00 to H'FFBFFF).
Register information should be located at the address that is multiple of four within the range.
Locating the register information in address space is shown in figure 8.3. Locate the MRA, SAR,
MRB, DAR, CRA, and CRB registers, in that order, from the start address of the register
information. In the case of chain transfer, register information should be located in consecutive
areas as shown in figure 8.3 and the register information start address should be located at the
corresponding vector address to the activation source. Figure 8.4 shows the correspondence
between the DTC vector address and register information. The DTC reads the start address of the
register information from the vector address set for each activation source, and then reads the
register information from that start address.
When the DTC is activated by software, the vector address is obtained from: H'0400 +
(DTVECR[6:0] × 2). For example, if DTVECR is H'10, the vector address is H'0420.
The configuration of the vector address is the same in both normal* and advanced modes, a 2-byte
unit being used in both cases. These two bytes specify the lower bits of the register information
start address.
Note: * Not available in this LSI.
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MRAStart address of
register information Register information
Register information
for second transfer
in case of chain
transfer
Chain transfer
Lower addresses
Four bytes
0123
SAR
MRB DAR
CRA CRB
MRA SAR
MRB DAR
CRA CRB
Figure 8.3 Correspondence between DTC Vector Address and Register Information
DTC vector
address
Chain transfer
Register information
start address Register information
Figure 8.4 Correspondence between DTC Vector Address and Register Information
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Table 8.2 Interrupt Sources, DTC Vector Addresses, and Corresponding DTCEs
Origin of
Activation
Source
Activation
Source
Vector Number
DTC
Vector Address
DTCE*
Priority
Software Write to DTVECR DTVECR H'0400 + (DTVECR
[6:0] × 2)
— High
External pin IRQ0 16 H'0420 DTCEA7
IRQ1 17 H'0422 DTCEA6
IRQ2 18 H'0424 DTCEA5
IRQ3 19 H'0426 DTCEA4
IRQ4 20 H'0428 DTCEA3
IRQ5 21 H'042A DTCEA2
IRQ6 22 H'042C DTCEA1
IRQ7 23 H'042E DTCEA0
A/D ADI 38 H'044C DTCEC6
TPU_0 TGI0A 40 H'0450 DTCEC5
TGI0B 41 H'0452 DTCEC4
TGI0C 42 H'0454 DTCEC3
TGI0D 43 H'0456 DTCEC2
TPU_1 TGI1A 48 H'0460 DTCEC1
TGI1B 49 H'0462 DTCEC0
TPU_2 TGI2A 52 H'0468 DTCED7
TGI2B 53 H'046A DTCED6
TPU_3 TGI3A 56 H'0470 DTCED5
TGI3B 57 H'0472 DTCED4
TGI3C 58 H'0474 DTCED3
TGI3D 59 H'0476 DTCED2
TPU_4 TGI4A 64 H'0480 DTCED1
TGI4B 65 H'0482 DTCED0
TPU_5 TGI5A 68 H'0488 DTCEE7
TGI5B 69 H'048A DTCEE6 Low
Section 8 Data Transfer Controller (DTC)
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Origin of
Activation
Source
Activation
Source
Vector Number
DTC
Vector Address
DTCE*
Priority
TMR_0 CMIA0 72 H'0490 DTCEE3 High
CMIB0 73 H'0492 DTCEE2
TMR_1 CMIA1 76 H'0498 DTCEE1
CMIB1 77 H'049A DTCEE0
DMAC DMTEND0A 80 H'04A0 DTCEF7
DMTEND0B 81 H'04A2 DTCEF6
DMTEND1A 82 H'04A4 DTCEF5
DMTEND1B 83 H'04A6 DTCEF4
SCI_0 RXI0 89 H'04B2 DTCEF3
TXI0 90 H'04B4 DTCEF2
SCI_1 RXI1 93 H'04BA DTCEF1
TXI1 94 H'04BC DTCEF0
SCI_2 RXI2 97 H'04C2 DTCEG7
TXI2 98 H'04C4 DTCEG6
SCI_3 RXI3 101 H'04CA DTCEF5
TXI3 102 H'04CC DTCEF4
SCI_4 RXI4 105 H'04D2 DTCEG3
TXI4 106 H'04D4 DTCEG2 Low
Note: * DTCE bits with no corresponding interrupt are reserved, and should be written with 0.
When clearing the software standby state or all-module-clocks-stop mode with an
interrupt, write 0 to the corresponding DTCE bit.
Section 8 Data Transfer Controller (DTC)
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8.5 Operation
The DTC stores register information in the on-chip RAM. When activated, the DTC reads register
information that is already stored in the on-chip RAM and transfers data on the basis of that
register information. After the data transfer, it writes updated register information back to the on-
chip RAM. Pre-storage of register information in the on-chip RAM makes it possible to transfer
data over any required number of channels. There are three transfer modes: normal mode, repeat
mode, and block transfer mode. Setting the CHNE bit to 1 makes it possible to perform a number
of transfers with a single activation (chain transfer). A setting can also be made to have chain
transfer performed only when the transfer counter value is 0. This enables DTC re-setting to be
performed by the DTC itself.
The 24-bit SAR designates the DTC transfer source address and the 24-bit DAR designates the
transfer destination address. After each transfer, SAR and DAR are independently incremented,
decremented, or left fixed.
Figure 8.5 shows a flowchart of DTC operation, and table 8.3 summarizes the chain transfer
conditions (combinations for performing the second and third transfers are omitted).
Section 8 Data Transfer Controller (DTC)
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Start
Read DTC vector
Next transfer
Read register information
Data transfer
Write register information
Clear activation flag
CHNE = 1?
End
No
No
No
No
No
Yes
Yes
Yes
Yes
Yes
Transfer counter = 0
or DISEL = 1?
Clear DTCER
Interrupt exception
handling
CHNS = 0?
DISEL = 1?
Transfer
counter = 0?
Figure 8.5 Flowchart of DTC Operation
Section 8 Data Transfer Controller (DTC)
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Table 8.3 Chain Transfer Conditions
1st Transfer 2nd Transfer
CHNE CHNS DISEL CR CHNE CHNS DISEL CR DTC Transfer
0 — 0 Not 0 — — — — Ends at 1st transfer
0 — 0 0 — — — — Ends at 1st transfer
0 — 1 — — — — — Interrupt request to CPU
1 0 — — 0 — 0 Not 0 Ends at 2nd transfer
0 — 0 0 Ends at 2nd transfer
0 — 1 — Interrupt request to CPU
1 1 0 Not 0 — — — — Ends at 1st transfer
1 1 — 0 0 — 0 Not 0 Ends at 2nd transfer
0 — 0 0 Ends at 2nd transfer
0 — 1 — Interrupt request to CPU
1 1 1 Not 0 — — — — Ends at 1st transfer
Interrupt request to CPU
8.5.1 Normal Mode
In normal mode, one operation transfers one byte or one word of data. Table 8.4 lists the register
function in normal mode. From 1 to 65,536 transfers can be specified. Once the specified number
of transfers has ended, a CPU interrupt can be requested.
Table 8.4 Register Function in Normal Mode
Name Abbreviation Function
DTC source address register SAR Designates source address
DTC destination address register DAR Designates destination address
DTC transfer count register A CRA Designates transfer count
DTC transfer count register B CRB Not used
Section 8 Data Transfer Controller (DTC)
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SAR DAR
Transfer
Figure 8.6 Memory Mapping in Normal Mode
8.5.2 Repeat Mode
In repeat mode, one operation transfers one byte or one word of data. Table 8.5 lists the register
function in repeat mode. From 1 to 256 transfers can be specified. Once the specified number of
transfers has ended, the initial state of the transfer counter and the address register specified as the
repeat area is restored, and transfer is repeated. In repeat mode the transfer counter value does not
reach H'00, and therefore CPU interrupts cannot be requested when DISEL = 0.
Table 8.5 Register Function in Repeat Mode
Name Abbreviation Function
DTC source address register SAR Designates source address
DTC destination address register DAR Designates destination address
DTC transfer count register AH CRAH Holds number of transfers
DTC transfer count register AL CRAL Designates transfer count
DTC transfer count register B CRB Not used
Section 8 Data Transfer Controller (DTC)
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SAR
or
DAR
DAR
or
SAR
Repeat area
Transfer
Figure 8.7 Memory Mapping in Repeat Mode
8.5.3 Block Transfer Mode
In block transfer mode, one operation transfers one block of data. Either the transfer source or the
transfer destination is designated as a block area. Table 8.6 lists the register function in block
transfer mode.
The block size is 1 to 256. When the transfer of one block ends, the initial state of the block size
counter and the address register specified as the block area is restored. The other address register
is then incremented, decremented, or left fixed. From 1 to 65,536 transfers can be specified. Once
the specified number of transfers has ended, a CPU interrupt is requested.
Table 8.6 Register Function in Block Transfer Mode
Name Abbreviation Function
DTC source address register SAR Designates source address
DTC destination address register DAR Designates destination address
DTC transfer count register AH CRAH Holds block size
DTC transfer count register AL CRAL Designates block size count
DTC transfer count register B CRB Designates transfer count
Section 8 Data Transfer Controller (DTC)
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First block
Transfer Block area
Nth block
DAR
or
SAR
SAR
or
DAR
Figure 8.8 Memory Mapping in Block Transfer Mode
8.5.4 Chain Transfer
Setting the CHNE bit to 1 enables a number of data transfers to be performed consecutively in
response to a single transfer request. SAR, DAR, CRA, CRB, MRA, and MRB, which define data
transfers, can be set independently.
Figure 8.9 shows the operation of chain transfer. When activated, the DTC reads the register
information start address stored at the vector address, and then reads the first register information
at that start address. The CHNE bit in MRB is checked after the end of data transfer, if the value is
1, the next register information, which is located consecutively, is read and transfer is performed.
This operation is repeated until the end of data transfer of register information with CHNE = 0. It
is also possible, by setting both the CHNE bit and CHNS bit to 1, to specify execution of chain
transfer only when the transfer counter value is 0.
In the case of transfer with CHNE set to 1, an interrupt request to the CPU is not generated at the
end of the specified number of transfers or by setting of the DISEL bit to 1, and the interrupt
source flag for the activation source is not affected.
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DTC vector
address
Register information
CHNE=1
Register information
CHNE=0
Register information
start address
Source
Destination
Source
Destination
Figure 8.9 Operation of Chain Transfer
8.5.5 Interrupts
An interrupt request is issued to the CPU when the DTC finishes the specified number of data
transfers, or a data transfer for which the DISEL bit was set to 1. In the case of interrupt
activation, the interrupt set as the activation source is generated. These interrupts to the CPU are
subject to CPU mask level and interrupt controller priority level control.
In the case of activation by software, a software activated data transfer end interrupt (SWDTEND)
is generated.
When the DISEL bit is 1 and one data transfer has ended, or the specified number of transfers has
ended, after data transfer ends, the SWDTE bit is held at 1 and an SWDTEND interrupt is
generated. The interrupt handling routine should clear the SWDTE bit to 0.
When the DTC is activated by software, an SWDTEND interrupt is not generated during a data
transfer wait or during data transfer even if the SWDTE bit is set to 1.
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8.5.6 Operation Timing
φ
DTC activation
request
DTC
request
Address
Vector read
Read Write
Data transfer
Transfer
information write
Transfer
information read
Figure 8.10 DTC Operation Timing (Example in Normal Mode or Repeat Mode)
φ
DTC activation
request
DTC
request
Address
Vector read
Read Write Read Write
Data transfer
Transfer
information write
Transfer
information read
Figure 8.11 DTC Operation Timing (Example of Block Transfer Mode,
with Block Size of 2)
Section 8 Data Transfer Controller (DTC)
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φ
DTC activation
request
DTC
request
Address
Vector read
Read Write Read Write
Data transfer Data transfer
Transfer
information
write
Transfer
information write
Transfer
information read Transfer
information
read
Figure 8.12 DTC Operation Timing (Example of Chain Transfer)
8.5.7 Number of DTC Execution States
Table 8.7 lists execution status for a single DTC data transfer, and table 8.7 shows the number of
states required for each execution status.
Table 8.7 DTC Execution Status
Mode
Vector Read
I
Register Information
Read/Write
J
Data Read
K
Data Write
L
Internal
Operations
M
Normal 1 6 1 1 3
Repeat 1 6 1 1 3
Block transfer 1 6 N N 3
Legend:
N: Block size (initial setting of CRAH and CRAL)
Section 8 Data Transfer Controller (DTC)
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Table 8.8 Number of States Required for Each Execution Status
Object to be Accessed
On-
Chip
RAM
On-
Chip
ROM
On-Chip I/O
Registers
External Devices
Bus width 32 16 8 16 8 16
Access states 1 1 2 2 2 3 2 3
Execution Vector read SI — 1 — — 4 6+2m 2 3+m
status Register information
read/write SJ
1 — — — — — — —
Byte data read SK 1 1 2 2 2 3+m 2 3+m
Word data read SK 1 1 4 2 4 6+2m 2 3+m
Byte data write SL 1 1 2 2 2 3+m 2 3+m
Word data write SL 1 1 4 2 4 6+2m 2 3+m
Internal operation SM 1
The number of execution states is calculated from the formula below. Note that Σ means the sum
of all transfers activated by one activation event (the number in which the CHNE bit is set to 1,
plus 1).
Number of execution states = I · SI + Σ (J · SJ + K · SK + L · SL) + M · SM
For example, when the DTC vector address table is located in on-chip ROM, normal mode is set,
and data is transferred from the on-chip ROM to an internal I/O register, the time required for the
DTC operation is 13 states. The time from activation to the end of the data write is 10 states.
Section 8 Data Transfer Controller (DTC)
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8.6 Procedures for Using DTC
8.6.1 Activation by Interrupt
The procedure for using the DTC with interrupt activation is as follows:
1. Set the MRA, MRB, SAR, DAR, CRA, and CRB register information in the on-chip RAM.
2. Set the start address of the register information in the DTC vector address.
3. Set the corresponding bit in DTCER to 1.
4. Set the enable bits for the interrupt sources to be used as the activation sources to 1. The DTC
is activated when an interrupt used as an activation source is generated.
5. After the end of one data transfer, or after the specified number of data transfers have ended,
the DTCE bit is cleared to 0 and a CPU interrupt is requested. If the DTC is to continue
transferring data, set the DTCE bit to 1.
8.6.2 Activation by Software
The procedure for using the DTC with software activation is as follows:
1. Set the MRA, MRB, SAR, DAR, CRA, and CRB register information in the on-chip RAM.
2. Set the start address of the register information in the DTC vector address.
3. Check that the SWDTE bit is 0.
4. Write 1 to SWDTE bit and the vector number to DTVECR.
5. Check the vector number written to DTVECR.
6. After the end of one data transfer, if the DISEL bit is 0 and a CPU interrupt is not requested,
the SWDTE bit is cleared to 0. If the DTC is to continue transferring data, set the SWDTE bit
to 1. When the DISEL bit is 1, or after the specified number of data transfers have ended, the
SWDTE bit is held at 1 and a CPU interrupt is requested.
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8.7 Examples of Use of the DTC
8.7.1 Normal Mode
An example is shown in which the DTC is used to receive 128 bytes of data via the SCI.
1. Set MRA to fixed source address (SM1 = SM0 = 0), incrementing destination address (DM1 =
1, DM0 = 0), normal mode (MD1 = MD0 = 0), and byte size (Sz = 0). The DTS bit can have
any value. Set MRB for one data transfer by one interrupt (CHNE = 0, DISEL = 0). Set the
SCI RDR address in SAR, the start address of the RAM area where the data will be received in
DAR, and 128 (H'0080) in CRA. CRB can be set to any value.
2. Set the start address of the register information at the DTC vector address.
3. Set the corresponding bit in DTCER to 1.
4. Set the SCI to the appropriate receive mode. Set the RIE bit in SCR to 1 to enable the
reception complete (RXI) interrupt. Since the generation of a receive error during the SCI
reception operation will disable subsequent reception, the CPU should be enabled to accept
receive error interrupts.
5. Each time reception of one byte of data ends on the SCI, the RDRF flag in SSR is set to 1, an
RXI interrupt is generated, and the DTC is activated. The receive data is transferred from RDR
to RAM by the DTC. DAR is incremented and CRA is decremented. The RDRF flag is
automatically cleared to 0.
6. When CRA becomes 0 after the 128 data transfers have ended, the RDRF flag is held at 1, the
DTCE bit is cleared to 0, and an RXI interrupt request is sent to the CPU. The interrupt
handling routine should perform wrap-up processing.
8.7.2 Chain Transfer
An example of DTC chain transfer is shown in which pulse output is performed using the PPG.
Chain transfer can be used to perform pulse output data transfer and PPG output trigger cycle
updating. Repeat mode transfer to the PPG’s NDR is performed in the first half of the chain
transfer, and normal mode transfer to the TPU’s TGR in the second half. This is because clearing
of the activation source and interrupt generation at the end of the specified number of transfers are
restricted to the second half of the chain transfer (transfer when CHNE = 0).
1. Perform settings for transfer to the PPG’s NDR. Set MRA to source address incrementing
(SM1 = 1, SM0 = 0), fixed destination address (DM1 = DM0 = 0), repeat mode (MD1 = 0,
MD0 = 1), and word size (Sz = 1). Set the source side as a repeat area (DTS = 1). Set MRB to
chain mode (CHNE = 1, DISEL = 0). Set the data table start address in SAR, the NDRH
address in DAR, and the data table size in CRAH and CRAL. CRB can be set to any value.
Section 8 Data Transfer Controller (DTC)
Rev.6.00 Mar. 18, 2009 Page 318 of 980
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2. Perform settings for transfer to the TPU’s TGR. Set MRA to source address incrementing
(SM1 = 1, SM0 = 0), fixed destination address (DM1 = DM0 = 0), normal mode (MD1 = MD0
= 0), and word size (Sz = 1). Set the data table start address in SAR, the TGRA address in
DAR, and the data table size in CRA. CRB can be set to any value.
3. Locate the TPU transfer register information consecutively after the NDR transfer register
information.
4. Set the start address of the NDR transfer register information to the DTC vector address.
5. Set the bit corresponding to TGIA in DTCER to 1.
6. Set TGRA as an output compare register (output disabled) with TIOR, and enable the TGIA
interrupt with TIER.
7. Set the initial output value in PODR, and the next output value in NDR. Set bits in DDR and
NDER for which output is to be performed to 1. Using PCR, select the TPU compare match to
be used as the output trigger.
8. Set the CST bit in TSTR to 1, and start the TCNT count operation.
9. Each time a TGRA compare match occurs, the next output value is transferred to NDR and the
set value of the next output trigger period is transferred to TGRA. The activation source TGFA
flag is cleared.
10. When the specified number of transfers are completed (the TPU transfer CRA value is 0), the
TGFA flag is held at 1, the DTCE bit is cleared to 0, and a TGIA interrupt request is sent to the
CPU. Termination processing should be performed in the interrupt handling routine.
8.7.3 Chain Transfer when Counter = 0
By executing a second data transfer, and performing re-setting of the first data transfer, only when
the counter value is 0, it is possible to perform 256 or more repeat transfers.
An example is shown in which a 128-kbyte input buffer is configured. The input buffer is assumed
to have been set to start at lower address H'0000. Figure 8.13 shows the chain transfer when the
counter value is 0.
1. For the first transfer, set the normal mode for input data. Set fixed transfer source address
(G/A, etc.), CRA = H'0000 (65,536 times), and CHNE = 1, CHNS = 1, and DISEL = 0.
2. Prepare the upper 8-bit addresses of the start addresses for each of the 65,536 transfer start
addresses for the first data transfer in a separate area (in ROM, etc.). For example, if the input
buffer comprises H'200000 to H'21FFFF, prepare H'21 and H'20.
3. For the second transfer, set repeat mode (with the source side as the repeat area) for re-setting
the transfer destination address for the first data transfer. Use the upper 8 bits of DAR in the
first register information area as the transfer destination. Set CHNE = DISEL = 0. If the above
input buffer is specified as H'200000 to H'21FFFF, set the transfer counter to 2.
Section 8 Data Transfer Controller (DTC)
Rev.6.00 Mar. 18, 2009 Page 319 of 980
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4. Execute the first data transfer 65,536 times by means of interrupts. When the transfer counter
for the first data transfer reaches 0, the second data transfer is started. Set the upper 8 bits of
the transfer source address for the first data transfer to H'21. The lower 16 bits of the transfer
destination address of the first data transfer and the transfer counter are H'0000.
5. Next, execute the first data transfer the 65,536 times specified for the first data transfer by
means of interrupts. When the transfer counter for the first data transfer reaches 0, the second
data transfer is started. Set the upper 8 bits of the transfer source address for the first data
transfer to H'20. The lower 16 bits of the transfer destination address of the first data transfer
and the transfer counter are H'0000.
6. Steps 4 and 5 are repeated endlessly. As repeat mode is specified for the second data transfer,
an interrupt request is not sent to the CPU.
First data
transfer register
information
Second data
transfer register
information
Chain transfer
(counter = 0) Upper 8 bits
of DAR
Input buffer
Input circuit
Figure 8.13 Chain Transfer when Counter = 0
Section 8 Data Transfer Controller (DTC)
Rev.6.00 Mar. 18, 2009 Page 320 of 980
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8.7.4 Software Activation
An example is shown in which the DTC is used to transfer a block of 128 bytes of data by means
of software activation. The transfer source address is H'1000 and the destination address is
H'2000. The vector number is H'60, so the vector address is H'04C0.
1. Set MRA to incrementing source address (SM1 = 1, SM0 = 0), incrementing destination
address (DM1 = 1, DM0 = 0), block transfer mode (MD1 = 1, MD0 = 0), and byte size (Sz =
0). The DTS bit can have any value. Set MRB for one block transfer by one interrupt (CHNE =
0). Set the transfer source address (H'1000) in SAR, the destination address (H'2000) in DAR,
and 128 (H'8080) in CRA. Set 1 (H'0001) in CRB.
2. Set the start address of the register information at the DTC vector address (H'04C0).
3. Check that the SWDTE bit in DTVECR is 0. Check that there is currently no transfer activated
by software.
4. Write 1 to the SWDTE bit and the vector number (H'60) to DTVECR. The write data is H'E0.
5. Read DTVECR again and check that it is set to the vector number (H'60). If it is not, this
indicates that the write failed. This is presumably because an interrupt occurred between steps
3 and 4 and led to a different software activation. To activate this transfer, go back to step 3.
6. If the write was successful, the DTC is activated and a block of 128 bytes of data is transferred.
7. After the transfer, an SWDTEND interrupt occurs. The interrupt handling routine should clear
the SWDTE bit to 0 and perform other wrap-up processing.
Section 8 Data Transfer Controller (DTC)
Rev.6.00 Mar. 18, 2009 Page 321 of 980
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8.8 Usage Notes
8.8.1 Module Stop Mode Setting
DTC operation can be disabled or enabled using the module stop control register. The initial
setting is for DTC operation to be enabled. Register access is disabled by setting module stop
mode. Module stop mode cannot be set while the DTC is activated. For details, refer to section 23,
Power-Down Modes.
8.8.2 On-Chip RAM
The MRA, MRB, SAR, DAR, CRA, and CRB registers are all located in on-chip RAM. When the
DTC is used, the RAME bit in SYSCR must not be cleared to 0.
8.8.3 DTCE Bit Setting
For DTCE bit setting, use bit manipulation instructions such as BSET and BCLR. If all interrupts
are disabled, multiple activation sources can be set at one time (only at the initial setting) by
writing data after executing a dummy read on the relevant register.
8.8.4 DMAC Transfer End Interrupt
When DTC transfer is activated by a DMAC transfer end interrupt, regardless of the transfer
counter and DISEL bit, the DMAC’s DTE bit is not subject to DTC control, and the write data has
priority. Consequently, an interrupt request may not be sent to the CPU when the DTC transfer
counter reaches 0.
8.8.5 Chain Transfer
When chain transfer is used, clearing of the activation source or DTCER is performed when the
last of the chain of data transfers is executed. SCI and A/D converter interrupt/activation sources,
on the other hand, are cleared when the DTC reads or writes to the prescribed register.
Therefore, when the DTC is activated by an interrupt or activation source, if a read/write of the
relevant register is not included in the last chained data transfer, the interrupt or activation source
will be retained.
Section 8 Data Transfer Controller (DTC)
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Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 323 of 980
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Section 9 I/O Ports
Table 9.1 summarizes the port functions. The pins of each port also have other functions such as
input/output or external interrupt input pins of on-chip peripheral modules. Each I/O port includes
a data direction register (DDR) that controls input/output, a data register (DR) that stores output
data, and a port register (PORT) used to read the pin states. The input-only ports do not have a DR
or DDR register.
Ports A to E have a built-in pull-up MOS function and a pull-up MOS control register (PCR) to
control the on/off state of MOS input pull-up.
Ports 3 and A include an open-drain control register (ODR) that controls the on/off state of the
output buffer PMOS.
Ports 1 to 3, 5 (P50 to P53), and 8 (P81, P83, P85)can drive a single TTL load and 30 pF
capacitive load. Ports A to G can drive a single TTL load and 50 pF capacitive load.
All of the I/O ports can drive a Darlington transistor when outputting data.
Ports 1 and 2 are Schmitt-triggered inputs. Ports 4, 5, and A (PA4, PA5, PA6, PA7) are Schmitt-
triggered inputs when used as IRQ inputs.
Section 9 I/O Ports
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Table 9.1 Port Functions
Mode 7
Port Description Mode 1* Mode 2* Mode 4 EXPE = 1 EXPE = 0
Input/
Output
Type
Port 1 General I/O port
also functioning
as PPG outputs,
TPU I/Os, and
DMAC I/Os
P17/PO15/TIOCB2/TCLKD
P16/PO14/TIOCA2
P15/PO13/TIOCB1/TCLKC/DACK1
P14/PO12/TIOCA1/DACK0
P13/PO11/TIOCD0/TCLKB/TEND1
P12/PO10/TIOCC0/TCLKA/TEND0
P11/PO9/TIOCB0/DREQ1
P10/PO8/TIOCA0/DREQ0
Schmitt-
triggered
input
Port 2 General I/O port
also functioning
as PPG outputs,
TPU I/Os, and
TMR I/Os
P27/PO7/TIOCB5
P26/PO6/TIOCA5
P25/PO5/TIOCB4/TMO1
P24/PO4/TIOCA4/RxD4/TMO0
P23/PO3/TIOCD3/TxD4/TMCI1
P22/PO2/TIOCC3/TMCI0
P21/PO1/TIOCB3/TMRI1
P20/PO0/TIOCA3/TMIR0
Schmitt-
triggered
input
P35/SCK1/SCL0/(OE) P35/SCK1/
SCL0(OE)
P35/SCK1/
SCL0
Port 3 General I/O port
also functioning
as SCI I/Os, I2C
I/Os, and bus
control I/Os
P34/SCK0/SCK4/SDA0
P33/RxD1/SCL1
P32/RxD0/IrRxD/SDA1
P31/TxD1
P30/TxD0/IrTxD
Open-
drain
output
capability
Port 4 General I/O port
also functioning
as A/D converter
analog inputs and
D/A converter
analog outputs
P47/AN7/(IRQ7)
P46/AN6/(IRQ6)
P45/AN5/(IRQ5)
P44/AN4/(IRQ4)
P43/AN3/(IRQ3)
P42/AN2/(IRQ2)
P41/AN1/(IRQ1)
P40/AN0/(IRQ0)
Schmitt-
triggered
input when
used as
IRQ input
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 325 of 980
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Mode 7
Port Description Mode 1* Mode 2* Mode 4 EXPE = 1 EXPE = 0
Input/
Output
Type
Port 5 General I/O port
also functioning
as interrupt inputs,
A/D converter
inputs, and SCI
I/Os
P53/ADTRG/IRQ3
P52/SCK2/IRQ2
P51/RxD2/IRQ1
P50/TxD2/IRQ0
Schmitt-
triggered
input when
used as
IRQ input
Port 8 General I/O port
also functioning
as SCI I/Os
P85/SCK3
P83/RxD3
P81/TxD3
Port 9 Dedicated input
port also
functioning as A/D
converter analog
inputs and D/A
converter analog
outputs
P95/AN13/DA3
P94/AN12/DA2
Port A General I/O port
also functioning
as address
outputs interrupt
inputs, and bus
control I/Os
PA7/A23/CS7/IRQ7
PA6/A22/IRQ6
PA5/A21/IRQ5
A20/IRQ4
A19
A18
A17
A16
PA7/A23/
CS7/
IRQ7
PA6/A22/
IRQ6
PA5/A21/
IRQ5
PA4/A20/
IRQ4
PA3/A19
PA2/A18
PA1/A17
PA0/A16
PA7/A23/
CS7/
IRQ7
PA6/A22/
IRQ6
PA5/A21/
IRQ5
PA4/A20/
IRQ4
PA3/A19
PA2/A18
PA1/A17
PA0/A16
PA7/IRQ7
PA6/IRQ6
PA5/IRQ5
PA4/IRQ4
PA3
PA2
PA1
PA0
Only PA4
to PA7 are
Schmitt-
triggered
input when
used as
IRQ input.
Built-in
MOS input
pull-up
Open-
drain
output
capability
Port B General I/O port
also functioning
as address
outputs
A15
A14
A13
A12
A11
A10
A9
A8
PB7/A15
PB6/A14
PB5/A13
PB4/A12
PB3/A11
PB2/A10
PB1/A9
PB0/A8
PB7/A15
PB6/A14
PB5/A13
PB4/A12
PB3/A11
PB2/A10
PB1/A9
PB0/A8
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
Built-in
MOS input
pull-up
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 326 of 980
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Mode 7
Port Description Mode 1* Mode 2* Mode 4 EXPE = 1 EXPE = 0
Input/
Output
Type
Port C General I/O port
also functioning
as address
outputs
A7
A6
A5
A4
A3
A2
A1
A0
PC7/A7
PC6/A6
PC5/A5
PC4/A4
PC3/A3
PC2/A2
PC1/A1
PC0/A0
PC7/A7
PC6/A6
PC5/A5
PC4/A4
PC3/A3
PC2/A2
PC1/A1
PC0/A0
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
Built-in
MOS input
pull-up
Port D General I/O port
also functioning
as data I/Os
D15
D14
D13
D12
D11
D10
D9
D8
D15
D14
D13
D12
D11
D10
D9
D8
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
Built-in
MOS input
pull-up
Port E General I/O port
also functioning
as data I/Os
PE7/D7
PE6/D6
PE5/D5
PE4/D4
PE3/D3
PE2/D2
PE1/D1
PE0/D0
PE7/D7
PE6/D6
PE5/D5
PE4/D4
PE3/D3
PE2/D2
PE1/D1
PE0/D0
PE7
PE6
PE5
PE4
PE3
PE2
PE1
PE0
Built-in
MOS input
pull-up
Port F General I/O port
also functioning
as interrupt inputs
and bus control
I/Os
PF7/φ
PF6/AS
RD
HWR
PF3/LWR
PF7/φ
PF6/AS
RD
HWR
PF3/LWR
PF7/φ
PF6
PF5
PF4
PF3
PF2/CS6/LCAS PF2/CS6/
LCAS
PF2
PF1/CS5/UCAS PF1/CS5/
UCAS
PF1
PF0/WAIT/OE PF0/WAIT/OE PF0
Section 9 I/O Ports
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Mode 7
Port Description Mode 1* Mode 2* Mode 4 EXPE = 1 EXPE = 0
Input/
Output
Type
Port G General I/O port
also functioning
as bus control
I/Os
PG6/BREQ
PG5/BACK
PG4/CS4/BREQO
PG3/CS3/RAS3
PG2/CS2/RAS2
PG1/CS1
PG0/CS0
PG6/BREQ
PG5/BACK
PG4/CS4/
BREQO
PG3/CS3/
RAS3
PG2/CS2/
RAS2
PG1/CS1
PG0/CS0
PG6
PG5
PG4
PG3
PG2
PG1
PG0
Note: * Only modes 1 and 2 are available in the ROMless version.
9.1 Port 1
Port 1 is an 8-bit I/O port that also has other functions. The port 1 has the following registers.
• Port 1 data direction register (P1DDR)
• Port 1 data register (P1DR)
• Port 1 register (PORT1)
9.1.1 Port 1 Data Direction Register (P1DDR)
The individual bits of P1DDR specify input or output for the pins of port 1.
Bit Bit Name Initial Value R/W Description
7 P17DDR 0 W
6 P16DDR 0 W
5 P15DDR 0 W
4 P14DDR 0 W
When a pin function is specified to a general purpose
I/O, setting this bit to 1 makes the corresponding port
1 pin an output pin, while clearing this bit to 0 makes
the pin an input pin.
3 P13DDR 0 W
2 P12DDR 0 W
1 P11DDR 0 W
0 P10DDR 0 W
Section 9 I/O Ports
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9.1.2 Port 1 Data Register (P1DR)
P1DR stores output data for the port 1 pins.
Bit Bit Name Initial Value R/W Description
7 P17DR 0 R/W
6 P16DR 0 R/W
5 P15DR 0 R/W
4 P14DR 0 R/W
Output data for a pin is stored when the pin function
is specified to a general purpose I/O.
3 P13DR 0 R/W
2 P12DR 0 R/W
1 P11DR 0 R/W
0 P10DR 0 R/W
9.1.3 Port 1 Register (PORT1)
PORT1 shows the pin states.
PORT1 cannot be modified.
Bit Bit Name Initial Value R/W Description
7 P17 —* R
6 P16 —* R
5 P15 —* R
4 P14 —* R
If a port 1 read is performed while P1DDR bits are
set to 1, the P1DR values are read. If a port 1 read is
performed while P1DDR bits are cleared to 0, the pin
states are read.
3 P13 —* R
2 P12 —* R
1 P11 —* R
0 P10 —* R
Note: * Determined by the states of pins P17 to P10.
Section 9 I/O Ports
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9.1.4 Pin Functions
Port 1 pins also function as the pins for PPG outputs, TPU I/Os, and DMAC outputs. The
correspondence between the register specification and the pin functions is shown below.
• P17/PO15/TIOCB2/TCLKD
The pin function is switched as shown below according to the combination of the TPU channel
2 settings (by bits MD3 to MD0 in TMDR_2, bits IOB3 to IOB0 in TIOR_2, and bits CCLR1
and CCLR0 in TCR_2), bits TPSC2 to TPSC0 in TCR_0 and TCR_5, bit NDER15 in
NDERH, and bit P17DDR.
TPU channel 2
settings
(1) in table below (2) in table below
P17DDR — 0 1 1
NDER15 — — 0 1
P17 input P17 output PO15 output TIOCB2 output
TIOCB2 input*1
Pin function
TCLKD input*2
Notes: 1. TIOCB2 input when MD3 to MD0 = B'0000 or B'01×× and IOB3 = 1.
2. TCLKD input when the setting for either TCR_0 or TCR_5 is TPSC2 to TPSC0 = B'111.
TCLKD input when channels 2 and 4 are set to phase counting mode.
TPU channel 2
settings
(2) (1) (2) (2) (1) (2)
MD3 to MD0 B'0000, B'01×× B'0010 B'0011
IOB3 to IOB0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
— B'××00 Other than B'××00
CCLR1, CCLR0 — — — — Other than
B'10
B'10
Output function — Output
compare
output
— — PWM mode
2 output
—
Legend:
×: Don’t care
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 330 of 980
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• P16/PO14/TIOCA2
The pin function is switched as shown below according to the combination of the TPU channel
2 settings (by bits MD3 to MD0 in TMDR_2, bits IOA3 to IOA0 in TIOR_2, and bits CCLR1
and CCLR0 in TCR_2), bit NDER14 in NDERH, and bit P16DDR.
TPU channel 2
settings
(1) in table below (2) in table below
P16DDR — 0 1 1
NDER14 — — 0 1
TIOCA2 output P16 input P16 output PO14 output Pin function
TIOCA2 input*1
Note: 1. TIOCA2 input when MD3 to MD0 = B'0000 or B'01×× and IOA3 = 1.
TPU channel 1
settings
(2) (1) (2) (2) (1) (2)
MD3 to MD0 B'0000, B'01×× B'001× B'0010 B'0011
IOA3 to IOA0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00 Other than B'××00
CCLR1, CCLR0 — — — — Other than
B'10
B'10
Output function — Output
compare
output
— PWM*2 mode
1 output
PWM
mode 2
output
—
Legend:
×: Don’t care
Note: 2. TIOCB2 output disabled.
Section 9 I/O Ports
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• P15/PO13/TIOCB1/TCLKC/DACK1
The pin function is switched as shown below according to the combination of the TPU channel
1 settings (by bits MD3 to MD0 in TMDR_1, bits IOB3 to IOB0 in TIOR_1, and bits CCLR1
and CCLR0 in TCR_1), bits TPSC2 to TPSC0 in TCR_0, TCR_2, TCR_4, and TCR_5, bit
NDER13 in NDERH, bit SAE1 in DMA BCRH and bit P15DDR.
SAE1 0 1 1
TPU channel 2
settings
(1) in table below (2) in table below —
P15DDR — 0 1 1 —
NDER13 — — 0 1 —
P15
input
P15 output PO13 output TIOCB1 output
TIOCB1 input*1
DACK1
output
Pin function
TCLKC input*2
Notes: 1. TIOCB1 input when MD3 to MD0 = B'0000 or B'01×× and IOB3 to IOB0 = B'10××.
2. TCLKC input when the setting for either TCR_0 or TCR_2 is TPSC2 to TPSC0 = B'111,
or when the setting for either TCR_4 or TCR_5 is TPSC2 to TPSC0 = B'101.
TCLKC input when phase counting mode is set for channels 2 and 4.
TPU channel 1
settings
(2) (1) (2) (2) (1) (2)
MD3 to MD0 B'0000, B'01×× B'0010 B'0011
IOB3 to IOB0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
— B'××00 Other than B'××00
CCLR1, CCLR0 — — — — Other than
B'10
B'10
Output function — Output
compare
output
— — PWM mode
2 output
—
Legend:
×: Don’t care
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 332 of 980
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• P14/PO12/TIOCA1/DACK0
The pin function is switched as shown below according to the combination of the TPU channel
1 settings (by bits MD3 to MD0 in TMDR_1, bits IOA3 to IOA0 in TIOR_1, and bits CCLR1
and CCLR0 in TCR_1), bit NDER12 in NDERH, bit SAE0 in DMABCRH and bit P14DDR.
SAE0 0 1 1
TPU channel 1
settings
(1) in table below (2) in table below —
P14DDR — 0 1 1 —
NDER12 — — 0 1 —
P14 input P14 output PO12 output Pin function TIOCB1 output
TIOCA1 input*1
DACK0
output
Note: 1. TIOCA1 input when MD3 to MD0 = B'0000, and B'01×× and IOA3 to IOA0 = B'10××.
TPU channel 1
settings
(2) (1) (2) (1) (1) (2)
MD3 to MD0 B'0000, B'01×× B'001× B'0010 B'0011
IOA3 to IOA0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00 Other
than B'××00
Other than B'××00
CCLR1, CCLR0 — — — — Other than
B'01
B'01
Output function — Output
compare
output
— PWM*2
mode 1
output
PWM mode
2 output
—
Legend:
×: Don’t care
Note: 2. TIOCB1 output disabled.
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 333 of 980
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• P13/PO11/TIOCD0/TCLKB/TEND1
The pin function is switched as shown below according to the combination of the TPU channel
0 settings (by bits MD3 to MD0 in TMDR_0, bits IOD3 to IOD0 in TIOR0L, and bits CCLR2
to CCLR0 in TCR_0), bits TPSC2 to TPSC0 in TCR_0 to TCR_2, bit NDER11 in NDERH,
bit TEE1 in DMATCR of DMAC and bit P13DDR.
TEE1 0 1
TPU channel 0
settings
(1) in table below (2) in table below — —
P13DDR — 0 1 1 —
NDER11 — — 0 1 —
P13 input P13 output PO11 output TIOCD0 output
TIOCD0 input*1
TEND1 output
Pin function
TCLKB input*2
Notes: 1. TIOCD0 input when MD3 to MD0 = B'0000 and IOD3 to IOD0 = B'10××.
2. TCLKB input when the setting for any of TCR_0 to TCR_2 is TPSC2 to TPSC0 = B'101.
TCLKB input when phase counting mode is set for channels 1 and 5.
TPU channel 0
settings
(2) (1) (2) (2) (1) (2)
MD3 to MD0 B'0000 B'0010 B'0011
IOD3 to IOD0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
— B'××00 Other than B'××00
CCLR2, CCLR0 — — — — Other than
B'110
B'110
Output function — Output
compare
output
— — PWM mode
2 output
—
Legend:
×: Don’t care
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 334 of 980
REJ09B0050-0600
• P12/PO10/TIOCC0/TCLKA/TEND0
The pin function is switched as shown below according to the combination of the TPU channel
0 settings (by bits MD3 to MD0 in TMDR_0, bits IOC3 to IOC0 in TIORL_0, and bits CCLR2
to CCLR0 in TCR_0), bits TPSC2 to TPSC0 in TCR_0 to TCR_5, bit NDER10 in NDERH,
bit TEE0 in DMATCR of DMAC and bit P12DDR.
TEE0 0 1
TPU channel 2
settings
(1) in table below (2) in table below —
P12DDR — 0 1 1 —
NDER10 — — 0 1 —
P12 input P12 output PO10 output TIOCO0 output
TIOCC0 input*1
TEND0
output
Pin function
TCLKA input*2
Notes: 1. TIOCC0 input when MD3 to MD0 = B'0000 and IOC3 to IOC0 = B'10××.
2. TCLKA input when the setting for any of TCR_0 to TCR_5 is TPSC2 to TPSC0 = B'100.
TCLKA input when phase counting mode is set for channels 1 and 5.
TPU channel 0
settings
(2) (1) (2) (1) (1) (2)
MD3 to MD0 B'0000 B'001× B'0010 B'0011
IOC3 to IOC0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00 Other
than B'××00
Other than B'××00
CCLR2, CCLR0 — — — — Other than
B'101
B'101
Output function — Output
compare
output
— PWM*3
mode 1
output
PWM mode
2 output
—
Legend:
×: Don’t care
Note: 3. TIOCD0 output disabled.
Output disabled and settings (2) effective when BFA = 1 or BFB = 1 in TMDR_0.
Section 9 I/O Ports
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• P11/PO9/TIOCB0/DREQ1
The pin function is switched as shown below according to the combination of the TPU channel
0 settings (by bits MD3 to MD0 in TMDR_0, bits IOB3 to IOB0 in TIORH_0, and bits
CCLR2 to CCLR0 in TCR_0), bit NDER9 in NDERH, and bit P11DDR.
TPU channel 0
settings
(1) in table below (2) in table below
P11DDR — 0 1 1
NDER9 — — 0 1
P11 input P11 output PO9 output TIOCB0 output
TIOCB0 input*
Pin function
DREQ1 input
Note: * TIOCB0 input when MD3 to MD0 = B'0000 and IOB3 to IOB0 = B'10××.
TPU channel 0
settings
(2) (1) (2) (2) (1) (2)
MD3 to MD0 B'0000 B'0010 B'0011
IOB3 to IOB0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
— B'××00 Other than B'××00
CCLR2, CCLR0 — — — — Other than
B'010
B'010
Output function — Output
compare
output
— — PWM mode
2 output
—
Legend:
×: Don’t care
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 336 of 980
REJ09B0050-0600
• P10/PO8/TIOCA0/DREQ0
The pin function is switched as shown below according to the combination of the TPU channel
0 settings (by bits MD3 to MD0 in TMDR_0, bits IOA3 to IOA0 in TIORH_0, and bits
CCLR2 to CCLR0 in TCR_0), bit NDER8 in NDERH, and bit P10DDR.
TPU channel 0
settings
(1) in table below (2) in table below
P10DDR — 0 1 1
NDER8 — — 0 1
P10 input P10 output PO8 output TIOCA0 output
TIOCA0 input*1
Pin function
DREQ0 input
Note: 1. TIOCA0 input when MD3 to MD0 = B'0000 and IOA3 to IOA0 = B'10××.
TPU channel 0
settings
(2) (1) (2) (1) (1) (2)
MD3 to MD0 B'0000 B'001× B'0010 B'0011
IOA3 to IOA0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00 Other
than B'××00
Other than B'××00
CCLR2, CCLR0 — — — — Other than
B'001
B'001
Output function — Output
compare
output
— PWM*2
mode 1
output
PWM mode
2 output
—
Legend:
×: Don’t care
Note: 2. TIOCB0 output disabled.
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 337 of 980
REJ09B0050-0600
9.2 Port 2
Port 2 is an 8-bit I/O port that also has other functions. The port 2 has the following registers.
• Port 2 data direction register (P2DDR)
• Port 2 data register (P2DR)
• Port 2 register (PORT2)
9.2.1 Port 2 Data Direction Register (P2DDR)
The individual bits of P2DDR specify input or output for the pins of port 2.
P2DDR cannot be read; if it is, an undefined value will be read.
Bit Bit Name Initial Value R/W Description
7 P27DDR 0 W
6 P26DDR 0 W
5 P25DDR 0 W
4 P24DDR 0 W
When a pin function is specified to a general
purpose I/O, setting this bit to 1 makes the
corresponding port 1 pin an output pin, while
clearing this bit to 0 makes the pin an input pin.
3 P23DDR 0 W
2 P22DDR 0 W
1 P21DDR 0 W
0 P20DDR 0 W
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 338 of 980
REJ09B0050-0600
9.2.2 Port 2 Data Register (P2DR)
P2DR stores output data for the port 2 pins.
Bit Bit Name Initial Value R/W Description
7 P27DR 0 R/W
6 P26DR 0 R/W
5 P25DR 0 R/W
4 P24DR 0 R/W
Output data for a pin is stored when the pin function
is specified to a general purpose I/O.
3 P23DR 0 R/W
2 P22DR 0 R/W
1 P21DR 0 R/W
0 P20DR 0 R/W
9.2.3 Port 2 Register (PORT2)
PORT2 shows the pin states.
PORT2 cannot be modified.
Bit Bit Name Initial Value R/W Description
7 P27 —* R
6 P26 —* R
5 P25 —* R
4 P24 —* R
If a port 2 read is performed while P2DDR bits are
set to 1, the P2DR values are read. If a port 2 read
is performed while P2DDR bits are cleared to 0, the
pin states are read.
3 P23 —* R
2 P22 —* R
1 P21 —* R
0 P20 —* R
Note: * Determined by the states of pins P27 to P20.
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 339 of 980
REJ09B0050-0600
9.2.4 Pin Functions
Port 2 pins also function as PPG outputs, TPU I/Os, and TMR I/Os. The correspondence between
the register specification and the pin functions is shown below.
• P27/PO7/TIOCB5
The pin function is switched as shown below according to the combination of the TPU channel
5 settings (by bits MD3 to MD0 in TMDR_5, bits IOB3 to IOB0 in TIOR_5, and bits CCLR1
and CCLR0 in TCR_5), bit NDER7 in NDERL, and bit P27DDR.
TPU channel 5
settings
(1) in table below (2) in table below
P27DDR — 0 1 1
NDER7 — — 0 1
P27 input P27 output PO7 output Pin function TIOCB5 output
TIOCB5 input*
Note: * TIOCB5 input when MD3 to MD0 = B'0000 or B'01×× and IOB3 = 1.
TPU channel 5
settings
(2) (1) (2) (2) (1) (2)
MD3 to MD0 B'0000 to B'01×× B'0010 B'0011
IOB3 to IOB0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
— B'××00 Other than B'××00
CCLR1, CCLR0 — — — — Other than
B'10
B'10
Output function — Output
compare
output
— — PWM mode
2 output
—
Legend:
×: Don’t care
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 340 of 980
REJ09B0050-0600
• P26/PO6/TIOCA5
The pin function is switched as shown below according to the combination of the TPU channel
5 settings (by bits MD3 to MD0 in TMDR_5, bits IOA3 to IOA0 in TIOR_5, and bits CCLR1
and CCLR0 in TCR_5), bit NDER6 in NDERL, and bit P26DDR.
TPU channel 5
settings
(1) in table below (2) in table below
P26DDR — 0 1 1
NDER6 — — 0 1
P26 input P26 output PO6 output Pin function TIOCA5 output
TIOCA5 input*1
Note: 1. TIOCA5 input when MD3 to MD0 = B'0000 or B'01×× and IOA3 = 1.
TPU channel 5
settings
(2) (1) (2) (2) (1) (2)
MD3 to MD0 B'0000 to B'00×× B'001× B'0010 B'0011
IOA3 to IOA0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00 Other than
B'××00
Other than B'××00
CCLR1, CCLR0 — — — — Other than
B'01
B'01
Output function — Output
compare
output
— PWM*2
mode 1
output
PWM mode
2 output
—
Legend:
×: Don’t care
Note: 2. TIOCB5 output disabled.
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 341 of 980
REJ09B0050-0600
• P25/PO5/TIOCB4/TMO1
The pin function is switched as shown below according to the combination of the TPU channel
4 settings (by bits MD3 to MD0 in TMDR_4, bits IOB3 to IOB0 in TIOR_4, and bits CCLR1
and CCLR0 in TCR_4), bit NDER5 in NDERL, bit P25DDR, and bits OS3 to USO in TCSRI
of TMR.
TPU channel 4
settings
(1) in table below (2) in table below
OS3 to OS0 — All 0 All 1 One value is 1
P25DDR — 0 1 1 —
NDER5 — — 0 1 —
P25 input P25 output PO5 output TMO1 output Pin function TIOCB4 output
TIOCB4 input*
Note: * TIOCB4 input when MD3 to MD0 = B'0000 or B'01×× and IOB3 to IOB0 = B'10××.
TPU channel 4
settings
(2) (1) (2) (2) (1) (2)
MD3 to MD0 B'0000 to B'01×× B'0010 B'0011
IOB3 to IOB0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
— B'××00 Other than B'××00
CCLR1, CCLR0 — — — — Other than
B'10
B'10
Output function — Output
compare
output
— — PWM mode
2 output
—
Legend:
×: Don’t care
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 342 of 980
REJ09B0050-0600
• P24/PO4/TIOCA4/RxD4/TMO0
The pin function is switched as shown below according to the combination of the TPU channel
4 settings (by bits MD3 to MD0 in TMDR_4, bits IOA3 to IOA0 in TIOR_4, and bits CCLR1
and CCLR0 in TCR4), bit NDER4 in NDERL, bit RE in SCI_4, bit P24DDR, and bit OS3 to
OS0 in TCSRO of TMR.
RE 0 1
TPU channel 4
settings
(1) in table below (2) in table below —
OS3 to OS0 All 0 Not all 0 —
P24DDR — 0 1 1 — —
NDER4 — — 0 1 — —
P24
input
P24
output
PO4
output
TMO0
output
Pin function TIOCA4 output
TIOCA4 input*1
RXD4 input
Note: 1. TIOCA4 input when MD3 to MD0 = B'0000 or B'01×× and IOA3 to IOA0 = B'10××.
TPU channel 4
settings
(2) (1) (2) (1) (1) (2)
MD3 to MD0 B'0000 to B'01×× B'001× B'0010 B'0011
IOA3 to IOA0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00 Other than
B'××00
Other than B'××00
CCLR1, CCLR0 — — — — Other than
B'01
B'01
Output function — Output
compare
output
— PWM*2
mode 1
output
PWM mode
2 output
—
Legend:
×: Don’t care
Note: 2. TIOCB4 output disabled.
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 343 of 980
REJ09B0050-0600
• P23/PO3/TIOCD3/TXD4/TMCI1
The pin function is switched as shown below according to the combination of the TPU channel
3 settings (by bits MD3 to MD0 in TMDR_3, bits IOD3 to IOD0 in TIORL_3, and bits
CCLR2 to CCLR0 in TCR_3), bit NDER3 in NDERL, bit TE in SCR of SCI_4, and bit
P23DDR.
TPU channel 3
settings
(1) in table below (2) in table below
TE 0 1
P23DDR — 0 1 1 —
NDER3 — — 0 1 —
P23 input P23 output PO3 output TIOCD3 output
TIOCD3 input*1
TxD4 output
Pin function
TMCI1 input*2
Notes: 1. TIOCD3 input when MD3 to MD0 = B'0000 and IOD3 to IOD0 = B'10××.
2. When used as the TMR external clock input pin, the external clock is selected by the
CKS2 to CKS0 bits in TCR1.
TPU channel 3
settings
(2) (1) (2) (2) (1) (2)
MD3 to MD0 B'0001 to B'0011 B'0010 B'0011
IOD3 to IOD0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
— B'××00 Other than B'××00
CCLR2 to
CCLR0
— — — — Other than
B'110
B'110
Output function — Output
compare
output
— — PWM mode
2 output
—
Legend:
×: Don’t care
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 344 of 980
REJ09B0050-0600
• P22/PO2/TIOCC3/TMCI0
The pin function is switched as shown below according to the combination of the TPU channel
3 settings (by bits MD3 to MD0 in TMDR_3, bits IOC3 to IOC0 in TIORL_3, and bits CCLR2
to CCLR0 in TCR_3), bit NDER2 in NDERL, and bit P22DDR.
TPU channel 3
settings
(1) in table below (2) in table below
P22DDR — 0 1 1
NDER2 — — 0 1
P22 input P22 output PO2 output TIOCC3 output
TIOCC3 input*1
Pin function
TMCI0 input*2
Notes: 1. TIOCC3 input when MD3 to MD0 = B'0000 and IOC3 to IOC0 = B'10××.
2. When used as the TMR external clock input pin, the external clock is selected by the
CKS2 to CKS0 bits in TCR_1.
TPU channel 3
settings
(2) (1) (2) (1) (1) (2)
MD3 to MD0 B'0000 B'001× B'0010 B'0011
IOC3 to IOC0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00 Other than
B'××00
Other than B'××00
CCLR2 to
CCLR0
— — — — Other than
B'101
B'101
Output function — Output
compare
output
— PWM*3
mode 1
output
PWM mode
2 output
—
Legend:
×: Don’t care
Note: 3. TIOCD3 output disabled.
Output disabled and settings (2) effective when BFA = 1 or BFB = 1 in TMDR_3.
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 345 of 980
REJ09B0050-0600
• P21/PO1/TIOCB3/TMRI1
The pin function is switched as shown below according to the combination of the TPU channel
3 settings (by bits MD3 to MD0 in TMDR_3, bits IOB3 to IOB0 in TIORH_3, and bits
CCLR2 to CCLR0 in TCR_3), bit NDER1 in NDERL, and bit P21DDR.
TPU channel 3
settings
(1) in table below (2) in table below
P21DDR — 0 1 1
NDER1 — — 0 1
P21 input P21 output PO1 output TIOCB3 output
TIOCB3 input*1
Pin function
TMRI1 input*2
Notes: 1. TIOCB3 input when MD3 to MD0 = B'0000 and IOB3 to IOB0 = B'10××.
2. When used as the TMR counter reset pin, set both the CCLR1 and CCLR0 bits in
TCR_1 to 1.
TPU channel 3
settings
(2) (1) (2) (2) (1) (2)
MD3 to MD0 B'0000 B'0010 B'0011
IOB3 to IOB0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
— B'××00 Other than B'××00
CCLR2 to
CCLR0
— — — — Other than
B'010
B'010
Output function — Output
compare
output
— — PWM mode
2 output
—
Legend:
×: Don’t care
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 346 of 980
REJ09B0050-0600
• P20/PO0/TIOCA3/TMRI0
The pin function is switched as shown below according to the combination of the TPU channel
3 settings (by bits MD3 to MD0 in TMDR_3, bits IOA3 to IOA0 in TIORH_3, and bits
CCLR2 to CCLR0 in TCR_3), bit NDER0 in NDERL, and bit P20DDR.
TPU channel 3
settings
(1) in table below (2) in table below
P20DDR — 0 1 1
NDER0 — — 0 1
P20 input P20 output PO0 output TIOCA3 output
TIOCA0 input*1
Pin function
TMRI0 input*2
Notes: 1. TIOCA3 input when MD3 to MD0 = B'0000 and IOA3 to IOA0 = B'10××.
2. When used as the TMR counter reset pin, set both the CCLR1 and CCLR0 bits in
TCR_1 to 1.
TPU channel 3
settings
(2) (1) (2) (1) (1) (2)
MD3 to MD0 B'0000 B'001× B'0010 B'0011
IOA3 to IOA0 B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00 Other than
B'××00
Other than
B'××00
CCLR2 to
CCLR0
— — — — Other than
B'001
B'001
Output function — Output
compare
output
— PWM*3
mode 1
output
PWM mode
2 output
—
Legend:
×: Don’t care
Note: 3. TIOCB3 output disabled.
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 347 of 980
REJ09B0050-0600
9.3 Port 3
Port 3 is a 6-bit I/O port that also has other functions. The port 3 has the following registers.
• Port 3 data direction register (P3DDR)
• Port 3 data register (P3DR)
• Port 3 register (PORT3)
• Port 3 open drain control register (P3ODR)
• Port function control register 2(PFCR2)
9.3.1 Port 3 Data Direction Register (P3DDR)
The individual bits of P3DDR specify input or output for the pins of port 3.
P3DDR cannot be read; if it is, an undefined value will be read.
Bit Bit Name Initial Value R/W Description
7, 6 — All 0 — Reserved
These bits are always read as 0 and cannot be
modified.
5 P35DDR 0 W
4 P34DDR 0 W
3 P33DDR 0 W
When a pin function is specified to a general
purpose I/O, setting this bit to 1 makes the
corresponding port 1 pin an output pin, while
clearing this bit to 0 makes the pin an input pin.
2 P32DDR 0 W
1 P31DDR 0 W
0 P30DDR 0 W
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 348 of 980
REJ09B0050-0600
9.3.2 Port 3 Data Register (P3DR)
P3DR stores output data for the port 3 pins.
Bit Bit Name Initial Value R/W Description
7, 6 — All 0 — Reserved
These bits are always read as 0 and cannot be
modified.
5 P35DR 0 R/W
4 P34DR 0 R/W
3 P33DR 0 R/W
Output data for a pin is stored when the pin function
is specified to a general purpose I/O.
2 P32DR 0 R/W
1 P31DR 0 R/W
0 P30DR 0 R/W
9.3.3 Port 3 Register (PORT3)
PORT3 shows the pin states.
PORT3 cannot be modified.
Bit Bit Name Initial Value R/W Description
7, 6 — All 0 — Reserved
These bits are always read as 0 and cannot be
modified.
5 P35 —* R
4 P34 —* R
3 P33 —* R
If a port 3 read is performed while P3DDR bits are
set to 1, the P3DR values are read. If a port 1 read
is performed while P3DDR bits are cleared to 0, the
pin states are read.
2 P32 —* R
1 P31 —* R
0 P30 —* R
Note: * Determined by the states of pins P35 to P30.
Section 9 I/O Ports
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REJ09B0050-0600
9.3.4 Port 3 Open Drain Control Register (P3ODR)
P3ODR controls the output status for each port 3 pin.
Bit Bit Name Initial Value R/W Description
7, 6 — All 0 — Reserved
These bits are always read as 0 and cannot be
modified.
5 P35ODR 0 R/W
4 P34ODR 0 R/W
3 P33ODR 0 R/W
Setting a P3ODR bit to 1 makes the corresponding
port 3 pin an NMOS open-drain output pin, while
clearing the bit to 0 makes the pin a CMOS output
pin.
2 P32ODR 0 R/W
1 P31ODR 0 R/W
0 P30ODR 0 R/W
Section 9 I/O Ports
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9.3.5 Port Function Control Register 2 (PFCR2)
PFCR2 controls the I/O port.
Bit Bit Name Initial Value R/W Description
7
to
4
— All 0 — Reserved
These bits are always read as 0 and cannot be
modified.
3 ASOE 1 R/W AS Output Enable
Selects to enable or disable the AS output pin.
0: PF6 is designated as I/O port
1: PF6 is designated as AS output pin
2 LWROE 1 R/W LWR Output Enable
Selects to enable or disable the LWR output pin.
0: PF3 is designated as I/O port
1: PF3 is designated as LWR output pin
1 OES 1 R/W OE Output Select
Selects the OE output pin port when the OEE bit is
set to 1 in DRAMCR (enabling OE output).
0: P35 is designated as OE output pin
1: PH3 is designated as OE output pin
0 — 0 — Reserved
This bit is always read as 0 and cannot be modified.
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 351 of 980
REJ09B0050-0600
9.3.6 Pin Functions
Port 3 pins also function as the pins for SCI I/Os, I2C output, and a bus control signal output. The
correspondence between the register specification and the pin functions is shown below.
• P35/SCK1/SCL0/(OE)
The pin function is switched as shown below according to the combination of the ICE bit in
ICCRA of I2C_0, C/A bit in SMR of SCI_1, bits CKE0 and CKE1 in SCR, bits OEE in
DRAMCR, bit OES in PFCR2, and bit P35DDR.
Modes 1, 2, 4, 7 (EXPE = 1)
OEE 0 1
OES — 1 0
ICE — 1 0 1 —
CKE1 0 1 — 0 1 — —
C/A 0 1 — — 0 1 — — —
CKE0 0 1 — — — 0 1 — — — —
P35DDR 0 1 — — — — 0 1 — — — — —
Pin
function
P35
input
P35
output*1
SCK1
output*1
SCK1
output*1
SCK1
input
SCL0
I/O*2
P35
input
P35
output*1
SCK1
output*1
SCK1
output*1
SCK1
input
SCL0
I/O*2
OE output
Mode 7 (EXPE = 0)
OEE —
OES —
ICE 0 1
CKE1 0 1 —
C/A 0 1 — —
CKE0 0 1 — — —
P35DDR 0 1 — — — —
Pin function P35
input
P35
output*1
SCK1
output*1
SCK1
output*1
SCK1
input
SCL0
I/O*2
Notes: 1. NMOS open-drain output when P35ODR = 1.
2. NMOS open-drain output regardless of P35ODR
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 352 of 980
REJ09B0050-0600
• P34/SCK0/SCK4/SDA0
The pin function is switched as shown below according to the combination of bit ICE in ICCRA
of I2C_0, bit C/A in SMR, bits CKE0 and CKE1 in SCR, and bit P34DDR.
ICE 0 1
CKE1 0 1 —
C/A 0 1 — —
CKE0 0 1 — — —
P34DDR 0 1 — — — —
Pin function P34
input
P34
output*1
SCK0/SCK4
output*1*3
SCK0/SCK4
output*1*3
SCK0/SCK4
input
SDA0
I/O*2
Notes: 1. NMOS open-drain output when P34ODR = 1.
2. NMOS open-drain output regardless of P34ODR
3. Simultaneous output of SCK0 and SCK4 cannot be set.
• P33/RxD1/SCL1
The pin function is switched as shown below according to the combination of bit ICE in ICCRA
of I2C_0, bit RE in SCR of SCI_1 and bit P33DDR.
ICE 0 1
RE 0 1 —
P33DDR 0 1 — —
Pin function P33 input P33 output*1 RxD1 input SCL1 I/O*2
Notes: 1. NMOS open-drain output when P33ODR = 1.
2. NMOS open-drain output regardless of P33ODR
• P32/RxD0/IrRxD/SDA1
The pin function is switched as shown below according to the combination of bit ICE in ICCRA
of I2C_0, bit RE in SCR of SCI_0 and bit P32DDR.
ICE 0 1
RE 0 1 —
P32DDR 0 1 — —
Pin function P32 input P32 output*1 RxD0/IrRxD
input
SDA1 I/O*2
Notes: 1. NMOS open-drain output when P32ODR = 1.
2. NMOS open-drain output regardless of P32ODR
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• P31/TxD1
The pin function is switched as shown below according to the combination of bit TE in SCR of
SCI_1 and bit P31DDR.
TE 0 1
P31DDR 0 1 —
Pin function P31 input P31 output* TxD1 output*
Note: * NMOS open-drain output when P31ODR = 1.
• P30/TxD0/IrTxD
The pin function is switched as shown below according to the combination of bit TE in SCR of
SCI_0 and bit P30DDR.
TE 0 1
P30DDR 0 1 —
Pin function P30 input P30 output* TxD0/IrTxD
output*
Note: * NMOS open-drain output when P30ODR = 1.
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9.4 Port 4
Port 4 is an 8-bit input-only port. Port 4 has the following register.
• Port 4 register (PORT4)
9.4.1 Port 4 Register (PORT4)
PORT4 is an 8-bit read-only register that shows port 4 pin states.
PORT4 cannot be modified.
Bit Bit Name Initial Value R/W Description
7 P47 —* R The pin states are always read from this register.
6 P46 —* R
5 P45 —* R
4 P44 —* R
3 P43 —* R
2 P42 —* R
1 P41 —* R
0 P40 —* R
Note: * Determined by the states of pins P47 to P40.
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9.4.2 Pin Functions
Port 4 also functions as the pins for A/D converter analog input and D/A converter analog output.
The correspondence between pins are as follows.
P47/AN7/(IRQ7)
Pin function AN7 input
IRQ7 interrupt input*
Note: * IRQ7 input when bit ITS7 in ITSR is 1.
P46/AN6/DA0/(IRQ6)
Pin function AN6 input
IRQ6 interrupt input*
Note: * IRQ6 input when bit ITS6 in ITSR is 1.
P45/AN5/(IRQ5)
Pin function AN5 input
IRQ5 interrupt input*
Note: * IRQ5 input when bit ITS5 in ITSR is 1.
P44/AN4/(IRQ4)
Pin function AN4 input
IRQ4 interrupt input*
Note: * IRQ4 input when bit ITS4 in ITSR is 1.
P43/AN3/(IRQ3)
Pin function AN3 input
IRQ3 interrupt input*
Note: * IRQ3 input when bit ITS3 in ITSR is 1.
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P42/AN2/(IRQ2)
Pin function AN2 input
IRQ2 interrupt input*
Note: * IRQ2 input when bit ITS2 in ITSR is 1.
P41/AN1/(IRQ1)
Pin function AN1 input
IRQ1 interrupt input*
Note: * IRQ1 input when bit ITS1 in ITSR is 1.
P40/AN0/(IRQ0)
Pin function AN0 input
IRQ0 interrupt input*
Note: * IRQ0 input when bit ITS0 in ITSR is 1.
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9.5 Port 5
Port 5 is a 4-bit I/O port. The port 5 has the following registers.
• Port 5 data direction register (P5DDR)
• Port 5 data register (P5DR)
• Port 5 register (PORT5)
9.5.1 Port 5 Data Direction Register (P5DDR)
The individual bits of P5DDR specify input or output for the pins of port 5.
P5DDR cannot be read; if it is, an undefined value will be read.
Bit Bit Name Initial Value R/W Description
7
to
4
— All 0 — Reserved
These bits are always read as 0 and cannot be
modified.
3 P53DDR 0 W
2 P52DDR 0 W
1 P51DDR 0 W
0 P50DDR 0 W
When a pin function is specified to a general
purpose I/O, setting this bit to 1 makes the
corresponding port 1 pin an output pin, while
clearing this bit to 0 makes the pin an input pin.
9.5.2 Port 5 Data Register (P5DR)
P5DR stores output data for the port 5 pins.
Bit Bit Name Initial Value R/W Description
7
to
4
— All 0 — Reserved
These bits are always read as 0 and cannot be
modified.
3 P53DR 0 R/W
2 P52DR 0 R/W
Output data for a pin is stored when the pin function
is specified to a general purpose I/O.
1 P51DR 0 R/W
0 P50DR 0 R/W
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9.5.3 Port 5 Register (PORT5)
PORT5 shows the pin states. PORT5 cannot be modified.
Bit Bit Name Initial Value R/W Description
7
to
4
— Undefined R Reserved
Undefined values are read from these bits.
3 P53 —* R
2 P52 —* R
1 P51 —* R
0 P50 —* R
If bits P53 to P50 are read while P5DDR bits are set
to 1, the P5DR values are read. If a port 5 read is
performed while P5DDR bits are cleared to 0, the
pin states are read.
Note: * Determined by the states of pins P53 to P50.
9.5.4 Pin Functions
Port 5 pins also function as the pins for SCI I/Os, A/D converter inputs, and interrupt inputs. The
correspondence between the register specification and the pin functions is shown below.
• P53/ADTRG/IRQ3
The pin function is switched as shown below according to the combination of bits TRGS1 and
TRGS0 in the A/D control register (ADCR), bit ITS3 in ITSR, and bit P53DDR.
P53DDR 0 1
Pin function P53 input P53 output
ADTRG input*1
IRQ3 interrupt input*2
Notes: 1. ADTRG input when TRGS1 = TRGS0 = 1.
2. IRQ3 input when ITS3 = 0.
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• P52/SCK2/IRQ2
The pin function is switched as shown below according to the combination of bit C/A in SMR of
SCI_2, bits CKE0 and CKE1 in SCR, bit ITS2 in ITSR, and bit P52DDR.
CKE1 0 1
C/A 0 1 —
CKE0 0 1 — —
P52DDR 0 1 — — —
P52 input P52 output SCK2 output SCK2 output SCK2 input Pin function
IRQ2 interrupt input*
Note: * IRQ2 input when ITS2 = 0.
• P51/RxD2/IRQ1
The pin function is switched as shown below according to the combination of bit RE in SCR of
SCI_2, bit ITS1 in ITSR, and bit P51DDR.
RE 0 1
P51DDR 0 1 —
P51 input P51 output RxD2 input Pin function
IRQ1 interrupt input*
Note: * IRQ1 input when ITS1 = 0.
• P50/TxD2/IRQ0
The pin function is switched as shown below according to the combination of bit TE in SCR of
SCI_2, bit ITS0 in ITSR, and bit P50DDR.
TE 0 1
P50DDR 0 1 —
P50 input P50 output TxD2 input Pin function
IRQ0 interrupt input*
Note: * IRQ0 input when ITS0 = 0.
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9.6 Port 8
Port 8 is a 6-bit I/O port that also has other functions. The port 8 has the following registers.
• Port 8 data direction register (P8DDR)
• Port 8 data register (P8DR)
• Port 8 register (PORT8)
9.6.1 Port 8 Data Direction Register (P8DDR)
The individual bits of P8DDR specify input or output for the pins of port 8.
P8DDR cannot be read; if it is, an undefined value will be read.
Bit Bit Name Initial Value R/W Description
7, 6 — All 0 — Reserved
These bits are always read as 0 and cannot be
modified.
5 P85DDR 0 W
4 — 0 —
3 P83DDR 0 W
2 — 0 —
1 P81DDR 0 W
0 — 0 —
When a pin function is specified to a general
purpose I/O, setting bit 5, 3, or 1 makes the
corresponding port 1 pin an output pin, while
clearing this bit to 0 makes the pin an input pin.
Bits 4, 2, and 0 are reserved.
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9.6.2 Port 8 Data Register (P8DR)
P8DR stores output data for the port 8 pins.
Bit Bit Name Initial Value R/W Description
7, 6 — All 0 — Reserved
These bits are always read as 0 and cannot be
modified.
5 P85DR 0 R/W
4 — 0 —
3 P83DR 0 R/W
2 — 0 —
1 P81DR 0 R/W
0 — 0 —
Bits 5, 3, and 1 store output data when the pin
function is specified to a general purpose I/O.
Bits 4, 2, and 0 are reserved.
9.6.3 Port 8 Register (PORT8)
PORT8 shows the pin states.
PORT8 cannot be modified.
Bit Bit Name Initial Value R/W Description
7, 6 — Undefined — Reserved
These bits are reserved, if read they will return an
undefined value.
5 P85 —* R
4 — Undefined R
3 P83 —* R
2 — Undefined R
1 P81 —* R
0 — Undefined R
If a port 8 read is performed while P8DDR bits are
set to 1, the P8DR values are read. If a port 8 read
is performed while P8DDR bits are cleared to 0, the
pin states are read.
Bits 4, 2, and 0 are reserved.
Note: * Determined by the states of pins P85, P83 and P81.
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9.6.4 Pin Functions
Port 8 pins also function as interrupt inputs and SCI_3 I/Os. The correspondence between the
register specification and the pin functions is shown below.
• P85/SCK3
The pin function is switched as shown below according to the combination of bit C/A in SMR in
SCI_3, bits CKE0 and CKE1 in SCR, and bit P85DDR.
CKE1 0 1
C/A 0 1 ⎯
CKE0 0 1 ⎯ ⎯
P85DDR 0 1 ⎯ ⎯ ⎯
Pin function P85 input P85 output SCK3 output SCK3 output SCK3 input
• P83/RxD3
The pin function is switched as shown below according to the combination of bit RE in SCR of
SCI_3, and bit P83DDR.
RE 0 1
P83DDR 0 1 ⎯
Pin function P83 input P83 output RxD3 input
• P81/TxD3
The pin function is switched as shown below according to the combination of bit TE in SCR of
SCI_3, and bit P81DDR.
TE 0 1
P81DDR 0 1 —
Pin function P81 input P81 output TxD3 output
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9.7 Port 9
Port 9 is a 2-bit input-only port. Port 9 has the following register.
• Port 9 register (PORT9)
9.7.1 Port 9 Register (PORT9)
PORT9 is an 8-bit read-only register that shows port 4 pin states.
PORT9 cannot be modified.
Bit Bit Name Initial Value R/W Description
7, 6 — Undefined R Reserved
If read they will return an undefined value.
5 P95 —* R
4 P94 —* R
The pin states are always read when a port 9 read
is performed.
3 — Undefined R
2 — Undefined R
Reserved
If read they will return an undefined value.
1 — Undefined R
0 — Undefined R
Note: * Determined by the states of pins P95 and P94.
9.7.2 Pin Functions
Port 9 also functions as the pins for A/D converter analog input and D/A converter analog output.
The correspondence between pins are as follows.
P95/AN13/DA3
AN13 input Pin function
DA3 output
P94/AN12/DA2
AN12 input Pin function
DA2 output
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9.8 Port A
Port A is an 8-bit I/O port that also has other functions. The port A has the following registers.
• Port A data direction register (PADDR)
• Port A data register (PADR)
• Port A register (PORTA)
• Port A MOS zcontrol register (PAPCR)
• Port A open-drain control register (PAODR)
• Port function control register 0 (PFCR0)
• Port function control register 1 (PFCR1)
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9.8.1 Port A Data Direction Register (PADDR)
The individual bits of PADDR specify input or output for the pins of port A. PADDR cannot be
read; if it is, an undefined value will be read.
Bit Bit Name Initial Value R/W Description
7 PA7DDR 0 W
6 PA6DDR 0 W
5 PA5DDR 0 W
4 PA4DDR 0 W
3 PA3DDR 0 W
2 PA2DDR 0 W
1 PA1DDR 0 W
0 PA0DDR 0 W
• Modes 1 and 2
Pins PA4 to PA0 are address outputs.
For pins PA6 and PA5, when the corresponding
A22E and A21E bits are set to 1, setting a PADDR
bit to 1 makes the corresponding port A pin an
address output, while clearing the bit to 0 makes the
pin an input port. Clearing A22E and A21E bits to 0
makes the corresponding port A pin an I/O port, and
its function can be switched with PADDR. For pin
PA7, when the A23E bit is set to 1, setting the
PA7DDR bit to 1 makes the pin an address output,
while clearing the bit to 0 makes the pin an input
port. When the CS7E bit is set to 1 while the A23E
bit is cleared to 0, pin PA7 functions as the CS7
output pin when PA7DDR is set to 1, and as an
input port when the bit is cleared to 0. When the
CS7E bit is cleared to 0, pin PA7 is an I/O port, and
its function can be switched with PA7DDR.
• Modes 4 and 7 (when EXPE = 1)
For pins PA6 to PA0, when the corresponding A22E
to A16E bits are set to 1, setting a PADDR bit to 1
makes the corresponding port A pin an address
output, while clearing the bit to 0 makes the pin an
input port. Clearing A22E to A21E bits to 0 makes
the corresponding port A pin an I/O port, and its
function can be switched with PADDR. For pin PA7,
when the A23E bit is set to 1, setting the PA7DDR
bit to 1 makes the pin an address output, while
clearing the bit to 0 makes the pin an input port.
When the CS7E bit is set to 1 while the A23E bit is
cleared to 0, pin PA7 functions as the CS7 output
pin when PA7DDR is set to 1, and as an input port
when the bit is cleared to 0. When the CS7E bit is
cleared to 0, pin PA7 is an I/O port, and its function
can be switched with PA7DDR.
• Mode 7 (when EXPE = 0)
Port A is an I/O port, and its pin functions can be
switched with PADDR.
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9.8.2 Port A Data Register (PADR)
PADR stores output data for the port A pins.
Bit Bit Name Initial Value R/W Description
7 PA7DR 0 R/W
6 PA6DR 0 R/W
Output data for a pin is stored when the pin function
is specified to a general purpose I/O.
5 PA5DR 0 R/W
4 PA4DR 0 R/W
3 PA3DR 0 R/W
2 PA2DR 0 R/W
1 PA1DR 0 R/W
0 PA0DR 0 R/W
9.8.3 Port A Register (PORTA)
PORTA shows port A pin states.
PORTA cannot be modified.
Bit Bit Name Initial Value R/W Description
7 PA7 —* R
6 PA6 —* R
5 PA5 —* R
4 PA4 —* R
If a port A read is performed while PADDR bits are
set to 1, the PADR values are read. If a port A read
is performed while PADDR bits are cleared to 0, the
pin states are read.
3 PA3 —* R
2 PA2 —* R
1 PA1 —* R
0 PA0 —* R
Note: * Determined by the states of pins PA7 to PA0.
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9.8.4 Port A MOS Pull-Up Control Register (PAPCR)
PAPCR controls the MOS input pull-up function. Bits 7 to 5 are valid in modes 1 and 2 and all the
bits are valid in modes 4 and 7.
Bit Bit Name Initial Value R/W Description
7 PA7PCR 0 R/W
6 PA6PCR 0 R/W
5 PA5PCR 0 R/W
4 PA4PCR 0 R/W
When PADDR = 0 (input port), setting the
corresponding bit to 1 turns on the MOS input pull-
up for that pin.
3 PA3PCR 0 R/W
2 PA2PCR 0 R/W
1 PA1PCR 0 R/W
0 PA0PCR 0 R/W
9.8.5 Port A Open Drain Control Register (PAODR)
PAODR specifies an output type of port A.
Bit Bit Name Initial Value R/W Description
7 PA7ODR 0 R/W
6 PA6ODR 0 R/W
5 PA5ODR 0 R/W
4 PA4ODR 0 R/W
When not specified for address output, setting the
corresponding bit to 1 specifies a pin output type to
NMOS open-drain output, while clearing this bit to 0
specifies that to CMOS output.
3 PA3ODR 0 R/W
2 PA2ODR 0 R/W
1 PA1ODR 0 R/W
0 PA0ODR 0 R/W
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9.8.6 Port Function Control Register 0 (PFCR0)
PFCR0 controls the I/O port.
Bit Bit Name Initial Value R/W Description
7 CS7E 1 R/W
6 CS6E 1 R/W
5 CS5E 1 R/W
4 CS4E 1 R/W
3 CS3E 1 R/W
2 CS2E 1 R/W
1 CS1E 1 R/W
0 CS0E 1 R/W
CS7 to CS0 enable
Enable/disable corresponding CSn output.
0: Set as I/O port.
1: Set as CSn output pin.
(n = 7 to 0)
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9.8.7 Port Function Control Register 1 (PFCR1)
PFCR1 performs I/O port control. Bits 7 to 5 are valid in modes 1 and 2 and all the bits are valid
in modes 4 and 7.
Bit Bit Name Initial Value R/W Description
7 A23E 1 R/W Address 23 Enable
Enables or disables output for address output 23
(A23).
0: DR output when PA7DDR = 1
1: A23 output when PA7DDR = 1
6 A22E 1 R/W Address 22 Enable
Enables or disables output for address output 22
(A22).
0: DR output when PA6DDR = 1
1: A22 output when PA6DDR = 1
5 A21E 1 R/W Address 21 Enable
Enables or disables output for address output 21
(A21).
0: DR output when PA5DDR = 1
1: A21 output when PA5DDR = 1
4 A20E 1 R/W Address 20 Enable
Enables or disables output for address output 20
(A20).
0: DR output when PA4DDR = 1
1: A20 output when PA4DDR = 1
3 A19E 1 R/W Address 19 Enable
Enables or disables output for address output 19
(A19).
0: DR output when PA3DDR = 1
1: A19 output when PA3DDR = 1
2 A18E 1 R/W Address 18 Enable
Enables or disables output for address output 18
(A18).
0: DR output when PA2DDR = 1
1: A18 output when PA2DDR = 1
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Bit Bit Name Initial Value R/W Description
1 A17E 1 R/W Address 17 Enable
Enables or disables output for address output 17
(A17).
0: DR output when PA1DDR = 1
1: A17 output when PA1DDR = 1
0 A16E 1 R/W Address 16 Enable
Enables or disables output for address output 16
(A16).
0: DR output when PA0DDR = 1
1: A16 output when PA0DDR = 1
9.8.8 Pin Functions
Port A pins also function as the pins for address outputs and interrupt inputs. The correspondence
between the register specification and the pin functions is shown below.
• PA7/A23/CS7/IRQ7
The pin function is switched as shown below according to the operating mode, bit EXPE, bits
A23E and CS7E, bits ITS7 to ITS5 in ITSR, and bit PA7DDR.
Operating
mode
1, 2, 4 7
EXPE — 0 1
A23E 0 1 — 0 1
CS7E 0 1 — — 0 1 —
PA7DDR 0 1 0 1 0 1 0 1 0 1 0 1
PA7
input
PA7
output
PA7
input
CS7
output
PA7
output
Address
output
PA7
input
PA7
output
PA7
input
PA7
output
PA7
input
CS7
output
PA7
input
Address
output
Pin function
IRQ7 interrupt input*
Note: * IRQ7 input when ITS7 = 0.
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• PA6/A22/IRQ6, PA5/A21/IRQ5
The pin function is switched as shown below according to the operating mode, bit EXPE, bits
A22E and A21E, bits IS6 and ITS5 in ITSR, and bit PAnDDR.
Operating
mode
1, 2, 4 7
EXPE — 0 1
AxxE 0 1 — 0 1
PAnDDR 0 1 0 1 0 1 0 1 0 1
PAn
input
PAn
output
PAn
input
Address
output
PAn
input
PAn
output
PAn
input
PAn
output
PAn
input
Address
output
Pin function
IRQn interrupt input*
n = 6 or 5 xx = 22 or 21
Note: * IRQn input when ITSn = 0.
• PA4/A20/IRQ4
The pin function is switched as shown below according to the operating mode, bit EXPE, bit
A20E and bit PA4DDR.
Operating
mode
1, 2 4 7
EXPE — — 0 1
A20E — 0 1 — 0 1
PA4DDR — 0 1 0 1 0 1 0 1 0 1
Address
output
PA4
input
PA4
output
PA4
input
Address
output
PA4
input
PA4
output
PA4
input
PA4
output
PA4
input
Address
output
Pin function
IRQ4 interrupt input*
Note: * IRQ4 input when ITS4 = 0.
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• PA3/A19, PA2/A18, PA1/A17, PA0/A16
The pin function is switched as shown below according to the operating mode, bit EXPE, bits
A19E to A16E, and bit PADDR.
Operating
mode
1, 2 4 7
EXPE — — 0 1
AxxE — 0 1 — 0 1
PAnDDR — 0 1 0 1 0 1 0 1 0 1
Pin function Address
output
PAn
input
PAn
output
PAn
input
Address
output
PAn
input
PAn
output
PAn
input
PAn
output
PAn
input
Address
output
xx = 19 to 16 n = 3 to 0
9.8.9 Port A MOS Input Pull-Up States
Port A has a built-in MOS input pull-up function that can be controlled by software. This MOS
input pull-up function can be used by pins PA7 to PA5 in modes 1 and 2 and by all pins in modes
4 and 7. MOS input pull-up can be specified as on or off on a bit-by-bit basis.
Table 9.2 summarizes the MOS input pull-up states.
Table 9.2 MOS Input Pull-Up States (Port A)
Mode
Reset
Hardware
Standby Mode
Software
Standby Mode
In Other
Operations
4, 7 PA7 to PA0 Off Off On/Off On/Off
1, 2 PA7 to PA5 On/Off On/Off
PA4 to PA0 Off Off
Legend:
Off: MOS input pull-up is always off.
On/Off: On when PADDR = 0 and PAPCR = 1; otherwise off.
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9.9 Port B
Port B is an 8-bit I/O port that also has other functions. The port B has the following registers.
• Port B data direction register (PBDDR)
• Port B data register (PBDR)
• Port B register (PORTB)
• Port B MOS pull-up control register (PBPCR)
9.9.1 Port B Data Direction Register (PBDDR)
The individual bits of PBDDR specify input or output for the pins of port B.
PBDDR cannot be read; if it is, an undefined value will be read.
Bit Bit Name Initial Value R/W Description
7 PB7DDR 0 W
6 PB6DDR 0 W
5 PB5DDR 0 W
4 PB4DDR 0 W
3 PB3DDR 0 W
2 PB2DDR 0 W
1 PB1DDR 0 W
0 PB0DDR 0 W
• Modes 1 and 2
Port B pins are address outputs regardless of the
PBDDR settings.
• Modes 4 and 7 (when EXPE = 1)
Setting a PBDDR bit to 1 makes the corresponding
port B pin an address output, while clearing the bit
to 0 makes the pin an input port.
• Mode 7 (when EXPE = 0)
Port B is an I/O port, and its pin functions can be
switched with PBDDR.
Section 9 I/O Ports
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9.9.2 Port B Data Register (PBDR)
PBDR is stores output data for the port B pins.
Bit Bit Name Initial Value R/W Description
7 PB7DR 0 R/W
6 PB6DR 0 R/W
An output data for a pin is stored when the pin
function is specified to a general purpose I/O.
5 PB5DR 0 R/W
4 PB4DR 0 R/W
3 PB3DR 0 R/W
2 PB2DR 0 R/W
1 PB1DR 0 R/W
0 PB0DR 0 R/W
9.9.3 Port B Register (PORTB)
PORTB shows port B pin states. PORTB cannot be modified.
Bit Bit Name Initial Value R/W Description
7 PB7 —* R
6 PB6 —* R
5 PB5 —* R
4 PB4 —* R
If this register is read is while PBDDR bits are set to
1, the PBDR values are read. If a port B read is
performed while PBDDR bits are cleared to 0, the pin
states are read.
3 PB3 —* R
2 PB2 —* R
1 PB1 —* R
0 PB0 —* R
Note: * Determined by the states of pins PB7 to PB0.
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9.9.4 Port B MOS Pull-Up Control Register (PBPCR)
PBPCR controls the on/off state of MOS input pull-up of port B. PBPCR is valid in modes 4 and
7.
Bit Bit Name Initial Value R/W Description
7 PB7PCR 0 R/W
6 PB6PCR 0 R/W
5 PB5PCR 0 R/W
4 PB4PCR 0 R/W
When PBDDR = 0 (input port), setting the
corresponding bit to 1 turns on the MOS input pull-
up for that pin.
3 PB3PCR 0 R/W
2 PB2PCR 0 R/W
1 PB1PCR 0 R/W
0 PB0PCR 0 R/W
9.9.5 Pin Functions
Port B pins also function as the pins for address outputs. The correspondence between the register
specification and the pin functions is shown below.
• PB7/A15, PB6/A14, PB5/A13, PB4/A12, PB3/A11, PB2/A10, PB1/A9, PB0/A8
The pin function is switched as shown below according to the operating mode, bit EXPE, and bit
PBDDR.
Operating
mode
1, 2 4 7
EXPE — — 0 1
PBnDDR — 0 1 0 1 0 1
Pin function Address
output
PBn input Address
output
PBn input PBn output PBn input Address
output
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9.9.6 Port B MOS Input Pull-Up States
Port B has a built-in MOS input pull-up function that can be controlled by software. This MOS
input pull-up function can be used in modes 4 and 7. MOS input pull-up can be specified as on or
off on a bit-by-bit basis.
In modes 4 and 7, when a PBDDR bit is cleared to 0, setting the corresponding PBPCR bit to 1
turns on the MOS input pull-up for that pin.
Table 9.3 summarizes the MOS input pull-up states.
Table 9.3 MOS Input Pull-Up States (Port B)
Mode
Reset
Hardware
Standby Mode
Software
Standby Mode
In Other
Operations
1, 2 Off Off Off Off
4, 7 On/Off On/Off
Legend:
Off: MOS input pull-up is always off.
On/Off: On when PBDDR = 0 and PBPCR = 1; otherwise off.
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9.10 Port C
Port C is an 8-bit I/O port that also has other functions. The port C has the following registers.
• Port C data direction register (PCDDR)
• Port C data register (PCDR)
• Port C register (PORTC)
• Port C MOS pull-up control register (PCPCR)
9.10.1 Port C Data Direction Register (PCDDR)
The individual bits of PCDDR specify input or output for the pins of port C.
PCDDR cannot be read; if it is, an undefined value will be read.
Bit Bit Name Initial Value R/W Description
7 PC7DDR 0 W
6 PC6DDR 0 W
5 PC5DDR 0 W
4 PC4DDR 0 W
3 PC3DDR 0 W
2 PC2DDR 0 W
1 PC1DDR 0 W
0 PC0DDR 0 W
• Modes 1 and 2
Port C pins are address outputs regardless of the
PCDDR settings.
• Modes 4 and 7 (when EXPE = 1)
Setting a PCDDR bit to 1 makes the corresponding
port C pin an address output, while clearing the bit
to 0 makes the pin an input port.
• Mode 7 (when EXPE = 0)
Port C is an I/O port, and its pin functions can be
switched with PCDDR.
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9.10.2 Port C Data Register (PCDR)
PCDR stores output data for the port C pins.
Bit Bit Name Initial Value R/W Description
7 PC7DR 0 R/W
6 PC6DR 0 R/W
5 PC5DR 0 R/W
4 PC4DR 0 R/W
Output data for a pin is stored when the pin function
is specified to a general purpose I/O.
3 PC3DR 0 R/W
2 PC2DR 0 R/W
1 PC1DR 0 R/W
0 PC0DR 0 R/W
9.10.3 Port C Register (PORTC)
PORTC is shows port C pin states.
PORTC cannot be modified.
Bit Bit Name Initial Value R/W Description
7 PC7 —* R
6 PC6 —* R
5 PC5 —* R
4 PC4 —* R
If a port C read is performed while PCDDR bits are
set to 1, the PCDR values are read. If a port C read
is performed while PCDDR bits are cleared to 0, the
pin states are read.
3 PC3 —* R
2 PC2 —* R
1 PC1 —* R
0 PC0 —* R
Note: * Determined by the states of pins PC7 to PC0.
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9.10.4 Port C MOS Pull-Up Control Register (PCPCR)
PCPCR controls the on/off state of MOS input pull-up of port C. PCPCR is valid in modes 4 and
7.
Bit Bit Name Initial Value R/W Description
7 PC7PCR 0 R/W
6 PC6PCR 0 R/W
5 PC5PCR 0 R/W
4 PC4PCR 0 R/W
When PCDDR = 0 (input port), setting the
corresponding bit to 1 turns on the MOS input pull-
up for that pin.
3 PC3PCR 0 R/W
2 PC2PCR 0 R/W
1 PC1PCR 0 R/W
0 PC0PCR 0 R/W
9.10.5 Pin Functions
Port C pins also function as the pins for address outputs. The correspondence between the register
specification and the pin functions is shown below.
• PC7/A7, PC6/A6, PC5/A5, PC4/A4, PC3/A3, PC2/A2, PC1/A1, PC0/A0
The pin function is switched as shown below according to the operating mode, bit EXPE, and bit
PCDDR.
Operating
mode
1, 2 4 7
EXPE — — 0 1
PCnDDR — 0 1 0 1 0 1
Pin function Address
output
PCn input Address
output
PCn input PCn output PCn input Address
output
Legend: n = 7 to 0
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9.10.6 Port C MOS Input Pull-Up States
Port C has a built-in MOS input pull-up function that can be controlled by software. This MOS
input pull-up function can be used in modes 4 and 7. MOS input pull-up can be specified as on or
off on a bit-by-bit basis.
In modes 4 and 7, when a PCDDR bit is cleared to 0, setting the corresponding PCPCR bit to 1
turns on the MOS input pull-up for that pin.
Table 9.4 summarizes the MOS input pull-up states.
Table 9.4 MOS Input Pull-Up States (Port C)
Mode
Reset
Hardware
Standby Mode
Software
Standby Mode
In Other
Operations
1, 2 Off Off Off Off
4, 7 On/Off On/Off
Legend:
Off: MOS input pull-up is always off.
On/Off: On when PCDDR = 0 and PCPCR = 1; otherwise off.
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9.11 Port D
Port D is an 8-bit I/O port that also has other functions. The port D has the following registers.
• Port D data direction register (PDDDR)
• Port D data register (PDDR)
• Port D register (PORTD)
• Port D MOS pull-up control register (PDPCR)
9.11.1 Port D Data Direction Register (PDDDR)
The individual bits of PDDDR specify input or output for the pins of port D.
PDDDR cannot be read; if it is, an undefined value will be read.
Bit Bit Name Initial Value R/W Description
7 PD7DDR 0 W
6 PD6DDR 0 W
5 PD5DDR 0 W
4 PD4DDR 0 W
3 PD3DDR 0 W
2 PD2DDR 0 W
1 PD1DDR 0 W
0 PD0DDR 0 W
• Modes 1, 2, 4, and 7 (when EXPE = 1)
Port D is automatically designated for data
input/output.
• Mode 7 (when EXPE = 0)
Port D is an I/O port, and its pin functions can be
switched with PDDDR.
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9.11.2 Port D Data Register (PDDR)
PDDR stores output data for the port D pins.
Bit Bit Name Initial Value R/W Description
7 PD7DR 0 R/W
6 PD6DR 0 R/W
5 PD5DR 0 R/W
4 PD4DR 0 R/W
Output data for a pin is stored when the pin function
is specified to a general purpose I/O.
3 PD3DR 0 R/W
2 PD2DR 0 R/W
1 PD1DR 0 R/W
0 PD0DR 0 R/W
9.11.3 Port D Register (PORTD)
PORTD shows port D pin states.
PORTD cannot be modified.
Bit Bit Name Initial Value R/W Description
7 PD7 —* R
6 PD6 —* R
5 PD5 —* R
4 PD4 —* R
If a port D read is performed while PDDDR bits are
set to 1, the PDDR values are read. If a port D read
is performed while PDDDR bits are cleared to 0, the
pin states are read.
3 PD3 —* R
2 PD2 —* R
1 PD1 —* R
0 PD0 —* R
Note: * Determined by the states of pins PD7 to PD0.
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9.11.4 Port D Pull-up Control Register (PDPCR)
PDPCR controls on/off states of the input pull-up MOS of port D. PDPCR is valid in mode 7.
Bit Bit Name Initial Value R/W Description
7 PD7PCR 0 R/W
6 PD6PCR 0 R/W
5 PD5PCR 0 R/W
4 PD4PCR 0 R/W
When PDDDR = 0 (input port), the input pull-up
MOS of the input pin is on when the corresponding
bit is set to 1.
3 PD3PCR 0 R/W
2 PD2PCR 0 R/W
1 PD1PCR 0 R/W
0 PD0PCR 0 R/W
9.11.5 Pin Functions
Port D pins also function as the pins for data I/Os. The correspondence between the register
specification and the pin functions is shown below.
• PD7/D15, PD6/D14, PD5/D13, PD4/D12, PD3/D11, PD2/D10, PD1/D9, PD0/D8
The pin function is switched as shown below according to the operating mode, bit EXPE, and bit
PDDDR.
Operating
mode
1, 2, 4 7
EXPE — 0 1
PDnDDR — 0 1 —
Pin function Data I/O PDn input PDn output Data I/O
Legend: n = 7 to 0
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9.11.6 Port D MOS Input Pull-Up States
Port D has a built-in MOS input pull-up function that can be controlled by software. This MOS
input pull-up function can be used in mode 7. MOS input pull-up can be specified as on or off on a
bit-by-bit basis.
In mode 7, when a PDDDR bit is cleared to 0, setting the corresponding PDPCR bit to 1 turns on
the MOS input pull-up for that pin.
Table 9.5 summarizes the MOS input pull-up states.
Table 9.5 MOS Input Pull-Up States (Port D)
Mode
Reset
Hardware
Standby Mode
Software
Standby Mode
In Other
Operations
1, 2, 4 Off Off Off Off
7 On/Off On/Off
Legend:
OFF: MOS input pull-up is always off.
On/Off: On when PDDDR = 0 and PDPCR = 1; otherwise off.
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9.12 Port E
Port E is an 8-bit I/O port that also has other functions. The port E has the following registers.
• Port E data direction register (PEDDR)
• Port E data register (PEDR)
• Port E register (PORTE)
• Port E MOS pull-up control register (PEPCR)
9.12.1 Port E Data Direction Register (PEDDR)
The individual bits of PEDDR specify input or output for the pins of port E.
PEDDR cannot be read; if it is, an undefined value will be read.
Bit Bit Name Initial Value R/W Description
7 PE7DDR 0 W
6 PE6DDR 0 W
5 PE5DDR 0 W
4 PE4DDR 0 W
3 PE3DDR 0 W
2 PE2DDR 0 W
1 PE1DDR 0 W
0 PE0DDR 0 W
• Modes 1, 2, and 4
When 8-bit bus mode is selected, port E functions
as an I/O port. The pin states can be changed with
PEDDR.
When 16-bit bus mode is selected, port E is
designated for data input/output.
For details on 8-bit and 16-bit bus modes, see
section 6, Bus Controller.
• Mode 7 (when EXPE = 1)
When 8-bit bus mode is selected, port E functions
as an I/O port. Setting a PEDDR bit to 1 makes the
corresponding port E pin an output port, while
clearing the bit to 0 makes the pin an input port.
When 16-bit bus mode is selected, port E is
designated for data input/output.
• Mode 7 (when EXPE = 0)
Port E is an I/O port, and its pin functions can be
switched with PEDDR.
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9.12.2 Port E Data Register (PEDR)
PEDR stores output data for the port E pins.
Bit Bit Name Initial Value R/W Description
7 PE7DR 0 R/W
6 PE6DR 0 R/W
5 PE5DR 0 R/W
4 PE4DR 0 R/W
Output data for a pin is stored when the pin function
is specified to a general purpose I/O.
3 PE3DR 0 R/W
2 PE2DR 0 R/W
1 PE1DR 0 R/W
0 PE0DR 0 R/W
9.12.3 Port E Register (PORTE)
PORTE shows port E pin states.
PORTE cannot be modified.
Bit Bit Name Initial Value R/W Description
7 PE7 —* R
6 PE6 —* R
5 PE5 —* R
4 PE4 —* R
If a port E read is performed while PEDDR bits are
set to 1, the PEDR values are read. If a port E read
is performed while PEDDR bits are cleared to 0, the
pin states are read.
3 PE3 —* R
2 PE2 —* R
1 PE1 —* R
0 PE0 —* R
Note: * Determined by the states of pins PE7 to PE0.
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9.12.4 Port E Pull-up Control Register (PEPCR)
PEPCR controls on/off states of the input pull-up MOS of port E. PEPCR is valid in 8-bit bus
mode.
Bit Bit Name Initial Value R/W Description
7 PE7PCR 0 R/W
6 PE6PCR 0 R/W
5 PE5PCR 0 R/W
4 PE4PCR 0 R/W
When PEDDR = 0 (input port), the input pull-up
MOS of the input pin is on when the corresponding
bit is set to 1.
3 PE3PCR 0 R/W
2 PE2PCR 0 R/W
1 PE1PCR 0 R/W
0 PE0PCR 0 R/W
9.12.5 Pin Functions
Port E pins also function as the pins for data I/Os. The correspondence between the register
specification and the pin functions is shown below.
• PE7/D7, PE6/D6, PE5/D5, PE4/D4, PE3/D3, PE2/D2, PE1/D1, PE0/D0
The pin function is switched as shown below according to the operating mode, bus mode, bit
EXPE, and bit PEDDR.
Operating
mode
1, 2, 4 7
Bus mode All areas
8-bit space
At least
one area
16-bit
space
— All areas
8-bit space
At least
one area
16-bit
space
EXPE — — 0 1 1
PEnDDR 0 1 — 0 1 0 1 —
Pin function PEn input PEn
output
Data I/O PEn input PEn
output
PEn input PEn
output
Data I/O
Legend: n = 7 to 0
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9.12.6 Port E MOS Input Pull-Up States
Port E has a built-in MOS input pull-up function that can be controlled by software. This MOS
input pull-up function can be used in 8-bit bus mode. MOS input pull-up can be specified as on or
off on a bit-by-bit basis. In 8-bit bus mode, when a PEDDR bit is cleared to 0, setting the
corresponding PEPCR bit to 1 turns on the MOS input pull-up for that pin.
Table 9.6 summarizes the MOS input pull-up states.
Table 9.6 MOS Input Pull-Up States (Port E)
Mode
Reset
Hardware
Standby Mode
Software
Standby Mode
In Other
Operations
1, 2, and 4 8-bit bus Off Off On/Off On/Off
16-bit bus Off Off
Legend:
Off: MOS input pull-up is always off.
On/Off: On when PEDDR = 0 and PEPCR = 1; otherwise off.
9.13 Port F
Port F is an 8-bit I/O port that also has other functions. The port F has the following registers. For
details on the port function control register 0, refer to section 9.8.6, Port Function Control Register
0 (PFCR0), and for details on the port function control register 2, refer to section 9.3.5, Port
Function Control Register 2 (PFCR2).
• Port F data direction register (PFDDR)
• Port F data register (PFDR)
• Port F register (PORTF)
• Port Function Control Register 0 (PFCR0)
• Port Function Control Register 2 (PFCR2)
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9.13.1 Port F Data Direction Register (PFDDR)
The individual bits of PFDDR specify input or output for the pins of port F.
PFDDR cannot be read; if it is, an undefined value will be read.
Bit Bit Name Initial Value R/W Description
7 PF7DDR 1/0* W
6 PF6DDR 0 W
5 PF5DDR 0 W
4 PF4DDR 0 W
3 PF3DDR 0 W
2 PF2DDR 0 W
1 PF1DDR 0 W
0 PF0DDR 0 W
• Modes 1, 2, 4, and 7 (when EXPE = 1)
Pin PF7 functions as the φ output pin when the
corresponding PFDDR bit is set to 1, and as an
input port when the bit is cleared to 0.
Pin PF6 functions as the AS output pin when ASOE
is set to 1. When ASOE is cleared to 0, pin PF6 is
an I/O port and its function can be switched with
PF6DDR.
Pins PF5 and PF4 are automatically designated as
bus control outputs (RD and HWR).
Pin PF3 functions as the LWR output pin when
LWROE is set to 1. When LWROE is cleared to 0,
pin PF3 is an I/O port and its function can be
switched with PF3DDR.
Pins PF2 and PF1 function as bus control output
pins (LCAS and UCAS) when the appropriate bus
controller settings are made. When the CS output
enable bits (CS6E and CS5E) are set to 1, they
function as CS outputs. When the CS output enable
bits (CS6E and CS5E) are cleared to 0, pins PF2
and PF1 are I/O ports and their functions can be
switched with the corresponding PFDDR bits.
Pin PF0 functions as a bus control input pin (WAIT)
when the appropriate bus controller settings are
made. Otherwise, this pin is an output port when the
corresponding PFDDR bit is set to 1, and an input
port when the bit is cleared to 0.
• Mode 7 (when EXPE = 0)
Pin PF7 functions as the φ output pin when the
corresponding PFDDR bit is set to 1, and as an
input port when the bit is cleared to 0.
Pins PF6 to PF0 are I/O ports, and their functions
can be switched with PFDDR.
Note: * PF7DDR is initialized to 1 in modes 1, 2, and 4, and to 0 in mode 7.
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9.13.2 Port F Data Register (PFDR)
PFDR stores output data for the port F pins.
Bit Bit Name Initial Value R/W Description
7 PF7DR 0 R/W
6 PF6DR 0 R/W
5 PF5DR 0 R/W
4 PF4DR 0 R/W
Output data for a pin is stored when the pin function
is specified to a general purpose I/O.
3 PF3DR 0 R/W
2 PF2DR 0 R/W
1 PF1DR 0 R/W
0 PF0DR 0 R/W
9.13.3 Port F Register (PORTF)
PORTF shows port F pin states.
PORTF cannot be modified.
Bit Bit Name Initial Value R/W Description
7 PF7 —* R
6 PF6 —* R
5 PF5 —* R
4 PF4 —* R
If a port F read is performed while PFDDR bits are
set to 1, the PFDR values are read. If a port F read
is performed while PFDDR bits are cleared to 0, the
pin states are read.
3 PF3 —* R
2 PF2 —* R
1 PF1 —* R
0 PF0 —* R
Note: * Determined by the states of pins PF7 to PF0.
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9.13.4 Pin Functions
Port F pins also function as the pins for external interrupt inputs, bus control signal I/Os, and
system clock outputs (φ). The correspondence between the register specification and the pin
functions is shown below.
• PF7/φ
The pin function is switched as shown below according to bit PF7DDR.
Operating
mode
1, 2, 4, 7
PF7DDR 0 1
Pin function PF7 input φ output
• PF6/AS
The pin function is switched as shown below according to the operating mode, bit EXPE, bit
ASOE, and bit PF6DDR.
Operating
mode
1, 2, 4 7
EXPE — 0 1
ASOE 1 0 — 1 0
PF6DDR — 0 1 0 1 — 0 1
Pin function AS output PF6 input PF6
output
PF6 input PF6
output
AS output PF6 input PF6
output
• PF5/RD
The pin function is switched as shown below according to the operating mode, bit EXPE, and bit
PF5DDR.
Operating
mode
1, 2, 4 7
EXPE — 0 1
PF5DDR — 0 1 —
Pin function RD output PF5 input PF5 output RD output
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• PF4/HWR
The pin function is switched as shown below according to the operating mode, bit EXPE, and bit
PF4DDR.
Operating
mode
1, 2, 4 7
EXPE — 0 1
PF4DDR — 0 1 —
Pin function HWR output PF4 input PF4 output HWR output
• PF3/LWR
The pin function is switched as shown below according to the operating mode, bit EXPE, bit
LWROE, and bit PF3DDR.
Operating
mode
1, 2, 4 7
EXPE — 0 1
LWROD 1 0 — 1 0
PF3DDR — 0 1 0 1 — 0 1
Pin function LWR
output
PF3 input PF3
output
PF3 input PF3
output
LWR
output
PF3 input PF3
output
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• PF2/CS6/LCAS
The pin function is switched as shown below according to the combination of the operating mode,
bit EXPE, bits RMTS2 to RMTS0 in DRAMCR, bits ABW5 to ABW2 in ABWCR, and bit
PF2DDR.
Operating
mode
1, 2, 4 3, 7
EXPE — 0 1
Areas 2 to 5 Any
DRAM
space
area is
16-bit
bus
space
All DRAM space areas are 8-
bit bus space, or areas 2 to 5
are all normal space
— Any
DRAM
space
area is
16-bit
bus
space
All DRAM space areas are 8-
bit bus space, or areas 2 to 5
are all normal space
CS6E — 1 0 — — 1 0
PF2DDR — 0 1 0 1 0 1 — 0 1 0 1
Pin function LCAS
output
PF2
input
CS6
output
PF2
input
PF2
output
PF2
input
PF2
output
LCAS
output
PF2
input
CS6
output
PF2
input
PF2
output
• PF1/CS5/UCAS
The pin function is switched as shown below according to the combination of the operating mode,
bit EXPE, bits RMTS2 to RMTS0 in DRAMCR, and bit PF1DDR.
Operating
mode
1, 2, 4 3, 7
EXPE — 0 1
Areas 2 to 5 Any
DRAM
space
area is
16-bit
bus
space
All DRAM space areas are 8-
bit bus space, or areas 2 to 5
are all normal space
— Any
DRAM
space
area is
16-bit
bus
space
All DRAM space areas are 8-
bit bus space, or areas 2 to 5
are all normal space
CS6E — 1 0 — — 1 0
PF1DDR — 0 1 0 1 0 1 — 0 1 0 1
Pin function UCAS
output
PF1
input
CS5
output
PF1
input
PF1
output
PF1
input
PF1
output
UCAS
output
PF1
input
CS5
output
PF1
input
PF1
output
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• PF0/WAIT/OE
The pin function is switched as shown below according to the operating mode, bit EXPE, bit
WAITE, bit OEE in DRAMCR, bit OES in PFCR2, and bit PF0DDR.
Operating
mode
1, 2, 4 7
EXPE — 0 1
OEE 0 1 — 0 1
OES — 0 1 — — 0 1
WAITE — 0 1 — — — 0 1 —
PF0DDR 0 1 0 1 — — 0 1 0 1 0 1 — —
Pin function PF0
input
PF0
output
PF0
input
PF0
output
W
AIT
input
OE
output
PF0
input
PF0
output
PF0
input
PF0
output
PF0
input
PF0
output
WAIT
input
OE
output
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 395 of 980
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9.14 Port G
Port G is a 7-bit I/O port that also has other functions. The port G has the following registers.
• Port G data direction register (PGDDR)
• Port G data register (PGDR)
• Port G register (PORTG)
• Port Function Control Register 0 (PFCR0)
9.14.1 Port G Data Direction Register (PGDDR)
The individual bits of PGDDR specify input or output for the pins of port G.
PGDDR cannot be read; if it is, an undefined value will be read.
Bit Bit Name Initial Value R/W Description
7 — 0 — Reserved
6 PG6DDR 0 W
5 PG5DDR 0 W
4 PG4DDR 0 W
3 PG3DDR 0 W
2 PG2DDR 0 W
1 PG1DDR 0 W
0 PG0DDR 1/0* W
• Modes 1, 2, 4, and 7 (when EXPE = 1)
Pins PG6 and PG5 function as bus control
input/output pins (BREQ and BACK) when the
appropriate bus controller settings are made.
Otherwise, these pins are I/O ports, and their
functions can be switched with PGDDR. Pin PG4
functions as the bus control input/output pin
(BREQO) when the appropriate bus controller
settings are made. Otherwise, when the CS7E bit is
set to 1, pin PG4 functions as the CS7 output pin
when PG4DDR is set to 1, and as an input port
when the bit is cleared to 0. When the CS7E bit is
cleared to 0, pin PG4 is an I/O port, and its function
can be switched with PG4DDR. When the CS
output enable bits (CS3E to CS0E) are set to 1, pins
PG3 to PG0 function as CS output pins when the
corresponding PGDDR bit is set to 1, and as input
ports when the bit is cleared to 0. When CS3E to
CS0E are cleared to 0, pins PG3 to PG0 are I/O
ports, and their functions can be switched with
PGDDR.
• Mode 7 (when EXPE = 0)
Pins PG6 to PG0 are I/O ports, and their functions
can be switched with PGDDR.
Note: * PG0DDR is initialized to 1 in modes 1 and 2, and to 0 in modes 4 and 7.
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 396 of 980
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9.14.2 Port G Data Register (PGDR)
PGDR stores output data for the port G pins.
Bit Bit Name Initial Value R/W Description
7 — 0 — Reserved
This bit is always read as 0, and cannot be
modified.
6 PG6DR 0 R/W
5 PG5DR 0 R/W
4 PG4DR 0 R/W
3 PG3DR 0 R/W
2 PG2DR 0 R/W
1 PG1DR 0 R/W
0 PG0DR 0 R/W
An output data for a pin is stored when the pin
function is specified to a general purpose I/O.
9.14.3 Port G Register (PORTG)
PORTG shows port G pin states.
PORTG cannot be modified.
Bit Bit Name Initial Value R/W Description
7 — Undefined — Reserved
If this bit is read, it will return an undefined value.
6 PG6 —* R
5 PG5 —* R
4 PG4 —* R
3 PG3 —* R
2 PG2 —* R
1 PG1 —* R
0 PG0 —* R
If a port G read is performed while PGDDR bits are
set to 1, the PGDR values are read. If a port G read
is performed while PGDDR bits are cleared to 0, the
pin states are read.
Note: * Determined by the states of pins PG6 to PG0.
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 397 of 980
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9.14.4 Pin Functions
Port G pins also function as the pins for bus control signal I/Os. The correspondence between the
register specification and the pin functions is shown below.
• PG6/BREQ
The pin function is switched as shown below according to the operating mode, bit EXPE, bit
BRLE, and bit PG6DDR.
Operating
mode
1, 2, 4 7
EXPE — 0 1
BRLE 0 1 — 0 1
PG6DDR 0 1 — 0 1 0 1 —
Pin
function
PG6 input PG6
output
BREQ
input
PG6 input PG6
output
PG6 input PG6
output
BREQ
input
• PG5/BACK
The pin function is switched as shown below according to the operating mode, bit EXPE, bit
BRLE, and bit PG5DDR.
Operating
mode
1, 2, 4 7
EXPE — 0 1
BRLE 0 1 — 0 1
PG5DDR 0 1 — 0 1 0 1 —
Pin
function
PG5 input PG5
output
BACK
output
PG5 input PG5
output
PG5 input PG5
output
BACK
output
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 398 of 980
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• PG4/CS4/BREQO
The pin function is switched as shown below according to the operating mode, bit EXPE, bit
BRLE, bit BREQO, bit CS4E and bit PG4DDR.
EXPE
Operating
mode 7
1, 2, 4
1
1
1
11
0
1
0
−
−
−
−
−
−
−
−
−
0
0
01
0
01
01
0
01
01
1
0
0
1
01
01
1
0
1
1
01
0
BRLE
BREQ0E
CS4E
Pin
function
PG4
input
PG4
input
PG4
input
PG4
input
PG4
input
PG4
input
PG4
input
PG4
input
PG4
input
PG4
output
PG4
output
PG4
output
PG4
output
PG4
output
CS4
output
CS4
output
CS4
output
CS4
output
BREQO
output
BREQO
output
PG4DDR
• PG3/CS3/RAS3, PG2/CS2/RAS2
The pin function is switched as shown below according to the operating mode, bit EXPE, bit
PGnDDR, bit CSnE, and bits RMTS2 to RMTS0.
Operating
mode
1, 2, 4 7
EXPE — 0 1
CSnE 0 1 — 0 1
RMTS2 to
RMTS0
— Area n is in
normal space
Area n is in
DRAM
space
— — Area n is in
normal space
Area n is in
DRAM
space
PGnDDR 0 1 0 1 — 0 1 0 1 0 1 —
Pin
function
PGn
input
PGn
output
PGn
input
CSn
output
RASn
output
PGn
input
PGn
output
PGn
input
PGn
output
PGn
input
CSn
output
RASn
output
Legend: n = 2 or 3
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 399 of 980
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• PG1/CS1, PG0/CS0
The pin function is switched as shown below according to the operating mode, bit EXPE, bit
PGnDDR, and bit CsnE.
Operating
mode
1, 2, 4 7
EXPE — 0 1
CSnE 0 1 — 0 1
PGnDDR 0 1 0 1 0 1 0 1 0 1
Pin function PGn
input
PGn
output
PGn
input
CSn
output
PGn
input
PGn
output
PGn
input
PGn
output
PGn
input
CSn
output
Legend: n = 1 or 0
Section 9 I/O Ports
Rev.6.00 Mar. 18, 2009 Page 400 of 980
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Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 401 of 980
REJ09B0050-0600
Section 10 16-Bit Timer Pulse Unit (TPU)
This LSI has an on-chip 16-bit timer pulse unit (TPU) that comprises six 16-bit timer channels.
The function list of the 16-bit timer unit and its block diagram are shown in table 10.1 and figure
10.1, respectively.
10.1 Features
• Maximum 16-pulse input/output
• Selection of 8 counter input clocks for each channel
• The following operations can be set for each channel:
Waveform output at compare match
Input capture function
Counter clear operation
Synchronous operations:
Multiple timer counters (TCNT) can be written to simultaneously
Simultaneous clearing by compare match and input capture possible
Register simultaneous input/output possible by counter synchronous operation
Maximum of 15-phase PWM output possible by combination with synchronous operation
• Buffer operation settable for channels 0 and 3
• Phase counting mode settable independently for each of channels 1, 2, 4, and 5
• Cascaded operation
• Fast access via internal 16-bit bus
• 26 interrupt sources
• Automatic transfer of register data
• Programmable pulse generator (PPG) output trigger can be generated
• A/D converter conversion start trigger can be generated
• Module stop mode can be set
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 402 of 980
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Table 10.1 TPU Functions
Item Channel 0 Channel 1 Channel 2 Channel 3 Channel 4 Channel 5
Count clock φ/1
φ/4
φ/16
φ/64
TCLKA
TCLKB
TCLKC
TCLKD
φ/1
φ/4
φ/16
φ/64
φ/256
TCLKA
TCLKB
φ/1
φ/4
φ/16
φ/64
φ/1024
TCLKA
TCLKB
TCLKC
φ/1
φ/4
φ/16
φ/64
φ/256
φ/1024
φ/4096
TCLKA
φ/1
φ/4
φ/16
φ/64
φ/1024
TCLKA
TCLKC
φ/1
φ/4
φ/16
φ/64
φ/256
TCLKA
TCLKC
TCLKD
General registers
(TGR)
TGRA_0
TGRB_0
TGRA_1
TGRB_1
TGRA_2
TGRB_2
TGRA_3
TGRB_3
TGRA_4
TGRB_4
TGRA_5
TGRB_5
General registers/
buffer registers
TGRC_0
TGRD_0
— — TGRC_3
TGRD_3
— —
I/O pins TIOCA0
TIOCB0
TIOCC0
TIOCD0
TIOCA1
TIOCB1
TIOCA2
TIOCB2
TIOCA3
TIOCB3
TIOCC3
TIOCD3
TIOCA4
TIOCB4
TIOCA5
TIOCB5
Counter clear
function
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
0 output O O O O O O
1 output O O O O O O
Compare
match
output
Toggle
output O O O O O O
Input capture
function O O O O O O
Synchronous
operation O O O O O O
PWM mode O O O O O O
Phase counting
mode
— O O —
O O
Buffer operation O — —
O — —
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 403 of 980
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Item Channel 0 Channel 1 Channel 2 Channel 3 Channel 4 Channel 5
DTC
activation
TGR
compare
match or
input capture
TGR
compare
match or
input capture
TGR
compare
match or
input capture
TGR
compare
match or
input capture
TGR
compare
match or
input capture
TGR
compare
match or
input capture
DMAC
activation
TGRA
compare
match or
input capture
TGRA
compare
match or
input capture
TGRA
compare
match or
input capture
TGRA
compare
match or
input capture
TGRA
compare
match or
input capture
TGRA
compare
match or
input capture
A/D
converter
trigger
TGRA
compare
match or
input capture
TGRA
compare
match or
input capture
TGRA
compare
match or
input capture
TGRA
compare
match or
input capture
TGRA
compare
match or
input capture
TGRA
compare
match or
input capture
PPG
trigger
TGRA/
TGRB
compare
match or
input capture
TGRA/
TGRB
compare
match or
input capture
TGRA/
TGRB
compare
match or
input capture
TGRA/
TGRB
compare
match or
input capture
— —
Interrupt
sources
5 sources
• Compare
match or
input
capture 0A
• Compare
match or
input
capture 0B
• Compare
match or
input
capture 0C
• Compare
match or
input
capture 0D
• Overflow
4 sources
• Compare
match or
input
capture 1A
• Compare
match or
input
capture 1B
• Overflow
• Underflow
4 sources
• Compare
match or
input
capture 2A
• Compare
match or
input
capture 2B
• Overflow
• Underflow
5 sources
• Compare
match or
input
capture 3A
• Compare
match or
input
capture 3B
• Compare
match or
input
capture 3C
• Compare
match or
input
capture 3D
• Overflow
4 sources
• Compare
match or
input
capture 4A
• Compare
match or
input
capture 4B
• Overflow
• Underflow
4 sources
• Compare
match or
input
capture 5A
• Compare
match or
input
capture 5B
• Overflow
• Underflow
Legend:
O: Possible
⎯: Not possible
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 404 of 980
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Channel 3
TMDR
TIORL
TSR
TCR
TIORH
TIER
TGRA
TCNT
TGRB
TGRC
TGRD
Channel 4
TMDR
TSR
TCR
TIOR
TIER
TGRA
TCNT
TGRB
Control logic TMDR
TSR
TCR
TIOR
TIER
TGRA
TCNT
TGRB
Control logic for channels 3 to 5
TMDR
TSR
TCR
TIOR
TIER
TGRA
TCNT
TGRB
TGRC
Channel 1
TMDR
TSR
TCR
TIOR
TIER
TGRA
TCNT
TGRB
Channel 0
TMDR
TSR
TCR
TIORH
TIER
Control logic for channels 0 to 2
TGRA
TCNT
TGRB
TGRD
TSYRTSTR
Input/output pins
TIOCA3
TIOCB3
TIOCC3
TIOCD3
TIOCA4
TIOCB4
TIOCA5
TIOCB5
Clock input
φ/1
φ/4
φ/16
φ/64
φ/256
φ/1024
φ/4096
TCLKA
TCLKB
TCLKC
TCLKD
Input/output pins
TIOCA0
TIOCB0
TIOCC0
TIOCD0
TIOCA1
TIOCB1
TIOCA2
TIOCB2
Interrupt request signals
Channel 3:
Channel 4:
Channel 5:
Interrupt request signals
Channel 0:
Channel 1:
Channel 2:
Internal data bus
A/D conversion start request signal
PPG output trigger signal
TIORL
Module data bus
TGI3A
TGI3B
TGI3C
TGI3D
TCI3V
TGI4A
TGI4B
TCI4V
TCI4U
TGI5A
TGI5B
TCI5V
TCI5U
TGI0A
TGI0B
TGI0C
TGI0D
TCI0V
TGI1A
TGI1B
TCI1V
TCI1U
TGI2A
TGI2B
TCI2V
TCI2U
Channel 3:
Channel 4:
Channel 5:
Internal clock:
External clock:
Channel 0:
Channel 1:
Channel 2:
Legend:
TSTR: Timer start register
TSYR: Timer synchronous register
TCR: Timer control register
TMDR: Timer mode register
TIOR (H, L): Timer I/O control registers (H, L)
TIER: Timer interrupt enable register
TSR: Timer status register
TGR (A, B, C, D): Timer general registers (A, B, C, D)
TCNT: Timer counter
Channel 2 Common Channel 5
Bus interface
Figure 10.1 Block Diagram of TPU
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 405 of 980
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10.2 Input/Output Pins
Table 10.2 Pin Configuration
Channel Symbol I/O Function
All TCLKA Input External clock A input pin
(Channels 1 and 5 phase counting mode A phase input)
TCLKB Input External clock B input pin
(Channels 1 and 5 phase counting mode B phase input)
TCLKC Input External clock C input pin
(Channels 2 and 4 phase counting mode A phase input)
TCLKD Input External clock D input pin
(Channels 2 and 4 phase counting mode B phase input)
0 TIOCA0 I/O TGRA_0 input capture input/output compare output/PWM output pin
TIOCB0 I/O TGRB_0 input capture input/output compare output/PWM output pin
TIOCC0 I/O TGRC_0 input capture input/output compare output/PWM output pin
TIOCD0 I/O TGRD_0 input capture input/output compare output/PWM output pin
1 TIOCA1 I/O TGRA_1 input capture input/output compare output/PWM output pin
TIOCB1 I/O TGRB_1 input capture input/output compare output/PWM output pin
2 TIOCA2 I/O TGRA_2 input capture input/output compare output/PWM output pin
TIOCB2 I/O TGRB_2 input capture input/output compare output/PWM output pin
3 TIOCA3 I/O TGRA_3 input capture input/output compare output/PWM output pin
TIOCB3 I/O TGRB_3 input capture input/output compare output/PWM output pin
TIOCC3 I/O TGRC_3 input capture input/output compare output/PWM output pin
TIOCD3 I/O TGRD_3 input capture input/output compare output/PWM output pin
4 TIOCA4 I/O TGRA_4 input capture input/output compare output/PWM output pin
TIOCB4 I/O TGRB_4 input capture input/output compare output/PWM output pin
5 TIOCA5 I/O TGRA_5 input capture input/output compare output/PWM output pin
TIOCB5 I/O TGRB_5 input capture input/output compare output/PWM output pin
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 406 of 980
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10.3 Register Descriptions
The TPU has the following registers in each channel.
• Timer control register_0 (TCR_0)
• Timer mode register_0 (TMDR_0)
• Timer I/O control register H_0 (TIORH_0)
• Timer I/O control register L_0 (TIORL_0)
• Timer interrupt enable register_0 (TIER_0)
• Timer status register_0 (TSR_0)
• Timer counter_0 (TCNT_0)
• Timer general register A_0 (TGRA_0)
• Timer general register B_0 (TGRB_0)
• Timer general register C_0 (TGRC_0)
• Timer general register D_0 (TGRD_0)
• Timer control register_1 (TCR_1)
• Timer mode register_1 (TMDR_1)
• Timer I/O control register _1 (TIOR_1)
• Timer interrupt enable register_1 (TIER_1)
• Timer status register_1 (TSR_1)
• Timer counter_1 (TCNT_1)
• Timer general register A_1 (TGRA_1)
• Timer general register B_1 (TGRB_1)
• Timer control register_2 (TCR_2)
• Timer mode register_2 (TMDR_2)
• Timer I/O control register_2 (TIOR_2)
• Timer interrupt enable register_2 (TIER_2)
• Timer status register_2 (TSR_2)
• Timer counter_2 (TCNT_2)
• Timer general register A_2 (TGRA_2)
• Timer general register B_2 (TGRB_2)
• Timer control register_3 (TCR_3)
• Timer mode register_3 (TMDR_3)
• Timer I/O control register H_3 (TIORH_3)
• Timer I/O control register L_3 (TIORL_3)
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 407 of 980
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• Timer interrupt enable register_3 (TIER_3)
• Timer status register_3 (TSR_3)
• Timer counter_3 (TCNT_3)
• Timer general register A_3 (TGRA_3)
• Timer general register B_3 (TGRB_3)
• Timer general register C_3 (TGRC_3)
• Timer general register D_3 (TGRD_3)
• Timer control register_4 (TCR_4)
• Timer mode register_4 (TMDR_4)
• Timer I/O control register _4 (TIOR_4)
• Timer interrupt enable register_4 (TIER_4)
• Timer status register_4 (TSR_4)
• Timer counter_4 (TCNT_4)
• Timer general register A_4 (TGRA_4)
• Timer general register B_4 (TGRB_4)
• Timer control register_5 (TCR_5)
• Timer mode register_5 (TMDR_5)
• Timer I/O control register_5 (TIOR_5)
• Timer interrupt enable register_5 (TIER_5)
• Timer status register_5 (TSR_5)
• Timer counter_5 (TCNT_5)
• Timer general register A_5 (TGRA_5)
• Timer general register B_5 (TGRB_5)
Common Registers
• Timer start register (TSTR)
• Timer synchronous register (TSYR)
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 408 of 980
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10.3.1 Timer Control Register (TCR)
The TCR registers control the TCNT operation for each channel. The TPU has a total of six TCR
registers, one for each channel. TCR register settings should be made only when TCNT operation
is stopped.
Bit Bit Name Initial Value R/W Description
7
6
5
CCLR2
CCLR1
CCLR0
0
0
0
R/W
R/W
R/W
Counter Clear 2 to 0
These bits select the TCNT counter clearing source.
See tables 10.3 and 10.4 for details.
4
3
CKEG1
CKEG0
0
0
R/W
R/W
Clock Edge 1 and 0
These bits select the input clock edge. When the
input clock is counted using both edges, the input
clock period is halved (e.g. φ/4 both edges = φ/2
rising edge). If phase counting mode is used on
channels 1, 2, 4, and 5, this setting is ignored and
the phase counting mode setting has priority.
Internal clock edge selection is valid when the input
clock is φ/4 or slower. This setting is ignored if the
input clock is φ/1, or when overflow/underflow of
another channel is selected.
00: Count at rising edge
01: Count at falling edge
1×: Count at both edges
Legend: ×: Don’t care
2
1
0
TPSC2
TPSC1
TPSC0
0
0
0
R/W
R/W
R/W
Time Prescaler 2 to 0
These bits select the TCNT counter clock. The
clock source can be selected independently for
each channel. See tables 10.5 to 10.10 for details.
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 409 of 980
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Table 10.3 CCLR2 to CCLR0 (Channels 0 and 3)
Channel
Bit 7
CCLR2
Bit 6
CCLR1
Bit 5
CCLR0
Description
0, 3 0 0 0 TCNT clearing disabled
1 TCNT cleared by TGRA compare match/input
capture
1 0 TCNT cleared by TGRB compare match/input
capture
1 TCNT cleared by counter clearing for another
channel performing synchronous clearing/
synchronous operation*1
1 0 0 TCNT clearing disabled
1 TCNT cleared by TGRC compare match/input
capture*2
1 0 TCNT cleared by TGRD compare match/input
capture*2
1 TCNT cleared by counter clearing for another
channel performing synchronous clearing/
synchronous operation*1
Notes: 1. Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1.
2. When TGRC or TGRD is used as a buffer register, TCNT is not cleared because the
buffer register setting has priority, and compare match/input capture does not occur.
Table 10.4 CCLR2 to CCLR0 (Channels 1, 2, 4, and 5)
Channel
Bit 7
Reserved*2
Bit 6
CCLR1
Bit 5
CCLR0
Description
1, 2, 4, 5 0 0 0 TCNT clearing disabled
1 TCNT cleared by TGRA compare match/input
capture
1 0 TCNT cleared by TGRB compare match/input
capture
1 TCNT cleared by counter clearing for another
channel performing synchronous clearing/
synchronous operation*1
Notes: 1. Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1.
2. Bit 7 is reserved in channels 1, 2, 4, and 5. It is always read as 0 and cannot be
modified.
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 410 of 980
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Table 10.5 TPSC2 to TPSC0 (Channel 0)
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
0 0 0 0 Internal clock: counts on φ/1
1 Internal clock: counts on φ/4
1 0 Internal clock: counts on φ/16
1 Internal clock: counts on φ/64
1 0 0 External clock: counts on TCLKA pin input
1 External clock: counts on TCLKB pin input
1 0 External clock: counts on TCLKC pin input
1 External clock: counts on TCLKD pin input
Table 10.6 TPSC2 to TPSC0 (Channel 1)
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
1 0 0 0 Internal clock: counts on φ/1
1 Internal clock: counts on φ/4
1 0 Internal clock: counts on φ/16
1 Internal clock: counts on φ/64
1 0 0 External clock: counts on TCLKA pin input
1 External clock: counts on TCLKB pin input
1 0 Internal clock: counts on φ/256
1 Counts on TCNT2 overflow/underflow
Note: This setting is ignored when channel 1 is in phase counting mode.
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 411 of 980
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Table 10.7 TPSC2 to TPSC0 (Channel 2)
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
2 0 0 0 Internal clock: counts on φ/1
1 Internal clock: counts on φ/4
1 0 Internal clock: counts on φ/16
1 Internal clock: counts on φ/64
1 0 0 External clock: counts on TCLKA pin input
1 External clock: counts on TCLKB pin input
1 0 External clock: counts on TCLKC pin input
1 Internal clock: counts on φ/1024
Note: This setting is ignored when channel 2 is in phase counting mode.
Table 10.8 TPSC2 to TPSC0 (Channel 3)
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
3 0 0 0 Internal clock: counts on φ/1
1 Internal clock: counts on φ/4
1 0 Internal clock: counts on φ/16
1 Internal clock: counts on φ/64
1 0 0 External clock: counts on TCLKA pin input
1 Internal clock: counts on φ/1024
1 0 Internal clock: counts on φ/256
1 Internal clock: counts on φ/4096
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.9 TPSC2 to TPSC0 (Channel 4)
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
4 0 0 0 Internal clock: counts on φ/1
1 Internal clock: counts on φ/4
1 0 Internal clock: counts on φ/16
1 Internal clock: counts on φ/64
1 0 0 External clock: counts on TCLKA pin input
1 External clock: counts on TCLKC pin input
1 0 Internal clock: counts on φ/1024
1 Counts on TCNT5 overflow/underflow
Note: This setting is ignored when channel 4 is in phase counting mode.
Table 10.10 TPSC2 to TPSC0 (Channel 5)
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
5 0 0 0 Internal clock: counts on φ/1
1 Internal clock: counts on φ/4
1 0 Internal clock: counts on φ/16
1 Internal clock: counts on φ/64
1 0 0 External clock: counts on TCLKA pin input
1 External clock: counts on TCLKC pin input
1 0 Internal clock: counts on φ/256
1 External clock: counts on TCLKD pin input
Note: This setting is ignored when channel 5 is in phase counting mode.
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.3.2 Timer Mode Register (TMDR)
TMDR registers are used to set the operating mode for each channel. The TPU has six TMDR
registers, one for each channel. TMDR register settings should be made only when TCNT
operation is stopped.
Bit Bit Name Initial Value R/W Description
7, 6 – All 1 – Reserved
These bits are always read as 1 and cannot be
modified.
5 BFB 0 R/W Buffer Operation B
Specifies whether TGRB is to operate in the normal
way, or TGRB and TGRD are to be used together
for buffer operation. When TGRD is used as a buffer
register, TGRD input capture/output compare is not
generated.
In channels 1, 2, 4, and 5, which have no TGRD, bit
5 is reserved. It is always read as 0 and cannot be
modified.
0: TGRB operates normally
1: TGRB and TGRD used together for buffer
operation
4 BFA 0 R/W Buffer Operation A
Specifies whether TGRA is to operate in the normal
way, or TGRA and TGRC are to be used together
for buffer operation. When TGRC is used as a buffer
register, TGRC input capture/output compare is not
generated.
In channels 1, 2, 4, and 5, which have no TGRC, bit
4 is reserved. It is always read as 0 and cannot be
modified.
0: TGRA operates normally
1: TGRA and TGRC used together for buffer
operation
3
2
1
0
MD3
MD2
MD1
MD0
0
0
0
0
R/W
R/W
R/W
R/W
Modes 3 to 0
These bits are used to set the timer operating mode.
MD3 is a reserved bit. The write value should
always be 0. See table 10.11 for details.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.11 MD3 to MD0
Bit 3
MD3*1
Bit 2
MD2*2
Bit 1
MD1
Bit 0
MD0
Description
0 0 0 0 Normal operation
1 Reserved
1 0 PWM mode 1
1 PWM mode 2
1 0 0 Phase counting mode 1
1 Phase counting mode 2
1 0 Phase counting mode 3
1 Phase counting mode 4
1 × × × —
Legend: ×: Don’t care
Notes: 1. MD3 is a reserved bit. The write value should always be 0.
2. Phase counting mode cannot be set for channels 0 and 3. In this case, 0 should always
be written to MD2.
10.3.3 Timer I/O Control Register (TIOR)
TIOR registers control the TGR registers. The TPU has eight TIOR registers, two each for
channels 0 and 3, and one each for channels 1, 2, 4, and 5. Care is required since TIOR is affected
by the TMDR setting.
The initial output specified by TIOR is valid when the counter is stopped (the CST bit in TSTR is
cleared to 0). Note also that, in PWM mode 2, the output at the point at which the counter is
cleared to 0 is specified.
When TGRC or TGRD is designated for buffer operation, this setting is invalid and the register
operates as a buffer register.
Section 10 16-Bit Timer Pulse Unit (TPU)
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TIORH_0, TIOR_1, TIOR_2, TIORH_3, TIOR_4, TIOR_5
Bit Bit Name Initial Value R/W Description
7
6
5
4
IOB3
IOB2
IOB1
IOB0
0
0
0
0
R/W
R/W
R/W
R/W
I/O Control B3 to B0
Specify the function of TGRB.
For details, see tables 10.12, 10.14, 10.15, 10.16,
10.18, and 10.19.
3
2
1
0
IOA3
IOA2
IOA1
IOA0
0
0
0
0
R/W
R/W
R/W
R/W
I/O Control A3 to A0
Specify the function of TGRA.
For details, see tables 10.20, 10.22, 10.23, 10.24,
10.26, and 10.27.
TIORL_0, TIORL_3
Bit Bit Name Initial Value R/W Description
7
6
5
4
IOD3
IOD2
IOD1
IOD0
0
0
0
0
R/W
R/W
R/W
R/W
I/O Control D3 to D0
Specify the function of TGRD.
For details, see tables 10.13, and 10.17.
3
2
1
0
IOC3
IOC2
IOC1
IOC0
0
0
0
0
R/W
R/W
R/W
R/W
I/O Control C3 to C0
Specify the function of TGRC.
For details, see tables 10.21, and 10.25
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.12 TIORH_0
Description
Bit 7
IOB3
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
TGRB_0
Function
TIOCB0 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 0 0 0 Capture input source is TIOCB0 pin
Input capture at rising edge
1 Capture input source is TIOCB0 pin
Input capture at falling edge
1 ×
Input
capture
register
Capture input source is TIOCB0 pin
Input capture at both edges
1 × × Capture input source is channel 1/count clock
Input capture at TCNT_1 count- up/count-down*
Legend: ×: Don’t care
Note: * When bits TPSC2 to TPSC0 in TCR_1 are set to B'000 and φ/1 is used as the TCNT_1
count clock, this setting is invalid and input capture is not generated.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.13 TIORL_0
Description
Bit 7
IOD3
Bit 6
IOD2
Bit 5
IOD1
Bit 4
IOD0
TGRD_0
Function
TIOCD0 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register*2 Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 0 0 0 Capture input source is TIOCD0 pin
Input capture at rising edge
1 Capture input source is TIOCD0 pin
Input capture at falling edge
1 ×
Input
capture
register*2
Capture input source is TIOCD0 pin
Input capture at both edges
1 × × Capture input source is channel 1/count clock
Input capture at TCNT_1 count-up/count-down*1
Legend: ×: Don’t care
Notes: 1. When bits TPSC2 to TPSC0 in TCR_1 are set to B'000 and φ/1 is used as the TCNT_1
count clock, this setting is invalid and input capture is not generated.
2. When the BFB bit in TMDR_0 is set to 1 and TGRD_0 is used as a buffer register, this
setting is invalid and input capture/output compare is not generated.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.14 TIOR_1
Description
Bit 7
IOB3
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
TGRB_1
Function
TIOCB1 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 0 0 0 Capture input source is TIOCB1 pin
Input capture at rising edge
1 Capture input source is TIOCB1 pin
Input capture at falling edge
1 ×
Input
capture
register
Capture input source is TIOCB1 pin
Input capture at both edges
1 × × TGRC_0 compare match/input capture
Input capture at generation of TGRC_0 compare
match/input capture
Legend: ×: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.15 TIOR_2
Description
Bit 7
IOB3
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
TGRB_2
Function
TIOCB2 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 × 0 0 Capture input source is TIOCB2 pin
Input capture at rising edge
1 Capture input source is TIOCB2 pin
Input capture at falling edge
1 ×
Input
capture
register
Capture input source is TIOCB2 pin
Input capture at both edges
Legend: ×: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.16 TIORH_3
Description
Bit 7
IOB3
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
TGRB_3
Function
TIOCB3 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 0 0 0 Capture input source is TIOCB3 pin
Input capture at rising edge
1 Capture input source is TIOCB3 pin
Input capture at falling edge
1 ×
Input
capture
register
Capture input source is TIOCB3 pin
Input capture at both edges
1 × × Capture input source is channel 4/count clock
Input capture at TCNT_4 count-up/count-down*
Legend: ×: Don’t care
Note: * When bits TPSC2 to TPSC0 in TCR_4 are set to B'000 and φ/1 is used as the TCNT_4
count clock, this setting is invalid and input capture is not generated.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.17 TIORL_3
Description
Bit 7
IOD3
Bit 6
IOD2
Bit 5
IOD1
Bit 4
IOD0
TGRD_3
Function
TIOCD3 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register*2 Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 0 0 0 Capture input source is TIOCD3 pin
Input capture at rising edge
1 Capture input source is TIOCD3 pin
Input capture at falling edge
1 ×
Input
capture
register*2
Capture input source is TIOCD3 pin
Input capture at both edges
1 × × Capture input source is channel 4/count clock
Input capture at TCNT_4 count-up/count-down*1
Legend: ×: Don’t care
Notes: 1. When bits TPSC2 to TPSC0 in TCR_4 are set to B'000 and φ/1 is used as the TCNT_4
count clock, this setting is invalid and input capture is not generated.
2. When the BFB bit in TMDR_3 is set to 1 and TGRD_3 is used as a buffer register, this
setting is invalid and input capture/output compare is not generated.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.18 TIOR_4
Description
Bit 7
IOB3
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
TGRB_4
Function
TIOCB4 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 0 0 0 Capture input source is TIOCB4 pin
Input capture at rising edge
1 Capture input source is TIOCB4 pin
Input capture at falling edge
1 ×
Input
capture
register
Capture input source is TIOCB4 pin
Input capture at both edges
1 × × Capture input source is TGRC_3 compare
match/input capture
Input capture at generation of TGRC_3 compare
match/input capture
Legend: ×: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.19 TIOR_5
Description
Bit 7
IOB3
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
TGRB_5
Function
TIOCB5 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 × 0 0 Capture input source is TIOCB5 pin
Input capture at rising edge
1 Capture input source is TIOCB5 pin
Input capture at falling edge
1 ×
Input
capture
register
Capture input source is TIOCB5 pin
Input capture at both edges
Legend: ×: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.20 TIORH_0
Description
Bit 3
IOA3
Bit 2
IOA2
Bit 1
IOA1
Bit 0
IOA0
TGRA_0
Function
TIOCA0 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 0 0 0 Capture input source is TIOCA0 pin
Input capture at rising edge
1 Capture input source is TIOCA0 pin
Input capture at falling edge
1 ×
Input
capture
register
Capture input source is TIOCA0 pin
Input capture at both edges
1 × × Capture input source is channel 1/count clock
Input capture at TCNT_1 count-up/count-down
Legend: ×: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.21 TIORL_0
Description
Bit 3
IOC3
Bit 2
IOC2
Bit 1
IOC1
Bit 0
IOC0
TGRC_0
Function
TIOCC0 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register* Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 0 0 0 Capture input source is TIOCC0 pin
Input capture at rising edge
1 Capture input source is TIOCC0 pin
Input capture at falling edge
1 ×
Input
capture
register*
Capture input source is TIOCC0 pin
Input capture at both edges
1 × × Capture input source is channel 1/count clock
Input capture at TCNT_1 count-up/count-down
Legend: ×: Don’t care
Note: * When the BFA bit in TMDR_0 is set to 1 and TGRC_0 is used as a buffer register, this
setting is invalid and input capture/output compare is not generated.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.22 TIOR_1
Description
Bit 3
IOA3
Bit 2
IOA2
Bit 1
IOA1
Bit 0
IOA0
TGRA_1
Function
TIOCA1 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 0 0 0 Capture input source is TIOCA1 pin
Input capture at rising edge
1 Capture input source is TIOCA1 pin
Input capture at falling edge
1 ×
Input
capture
register
Capture input source is TIOCA1 pin
Input capture at both edges
1 × × Capture input source is TGRA_0 compare
match/input capture
Input capture at generation of channel
0/TGRA_0 compare match/input capture
Legend: ×: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.23 TIOR_2
Description
Bit 3
IOA3
Bit 2
IOA2
Bit 1
IOA1
Bit 0
IOA0
TGRA_2
Function
TIOCA2 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 × 0 0 Capture input source is TIOCA2 pin
Input capture at rising edge
1 Capture input source is TIOCA2 pin
Input capture at falling edge
1 ×
Input
capture
register
Capture input source is TIOCA2 pin
Input capture at both edges
Legend: ×: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.24 TIORH_3
Description
Bit 3
IOA3
Bit 2
IOA2
Bit 1
IOA1
Bit 0
IOA0
TGRA_3
Function
TIOCA3 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 0 0 0 Capture input source is TIOCA3 pin
Input capture at rising edge
1 Capture input source is TIOCA3 pin
Input capture at falling edge
1 ×
Input
capture
register
Capture input source is TIOCA3 pin
Input capture at both edges
1 × × Capture input source is channel 4/count clock
Input capture at TCNT_4 count-up/count-down
Legend: ×: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.25 TIORL_3
Description
Bit 3
IOC3
Bit 2
IOC2
Bit 1
IOC1
Bit 0
IOC0
TGRC_3
Function
TIOCC3 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register* Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 0 0 0 Capture input source is TIOCC3 pin
Input capture at rising edge
1 Capture input source is TIOCC3 pin
Input capture at falling edge
1 ×
Input
capture
register*
Capture input source is TIOCC3 pin
Input capture at both edges
1 × × Capture input source is channel 4/count clock
Input capture at TCNT_4 count-up/count-down
Legend: ×: Don’t care
Note: * When the BFA bit in TMDR_3 is set to 1 and TGRC_3 is used as a buffer register, this
setting is invalid and input capture/output compare is not generated.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.26 TIOR_4
Description
Bit 3
IOA3
Bit 2
IOA2
Bit 1
IOA1
Bit 0
IOA0
TGRA_4
Function
TIOCA4 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 0 0 0 Capture input source is TIOCA4 pin
Input capture at rising edge
1 Capture input source is TIOCA4 pin
Input capture at falling edge
1 ×
Input
capture
register
Capture input source is TIOCA4 pin
Input capture at both edges
1 × × Capture input source is TGRA_3 compare
match/input capture
Input capture at generation of TGRA_3 compare
match/input capture
Legend: ×: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.27 TIOR_5
Description
Bit 3
IOA3
Bit 2
IOA2
Bit 1
IOA1
Bit 0
IOA0
TGRA_5
Function
TIOCA5 Pin Function
0 0 0 0 Output disabled
1
Output
compare
register Initial output is 0 output
0 output at compare match
1 0 Initial output is 0 output
1 output at compare match
1 Initial output is 0 output
Toggle output at compare match
1 0 0 Output disabled
1 Initial output is 1 output
0 output at compare match
1 0 Initial output is 1 output
1 output at compare match
1 Initial output is 1 output
Toggle output at compare match
1 × 0 0 Input capture source is TIOCA5 pin
Input capture at rising edge
1 Input capture source is TIOCA5 pin
Input capture at falling edge
1 ×
Input
capture
register
Input capture source is TIOCA5 pin
Input capture at both edges
Legend: ×: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.3.4 Timer Interrupt Enable Register (TIER)
TIER registers control enabling or disabling of interrupt requests for each channel. The TPU has
six TIER registers, one for each channel.
Bit Bit Name Initial value R/W Description
7 TTGE 0 R/W A/D Conversion Start Request Enable
Enables or disables generation of A/D conversion
start requests by TGRA input capture/compare
match.
0: A/D conversion start request generation disabled
1: A/D conversion start request generation enabled
6 – 1 – Reserved
This bit is always read as 1 and cannot be modified.
5 TCIEU 0 R/W Underflow Interrupt Enable
Enables or disables interrupt requests (TCIU) by the
TCFU flag when the TCFU flag in TSR is set to 1 in
channels 1, 2, 4, and 5.
In channels 0 and 3, bit 5 is reserved. It is always
read as 0 and cannot be modified.
0: Interrupt requests (TCIU) by TCFU disabled
1: Interrupt requests (TCIU) by TCFU enabled
4 TCIEV 0 R/W Overflow Interrupt Enable
Enables or disables interrupt requests (TCIV) by the
TCFV flag when the TCFV flag in TSR is set to 1.
0: Interrupt requests (TCIV) by TCFV disabled
1: Interrupt requests (TCIV) by TCFV enabled
3 TGIED 0 R/W TGR Interrupt Enable D
Enables or disables interrupt requests (TGID) by the
TGFD bit when the TGFD bit in TSR is set to 1 in
channels 0 and 3.
In channels 1, 2, 4, and 5, bit 3 is reserved. It is
always read as 0 and cannot be modified.
0: Interrupt requests (TGID) by TGFD bit disabled
1: Interrupt requests (TGID) by TGFD bit enabled
Section 10 16-Bit Timer Pulse Unit (TPU)
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Bit Bit Name Initial value R/W Description
2 TGIEC 0 R/W TGR Interrupt Enable C
Enables or disables interrupt requests (TGIC) by the
TGFC bit when the TGFC bit in TSR is set to 1 in
channels 0 and 3.
In channels 1, 2, 4, and 5, bit 2 is reserved. It is
always read as 0 and cannot be modified.
0: Interrupt requests (TGIC) by TGFC bit disabled
1: Interrupt requests (TGIC) by TGFC bit enabled
1 TGIEB 0 R/W TGR Interrupt Enable B
Enables or disables interrupt requests (TGIB) by the
TGFB bit when the TGFB bit in TSR is set to 1.
0: Interrupt requests (TGIB) by TGFB bit disabled
1: Interrupt requests (TGIB) by TGFB bit enabled
0 TGIEA 0 R/W TGR Interrupt Enable A
Enables or disables interrupt requests (TGIA) by the
TGFA bit when the TGFA bit in TSR is set to 1.
0: Interrupt requests (TGIA) by TGFA bit disabled
1: Interrupt requests (TGIA) by TGFA bit enabled
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.3.5 Timer Status Register (TSR)
TSR registers indicate the status of each channel. The TPU has six TSR registers, one for each
channel.
Bit
Bit
Name
Initial value
R/W
Description
7 TCFD 1 R Count Direction Flag
Status flag that shows the direction in which TCNT
counts in channels 1, 2, 4, and 5.
In channels 0 and 3, bit 7 is reserved. It is always
read as 1 and cannot be modified.
0: TCNT counts down
1: TCNT counts up
6 – 1 – Reserved
This bit is always read as 1 and cannot be
modified.
5 TCFU 0 R/(W)* Underflow Flag
Status flag that indicates that TCNT underflow has
occurred when channels 1, 2, 4, and 5 are set to
phase counting mode.
In channels 0 and 3, bit 5 is reserved. It is always
read as 0 and cannot be modified.
[Setting condition]
When the TCNT value underflows (changes from
H'0000 to H'FFFF)
[Clearing condition]
When 0 is written to TCFU after reading TCFU = 1
4 TCFV 0 R/(W)* Overflow Flag
Status flag that indicates that TCNT overflow has
occurred.
[Setting condition]
When the TCNT value overflows (changes from
H'FFFF to H'0000)
[Clearing condition]
When 0 is written to TCFV after reading TCFV = 1
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Bit
Bit
Name
Initial value
R/W
Description
3 TGFD 0 R/(W)* Input Capture/Output Compare Flag D
Status flag that indicates the occurrence of TGRD
input capture or compare match in channels 0 and
3.
In channels 1, 2, 4, and 5, bit 3 is reserved. It is
always read as 0 and cannot be modified.
[Setting conditions]
• When TCNT = TGRD while TGRD is
functioning as output compare register
• When TCNT value is transferred to TGRD by
input capture signal while TGRD is functioning
as input capture register
[Clearing conditions]
• When DTC is activated by TGID interrupt while
DISEL bit of MRB in DTC is 0
• When 0 is written to TGFD after reading TGFD
= 1
2 TGFC 0 R/(W)* Input Capture/Output Compare Flag C
Status flag that indicates the occurrence of TGRC
input capture or compare match in channels 0 and
3.
In channels 1, 2, 4, and 5, bit 2 is reserved. It is
always read as 0 and cannot be modified.
[Setting conditions]
• When TCNT = TGRC while TGRC is
functioning as output compare register
• When TCNT value is transferred to TGRC by
input capture signal while TGRC is functioning
as input capture register
[Clearing conditions]
• When DTC is activated by TGIC interrupt while
DISEL bit of MRB in DTC is 0
• When 0 is written to TGFC after reading TGFC
= 1
Section 10 16-Bit Timer Pulse Unit (TPU)
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Bit
Bit
Name
Initial value
R/W
Description
1 TGFB 0 R/(W)* Input Capture/Output Compare Flag B
Status flag that indicates the occurrence of TGRB
input capture or compare match.
[Setting conditions]
• When TCNT = TGRB while TGRB is functioning
as output compare register
• When TCNT value is transferred to TGRB by
input capture signal while TGRB is functioning
as input capture register
[Clearing conditions]
• When DTC is activated by TGIB interrupt while
DISEL bit of MRB in DTC is 0
• When 0 is written to TGFB after reading TGFB
= 1
0 TGFA 0 R/(W)* Input Capture/Output Compare Flag A
Status flag that indicates the occurrence of TGRA
input capture or compare match.
[Setting conditions]
• When TCNT = TGRA while TGRA is functioning
as output compare register
• When TCNT value is transferred to TGRA by
input capture signal while TGRA is functioning
as input capture register
[Clearing conditions]
• When DTC is activated by TGIA interrupt while
DISEL bit of MRB in DTC is 0
• When 0 is written to TGFA after reading TGFA
= 1
• When DMAC is activated by TGIA interrupt
while DTE bit of DMABCR in DMAC is set to 1
Note: * Only 0 can be written, for flag clearing.
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.3.6 Timer Counter (TCNT)
The TCNT registers are 16-bit readable/writable counters. The TPU has six TCNT counters, one
for each channel.
The TCNT counters are initialized to H'0000 by a reset, or in hardware standby mode.
The TCNT counters cannot be accessed in 8-bit units; they must always be accessed as a 16-bit
unit.
10.3.7 Timer General Register (TGR)
The TGR registers are 16-bit readable/writable registers with a dual function as output compare
and input capture registers. The TPU has 16 TGR registers, four each for channels 0 and 3 and two
each for channels 1, 2, 4, and 5. TGRC and TGRD for channels 0 and 3 can also be designated for
operation as buffer registers. The TGR registers cannot be accessed in 8-bit units; they must
always be accessed as a 16-bit unit. TGR buffer register combinations are TGRA–TGRC and
TGRB–TGRD.
10.3.8 Timer Start Register (TSTR)
TSTR selects operation/stoppage for channels 0 to 5. When setting the operating mode in TMDR
or setting the count clock in TCR, first stop the TCNT counter.
Bit Bit Name Initial value R/W Description
7, 6 – All 0 – Reserved
The write value should always be 0.
5
4
3
2
1
0
CST5
CST4
CST3
CST2
CST1
CST0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
Counter Start 5 to 0
These bits select operation or stoppage for TCNT.
If 0 is written to the CST bit during operation with
the TIOC pin designated for output, the counter
stops but the TIOC pin output compare output level
is retained. If TIOR is written to when the CST bit is
cleared to 0, the pin output level will be changed to
the set initial output value.
0: TCNT_5 to TCNT_0 count operation is stopped
1: TCNT_5 to TCNT_0 performs count operation
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.3.9 Timer Synchronous Register (TSYR)
TSYR selects independent operation or synchronous operation for the TCNT counters of channels
0 to 5. A channel performs synchronous operation when the corresponding bit in TSYR is set to 1.
Bit Bit Name Initial value R/W Description
7, 6 – – R/W
R/W
Reserved
The write value should always be 0.
5
4
3
2
1
0
SYNC5
SYNC4
SYNC3
SYNC2
SYNC1
SYNC0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
Timer Synchronization 5 to 0
These bits select whether operation is independent
of or synchronized with other channels.
When synchronous operation is selected,
synchronous presetting of multiple channels, and
synchronous clearing through counter clearing on
another channel are possible.
To set synchronous operation, the SYNC bits for at
least two channels must be set to 1. To set
synchronous clearing, in addition to the SYNC bit,
the TCNT clearing source must also be set by
means of bits CCLR2 to CCLR0 in TCR.
0: TCNT_5 to TCNT_0 operates independently
(TCNT presetting /clearing is unrelated to
other channels)
1: TCNT_5 to TCNT_0 performs synchronous
operation (TCNT synchronous presetting/
synchronous clearing is possible)
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.4 Operation
10.4.1 Basic Functions
Each channel has a TCNT and TGR register. TCNT performs up-counting, and is also capable of
free-running operation, periodic counting, and external event counting.
Each TGR can be used as an input capture register or output compare register.
Counter Operation: When one of bits CST0 to CST5 is set to 1 in TSTR, the TCNT counter for
the corresponding channel starts counting. TCNT can operate as a free-running counter, periodic
counter, and so on.
1. Example of count operation setting procedure
Figure 10.2 shows an example of the count operation setting procedure.
Select counter clock
Operation selection
Select counter clearing source
Periodic counter
Set period
Start count
<Periodic counter>
[1]
[2]
[4]
[3]
[5]
Free-running counter
Start count
<Free-running counter>
[5]
[1]
[2]
[3]
[4]
[5]
Select output compare register
Select the counter
clock with bits
TPSC2 to TPSC0 in
TCR. At the same
time, select the
input clock edge
with bits CKEG1
and CKEG0 in TCR.
For periodic counter
operation, select the
TGR to be used as
the TCNT clearing
source with bits
CCLR2 to CCLR0 in
TCR.
Designate the TGR
selected in [2] as an
output compare
register by means of
TIOR.
Set the periodic
counter cycle in the
TGR selected in [2].
Set the CST bit in
TSTR to 1 to start
the counter
operation.
Figure 10.2 Example of Counter Operation Setting Procedure
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2. Free-running count operation and periodic count operation
Immediately after a reset, the TPU’s TCNT counters are all designated as free-running
counters. When the relevant bit in TSTR is set to 1 the corresponding TCNT counter starts up-
count operation as a free-running counter. When TCNT overflows (changes from H'FFFF to
H'0000), the TCFV bit in TSR is set to 1. If the value of the corresponding TCIEV bit in TIER
is 1 at this point, the TPU requests an interrupt. After overflow, TCNT starts counting up again
from H'0000.
Figure 10.3 illustrates free-running counter operation.
TCNT value
H'FFFF
H'0000
CST bit
TCFV
Time
Figure 10.3 Free-Running Counter Operation
When compare match is selected as the TCNT clearing source, the TCNT counter for the
relevant channel performs periodic count operation. The TGR register for setting the period is
designated as an output compare register, and counter clearing by compare match is selected
by means of bits CCLR2 to CCLR0 in TCR. After the settings have been made, TCNT starts
count-up operation as a periodic counter when the corresponding bit in TSTR is set to 1. When
the count value matches the value in TGR, the TGF bit in TSR is set to 1 and TCNT is cleared
to H'0000.
If the value of the corresponding TGIE bit in TIER is 1 at this point, the TPU requests an
interrupt. After a compare match, TCNT starts counting up again from H'0000.
Figure 10.4 illustrates periodic counter operation.
Section 10 16-Bit Timer Pulse Unit (TPU)
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TCNT value
TGR
H'0000
CST bit
TGF
Time
Counter cleared by TGR
compare match
Flag cleared by software or
DTC activation
Figure 10.4 Periodic Counter Operation
Section 10 16-Bit Timer Pulse Unit (TPU)
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Waveform Output by Compare Match: The TPU can perform 0, 1, or toggle output from the
corresponding output pin using a compare match.
1. Example of setting procedure for waveform output by compare match
Figure 10.5 shows an example of the setting procedure for waveform output by a compare
match.
Select waveform output mode
Output selection
Set output timing
Start count
<Waveform output>
[1]
[2]
[3]
[1] Select initial value 0 output or 1 output, and
compare match output value 0 output, 1 output,
or toggle output, by means of TIOR. The set
initial value is output at the TIOC pin until the
first compare match occurs.
[2] Set the timing for compare match generation in
TGR.
[3] Set the CST bit in TSTR to 1 to start the count
operation.
Figure 10.5 Example of Setting Procedure for Waveform Output by Compare Match
Section 10 16-Bit Timer Pulse Unit (TPU)
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2. Examples of waveform output operation
Figure 10.6 shows an example of 0 output/1 output.
In this example, TCNT has been designated as a free-running counter, and settings have been
made so that 1 is output by compare match A, and 0 is output by compare match B. When the
set level and the pin level match, the pin level does not change.
TCNT value
H'FFFF
H'0000
TIOCA
TIOCB
Time
TGRA
TGRB
No change No change
No change No change
1 output
0 output
Figure 10.6 Example of 0 Output/1 Output Operation
Figure 10.7 shows an example of toggle output.
In this example TCNT has been designated as a periodic counter (with counter clearing
performed by compare match B), and settings have been made so that output is toggled by both
compare match A and compare match B.
TCNT value
H'FFFF
H'0000
TIOCB
TIOCA
Time
TGRB
TGRA
Toggle output
Toggle output
Counter cleared by TGRB compare match
Figure 10.7 Example of Toggle Output Operation
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Input Capture Function: The TCNT value can be transferred to TGR on detection of the TIOC
pin input edge.
Rising edge, falling edge, or both edges can be selected as the detection edge. For channels 0, 1, 3,
and 4, it is also possible to specify another channel’s counter input clock or compare match signal
as the input capture source.
Note: When another channel’s counter input clock is used as the input capture input for channels
0 and 3, φ/1 should not be selected as the counter input clock used for input capture input.
Input capture will not be generated if φ/1 is selected.
1. Example of setting procedure for input capture operation
Figure 10.8 shows an example of the setting procedure for input capture operation.
Select input capture input
Input selection
Start count
<Input capture operation>
[1]
[2]
[1] Designate TGR as an input capture register by
means of TIOR, and select the input capture
source and input signal edge (rising edge, falling
edge, or both edges).
[2] Set the CST bit in TSTR to 1 to start the count
operation.
Figure 10.8 Example of Setting Procedure for Input Capture Operation
Section 10 16-Bit Timer Pulse Unit (TPU)
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2. Example of input capture operation
Figure 10.9 shows an example of input capture operation.
In this example both rising and falling edges have been selected as the TIOCA pin input
capture input edge, falling edge has been selected as the TIOCB pin input capture input edge,
and counter clearing by TGRB input capture has been designated for TCNT.
TCNT value
H'0180
H'0000
TIOCA
TGRA
Time
H'0010
H'0005
Counter cleared by TIOCB
input (falling edge)
H'0160
H'0005 H'0160 H'0010
TGRB H'0180
TIOCB
Figure 10.9 Example of Input Capture Operation
10.4.2 Synchronous Operation
In synchronous operation, the values in multiple TCNT counters can be rewritten simultaneously
(synchronous presetting). Also, multiple of TCNT counters can be cleared simultaneously
(synchronous clearing) by making the appropriate setting in TCR.
Synchronous operation enables TGR to be incremented with respect to a single time base.
Channels 0 to 5 can all be designated for synchronous operation.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Example of Synchronous Operation Setting Procedure: Figure 10.10 shows an example of the
synchronous operation setting procedure.
Synchronous operation
selection
Set TCNT
Synchronous presetting
<Synchronous presetting>
[1]
[2]
Synchronous clearing
Select counter
clearing source
<Counter clearing>
[3]
Start count [5]
Set synchronous
counter clearing
<Synchronous clearing>
[4]
Start count [5]
Clearing
source generation
channel?
No
Yes
[1] Set to 1 the SYNC bits in TSYR corresponding to the channels to be designated for synchronous operation.
[2] When the TCNT counter of any of the channels designated for synchronous operation is written to, the
same value is simultaneously written to the other TCNT counters.
[3] Use bits CCLR2 to CCLR0 in TCR to specify TCNT clearing by input capture/output compare, etc.
[4] Use bits CCLR2 to CCLR0 in TCR to designate synchronous clearing for the counter clearing source.
[5] Set to 1 the CST bits in TSTR for the relevant channels, to start the count operation.
Set synchronous
operation
Figure 10.10 Example of Synchronous Operation Setting Procedure
Example of Synchronous Operation: Figure 10.11 shows an example of synchronous operation.
In this example, synchronous operation and PWM mode 1 have been designated for channels 0 to
2, TGRB_0 compare match has been set as the channel 0 counter clearing source, and
synchronous clearing has been set for the channel 1 and 2 counter clearing source.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Three-phase PWM waveforms are output from pins TIOCA0, TIOCA1, and TIOCA2. At this
time, synchronous presetting, and synchronous clearing by TGRB_0 compare match, is performed
for channel 0 to 2 TCNT counters, and the data set in TGRB_0 is used as the PWM cycle.
For details on PWM modes, see section 10.4.5, PWM Modes.
TCNT0 to TCNT2 values
H'0000
TIOCA_0
TIOCA_1
TGRB_0
Synchronous clearing by TGRB_0 compare match
TGRA_2
TGRA_1
TGRB_2
TGRA_0
TGRB_1
TIOCA_2
Time
Figure 10.11 Example of Synchronous Operation
10.4.3 Buffer Operation
Buffer operation, provided for channels 0 and 3, enables TGRC and TGRD to be used as buffer
registers.
Buffer operation differs depending on whether TGR has been designated as an input capture
register or a compare match register.
Table 10.28 shows the register combinations used in buffer operation.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.28 Register Combinations in Buffer Operation
Channel Timer General Register Buffer Register
0 TGRA_0 TGRC_0
TGRB_0 TGRD_0
3 TGRA_3 TGRC_3
TGRB_3 TGRD_3
• When TGR is an output compare register
When a compare match occurs, the value in the buffer register for the corresponding channel is
transferred to the timer general register.
This operation is illustrated in figure 10.12.
Buffer register Timer general
register TCNTComparator
Compare match signal
Figure 10.12 Compare Match Buffer Operation
• When TGR is an input capture register
When input capture occurs, the value in TCNT is transferred to TGR and the value previously
held in the timer general register is transferred to the buffer register.
This operation is illustrated in figure 10.13.
Buffer register Timer general
register TCNT
Input capture
signal
Figure 10.13 Input Capture Buffer Operation
Section 10 16-Bit Timer Pulse Unit (TPU)
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Example of Buffer Operation Setting Procedure: Figure 10.14 shows an example of the buffer
operation setting procedure.
Select TGR function
Buffer operation
Set buffer operation
Start count
<Buffer operation>
[1]
[2]
[3]
[1] Designate TGR as an input capture register or
output compare register by means of TIOR.
[2] Designate TGR for buffer operation with bits
BFA and BFB in TMDR.
[3] Set the CST bit in TSTR to 1 to start the count
operation.
Figure 10.14 Example of Buffer Operation Setting Procedure
Section 10 16-Bit Timer Pulse Unit (TPU)
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Examples of Buffer Operation:
1. When TGR is an output compare register
Figure 10.15 shows an operation example in which PWM mode 1 has been designated for
channel 0, and buffer operation has been designated for TGRA and TGRC. The settings used
in this example are TCNT clearing by compare match B, 1 output at compare match A, and 0
output at compare match B.
As buffer operation has been set, when compare match A occurs the output changes and the
value in buffer register TGRC is simultaneously transferred to timer general register TGRA.
This operation is repeated each time compare match A occurs.
For details on PWM modes, see section 10.4.5, PWM Modes.
TCNT value
TGRB_0
H'0000
TGRC_0
TGRA_0
H'0200 H'0520
TIOCA
H'0200
H'0450 H'0520
H'0450
TGRA_0 H'0450H'0200
Transfer
Time
Figure 10.15 Example of Buffer Operation (1)
Section 10 16-Bit Timer Pulse Unit (TPU)
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2. When TGR is an input capture register
Figure 10.16 shows an operation example in which TGRA has been designated as an input
capture register, and buffer operation has been designated for TGRA and TGRC.
Counter clearing by TGRA input capture has been set for TCNT, and both rising and falling
edges have been selected as the TIOCA pin input capture input edge.
As buffer operation has been set, when the TCNT value is stored in TGRA upon occurrence of
input capture A, the value previously stored in TGRA is simultaneously transferred to TGRC.
TCNT value
H'09FB
H'0000
TGRC
Time
H'0532
TIOCA
TGRA H'0F07H'0532
H'0F07
H'0532
H'0F07
H'09FB
Figure 10.16 Example of Buffer Operation (2)
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.4.4 Cascaded Operation
In cascaded operation, two 16-bit counters for different channels are used together as a 32-bit
counter.
This function works by counting the channel 1 (channel 4) counter clock at overflow/underflow of
TCNT_2 (TCNT_5) as set in bits TPSC2 to TPSC0 in TCR.
Underflow occurs only when the lower 16-bit TCNT is in phase counting mode.
Table 10.29 shows the register combinations used in cascaded operation.
Note: When phase counting mode is set for channel 1 or 4, the counter clock setting is invalid
and the counter operates independently in phase counting mode.
Table 10.29 Cascaded Combinations
Combination Upper 16 Bits Lower 16 Bits
Channels 1 and 2 TCNT_1 TCNT_2
Channels 4 and 5 TCNT_4 TCNT_5
Example of Cascaded Operation Setting Procedure: Figure 10.17 shows an example of the
setting procedure for cascaded operation.
Cascaded operation
Set cascading
Start count
<Cascaded operation>
Set bits TPSC2 to TPSC0 in the channel 1
(channel 4) TCR to B'1111 to select TCNT_2
(TCNT_5) overflow/underflow counting.
Set the CST bit in TSTR for the upper and lower
channel to 1 to start the count operation.
[1]
[2]
[1]
[2]
Figure 10.17 Cascaded Operation Setting Procedure
Section 10 16-Bit Timer Pulse Unit (TPU)
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Examples of Cascaded Operation: Figure 10.18 illustrates the operation when counting upon
TCNT_2 overflow/underflow has been set for TCNT_1, TGRA_1 and TGRA_2 have been
designated as input capture registers, and the TIOC pin rising edge has been selected.
When a rising edge is input to the TIOCA1 and TIOCA2 pins simultaneously, the upper 16 bits of
the 32-bit data are transferred to TGRA_1, and the lower 16 bits to TGRA_2.
TCNT_2
clock
TCNT_2 H'FFFF H'0000 H'0001
TIOCA1,
TIOCA2
TGRA_1 H'03A2
TGRA_2 H'0000
TCNT_1
clock
TCNT_1 H'03A1 H'03A2
Figure 10.18 Example of Cascaded Operation (1)
Figure 10.19 illustrates the operation when counting upon TCNT_2 overflow/underflow has been
set for TCNT_1, and phase counting mode has been designated for channel 2.
TCNT_1 is incremented by TCNT_2 overflow and decremented by TCNT_2 underflow.
TCLKC
TCNT_2 FFFD
TCNT_1 0001
TCLKD
FFFE FFFF 0000 0001 0002 0001 0000 FFFF
0000 0000
Figure 10.19 Example of Cascaded Operation (2)
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.4.5 PWM Modes
In PWM mode, PWM waveforms are output from the output pins. 0, 1, or toggle output can be
selected as the output level in response to compare match of each TGR.
Settings of TGR registers can output a PWM waveform in the range of 0–% to 100–% duty.
Designating TGR compare match as the counter clearing source enables the cycle to be set in that
register. All channels can be designated for PWM mode independently. Synchronous operation is
also possible.
There are two PWM modes, as described below.
• PWM mode 1
PWM output is generated from the TIOCA and TIOCC pins by pairing TGRA with TGRB and
TGRC with TGRD. The outputs specified by bits IOA3 to IOA0 and IOC3 to IOC0 in TIOR
are output from the TIOCA and TIOCC pins at compare matches A and C, respectively. The
outputs specified by bits IOB3 to IOB0 and IOD3 to IOD0 in TIOR are output at compare
matches B and D, respectively. The initial output value is the value set in TGRA or TGRC. If
the set values of paired TGRs are identical, the output value does not change when a compare
match occurs.
In PWM mode 1, a maximum 8-phase PWM output is possible.
• PWM mode 2
PWM output is generated using one TGR as the cycle register and the others as duty registers.
The output specified in TIOR is performed by means of compare matches. Upon counter
clearing by a synchronization register compare match, the output value of each pin is the initial
value set in TIOR. If the set values of the cycle and duty registers are identical, the output
value does not change when a compare match occurs.
In PWM mode 2, a maximum 15-phase PWM output is possible by combined use with
synchronous operation.
The correspondence between PWM output pins and registers is shown in table 10.30.
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 455 of 980
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Table 10.30 PWM Output Registers and Output Pins
Output Pins
Channel Registers PWM Mode 1 PWM Mode 2
0 TGRA_0 TIOCA0 TIOCA0
TGRB_0 TIOCB0
TGRC_0 TIOCC0 TIOCC0
TGRD_0 TIOCD0
1 TGRA_1 TIOCA1 TIOCA1
TGRB_1 TIOCB1
2 TGRA_2 TIOCA2 TIOCA2
TGRB_2 TIOCB2
3 TGRA_3 TIOCA3 TIOCA3
TGRB_3 TIOCB3
TGRC_3 TIOCC3 TIOCC3
TGRD_3 TIOCD3
4 TGRA_4 TIOCA4 TIOCA4
TGRB_4 TIOCB4
5 TGRA_5 TIOCA5 TIOCA5
TGRB_5 TIOCB5
Note: In PWM mode 2, PWM output is not possible for the TGR register in which the cycle is set.
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 456 of 980
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Example of PWM Mode Setting Procedure: Figure 10.20 shows an example of the PWM mode
setting procedure.
Select counter clock
PWM mode
Select counter clearing source
Select waveform output level
<PWM mode>
[1]
[2]
[3]
Set TGR [4]
Set PWM mode [5]
Start count [6]
[1] Select the counter clock with bits TPSC2 to
TPSC0 in TCR. At the same time, select the
input clock edge with bits CKEG1 and CKEG0 in
TCR.
[2] Use bits CCLR2 to CCLR0 in TCR to select the
TGR to be used as the TCNT clearing source.
[3] Use TIOR to designate the TGR as an output
compare register, and select the initial value and
output value.
[4] Set the cycle in the TGR selected in [2], and
set the duty in the other TGRs.
[5] Select the PWM mode with bits MD3 to MD0 in
TMDR.
[6] Set the CST bit in TSTR to 1 to start the count
operation.
Figure 10.20 Example of PWM Mode Setting Procedure
Examples of PWM Mode Operation: Figure 10.21 shows an example of PWM mode 1
operation.
In this example, TGRA compare match is set as the TCNT clearing source, 0 is set for the TGRA
initial output value and output value, and 1 is set as the TGRB output value.
In this case, the value set in TGRA is used as the cycle, and the values set in TGRB registers as
the duty.
Section 10 16-Bit Timer Pulse Unit (TPU)
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TCNT value
TGRA
H'0000
TIOCA
Time
TGRB
Counter cleared by
TGRA compare match
Figure 10.21 Example of PWM Mode Operation (1)
Figure 10.22 shows an example of PWM mode 2 operation.
In this example, synchronous operation is designated for channels 0 and 1, TGRB_1 compare
match is set as the TCNT clearing source, and 0 is set for the initial output value and 1 for the
output value of the other TGR registers (TGRA_0 to TGRD_0, TGRA_1), to output a 5-phase
PWM waveform.
In this case, the value set in TGRB_1 is used as the cycle, and the values set in the other TGRs as
the duty.
TCNT value
TGRB_1
H'0000
TIOCA0
Counter cleared by
TGRB_1 compare match
Time
TGRA_1
TGRD_0
TGRC_0
TGRB_0
TGRA_0
TIOCB0
TIOCC0
TIOCD0
TIOCA1
Figure 10.22 Example of PWM Mode Operation (2)
Section 10 16-Bit Timer Pulse Unit (TPU)
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Figure 10.23 shows examples of PWM waveform output with 0% duty and 100% duty in PWM
mode.
TCNT value
TGRA
H'0000
TIOCA
Time
TGRB
0% duty
TGRB rewritten
TGRB
rewritten
TGRB rewritten
TCNT value
TGRA
H'0000
TIOCA
Time
TGRB
100% duty
TGRB rewritten
TGRB rewritten
TGRB rewritten
Output does not change when cycle register and duty register
compare matches occur simultaneously
TCNT value
TGRA
H'0000
TIOCA
Time
TGRB
100% duty
TGRB rewritten
TGRB rewritten
TGRB rewritten
Output does not change when cycle register and duty
register compare matches occur simultaneously
0% duty
Figure 10.23 Example of PWM Mode Operation (3)
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.4.6 Phase Counting Mode
In phase counting mode, the phase difference between two external clock inputs is detected and
TCNT is incremented/decremented accordingly. This mode can be set for channels 1, 2, 4, and 5.
When phase counting mode is set, an external clock is selected as the counter input clock and
TCNT operates as an up/down-counter regardless of the setting of bits TPSC2 to TPSC0 and bits
CKEG1 and CKEG0 in TCR. However, the functions of bits CCLR1 and CCLR0 in TCR, and of
TIOR, TIER, and TGR are valid, and input capture/compare match and interrupt functions can be
used.
This can be used for two-phase encoder pulse input.
When overflow occurs while TCNT is counting up, the TCFV flag in TSR is set; when underflow
occurs while TCNT is counting down, the TCFU flag is set.
The TCFD bit in TSR is the count direction flag. Reading the TCFD flag provides an indication of
whether TCNT is counting up or down.
Table 10.31 shows the correspondence between external clock pins and channels.
Table 10.31 Clock Input Pins in Phase Counting Mode
External Clock Pins
Channels A-Phase B-Phase
When channel 1 or 5 is set to phase counting mode TCLKA TCLKB
When channel 2 or 4 is set to phase counting mode TCLKC TCLKD
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 460 of 980
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Example of Phase Counting Mode Setting Procedure: Figure 10.24 shows an example of the
phase counting mode setting procedure.
Phase counting mode
Select phase counting mode
Start count
<Phase counting mode>
Select phase counting mode with bits MD3 to
MD0 in TMDR.
Set the CST bit in TSTR to 1 to start the count
operation.
[1]
[2]
[1]
[2]
Figure 10.24 Example of Phase Counting Mode Setting Procedure
Section 10 16-Bit Timer Pulse Unit (TPU)
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Examples of Phase Counting Mode Operation: In phase counting mode, TCNT counts up or
down according to the phase difference between two external clocks. There are four modes,
according to the count conditions.
1. Phase counting mode 1
Figure 10.25 shows an example of phase counting mode 1 operation, and table 10.32
summarizes the TCNT up/down-count conditions.
TCNT value
Time
Down-count
Up-count
TCLKA (channels 1 and 5)
TCLKC (channels 2 and 4)
TCLKB (channels 1 and 5)
TCLKD (channels 2 and 4)
Figure 10.25 Example of Phase Counting Mode 1 Operation
Table 10.32 Up/Down-Count Conditions in Phase Counting Mode 1
TCLKA (Channels 1 and 5)
TCLKC (Channels 2 and 4)
TCLKB (Channels 1 and 5)
TCLKD (Channels 2 and 4)
Operation
High level Up-count
Low level
Low level
High level
High level Down-count
Low level
High level
Low level
Legend:
: Rising edge
: Falling edge
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 462 of 980
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2. Phase counting mode 2
Figure 10.26 shows an example of phase counting mode 2 operation, and table 10.33
summarizes the TCNT up/down-count conditions.
Time
Down-countUp-count
TCNT value
TCLKA (channels 1 and 5)
TCLKC (channels 2 and 4)
TCLKB (channels 1 and 5)
TCLKD (channels 2 and 4)
Figure 10.26 Example of Phase Counting Mode 2 Operation
Table 10.33 Up/Down-Count Conditions in Phase Counting Mode 2
TCLKA (Channels 1 and 5)
TCLKC (Channels 2 and 4)
TCLKB (Channels 1 and 5)
TCLKD (Channels 2 and 4)
Operation
High level Don’t care
Low level Don’t care
Low level Don’t care
High level Up-count
High level Don’t care
Low level Don’t care
High level Don’t care
Low level Down-count
Legend:
: Rising edge
: Falling edge
Section 10 16-Bit Timer Pulse Unit (TPU)
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3. Phase counting mode 3
Figure 10.27 shows an example of phase counting mode 3 operation, and table 10.34
summarizes the TCNT up/down-count conditions.
Time
Up-count Down-count
TCNT value
TCLKA (channels 1 and 5)
TCLKC (channels 2 and 4)
TCLKB (channels 1 and 5)
TCLKD (channels 2 and 4)
Figure 10.27 Example of Phase Counting Mode 3 Operation
Table 10.34 Up/Down-Count Conditions in Phase Counting Mode 3
TCLKA (Channels 1 and 5)
TCLKC (Channels 2 and 4)
TCLKB (Channels 1 and 5)
TCLKD (Channels 2 and 4)
Operation
High level Don’t care
Low level Don’t care
Low level Don’t care
High level Up-count
High level Down-count
Low level Don’t care
High level Don’t care
Low level Don’t care
Legend:
: Rising edge
: Falling edge
Section 10 16-Bit Timer Pulse Unit (TPU)
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4. Phase counting mode 4
Figure 10.28 shows an example of phase counting mode 4 operation, and table 10.35
summarizes the TCNT up/down-count conditions.
Time
Up-count Down-count
TCNT value
TCLKA (channels 1 and 5)
TCLKC (channels 2 and 4)
TCLKB (channels 1 and 5)
TCLKD (channels 2 and 4)
Figure 10.28 Example of Phase Counting Mode 4 Operation
Table 10.35 Up/Down-Count Conditions in Phase Counting Mode 4
TCLKA (Channels 1 and 5)
TCLKC (Channels 2 and 4)
TCLKB (Channels 1 and 5)
TCLKD (Channels 2 and 4)
Operation
High level Up-count
Low level
Low level Don’t care
High level
High level Down-count
Low level
High level Don’t care
Low level
Legend:
: Rising edge
: Falling edge
Phase Counting Mode Application Example: Figure 10.29 shows an example in which phase
counting mode is designated for channel 1, and channel 1 is coupled with channel 0 to input servo
motor 2-phase encoder pulses in order to detect the position or speed.
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 465 of 980
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Channel 1 is set to phase counting mode 1, and the encoder pulse A-phase and B-phase are input
to TCLKA and TCLKB.
Channel 0 operates with TCNT counter clearing by TGRC_0 compare match; TGRA_0 and
TGRC_0 are used for the compare match function, and are set with the speed control cycle and
position control cycle. TGRB_0 is used for input capture, with TGRB_0 and TGRD_0 operating
in buffer mode. The channel 1 counter input clock is designated as the TGRB_0 input capture
source, and detection of the pulse width of 2-phase encoder 4-multiplication pulses is performed.
TGRA_1 and TGRB_1 for channel 1 are designated for input capture, channel 0 TGRA_0 and
TGRC_0 compare matches are selected as the input capture source, and the up/down-counter
values for the control cycles are stored.
This procedure enables accurate position/speed detection to be achieved.
TCNT_1
TCNT_0
Channel 1
TGRA_1
(speed cycle capture)
TGRA_0
(speed control cycle)
TGRB_1
(position cycle capture)
TGRC_0
(position control cycle)
TGRB_0 (pulse width capture)
TGRD_0 (buffer operation)
Channel 0
TCLKA
TCLKB
Edge
detection
circuit
+
-
+
-
Figure 10.29 Phase Counting Mode Application Example
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.5 Interrupts
There are three kinds of TPU interrupt source: TGR input capture/compare match, TCNT
overflow, and TCNT underflow. Each interrupt source has its own status flag and enable/disable
bit, allowing generation of interrupt request signals to be enabled or disabled individually.
When an interrupt request is generated, the corresponding status flag in TSR is set to 1. If the
corresponding enable/disable bit in TIER is set to 1 at this time, an interrupt is requested. The
interrupt request is cleared by clearing the status flag to 0.
Relative channel priorities can be changed by the interrupt controller, but the priority order within
a channel is fixed. For details, see section 5, Interrupt Controller.
Table 10.36 lists the TPU interrupt sources.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.36 TPU Interrupts
Channel
Name
Interrupt Source
Interrupt
Flag
DTC
Activation
DMAC
Activation
0 TGI0A TGRA_0 input capture/compare match TGFA_0 Possible Possible
TGI0B TGRB_0 input capture/compare match TGFB_0 Possible Not possible
TGI0C TGRC_0 input capture/compare match TGFC_0 Possible Not possible
TGI0D TGRD_0 input capture/compare match TGFD_0 Possible Not possible
TGI0E TCNT_0 overflow TCFV_0 Not possible Not possible
1 TGI1A TGRA_1 input capture/compare match TGFA_1 Possible Possible
TGI1B TGRB_1 input capture/compare match TGFB_1 Possible Not possible
TCI1V TCNT_1 overflow TCFV_1 Not possible Not possible
TCI1U TCNT_1 underflow TCFU_1 Not possible Not possible
2 TGI2A TGRA_2 input capture/compare match TGFA_2 Possible Possible
TGI2B TGRB_2 input capture/compare match TGFB_2 Possible Not possible
TCI2V TCNT_2 overflow TCFV_2 Not possible Not possible
TCI2U TCNT_2 underflow TCFU_2 Not possible Not possible
3 TGI3A TGRA_3 input capture/compare match TGFA_3 Possible Possible
TGI3B TGRB_3 input capture/compare match TGFB_3 Possible Not possible
TGI3C TGRC_3 input capture/compare match TGFC_3 Possible Not possible
TGI3D TGRD_3 input capture/compare match TGFD_3 Possible Not possible
TCI3V TCNT_3 overflow TCFV_3 Not possible Not possible
4 TGI4A TGRA_4 input capture/compare match TGFA_4 Possible Possible
TGI4B TGRB_4 input capture/compare match TGFB_4 Possible Not possible
TCI4V TCNT_4 overflow TCFV_4 Not possible Not possible
TCI4U TCNT_4 underflow TCFU_4 Not possible Not possible
5 TGI5A TGRA_5 input capture/compare match TGFA_5 Possible Possible
TGI5B TGRB_5 input capture/compare match TGFB_5 Possible Not possible
TCI5V TCNT_5 overflow TCFV_5 Not possible Not possible
TCI5U TCNT_5 underflow TCFU_5 Not possible Not possible
Note: This table shows the initial state immediately after a reset. The relative channel priorities
can be changed by the interrupt controller.
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 468 of 980
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Input Capture/Compare Match Interrupt: An interrupt is requested if the TGIE bit in TIER is set to
1 when the TGF flag in TSR is set to 1 by the occurrence of a TGR input capture/compare match
on a particular channel. The interrupt request is cleared by clearing the TGF flag to 0. The TPU has
16 input capture/compare match interrupts, four each for channels 0 and 3, and two each for
channels 1, 2, 4, and 5.
Overflow Interrupt: An interrupt is requested if the TCIEV bit in TIER is set to 1 when the
TCFV flag in TSR is set to 1 by the occurrence of TCNT overflow on a channel. The interrupt
request is cleared by clearing the TCFV flag to 0. The TPU has six overflow interrupts, one for
each channel.
Underflow Interrupt: An interrupt is requested if the TCIEU bit in TIER is set to 1 when the
TCFU flag in TSR is set to 1 by the occurrence of TCNT underflow on a channel. The interrupt
request is cleared by clearing the TCFU flag to 0. The TPU has four underflow interrupts, one
each for channels 1, 2, 4, and 5.
10.6 DTC Activation
The DTC can be activated by the TGR input capture/compare match interrupt for a channel. For
details, see section 8, Data Transfer Controller (DTC).
A total of 16 TPU input capture/compare match interrupts can be used as DTC activation sources,
four each for channels 0 and 3, and two each for channels 1, 2, 4, and 5.
10.7 DMAC Activation
The DMAC can be activated by the TGRA input capture/compare match interrupt for a channel.
For details, see section 7, DMA Controller (DMAC).
In the TPU, a total of six TGRA input capture/compare match interrupts can be used as DMAC
activation sources, one for each channel.
10.8 A/D Converter Activation
The A/D converter can be activated by the TGRA input capture/compare match for a channel.
If the TTGE bit in TIER is set to 1 when the TGFA flag in TSR is set to 1 by the occurrence of a
TGRA input capture/compare match on a particular channel, a request to start A/D conversion is
sent to the A/D converter. If the TPU conversion start trigger has been selected on the A/D
converter side at this time, A/D conversion is started.
In the TPU, a total of six TGRA input capture/compare match interrupts can be used as A/D
converter conversion start sources, one for each channel.
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.9 Operation Timing
10.9.1 Input/Output Timing
TCNT Count Timing: Figure 10.30 shows TCNT count timing in internal clock operation, and
figure 10.31 shows TCNT count timing in external clock operation.
TCNT
TCNT
input clock
Internal clock
φ
N – 1 N N + 1 N + 2
Falling edge Rising edge
Figure 10.30 Count Timing in Internal Clock Operation
TCNT
TCNT
input clock
External clock
φ
N – 1 N N + 1 N + 2
Falling edge Rising edge Falling edge
Figure 10.31 Count Timing in External Clock Operation
Section 10 16-Bit Timer Pulse Unit (TPU)
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Output Compare Output Timing: A compare match signal is generated in the final state in
which TCNT and TGR match (the point at which the count value matched by TCNT is updated).
When a compare match signal is generated, the output value set in TIOR is output at the output
compare output pin. After a match between TCNT and TGR, the compare match signal is not
generated until the (TIOC pin) TCNT input clock is generated.
Figure 10.32 shows output compare output timing.
TGR
TCNT
TCNT
input clock
N
N N + 1
Compare
match signal
TIOC pin
φ
Figure 10.32 Output Compare Output Timing
Input Capture Signal Timing: Figure 10.33 shows input capture signal timing.
TCNT
Input capture
input
N N + 1 N + 2
NN + 2
TGR
Input capture
signal
φ
Figure 10.33 Input Capture Input Signal Timing
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Timing for Counter Clearing by Compare Match/Input Capture: Figure 10.34 shows the
timing when counter clearing by compare match occurrence is specified, and figure 10.35 shows
the timing when counter clearing by input capture occurrence is specified.
TCNT
Counter
clear signal
Compare
match signal
TGR N
N H'0000
φ
Figure 10.34 Counter Clear Timing (Compare Match)
TCNT
Counter clear
signal
Input capture
signal
TGR
N H'0000
N
φ
Figure 10.35 Counter Clear Timing (Input Capture)
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Buffer Operation Timing: Figures 10.36 and 10.37 show the timings in buffer operation.
TGRA,
TGRB
Compare
match signal
TCNT
TGRC,
TGRD
nN
N
n n + 1
φ
Figure 10.36 Buffer Operation Timing (Compare Match)
TGRA,
TGRB
TCNT
Input capture
signal
TGRC,
TGRD
N
n
n N + 1
N
N N + 1
φ
Figure 10.37 Buffer Operation Timing (Input Capture)
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10.9.2 Interrupt Signal Timing
TGF Flag Setting Timing in Case of Compare Match: Figure 10.38 shows the timing for
setting of the TGF flag in TSR by compare match occurrence, and the TGI interrupt request signal
timing.
TGR
TCNT
TCNT input
clock
N
N N + 1
Compare
match signal
TGF flag
TGI interrupt
φ
Figure 10.38 TGI Interrupt Timing (Compare Match)
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TGF Flag Setting Timing in Case of Input Capture: Figure 10.39 shows the timing for setting
of the TGF flag in TSR by input capture occurrence, and the TGI interrupt request signal timing.
TGR
TCNT
Input capture
signal
N
N
TGF flag
TGI interrupt
φ
Figure 10.39 TGI Interrupt Timing (Input Capture)
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TCFV Flag/TCFU Flag Setting Timing: Figure 10.40 shows the timing for setting of the TCFV
flag in TSR by overflow occurrence, and the TCIV interrupt request signal timing.
Figure 10.41 shows the timing for setting of the TCFU flag in TSR by underflow occurrence, and
the TCIU interrupt request signal timing.
Overflow
signal
TCNT
(overflow)
TCNT input
clock
H'FFFF H'0000
TCFV flag
TCIV interrupt
φ
Figure 10.40 TCIV Interrupt Setting Timing
Underflow
signal
TCNT
(underflow)
TCNT
input clock
H'0000 H'FFFF
TCFU flag
TCIU interrupt
φ
Figure 10.41 TCIU Interrupt Setting Timing
Section 10 16-Bit Timer Pulse Unit (TPU)
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Status Flag Clearing Timing: After a status flag is read as 1 by the CPU, it is cleared by writing
0 to it. When the DTC or DMAC is activated, the flag is cleared automatically. Figure 10.42
shows the timing for status flag clearing by the CPU, and figure 10.43 shows the timing for status
flag clearing by the DTC or DMAC.
Status flag
Write signal
Address TSR address
Interrupt
request
signal
TSR write cycle
T1T2
φ
Figure 10.42 Timing for Status Flag Clearing by CPU
Interrupt
request
signal
Status flag
Address Source address
DTC/DMAC
read cycle
T1T2
Destination
address
T1T2
DTC/DMAC
write cycle
φ
Figure 10.43 Timing for Status Flag Clearing by DTC/DMAC* Activation
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.10 Usage Notes
10.10.1 Module Stop Mode Setting
TPU operation can be disabled or enabled using the module stop control register. The initial
setting is for TPU operation to be halted. Register access is enabled by clearing module stop
mode. For details, refer to section 23, Power-Down Modes.
10.10.2 Input Clock Restrictions
The input clock pulse width must be at least 1.5 states in the case of single-edge detection, and at
least 2.5 states in the case of both-edge detection. The TPU will not operate properly with a
narrower pulse width.
In phase counting mode, the phase difference and overlap between the two input clocks must be at
least 1.5 states, and the pulse width must be at least 2.5 states. Figure 10.44 shows the input clock
conditions in phase counting mode.
Overlap
Phase
diffe-
rence
Phase
diffe-
rence
Overlap
TCLKA
(TCLKC)
TCLKB
(TCLKD)
Pulse width Pulse width
Pulse width Pulse width
Notes: Phase difference and overlap
Pulse width : 1.5 states or more
: 2.5 states or more
Figure 10.44 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.10.3 Caution on Cycle Setting
When counter clearing by compare match is set, TCNT is cleared in the final state in which it
matches the TGR value (the point at which the count value matched by TCNT is updated).
Consequently, the actual counter frequency is given by the following formula:
f =
φ
(N + 1)
Where f: Counter frequency
φ: Operating frequency
N: TGR set value
10.10.4 Contention between TCNT Write and Clear Operations
If the counter clearing signal is generated in the T2 state of a TCNT write cycle, TCNT clearing
takes precedence and the TCNT write is not performed. Figure 10.45 shows the timing in this
case.
Counter clearing
signal
Write signal
Address
φ
TCNT address
TCNT
TCNT write cycle
T
1
T
2
N H'0000
Figure 10.45 Contention between TCNT Write and Clear Operations
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10.10.5 Contention between TCNT Write and Increment Operations
If incrementing occurs in the T2 state of a TCNT write cycle, the TCNT write takes precedence
and TCNT is not incremented. Figure 10.46 shows the timing in this case.
TCNT input
clock
Write signal
Address
φ
TCNT address
TCNT
TCNT write cycle
T
1
T
2
N M
TCNT write data
Figure 10.46 Contention between TCNT Write and Increment Operations
10.10.6 Contention between TGR Write and Compare Match
If a compare match occurs in the T2 state of a TGR write cycle, the TGR write takes precedence
and the compare match signal is disabled. A compare match also does not occur when the same
value as before is written.
Figure 10.47 shows the timing in this case.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Compare
match signal
Write signal
Address
φ
TGR address
TCNT
TGR write cycle
T
1
T
2
N M
TGR write data
TGR
N N + 1
Disabled
Figure 10.47 Contention between TGR Write and Compare Match
10.10.7 Contention between Buffer Register Write and Compare Match
If a compare match occurs in the T2 state of a TGR write cycle, the data transferred to TGR by the
buffer operation will be the data prior to the write.
Figure 10.48 shows the timing in this case.
Compare
match signal
Write signal
Address
φ
Buffer register
address
Buffer
register
TGR write cycle
T
1
T
2
N
TGR
N M
Buffer register write data
Figure 10.48 Contention between Buffer Register Write and Compare Match
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.10.8 Contention between TGR Read and Input Capture
If the input capture signal is generated in the T1 state of a TGR read cycle, the data that is read will
be the data after input capture transfer.
Figure 10.49 shows the timing in this case.
Input capture
signal
Read signal
Address
φ
TGR address
TGR
TGR read cycle
T
1
T
2
M
Internal
data bus
X M
Figure 10.49 Contention between TGR Read and Input Capture
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 482 of 980
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10.10.9 Contention between TGR Write and Input Capture
If the input capture signal is generated in the T2 state of a TGR write cycle, the input capture
operation takes precedence and the write to TGR is not performed.
Figure 10.50 shows the timing in this case.
Input capture
signal
Write signal
Address
φ
TCNT
TGR write cycle
T
1
T
2
M
TGR
M
TGR address
Figure 10.50 Contention between TGR Write and Input Capture
10.10.10 Contention between Buffer Register Write and Input Capture
If the input capture signal is generated in the T2 state of a buffer register write cycle, the buffer
operation takes precedence and the write to the buffer register is not performed.
Figure 10.51 shows the timing in this case.
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 483 of 980
REJ09B0050-0600
Input capture
signal
Write signal
Address
φ
TCNT
Buffer register write cycle
T
1
T
2
N
TGR
N
M
M
Buffer
register
Buffer register
address
Figure 10.51 Contention between Buffer Register Write and Input Capture
10.10.11 Contention between Overflow/Underflow and Counter Clearing
If overflow/underflow and counter clearing occur simultaneously, the TCFV/TCFU flag in TSR is
not set and TCNT clearing takes precedence.
Figure 10.52 shows the operation timing when a TGR compare match is specified as the clearing
source, and H'FFFF is set in TGR.
Counter
clearing signal
TCNT input
clock
φ
TCNT
TGF
Disabled
TCFV
H'FFFF H'0000
Figure 10.52 Contention between Overflow and Counter Clearing
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Mar. 18, 2009 Page 484 of 980
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10.10.12 Contention between TCNT Write and Overflow/Underflow
If there is an up-count or down-count in the T2 state of a TCNT write cycle, when
overflow/underflow occurs, the TCNT write takes precedence and the TCFV/TCFU flag in TSR is
not set.
Figure 10.53 shows the operation timing when there is contention between TCNT write and
overflow.
Write signal
Address
φ
TCNT address
TCNT
TCNT write cycle
T
1
T
2
H'FFFF M
TCNT write data
TCFV flag
Figure 10.53 Contention between TCNT Write and Overflow
10.10.13 Multiplexing of I/O Pins
In this LSI, the TCLKA input pin is multiplexed with the TIOCC0 I/O pin, the TCLKB input pin
with the TIOCD0 I/O pin, the TCLKC input pin with the TIOCB1 I/O pin, and the TCLKD input
pin with the TIOCB2 I/O pin. When an external clock is input, compare match output should not
be performed from a multiplexed pin.
10.10.14 Interrupts and Module Stop Mode
If module stop mode is entered when an interrupt has been requested, it will not be possible to
clear the CPU interrupt source or the DMAC or DTC activation source. Interrupts should therefore
be disabled before entering module stop mode.
Section 11 Programmable Pulse Generator (PPG)
Rev.6.00 Mar. 18, 2009 Page 485 of 980
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Section 11 Programmable Pulse Generator (PPG)
The programmable pulse generator (PPG) provides pulse outputs by using the 16-bit timer pulse
unit (TPU) as a time base. The PPG pulse outputs are divided into 4-bit groups (groups 3 to 0) that
can operate both simultaneously and independently. The block diagram of PPG is shown in figure
11.1
11.1 Features
• 16-bit output data
• Four output groups
• Selectable output trigger signals
• Non-overlap mode
• Can operate together with the data transfer controller (DTC) and the DMA controller (DMAC)
• Settable inverted output
• Module stop mode can be set
PPG0001A_000020020100
Section 11 Programmable Pulse Generator (PPG)
Rev.6.00 Mar. 18, 2009 Page 486 of 980
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Compare match signals
PO15
PO14
PO13
PO12
PO11
PO10
PO9
PO8
PO7
PO6
PO5
PO4
PO3
PO2
PO1
PO0
Legend:
PMR:
PCR:
NDERH:
NDERL:
NDRH:
NDRL:
PODRH:
PODRL:
PPG output mode register
PPG output control register
Next data enable register H
Next data enable register L
Next data register H
Next data register L
Output data register H
Output data register L
Internal
data bus
Pulse output
pins, group 3
Pulse output
pins, group 2
Pulse output
pins, group 1
Pulse output
pins, group 0
PODRH
PODRL
NDRH
NDRL
Control logic
NDERH
PMR
NDERL
PCR
Figure 11.1 Block Diagram of PPG
Section 11 Programmable Pulse Generator (PPG)
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11.2 Input/Output Pins
Table 11.1 summarizes the I/O pins of the PPG.
Table 11.1 Pin Configuration
Pin Name I/O Function
PO15 Output
PO14 Output
PO13 Output
PO12 Output
Group 3 pulse output
PO11 Output
PO10 Output
PO9 Output
PO8 Output
Group 2 pulse output
PO7 Output
PO6 Output
PO5 Output
PO4 Output
Group 1 pulse output
PO3 Output
PO2 Output
Group 0 pulse output
PO1 Output
PO0 Output
11.3 Register Descriptions
The PPG has the following registers.
• Next data enable register H (NDERH)
• Next data enable register L (NDERL)
• Output data register H (PODRH)
• Output data register L (PODRL)
• Next data register H (NDRH)
• Next data register L (NDRL)
• PPG output control register (PCR)
• PPG output mode register (PMR)
Section 11 Programmable Pulse Generator (PPG)
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11.3.1 Next Data Enable Registers H, L (NDERH, NDERL)
NDERH, NDERL enable or disable pulse output on a bit-by-bit basis. For outputting pulse by the
PPG, set the corresponding DDR to 1.
• NDREH
Bit Bit Name Initial Value R/W Description
7
6
5
4
3
2
1
0
NDER15
NDER14
NDER13
NDER12
NDER11
NDER10
NDER9
NDER8
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Next Data Enable 15 to 8
When a bit is set to 1, the value in the
corresponding NDRH bit is transferred to the
PODRH bit by the selected output trigger. Values
are not transferred from NDRH to PODRH for
cleared bits.
• NDERL
Bit Bit Name Initial Value R/W Description
7
6
5
4
3
2
1
0
NDER7
NDER6
NDER5
NDER4
NDER3
NDER2
NDER1
NDER0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Next Data Enable 7 to 0
When a bit is set to 1, the value in the
corresponding NDRL bit is transferred to the
PODRL bit by the selected output trigger. Values
are not transferred from NDRL to PODRL for
cleared bits.
Section 11 Programmable Pulse Generator (PPG)
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11.3.2 Output Data Registers H, L (PODRH, PODRL)
PODRH and PODRL store output data for use in pulse output. A bit that has been set for pulse
output by NDER is read-only and cannot be modified.
• PODRH
Bit Bit Name Initial Value R/W Description
7
6
5
4
3
2
1
0
POD15
POD14
POD13
POD12
POD11
POD10
POD9
POD8
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Output Data Register 15 to 8
For bits which have been set to pulse output by
NDERH, the output trigger transfers NDRH values
to this register during PPG operation. While
NDERH is set to 1, the CPU cannot write to this
register. While NDERH is cleared, the initial output
value of the pulse can be set.
• PODRL
Bit Bit Name Initial Value R/W Description
7
6
5
4
3
2
1
0
POD7
POD6
POD5
POD4
POD3
POD2
POD1
POD0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Output Data Register 7 to 0
For bits which have been set to pulse output by
NDERL, the output trigger transfers NDRL values
to this register during PPG operation. While
NDERL is set to 1, the CPU cannot write to this
register. While NDERL is cleared, the initial output
value of the pulse can be set.
Section 11 Programmable Pulse Generator (PPG)
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11.3.3 Next Data Registers H, L (NDRH, NDRL)
NDRH, NDRL store the next data for pulse output. The NDR addresses differ depending on
whether pulse output groups have the same output trigger or different output triggers.
• NDRH
If pulse output groups 2 and 3 have the same output trigger, all eight bits are mapped to the same
address and can be accessed at one time, as shown below.
Bit Bit Name Initial Value R/W Description
7
6
5
4
3
2
1
0
NDR15
NDR14
NDR13
NDR12
NDR11
NDR10
NDR9
NDR8
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Next Data Register 15 to 8
The register contents are transferred to the
corresponding PODRH bits by the output trigger
specified with PCR.
If pulse output groups 2 and 3 have different output triggers, upper 4 bits and lower 4 bits are
mapped to the different addresses as shown below.
Bit Bit Name Initial Value R/W Description
7
6
5
4
NDR15
NDR14
NDR13
NDR12
0
0
0
0
R/W
R/W
R/W
R/W
Next Data Register 15 to 12
The register contents are transferred to the
corresponding PODRH bits by the output trigger
specified with PCR.
3
to
0
— All 1 — Reserved
These bits are always read as 1 and cannot be
modified.
Section 11 Programmable Pulse Generator (PPG)
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Bit Bit Name Initial Value R/W Description
7
to
4
— All 1 — Reserved
These bits are always read as 1 and cannot be
modified.
3
2
1
0
NDR11
NDR10
NDR9
NDR8
0
0
0
0
R/W
R/W
R/W
R/W
Next Data Register 11 to 8
The register contents are transferred to the
corresponding PODRH bits by the output trigger
specified with PCR.
• NDRL
If pulse output groups 0 and 1 have the same output trigger, all eight bits are mapped to the same
address and can be accessed at one time, as shown below.
Bit Bit Name Initial Value R/W Description
7
6
5
4
3
2
1
0
NDR7
NDR6
NDR5
NDR4
NDR3
NDR2
NDR1
NDR0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Next Data Register 7 to 0
The register contents are transferred to the
corresponding PODRL bits by the output trigger
specified with PCR.
If pulse output groups 0 and 1 have different output triggers, upper 4 bits and lower 4 bits are
mapped to the different addresses as shown below.
Bit Bit Name Initial Value R/W Description
7
6
5
4
NDR7
NDR6
NDR5
NDR4
0
0
0
0
R/W
R/W
R/W
R/W
Next Data Register 7 to 4
The register contents are transferred to the
corresponding PODRL bits by the output trigger
specified with PCR.
3
to
0
— All 1 — Reserved
These bits are always read as 1 and cannot be
modified.
Section 11 Programmable Pulse Generator (PPG)
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Bit Bit Name Initial Value R/W Description
7
to
4
— All 1 — Reserved
These bits are always read as 1 and cannot be
modified.
3
2
1
0
NDR3
NDR2
NDR1
NDR0
0
0
0
0
R/W
R/W
R/W
R/W
Next Data Register 3 to 0
The register contents are transferred to the
corresponding PODRL bits by the output trigger
specified with PCR.
11.3.4 PPG Output Control Register (PCR)
PCR selects output trigger signals on a group-by-group basis. For details on output trigger
selection, refer to section 11.3.5, PPG Output Mode Register (PMR).
Bit Bit Name Initial Value R/W Description
7
6
G3CMS1
G3CMS0
1
1
R/W
R/W
Group 3 Compare Match Select 1 and 0
Select output trigger of pulse output group 3.
00: Compare match in TPU channel 0
01: Compare match in TPU channel 1
10: Compare match in TPU channel 2
11: Compare match in TPU channel 3
5
4
G2CMS1
G2CMS0
1
1
R/W
R/W
Group 2 Compare Match Select 1 and 0
Select output trigger of pulse output group 2.
00: Compare match in TPU channel 0
01: Compare match in TPU channel 1
10: Compare match in TPU channel 2
11: Compare match in TPU channel 3
3
2
G1CMS1
G1CMS0
1
1
R/W
R/W
Group 1 Compare Match Select 1 and 0
Select output trigger of pulse output group 1.
00: Compare match in TPU channel 0
01: Compare match in TPU channel 1
10: Compare match in TPU channel 2
11: Compare match in TPU channel 3
Section 11 Programmable Pulse Generator (PPG)
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Bit Bit Name Initial Value R/W Description
1
0
G0CMS1
G0CMS0
1
1
R/W
R/W
Group 0 Compare Match Select 1 and 0
Select output trigger of pulse output group 0.
00: Compare match in TPU channel 0
01: Compare match in TPU channel 1
10: Compare match in TPU channel 2
11: Compare match in TPU channel 3
11.3.5 PPG Output Mode Register (PMR)
PMR selects the pulse output mode of the PPG for each group. If inverted output is selected, a
low-level pulse is output when PODRH is 1 and a high-level pulse is output when PODRH is 0. If
non-overlapping operation is selected, PPG updates its output values at compare match A or B of
the TPU that becomes the output trigger. For details, refer to section 11.4.4, Non-Overlapping
Pulse Output.
Bit Bit Name Initial Value R/W Description
7 G3INV 1 R/W Group 3 Inversion
Selects direct output or inverted output for pulse
output group 3.
0: Inverted output
1: Direct output
6 G2INV 1 R/W Group 2 Inversion
Selects direct output or inverted output for pulse
output group 2.
0: Inverted output
1: Direct output
5 G1INV 1 R/W Group 1 Inversion
Selects direct output or inverted output for pulse
output group 1.
0: Inverted output
1: Direct output
4 G0INV 1 R/W Group 0 Inversion
Selects direct output or inverted output for pulse
output group 0.
0: Inverted output
1: Direct output
Section 11 Programmable Pulse Generator (PPG)
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Bit Bit Name Initial Value R/W Description
3 G3NOV 0 R/W Group 3 Non-Overlap
Selects normal or non-overlapping operation for
pulse output group 3.
0: Normal operation (output values updated at
compare match A in the selected TPU channel)
1: Non-overlapping operation (output values
updated at compare match A or B in the
selected TPU channel)
2 G2NOV 0 R/W Group 2 Non-Overlap
Selects normal or non-overlapping operation for
pulse output group 2.
0: Normal operation (output values updated at
compare match A in the selected TPU channel)
1: Non-overlapping operation (output values
updated at compare match A or B in the
selected TPU channel)
1 G1NOV 0 R/W Group 1 Non-Overlap
Selects normal or non-overlapping operation for
pulse output group 1.
0: Normal operation (output values updated at
compare match A in the selected TPU channel)
1: Non-overlapping operation (output values
updated at compare match A or B in the
selected TPU channel)
0 G0NOV 0 R/W Group 0 Non-Overlap
Selects normal or non-overlapping operation for
pulse output group 0.
0: Normal operation (output values updated at
compare match A in the selected TPU channel)
1: Non-overlapping operation (output values
updated at compare match A or B in the
selected TPU channel)
Section 11 Programmable Pulse Generator (PPG)
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11.4 Operation
Figure 11.2 shows an overview diagram of the PPG. PPG pulse output is enabled when the
corresponding bits in P1DDR, P2DDR, and NDER are set to 1. An initial output value is
determined by its corresponding PODR initial setting. When the compare match event specified
by PCR occurs, the corresponding NDR bit contents are transferred to PODR to update the output
values. Sequential output of data of up to 16 bits is possible by writing new output data to NDR
before the next compare match.
Output trigger signal
Pulse output pin Internal data bus
Normal output/inverted output
C
PODRQD
NDER
Q
NDRQD
DDR
Figure 11.2 Overview Diagram of PPG
Section 11 Programmable Pulse Generator (PPG)
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11.4.1 Output Timing
If pulse output is enabled, NDR contents are transferred to PODR and output when the specified
compare match event occurs. Figure 11.3 shows the timing of these operations for the case of
normal output in groups 2 and 3, triggered by compare match A.
TCNT N N + 1
φ
TGRA N
Compare match
A signal
NDRH
mn
PODRH
PO8 to PO15
n
mn
Figure 11.3 Timing of Transfer and Output of NDR Contents (Example)
Section 11 Programmable Pulse Generator (PPG)
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11.4.2 Sample Setup Procedure for Normal Pulse Output
Figure 11.4 shows a sample procedure for setting up normal pulse output.
Select TGR functions [1]
Set TGRA value
Set counting operation
Select interrupt request
Set initial output data
Enable pulse output
Select output trigger
Set next pulse
output data
Start counter
Set next pulse
output data
Normal PPG output
No
Yes
TPU setup
Port and
PPG setup
TPU setup
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
Compare match?
[1] Set TIOR to make TGRA an output
compare register (with output
disabled)
[2] Set the PPG output trigger period
[3] Select the counter clock source with
bits TPSC2 to TPSC0 in TCR.
Select the counter clear source with
bits CCLR2 to CCLR0.
[4] Enable the TGIA interrupt in TIER.
The DTC or DMAC can also be set
up to transfer data to NDR.
[5] Set the initial output values in
PODR.
[6] Set the DDR and NDER bits for the
pins to be used for pulse output to 1.
[7] Select the TPU compare match
event to be used as the output
trigger in PCR.
[8] Set the next pulse output values in
NDR.
[9] Set the CST bit in TSTR to 1 to start
the TCNT counter.
[10] At each TGIA interrupt, set the next
output values in NDR.
Figure 11.4 Setup Procedure for Normal Pulse Output (Example)
Section 11 Programmable Pulse Generator (PPG)
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11.4.3 Example of Normal Pulse Output (Example of Five-Phase Pulse Output)
Figure 11.5 shows an example in which pulse output is used for cyclic five-phase pulse output.
TCNT value TCNT
TGRA
H'0000
NDRH
00 80 C0 40 60 20 30 10 18 08 88
PODRH
PO15
PO14
PO13
PO12
PO11
Time
Compare match
C0
80
C080 40 60 20 30 10 18 08 88 80 C0 40
Figure 11.5 Normal Pulse Output Example (Five-Phase Pulse Output)
1. Set up TGRA in TPU which is used as the output trigger to be an output compare register. Set
a cycle in TGRA so the counter will be cleared by compare match A. Set the TGIEA bit in
TIER to 1 to enable the compare match/input capture A (TGIA) interrupt.
2. Write H'F8 in P1DDR and NDERH, and set the G3CMS1, G3CMS0, G2CMS1, and G2CMS0
bits in PCR to select compare match in the TPU channel set up in the previous step to be the
output trigger. Write output data H'80 in NDRH.
3. The timer counter in the TPU channel starts. When compare match A occurs, the NDRH
contents are transferred to PODRH and output. The TGIA interrupt handling routine writes the
next output data (H'C0) in NDRH.
4. Five-phase pulse output (one or two phases active at a time) can be obtained subsequently by
writing H'40, H'60, H'20, H'30, H'10, H'18, H'08, H'88... at successive TGIA interrupts.
Section 11 Programmable Pulse Generator (PPG)
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If the DTC or DMAC is set for activation by the TGIA interrupt, pulse output can be obtained
without imposing a load on the CPU.
11.4.4 Non-Overlapping Pulse Output
During non-overlapping operation, transfer from NDR to PODR is performed as follows:
• NDR bits are always transferred to PODR bits at compare match A.
• At compare match B, NDR bits are transferred only if their value is 0. Bits are not transferred
if their value is 1.
Figure 11.6 illustrates the non-overlapping pulse output operation.
Compare match A
Compare match B
Pulse
output
pin
Internal data bus
Normal output/inverted output
C
PODRQD
NDER
Q
NDRQD
DDR
Figure 11.6 Non-Overlapping Pulse Output
Therefore, 0 data can be transferred ahead of 1 data by making compare match B occur before
compare match A.
The NDR contents should not be altered during the interval from compare match B to compare
match A (the non-overlap margin).
This can be accomplished by having the TGIA interrupt handling routine write the next data in
NDR, or by having the TGIA interrupt activate the DTC or DMAC. Note, however, that the next
data must be written before the next compare match B occurs.
Figure 11.7 shows the timing of this operation.
Section 11 Programmable Pulse Generator (PPG)
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0/1 output0 output 0/1 output0 output
Do not write
to NDR here
Write to NDR
here
Compare match A
Compare match B
NDR
PODR
Do not write
to NDR here
Write to NDR
here
Write to NDR Write to NDR
Figure 11.7 Non-Overlapping Operation and NDR Write Timing
Section 11 Programmable Pulse Generator (PPG)
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11.4.5 Sample Setup Procedure for Non-Overlapping Pulse Output
Figure 11.8 shows a sample procedure for setting up non-overlapping pulse output.
Select TGR functions [1]
Set TGR values
Set counting operation
Select interrupt request
Set initial output data
Enable pulse output
Select output trigger
Set next pulse
output data
Start counter
Set next pulse
output data
Compare match A? No
Yes
TPU setup
PPG setup
TPU setup
Non-overlapping
pulse output
Set non-overlapping groups
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
[1] Set TIOR to make TGRA and
TGRB an output compare registers
(with output disabled)
[2] Set the pulse output trigger period
in TGRB and the non-overlap
period in TGRA.
[3] Select the counter clock source
with bits TPSC2 to TPSC0 in TCR.
Select the counter clear source
with bits CCLR2 to CCLR0.
[4] Enable the TGIA interrupt in TIER.
The DTC or DMAC can also be set
up to transfer data to NDR.
[5] Set the initial output values in
PODR.
[6] Set the DDR and NDER bits for the
pins to be used for pulse output to
1.
[7] Select the TPU compare match
event to be used as the pulse
output trigger in PCR.
[8] In PMR, select the groups that will
operate in non-overlap mode.
[9] Set the next pulse output values in
NDR.
[10] Set the CST bit in TSTR to 1 to
start the TCNT counter.
[11] At each TGIA interrupt, set the next
output values in NDR.
Figure 11.8 Setup Procedure for Non-Overlapping Pulse Output (Example)
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11.4.6 Example of Non-Overlapping Pulse Output (Example of Four-Phase
Complementary Non-Overlapping Output)
Figure 11.9 shows an example in which pulse output is used for four-phase complementary non-
overlapping pulse output.
TCNT value
TCNT
TGRB
TGRA
H'0000
NDRH 95 65 59 56 95 65
00 95 05 65 41 59 50 56 14 95 05 65
PODRH
PO15
PO14
PO13
PO12
PO11
PO10
PO9
PO8
Time
Non-overlap margin
Figure 11.9 Non-Overlapping Pulse Output Example (Four-Phase Complementary)
1. Set up the TPU channel to be used as the output trigger channel so that TGRA and TGRB are
output compare registers. Set the trigger period in TGRB and the non-overlap margin in
TGRA, and set the counter to be cleared by compare match B. Set the TGIEA bit in TIER to 1
to enable the TGIA interrupt.
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2. Write H'FF in P1DDR and NDERH, and set the G3CMS1, G3CMS0, G2CMS1, and G2CMS0
bits in PCR to select compare match in the TPU channel set up in the previous step to be the
output trigger. Set the G3NOV and G2NOV bits in PMR to 1 to select non-overlapping output.
Write output data H'95 in NDRH.
3. The timer counter in the TPU channel starts. When a compare match with TGRB occurs,
outputs change from 1 to 0. When a compare match with TGRA occurs, outputs change from 0
to 1 (the change from 0 to 1 is delayed by the value set in TGRA). The TGIA interrupt
handling routine writes the next output data (H'65) in NDRH.
4. Four-phase complementary non-overlapping pulse output can be obtained subsequently by
writing H'59, H'56, H'95... at successive TGIA interrupts.
If the DTC or DMAC is set for activation by the TGIA interrupt, pulse output can be obtained
without imposing a load on the CPU.
Section 11 Programmable Pulse Generator (PPG)
Rev.6.00 Mar. 18, 2009 Page 504 of 980
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11.4.7 Inverted Pulse Output
If the G3INV, G2INV, G1INV, and G0INV bits in PMR are cleared to 0, values that are the
inverse of the PODR contents can be output.
Figure 11.10 shows the outputs when G3INV and G2INV are cleared to 0, in addition to the
settings of figure 11.9.
TCNT value
TCNT
TGRB
TGRA
H'0000
NDRH 95 65 59 56 95 65
00 95 05 65 41 59 50 56 14 95 05 65
PODRL
PO15
PO14
PO13
PO12
PO11
PO10
PO9
PO8
Time
Figure 11.10 Inverted Pulse Output (Example)
Section 11 Programmable Pulse Generator (PPG)
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11.4.8 Pulse Output Triggered by Input Capture
Pulse output can be triggered by TPU input capture as well as by compare match. If TGRA
functions as an input capture register in the TPU channel selected by PCR, pulse output will be
triggered by the input capture signal.
Figure 11.11 shows the timing of this output.
φ
N
MN
TIOC pin
Input capture
signal
NDR
PODR
MNPO
Figure 11.11 Pulse Output Triggered by Input Capture (Example)
11.5 Usage Notes
11.5.1 Module Stop Mode Setting
PPG operation can be disabled or enabled using the module stop control register. The initial value
is for PPG operation to be halted. Register access is enabled by clearing module stop mode. For
details, refer to section 22, Power-Down Modes.
11.5.2 Operation of Pulse Output Pins
Pins PO0 to PO15 are also used for other peripheral functions such as the TPU. When output by
another peripheral function is enabled, the corresponding pins cannot be used for pulse output.
Note, however, that data transfer from NDR bits to PODR bits takes place, regardless of the usage
of the pins.
Pin functions should be changed only under conditions in which the output trigger event will not
occur.
Section 11 Programmable Pulse Generator (PPG)
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Section 12 8-Bit Timers (TMR)
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Section 12 8-Bit Timers (TMR)
This LSI has an on-chip 8-bit timer module with two channels operating on the basis of an 8-bit
counter. The 8-bit timer module can be used to count external events and be used as a
multifunction timer in a variety of applications, such as generation of counter reset, interrupt
requests, and pulse output with an arbitrary duty cycle using a compare-match signal with two
registers.
12.1 Features
• Selection of four clock sources
The counters can be driven by one of three internal clock signals (φ/8, φ/64, or φ/8192) or an
external clock input
• Selection of three ways to clear the counters
The counters can be cleared on compare match A or B, or by an external reset signal
• Timer output control by a combination of two compare match signals
The timer output signal in each channel is controlled by a combination of two independent
compare match signals, enabling the timer to generate output waveforms with an arbitrary duty
cycle or PWM output
• Provision for cascading of two channels (TMR_0 and TMR_1)
Operation as a 16-bit timer is possible, using TMR_0 for the upper 8 bits and TMR_1 for the
lower 8 bits (16-bit count mode)
TMR_1 can be used to count TMR_0 compare matches (compare match count mode)
• Three independent interrupts
Compare match A and B and overflow interrupts can be requested independently
• A/D converter conversion start trigger can be generated
TIMH260A_000020020100
Section 12 8-Bit Timers (TMR)
Rev.6.00 Mar. 18, 2009 Page 508 of 980
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Figure 12.1 shows a block diagram of the 8-bit timer module (TMR_0 and TMR_1).
External clock source Internal clock sources
TMR_0
φ/8
φ/64
φ/8192
TMR_1
φ/8
φ/64
φ/8192
Clock 1
Clock 0
Compare match A1
Compare match A0
Clear 1
CMIA0
CMIB0
OVI0
CMIA1
CMIB1
OVI1
Interrupt signals
TCORA_0: Time constant register A_0
TCORB_0: Time constant register B_0
TCNT_0: Timer counter_0
TCSR_0: Timer control/status register_0
TCR_0: Timer control register_0
TCORA_1: Time constant register A_1
TCORB_1: Time constant register B_1
TCNT_1: Timer counter_1
TCSR_1: Timer control/status register_1
TCR_1: Timer control register_1
TMO0
TMRI0
Internal bus
TCORA_0
Comparator A_0
Comparator B_0
TCORB_0
TCSR_0
TCR_0
TCORA_1
Comparator A_1
TCNT_1
Comparator B_1
TCORB_1
TCSR_1
TCR_1
TMCI0
TMCI1
TCNT_0
Overflow 1
Overflow 0
Compare match B1
Compare match B0
TMO1
TMRI1
A/D
conversion
start request
signal
Clock select
Control logic
Clear 0
Legend:
Figure 12.1 Block Diagram of 8-Bit Timer Module
Section 12 8-Bit Timers (TMR)
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12.2 Input/Output Pins
Table 12.1 summarizes the pins of the 8-bit timer module.
Table 12.1 Pin Configuration
Channel Name Symbol I/O Function
0 Timer output pin TMO0 Output Outputs at compare match
Timer clock input pin TMCI0 Input Inputs external clock for counter
Timer reset input pin TMRI0 Input Inputs external reset to counter
1 Timer output pin TMO1 Output Outputs at compare match
Timer clock input pin TMCI1 Input Inputs external clock for counter
Timer reset input pin TMRI1 Input Inputs external reset to counter
12.3 Register Descriptions
The 8-bit timer module has the following registers. For details on the module stop control register,
refer to section 23.1.2, Module Stop Control Registers H, L (MSTPCRH, MSTPCRL).
• Timer counter_0 (TCNT_0)
• Time constant register A_0 (TCORA_0)
• Time constant register B_0 (TCORB_0)
• Timer control register_0 (TCR_0)
• Timer control/status register_0 (TCSR_0)
• Timer counter_1 (TCNT_1)
• Time constant register A_1 (TCORA_1)
• Time constant register B_1 (TCORB_1)
• Timer control register_1 (TCR_1)
• Timer control/status register_1 (TCSR_1)
12.3.1 Timer Counter (TCNT)
TCNT is 8-bit up-counter. TCNT_0 and TCNT_1 comprise a single 16-bit register so they can be
accessed together by a word transfer instruction. Bits CKS2 to CKS0 in TCR are used to select a
clock. TCNT can be cleared by an external reset input or by a compare match signal A or B.
Which signal is to be used for clearing is selected by bits CCLR1 and CCLR0 in TCR. When
TCNT overflows from H'FF to H'00, OVF in TCSR is set to 1. TCNT is initialized to H'00.
Section 12 8-Bit Timers (TMR)
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12.3.2 Time Constant Register A (TCORA)
TCORA is 8-bit readable/writable register. TCORA_0 and TCORA_1 comprise a single 16-bit
register so they can be accessed together by a word transfer instruction.
The value in TCORA is continually compared with the value in TCNT. When a match is detected,
the corresponding CMFA flag in TCSR is set to 1. Note, however, that comparison is disabled
during the T2 state of a TCORA write cycle.
The timer output from the TMO pin can be freely controlled by this compare match signal
(compare match A) and the settings of bits OS1 and OS0 in TCSR.
TCORA is initialized to H'FF.
12.3.3 Time Constant Register B (TCORB)
TCORB is 8-bit readable/writable register. TCORB_0 and TCORB_1 comprise a single 16-bit
register so they can be accessed together by a word transfer instruction.
TCORB is continually compared with the value in TCNT. When a match is detected, the
corresponding CMFB flag in TCSR is set to 1. Note, however, that comparison is disabled during
the T2 state of a TCOBR write cycle.
The timer output from the TMO pin can be freely controlled by this compare match signal
(compare match B) and the settings of bits OS3 and OS2 in TCSR.
TCORB is initialized to H'FF.
12.3.4 Timer Control Register (TCR)
TCR selects the clock source and the time at which TCNT is cleared, and controls interrupts.
Section 12 8-Bit Timers (TMR)
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Bit Bit Name Initial Value R/W Description
7 CMIEB 0 R/W Compare Match Interrupt Enable B
Selects whether CMFB interrupt requests
(CMIB) are enabled or disabled when the CMFB
flag in TCSR is set to 1.
0: CMFB interrupt requests (CMIB) are disabled
1: CMFB interrupt requests (CMIB) are enabled
6 CMIEA 0 R/W Compare Match Interrupt Enable A
Selects whether CMFA interrupt requests
(CMIA) are enabled or disabled when the CMFA
flag in TCSR is set to 1.
0: CMFA interrupt requests (CMIA) are disabled
1: CMFA interrupt requests (CMIA) are enabled
5 OVIE 0 R/W Timer Overflow Interrupt Enable
Selects whether OVF interrupt requests (OVI)
are enabled or disabled when the OVF flag in
TCSR is set to 1.
0: OVF interrupt requests (OVI) are disabled
1: OVF interrupt requests (OVI) are enabled
4
3
CCLR1
CCLR0
0
0
R/W
R/W
Counter Clear 1 and 0
These bits select the method by which TCNT is
cleared
00: Clearing is disabled
01: Clear by compare match A
10: Clear by compare match B
11: Clear by rising edge of external reset input
2
1
0
CKS2
CKS1
CKS0
0
0
0
R/W
R/W
R/W
Clock Select 2 to 0
These bits select the clock input to TCNT and
count condition. See table 12.2.
Section 12 8-Bit Timers (TMR)
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Table 12.2 Clock Input to TCNT and Count Condition
TCR
Channel Bit 2
CKS2
Bit 1
CKS1
Bit 0
CKS0
Description
TMR_0 0 0 0 Clock input disabled
1 Internal clock, counted at falling edge of φ/8
1 0 Internal clock, counted at falling edge of φ/64
1 Internal clock, counted at falling edge of φ/8192
1 0 0 Count at TCNT_1 overflow signal*
TMR_1 0 0 0 Clock input disabled
1 Internal clock, counted at falling edge of φ/8
1 0 Internal clock, counted at falling edge of φ/64
1 Internal clock, counted at falling edge of φ/8192
1 0 0 Count at TCNT_0 compare match A*
All 1 0 1 External clock, counted at rising edge
1 0 External clock, counted at falling edge
1 1 External clock, counted at both rising and falling edges
Note: * If the count input of TMR_0 is the TCNT_1 overflow signal and that of TMR_1 is the
TCNT_0 compare match signal, no incrementing clock is generated. Do not use this
setting.
12.3.5 Timer Control/Status Register (TCSR)
TCSR displays status flags, and controls compare match output.
TCSR_0
Bit Bit Name Initial Value R/W Description
7 CMFB 0 R/(W)* Compare Match Flag B
[Setting condition]
Set when TCNT matches TCORB
[Clearing conditions]
• Cleared by reading CMFB when CMFB = 1,
then writing 0 to CMFB
• When DTC is activated by CMIB interrupt
while DISEL bit of MRB in DTC is 0
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Bit Bit Name Initial Value R/W Description
6 CMFA 0 R/(W)* Compare Match Flag A
[Setting condition]
Set when TCNT matches TCORA
[Clearing conditions]
• Cleared by reading CMFA when CMFA = 1,
then writing 0 to CMFA
• When DTC is activated by CMIA interrupt
while DISEL bit of MRB in DTC is 0
5 OVF 0 R/(W)* Timer Overflow Flag
[Setting condition]
Set when TCNT overflows from H'FF to H'00
[Clearing condition]
Cleared by reading OVF when OVF = 1, then
writing 0 to OVF
4 ADTE 0 R/W A/D Trigger Enable
Selects enabling or disabling of A/D converter
start requests by compare match A.
0: A/D converter start requests by compare
match A are disabled
1: A/D converter start requests by compare
match A are enabled
3
2
OS3
OS2
0
0
R/W
R/W
Output Select 3 and 2
These bits select a method of TMO pin output
when compare match B of TCORB and TCNT
occurs.
00: No change when compare match B occurs
01: 0 is output when compare match B occurs
10: 1 is output when compare match B occurs
11: Output is inverted when compare match B
occurs (toggle output)
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Bit Bit Name Initial Value R/W Description
1
0
OS1
OS0
0
0
R/W
R/W
Output Select 1 and 0
These bits select a method of TMO pin output
when compare match A of TCORA and TCNT
occurs.
00: No change when compare match A occurs
01: 0 is output when compare match A occurs
10: 1 is output when compare match A occurs
11: Output is inverted when compare match A
occurs (toggle output)
Note: * Only 0 can be written to bits 7 to 5, to clear these flags.
TCSR_1
Bit Bit Name Initial Value R/W Description
7 CMFB 0 R/(W)* Compare Match Flag B
[Setting condition]
Set when TCNT matches TCORB
[Clearing conditions]
• Cleared by reading CMFB when CMFB = 1,
then writing 0 to CMFB
• When DTC is activated by CMIB interrupt
while DISEL bit of MRB in DTC is 0
6 CMFA 0 R/(W)* Compare Match Flag A
[Setting condition]
Set when TCNT matches TCORA
[Clearing conditions]
• Cleared by reading CMFA when CMFA = 1,
then writing 0 to CMFA
• When DTC is activated by CMIA interrupt
while DISEL bit of MRB in DTC is 0
5 OVF 0 R/(W)* Timer Overflow Flag
[Setting condition]
Set when TCNT overflows from H'FF to H'00
[Clearing condition]
Cleared by reading OVF when OVF = 1, then
writing 0 to OVF
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Bit Bit Name Initial Value R/W Description
4 — 1 R Reserved
This bit is always read as 1 and cannot be
modified.
3
2
OS3
OS2
0
0
R/W
R/W
Output Select 3 and 2
These bits select a method of TMO pin output
when compare match B of TCORB and TCNT
occurs.
00: No change when compare match B occurs
01: 0 is output when compare match B occurs
10: 1 is output when compare match B occurs
11: Output is inverted when compare match B
occurs (toggle output)
1
0
OS1
OS0
0
0
R/W
R/W
Output Select 1 and 0
These bits select a method of TMO pin output
when compare match A of TCORA and TCNT
occurs.
00: No change when compare match A occurs
01: 0 is output when compare match A occurs
10: 1 is output when compare match A occurs
11: Output is inverted when compare match A
occurs (toggle output)
Note: * Only 0 can be written to bits 7 to 5, to clear these flags.
12.4 Operation
12.4.1 Pulse Output
Figure 12.2 shows an example that the 8-bit timer is used to generate a pulse output with a
selected duty cycle. The control bits are set as follows:
[1] In TCR, bit CCLR1 is cleared to 0 and bit CCLR0 is set to 1 so that the timer counter is
cleared at a TCORA compare match.
[2] In TCSR, bits OS3 to OS0 are set to B'0110, causing the output to change to 1 at a TCORA
compare match and to 0 at a TCORB compare match.
With these settings, the 8-bit timer provides output of pulses at a rate determined by TCORA with
a pulse width determined by TCORB. No software intervention is required.
Section 12 8-Bit Timers (TMR)
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TCNT
H'FF Counter clear
TCORA
TCORB
H'00
TMO
Figure 12.2 Example of Pulse Output
12.5 Operation Timing
12.5.1 TCNT Incrementation Timing
Figure 12.3 shows the count timing for internal clock input. Figure 12.4 shows the count timing
for external clock signal. Note that the external clock pulse width must be at least 1.5 states for
incrementation at a single edge, and at least 2.5 states for incrementation at both edges. The
counter will not increment correctly if the pulse width is less than these values.
φ
Internal clock
Clock input
to TCNT
TCNT N–1 N N+1
Figure 12.3 Count Timing for Internal Clock Input
Section 12 8-Bit Timers (TMR)
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φ
External clock
input pin
Clock input
to TCNT
TCNT N–1 N N+1
Figure 12.4 Count Timing for External Clock Input
12.5.2 Timing of CMFA and CMFB Setting when Compare-Match Occurs
The CMFA and CMFB flags in TCSR are set to 1 by a compare match signal generated when the
TCOR and TCNT values match. The compare match signal is generated at the last state in which
the match is true, just before the timer counter is updated. Therefore, when TCOR and TCNT
match, the compare match signal is not generated until the next incrementation clock input.
Figure 12.5 shows this timing.
φ
TCNT N N+1
TCOR N
Compare match
signal
CMF
Figure 12.5 Timing of CMF Setting
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12.5.3 Timing of Timer Output when Compare-Match Occurs
When compare match A or B occurs, the timer output changes as specified by bits OS3 to OS0 in
TCSR.
Figure 12.6 shows the timing when the output is set to toggle at compare match A.
φ
Compare match A
signal
Timer output pin
Figure 12.6 Timing of Timer Output
12.5.4 Timing of Compare Match Clear
TCNT is cleared when compare match A or B occurs, depending on the setting of the CCLR1 and
CCLR0 bits in TCR. Figure 12.7 shows the timing of this operation.
φ
N H'00
Compare match
signal
TCNT
Figure 12.7 Timing of Compare Match Clear
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12.5.5 Timing of TCNT External Reset
TCNT is cleared at the rising edge of an external reset input, depending on the settings of the
CCLR1 and CCLR0 bits in TCR. The clear pulse width must be at least 1.5 states. Figure 12.8
shows the timing of this operation.
φ
Clear signal
External reset
input pin
TCNT N H'00N–1
Figure 12.8 Timing of Clearance by External Reset
12.5.6 Timing of Overflow Flag (OVF) Setting
The OVF in TCSR is set to 1 when TCNT overflows (changes from H'FF to H'00). Figure 12.9
shows the timing of this operation.
φ
OVF
Overflow signal
TCNT H'FF H'00
Figure 12.9 Timing of OVF Setting
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12.6 Operation with Cascaded Connection
If bits CKS2 to CKS0 in either TCR_0 or TCR_1 are set to B'100, the 8-bit timers of the two
channels are cascaded. With this configuration, a single 16-bit timer could be used (16-bit counter
mode) or compare matches of the 8-bit channel 0 could be counted by the timer of channel 1
(compare match count mode). In this case, the timer operates as below.
12.6.1 16-Bit Counter Mode
When bits CKS2 to CKS0 in TCR_0 are set to B'100, the timer functions as a single 16-bit timer
with channel 0 occupying the upper 8 bits and channel 1 occupying the lower 8 bits.
[1] Setting of compare match flags
• The CMF flag in TCSR_0 is set to 1 when a 16-bit compare match event occurs.
• The CMF flag in TCSR_1 is set to 1 when a lower 8-bit compare match event occurs.
[2] Counter clear specification
• If the CCLR1 and CCLR0 bits in TCR_0 have been set for counter clear at compare match, the
16-bit counters (TCNT_0 and TCNT_1 together) are cleared when a 16-bit compare match
event occurs. The 16-bit counters (TCNT0 and TCNT1 together) are cleared even if counter
clear by the TMRI0 pin has also been set.
• The settings of the CCLR1 and CCLR0 bits in TCR_1 are ignored. The lower 8 bits cannot be
cleared independently.
[3] Pin output
• Control of output from the TMO0 pin by bits OS3 to OS0 in TCSR_0 is in accordance with the
16-bit compare match conditions.
• Control of output from the TMO1 pin by bits OS3 to OS0 in TCSR_1 is in accordance with the
lower 8-bit compare match conditions.
12.6.2 Compare Match Count Mode
When bits CKS2 to CKS0 in TCR_1 are B'100, TCNT_1 counts compare match A’s for channel
0.
Channels 0 and 1 are controlled independently. Conditions such as setting of the CMF flag,
generation of interrupts, output from the TMO pin, and counter clear are in accordance with the
settings for each channel.
Section 12 8-Bit Timers (TMR)
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12.7 Interrupts
12.7.1 Interrupt Sources and DTC Activation
There are three 8-bit timer interrupt sources: CMIA, CMIB, and OVI. Their relative priorities are
shown in table 12.3. Each interrupt source is set as enabled or disabled by the corresponding
interrupt enable bit in TCR or TCSR, and independent interrupt requests are sent for each to the
interrupt controller. It is also possible to activate the DTC by means of CMIA and CMIB
interrupts.
Table 12.3 8-Bit Timer Interrupt Sources
Name Interrupt Source Interrupt Flag DTC Activation Priority
CMIA0 TCORA_0 compare match CMFA Possible High
CMIB0 TCORB_0 compare match CMFB Possible
OVI0 TCNT_0 overflow OVF Not possible Low
CMIA1 TCORA_1 compare match CMFA Possible High
CMIB1 TCORB_1 compare match CMFB Possible
OVI1 TCNT_1 overflow OVF Not possible Low
12.7.2 A/D Converter Activation
The A/D converter can be activated only by TMR_0 compare match A.
If the ADTE bit in TCSR0 is set to 1 when the CMFA flag is set to 1 by the occurrence of TMR_0
compare match A, a request to start A/D conversion is sent to the A/D converter. If the 8-bit timer
conversion start trigger has been selected on the A/D converter side at this time, A/D conversion is
started.
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12.8 Usage Notes
12.8.1 Contention between TCNT Write and Clear
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the clear
takes priority, so that the counter is cleared and the write is not performed.
Figure 12.10 shows this operation.
φ
Address TCNT address
Internal write signal
Counter clear signal
TCNT N H'00
T
1
T
2
TCNT write cycle by CPU
Figure 12.10 Contention between TCNT Write and Clear
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12.8.2 Contention between TCNT Write and Increment
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the write
takes priority and the counter is not incremented.
Figure 12.11 shows this operation.
φ
Address TCNT address
Internal write signal
TCNT input clock
TCNT NM
T
1
T
2
TCNT write cycle by CPU
Counter write data
Figure 12.11 Contention between TCNT Write and Increment
Section 12 8-Bit Timers (TMR)
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12.8.3 Contention between TCOR Write and Compare Match
During the T2 state of a TCOR write cycle, the TCOR write has priority and the compare match
signal is inhibited even if a compare match event occurs as shown in figure 12.12.
φ
Address TCOR address
Internal write signal
TCNT
TCOR NM
T1T2
TCOR write cycle by CPU
TCOR write data
N N+1
Compare match signal
Inhibited
Figure 12.12 Contention between TCOR Write and Compare Match
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12.8.4 Contention between Compare Matches A and B
If compare match events A and B occur at the same time, the 8-bit timer operates in accordance
with the priorities for the output statuses set for compare match A and compare match B, as shown
in table 12.4.
Table 12.4 Timer Output Priorities
Output Setting Priority
Toggle output High
1 output
0 output
No change Low
12.8.5 Switching of Internal Clocks and TCNT Operation
TCNT may increment erroneously when the internal clock is switched over. Table 12.5 shows the
relationship between the timing at which the internal clock is switched (by writing to the CKS1
and CKS0 bits) and the TCNT operation.
When the TCNT clock is generated from an internal clock, the falling edge of the internal clock
pulse is detected. If clock switching causes a change from high to low level, as shown in case 3 in
table 12.5, a TCNT clock pulse is generated on the assumption that the switchover is a falling
edge. This increments TCNT.
The erroneous incrementation can also happen when switching between internal and external
clocks.
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Table 12.5 Switching of Internal Clock and TCNT Operation
No.
Timing of Switchover
by Means of CKS1
and CKS0 Bits
TCNT Clock Operation
1 Switching from
low to low*1
TCNT
TCNT clock
Clock after
switchover
Clock before
switchover
CKS bit write
NN
2 Switching from
low to high*2
TCNT
CKS bit write
N N+1 N
TCNT clock
Clock after
switchover
Clock before
switchover
3 Switching from
high to low*3
TCNT
CKS bit write
NN N
*
4
TCNT clock
Clock after
switchover
Clock before
switchover
Section 12 8-Bit Timers (TMR)
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No.
Timing of Switchover
by Means of CKS1
and CKS0 Bits
TCNT Clock Operation
4 Switching from high
to high
TCNT
CKS bit write
NN N
TCNT clock
Clock after
switchover
Clock before
switchover
Notes: 1. Includes switching from low to stop, and from stop to low.
2. Includes switching from stop to high.
3. Includes switching from high to stop.
4. Generated on the assumption that the switchover is a falling edge; TCNT is
incremented.
12.8.6 Mode Setting with Cascaded Connection
If 16-bit counter mode and compare match count mode are specified at the same time, input clocks
for TCNT_0 and TCNT_1 are not generated, and the counter stops. Do not specify 16-bit counter
and compare match count modes simultaneously.
12.8.7 Interrupts in Module Stop Mode
If module stop mode is entered when an interrupt has been requested, it will not be possible to
clear the CPU interrupt source or the DTC and DMAC activation source. Interrupts should
therefore be disabled before entering module stop mode.
Section 12 8-Bit Timers (TMR)
Rev.6.00 Mar. 18, 2009 Page 528 of 980
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Section 13 Watchdog Timer
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Section 13 Watchdog Timer
The watchdog timer (WDT) is an 8-bit timer that outputs an overflow signal (WDTOVF) if a
system crash prevents the CPU from writing to the timer counter, thus allowing it to overflow.
At the same time, the WDT can also generate an internal reset signal.
When this watchdog function is not needed, the WDT can be used as an interval timer. In interval
timer operation, an interval timer interrupt is generated each time the counter overflows.
The block diagram of the WDT is shown in figure 13.1.
13.1 Features
• Selectable from eight counter input clocks
• Switchable between watchdog timer mode and interval timer mode
In watchdog timer mode
• If the counter overflows, the WDT outputs WDTOVF. It is possible to select whether or not
the entire chip is reset at the same time.
In interval timer mode
• If the counter overflows, the WDT generates an interval timer interrupt (WOVI).
WDT0101A_000020020100
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Overflow
Interrupt
control
WOVI
(interrupt request
signal)
Internal reset signal*
WDTOVF Reset
control
RSTCSR TCNT TSCR
φ/2
φ/64
φ/128
φ/512
φ/2048
φ/8192
φ/32768
φ/131072
Clock Clock
select
Internal clock
sources
Bus
interface
Module bus
TCSR:
TCNT:
RSTCSR:
Note: * An internal reset signal can be generated by the register setting.
Timer control/status register
Timer counter
Reset control/status register
WDT
Legend:
Internal bus
Figure 13.1 Block Diagram of WDT
13.2 Input/Output Pin
Table 13.1 describes the WDT output pin.
Table 13.1 Pin Configuration
Name Symbol I/O Function
Watchdog timer overflow WDTOVF Output Outputs counter overflow signal in watchdog
timer mode
Section 13 Watchdog Timer
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13.3 Register Descriptions
The WDT has the following three registers. To prevent accidental overwriting, TCSR, TCNT, and
RSTCSR have to be written to in a method different from normal registers. For details, refer to
section 13.6.1, Notes on Register Access.
• Timer counter (TCNT)
• Timer control/status register (TCSR)
• Reset control/status register (RSTCSR)
13.3.1 Timer Counter (TCNT)
TCNT is an 8-bit readable/writable up-counter. TCNT is initialized to H'00 when the TME bit in
TCSR is cleared to 0.
13.3.2 Timer Control/Status Register (TCSR)
TCSR selects the clock source to be input to TCNT, and the timer mode.
Bit Bit Name Initial Value R/W Description
7 OVF 0 R/(W)* Overflow Flag
Indicates that TCNT has overflowed in interval
timer mode. Only a write of 0 is permitted, to
clear the flag.
[Setting condition]
When TCNT overflows in interval timer mode
(changes from H’FF to H’00)
When internal reset request generation is
selected in watchdog timer mode, OVF is cleared
automatically by the internal reset.
[Clearing condition]
Cleared by reading TCSR when OVF = 1, then
writing 0 to OVF
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Bit Bit Name Initial Value R/W Description
6 WT/IT 0 R/W Timer Mode Select
Selects whether the WDT is used as a watchdog
timer or interval timer.
0: Interval timer mode
When TCNT overflows, an interval timer
interrupt (WOVI) is requested.
1: Watchdog timer mode
When TCNT overflows, the WDTOVF signal is
output.
5 TME 0 R/W Timer Enable
When this bit is set to 1, TCNT starts counting.
When this bit is cleared, TCNT stops counting
and is initialized to H'00.
4, 3 — All 1 — Reserved
These bits are always read as 1 and cannot be
modified.
2
1
0
CKS2
CKS1
CKS0
0
0
0
R/W
R/W
R/W
Clock Select 2 to 0
Selects the clock source to be input to TCNT.
The overflow frequency for φ = 20 MHz is
enclosed in parentheses.
000: Clock φ/2 (frequency: 25.6 μs)
001: Clock φ/64 (frequency: 819.2 μs)
010: Clock φ/128 (frequency: 1.6 ms)
011: Clock φ/512 (frequency: 6.6 ms)
100: Clock φ/2048 (frequency: 26.2 ms)
101: Clock φ/8192 (frequency: 104.9 ms)
110: Clock φ/32768 (frequency: 419.4 ms)
111: Clock φ/131072 (frequency: 1.68 s)
Note: * Only a write of 0 is permitted, to clear the flag.
Section 13 Watchdog Timer
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13.3.3 Reset Control/Status Register (RSTCSR)
RSTCSR controls the generation of the internal reset signal when TCNT overflows, and selects
the type of internal reset signal. RSTCSR is initialized to H'1F by a reset signal from the RES pin,
but not by the WDT internal reset signal caused by overflows.
Bit Bit Name Initial Value R/W Description
7 WOVF 0 R/(W)* Watchdog Timer Overflow Flag
This bit is set when TCNT overflows in watchdog
timer mode. This bit cannot be set in interval
timer mode, and only 0 can be written.
[Setting condition]
Set when TCNT overflows (changed from H'FF to
H'00) in watchdog timer mode
[Clearing condition]
Cleared by reading RSTCSR when WOVF = 1,
and then writing 0 to WOVF
6 RSTE 0 R/W Reset Enable
Specifies whether or not a reset signal is
generated in the chip if TCNT overflows during
watchdog timer operation.
0: Reset signal is not generated even if TCNT
overflows
(Though this LSI is not reset, TCNT and TCSR
in WDT are reset)
1: Reset signal is generated if TCNT overflows
5 — 0 R/W Reserved
These bits can be read from or written to, but the
operation is not affected.
4
to
0
— All 1 — Reserved
These bits are always read as 1 and cannot be
modified.
Note: * Only a write of 0 is permitted, to clear the flag.
Section 13 Watchdog Timer
Rev.6.00 Mar. 18, 2009 Page 534 of 980
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13.4 Operation
13.4.1 Watchdog Timer Mode
To use the WDT as a watchdog timer mode, set the WT/IT and TME bits in TCSR to 1.
If TCNT overflows without being rewritten because of a system crash or other error, the
WDTOVF signal is output.
This ensures that TCNT does not overflow while the system is operating normally. Software must
prevent TCNT overflows by rewriting the TCNT value (normally be writing H'00) before
overflow occurs. This WDTOVF signal can be used to reset the chip internally in watchdog timer
mode.
If TCNT overflows when 1 is set in the RSTE bit in RSTCSR, a signal that resets this LSI
internally is generated at the same time as the WDTOVF signal. If a reset caused by a signal input
to the RES pin occurs at the same time as a reset caused by a WDT overflow, the RES pin reset
has priority and the WOVF bit in RSTCSR is cleared to 0.
The WDTOVF signal is output for 132 states when RSTE = 1, and for 130 states when RSTE = 0.
The internal reset signal is output for 518 states.
When TCNT overflows in watchdog timer mode, the WOVF bit in RSTCSR is set to 1. If TCNT
overflows when 1 is set in the RSTE bit in RSTCSR, an internal reset signal is generated to the
entire chip.
Section 13 Watchdog Timer
Rev.6.00 Mar. 18, 2009 Page 535 of 980
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TCNT count
H'00 Time
H'FF
WT/IT=1
TME=1
H'00 written
to TCNT
WT/IT=1
TME=1
H'00 written
to TCNT
132 states*2
518 states
WDTOVF signal
Internal reset signal*1
WT/IT:
TME:
Notes: 1. If TCNT overflows when the RSTE bit is set to 1, an internal reset signal is generated.
2. 130 states when the RSTE bit is cleared to 0.
Overflow
WDTOVF and
internal reset are
generated
WOVF=1
Timer mode select bit
Timer enable bit
Legend:
Figure 13.2 Operation in Watchdog Timer Mode
13.4.2 Interval Timer Mode
To use the WDT as an interval timer, set the WT/IT bit to 0 and TME bit in TCSR to 1.
When the WDT is used as an interval timer, an interval timer interrupt (WOVI) is generated each
time the TCNT overflows. Therefore, an interrupt can be generated at intervals.
When the TCNT overflows in interval timer mode, an interval timer interrupt (WOVI) is requested
at the same time the OVF bit in the TCSR is set to 1.
Section 13 Watchdog Timer
Rev.6.00 Mar. 18, 2009 Page 536 of 980
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TCNT count
H'00 Time
H'FF
WT/IT=0
TME=1
WOVI
Overflow Overflow Overflow Overflow
Legend:
WOVI: Interval timer interrupt request generation
WOVI WOVI WOVI
Figure 13.3 Operation in Interval Timer Mode
13.5 Interrupts
During interval timer mode operation, an overflow generates an interval timer interrupt (WOVI).
The interval timer interrupt is requested whenever the OVF flag is set to 1 in TCSR. OVF must be
cleared to 0 in the interrupt handling routine.
Table 13.2 WDT Interrupt Source
Name Interrupt Source Interrupt Flag DTC Activation
WOVI TCNT overflow OVF Impossible
13.6 Usage Notes
13.6.1 Notes on Register Access
The watchdog timer’s TCNT, TCSR, and RSTCSR registers differ from other registers in being
more difficult to write to. The procedures for writing to and reading these registers are given
below.
Writing to TCNT, TCSR, and RSTCSR
TCNT and TCSR must be written to by a word transfer instruction. They cannot be written to by a
byte transfer instruction.
Section 13 Watchdog Timer
Rev.6.00 Mar. 18, 2009 Page 537 of 980
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TCNT and TCSR both have the same write address. Therefore, satisfy the relative condition
shown in figure 13.4 to write to TCNT or TCSR. The transfer instruction writes the lower byte
data to TCNT or TCSR according to the satisfied condition.
To write to RSTCSR, execute a word transfer instruction for address H'FFBE. A byte transfer
instruction cannot perform writing to RSTCSR.
The method of writing 0 to the WOVF bit differs from that of writing to the RSTE bit. To write 0
to the WOVF bit, satisfy the lower condition shown in figure 13.4.
If satisfied, the transfer instruction clears the WOVF bit to 0, but has no effect on the RSTE bit.
To write to the RSTE bit, satisfy the above condition shown in figure 13.4. If satisfied, the transfer
instruction writes the value in bit 6 of the lower byte into the RSTE bit, but has no effect on the
WOVF bit.
TCNT write or
Writing to RSTE bit in RSTCSR
TCSR write
Address: H'FFBC (TCNT)
H'FFBE (RSTCSR) 15 8 7 0
H'5A Write data
Address: H'FFBC (TCSR) 15 8 7 0
H'A5 Write data
Writing 0 to WOVF bit in RSTCSR
Address: H'FFBE (RSTCSR) 15 8 7 0
H'A5 H'00
Figure 13.4 Writing to TCNT, TCSR, and RSTCSR
Reading TCNT, TCSR, and RSTCSR
These registers are read in the same way as other registers. The read addresses are H'FFBC for
TCSR, H'FFBD for TCNT, and H'FFBF for RSTCSR.
Section 13 Watchdog Timer
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13.6.2 Contention between Timer Counter (TCNT) Write and Increment
If a timer counter clock pulse is generated during the next cycle after the T2 state of a TCNT write
cycle, the write takes priority and the timer counter is not incremented. Figure 13.5 shows this
operation.
Address
φ
Internal write signal
TCNT input clock
TCNT NM
T1T2Next cycle
TCNT write cycle
Counter write data
Figure 13.5 Contention between TCNT Write and Increment
13.6.3 Changing Value of CKS2 to CKS0
If bits CKS2 to CKS0 in TCSR are written to while the WDT is operating, errors could occur in
the incrementation. Software must stop the watchdog timer (by clearing the TME bit to 0) before
changing the value of bits CKS2 to CKS0.
13.6.4 Switching between Watchdog Timer Mode and Interval Timer Mode
If the mode is switched from watchdog timer to interval timer, while the WDT is operating, errors
could occur in the incrementation. Software must stop the watchdog timer (by clearing the TME
bit to 0) before switching the mode.
Section 13 Watchdog Timer
Rev.6.00 Mar. 18, 2009 Page 539 of 980
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13.6.5 Internal Reset in Watchdog Timer Mode
This LSI is not reset internally if TCNT overflows while the RSTE bit is cleared to 0 during
watchdog timer mode operation, but TCNT and TCSR of the WDT are reset.
TCNT, TCSR, and RSTCR cannot be written to while the WDTOVF signal is low. Also note that
a read of the WOVF flag is not recognized during this period. To clear the WOVF flag, therefore,
read TCSR after the WDTOVF signal goes high, then write 0 to the WOVF flag.
13.6.6 System Reset by WDTOVF Signal
If the WDTOVF output signal is input to the RES pin, the chip will not be initialized correctly.
Make sure that the WDTOVF signal is not input logically to the RES pin.
To reset the entire system by means of the WDTOVF signal, use the circuit shown in figure 13.6.
Reset input
Reset signal to entire system
This LSI
Figure 13.6 Circuit for System Reset by WDTOVF Signal (Example)
Section 13 Watchdog Timer
Rev.6.00 Mar. 18, 2009 Page 540 of 980
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Section 14 Serial Communication Interface (SCI, IrDA)
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Section 14 Serial Communication Interface (SCI, IrDA)
This LSI has five independent serial communication interface (SCI) channels. The SCI can handle
both asynchronous and clocked synchronous serial communication. Serial data communication
can be carried out with standard asynchronous communication chips such as a Universal
Asynchronous Receiver/Transmitter (UART) or Asynchronous Communication Interface Adapter
(ACIA). A function is also provided for serial communication between processors
(multiprocessor communication function) in asynchronous mode. The SCI also supports an IC
card (Smart Card) interface conforming to ISO/IEC 7816-3 (Identification Card) as an
asynchronous serial communication interface extension function. One of the five SCI channels
(SCI_0) can generate an IrDA communication waveform conforming to IrDA specification
version 1.0.
Figure 14.1 shows a block diagram of the SCI.
14.1 Features
• Choice of asynchronous or clocked synchronous serial communication mode
• Full-duplex communication capability
The transmitter and receiver are mutually independent, enabling transmission and reception to
be executed simultaneously. Double-buffering is used in both the transmitter and the receiver,
enabling continuous transmission and continuous reception of serial data.
• On-chip baud rate generator allows any bit rate to be selected
External clock can be selected as a transfer clock source (except for in Smart Card interface
mode).
• Choice of LSB-first or MSB-first transfer (except in the case of asynchronous mode 7-bit data)
• Four interrupt sources
Four interrupt sources — transmit-end, transmit-data-empty, receive-data-full, and receive
error — that can issue requests. The transmit-data-empty interrupt and receive data full
interrupts can activate the data transfer controller (DTC) or DMA controller (DMAC).
• Module stop mode can be set
Asynchronous mode
• Data length: 7 or 8 bits
• Stop bit length: 1 or 2 bits
• Parity: Even, odd, or none
• Receive error detection: Parity, overrun, and framing errors
• Break detection: Break can be detected by reading the RxD pin level directly in case of a
framing error
SCI0021AA_000020020100
Section 14 Serial Communication Interface (SCI, IrDA)
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• Average transfer rate generator (SCI_2 only): The following transfer rate can be selected.
115.152 or 460.606 kbps at 10.667-MHz operation
115.196, 460.784 or 720 kbps at 16-MHz operation
720 kbps at 32-MHz operation
Clocked synchronous mode
• Data length: 8 bits
• Receive error detection: Overrun errors detected
Smart Card Interface
• Automatic transmission of error signal (parity error) in receive mode
• Error signal detection and automatic data retransmission in transmit mode
• Direct convention and inverse convention both supported
Section 14 Serial Communication Interface (SCI, IrDA)
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RxD
TxD
SCK
Clock
External clock
φ
φ/4
φ/16
φ/64
TEI
TXI
RXI
ERI
SCMR
SSR
SCR
SMR
SEMR
Transmission/
reception control
Baud rate
generator
BRR
Module data bus
RDR
TSRRSR
Parity generation
Parity check
TDR
Bus interface
Internal
data bus
Average transfer
rate generator
(SCI_2)
10.667-MHz operation
• 115.152 kbps
• 460.606 kbps
16-MHz operation
• 115.196 kbps
• 460.784 kbps
• 720 kbps
32-MHz operation
• 720 kbps
Legend:
RSR: Receive shift register
RDR: Receive data register
TSR: Transmit shift register
TDR: Transmit data register
SMR: Serial mode register
SCR: Serial control register
SSR: Serial status register
SCMR: Smart card mode register
BRR: Bit rate register
SEMR: Serial extension mode register (only in SCI_2)
Figure 14.1 Block Diagram of SCI
Section 14 Serial Communication Interface (SCI, IrDA)
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14.2 Input/Output Pins
Table 14.1 shows the serial pins for each SCI channel.
Table 14.1 Pin Configuration
Channel Pin Name* I/O Function
SCK0 I/O Channel 0 clock input/output
RxD0/IrRxD Input Channel 0 receive data input (normal/IrDA)
0
TxD0/IrTxD Output Channel 0 transmit data output (normal/IrDA)
SCK1 I/O Channel 1 clock input/output
RxD1 Input Channel 1 receive data input
1
TxD1 Output Channel 1 transmit data output
SCK2 I/O Channel 2 clock input/output
RxD2 Input Channel 2 receive data input
2
TxD2 Output Channel 2 transmit data output
SCK3 I/O Channel 3 clock input/output
RxD3 Input Channel 3 receive data input
3
TxD3 Output Channel 3 transmit data output
4 SCK4 I/O Channel 4 clock input/output
RxD4 Input Channel 4 receive data input
TxD4 Output Channel 4 transmit data output
Note: * Pin names SCK, RxD, and TxD are used in the text for all channels, omitting the
channel designation.
Section 14 Serial Communication Interface (SCI, IrDA)
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14.3 Register Descriptions
The SCI has the following registers. The serial mode register (SMR), serial status register (SSR),
and serial control register (SCR) are described separately for normal serial communication
interface mode and Smart Card interface mode because their bit functions partially differ.
• Receive shift register_0 (RSR_0)
• Transmit shift register_0 (TSR_0)
• Receive data register_0 (RDR_0)
• Transmit data register_0 (TDR_0)
• Serial mode register_0 (SMR_0)
• Serial control register_0 (SCR_0)
• Serial status register_0 (SSR_0)
• Smart card mode register_0 (SCMR_0)
• Bit rate register_0 (BRR_0)
• IrDA control register_0 (IrCR_0)
• Receive shift register_1 (RSR_1)
• Transmit shift register_1 (TSR_1)
• Receive data register_1 (RDR_1)
• Transmit data register_1 (TDR_1)
• Serial mode register_1 (SMR_1)
• Serial control register_1 (SCR_1)
• Serial status register_1 (SSR_1)
• Smart card mode register_1 (SCMR_1)
• Bit rate register_1 (BRR_1)
• Receive shift register_2 (RSR_2)
• Transmit shift register_2 (TSR_2)
• Receive data register_2 (RDR_2)
• Transmit data register_2 (TDR_2)
• Serial mode register_2 (SMR_2)
• Serial control register_2 (SCR_2)
• Serial status register_2 (SSR_2)
• Smart card mode register_2 (SCMR_2)
• Bit rate register_2 (BRR_2)
• Serial extension mode register_2 (SEMR_2)
• Receive shift register_3 (RSR_3)
Section 14 Serial Communication Interface (SCI, IrDA)
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• Transmit shift register_3 (TSR_3)
• Receive data register_3 (RDR_3)
• Transmit data register_3 (TDR_3)
• Serial mode register_3 (SMR_3)
• Serial control register_3 (SCR_3)
• Serial status register_3 (SSR_3)
• Smart card mode register_3 (SCMR_3)
• Bit rate register_3 (BRR_3)
• Receive shift register_4 (RSR_4)
• Transmit shift register_4 (TSR_4)
• Receive data register_4 (RDR_4)
• Transmit data register_4 (TDR_4)
• Serial mode register_4 (SMR_4)
• Serial control register_4 (SCR_4)
• Serial status register_4 (SSR_4)
• Smart card mode register_4 (SCMR_4)
• Bit rate register_4 (BRR_4)
14.3.1 Receive Shift Register (RSR)
RSR is a shift register used to receive serial data that is input to the RxD pin and convert it into
parallel data. When one byte of data has been received, it is transferred to RDR automatically.
RSR cannot be directly accessed by the CPU.
14.3.2 Receive Data Register (RDR)
RDR is an 8-bit register that stores receive data. When the SCI has received one byte of serial
data, it transfers the received serial data from RSR to RDR where it is stored. After this, RSR is
receive-enabled. Since RSR and RDR function as a double buffer in this way, enables continuous
receive operations to be performed. After confirming that the RDRF bit in SSR is set to 1, read
RDR for only once. RDR cannot be written to by the CPU.
14.3.3 Transmit Data Register (TDR)
TDR is an 8-bit register that stores transmit data. When the SCI detects that TSR is empty, it
transfers the transmit data written in TDR to TSR and starts transmission. The double-buffered
structures of TDR and TSR enable continuous serial transmission. If the next transmit data has
Section 14 Serial Communication Interface (SCI, IrDA)
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already been written to TDR during serial transmission, the SCI transfers the written data to TSR
to continue transmission. Although TDR can be read or written to by the CPU at all times, to
achieve reliable serial transmission, write transmit data to TDR for only once after confirming that
the TDRE bit in SSR is set to 1.
14.3.4 Transmit Shift Register (TSR)
TSR is a shift register that transmits serial data. To perform serial data transmission, the SCI first
transfers transmit data from TDR to TSR, then sends the data to the TxD pin starting. TSR cannot
be directly accessed by the CPU.
14.3.5 Serial Mode Register (SMR)
SMR is used to set the SCI’s serial transfer format and select the on-chip baud rate generator clock
source.
Some bit functions of SMR differ in normal serial communication interface mode and Smart Card
interface mode.
Normal Serial Communication Interface Mode (When SMIF in SCMR is 0)
Bit Bit Name Initial Value R/W Description
7 C/A 0 R/W Communication Mode
0: Asynchronous mode
1: Clocked synchronous mode
6 CHR 0 R/W Character Length (enabled only in asynchronous
mode)
0: Selects 8 bits as the data length.
1: Selects 7 bits as the data length. LSB-first is
fixed and the MSB (bit 7) of TDR is not
transmitted in transmission.
In clocked synchronous mode, a fixed data length
of 8 bits is used.
5 PE 0 R/W Parity Enable (enabled only in asynchronous
mode)
When this bit is set to 1, the parity bit is added to
transmit data before transmission, and the parity
bit is checked in reception. For a multiprocessor
format, parity bit addition and checking are not
performed regardless of the PE bit setting.
Section 14 Serial Communication Interface (SCI, IrDA)
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Bit Bit Name Initial Value R/W Description
4 O/E 0 R/W Parity Mode (enabled only when the PE bit is 1 in
asynchronous mode)
0: Selects even parity.
1: Selects odd parity.
3 STOP 0 R/W Stop Bit Length (enabled only in asynchronous
mode)
Selects the stop bit length in transmission.
0: 1 stop bit
1: 2 stop bits
In reception, only the first stop bit is checked
regardless of the STOP bit setting. If the second
stop bit is 0, it is treated as the start bit of the next
transmit character.
2 MP 0 R/W Multiprocessor Mode (enabled only in
asynchronous mode)
When this bit is set to 1, the multiprocessor
communication function is enabled. The PE bit
and O/E bit settings are invalid in multiprocessor
mode.
1
0
CKS1
CKS0
0
0
R/W
R/W
Clock Select 1 and 0:
These bits select the clock source for the on-chip
baud rate generator.
00: φ clock (n = 0)
01: φ/4 clock (n = 1)
10: φ/16 clock (n = 2)
11: φ/64 clock (n = 3)
For the relation between the bit rate register
setting and the baud rate, see section 14.3.9, Bit
Rate Register (BRR). n is the decimal display of
the value of n in BRR (see section 14.3.9, Bit Rate
Register (BRR)).
Section 14 Serial Communication Interface (SCI, IrDA)
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Smart Card Interface Mode (When SMIF in SCMR is 1)
Bit Bit Name Initial Value R/W Description
7 GM 0 R/W GSM Mode
When this bit is set to 1, the SCI operates in GSM
mode. In GSM mode, the timing of the TEND
setting is advanced by 11.0 etu (Elementary Time
Unit: the time for transfer of 1 bit), and clock
output control mode addition is performed. For
details, refer to section 14.7.8, Clock Output
Control.
6 BLK 0 R/W When this bit is set to 1, the SCI operates in block
transfer mode. For details on block transfer mode,
refer to section 14.7.3, Block Transfer Mode.
5 PE 0 R/W Parity Enable (enabled only in asynchronous
mode)
When this bit is set to 1, the parity bit is added to
transmit data before transmission, and the parity
bit is checked in reception. In Smart Card interface
mode, this bit must be set to 1.
4 O/E 0 R/W Parity Mode (enabled only when the PE bit is 1 in
asynchronous mode)
0: Selects even parity.
1: Selects odd parity.
For details on setting this bit in Smart Card
interface mode, refer to section 14.7.2, Data
Format (Except for Block Transfer Mode).
3
2
BCP1
BCP0
0
0
R/W
R/W
Basic Clock Pulse 1 and 0
These bits select the number of basic clock
periods in a 1-bit transfer interval on the Smart
Card interface.
00: 32 clock (S = 32)
01: 64 clock (S = 64)
10: 372 clock (S = 372)
11: 256 clock (S = 256)
For details, refer to section 14.7.4, Receive Data
Sampling Timing and Reception Margin. S stands
for the value of S in BRR (see section 14.3.9, Bit
Rate Register (BRR)).
Section 14 Serial Communication Interface (SCI, IrDA)
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Bit Bit Name Initial Value R/W Description
1
0
CKS1
CKS0
0
0
R/W
R/W
Clock Select 1 and 0:
These bits select the clock source for the on-chip
baud rate generator.
00: φ clock (n = 0)
01: φ/4 clock (n = 1)
10: φ/16 clock (n = 2)
11: φ/64 clock (n = 3)
For the relation between the bit rate register
setting and the baud rate, see section 14.3.9, Bit
Rate Register (BRR). n is the decimal display of
the value of n in BRR (see section 14.3.9, Bit Rate
Register (BRR)).
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 551 of 980
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14.3.6 Serial Control Register (SCR)
SCR performs enabling or disabling of SCI transfer operations and interrupt requests, and
selection of the transfer/receive clock source. For details on interrupt requests, refer to section
14.9, SCI Interrupts. Some bit functions of SCR differ in normal serial communication interface
mode and Smart Card interface mode.
Normal Serial Communication Interface Mode (When SMIF in SCMR is 0)
Bit Bit Name Initial Value R/W Description
7 TIE 0 R/W Transmit Interrupt Enable
When this bit is set to 1, TXI interrupt request is
enabled.
TXI interrupt request cancellation can be
performed by reading 1 from the TDRE flag, then
clearing it to 0, or clearing the TIE bit to 0.
6 RIE 0 R/W Receive Interrupt Enable
When this bit is set to 1, RXI and ERI interrupt
requests are enabled.
RXI and ERI interrupt request cancellation can be
performed by reading 1 from the RDRF flag, or the
FER, PER, or ORER flag, then clearing the flag to
0, or by clearing the RIE bit to 0.
5 TE 0 R/W Transmit Enable
When this bit s set to 1, transmission is enabled.
In this state, serial transmission is started when
transmit data is written to TDR and the TDRE flag
in SSR is cleared to 0. SMR setting must be
performed to decide the transfer format before
setting the TE bit to 1.
The TDRE flag in SSR is fixed at 1 if transmission
is disabled by clearing this bit to 0.
Section 14 Serial Communication Interface (SCI, IrDA)
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Bit Bit Name Initial Value R/W Description
4 RE 0 R/W Receive Enable
When this bit is set to 1, reception is enabled.
Serial reception is started in this state when a start
bit is detected in asynchron ou s mode or serial
clock input is detected in clocked s ynchronous
mode. SMR setting must be performed to decide
the transfer format before setting the RE bit to 1.
Clearing the RE bit to 0 does not affect the RDRF,
FER, PER, and ORER flags, which retain their
states.
3 MPIE 0 R/W
Multiprocessor Interrupt Enable (enabled only
when the MP bit in SMR is 1 in asynchronous
mode)
When this bit is set to 1, receive data in which the
multiprocessor bit is 0 is skipped, and setting of
the RDRF, FER, and ORER status flags in SSR is
prohibited. On receiving data in which the
multiprocessor bit is 1, this bit is automatically
cleared and normal reception is resumed. For
details, refer to section 14.5, Multiprocessor
Communication Function.
When receive data inclu ding MPB = 0 in SSR is
received, receive data transfer from RSR to RDR,
receive error detection, and setting of the RDRF,
FER, and ORER flags in SSR , is not performed.
When receive data inclu ding MPB = 1 is received,
the MPB bit in SSR is set to 1, the MPIE bit is
cleared to 0 automatically, and generation of RXI
and ERI interrupts (when the TIE and RIE bits in
SCR are set to 1) and FER and ORER flag setting
is enabled.
2 TEIE 0 R/W Transmit End Interrupt Enable
When this bit is set to 1, TEI interrupt request is
enabled. TEI cancellation can be performed by
reading 1 from the TDRE flag in SSR, then
clearing it to 0 and clearing the TEND flag to 0, or
by clearing the TEIE bit to 0.
Section 14 Serial Communication Interface (SCI, IrDA)
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Bit Bit Name Initial Value R/W Description
1
0
CKE1
CKE0
0
0
R/W
R/W
Clock Enable 1 and 0
Selects the clock source and SCK pin function.
Asynchronous mode
00: On-chip baud rate generator
SCK pin functions as I/O port
01: On-chip baud rate generator
(Outputs a clock of the same frequency as the
bit rate from the SCK pin.)
1×: External clock
(Inputs a clock with a frequency 16 times the
bit rate from the SCK pin.)
Clocked synchronous mode
0×: Internal clock (SCK pin functions as clock
output)
1×: External clock (SCK pin functions as clock
input)
Legend: ×: Don’t care
Section 14 Serial Communication Interface (SCI, IrDA)
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Smart Card Interface Mode (When SMIF in SCMR is 1)
Bit Bit Name Initial Value R/W Description
7 TIE 0 R/W Transmit Interrupt Enable
When this bit is set to 1, TXI interrupt request is
enabled. TXI interrupt request cancellation can be
performed by reading 1 from the TDRE flag, then
clearing it to 0, or clearing the TIE bit to 0.
6 RIE 0 R/W Receive Interrupt Enable
When this bit is set to 1, RXI and ERI interrupt
requests are enabled.
RXI and ERI interrupt request cancellation can be
performed by reading 1 from the RDRF flag, or the
FER, PER, or ORER flag, then clearing the flag to
0, or by clearing the RIE bit to 0.
5 TE 0 R/W Transmit Enable
When this bit is set to 1, transmission is enabled.
In this state, serial transmission is started when
transmit data is written to TDR and the TDRE flag
in SSR is cleared to 0. SMR setting must be
performed to decide the transfer format before
setting the TE bit to 1.
The TDRE flag in SSR is fixed at 1 if transmission
is disabled by clearing this bit to 0.
4 RE 0 R/W Receive Enable
When this bit is set to 1, reception is enabled.
Serial reception is started in this state when a start
bit is detected in asynchron ou s mode or serial
clock input is detected in clocked s ynchronous
mode. SMR setting must be performed to decide
the transfer format before setting the RE bit to 1.
Clearing the RE bit to 0 does not affect the RDRF,
FER, PER, and ORER flags, which retain their
states.
3 MPIE 0 R/W Multiprocessor Interrupt Enable (enabled only
when the MP bit in SMR is 1 in asynchronous
mode)
Write 0 to this bit in Smart Card interface mode.
Section 14 Serial Communication Interface (SCI, IrDA)
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Bit Bit Name Initial Value R/W Description
2 TEIE 0 R/W Transmit End Interrupt Enable
Write 0 to this bit in Smart Card interface mode.
1
0
CKE1
CKE0
0
0
R/W Clock Enable 1 and 0
Enables or disables clock output from the SCK
pin. The clock output can be dynamically
switched in GSM mode. For details, refer to
section 14.7.8, Clock Output Control.
When the GM bit in SMR is 0:
00: Output disabled (SCK pin can be used as an
I/O port pin)
01: Clock output
1×: Reserved
When the GM bit in SMR is 1:
00: Output fixed low
01: Clock output
10: Output fixed high
11: Clock output
Legend: ×: Don’t care
Section 14 Serial Communication Interface (SCI, IrDA)
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14.3.7 Serial Status Register (SSR)
SSR is a register containing status flags of the SCI and multiprocessor bits for transfer. 1 cannot
be written to flags TDRE, RDRF, ORER, PER, and FER; they can only be cleared. Some bit
functions of SSR differ in normal serial communication interface mode and Smart Card interface
mode.
Normal Serial Communication Interface Mode (When SMIF in SCMR is 0)
Bit Bit Name Initial Value R/W Description
7 TDRE 1 R/(W)* Transmit Data Register Empty
Indicates whether TDR contains transmit data.
[Setting conditions]
• When the TE bit in SCR is 0
• When data is transferred from TDR to TSR,
and data writing to TDR is enabled.
[Clearing conditions]
• When 0 is written to TDRE after reading
TDRE = 1
• When the DMAC or DTC is activated by a TXI
interrupt request and transfers data to TDR
6 RDRF 0 R/(W)* Receive Data Register Full
Indicates that the received data is stored in RDR.
[Setting condition]
When serial reception ends normally and receive
data is transferred from RSR to RDR
[Clearing conditions]
• When 0 is written to RDRF after reading
RDRF = 1
• When the DMAC or DTC is activated by an
RXI interrupt and transferred data from RDR
The RDRF flag is not affected and retains its
previous value when the RE bit in SCR is cleared
to 0. Exercise care because if reception of the
next data is completed while the RDRF flag is set
to 1, an overrun error occurs and receive data
will be lost.
Section 14 Serial Communication Interface (SCI, IrDA)
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Bit Bit Name Initial Value R/W Description
5 ORER 0 R/(W)* Overrun Error
Indicates that an overrun error occurred while
receiving and the reception has ended
abnormally.
[Setting condition]
When the next serial reception is completed
while RDRF = 1
The receive data prior to the overrun error is
retained in RDR, and the data received
subsequently is lost. Also, subsequent serial
reception cannot be continued while the ORER
flag is set to 1. In clocked synchronous mode,
serial transmission cannot be continued, either.
[Clearing condition]
When 0 is written to ORER after reading ORER =
1
The ORER flag is not affected and retains its
previous state when the RE bit in SCR is cleared
to 0.
4 FER 0 R/(W)* Framing Error
Indicates that a framing error occurred while
receiving in asynchronous mode and the
reception has ended abnormally.
[Setting condition]
When the stop bit is 0
In 2-stop-bit mode, only the first stop bit is
checked for a value of 0; the second stop bit is
not checked. If a framing error occurs, the
receive data is transferred to RDR but the RDRF
flag is not set. Also, subsequent serial reception
cannot be continued while the FER flag is set to
1. In clocked synchronous mode, serial
transmission cannot be continued, either.
[Clearing condition]
When 0 is written to FER after reading FER = 1
The FER flag is not affected and retains its
previous state when the RE bit in SCR is cleared
to 0.
Section 14 Serial Communication Interface (SCI, IrDA)
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Bit Bit Name Initial Value R/W Description
3 PER 0 R/(W)* Parity Error
Indicates that a parity error occurred while
receiving in asynchronous mode and the
reception has ended abnormally.
[Setting condition]
When a parity error is detected during reception
If a parity error occurs, the receive data is
transferred to RDR but the RDRF flag is not set.
Also, subsequent serial reception cannot be
continued while the PER flag is set to 1. In
clocked synchronous mode, serial transmission
cannot be continued, either.
[Clearing condition]
When 0 is written to PER after reading PER = 1
The PER flag is not affected and retains its
previous state when the RE bit in SCR is cleared
to 0.
2 TEND 1 R Transmit End
[Setting conditions]
• When the TE bit in SCR is 0
• When TDRE = 1 at transmission of the last bit
of a 1-byte serial transmit character
[Clearing conditions]
• When 0 is written to TDRE after reading
TDRE = 1
• When the DMAC or DTC is activated by a TXI
interrupt and writes data to TDR
1 MPB 0 R Multiprocessor Bit
MPB stores the multiprocessor bit in the receive
data. When the RE bit in SCR is cleared to 0 its
previous state is retained.
0 MPBT 0 R/W Multiprocessor Bit Transfer
MPBT sets the multiprocessor bit to be added to
the transmit data.
Note: * Only 0 can be written, to clear the flag. Alternately, use the bit clear instruction to clear
the flag.
Section 14 Serial Communication Interface (SCI, IrDA)
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Smart Card Interface Mode (When SMIF in SCMR is 1)
Bit Bit Name Initial Value R/W Description
7 TDRE 1 R/(W)*1 Transmit Data Register Empty
Indicates whether TDR contains transmit data.
[Setting conditions]
• When the TE bit in SCR is 0
• When data is transferred from TDR to TSR,
and data writing to TDR is enabled.
[Clearing conditions]
• When 0 is written to TDRE after reading
TDRE = 1
• When the DMAC or DTC is activated by a TXI
interrupt request and transfers data to TDR
6 RDRF 0 R/(W)* 1 Receive Data Register Full
Indicates that the received data is stored in RDR.
[Setting condition]
When serial reception ends normally and receive
data is transferred from RSR to RDR
[Clearing conditions]
• When 0 is written to RDRF after reading
RDRF = 1
• When the DMAC or DTC is activated by an
RXI interrupt and transferred data from RDR
The RDRF flag is not affected and retains its
previous value when the RE bit in SCR is cleared
to 0. Exercise care because if reception of the
next data is completed while the RDRF flag is set
to 1, an overrun error occurs and receive data
will be lost.
Section 14 Serial Communication Interface (SCI, IrDA)
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Bit Bit Name Initial Value R/W Description
5 ORER 0 R/(W)* 1 Overrun Error
Indicates that an overrun error occurred while
receiving and the reception has ended
abnormally.
[Setting condition]
When the next serial reception is completed
while RDRF = 1
The receive data prior to the overrun error is
retained in RDR, and the data received
subsequently is lost. Also, subsequent serial
reception cannot be continued while the ORER
flag is set to 1. In clocked synchronous mode,
serial transmission cannot be continued, either.
[Clearing condition]
When 0 is written to ORER after reading ORER =
1
The ORER flag is not affected and retains its
previous state when the RE bit in SCR is cleared
to 0.
4 ERS 0 R/(W)* 1 Error Signal Status
[Setting condition]
When the low level of the error signal is sampled
[Clearing condition]
When 0 is written to ERS after reading ERS = 1
Section 14 Serial Communication Interface (SCI, IrDA)
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Bit Bit Name Initial Value R/W Description
3 PER 0 R/(W)* 1 Parity Error
Indicates that a parity error occurred while
receiving in asynchronous mode and the
reception has ended abnormally.
[Setting condition]
When a parity error is detected during reception
If a parity error occurs, the receive data is
transferred to RDR but the RDRF flag is not set.
Also, subsequent serial reception cannot be
continued while the PER flag is set to 1. In
clocked synchronous mode, serial transmission
cannot be continued, either.
[Clearing condition]
When 0 is written to PER after reading PER = 1
The PER flag is not affected and retains its
previous state when the RE bit in SCR is cleared
to 0.
Section 14 Serial Communication Interface (SCI, IrDA)
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Bit Bit Name Initial Value R/W Description
2 TEND 1 R Transmit End
This bit is set to 1 when no error signal has been
sent back from the receiving end and the next
transmit data is ready to be transferred to TDR.
[Setting conditions]
• When the TE bit in SCR is 0 and the ERS bit
is also 0
• If the ERS bit is 0 and the TDRE bit is 1 after
the specified interval after transmission of 1-
byte data
Timing to set this bit differs according to the
register settings.
GM = 0, BLK = 0: 2.5 etu*2 after transmission
GM = 0, BLK = 1: 1.5 etu*2 after transmission
GM = 1, BLK = 0: 1.0 etu*2 after transmission
GM = 1, BLK = 1: 1.0 etu*2 after transmission
[Clearing conditions]
• When 0 is written to TEND after reading
TEND = 1
• When the DMAC or DTC is activated by a TXI
interrupt and writes data to TDR
1 MPB 0 R Multiprocessor Bit
This bit is not used in Smart Card interface
mode.
0 MPBT 0 R/W Multiprocessor Bit Transfer
Write 0 to this bit in Smart Card interface mode.
Notes: 1. Only 0 can be written, to clear the flag. Alternately, use the bit clear instruction to clear
the flag.
2. etu: Elementary Time Unit: (time for transfer of 1 bit)
Section 14 Serial Communication Interface (SCI, IrDA)
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14.3.8 Smart Card Mode Register (SCMR)
SCMR selects Smart Card interface mode and its format.
Bit Bit Name Initial Value R/W Description
7
to
4
— All 1 — Reserved
These bits are always read as 1.
3 SDIR 0 R/W Smart Card Data Transfer Direction
Selects the serial/parallel conversion format.
0: LSB-first in transfer
1: MSB-first in transfer
The bit setting is valid only when the transfer
data format is 8 bits. For 7-bit data, LSB-first is
fixed.
2 SINV 0 R/W Smart Card Data Invert
Specifies inversion of the data logic level. The
SINV bit does not affect the logic level of the
parity bit. To invert the parity bit, invert the O/E
bit in SMR.
0: TDR contents are transmitted as they are.
Receive data is stored as it is in RDR.
1: TDR contents are inverted before being
transmitted. Receive data is stored in inverted
form in RDR.
1 — 1 — Reserved
This bit is always read as 1.
0 SMIF 0 R/W Smart Card Interface Mode Select
This bit is set to 1 to make the SCI operate in
Smart Card interface mode.
0: Normal asynchronous mode or clocked
synchronous mode
1: Smart card interface mode
Section 14 Serial Communication Interface (SCI, IrDA)
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14.3.9 Bit Rate Register (BRR)
BRR is an 8-bit register that adjusts the bit rate. As the SCI performs baud rate generator control
independently for each channel, different bit rates can be set for each channel. Table 14.2 shows
the relationships between the N setting in BRR and bit rate B for normal asynchronous mode,
clocked synchronous mode, and Smart Card interface mode. The initial value of BRR is H'FF, and
it can be read or written to by the CPU at all times.
Table 14.2 Relationships between N Setting in BRR and Bit Rate B
Mode Bit Rate Error
Asynchronous
Mode
10
6
64 2
2n-1
(N + 1)
B =
10
6
B 64 2
2n-1
(N + 1)
Error (%) = { - 1 } 100
Clocked
Synchronous
Mode
10
6
8 2
2n-1
(N + 1)
B =
Smart Card
Interface Mode
10
6
S 2
2n-1
(N + 1)
B =
10
6
B S 2
2n-1
(N + 1)
Error (%) = { - 1 } 100
Notes: B: Bit rate (bit/s)
N: BRR setting for baud rate generator (0 ≤ N ≤ 255)
φ: Operating frequency (MHz)
n and S: Determined by the SMR settings shown in the following tables.
SMR Setting SMR Setting
CKS1 CKS0 n BCP1 BCP0 S
0 0 0 0 0 32
0 1 1 0 1 64
1 0 2 1 0 372
1 1 3 1 1 256
Table 14.3 shows sample N settings in BRR in normal asynchronous mode. Table 14.4 shows the
maximum bit rate for each frequency in normal asynchronous mode. Table 14.6 shows sample N
settings in BRR in clocked synchronous mode. Table 14.8 shows sample N settings in BRR in
Smart Card interface mode. In Smart Card interface mode, S (the number of basic clock periods in
a 1-bit transfer interval) can be selected. For details, refer to section 14.7.4, Receive Data
Sampling Timing and Reception Margin. Tables 14.5 and 14.7 show the maximum bit rates with
external clock input.
Section 14 Serial Communication Interface (SCI, IrDA)
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Table 14.3 BRR Settings for Various Bit Rates (Asynchronous Mode)
Operating Frequency φ (MHz)
8 9.8304 10 12
Bit Rate
(bit/s) n N
Error
(%) n N
Error
(%) n N
Error
(%) n N
Error
(%)
110 2 141 0.03 2 174 –0.26 2 177 –0.25 2 212 0.03
150 2 103 0.16 2 127 0.00 2 129 0.16 2 155 0.16
300 1 207 0.16 1 255 0.00 2 64 0.16 2 77 0.16
600 1 103 0.16 1 127 0.00 1 129 0.16 1 155 0.16
1200 0 207 0.16 0 255 0.00 1 64 0.16 1 77 0.16
2400 0 103 0.16 0 127 0.00 0 129 0.16 0 155 0.16
4800 0 51 0.16 0 63 0.00 0 64 0.16 0 77 0.16
9600 0 25 0.16 0 31 0.00 0 32 –1.36 0 38 0.16
19200 0 12 0.16 0 15 0.00 0 15 –1.73 0 19 –2.34
31250 0 7 0.00 0 9 –1.70 0 9 0.00 0 11 0.00
38400 — — — 0 7 0.00 0 7 –1.73 0 9 –2.34
Operating Frequency φ (MHz)
12.288 14 14.7456 16
Bit Rate
(bit/s) n N
Error
(%) n N
Error
(%) n N
Error
(%) n N
Error
(%)
110 2 217 0.08 2 248 –0.17 3 64 0.69 3 70 0.03
150 2 159 0.00 2 181 0.16 2 191 0.00 2 207 0.16
300 2 79 0.00 2 90 0.16 2 95 0.00 2 103 0.16
600 1 159 0.00 1 181 0.16 1 191 0.00 1 207 0.16
1200 1 79 0.00 1 90 0.16 1 95 0.00 1 103 0.16
2400 0 159 0.00 0 181 0.16 0 191 0.00 0 207 0.16
4800 0 79 0.00 0 90 0.16 0 95 0.00 0 103 0.16
9600 0 39 0.00 0 45 –0.93 0 47 0.00 0 51 0.16
19200 0 19 0.00 0 22 –0.93 0 23 0.00 0 25 0.16
31250 0 11 2.40 0 13 0.00 0 14 –1.70 0 15 0.00
38400 0 9 0.00 — — — 0 11 0.00 0 12 0.16
Section 14 Serial Communication Interface (SCI, IrDA)
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Operating Frequency φ (MHz)
17.2032 18 19.6608 20
Bit Rate
(bit/s) n N
Error
(%) n N
Error
(%) n N
Error
(%) n N
Error
(%)
110 3 75 0.48 3 79 –0.12 3 86 0.31 3 88 –0.25
150 2 223 0.00 2 233 0.16 2 255 0.00 3 64 0.16
300 2 111 0.00 2 116 0.16 2 127 0.00 2 129 0.16
600 1 223 0.00 1 233 0.16 1 255 0.00 2 64 0.16
1200 1 111 0.00 1 116 0.16 1 127 0.00 1 129 0.16
2400 0 223 0.00 0 233 0.16 0 255 0.00 1 64 0.16
4800 0 111 0.00 0 116 0.16 0 127 0.00 0 129 0.16
9600 0 55 0.00 0 58 –0.69 0 63 0.00 0 64 0.16
19200 0 27 0.00 0 28 1.02 0 31 0.00 0 32 –1.36
31250 0 16 1.20 0 17 0.00 0 19 –1.70 0 19 0.00
38400 0 13 0.00 0 14 –2.34 0 15 0.00 0 15 1.73
Operating Frequency φ (MHz)
25 30 33 34*
Bit Rate
(bit/s) n N
Error
(%) n N
Error
(%) n N
Error
(%) n N
Error
(%)
110 3 110 –0.02 3 132 0.13 3 145 0.33 3 150 –0.05
150 3 80 0.47 3 97 –0.35 3 106 0.39 3 110 –0.29
300 2 162 –0.15 2 194 0.16 2 214 –0.07 2 220 0.16
600 2 80 0.47 2 97 –0.35 2 106 0.39 2 110 –0.29
1200 1 162 –0.15 1 194 0.16 1 214 –0.07 1 220 0.16
2400 1 80 0.47 1 97 –0.35 1 106 0.39 1 110 –0.29
4800 0 162 –0.15 0 194 0.16 0 214 –0.07 0 220 0.16
9600 0 80 0.47 0 97 –0.35 0 106 0.39 0 110 –0.29
19200 0 40 –0.76 0 48 –0.35 0 53 –0.54 0 54 0.62
31250 0 24 0.00 0 29 0 0 32 0 0 33 0.00
38400 0 19 1.73 0 23 1.73 0 26 –0.54 0 27 –1.18
Note: * Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
Section 14 Serial Communication Interface (SCI, IrDA)
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Table 14.4 Maximum Bit Rate for Each Frequency (Asynchronous Mode)
φ (MHz) Maximum Bit Rate (bit/s) n N
8 250000 0 0
9.8304 307200 0 0
10 312500 0 0
12 375000 0 0
12.288 384000 0 0
14 437500 0 0
14.7456 460800 0 0
16 500000 0 0
17.2032 537600 0 0
18 562500 0 0
19.6608 614400 0 0
20 625000 0 0
25 781250 0 0
30 937500 0 0
33 1031250 0 0
34* 1062500 0 0
Note: * Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
Section 14 Serial Communication Interface (SCI, IrDA)
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Table 14.5 Maximum Bit Rate with External Clock Input (Asynchronous Mode)
φ (MHz) External Input Clock (MHz) Maximum Bit Rate (bit/s)
8 2.0000 125000
9.8304 2.4576 153600
10 2.5000 156250
12 3.0000 187500
12.288 3.0720 192000
14 3.5000 218750
14.7456 3.6864 230400
16 4.0000 250000
17.2032 4.3008 268800
18 4.5000 281250
19.6608 4.9152 307200
20 5.0000 312500
25 6.2500 390625
30 7.5000 468750
33 8.2500 515625
34* 8.5000 531250
Note: * Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
Section 14 Serial Communication Interface (SCI, IrDA)
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Table 14.6 BRR Settings for Various Bit Rates (Clocked Synchronous Mode)
Operating Frequency φ (MHz)
8 10 16 20 25 30 33 34*1
Bit Rate
(bit/s) n N n N n N n N n N n N n N n N
110
250 3 124 — — 3 249
500 2 249 — — 3 124 — — 3 233
1 k 2 124 — — 2 249 — — 3 97 3 116 3 128 3 128
2.5 k 1 199 1 249 2 99 2 124 2 155 2 187 2 205 2 212
5 k 1 99 1 124 1 199 1 249 2 77 2 93 2 102 2 105
10 k 0 199 0 249 1 99 1 124 1 155 1 187 1 205 1 212
25 k 0 79 0 99 0 159 0 199 0 249 1 74 1 82 1 84
50 k 0 39 0 49 0 79 0 99 0 124 0 149 0 164 0 169
100 k 0 19 0 24 0 39 0 49 0 62 0 74 0 82 0 84
250 k 0 7 0 9 0 15 0 19 0 24 0 29 0 32 0 33
500 k 0 3 0 4 0 7 0 9 — — 0 14 — — 0 16
1 M 0 1 0 3 0 4 — — — — — —
2.5 M 0 0* 0 1 — — 0 2 — —
5 M 0 0* — — — — — —
Legend:
Blank: Cannot be set.
—: Can be set, but there will be a degree of error.
*: Continuous transfer is not possible.
Note: 1. Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 570 of 980
REJ09B0050-0600
Table 14.7 Maximum Bit Rate with External Clock Input (Clocked Synchronous Mode)
φ (MHz) External Input Clock (MHz) Maximum Bit Rate (bit/s)
8 1.3333 1333333.3
10 1.6667 1666666.7
12 2.0000 2000000.0
14 2.3333 2333333.3
16 2.6667 2666666.7
18 3.0000 3000000.0
20 3.3333 3333333.3
25 4.1667 4166666.7
30 5.0000 5000000.0
33 5.5000 5500000.0
34* 5.6667 5666666.7
Note: * Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 571 of 980
REJ09B0050-0600
Table 14.8 Examples of Bit Rate for Various BRR Settings (Smart Card Interface Mode)
(when n = 0 and S = 372)
Operating Frequency φ (MHz)
10.00 10.7136 13.00 14.2848
Bit Rate
(bit/s) n N
Error
(%) n N
Error
(%) n N
Error
(%) n N
Error
(%)
9600 0 1 30 0 1 25 0 1 8.99 0 1 0.00
Operating Frequency φ (MHz)
16.00 18.00 20.00 25.00
Bit Rate
(bit/s) n N
Error
(%) n N
Error
(%) n N
Error
(%) n N
Error
(%)
9600 0 1 12.01 0 2 15.99 0 2 6.60 0 3 12.49
Operating Frequency φ (MHz)
30.00 33.00 34.00*
Bit Rate
(bit/s) n N
Error
(%) n N
Error
(%) n N
Error
(%)
9600 0 3 5.01 0 4 7.59 0 4 4.79
Note: * Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 572 of 980
REJ09B0050-0600
Table 14.9 Maximum Bit Rate at Various Frequencies (Smart Card Interface Mode)
(when S = 372)
φ (MHz) Maximum Bit Rate (bit/s) n N
10.00 13441 0 0
10.7136 14400 0 0
13.00 17473 0 0
14.2848 19200 0 0
16.00 21505 0 0
18.00 24194 0 0
20.00 26882 0 0
25.00 33602 0 0
30.00 40323 0 0
33.00 44355 0 0
34.00* 45699 0 0
Note: * Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 573 of 980
REJ09B0050-0600
14.3.10 IrDA Control Register (IrCR)
IrCR selects the function of SCI_0.
Bit Bit Name Initial Value R/W Description
7 IrE 0 R/W IrDA Enable
Specifies normal SCI mode or IrDA mode for
SCI_0 input/output.
0: Pins TxD0/IrTxD and RxD0/IrRxD function as
TxD0 and RxD0
1: Pins TxD0/IrTxD and RxD0/IrRxD function as
IrTxD and IrRxD
6
5
4
IrCKS2
IrCKS1
IrCKS0
0
0
0
R/W
R/W
R/W
IrDA Clock Select 2 to 0
Specifies the high pulse width in IrTxD output
pulse encoding when the IrDA function is enabled.
000: Pulse width = B × 3/16 (3/16 of bit rate)
001: Pulse width = φ/2
010: Pulse width = φ/4
011: Pulse width = φ/8
100: Pulse width = φ/16
101: Pulse width = φ/32
110: Pulse width = φ/64
111: Pulse width = φ/128
3
to
0
— All 0 — Reserved
These bits are always read as 0 and cannot be
modified.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 574 of 980
REJ09B0050-0600
14.3.11 Serial Extension Mode Register (SEMR)
SEMR selects the clock source in asynchronous mode. The basic clock can be automatically set by
selecting the average transfer rate.
Bit Bit Name Initial Value R/W Description
7
to
4
— Undefined — Reserved
If these bits are read, an undefined value will be
returned. They cannot be modified.
3 ABCS 0 R/W Asynchronous basic clock selection (valid only in
asynchronous mode)
Selects the basic clock for 1-bit period in
asynchronous mode.
0: Operates on a basic clock with a frequency of
16 times the transfer rate.
1: Operates on a basic clock with a frequency of
8 times the transfer rate.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 575 of 980
REJ09B0050-0600
Bit Bit Name Initial Value R/W Description
2
1
0
ACS2
ACS1
ACS0
0
0
0
R/W
R/W
R/W
Asynchronous clock source selection (valid when
CKE1 = 1 in asynchronous mode)
Selects the clock source for the average transfer
rate.
The basic clock can be automatically set by
selecting the average transfer rate in spite of the
value of ABCS.
000: External clock input
001: Selects 115.152 kbps which is the average
transfer rate dedicated for φ= 10.667 MHz.
(Operates on a basic clock with a
frequency of 16 times the transfer rate.)
010: Selects 460.606 kbps which is the average
transfer rate dedicated for φ= 10.667 MHz.
(Operates on a basic clock with a
frequency of 8 times the transfer rate.)
011: Selects 720 kbps which is the average
transfer rate dedicated for φ = 32 MHz.
(Operates on a basic clock with a
frequency of 16 times the transfer rate.)
100: Reserved
101: Selects 115.196 kbps which is the average
transfer rate dedicated for φ = 16 MHz
(Operates on a basic clock with a
frequency of 16 times the transfer rate.)
110: Selects 460.784 kbps which is the average
transfer rate dedicated for φ = 16 MHz
(Operates on a basic clock with a
frequency of 16 times the transfer rate.)
111: Selects 720 kbps which is the average
transfer rate dedicated for φ = 16 MHz
(Operates on a basic clock with a
frequency of 8 times the transfer rate.)
Note that the average transfer rate does not
correspond to the frequency other than 10.667,
16, or 32 MHz.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 576 of 980
REJ09B0050-0600
14.4 Operation in Asynchronous Mode
Figure 14.2 shows the general format for asynchronous serial communication. One frame consists
of a start bit (low level), followed by transfer data, a parity bit, and finally stop bits (high level). In
asynchronous serial communication, the transmission line is usually held in the mark state (high
level). The SCI monitors the transmission line, and when it goes to the space state (low level),
recognizes a start bit and starts serial communication. In asynchronous serial communication, the
communication line is usually held in the mark state (high level). The SCI monitors the
communication line, and when it goes to the space state (low level), recognizes a start bit and
starts serial communication. Inside the SCI, the transmitter and receiver are independent units,
enabling full-duplex communication. Both the transmitter and the receiver also have a double-
buffered structure, so that data can be read or written during transmission or reception, enabling
continuous data transfer.
LSB
Start
bit
MSB
Idle state
(mark state)
Stop bit(s)
0
Transmit/receive data
D0 D1 D2 D3 D4 D5 D6 D7 0/1 1 1
1 1
Serial
data Parity
bit
1 bit 1 or
2 bits
7 or 8 bits 1 bit,
or none
One unit of transfer data (character or frame)
Figure 14.2 Data Format in Asynchronous Communication
(Example with 8-Bit Data, Parity, Two Stop Bits)
14.4.1 Data Transfer Format
Table 14.10 shows the data transfer formats that can be used in asynchronous mode. Any of 12
transfer formats can be selected according to the SMR setting. For details on the multiprocessor
bit, refer to section 14.5, Multiprocessor Communication Function.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 577 of 980
REJ09B0050-0600
Table 14.10 Serial Transfer Formats (Asynchronous Mode)
PE
0
0
1
1
0
0
1
1
—
—
—
—
S
8-bit data
STOP
S
7-bit data
STOP
S
8-bit data
STOP STOP
S
8-bit data
P
STOP
S
7-bit data
STOP
P
S
8-bit data
MPB STOP
S
8-bit data
MPB STOP STOP
S
7-bit data
STOPMPB
S
7-bit data
STOPMPB STOP
S
7-bit data
STOPSTOP
CHR
0
0
0
0
1
1
1
1
0
0
1
1
MP
0
0
0
0
0
0
0
0
1
1
1
1
STOP
0
1
0
1
0
1
0
1
0
1
0
1
SMR Settings
123456789101112
Serial Transfer Format and Frame Length
STOP
S
8-bit data
P
STOP
S
7-bit data
STOP
P
STOP
Legend:
S: Start bit
STOP: Stop bit
P: Parity bit
MPB: Multiprocessor bit
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 578 of 980
REJ09B0050-0600
14.4.2 Receive Data Sampling Timing and Reception Margin in Asynchronous Mode
In asynchronous mode, the SCI operates on a basic clock with a frequency of 16 times the bit rate.
In reception, the SCI samples the falling edge of the start bit using the basic clock, and performs
internal synchronization. Receive data is latched at the middle of each bit by sampling the data at
the rising edge of the 8th pulse of the basic clock as shown in figure 14.3. Thus the reception
margin in asynchronous mode is given by formula (1) below.
M = { (0.5 – ) – (L – 0.5) F – (1 + F) } 100 [%]
1
2N D – 0.5
N
... Formula (1)
Where M: Reception Margin
N: Ratio of bit rate to clock (N = 16)
D: Clock duty (D = 0.5 to 1.0)
L: Frame length (L = 9 to 12)
F: Absolute value of clock rate deviation
Assuming values of F = 0 and D = 0.5 in formula (1), a reception margin is given by formula
below.
M = {0.5 – 1/(2 × 16)} × 100 [%] = 46.875%
However, this is only the computed value, and a margin of 20% to 30% should be allowed in
system design.
Internal base
clock
16 clocks
8 clocks
Receive data
(RxD)
Synchronization
sampling timing
Start bit D0 D1
Data sampling
timing
15 0 7 15 007
Figure 14.3 Receive Data Sampling Timing in Asynchronous Mode
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 579 of 980
REJ09B0050-0600
14.4.3 Clock
Either an internal clock generated by the on-chip baud rate generator or an external clock input at
the SCK pin can be selected as the SCI’s serial clock, according to the setting of the C/A bit in
SMR and the CKE1 and CKE0 bits in SCR. When an external clock is input at the SCK pin, the
clock frequency should be 16 times the bit rate used.
When the SCI is operated on an internal clock, the clock can be output from the SCK pin. The
frequency of the clock output in this case is equal to the bit rate, and the phase is such that the
rising edge of the clock is in the middle of the transmit data, as shown in figure 14.4.
0
1 frame
SCK
TxD D0 D1 D2 D3 D4 D5 D6 D7 0/1 1 1
Figure 14.4 Relation between Output Clock and Transfer Data Phase
(Asynchronous Mode)
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 580 of 980
REJ09B0050-0600
14.4.4 SCI Initialization (Asynchronous Mode)
Before transmitting and receiving data, you should first clear the TE and RE bits in SCR to 0, then
initialize the SCI as shown in figure 14.5. Do not write to SMR, SCMR, IrCR, or SEMR while the
SCI is operating. This also applies to writing the same data as the current register contents. When
the operating mode, transfer format, etc., is changed, the TE and RE bits must be cleared to 0
before making the change. When the TE bit is cleared to 0, the TDRE flag is set to 1. Note that
clearing the RE bit to 0 does not initialize the contents of the RDRF, PER, FER, and ORER flags,
or the contents of RDR. When the external clock is used in asynchronous mode, the clock must be
supplied even during initialization.
Wait
<Initialization completed>
Start of initialization
Set data transfer format in
SMR and SCMR
[1]
Set CKE1 and CKE0 bits in SCR
(TE, RE bits 0)
No
Yes
Set value in BRR
Clear TE and RE bits in SCR to 0
[2]
[3]
Set TE and RE bits in
SCR to 1, and set RIE, TIE, TEIE,
and MPIE bits [4]
1-bit interval elapsed?
[1] Set the clock selection in SCR.
Be sure to clear bits RIE, TIE,
TEIE, and MPIE, and bits TE and
RE, to 0.
When the clock is selected in
asynchronous mode, it is output
immediately after SCR settings are
made.
[2] Set the data transfer format in SMR
and SCMR.
[3] Write a value corresponding to the
bit rate to BRR. (Not necessary if
an external clock is used.)
[4] Wait at least one bit interval, then
set the TE bit or RE bit in SCR to 1.
Also set the RIE, TIE, TEIE, and
MPIE bits.
Setting the TE and RE bits enables
the TxD and RxD pins to be used.
Figure 14.5 Sample SCI Initialization Flowchart
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 581 of 980
REJ09B0050-0600
14.4.5 Data Transmission (Asynchronous Mode)
Figure 14.6 shows an example of the operation for transmission in asynchronous mode. In
transmission, the SCI operates as described below.
1. The SCI monitors the TDRE flag in SSR, and if is cleared to 0, recognizes that data has been
written to TDR, and transfers the data from TDR to TSR.
2. After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmission. If the TIE bit is set to 1 at this time, a transmit data empty interrupt request
(TXI) is generated. Because the TXI interrupt routine writes the next transmit data to TDR
before transmission of the current transmit data has finished, continuous transmission can be
enabled.
3. Data is sent from the TxD pin in the following order: start bit, transmit data, parity bit or
multiprocessor bit (may be omitted depending on the format), and stop bit.
4. The SCI checks the TDRE flag at the timing for sending the stop bit.
5. If the TDRE flag is 0, the data is transferred from TDR to TSR, the stop bit is sent, and then
serial transmission of the next frame is started.
6. If the TDRE flag is 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the “mark
state” is entered in which 1 is output. If the TEIE bit in SCR is set to 1 at this time, a TEI
interrupt request is generated.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 582 of 980
REJ09B0050-0600
Figure 14.7 shows a sample flowchart for transmission in asynchronous mode.
TDRE
TEND
0
1 frame
D0 D1 D7 0/1 1 0 D0 D1 D7 0/1 1
1 1
DataStart
bit Parity
bit Stop
bit Start
bit Data Parity
bit Stop
bit
TXI interrupt
request generated Data written to TDR and
TDRE flag cleared to 0 in
TXI interrupt handling routine TEI interrupt
request generated
Idle state
(mark state)
TXI interrupt
request generated
Figure 14.6 Example of Operation in Transmission in Asynchronous Mode
(Example with 8-Bit Data, Parity, One Stop Bit)
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 583 of 980
REJ09B0050-0600
No
<End>
[1]
Yes
Initialization
Start of transmission
Read TDRE flag in SSR [2]
Write transmit data to TDR
and clear TDRE flag in SSR to 0
No
Yes
No
Yes
Read TEND flag in SSR
[3]
No
Yes
[4]
Clear DR to 0 and
set DDR to 1
Clear TE bit in SCR to 0
Note: * Not supported by the H8S/2366F.
TDRE = 1?
All data transmitted?
TEND = 1?
Break output?
[1] SCI initialization:
The TxD pin is automatically
designated as the transmit data
output pin.
After the TE bit is set to 1, a frame
of 1s is output, and transmission is
enabled.
[2] SCI status check and transmit data
write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR and clear the
TDRE flag to 0.
[3] Serial transmission continuation
procedure:
To continue serial transmission,
read 1 from the TDRE flag to
confirm that writing is possible,
then write data to TDR, and then
clear the TDRE flag to 0. Checking
and clearing of the TDRE flag is
automatic when the DMAC* or
DTC is activated by a transmit-
data-empty interrupt (TXI) request,
and data is written to TDR.
[4] Break output at the end of serial
transmission:
To output a break in serial
transmission, set DDR for the port
corresponding to the TxD pin to 1,
clear DR to 0, then clear the TE bit
in SCR to 0.
Figure 14.7 Sample Serial Transmission Flowchart
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 584 of 980
REJ09B0050-0600
14.4.6 Serial Data Reception (Asynchronous Mode)
Figure 14.8 shows an example of the operation for reception in asynchronous mode. In serial
reception, the SCI operates as described below.
1. The SCI monitors the communication line, and if a start bit is detected, performs internal
synchronization, receives receive data in RSR, and checks the parity bit and stop bit.
2. If an overrun error (when reception of the next data is completed while the RDRF flag is still
set to 1) occurs, the ORER bit in SSR is set to 1. If the RIE bit in SCR is set to 1 at this time,
an ERI interrupt request is generated. Receive data is not transferred to RDR. The RDRF flag
remains to be set to 1.
3. If a parity error is detected, the PER bit in SSR is set to 1 and receive data is transferred to
RDR. If the RIE bit in SCR is set to 1 at this time, an ERI interrupt request is generated.
4. If a framing error (when the stop bit is 0) is detected, the FER bit in SSR is set to 1 and receive
data is transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an ERI interrupt
request is generated.
5. If reception finishes successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an RXI interrupt request is
generated. Because the RXI interrupt routine reads the receive data transferred to RDR before
reception of the next receive data has finished, continuous reception can be enabled.
RDRF
FER
0
1 frame
D0 D1 D7 0/1 1 0 D0 D1 D7 0/1 0
1 1
DataStart
bit Parity
bit Stop
bit Start
bit Data Parity
bit Stop
bit
RXI interrupt
request
generated ERI interrupt request
generated by framing
error
Idle state
(mark state)
RDR data read and RDRF
flag cleared to 0 in RXI
interrupt handling routine
Figure 14.8 Example of SCI Operation in Reception
(Example with 8-Bit Data, Parity, One Stop Bit)
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 585 of 980
REJ09B0050-0600
Table 14.11 shows the states of the SSR status flags and receive data handling when a receive
error is detected. If a receive error is detected, the RDRF flag retains its state before receiving
data. Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the
ORER, FER, PER, and RDRF bits to 0 before resuming reception. Figure 14.9 shows a sample
flowchart for serial data reception.
Table 14.11 SSR Status Flags and Receive Data Handling
SSR Status Flag
RDRF* ORER FER PER Receive Data Receive Error Type
1 1 0 0 Lost Overrun error
0 0 1 0 Transferred to RDR Framing error
0 0 0 1 Transferred to RDR Parity error
1 1 1 0 Lost Overrun error + framing error
1 1 0 1 Lost Overrun error + parity error
0 0 1 1 Transferred to RDR Framing error + parity error
1 1 1 1 Lost Overrun error + framing error +
parity error
Note: * The RDRF flag retains its state before data reception.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 586 of 980
REJ09B0050-0600
Yes
<End>
[1]
No
Initialization
Start of reception
[2]
No
Yes
Read RDRF flag in SSR [4]
[5]
Clear RE bit in SCR to 0
Read ORER, PER, and
FER flags in SSR
Error handling
(Continued on next page)
[3]
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
Yes
PER ∨ FER ∨ ORER = 1?
RDRF = 1?
All data received?
SCI initialization:
The RxD pin is automatically
designated as the receive data
input pin.
Receive error handling and
break detection:
If a receive error occurs, read the
ORER, PER, and FER flags in
SSR to identify the error. After
performing the appropriate error
processing, ensure that the
ORER, PER, and FER flags are
all cleared to 0. Reception cannot
be resumed if any of these flags
are set to 1. In the case of a
framing error, a break can be
detected by reading the value of
the input port corresponding to
the RxD pin.
SCI status check and receive
data read :
Read SSR and check that RDRF
= 1, then read the receive data in
RDR and clear the RDRF flag to
0. Transition of the RDRF flag
from 0 to 1 can also be identified
by an RXI interrupt.
Serial reception continuation
procedure:
To continue serial reception,
before the stop bit for the current
frame is received, read the
RDRF flag, read RDR, and clear
the RDRF flag to 0. The RDRF
flag is cleared automatically
when the DMAC* or DTC is
activated by an RXI interrupt and
the RDR value is read.
[1]
[2] [3]
[4]
[5]
Note: * Not supported by the H8S/2366F.
Figure 14.9 Sample Serial Reception Data Flowchart (1)
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 587 of 980
REJ09B0050-0600
<End>
[3]
Error handling
Parity error handling
Yes
No
Clear ORER, PER, and
FER flags in SSR to 0
No
Yes
No
Yes
Framing error handling
No
Yes
Overrun error handling
ORER = 1?
FER = 1?
Break?
PER = 1?
Clear RE bit in SCR to 0
Figure 14.9 Sample Serial Reception Data Flowchart (2)
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 588 of 980
REJ09B0050-0600
14.5 Multiprocessor Communication Function
Use of the multiprocessor communication function enables data transfer to be performed among a
number of processors sharing communication lines by means of asynchronous serial
communication using the multiprocessor format, in which a multiprocessor bit is added to the
transfer data. When multiprocessor communication is carried out, each receiving station is
addressed by a unique ID code. The serial communication cycle consists of two component
cycles: an ID transmission cycle which specifies the receiving station, and a data transmission
cycle to the specified receiving station. The multiprocessor bit is used to differentiate between the
ID transmission cycle and the data transmission cycle. If the multiprocessor bit is 1, the cycle is
an ID transmission cycle, and if the multiprocessor bit is 0, the cycle is a data transmission cycle.
Figure 14.10 shows an example of inter-processor communication using the multiprocessor
format. The transmitting station first sends communication data with a 1 multiprocessor bit added
to the ID code of the receiving station. It then sends transmit data as data with a 0 multiprocessor
bit added. When data with a 1 multiprocessor bit is received, the receiving station compares that
data with its own ID. The station whose ID matches then receives the data sent next. Stations
whose ID does not match continue to skip data until data with a 1 multiprocessor bit is again
received.
The SCI uses the MPIE bit in SCR to implement this function. When the MPIE bit is set to 1,
transfer of receive data from RSR to RDR, error flag detection, and setting the SSR status flags,
RDRF, FER, and ORER to 1 are inhibited until data with a 1 multiprocessor bit is received. On
reception of receive character with a 1 multiprocessor bit, the MPBR bit in SSR is set to 1 and the
MPIE bit is automatically cleared, thus normal reception is resumed. If the RIE bit in SCR is set to
1 at this time, an RXI interrupt is generated.
When the multiprocessor format is selected, the parity bit setting is invalid. All other bit settings
are the same as those in normal asynchronous mode. The clock used for multiprocessor
communication is the same as that in normal asynchronous mode.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 589 of 980
REJ09B0050-0600
Transmitting
station
Receiving
station A
(ID = 01)
Receiving
station B
(ID = 02)
Receiving
station C
(ID = 03)
Receiving
station D
(ID = 04)
Serial communication line
Serial
data
ID transmission cycle =
receiving station
specification
Data transmission cycle =
data transmission to
receiving station specified by ID
(MPB= 1) (MPB= 0)
H'01 H'AA
[Legend]
MPB: Multiprocessor bit
Figure 14.10 Example of Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A)
14.5.1 Multiprocessor Serial Data Transmission
Figure 14.11 shows a sample flowchart for multiprocessor serial data transmission. For an ID
transmission cycle, set the MPBT bit in SSR to 1 before transmission. For a data transmission
cycle, clear the MPBT bit in SSR to 0 before transmission. All other SCI operations are the same
as those in asynchronous mode.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 590 of 980
REJ09B0050-0600
No
<End>
[1]
Yes
Initialization
Start of transmission
Read TDRE flag in SSR [2]
Write transmit data to TDR and
set MPBT bit in SSR
No
Yes
No
Yes
Read TEND flag in SSR
[3]
No
Yes
[4]
Clear DR to 0 and set DDR to 1
Clear TE bit in SCR to 0
TDRE = 1?
All data transmitted?
TEND = 1?
Break output?
Clear TDRE flag to 0
SCI initialization:
The TxD pin is automatically
designated as the transmit data
output pin.
After the TE bit is set to 1,
a frame of 1s is output, and
transmission is enabled.
SCI status check and transmit
data write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR. Set the
MPBT bit in SSR to 0 or 1.
Finally, clear the TDRE flag to 0.
Serial transmission continuation
procedure:
To continue serial transmission,
be sure to read 1 from the TDRE
flag to confirm that writing is
possible, then write data to TDR,
and then clear the TDRE flag to
0. Checking and clearing of the
TDRE flag is automatic when the
DMAC* or DTC is activated by a
transmit-data-empty interrupt
(TXI) request, and data is written
to TDR.
Break output at the end of serial
transmission:
To output a break in serial
transmission, set the port DDR to
1, clear DR to 0, then clear the
TE bit in SCR to 0.
[1]
[2]
[3]
[4]
Note: * Not supported by the H8S/2366F.
Figure 14.11 Sample Multiprocessor Serial Transmission Flowchart
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 591 of 980
REJ09B0050-0600
14.5.2 Multiprocessor Serial Data Reception
Figure 14.13 shows a sample flowchart for multiprocessor serial data reception. If the MPIE bit in
SCR is set to 1, data is skipped until data with a 1 multiprocessor bit is received. On receiving
data with a 1 multiprocessor bit, the receive data is transferred to RDR. An RXI interrupt request
is generated at this time. All other SCI operations are the same as in asynchronous mode. Figure
14.12 shows an example of SCI operation for multiprocessor format reception.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 592 of 980
REJ09B0050-0600
MPIE
RDR
value
0D0 D1 D7 1 1 0 D0 D1 D7 0 1
1 1
Data (ID1)Start
bit MPB Stop
bit Start
bit Data (Data1) MPB Stop
bit
RXI interrupt
request
(multiprocessor
interrupt)
generated
MPIE = 0
Idle state
(mark state)
RDRF
RDR data read
and RDRF flag
cleared to 0 in
RXI interrupt
handling routine
If not this station’s ID,
MPIE bit is set to 1
again
RXI interrupt request is
not generated, and RDR
retains its state
ID1
(a) Data does not match station’s ID
MPIE
RDR
value
0D0 D1 D7 1 1 0 D0 D1 D7 0 1
1 1
Data (ID2)Start
bit
MPB Stop
bit Start
bit Data (Data2) MPB Stop
bit
RXI interrupt
request
(multiprocessor
interrupt)
generated
MPIE = 0
Idle state
(mark state)
RDRF
RDR data read and
RDRF flag cleared
to 0 in RXI interrupt
handling routine
Matches this station’s ID,
so reception continues, and
data is received in RXI
interrupt handling routine
MPIE bit set to 1
again
ID2
(b) Data matches station’s ID
Data2ID1
Figure 14.12 Example of SCI Operation in Reception
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit)
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 593 of 980
REJ09B0050-0600
Yes
<End>
[1]
No
Initialization
Start of reception
No
Yes
[4]
Clear RE bit in SCR to 0
Error handling
(Continued on
next page)
[5]
No
Yes
FER ∨ ORER = 1?
RDRF = 1?
All data received?
Set MPIE bit in SCR to 1 [2]
Read ORER and FER flags in SSR
Read RDRF flag in SSR [3]
Read receive data in RDR
No
Yes
This station's ID?
Read ORER and FER flags in SSR
Yes
No
Read RDRF flag in SSR
No
Yes
FER ∨ ORER = 1?
Read receive data in RDR
RDRF = 1?
SCI initialization:
The RxD pin is automatically
designated as the receive data
input pin.
ID reception cycle:
Set the MPIE bit in SCR to 1.
SCI status check, ID reception
and comparison:
Read SSR and check that the
RDRF flag is set to 1, then read
the receive data in RDR and
compare it with this station’s ID.
If the data is not this station’s ID,
set the MPIE bit to 1 again, and
clear the RDRF flag to 0.
If the data is this station’s ID,
clear the RDRF flag to 0.
SCI status check and data
reception:
Read SSR and check that the
RDRF flag is set to 1, then read
the data in RDR.
Receive error handling and break
detection:
If a receive error occurs, read the
ORER and FER flags in SSR to
identify the error. After
performing the appropriate error
handling, ensure that the ORER
and FER flags are both cleared
to 0.
Reception cannot be resumed if
either of these flags is set to 1.
In the case of a framing error, a
break can be detected by reading
the RxD pin value.
[1]
[2]
[3]
[4]
[5]
Figure 14.13 Sample Multiprocessor Serial Reception Flowchart (1)
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 594 of 980
REJ09B0050-0600
<End>
Error handling
Yes
No
Clear ORER, PER, and
FER flags in SSR to 0
No
Yes
No
Yes
Framing error handling
Overrun error handling
ORER = 1?
FER = 1?
Break?
Clear RE bit in SCR to 0
[5]
Figure 14.13 Sample Multiprocessor Serial Reception Flowchart (2)
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 595 of 980
REJ09B0050-0600
14.6 Operation in Clocked Synchronous Mode
Figure 14.14 shows the general format for clocked synchronous communication. In clocked
synchronous mode, data is transmitted or received in synchronization with clock pulses. One
character of communication data consists of 8-bit data. In clocked synchronous serial
communication, data on the transmission line is output from one falling edge of the serial clock to
the next. In clocked synchronous mode, the SCI receives data in synchronization with the rising
edge of the serial clock. After 8-bit data is output, the transmission line holds the MSB state. In
clocked synchronous mode, no parity or multiprocessor bit is added. Inside the SCI, the
transmitter and receiver are independent units, enabling full-duplex communication by use of a
common clock. Both the transmitter and the receiver also have a double-buffered structure, so that
data can be read or written during transmission or reception, enabling continuous data transfer.
Don’t
care
Don’t
care
One unit of transfer data (character or frame)
Bit 0
Serial
data
Serial
clock
Bit 1 Bit 3 Bit 4 Bit 5
LSB MSB
Bit 2 Bit 6 Bit 7
*
Note: * High except in continuous transfer
*
Figure 14.14 Data Format in Clocked Synchronous Communication (For LSB-First)
14.6.1 Clock
Either an internal clock generated by the on-chip baud rate generator or an external
synchronization clock input at the SCK pin can be selected, according to the setting of CKE1 and
CKE0 bits in SCR. When the SCI is operated on an internal clock, the serial clock is output from
the SCK pin. Eight serial clock pulses are output in the transfer of one character, and when no
transfer is performed the clock is fixed high.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 596 of 980
REJ09B0050-0600
14.6.2 SCI Initialization (Clocked Synchronous Mode)
Before transmitting and receiving data, you should first clear the TE and RE bits in SCR to 0, then
initialize the SCI as described in a sample flowchart in figure 14.15. Do not write to SMR, SCMR,
IrCR, or SEMR while the SCI is operating. This also applies to writing the same data as the
current register contents. When the operating mode, transfer format, etc., is changed, the TE and
RE bits must be cleared to 0 before making the change. When the TE bit is cleared to 0, the
TDRE flag is set to 1. Note that clearing the RE bit to 0 does not change the contents of the
RDRF, PER, FER, and ORER flags, or the contents of RDR.
Wait
<Transfer start>
Start of initialization
Set data transfer format in
SMR and SCMR
No
Yes
Set value in BRR
Clear TE and RE bits in SCR to 0
[2]
[3]
Set TE and RE bits in SCR to 1, and
set RIE, TIE, TEIE, and MPIE bits
Note: In simultaneous transmit and receive operations, the TE and RE bits should
both be cleared to 0 or set to 1 simultaneously.
[4]
1-bit interval elapsed?
Set CKE1 and CKE0 bits in SCR
(TE, RE bits 0) [1]
[1] Set the clock selection in SCR. Be sure
to clear bits RIE, TIE, TEIE, and MPIE,
TE and RE, to 0.
[2] Set the data transfer format in SMR
and SCMR.
[3] Write a value corresponding to the bit
rate to BRR. (Not necessary if an
external clock is used.)
[4] Wait at least one bit interval, then set
the TE and RE bits in SCR to 1.
Also set the RIE, TIE, TEIE, and MPIE
bits.
Setting the TE and RE bits enable the
TxD and RxD pins to be used.
Figure 14.15 Sample SCI Initialization Flowchart
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 597 of 980
REJ09B0050-0600
14.6.3 Serial Data Transmission (Clocked Synchronous Mode)
Figure 14.16 shows an example of SCI operation for transmission in clocked synchronous mode.
In serial transmission, the SCI operates as described below.
1. The SCI monitors the TDRE flag in SSR, and if is 0, recognizes that data has been written to
TDR, and transfers the data from TDR to TSR.
2. After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmission. If the TIE bit in SCR is set to 1 at this time, a TXI interrupt request is generated.
Because the TXI interrupt routine writes the next transmit data to TDR before transmission of
the current transmit data has finished, continuous transmission can be enabled.
3. 8-bit data is sent from the TxD pin synchronized with the output clock when output clock
mode has been specified and synchronized with the input clock when use of an external clock
has been specified.
4. The SCI checks the TDRE flag at the timing for sending the MSB.
5. If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, and serial transmission
of the next frame is started.
6. If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, and the TxD pin maintains the
output state of the last bit. If the TEIE bit in SCR is set to 1 at this time, a TEI interrupt
request is generated. The SCK pin is fixed high.
Figure 14.17 shows a sample flowchart for serial data transmission. Even if the TDRE flag is
cleared to 0, transmission will not start while a receive error flag (ORER, FER, or PER) is set to 1.
Make sure to clear the receive error flags to 0 before starting transmission. Note that clearing the
RE bit to 0 does not clear the receive error flags.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 598 of 980
REJ09B0050-0600
Transfer direction
Bit 0
Serial data
Serial clock
1 frame
TDRE
TEND
Bit 1 Bit 7 Bit 0 Bit 1 Bit 7Bit 6
Data written to TDR
and TDRE flag
cleared to 0 in TXI
interrupt handling routine
TEI interrupt
request generated
TXI interrupt
request generated
TXI interrupt
request generated
Figure 14.16 Sample SCI Transmission Operation in Clocked Synchronous Mode
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 599 of 980
REJ09B0050-0600
No
<End>
[1]
Yes
Initialization
Start of transmission
Read TDRE flag in SSR [2]
Write transmit data to TDR and
clear TDRE flag in SSR to 0
No
Yes
No
Yes
Read TEND flag in SSR
[3]
Clear TE bit in SCR to 0
TDRE = 1?
All data transmitted?
TEND = 1?
[1] SCI initialization:
The TxD pin is automatically
designated as the transmit data output
pin.
[2] SCI status check and transmit data
write:
Read SSR and check that the TDRE
flag is set to 1, then write transmit data
to TDR and clear the TDRE flag to 0.
[3] Serial transmission continuation
procedure:
To continue serial transmission, be
sure to read 1 from the TDRE flag to
confirm that writing is possible, then
write data to TDR, and then clear the
TDRE flag to 0.
Checking and clearing of the TDRE
flag is automatic when the DMAC* or
DTC is activated by a transmit-data-
empty interrupt (TXI) request and data
is written to TDR.
Note: * Not supported by the H8S/2366F.
Figure 14.17 Sample Serial Transmission Flowchart
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 600 of 980
REJ09B0050-0600
14.6.4 Serial Data Reception (Clocked Synchronous Mode)
Figure 14.18 shows an example of SCI operation for reception in clocked synchronous mode. In
serial reception, the SCI operates as described below.
1. The SCI performs internal initialization in synchronization with a synchronization clock input
or output, starts receiving data, and stores the received data in RSR.
2. If an overrun error (when reception of the next data is completed while the RDRF flag is still
set to 1) occurs, the ORER bit in SSR is set to 1. If the RIE bit in SCR is set to 1 at this time,
an ERI interrupt request is generated. Receive data is not transferred to RDR. The RDRF flag
remains to be set to 1.
3. If reception finishes successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an RXI interrupt request is
generated. Because the RXI interrupt routine reads the receive data transferred to RDR before
reception of the next receive data has finished, continuous reception can be enabled.
Bit 7
Serial
data
Serial
clock
1 frame
RDRF
ORER
Bit 0 Bit 7 Bit 0 Bit 1 Bit 6 Bit 7
RXI interrupt request
generated RDR data read and
RDRF flag cleared to 0
in RXI interrupt handling
routine
RXI interrupt request
generated ERI interrupt request
generated by overrun
error
Figure 14.18 Example of SCI Operation in Reception
Transfer cannot be resumed while a receive error flag is set to 1. Accordingly, clear the ORER,
FER, PER, and RDRF bits to 0 before resuming reception. Figure 14.19 shows a sample
flowchart for serial data reception.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 601 of 980
REJ09B0050-0600
Yes
<End>
[1]
No
Initialization
Start of reception
[2]
No
Yes
Read RDRF flag in SSR [4]
[5]
Clear RE bit in SCR to 0
Error processing
(Continued below)
[3]
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
Yes
ORER = 1?
RDRF = 1?
All data received?
Read ORER flag in SSR
[1]
[2] [3]
[4]
[5]
SCI initialization:
The RxD pin is automatically
designated as the receive data
input pin.
Receive error handling:
If a receive error occurs, read the
ORER flag in SSR, and after
performing the appropriate error
handling, clear the ORER flag to
0. Transfer cannot be resumed if
the ORER flag is set to 1.
SCI status check and receive
data read:
Read SSR and check that the
RDRF flag is set to 1, then read
the receive data in RDR and
clear the RDRF flag to 0.
Transition of the RDRF flag from
0 to 1 can also be identified by
an RXI interrupt.
Serial reception continuation
procedure:
To continue serial reception,
before the MSB (bit 7) of the
current frame is received, finish
reading the RDRF flag, reading
RDR, and clearing the RDRF flag
to 0. The RDRF flag is cleared
automatically when the DMAC or
DTC is activated by a receive-
data-full interrupt (RXI) request
and the RDR value is read.
<End>
Error handling
Overrun error handling
[3]
Clear ORER flag in SSR to 0
Figure 14.19 Sample Serial Reception Flowchart
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 602 of 980
REJ09B0050-0600
14.6.5 Simultaneous Serial Data Transmission and Reception (Clocked Synchronous
Mode)
Figure 14.20 shows a sample flowchart for simultaneous serial transmit and receive operations.
The following procedure should be used for simultaneous serial data transmit and receive
operations after the SCI is initialized. To switch from transmit mode to simultaneous transmit and
receive mode, after checking that the SCI has finished transmission and the TDRE and TEND
flags are set to 1, clear TE to 0. Then simultaneously set TE and RE to 1 with a single instruction.
To switch from receive mode to simultaneous transmit and receive mode, after checking that the
SCI has finished reception, clear RE to 0. Then after checking that the RDRF and receive error
flags (ORER, FER, and PER) are cleared to 0, simultaneously set TE and RE to 1 with a single
instruction.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 603 of 980
REJ09B0050-0600
Yes
<End>
[1]
No
Initialization
Start of transmission/reception
[5]
Error handling
[3]
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
Yes
ORER = 1?
All data received?
[2]
Read TDRE flag in SSR
No
Yes
TDRE = 1?
Write transmit data to TDR and
clear TDRE flag in SSR to 0
No
Yes
RDRF = 1?
Read ORER flag in SSR
[4]
Read RDRF flag in SSR
Clear TE and RE bits in SCR to 0
Note: When switching from transmit or receive operation to simultaneous
transmit and receive operations, first clear the TE and RE bits to 0,
then set both these bits to 1 simultaneously.
[1]
[2]
[3]
[4]
[5]
SCI initialization:
The TxD pin is designated as the
transmit data output pin, and the
RxD pin is designated as the
receive data input pin, enabling
simultaneous transmit and receive
operations.
SCI status check and transmit data
write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR and clear the
TDRE flag to 0.
Transition of the TDRE flag from 0 to
1 can also be identified by a TXI
interrupt.
Receive error handling:
If a receive error occurs, read the
ORER flag in SSR, and after
performing the appropriate error
handling, clear the ORER flag to 0.
Transmission/reception cannot be
resumed if the ORER flag is set to 1.
SCI status check and receive data
read:
Read SSR and check that the
RDRF flag is set to 1, then read the
receive data in RDR and clear the
RDRF flag to 0. Transition of the
RDRF flag from 0 to 1 can also be
identified by an RXI interrupt.
Serial transmission/reception
continuation procedure:
To continue serial transmission/
reception, before the MSB (bit 7) of
the current frame is received, finish
reading the RDRF flag, reading
RDR, and clearing the RDRF flag to
0. Also, before the MSB (bit 7) of
the current frame is transmitted,
read 1 from the TDRE flag to
confirm that writing is possible.
Then write data to TDR and clear
the TDRE flag to 0.
Checking and clearing of the TDRE
flag is automatic when the DMAC or
DTC is activated by a transmit-data-
empty interrupt (TXI) request and
data is written to TDR. Also, the
RDRF flag is cleared automatically
when the DMAC or DTC is activated
by a receive-data-full interrupt (RXI)
request and the RDR value is read.
Figure 14.20 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 604 of 980
REJ09B0050-0600
14.7 Operation in Smart Card Interface Mode
The SCI supports an IC card (Smart Card) interface conforming to ISO/IEC 7816-3 (Identification
Card) as a serial communication interface extension function. Switching between the normal
serial communication interface and the Smart Card interface is carried out by means of a register
setting.
14.7.1 Pin Connection Example
Figure 14.21 shows an example of connection with the Smart Card. In communication with an IC
card, since both transmission and reception are carried out on a single data transmission line, the
TxD pin and RxD pin should be connected with the LSI pin. The data transmission line should be
pulled up to the VCC power supply with a resistor. If an IC card is not connected, and the TE and
RE bits are both set to 1, closed transmission/reception is possible, enabling self-diagnosis to be
carried out. When the clock generated on the SCI is used by an IC card, the SCK pin output is
input to the CLK pin of the IC card. This LSI port output is used as the reset signal.
TxD
RxD
This LSI
V
CC
I/O
Connected equipment
IC card
Data line
CLK
RST
SCK
Rx (port) Clock line
Reset line
Figure 14.21 Schematic Diagram of Smart Card Interface Pin Connections
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 605 of 980
REJ09B0050-0600
14.7.2 Data Format (Except for Block Transfer Mode)
Figure 14.22 shows the transfer data format in Smart Card interface mode.
• One frame consists of 8-bit data plus a parity bit in asynchronous mode.
• In transmission, a guard time of at least 2 etu (Elementary Time Unit: time for transfer of 1 bit)
is left between the end of the parity bit and the start of the next frame.
• If a parity error is detected during reception, a low error signal level is output for one etu
period, 10.5 etu after the start bit.
• If an error signal is sampled during transmission, the same data is retransmitted automatically
after the elapse of 2 etu or longer.
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
When there is no parity error
Transmitting station output
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
When a parity error occurs
Transmitting station output
DE
Receiving station
output
Start bit
Data bits
Parity bit
Error signal
Legend:
Ds:
D0 to D7:
Dp:
DE:
Figure 14.22 Normal Smart Card Interface Data Format
Data transfer with the types of IC cards (direct convention and inverse convention) are performed
as described in the following.
Ds
AZZAZZ ZZAA(Z) (Z) State
D0 D1 D2 D3 D4 D5 D6 D7 Dp
Figure 14.23 Direct Convention (SDIR = SINV = O/E = 0)
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 606 of 980
REJ09B0050-0600
As in the above sample start character, with the direct convention type, the logic 1 level
corresponds to state Z and the logic 0 level to state A, and transfer is performed in LSB-first order.
The start character data above is H'3B. For the direct convention type, clear the SDIR and SINV
bits in SCMR to 0. According to the Smart Card regulations, clear the O/E bit in SMR to 0 to
select even parity mode.
Ds
AZZAAA ZAAA(Z) (Z) State
D7 D6 D5 D4 D3 D2 D1 D0 Dp
Figure 14.24 Inverse Convention (SDIR = SINV = O/E = 1)
With the inverse convention type, the logic 1 level corresponds to state A and the logic 0 level to
state Z, and transfer is performed in MSB-first order. The start character data above is H'3F. For
the inverse convention type, set the SDIR and SINV bits in SCMR to 1. According to the Smart
Card regulations, even parity mode is the logic 0 level of the parity bit, and corresponds to state Z.
In this LSI, the SINV bit inverts only data bits D7 to D0. Therefore, set the O/E bit in SMR to 1
to invert the parity bit for both transmission and reception.
14.7.3 Block Transfer Mode
Operation in block transfer mode is the same as that in normal Smart Card interface, except for the
following points.
• In reception, though the parity check is performed, no error signal is output even if an error is
detected. However, the PER bit in SSR is set to 1 and must be cleared before receiving the
parity bit of the next frame.
• In transmission, a guard time of at least 1 etu is left between the end of the parity bit and the
start of the next frame.
• In transmission, because retransmission is not performed, the TEND flag is set to 1, 11.5 etu
after transmission start.
• As with the normal Smart Card interface, the ERS flag indicates the error signal status, but
since error signal transfer is not performed, this flag is always cleared to 0.
Note: etu: Elementary Time Unit (time for transfer of 1 bit)
14.7.4 Receive Data Sampling Timing and Reception Margin
Only the internal clock generated by the on-chip baud rate generator is used as transmit/receive
clock in Smart Card interface. In Smart Card interface mode, the SCI operates on a basic clock
with a frequency of 32, 64, 372, or 256 times the bit rate (fixed at 16 times in normal
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 607 of 980
REJ09B0050-0600
asynchronous mode) as determined by bits BCP1 and BCP0. In reception, the SCI samples the
falling edge of the start bit using the basic clock, and performs internal synchronization. As
shown in figure 14.25, by sampling receive data at the rising-edge of the 16th, 32nd, 186th, or
128th pulse of the basic clock, data can be latched at the middle of the bit. The reception margin is
given by the following formula.
M = | (0.5 – ) – (L – 0.5) F – (1 + F) | 100%
1
2N | D – 0.5 |
N
Where M: Reception margin (%)
N: Ratio of bit rate to clock (N = 32, 64, 372, and 256)
D: Clock duty (D = 0 to 1.0)
L: Frame length (L = 10)
F: Absolute value of clock frequency deviation
Assuming values of F = 0, D = 0.5 and N = 372 in the above formula, the reception margin
formula is as follows.
M = (0.5 – 1/2 × 372) × 100%
= 49.866%
Internal
basic clock
372 clocks
186 clocks
Receive data
(RxD)
Synchronization
sampling timing
D0 D1
Data sampling
timing
185 371 0
371
185 0
0
Start bit
Figure 14.25 Receive Data Sampling Timing in Smart Card Mode
(Using Clock of 372 Times the Bit Rate)
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 608 of 980
REJ09B0050-0600
14.7.5 Initialization
Before transmitting and receiving data, initialize the SCI as described below. Initialization is also
necessary when switching from transmit mode to receive mode, or vice versa.
1. Clear the TE and RE bits in SCR to 0.
2. Clear the error flags ERS, PER, and ORER in SSR to 0.
3. Set the GM, BLK, O/E, BCP1, BCP0, CKS1, and CKS0 bits in SMR. Set the PE bit to 1.
4. Set the SMIF, SDIR, and SINV bits in SCMR.
When the SMIF bit is set to 1, the TxD and RxD pins are both switched from ports to SCI pins,
and are placed in the high-impedance state.
5. Set the value corresponding to the bit rate in BRR.
6. Set the CKE0 and CKE1 bits in SCR. Clear the TIE, RIE, TE, RE, MPIE, and TEIE bits to 0.
If the CKE0 bit is set to 1, the clock is output from the SCK pin.
7. Wait at least one bit interval, then set the TIE, RIE, TE, and RE bits in SCR. Do not set the TE
bit and RE bit at the same time, except for self-diagnosis.
To switch from receive mode to transmit mode, after checking that the SCI has finished reception,
initialize the SCI, and clear RE to 0 and set TE to 1. Whether SCI has finished reception can be
checked with the RDRF, PER, or ORER flag. To switch from transmit mode to receive mode,
after checking that the SCI has finished transmission, initialize the SCI, and clear TE to 0 and set
RE to 1. Whether SCI has finished transmission can be checked with the TEND flag.
14.7.6 Data Transmission (Except for Block Transfer Mode)
As data transmission in Smart Card interface mode involves error signal sampling and
retransmission processing, the operations are different from those in normal serial communication
interface mode (except for block transfer mode). Figure 14.26 illustrates the retransfer operation
when the SCI is in transmit mode.
1. If an error signal is sampled from the receiving end after transmission of one frame is
completed, the ERS bit in SSR is set to 1. If the RIE bit in SCR is set at this time, an ERI
interrupt request is generated. The ERS bit in SSR should be cleared to 0 before the next
parity bit is sampled.
2. The TEND bit in SSR is not set for a frame for which an error signal is received. Data is
retransferred from TDR to TSR, and retransmitted automatically.
3. If an error signal is not sent back from the receiving end, the ERS bit in SSR is not set.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 609 of 980
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4. Transmission of one frame, including a retransfer, is judged to have been completed, and the
TEND bit in SSR is set to 1. If the TIE bit in SCR is set at this time, a TXI interrupt request is
generated. Writing transmit data to TDR transfers the next transmit data.
Figure 14.28 shows a flowchart for transmission. The sequence of transmit operations can be
performed automatically by specifying the DTC or DMAC to be activated with a TXI interrupt
source. In a transmit operation, the TDRE flag is also set to 1 at the same time as the TEND flag in
SSR, and a TXI interrupt will be generated if the TIE bit in SCR has been set to 1. If the TXI
request is designated beforehand as a DTC or DMAC activation source, the DTC or DMAC will
be activated by the TXI request, and transfer of the transmit data will be carried out. The TDRE
and TEND flags are automatically cleared to 0 when data transfer is performed by the DTC or
DMAC. In the event of an error, the SCI retransmits the same data automatically. During this
period, the TEND flag remains cleared to 0 and the DTC or DMAC is not activated. Therefore,
the SCI and DTC or DMAC will automatically transmit the specified number of bytes in the event
of an error, including retransmission. However, the ERS flag is not cleared automatically when an
error occurs, and so the RIE bit should be set to 1 beforehand so that an ERI request will be
generated in the event of an error, and the ERS flag will be cleared.
When performing transfer using the DTC or DMAC, it is essential to set and enable the DTC or
DMAC before carrying out SCI setting. For details on the DTC or DMAC setting procedures,
refer to section 8, Data Transfer Controller (DTC) or section 7, DMA Controller (DMAC).
D0 D1 D2 D3 D4 D5 D6 D7 Dp DE Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp (DE) Ds D0 D1 D2 D3 D4Ds
Transfer
frame n+1
Retransferred framenth transfer frame
TDRE
TEND
[6]
FER/ERS
Transfer to TSR from TDR Transfer to TSR from TDR Transfer to TSR
from TDR
[7] [9]
[8]
Figure 14.26 Retransfer Operation in SCI Transmit Mode
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 610 of 980
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The timing for setting the TEND flag depends on the value of the GM bit in SMR. The TEND
flag generation timing is shown in figure 14.27.
Ds D0 D1 D2 D3 D4 D5 D6 D7 DpI/O data
12.5etu
TXI
(TEND interrupt)
11.0etu
DE
Guard
time
When GM = 0
When GM = 1
Start bit
Data bits
Parity bit
Error signal
Legend:
Ds:
D0 to D7:
Dp:
DE:
Note: etu: Elementary Time Unit (time for transfer of 1 bit)
Figure 14.27 TEND Flag Generation Timing in Transmission Operation
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 611 of 980
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Initialization
No
Yes
Clear TE bit to 0
Start transmission
Start
No
No
No
Yes
Yes
Yes
Yes
No
End
Write data to TDR,
and clear TDRE flag
in SSR to 0
Error processing
Error processing
TEND = 1?
All data transmitted ?
TEND = 1?
ERS = 0?
ERS = 0?
Figure 14.28 Example of Transmission Processing Flow
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 612 of 980
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14.7.7 Serial Data Reception (Except for Block Transfer Mode)
Data reception in Smart Card interface mode uses the same operation procedure as for normal
serial communication interface mode. Figure 14.29 illustrates the retransfer operation when the
SCI is in receive mode.
1. If an error is found when the received parity bit is checked, the PER bit in SSR is
automatically set to 1. If the RIE bit in SCR is set at this time, an ERI interrupt request is
generated. The PER bit in SSR should be cleared to 0 before the next parity bit is sampled.
2. The RDRF bit in SSR is not set for a frame in which an error has occurred.
3. If no error is found when the received parity bit is checked, the PER bit in SSR is not set to 1.
4. The receive operation is judged to have been completed normally, and the RDRF flag in SSR
is automatically set to 1. If the RIE bit in SCR is set at this time, an RXI interrupt request is
generated.
Figure 14.30 shows a flowchart for reception. The sequence of receive operations can be
performed automatically by specifying the DTC or DMAC to be activated with an RXI interrupt
source. In a receive operation, an RXI interrupt request is generated when the RDRF flag in SSR
is set to 1. If the RXI request is designated beforehand as a DTC or DMAC activation source, the
DTC or DMAC will be activated by the RXI request, and transfer of the receive data will be
carried out. The RDRF flag is cleared to 0 automatically when data transfer is performed by the
DTC or DMAC. If an error occurs in receive mode and the ORER or PER flag is set to 1, a
transfer error interrupt (ERI) request will be generated, and so the error flag must be cleared to 0.
In the event of an error, the DTC or DMAC is not activated and receive data is skipped.
Therefore, receive data is transferred for only the specified number of bytes in the event of an
error. Even when a parity error occurs in receive mode and the PER flag is set to 1, the data that
has been received is transferred to RDR and can be read from there.
Note: For details on receive operations in block transfer mode, refer to section 14.4, Operation in
Asynchronous Mode.
D0 D1 D2 D3 D4 D5 D6 D7 Dp DE Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp (DE)Ds D0 D1 D2 D3 D4Ds
Transfer
frame n+1
Retransferred framenth transfer frame
RDRF
[1]
PER
[2]
[3]
[4]
Figure 14.29 Retransfer Operation in SCI Receive Mode
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 613 of 980
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Initialization
Read RDR and clear
RDRF flag in SSR to 0
Clear RE bit to 0
Start reception
Start
Error processing
No
No
No
Yes
Yes
ORER = 0 and
PER = 0
RDRF = 1?
All data received?
Yes
Figure 14.30 Example of Reception Processing Flow
14.7.8 Clock Output Control
When the GM bit in SMR is set to 1, the clock output level can be fixed with bits CKE1 and
CKE0 in SCR. At this time, the minimum clock pulse width can be made the specified width.
Figure 14.31 shows the timing for fixing the clock output level. In this example, GM is set to 1,
CKE1 is cleared to 0, and the CKE0 bit is controlled.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 614 of 980
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Specified pulse width
SCK
CKE0
Specified pulse width
Figure 14.31 Timing for Fixing Clock Output Level
When turning on the power or switching between Smart Card interface mode and software
standby mode, the following procedures should be followed in order to maintain the clock duty.
Powering On: To secure the clock duty from power-on, the following switching procedure should
be followed.
1. The initial state is port input and high impedance. Use a pull-up resistor or pull-down
resistor to fix the potential.
2. Fix the SCK pin to the specified output level with the CKE1 bit in SCR.
3. Set SMR and SCMR, and switch to smart card mode operation.
4. Set the CKE0 bit in SCR to 1 to start clock output.
When changing from smart card interface mode to software standby mode:
1. Set the data register (DR) and data direction register (DDR) corresponding to the SCK pin
to the value for the fixed output state in software standby mode.
2. Write 0 to the TE bit and RE bit in the serial control register (SCR) to halt transmit/receive
operation. At the same time, set the CKE1 bit to the value for the fixed output state in
software standby mode.
3. Write 0 to the CKE0 bit in SCR to halt the clock.
4. Wait for one serial clock period.
During this interval, clock output is fixed at the specified level, with the duty preserved.
5. Make the transition to the software standby state.
When returning to smart card interface mode from software standby mode:
1. Exit the software standby state.
2. Write 1 to the CKE0 bit in SCR and output the clock. Signal generation is started with the
normal duty.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 615 of 980
REJ09B0050-0600
[1] [2] [3] [4] [5] [7]
Software
standby
Normal operation Normal operation
[6]
Figure 14.32 Clock Halt and Restart Procedure
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 616 of 980
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14.8 IrDA Operation
When the IrDA function is enabled with bit IrE in IrCR, the SCI_0 TxD0 and RxD0 signals are
subjected to waveform encoding/decoding conforming to IrDA specification version 1.0 (IrTxD
and IrRxD pins). By connecting these pins to an infrared transceiver/receiver, it is possible to
implement infrared transmission/reception conforming to the IrDA specification version 1.0
system.
In the IrDA specification version 1.0 system, communication is started at a transfer rate of 9600
bps, and subsequently the transfer rate can be varied as necessary. As the IrDA interface in this
LSI does not include a function for varying the transfer rate automatically, the transfer rate setting
must be changed by software.
Figure 14.33 shows a block diagram of the IrDA function.
IrDA
Pulse encoder
Pulse decoder
TxD0/IrTxD
RxD0/IrRxD
SCI0
TxD
RxD
IrCR
Figure 14.33 Block Diagram of IrDA
Transmission: In transmission, the output signal (UART frame) from the SCI is converted to an
IR frame by the IrDA interface (see figure 14.34).
When the serial data is 0, a high pulse of 3/16 the bit rate (interval equivalent to the width of one
bit) is output (initial value). The high-level pulse can be varied according to the setting of bits
IrCKS2 to IrCKS0 in IrCR.
Section 14 Serial Communication Interface (SCI, IrDA)
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In the specification, the high pulse width is fixed at a minimum of 1.41 µs, and a maximum of
(3/16 + 2.5%) × bit rate or (3/16 × bit rate) + 1.08 µs. When system clock φ is 20 MHz, 1.6 µs can
be set for a high pulse width with a minimum value of 1.41 µs.
When the serial data is 1, no pulse is output.
UART frame Data
IR frame Data
0000 011 111
0000 011 111
Start
bit
Transmit Receive
Stop
bit
Start
bit Stop
bit
Bit
cycle Pulse width
1.6 μs to 3/16 bit cycle
Figure 14.34 IrDA Transmit/Receive Operations
Reception: In reception, IR frame data is converted to a UART frame by the IrDA interface, and
input to the SCI.
When a high pulse is detected, 0 data is output, and if there is no pulse during a one-bit interval, 1
data is output. Note that a pulse shorter than the minimum pulse width of 1.41 µs will be identified
as a 0 signal.
High Pulse Width Selection: Table 14.12 shows possible settings for bits IrCKS2 to IrCKS0
(minimum pulse width), and operating frequencies of this LSI and bit rates, for making the pulse
width shorter than 3/16 times the bit rate in transmission.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 618 of 980
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Table 14.12 Settings of Bits IrCKS2 to IrCKS0
Bit Rate (bps) (Above) /Bit Period × 3/16 (µs) (Below)
2400 9600 19200 38400 57600 115200
Operating
Frequency
φ (MHz) 78.13 19.53 9.77 4.88 3.26 1.63
8 100 100 100 100 100 100
9.8304 100 100 100 100 100 100
10 100 100 100 100 100 100
12 101 101 101 101 101 101
12.288 101 101 101 101 101 101
14 101 101 101 101 101 101
14.7456 101 101 101 101 101 101
16 101 101 101 101 101 101
16.9344 101 101 101 101 101 101
17.2032 101 101 101 101 101 101
18 101 101 101 101 101 101
19.6608 101 101 101 101 101 101
20 101 101 101 101 101 101
25 110 110 110 110 110 —
30 110 110 110 110 110 —
33 110 110 110 110 110 —
34* 110 110 110 110 110 —
Legend:
—: A bit rate setting cannot be made on the SCI side.
Note: * Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 619 of 980
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14.9 SCI Interrupts
14.9.1 Interrupts in Normal Serial Communication Interface Mode
Table 14.13 shows the interrupt sources in normal serial communication interface mode. A
different interrupt vector is assigned to each interrupt source, and individual interrupt sources can
be enabled or disabled using the enable bits in SCR.
When the TDRE flag in SSR is set to 1, a TXI interrupt request is generated. When the TEND
flag in SSR is set to 1, a TEI interrupt request is generated. A TXI interrupt can activate the DTC
or DMAC to perform data transfer. The TDRE flag is cleared to 0 automatically when data
transfer is performed by the DTC or DMAC.
When the RDRF flag in SSR is set to 1, an RXI interrupt request is generated. When the ORER,
PER, or FER flag in SSR is set to 1, an ERI interrupt request is generated. An RXI interrupt
request can activate the DTC or DMAC to perform data transfer. The RDRF flag is cleared to 0
automatically when data transfer is performed by the DTC or DMAC.
A TEI interrupt is generated when the TEND flag is set to 1 while the TEIE bit is set to 1. If a TEI
interrupt and a TXI interrupt are generated simultaneously, the TXI interrupt has priority for
acceptance. However, note that if the TDRE and TEND flags are cleared simultaneously by the
TXI interrupt routine, the SCI cannot branch to the TEI interrupt routine later.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 620 of 980
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Table 14.13 SCI Interrupt Sources
Channel
Name
Interrupt Source
Interrupt Flag
DTC
Activation
DMAC
Activation
Priority
ERI0 Receive Error ORER, FER, PER Not possible Not possible High
RXI0 Receive Data Full RDRF Possible Possible
TXI0 Transmit Data Empty TDRE Possible Possible
0
TEI0 Transmission End TEND Not possible Not possible
ERI1 Receive Error ORER, FER, PER Not possible Not possible
RXI1 Receive Data Full RDRF Possible Possible
TXI1 Transmit Data Empty TDRE Possible Possible
1
TEI1 Transmission End TEND Not possible Not possible
ERI2 Receive Error ORER, FER, PER Not possible Not possible
RXI2 Receive Data Full RDRF Possible Not possible
TXI2 Transmit Data Empty TDRE Possible Not possible
2
TEI2 Transmission End TEND Not possible Not possible
ERI3 Receive Error ORER, FER, PER Not possible Not possible
RXI3 Receive Data Full RDRF Possible Not possible
TXI3 Transmit Data Empty TDRE Possible Not possible
3
TEI3 Transmission End TEND Not possible Not possible
ERI4 Receive Error ORER, FER, PER Not possible Not possible 4
RXI4 Receive Data Full RDRF Possible Not possible
TXI4 Transmit Data Empty TDRE Possible Not possible
TEI4 Transmission End TEND Not possible Not possible Low
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 621 of 980
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14.9.2 Interrupts in Smart Card Interface Mode
Table 14.14 shows the interrupt sources in Smart Card interface mode. The transmit end interrupt
(TEI) request cannot be used in this mode.
Table 14.14 Interrupt Sources
Channel
Name
Interrupt Source
Interrupt Flag
DTC
Activation
DMAC
Activation
Priority
ERI0 Receive Error, detection ORER, PER, ERS Not possible Not possible High
RXI0 Receive Data Full RDRF Possible Possible
0
TXI0 Transmit Data Empty TEND Possible Possible
ERI1 Receive Error, detection ORER, PER, ERS Not possible Not possible
RXI1 Receive Data Full RDRF Possible Possible
1
TXI1 Transmit Data Empty TEND Possible Possible
ERI2 Receive Error, detection ORER, PER, ERS Not possible Not possible
RXI2 Receive Data Full RDRF Possible Not possible
2
TXI2 Transmit Data Empty TEND Possible Not possible
ERI3 Receive Error, detection ORER, PER, ERS Not possible Not possible
RXI3 Receive Data Full RDRF Possible Not possible
3
TXI3 Transmit Data Empty TEND Possible Not possible
4 ERI4 Receive Error, detection ORER, PER, ERS Not possible Not possible
RXI4 Receive Data Full RDRF Possible Not possible
TXI4 Transmit Data Empty TEND Possible Not possible Low
In Smart Card interface mode, as in normal serial communication interface mode, transfer can be
carried out using the DTC or DMAC. In transmit operations, the TDRE flag is also set to 1 at the
same time as the TEND flag in SSR, and a TXI interrupt is generated. If the TXI request is
designated beforehand as a DTC or DMAC activation source, the DTC or DMAC will be
activated by the TXI request, and transfer of the transmit data will be carried out. The TDRE and
TEND flags are automatically cleared to 0 when data transfer is performed by the DTC or DMAC.
In the event of an error, the SCI retransmits the same data automatically. During this period, the
TEND flag remains cleared to 0 and the DTC or DMAC is not activated. Therefore, the SCI and
DTC or DMAC will automatically transmit the specified number of bytes in the event of an error,
including retransmission. However, the ERS flag is not cleared automatically when an error
occurs, and so the RIE bit should be set to 1 beforehand so that an ERI request will be generated in
the event of an error, and the ERS flag will be cleared.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 622 of 980
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When performing transfer using the DTC or DMAC, it is essential to set and enable the DTC or
DMAC before carrying out SCI setting. For details on the DTC or DMAC setting procedures,
refer to section 8, Data Transfer Controller (DTC) or section 7, DMA Controller (DMAC).
In receive operations, an RXI interrupt request is generated when the RDRF flag in SSR is set to
1. If the RXI request is designated beforehand as a DTC or DMAC activation source, the DTC or
DMAC will be activated by the RXI request, and transfer of the receive data will be carried out.
The RDRF flag is cleared to 0 automatically when data transfer is performed by the DTC or
DMAC. If an error occurs, an error flag is set but the RDRF flag is not. Consequently, the DTC or
DMAC is not activated, but instead, an ERI interrupt request is sent to the CPU. Therefore, the
error flag should be cleared.
14.10 Usage Notes
14.10.1 Module Stop Mode Setting
SCI operation can be disabled or enabled using the module stop control register. The initial setting
is for SCI operation to be halted. Register access is enabled by clearing module stop mode. For
details, refer to section 23, Power-Down Modes.
14.10.2 Break Detection and Processing
When framing error detection is performed, a break can be detected by reading the RxD pin value
directly. In a break, the input from the RxD pin becomes all 0s, and so the FER flag is set, and the
PER flag may also be set. Note that, since the SCI continues the receive operation after receiving
a break, even if the FER flag is cleared to 0, it will be set to 1 again.
14.10.3 Mark State and Break Sending
When TE is 0, the TxD pin is used as an I/O port whose direction (input or output) and level are
determined by DR and DDR. This can be used to set the TxD pin to mark state or send a break
during serial data transmission. To maintain the communication line at mark state until TE is set
to 1, set both DDR and DR to 1. Since TE is cleared to 0 at this point, the TxD pin becomes an
I/O port, and 1 is output from the TxD pin. To send a break during serial transmission, first set
DDR to 1 and clear DR to 0, and then clear TE to 0. When TE is cleared to 0, the transmitter is
initialized regardless of the current transmission state, the TxD pin becomes an I/O port, and 0 is
output from the TxD pin.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 623 of 980
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14.10.4 Receive Error Flags and Transmit Operations (Clocked Synchronous Mode Only)
Transmission cannot be started when a receive error flag (ORER, PER, or FER) is set to 1, even if
the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 before starting
transmission. Note also that receive error flags cannot be cleared to 0 even if the RE bit is cleared
to 0.
14.10.5 Relation between Writes to TDR and the TDRE Flag
The TDRE flag in SSR is a status flag that indicates that transmit data has been transferred from
TDR to TSR. When the SCI transfers data from TDR to TSR, the TDRE flag is set to 1.
Data can be written to TDR regardless of the state of the TDRE flag. However, if new data is
written to TDR when the TDRE flag is cleared to 0, the data stored in TDR will be lost since it has
not yet been transferred to TSR. It is therefore essential to check that the TDRE flag is set to 1
before writing transmit data to TDR.
14.10.6 Restrictions on Use of DMAC or DTC
• When an external clock source is used as the serial clock, the transmit clock should not be
input until at least five φ clock cycles after TDR is updated by the DMAC or DTC. Abnormal
operation may occur if the transmit clock is input within 4 φ clocks after TDR is updated.
(figure 14.35)
• When RDR is read by the DMAC or DTC, be sure to set the activation source to the relevant
SCI receive-data-full interrupt (RXI).
t
D0
LSB
Serial data
SCK
D1 D3 D4 D5D2 D6 D7
Note: When operating on an external clock, set t > 4 clocks.
TDRE
Figure 14.35 Example of Synchronous Transmission Using DTC
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 624 of 980
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14.10.7 Operation in Case of Mode Transition
• Transmission
Operation should be stopped (by clearing TE, TIE, and TEIE to 0) before making a module
stop mode or software standby mode transition. TSR, TDR, and SSR are reset. The output pin
states in module stop mode or software standby mode depend on the port settings, and become
high-level output after the relevant mode is cleared. If a transition is made during
transmission, the data being transmitted will be undefined.
When transmitting without changing the transmit mode after the relevant mode is cleared,
transmission can be started by setting TE to 1 again, and performing the following sequence:
SSR read → TDR write → TDRE clearance. To transmit with a different transmit mode after
clearing the relevant mode, the procedure must be started again from initialization.
Figure 14.36 shows a sample flowchart for mode transition during transmission. Port pin states
during mode transition are shown in figures 14.37 and 14.38.
Operation should also be stopped (by clearing TE, TIE, and TEIE to 0) before making a
transition from transmission by DTC transfer to module stop mode or software standby mode
transition. To perform transmission with the DTC after the relevant mode is cleared, setting
TE and TIE to 1 will set the TXI flag and start DTC transmission.
• Reception
Receive operation should be stopped (by clearing RE to 0) before making a module stop mode
or software standby mode transition. RSR, RDR, and SSR are reset. If a transition is made
during reception, the data being received will be invalid.
To continue receiving without changing the reception mode after the relevant mode is cleared,
set RE to 1 before starting reception. To receive with a different receive mode, the procedure
must be started again from initialization.
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 625 of 980
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Figure 14.39 shows a sample flowchart for mode transition during reception.
Read TEND flag in SSR
TE = 0
Transition to software
standby mode
Exit from software
standby mode
Change
operating mode? No
All data
transmitted?
TEND = 1
Yes
Yes
Yes
<Transmission>
No
No
[1]
[3]
[2]
TE = 1Initialization
<Start of transmission>
[1] Data being transmitted is interrupted.
After exiting software standby mode,
normal CPU transmission is possible
by setting TE to 1, reading SSR,
writing TDR, and clearing TDRE to 0,
but note that if the DTC has been
activated, the remaining data in
DTCRAM will be transmitted when
TE and TIE are set to 1.
[2] If TIE and TEIE are set to 1, clear
them to 0 in the same way.
[3] Includes module stop mode.
Figure 14.36 Sample Flowchart for Mode Transition during Transmission
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 626 of 980
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SCK output pin
TE bit
TxD output pin Port input/output High outputPort input/output High output Start Stop
Start of transmission End of
transmission
Port input/output
SCI TxD output Port SCI TxD
output
Port
Transition
to software
standby
Exit from
software
standby
Figure 14.37 Port Pin States during Mode Transition
(Internal Clock, Asynchronous Transmission)
Port input/output
Last TxD bit held
High output*Port input/output Marking output
Port input/output
SCI TxD output PortPort
Note: * Initialized by software standby.
SCK output pin
TE bit
TxD output pin
SCI TxD
output
Start of transmission End of
transmission
Transition
to software
standby
Exit from
software
standby
Figure 14.38 Port Pin States during Mode Transition
(Internal Clock, Synchronous Transmission)
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 627 of 980
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RE = 0
Transition to software
standby mode
Read receive data in RDR
Read RDRF flag in SSR
Exit from software
standby mode
Change
operating mode? No
RDRF = 1
Yes
Yes
<Reception>
No [1]
[2]
RE = 1Initialization
<Start of reception>
[1] Receive data being received
becomes invalid.
[2] Includes module stop mode.
Figure 14.39 Sample Flowchart for Mode Transition during Reception
Section 14 Serial Communication Interface (SCI, IrDA)
Rev.6.00 Mar. 18, 2009 Page 628 of 980
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Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 629 of 980
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Section 15 I2C Bus Interface2 (IIC2) (Option)
An I2C bus interface is an option. When using the optional functions, take notice of the following
item:
For the masked ROM version, ‘W’ is added to the model name of the product that uses optional
functions.
For example: HD6432365WTE
This LSI has a two-channel I2C bus interface,
The I2C bus interface conforms to and provides a subset of the NXP Semiconductors I2C bus
(inter-IC bus) interface (Rev.03) standard and fast mode functions. The register configuration that
controls the I2C bus differs partly from the NXP Semiconductors configuration, however.
Figure 15.1 shows a block diagram of the I2C bus interface2.
Figure 15.2 shows an example of I/O pin connections to external circuits.
15.1 Features
• Continuous transmission/reception
Since the shift register, transmit data register, and receive data register are independent from
each other, the continuous transmission/reception can be performed.
• Start and stop conditions generated automatically in master mode
• Selection of acknowledge output levels when receiving
• Automatic loading of acknowledge bit when transmitting
• Bit synchronization/wait function
In master mode, the state of SCL is monitored per bit, and the timing is synchronized
automatically
If transmission/reception is not yet possible, set the SCL to low until preparations are
completed.
• Six interrupt sources
⎯ Transmit-data-empty (including slave-address match), transmit-end, receive-data-full
(including slave-address match), arbitration lost, NACK detection, and stop condition
detection
• Direct bus drive
⎯ Two pins, SCL and SDA pins function as NMOS open-drain outputs.
IFIIC40_000020020100
Section 15 I2C Bus Interface2 (IIC2) (Option)
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SCL
ICCRA
Transfer clock
generation
circuit
Address
comparator
Interrupt
generator Interrupt request
Bus state
decision circuit
Arbitration
decision circuit
Noise canceler
Noise canceler
Output
control
Output
control
Transmission/
reception
control circuit
ICCRB
ICMR
ICSR
ICEIR
ICDRR
ICDRS
ICDRT
I2C bus control register A
I2C bus control register B
I2C mode register
I2C status register
I2C interrupt permission register
I2C transmission data register
I2C reception data register
I2C bus shift register
Slave address register
Legend:
ICCRA:
ICCRB:
ICMR:
ICSR:
ICIER:
ICDRT:
ICDRR:
ICDRS:
SAR:
SAR
SDA
Internal data bus
Figure 15.1 Block Diagram of I2C Bus Interface2
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 631 of 980
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Vcc Vcc
SCL in
SCL out
SCL
SDA in
SDA out
SDA
SCL
(Master)
(Slave 1) (Slave 2)
SDA
SCL in
SCL out
SCL
SDA in
SDA out
SDA
SCL in
SCL out
SCL
SDA in
SDA out
SDA
Figure 15.2 External Circuit Connections of I/O Pins
15.2 Input/Output Pins
Table 15.1 summarizes the input/output pins used by the I2C bus interface.
Table 15.1 Pin Configuration
Name Abbreviation I/O Function
Serial clock SCL0 I/O IIC2_0 serial clock input/output
Serial data SDA0 I/O IIC2_0 serial data input/output
Serial clock SCL1 I/O IIC2_1 serial clock input/output
Serial data SDA1 I/O IIC2_1 serial data input/output
Note: The pin symbols are represented as SCL and SDA; channel numbers are omitted in this
manual.
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 632 of 980
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15.3 Register Descriptions
The I2C bus interface has the following registers.
• I2C bus control register A_0 (ICCRA_0)
• I2C bus control register B_0 (ICCRB_0)
• I2C bus mode register_0 (ICMR_0)
• I2C bus interrupt enable register_0 (ICIER_0)
• I2C bus status register_0 (ICSR_0)
• I2C bus slave address register_0 (SAR_0)
• I2C bus transmit data register_0 (ICDRT_0)
• I2C bus receive data register_0 (ICDRR_0)
• I2C bus shift register_0 (ICDRS_0)
• I2C bus control register A_1 (ICCRA_1)
• I2C bus control register B_1 (ICCRB_1)
• I2C bus mode register_1 (ICMR_1)
• I2C bus interrupt enable register_1 (ICIER_1)
• I2C bus status register_1 (ICSR_1)
• I2C bus slave address register_1 (SAR_1)
• I2C bus transmit data register_1 (ICDRT_1)
• I2C bus receive data register_1 (ICDRR_1)
• I2C bus shift register_1 (ICDRS_1)
Section 15 I2C Bus Interface2 (IIC2) (Option)
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15.3.1 I2C Bus Control Register A (ICCRA)
ICCRA is an 8-bit readable/writable register that enables or disables the I2C bus interface, controls
transmission or reception, and selects master or slave mode, transmission or reception, and transfer
clock frequency in master mode.
Bit Bit Name Initial Value R/W Description
7 ICE 0 R/W I2C Bus Interface Enable
0: This module is halted.
1: This bit is enabled for transfer operations. (SCL and SDA
pins are bus drive state.)
6 RCVD 0 R/W Reception Disable
This bit enables or disables the next operation when TRS is
0 and ICDRR is read.
0: Enables next reception
1: Disables next reception
5
4
MST
TRS
0
0
R/W
R/W
Master/Slave Select
Transmit/Receive Select
When arbitration is lost in master mode, MST and TRS are
both reset by hardware, causing a transition to slave
receive mode. Modification of the TRS bit should be made
between transfer frames. In addition, TRS is set to 1
automatically in slave receive mode when the seventh bit of
the start condition matches the slave address set in SAR
and the eighth bit is set to 1.
Operating modes are described below according to MST
and TRS combination.
00: Slave receive mode
01: Slave transmit mode
10: Master receive mode
11: Master transmit mode
3
2
1
0
CKS3
CKS2
CKS1
CKS0
0
0
0
0
R/W
R/W
R/W
R/W
Transfer clock select 3 to 0
In master mode, these bits should be set according to the
necessary transfer rate. In slave mode, they are used to
secure the data setup time in transmit mode. The data
setup time is 10 tcyc when CKS3 is cleared to 0; 20 tcyc
when CKS3 is set to 1.
Section 15 I2C Bus Interface2 (IIC2) (Option)
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Table 15.2 Transfer Rate
Bit3 Bit2 Bit1 Bit0 Transfer Rate
CKS3 CKS2 CKS1 CKS0 Clock
φ =
8MHz
φ =
10MHz
φ =
20MHz
φ =
25 MHz
φ =
33 MHz
φ =
34 MHz*1
0 φ/28 286 kHz 357 kHz 714 kHz*2 893 kHz*2 1179
kHz*2
1214
kHz*2
0
1 φ/40 200 kHz 250 kHz 500 kHz*2 625 kHz*2 825 kHz*2 850 kHz*2
0 φ/48 167 kHz 208 kHz 417 kHz*2 521 kHz*2 688 kHz*2 708 kHz*2
0*3
1
1 φ/64 125 kHz 156 kHz 313 kHz 391 kHz*2 516 kHz*2 531 kHz*2
0 φ/168 47.6 kHz 59.5 kHz 119 kHz 149 kHz 196 kHz 202 kHz 0
1 φ/100 80.0 kHz 100 kHz 200 kHz 250 kHz 330 kHz 340 kHz
0 φ/112 71.4 kHz 89.3 kHz 179 kHz 223 kHz 295 kHz 304 kHz
0*3
1
1
1 φ/128 62.5 kHz 78.1 kHz 156 kHz 195 kHz 258 kHz 266 kHz
0 φ/56 143 kHz 179 kHz 357 kHz 446 kHz*2 589 kHz*2 607 kHz*2 1 0
1 φ/80 100 kHz 125 kHz 250 kHz 313 kHz 413 kHz*2 425 kHz*2
0 φ/96 83.3 kHz 104 kHz 208 kHz 260 kHz 344 kHz 354 kHz
0
1
1 φ/128 62.5 kHz 78.1 kHz 156 kHz 195 kHz 258 kHz 266 kHz
0 φ/336 23.8 kHz 29.8 kHz 59.5 kHz 74.4 kHz 98.2 kHz 101 kHz 1 0
1 φ/200 40.0 kHz 50.0 kHz 100 kHz 125 kHz 165 kHz 170 kHz
1 0 φ/224 35.7 kHz 44.6 kHz 89.3 kHz 112 kHz 147 kHz 152 kHz
1 φ/256 31.3 kHz 39.1 kHz 78.1 kHz 97.7 kHz 129 kHz 133 kHz
Notes: 1. Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
2. Does not conform to the I2C bus interface specification (standard mode: max. 100 kHz,
fast mode: max. 400 kHz).
3. If CKS3 and CKS2 are both cleared to 0 (7.5 tcyc bit synchronization) and the operating
frequency is 20 MHz or greater, it may not be possible to maintain the prescribed
transfer rate under certain load conditions. Therefore, a bit synchronization setting other
than 7.5 tcyc should be used if the operating frequency exceeds 20 MHz.
Section 15 I2C Bus Interface2 (IIC2) (Option)
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15.3.2 I2C Bus Control Register B (ICCRB)
ICCRB is an 8-bit readable/writable register that issues start/stop conditions, manipulates the SDA
pin, monitors the SCL pin, and controls reset in I2C control.
Bit Bit Name Initial Value R/W Description
7 BBSY 0 R/W Bus Busy
This bit enables to confirm whether the I2C bus is occupied
or released and to issue start and stop conditions in master
mode. This bit is set to 1 when the SDA level changes from
high to low under the condition of SCL = high, assuming
that the start condition has been issued. This bit is cleared
to 0 when the SDA level changes from low to high under
the condition of SCL = high, assuming that the stop
condition has been issued. Write 1 to BBSY and 0 to SCP
to issue a start condition. Follow this procedure when also
re-transmitting a start condition. Write 0 to BBSY and 0 to
SCP to issue a stop condition. To issue a start/stop
condition, use the MOV instruction.
6 SCP 1 W Start Condition/Stop Condition Prohibit
The SCP bit controls the issue of start/stop conditions in
master mode.
To issue a start condition, write 1 in BBSY and 0 in SCP. A
retransmit start condition is issued in the same way. To
issue a stop condition, write 0 in BBSY and 0 in SCP. This
bit is always read as 1. If 1 is written, the data is not stored.
5 SDAO 1 R/W Monitors the output level of SDA.
0: When reading, SDA pin outputs low.
1: When reading, SDA pin outputs high.
The write value should always be 1.
4 ⎯ 1 R/W Reserved
The write value should always be 1.
3 SCLO 1 R This bit monitors SCL output level. When reading and
SCLO is 1, SCL pin outputs high. When reading and SCLO
is 0, SCL pin outputs low.
2 ⎯ 1 ⎯ Reserved
This bit is always read as 1.
1 IICRST 0 R/W IIC control part reset
This bit resets control parts except for I2C registers. If this
bit is set to 1 when hang-up is occurred because of
communication failure during I2C operation, I2C control part
can be reset without setting ports and initializing registers.
Section 15 I2C Bus Interface2 (IIC2) (Option)
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Bit Bit Name Initial Value R/W Description
0 ⎯ 1 ⎯ Reserved
This bit is always read as 1.
15.3.3 I2C Bus Mode Register (ICMR)
ICMR performs master mode wait control and selects the transfer bit count.
Bit Bit Name Initial Value R/W Description
7 ⎯ 0 R/W Reserved
The write value should always be 0.
6 WAIT 0 R/W Wait Insertion Bit
This bit selects whether to insert a wait after data transfer
except for the acknowledge bit. When WAIT is set to 1,
after the fall of the clock for the final data bit, low period is
extended for two transfer clocks. If WAIT is cleared to 0,
data and acknowledge bits are transferred consecutively
with no wait inserted.
The setting of this bit is invalid in slave mode.
5, 4 ⎯ All 1 ⎯ Reserved
These bits are always read as 1.
3 BCWP 1 R/W BC Write Protect
This bit controls the BC2 to BC0 modifications. When
modifying BC2 to BC0, this bit should be cleared to 0 and
use the MOV instruction.
0: When writing, values of BC2 to BC0 are set.
1: When reading, 1 is always read.
When writing, settings of BC2 to BC0 are invalid.
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Bit Bit Name Initial Value R/W Description
2
1
0
BC2
BC1
BC0
0
0
0
R/W
R/W
R/W
Bit Counter 2 to 0
These bits specify the number of bits to be transferred next.
When read, the remaining number of transfer bits is
indicated. The data is transferred with one addition
acknowledge bit. Bit BC2 to BC0 settings should be made
during an interval between transfer frames. If bits BC2 to
BC0 are set to a value other than 000, the setting should be
made while the SCL line is low. The value returns to 000 at
the end of a data transfer, including the acknowledge bit.
With the clock synchronous serial format, these bits should
not be modified.
000: 9
001: 2
010: 3
011: 4
100: 5
101: 6
110: 7
111: 8
15.3.4 I2C Bus Interrupt Enable Register (ICIER)
ICIER is an 8-bit readable/writable register that enables or disables interrupt sources and
acknowledge bits, sets acknowledge bits to be transferred, and confirms acknowledge bits to be
received.
Bit Bit Name Initial Value R/W Description
7 TIE 0 R/W Transmit Interrupt Enable
When the TDRE bit in ICSR is set to 1, this bit enables or
disables the transmit data empty interrupt (TXI).
0: Transmit data empty interrupt request (TXI) is disabled.
1: Transmit data empty interrupt request (TXI) is enabled.
6 TEIE 0 R/W Transmit End Interrupt Enable
This bit enables or disables the transmit end interrupt (TEI)
at the rising of the ninth clock while the TDRE bit in ICSR is
1. TEI can be canceled by clearing the TEND bit or the
TEIE bit to 0.
0: Transmit end interrupt request (TEI) is disabled.
1: Transmit end interrupt request (TEI) is enabled.
Section 15 I2C Bus Interface2 (IIC2) (Option)
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Bit Bit Name Initial Value R/W Description
5 RIE 0 R/W Receive interrupt enable
This bit enables or disables the receive data full interrupt
request (RXI) when a received data is transferred from
ICDRS to ICDRR and the RDRF bit in ICSR is set to 1. RXI
can be canceled by clearing the RDRF or RIE bit to 0.
0: Receive data full interrupt request (RXI) is disabled.
1: Receive data full interrupt request (RXI) is enabled.
4 NAKIE 0 R/W NACK receive interrupt enable
This bit enables or disables the NACK receive interrupt
request (NAKI) when the NACKF and AL bits in ICSR are
set to 1. NAKI can be canceled by clearing the NACKF, AL,
or NAKIE bit to 0.
0: NACK receive interrupt request (NAKI) is disabled.
1: NACK receive interrupt request (NAKI) is enabled.
3 STIE 0 R/W Stop condition detection interrupt enable
0: Stop condition detection interrupt request (STPI) is
disabled.
1: Stop condition detection interrupt request (STPI) is
enabled.
2 ACKE 0 R/W Acknowledge Bit Judgement Select
0: The value of the acknowledge bit is ignored, and
continuous transfer is performed.
1: If the acknowledge bit is 1, continuous transfer is
interrupted.
1 ACKBR 0 R Receive acknowledge
In transmit mode, this bit stores the acknowledge data that
are returned by the receive device. This bit cannot be
modified.
0: Receive acknowledge = 0
1: Receive acknowledge = 1
0 ACKBT 0 R/W Transmit acknowledge
In receive mode, this bit specifies the bit to be sent at the
acknowledge timing.
0: 0 is sent at the acknowledge timing.
1: 1 is sent at the acknowledge timing.
Section 15 I2C Bus Interface2 (IIC2) (Option)
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15.3.5 I2C Bus Status Register (ICSR)
ICSR is an 8-bit readable/writable register that performs confirmation of interrupt request flags
and status.
Bit Bit Name Initial Value R/W Description
7 TDRE 0 R/W Transmit Data Register Empty
[Setting conditions]
• When data is transferred from ICDRT to ICDRS and
ICDRT becomes empty
• When TRS is set
• When a transition from receive mode to transmit mode is
made in slave mode
[Clearing conditions]
• When 0 is written in TDRE after reading TDRE = 1
• When data is written to ICDRT
6 TEND 0 R/W Transmit end
[Setting condition]
When the ninth clock of SCL is rose while the TDRE flag is
1
[Clearing conditions]
• When 0 is written in TEND after reading TEND = 1
• When data is written to ICDRT
5 RDRF 0 R/W Receive Data Register Full
[Setting condition]
When a received data is transferred from ICDRS to ICDRR
[Clearing conditions]
• When 0 is written in RDRF after reading RDRF = 1
• When ICDRR is read
Section 15 I2C Bus Interface2 (IIC2) (Option)
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Bit Bit Name Initial Value R/W Description
4 NACKF 0 R/W No acknowledge detection flag
[Setting condition]
When no acknowledge is detected from the receive device
in transmission while the ACKE bit in ICIER is 1
[Clearing condition]
When 0 is written in NACKF after reading NACKF = 1
Note: When NACKF = 1 is detected, NACKF must be
cleared to 0. Subsequent transmission in not made
until NACKF is cleared to 0.
3 STOP 0 R/W Stop condition detection flag
[Setting conditions]
• In master mode, when a stop condition is detected after
frame transfer
• In slave mode, when a stop condition is detected after
the general call address or the first byte slave address,
next to detection of start condition, accords with the
address set in SAR
[Clearing condition]
When 0 is written in STOP after reading STOP = 1
2 AL 0 R/W Arbitration Lost Flag
This flag indicates that arbitration was lost in master mode.
When two or more master devices attempt to seize the bus
at nearly the same time, if the I2C bus interface detects data
differing from the data it sent, it sets AL to 1 to indicate that
the bus has been taken by another master.
[Setting conditions]
• If the internal SDA and SDA pin disagree at the rise of
SCL in master transmit mode
• When the SDA pin outputs high in master mode while a
start condition is detected
[Clearing condition]
When 0 is written in AL/OVE after reading AL/OVE=1
Section 15 I2C Bus Interface2 (IIC2) (Option)
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Bit Bit Name Initial Value R/W Description
1 AAS 0 R/W Slave Address Recognition Flag
In slave receive mode, this flag is set to 1 if the first frame
following a start condition matches bits SVA6 to SVA0 in
SAR.
[Setting conditions]
• When the slave address is detected in slave receive
mode
• When the general call address is detected in slave
receive mode.
[Clearing condition]
When 0 is written in AAS after reading AAS=1
0 ADZ 0 R/W General Call Address Recognition Flag
This bit is valid in slave receive mode.
[Setting condition]
When the general call address is detected in slave receive
mode
[Clearing conditions]
When 0 is written in ADZ after reading ADZ=1
15.3.6 Slave Address Register (SAR)
SAR is an 8-bit readable/writable register that sets slave address. When the chip is in slave mode,
if the upper 7 bits of SAR match the upper 7 bits of the first frame received after a start condition,
the chip operates as the slave device.
Bit Bit Name Initial Value R/W Description
7 to
1
SVA6 to
SVA0
0
R/W
Slave Address 6 to 0
These bits set a unique address in bits SVA6 to SVA0,
differing form the addresses of other slave devices
connected to the I2C bus.
0 ⎯ 0 R/W Reserved
Though this bit can be read from or written to, the write
value should always be 0.
Section 15 I2C Bus Interface2 (IIC2) (Option)
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15.3.7 I2C Bus Transmit Data Register (ICDRT)
ICDRT is an 8-bit readable/writable register that stores the transmit data. When ICDRT detects the
space in the I2C bus shift register (ICDRS), it transfers the transmit data which is written in
ICDRT to ICDRS and starts transferring data. If the next transfer data is written to ICDRT during
transferring data of ICDRS, continuous transfer is possible. The initial value of ICDRT is H'FF.
15.3.8 I2C Bus Receive Data Register (ICDRR)
ICDRR is an 8-bit register that stores the receive data. When data of one byte is received, ICDRR
transfers the received data from ICDRS to ICDRR and the next data can be received. ICDRR is a
receive-only register, therefore the CPU cannot be written to this register. The initial value of
ICDRR is H'FF.
15.3.9 I2C Bus Shift Register (ICDRS)
ICDRS is a register that is used to transfer/receive data. In transmission, data is transferred from
ICDRT to ICDRS and the data is sent from the SDA pin. In reception, data is transferred from
ICDRS to ICDRR after data of one byte is received. This register cannot be read from the CPU.
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 643 of 980
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15.4 Operation
15.4.1 I2C Bus Format
Figure 15.3 shows the I2C bus formats. Figure 15.4 shows the I2C bus timing. The first frame
following a start condition always consists of 8 bits.
S SLA R/ A DATA A A/ P
1111
n7
1 m
(a) I
2
C bus format
(b) I
2
C bus format (start condition retransmission)
n: transfer bit count
(n = 1 to 8)
m: transfer frame count
(m ≥ 1)
S SLA R/ A DATA
111
n17
1 m1
S SLA R/ A DATA A/ P
111
n27
1 m2
111
A/
n1 and n2: transfer bit count (n1 and n2 = 1 to 8)
m1 and m2: transfer frame count (m1 and m2 ≥ 1)
11
Figure 15.3 I2C Bus Formats
SDA
SCL
S
1-7
SLA
8
R/
9
A
1-7
DATA
89 1-7 89
A DATA PA
Figure 15.4 I2C Bus Timing
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 644 of 980
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Legend:
S: Start condition. The master device drives SDA from high to low while SCL is high.
SLA: Slave address
R/W: Indicates the direction of data transfer: from the slave device to the master device when
R/W is 1, or from the master device to the slave device when R/W is 0.
A: Acknowledge. The receiving device drives SDA to low.
DATA: Transferred data
P: Stop condition. The master device drives SDA from low to high while SCL is high.
15.4.2 Master Transmit Operation
In I2C bus format master transmit mode, the master device outputs the transmit clock and transmit
data, and the slave device returns an acknowledge signal. For master transmit mode operation
timing, refer to figures 15.5 and 15.6. The transmission procedure and operations in master
transmit mode are described below.
1. Set the ICE bit in ICCRA to 1. Set the WAIT bit in ICMR and the CKS3 to CKS0 bits in
ICCR1 to 1. (Initial setting)
2. Read the BBSY flag in ICCRB to confirm that the bus is free. Set the MST and TRS bits in
ICCRA to select master transmit mode. Then, write 1 to BBSY and 0 to SCP using MOV
instruction. (Start condition issued) This generates the start condition.
3. After confirming that TDRE in ICSR has been set, write the transmit data (the first byte data
show the slave address and R/W) to ICDRT. After this, when TDRE is cleared to 0, data is
transferred from ICDRT to ICDRS. TDRE is set again.
4. When transmission of one byte data is completed while TDRE is 1, TEND in ICSR is set to 1
at the rise of the 9th transmit clock pulse. Read the ACKBR bit in ICIER, and confirm that the
slave device has been selected. Then, write second byte data to ICDRT, and clear TDRE and
TEND. When ACKBR is 1, the slave device has not been acknowledged, so issue the stop
condition. To issue the stop condition, write 0 to BBSY and SCP using MOV instruction. SCL
is fixed low until the transmit data is prepared or the stop condition is issued.
5. The transmit data after the second byte is written to ICDRT every time TDRE is set, thus
clearing TDRE.
6. Write the number of bytes to be transmitted to ICDRT. Wait until TEND is set (the end of last
byte data transmission) while TDRE is 1, or wait for NACK (NACKF in ICSR = 1) from the
Section 15 I2C Bus Interface2 (IIC2) (Option)
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receive device while ACKE in ICIER is 1. Then, issue the stop condition to clear TEND or
NACKF.
7. When the STOP bit in ICSR is set to 1, the operation returns to the slave receive mode.
TDRE
SCL
(master output)
SDA
(master output)
SDA
(slave output)
TEND
[5] Write data to ICDRT (third byte).
Clear TDRE.
ICDRT
ICDRS
[2] Instruction of start
condition issuance [3] Write data to ICDRT (first byte).
Clear TDRE.
[4] Write data to ICDRT (second byte).
Clear TDRE and TEND.
User
processing
1
Bit 7
Slave address
Address + R/ Data 1
Data 1
Data 2
Address + R/
Bit 6 Bit 7 Bit 6Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
2123456789
A
R/
Figure 15.5 Master Transmit Mode Operation Timing 1
Section 15 I2C Bus Interface2 (IIC2) (Option)
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TDRE
[6] Issue stop condition. Clear TEND.
[7] Set slave receive mode
TEND
ICDRT
ICDRS
19 23456789
AA/
SCL
(master output)
SDA
(master output)
SDA
(slave output)
Bit 7 Bit 6
Data n
Data n
Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
[5] Write data to ICDRT. Clear TDRE.
User
processing
Figure 15.6 Master Transmit Mode Operation Timing 2
15.4.3 Master Receive Operation
In master receive mode, the master device outputs the receive clock, receives data from the slave
device, and returns an acknowledge signal. For master receive mode operation timing, refer to
figures 15.7 and 15.8. The reception procedure and operations in master receive mode are shown
below.
1. Clear the TEND bit in ICSR to 0, then clear the TRS bit in ICCRA to 0 to switch from master
transmit mode to master receive mode. Then, clear the TDRE bit to 0.
2. When ICDRR is read (dummy data read), reception is started, and the receive clock is output,
and data received, in synchronization with the internal clock. The master device outputs the
level specified by ACKBT in ICIER to SDA, at the 9th receive clock pulse.
3. After the reception of first frame data is completed, the RDRF bit in ICST is set to 1 at the rise
of 9th receive clock pulse. At this time, the received data is read by reading ICDRR.
4. The continuous reception is performed by reading ICDRR and clearing RDRF to 0 every time
RDRF is set. If 8th receive clock pulse falls after reading ICDRR by the other processing while
RDRF is 1, SCL is fixed low until ICDRR is read.
5. If next frame is the last receive data, set the RCVD bit in ICCR1 to 1 before reading ICDRR.
This enables the issuance of the stop condition after the next reception.
6. When the RDRF bit is set to 1 at rise of the 9th receive clock pulse, read ICDRR. Then, clear
RCVD.
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 647 of 980
REJ09B0050-0600
7. When the STOP bit in ICSR is set to 1, read ICDRR and clear RDRF to 0. Then clear the
RCVD bit to 0.
8. The operation returns to the slave receive mode.
TDRE
TEND
ICDRS
ICDRR
[1] Clear TDRE after clearing
TEND and TRS [2] Read ICDRR (dummy read) [3] Read ICDRR
1
A
2134567899
A
TRS
RDRF
SCL
(master output)
SDA
(master output)
SDA
(slave output) Bit 7
Master transmit mode Master receive mode
Bit 7Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
User
processing
Data 1
Data 1
Figure 15.7 Master Receive Mode Operation Timing 1
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 648 of 980
REJ09B0050-0600
RDRF
RCVD
ICDRS
ICDRR
Data n-1 Data n
Data n
Data n-1
[5] Read ICDRR and clear RDRF
after setting RCVD. [6] Issue stop
condition
[7] Read ICDRR, clear RDRF,
and clear RCVD. [8] Set slave
receive mode
19 23456789
AA/A
SCL
(master output)
SDA
(master output)
SDA
(slave output) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
User
processing
Figure 15.8 Master Receive Mode Operation Timing 2
15.4.4 Slave Transmit Operation
In slave transmit mode, the slave device outputs the transmit data, while the master device outputs
the receive clock and returns an acknowledge signal. For slave transmit mode operation timing,
refer to figures 15.9 and 15.10.
The transmission procedure and operations in slave transmit mode are described below.
1. Set the ICE bit in ICCRA to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCRA to 1. (Initial setting) Set the MST and TRS bits in ICCRA to select slave receive
mode, and wait until the slave address matches.
2. When the slave address matches in the first frame following detection of the start condition,
the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th
clock pulse. At this time, if the 8th bit data (R/W) is 1, the TRS in ICCRA and TDRE in ICSR
are set to 1, and the mode changes to slave transmit mode automatically. The continuous
transmission is performed by clearing TDRE after writing transmit data to ICDRT every time
TDRE is set.
3. If TDRE is set after writing last transmit data to ICDRT, wait until TEND in ICSR is set to 1,
with TDRE = 1. When TEND is set, clear TEND.
4. Clear TRS for the end processing, and read ICDRR (dummy read). SCL is free.
5. Clear TDRE.
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 649 of 980
REJ09B0050-0600
TDRE
TEND
ICDRS
ICDRR
1
A
2134567899
A
TRS
ICDRT
SCL
(master output)
Slave receive mode Slave transmit mode
SDA
(master output)
SDA
(slave output)
SCL
(slave output)
Bit 7 Bit 7
Data 1
Data 1
Data 2 Data 3
Data 2
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
[2] Write data to ICDRT (data 1),
and clear TDRE. [2] Write data to ICDRT (data 2),
and clear TDRE. [2] Write data to ICDRT (data 3),
and clear TDRE.
User
processing
Figure 15.9 Slave Transmit Mode Operation Timing 1
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 650 of 980
REJ09B0050-0600
TDRE
Data n
TEND
ICDRS
ICDRR
19 23456789
TRS
ICDRT
AA
SCL
(master output)
SDA
(master output)
SDA
(slave output)
SCL
(slave output)
Bit 7
Slave transmit mode
Slave receive
mode
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
[3] Clear TEND [5] Clear TDRE
[4] Read ICDRR (dummy read)
after clearing TRS
User
processing
Figure 15.10 Slave Transmit Mode Operation Timing 2
15.4.5 Slave Receive Operation
In slave receive mode, the master device outputs the transmit clock and transmit data, and the
slave device returns an acknowledge signal. For slave receive mode operation timing, refer to
figures 15.11 and 15.12. The reception procedure and operations in slave receive mode are
described below.
1. Set the ICE bit in ICCRA to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCRA to 1. (Initial setting) Set the MST and TRS bits in ICCRA to select slave receive
mode, and wait until the slave address matches.
2. When the slave address matches in the first frame following detection of the start condition,
the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th
clock pulse. At the same time, RDRF in ICSR is set to read ICDRR (dummy read) and RDRF
is cleared. (Since the read data show the slave address and R/W, it is not used.)
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 651 of 980
REJ09B0050-0600
3. Clear RDRF after reading ICDRR every time RDRF is set. If 8th receive clock pulse falls
while RDRF is 1, SCL is fixed low until ICDRR is read. The change of the acknowledge
before reading ICDRR, to be returned to the master device, is reflected to the next transmit
frame.
4. The last byte data is read by reading ICDRR.
ICDRS
ICDRR
12 134567899
AA
RDRF
Data 1 Data 2
Data 1
SCL
(master output)
SDA
(master output)
SDA
(slave output)
SCL
(slave output)
Bit 7 Bit 7Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
[2] Read ICDRR (dummy read), and clear RDRF. [2] Read ICDRR, and clear RDRF.
User
processing
Figure 15.11 Slave Receive Mode Operation Timing 1
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 652 of 980
REJ09B0050-0600
ICDRS
ICDRR
12345678 99
A
A
RDRF
SCL
(master output)
SDA
(master output)
SDA
(slave output)
SCL
(slave output)
User
processing
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Data 1
[7] Set ACKBT [8] Read ICDRR,
and clear RDRF.
[10] Read ICDRR,
and clear RDRF.
Data 2
Data 1
Figure 15.12 Slave Receive Mode Operation Timing 2
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 653 of 980
REJ09B0050-0600
15.4.6 Noise Canceler
The logic levels at the SCL and SDA pins are routed through noise cancelers before being latched
internally. Figure 15.13 shows a block diagram of the noise canceler circuit.
The noise canceler consists of two cascaded latches and a match detector. The SCL (or SDA)
input signal is sampled on the system clock, but is not passed forward to the next circuit unless the
outputs of both latches agree. If they do not agree, the previous value is held.
C
QD March detector Internal
SCL or SDA
signal
SCL or SDA
input signal
Sampling
clock
Sampling clock
System clock
period
Latch Latch
C
QD
Figure 15.13 Block Diagram of Noise Canceler
15.4.7 Example of Use
Flowcharts in respective modes that use the I2C bus interface are shown in figures 15.14 to 15.17.
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 654 of 980
REJ09B0050-0600
BBSY=0 ?
No
TEND=1 ?
No
Yes
Start
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
[13]
[14]
[15]
Initialize
Set MST = 1 and TRS
= 1 in ICCRA.
Write BBSY = 1
and SCP = 0.
Write transmit data
in ICDRT
Write BBSY = 0
and SCP = 0
Set MST = 1 and TRS
= 0 in ICCRA
Read BBSY in ICCRB
Read TEND in ICSR
Read ACKBR in ICIER
Master receive mode
Yes
ACKBR=0 ?
Write transmit data in ICDRT
Read TDRE in ICSR
Read TEND in ICSR
Clear TEND in ICSR
Read STOP in ICSR
Clear TDRE in ICSR
End
Write transmit data in ICDRT
Transmit
mode?
No
Yes
TDRE=1 ?
Final byte?
STOP=1 ?
No
No
No
No
No
Yes
Yes
TEND=1 ?
Yes
Yes
Yes
[1] Test the status of the SCL and SDA lines.*
[2] Select master transmit mode.*
[3] Start condition issuance.*
[4] Select transmit data for the first byte (slave address + R/W),
and clear TDRE to 0.
[5] Wait for 1 byte to be transmitted.
[6] Test the acknowledge bit, transferred from the specified slave device.
[7] Set transmit data for the second and subsequent data (except for the final byte),
and clear TDRE and TEND to 0.
[8] Wait for ICDRT empty.
[9] Set the final byte of transmit data, and clear TDRE and TEND to 0.
[10] Wait for the completion of transmission for the final byte.
[11] Clear TEND flag.
[12] Clear STOP flag.
[13] Stop condition issuance.
[14] Wait for the creation of the stop condition.
[15] Set slave receive mode. Clear TDRE.
[12]
Clear STOP in ICSR
Note: * Ensure that no interrupts occur between
when BBSY is cleared to 0 and start condition [3].
Figure 15.14 Sample Flowchart for Master Transmit Mode
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 655 of 980
REJ09B0050-0600
No
Yes
RDRF=1 ?
No
Yes
RDRF=1 ?
(Last receive
- 1)?
Mater receive mode
Clear TEND in ICSR
Set TRS = 0 (ICCRA)
Clear TDRE of ICSR
Set ACKBT = 0 (ICIER)
Dummy read ICDRR
Read RDRF in ICSR
Read ICDRR
Set ACKBT = 1 (ICIER)
Set RCVD - 1 (ICCRA)
Read ICDRR
Read RDRF in ICSR
Write BBSY = 0
and SCP = 0
Read STOP of ICSR
Read ICDRR
Set RCVD = 0 (ICCRA)
Set MST = 0 (ICCRA)
End
No
Yes
STOP=1 ?
No
Yes
[1] Clear TEND, select master receive mode, and then clear TDRE.*
[2] Set acknowledge to the transmitting device.*
[3] Dummy read ICDDR*
[4] Wait for 1 byte to be received.
[5] Check if (last receive - 1)
[6] Read the receive data, and clear RDRF to 0.
[7] Set acknowledge of the final byte. Disable continuous receive (RCVD = 1).
[8] Read receive data of (final byte - 1), and clear RDRF to 0.
[9] Wait for the final byte to be received.
[10] Clear STOP flag.
[11] Stop condition issuance
[12] Wait for the creation of stop condition.
[13] Read the receive data of the final byte, and clear RDRF to 0.
[14] Clear RCVD to 0.
[15] Clear ACKBT.
[16] Set slave receive mode.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
Clear STOP of ICSR
[10]
[9]
[11]
[12]
[13]
[14]
[16]
Note: * Prevent any interrupts while steps [1] to [3] are executed.
Additional information: When receiving one-byte data, execute step [1], and then step [7] omitting steps [2] to [6].
In step [8], dummy read ICDRR.
Clear ACKBT of ICIER
[15]
Figure 15.15 Sample Flowchart for Master Receive Mode
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 656 of 980
REJ09B0050-0600
TDRE=1 ?
Yes
Yes
No
Slave transmit mode
Clear AAS in ICSR
Write transmit data
in ICDRT
Read TDRE in ICSR
End of
transmission?
Write transmit data
in ICDRT
Read TEND in ICSR
Clear TEND in ICSR
Set TRS=0 in ICCRA
Dummy read ICDRR
Clear TDRE in ICSR
End
[1] Clear the flag AAS.
[2] Set transmit data for ICDRT (except for the last data),
and clear TDRE to 0.
[3] Wait for ICDRT empty.
[4] Set the last byte of the transmit data, and clear TDRE to 0.
[5] Wait the transmission end of the last byte.
[6] Clear the flag TEND.
[7] Set slave receive mode.
[8] Dummy read ICDRR to release the SCL line.
[9] Clear the flag TDRE.
No
No
Yes
TEND=1 ?
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Figure 15.16 Sample Flowchart for Slave Transmit Mode
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 657 of 980
REJ09B0050-0600
No
Yes
Yes
Yes
RDRF=1 ?
No
Yes
RDRF=1 ?
The last receive
- 1?
Slave receive mode
Clear AAS in ICSR
Set ACKBT=0 in ICIER
Dummy read ICDRR
Read RDRF in ICSR
Read ICDRR
Set ACKBT=1 in ICIER
Read ICDRR
Read RDRF in ICSR
Read ICDRR
End
No
No
No
Yes
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[1] Clear the flag AAS.
[2] Set the acknowledge for the transmit device.
[3] Dummy read ICDRR.
[4] Wait the reception end of 1 byte.
[5] Judge the (last receive - 1).
[6] Read the received data, and clear RDRF to 0.
[7] Set the acknowledge for the last byte.
[8] Read the received data of the (last byte - 1),
and clear RDRF to 0.
[9] Wait the reception end of the last byte.
[10] Read the received data of the last byte,
and clear RDRF to 0.
Additional information: When receiving one byte of data, execute step [1], and then step [7] omitting steps [2] to [6].
In step [8], dummy read ICDRR.
TDRE=0 ?
RDRF= 1?
Slave transmit mode
Figure 15.17 Sample Flowchart for Slave Receive Mode
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 658 of 980
REJ09B0050-0600
15.5 Interrupt Request
There are six interrupt requests in this module; transmit data empty, transmit end, receive data full,
NACK receive, STOP recognition, and arbitration lost. Table 15.3 shows the contents of each
interrupt request.
Table 15.3 Interrupt Requests
Interrupt Request Abbreviation Interrupt Condition
Transmit Data Empty TXI (TDRE = 1) • (TIE = 1)
Transmit End TEI (TEND = 1) • (TEIE = 1)
Receive Data Full RXI (RDRF = 1) • (RIE = 1)
STOP Recognition STPI (STOP = 1) • (STIE = 1)
NACK Detection NAKI {(NACKF = 1)+(AL = 1)} • (NAKIE = 1)
Arbitration Lost
When interrupt conditions described in table 15.3 are 1 and the CPU is ready to receive interrupts,
an interrupt execution handling is executed. Clear each interrupt source during an interrupt
execution handling. Note that TDRE and TEND are automatically cleared by writing the transmit
data to ICDRT, and RDRF is automatically cleared by reading ICDRR. When the transmit data is
written to ICDRT, TDRE is set again simultaneously. When TDRE is cleared, extra one byte of
data may be transmitted.
15.6 Bit Synchronous Circuit
In master mode,
• When SCL is driven to low by the slave device
• When the rising speed of SCL is lower by the load of the SCL line (load capacitance or pull-up
resistance)
This module has a possibility that high level period may be short in the two states described
above. Therefore it monitors SCL and communicates by bit with synchronization.
Figure 15.18 shows the timing of the bit synchronous circuit and table 15.4 shows the time when
SCL output changes from low to Hi-Z then SCL is monitored.
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 659 of 980
REJ09B0050-0600
SCL VIH
SCL monitor
timing reference
clock
Internal SCL
Figure 15.18 Timing of the Bit Synchronous Circuit
Table 15.4 Time for monitoring SCL
CKS3 CKS2 Time for monitoring SCL
0 7.5 tcyc* 0
1 19.5 tcyc
1 0 17.5 tcyc
1 41.5 tcyc
Note: * If the operating frequency exceeds 20 MHz, it may not be possible to maintain the
prescribed transfer rate under certain load conditions. A setting other than 7.5 tcyc
should therefore be used.
15.7 Usage Notes
1. Issue (retransmit) the start/stop conditions after the fall of the ninth clock is confirmed.
Check SCLO in the I2C control register B (ICCRB)* to confirm the fall of the ninth clock.
When the start/stop conditions are issued (retransmitted) at the specific timing under the
following condition (i) or (ii), such conditions may not be output successfully. This does not
occur in other cases.
(i) When the rising of SCL falls behind the time specified in section 15.6, Bit Synchronous
Circuit, by the load of the SCL bus (load capacitance or pull-up resistance)
(ii) When the bit synchronous circuit is activated by extending the low period of eighth and
ninth clocks, that is driven by the slave device
2. Control WAIT in the I2C bus mode register (ICMR) to be set to 0.
When WAIT is set to 1, and SCL is driven low for two or more transfer clocks by the slave
device at the eighth and ninth clocks, the high period of ninth clock may be shortened. This
does not occur in other cases.
Section 15 I2C Bus Interface2 (IIC2) (Option)
Rev.6.00 Mar. 18, 2009 Page 660 of 980
REJ09B0050-0600
3. I2C bus interface 2 (IIC2) master receive mode
When operating in master receive mode with RDRF set to 1, SCL is driven low at the falling
edge of the eighth clock cycle. However, when ICDRR is read near the falling edge of the
eighth clock cycle, SCL is only fixed low for one clock cycle at the eighth clock cycle of the
next receive data, after which SCL is no longer fixed and the ninth clock cycle is output, even
if ICDRR is not read. This causes the receive data to overflow.
The following methods can be used to prevent this from occurring.
⎯ In master receive mode, complete processing to read ICDRR before the rising edge of the
eighth clock cycle.
⎯ In master receive mode, set RCVD to 1 and perform communication processing one byte at
a time.
4. Limitations on transfer rate setting values when using I2C bus interface 2 (IIC2) in multi-
master mode
When operating in multi-master mode and the IIC transfer rate setting of the MCU is slower
than that of another master device, an SCL of an unanticipated width may by output
occasionally. To prevent this, set the transfer rate to a value 1/1.8 or greater than the fastest
transfer rate among the other master devices. For example, if the fastest transfer rate setting
among the other master devices is 400 kbps, set the IIC transfer rate of the MCU to 223 kbps
(400/1.8) or higher.
5. Limitations on use of bit manipulation instructions to set MST and TRS when using I2C bus
interface 2 (IIC2) in multi-master mode
When bit manipulation instructions are used to set MST and TRS in succession to specify
master transmit while operating in multi-master mode, an arbitration lost may occur, during
execution of the bit manipulation instruction to set TRS, with timing that results in a
contradictory state in which AL in ICSR is set to 1 and master transmit mode (MST = 1, TRS
= 1) is selected as well.
The following methods can be used to prevent this from occurring.
⎯ When operating in multi-master mode, always use the MOV instruction to set MST and
TRS.
⎯ When an arbitration lost occurs, confirm that MST and TRS are both cleared to 0. If the
settings are other than MST = 0, TRS = 0, clear MST and TRS to 0.
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 661 of 980
REJ09B0050-0600
Section 16 A/D Converter
This LSI includes a successive approximation type 10-bit A/D converter that allows up to ten
analog input channels to be selected. The block diagram of A/D converter is shown in figure 16.1.
16.1 Features
• 10-bit resolution
• Ten input channels
• Conversion time: 7.6 µs per channel (at 34-MHz operation)
• Two kinds of operating modes
⎯ Single mode: Single-channel A/D conversion
⎯ Scan mode: Continuous A/D conversion on 1 to 4 channels or 1 to 8 channels
• Eight data registers
⎯ Conversion results are held in a 16-bit data register for each channel
• Sample and hold function
• Three kinds of conversion start
⎯ Conversion can be started by software, 16-bit timer pulse unit (TPU), conversion start
trigger by 8-bit timer (TMR), or external trigger signal.
• Interrupt request
⎯ A/D conversion end interrupt (ADI) request can be generated
• Module stop mode can be set
ADCMS04A_010020020100
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 662 of 980
REJ09B0050-0600
Module data bus
Control circuit
Internal data bus
10-bit D/A
Comparator
+
–
Sample-and-
hold circuit
ADI interrupt
signal
Bus interface
A
D
C
S
R
A
D
C
R
A
D
D
R
D
A
D
D
R
C
A
D
D
R
G
A
D
D
R
F
A
D
D
R
E
A
D
D
R
H
A
D
D
R
B
A
D
D
R
A
AVCC
Vref
AVSS
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
AN12
AN13
ADTRG
Conversion start
trigger from 8-bit
timer or TPU
Successive approximations
register
Multiplexer
Legend:
ADCR: A/D control register
ADCSR: A/D control/status register
ADDRA: A/D data register A
ADDRB: A/D data register B
ADDRC: A/D data register C
ADDRD: A/D data register D
ADDRE: A/D data register E
ADDRF: A/D data register F
ADDRG: A/D data register G
ADDRH: A/D data register H
Figure 16.1 Block Diagram of A/D Converter
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 663 of 980
REJ09B0050-0600
16.2 Input/Output Pins
Table 16.1 summarizes the input pins used by the A/D converter.
The AVCC and AVSS pins are the power supply pins for the analog block in the A/D converter. The
Vref pin is the A/D conversion reference voltage pin.
The sixteen analog input pins are divided into two channel sets: channel set 0 (AN0 to AN7) and
channel set 1 (AN12 and AN13).
Table 16.1 Pin Configuration
Pin Name Symbol I/O Function
Analog power supply pin AVCC Input Analog block power supply
Analog ground pin AVSS Input Analog block ground
Reference voltage pin Vref Input A/D conversion reference voltage
Analog input pin 0 AN0 Input Channel set 0 analog inputs
Analog input pin 1 AN1 Input
Analog input pin 2 AN2 Input
Analog input pin 3 AN3 Input
Analog input pin 4 AN4 Input
Analog input pin 5 AN5 Input
Analog input pin 6 AN6 Input
Analog input pin 7 AN7 Input
Analog input pin 12 AN12 Input Channel set 1 analog inputs
Analog input pin 13 AN13 Input
A/D external trigger input
pin
ADTRG Input External trigger input for starting A/D
conversion
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 664 of 980
REJ09B0050-0600
16.3 Register Descriptions
The A/D converter has the following registers.
• A/D data register A (ADDRA)
• A/D data register B (ADDRB)
• A/D data register C (ADDRC)
• A/D data register D (ADDRD)
• A/D data register E (ADDRE)
• A/D data register F (ADDRF)
• A/D data register G (ADDRG)
• A/D data register H (ADDRH)
• A/D control/status register (ADCSR)
• A/D control register (ADCR)
16.3.1 A/D Data Registers A to H (ADDRA to ADDRH)
There are eight 16-bit read-only ADDR registers, ADDRA to ADDRH, used to store the results of
A/D conversion. The ADDR registers, which store a conversion result for each channel, are
shown in table 16.2.
The converted 10-bit data is stored to bits 15 to 6. The lower 6-bit data is always read as 0.
The data bus between the CPU and the A/D converter is 16-bit width. The data can be read
directly from the CPU.
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 665 of 980
REJ09B0050-0600
Table 16.2 Analog Input Channels and Corresponding ADDR Registers
Analog Input Channel
Channel Set 0 (CH3 = 0) Channel Set 1 (CH3 = 1)
A/D Data Register which Stores
Conversion Result
AN0 ⎯ ADDRA
AN1 ⎯ ADDRB
AN2 ⎯ ADDRC
AN3 ⎯ ADDRD
AN4 AN12 ADDRE
AN5 AN13 ADDRF
AN6 ⎯ ADDRG
AN7 ⎯ ADDRH
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 666 of 980
REJ09B0050-0600
16.3.2 A/D Control/Status Register (ADCSR)
ADCSR controls A/D conversion operations.
Bit Bit Name Initial Value R/W Description
7 ADF 0 R/(W)* A/D End Flag
A status flag that indicates the end of A/D
conversion.
[Setting conditions]
• When A/D conversion ends in single mode
• When A/D conversion ends on all specified
channels in scan mode
[Clearing conditions]
• When 0 is written after reading ADF = 1
• When the DTC or DMAC is activated by an
ADI interrupt and ADDR is read
6 ADIE 0 R/W A/D Interrupt Enable
A/D conversion end interrupt (ADI) request
enabled when 1 is set
5 ADST 0 R/W A/D Start
Clearing this bit to 0 stops A/D conversion, and
the A/D converter enters wait state. When this bit
is set to 1 by software, TPU (trigger), TMR
(trigger), or the ADTRG pin, A/D conversion
starts. This bit remains set to 1 during A/D
conversion. In single mode, cleared to 0
automatically when conversion on the specified
channel ends. In scan mode, conversion
continues sequentially on the specified channels
until this bit is cleared to 0 by a reset, or a
transition to hardware standby mode or software
standby mode.
4 — 0 — Reserved
This bit is always read as 0 and cannot be
modified.
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 667 of 980
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Bit Bit Name Initial Value R/W Description
3
2
1
0
CH3
CH2
CH1
CH0
0
0
0
0
R/W
R/W
R/W
R/W
Channel select 3 to 0
Selects analog input together with bits SCANE
and SCANS in ADCR.
Set the input channel when conversion is
stopped (ADST = 0).
When SCANE = 0 and SCANS = X
0000: AN0 10××: Cannot be set
0001: AN1 10××: Cannot be set
0010: AN2 10××: Cannot be set
0011: AN3 10××: Cannot be set
0100: AN4 1100: AN12
0101: AN5 1101: AN13
0110: AN6 111×: Cannot be set
0111: AN7 111×: Cannot be set
When SCANE = 1 and SCANS = 0
0000: AN0 1000: AN8
0001: AN0 and AN1 1001: AN8 and AN9
0010: AN0 to AN2 1010: AN8 to AN10
0011: AN0 to AN3 1011: AN8 to AN11
0100: AN4 1100: AN12
0101: AN4 and AN5 1101: AN12 and AN13
0110: AN4 to AN6 1110: AN12 to AN14
0111: AN4 to AN7 1111: AN12 to AN15
When SCANE = 1 and SCANS = 1
0000: AN0 1×××: Cannot be set
0001: AN0 and AN1 1×××: Cannot be set
0010: AN0 to AN2 1×××: Cannot be set
0011: AN0 to AN3 1×××: Cannot be set
0100: AN0 to AN4 1×××: Cannot be set
0101: AN0 to AN5 1×××: Cannot be set
0110: AN0 to AN6 1×××: Cannot be set
0111: AN0 to AN7 1×××: Cannot be set
Legend: ×: Don’t care.
Note: * Only 0 can be written in bit 7, to clear the flag.
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 668 of 980
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16.3.3 A/D Control Register (ADCR)
ADCR enables A/D conversion start by an external trigger input.
It also sets the A/D converter operating mode and the A/D conversion time.
Bit Bit Name Initial Value R/W Description
7
6
TRGS1
TRGS0
0
0
R/W
R/W
Timer Trigger Select 1 and 0
These bits select enabling or disabling of the start
of A/D conversion by a trigger signal.
00: A/D conversion start by external trigger is
disabled
01: A/D conversion start by external trigger (TPU)
is enabled
10: A/D conversion start by external trigger (TMR)
is enabled
11: A/D conversion start by external trigger pin
(ADTRG) is enabled
5
4
SCANE
SCANS
0
0
R/W
R/W
Scan Mode
Selects single mode or scan mode as the A/D
conversion operating mode.
0×: Single mode
10: Scan mode. A/D conversion is performed
continuously for channels 1 to 4
11: Scan mode. A/D conversion is performed
continuously for channels 1 to 8.
3
2
CKS1
CKS0
0
0
R/W
R/W
Clock Select 1 to 0
Sets the A/D conversion time.
Only set bits CKS1 and CKS0 while conversion is
stopped (ADST = 0).
00: A/D conversion time = 530 states (max)
01: A/D conversion time = 266 states (max)
10: A/D conversion time = 134 states (max)
11: A/D conversion time = 68 states (max)
1, 0 — All 0 — Reserved
These bits are always read as 0 and cannot be
modified.
Legend: ×: Don’t care.
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 669 of 980
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16.4 Operation
The A/D converter operates by successive approximation with 10-bit resolution. It has two
operating modes: single mode and scan mode. When changing the operating mode or analog input
channel, to prevent incorrect operation, first clear the bit ADST to 0 in ADCSR to halt A/D
conversion. The ADST bit can be set at the same time as the operating mode or analog input
channel is changed.
16.4.1 Single Mode
In single mode, A/D conversion is to be performed only once on the specified single channel.
Operations are as follows.
1. A/D conversion is started when the ADST bit in ADCSR is set to 1, according to the software
or external trigger input.
2. When A/D conversion is completed, the result is transferred to the corresponding A/D data
register to the channel.
3. On completion of conversion, the ADF bit in ADCSR is set to 1. If the ADIE bit is set to 1 at
this time, an ADI interrupt request is generated.
4. The ADST bit remains set to 1 during A/D conversion, and is automatically cleared to 0 when
conversion ends. When the ADST bit is cleared to 0 during A/D conversion, A/D conversion
stops and the A/D converter enters wait state.
16.4.2 Scan Mode
In scan mode, A/D conversion is to be performed sequentially on the specified channels:
maximum four channels or maximum eight channels. Operations are as follows.
1. When the ADST bit in ADCSR is set to 1 by software, TPU or external trigger input, A/D
conversion starts on the first channel in the group.
The consecutive A/D conversion on maximum four channels (SCANE and SCANS = 10) or on
maximum eight channels (SCANE and SCANS = 11) can be selected. When the consecutive
A/D conversion is performed on the four channels, the A/D conversion starts on AN0 when
CH3 = 1 and CH2 = 1, AN4 when CH3 and CH2 = 01, or AN12 when CH3 and CH2 = 11.
When the consecutive A/D conversion is performed on the eight channels, the A/D conversion
starts on AN0 when CH3 = 0.
2. When A/D conversion for each channel is completed, the result is sequentially transferred to
the corresponding A/D data register to each channel.
Section 16 A/D Converter
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3. When conversion of all the selected channels is completed, the ADF bit in ADCSR is set to 1.
If the ADIE bit is set to 1 at this time, an ADI interrupt is requested. Conversion of the first
channel in the group starts again.
4. The ADST bit is not cleared automatically, and steps [2] and [3] are repeated as long as the
ADST bit remains set to 1. When the ADST bit is cleared to 0, A/D conversion stops and the
A/D converter enters wait state. If the ADST bit is later set to 1, A/D conversion starts again
from the first channel in the group.
16.4.3 Input Sampling and A/D Conversion Time
The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog
input when A/D conversion start delay time (tD) passes after the ADST bit is set to 1, then starts
conversion. Figure 16.2 shows the A/D conversion timing. Table 16.3 indicates the A/D
conversion time.
As indicated in figure 16.2, the A/D conversion time (tCONV) includes tD and the input sampling time
(tSPL). The length of tD varies depending on the timing of the write access to ADCSR. The total
conversion time therefore varies within the ranges indicated in tables 16.3.
In scan mode, the values given in table 16.3 apply to the first conversion time. The values given
in table 16.4 apply to the second and subsequent conversions.
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 671 of 980
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(1)
(2)
tDtSPL
tCONV
φ
Address
Write signal
Input sampling
timing
ADF
Legend:
(1): ADCSR write cycle
(2): ADCSR address
tD: A/D conversion start delay time
tSPL: Input sampling time
tCONV: A/D conversion time
Figure 16.2 A/D Conversion Timing
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 672 of 980
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Table 16.3 A/D Conversion Time (Single Mode)
CKS1 = 0 CKS1 = 1
CKS0 = 0 CKS0 = 1 CKS0 = 0 CKS0 = 1
Item Symbol Min Typ Max Min Typ Max Min Typ Max Min Typ Max
A/D conversion
start delay time
tD 18 — 33 10 — 16 6 — 9 4 — 5
Input sampling
time
tSPL — 127 — — 63 — — 31 — — 15 —
A/D conversion
time
tCONV 515 — 530 259 — 266 131 — 134 67 — 68
Note: Values in the table are the number of states.
Table 16.4 A/D Conversion Time (Scan Mode)
CKS1 CKS0 Conversion Time (State)
0 512 (Fixed) 0
1 256 (Fixed)
1 0 128 (Fixed)
1 64 (Fixed)
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16.4.4 External Trigger Input Timing
A/D conversion can be externally triggered. When the TRGS1 and TRGS0 bits are set to 11 in
ADCR, external trigger input is enabled at the ADTRG pin. A falling edge at the ADTRG pin sets
the ADST bit to 1 in ADCSR, starting A/D conversion. Other operations, in both single and scan
modes, are the same as when the bit ADST has been set to 1 by software. Figure 16.3 shows the
timing.
φ
ADTRG
Internal trigger signal
ADST
A/D conversion
Figure 16.3 External Trigger Input Timing
16.5 Interrupts
The A/D converter generates an A/D conversion end interrupt (ADI) at the end of A/D conversion.
Setting the ADIE bit to 1 enables an ADI interrupt requests while the bit ADF in ADCSR is set to
1 after A/D conversion is completed. The DTC or DMAC can be activated by an ADI interrupt.
Having the converted data read by the DTC or DMAC in response to an ADI interrupt enables
continuous conversion to be achieved without imposing a load on software.
Table 16.5 A/D Converter Interrupt Source
Name Interrupt Source Interrupt Flag DTC Activation DMAC Activation
ADI End of conversion ADF Possible Possible
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 674 of 980
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16.6 A/D Conversion Precision Definitions
This LSI’s A/D conversion precision definitions are given below.
• Resolution
The number of A/D converter digital output codes
• Quantization error
The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 16.4).
• Offset error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from the minimum voltage value B'0000000000 (H'000) to
B'0000000001 (H'001) (see figure 16.5).
• Full-scale error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from B'1111111110 (H'3FE) to B'1111111111 (H'3FF) (see
figure 16.5).
• Nonlinearity error
The error with respect to the ideal A/D conversion characteristic between the zero voltage and
the full-scale voltage. Does not include the offset error, full-scale error, or quantization error
(see figure 16.5).
• Absolute precision
The deviation between the digital value and the analog input value. Includes the offset error,
full-scale error, quantization error, and nonlinearity error.
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 675 of 980
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111
110
101
100
011
010
001
000 1
1024 2
1024 1022
1024 1023
1024 FS
Quantization error
Digital output
Ideal A/D conversion
characteristic
Analog
input voltage
Figure 16.4 A/D Conversion Precision Definitions
FS
Digital output
Ideal A/D conversion
characteristic
Nonlinearity
error
Analog
input voltage
Offset error
Actual A/D conversion
characteristic
Full-scale error
Figure 16.5 A/D Conversion Precision Definitions
Section 16 A/D Converter
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16.7 Usage Notes
16.7.1 Module Stop Mode Setting
Operation of the A/D converter can be disabled or enabled using the module stop control register.
The initial setting is for operation of the A/D converter to be halted. Register access is enabled by
clearing module stop mode. For details, refer to section 23, Power-Down Modes.
16.7.2 Permissible Signal Source Impedance
This LSI’s analog input is designed so that conversion precision is guaranteed for an input signal
for which the signal source impedance is 5 kΩ or less. This specification is provided to enable the
A/D converter’s sample-and-hold circuit input capacitance to be charged within the sampling
time; if the sensor output impedance exceeds 5 kΩ, charging may be insufficient and it may not be
possible to guarantee the A/D conversion precision. However, if a large capacitance is provided
externally for conversion in single mode, the input load will essentially comprise only the internal
input resistance of 10 kΩ, and the signal source impedance is ignored. However, since a low-pass
filter effect is obtained in this case, it may not be possible to follow an analog signal with a large
differential coefficient (e.g., 5 mV/μs or greater) (see figure 16.6). When converting a high-speed
analog signal or conversion in scan mode, a low-impedance buffer should be inserted.
Equivalent circuit of A/D converter
This LSI
20 pF
Cin =
15 pF
10 kΩ
Up to 10 kΩ
Low-pass
filter
C to 0.1 μF
Sensor output
impedance
Sensor input
Figure 16.6 Example of Analog Input Circuit
Section 16 A/D Converter
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16.7.3 Influences on Absolute Precision
Adding capacitance results in coupling with GND, and therefore noise in GND may adversely
affect absolute precision. Be sure to make the connection to an electrically stable GND such as
AVss.
Care is also required to insure that filter circuits do not communicate with digital signals on the
mounting board, so acting as antennas.
16.7.4 Setting Range of Analog Power Supply and Other Pins
If conditions shown below are not met, the reliability of the device may be adversely affected.
• Analog input voltage range
The voltage applied to analog input pin ANn during A/D conversion should be in the range
AVss ≤ AVn ≤ Vref.
• Relation between AVcc, AVss and Vcc, Vss
As the relationship between AVcc, AVss and Vcc, Vss, set AVcc ≥ Vcc and AVss = Vss. If
the A/D converter is not used, the AVcc and AVss pins must not be left open.
• Vref setting range
The reference voltage at the Vref pin should be set in the range Vref ≤ AVcc.
16.7.5 Notes on Board Design
In board design, digital circuitry and analog circuitry should be as mutually isolated as possible,
and layout in which digital circuit signal lines and analog circuit signal lines cross or are in close
proximity should be avoided as far as possible. Failure to do so may result in incorrect operation
of the analog circuitry due to inductance, adversely affecting A/D conversion values.
Also, digital circuitry must be isolated from the analog input signals (AN0 to AN7, AN12, AN13),
analog reference power supply (Vref), and analog power supply (AVcc) by the analog ground
(AVss). Also, the analog ground (AVss) should be connected at one point to a stable digital
ground (Vss) on the board.
Section 16 A/D Converter
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16.7.6 Notes on Noise Countermeasures
A protection circuit connected to prevent damage due to an abnormal voltage such as an excessive
surge at the analog input pins (AN0 to AN7, AN12, AN13) should be connected between AVcc
and AVss as shown in figure 16.7. Also, the bypass capacitors connected to AVcc and the filter
capacitor connected to AN0 to AN15 must be connected to AVss.
If a filter capacitor is connected, the input currents at the analog input pins (AN0 to AN7, AN12,
AN13) are averaged, and so an error may arise. Also, when A/D conversion is performed
frequently, as in scan mode, if the current charged and discharged by the capacitance of the
sample-and-hold circuit in the A/D converter exceeds the current input via the input impedance
(Rin), an error will arise in the analog input pin voltage. Careful consideration is therefore required
when deciding the circuit constants.
AVCC
*1*1
Vref
AN0 to AN7, AN12, AN13
AVSS
Notes: Values are reference values.
1.
2. Rin: Input impedance
Rin*2100 Ω
0.1 µF
0.01 µF10 µF
Figure 16.7 Example of Analog Input Protection Circuit
Section 16 A/D Converter
Rev.6.00 Mar. 18, 2009 Page 679 of 980
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Table 16.6 Analog Pin Specifications
Item Min Max Unit
Analog input capacitance — 20 pF
Permissible signal source impedance — 5 kΩ
Section 16 A/D Converter
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Section 17 D/A Converter
Rev.6.00 Mar. 18, 2009 Page 681 of 980
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Section 17 D/A Converter
17.1 Features
D/A converter features are listed below.
• 8-bit resolution
• Two output channels
• Maximum conversion time of 10 µs (with 20 pF load)
• Output voltage of 0 V to Vref
• D/A output hold function in software standby mode
• Setting the module stop mode
DAC0004A_000020020100
Section 17 D/A Converter
Rev.6.00 Mar. 18, 2009 Page 682 of 980
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Module data bus Internal data bus
Vref
AVCC
DA3
DA2
AVSS
8-bit
D/A
Control circuit
DADR2
DADR3
Bus interface
Legend:
DADR2: D/A data register 2
DADR3: D/A data register 3
DADR4: D/A data register 4
DACR23: D/A control register 23
DACR23
Figure 17.1 Block Diagram of D/A Converter
Section 17 D/A Converter
Rev.6.00 Mar. 18, 2009 Page 683 of 980
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17.2 Input/Output Pins
Table 17.1 summarizes the input and output pins of the D/A converter.
Table 17.1 Pin Configuration
Pin Name Symbol I/O Function
Analog power pin AVCC Input Analog power
Analog ground pin AVSS Input Analog ground
Reference voltage pin Vref Input Reference voltage of D/A converter
Analog output pin 2 DA2 Output Channel 2 analog output
Analog output pin 3 DA3 Output Channel 3 analog output
17.3 Register Descriptions
The D/A converter has the following registers.
• D/A data register 2 (DADR2)
• D/A data register 3 (DADR3)
• D/A control register 01 (DACR01)
• D/A control register 23 (DACR23)
17.3.1 D/A Data Registers 2 and 3 (DADR2 and DADR3)
DADR2 and DADR3 are 8-bit readable/writable registers that store data for conversion.
Whenever output is enabled, the values in DADR are converted and output to the analog output
pins.
Section 17 D/A Converter
Rev.6.00 Mar. 18, 2009 Page 684 of 980
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17.3.2 D/A Control Register 23 (DACR23)
DACR23 control the operation of the D/A converter.
Bit Bit Name Initial Value R/W Description
7 DAOE3 0 R/W D/A Output Enable 3
Controls D/A conversion and analog output.
0: Analog output (DA3) is disabled
1: Channel 3 D/A conversion is enabled; analog
output (DA3) is enabled
6 DAOE2 0 R/W D/A Output Enable 2
Controls D/A conversion and analog output.
0: Analog output (DA2) is disabled
1: Channel 2 D/A conversion is enabled; analog
output (DA2) is enabled
5 DAE 0 R/W D/A Enable
Used together with the DAOE0 and DAOE1 bits to
control D/A conversion. When the DAE bit is
cleared to 0, channel 2 and 3 D/A conversions are
controlled independently. When the DAE bit is set
to 1, channel 2 and 3 D/A conversions are
controlled together.
Output of conversion results is always controlled
independently by the DAOE0 and DAOE1 bits.
For details, see table 17.2.
4
to
0
— All 1 — Reserved
These bits are always read as 1 and cannot be
modified.
Section 17 D/A Converter
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Table 17.2 Control of D/A Conversion
Bit 5
DAE
Bit 7
DAOE3
Bit 6
DAOE2
Description
0 0 0 D/A conversion disabled
1 Channel 2 D/A conversion enabled, channel3 D/A conversion
disabled
1 0 Channel 3 D/A conversion enabled, channel2 D/A conversion
disabled
1 Channel 2 and 3 D/A conversions enabled
1 0 0 D/A conversion disabled
1 Channel 2 and 3 D/A conversions enabled
1 0
1
17.4 Operation
The D/A converter includes D/A conversion circuits for two channels, each of which can operate
independently.
When DAOE bit in DACR23 is set to 1, D/A conversion is enabled and the conversion result is
output.
The operation example concerns D/A conversion on channel 2. Figure 17.2 shows the timing of
this operation.
[1] Write the conversion data to DADR2.
[2] Set the DAOE0 bit in DACR23 to 1. D/A conversion is started. The conversion result is output
from the analog output pin DA2 after the conversion time tDCONV has elapsed. The conversion
result is continued to output until DADR0 is written to again or the DAOE0 bit is cleared to 0.
The output value is expressed by the following formula:
DADRcontents
256 × Vref
[3] If DADR2 is written to again, the conversion is immediately started. The conversion result is
output after the conversion time tDCONV has elapsed.
[4] If the DAOE0 bit is cleared to 0, analog output is disabled.
Section 17 D/A Converter
Rev.6.00 Mar. 18, 2009 Page 686 of 980
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Conversion data 1
Conversion
result 1
High-impedance state
t
DCONV
DADR2
write cycle
DA2
DAOE0
DADR2
Address
φ
DACR23
write cycle
Conversion data 2
Conversion
result 2
t
DCONV
Legend:
t
DCONV
: D/A conversion time
DADR2
write cycle
DACR23
write cycle
Figure 17.2 Example of D/A Converter Operation
17.5 Usage Notes
17.5.1 Setting for Module Stop Mode
It is possible to enable/disable the D/A converter operation using the module stop control register,
the D/A converter does not operate by the initial value of the register. The register can be accessed
by releasing the module stop mode. For details, see section 23, Power-Down Modes.
17.5.2 D/A Output Hold Function in Software Standby Mode
If D/A conversion is enabled and this LSI enters software standby mode, D/A output is held and
analog power supply current remains at the same level during D/A conversion. When the analog
power supply current is required to go low in software standby mode, bits DAOE2, DAOE3 and
DAE should be cleared to 0, and D/A output should be disabled.
Section 18 RAM
Rev.6.00 Mar. 18, 2009 Page 687 of 980
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Section 18 RAM
This LSI has an on-chip high-speed static RAM. The RAM is connected to the CPU by a 16-bit
data bus, enabling one-state access by the CPU to both byte data and word data.
The on-chip RAM can be enabled or disabled by means of the RAME bit in the system control
register (SYSCR). For details on the system control register (SYSCR), refer to section 3.2.2,
System Control Register (SYSCR).
Part No. ROM Type
RAM
Capacitance RAM Address
H8S/2368F HD64F2368 Flash memory version 32 kbytes H'FF4000 to H'FFBFFF
HD64F2367 24 kbytes H'FF6000 to H'FFBFFF
HD64F2364 32 kbytes H'FF4000 to H'FFBFFF
HD64F2362
HD64F2361 24 kbytes H'FF6000 to H'FFBFFF
HD64F2360 16 kbytes H'FF8000 to H'FFBFFF
HD6432365 Masked ROM version
HD6412363 ROMless version
Section 18 RAM
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Section 19 Flash Memory (0.35-μm F-ZTAT Version)
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Section 19 Flash Memory (0.35-μm F-ZTAT Version)
The features of the flash memory included in the flash memory version are summarized below.
The block diagram of the flash memory is shown in figure 19.1.
19.1 Features
• Size
Product Classification ROM Size ROM Address
H8S/2368 Group HD64F2367 384 kbytes H'000000 to H'05FFFF (Modes 3, 4, and 7)
• Programming/erase methods
The flash memory is programmed 128 bytes at a time. Erase is performed in single-block
units. The flash memory of 384 kbytes is configured as follows: 64 kbytes × 5 blocks, 32
kbytes × 1 block, and 4 kbytes × 8 blocks. To erase the entire flash memory, each block must
be erased in turn.
• Reprogramming capability
The flash memory can be reprogrammed up to 100 times.
• Two on-board programming modes
Boot mode
User program mode
On-board programming/erasing can be done in boot mode in which the on-chip boot program
is started for erase or programming of the entire flash memory. In normal user program mode,
individual blocks can be erased or programmed.
• Programmer mode
Flash memory can be programmed/erased in programmer mode, using a PROM programmer,
as well as in on-board programming mode.
• Automatic bit rate adjustment
With data transfer in boot mode, the bit rate of this LSI can be automatically adjusted to match
the transfer bit rate of the host.
• Programming/erasing protection
There are three protect modes, hardware, software, and error protect, which allow protected
status to be designated for flash memory program/erase operations.
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 690 of 980
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Module bus
Bus interface/controller
Flash memory
Operating
mode
EBR1
Internal address bus
Internal data bus (16 bits)
Mode pins
EBR2
SYSCR
FLMCR2
FLMCR1
Legend:
FLMCR1: Flash memory control register 1
FLMCR2: Flash memory control register 2
EBR1: Erase block register 1
EBR2: Erase block register 2
SYSCR: System control register
Figure 19.1 Block Diagram of Flash Memory
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
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19.2 Mode Transitions
When the mode pins are set in the reset state and a reset-start is executed, this LSI enters an
operating mode as shown in figure 19.2. In user mode, flash memory can be read but not
programmed or erased.
The boot, user program and programmer modes are provided as modes to write and erase the flash
memory.
The differences between boot mode and user program mode are shown in table 19.1. Figure 19.3
shows boot mode. Figure 19.4 shows user program mode.
Boot mode
On-board programming mode
User
program mode
User mode
(on-chip ROM
enabled)
Reset state
Programmer
mode
RES = 0
SWE = 1
SWE = 0
Note: Only make a transition between user mode and user program mode when the CPU is
not accessing the flash memory.
RES = 0
RES
= 0
RES = 0
MD2 = 1
MD0 = 1, MD1 = 1, MD2 = 0
MD0 = 0, MD1 = 0,
MD2 = 0, P50 = 0,
P51 = 0, P52 = 1
Figure 19.2 Flash Memory State Transitions
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 692 of 980
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Table 19.1 Differences between Boot Mode and User Program Mode
Boot Mode User Program Mode
Total erase Yes Yes
Block erase No Yes
Programming control program* Program/program-verify Erase/erase-verify/program/
program-verify
Note: * To be provided by the user, in accordance with the recommended algorithm.
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 693 of 980
REJ09B0050-0600
Flash memory
This LSI
RAM
Host
Programming control
program
SCI
Application program
(old version)
New application
program
Flash memory
This LSI
RAM
Host
SCI
Application program
(old version)
Boot program area
New application
program
Flash memory
This LSI
RAM
Host
SCI
Flash memory
prewrite-erase
Boot program
New application
program
Flash memory
This LSI
Program execution state
RAM
Host
SCI
New application
program
Boot program
Programming control
program
1. Initial state
The old program version or data remains written
in the flash memory. The user should prepare the
programming control program and new
application program beforehand in the host.
2. Programming control program transfer
When boot mode is entered, the boot program in
the chip (originally incorporated in the chip) is
started and the programming control program in
the host is transferred to RAM via SCI
communication. The boot program required for
flash memory erasing is automatically transferred
to the RAM boot program area.
3. Flash memory initialization
The erase program in the boot program area (in
RAM) is executed, and the flash memory is
initialized (to H'FF). In boot mode, entire flash
memory erasure is performed, without regard to
blocks.
4. Writing new application program
The programming control program transferred
from the host to RAM is executed, and the new
application program in the host is written into the
flash memory.
Programming control
program
Boot programBoot program
Boot program area Boot program area
Programming control
program
Figure 19.3 Boot Mode
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 694 of 980
REJ09B0050-0600
Flash memory
This LSI
RAM
Host
Programming/
erase control program
SCI
Boot program
New application
program
Flash memory
This LSI
RAM
Host
SCI
New application
program
Flash memory
This LSI
RAM
Host
SCI
Flash memory
erase
Boot program
New application
program
Flash memory
This LSI
Program execution state
RAM
Host
SCI
Boot program
Boot program
Application program
(old version)
New application
program
1. Initial state
(1) the program that will transfer the
programming/ erase control program to on-chip
RAM should be written into the flash memory by
the user beforehand. (2) The programming/erase
control program should be prepared in the host
or in the flash memory.
2. Programming/erase control program transfer
When user program mode is entered, user
software confirms this fact, executes the transfer
program in the flash memory, and transfers the
programming/erase control program to RAM.
3. Flash memory initialization
The programming/erase program in RAM is
executed, and the flash memory is initialized (to
H'FF). Erasing can be performed in block units,
but not in byte units.
4. Writing new application program
Next, the new application program in the host is
written into the erased flash memory blocks. Do
not write to unerased blocks.
Programming/
erase control program
Programming/
erase control program
Programming/
erase control program
Transfer program
Application program
(old version)
Transfer program
Transfer program
Transfer program
Figure 19.4 User Program Mode
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 695 of 980
REJ09B0050-0600
19.3 Block Configuration
Figure 19.5 shows the block configuration of 384-kbyte flash memory. The thick lines indicate
erasing units, the narrow lines indicate programming units, and the values are addresses. The 384-
kbyte flash memory is divided into 64 kbytes (5 blocks), 32 kbytes (1 block), and 4 kbytes (8
blocks). Erasing is performed in these divided units. Programming is performed in 128-byte units
starting from an address whose lower eight bits are H'00 or H'80.
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 696 of 980
REJ09B0050-0600
EB0
Erase unit
4 kbytes
EB1
Erase unit
4 kbytes
EB2
Erase unit
4 kbytes
EB3
Erase unit
4 kbytes
EB4
Erase unit
4 kbytes
EB7
Erase unit
4 kbytes
EB8
Erase unit
32 kbytes
EB9
Erase unit
64 kbytes
EB10
Erase unit
64 kbytes
EB11
Erase unit
64 kbytes
H'000000 H'000001 H'000002 H'00007F
H'000FFF
H'00107F
H'00207F
H'00307F
H'00407F
H'00707F
H'007FFF
H'001FFF
H'002FFF
H'003FFF
H'03FFFF
H'00807F
H'00FFFF
H'01007F
H'01FFFF
H'02007F
H'02FFFF
H'03007F
H'001000 H'001001 H'001002
H'002000 H'002001 H'002002
H'003000 H'003001 H'003002
H'004000 H'004001 H'004002
H'007000 H'007001 H'007002
H'008000 H'008001 H'008002
H'010000 H'010001 H'010002
H'020000 H'020001 H'020002
H'030000 H'030001 H'030002
Programming unit: 128 bytes
Programming unit: 128 bytes
EB12
Erase unit
64 kbytes
EB13
Erase unit
64 kbytes
H'05FFFF
H'04007F
H'04FFFF
H'05007F
H'040000 H'040001 H'040002
H'050000 H'050001 H'050002
Programming unit: 128 bytes
Programming unit: 128 bytes
Programming unit: 128 bytes
Programming unit: 128 bytes
Programming unit: 128 bytes
Programming unit: 128 bytes
Programming unit: 128 bytes
Programming unit: 128 bytes
Programming unit: 128 bytes
Programming unit: 128 bytes
Figure 19.5 384-kbyte Flash Memory Block Configuration (Modes 3, 4, and 7)
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 697 of 980
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19.4 Input/Output Pins
The flash memory is controlled by means of the pins shown in table 19.2.
Table 19.2 Pin Configuration
Pin Name I/O Function
RES Input Reset
MD2 Input Sets this LSI’s operating mode
MD1 Input Sets this LSI’s operating mode
MD0 Input Sets this LSI’s operating mode
P52 Input Sets operating mode in programmer mode
P51 Input Sets operating mode in programmer mode
P50 Input Sets operating mode in programmer mode
TxD1 Output Serial transmit data output
RxD1 Input Serial receive data input
19.5 Register Descriptions
The flash memory has the following registers. For details on the system control register, refer to
section 3.2.2, System Control Register (SYSCR).
• Flash memory control register 1 (FLMCR1)
• Flash memory control register 2 (FLMCR2)
• Erase block register 1 (EBR1)
• Erase block register 2 (EBR2)
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 698 of 980
REJ09B0050-0600
19.5.1 Flash Memory Control Register 1 (FLMCR1)
FLMCR1 is a register that makes the flash memory transit to program mode, program-verify
mode, erase mode, or erase-verify mode. For details on register setting, refer to section 19.7,
Flash Memory Programming/Erasing.
Bit Bit Name Initial Value R/W Description
7 — 0/1 R This bit is reserved. This bit is always read as 0 in
modes 1 and 2. This bit is always read as 1 in
modes 3 to 7.
6 SWE 0 R/W Software Write Enable
When this bit is set to 1, flash memory
programming/erasing is enabled. When this bit is
cleared to 0, other FLMCR1 register bits and all
EBR1 and EBR2 bits cannot be set.
5 ESU 0 R/W Erase Setup
When this bit is set to 1 while SWE = 1, the flash
memory transits to the erase setup state. When it is
cleared to 0, the erase setup state is cancelled.
4 PSU 0 R/W Program Setup
When this bit is set to 1 while SWE = 1, the flash
memory transits to the program setup state. When
it is cleared to 0, the program setup state is
cancelled.
3 EV 0 R/W Erase-Verify
When this bit is set to 1 while SWE = 1, the flash
memory transits to erase-verify mode. When it is
cleared to 0, erase-verify mode is cancelled.
2 PV 0 R/W Program-Verify
When this bit is set to 1 while SWE = 1, the flash
memory transits to program-verify mode. When it is
cleared to 0, program-verify mode is cancelled.
1 E 0 R/W Erase
When this bit is set to 1 while SWE = 1, and ESU =
1, the flash memory transits to erase mode. When it
is cleared to 0, erase mode is cancelled.
0 P 0 R/W Program
When this bit is set to 1 while SWE = 1, and PSU =
1, the flash memory transits to program mode.
When it is cleared to 0, program mode is cancelled.
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 699 of 980
REJ09B0050-0600
19.5.2 Flash Memory Control Register 2 (FLMCR2)
FLMCR2 is a register that displays the state of flash memory programming/erasing. When the
SWE bit in FLMCR1 is cleared to 0, FLMCR2 is initialized to H'00. FLMCR2 is a read-only
register, and should not be written to.
Bit Bit Name Initial Value R/W Description
7 FLER 0 R Indicates that an error has occurred during an
operation on flash memory (programming or
erasing). When FLER is set to 1, flash memory
goes to the error-protection state.
See section 19.8.3, Error Protection, for details.
6
to
0
— All 0 R Reserved
These bits always read 0.
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 700 of 980
REJ09B0050-0600
19.5.3 Erase Block Register 1 (EBR1)
EBR1 specifies the flash memory erase area block. EBR1 is initialized to H'00 when the SWE bit
in FLMCR1 is 0. Set only one bit in EBR1 and EBR2 together (do not set more than one bit at the
same time. Setting more than one bit will automatically clear all EBR1 and EBR2 bits to 0). For
details, see table 19.3.
Bit Bit Name Initial Value R/W Description
7 EB7 0 R/W When this bit is set to 1, 4 kbytes of EB7 are to be
erased.
6 EB6 0 R/W When this bit is set to 1, 4 kbytes of EB6 are to be
erased.
5 EB5 0 R/W When this bit is set to 1, 4 kbytes of EB5 are to be
erased.
4 EB4 0 R/W When this bit is set to 1, 4 kbytes of EB4 are to be
erased.
3 EB3 0 R/W When this bit is set to 1, 4 kbytes of EB3 are to be
erased.
2 EB2 0 R/W When this bit is set to 1, 4 kbytes of EB2 are to be
erased.
1 EB1 0 R/W When this bit is set to 1, 4 kbytes of EB1 are to be
erased.
0 EB0 0 R/W When this bit is set to 1, 4 kbytes of EB0 are to be
erased.
19.5.4 Erase Block Register 2 (EBR2)
EBR2 specifies the flash memory erase area block. EBR2 is initialized to H'00 when the SWE bit
in FLMCR1 is 0. Set only one bit in EBR2 and EBR1 together (do not set more than one bit at the
same time. Setting more than one bit will automatically clear all EBR1 and EBR2 bits to 0). For
details, see table 19.3.
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 701 of 980
REJ09B0050-0600
Bit Bit Name Initial Value R/W Description
7, 6 — All 0 R/W Reserved
The initial value should not be changed.
5 EB13 0 R/W When this bit is set to 1, 64 kbytes of EB13 are to
be erased.
4 EB12 0 R/W When this bit is set to 1, 64 kbytes of EB12 are to
be erased.
3 EB11 0 R/W When this bit is set to 1, 64 kbytes of EB11 are to
be erased.
2 EB10 0 R/W When this bit is set to 1, 64 kbytes of EB10 are to
be erased.
1 EB9 0 R/W When this bit is set to 1, 64 kbytes of EB9 are to
be erased.
0 EB8 0 R/W When this bit is set to 1, 32 kbytes of EB8 are to
be erased.
Table 19.3 Erase Blocks
Address
Block (Size) Modes 3, 4, and 7
EB0 (4 kbytes) H'000000 to H'000FFF
EB1 (4 kbytes) H'001000 to H'001FFF
EB2 (4 kbytes) H'002000 to H'002FFF
EB3 (4 kbytes) H'003000 to H'003FFF
EB4 (4 kbytes) H'004000 to H'004FFF
EB5 (4 kbytes) H'005000 to H'005FFF
EB6 (4 kbytes) H'006000 to H'006FFF
EB7 (4 kbytes) H'007000 to H'007FFF
EB8 (32 kbytes) H'008000 to H'00FFFF
EB9 (64 kbytes) H'010000 to H'01FFFF
EB10 (64 kbytes) H'020000 to H'02FFFF
EB11 (64 kbytes) H'030000 to H'03FFFF
EB12 (64 kbytes) H'040000 to H'04FFFF
EB13 (64 kbytes) H'050000 to H'05FFFF
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 702 of 980
REJ09B0050-0600
19.6 On-Board Programming Modes
In an on-board programming mode, programming, erasing, and verification for the on-chip flash
memory can be performed. There are two on-board programming modes: boot mode and user
program mode. Table 19.4 shows how to select boot mode. User program mode can be selected by
setting the control bits by software. For a diagram that shows mode transitions of flash memory,
see figure 19.2.
Table 19.4 Setting On-Board Programming Mode
Mode Setting MD2 MD1 MD0
Boot mode Single-chip activation expanded mode
with on-chip ROM enabled
0 1 1
19.6.1 Boot Mode
When this LSI enters boot mode, the embedded boot program is started. The boot program
transfers the programming control program from the externally connected host to the on-chip
RAM via the SCI_1. When the flash memory is all erased, the programming control program is
executed.
Table 19.5 shows the boot mode operations between reset end and branching to the programming
control program.
1. When the boot program is initiated, the SCI_1 should be set to asynchronous mode, the chip
measures the low-level period of asynchronous SCI communication data (H'00) transmitted
continuously from the host. The chip then calculates the bit rate of transmission from the host,
and adjusts the SCI_1 bit rate to match that of the host. The transfer format is 8-bit data, 1
stop bit, and no parity. The reset should end with the RxD pin high. The RxD and TxD pins
should be pulled up on the board if necessary. After the reset ends, it takes approximately 100
states before the chip is ready to measure the low-level period.
2. After matching the bit rates, the chip transmits one H'00 byte to the host to indicate the end of
bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has
been received normally, and transmit one H'55 byte to the chip. If reception could not be
performed normally, initiate boot mode again by a reset. Depending on the host’s transfer bit
rate and system clock frequency of this LSI, there will be a discrepancy between the bit rates
of the host and the chip. To operate the SCI properly, set the host’s transfer bit rate and system
clock frequency of this LSI within the ranges listed in table 19.6.
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 703 of 980
REJ09B0050-0600
3. When boot mode is used, the flash memory programming control program must be prepared in
the host beforehand. Prepare a programming control program in accordance with the
description in section 19.7, Flash Memory Programming/Erasing.
4. Before branching to the programming control program, the chip terminates transfer operations
by the SCI_1 (by clearing the RE and TE bits in SCR to 0), but the adjusted bit rate value
remains set in BRR. Therefore, the programming control program can still use it for transfer
of program data or verify data with the host. The TxD pin is high. The contents of the CPU
general registers are undefined immediately after branching to the programming control
program. These registers must be initialized at the beginning of the programming control
program, since the stack pointer (SP), in particular, is used implicitly in subroutine calls, etc.
5. In boot mode, if flash memory contains data (all data is not 1), all blocks of flash memory are
erased. Boot mode is used for the initial programming in the on-board state or for a forcible
return when a program that is to be initiated in user program mode was accidentally erased
and could not be executed in user program mode.
Notes: 1. In boot mode, a part of the on-chip RAM area (H'FF8000 to H'FF87FF) is used by the
boot program. Addresses H'FF8800 to H'FFBFFF is the area to which the
programming control program is transferred from the host. The boot program area
cannot be used until the execution state in boot mode switches to the programming
control program.
2. Boot mode can be cleared by a reset. Release the reset by setting the MD pins, after
waiting at least 20 states since driving the reset pin low. Boot mode is also cleared
when the WDT overflow reset occurs.
3. Do not change the MD pin input levels in boot mode.
4. All interrupts are disabled during programming or erasing of the flash memory.
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 704 of 980
REJ09B0050-0600
Table 19.5 Boot Mode Operation
Communication Contents
Processing Contents
Host Operation LSI Operation
Processing Contents
Continuously transmits data H'00
at specified bit rate.
Branches to boot program at reset-start.
Boot program initiation
H'00, H'00 . . . H'00
H'00
H'55
Transmits data H'55 when data H'00
is received error-free.
H'AA reception.
H'XX
Transmits number of bytes (N) of
programming control program to be
transferred as 2-byte data
(low-order byte following high-order
byte).
Transmits 1-byte of programming
control program (repeated for N times).
H'AA reception.
Upper bytes, lower bytes
Echoback
Echoback
H'AA
Branches to programming control program
transferred to on-chip RAM and starts
execution.
Checks flash memory data, erases all flash
memory blocks in case of written data
existing, and transmits data H'AA to host.
(If erase could not be done, transmits data
H'FF to host and aborts operation.)
H'FF
Boot program
erase error
H'AA
Item
Boot mode initiation
• Measures low-level period of receive data H'00.
• Calculates bit rate and sets BRR in SCI_1.
• Transmits data H'00 to host as adjustment end
indication.
Transmits data H'AA to host when data H'55 is
received.
Bit rate adjustment
Echobacks the 2-byte data
received to host.
Echobacks received data to host and also
transfers it to RAM.
(repeated for N times)
Transfer of number of bytes of
programming control program
Flash memory erase
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 705 of 980
REJ09B0050-0600
Table 19.6 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate is
Possible
Host Bit Rate System Clock Frequency Range of LSI
19,200 bps 8 to 25 MHz
9,600 bps 8 to 25 MHz
19.6.2 User Program Mode
On-board programming/erasing of an individual flash memory block can also be performed in user
program mode by branching to a user program/erase program. The user must set branching
conditions and provide on-board means of supplying programming data. The flash memory must
contain the program/erase program or a program which provides the program/erase program from
external memory. Because the flash memory itself cannot be read during programming/erasing,
transfer the program/erase program to on-chip RAM, as like in boot mode. Figure 19.6 shows a
sample procedure for programming/erasing in user program mode. Prepare a program/erase
program in accordance with the description in section 19.7, Flash Memory Programming/Erasing.
Yes
No
Program/erase?
Transfer user program/erase control
program to RAM
Reset-start
Branch to user program/erase control
program in RAM
Branch to flash memory application
program
Branch to flash memory application
program
Execute user program/erase control
program (flash memory programming)
Figure 19.6 Programming/Erasing Flowchart Example in User Program Mode
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 706 of 980
REJ09B0050-0600
19.7 Flash Memory Programming/Erasing
A software method, using the CPU, is employed to program and erase flash memory in the on-
board programming modes. Depending on the FLMCR1 and FLMCR2 setting, the flash memory
operates in one of the following four modes: program mode, erase mode, program-verify mode,
and erase-verify mode. The programming control program in boot mode and the user
program/erase program in user mode use these operating modes in combination to perform
programming/erasing. Flash memory programming and erasing should be performed in
accordance with the descriptions in section 19.7.1, Program/Program-Verify and section 19.7.2,
Erase/Erase-Verify, respectively.
19.7.1 Program/Program-Verify
When programming data or programs to the flash memory, the program/program-verify flowchart
shown in figure 19.7 should be followed. Performing programming operations according to this
flowchart will enable data or programs to be programmed to the flash memory without subjecting
the chip to voltage stress or sacrificing program data reliability.
1. Programming must be done to an empty address. Do not reprogram an address to which
programming has already been performed.
2. Programming should be carried out 128 bytes at a time. A 128-byte data transfer must be
performed even if programming fewer than 128 bytes. In this case, H'FF data must be written
to the extra addresses.
3. Prepare the following data storage areas in RAM: a 128-byte programming data area, a 128-
byte reprogramming data area, and a 128-byte additional-programming data area. Perform
reprogramming data computation and additional programming data computation according to
figure 19.7.
4. Consecutively transfer 128 bytes of data in byte units from the programming data area,
reprogramming data area, or additional-programming data area to the flash memory. The
program address and 128-byte data are latched in the flash memory. The lower 8 bits of the
start address in the flash memory destination area must be H'00 or H'80.
5. The time during which the P bit is set to 1 is the programming time. Figure 19.7 shows the
allowable programming times.
6. The watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc.
Set a value greater than (y + z2 + α + β) µs as the WDT overflow period.
7. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower 2 bits
are B'00. Verify data can be read in words from the address to which a dummy write was
performed.
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 707 of 980
REJ09B0050-0600
8. The maximum number of repetitions of the program/program-verify sequence to the same bit
(N) must not be exceeded.
Start
End of programming
End sub
Set SWE bit in FLMCR1
Wait (x) μs
n = 1
m = 0
Sub-routine-call
Subroutine-call
See Note 7 for pulse width
Note 7: Write Pulse Width
Start of programming
Write pulse application
Set PSU bit in FLMCR1
Enable WDT
Set P bit in FLMCR1
Wait (y) μs
Clear P bit in FLMCR1
Wait (z1) μs or (z2) ms or (z3) μs
Clear PSU bit in FLMCR1
Wait (α) μs
Disable WDT
Wait (β) μs
Write pulse application subroutine
NG
NG
NG
NG
NG NG
OK
OK
OK
OK
OK
Wait (γ) μs
Wait (ε) μs
*2
*4
*6
*6
*6
*6
*6*6
*6
*5 *6
*6
*1
Set PV bit in FLMCR1
H'FF dummy write to verify address
Read verify data
Additional program data computation
Transfer additional program data to
additional program data area
Write data = verify
data?
*4
*1
*4
*3
Reprogram data computation
Clear PV bit in FLMCR1
Clear SWE bit in FLMCR1
m = 1
128-byte
data verification
completed?
m = 0?
6 ≥ n ?
6 ≥ n ?
Increment address
Programming failure
OK
Clear SWE bit in FLMCR1
n ≥ (N)?
Reprogram Data (X')
0
1
Verify Data (V)
0
1
0
1
Additional Program Data (Y)
0
1
Comments
Additional programming executed
Additional programming not executed
Additional programming not executed
Additional programming not executed
Additional Program Data Operation Chart
Write 128-byte data in RAM reprogram
data area consecutively to flash memory
Write pulse application
(z1) μs or (z2) μs
Perform programming in the erased state.
Do not perform additional programming
on previously programmed addresses.
RAM
Program data storage
area (128 bytes)
Reprogram data storage
area (128 bytes)
Additional program data
storage area (128 bytes)
Store 128-byte program data in program
data area and reprogram data area
Number of Writes (n)
1
2
3
4
5
6
7
8
9
10
11
12
13
.
.
.
998
999
1000
Write Time (z) μs
z1
z1
z1
z1
z1
z1
z2
z2
z2
z2
z2
z2
z2
.
.
.
z2
z2
z2
Notes: 1. Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80. A 128-byte data transfer must
be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses.
2. Verify data is read in 16-bit (W) units.
3. The reprogram data is given by the operation of the following tables (comparison between stored data in the program data area and verify data).
Programming is executed for the bits of reprogram data 0 in the next reprogram loop. Even bits for which programming has been completed will
be subjected to additional programming if they fail the subsequent verify operation.
4. A 128-byte areas for storing program data, reprogram data, and additional program data must be provided in the RAM. The contents of the
reprogram and additional program data are modified as programming proceeds.
5. A write pulse of (z1) or (z2) µs should be applied according to the progress of the programming operation. See Note *7 for the pulse widths.
When writing of additional-programming data is executed, a (z3) μs write pulse should be applied.
Reprogram data X' means reprogram data when the write pulse is applied.
6. For the values of x, y, z1, z2, z3, α, β, γ, ε, η, θ, and N, see section 25.2.5, Flash Memory Characteristics.
Original Data (D)
0
1
Verify Data (V)
0
1
0
1
Reprogram Data (X)
1
0
1
Comments
Programming completed
Programming incomplete; reprogram
Still in erased state; no action
Program Data Operation Chart
Transfer reprogram data to reprogram
data area
n ← n + 1
Note: Use a z3 µs write pulse for additional
programming.
Sequentially write 128-byte data in
additional program data area in RAM to
flash memory
Write pulse application
(z3) µs
(additional programming)
Wait (θ) μs
Wait (η) μs
Wait (θ) μs
Figure 19.7 Program/Program-Verify Flowchart
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 708 of 980
REJ09B0050-0600
19.7.2 Erase/Erase-Verify
When erasing flash memory, the erase/erase-verify flowchart shown in figure 19.8 should be
followed.
1. Prewriting (setting erase block data to all 0s) is not necessary.
2. Erasing is performed in block units. Make only a single-bit specification in the erase block
registers (EBR1 and EBR2). To erase multiple blocks, each block must be erased in turn.
3. The time during which the E bit is set to 1 is the flash memory erase time.
4. The watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a
value greater than (y + z + α + β) ms as the WDT overflow period.
5. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower two
bits are B'00. Verify data can be read in longwords from the address to which a dummy write
was performed.
6. If the read data is not erased, set erase mode again, and repeat the erase/erase-verify sequence
as before. The maximum number of repetitions of the erase/erase-verify sequence (N) must
not be exceeded.
19.7.3 Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including NMI input, are disabled when flash memory is being programmed or
erased, and while the boot program is executing in boot mode. There are three reasons for this:
1. Interrupt during programming or erasing might cause a violation of the programming or
erasing algorithm, with the result that normal operation could not be assured.
2. If the interrupt exception handling is started when the vector address has not been programmed
yet or the flash memory is being programmed or erased, the vector would not be read correctly,
possibly resulting in CPU runaway.
3. If an interrupt occurred during boot program execution, it would not be possible to execute the
normal boot mode sequence.
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 709 of 980
REJ09B0050-0600
End of erasing
Start
Set SWE bit in FLMCR1
Set ESU bit in FLMCR1
Set E bit in FLMCR1
Wait (x) μs
Wait (y) μs
n = 1
Set EBR1, EBR2
Enable WDT
*2
*2
*4
Wait (z) μs*2
Wait (α) μs*2
Wait (β) μs*2
Wait (γ) μs
Set block start address to verify address
*2
Wait (ε) μs*2
*3
*2
*2*2
Wait (η) μs
*2
*2
*5
Start of erase
Clear E bit in FLMCR1
Clear ESU bit in FLMCR1
Set EV bit in FLMCR1
H'FF dummy write to verify address
Read verify data
Clear EV bit in FLMCR1
Wait (η) μs
Clear EV bit in FLMCR1
Clear SWE bit in FLMCR1
Disable WDT
Halt erase
*1
Verify data = all 1?
Last address of block?
End of
erasing of all erase
blocks?
Erase failure
Clear SWE bit in FLMCR1
n ≥ N?
NG
NG
NG NG
OK
OK
OK OK
n ← n + 1
Increment
address
Notes: 1. Prewriting (setting erase block data to all 0) is not necessary.
2. The values of x, y, z, α, β, γ, ε, η, θ, and N are shown in section 25.2.5, Flash Memory Characteristics.
3. Verify data is read in 16-bit (W) units.
4. Set only one bit in EBR1or EBR2. More than one bit cannot be set.
5. Erasing is performed in block units. To erase a number of blocks, the individual blocks must be erased sequentially.
Wait (θ) μs Wait (θ) μs
Figure 19.8 Erase/Erase-Verify Flowchart
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 710 of 980
REJ09B0050-0600
19.8 Program/Erase Protection
There are three kinds of flash memory program/erase protection: hardware protection, software
protection, and error protection.
19.8.1 Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly
disabled or aborted because of a transition to reset (including an overflow reset by the WDT) or
standby mode. Flash memory control register 1 (FLMCR1), flash memory control register 2
(FLMCR2), erase block register 1 (EBR1), and erase block register 2 (EBR2) are initialized. In a
reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation
stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the
RES pulse width specified in the AC Characteristics section.
19.8.2 Software Protection
Protection can be implemented against programming/erasing of all flash memory blocks by
clearing the SWE bit in FLMCR1 to 0. When protection is in effect, setting the P or E bit in
FLMCR1 does not cause a transition to program mode or erase mode. By setting the erase block
register 1 (EBR1) and erase block register 2 (EBR2), erase protection can be set for individual
blocks. When EBR1 and EBR2 are set to H'00, erase protection is set for all blocks.
19.8.3 Error Protection
In error protection, an error is detected when the CPU’s runaway occurs during flash memory
programming/erasing, or operation is not performed in accordance with the program/erase
algorithm, and the program/erase operation is forcibly aborted. Aborting the program/erase
operation prevents damage to the flash memory due to overprogramming or overerasing.
When the following errors are detected during programming/erasing of flash memory, the FLER
bit in FLMCR2 is set to 1, and the error protection state is entered.
• When flash memory is read during programming/erasing (including a vector read or instruction
fetch)
• When an exception handling (excluding a reset) is started during programming/erasing
• When a SLEEP instruction is executed during programming/erasing
• When the CPU releases the bus during programming/erasing
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 711 of 980
REJ09B0050-0600
The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained, but program mode or erase
mode is forcibly aborted at the point at which the error occurred. Program mode or erase mode
cannot be re-entered by re-setting the P or E bit. However, since PV and EV bit setting is enabled,
and a transition can be made to verify mode. The error protection state can be canceled by a reset
or in hardware standby mode.
19.9 Programmer Mode
In programmer mode, a PROM programmer can perform programming/erasing via a socket
adapter, just like for a discrete flash memory. Use a PROM programmer which supports the
Renesas 512-kbyte flash memory on-chip MCU device type (FZTAT512V3A). A 12-MHz input
clock is needed.
19.10 Power-Down States for Flash Memory
In user mode, the flash memory will operate in either of the following states:
• Normal operating mode
The flash memory can be read.
• Standby mode
All flash memory circuits are halted.
Table 19.7 shows the correspondence between the operating modes of this LSI and the flash
memory. When the flash memory returns to normal operation from a standby state, a power
supply circuit stabilization period is needed. When the flash memory returns to its normal
operating state, bits STS3 to STS0 in SBYCR must be set to provide a wait time of at least 100 µs,
even when the external clock is being used.
Table 19.7 Flash Memory Operating States
Operating Mode Flash Memory Operating State
Active mode Normal operating state
Sleep mode Normal operating state
Standby mode Standby state
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 712 of 980
REJ09B0050-0600
19.11 Usage Notes
Precautions concerning the use of on-board programming mode, and programmer mode are
summarized below.
1. Use the specified voltages and timing for programming and erasing.
Applied voltages in excess of the rating can permanently damage the device. Use a PROM
programmer that supports the Renesas microcomputer device type with 512-kbyte on-chip
flash memory (FZTAT512V3A).
Do not select the HN27C4096 setting for the PROM programmer, and only use the specified
socket adapter.
2. Reset the flash memory before turning on/off the power.
When applying or disconnecting Vcc power, fix the RES pin low and place the flash memory
in the hardware protection state. The power-on and power-off timing requirements should also
be satisfied in the event of a power failure and subsequent recovery.
3. Use the recommended algorithm when programming and erasing flash memory.
The recommended algorithm enables programming and erasing to be carried out without
subjecting the device to voltage stress or sacrificing program data reliability. When setting the
P or E bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against
program runaway, etc.
4. Do not set or clear the SWE bit during execution of a program in flash memory.
Wait for at least 100 µs after clearing the SWE bit before executing a program or reading data
in flash memory.
When the SWE bit is set, data in flash memory can be rewritten. When the SWE bit is set to 1,
data in flash memory can be read only in program-verify/erase-verify mode. Access flash
memory only for verify operations (verification during programming/erasing). Also, do not
clear the SWE bit during programming, erasing, or verifying.
5. Do not use interrupts while flash memory is being programmed or erased.
All interrupt requests, including NMI, should be disabled during programming/erasing the
flash memory to give priority to program/erase operations.
6. Do not perform additional programming. Erase the memory before reprogramming.
In on-board programming, perform only one programming operation on a 128-byte
programming unit block. In programmer mode, too, perform only one programming operation
on a 128-byte programming unit block. Programming should be carried out with the entire
programming unit block erased.
7. Before programming, check that the chip is correctly mounted in the PROM programmer.
Overcurrent damage to the device can result if the index marks on the PROM programmer
socket, socket adapter, and chip are not correctly aligned.
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 713 of 980
REJ09B0050-0600
8. Do not touch the socket adapter or chip during programming.
Touching either of these can cause contact faults and write errors.
9. Apply the reset signal after the SWE, bit is cleared during its operation.
The reset signal is applied at least 100 µs after the SWE bit has been cleared.
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 714 of 980
REJ09B0050-0600
φ
V
CC
t
OSC1
Min 0 μs
t
MDS
*3
MD2 to MD0
*1
RES
SWE bit
SWE set
(1) Boot Mode
(2) User Program Mode
SWE cleared
Programming/
erasing
possible
Wait time: x Wait time: 100 μs
Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit)
*2
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
power-off by pulling the pins up or down.
2. See section 25.2.5, Flash Memory Characteristics.
3. Mode programming setup time t
MDS
(min) = 200 ns
SWE set SWE cleared
φ
V
CC
t
OSC1
MD2 to MD0
*1
RES
SWE bit
Programming/
erasing
possible
Wait time: x
t
MDS
*3
Wait time: 100 μs
Min 0 μs
Figure 19.9 Power-On/Off Timing
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 715 of 980
REJ09B0050-0600
Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit)*3
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations prohibited)
Notes: 1. When entering boot mode or making a transition from boot mode to another mode, mode switching must be
carried out by means of RES input. The state of ports with multiplexed address functions and bus control output
pins (AS, RD, HWR, LWR) will change during this switchover interval (the interval during which the RES pin
input is low), and therefore these pins should not be used as output signals during this time.
2. When making a transition from boot mode to another mode, a mode programming setup time tMDS
(min) of 200
ns is necessary with respect to RES clearance timing.
3. See section 25.2.5, Flash Memory Characteristics.
4. Wait time: 100 μs
φ
V
CC
t
OSC1
t
MDS
t
MDS
Wait time: x
Programming/erasing
possible
Wait time: x
Programming/erasing
possible
Wait time: x
Programming/erasing
possible
Wait time: x
Programming/erasing
possible
t
RESW
MD2 to MD0
RES
SWE bit
Boot
mode
Mode
change
*
1Mode
change
*
1
User
program
mode
User
program
mode
User
program
mode
User modeUser
mode
User
mode
SWE
set SWE
cleared
*
4
*
4
*
4
*
4
*
2
Figure 19.10 Mode Transition Timing
(Example: Boot Mode → User Mode ↔ User Program Mode)
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 716 of 980
REJ09B0050-0600
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 717 of 980
REJ09B0050-0600
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
The flash memory has the following features. Figure 20.1 shows a block diagram of the flash
memory.
20.1 Features
• Size
Product Classification ROM Size ROM Address
H8S/2368F HD64F2368 512 kbytes H'000000 to H'07FFFF
(Modes 3 to 5 and 7)
H8S/2364F HD64F2364 384 kbytes H'000000 to H'05FFFF
(Modes 3 to 5 and 7)
H8S/2362F HD64F2362 256 kbytes
H8S/2361F HD64F2361
H8S/2360F HD64F2360
H'000000 to H'03FFFF
(Modes 3 to 5 and 7)
• Two flash-memory MATs according to LSI initiation mode
The on-chip flash memory has two memory spaces in the same address space (hereafter
referred to as memory MATs). The mode setting in the initiation determines which memory
MAT is initiated first. The MAT can be switched by using the bank-switching method after
initiation.
⎯ The user memory MAT is initiated at a power-on reset in user mode: 512 kbytes
(H8S/2368F), 384 kbytes (H8S/2364F), 256 kbytes (H8S/2362F, H8S/2361F, H8S/2360F)
⎯ The user boot memory MAT is initiated at a power-on reset in user boot mode: 8 kbytes
• Programming/erasing interface by the download of on-chip program
This LSI has a dedicated programming/erasing program. After downloading this program to
the on-chip RAM, programming/erasing can be performed by setting the argument parameter.
The user branch is also supported.
• Programming/erasing time
The flash memory programming time is 1 ms (typ) in 128-byte simultaneous programming and
8 µs per byte. The erasing time is 750 ms (typ) per 64-kbyte block.
• Number of programming
The number of flash memory programming can be up to 100 times.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 718 of 980
REJ09B0050-0600
• Three on-board programming modes and one off-board programming mode
⎯ Boot mode
This mode is a program mode that uses an on-chip SCI interface. The user MAT and user
boot MAT can be programmed. This mode can automatically adjust the bit rate between
host and this LSI.
⎯ User program mode
The user MAT can be programmed by using the optional interface.
⎯ User boot mode
The user boot program of the optional interface can be made and the user MAT can be
programmed.
• One off-board programming mode
⎯ PROM mode
This mode uses the PROM programmer. The user MAT and user boot MAT can be
programmed.
• Protection modes
There are two protection modes: software protection by the register setting and hardware
protection by the FWE pin. The protection state for flash memory programming/erasing can be
set.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 719 of 980
REJ09B0050-0600
FCCS
FPCS
FECS
FKEY
FVACR
Control unit
Memory MAT unit
Flash memory
User MAT: 512 kbytes*
User boot MAT: 8 kbytes
Operating
mode
Module bus
Mode pin
Internal address bus
Internal data bus (16 bits)
Legend:
FCCS: Flash code control status register
FPCS: Flash program code select register
FECS: Flash erase code select register
FKEY: Flash key code register
FMATS: Flash MAT select register
FTDAR: Flash transfer destination address register
FVACR: Flash vector address control register
Notes: To read from or write to the registers, the FLSHE bit in the system control
register (SYSCR) must be set to 1.
* 384 kbytes, 256 kbytes
FMATS
FTDAR
Figure 20.1 Block Diagram of Flash Memory
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 720 of 980
REJ09B0050-0600
20.1.1 Operating Mode
When each mode pin and the FWE pin are set in the reset state and reset start is performed, the
microcomputer enters each operating mode as shown in figure 20.2.
• Flash memory cannot be read, programmed, or erased in ROM invalid mode.
• Flash memory can be read in user mode, but cannot be programmed or erased.
• Flash memory can be read, programmed, or erased on the board only in user program mode,
user boot mode, and boot mode.
• Flash memory can be read, programmed, or erased by means of the PROM programmer in
PROM mode.
Reset state
ROM invalid
mode PROM mode
User mode User program
mode
User boot
mode Boot mode
On-board programming mode
RES
=
0
ROM invalid
mode setting
RES
=
0
User mode setting
User boot
mode setting
RES
=
0
Boot mode setting
RES
=
0
RES
=
0
PROM mode setting
FLSHE = 0
FLSHE = 1
Figure 20.2 Mode Transition of Flash Memory
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 721 of 980
REJ09B0050-0600
20.1.2 Mode Comparison
The comparison table of programming and erasing related items about boot mode, user program
mode, user boot mode, and PROM mode is shown in table 20.1.
Table 20.1 Comparison of Programming Modes
Boot mode
User program
mode
User boot mode
PROM mode
Programming/
erasing
environment
On-board
programming
On-board
programming
On-board
programming
Off-board
programming
Programming/
erasing enable
MAT
User MAT
User boot MAT
User MAT User MAT User MAT
User boot MAT
All erasure (Automatic) (Automatic)
Block division
erasure
*1 ×
Program data
transfer
From host via
SCI
From optional
device via RAM
From optional
device via RAM
Via programmer
Reset initiation
MAT
Embedded
program storage
MAT
User MAT User boot MAT*2 ⎯
Transition to
user mode
Changing mode
setting and reset
Changing FLSHE
bit
Changing mode
setting and reset
⎯
Notes: 1. All-erasure is performed. After that, the specified block can be erased.
2. Firstly, the reset vector is fetched from the embedded program storage MAT. After the
flash memory related registers are checked, the reset vector is fetched from the user
boot MAT.
• The user boot MAT can be programmed or erased only in boot mode and PROM mode.
• The user MAT and user boot MAT are erased in boot mode. Then, the user MAT and user boot
MAT can be programmed by means of the command method. However, the contents of the
MAT cannot be read until this state.
Only user boot MAT is programmed and the user MAT is programmed in user boot mode or
only user MAT is programmed because user boot mode is not used.
• The boot operation of the optional interface can be performed by the mode pin setting different
from user program mode in user boot mode.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 722 of 980
REJ09B0050-0600
20.1.3 Flash MAT Configuration
This LSI’s flash memory is configured by the 256-kbyte/384-kbyte/512-kbyte user MAT and 8-
kbyte user boot MAT.
The start address is allocated to the same address in the user MAT and user boot MAT. Therefore,
when the program execution or data access is performed between two MATs, the MAT must be
switched by using FMATS.
The user MAT or user boot MAT can be read in all modes if it is in ROM valid mode. However,
the user boot MAT can be programmed only in boot mode and PROM mode.
<User Boot MAT><User MAT>
Address H'03FFFF
(
H'05FFFF/H'07FFFF
)
Address H'000000 Address H'000000
Address H'001FFF
256 kbytes
(384 kbytes/512 kbytes)
8 kbytes
Figure 20.3 Flash Memory Configuration
The size of the user MAT is different from that of the user boot MAT. An address which exceeds
the size of the 8-kbyte user boot MAT should not be accessed. If the attempt is made, data is read
as undefined value.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 723 of 980
REJ09B0050-0600
20.1.4 Block Division
The user MAT is divided into 64 kbytes (seven blocks), 32 kbytes (one block), and 4 kbytes (eight
blocks) as shown in figure 20.4. The user MAT can be erased in this divided-block units and the
erase-block number of EB0 to EB15 is specified when erasing.
<User MAT>
Address H'000000
Address H'03FFFF
Address H'05FFFF
Address H'07FFFF
512 kbytes
32 kbytes
64 kbytes
64 kbytes
64 kbytes
64 kbytes
64 kbytes
64 kbytes
64 kbytes
EB0
EB7
to
EB8
EB9
EB10
EB11
EB12
EB13
EB14
EB15
Erase bloc
k
4 kbytes × 8
384 kbytes
256 kbytes
Figure 20.4 Block Division of User MAT
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 724 of 980
REJ09B0050-0600
20.1.5 Programming/Erasing Interface
Programming/erasing is executed by downloading the on-chip program to the on-chip RAM and
specifying the program address/data and erase block by using the interface register/parameter.
The procedure program is made by the user in user program mode and user boot mode. An
overview of the procedure is given as follows. For details, see section 20.4.2, User Program Mode.
Initialization execution
(downloaded program execution)
Select on-chip program to be
downloaded and
specify the destination.
Start user procedure
program for programming/erasing.
End user procedure
program
Yes
Programming (in 128-byte units)
or erasing (in one-block units)
(downloaded program execution)
Download on-chip program
by setting FKEY and SCO bits.
No
Programming/erasing
completed?
Figure 20.5 Overview of User Procedure Program
1. Selection of on-chip program to be downloaded
For programming/erasing execution, the FLSHE bit must be set to 1 to transition to user
program mode.
This LSI has programming/erasing programs which can be downloaded to the on-chip RAM.
The on-chip program to be downloaded is selected by setting the corresponding bits in the
programming/erasing interface register. The address of the programming destination is
specified by the FTDAR.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 725 of 980
REJ09B0050-0600
2. Download of on-chip program
The on-chip program is automatically downloaded by setting the SCO bit in the flash key
register (FKEY) and the flash control register (FCCS) of the programming/erasing interface
register.
The flash memory is replaced to the embedded program storage area when downloading. Since
the flash memory cannot be read when programming/erasing, the procedure program, which is
working from download to completion of programming/erasing, must be executed in the space
other than the flash memory to be programmed/erased (for example, on-chip RAM).
Since the result of download is returned to the programming/erasing interface parameter,
whether the normal download is executed or not can be confirmed.
3. Initialization of programming/erasing
The operating frequency is set before execution of programming/erasing. This setting is
performed by using the programming/erasing interface parameter.
4. Programming/erasing execution
The program data/programming destination address is specified in 128-byte units when
programming.
The block to be erased is specified in erase-block units when erasing.
These specifications are set by using the programming/erasing interface parameter and the on-
chip program is initiated. The on-chip program is executed by using the JSR or BSR
instruction and performing the subroutine call of the specified address in the on-chip RAM.
The execution result is returned to the programming/erasing interface parameter.
The area to be programmed must be erased in advance when programming flash memory.
All interrupts are prohibited during programming and erasing. Interrupts must be masked
within the user system.
5. When programming/erasing is executed consecutively
When the processing is not ended by the 128-byte programming or one-block erasure, the
program address/data and erase-block number must be updated and consecutive
programming/erasing is required.
Since the downloaded on-chip program is left in the on-chip RAM after the processing,
download and initialization are not required when the same processing is executed
consecutively.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 726 of 980
REJ09B0050-0600
20.2 Input/Output Pins
Table 20.2 shows the flash memory pin configuration.
Table 20.2 Pin Configuration
Pin Name Abbreviation Input/Output Function
Reset RES Input Reset
Mode 2 MD2 Input Sets operating mode of this LSI
Mode 1 MD1 Input Sets operating mode of this LSI
Mode 0 MD0 Input Sets operating mode of this LSI
Port 52 P52 Input Sets operating mode of programmer
mode
Port 51 P51 Input Sets operating mode of programmer
mode
Port 50 P50 Input Sets operating mode of programmer
mode
Transmit data TxD1 Output Serial transmit data output (used in boot
mode)
Receive data RxD1 Input Serial receive data input (used in boot
mode)
Note: For the pin configuration in PROM mode, see section 20.7, Programmer Mode.
20.3 Register Descriptions
The registers/parameters which control flash memory are shown as follows.
• Flash code control status register (FCCS)
• Flash program code select register (FPCS)
• Flash erase code select register (FECS)
• Flash key code register (FKEY)
• Flash MAT select register (FMATS)
• Flash transfer destination address register (FTDAR)
• Download pass and fail result (DPFP)
• Flash pass and fail result (FPFR)
• Flash multipurpose address area (FMPAR)
• Flash multipurpose data destination area (FMPDR)
• Flash erase Block select (FEBS)
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 727 of 980
REJ09B0050-0600
• Flash program and erase frequency control (FPEFEQ)
• Flash vector address control register (FVACR)
There are several operating modes for accessing flash memory, for example, read mode/program
mode.
There are two memory MATs: user MAT and user boot MAT. The dedicated registers/parameters
are allocated for each operating mode and MAT selection. The correspondence of operating modes
and registers/parameters for use is shown in table 20.3.
Table 20.3 Register/Parameter and Target Mode
Download
Initiali-
zation
Program-
ming
Erasure
Read
FCCS ⎯ ⎯ ⎯ ⎯
FPCS ⎯ ⎯ ⎯ ⎯
FECS ⎯ ⎯ ⎯ ⎯
FKEY ⎯ ⎯
FMATS ⎯ ⎯ *1 *1 *2
Programming/erasing
interface register
FTDAR ⎯ ⎯ ⎯ ⎯
Programming/erasing
interface parameter
DPFR ⎯ ⎯ ⎯ ⎯
FPFR ⎯ ⎯
FPEFEQ ⎯ ⎯ ⎯ ⎯
FUBRA ⎯ ⎯ ⎯ ⎯
FMPAR ⎯ ⎯ ⎯ ⎯
FMPDR ⎯ ⎯ ⎯ ⎯
FEBS ⎯ ⎯ ⎯ ⎯
Notes: 1. The setting is required when programming or erasing user MAT in user boot mode.
2. The setting may be required according to the combination of initiation mode and read
target MAT.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 728 of 980
REJ09B0050-0600
20.3.1 Programming/Erasing Interface Register
The programming/erasing interface registers are as described below. They are all 8-bit registers
that can be accessed in byte. Except for the FLER bit in FCCS, these registers are initialized at a
power-on reset, in hardware standby mode, or in software standby mode. The FLER bit is not
initialized in software standby mode.
• Flash Code Control and Status Register (FCCS)
FCCS is configured by bits which request the monitor of the FWE pin state and error
occurrence during programming or erasing flash memory and the download of on-chip
program.
Bit Bit Name
Initial
Value R/W Description
7 ⎯ 1 R Reserved
This bit is always read as 0. The write value should
always be 1.
6, 5 ⎯ All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 729 of 980
REJ09B0050-0600
Bit Bit Name
Initial
Value R/W Description
4 FLER 0 R Flash Memory Error
Indicates an error occurs during programming and
erasing flash memory. When FLER is set to 1, flash
memory enters the error protection state. This bit is
initialized at transition to a power-on reset or hardware
standby mode.
When FLER is set to 1, high voltage is applied to the
internal flash memory. To reduce the damage to flash
memory, the reset must be released after the reset
period of 100 μs which is longer than normal.
0: Flash memory operates normally
Programming/erasing protection for flash memory
(error protection) is invalid.
[Clearing condition] At a power-on reset or in hardware
standby mode
1: Indicates an error occurs during programming/erasing
flash memory.
Programming/erasing protection for flash memory
(error protection) is valid.
[Setting conditions]
• When an interrupt, such as NMI, occurs during
programming/erasing flash memory.
• When the flash memory is read during
programming/erasing flash memory
• When the SLEEP instruction is executed during
programming/erasing flash memory
• When a bus master other than the CPU, such as the
DMAC, DTC, or BREQ, gets bus mastership during
programming/erasing flash memory.
3 to 1 ⎯ All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 730 of 980
REJ09B0050-0600
Bit Bit Name
Initial
Value R/W Description
0 SCO 0 (R)/W Source Program Copy Operation
Requests the on-chip programming/erasing program to
be downloaded to the on-chip RAM.
When this bit is set to 1, the on-chip program which is
selected by FPCS/FECS is automatically downloaded in
the on-chip RAM specified by FTDAR.
In order to set this bit to 1, H'A5 must be written to FKEY,
and this operation must be executed in the on-chip RAM.
Four NOP instructions must be executed immediately
after setting this bit to 1.
Since this bit is cleared to 0 when download is
completed, this bit cannot be read as 1.
All interrupts must be disabled. This should be made in
the user system.
0: Download of the on-chip programming/erasing
program to the on-chip RAM is not executed
[Clear condition] When download is completed
1: Request that the on-chip programming/erasing
program is downloaded to the on-chip RAM is
occurred
[Set conditions] When all of the following conditions
are satisfied and 1 is written to this bit
• H'A5 is written to FKEY
• During execution in the on-chip RAM
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 731 of 980
REJ09B0050-0600
• Flash Program Code Select Register (FPCS)
FPCS selects the on-chip programming program to be downloaded.
Bit
Bit
Name
Initial
Value R/W Description
7 to 1 ⎯ All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
0 PPVS 0 R/W Program Pulse Verify
Selects the programming program.
0: On-chip programming program is not selected
[Clear condition] When transfer is completed
1: On-chip programming program is selected
• Flash Erase Code Select Register (FECS)
FECS selects download of the on-chip erasing program.
Bit
Bit
Name
Initial
Value R/W Description
7 to 1 ⎯ All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
0 EPVB 0 R/W Erase Pulse Verify Block
Selects the erasing program.
0: On-chip erasing program is not selected
[Clear condition] When transfer is completed
1: On-chip erasing program is selected
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 732 of 980
REJ09B0050-0600
• Flash Key Code Register (FKEY)
FKEY is a register for software protection that enables download of on-chip program and
programming/erasing of flash memory. Before setting the SCO bit to 1 in order to download
on-chip program or executing the downloaded programming/erasing program, these processing
cannot be executed if the key code is not written.
Bit
Bit
Name
Initial
Value R/W Description
7
6
5
4
3
2
1
0
K7
K6
K5
K4
K3
K2
K1
K0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Key Code
Only when H'A5 is written, writing to the SCO bit is valid.
When the value other than H'A5 is written to FKEY, 1
cannot be written to the SCO bit. Therefore downloading
to the on-chip RAM cannot be executed.
Only when H'5A is written, programming/erasing can be
executed. Even if the on-chip programming/erasing
program is executed, the flash memory cannot be
programmed or erased when the value other than H'5A is
written to FKEY.
H'A5: Writing to the SCO bit is enabled (The SCO bit
cannot be set by the value other than H'A5.)
H'5A: Programming/erasing is enabled (The value other
than H'A5 is in software protection state.)
H'00: Initial value
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 733 of 980
REJ09B0050-0600
• Flash MAT Select Register (FMATS)
FMATS specifies whether user MAT or user boot MAT is selected.
Bit
Bit
Name
Initial
Value R/W Description
7
6
5
4
3
2
1
0
MS7
MS6
MS5
MS4
MS3
MS2
MS1
MS0
0/1*
0
0/1*
0
0/1*
0
0/1*
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
MAT Select
These bits are in user-MAT selection state when the
value other than H'AA is written and in user-boot-MAT
selection state when H'AA is written.
The MAT is switched by writing the value in FMATS.
When the MAT is switched, follow section 20.6, Switching
between User MAT and User Boot MAT. (The user boot
MAT cannot be programmed in user programming mode
if user boot MAT is selected by FMATS. The user boot
MAT must be programmed in boot mode or in PROM
mode.)
H'AA: The user boot MAT is selected (in user-MAT
selection state when the value of these bits are
other than H'AA)
Initial value when these bits are initiated in user
boot mode.
H'00: Initial value when these bits are initiated in a mode
except for user boot mode (in user-MAT selection
state)
[Programmable condition] These bits are in the execution
state in the on-chip RAM.
Note: * Set to 1 when in user boot mode, otherwise set to 0.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 734 of 980
REJ09B0050-0600
• Flash Transfer Destination Address Register (FTDAR)
FTDAR is a register that specify the address to download an on-chip program. This register
must be specified before setting the SCO bit in FCCS to 1.
Bit
Bit
Name
Initial
Value R/W Description
7 TDER 0 R/W Transfer Destination Address Setting Error
This bit is set to 1 when the address specified by bits
TDA6 to TDA0, which is the start address to download an
on-chip program, is over the range. Whether or not the
range specified by bits TDA6 to TDA0 is within the range
of H'00 to H'03 is determined when an on-chip program is
downloaded by setting the SCO bit in FCCS. Make sure
that this bit is cleared to 0 before setting the SCO bit to 1
and the value specified by TDA6 to TDA0 is within the
range of H'00 to H'03.
0: The value specified by bits TDA6 to TDA0 is within the
range.
1: The value specified by is TDA6 to TDA0 is over the
range (H'04 to H'FF) and the download is stopped.
6
5
4
3
2
1
0
TDA6
TDA5
TDA4
TDA3
TDA2
TDA1
TDA0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Transfer Destination Address
Specifies the start address to download an on-chip
program. H'00 to H'03 can be specified meaning that the
start address in the on-chip RAM space can be specified
in units of 4 kbytes.
H'00: H'FF9000 is specified as a start address to
download an on-chip program.
H'01: H'FFA000 is specified as a start address to
download an on-chip program.
H'02: H'FFB000 is specified as a start address to
download an on-chip program.
H'03: H'FF8000 is specified as a start address to
download an on-chip program.
H'04 to H'07: Setting prohibited. Specifying this value
sets the TDRE bit to 1 and stops the
download.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 735 of 980
REJ09B0050-0600
20.3.2 Programming/Erasing Interface Parameter
The programming/erasing interface parameter specifies the operating frequency, storage place for
program data, programming destination address, and erase block and exchanges the processing
result for the downloaded on-chip program. This parameter uses the general registers of the CPU
(ER0 and ER1) or the on-chip RAM area. The initial value is undefined at a power-on reset or in
hardware standby mode.
When download, initialization, or on-chip program is executed, registers of the CPU except for
R0L are stored. The return value of the processing result is written in ER0, ER1. Since the stack
area is used for storing the registers except for ER0, ER1, the stack area must be saved at the
processing start. (A maximum size of a stack area to be used is 128 bytes.)
The programming/erasing interface parameter is used in the following four items.
1. Download control
2. Initialization before programming or erasing
3. Programming
4. Erasing
These items use different parameters. The correspondence table is shown in table 20.4. The
meaning of the bits in FPFR varies in each processing program: initialization, programming, or
erasure. For details, see descriptions of FPFR for each process.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 736 of 980
REJ09B0050-0600
Table 20.4 Parameters and Target Modes
Name of
Parameter
Abbrevia-
tion
Down
Load
Initializa-
tion
Program-
ming Erasure R/W
Initial
Value
Alloca-
tion
Download pass
and fail result
DPFR ⎯ ⎯ ⎯ R/W Undefined On-chip
RAM*
Flash pass and fail
result
FPFR R/W Undefined R0L of
CPU
Flash
programming/
erasing frequency
control
FPEFEQ ⎯ ⎯ ⎯ R/W Undefined ER0 of
CPU
Flash user branch
address set
FUBRA ⎯ ⎯ ⎯ R/W Undefined ER1 of
CPU
Flash multipurpose
address area
FMPAR ⎯ ⎯ ⎯ R/W Undefined ER1 of
CPU
Flash multipurpose
data destination
area
FMPDR ⎯ ⎯ ⎯ R/W Undefined ER0 of
CPU
Flash erase block
select
FEBS ⎯ ⎯ ⎯ R/W Undefined R0L of
CPU
Note: * A single byte of the start address to download an on-chip program, which is specified by
FTDAR.
(1) Download Control
The on-chip program is automatically downloaded by setting the SCO bit to 1. The on-chip RAM
area to be downloaded is the 128-kbyte area starting from the address specified by FTDAR.
Download control is set in the program/erase interface register, and the return value is passed
using the DPFR parameter.
(a) Download pass/fail result parameter (DPFR: single byte of start address specified by FTDAR)
This parameter indicates the return value of the download result. The value of this parameter can
be used to determine if downloading is executed or not. Since the confirmation whether the SCO
bit is set to 1 is difficult, the certain determination must be performed by writing the single byte of
the start address specified by FTDAR to the value other than the return value of download (for
example, H'FF) before the download start (before setting the SCO bit to 1).
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 737 of 980
REJ09B0050-0600
Bit
Bit
Name
Initial
Value R/W Description
7 to 3 ⎯ ⎯ ⎯ Unused
Return 0
2 SS ⎯ R/W Source Select Error Detect
Only one type for the on-chip program which can be
downloaded can be specified. When more than two types
of the program are selected, the program is not selected,
or the program is selected without mapping, error is
occurred.
0: Download program can be selected normally
1: Download error is occurred (multi-selection or program
which is not mapped is selected)
1 FK ⎯ R/W Flash Key Register Error Detect (FK)
Returns the check result whether the value of FKEY is
set to H'A5.
0: KEY setting is normal (FKEY = H'A5)
1: Setting value of FKEY becomes error (FKEY = value
other than H'A5)
0 SF ⎯ R/W Success/Fail
Returns the result whether download is ended normally
or not. The determination result whether program that is
downloaded to the on-chip RAM is read back and then
transferred to the on-chip RAM is returned.
0: Downloading on-chip program is ended normally (no
error)
1: Downloading on-chip program is ended abnormally
(error occurs)
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 738 of 980
REJ09B0050-0600
(2) Programming/Erasing Initialization
The on-chip programming/erasing program to be downloaded includes the initialization program.
The specified period pulse must be applied when programming or erasing. The specified pulse
width is made by the method in which wait loop is configured by the CPU instruction. The
operating frequency of the CPU must be set.
The initial program is set as a parameter of the programming/erasing program which has
downloaded these settings.
(a) Flash programming/erasing frequency parameter (FPEFEQ: general register ER0 of CPU)
This parameter sets the operating frequency of the CPU and enables the user branch function.
Bit
Bit
Name
Initial
Value R/W Description
31 to 16 FUBE15
to 0
⎯ R/W Set to H'AAFF if the user branch function is enabled by
the flash user branch enable bit. Otherwise, set to
H'0000.
15 to 0 F15 to F0 ⎯ R/W Frequency Set
Set the operating frequency of the CPU. The setting
value must be calculated as the following methods.
1. The operating frequency which is shown in MHz units
must be rounded in a number to three decimal places
and be shown in a number of two decimal places.
2. The value multiplied by 100 is converted to the binary
digit and is written to the FPEFEQ parameter (general
register ER0).
For example, when the operating frequency of the CPU is
34.000 MHz, the value is as follows.
1. The number to three decimal places of 34.000 is
rounded and the value is thus 34.00.
2. The formula that 34.00 × 100 = 3400 is converted to
the binary digit and B'0000,1101,0100,1000 (H'0D48)
is set to R0.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 739 of 980
REJ09B0050-0600
(b) Flash user branch address setting parameter (FUBRA: general register ER1 of CPU)
This parameter sets the user branch destination address. A specified user program can be used to
perform programming or erasing of processing units of predetermined size. When using the user
branch function, set the flash user branch enable bits in FPEFEQ to H'AAFF in addition to the
settings in this register.
Bits 31 to 0: User branch destination address (UA31 to UA0)
Bit
Bit
Name
Initial
Value R/W Description
31 to 0 UA31 to
UA0
— R/W User branch destination address
When no user branching is required, set address 0
(H'00000000). A user branch destination must be within
the RAM space other than the area occupied by the
internal program transferred, or the external bus space.
Proceed with caution to avoid branching to an area
without execution code, which would cause a runaway,
and avoid corrupting the internal program area or a stack
area. In the event of a program runaway, flash memory
values are not guaranteed.
During user-branched processing, do not download,
initialize, or invoke any programming/erase program
routines of the internal program. Programming/erasing
subsequent to the user branch routine cannot be
otherwise guaranteed. In addition, do not modify the
prepared data to be written. Likewise, do not rewrite the
programming/erase interface register during user
branched processing. After completing the user-branch
processing, return to the programming/erase program by
the RTS instructions.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 740 of 980
REJ09B0050-0600
(c) Flash pass/fail parameter (FPFR: general register R0L of CPU)
This parameter indicates the return value of the initialization result.
Bit
Bit
Name
Initial
Value R/W Description
7 to 2 ⎯ ⎯ ⎯ Unused
Return 0
1 FQ ⎯ R/W Frequency Error Detect
Returns the check result whether the specified operating
frequency of the CPU is in the range of the supported
operating frequency.
0: Setting of operating frequency is normal
1: Setting of operating frequency is abnormal
0 SF ⎯ R/W Success/Fail
Indicates whether initialization is completed normally.
0: Initialization is ended normally (no error)
1: Initialization is ended abnormally (error occurs)
(3) Programming Execution
When flash memory is programmed, the programming destination address on the user MAT must
be passed to the programming program in which the program data is downloaded.
1. The start address of the programming destination on the user MAT must be stored in a general
register ER1. This parameter is called as FMPAR (flash multipurpose address area parameter).
Since the program data is always in units of 128 bytes, the lower eight bits (A7 to A0) must be
H'00 or H'80 as the boundary of the programming start address on the user MAT.
2. The program data for the user MAT must be prepared in the consecutive area. The program
data must be in the consecutive space which can be accessed by using the MOV.B instruction
of the CPU and in other than the flash memory space.
When data to be programmed does not satisfy 128 bytes, the 128-byte program data must be
prepared by filling with the dummy code H'FF.
The start address of the area in which the prepared program data is stored must be stored in a
general register ER0. This parameter is called as FMPDR (flash multipurpose data destination
area parameter).
For details on the program processing procedure, see section 20.4.2, User Program Mode.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 741 of 980
REJ09B0050-0600
(a) Flash multipurpose address area parameter (FMPAR: general register ER1 of CPU)
This parameter stores the start address of the programming destination on the user MAT.
When the address in the area other than flash memory space is set, an error occurs.
The start address of the programming destination must be at the 128-byte boundary. If this
boundary condition is not satisfied, an error occurs. The error occurrence is indicated by the WA
bit (bit 1) in FPFR.
Bit
Bit
Name
Initial
Value R/W Description
31 to 0 MOA31 to
MOA0
⎯ R/W Store the start address of the programming destination
on the user MAT. The consecutive 128-byte
programming is executed starting from the specified start
address of the user MAT. Therefore, the specified
programming start address becomes a 128-byte
boundary and MOA6 to MOA0 are always 0.
(b) Flash multipurpose data destination parameter (FMPDR: general register ER0 of CPU):
This parameter stores the start address in the area which stores the data to be programmed in the
user MAT. When the storage destination of the program data is in flash memory, an error occurs.
The error occurrence is indicated by the WD bit in FPFR.
Bit
Bit
Name
Initial
Value R/W Description
31 to 0 MOD31 to
MOD0
⎯ R/W Store the start address of the area which stores the
program data for the user MAT. The consecutive 128-
byte data is programmed to the user MAT starting from
the specified start address.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 742 of 980
REJ09B0050-0600
(c) Flash pass/fail parameter (FPFR: general register R0L of CPU)
This parameter indicates the return value of the program processing result.
Bit
Bit
Name
Initial
Value R/W Description
7 ⎯ ⎯ ⎯ Unused
Return 0.
6 MD ⎯ R/W Programming Mode Related Setting Error Detect
Returns the check result that the error protection state is
not entered. When the error protection state is entered, 1
is written to this bit. The state can be confirmed with the
FLER bit in FCCS. For conditions to enter the error
protection state, see section 20.5.3, Error Protection.
0: FLER setting is normal (FLER = 0)
1: Programming cannot be performed (FLER = 1)
5 EE ⎯ R/W Programming Execution Error Detect
1 is returned to this bit when the specified data could not
be written because the user MAT was not erased. If this
bit is set to 1, there is a high possibility that the user MAT
is partially rewritten. In this case, after removing the error
factor, erase the user MAT.
If FMATS is set to H'AA and the user boot MAT is
selected, an error occurs when programming is
performed. In this case, both the user MAT and user boot
MAT are not rewritten. Programming of the user boot
MAT should be performed in boot mode or PROM mode.
0: Programming has ended normally
1: Programming has ended abnormally (programming
result is not guaranteed)
4 FK ⎯ R/W Flash Key Register Error Detect
Returns the check result of the value of FKEY before the
start of the programming processing.
0: FKEY setting is normal (FKEY = H'5A)
1: FKEY setting is error (FKEY = value other than H'5A)
3 ⎯ ⎯ ⎯ Unused
Returns 0.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 743 of 980
REJ09B0050-0600
Bit
Bit
Name
Initial
Value R/W Description
2 WD ⎯ R/W Write Data Address Detect
When the address in the flash memory area is specified
as the start address of the storage destination of the
program data, an error occurs.
0: Setting of write data address is normal
1: Setting of write data address is abnormal
1 WA ⎯ R/W Write Address Error Detect
When the following items are specified as the start
address of the programming destination, an error occurs.
• When the programming destination address in the
area other than flash memory is specified
• When the specified address is not a 128-byte
boundary (the value of A6 to A0 is not H'0).
0: Setting of programming destination address is normal
1: Setting of programming destination address is
abnormal
0 SF ⎯ R/W Success/Fail
Indicates whether the program processing is ended
normally or not.
0: Programming is ended normally (no error)
1: Programming is ended abnormally (error occurs)
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 744 of 980
REJ09B0050-0600
(4) Erasure Execution
When flash memory is erased, the erase-block number on the user MAT must be passed to the
erasing program which is downloaded. This is set to the FEBS parameter (general register ER0).
One block is specified from the block number 0 to 15.
For details on the erasing processing procedure, see section 20.4.2, User Program Mode.
(a) Flash erase block select parameter (FEBS: general register ER0 of CPU)
This parameter specifies the erase-block number.
Bit
Bit
Name
Initial
Value R/W Description
31 to 8 ⎯ ⎯ ⎯ Unused
These bits should be cleared to H'0.
7 to 0 EBN7 to 0 ⎯ R/W Erase Block Number
Set an erase-block number within the range from 0 to 15.
H'00 corresponds to the EB0 block and H'0F corresponds
to the EB15 block. An error occurs if a number outside
the range from H'00 to H'0F* is set
Note: * For the H8S/2362F, H8S/2361F, and H8S/2360F
choose a setting value within the range from H'00
to H'0B.
For the H8S/2364F, choose a setting value within
the range from H'00 to H'0D.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 745 of 980
REJ09B0050-0600
(b) Flash pass/fail parameter (FPFR: general register R0L of CPU)
This parameter returns value of the erasing processing result.
Bit
Bit
Name
Initial
Value R/W Description
7 ⎯ ⎯ ⎯ Unused
Return 0.
6 MD Programming Mode Related Setting Error Detect
Returns the check result of whether the error protection
state is entered. The error protection state is entered, 1 is
written to this bit. The error protection state can be
confirmed with the FLER bit in FCCS. For conditions to
enter the error protection state, see section 20.5.3, Error
Protection.
0: FLER setting is normal (FLER = 0)
1: FLER = 1 and programming cannot be performed
5 EE ⎯ R/W Erasure Execution Error Detect
1 is returned to this bit when the user MAT could not be
erased or when flash-memory related register settings
are partially changed. If this bit is set to 1, there is a high
possibility that the user MAT is partially erased. In this
case, after removing the error factor, erase the user
MAT. If FMATS is set to H'AA and the user boot MAT is
selected, an error occurs when erasure is performed. In
this case, both the user MAT and user boot MAT are not
erased. Erasing of the user boot MAT should be
performed in boot mode or PROM mode.
0: Erasure has ended normally
1: Erasure has ended abnormally (erasure result is not
guaranteed)
4 FK ⎯ R/W Flash Key Register Error Detect
Returns the check result of FKEY value before start of
the erasing processing.
0: FKEY setting is normal (FKEY = H'5A)
1: FKEY setting is error (FKEY = value other than H'5A)
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 746 of 980
REJ09B0050-0600
Bit
Bit
Name
Initial
Value R/W Description
3 EB ⎯ R/W Erase Block Select Error Detect
Returns the check result whether the specified erase-
block number is in the block range of the user MAT.
0: Setting of erase-block number is normal
1: Setting of erase-block number is abnormal
2, 1 ⎯ ⎯ ⎯ Unused
Return 0.
0 SF ⎯ R/W Success/Fail
Indicates whether the erasing processing is ended
normally or not.
0: Erasure is ended normally (no error)
1: Erasure is ended abnormally (error occurs)
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 747 of 980
REJ09B0050-0600
20.3.3 Flash Vector Address Control Register (FVACR)
FVACR modifies the space from which the vector table data of the NMI interrupts is read.
Normally the vector table data is read from the address spaces from H'00001C to H'00001F.
However, the vector table can be read from the on-chip RAM by the FVACR setting. FVACR is
initialized to H'00 at a power-on reset or in hardware standby mode.
All interrupts including NMI must be prohibited in the programming/erasing processing or during
downloading on-chip program. When the NMI interrupt is necessary, FVACR must be set and the
interrupt exception processing routine must be set in the on-chip RAM space or in the external
space.
Bit
Bit
Name
Initial
Value R/W Description
7 FVCHGE 0 R/W Vector Switch Function Valid
Selects whether the function for modifying the space from
which the vector table data is read is valid or invalid.
When FVCHGE = 1, the vector table data can be read
from the on-chip RAM space.
0: Function for modifying the space from which the vector
table data is read is invalid (Initial value)
1: Function for modifying the space from which the vector
table data is read is valid
6 to 4 ⎯ All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
3
2
1
0
FVSEL3
FVSEL2
FVSEL1
FVSEL0
0
0
0
0
R/W
R/W
R/W
R/W
Interrupt Source Select
The vector table of the NMI interrupt processing can be in
the on-chip RAM space by setting this bit.
0000: Vector table data is in area 0
(H'00001C to H'00001F)
0001: Setting prohibited
001×: Setting prohibited
01××: Setting prohibited
1000: Vector table data is in the on-chip RAM space
(H'FFA01C to H'FFA01F)
1001: Setting prohibited
101×: Setting prohibited
11××: Setting prohibited
Legend:
×: Don’t care
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 748 of 980
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20.4 On-Board Programming Mode
When the pin is set in on-board programming mode and the reset start is executed, the on-board
programming state that can program/erase the on-chip flash memory is entered. On-board
programming mode has three operating modes: user programming mode, user boot mode, and
boot mode.
For details of the pin setting for entering each mode, see table 20.5. User programming mode can
be used by setting the control bit (FLSHE) by software. For details of the state transition of each
mode for flash memory, see figure 20.2.
Table 20.5 Setting On-Board Programming Mode
Mode Setting MD2 MD1 MD0
Boot mode Advanced mode 0 1 1
User boot mode Advanced mode 1 0 1
20.4.1 Boot Mode
Boot mode executes programming/erasing user MAT and user boot MAT by means of the control
command and program data transmitted from the host using the on-chip SCI. The tool for
transmitting the control command and program data must be prepared in the host. The SCI
communication mode is set to asynchronous mode. When reset start is executed after this LSI’s
pin is set in boot mode, the boot program in the microcomputer is initiated. After the SCI bit rate
is automatically adjusted, the communication with the host is executed by means of the control
command method.
The system configuration diagram in boot mode is shown in figure 20.6. For details on the pin
setting in boot mode, see table 20.5. The NMI and other interrupts are ignored in boot mode.
However, the NMI and other interrupts should be disabled in the user system.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 749 of 980
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Host
RxD1
TxD1
Control command,
analysis execution
software (on-chip)
Flash
memory
On-chip RAMOn-chip SCI1
This LSI
Boot
programming
tool and program
data
Control command, program data
Reply response
Figure 20.6 System Configuration in Boot Mode
(1) SCI Interface Setting by Host
When boot mode is initiated, this LSI measures the low period of asynchronous SCI-communica-
tion data (H'00), which is transmitted consecutively by the host. The SCI transmit/receive format
is set to 8-bit data, 1 stop bit, and no parity. This LSI calculates the bit rate of transmission by the
host by means of the measured low period and transmits the bit adjustment end sign (1 byte of
H'00) to the host. The host must confirm that this bit adjustment end sign (H'00) has been received
normally and transmits 1 byte of H'55 to this LSI. When reception is not executed normally, boot
mode is initiated again (reset) and the operation described above must be executed. The bit rate
between the host and this LSI is not matched by the bit rate of transmission by the host and system
clock frequency of this LSI. To operate the SCI normally, the transfer bit rate of the host must be
set to 9,600 bps or 19,200 bps.
The system clock frequency, which can automatically adjust the transfer bit rate of the host and
the bit rate of this LSI, is shown in table 20.6. Boot mode must be initiated in the range of this
system clock.
D0 D1 D2 D3 D4 D5 D6 D7
Start
bit
Stop bit
Measure low period (9 bits) (data is H'00) High period of
at least 1 bit
Figure 20.7 Automatic-Bit-Rate Adjustment Operation of SCI
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 750 of 980
REJ09B0050-0600
Table 20.6 System Clock Frequency for Automatic-Bit-Rate Adjustment by This LSI
Bit Rate of Host System Clock Frequency
9,600 bps 8 to 25 MHz
19,200 bps 8 to 25 MHz
(2) State Transition Diagram
The overview of the state transition diagram after boot mode is initiated is shown in figure 20.8.
1. Bit rate adjustment
After boot mode is initiated, the bit rate of the SCI interface is adjusted with that of the host.
2. Waiting for inquiry set command
For inquiries about user-MAT size and configuration, MAT start address, and support state,
the required information is transmitted to the host.
3. Automatic erasure of all user MAT and user boot MAT
After inquiries have finished, all user MAT and user boot MAT are automatically erased.
4. Waiting for programming/erasing command
⎯ When the program preparation notice is received, the state for waiting program data is
entered. The programming start address and program data must be transmitted following
the programming command. When programming is finished, the programming start address
must be set to H'FFFFFFFF and transmitted. Then the state for waiting program data is
returned to the state of programming/erasing command wait. Before reprogramming erased
blocks containing a programming finished area for which the programming finished
command has been issued, make sure to erase the corresponding erased blocks.
:
EB9
EB10
EB11
EB12
:
Before reprogramming erased blocks containing a programming
finished area (EB10 and EB11), the corresponding erased
blocks (EB10 and EB11) should be erased.
Programming finished area
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 751 of 980
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⎯ When the erasure preparation notice is received, the state for waiting erase-block data is
entered. The erase-block number must be transmitted following the erasing command.
When the erasure is finished, the erase-block number must be set to H'FF and transmitted.
Then the state for waiting erase-block data is returned to the state for waiting
programming/erasing command. The erasure must be used when the specified block is
programmed without a reset start after programming is executed in boot mode. When
programming can be executed by only one operation, all blocks are erased before the state
for waiting programming/erasing/other command is entered. The erasing operation is not
required.
⎯ There are many commands other than programming/erasing. Examples are sum check,
blank check (erasure check), and memory read of the user MAT/user boot MAT and
acquisition of current status information.
Note that memory read of the user MAT/user boot MAT can only read the programmed data after
all user MAT/user boot MAT has automatically been erased.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 752 of 980
REJ09B0050-0600
Wait for inquiry
setting command
Wait for
programming/erasing
command
Bit rate adjustment
Processing of
read/check command
Boot mode initiation
(reset by boot mode)
H'00.......H'00 reception
H'00 transmission
(adjustment completed)
(Bit rate adjustment)
Processing of
inquiry setting
command
All user MAT and
user boot MAT erasure
Wait for program data
Wait for erase-block
data
Read/check command
reception
Command response
(Program command reception)
(Program data transmission)
(Erasure selection command reception)
(Program end notice) (Erase-block specification)
(Erasure end selection
command reception)
Inquiry command reception
H'55 reception
Inquiry command response
1
2
3
4
Figure 20.8 Overview of Boot Mode State Transition Diagram
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 753 of 980
REJ09B0050-0600
20.4.2 User Program Mode
The user MAT can be programmed/erased in user program mode. (The user boot MAT cannot be
programmed/erased.)
Programming/erasing is executed by downloading the program in the microcomputer.
The overview flow is shown in figure 20.9.
High voltage is applied to internal flash memory during the programming/erasing processing.
Therefore, transition to reset or hardware standby must not be executed. Doing so may cause
damage or destroy flash memory. If reset is executed accidentally, reset must be released after the
reset input period, which is longer than normal 100 μs.
When programming,
program data is prepared
Programming/erasing
procedure program is
transferred to the on-chip
RAM and executed
Programming/erasing
start
Programming/erasing
end
Programming/erasing is executed only in the on-chip RAM.
However, if program data is in a consecutive area and can be
accessed by the MOV.B instruction of the CPU like SRAM or
ROM, the program data can be in an external space.
After programming/erasing is finished, it must be protected.
1.
2.
Figure 20.9 Programming/Erasing Overview Flow
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 754 of 980
REJ09B0050-0600
(1) On-chip RAM Address Map when Programming/Erasing Is Executed
Parts of the procedure program that are made by the user, like download request,
programming/erasing procedure, and determination of the result, must be executed in the on-chip
RAM. The on-chip program that is to be downloaded is all in the on-chip RAM. Note that area in
the on-chip RAM must be controlled so that these parts do not overlap.
Figure 20.10 shows the program area to be downloaded.
System use area
(15 bytes)
<
On-chip RAM
>
Address
Area to be
downloaded
(Size : 4 kbytes)
Unusable area in
programming/erasing
processing period
Area that can be used by user
DPFR
(Return value: 1 byte)
Programming/erasing program entry
Programming finished
Initialization program entry
Initialization + programming program
+ Programming finished
or
Initialization + erasing program
Area that can be used by user
RAMTOP
(H'FF4000/H'FF6000/H'FF8000)
FTDAR setting
FTDAR setting + 16
FTDAR setting + 32
FTDAR setting + 4
RAMEND (H'FFC000)
Figure 20.10 RAM Map when Programming/Erasing Is Executed
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 755 of 980
REJ09B0050-0600
(2) Programming Procedure in User Program Mode
The procedures for download, initialization, and programming are shown in figure 20.11.
Select on-chip program
to be downloaded and
specify download
destination by FTDAR
Set FKEY to H'A5
Set SCO to 1 and
execute download
DPFR = 0?
Yes
No
Download error processing
Set the FPEFEQ, FUBRA
parameter
Yes
End programming
procedure program
FPFR = 0? No
Disable interrupts and bus
master operation
other than CPU
Clear FKEY to 0
Programming
JSR FTDAR setting + 16
Yes
FPFR = 0? No
Clear FKEY and
programming
error processing
Yes
FPFR = 0? No
Clear FKEY and
programming
error processing
Yes
Required data
programming is
completed?
No
Set FKEY to H'5A
Clear FKEY to 0
1.
2.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
17.
16.
Programming finished
processing
JSR FTDAR setting + 16
15.
a
a
3.
Download
Initialization
Programming
Initialization
JSR FTDAR setting + 32
Initialization error processing
Set parameters to ER1
and ER0
(FMPAR and FMPDR)
Start programming
procedure program
Figure 20.11 Programming Procedure
The procedure program must be executed in an area other than the flash memory to be
programmed. Especially the part where the SCO bit in FCCS is set to 1 for downloading must be
executed in the on-chip RAM.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 756 of 980
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The area that can be executed in the steps of the user procedure program (on-chip RAM, user
MAT, and external space) is shown in section 20.4.4, Procedure Program and Storable Area for
Programming Data.
The following description assumes the area to be programmed on the user MAT is erased and
program data is prepared in the consecutive area. When erasing is not executed, erasing is
executed before writing.
128-byte programming is performed in one program processing. When more than 128-byte
programming is performed, programming destination address/program data parameter is updated
in 128-byte units and programming is repeated.
When less than 128-byte programming is performed, data must total 128 bytes by adding the
invalid data. If the dummy data to be added is H'FF, the program processing period can be
shortened.
1. Select the on-chip program to be downloaded and specify a download destination
When the PPVS bit of FPCS is set to 1, the programming program is selected. Several
programming/erasing programs cannot be selected at one time. If several programs are set,
download is not performed and a download error is returned to the SS bit in DPFR. The start
address of a download destination is specified by FTDAR.
2. Program H'A5 in FKEY
If H'A5 is not written to FKEY for protection, 1 cannot be written to the SCO bit for download
request.
3. 1 is written to the SCO bit of FCCS and then download is executed.
To write 1 to the SCO bit, the following conditions must be satisfied.
⎯ H'A5 is written to FKEY.
⎯ The SCO bit writing is executed in the on-chip RAM.
When the SCO bit is set to 1, download is started automatically. When the SCO bit is returned
to the user procedure program, the SCO is cleared to 0. Therefore, the SCO bit cannot be
confirmed to be 1 in the user procedure program.
The download result can be confirmed only by the return value of DPFR. Before the SCO bit
is set to 1, incorrect determination must be prevented by setting the one byte of the start
address (to be used as DPFR) specified by FTDAR to a value other than the return value
(H'FF).
When download is executed, particular interrupt processing, which is accompanied by the bank
switch as described below, is performed as an internal microcomputer processing. Four NOP
instructions are executed immediately after the instructions that set the SCO bit to 1.
⎯ The user-MAT space is switched to the on-chip program storage area.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 757 of 980
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⎯ After the selection condition of the download program and the FTDAR setting are checked,
the transfer processing to the on-chip RAM specified by FTDAR is executed.
⎯ The SCO bits in FPCS, FECS, and FCCS are cleared to 0.
⎯ The return value is set to the DPFR parameter.
⎯ After the on-chip program storage area is returned to the user-MAT space, the user
procedure program is returned.
The notes on download are as follows.
⎯ In the download processing, the values of CPU general registers other than ER0 and ER1
are retained.
⎯ In the download processing, any interrupts are not accepted. However, interrupt requests
other than the NMI are held. Therefore, when the user procedure program is returned, the
NMI interrupts occur. NMI requests are discarded if the FVACR value is H'00. However, if
H'88 has been written to FVACR, they are held and the interrupts are generated when
processing returns to the user procedure program.
⎯ The sources of the interrupt requests from the on-chip module and at the falling edge of the
IRQ are held during downloading. The refresh cycles for the DRAM can be inserted.
⎯ When the level-detection interrupt requests are to be held, interrupts must be input until the
download is ended.
⎯ When hardware standby mode is entered during download processing, the normal
download cannot be guaranteed in the on-chip RAM. Therefore, download must be
executed again.
⎯ Since a stack area of a maximum 128-byte is used, the area must be allocated before setting
the SCO bit to 1.
⎯ If a flash memory access by the DMAC, DTC, or BREQ signal is requested during
downloading, the operation cannot be guaranteed. Therefore, an access request by the
DMAC, DTC, or BREQ signal must not be generated.
4. FKEY is cleared to H'00 for protection.
5. The value of the DPFR parameter must be checked and the download result must be
confirmed.
⎯ Check the value of the DPFR parameter (one byte of start address of the download
destination specified by FTDAR). If the value is H'00, download has been performed
normally. If the value is not H'00, the source that caused download to fail can be
investigated by the description below.
⎯ If the value of the DPFR parameter is the same as before downloading (e.g. H'FF), the
address setting of the download destination in FTDAR may be abnormal. In this case,
confirm the setting of the TDER bit (bit 7) in FTDAR.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 758 of 980
REJ09B0050-0600
⎯ If the value of the DPFR parameter is different from before downloading, check the SS bit
(bit 2) and the FK bit (bit 1) in the DPFR parameter to ensure that the download program
selection and FKEY setting were normal, respectively.
6. The operating frequency and user branch destination are set to the FPEFEQ and FUBRA
parameters for initialization.
⎯ The current frequency of the CPU clock is set to the FPEFEQ parameter (general register
ER0).
The allowable setting range for the FPEFEQ parameter is 8 MHz to 34 MHz. When the
frequency is set to out of this range, an error is returned to the FPFR parameter of the
initialization program and initialization is not performed. For details on the frequency
setting, see the description in 20.3.2 (2) (a), Flash programming/erasing frequency
parameter (FPEFEQ: general register ER0 of CPU).
⎯ Set the user branch destination address as the FUBRA parameter (general register ER1)
and the user branch enable bits (FUBE15 to FUBE0) as the FPEFEQ parameter (general
register ER0). Set FUBRA and FUBE15 to FUBE0 to 0 if the user branch function is not
required.
Do use programmable user MAT as the user branch destination. Also, do not use an area
containing a downloaded internal program as the user branch destination. After user branch
processing completes, use the RTS instruction to return to programming processing.
For details, see the descriptions in 21.3.2 (2) (a), Flash programming/erasing frequency
parameter (FPEFEQ: general register ER0 of CPU), and 21.3.2 (2) (b), Flash user branch
address setting parameter (FUBRA: general register ER1 of CPU).
7. Initialization
When a programming program is downloaded, the initialization program is also downloaded to
the on-chip RAM. There is an entry point of the initialization program in the area from the
start address specified by FTDAR + 32 bytes of the on-chip RAM. The subroutine is called
and initialization is executed by using the following steps.
MOV.L DLTOP+32,ER2; Set entry address to ER2
JSR @ER2; Call initialization routine
NOP
⎯ The general registers other than ER0, ER1 are held in the initialization program.
⎯ R0L is a return value of the FPFR parameter.
⎯ Since the stack area is used in the initialization program, a stack area of a maximum 128
bytes must be allocated in RAM.
⎯ Interrupts can be accepted during the execution of the initialization program. The program
storage area and stack area in the on-chip RAM and register values must not be destroyed.
8. The return value in the initialization program, FPFR (general register R0L) is determined.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 759 of 980
REJ09B0050-0600
9. All interrupts and the use of a bus master other than the CPU are prohibited.
The specified voltage is applied for the specified time when programming or erasing. If
interrupts occur or the bus mastership is moved to other than the CPU during this time, the
voltage for more than the specified time will be applied and flash memory may be damaged.
Therefore, interrupts, movement of bus mastership to other than the CPU (DMAC, DTC, or
1set to B'1 in interrupt control mode 0 or bits 2 to 0 (I2 to I0) in the extend control register of
the CPU should be set to B'111 in interrupt control mode 2. Then interrupts other than NMI are
held and are not executed.
The NMI interrupts must be masked within the user system.
The interrupts that are held must be executed after all program processing.
When the bus mastership is moved to other than the CPU by the DMAC, DTC, or BREQ
signal or DRAM refresh cycles are entered, the error protection state is entered. Therefore,
taking bus mastership by the DMAC, DTC, or BREQ signal is prohibited.
10. FKEY must be set to H'5A and the user MAT must be prepared for programming.
11. The parameter which is required for programming is set.
The start address of the programming destination of the user MAT (FMPAR) is set to general
register ER1. The start address of the program data area (FMPDR) is set to general register
ER0.
⎯ Example of the FMPAR setting
FMPAR specifies the programming destination address. When an address other than one in
the user MAT area is specified, even if the programming program is executed,
programming is not executed and an error is returned to the return value parameter FPFR.
Since the unit is 128 bytes, the lower eight bits (A7 to A0) must be H'00 or H'80 as the
boundary of 128 bytes.
⎯ Example of the FMPDR setting
When the storage destination of the program data is flash memory, even if the program
execution routine is executed, programming is not executed and an error is returned to the
FPFR parameter. In this case, the program data must be transferred to the on-chip RAM
and then programming must be executed.
12. Programming
There is an entry point of the programming program in the area from the start address specified
by FTDAR + 16 bytes of the on-chip RAM. The subroutine is called and programming is
executed by using the following steps.
MOV.L #DLTOP+16,ER2; Set entry address to ER2
JSR @ER2; Call programming routine
NOP
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 760 of 980
REJ09B0050-0600
⎯ The general registers other than ER0, ER1 are held in the programming program.
⎯ R0L is a return value of the FPFR parameter.
⎯ Since the stack area is used in the programming program, a stack area of a maximum 128
bytes must be allocated in RAM
13. The return value in the programming program, FPFR (general register R0L) is determined.
14. Determine whether programming of the necessary data has finished.
If more than 128 bytes of data are to be programmed, specify FMPAR and FMPDR in 128-
byte units, and repeat steps 12 to 14. Increment the programming destination address by 128
bytes and update the programming data pointer correctly. If an address which has already been
programmed is written to again, not only will a programming error occur, but also flash
memory will be damaged.
15. Execution of Programming Finished Processing
The entry point of the programming library is in the area beginning at the download
destination start address specified by FTDAR plus 16 bytes. Subroutine calls should therefore
be performed as follows.
MOV.L #H'F0F0F0F0,ER0;
MOV.L #H'0F0F0F0F,ER1;
MOV.L #DLTOP+16,ER2; Set entry address to ER2
JSR @ER2; Call programming finished routine
⎯ Data is stored in a general register other than ER0, ER1 by the programming finished
program.
⎯ R0L is the return value of the FPFR parameter.
⎯ The programming finished program uses the stack area, so a maximum 128-byte stack area
should be reserved in RAM beforehand.
⎯ Only perform programming finished processing once per block. Even if multiple 128-byte
programming operations have been performed to the same block, programming finished
processing should only be carried out once. (Due not perform programming finished
processing multiple times.) If it is necessary to reprogram blocks within a previously
programmed area on which programming finished processing has been performed, first
erase the blocks in question and then reprogram them.
⎯ Programming finished processing should be performed on all blocks containing areas that
have been programmed after initialization processing. For example, if programming
finished processing is to be carried out once after programming blocks EB1 to EB3,
programming finished processing should be performed individually on EB1, EB2, and
EB3.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 761 of 980
REJ09B0050-0600
⎯ Programming finished processing should be poerformed immediately after programming of
the necessary data has completed. Caution is necessary because if an operation such as
initialization processing, internal program downloading, rewriting an area of RAM that is a
download destination, or MAT switching is performed before programming finished
processing, programming will not take place correctly.
:
EB9
EB10
EB11
EB12
:
Before reprogramming erased blocks containing a programming
finished area (EB10 and EB11), the corresponding erased
blocks (EB10 and EB11) should be erased.
Programming finished area
16. Determine the FPFR (general-purpose register R0L) value returned by the programming
program.
17. After programming finishes, clear FKEY and specify software protection.
If this LSI is restarted by a power-on reset immediately after user MAT programming has
finished, secure a reset period (period of RES = 0) that is at least as long as normal 100 μs.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 762 of 980
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(3) Erasing Procedure in User Program Mode
The procedures for download, initialization, and erasing are shown in figure 20.12.
Set FKEY to H'A5
Set SCO to 1 and
execute download
DPFR = 0?
Yes
No
Download error processing
Set the FPEFEQ, FUBRA
parameters
Yes
End erasing
procedure program
FPFR = 0 ?
No
Initialization error processing
Disable interrupts and
bus master operation
other than CPU
Clear FKEY to 0
Set FEBS parameter
Yes
FPFR = 0?
No
Clear FKEY and erasing
error processing
Yes
Required block
erasing is
completed?
No
Set FKEY to H'5A
Clear FKEY to 0
1.
2.
3.
4.
5.
6.
a
a
Download
Initialization
Erasing
Initialization
JSR FTDAR setting
+ 32
Erasing
JSR
FTDAR setting
+ 16
Select on-chip program
to be downloaded and
specify download
destination by FTDAR
Start erasing procedure
program
Figure 20.12 Erasing Procedure
The procedure program must be executed in an area other than the user MAT to be erased.
Especially the part where the SCO bit in FCCS is set to 1 for downloading must be executed in the
on-chip RAM.
The area that can be executed in the steps of the user procedure program (on-chip RAM, user
MAT, and external space) is shown in section 20.4.4, Procedure Program and Storable Area for
Programming Data.
For the downloaded on-chip program area, refer to figure 20.10.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 763 of 980
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A single divided block is erased by one erasing processing. For block divisions, refer to figure
20.4. To erase two or more blocks, update the erase block number and perform the erasing
processing for each block.
1. Select the on-chip program to be downloaded
Set the EPVB bit in FECS to 1.
Several programming/erasing programs cannot be selected at one time. If several programs are
set, download is not performed and a download error is reported to the SS bit in the DPFR
parameter.
Specify the start address of a download destination by FTDAR.
The procedures to be carried out after setting FKEY, e.g. download and initialization, are the
same as those in the programming procedure. For details, refer to Programming Procedure in
User Program Mode in section 20.4.2 (2) Programming Procedure in User Program Mode.
The procedures after setting parameters for erasing programs are as follows:
2. Set the FEBS parameter necessary for erasure
Set the erase block number of the user MAT in the flash erase block select parameter FEBS
(general register ER0). If a value other than an erase block number of the user MAT is set, no
block is erased even though the erasing program is executed, and an error is returned to the
return value parameter FPFR.
3. Erasure
Similar to as in programming, there is an entry point of the erasing program in the area from
the start address of a download destination specified by FTDAR + 16 bytes of on-chip RAM.
The subroutine is called and erasing is executed by using the following steps.
MOV.L #DLTOP+16,ER2; Set entry address to ER2
JSR @ER2; Call erasing routine
NOP
• The general registers other than ER0, ER1 are held in the erasing program.
• R0L is a return value of the FPFR parameter.
• Since the stack area is used in the erasing program, a stack area of a maximum 128 bytes
must be allocated in RAM
4. The return value in the erasing program, FPFR (general register R0L) is determined.
5. Determine whether erasure of the necessary blocks has completed.
If more than one block is to be erased, update the FEBS parameter and repeat steps 3 to 5.
Blocks that have already been erased can be erased again.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 764 of 980
REJ09B0050-0600
6. After erasure completes, clear FKEY and specify software protection.
If this LSI is restarted by a power-on reset immediately after user MAT erasure has completed,
secure a reset period (period of RES = 0) that is at least as long as normal 100 μs.
20.4.3 User Boot Mode
This LSI has user boot mode which is initiated with different mode pin settings than those in user
program mode or boot mode. User boot mode is a user-arbitrary boot mode, unlike boot mode that
uses the on-chip SCI.
Only the user MAT can be programmed/erased in user boot mode. Programming/erasing of the
user boot MAT is only enabled in boot mode or programmer mode.
(1) User Boot Mode Initiation
For the mode pin settings to start up user boot mode, see table 20.5.
When the reset start is executed in user boot mode, the built-in check routine runs. The user MAT
and user boot MAT states are checked by this check routine.
While the check routine is running, NMI and all other interrupts cannot be accepted.
Next, processing starts from the execution start address of the reset vector in the user boot MAT.
At this point, H'AA is set to FMATS because the execution MAT is the user boot MAT.
(2) User MAT Programming in User Boot Mode
For programming the user MAT in user boot mode, additional processing made by setting FMATS
are required: switching from user-boot-MAT selection state to user-MAT selection state, and
switching back to user-boot-MAT selection state after programming completes.
Figure 20.13 shows the procedure for programming the user MAT in user boot mode.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 765 of 980
REJ09B0050-0600
Set FKEY to H'A5
DPFR = 0 ?
Yes
No
Download error processing
Set the FPEFEQ and
FUBRA parameters
Initialization
JSR
FTDAR setting
+ 32
Yes
End programming
procedure program
FPFR = 0 ? No
Initialization error processing
Disable interrupts
and bus master operation
other than CPU
Clear FKEY to 0
Programming finished
processing
JSR FTDAR setting + 16
Set parameter to ER0 and
ER1 (FMPAR and FMPDR)
Programming
JSR
FTDAR setting
+ 16
Yes
FPFR = 0 ? No
Yes
Required data
programming is
completed?
No
Set FKEY to H'A5
Clear FKEY to 0
1
1
Download
Initialization
Programming
MAT
switchover
MAT
switchover
Set FMATS to value other than
H'AA to select user MAT
Set SCO to 1 and
execute download
Clear FKEY and programming
error processing*
Yes
FPFR = 0 ? No
Clear FKEY and programming
error processing
Set FMATS to H'AA to
select user boot MAT
User-boot-MAT selection state
User-MAT selection state
User-boot-MAT
selection state
Note: * The MAT must be switched by FMATS
to perform the programming error
processing in the user boot MAT.
Start programming
procedure program
Select on-chip program
to be downloaded and
specify download
destination by FTDAR
Figure 20.13 Procedure for Programming User MAT in User Boot Mode
The difference between the programming procedures in user program mode and user boot mode is
whether the MAT is switched or not as shown in figure 20.13.
In user boot mode, the user boot MAT can be seen in the flash memory space with the user MAT
hidden in the background. The user MAT and user boot MAT are switched only while the user
MAT is being programmed. Because the user boot MAT is hidden while the user MAT is being
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 766 of 980
REJ09B0050-0600
programmed, the procedure program must be located in an area other than flash memory. After
programming completes, switch the MATs again to return to the first state.
MAT switching is enabled by writing a specific value to FMATS. However note that while the
MATs are being switched, the LSI is in an unstable state, e.g. access to a MAT is not allowed until
MAT switching is completed, and if an interrupt occurs, from which MAT the interrupt vector is
read is undetermined. Perform MAT switching in accordance with the description in section 20.6,
Switching between User MAT and User Boot MAT.
Except for MAT switching, the programming procedure is the same as that in user program mode.
The area that can be executed in the steps of the user procedure program (on-chip RAM, user
MAT, and external space) is shown in section 20.4.4, Procedure Program and Storable Area for
Programming Data.
(3) User MAT Erasing in User Boot Mode
For erasing the user MAT in user boot mode, additional processing made by setting FMATS are
required: switching from user-boot-MAT selection state to user-MAT selection state, and
switching back to user-boot-MAT selection state after erasing completes.
Figure 20.14 shows the procedure for erasing the user MAT in user boot mode.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 767 of 980
REJ09B0050-0600
Yes
No
Start erasing
procedure program
Set FKEY to H'A5
Yes
No
Download error processing
Set the FPEFEQ and
FUBRA parameters
End erasing
procedure program
FPFR = 0 ?
Initialization error processing
Disable interrupts
and bus master operation
other than CPU
Clear FKEY to 0
Set FEBS parameter
Yes
No
Clear FKEY and erasing
error processing*
Yes
Required
block erasing is
completed?
No
Set FKEY to H'A5
Clear FKEY to 0
1
1
Download
Initialization
Erasing
Set FMATS to value other
than H'AA to select user MAT
Set SCO to 1 and
execute download
Set FMATS to H'AA to
select user boot MAT
User-boot-MAT selection state
User-MAT selection state
User-boot-MAT
selection state
Note: * The MAT must be switched by FMATS to perform
the erasing error processing in the user boot MAT.
MAT
switchover
MAT
switchover
DPFR = 0 ?
Initialization
JSR
FTDAR setting
+ 32
Programming
JSR
FTDAR setting
+ 16
FPFR = 0 ?
Select on-chip program
to be downloaded and
specify download
destination by FTDAR
Figure 20.14 Procedure for Erasing User MAT in User Boot Mode
The difference between the erasing procedures in user program mode and user boot mode depends
on whether the MAT is switched or not as shown in figure 20.14.
MAT switching is enabled by writing a specific value to FMATS. However note that while the
MATs are being switched, the LSI is in an unstable state, e.g. access to a MAT is not allowed until
MAT switching is completed, and if an interrupt occurs, from which MAT the interrupt vector is
read is undetermined. Perform MAT switching in accordance with the description in section 20.6,
Switching between User MAT and User Boot MAT.
Except for MAT switching, the erasing procedure is the same as that in user program mode.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 768 of 980
REJ09B0050-0600
The area that can be executed in the steps of the user procedure program (on-chip RAM, user
MAT, and external space) is shown in section 20.4.4, Procedure Program and Storable Area for
Programming Data.
20.4.4 Procedure Program and Storable Area for Programming Data
In the descriptions in the previous section, the programming/erasing procedure programs and
storable areas for program data are assumed to be in the on-chip RAM. However, the program and
the data can be stored in and executed from other areas, such as part of flash memory which is not
to be programmed or erased, or somewhere in the external address space.
(1) Conditions that Apply to Programming/Erasing
1. The on-chip programming/erasing program is downloaded from the address in the on-chip
RAM specified by FTDAR, therefore, this area is not available for use.
2. The on-chip programming/erasing program will use the 128 bytes as a stack. So, make sure
that this area is secured.
3. Download by setting the SCO bit to 1 will lead to switching of the MAT. If, therefore, this
operation is used, it should be executed from the on-chip RAM.
4. The flash memory is accessible until the start of programming or erasing, that is, until the
result of downloading has been determined. When in a mode in which the external address
space is not accessible, such as single-chip mode, the required procedure programs, NMI
handling vector and NMI handler should be transferred to the on-chip RAM before
programming/erasing of the flash memory starts.
5. The flash memory is not accessible during programming/erasing operations, therefore, the
operation program is downloaded to the on-chip RAM to be executed. The NMI-handling
vector and programs such as that which activate the operation program, and NMI handler
should thus be stored in on-chip memory other than flash memory or the external address
space.
6. After programming/erasing, the flash memory should be inhibited until FKEY is cleared.
The reset state (RES = 0) must be in place for more than 100 μs when the LSI mode is changed
to reset on completion of a programming/erasing operation.
Transitions to the reset state, and hardware standby mode are inhibited during
programming/erasing. When the reset signal is accidentally input to the chip, a longer period in
the reset state than usual (100 μs) is needed before the reset signal is released.
7. Switching of the MATs by FMATS should be needed when programming/erasing of the user
boot MAT is operated in user-boot mode. The program which switches the MATs should be
executed from the on-chip RAM. See section 20.6, Switching between User MAT and User
Boot MAT. Please make sure you know which MAT is selected when switching between
them.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 769 of 980
REJ09B0050-0600
8. When the data storable area indicated by programming parameter FMPDR is within the flash
memory area, an error will occur even when the data stored is normal. Therefore, the data
should be transferred to the on-chip RAM to place the address that FMPDR indicates in an
area other than the flash memory.
In consideration of these conditions, there are three factors; operating mode, the bank structure of
the user MAT, and operations.
The areas in which the programming data can be stored for execution are shown in tables.
Table 20.7 Executable MAT
Initiated Mode
Operation User Program Mode User Boot Mode*
Programming Table 20.8 (1) Table 20.8 (3)
Erasing Table 20.8 (2) Table 20.8 (4)
Note: * Programming/Erasing is possible to user MATs.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 770 of 980
REJ09B0050-0600
Table 20.8 (1) Useable Area for Programming in User Program Mode
Storable /Executable Area Selected MAT
Item
On-chip
RAM
User
MAT
External Space
(Expanded
Mode)
User
MAT
Embedded
Program
Storage Area
Storage Area for
Program Data
×* ⎯ ⎯
Operation for
Selection of On-chip
Program to be
Downloaded
Operation for Writing
H'A5 to FKEY
Execution of Writing
SC0 = 1 to FCCS
(Download)
× ×
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for Settings
of Initial Parameter
Execution of
Initialization
× ×
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling Routine ×
Operation for Inhibit
of Interrupt
Operation for Writing
H'5A to FKEY
Operation for Settings
of Program
Parameter
×
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 771 of 980
REJ09B0050-0600
Storable /Executable Area Selected MAT
Item
On-chip
RAM
Target
Flash
Memory
External Space
(Expanded
Mode)
User
MAT
Embedded
Program
Storage Area
Execution of
Programming
× ×
Determination of
Program Result
×
Operation for
Program Error
×
Operation for FKEY
Clear
×
Note: * Transferring the data to the on-chip RAM enables this area to be used.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 772 of 980
REJ09B0050-0600
Table 20.8 (2) Useable Area for Erasure in User Program Mode
Storable /Executable Area Selected MAT
Item
On-chip
RAM
User
MAT
External Space
(Expanded
Mode)
User
MAT
Embedded
Program
Storage Area
Operation for
Selection of On-chip
Program to be
Downloaded
Operation for Writing
H'A5 to FKEY
Execution of Writing
SC0 = 1 to FCCS
(Download)
× ×
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for Settings
of Initial Parameter
Execution of
Initialization
× ×
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling Routine ×
Operation for Inhibit
of Interrupt
Operation for Writing
H'5A to FKEY
Operation for Settings
of Erasure Parameter
×
Execution of Erasure × ×
Determination of
Erasure Result
×
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 773 of 980
REJ09B0050-0600
Storable /Executable Area Selected MAT
Item
On-chip
RAM
User
MAT
External Space
(Expanded
Mode)
User
MAT
Embedded
Program
Storage Area
Operation for Erasure
Error
×
Operation for FKEY
Clear
×
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 774 of 980
REJ09B0050-0600
Table 20.8 (3) Useable Area for Programming in User Boot Mode
Storable/Executable Area Selected MAT
Item
On-chip
RAM
User
Boot
MAT
External Space
(Expanded
Mode)
User
MAT
User
Boot
MAT
Embedded
Program
Storage Area
Storage Area for
Program Data
×*1 ⎯ ⎯ ⎯
Operation for
Selection of On-chip
Program to be
Downloaded
Operation for
Writing H'A5 to
FKEY
Execution of Writing
SC0 = 1 to FCCS
(Download)
× ×
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for
Settings of Initial
Parameter
Execution of
Initialization
× ×
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling
Routine
×
Operation for
Interrupt Inhibit
Switching MATs by
FMATS
× ×
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 775 of 980
REJ09B0050-0600
Storable/Executable Area Selected MAT
Item
On-chip
RAM
User
Boot
MAT
External Space
(Expanded
Mode)
User
MAT
User
Boot
MAT
Embedded
Program
Storage Area
Operation for
Writing H'5A to
FKEY
×
Operation for
Settings of Program
Parameter
×
Execution of
Programming
× ×
Determination of
Program Result
×
Operation for
Program Error
×*2
Operation for FKEY
Clear
×
Switching MATs by
FMATS
× ×
Notes: 1. Transferring the data to the on-chip RAM enables this area to be used.
2. Switching FMATS by a program in the on-chip RAM enables this area to be used.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 776 of 980
REJ09B0050-0600
Table 20.8 (4) Useable Area for Erasure in User Boot Mode
Storable/Executable Area Selected MAT
Item
On-chip
RAM
User
Boot
MAT
External Space
(Expanded
Mode)
User
MAT
User
Boot
MAT
Embedded
Program
Storage Area
Operation for
Selection of On-chip
Program to be
Downloaded
Operation for
Writing H'A5 to
FKEY
Execution of Writing
SC0 = 1 to FCCS
(Download)
× ×
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for
Settings of Initial
Parameter
Execution of
Initialization
× ×
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling
Routine
×
Operation for
Interrupt Inhibit
Switching MATs by
FMATS
× ×
Operation for
Writing H'5A to
FKEY
×
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 777 of 980
REJ09B0050-0600
Storable/Executable Area Selected MAT
Item
On-chip
RAM
User
Boot
MAT
External Space
(Expanded
Mode)
User
MAT
User
Boot
MAT
Embedded
Program
Storage Area
Operation for
Settings of Erasure
Parameter
×
Execution of
Erasure
× ×
Determination of
Erasure Result
×
Operation for
Erasure Error
×*
Operation for FKEY
Clear
×
Switching MATs by
FMATS
× ×
Note: * Switching FMATS by a program in the on-chip RAM enables this area to be used.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 778 of 980
REJ09B0050-0600
20.5 Protection
There are two kinds of flash memory program/erase protection: hardware and software protection.
20.5.1 Hardware Protection
Programming and erasing of flash memory is forcibly disabled or suspended by hardware
protection. In this state, the downloading of a on-chip program and initialization are possible.
However, an activated program for programming or erasure cannot program or erase locations in a
user MAT, and the error in programming/erasing is reported in the parameter FPFR.
Table 20.9 Hardware Protection
Function to be Protected
Item Description Download Program/Erase
Reset/standby
protection
• The program/erase interface
registers are initialized in the power-
on reset state (including a power-on
reset by the WDT) and standby
mode and the program/erase-
protected state is entered.
• The reset state will not be entered
by a reset using the RES pin unless
the RES pin is held low until
oscillation has stabilized after power
is initially supplied. In the case of a
reset during operation, hold the RES
pin low for the RES pulse width that
is specified in the section on AC
characteristics section. If a reset is
input during programming or
erasure, data values in the flash
memory are not guaranteed. In this
case, execute erasure and then
execute program again.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 779 of 980
REJ09B0050-0600
20.5.2 Software Protection
Software protection is set up by disabling the downloading of on-chip programs for programming
and erasing or by means of a key code register.
Table 20.10 Software Protection
Function to be Protected
Item Description Download
Program/
Erase
Protection by the
SCO bit
• The program/erase-protected state
is entered by clearing the SCO bit in
FCCS which disables the down-
loading of the programming/erasing
programs.
Protection by the
FKEY register
• Downloading and
programming/erasing are disabled
unless the required key code is
written in FKEY. Different key codes
are used for downloading and for
programming/erasing.
20.5.3 Error Protection
Error protection is a mechanism for aborting programming or erasure when an error occurs, in the
form of the microcomputer entering runaway during programming/erasing of the flash memory or
operations that are not according to the established procedures for programming/erasing. Aborting
programming or erasure in such cases prevents damage to the flash memory due to excessive
programming or erasing.
If the microcomputer malfunctions during programming/erasing of the flash memory, the FLER
bit in the FCCS register is set to 1 and the error-protection state is entered, and this aborts the
programming or erasure.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 780 of 980
REJ09B0050-0600
The FLER bit is set in the following conditions:
1. When an interrupt such as NMI occurs during programming/erasing.
2. When the flash memory is read during programming/erasing (including a vector read or an
instruction fetch).
3. When a SLEEP instruction (including software-standby mode) is executed during
programming/erasing.
4. When a bus master other than the CPU such as the DMAC or DTC gets bus mastership during
programming/erasing.
Error protection is cancelled only by a power-on reset or by hardware-standby mode. Note that the
reset should only be released after providing a reset input over a period longer than the normal 100
μs period. Since high voltages are applied during programming/erasing of the flash memory, some
voltage may remain after the error-protection state has been entered. For this reason, it is
necessary to reduce the risk of damage to the flash memory by extending the reset period so that
the charge is released.
The state-transition diagram in figure 20.15 shows transitions to and from the error-protection
state.
Reset or standby
(Hardware protection)
Program mode
Erase mode
Error protection mode
Error-protection mode
(Software standby)
Read disabled
Programming/erasing
enabled
FLER = 0
Read disabled
Programming/erasing disabled
FLER = 0
Read enabled
Programming/erasing disabled
FLER = 1
Read disabled
programming/erasing disabled
FLER = 1
RES = 0 or STBY = 0
Error occurrence
Error occurred
(Software standby)
RES = 0 or
STBY = 0
Software-standby mode
Cancel
software-standby mode
RES = 0 or
STBY = 0
Program/erase interface
register is in its initial state.
Program/erase interface
register is in its initial state.
Figure 20.15 Transitions to Error-Protection State
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 781 of 980
REJ09B0050-0600
20.6 Switching between User MAT and User Boot MAT
It is possible to alternate between the user MAT and user boot MAT. However, the following
procedure is required because these MATs are allocated to address 0.
(Switching to the user boot MAT disables programming and erasing. Programming of the user
boot MAT should take place in boot mode or PROM mode.)
1. MAT switching by FMATS should always be executed from the on-chip RAM.
2. To ensure that the MAT that has been switched to is accessible, execute four NOP instructions
in the on-chip RAM immediately after writing to FMATS of the on-chip RAM (this prevents
access to the flash memory during MAT switching).
3. If an interrupt has occurred during switching, there is no guarantee of which memory MAT is
being accessed. Always mask the maskable interrupts before switching between MATs. In
addition, configure the system so that NMI interrupts do not occur during MAT switching.
4. After the MATs have been switched, take care because the interrupt vector table will also have
been switched. If interrupt processing is to be the same before and after MAT switching,
transfer the interrupt-processing routines to the on-chip RAM, and use the settings of FVACR
to place the interrupt-vector table in the on-chip RAM .
5. Memory sizes of the user MAT and user boot MAT are different. When accessing the user
boot MAT, do not access addresses above the top of its 8-kbyte memory space. If access goes
beyond the 8-kbyte space, the values read are undefined.
<
User MAT
><
On-chip RAM
><
User boot MAT
>
Procedure for
switching to the
user boot MAT
Procedure for
switching to
the user MAT
Procedure for switching to the user boot MAT
(1) Mask interrupts
(2) Write H'AA to FMATS.
(3) Execute four NOP instructions before
accessing the user boot MAT.
Procedure for switching to the user MAT
(1) Mask interrupts
(2) Write a value other than H'AA to FMATS.
(3) Execute four NOP instructions before accessing
the user MAT.
Figure 20.16 Switching between the User MAT and User Boot MAT
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 782 of 980
REJ09B0050-0600
20.7 Programmer Mode
Along with its on-board programming mode, this LSI also has a PROM mode as a further mode
for the writing and erasing of programs and data. In the PROM mode, a general-purpose PROM
programmer can freely be used to write programs to the on-chip ROM. Program/erase is possible
on the user MAT and user boot MAT. The PROM programmer must support Renesas
microcomputers with 512-kbyte flash memory as a device type.
A status-polling system is adopted for operation in automatic program, automatic erase, and
status-read modes. In the status-read mode, details of the system’s internal signals are output after
execution of automatic programming or automatic erasure. In the PROM mode, provide a 12-MHz
input-clock signal.
20.8 Serial Communication Interface Specification for Boot Mode
Initiating boot mode enables the boot program to communicate with the host by using the internal
SCI. The serial communication interface specification is shown below.
(1) Status
The boot program has three states.
1. Bit-Rate-Adjustment State
In this state, the boot program adjusts the bit rate to communicate with the host. Initiating boot
mode enables starting of the boot program and entry to the bit-rate-adjustment state. The
program receives the command from the host to adjust the bit rate. After adjusting the bit rate,
the program enters the inquiry/selection state.
2. Inquiry/Selection State
In this state, the boot program responds to inquiry commands from the host. The device name,
clock mode, and bit rate are selected. After selection of these settings, the program is made to
enter the programming/erasing state by the command for a transition to the
programming/erasing state. The program transfers the libraries required for erasure to the
RAM and erases the user MATs and user boot MATs before the transition.
3. Programming/erasing state
Programming and erasure by the boot program take place in this state. The boot program is
made to transfer the programming/erasing programs to the RAM by commands from the host.
Sum checks and blank checks are executed by sending these commands from the host.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 783 of 980
REJ09B0050-0600
These boot program states are shown in figure 20.17.
Transition to
programming/erasing
Programming/erasing
wait
Checking
Inquiry
Response
ErasingProgramming
Reset
Bit-rate-adjustment
state
Operations for erasing
user MATs and user
boot MATs
Operations for
inquiry and selection
Operations for
programming Operations for
checking
Operations for
erasing
Operations for
response
Inquiry/response
wait
Figure 20.17 Boot Program States
(2) Bit-Rate-Adjustment State
The bit rate is calculated by measuring the period of transfer of a low-level byte (H'00) from the
host. The bit rate can be changed by the command for a new bit rate selection. After the bit rate
has been adjusted, the boot program enters the inquiry and selection state. The bit-rate-adjustment
sequence is shown in figure 20.18.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 784 of 980
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Host Boot Program
H'00 (30 times maximum)
H'E6 (Boot response)
Measuring the
1-bit length
H'00 (Completion of adjustment)
H'55
H'FF (error)
Figure 20.18 Bit-Rate-Adjustment Sequence
(3) Communications Protocol
After adjustment of the bit rate, the protocol for communications between the host and the boot
program is as shown below.
1. One-byte commands and one-byte responses
These commands and responses are comprised of a single byte. These are consists of the
inquiries and the ACK for successful completion.
2. n-byte commands or n-byte responses
These commands and responses are comprised of n bytes of data. These are selections and
responses to inquiries.
The amount of programming data is not included under this heading because it is determined
in another command.
3. Error response
The error response is a response to inquiries. It consists of an error response and an error code
and comes two bytes.
4. Programming of 128 bytes
The size is not specified in commands. The size of n is indicated in response to the
programming unit inquiry.
5. Memory read response
This response consists of 4 bytes of data.
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Command or response
Size
Data
Checksum
Error response
Error code
Command or response
Error response
n-byte Command or
n-byte response
One-byte command
or one-byte response
Address
Command
Data (n bytes)
Checksum
128-byte programming
Size
Response
Data
Checksum
Memory read
response
Figure 20.19 Communication Protocol Format
• Command (one byte): Commands including inquiries, selection, programming, erasing, and
checking
• Response (one byte): Response to an inquiry
• Size (one byte): The amount of data for transmission excluding the command, amount of data,
and checksum
• Checksum (one byte): The checksum is calculated so that the total of all values from the
command byte to the SUM byte becomes H'00.
• Data (n bytes): Detailed data of a command or response
• Error response (one byte): Error response to a command
• Error code (one byte): Type of the error
• Address (four bytes): Address for programming
• Data (n bytes): Data to be programmed (the size is indicated in the response to the
programming unit inquiry.)
• Size (four bytes): Four-byte response to a memory read
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(4) Inquiry and Selection States
The boot program returns information from the flash memory in response to the host’s inquiry
commands and sets the device code, clock mode, and bit rate in response to the host’s selection
command.
Inquiry and selection commands are listed below.
Table 20.11 Inquiry and Selection Commands
Command Command Name Description
H'20 Supported Device Inquiry Inquiry regarding device codes
H'10 Device Selection Selection of device code
H'21 Clock Mode Inquiry Inquiry regarding numbers of clock modes and
values of each mode
H'11 Clock Mode Selection Indication of the selected clock mode
H'22 Multiplication Ratio Inquiry Inquiry regarding the number of frequency-
multiplied clock types, the number of
multiplication ratios, and the values of each
multiple
H'23 Operating Clock Frequency
Inquiry
Inquiry regarding the maximum and minimum
values of the main clock and peripheral clocks
H'24 User Boot MAT Information
Inquiry
Inquiry regarding the number of user boot
MATs and the start and last addresses of each
MAT
H'25 User MAT Information Inquiry Inquiry regarding the a number of user MATs
and the start and last addresses of each MAT
H'26 Block for Erasing Information
Inquiry
Inquiry regarding the number of blocks and the
start and last addresses of each block
H'27 Programming Unit Inquiry Inquiry regarding the unit of programming data
H'3F New Bit Rate Selection Selection of new bit rate
H'40 Transition to
Programming/Erasing State
Erasing of user MAT and user boot MAT, and
entry to programming/erasing state
H'4F Boot Program Status Inquiry Inquiry into the operated status of the boot
program
The selection commands, which are device selection (H'10), clock mode selection (H'11), and new
bit rate selection (H'3F), should be sent from the host in that order. These commands will certainly
be needed. When two or more selection commands are sent at once, the last command will be
valid.
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All of these commands, except for the boot program status inquiry command (H'4F), will be valid
until the boot program receives the programming/erasing transition (H'40). The host can choose
the needed commands out of the commands and inquiries listed above. The boot program status
inquiry command (H'4F) is valid after the boot program has received the programming/erasing
transition command (H'40).
(a) Supported Device Inquiry
The boot program will return the device codes of supported devices and the product code in
response to the supported device inquiry.
Command H'20
• Command, H'20, (one byte): Inquiry regarding supported devices
Response H'30 Size Number of devices
Number of
characters
Device code
Product name
···
SUM
• Response, H'30, (one byte): Response to the supported device inquiry
• Size (one byte): Number of bytes to be transmitted, excluding the command, size, and
checksum, that is, the amount of data contributes by the number of devices, characters, device
codes and product names
• Number of devices (one byte): The number of device types supported by the boot program
• Number of characters (one byte): The number of characters in the device codes and boot
program’s name
• Device code (four bytes): ASCII code of the supporting product
• Product name (n bytes): Type name of the boot program in ASCII-coded characters
• SUM (one byte): Checksum
The checksum is calculated so that the total number of all values from the command byte to
the SUM byte becomes H'00.
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(b) Device Selection
The boot program will set the supported device to the specified device code. The program will
return the selected device code in response to the inquiry after this setting has been made.
Command H'10 Size Device code SUM
• Command, H'10, (one byte): Device selection
• Size (one byte): Amount of device-code data
This is fixed at 4
• Device code (four bytes): Device code (ASCII code) returned in response to the supported
device inquiry
• SUM (one byte): Checksum
Response H'06
• Response, H'06, (one byte): Response to the device selection command
ACK will be returned when the device code matches.
Error response H'90 ERROR
• Error response, H'90, (one byte): Error response to the device selection command
ERROR : (one byte): Error code
H'11: Sum check error
H'21: Device code error, that is, the device code does not match
(c) Clock Mode Inquiry
The boot program will return the supported clock modes in response to the clock mode inquiry.
Command H'21
• Command, H'21, (one byte): Inquiry regarding clock mode
Response H'31 Size Number of modes Mode ··· SUM
• Response, H'31, (one byte): Response to the clock-mode inquiry
• Size (one byte): Amount of data that represents the number of modes and modes
• Number of clock modes (one byte): The number of supported clock modes
H'00 indicates no clock mode or the device allows to read the clock mode.
• Mode (one byte): Values of the supported clock modes (i.e. H'01 means clock mode 1.)
• SUM (one byte): Checksum
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(d) Clock Mode Selection
The boot program will set the specified clock mode. The program will return the selected clock-
mode information after this setting has been made.
The clock-mode selection command should be sent after the device-selection commands.
Command H'11 Size Mode SUM
• Command, H'11, (one byte): Selection of clock mode
• Size (one byte): Amount of data that represents the modes
• Mode (one byte): A clock mode returned in reply to the supported clock mode inquiry.
• SUM (one byte): Checksum
Response H'06
• Response, H'06, (one byte): Response to the clock mode selection command
ACK will be returned when the clock mode matches.
Error Response H'91 ERROR
• Error response, H'91, (one byte) : Error response to the clock mode selection command
• ERROR, (one byte): Error code
H'11: Checksum error
H'22: Clock mode error, that is, the clock mode does not match.
Even if the clock mode numbers are H'00 and H'01 by a clock mode inquiry, the clock mode must
be selected using these respective values.
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(e) Multiplication Ratio Inquiry
The boot program will return the supported multiplication and division ratios.
Command H'22
• Command, H'22, (one byte): Inquiry regarding multiplication ratio
Response H'32 Size Number
of types
Number of
multiplication ratios
Multiplica-
tion ratio
···
···
SUM
• Response, H'32, (one byte): Response to the multiplication ratio inquiry
• Size (one byte): The amount of data that represents the number of clock sources and
multiplication ratios and the multiplication ratios
• Number of types (one byte): The number of supported multiplied clock types
(e.g. when there are two multiplied clock types, which are the main and peripheral clocks, the
number of types will be H'02.)
• Number of multiplication ratios (one byte): The number of multiplication ratios for each type
(e.g. the number of multiplication ratios to which the main clock can be set and the peripheral
clock can be set.)
• Multiplication ratio (one byte)
Multiplication ratio: The value of the multiplication ratio (e.g. when the clock-frequency
multiplier is four, the value of multiplication ratio will be H'04.)
Division ratio: Not supported by the H8S/2368F 0.18 μm F-ZTAT Group.
The number of multiplication ratios returned is the same as the number of multiplication ratios
and as many groups of data are returned as there are types.
• SUM (one byte): Checksum
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(f) Operating Clock Frequency Inquiry
The boot program will return the number of operating clock frequencies, and the maximum and
minimum values.
Command H'23
• Command, H'23, (one byte): Inquiry regarding operating clock frequencies
Response H'33 Size Number of operating
clock frequencies
Minimum value of
operating clock
frequency
Maximum value of operating clock
frequency
···
SUM
• Response, H'33, (one byte): Response to operating clock frequency inquiry
• Size (one byte): The number of bytes that represents the minimum values, maximum values,
and the number of frequencies.
• Number of operating clock frequencies (one byte): The number of supported operating clock
frequency types
(e.g. when there are two operating clock frequency types, which are the main and peripheral
clocks, the number of types will be H'02.)
• Minimum value of operating clock frequency (two bytes): The minimum value of the
multiplied or divided clock frequency.
The minimum and maximum values represent the values in MHz, valid to the hundredths place
of MHz, and multiplied by 100. (e.g. when the value is 64 MHz, it will be D'6400 and H'1900.)
• Maximum value (two bytes): Maximum value among the multiplied or divided clock
frequencies.
There are as many pairs of minimum and maximum values as there are operating clock
frequencies.
• SUM (one byte): Checksum
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(g) User Boot MAT Information Inquiry
The boot program will return the number of user boot MATs and their addresses.
Command H'24
• Command, H'24, (one byte): Inquiry regarding user boot MAT information
Response H'34 Size Number of areas
Area-start address Area-last address
···
SUM
• Response, H'34, (one byte): Response to user boot MAT information inquiry
• Size (one byte): The number of bytes that represents the number of areas, area-start addresses,
and area-last address
• Number of Areas (one byte): The number of consecutive user boot MAT areas
When user boot MAT areas are consecutive, the number of areas returned is H'01.
• Area-start address (four byte): Start address of the area
• Area-last address (four byte): Last address of the area
There are as many groups of data representing the start and last addresses as there are areas.
• SUM (one byte): Checksum
(h) User MAT Information Inquiry
The boot program will return the number of user MATs and their addresses.
Command H'25
• Command, H'25, (one byte): Inquiry regarding user MAT information
Response H'35 Size Number of areas
Start address area Last address area
···
SUM
• Response, H'35, (one byte): Response to the user MAT information inquiry
• Size (one byte): The number of bytes that represents the number of areas, area-start address
and area-last address
• Number of areas (one byte): The number of consecutive user MAT areas
When the user MAT areas are consecutive, the number of areas is H'01.
• Area-start address (four byte): Start address of the area
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• Area-last address (four byte): Last address of the area
There are as many groups of data representing the start and last addresses as there are areas.
• SUM (one byte): Checksum
(i) Erased Block Information Inquiry
The boot program will return the number of erased blocks and their addresses.
Command H'26
• Command, H'26, (two bytes): Inquiry regarding erased block information
Response H'36 Size Number of blocks
Block start address Block last address
···
SUM
• Response, H'36, (one byte): Response to the number of erased blocks and addresses
• Size (three byte): The number of bytes that represents the number of blocks, block-start
addresses, and block-last addresses.
• Number of blocks (one byte): The number of erased blocks
• Block start address (four bytes): Start address of a block
• Block last Address (four bytes): Last address of a block
There are as many groups of data representing the start and last addresses as there are areas.
• SUM (one byte): Checksum
(j) Programming Unit Inquiry
The boot program will return the programming unit used to program data.
Command H'27
• Command, H'27, (one byte): Inquiry regarding programming unit
Response H'37 Size Programming unit SUM
• Response, H'37, (one byte): Response to programming unit inquiry
• Size (one byte): The number of bytes that indicate the programming unit, which is fixed to 2
• Programming unit (two bytes): A unit for programming
This is the unit for reception of programming.
• SUM (one byte): Checksum
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(k) New Bit-Rate Selection
The boot program will set a new bit rate and return the new bit rate.
This selection should be sent after sending the clock mode selection command.
Command H'3F Size Bit rate Input frequency
Number of
multiplication ratios
Multiplication
ratio 1
Multiplication
ratio 2
SUM
• Command, H'3F, (one byte): Selection of new bit rate
• Size (one byte): The number of bytes that represents the bit rate, input frequency, number of
multiplication ratios, and multiplication ratio
• Bit rate (two bytes): New bit rate
One hundredth of the value (e.g. when the value is 19,200 bps, the bit rate is H'00C0, which is
D'192.)
• Input frequency (two bytes): Frequency of the clock input to the boot program
This is valid to the hundredths place and represents the value in MHz multiplied by 100. (e.g.
when the value is 64 MHz, the input frequency is H'1900 (= D'6400).)
• Number of multiplication ratios (one byte): The number of multiplication ratios to which the
device can be set.
• Multiplication ratio 1 (one byte) : The value of multiplication or division ratios for the main
operating frequency
Multiplication ratio (one byte): The value of the multiplication ratio (e.g. when the clock
frequency is multiplied by four, the multiplication ratio will be H'04.)
Division ratio: The inverse of the division ratio, as a negative number (e.g. when the clock
frequency is divided by two, the value of division ratio will be H'FE. H'FE = D'-2)
• Multiplication ratio 2 (one byte): The value of multiplication or division ratios for the
peripheral frequency
Multiplication ratio (one byte): The value of the multiplication ratio (e.g. when the clock
frequency is multiplied by four, the multiplication ratio will be H'04.)
(Division ratio: The inverse of the division ratio, as a negative number (E.g. when the clock is
divided by two, the value of division ratio will be H'FE. H'FE = D'-2)
• SUM (one byte): Checksum
Response H'06
• Response, H'06, (one byte): Response to selection of a new bit rate
When it is possible to set the bit rate, the response will be ACK.
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Error Response H'BF ERROR
• Error response, H'BF, (one byte): Error response to selection of new bit rate
• ERROR: (one byte): Error code
H'11: Sum checking error
H'24: Bit-rate selection error
The rate is not available.
H'25: Error in input frequency
This input frequency is not within the specified range.
H'26: Multiplication-ratio error
The ratio does not match an available ratio.
H'27: Operating frequency error
The frequency is not within the specified range.
(5) Received Data Check
The methods for checking of received data are listed below.
1. Input frequency
The received value of the input frequency is checked to ensure that it is within the range of
minimum to maximum frequencies which matches the clock modes of the specified device. When
the value is out of this range, an input-frequency error is generated.
2. Multiplication ratio
The received value of the multiplication ratio or division ratio is checked to ensure that it matches
the clock modes of the specified device. When the value is out of this range, an input-frequency
error is generated.
3. Operating frequency error
Operating frequency is calculated from the received value of the input frequency and the
multiplication or division ratio. The input frequency is input to the LSI and the LSI is operated at
the operating frequency. The expression is given below.
Operating frequency = Input frequency × Multiplication ratio, or
Operating frequency = Input frequency ÷ Division ratio
The calculated operating frequency should be checked to ensure that it is within the range of
minimum to maximum frequencies which are available with the clock modes of the specified
device. When it is out of this range, an operating frequency error is generated.
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4. Bit rate
To facilitate error checking, the value (n) of clock select (CKS) in the serial mode register (SMR),
and the value(N) in the bit rate register (BRR), which are found from the peripheral operating
clock frequency (φ) and bit rate (B), are used to calculate the error rate to ensure that it is less than
4%. If the error is more than 4%, a bit rate error is generated. The error is calculated using the
following expression:
Error (%) = {[ ] − 1} × 100
(N + 1) × B × 64 × 2
(2×n − 1)
φ × 10
6
When the new bit rate is selectable, the rate will be set in the register after sending ACK in
response. The host will send an ACK with the new bit rate for confirmation and the boot program
will response with that rate.
Confirmation H'06
• Confirmation, H'06, (one byte): Confirmation of a new bit rate
Response H'06
• Response, H'06, (one byte): Response to confirmation of a new bit rate
The sequence of new bit-rate selection is shown in figure 20.20.
Host Boot program
Setting a new bit rate
H'06 (ACK)
Waiting for one-bit period
at the specified bit rate
H'06 (ACK) with the new bit rate
H'06 (ACK) with the new bit rate
Setting a new bit rate Setting a new bit rate
Figure 20.20 New Bit-Rate Selection Sequence
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(6) Transition to Programming/Erasing State
The boot program will transfer the erasing program, and erase the user MATs and user boot MATs
in that order. On completion of this erasure, ACK will be returned and will enter the
programming/erasing state.
The host should select the device code, clock mode, and new bit rate with device selection, clock-
mode selection, and new bit-rate selection commands, and then send the command for the
transition to programming/erasing state. These procedure should be carried out before sending of
the programming selection command or program data.
Command H'40
• Command, H'40, (one byte): Transition to programming/erasing state
Response H'06
• Response, H'06, (one byte): Response to transition to programming/erasing state
The boot program will send ACK when the user MAT and user boot MAT have been erased
by the transferred erasing program.
Error Response H'C0 H'51
• Error response, H'C0, (one byte): Error response for user boot MAT blank check
• Error code, H'51, (one byte): Erasing error
An error occurred and erasure was not completed.
(7) Command Error
A command error will occur when a command is undefined, the order of commands is incorrect,
or a command is unacceptable. Issuing a clock-mode selection command before a device selection
or an inquiry command after the transition to programming/erasing state command, are examples.
Error Response H'80 H'xx
• Error response, H'80, (one byte): Command error
• Command, H'xx, (one byte): Received command
(8) Command Order
The order for commands in the inquiry selection state is shown below.
1. A supported device inquiry (H'20) should be made to inquire about the supported devices.
2. The device should be selected from among those described by the returned information and set
with a device-selection (H'10) command.
3. A clock-mode inquiry (H'21) should be made to inquire about the supported clock modes.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
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4. The clock mode should be selected from among those described by the returned information
and set.
5. After selection of the device and clock mode, inquiries for other required information should
be made, such as the multiplication-ratio inquiry (H'22) or operating frequency inquiry (H'23),
which are needed for a new bit-rate selection.
6. A new bit rate should be selected with the new bit-rate selection (H'3F) command, according
to the returned information on multiplication ratios and operating frequencies.
7. After selection of the device and clock mode, the information of the user boot MAT and user
MAT should be made to inquire about the user boot MATs information inquiry (H'24), user
MATs information inquiry (H'25), erased block information inquiry (H'26), and programming
unit inquiry (H'27).
8. After making inquiries and selecting a new bit rate, issue the transition to
programming/erasing state command (H'40). The boot program will then enter the
programming/erasing state.
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(9) Programming/Erasing State
A programming selection command makes the boot program select the programming method, an
128-byte programming command makes it program the memory with data, and an erasing
selection command and block erasing command make it erase the block. The
programming/erasing commands are listed below.
Table 20.12 Programming/Erasing Command
Command Command Name Description
H'42 User boot MAT programming
selection
Transfers the user boot MAT programming
program
H'43 User MAT programming selection Transfers the user MAT programming
program
H'50 128-byte programming Programs 128 bytes of data
H'48 Erasing selection Transfers the erasing program
H'58 Block erasing Erases a block of data
H'52 Memory read Reads the contents of memory
H'4A User boot MAT sum check Checks the checksum of the user boot MAT
H'4B User MAT sum check Checks the checksum of the user MAT
H'4C User boot MAT blank check Checks the blank data of the user boot MAT
H'4D User MAT blank check Checks the blank data of the user MAT
H'4C User boot MAT blank check Checks whether the contents of the user
boot MAT are blank
H'4D User MAT blank check Checks whether the contents of the user
MAT are blank
H'4F Boot program status inquiry Inquires into the boot program’s status
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• Programming
Programming is executed by a programming-selection command and an 128-byte programming
command.
Firstly, the host should send the programming-selection command and select the programming
method and programming MATs. There are two programming selection commands, and selection
is according to the area and method for programming.
1. User boot MAT programming selection
2. User MAT programming selection
After issuing the programming selection command, the host should send the 128-byte
programming command. The 128-byte programming command that follows the selection
command represents the data programmed according to the method specified by the selection
command. When more than 128-byte data is programmed, 128-byte commands should repeatedly
be executed. Sending an 128-byte programming command with H'FFFFFFFF as the address will
stop the programming. On completion of programming, the boot program will wait for selection of
programming or erasing.
Where the sequence of programming operations that is executed includes programming with
another method or of another MAT, the procedure must be repeated from the programming
selection command.
The sequence for programming-selection and 128-byte programming commands is shown in
figure 20.21.
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Transfer of the
programming
program
Host Boot program
Programming selection (H'42, H'43)
ACK
Programming
128-byte programming (address, data)
ACK
128-byte programming (H'FFFFFFFF)
ACK
Repeat
Figure 20.21 Programming Sequence
(a) User boot MAT programming selection
The boot program will transfer a programming program. The data is programmed to the user boot
MATs by the transferred programming program.
Command H'42
• Command, H'42, (one byte): User boot-program programming selection
Response H'06
• Response, H'06, (one byte): Response to user boot-program programming selection
When the programming program has been transferred, the boot program will return ACK.
Error Response H'C2 ERROR
• Error response : H'C2 (1 byte): Error response to user boot MAT programming selection
• ERROR : (1 byte): Error code
H'54 : Selection processing error (transfer error occurs and processing is not completed)
• User-program programming selection
The boot program will transfer a program for programming. The data is programmed to the user
MATs by the transferred program for programming.
Command H'43
• Command, H'43, (one byte): User-program programming selection
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Response H'06
• Response, H'06, (one byte): Response to user-program programming selection
When the programming program has been transferred, the boot program will return ACK.
Error Response H'C3 ERROR
• Error response : H'C3 (1 byte): Error response to user MAT programming selection
• ERROR : (1 byte): Error code
H'54 : Selection processing error (transfer error occurs and processing is not completed)
(b) 128-byte programming
The boot program will use the programming program transferred by the programming selection to
program the user boot MATs or user MATs in response to 128-byte programming.
Command H'50 Address
Data ···
···
SUM
• Command, H'50, (one byte): 128-byte programming
• Programming Address (four bytes): Start address for programming
Multiple of the size specified in response to the programming unit inquiry
(i.e. H'00, H'01, H'00, H'00 : H'00010000)
• Programming Data (128 bytes): Data to be programmed
The size is specified in the response to the programming unit inquiry.
• SUM (one byte): Checksum
Response H'06
• Response, H'06, (one byte): Response to 128-byte programming
On completion of programming, the boot program will return ACK.
Error Response H'D0 ERROR
• Error response, H'D0, (one byte): Error response for 128-byte programming
• ERROR: (one byte): Error code
H'11: Checksum Error
H'2A: Address error
The address is not within the specified MAT.
H'53: Programming error
A programming error has occurred and programming cannot be continued.
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The specified address should match the unit for programming of data. For example, when the
programming is in 128-byte units, the lower byte of the address should be H'00 or H'80.
When there are less than 128 bytes of data to be programmed, the host should fill the rest with
H'FF.
Sending the 128-byte programming command with the address of H'FFFFFFFF will stop the
programming operation. The boot program will interpret this as the end of the programming and
wait for selection of programming or erasing.
Command H'50 Address SUM
• Command, H'50, (one byte): 128-byte programming
• Programming Address (four bytes): End code is H'FF, H'FF, H'FF, H'FF.
• SUM (one byte): Checksum
Response H'06
• Response, H'06, (one byte): Response to 128-byte programming
On completion of programming, the boot program will return ACK.
Error Response H'D0 ERROR
• Error Response, H'D0, (one byte): Error response for 128-byte programming
• ERROR: (one byte): Error code
H'11: Checksum error
H'53: Programming error
An error has occurred in programming and programming cannot be continued.
(10) Erasure
Erasure is performed with the erasure selection and block erasure command.
Firstly, erasure is selected by the erasure selection command and the boot program then erases the
specified block. The command should be repeatedly executed if two or more blocks are to be
erased. Sending a block-erasure command from the host with the block number H'FF will stop the
erasure operating. On completion of erasing, the boot program will wait for selection of
programming or erasing.
The sequences of the issuing of erasure selection commands and the erasure of data are shown in
figure 20.22.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 804 of 980
REJ09B0050-0600
Transfer of erasure
program
Host Boot program
Preparation for erasure (H'48)
ACK
Erasure
Erasure (Erasure block number)
Erasure (H'FF)
ACK
ACK
Repeat
Figure 20.22 Erasure Sequence
(a) Erasure Selection
The boot program will transfer the erasure program. User MAT data is erased by the transferred
erasure program.
Command H'48
• Command, H'48, (one byte): Erasure selection
Response H'06
• Response, H'06, (one byte): Response for erasure selection
After the erasure program has been transferred, the boot program will return ACK.
Error Response H'C8 ERROR
• Error Response, H'C8, (one byte): Error response to erasure selection
• ERROR: (one byte): Error code
H'54: Selection processing error (transfer error occurs and processing is not completed)
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 805 of 980
REJ09B0050-0600
(b) Block Erasure
The boot program will erase the contents of the specified block.
Command H'58 Size Block number SUM
• Command, H'58, (one byte): Erasure
• Size (one byte): The number of bytes that represents the erasure block number
This is fixed to 1.
• Block number (one byte): Number of the block to be erased
• SUM (one byte): Checksum
Response H'06
• Response, H'06, (one byte): Response to Erasure
After erasure has been completed, the boot program will return ACK.
Error Response H'D8 ERROR
• Error Response, H'D8, (one byte): Response to Erasure
• ERROR (one byte): Error code
H'11: Sum check error
H'29: Block number error
Block number is incorrect.
H'51: Erasure error
An error has occurred during erasure.
On receiving block number H'FF, the boot program will stop erasure and wait for a selection
command.
Command H'58 Size Block number SUM
• Command, H'58, (one byte): Erasure
• Size, (one byte): The number of bytes that represents the block number
This is fixed to 1.
• Block number (one byte): H'FF
Stop code for erasure
• SUM (one byte): Checksum
Response H'06
• Response, H'06, (one byte): Response to end of erasure (ACK)
When erasure is to be performed after the block number H'FF has been sent, the procedure
should be executed from the erasure selection command.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 806 of 980
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(11) Memory read
The boot program will return the data in the specified address.
Command H'52 Size Area Read address
Read size SUM
• Command: H'52 (1 byte): Memory read
• Size (1 byte): Amount of data that represents the area, read address, and read size (fixed at 9)
• Area (1 byte)
H'00: User boot MAT
H'01: User MAT
An address error occurs when the area setting is incorrect.
• Read address (4 bytes): Start address to be read from
• Read size (4 bytes): Size of data to be read
• SUM (1 byte): Checksum
Response H'52 Read size
Data ···
SUM
• Response: H'52 (1 byte): Response to memory read
• Read size (4 bytes): Size of data to be read
• Data (n bytes): Data for the read size from the read address
• SUM (1 byte): Checksum
Error Response H'D2 ERROR
• Error response: H'D2 (1 byte): Error response to memory read
• ERROR: (1 byte): Error code
H'11: Sum check error
H'2A: Address error
The read address is not in the MAT.
H'2B: Size error
The read size exceeds the MAT.
(12) User-Boot Program Sum Check
The boot program will return the byte-by-byte total of the contents of the bytes of the user-boot
program, as a four-byte value.
Command H'4A
• Command, H'4A, (one byte): Sum check for user-boot program
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 807 of 980
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Response H'5A Size Checksum of user boot program SUM
• Response, H'5A, (one byte): Response to the sum check of user-boot program
• Size (one byte): The number of bytes that represents the checksum
This is fixed to 4.
• Checksum of user boot program (four bytes): Checksum of user boot MATs
The total of the data is obtained in byte units.
• SUM (one byte): Sum check for data being transmitted
(13) User-Program Sum Check
The boot program will return the byte-by-byte total of the contents of the bytes of the user
program.
Command H'4B
• Command, H'4B, (one byte): Sum check for user program
Response H'5B Size Checksum of user program SUM
• Response, H'5B, (one byte): Response to the sum check of the user program
• Size (one byte): The number of bytes that represents the checksum
This is fixed to 4.
• Checksum of user boot program (four bytes): Checksum of user MATs
The total of the data is obtained in byte units.
• SUM (one byte): Sum check for data being transmitted
(14) User Boot MAT Blank Check
The boot program will check whether or not all user boot MATs are blank and return the result.
Command H'4C
• Command, H'4C, (one byte): Blank check for user boot MAT
Response H'06
• Response, H'06, (one byte): Response to the blank check of user boot MAT
If all user MATs are blank (H'FF), the boot program will return ACK.
Error Response H'CC H'52
• Error Response, H'CC, (one byte): Response to blank check for user boot MAT
• Error Code, H'52, (one byte): Erasure has not been completed.
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 808 of 980
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(15) User MAT Blank Check
The boot program will check whether or not all user MATs are blank and return the result.
Command H'4D
• Command, H'4D, (one byte): Blank check for user MATs
Response H'06
• Response, H'06, (one byte): Response to the blank check for user boot MATs
If the contents of all user MATs are blank (H'FF), the boot program will return ACK.
Error Response H'CD H'52
• Error Response, H'CD, (one byte): Error response to the blank check of user MATs.
• Error code, H'52, (one byte): Erasure has not been completed.
(16) Boot Program State Inquiry
The boot program will return indications of its present state and error condition. This inquiry can
be made in the inquiry/selection state or the programming/erasing state.
Command H'4F
• Command, H'4F, (one byte): Inquiry regarding boot program’s state
Response H'5F Size Status ERROR SUM
• Response, H'5F, (one byte): Response to boot program state inquiry
• Size (one byte): The number of bytes. This is fixed to 2.
• Status (one byte): State of the boot program
Table 20.13 Status Code
Code Description
H'11 Device Selection Wait
H'12 Clock Mode Selection Wait
H'13 Bit Rate Selection Wait
H'1F Programming/Erasing State Transition Wait (Bit rate selection is completed)
H'31 Programming State for Erasure
H'3F Programming/Erasing Selection Wait (Erasure is completed)
H'4F Programming Data Receive Wait
H'5F Erasure Block Specification Wait (Erasure is completed)
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 809 of 980
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• ERROR (one byte): Error status
ERROR = 0 indicates normal operation.
ERROR = 1 indicates error has occurred.
Table 20.14 Error Code
Code Description
H'00 No Error
H'11 Sum Check Error
H'12 Program Size Error
H'21 Device Code Mismatch Error
H'22 Clock Mode Mismatch Error
H'24 Bit Rate Selection Error
H'25 Input Frequency Error
H'26 Multiplication Ratio Error
H'27 Operating Frequency Error
H'29 Block Number Error
H'2A Address Error
H'2B Data Length Error
H'51 Erasure Error
H'52 Erasure Incomplete Error
H'53 Programming Error
H'54 Selection Processing Error
H'80 Command Error
H'FF Bit-Rate-Adjustment Confirmation Error
• SUM (one byte): Sum check
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 810 of 980
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20.9 Usage Notes
1. Download time of on-chip program
The programming program that includes the initialization routine and the erasing program that
includes the initialization routine are each 4 kbytes or less. Accordingly, when the CPU clock
frequency is 34 MHz, the download for each program takes approximately 60 μs at maximum.
2. Write to flash-memory related registers by DMAC
While an instruction in on-chip RAM is being executed, the DMAC can write to the SCO bit
in FCCS that is used for a download request or FMATS that is used for MAT switching. Make
sure that these registers are not accidentally written to, otherwise an on-chip program may be
downloaded and damage RAM or a MAT switchover may occur and the CPU get out of
control. Do not use DMAC to program FLASH related registers.
3. Compatibility with programming/erasing program of conventional F-ZTAT H8 microcomputer
A programming/erasing program for flash memory used in the conventional F-ZTAT H8
microcomputer which does not support download of the on-chip program by a SCO transfer
request cannot run in this LSI. Be sure to download the on-chip program to execute
programming/erasing of flash memory in this LSI.
4. Monitoring runaway by WDT
Unlike the conventional F-ZTAT H8 microcomputer, no countermeasures are available for a
runaway by WDT during programming/erasing by the downloaded on-chip program. Prepare
countermeasures (e.g. use of the periodic timer interrupts) for WDT while taking the
programming/erasing time into consideration as required.
5. Notes on supplying power
When the power is supplied, the reset signal must be a low level and the external-input clock
must be supplied.
6. User branch processing intervals
The user branch processing interval differs for programming and erasing operations. Table
20.15 shows the maximum start intervals when the CPU clock frequency is 35 MHz.
Table 20.15 User Branch Processing Start Intervals
Maximum Interval
Programming operation 1 ms
Erasing operation 30 ms
Section 21 Mask ROM
Rev.6.00 Mar. 18, 2009 Page 811 of 980
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Section 21 Mask ROM
H8S/2635 has 256 kbytes of mask ROM. The on-chip ROM is connected to the CPU, data transfer
controller (DTC), and DMA controller (DMAC) with a 16-bit data bus. The on-chip ROM can be
accessed by the CPU, DTC, and DMAC in 8 or 16-bit units. The data in the on-chip ROM can
always be accessed in one state.
H'000000
H'000002
H'03FFFE
H'000001
H'000003
H'03FFFF
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
Figure 21.1 Block Diagram of 256-kbyte Mask ROM (HD6432365)
The on-chip ROM is enabled or disabled according to the operating mode. The operating mode is
selected by the mode setting pins MD2 to MD0 as shown in table 3.1. Select mode 4 or 7 when the
on-chip ROM is used, and mode 1 or 2 when the on-chip ROM is not used. The on-chip ROM is
allocated in area 0.
Section 21 Mask ROM
Rev.6.00 Mar. 18, 2009 Page 812 of 980
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Section 22 Clock Pulse Generator
Rev.6.00 Mar. 18, 2009 Page 813 of 980
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Section 22 Clock Pulse Generator
This LSI has an on-chip clock pulse generator (CPG) that generates the system clock (φ) and
internal clocks.
The clock pulse generator consists of an oscillator circuit, PLL circuit, and divider.
Figure 22.1 shows a block diagram of the clock pulse generator.
EXTAL
PLL circuit
(×1, 2, 4)
Oscillator Divider
System clock
to φ pin
Internal cloc
k
to peripheral
modules
SCK2 to SCK0
SCKCR
STC0, STC1
PLLCR
XTAL
Legend:
PLLCR: PLL system control register
SCKCR: System clock control register
Figure 22.1 Block Diagram of Clock Pulse Generator
The frequency can be changed by means of the PLL circuit. Frequency changes are made by
software by means of settings in the PLL control register (PLLCR) and the system clock control
register (SCKCR).
22.1 Register Descriptions
The clock pulse generator has the following registers.
• System clock control register (SCKCR)
• PLL control register (PLLCR)
CPG0400A_010020020100
Section 22 Clock Pulse Generator
Rev.6.00 Mar. 18, 2009 Page 814 of 980
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22.1.1 System Clock Control Register (SCKCR)
SCKCR controls φ clock output and selects operation when the frequency multiplication factor
used by the PLL circuit is changed, and the division ratio used by the divider.
Bit Bit Name Initial Value R/W Description
7 PSTOP 0 R/W φ Clock Output Disable
Controls φ output.
Normal Operation
0: φ output
1: Fixed high
Sleep Mode
0: φ output
1: Fixed high
Software Standby Mode
0: Fixed high
1: Fixed high
Hardware Standby Mode
0: High impedance
1: High impedance
All module clock stop mode
0: φ output
1: Fixed high
6 — 0 R/W Reserved
Though this bit can be read from or written to, the
write value should always be 0.
5, 4 — All 0 — Reserved
These bits are always read as 0 and cannot be
modified.
3 STCS 0 R/W Frequency Multiplication Factor Switching Mode
Select
Selects the operation when the PLL circuit
frequency multiplication factor is changed.
0: Specified multiplication factor is valid after
transition to software standby mode
1: Specified multiplication factor is valid immediately
after STC1 and STC0 bits are rewritten
Section 22 Clock Pulse Generator
Rev.6.00 Mar. 18, 2009 Page 815 of 980
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Bit Bit Name Initial Value R/W Description
2
1
0
SCK2
SCK1
SCK0
0
0
0
R/W
R/W
R/W
System Clock Select 2 to 0
Select the division ratio.
000: 1/1
001: 1/2
010: 1/4
011: Setting prohibited
100: Setting prohibited
101: Setting prohibited
11×: Setting prohibited
Legend:
×: Don’t care
22.1.2 PLL Control Register (PLLCR)
PLLCR sets the frequency multiplication factor used by the PLL circuit.
Bit Bit Name Initial Value R/W Description
7
to
4
— All 0 — Reserved
These bits are always read as 0 and cannot be
modified.
3 — 0 R/W Reserved
Though this bit can be read from or written to, the
write value should always be 0.
2 — 0 R/W Reserved
This bit is always read as 0 and cannot be
modified.
1
0
STC1
STC0
0
0
R/W
R/W
Frequency Multiplication Factor
The STC bits specify the frequency multiplication
factor used by the PLL circuit.
00: ×1
01: ×2
10: ×4
11: Setting prohibited
Section 22 Clock Pulse Generator
Rev.6.00 Mar. 18, 2009 Page 816 of 980
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22.2 Oscillator
Clock pulses can be supplied by connecting a crystal resonator, or by input of an external clock.
22.2.1 Connecting a Crystal Oscillator
A crystal oscillator can be connected as shown in the example in figure 22.2. Select the damping
resistance Rd according to table 22.1. An AT-cut parallel-resonance type should be used.
When a clock is supplied with a crystal resonator connected, the frequency of the crystal resonator
should be 8 MHz to 25 MHz.
Figure 22.3 shows the equivalent circuit of the crystal oscillator. Use a crystal oscillator that has
the characteristics shown in table 22.2.
EXTAL
XTAL
Note: * In the H8S/2368 0.18 μm F-ZTAT Group, C
L1
= C
L2
= 10 pF.
R
d
C
L2
C
L1
C
L1
= C
L2
= 10 to 22 pF*
Figure 22.2 Connection of Crystal Oscillator (Example)
Table 22.1 Damping Resistance Value
Frequency (MHz) 8 12 16 20 25
Rd (Ω) 200 0 0 0 0
XTAL
C
L
AT-cut parallel-resonance type
EXTAL
C
0
LR
s
Figure 22.3 Crystal Oscillator Equivalent Circuit
Section 22 Clock Pulse Generator
Rev.6.00 Mar. 18, 2009 Page 817 of 980
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Table 22.2 Crystal Oscillator Characteristics
Frequency (MHz) 8 12 16 20 25
RS max (Ω) 80 60 50 40 40
C0 max (pF) 7 7 7 7 7
22.2.2 External Clock Input
An external clock signal can be input as shown in the examples in figure 22.4. If the XTAL pin is
left open, make sure that parasitic capacitance is no more than 10 pF. When the counter clock is
input to the XTAL pin, make sure that the external clock is held high in standby mode.
Table 22.3 shows the input conditions for the external clock. The frequency of an external clock to
be input should be 8 MHz to 25 MHz.
EXTAL
XTAL
External clock input
Open
(a) XTAL pin left open
EXTAL
XTAL
External clock input
(b) Counter clock input at XTAL pin
Figure 22.4 External Clock Input (Examples)
Section 22 Clock Pulse Generator
Rev.6.00 Mar. 18, 2009 Page 818 of 980
REJ09B0050-0600
Table 22.3 External Clock Input Conditions
V
CC = 3.0 V
to 3.6 V
Test
Item Symbol Min Max Unit Conditions
External clock input
low pulse width
tEXL 15 — ns Figure 22.5
External clock input
high pulse width
tEXH 15 — ns
External clock rise time tEXr — 5 ns
External clock fall time tEXf — 5 ns
Clock low pulse width tCL 0.4 0.6 tcyc
Clock high pulse width tCH 0.4 0.6 tcyc
tEXH tEXL
tEXr tEXf
VCC × 0.5
EXTAL
Figure 22.5 External Clock Input Timing
22.3 PLL Circuit
The PLL circuit has the function of multiplying the frequency of the clock from the oscillator by a
factor of 1, 2, or 4. The multiplication factor is set with the STC1 and the STC0 bits in PLLCR.
The phase of the rising edge of the internal clock is controlled so as to match that of the rising
edge of the EXTAL pin.
When the multiplication factor of the PLL circuit is changed, the operation varies according to the
setting of the STCS bit in SCKCR.
When STCS = 0, the setting becomes valid after a transition to software standby mode. The
transition time count is performed in accordance with the setting of bits STS3 to STS0 in SBYCR.
For details on SBYCR, refer to section 23.1.1, Standby Control Register (SBYCR).
1. The initial PLL circuit multiplication factor is 1.
Section 22 Clock Pulse Generator
Rev.6.00 Mar. 18, 2009 Page 819 of 980
REJ09B0050-0600
2. A value is set in bits STS3 to STS0 to give the specified transition time.
3. The target value is set in bits STC1 and STC0, and a transition is made to software standby
mode.
4. The clock pulse generator stops and the value set in STC1 and STC0 becomes valid.
5. Software standby mode is cleared, and a transition time is secured in accordance with the
setting in STS3 to STS0.
6. After the set transition time has elapsed, this LSI resumes operation using the target
multiplication factor.
When STCS = 1, this LSI operates using the new multiplication factor immediately after bits
STC1 and STC0 are rewritten.
22.4 Frequency Divider
The frequency divider divides the PLL output clock to generate a 1/2 or 1/4 clock.
22.5 Usage Notes
22.5.1 Notes on Clock Pulse Generator
1. The following points should be noted since the frequency of φ changes according to the setting
of SCKCR and PLLCR.
Select the clock division ratio that is within the operation guaranteed range of clock cycle time
tcyc shown in the AC timing of Electrical Characteristics. In other words, the range of φ must
be specified from 8 MHz (min) to 33 MHz* (max); outside of this range must be prevented.
2. All the on-chip peripheral modules operate on the φ. Therefore, note that the time processing
of modules such as a timer and SCI differ before and after changing the clock division ratio. In
addition, wait time for clearing software standby mode differs by changing the clock division
ratio. See the description, Setting Oscillation Stabilization Time after Clearing Software
Standby Mode in section 23.2.3, Software Standby Mode, for details.
3. Note that the frequency of φ will be changed when setting SCKCR or PLLCR while executing
the external bus cycle with the write-data-buffer function.
Note: * 34 MHz for the H8S/2368 0.18μm F-ZTAT Group
Section 22 Clock Pulse Generator
Rev.6.00 Mar. 18, 2009 Page 820 of 980
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22.5.2 Notes on Oscillator
Since various characteristics related to the oscillator are closely linked to the user’s board design,
thorough evaluation is necessary on the user’s part, using the oscillator connection examples
shown in this section as a guide. As the oscillator circuit ratings will depend on the floating
capacitance of the oscillator and the mounting circuit, the ratings should be determined in
consultation with the oscillator manufacturer. The design must ensure that a voltage exceeding the
maximum rating is not applied to the oscillator pin.
22.5.3 Notes on Board Design
When using the crystal oscillator, place the crystal oscillator and its load capacitors as close as
possible to the XTAL and EXTAL pins. Other signal lines should be routed away from the
oscillator circuit to prevent induction from interfering with correct oscillation. See figure 22.6.
CL2
Signal A Signal B
CL1
This LSI
XTAL
EXTAL
Avoid
Figure 22.6 Note on Oscillator Board Design
Figure 22.7 shows the external circuitry recommended for the PLL circuit. Separate PLLVcc and
PLLVss from the other Vcc and Vss lines at the board power supply source, and be sure to insert
bypass capacitors CPB and CB close to the pins.
Section 22 Clock Pulse Generator
Rev.6.00 Mar. 18, 2009 Page 821 of 980
REJ09B0050-0600
PLLVCC
PLLVSS
VCC
VSS
Rp: 200
CPB: 0.1 µF*
CB: 0.1 µF*
Note: * CB and CPB are laminated ceramic capacitors.
Figure 22.7 Recommended External Circuitry for PLL Circuit
Section 22 Clock Pulse Generator
Rev.6.00 Mar. 18, 2009 Page 822 of 980
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Section 23 Power-Down Modes
Rev.6.00 Mar. 18, 2009 Page 823 of 980
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Section 23 Power-Down Modes
In addition to the normal program execution state, this LSI has power-down modes in which
operation of the CPU and oscillator is halted and power dissipation is reduced. Low-power
operation can be achieved by individually controlling the CPU, on-chip peripheral modules, and
so on.
This LSI’s operating modes are high-speed mode and six power down modes:
• Clock division mode
• Sleep mode
• Module stop mode
• All module clock stop mode
• Software standby mode
• Hardware standby mode
Sleep mode is a CPU state, clock division mode is an on-chip peripheral function (including bus
masters and the CPU) state, and module stop mode is an on-chip peripheral function (including
bus masters other than the CPU) state. A combination of these modes can be set.
After a reset, this LSI is in high-speed mode.
Table 23.1 shows the internal states of this LSI in each mode. Figure 23.1 shows the mode
transition diagram.
LPWS264A_000020020100
Section 23 Power-Down Modes
Rev.6.00 Mar. 18, 2009 Page 824 of 980
REJ09B0050-0600
Table 23.1 Operating Modes and Internal States of the LSI
Operating State
High
Speed
Mode
Clock
Division
Mode
Sleep
Mode
Module
Stop Mode
All Module
Clock Stop
Mode
Software
Standby
Mode
Hardware
Standby
Mode
Clock pulse generator Functions Functions Functions Functions Functions Halted Halted
Instruction
execution
Halted Halted Halted CPU
Register
Functions Functions
Retained
Functions Halted
Retained Undefined
NMI External
interrupts IRQ0 to 7
Functions Functions Functions Functions Functions Functions Halted
Peripheral
functions
WDT Functions Functions Functions Functions Functions Halted
(Retained)
Halted
(Reset)
TMR Functions Functions Functions Halted
(Retained)
Functions/
Halted
(Retained)*1
Halted
(Retained)
Halted
(Reset)
DMAC Functions Functions Functions Halted
(Retained)
Halted
(Retained)
Halted
(Retained)
Halted
(Reset)
DTC Functions Functions Functions Halted
(Retained)
Halted
(Retained)
Halted
(Retained)
Halted
(Reset)
TPU Functions Functions Functions Halted
(Retained)
Halted
(Retained)
Halted
(Retained)
Halted
(Reset)
PPG Functions Functions Functions Halted
(Retained)
Halted
(Retained)
Halted
(Retained)
Halted
(Reset)
D/A Functions Functions Functions Halted
(Retained)
Halted
(Retained)
Halted
(Retained)
Halted
(Reset)
A/D Functions Functions Functions Halted
(Retained)
Halted
(Retained)
Halted
(Retained)
Halted
(Reset)
SCI Functions Functions Functions Halted*2
(Reset/
Retained)
Halted*2
(Reset/
Retained)
Halted*2
(Reset/
Retained)
Halted
(Reset)
IIC2 Functions Functions Functions Halted*3
(Reset/
Retained)
Halted*3
(Reset/
Retained)
Halted*3
(Reset/
Retained)
Halted
(Reset)
RAM Functions Functions Functions Functions Functions Retained Retained
I/O Functions Functions Functions Functions Retained Retained High
impedance
Notes: “Halted (Retained)” in the table means that internal register values are retained and internal
operations are suspended.
“Halted (Reset)” in the table means that internal register values and internal states are
initialized.
Section 23 Power-Down Modes
Rev.6.00 Mar. 18, 2009 Page 825 of 980
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In module stop mode, only modules for which a stop setting has been made are halted
(reset or retained).
1. The active or halted state can be selected by means of the MSTP0 bit in MSTPCR.
2. TDR, SSR, and RDR are halted (reset) and other registers are halted (retained).
3. BC2 to BC0 are halted (reset) and other registers are halted (retained).
Program-halted stateProgram execution state
High-speel mode
(Internal clock is PLL
circuit output clock)
Reset state
STBY pin = low
STBY pin = high
RES pin = low
SSBY = 0
MSTPCR =
H'FFFF (H'FFFE),
EXMSTPCR = H'FFFF,
SSBY = 0
SSBY = 1
SCK2 to
SCK0 ≠ 0
RES pin = high
SCK2 to
SCK0 = 0
SLEEP
instruction
Interrupt*1
: Transition after exception handling : Power- down mode
SLEEP
instruction
Any interrupt
SLEEP
instruction
External
interrupt*2
Notes: 1. NMI, IRQ0 to IRQ7, 8-bit timer interrupts, watchdog timer interrupts.
(8-bit timer interrupts are valid when MSTP0 = 0.)
2. NMI, IRQ0 to IRQ7
(IRQ0 to IRQ7 are valid when the corresponding bit in SSIER is 1.)
• From any state, a transition to hardware standby mode occurs when STBY is driven low.
• From any state except hardware standby mode, a transition to the reset state occurs when RES
is driven low.
Hardware
standby mode
Sleep mode
All
module-clocks-stop
mode
Software
standby mode
Clock division
mode
Figure 23.1 Mode Transitions
Section 23 Power-Down Modes
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23.1 Register Descriptions
The registers relating to the power-down mode are shown below. For details on the system clock
control register (SCKCR), refer to section 22.1.1, System Clock Control Register (SCKCR).
• System clock control register (SCKCR)
• Standby control register (SBYCR)
• Module stop control register H (MSTPCRH)
• Module stop control register L (MSTPCRL)
• Extension module stop control register H (EXMSTPCRH)
• Extension module stop control register L (EXMSTPCRL)
23.1.1 Standby Control Register (SBYCR)
SBYCR performs software standby mode control.
Bit Bit Name Initial Value R/W Description
7 SSBY 0 R/W
Software Standby
This bit specifies the transition mode after
executing the SLEEP instruction
0: Shifts to sleep mode after the SLEEP
instruction is executed
1: Shifts to software standby mode after the
SLEEP instruction is executed
This bit does not change when clearing the
software standby mode by using external
interrupts and shifting to normal operation. This bit
should be written 0 when clearing.
6 OPE 1 R/W
Output Port Enable
Specifies whether the output of the address bus
and bus control signals (CS0 to CS7, AS, RD,
HWR, LWR, UCAS, LCAS) is retained or set to
the high-impedance state in software standby
mode.
0: In software standby mode, address bus and
bus control signals are high-impedance
1: In software standby mode, address bus and
bus control signals retain output state
Section 23 Power-Down Modes
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Bit Bit Name Initial Value R/W Description
5, 4 — All 0 — Reserved
These bits are always read as 0. The initial value
should not be changed.
3
2
1
0
STS3
STS2
STS1
STS0
1
1
1
1
R/W
R/W
R/W
R/W
Standby Timer Select 3 to 0
These bits select the time the MCU waits for the
clock to stabilize when software standby mode is
cleared by an external interrupt. With crystal
oscillation, refer to table 23.2 and make a
selection according to the operating frequency so
that the standby time is at least the oscillation
stabilization time. With an external clock, a PLL
circuit stabilization time is necessary. Refer to
table 23.2 to set the wait time. When DRAM is
used and self-refreshing in the software standby
state is selected, note that the DRAM’s tRAS
(self-refresh RAS pulse width) specification must
be satisfied.
With the F-ZTAT version, a flash memory
stabilization time must be provided.
0000: Setting prohibited
0001: Setting prohibited
0010: Setting prohibited
0011: Setting prohibited
0100: Setting prohibited
0101: Standby time = 64 states
0110: Standby time = 512 states
0111: Standby time = 1024 states
1000: Standby time = 2048 states
1001: Standby time = 4096 states
1010: Standby time = 16384 states
1011: Standby time = 32768 states
1100: Standby time = 65536 states
1101: Standby time = 131072 states
1110: Standby time = 262144 states
1111: Standby time = 524288 states
Section 23 Power-Down Modes
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23.1.2 Module Stop Control Registers H and L (MSTPCRH, MSTPCRL)
MSTPCR performs module stop mode control.
Setting a bit to 1, the corresponding module enters module stop mode, while clearing the bit to 0
clears the module stop mode.
• MSTPCRH
Bit Bit Name Initial Value R/W Module
15 ACSE 0 R/W All-Module-Clocks-Stop Mode Enable
Enables or disables all-module-clocks-stop mode,
in which, when the CPU executes a SLEEP
instruction after module stop mode has been set
for all the on-chip peripheral functions controlled
by MSTPCR or the on-chip peripheral functions
except the TMR.
0: All-module-clocks-stop mode disabled
1: All-module-clocks-stop mode enabled
14 MSTP14 0 R/W ⎯
13 MSTP13 0 R/W DMA controller (DMAC)
12 MSTP12 0 R/W Data transfer controller (DTC)
11 MSTP11 1 R/W 16-bit timer-pulse unit (TPU)
10 MSTP10 1 R/W Programmable pulse generator (PPG)
9 MSTP9 1 R/W ⎯
8 MSTP8 1 R/W D/A converter (channels 2 and 3)
• MSTPCRL
Bit Bit Name Initial Value R/W Module
7 MSTP7 1 R/W ⎯
6 MSTP6 1 R/W A/D converter
5 MSTP5 1 R/W Serial communication interface 4 (SCI_4)
4 MSTP4 1 R/W Serial communication interface 3 (SCI_3)
3 MSTP3 1 R/W Serial communication interface 2 (SCI_2)
2 MSTP2 1 R/W Serial communication interface 1 (SCI_1)
1 MSTP1 1 R/W Serial communication interface 0 (SCI_0)
0 MSTP0 1 R/W 8-bit timer (TMR)
Section 23 Power-Down Modes
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23.1.3 Extension Module Stop Control Registers H and L (EXMSTPCRH,
EXMSTPCRL)
EXMSTPCR performs all-module-clocks-stop mode control with MSTPCR.
When entering all-module-clocks-stop mode, set EXMSTPCR to H’FFFF. Otherwise, set
EXMSTPCR to H’FFFD.
• EXMSTPCRH
Bit Bit Name Initial Value R/W Module
15
to
12
— All 1 R/W Reserved
Read/write is enabled. 1 should be written in
writing.
11 MSTP27 1 R/W —
10 MSTP26 1 R/W —
9 MSTP25 1 R/W —
8 MSTP24 1 R/W —
• EXMSTPCRL
Bit Bit Name Initial Value R/W Module
7 MSTP23 1 R/W —
6 MSTP22 1 R/W —
5 MSTP21 1 R/W —
4 MSTP20 1 R/W I2C bus interface 2_1 (IIC2_1)
3 MSTP19 1 R/W I2C bus interface 2_0 (IIC2_0)
2 MSTP18 1 R/W —
1 MSTP17 0 R/W —
0 MSTP16 1 R/W —
Section 23 Power-Down Modes
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23.2 Operation
23.2.1 Clock Division Mode
When bits SCK2 to SCK0 in SCKCR are set to a value from 001 to 101, a transition is made to
clock division mode at the end of the bus cycle. In clock division mode, the CPU, bus masters, and
on-chip peripheral functions all operate on the operating clock (1/2 or 1/4) specified by bits SCK2
to SCK0.
Clock division mode is cleared by clearing all of bits SCK2 to SCK0 to 0. A transition is made to
high-speed mode at the end of the bus cycle, and clock division mode is cleared.
If a SLEEP instruction is executed while the SSBY bit in SBYCR is cleared to 0, the chip enters
sleep mode. When sleep mode is cleared by an interrupt, clock division mode is restored.
If a SLEEP instruction is executed while the SSBY bit in SBYCR is set to 1, the chip enters
software standby mode. When software standby mode is cleared by an external interrupt, clock
division mode is restored.
When the RES pin is driven low, the reset state is entered and clock division mode is cleared. The
same applies to a reset caused by watchdog timer overflow.
When the STBY pin is driven low, a transition is made to hardware standby mode.
23.2.2 Sleep Mode
Transition to Sleep Mode: When the SLEEP instruction is executed when the SSBY bit is 0 in
SBYCR, the CPU enters the sleep mode. In sleep mode, CPU operation stops but the contents of
the CPU’s internal registers are retained. Other peripheral functions do not stop.
Exiting Sleep Mode: Sleep mode is exited by any interrupt, or signals at the RES, or STBY pins.
• Exiting Sleep Mode by Interrupts:
When an interrupt occurs, sleep mode is exited and interrupt exception processing starts. Sleep
mode is not exited if the interrupt is disabled, or interrupts other than NMI are masked by the
CPU.
• Exiting Sleep Mode by RES pin:
Setting the RES pin level low selects the reset state. After the stipulated reset input duration,
driving the RES pin high starts the CPU performing reset exception processing.
• Exiting Sleep Mode by STBY Pin:
Section 23 Power-Down Modes
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When the STBY pin level is driven low, a transition is made to hardware standby mode.
23.2.3 Software Standby Mode
Transition to Software Standby Mode: If a SLEEP instruction is executed when the SSBY bit in
SBYCR is set to 1, software standby mode is entered. In this mode, the CPU, on-chip peripheral
functions, and oscillator all stop. However, the contents of the CPU’s internal registers, RAM
data, and the states of on-chip peripheral functions other than the SCI and A/D converter, and I/O
ports, are retained. Whether the address bus and bus control signals are placed in the high-
impedance state or retain the output state can be specified by the OPE bit in SBYCR.
In this mode the oscillator stops, and therefore power dissipation is significantly reduced.
Clearing Software Standby Mode: Software standby mode is cleared by an external interrupt
(NMI pin, or pins IRQ0 to IRQ7), or by means of the RES pin or STBY pin. Setting the SSI bit in
SSIER to 1 enables IRQ0 to IRQ7 to be used as software standby mode clearing sources.
Clearing with an Interrupt:
When an NMI or IRQ0 to IRQ7 interrupt request signal is input, clock oscillation starts, and after
the elapse of the time set in bits STS3 to STS0 in SBYCR, stable clocks are supplied to the entire
LSI, software standby mode is cleared, and interrupt exception handling is started.
When clearing software standby mode with an IRQ0 to IRQ7 interrupt, set the corresponding
enable bit to 1 and ensure that no interrupt with a higher priority than interrupts IRQ0 to IRQ7 is
generated. Software standby mode cannot be cleared if the interrupt has been masked on the CPU
side or has been designated as a DTC activation source.
Clearing with the RES Pin:
When the RES pin is driven low, clock oscillation is started. At the same time as clock oscillation
starts, clocks are supplied to the entire LSI. Note that the RES pin must be held low until clock
oscillation stabilizes. When the RES pin goes high, the CPU begins reset exception handling.
Clearing with the STBY Pin:
When the STBY pin is driven low, a transition is made to hardware standby mode.
Section 23 Power-Down Modes
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Setting Oscillation Stabilization Time after Clearing Software Standby Mode: Bits STS3 to
STS0 in SBYCR should be set as described below.
Using a Crystal Oscillator:
Set bits STS3 to STS0 so that the standby time is more than the oscillation stabilization time.
Table 23.2 shows the standby times for operating frequencies and settings of bits STS3 to STS0.
Using an External Clock:
A PLL circuit stabilization time is necessary. Refer to table 23.2 to set the wait time.
Table 23.2 Oscillation Stabilization Time Settings
φ*1 [MHz]
STS3 STS2 STS1 STS0 Standby Time 34*2 33 25 20 13 10 8 Unit
0 0 0 0 Reserved — — — — — — — µs
1 Reserved — — — — — — —
1 0 Reserved — — — — — — —
1 Reserved — — — — — — —
1 0 0 Reserved — — — — — — —
1 64 1.9 1.9 2.6 3.2 4.9 6.4 8.0
1 0 512 15.1 15.5 20.5 25.6 39.4 51.2 64.0
1 1024 30.1 31.0 41.0 51.2 78.8 102.4 128.0
1 0 0 0 2048 60.2 62.1 81.9 102.4 157.5 204.8 256.0
1 4096 0.12 0.12 0.16 0.20 0.32 0.41 0.51 ms
1 0 16384 0.48 0.50 0.66 0.82 1.26 1.64 2.05
1 32765 0.96 0.99 1.31 1.64 2.52 3.28 4.10
1 0 0 65536 1.93 1.99 2.62 3.28 5.04 6.55 8.19
1 131072 3.86 3.97 5.24 6.55 10.08 13.11 16.38
1 0 262144 7.71 7.94 10.49 13.11 20.16 26.21 32.77
1 524288 15.42 15.89 20.97 26.21 40.33 52.43 65.54
: Recommended time setting
Notes: 1. φ is the frequency divider output.
2. Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
Section 23 Power-Down Modes
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Software Standby Mode Application Example: Figure 23.2 shows an example in which a
transition is made to software standby mode at the falling edge on the NMI pin, and software
standby mode is cleared at the rising edge on the NMI pin.
In this example, an NMI interrupt is accepted with the NMIEG bit in INTCR cleared to 0 (falling
edge specification), then the NMIEG bit is set to 1 (rising edge specification), the SSBY bit is set
to 1, and a SLEEP instruction is executed, causing a transition to software standby mode.
Software standby mode is then cleared at the rising edge on the NMI pin.
Oscillator
NMI
NMIEG
SSBY
NMI exception
handling
NMIEG=1
SSBY=1
SLEEP instruction
Software standby mode
(power-down mode) Oscillation
stabilization
time tOSC2
NMI exception
handling
Figure 23.2 Software Standby Mode Application Example
Section 23 Power-Down Modes
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23.2.4 Hardware Standby Mode
Transition to Hardware Standby Mode: When the STBY pin is driven low, a transition is made
to hardware standby mode from any mode.
In hardware standby mode, all functions enter the reset state and stop operation, resulting in a
significant reduction in power dissipation. As long as the prescribed voltage is supplied, on-chip
RAM data is retained. I/O ports are set to the high-impedance state.
In order to retain on-chip RAM data, the RAME bit in SYSCR should be cleared to 0 before
driving the STBY pin low. Do not change the state of the mode pins (MD2 to MD0) while this
LSI is in hardware standby mode.
Clearing Hardware Standby Mode: Hardware standby mode is cleared by means of the STBY
pin and the RES pin. When the STBY pin is driven high while the RES pin is low, the reset state is
set and clock oscillation is started. Ensure that the RES pin is held low until the clock oscillator
stabilizes (for details on the oscillation stabilization time, refer to table 23.2). When the RES pin is
subsequently driven high, a transition is made to the program execution state via the reset
exception handling state.
Hardware Standby Mode Timing: Figure 23.3 shows an example of hardware standby mode
timing.
When the STBY pin is driven low after the RES pin has been driven low, a transition is made to
hardware standby mode. Hardware standby mode is cleared by driving the STBY pin high,
waiting for the oscillation stabilization time, then changing the RES pin from low to high.
Oscillator
RES
STBY
Oscillation
stabilization
time
Reset
exception
handling
Figure 23.3 Hardware Standby Mode Timing
Section 23 Power-Down Modes
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Hardware Standby Mode Timing when Power Is Supplied (Only H8S/2368 0.18 μm F-ZTAT
Group): When entering hardware standby mode immediately after the power is supplied, the RES
signal must be driven low for a given period with retaining the STBY signal high. After the RES
signal is canceled, drive the STBY signal low.
(1) Power supply
RES
(2) Reset period
(3) Hardware standby mode
STBY
Figure 23.4 Hardware Standby Mode Timing when Power Is Supplied
23.2.5 Module Stop Mode
Module stop mode can be set for individual on-chip peripheral modules.
When the corresponding MSTP bit in MSTPCR or EXMSTPCR is set to 1, module operation
stops at the end of the bus cycle and a transition is made to module stop mode. The CPU continues
operating independently.
When the corresponding MSTP bit is cleared to 0, module stop mode is cleared and the module
starts operating at the end of the bus cycle. In module stop mode, the internal states of modules
other than the SCI are retained.
After reset clearance, all modules other than the DMAC, and DTC are in module stop mode.
The module registers which are set in module stop mode cannot be read or written to.
Section 23 Power-Down Modes
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23.2.6 All-Module-Clocks-Stop Mode
When the ACSE bit in MSTPCRH is set to 1 and module stop mode is set for all the on-chip
peripheral functions controlled by MSTPCR or EXMSTPCR (MSTPCR = H'FFFF, EXMSTPCR
= H'FFFF), or for all the on-chip peripheral functions except the 8-bit timer (MSTPCR = H'FFFE,
EXMSTPCR = H'FFFF), executing a SLEEP instruction while the SSBY bit in SBYCR is cleared
to 0 will cause all the on-chip peripheral functions (except the 8-bit timer and watchdog timer), the
bus controller, and the I/O ports to stop operating, and a transition to be made to all-module-
clocks-stop mode, at the end of the bus cycle.
Operation or halting of the 8-bit timer can be selected by means of the MSTP0 bit.
All-module-clocks-stop mode is cleared by an external interrupt (NMI, IRQ0 to IRQ7 pins), RES
pin input, or an internal interrupt (8-bit timer, watchdog timer), and the CPU returns to the normal
program execution state via the exception handling state. All-module-clocks-stop mode is not
cleared if interrupts are disabled, if interrupts other than NMI are masked by the CPU, or if the
relevant interrupt is designated as a DTC activation source.
When the STBY pin is driven low, a transition is made to hardware standby mode.
23.3 φ Clock Output Control
Output of the φ clock can be controlled by means of the PSTOP bit in SCKCR, and DDR for the
corresponding port. When the PSTOP bit is set to 1, the φ clock stops at the end of the bus cycle,
and φ output goes high. φ clock output is enabled when the PSTOP bit is cleared to 0. When DDR
for the corresponding port is cleared to 0, φ clock output is disabled and input port mode is set.
Table 23.3 shows the state of the φ pin in each processing state.
Table 23.3 φ Pin State in Each Processing State
Register Setting
DDR PSTOP
Normal
operating state
Sleep mode
Software
standby mode
Hardware
standby mode
All-module-
clocks-stop
mode
0 X High impedance High
impedance
High impedance High impedance High
impedance
1 0 φ output φ output Fixed high High impedance φ output
1 1 Fixed high Fixed high Fixed high High impedance Fixed high
Section 23 Power-Down Modes
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23.4 Usage Notes
23.4.1 I/O Port Status
In software standby mode, I/O port states are retained. Therefore, there is no reduction in current
dissipation for the output current when a high-level signal is output.
23.4.2 Current Dissipation during Oscillation Stabilization Standby Period
Current dissipation increases during the oscillation stabilization standby period.
23.4.3 DMAC/DTC Module Stop
Depending on the operating status of the DMAC or DTC, the MSTP14 to MSTP13 and may not
be set to 1. Setting of the DMAC or DTC module stop mode should be carried out only when the
respective module is not activated.
For details, refer to section 7, DMA Controller (DMAC), and section 8, Data Transfer Controller
(DTC).
23.4.4 On-Chip Peripheral Module Interrupts
Relevant interrupt operations cannot be performed in module stop mode. Consequently, if module
stop mode is entered when an interrupt has been requested, it will not be possible to clear the CPU
interrupt source or the DMAC or DTC activation source.
Interrupts should therefore be disabled before entering module stop mode.
23.4.5 Writing to MSTPCR, EXMSTPCR
MSTPCR and EXMSTPCR should only be written to by the CPU.
Section 23 Power-Down Modes
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23.4.6 Notes on Clock Division Mode
The following points should be noted in clock division mode.
• Select the clock division ratio specified by the SCK2 to SCK0 bits so that the frequency of φ is
within the operation guaranteed range of clock cycle time (tcyc) shown in the Electrical
Characteristics. In other words, the range of φ must be specified to 8 MHz (min.); outside of
this range (φ < 8 MHz) must be prevented.
• All the on-chip peripheral modules operate on the φ. Therefore, note the time processing of
modules such as a timer and SCI differ before and after changing the clock division ratio. In
addition, wait time for clearing software standby mode differs by changing the clock division
ratio.
• Note that the frequency of φ will be changed by changing the clock division ratio.
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 839 of 980
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Section 24 List of Registers
The address list gives information on the on-chip I/O register addresses, how the register bits are
configured, and the register states in each operating mode. The information is given as shown
below.
1. Register addresses (address order)
⎯ Registers are listed from the lower allocation addresses.
⎯ Registers are classified by functional modules.
⎯ The access size is indicated.
2. Register bits
⎯ Bit configurations of the registers are described in the same order as the register addresses.
⎯ Reserved bits are indicated by ⎯ in the bit name column.
⎯ No entry in the bit-name column indicates that the whole register is allocated as a counter
or for holding data.
⎯ For the registers of 16 or 32 bits, the MSB is described first.
3. Register states in each operating mode
⎯ Register states are described in the same order as the register addresses.
⎯ The register states described here are for the basic operating modes. If there is a specific
reset for an on-chip peripheral module, refer to the section on that on-chip peripheral
module.
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 840 of 980
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24.1 Register Addresses (Address Order)
The data bus width indicates the numbers of bits by which the register is accessed.
The number of access states indicates the number of states based on the specified reference clock.
Register Name
Abbrevia-
tion
Bit No.
Address
Module
Data
Width
Access
States
DTC mode register A MRA 8 H’BC00 DTC 16/32 2
DTC source address register SAR 24 DTC 16/32 2
DTC mode register B MRB 8 to DTC 16/32 2
DTC destination address register DAR 24 DTC 16/32 2
DTC transfer count register A CRA 16 DTC 16/32 2
DTC transfer count register B CRB 16 H’BFFF DTC 16/32 2
I2C bus control register A_0 ICCRA_0 8 H'FD58 IIC2_0 8 2
I2C bus control register B_0 ICCRB_0 8 H'FD59 IIC2_0 8 2
I2C bus mode register_0 ICMR_0 8 H'FD5A IIC2_0 8 2
I2C bus interrupt enable register_0 ICIER_0 8 H'FD5B IIC2_0 8 2
I2C bus status register_0 ICSR_0 8 H'FD5C IIC2_0 8 2
Slave address register_0 SAR_0 8 H'FD5D IIC2_0 8 2
I2C transfer data register_0 ICDRT_0 8 H'FD5E IIC2_0 8 2
I2C receive data register_0 ICDRR_0 8 H'FD5F IIC2_0 8 2
I2C bus control register A_1 ICCRA_1 8 H'FD60 IIC2_1 8 2
I2C bus control register B_1 ICCRB_1 8 H'FD61 IIC2_1 8 2
I2C bus mode register_1 ICMR_1 8 H'FD62 IIC2_1 8 2
I2C bus interrupt enable register_1 ICIER_1 8 H'FD63 IIC2_1 8 2
I2C bus status register_1 ICSR_1 8 H'FD64 IIC2_1 8 2
Slave address register_1 SAR_1 8 H'FD65 IIC2_1 8 2
I2C transfer data register_1 ICDRT_1 8 H'FD66 IIC2_1 8 2
I2C receive data register_1 ICDRR_1 8 H'FD67 IIC2_1 8 2
Serial expansion mode register_2 SEMR_2 8 H'FDA8 SCI_2 8 2
Interrupt priority register A IPRA 16 H'FE00 INT 16 2
Interrupt priority register B IPRB 16 H'FE02 INT 16 2
Interrupt priority register C IPRC 16 H'FE04 INT 16 2
Interrupt priority register D IPRD 16 H'FE06 INT 16 2
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 841 of 980
REJ09B0050-0600
Register Name
Abbrevia-
tion
Bit No.
Address
Module
Data
Width
Access
States
Interrupt priority register E IPRE 16 H'FE08 INT 16 2
Interrupt priority register F IPRF 16 H'FE0A INT 16 2
Interrupt priority register G IPRG 16 H'FE0C INT 16 2
Interrupt priority register H IPRH 16 H'FE0E INT 16 2
Interrupt priority register I IPRI 16 H'FE10 INT 16 2
Interrupt priority register J IPRJ 16 H'FE12 INT 16 2
Interrupt priority register K IPRK 16 H'FE14 INT 16 2
IRQ pin select register ITSR 16 H'FE16 INT 16 2
Software standby release IRQ enable
register
SSIER 16 H'FE18 INT 16 2
IRQ sense control register L ISCRL 16 H'FE1C INT 16 2
IrDA control register_0 IrCR_0 8 H'FE1E IrDA_0 8 2
Port 1 data direction register P1DDR 8 H'FE20 PORT 8 2
Port 2 data direction register P2DDR 8 H'FE21 PORT 8 2
Port 3 data direction register P3DDR 8 H'FE22 PORT 8 2
Port 5 data direction register P5DDR 8 H'FE24 PORT 8 2
Port 8 data direction register P8DDR 8 H'FE27 PORT 8 2
Port A data direction register PADDR 8 H'FE29 PORT 8 2
Port B data direction register PBDDR 8 H'FE2A PORT 8 2
Port C data direction register PCDDR 8 H'FE2B PORT 8 2
Port D data direction register PDDDR 8 H'FE2C PORT 8 2
Port E data direction register PEDDR 8 H'FE2D PORT 8 2
Port F data direction register PFDDR 8 H'FE2E PORT 8 2
Port G data direction register PGDDR 8 H'FE2F PORT 8 2
Port function control register 0 PFCR0 8 H'FE32 PORT 8 2
Port function control register 1 PFCR1 8 H'FE33 PORT 8 2
Port function control register 2 PFCR2 8 H'FE34 PORT 8 2
Port A MOS pull-up control register PAPCR 8 H'FE36 PORT 8 2
Port B MOS pull-up control register PBPCR 8 H'FE37 PORT 8 2
Port C MOS pull-up control register PCPCR 8 H'FE38 PORT 8 2
Port D MOS pull-up control register PDPCR 8 H'FE39 PORT 8 2
Port E MOS pull-up control register PEPCR 8 H'FE3A PORT 8 2
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 842 of 980
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Register Name
Abbrevia-
tion
Bit No.
Address
Module
Data
Width
Access
States
Port 3 open drain control register P3ODR 8 H'FE3C PORT 8 2
Port A open drain control register PAODR 8 H'FE3D PORT 8 2
Serial mode register_3 SMR_3 8 H'FE40 SCI_3 8 2
Bit rate register_3 BRR_3 8 H'FE41 SCI_3 8 2
Serial control register_3 SCR_3 8 H'FE42 SCI_3 8 2
Transmit data register_3 TDR_3 8 H'FE43 SCI_3 8 2
Serial status register_3 SSR_3 8 H'FE44 SCI_3 8 2
Receive data register_3 RDR_3 8 H'FE45 SCI_3 8 2
Smart card mode register_3 SCMR_3 8 H'FE46 SCI_3 8 2
Serial mode register_4 SMR_4 8 H'FE48 SCI_4 8 2
Bit rate register_4 BRR_4 8 H'FE49 SCI_4 8 2
Serial control register_4 SCR_4 8 H'FE4A SCI_4 8 2
Transmit data register_4 TDR_4 8 H'FE4B SCI_4 8 2
Serial status register_4 SSR_4 8 H'FE4C SCI_4 8 2
Receive data register_4 RDR_4 8 H'FE4D SCI_4 8 2
Smart card mode register_4 SCMR_4 8 H'FE4E SCI_4 8 2
Timer control register_3 TCR_3 8 H'FE80 TPU_3 16 2
Timer mode register_3 TMDR_3 8 H'FE81 TPU_3 16 2
Timer I/O control register H_3 TIORH_3 8 H'FE82 TPU_3 16 2
Timer I/O control register L_3 TIORL_3 8 H'FE83 TPU_3 16 2
Timer interrupt enable register_3 TIER_3 8 H'FE84 TPU_3 16 2
Timer status register_3 TSR_3 8 H'FE85 TPU_3 16 2
Timer counter_3 TCNT_3 16 H'FE86 TPU_3 16 2
Timer general register A_3 TGRA_3 16 H'FE88 TPU_3 16 2
Timer general register B_3 TGRB_3 16 H'FE8A TPU_3 16 2
Timer general register C_3 TGRC_3 16 H'FE8C TPU_3 16 2
Timer general register D_3 TGRD_3 16 H'FE8E TPU_3 16 2
Timer control register_4 TCR_4 8 H'FE90 TPU_4 16 2
Timer mode register_4 TMDR_4 8 H'FE91 TPU_4 16 2
Timer I/O control register_4 TIOR_4 8 H'FE92 TPU_4 16 2
Timer interrupt enable register_4 TIER_4 8 H'FE94 TPU_4 16 2
Timer status register_4 TSR_4 8 H'FE95 TPU_4 16 2
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 843 of 980
REJ09B0050-0600
Register Name
Abbrevia-
tion
Bit No.
Address
Module
Data
Width
Access
States
Timer counter_4 TCNT_4 16 H'FE96 TPU_4 16 2
Timer general register A_4 TGRA_4 16 H'FE98 TPU_4 16 2
Timer general register B_4 TGRB_4 16 H'FE9A TPU_4 16 2
Timer control register_5 TCR_5 8 H'FEA0 TPU_5 16 2
Timer mode register_5 TMDR_5 8 H'FEA1 TPU_5 16 2
Timer I/O control register_5 TIOR_5 8 H'FEA2 TPU_5 16 2
Timer interrupt enable register_5 TIER_5 8 H'FEA4 TPU_5 16 2
Timer status register_5 TSR_5 8 H'FEA5 TPU_5 16 2
Timer counter_5 TCNT_5 16 H'FEA6 TPU_5 16 2
Timer general register A_5 TGRA_5 16 H'FEA8 TPU_5 16 2
Timer general register B_5 TGRB_5 16 H'FEAA TPU_5 16 2
Bus width control register ABWCR 8 H'FEC0 BSC 16 2
Access state control register ASTCR 8 H'FEC1 BSC 16 2
Wait control register AH WTCRAH 8 H'FEC2 BSC 16 2
Wait control register AL WTCRAL 8 H'FEC3 BSC 16 2
Wait control register BH WTCRBH 8 H'FEC4 BSC 16 2
Wait control register BL WTCRBL 8 H'FEC5 BSC 16 2
Read strobe timing control register RDNCR 8 H'FEC6 BSC 16 2
CS assertion period control registers H CSACRH 8 H'FEC8 BSC 16 2
CS assertion period control register L CSACRL 8 H'FEC9 BSC 16 2
Burst ROM interface control register H BROMCRH 8 H'FECA BSC 16 2
Burst ROM interface control register L BROMCRL 8 H'FECB BSC 16 2
Bus control register BCR 16 H'FECC BSC 16 2
DRAM control register DRAMCR 16 H'FED0 BSC 16 2
DRAM access control register DRACCR 8 H'FED2 BSC 16 2
Refresh control register REFCR 16 H'FED4 BSC 16 2
Refresh timer counter RTCNT 8 H'FED6 BSC 16 2
Refresh time constant register RTCOR 8 H'FED7 BSC 16 2
Memory address register_0AH MAR_0AH 16 H'FEE0 DMAC 16 2
Memory address register_0AL MAR_0AL 16 H'FEE2 DMAC 16 2
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 844 of 980
REJ09B0050-0600
Register Name
Abbrevia-
tion
Bit No.
Address
Module
Data
Width
Access
States
I/O address register_0A IOAR_0A 16 H'FEE4 DMAC 16 2
Transfer count register_0A ETCR_0A 16 H'FEE6 DMAC 16 2
Memory address register_0BH MAR_0BH 16 H'FEE8 DMAC 16 2
Memory address register_0BL MAR_0BL 16 H'FEEA DMAC 16 2
I/O address register_0B IOAR_0B 16 H'FEEC DMAC 16 2
Transfer count register_0B ETCR_0B 16 H'FEEE DMAC 16 2
Memory address register_1AH MAR_1AH 16 H'FEF0 DMAC 16 2
Memory address register_1AL MAR_1AL 16 H'FEF2 DMAC 16 2
I/O address register_1A IOAR_1A 16 H'FEF4 DMAC 16 2
Transfer count register_1A ETCR_1A 16 H'FEF6 DMAC 16 2
Memory address register_1BH MAR_1BH 16 H'FEF8 DMAC 16 2
Memory address register_1BL MAR_1BL 16 H'FEFA DMAC 16 2
I/O address register_1B IOAR_1B 16 H'FEFC DMAC 16 2
Transfer count register_1B ETCR_1B 16 H'FEFE DMAC 16 2
DMA write enable register DMAWER 8 H'FF20 DMAC 8 2
DMA terminal control register DMATCR 8 H'FF21 DMAC 8 2
DMA control register_0A DMACR_0A 8 H'FF22 DMAC 16 2
DMA control register_0B DMACR_0B 8 H'FF23 DMAC 16 2
DMA control register_1A DMACR_1A 8 H'FF24 DMAC 16 2
DMA control register_1B DMACR_1B 8 H'FF25 DMAC 16 2
DMA band control register H DMABCRH 8 H'FF26 DMAC 16 2
DMA band control register L DMABCRL 8 H'FF27 DMAC 16 2
DTC enable register A DTCERA 8 H'FF28 DTC 16 2
DTC enable register B DTCERB 8 H'FF29 DTC 16 2
DTC enable register C DTCERC 8 H'FF2A DTC 16 2
DTC enable register D DTCERD 8 H'FF2B DTC 16 2
DTC enable register E DTCERE 8 H'FF2C DTC 16 2
DTC enable register F DTCERF 8 H'FF2D DTC 16 2
DTC enable register G DTCERG 8 H'FF2E DTC 16 2
DTC enable register H DTCERH 8 H'FF2F DTC 16 2
DTC vector register DTVECR 8 H'FF30 DTC 16 2
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 845 of 980
REJ09B0050-0600
Register Name
Abbrevia-
tion
Bit No.
Address
Module
Data
Width
Access
States
Interrupt control register INTCR 8 H'FF31 INT 16 2
IRQ enable register IER 16 H'FF32 INT 16 2
IRQ status register ISR 16 H'FF34 INT 16 2
Standby control register SBYCR 8 H'FF3A SYSTEM 8 2
System clock control register SCKCR 8 H'FF3B SYSTEM 8 2
System control register SYSCR 8 H'FF3D SYSTEM 8 2
Mode control register MDCR 8 H'FF3E SYSTEM 8 2
Module stop control register H MSTPCRH 8 H'FF40 SYSTEM 8 2
Module stop control register L MSTPCRL 8 H'FF41 SYSTEM 8 2
Extension module stop control register
H
EXMSTPCR
H
8 H'FF42 SYSTEM 8 2
Extension module stop control register
L
EXMSTPCR
L
8 H'FF43 SYSTEM 8 2
PLL control register PLLCR 8 H'FF45 SYSTEM 8 2
PPG output control register PCR 8 H'FF46 PPG 8 2
PPG output mode register PMR 8 H'FF47 PPG 8 2
Next data enable register H NDERH 8 H'FF48 PPG 8 2
Next data enable register L NDERL 8 H'FF49 PPG 8 2
Output data register H PODRH 8 H'FF4A PPG 8 2
Output data register L PODRL 8 H'FF4B PPG 8 2
Next data register H*1 NDRH 8 H'FF4C PPG 8 2
Next data register L*1 NDRL 8 H'FF4D PPG 8 2
Next data register H*1 NDRH 8 H'FF4E PPG 8 2
Next data register L*1 NDRL 8 H'FF4F PPG 8 2
Port 1 register PORT1 8 H'FF50 PORT 8 2
Port 2 register PORT2 8 H'FF51 PORT 8 2
Port 3 register PORT3 8 H'FF52 PORT 8 2
Port 4 register PORT4 8 H'FF53 PORT 8 2
Port 5 register PORT5 8 H'FF54 PORT 8 2
Port 8 register PORT8 8 H'FF57 PORT 8 2
Port 9 register PORT9 8 H'FF58 PORT 8 2
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 846 of 980
REJ09B0050-0600
Register Name
Abbrevia-
tion
Bit No.
Address
Module
Data
Width
Access
States
Port A register PORTA 8 H'FF59 PORT 8 2
Port B register PORTB 8 H'FF5A PORT 8 2
Port C register PORTC 8 H'FF5B PORT 8 2
Port D register PORTD 8 H'FF5C PORT 8 2
Port E register PORTE 8 H'FF5D PORT 8 2
Port F register PORTF 8 H'FF5E PORT 8 2
Port G register PORTG 8 H'FF5F PORT 8 2
Port 1 data register P1DR 8 H'FF60 PORT 8 2
Port 2 data register P2DR 8 H'FF61 PORT 8 2
Port 3 data register P3DR 8 H'FF62 PORT 8 2
Port 5 data register P5DR 8 H'FF64 PORT 8 2
Port 8 data register P8DR 8 H'FF67 PORT 8 2
Port A data register PADR 8 H'FF69 PORT 8 2
Port B data register PBDR 8 H'FF6A PORT 8 2
Port C data register PCDR 8 H'FF6B PORT 8 2
Port D data register PDDR 8 H'FF6C PORT 8 2
Port E data register PEDR 8 H'FF6D PORT 8 2
Port F data register PFDR 8 H'FF6E PORT 8 2
Port G data register PGDR 8 H'FF6F PORT 8 2
Serial mode register_0 SMR_0 8 H'FF78 SCI_0 8 2
Bit rate register_0 BRR_0 8 H'FF79 SCI_0 8 2
Serial control register_0 SCR_0 8 H'FF7A SCI_0 8 2
Transmit data register_0 TDR_0 8 H'FF7B SCI_0 8 2
Serial status register_0 SSR_0 8 H'FF7C SCI_0 8 2
Receive data register_0 RDR_0 8 H'FF7D SCI_0 8 2
Smart card mode register_0 SCMR_0 8 H'FF7E SCI_0 8 2
Serial mode register_1 SMR_1 8 H'FF80 SCI_1 8 2
Bit rate register_1 BRR_1 8 H'FF81 SCI_1 8 2
Serial control register_1 SCR_1 8 H'FF82 SCI_1 8 2
Transmit data register_1 TDR_1 8 H'FF83 SCI_1 8 2
Serial status register_1 SSR_1 8 H'FF84 SCI_1 8 2
Receive data register_1 RDR_1 8 H'FF85 SCI_1 8 2
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 847 of 980
REJ09B0050-0600
Register Name
Abbrevia-
tion
Bit No.
Address
Module
Data
Width
Access
States
Smart card mode register_1 SCMR_1 8 H'FF86 SCI_1 8 2
Serial mode register_2 SMR_2 8 H'FF88 SCI_2 8 2
Bit rate register_2 BRR_2 8 H'FF89 SCI_2 8 2
Serial control register_2 SCR_2 8 H'FF8A SCI_2 8 2
Transmit data register_2 TDR_2 8 H'FF8B SCI_2 8 2
Serial status register_2 SSR_2 8 H'FF8C SCI_2 8 2
Receive data register_2 RDR_2 8 H'FF8D SCI_2 8 2
Smart card mode register_2 SCMR_2 8 H'FF8E SCI_2 8 2
A/D data register A ADDRA 16 H'FF90 A/D 16 2
A/D data register B ADDRB 16 H'FF92 A/D 16 2
A/D data register C ADDRC 16 H'FF94 A/D 16 2
A/D data register D ADDRD 16 H'FF96 A/D 16 2
A/D data register E ADDRE 16 H'FF98 A/D 16 2
A/D data register F ADDRF 16 H'FF9A A/D 16 2
A/D data register G ADDRG 16 H'FF9C A/D 16 2
A/D data register H ADDRH 16 H'FF9E A/D 16 2
A/D control/status register ADCSR 8 H'FFA0 A/D 16 2
A/D control register ADCR 8 H'FFA1 A/D 16 2
D/A data register 2 DADR2 8 H'FFA8 D/A 8 2
D/A data register 3 DADR3 8 H'FFA9 D/A 8 2
D/A control register 23 DACR23 8 H'FFAA D/A 8 2
Timer control register_0 TCR_0 8 H'FFB0 TMR_0 16 2
Timer control register_1 TCR_1 8 H'FFB1 TMR_1 16 2
Timer control/status register_0 TCSR_0 8 H'FFB2 TMR_0 16 2
Timer control/status register_1 TCSR_1 8 H'FFB3 TMR_1 16 2
Time constant register_A0 TCORA_0 8 H'FFB4 TMR_0 16 2
Time constant register_A1 TCORA_1 8 H'FFB5 TMR_1 16 2
Time constant register_B0 TCORB_0 8 H'FFB6 TMR_0 16 2
Time constant register_B1 TCORB_1 8 H'FFB7 TMR_1 16 2
Timer counter_0 TCNT_0 8 H'FFB8 TMR_0 16 2
Timer counter_1 TCNT_1 8 H'FFB9 TMR_1 16 2
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 848 of 980
REJ09B0050-0600
Register Name
Abbrevia-
tion
Bit No.
Address
Module
Data
Width
Access
States
Timer control/status register TCSR_0 8 H'FFBC*2
(Write)
WDT 16 2
H'FFBC
(Read)
Timer counter TCNT 8 H'FFBC*2
(Write)
WDT 16 2
H'FFBD
(Read)
Reset control/status register RSTCSR 8 H'FFBE*2
(Write)
WDT 16 2
H'FFBF
(Read)
Timer start register TSTR 8 H'FFC0 TPU 16 2
Timer synchronous register TSYR 8 H'FFC1 TPU 16 2
Flash code control status register FCCS*3 8 H'FFC4*4 FLASH 8 2
Flash program code select register FPCS*3 8 H'FFC5*4 FLASH 8 2
Flash erase code select register FECS*3 8 H'FFC6*4 FLASH 8 2
Flash memory control register 1 FLMCR1 8 H'FFC8 FLASH 8 2
Flash key code register FKEY*3 8 H'FFC8 FLASH 8 2
Flash memory control register 2 FLMCR2 8 H'FFC9 FLASH 8 2
Flash MAT select register FMATS*3 8 H'FFC9 FLASH 8 2
Flash transfer destination address
register
FTDAR*3 8 H'FFCA FLASH 8 2
Erase block register 1 EBR1 8 H'FFCA FLASH 8 2
Erase block register 2 EBR2 8 H'FFCB FLASH 8 2
Flash vector address control register FVACR*3 8 H'FFCB FLASH 8 2
Timer control register_0 TCR_0 8 H'FFD0 TPU_0 16 2
Timer mode register_0 TMDR_0 8 H'FFD1 TPU_0 16 2
Timer I/O control register H_0 TIORH_0 8 H'FFD2 TPU_0 16 2
Timer I/O control register L_0 TIORL_0 8 H'FFD3 TPU_0 16 2
Timer interrupt enable register_0 TIER_0 8 H'FFD4 TPU_0 16 2
Timer status register_0 TSR_0 8 H'FFD5 TPU_0 16 2
Timer counter_0 TCNT_0 16 H'FFD6 TPU_0 16 2
Timer general register A_0 TGRA_0 16 H'FFD8 TPU_0 16 2
Timer general register B_0 TGRB_0 16 H'FFDA TPU_0 16 2
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 849 of 980
REJ09B0050-0600
Register Name
Abbrevia-
tion
Bit No.
Address
Module
Data
Width
Access
States
Timer general register C_0 TGRC_0 16 H'FFDC TPU_0 16 2
Timer general register D_0 TGRD_0 16 H'FFDE TPU_0 16 2
Timer control register_1 TCR_1 8 H'FFE0 TPU_1 16 2
Timer mode register_1 TMDR_1 8 H'FFE1 TPU_1 16 2
Timer I/O control register_1 TIOR_1 8 H'FFE2 TPU_1 16 2
Timer interrupt enable register_1 TIER_1 8 H'FFE4 TPU_1 16 2
Timer status register_1 TSR_1 8 H'FFE5 TPU_1 16 2
Timer counter_1 TCNT_1 16 H'FFE6 TPU_1 16 2
Timer general register A_1 TGRA_1 16 H'FFE8 TPU_1 16 2
Timer general register B_1 TGRB_1 16 H'FFEA TPU_1 16 2
Timer control register_2 TCR_2 8 H'FFF0 TPU_2 16 2
Timer mode register_2 TMDR_2 8 H'FFF1 TPU_2 16 2
Timer I/O control register_2 TIOR_2 8 H'FFF2 TPU_2 16 2
Timer interrupt enable register_2 TIER_2 8 H'FFF4 TPU_2 16 2
Timer status rgister_2 TSR_2 8 H'FFF5 TPU_2 16 2
Timer counter_2 TCNT_2 16 H'FFF6 TPU_2 16 2
Timer general register A_2 TGRA_2 16 H'FFF8 TPU_2 16 2
Timer general register B_2 TGRB_2 16 H'FFFA TPU_2 16 2
Notes: 1. If the pulse output group 2 and pulse output group 3 output triggers are the same
according to the PCR setting, the NDRH address will be H'FF4C, and if different, the
address of NDRH for group 2 will be H'FF4E, and that for group 3 will be H'FF4C.
Similarly, if the pulse output group 0 and pulse output group 1 output triggers are the
same according to the PCR setting, the NDRL address will be H'FF4D, and if different,
the address of NDRL for group 0 will be H'FF4F, and that for group 1 will be H'FF4D.
2. For writing, refer to section 13.6.1, Notes on Register Access.
3. Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
4. Cannot be accessed by other than H8S/2368 0.18 μm F-ZTAT Group.
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 850 of 980
REJ09B0050-0600
24.2 Register Bits
Register bit names of the on-chip peripheral modules are described below.
Each line covers eight bits, and 16- or 32-bit registers are shown as 2 or 4 lines.
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module
MRA SM1 SM0 DM1 DM0 MD1 MD0 DTS Sz DTC*1
SAR — — — — — — — —
— — — — — — — —
— — — — — — — —
MRB CHNE DISEL CHNS — — — — —
DAR — — — — — — — —
— — — — — — — —
— — — — — — — —
CRA — — — — — — — —
— — — — — — — —
CRB — — — — — — — —
— — — — — — — —
ICCRA_0 ICE RCVD MST TRS CKS3 CKS2 CKS1 CKS0
ICCRB_0 BBSY SCP SDAO — SCLO — IICRST —
ICMR_0 — WAIT — — BCWP BC2 BC1 BC0
ICIER_0 TIE TEIE RIE NAKIE STIE ACKE ACKBR ACKBT
ICSR_0 TDRE TEND RDRF NACKF STOP AL AAS ADZ
SAR_0 SVA6 SVA5 SVA4 SVA3 SVA2 SVA1 SVA0 —
ICDRT_0 ICDRT7 ICDRT6 ICDRT5 ICDRT4 ICDRT3 ICDRT2 ICDRT1 ICDRT0
ICDRR_0 ICDRR7 ICDRR6 ICDRR5 ICDRR4 ICDRR3 ICDRR2 ICDRR1 ICDRR0
IIC2_0
ICCRA_1 ICE RCVD MST TRS CKS3 CKS2 CKS1 CKS0 IIC2_1
ICCRB_1 BBSY SCP SDAO — SCLO — IICRST —
ICMR_1 — WAIT — — BCWP BC2 BC1 BC0
ICIER_1 TIE TEIE RIE NAKIE STIE ACKE ACKBR ACKBT
ICSR_1 TDRE TEND RDRF NACKF STOP AL AAS ADZ
SAR_1 SVA6 SVA5 SVA4 SVA3 SVA2 SVA1 SVA0 —
ICDRT_1 ICDRT7 ICDRT6 ICDRT5 ICDRT4 ICDRT3 ICDRT2 ICDRT1 ICDRT0
ICDRR_1 ICDRR7 ICDRR6 ICDRR5 ICDRR4 ICDRR3 ICDRR2 ICDRR1 ICDRR0
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 851 of 980
REJ09B0050-0600
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module
SEMR_2 — — — — ABCS ACS2 ACS1 ACS0 SCI_2
Smart card
interface 2
— IPRA14 IPRA13 IPRA12 — IPRA10 IPRA9 IPRA8 IPRA
— IPRA6 IPRA5 IPRA4 — IPRA2 IPRA1 IPRA0
— IPRB14 IPRB13 IPRB12 — IPRB10 IPRB9 IPRB8 IPRB
— IPRB6 IPRB5 IPRB4 — IPRB2 IPRB1 IPRB0
— IPRC14 IPRC13 IPRC12 — IPRC10 IPRC9 IPRC8 IPRC
— IPRC6 IPRC5 IPRC4 — IPRC2 IPRC1 IPRC0
— IPRD14 IPRD13 IPRD12 — IPRD10 IPRD9 IPRD8 IPRD
— IPRD6 IPRD5 IPRD4 — IPRD2 IPRD1 IPRD0
— IPRE14 IPRE13 IPRE12 — IPRE10 IPRE9 IPRE8 IPRE
— IPRE6 IPRE5 IPRE4 — IPRE2 IPRE1 IPRE0
— IPRF14 IPRF13 IPRF12 — IPRF10 IPRF9 IPRF8 IPRF
— IPRF6 IPRF5 IPRF4 — IPRF2 IPRF1 IPRF0
— IPRG14 IPRG13 IPRG12 — IPRG10 IPRG9 IPRG8 IPRG
— IPRG6 IPRG5 IPRG4 — IPRG2 IPRG1 IPRG0
— IPRH14 IPRH13 IPRH12 — IPRH10 IPRH9 IPRH8 IPRH
— IPRH6 IPRH5 IPRH4 — IPRH2 IPRH1 IPRH0
— IPRI14 IPRI13 IPRI12 — IPRI10 IPRI9 IPRI8 IPRI
— IPRI6 IPRI5 IPRI4 — IPRI2 IPRI1 IPRI0
— IPRJ14 IPRJ13 IPRJ12 — IPRJ10 IPRJ9 IPRJ8 IPRJ
— IPRJ6 IPRJ5 IPRJ4 — IPRJ2 IPRJ1 IPRJ0
— IPRK14 IPRK13 IPRK12 — IPRK10 IPRK9 IPRK8 IPRK
— IPRK6 IPRK5 IPRK4 — IPRK2 IPRK1 IPRK0
— — — — — — — —
ITSR
ITS7 ITS6 ITS5 ITS4 ITS3 ITS2 ITS1 ITS0
— — — — — — — —
SSIER
SSI7 SSI6 SSI5 SSI4 SSI3 SSI2 SSI1 SSI0
IRQ7SCB IRQ7SCA IRQ6SCB IRQ6SCA IRQ5SCB IRQ5SCA IRQ4SCB IRQ4SCA ISCR
IRQ3SCB IRQ3SCA IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA
INT
IrCR_0 IrE IrCKS2 IrCKS1 IrCKS0 — — — — IrDA_0
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 852 of 980
REJ09B0050-0600
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module
P1DDR P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR
P2DDR P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR
P3DDR — — P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR
P5DDR — — — — P53DDR P52DDR P51DDR P50DDR
P8DDR — — P85DDR — P83DDR — P81DDR —
PADDR PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR
PBDDR PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR
PCDDR PC7DDR PC6DDR PC5DDR PC4DDR PC3DDR PC2DDR PC1DDR PC0DDR
PDDDR PD7DDR PD6DDR PD5DDR PD4DDR PD3DDR PD2DDR PD1DDR PD0DDR
PEDDR PE7DDR PE6DDR PE5DDR PE4DDR PE3DDR PE2DDR PE1DDR PE0DDR
PFDDR PF7DDR PF6DDR PF5DDR PF4DDR PF3DDR PF2DDR PF1DDR PF0DDR
PGDDR — PG6DDR PG5DDR PG4DDR PG3DDR PG2DDR PG1DDR PG0DDR
PFCR0 CS7E CS6E CS5E CS4E CS3E CS2E CS1E CS0E
PFCR1 A23E A22E A21E A20E A19E A18E A17E A16E
PFCR2 — — — — ASOE LWROE OES —
PAPCR PA7PCR PA6PCR PA5PCR PA4PCR PA3PCR PA2PCR PA1PCR PA0PCR
PBPCR PB7PCR PB6PCR PB5PCR PB4PCR PB3PCR PB2PCR PB1PCR PB0PCR
PCPCR PC7PCR PC6PCR PC5PCR PC4PCR PC3PCR PC2PCR PC1PCR PC0PCR
PDPCR PD7PCR PD6PCR PD5PCR PD4PCR PD3PCR PD2PCR PD1PCR PD0PCR
PORT
PEPCR PE7PCR PE6PCR PE5PCR PE4PCR PE3PCR PE2PCR PE1PCR PE0PCR
P3ODR — — P35ODR P34ODR P33ODR P32ODR P31ODR P30ODR
PAODR PA7ODR PA6ODR PA5ODR PA4ODR PA3ODR PA2ODR PA1ODR PA0ODR
SMR_3*4 C/A CHR PE O/E STOP MP CKS1 CKS0
SMR_3*5 GM BLK PE O/E BCP1 BCP0 CKS1 CKS0
BRR_3 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCI_3
Smart card
interface 3
SCR_3 TIE RIE TE RE MPIE TEIE CKE1 CKE0
TDR_3 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SSR_3*4 TDRE RDRF ORER FER PER TEND MPB MPBT
SSR_3*5 TDRE RDRF ORER ERS PER TEND MPB MPBT
RDR_3 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCMR_3 — — — — SDIR SINV — SMIF
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 853 of 980
REJ09B0050-0600
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module
SMR_4*4 C/A CHR PE O/E STOP MP CKS1 CKS0
SMR_4*5 GM BLK PE O/E BCP1 BCP0 CKS1 CKS0
BRR_4 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCR_4 TIE RIE TE RE MPIE TEIE CKE1 CKE0
TDR_4 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SSR_4*4 TDRE RDRF ORER FER PER TEND MPB MPBT
SSR_4*5 TDRE RDRF ORER ERS PER TEND MPB MPBT
RDR_4 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCMR_4 — — — — SDIR SINV — SMIF
SCI_4
Smart card
interface 4
TCR_3 CCLR2 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0
TMDR_3 — — BFB BFA MD3 MD2 MD1 MD0
TIORH_3 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0
TIORL_3 IOD3 IOD2 IOD1 IOD0 IOC3 IOC2 IOC1 IOC0
TIER_3 TTGE — — TCIEV TGIED TGIEC TGIEB TGIEA
TSR_3 — — — TCFV TGFD TGFC TGFB TGFA
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TCNT_3
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRA_3
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRB_3
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRC_3
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRD_3
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
TPU_3
TCR_4 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 TPU_4
TMDR_4 — — — — MD3 MD2 MD1 MD0
TIOR_4 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0
TIER_4 TTGE — TCIEU TCIEV — — TGIEB TGIEA
TSR_4 TCFD — TCFU TCFV — — TGFB TGFA
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 854 of 980
REJ09B0050-0600
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TCNT_4
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRA_4
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRB_4
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
TPU_4
TCR_5 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0
TMDR_5 — — — — MD3 MD2 MD1 MD0
TIOR_5 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0
TIER_5 TTGE — TCIEU TCIEV — — TGIEB TGIEA
TSR_5 TCFD — TCFU TCFV — — TGFB TGFA
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TCNT_5
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRA_5
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRB_5
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
TPU_5
ABWCR ABW7 ABW6 ABW5 ABW4 ABW3 ABW2 ABW1 ABW0 BSC
ASTCR AST7 AST6 AST5 AST4 AST3 AST2 AST1 AST0
WTCRAH — W72 W71 W70 — W62 W61 W60
WTCRAL — W52 W51 W50 — W42 W41 W40
WTCRBH — W32 W31 W30 — W22 W21 W20
WTCRBL — W12 W11 W10 — W02 W01 W00
RDNCR RDN7 RDN6 RDN5 RDN4 RDN3 RDN2 RDN1 RDN0
CSACRH CSXH7 CSXH6 CSXH5 CSXH4 CSXH3 CSXH2 CSXH1 CSXH0
CSACRL CSXT7 CSXT6 CSXT5 CSXT4 CSXT3 CSXT2 CSXT1 CSXT0
BROMCRH BSRM0 BSTS02 BSTS01 BSTS00 — — BSWD01 BSWD00
BROMCRL BSRM1 BSTS12 BSTS11 BSTS10 — — BSWD11 BSWD10
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 855 of 980
REJ09B0050-0600
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module
BRLE BREQ0E — IDLC ICIS1 ICIS0 WDBE WAITE BCR
— — — — — ICIS2 — —
BSC
OEE RAST — CAST — RMTS2 RMTS1 RMTS0 DRAMCR
BE RCDM DDS — — MXC2 MXC1 MXC0
DRACCR DRMI — TPC1 TPC0 — — RCD1 RCD0
CMF CMIE RCW1 RCW0 — RTCK2 RTCK1 RTCK0 REFCR
RFSHE CBRM RLW1 RLW0 SLFRF TPCS2 TPCS1 TPCS0
RTCNT Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
RTCOR Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
— — — — — — — — MAR_0AH
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 MAR_0AL
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 IOAR_0A
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 ETCR_0A
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
— — — — — — — — MAR_0BH
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8
DMAC
MAR_0BL
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 IOAR_0B
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 ETCR_0B
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
— — — — — — — — MAR_1AH
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 MAR_1AL
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
IOAR_1A Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 856 of 980
REJ09B0050-0600
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 ETCR_1A
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
— — — — — — — — MAR_1BH
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 MAR_1BL
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 IOARV1B
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 ETCR_1B
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
DMAWER — — — — WE1B WE1A WE0B WE0A
DMATCR — — TEE1 TEE0 — — — —
DMACR_0A*2 DTSZ DTID RPE DTDIR DTF3 DTF2 DTF1 DTF0
DMACR_0A*3 DTSZ SAID SAIDE BLKDIR BLKE — — —
DMACR_0B*2 DTSZ DTID RPE DTDIR DTF3 DTF2 DTF1 DTF0
DMACR_0B*3 — DAID DAIDE — DTF3 DTF2 DTF1 DTF0
DMACR_1A*2 DTSZ DTID RPE DTDIR DTF3 DTF2 DTF1 DTF0
DMACR_1A*3 DTSZ SAID SAIDE BLKDIR BLKE — — —
DMACR_1B*2 DTSZ DTID RPE DTDIR DTF3 DTF2 DTF1 DTF0
DMACR_1B*3 — DAID DAIDE — DTF3 DTF2 DTF1 DTF0
DMABCRH*2 FAE1 FAE0 SAE1 SAE0 DTA1B DTA1A DTA0B DTA0A
DMABCRH*3 FAE1 FAE0 — — DTA1 — DTA0 —
DMABCRL*2 DTE1B DTE1A DTE0B DTE0A DTIE1B DTIE1A DTIE0B DTIE0A
DMABCRL*3 DTME1 DTE1 DTME0 DTE0 DTIE1B DTIE1A DTIE0B DTIE0A
DMAC
DTCERA DTCEA7 DTCEA6 DTCEA5 DTCEA4 DTCEA3 DTCEA2 DTCEA1 DTCEA0
DTCERB — — — — — — — —
DTCERC — DTCEC6 DTCEC5 DTCEC4 DTCEC3 DTCEC2 DTCEC1 DTCEC0
DTCERD DTCED7 DTCED6 DTCED5 DTCED4 DTCED3 DTCED2 DTCED1 DTCED0
DTC
DTCERE DTCEE7 DTCEE6 DTCEE5 DTCEE4 DTCEE3 DTCEE2 DTCEE1 DTCEE0
DTCERF DTCEF7 DTCEF6 DTCEF5 DTCEF4 DTCEF3 DTCEF2 DTCEF1 DTCEF0
DTCERG DTCEG7 DTCEG6 DTCEG5 DTCEG4 DTCEG3 DTCEG2 — —
DTCERH — — — — — — — —
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 857 of 980
REJ09B0050-0600
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module
DTVECR SWDTE DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0 DTC
INTCR — — INTM1 INTM0 NMIEG — — — INT
— — — — — — — — IER
IRQ7E IRQ6E IRQ5E IRQ4E IRQ3E IRQ2E IRQ1E IRQ0E
— — — — — — — — ISR
IRQ7F IRQ6F IRQ5F IRQ4F IRQ3F IRQ2F IRQ1F IRQ0F
SBYCR SSBY OPE — — STS3 STS2 STS1 STS0
SCKCR PSTOP — — — STCS SCK2 SCK1 SCK0
SYSCR — — — — FLSHE — EXPE RAME
MDCR — — — — — MDS2 MDS1 MDS0
MSTPCRH ACSE MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8
MSTPCRL MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
EXMSTPCRH — — — — MSTP27 MSTP26 MSTP25 MSTP24
EXMSTPCRL MSTP23 MSTP22 MSTP21 MSTP20 MSTP19 MSTP18 MSTP17 MSTP16
PLLCR — — — — — — STC1 STC0
SYSTEM
PCR G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0
PMR G3INV G2INV G1INV G0INV G3NOV G2NOV G1NOV G0NOV
NDERH NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER8
NDERL NDER7 NDER6 NDER5 NDER4 NDER3 NDER2 NDER1 NDER0
PODRH POD15 POD14 POD13 POD12 POD11 POD10 POD9 POD8
PODRL POD7 POD6 POD5 POD4 POD3 POD2 POD1 POD0
NDRH*6 NDR15 NDR14 NDR13 NDR12 NDR11 NDR10 NDR9 NDR8
NDRL*6 NDR7 NDR6 NDR5 NDR4 NDR3 NDR2 NDR1 NDR0
NDRH*6 — — — — NDR11 NDR10 NDR9 NDR8
NDRL*6 — — — — NDR3 NDR2 NDR1 NDR0
PPG
PORT1 P17 P16 P15 P14 P13 P12 P11 P10 PORT
PORT2 P27 P26 P25 P24 P23 P22 P21 P20
PORT3 — — P35 P34 P33 P32 P31 P30
PORT4 P47 P46 P45 P44 P43 P42 P41 P40
PORT5 — — — — P53 P52 P51 P50
PORT8 — — P85 — P83 — P81 —
PORT9 — — P95 P94 — — — —
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 858 of 980
REJ09B0050-0600
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module
PORTA PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0
PORTB PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0
PORTC PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0
PORTD PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0
PORTE PE7 PE6 PE5 PE4 PE3 PE2 PE1 PE0
PORTF PF7 PF6 PF5 PF4 PF3 PF2 PF1 PF0
PORTG — PG6 PG5 PG4 PG3 PG2 PG1 PG0
P1DR P17DR P16DR P15DR P14DR P13DR P12DR P11DR P10DR
P2DR P27DR P26DR P25DR P24DR P23DR P22DR P21DR P20DR
P3DR — — P35DR P34DR P33DR P32DR P31DR P30DR
P5DR — — — — P53DR P52DR P51DR P50DR
P8DR — — P85DR — P83DR — P81DR —
PADR PA7DR PA6DR PA5DR PA4DR PA3DR PA2DR PA1DR PA0DR
PBDR PB7DR PB6DR PB5DR PB4DR PB3DR PB2DR PB1DR PB0DR
PCDR PC7DR PC6DR PC5DR PC4DR PC3DR PC2DR PC1DR PC0DR
PDDR PD7DR PD6DR PD5DR PD4DR PD3DR PD2DR PD1DR PD0DR
PEDR PE7DR PE6DR PE5DR PE4DR PE3DR PE2DR PE1DR PE0DR
PFDR PF7DR PF6DR PF5DR PF4DR PF3DR PF2DR PF1DR PF0DR
PGDR — PG6DR PG5DR PG4DR PG3DR PG2DR PG1DR PG0DR
PORT
SMR_0*4
SMR_0*5
C/A
GM
CHR
BLK
PE
PE
O/E
O/E
STOP
BCP1
MP
BCP0
CKS1
CKS1
CKS0
CKS0
BRR_0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCR_0 TIE RIE TE RE MPIE TEIE CKE1 CKE0
TDR_0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SSR_0*4
SSR_0*5
TDRE
TDRE
RDRF
RDRF
ORER
ORER
FER
ERS
PER
PER
TEND
TEND
MPB
MPB
MPBT
MPBT
RDR_0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCMR_0 — — — — SDIR SINV — SMIF
SCI_0,
Smart card
interface_0
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 859 of 980
REJ09B0050-0600
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module
SMR_1*4
SMR_1*5
C/A
GM
CHR
BLK
PE
PE
O/E
O/E
STOP
BCP1
MP
BCP0
CKS1
OKS1
CKS0
OKS0
BRR_1 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCR_1 TIE RIE TE RE MPIE TEIE CKE1 CKE0
TDR_1 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SSR_1*4
SSR_1*5
TDRE
TDRE
RDRF
RDRF
ORER
ORER
FER
ERS
PER
PER
TEND
TEND
MPB
MPB
MPBT
MPBT
RDR_1 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCMR_1 — — — — SDIR SINV — SMIF
SCI_1,
Smart card
interface_1
SMR_2*4
SMR_2*5
C/A
GM
CHR
BLK
PE
PE
O/E
O/E
STOP
BCP1
MP
BCP0
CKS1
CKS1
CKS0
CKS0
BRR_2 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCR_2 TIE RIE TE RE MPIE TEIE CKE1 CKE0
TDR_2 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SSR_2*4
SSR_2*5
TDRE
TDRE
RDRF
RDRF
ORER
ORER
FER
ERS
PER
PER
TEND
TEND
MPB
MPB
MPBT
MPBT
RDR_2 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCMR_2 — — — — SDIR SINV — SMIF
SCI_2,
Smart card
interface_2
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 ADDRA
AD1 AD0 — — — — — —
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 ADDRB
AD1 AD0 — — — — — —
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 ADDRC
AD1 AD0 — — — — — —
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 ADDRD
AD1 AD0 — — — — — —
A/D
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 ADDRE
AD1 AD0 — — — — — —
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 ADDRF
AD1 AD0 — — — — — —
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 ADDRG
AD1 AD0 — — — — — —
ADDRH AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2
AD1 AD0 — — — — — —
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 860 of 980
REJ09B0050-0600
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module
ADCSR ADF ADIE ADST — CH3 CH2 CH1 CH0
ADCR TRGS1 TRGS0 SCANE SCANS CKS1 CKS0 — —
A/D
DADR2 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
DADR3 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
DACR23 DAOE3 DAOE2 DAE — — — — —
D/A
TCR_0 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0
TCR_1 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0
TCSR_0 CMFB CMFA OVF ADTE OS3 OS2 OS1 OS0
TCSR_1 CMFB CMFA OVF — OS3 OS2 OS1 OS0
TCORA_0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
TCORA_1 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
TCORB_0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
TCORB_1 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
TCNT_0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
TCNT_1 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
TMR_0
TMR_1
TCSR OVF WT/IT TME — — CKS2 CKS1 CKS0
TCNT Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
RSTCSR WOVF RSTE — — — — — —
WDT
TSTR — — CST5 CST4 CST3 CST2 CST1 CST0
TSYR — — SYNC5 SYNC4 SYNC3 SYNC2 SYNC1 SYNC0
TPU
FCCS*7 — — — FLER — — — SCO FLASH
FPCS*7 — — — PPVD — — — PPVS
FECS*7 — — — — — — — EPVB
FLMCR1 — SWE ESU PSU EV PV E P
FKEY*7 K7 K6 K5 K4 K3 K2 K1 K0
FLMCR2 FLER — — — — — — —
FMATS*7 MS7 MS6 MS5 MS4 MS3 MS2 MS1 MS0
FTDAR*7 TDER TDA6 TDA5 TDA4 TDA3 TDA2 TDA1 TDA0
EBR1 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0
EBR2 — — EB13 EB12 EB11 EB10 EB9 EB8
FVACR*7 FVCHGE — — — FVSEL3 FVSEL2 FVSEL1 FVSEL0
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 861 of 980
REJ09B0050-0600
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module
TCR_0 CCLR2 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0
TMDR_0 — — BFB BFA MD3 MD2 MD1 MD0
TIORH_0 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0
TIORL_0 IOD3 IOD2 IOD1 IOD0 IOC3 IOC2 IOC1 IOC0
TIER_0 TTGE — — TCIEV TGIED TGIEC TGIEB TGIEA
TSR_0 — — — TCFV TGFD TGFC TGFB TGFA
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TCNT_0
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRA_0
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRB_0
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRC_0
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRD_0
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
TPU_0
TCR_1 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 TPU_1
TMDR_1 — — — — MD3 MD2 MD1 MD0
TIOR_1 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0
TIER_1 TTGE — TCIEU TCIEV — — TGIEB TGIEA
TSR_1 TCFD — TCFU TCFV — — TGFB TGFA
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TCNT_1
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRA_1
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
TGRB_1 Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 862 of 980
REJ09B0050-0600
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module
TCR_2 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 TPU_2
TMDR_2 — — — — MD3 MD2 MD1 MD0
TIOR_2 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0
TIER_2 TTGE — TCIEU TCIEV — — TGIEB TGIEA
TSR_2 TCFD — TCFU TCFV — — TGFB TGFA
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TCNT_2
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 TGRA_2
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
TGRB_2 Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Notes: 1. Loaded in on-chip RAM. The bus width is 32 bits when the DTC accesses this area as
register information, and 16 bits otherwise.
2. For short address mode
3. For full address mode
4. For normal mode
5. For smart card interface mode
6. If the pulse output group 2 and pulse output group 3 output triggers are the same
according to the PCR setting, the NDRH address will be H'FF4C, and if different, the
address of NDRH for group 2 will be H'FF4E, and that for group 3 will be H'FF4C.
Similarly, if the pulse output group 0 and pulse output group 1 output triggers are the
same according to the PCR setting, the NDRL address will be H'FF4D, and if different,
the address of NDRL for group 0 will be H'FF4F, and that for group 1 will be H'FF4D.
7. Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 863 of 980
REJ09B0050-0600
24.3 Register States in Each Operating Mode
Register
Name
Reset
High-
Speed
Clock
Division
Sleep
Module
Stop
All Module
Clock Stop
Software
Standby
Hardware
Standby
Module
MRA Initialized — — — — — — Initialized
SAR Initialized — — — — — — Initialized
MRB Initialized — — — — — — Initialized
DAR Initialized — — — — — — Initialized
CRA Initialized — — — — — — Initialized
CRB Initialized — — — — — — Initialized
DTC
ICCRA_0 Initialized — — — — — — Initialized
ICCRB_0 Initialized — — — — — — Initialized
ICMR_0 Initialized — — — — — — Initialized
ICIER_0 Initialized — — — — — — Initialized
ICSR_0 Initialized — — — — — — Initialized
SAR_0 Initialized — — — — — — Initialized
ICDRT_0 Initialized — — — — — — Initialized
ICDRR_0 Initialized — — — — — — Initialized
IIC2_0
ICCRA_1 Initialized — — — — — — Initialized
ICCRB_1 Initialized — — — — — — Initialized
ICMR_1 Initialized — — — — — — Initialized
ICIER_1 Initialized — — — — — — Initialized
ICSR_1 Initialized — — — — — — Initialized
SAR_1 Initialized — — — — — — Initialized
ICDRT_1 Initialized — — — — — — Initialized
ICDRR_1 Initialized — — — — — — Initialized
IIC2_1
SEMR_2 Initialized — — — — — — Initialized SCI2
IPRA Initialized — — — — — — Initialized
IPRB Initialized — — — — — — Initialized
IPRC Initialized — — — — — — Initialized
INT
IPRD Initialized — — — — — — Initialized
IPRE Initialized — — — — — — Initialized
IPRF Initialized — — — — — — Initialized
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 864 of 980
REJ09B0050-0600
Register
Name
Reset
High-
Speed
Clock
Division
Sleep
Module
Stop
All Module
Clock Stop
Software
Standby
Hardware
Standby
Module
IPRG Initialized — — — — — — Initialized
IPRH Initialized — — — — — — Initialized
IPRI Initialized — — — — — — Initialized
IPRJ Initialized — — — — — — Initialized
IPRK Initialized — — — — — — Initialized
ITSR Initialized — — — — — — Initialized
SSIER Initialized — — — — — — Initialized
ISCR Initialized — — — — — — Initialized
INT
IrCR_0 Initialized — — — — — — Initialized IrDA_0
P1DDR Initialized — — — — — — Initialized
P2DDR Initialized — — — — — — Initialized
P3DDR Initialized — — — — — — Initialized
P5DDR Initialized — — — — — — Initialized
P8DDR Initialized — — — — — — Initialized
PADDR Initialized — — — — — — Initialized
PBDDR Initialized — — — — — — Initialized
PCDDR Initialized — — — — — — Initialized
PDDDR Initialized — — — — — — Initialized
PEDDR Initialized — — — — — — Initialized
PFDDR Initialized — — — — — — Initialized
PORT
PGDDR Initialized — — — — — — Initialized
PFCR0 Initialized — — — — — — Initialized
PFCR1 Initialized — — — — — — Initialized
PFCR2 Initialized — — — — — — Initialized
PAPCR Initialized — — — — — — Initialized
PBPCR Initialized — — — — — — Initialized
PCPCR Initialized — — — — — — Initialized
PDPCR Initialized — — — — — — Initialized
PEPCR Initialized — — — — — — Initialized
P3ODR Initialized — — — — — — Initialized
PAODR Initialized — — — — — — Initialized
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 865 of 980
REJ09B0050-0600
Register
Name
Reset
High-
Speed
Clock
Division
Sleep
Module
Stop
All Module
Clock Stop
Software
Standby
Hardware
Standby
Module
SMR_3 Initialized — — — — — — Initialized
BRR_3 Initialized — — — — — — Initialized
SCR_3 Initialized — — — — — — Initialized
TDR_3 Initialized — — — Initialized Initialized Initialized Initialized
SSR_3 Initialized — — — Initialized Initialized Initialized Initialized
RDR_3 Initialized — — — Initialized Initialized Initialized Initialized
SCMR_3 Initialized — — — — — — Initialized
SCI_3
SMR_4 Initialized — — — — — — Initialized
BRR_4 Initialized — — — — — — Initialized
SCR_4 Initialized — — — — — — Initialized
TDR_4 Initialized — — — Initialized Initialized Initialized Initialized
SSR_4 Initialized — — — Initialized Initialized Initialized Initialized
RDR_4 Initialized — — — Initialized Initialized Initialized Initialized
SCMR_4 Initialized — — — — — — Initialized
SCI_4
TCR_3 Initialized — — — — — — Initialized
TMDR_3 Initialized — — — — — — Initialized
TIORH_3 Initialized — — — — — — Initialized
TIORL_3 Initialized — — — — — — Initialized
TIER_3 Initialized — — — — — — Initialized
TSR_3 Initialized — — — — — — Initialized
TCNT_3 Initialized — — — — — — Initialized
TGRA_3 Initialized — — — — — — Initialized
TGRB_3 Initialized — — — — — — Initialized
TGRC_3 Initialized — — — — — — Initialized
TGRD_3 Initialized — — — — — — Initialized
TPU_3
TCR_4 Initialized — — — — — — Initialized TPU_4
TMDR_4 Initialized — — — — — — Initialized
TIOR_4 Initialized — — — — — — Initialized
TIER_4 Initialized — — — — — — Initialized
TSR_4 Initialized — — — — — — Initialized
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 866 of 980
REJ09B0050-0600
Register
Name
Reset
High-
Speed
Clock
Division
Sleep
Module
Stop
All Module
Clock Stop
Software
Standby
Hardware
Standby
Module
TCNT_4 Initialized — — — — — — Initialized
TGRA_4 Initialized — — — — — — Initialized
TGRB_4 Initialized — — — — — — Initialized
TPU_4
TCR_5 Initialized — — — — — — Initialized
TMDR_5 Initialized — — — — — — Initialized
TIOR_5 Initialized — — — — — — Initialized
TIER_5 Initialized — — — — — — Initialized
TSR_5 Initialized — — — — — — Initialized
TCNT_5 Initialized — — — — — — Initialized
TGRA_5 Initialized — — — — — — Initialized
TGRB_5 Initialized — — — — — — Initialized
TPU_5
ABWCR Initialized — — — — — — Initialized
ASTCR Initialized — — — — — — Initialized
WTCRAH Initialized — — — — — — Initialized
WTCRAL Initialized — — — — — — Initialized
WTCRBH Initialized — — — — — — Initialized
WTCRBL Initialized — — — — — — Initialized
RDNCR Initialized — — — — — — Initialized
CSACRH Initialized — — — — — — Initialized
CSACRL Initialized — — — — — — Initialized
BROMCRH Initialized — — — — — — Initialized
BROMCRL Initialized — — — — — — Initialized
BCR Initialized — — — — — — Initialized
BSC
DRAMCR Initialized — — — — — — Initialized
DRACCR Initialized — — — — — — Initialized
REFCR Initialized — — — — — — Initialized
RTCNT Initialized — — — — — — Initialized
RTCOR Initialized — — — — — — Initialized
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 867 of 980
REJ09B0050-0600
Register
Name
Reset
High-
Speed
Clock
Division
Sleep
Module
Stop
All Module
Clock Stop
Software
Standby
Hardware
Standby
Module
MAR_0AH Initialized — — — — — — Initialized
MAR_0AL Initialized — — — — — — Initialized
IOAR_0A Initialized — — — — — — Initialized
ETCR_0A Initialized — — — — — — Initialized
MAR_0BH Initialized — — — — — — Initialized
MAR_0BL Initialized — — — — — — Initialized
IOAR_0B Initialized — — — — — — Initialized
ETCR_0B Initialized — — — — — — Initialized
MAR_1AH Initialized — — — — — — Initialized
MAR_1AL Initialized — — — — — — Initialized
IOAR_1A Initialized — — — — — — Initialized
ETCR_1A Initialized — — — — — — Initialized
MAR_1BH Initialized — — — — — — Initialized
MAR_1BL Initialized — — — — — — Initialized
IOAR_1B Initialized — — — — — — Initialized
ETCR_1B Initialized — — — — — — Initialized
DMAWER Initialized — — — — — — Initialized
DMATCR Initialized — — — — — — Initialized
DMACR_0A Initialized — — — — — — Initialized
DMACR_0B Initialized — — — — — — Initialized
DMACR_1A Initialized — — — — — — Initialized
DMACR_1B Initialized — — — — — — Initialized
DMABCRH Initialized — — — — — — Initialized
DMABCRL Initialized — — — — — — Initialized
DMAC
DTCERA Initialized — — — — — — Initialized DTC
DTCERB Initialized — — — — — — Initialized
DTCERC Initialized — — — — — — Initialized
DTCERD Initialized — — — — — — Initialized
DTCERE Initialized — — — — — — Initialized
DTCERF Initialized — — — — — — Initialized
DTCERG Initialized — — — — — — Initialized
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 868 of 980
REJ09B0050-0600
Register
Name
Reset
High-
Speed
Clock
Division
Sleep
Module
Stop
All Module
Clock Stop
Software
Standby
Hardware
Standby
Module
DTVECH Initialized — — — — — — Initialized
DTVECR Initialized — — — — — — Initialized
DTC
INTCR Initialized — — — — — — Initialized
IER Initialized — — — — — — Initialized
ISR Initialized — — — — — — Initialized
INT
SBYCR Initialized — — — — — — Initialized
SCKCR Initialized — — — — — — Initialized
SYSCR Initialized — — — — — — Initialized
MDCR Initialized — — — — — — Initialized
MSTPCRH Initialized — — — — — — Initialized
MSTPCRL Initialized — — — — — — Initialized
EXMSTPCRH Initialized — — — — — — Initialized
EXMSTPCRL Initialized — — — — — — Initialized
PLLCR Initialized — — — — — — Initialized
SYSTEM
PCR Initialized — — — — — — Initialized
PMR Initialized — — — — — — Initialized
NDERH Initialized — — — — — — Initialized
NDERL Initialized — — — — — — Initialized
PODRH Initialized — — — — — — Initialized
PODRL Initialized — — — — — — Initialized
NDRH Initialized — — — — — — Initialized
NDRL Initialized — — — — — — Initialized
NDRH Initialized — — — — — — Initialized
NDRL Initialized — — — — — — Initialized
PPG
PORT1 — — — — — — — — PORT
PORT2 — — — — — — — —
PORT3 — — — — — — — —
PORT4 — — — — — — — —
PORT5 — — — — — — — —
PORT8 — — — — — — — —
PORT9 — — — — — — — —
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 869 of 980
REJ09B0050-0600
Register
Name
Reset
High-
Speed
Clock
Division
Sleep
Module
Stop
All Module
Clock Stop
Software
Standby
Hardware
Standby
Module
PORTA — — — — — — — —
PORTB — — — — — — — —
PORTC — — — — — — — —
PORTD — — — — — — — —
PORTE — — — — — — — —
PORTF — — — — — — — —
PORTG — — — — — — — —
P1DR Initialized — — — — — — Initialized
P2DR Initialized — — — — — — Initialized
P3DR Initialized — — — — — — Initialized
P5DR Initialized — — — — — — Initialized
P8DR Initialized — — — — — — Initialized
PADR Initialized — — — — — — Initialized
PBDR Initialized — — — — — — Initialized
PCDR Initialized — — — — — — Initialized
PDDR Initialized — — — — — — Initialized
PEDR Initialized — — — — — — Initialized
PFDR Initialized — — — — — — Initialized
PGDR Initialized — — — — — — Initialized
PORT
SMR_0 Initialized — — — — — — Initialized SCI_0
BRR_0 Initialized — — — — — — Initialized
SCR_0 Initialized — — — — — — Initialized
TDR_0 Initialized — — — Initialized Initialized Initialized Initialized
SSR_0 Initialized — — — Initialized Initialized Initialized Initialized
RDR_0 Initialized — — — Initialized Initialized Initialized Initialized
SCMR_0 Initialized — — — — — — Initialized
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 870 of 980
REJ09B0050-0600
Register
Name
Reset
High-
Speed
Clock
Division
Sleep
Module
Stop
All Module
Clock Stop
Software
Standby
Hardware
Standby
Module
SMR_1 Initialized — — — — — — Initialized
BRR_1 Initialized — — — — — — Initialized
SCR_1 Initialized — — — — — — Initialized
TDR_1 Initialized — — — Initialized Initialized Initialized Initialized
SSR_1 Initialized — — — Initialized Initialized Initialized Initialized
RDR_1 Initialized — — — Initialized Initialized Initialized Initialized
SCMR_1 Initialized — — — — — — Initialized
SCI_1
SMR_2 Initialized — — — — — — Initialized
BRR_2 Initialized — — — — — — Initialized
SCR_2 Initialized — — — — — — Initialized
TDR_2 Initialized — — — Initialized Initialized Initialized Initialized
SSR_2 Initialized — — — Initialized Initialized Initialized Initialized
RDR_2 Initialized — — — Initialized Initialized Initialized Initialized
SCMR_2 Initialized — — — — — — Initialized
SCI_2
ADDRA Initialized — — — — — — Initialized
ADDRB Initialized — — — — — — Initialized
ADDRC Initialized — — — — — — Initialized
ADDRD Initialized — — — — — — Initialized
ADDRE Initialized — — — — — — Initialized
ADDRF Initialized — — — — — — Initialized
ADDRG Initialized — — — — — — Initialized
ADDRH Initialized — — — — — — Initialized
ADCSR Initialized — — — — — — Initialized
ADCR Initialized — — — — — — Initialized
A/D
DADR2 Initialized — — — — — — Initialized D/A
DADR3 Initialized — — — — — — Initialized
DACR23 Initialized — — — — — — Initialized
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 871 of 980
REJ09B0050-0600
Register
Name
Reset
High-
Speed
Clock
Division
Sleep
Module
Stop
All Module
Clock Stop
Software
Standby
Hardware
Standby
Module
TCR_0 Initialized — — — — — — Initialized
TCR_1 Initialized — — — — — — Initialized
TCSR_0 Initialized — — — — — — Initialized
TCSR_1 Initialized — — — — — — Initialized
TCORA_0 Initialized — — — — — — Initialized
TCORA_1 Initialized — — — — — — Initialized
TCORB_0 Initialized — — — — — — Initialized
TCORB_1 Initialized — — — — — — Initialized
TCNT_0 Initialized — — — — — — Initialized
TCNT_1 Initialized — — — — — — Initialized
TMR_0
TMR_1
TCSR Initialized — — — — — — Initialized
TCNT Initialized — — — — — — Initialized
RSTCSR Initialized — — — — — — Initialized
WDT
TSTR Initialized — — — — — — Initialized
TSYR Initialized — — — — — — Initialized
TPU
FCCS* Initialized — — — — — — Initialized FLASH
FPCS* Initialized — — — — — — Initialized
FECS* Initialized — — — — — — Initialized
FLMCR1 Initialized — — — — — — Initialized
FKEY* Initialized — — — — — — Initialized
FLMCR2 Initialized — — — — — — Initialized
FMATS* Initialized — — — — — — Initialized
FTDAR* Initialized — — — — — — Initialized
EBR1 Initialized — — — — — — Initialized
EBR2 Initialized — — — — — — Initialized
FVACR* Initialized — — — — — — Initialized
Section 24 List of Registers
Rev.6.00 Mar. 18, 2009 Page 872 of 980
REJ09B0050-0600
Register
Name
Reset
High-
Speed
Clock
Division
Sleep
Module
Stop
All Module
Clock Stop
Software
Standby
Hardware
Standby
Module
TCR_0 Initialized — — — — — — Initialized TPU_0
TMDR_0 Initialized — — — — — — Initialized
TIORH_0 Initialized — — — — — — Initialized
TIORL_0 Initialized — — — — — — Initialized
TIER_0 Initialized — — — — — — Initialized
TSR_0 Initialized — — — — — — Initialized
TCNT_0 Initialized — — — — — — Initialized
TGRA_0 Initialized — — — — — — Initialized
TGRB_0 Initialized — — — — — — Initialized
TGRC_0 Initialized — — — — — — Initialized
TGRD_0 Initialized — — — — — — Initialized
TCR_1 Initialized — — — — — — Initialized
TMDR_1 Initialized — — — — — — Initialized
TIOR_1 Initialized — — — — — — Initialized
TIER_1 Initialized — — — — — — Initialized
TSR_1 Initialized — — — — — — Initialized
TCNT_1 Initialized — — — — — — Initialized
TGRA_1 Initialized — — — — — — Initialized
TGRB_1 Initialized — — — — — — Initialized
TPU_1
TCR_2 Initialized — — — — — — Initialized
TMDR_2 Initialized — — — — — — Initialized
TIOR_2 Initialized — — — — — — Initialized
TIER_2 Initialized — — — — — — Initialized
TPU_2
TSR_2 Initialized — — — — — — Initialized
TCNT_2 Initialized — — — — — — Initialized
TGRA_2 Initialized — — — — — — Initialized
TGRB_2 Initialized — — — — — — Initialized
Note: * Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 873 of 980
REJ09B0050-0600
Section 25 Electrical Characteristics
25.1 Electrical Characteristics of Masked ROM and ROMless Versions
25.1.1 Absolute Maximum Ratings
Table 25.1 lists the absolute maximum ratings.
Table 25.1 Absolute Maximum Ratings
Item Symbol Value Unit
Power supply voltage VCC
PLLVCC
–0.3 to +4.0 V
Input voltage (except ports 4, 9) Vin –0.3 to VCC +0.3 V
Input voltage (ports 4, 9) Vin –0.3 to AVCC +0.3 V
Reference power supply voltage Vref –0.3 to AVCC +0.3 V
Analog power supply voltage AVCC –0.3 to +4.0 V
Analog input voltage VAN –0.3 to AVCC +0.3 V
Operating temperature Topr Regular specifications:
–20 to +75
°C
Wide-range specifications:
–40 to +85
°C
Storage temperature Tstg –55 to +125 °C
Caution: Permanent damage to the LSI may result if absolute maximum ratings are exceeded.
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 874 of 980
REJ09B0050-0600
25.1.2 DC Characteristics
Table 25.2 DC Characteristics (1)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC,
VSS = AVSS = 0 V*1, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
VT– V
CC × 0.2 — — V
VT+ — — VCC × 0.7 V
Schmitt
trigger input
voltage
Ports 1, 2, and 4*2,
P50 to P53*2,
PA4 to PA7*2 VT+ – VT–VCC × 0.07 — — V
Input high
voltage
STBY,
MD2 to MD0
VIH V
CC × 0.9 — VCC +0.3 V
RES, NMI, EMLE VCC × 0.9 — VCC +0.3 V
EXTAL VCC × 0.7 — VCC +0.3 V
Port 3,
P50 to P53*3, port
8, ports A to G*3
2.2V — VCC +0.3 V
Ports 4 and 9 2.2V — VCC +0.3 V
Input low
voltage
RES, STBY,
MD2 to MD0,
EMLE
VIL –0.3 — VCC × 0.1 V
NMI, EXTAL –0.3 — VCC × 0.2 V
Ports 3 to 5*3, 8, 9,
A to G*3
–0.3 — VCC × 0.2 V
Output high All output pins VOH V
CC –0.5 — — V IOH = –200 μA
voltage V
CC –1.0 — — V IOH = –1 mA
All output pins VOL — — 0.4 V IOL = 1.6 mA Output low
voltage P32 to P35*4 — — 0.5 V IOL = 8.0 mA
Notes: 1. When the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS
pins open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS.
2. When used as IRQ0 to IRQ7.
3. When used as other than IRQ0 to IRQ7.
4. When used as SCL0 to SCL1, SDA0 to SDA1.
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 875 of 980
REJ09B0050-0600
Table 25.3 DC Characteristics (2)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC,
VSS = AVSS = 0 V*1, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
RES |Iin| — — 10.0 μA Vin = 0.5 to
VCC –0.5 V
STBY, NMI,
MD2 to MD0
— — 1.0 μA
Input
leakage
current
Ports 4 and 9 — — 1.0 μA Vin = 0.5 to
AVCC –0.5 V
Three-state
leakage
current
(off state)
Ports 1 to 3,
P50 to P53,
ports 8, A to G
| ITSI | — — 1.0 μA Vin = 0.5 to
VCC –0.5 V
Input pull-up
MOS current
Ports A to E –Ip 10 — 300 μA VCC = 3.0 to
3.6 V
Vin = 0 V
RES Cin — — 30 pF Vin = 0 V
NMI — — 30 pF f = 1 MHz
Input
capacitance
All input pins
except RES
and NMI
— — 15 pF Ta = 25°C
Normal operation ICC*4 — 75
(3.3 V)
115 mA f = 33 MHz
Sleep mode — 55
(3.3 V)
95 mA f = 33 MHz
Standby mode*3 — 0.01 10 μA Ta ≤ 50°C
Current
dissipation*2
— — 80 μA 50°C < Ta
During A/D and
D/A conversion
AICC — 0.3
(3.0 V)
2.0 mA Analog
power
supply
current Idle — 0.01 5.0 μA
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 876 of 980
REJ09B0050-0600
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
During A/D and
D/A conversion
AICC — 2.0
(3.0 V)
3.5 mA Reference
power
supply
current Idle — 0.01 5.0 μA
RAM standby voltage VRAM 2.0 — — V
Notes: 1. When the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS
pins open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS.
2. Current dissipation values are for VIHmin = VCC – 0.2 V and VILmax = 0.2 V with all output
pins unloaded and all MOS input pull-ups in the off state.
3. The values are for VRAM ≤ VCC < 3.0 V, VIHmin = VCC × 0.9, and VILmax = 0.3 V.
4. ICC depends on VCC and f as follows:
ICCmax = 1.0 (mA) + 0.95 (mA/(MHz × V)) × VCC × f (normal operation)
ICCmax = 1.0 (mA) + 0.8 (mA/(MHz × V)) × VCC × f (sleep mode)
Table 25.4 Permissible Output Currents
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC,
VSS = AVSS = 0 V*, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Typ Max Unit
SCL0, 1, SDA0, 1 — — 8.0 Permissible output low
current (per pin) Output pins other
than the above
IOL
— — 2.0
mA
Permissible output low
current (total)
Total of all output
pins
ΣIOL — — 80 mA
Permissible output high
current (per pin)
All output pins –IOH — — 2.0 mA
Permissible output high
current (total)
Total of all output
pins
Σ–IOH — — 40 mA
Caution: To protect the LSI’s reliability, do not exceed the output current values in table 25.4.
Note: * When the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS
pins open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS.
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 877 of 980
REJ09B0050-0600
25.1.3 AC Characteristics
LSI output pin
CRH
RL
3 V
C = 50 pF: ports A to G
C = 30 pF: ports 1 to 3,
P50 to P53,
port 8
RL = 2.4 kΩ
RH = 12 kΩ
Input/output timing
measurement level:
1.5 V (V
CC
= 3.0 V to 3.6 V)
Figure 25.1 Output Load Circuit
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 878 of 980
REJ09B0050-0600
(1) Clock Timing
Table 25.5 Clock Timing
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Max Unit Test Conditions
Clock cycle time tcyc 30.3 125 ns Figure 25.2
Clock pulse high width tCH 10 — ns
Clock pulse low width tCL 10 — ns
Clock rise time tCr — 5 ns
Clock fall time tCf — 5 ns
Figure 25.2
Reset oscillation stabilization
time (crystal)
tOSC1 10 — ms Figure 25.3(1)
Software standby oscillation
stabilization time (crystal)
tOSC2 10 — ms Figure 25.3(2)
External clock output delay
stabilization time
tDEXT 1 — ms Figure 25.3(1)
tcyc
tCH tCf
tCL tCr
Figure 25.2 System Clock Timing
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 879 of 980
REJ09B0050-0600
EXTAL
V
CC
STBY
RES
φ
t
DEXT
t
OSC1
t
DEXT
t
OSC1
Figure 25.3 Oscillation Stabilization Timing (1)
Oscillator
Software standby mode
(power-down mode) Oscillation
stabilization time
tOSC2
φ
NMI
NMI exception
handling
NMIEG = 1
SSBY = 1
NMI exception handling
SLEEP
instruction
NMIEG
SSBY
Figure 25.3 Oscillation Stabilization Timing (2)
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 880 of 980
REJ09B0050-0600
(2) Control Signal Timing
Table 25.6 Control Signal Timing
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Max Unit Test Conditions
RES setup time tRESS 200 — ns Figure 25.4
RES pulse width tRESW 20 — tcyc
NMI setup time tNMIS 150 — ns Figure 25.5
NMI hold time tNMIH 10 —
NMI pulse width (in recovery from
software standby mode)
tNMIW 200 —
IRQ setup time tIRQS 150 — ns
IRQ hold time tIRQH 10 —
IRQ pulse width (in recovery from
software standby mode)
tIRQW 200 —
φ
RES
t
RESS
t
RESS
t
RESW
Figure 25.4 Reset Input Timing
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 881 of 980
REJ09B0050-0600
φ
NMI
IRQi
(i = 0 to 7)*
IRQ
(edge input)
Note: * Necessary for SSIER setting to clear software standby mode.
tNMIS tNMIH
tIRQS
tIRQS
tIRQH
tNMIW
tIRQW
IRQ
(level input)
Figure 25.5 Interrupt Input Timing
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 882 of 980
REJ09B0050-0600
(3) Bus Timing
Table 25.7 Bus Timing (1)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Max Unit Test Conditions
Address delay time tAD — 20 ns
Address setup time 1 tAS1 0.5 × tcyc –13 — ns
Figures 25.6 to
25.19
Address setup time 2 tAS2 1.0 × tcyc –13 — ns
Address setup time 3 tAS3 1.5 × tcyc –13 — ns
Address setup time 4 tAS4 2.0 × tcyc –13 — ns
Address hold time 1 tAH1 0.5 × tcyc –8 — ns
Address hold time 2 tAH2 1.0 × tcyc –8 — ns
Address hold time 3 tAH3 1.5 × tcyc –8 — ns
CS delay time 1 tCSD1 — 15 ns
CS delay time 2 tCSD2 — 15 ns
CS delay time 3 tCSD3 — 20 ns
AS delay time tASD — 15 ns
RD delay time 1 tRSD1 — 15 ns
RD delay time 2 tRSD2 — 15 ns
Read data setup time 1 tRDS1 15 — ns
Read data setup time 2 tRDS2 15 — ns
Read data hold time 1 tRDH1 0 — ns
Read data hold time 2 tRDH2 0 — ns
Read data access time 1 tAC1 — 1.0 × tcyc –20 ns
Read data access time 2 tAC2 — 1.5 × tcyc –20 ns
Read data access time 3 tAC3 — 2.0 × tcyc –20 ns
Read data access time 4 tAC4 — 2.5 × tcyc –20 ns
Read data access time 5 tAC5 — 1.0 × tcyc –20 ns
Read data access time 6 tAC6 — 2.0 × tcyc –20 ns
Read data access time 7 tAC7 — 4.0 × tcyc –20 ns
Read data access time 8 tAC8 — 3.0 × tcyc –20 ns
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 883 of 980
REJ09B0050-0600
Item Symbol Min Max Unit Test Conditions
Address read data access time 1 tAA1 — 1.0 × tcyc –20 ns
Address read data access time 2 tAA2 — 1.5 × tcyc –20 ns
Address read data access time 3 tAA3 — 2.0 × tcyc –20 ns
Figures 25.6 to
25.19
Address read data access time 4 tAA4 — 2.5 × tcyc –20 ns
Address read data access time 5 tAA5 — 3.0 × tcyc –20 ns
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 884 of 980
REJ09B0050-0600
Table 25.8 Bus Timing (2)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Max Unit Test Conditions
WR delay time 1 tWRD1 — 15 ns
WR delay time 2 tWRD2 — 15 ns
Figures 25.6 to
25.19
WR pulse width 1 tWSW1 1.0 × tcyc –13 — ns
WR pulse width 2 tWSW2 1.5 × tcyc –13 — ns
Write data delay time tWDD — 20 ns
Write data setup time 1 tWDS1 0.5 × tcyc –13 — ns
Write data setup time 2 tWDS2 1.0 × tcyc –13 — ns
Write data setup time 3 tWDS3 1.5 × tcyc –13 — ns
Write data hold time 1 tWDH1 0.5 × tcyc –8 — ns
Write data hold time 2 tWDH2 1.0 × tcyc –8 — ns
Write data hold time 3 tWDH3 1.5 × tcyc –8 — ns
Write command setup time 1 tWCS1 0.5 × tcyc –10 — ns
Write command setup time 2 tWCS2 1.0 × tcyc –10 — ns
Write command hold time 1 tWCH1 0.5 × tcyc –10 — ns
Write command hold time 2 tWCH2 1.0 × tcyc –10 — ns
Read command setup time 1 tRCS1 1.5 × tcyc –10 — ns
Read command setup time 2 tRCS2 2.0 × tcyc –10 — ns
Read command hold time tRCH 0.5 × tcyc –10 — ns
CAS delay time 1 tCASD1 — 15 ns
CAS delay time 2 tCASD2 — 15 ns
CAS setup time 1 tCSR1 0.5 × tcyc –10 — ns
CAS setup time 2 tCSR2 1.5 × tcyc –10 — ns
CAS pulse width 1 tCASW1 1.0 × tcyc –20 — ns
CAS pulse width 2 tCASW2 1.5 × tcyc –20 — ns
CAS precharge time 1 tCPW1 1.0 × tcyc –20 — ns
CAS precharge time 2 tCPW2 1.5 × tcyc –20 — ns
OE delay time 1 tOED1 — 15 ns
OE delay time 2 tOED2 — 15 ns
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 885 of 980
REJ09B0050-0600
Item Symbol Min Max Unit Test Conditions
Precharge time 1 tPCH1 1.0 × tcyc –20 — ns
Precharge time 2 tPCH2 1.5 × tcyc –20 — ns
Figures 25.6 to
25.19
Self-refresh precharge time 1 tRPS1 2.5 × tcyc –20 — ns
Self-refresh precharge time 2 tRPS2 3.0 × tcyc –20 — ns
Figures 25.20 and
25.21
WAIT setup time tWTS 25 — ns
WAIT hold time tWTH 5 — ns
Figures 25.8 and
25.14
BREQ setup time tBREQS 30 — ns Figure 25.22
BACK delay time tBACD — 15 ns
Bus floating time tBZD — 40 ns
BREQO delay time tBRQOD — 25 ns Figure 25.23
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 886 of 980
REJ09B0050-0600
φ
T
1
T
2
A23 to A0
CS7 to CS0
AS
RD
D15 to D0
RD
D15 to D0
HWR, LWR
D15 to D0
Read
(RDNn = 1)
Read
(RDNn = 0)
Write
t
AD
t
CSD1
t
AS1
t
AS1
t
AS1
t
AS1
t
RSD1
t
RSD1
t
AC5
t
AA2
t
RSD1
t
WRD2
t
WSW1
t
WDH1
t
WDD
t
WRD2
t
AH1
t
AC2
t
RDS2
t
AA3
t
RSD2
t
RDS1
t
RDH1
t
AH1
t
ASD
t
ASD
DACK0, DACK1
t
DACD1
t
DACD2
t
RDH2
Figure 25.6 Basic Bus Timing: Two-State Access
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 887 of 980
REJ09B0050-0600
T1
φ
A23 to A0
CS7 to CS0
AS
RD
D15 to D0
RD
D15 to D0
HWR, LWR
D15 to D0
T2T3
Read
(RDNn = 1)
Read
(RDNn = 0)
Write
tAD
tAS1 tAH1
tRSD1
tRDS1 tRDH1
tRSD2
tRDS2 tRDH2
tASD
tASD
tRSD1
tRSD1
tAC6
tAC4
tAA5
tAS2
tWSW2
tWDS1
tWRD1
tWRD2 tAH1
tAA4
tAS1
tAS1
tCSD1
DACK0, DACK1
tDACD1 tDACD2
tWDH1
tWDD
Figure 25.7 Basic Bus Timing: Three-State Access
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 888 of 980
REJ09B0050-0600
T
1
φ
A23 to A0
CS7 to CS0
AS
RD
D15 to D0
RD
D15 to D0
HWR, LWR
D15 to D0
WAIT
t
WTS
t
WTH
t
WTS
t
WTH
T
2
T
w
T
3
Read
(RDNn = 1)
Read
(RDNn = 0)
Write
Figure 25.8 Basic Bus Timing: Three-State Access, One Wait
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 889 of 980
REJ09B0050-0600
T
h
t
AD
t
CSD1
t
AS1
t
ASD
t
AS3
t
RSD1
t
AC5
t
RDS1
t
RDH1
t
AH2
t
AH3
t
WDH3
t
WSW1
t
WDS2
t
WDD
t
AS3
t
WRD2
t
WRD2
t
RSD2
t
RSD1
t
AC2
t
RDS2
t
RDH2
t
AS3
t
RSD1
t
AH3
t
AH1
t
ASD
φ
A23 to A0
CS7 to CS0
AS
RD
D15 to D0
RD
D15 to D0
HWR, LWR
D15 to D0
T
1
T
2
T
t
Read
(RDNn = 1)
Read
(RDNn = 0)
Write
DACK0, DACK1
t
DACD1
t
DACD2
Figure 25.9 Basic Bus Timing: Two-State Access (CS Assertion Period Extended)
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 890 of 980
REJ09B0050-0600
T
h
t
AD
t
CSD1
t
AS1
t
ASD
t
AS3
t
RSD1
t
RSD1
t
ASD
t
AH1
t
AH3
t
AH2
t
AH3
t
WDH3
t
WSW2
t
WDS3
t
AS4
t
AS3
t
RSD1
t
WRD2
t
WRD1
t
AC4
t
RDH2
t
RSD2
t
AC6
t
RDH1
T
1
T
2
T
3
T
t
φ
A23 to A0
CS7 to CS0
AS
RD
D15 to D0
RD
D15 to D0
D15 to D0
HWR, LWR
Read
(RDNn = 1)
Read
(RDNn = 0)
Write
DACK0, DACK1
t
DACD1
t
DACD2
t
RDS2
t
WDD
t
RDS1
Figure 25.10 Basic Bus Timing: Three-State Access (CS Assertion Period Extended)
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 891 of 980
REJ09B0050-0600
T1
φ
A23 to A6,
A0
A5 to A1
CS1, CS0
AS
RD
D15 to D0
HWR, LWR
T2T1
tAD
tRSD2
tAA1 tRDS2 tRDH2
T1
Read
Figure 25.11 Burst ROM Access Timing: One-State Burst Access
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 892 of 980
REJ09B0050-0600
T
1
φ
A23 to A6,
A0
A5 to A1
CS1, CS0
AS
RD
D15 to D0
HWR, LWR
T
2
T
3
T
1
t
AD
t
AS1
t
ASD
t
AA3
t
RSD2
t
RDS2
t
RDH2
t
ASD
t
AH1
T
2
Read
Figure 25.12 Burst ROM Access Timing: Two-State Burst Access
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 893 of 980
REJ09B0050-0600
T
p
t
AD
t
AS3
t
AH1
t
CSD2
t
PCH2
t
AS2
t
AC1
t
OED1
t
OED1
t
AA3
t
AC4
t
WCS1
t
WCH1
t
WRD2
t
WDD
t
WDS1
t
WDH2
t
RDS2
t
RDH2
t
AH2
t
CSD3
t
CASD1
t
CASD1
t
CASW1
t
AD
φ
A23 to A0
RAS3, RAS2
UCAS
LCAS
OE, RD
HWR
D15 to D0
OE, RD
HWR
D15 to D0
AS
T
r
T
c1
T
c2
Read
Write
DACK0, DACK1
t
DACD1
t
DACD2
Notes: DACK timing: when DDS = 0
RAS timing: when RAST = 0
t
WRD2
Figure 25.13 DRAM Access Timing: Two-State Access
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 894 of 980
REJ09B0050-0600
T
p
T
r
T
c1
T
cw
T
cwp
T
c2
φ
A23 to A0
RAS3, RAS2
UCAS, LCAS
OE, RD
HWR
D15 to D0
UCAS, LCAS
OE, RD
HWR
t
WTS
t
WTH
t
WTS
t
WTH
D15 to D0
WAIT
AS
Read
Write
Tcw : Wait cycle inserted by programmable wait function
Tcwp: Wait cycle inserted by pin wait function
DACK0, DACK1
DACK timing: when DDS = 0
RAS timing: when RAST = 0
Notes:
Figure 25.14 DRAM Access Timing: Two-State Access, One Wait
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 895 of 980
REJ09B0050-0600
T
p
φ
A23 to A0
RAS3, RAS2
UCAS
LCAS
OE, RD
HWR
D15 to D0
OE, RD
HWR
D15 to D0
AS
T
r
T
c1
t
CPW1
t
AC3
t
RCH
t
RCS1
T
c2
T
c1
T
c2
Read
Write
DACK timing: when DDS = 1
RAS timing: when RAST = 1
Notes:
DACK0, DACK1
t
DACD1
t
DACD2
Figure 25.15 DRAM Access Timing: Two-State Burst Access
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 896 of 980
REJ09B0050-0600
T
p
t
AD
t
AD
t
AS2
t
AH2
t
CSD2
t
PCH1
t
AS3
t
CSD3
t
CASD1
t
AH3
t
CASD2
t
CASW2
t
AC2
t
AA5
t
AC7
t
WRD2
t
WDD
t
WDS2
t
WDH3
t
WCS2
t
WCH2
t
RDH2
t
OED2
t
OED1
φ
A23 to A0
RAS3, RAS2
UCAS
LCAS
OE, RD
HWR
D15 to D0
OE, RD
HWR
D15 to D0
AS
T
r
T
c1
T
c2
T
c3
Write
Read
DACK timing: when DDS = 0
RAS timing: when RAST = 1
Notes:
DACK0, DACK1
t
DACD1
t
DACD2
t
WRD2
t
RDS2
Figure 25.16 DRAM Access Timing: Three-State Access (RAST = 1)
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 897 of 980
REJ09B0050-0600
T
p
T
r
T
c1
T
c2
T
c3
T
c1
T
c2
T
c3
φ
A23 to A0
RAS3, RAS2
UCAS
LCAS
OE, RD
HWR
D15 to D0
OE, RD
HWR
t
RCH
t
RCS2
t
AC8
t
CPW2
D15 to D0
AS
Read
Write
DACK timing: when DDS = 1
RAS timing: when RAST = 1
Notes:
DACK0, DACK1
Figure 25.17 DRAM Access Timing: Three-State Burst Access
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 898 of 980
REJ09B0050-0600
TRp
φ
RAS3, RAS2
UCAS, LCAS
OE
TRr
tCSD2
tCSR1
tCASD1
tCASD1
tCSD1
TRc1 TRc2
Figure 25.18 CAS-Before-RAS Refresh Timing
T
Rp
φ
RAS3, RAS2
UCAS, LCAS
OE
T
Rrw
t
CSD2
t
CSR2
t
CASD1
t
CSD1
t
CASD1
T
Rr
T
Rc1
T
Rcw
T
Rc2
Figure 25.19 CAS-Before-RAS Refresh Timing (with Wait Cycle Insertion)
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 899 of 980
REJ09B0050-0600
T
Rp
φ
RAS3, RAS2
UCAS, LCAS
OE
T
Rr
t
CSD2
t
CASD1
t
CSD2
t
CASD1
t
RPS2
T
Rc
T
Rc
T
psr
T
p
T
r
DRAM accessSelf-refresh
Figure 25.20 Self-Refresh Timing (Return from Software Standby Mode: RAST = 0)
TRp
φ
RAS3, RAS2
UCAS, LCAS
OE
TRr
tCSD2
tCASD1
tCSD2
tCASD1
tRPS1
TRc TRc Tpsr TpTr
DRAM accessSelf-refresh
Figure 25.21 Self-Refresh Timing (Return from Software Standby Mode: RAST = 1)
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 900 of 980
REJ09B0050-0600
φ
BREQ
tBREQS tBREQS
tBACD
tBZD
tBACD
tBZD
BACK
A23 to A0
CS7 to CS0
(RAS3, RAS2)
D15 to D0
AS, RD
HWR, LWR
UCAS, LCAS, OE
Figure 25.22 External Bus Release Timing
φ
BACK
tBRQOD tBRQOD
BREQO
Figure 25.23 External Bus Request Output Timing
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 901 of 980
REJ09B0050-0600
(4) DMAC Timing
Table 25.9 DMAC Timing
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Max Unit Test Conditions
DREQ setup time tDRQS 25 — ns Figure 25.27
DREQ hold time tDRQH 10 —
TEND delay time tTED — 18 ns Figure 25.26
DACK delay time 1 tDACD1 — 18 Figures 25.24 and 25.25
DACK delay time 2 tDACD2 — 18
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 902 of 980
REJ09B0050-0600
T1
φ
A23 to A0
CS7 to CS0
AS
tDACD1 tDACD2
RD
(read)
D15 to D0
(read)
HWR, LWR
(write)
D15 to D0
(write)
DACK0, DACK1
T2
Figure 25.24 DMAC Single Address Transfer Timing: Two-State Access
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 903 of 980
REJ09B0050-0600
T1
tDACD1 tDACD2
φ
A23 to A0
CS7 to CS0
AS
RD
(read)
D15 to D0
(read)
HWR, LWR
(write)
D15 to D0
(write)
DACK0, DACK1
T2T3
Figure 25.25 DMAC Single Address Transfer Timing: Three-State Access
T1
tTED tTED
φ
TEND0, TEND1
T2 or T3
Figure 25.26 DMAC TEND Output Timing
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 904 of 980
REJ09B0050-0600
φ
DREQ0, DREQ1
tDRQS tDRQH
Figure 25.27 DMAC DREQ Input Timing
(5) Timing of On-Chip Peripheral Modules
Table 25.10 Timing of On-Chip Peripheral Modules
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Max Unit Test Conditions
I/O ports Output data delay time tPWD — 40 ns Figure 25.28
Input data setup time tPRS 25 — ns
Input data hold time tPRH 25 — ns
PPG Pulse output delay time tPOD — 40 ns Figure 25.29
TPU Timer output delay time tTOCD — 40 ns Figure 25.30
Timer input setup time tTICS 25 — ns
Timer clock input setup time tTCKS 25 — ns Figure 25.31
Timer clock
pulse width
Single-edge
specification
tTCKWH 1.5 — tcyc
Both-edge
specification
tTCKWL 2.5 — tcyc
8-bit timer Timer output delay time tTMOD — 40 ns Figure 25.32
Timer reset input setup time tTMRS 25 — ns Figure 25.34
Timer clock input setup time tTMCS 25 — ns Figure 25.33
Timer clock
pulse width
Single-edge
specification
tTMCWH 1.5 — tcyc
Both-edge
specification
tTMCWL 2.5 — tcyc
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 905 of 980
REJ09B0050-0600
Item Symbol Min Max Unit Test Conditions
WDT Overflow output delay time tWOVD — 40 ns Figure 25.35
SCI Asynchronous tScyc 4 — tcyc Figure 25.36
Input clock
cycle Synchronous 6 —
Input clock pulse width tSCKW 0.4 0.6 tScyc
Input clock rise time tSCKr — 1.5 tcyc
Input clock fall time tSCKf — 1.5
Transmit data delay time tTXD — 40 ns Figure 25.37
Receive data setup time
(synchronous)
tRXS 40 — ns
Receive data hold time
(synchronous)
tRXH 40 — ns
A/D
converter
Trigger input setup time tTRGS 30 — ns Figure 25.38
IIC2 SCL input cycle time tSCL 12 tcyc +600 — ns Figure 25.39
SCL input high pulse width tSCLH 3 tcyc +300 — ns
SCL input low pulse width tSCLL 5 tcyc +300 — ns
SCL, SDA Input fall time tSf — 300 ns
SCL, SDA Input spike pulse
removal time
tSP — 1 tcyc ns
SDA input bus free time tBUF 5 tcyc — ns
Start condition input hold
time
tSTAH 3 tcyc — ns
Retransmit start condition
input setup time
tSTAS 3 tcyc — ns
Stop condition input setup
time
tSTOS 1 tcyc +20 — ns
Data input setup time tSDAS 0 — ns
Data input hold time tSDAH 0 — ns
SCL, SDA capacitive load Cb — 400 pF
SCL, SDA fall time tSf — 300 ns
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 906 of 980
REJ09B0050-0600
T
1
t
PRS
t
PRH
t
PWD
T
2
Ports 1 to 6, 8 and 9,
A to G
(read)
Ports 1 to 3, 6, 8,
P53 to P50,
ports A to G
(write)
Figure 25.28 I/O Port Input/Output Timing
PO15 to PO0
t
POD
Figure 25.29 PPG Output Timing
Output compare
output*
Input capture
input*
t
TOCD
t
TICS
Note: * TIOCA0 to TIOCA5, TIOCB0 to TIOCB5, TIOCC0, TIOCC3, TIOCD0, TIOCD3
Figure 25.30 TPU Input/Output Timing
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 907 of 980
REJ09B0050-0600
TCLKA to TCLKD
tTCKWL tTCKWH
tTCKS tTCKS
Figure 25.31 TPU Clock Input Timing
TMO0, TMO1
tTMOD
Figure 25.32 8-Bit Timer Output Timing
TMCI0, TMCI1
t
TMCWL
t
TMCWH
t
TMCS
t
TMCS
Figure 25.33 8-Bit Timer Clock Input Timing
TMRI0, TMRI1
tTMRS
Figure 25.34 8-Bit Timer Reset Input Timing
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 908 of 980
REJ09B0050-0600
φ
WDTOVF
t
WOVD
t
WOVD
Figure 25.35 WDT Output Timing
SCK0 to SCK4
tSCKW tSCKr tSCKf
tScyc
Figure 25.36 SCK Clock Input Timing
SCK0 to SCK4 t
TXD
t
RXS
t
RXH
TxD0 to TxD4
(transmit data)
RxD0 to RxD4
(receive data)
Figure 25.37 SCI Input/Output Timing: Synchronous Mode
φ
ADTRG
t
TRGS
Figure 25.38 A/D Converter External Trigger Input Timing
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 909 of 980
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t
BUF
t
STAH
t
STAS
t
SP
t
STOS
t
SCLH
t
SCLL
t
Sf
t
Sr
t
SCL
t
SDAH
t
SDAS
P*S*S
r
*
V
IH
V
IL
SDA0
to
SDA1
SCL0
to
SCL1
Note: * S, P, and Sr represent the following conditions:
S: Start condition
P: Stop condition
Sr: Retransmit start condition
Figure 25.39 I2C Bus Interface Input/Output Timing (Option)
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 910 of 980
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25.1.4 A/D Conversion Characteristics
Table 25.11 A/D Conversion Characteristics
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Min Typ Max Unit
Resolution 10 10 10 Bit
Conversion time 8.1 — — μs
Analog input capacitance — — 20 pF
Permissible signal source impedance — — 5 kΩ
Nonlinearity error — — ±5.5 LSB
Offset error — — ±5.5 LSB
Full-scale error — — ±5.5 LSB
Quantization error — — ±0.5 LSB
Absolute accuracy — — ±6.0 LSB
25.1.5 D/A Conversion Characteristics
Table 25.12 D/A Conversion Characteristics
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Min Typ Max Unit Test Conditions
Resolution 8 8 8 Bit
Conversion time — — 10 μs 20 pF capacitive load
Absolute accuracy — ±2.0 ±3.0 LSB 2 MΩ resistive load
— — ±2.0 LSB 4 MΩ resistive load
Section 25 Electrical Characteristics
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25.2 Electrical Characteristics of 0.35 μm F-ZTAT Version
25.2.1 Absolute Maximum Ratings
Table 25.13 lists the absolute maximum ratings.
Table 25.13 Absolute Maximum Ratings
Item Symbol Value Unit
Power supply voltage VCC
PLLVCC
–0.3 to +4.0 V
Input voltage (except ports 4, 9) Vin –0.3 to VCC +0.3 V
Input voltage (ports 4, 9) Vin –0.3 to AVCC +0.3 V
Reference power supply voltage Vref –0.3 to AVCC +0.3 V
Analog power supply voltage AVCC –0.3 to +4.0 V
Analog input voltage VAN –0.3 to AVCC +0.3 V
Operating temperature Topr Regular specifications:
–20 to +75*
°C
Wide-range specifications:
–40 to +85*
°C
Storage temperature Tstg –55 to +125 °C
Caution: Permanent damage to the LSI may result if absolute maximum ratings are exceeded.
Note: * F-ZTAT version:
Ranges of operating temperature when flash memory is programmed/erased:
Regular specifications: 0 to +75°C
Wide-range specifications: 0 to +85°C
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 912 of 980
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25.2.2 DC Characteristics
Table 25.14 DC Characteristics (1)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC,
VSS = AVSS = 0 V*1, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
VT– V
CC × 0.2 — — V
VT+ — — VCC × 0.7 V
Schmitt
trigger input
voltage
Ports 1, 2, and 4*2,
P50 to P53*2,
PA4 to PA7*2 VT+ – VT–VCC × 0.07 — — V
Input high
voltage
STBY,
MD2 to MD0
VIH V
CC × 0.9 — VCC +0.3 V
RES, NMI, EMLE VCC × 0.9 — VCC +0.3 V
EXTAL VCC × 0.7 — VCC +0.3 V
Port 3,
P50 to P53*3, port
8, ports A to G*3
V
CC × 0.7 — VCC +0.3 V
Ports 4 and 9 AVCC × 0.7 — AVCC +0.3 V
Input low
voltage
RES, STBY,
MD2 to MD0,
EMLE
VIL –0.3 — VCC × 0.1 V
NMI, EXTAL –0.3 — VCC × 0.2 V
Ports 3 to 5*3, 8, 9,
A to G*3
–0.3 — VCC × 0.2 V
Output high
voltage
All output pins VOH V
CC –0.5 — — V IOH = –200 μA
V
CC –1.0 — — V IOH = –1 mA
All output pins — — 0.4 V IOL = 1.6 mA Output low
voltage P32 to P35*4
VOL
— — 0.5 V IOL = 8.0 mA
Notes: 1. When the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS
pins open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS.
2. When used as IRQ0 to IRQ7.
3. When used as other than IRQ0 to IRQ7.
4. When used as SCL0 to SCL1, SDA0 to SDA1.
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 913 of 980
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Table 25.15 DC Characteristics (2)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC,
VSS = AVSS = 0 V*1, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
RES |Iin| — — 10.0 μA Vin = 0.5 to
VCC –0.5 V
STBY, NMI,
MD2 to MD0
— — 1.0 μA
Input
leakage
current
Ports 4 and 9 — — 1.0 μA Vin = 0.5 to
AVCC –0.5 V
Three-state
leakage
current
(off state)
Ports 1 to 3,
P50 to P53,
ports 8, A to G
| ITSI | — — 1.0 μA Vin = 0.5 to
VCC –0.5 V
Input pull-up
MOS current
Ports A to E –Ip 10 — 300 μA VCC = 3.0 to
3.6 V
Vin = 0 V
RES Cin — — 30 pF Vin = 0 V
NMI — — 30 pF f = 1 MHz
Input
capacitance
All input pins
except RES
and NMI
— — 15 pF Ta = 25°C
Normal operation ICC*4 — 75
(3.3 V)
115 mA f = 33 MHz
Sleep mode — 55
(3.3 V)
95 mA f = 33 MHz
Standby mode*3 — 0.01 10 μA Ta ≤ 50°C
Current
dissipation*2
— — 80 μA 50°C < Ta
During A/D and
D/A conversion
AICC — 0.3
(3.0 V)
2.0 mA Analog
power
supply
current Idle — 0.01 5.0 μA
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 914 of 980
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Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
During A/D and
D/A conversion
AICC — 2.0
(3.0 V)
3.5 mA Reference
power
supply
current Idle — 0.01 0.5 μA
RAM standby voltage VRAM 2.0 — — V
Notes: 1. When the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS
pins open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS.
2. Current dissipation values are for VIHmin = VCC – 0.2 V and VILmax = 0.2 V with all output
pins unloaded and all MOS input pull-ups in the off state.
3. The values are for VRAM ≤ VCC < 3.0 V, VIHmin = VCC × 0.9, and VILmax = 0.3 V.
4. ICC depends on VCC and f as follows:
ICCmax = 1.0 (mA) + 0.95 (mA/(MHz × V)) × VCC × f (normal operation)
ICCmax = 1.0 (mA) + 0.8 (mA/(MHz × V)) × VCC × f (sleep mode)
Table 25.16 Permissible Output Currents
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC,
VSS = AVSS = 0 V*, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Typ Max Unit
SCL0 to SCL1, SDA0 to SDA1 — — 8.0 Permissible output low
current (per pin) Output pins other than the above
IOL
— — 2.0
mA
Permissible output low
current (total)
Total of all output pins ΣIOL — — 80 mA
Permissible output high
current (per pin)
All output pins –IOH — — 2.0 mA
Permissible output high
current (total)
Total of all output pins Σ–IOH — — 40 mA
Caution: To protect the LSI’s reliability, do not exceed the output current values in table 25.16.
Note: * When the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS
pins open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS.
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 915 of 980
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Table 0.•
Clock Timing
Table 25.17 Clock Timing
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Max Unit Test Conditions
Clock cycle time tcyc 30.3 125 ns Figure 25.2
Clock pulse high width tCH 10 — ns
Clock pulse low width tCL 10 — ns
Clock rise time tCr — 5 ns
Clock fall time tCf — 5 ns
Figure 25.2
Reset oscillation stabilization
time (crystal)
tOSC1 10 — ms Figure 25.3(1)
Software standby oscillation
stabilization time (crystal)
tOSC2 10 — ms Figure 25.3(2)
External clock output delay
stabilization time
tDEXT 1 — ms Figure 25.3(1)
Section 25 Electrical Characteristics
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Table 0.•
Control Signal Timing
Table 25.18 Control Signal Timing
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Max Unit Test Conditions
RES setup time tRESS 200 — ns Figure 25.4
RES pulse width tRESW 20 — tcyc
NMI setup time tNMIS 150 — ns Figure 25.5
NMI hold time tNMIH 10 —
NMI pulse width (in recovery from
software standby mode)
tNMIW 200 —
IRQ setup time tIRQS 150 — ns
IRQ hold time tIRQH 10 —
IRQ pulse width (in recovery from
software standby mode)
tIRQW 200 —
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 917 of 980
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Table 0.•
Bus Timing
Table 25.19 Bus Timing (1)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Max Unit Test Conditions
Address delay time tAD — 20 ns
Address setup time 1 tAS1 0.5 × tcyc –13 — ns
Figures 25.6 to
25.19
Address setup time 2 tAS2 1.0 × tcyc –13 — ns
Address setup time 3 tAS3 1.5 × tcyc –13 — ns
Address setup time 4 tAS4 2.0 × tcyc –13 — ns
Address hold time 1 tAH1 0.5 × tcyc –8 — ns
Address hold time 2 tAH2 1.0 × tcyc –8 — ns
Address hold time 3 tAH3 1.5 × tcyc –8 — ns
CS delay time 1 tCSD1 — 15 ns
CS delay time 2 tCSD2 — 15 ns
CS delay time 3 tCSD3 — 20 ns
AS delay time tASD — 15 ns
RD delay time 1 tRSD1 — 15 ns
RD delay time 2 tRSD2 — 15 ns
Read data setup time 1 tRDS1 15 — ns
Read data setup time 2 tRDS2 15 — ns
Read data hold time 1 tRDH1 0 — ns
Read data hold time 2 tRDH2 0 — ns
Read data access time 1 tAC1 — 1.0 × tcyc –20 ns
Read data access time 2 tAC2 — 1.5 × tcyc –20 ns
Read data access time 3 tAC3 — 2.0 × tcyc –20 ns
Read data access time 4 tAC4 — 2.5 × tcyc –20 ns
Read data access time 5 tAC5 — 1.0 × tcyc –20 ns
Read data access time 6 tAC6 — 2.0 × tcyc –20 ns
Read data access time 7 tAC7 — 4.0 × tcyc –20 ns
Read data access time 8 tAC8 — 3.0 × tcyc –20 ns
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 918 of 980
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Item Symbol Min Max Unit Test Conditions
Address read data access time 1 tAA1 — 1.0 × tcyc –20 ns
Address read data access time 2 tAA2 — 1.5 × tcyc –20 ns
Address read data access time 3 tAA3 — 2.0 × tcyc –20 ns
Figures 25.6 to
25.19
Address read data access time 4 tAA4 — 2.5 × tcyc –20 ns
Address read data access time 5 tAA5 — 3.0 × tcyc –20 ns
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 919 of 980
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Table 25.20 Bus Timing (2)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Max Unit Test Conditions
WR delay time 1 tWRD1 — 15 ns
WR delay time 2 tWRD2 — 15 ns
Figures 25.6 to
25.19
WR pulse width 1 tWSW1 1.0 × tcyc –13 — ns
WR pulse width 2 tWSW2 1.5 × tcyc –13 — ns
Write data delay time tWDD — 20 ns
Write data setup time 1 tWDS1 0.5 × tcyc –13 — ns
Write data setup time 2 tWDS2 1.0 × tcyc –13 — ns
Write data setup time 3 tWDS3 1.5 × tcyc –13 — ns
Write data hold time 1 tWDH1 0.5 × tcyc –8 — ns
Write data hold time 2 tWDH2 1.0 × tcyc –8 — ns
Write data hold time 3 tWDH3 1.5 × tcyc –8 — ns
Write command setup time 1 tWCS1 0.5 × tcyc –10 — ns
Write command setup time 2 tWCS2 1.0 × tcyc –10 — ns
Write command hold time 1 tWCH1 0.5 × tcyc –10 — ns
Write command hold time 2 tWCH2 1.0 × tcyc –10 — ns
Read command setup time 1 tRCS1 1.5 × tcyc –10 — ns
Read command setup time 2 tRCS2 2.0 × tcyc –10 — ns
Read command hold time tRCH 0.5 × tcyc –10 — ns
CAS delay time 1 tCASD1 — 15 ns
CAS delay time 2 tCASD2 — 15 ns
CAS setup time 1 tCSR1 0.5 × tcyc –10 — ns
CAS setup time 2 tCSR2 1.5 × tcyc –10 — ns
CAS pulse width 1 tCASW1 1.0 × tcyc –20 — ns
CAS pulse width 2 tCASW2 1.5 × tcyc –20 — ns
CAS precharge time 1 tCPW1 1.0 × tcyc –20 — ns
CAS precharge time 2 tCPW2 1.5 × tcyc –20 — ns
OE delay time 1 tOED1 — 15 ns
OE delay time 2 tOED2 — 15 ns
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 920 of 980
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Item Symbol Min Max Unit Test Conditions
Precharge time 1 tPCH1 1.0 × tcyc –20 — ns
Precharge time 2 tPCH2 1.5 × tcyc –20 — ns
Figures 25.6 to
25.19
Self-refresh precharge time 1 tRPS1 2.5 × tcyc –20 — ns
Self-refresh precharge time 2 tRPS2 3.0 × tcyc –20 — ns
Figures 25.20 and
25.21
WAIT setup time tWTS 25 — ns Figure 25.14
WAIT hold time tWTH 5 — ns
BREQ setup time tBREQS 30 — ns Figure 25.22
BACK delay time tBACD — 15 ns
Bus floating time tBZD — 40 ns
BREQO delay time tBRQOD — 25 ns Figure 25.23
Table 0.•
DMAC Timing
Table 25.21 DMAC Timing
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Max Unit Test Conditions
DREQ setup time tDRQS 25 — ns Figure 25.27
DREQ hold time tDRQH 10 —
TEND delay time tTED — 18 ns Figure 25.26
DACK delay time 1 tDACD1 — 18 Figures 25.24 and 25.25
DACK delay time 2 tDACD2 — 18
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 921 of 980
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(5) Timing of On-Chip Peripheral Modules
Table 25.22 Timing of On-Chip Peripheral Modules
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Max Unit Test Conditions
I/O ports Output data delay time tPWD — 40 ns Figure 25.28
Input data setup time tPRS 25 — ns
Input data hold time tPRH 25 — ns
PPG Pulse output delay time tPOD — 40 ns Figure 25.29
TPU Timer output delay time tTOCD — 40 ns Figure 25.30
Timer input setup time tTICS 25 — ns
Timer clock input setup time tTCKS 25 — ns Figure 25.31
Timer clock
pulse width
Single-edge
specification
tTCKWH 1.5 — tcyc
Both-edge
specification
tTCKWL 2.5 — tcyc
8-bit timer Timer output delay time tTMOD — 40 ns Figure 25.32
Timer reset input setup time tTMRS 25 — ns Figure 25.34
Timer clock input setup time tTMCS 25 — ns Figure 25.33
Timer clock
pulse width
Single-edge
specification
tTMCWH 1.5 — tcyc
Both-edge
specification
tTMCWL 2.5 — tcyc
WDT Overflow output delay time tWOVD — 40 ns Figure 25.35
SCI Asynchronous tScyc 4 — tcyc Figure 25.36
Input clock
cycle Synchronous 6 —
Input clock pulse width tSCKW 0.4 0.6 tScyc
Input clock rise time tSCKr — 1.5 tcyc
Input clock fall time tSCKf — 1.5
Transmit data delay time tTXD — 40 ns Figure 25.37
Receive data setup time
(synchronous)
tRXS 40 — ns
Receive data hold time
(synchronous)
tRXH 40 — ns
A/D
converter
Trigger input setup time tTRGS 30 — ns Figure 25.38
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 922 of 980
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Item Symbol Min Max Unit Test Conditions
IIC2 SCL input cycle time tSCL 12 tcyc +600 — ns Figure 25.39
SCL input high pulse width tSCLH 3 tcyc +300 — ns
SCL input low pulse width tSCLL 5 tcyc +300 — ns
SCL, SDA Input fall time tSf — 300 ns
SCL, SDA Input spike pulse
removal time
tSP — 1 tcyc ns
SDA input bus free time tBUF 5 tcyc — ns
Start condition input hold
time
tSTAH 3 tcyc — ns
Retransmit start condition
input setup time
tSTAS 3 tcyc — ns
Stop condition input setup
time
tSTOS 1 tcyc +20 — ns
Data input setup time tSDAS 0 — ns
Data input hold time tSDAH 0 — ns
SCL, SDA capacitive load Cb — 400 pF
SCL, SDA fall time tSf — 300 ns
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 923 of 980
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25.2.3 A/D Conversion Characteristics
Table 25.23 A/D Conversion Characteristics
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Min Typ Max Unit
Resolution 10 10 10 Bit
Conversion time 8.1 — — μs
Analog input capacitance — — 20 pF
Permissible signal source impedance — — 5 kΩ
Nonlinearity error — — ±5.5 LSB
Offset error — — ±5.5 LSB
Full-scale error — — ±5.5 LSB
Quantization error — — ±0.5 LSB
Absolute accuracy — — ±6.0 LSB
25.2.4 D/A Conversion Characteristics
Table 25.24 D/A Conversion Characteristics
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 33 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Item Min Typ Max Unit Test Conditions
Resolution 8 8 8 Bit
Conversion time — — 10 μs 20 pF capacitive load
Absolute accuracy — ±2.0 ±3.0 LSB 2 MΩ resistive load
— — ±2.0 LSB 4 MΩ resistive load
Section 25 Electrical Characteristics
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25.2.5 Flash Memory Characteristics
Table 25.25 Flash Memory Characteristics
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC,
VSS = AVSS = 0 V, Ta = 0°C to 75°C (program/erase operating temperature range:
regular specifications), Ta = 0°C to 85°C (program/erase operating temperature
range: wide-range specifications)
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
Programming time*1*2*4 t
P — 10 200 ms/
128 bytes
Erase time*1*3*6 t
E — 50 1000 ms/
block
Rewrite times NWEC — — 100 Times
Wait time after
SWE bit setting*1
x 1 — — μs
Wait time after
PSU bit setting*1
y 50 — — μs
z1 — — 30 μs 1 ≤ n ≤ 6
z2 — — 200 μs 7 ≤ n ≤ 1000
Wait time after
P bit setting*1*4
z
z3 — — 10 μs Additional
program-
ming wait
Programming
Wait time after
P bit clearing*1
α 5 — — μs
Wait time after
PSU bit clearing*1
β 5 — — μs
Wait time after
PV bit setting*1
γ 4 — — μs
Wait time after
H'FF dummy
write*1
ε 2 — — μs
Wait time after
PV bit clearing*1
η 2 — — μs
Wait time after
SWE bit clearing*1
θ 100 — — μs
Maximum number
of writes*1*4
N — — 1000*5 Times
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 925 of 980
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Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
Wait time after
SWE bit setting*1
x 1 — — μs
Wait time after
ESU bit setting*1
y 100 — — μs
Wait time after
E bit setting*1*6
z — — 10 ms Erase time
wait
Wait time after
E bit clearing*1
α 10 — — μs
Erasing
Wait time after
ESU bit clearing*1
β 10 — — μs
Wait time after
EV bit setting*1
γ 20 — — μs
Wait time after
H'FF dummy
write*1
ε 2 — — μs
Wait time after
EV bit clearing*1
η 4 — — μs
Wait time after
SWE bit clearing*1
θ 100 — — μs
Maximum number
of erases*1*6
N — — 100 Times
Notes: 1. Follow the program/erase algorithms when making the time settings.
2. Programming time per 128 bytes. (Indicates the total time during which the P bit is set
in flash memory control register 1 (FLMCR1). Does not include the program-verify
time.)
3. Time to erase one block. (Indicates the time during which the E bit is set in FLMCR1.
Does not include the erase-verify time.)
4. Maximum programming time
t
P
(max) = Σ wait time after P bit setting (z)
N
i=1
5. The maximum number of writes (N) should be set as shown below according to the
actual set value of (z) so as not to exceed the maximum programming time (tP(max)).
The wait time after P bit setting (z) should be changed as follows according to the
number of writes (n).
Number of writes (n)
1 ≤ n ≤ 6 z = 30 µs
7 ≤ n ≤ 1000 z = 200 µs
(Additional programming)
Number of writes (n)
1 ≤ n ≤ 6 z = 10 µs
6. For the maximum erase time (tE(max)), the following relationship applies between the
wait time after E bit setting (z) and the maximum number of erases (N):
t E(max) = Wait time after E bit setting (z) × maximum number of erases (N)
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 926 of 980
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25.3 Electrical Characteristics for 0.18 μm F-ZTAT Version
25.3.1 Absolute Maximum Ratings
Table 25.26 lists the absolute maximum ratings.
Table 25.26 Absolute Maximum Ratings
Item Symbol Value Unit
Power supply voltage VCC
PLLVCC
−0.3 to +4.3 V
Input voltage (except ports 4 and 9) Vin −0.3 to VCC +0.3 V
Input voltage (ports 4 and 9) Vin −0.3 to AVCC +0.3 V
Reference power supply voltage Vref −0.3 to AVCC +0.3 V
Analog power supply voltage AVCC −0.3 to +4.0 V
Analog input voltage VAN −0.3 to AVCC +0.3 V
Operating temperature Topr Regular specifications:
−20 to +75*
°C
Wide-range specifications:
−40 to +85*
°C
Storage temperature Tstg −55 to +125 °C
Caution: Permanent damage to the LSI may result if absolute maximum ratings are exceeded.
Note: * Ranges of operating temperature when flash memory is programmed/erased:
Regular specifications: 0 to +75°C
Wide-range specifications: 0 to +85°C
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 927 of 980
REJ09B0050-0600
25.3.2 DC Characteristics
Table 25.27 DC Characteristics
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC,
VSS = AVSS = 0 V*1, Ta = −20°C to +75°C (regular specifications),
Ta = −40°C to +85°C (wide-range specifications)
Item
Symbol
Min.
Typ.
Max.
Unit
Test
Conditions
VT− V
CC × 0.2 ⎯ ⎯ V
VT+ ⎯ ⎯ V
CC × 0.7 V
Schmitt
trigger input
voltage
Port 1, 2, 4*2, P50
to P53*2, PA4 to
PA7*2 VT+ −
VT−
VCC × 0.07 ⎯ ⎯ V
Input high
voltage
STBY,
MD2 to MD0
VIH V
CC × 0.9 ⎯ V
CC +0.3 V
RES, NMI, FWE VCC × 0.9 ⎯ V
CC +0.3 V
EXTAL VCC × 0.7 ⎯ V
CC +0.3 V
Port 3,
P50 to P53*3, port
8*3, ports A to G*3
2.2 ⎯ V
CC +0.3 V
Port 4, Port 9 2.2 ⎯ AVCC +0.3 V
Input low
voltage
RES, STBY,
MD2 to MD0,
EMLE
VIL −0.3 ⎯ V
CC × 0.1 V
NMI, EXTAL −0.3 ⎯ V
CC × 0.2 V
Ports 3 to 5*3,
port 8, port 9,
ports A to G*3
−0.3 ⎯ V
CC × 0.2 V
All output pins VOH V
CC −0.5 ⎯ ⎯ V IOH = −200 μA Output high
voltage V
CC −1.0 ⎯ ⎯ V IOH = −1 mA
All output pins VOL ⎯ ⎯ 0.4 V IOL = 1.6 mA Output low
voltage P32 to P35*4 ⎯ ⎯ 0.5 V IOL = 8.0 mA
Notes: 1. When the A/D and D/A converters are not used, the AVCC, Vref, and AVSS pins should not
be open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS.
2. When used as IRQ0 to IRQ7.
3. When used as other than IRQ0 to IRQ7
4. When used as SCL0, SCL1, SDA0, and SDA1.
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 928 of 980
REJ09B0050-0600
Table 25.28 DC Characteristics
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC,
VSS = AVSS = 0 V*1, Ta = −20°C to +75°C (regular specifications),
Ta = −40°C to +85°C (wide-range specifications)
Item
Symbol
Min.
Typ.
Max.
Unit
Test
Conditions
RES |Iin| ⎯ ⎯ 10.0 μA Vin = 0.5 to
VCC −0.5 V
STBY, NMI,
MD2 to MD0
⎯ ⎯ 1.0 μA
Input
leakage
current
Port 4, Port 9 ⎯ ⎯ 1.0 μA Vin = 0.5 to
AVCC −0.5 V
Three-state
leakage
current
(off state)
Ports 1 to 3,
P50 to P53,
port 8,
ports A to G
| ITSI | ⎯ ⎯ 1.0 μA Vin = 0.5 to
VCC −0.5 V
Input pull-up
MOS
current
Ports A to E −Ip 10 ⎯ 300 μA VCC = 3.0 to
3.6 V
Vin = 0 V
RES Cin ⎯ ⎯ 30 pF Vin = 0 V
NMI ⎯ ⎯ 30 pF f = 1 MHz
Input
capacitance
All input pins
except RES
and NMI
⎯ ⎯ 15 pF Ta = 25°C
Normal operation ICC*4 ⎯ 40 (3.3 V) 60 mA f = 34 MHz
Sleep mode ⎯ 20 (3.3 V) 40 mA f = 34 MHz
Standby mode*3 ⎯ 5 20 μA Ta ≤ 50°C
Current
consump-
tion*2
⎯ ⎯ 80 μA 50°C < Ta
During A/D and
D/A conversion
AICC ⎯ 0.5 (3.0 V) 2.0 mA Analog
power
supply
current Idle ⎯ 0.01 5.0 μA
During A/D and
D/A conversion
AICC ⎯ 3.0 (3.0 V) 6.0 mA Reference
power
supply
current Idle ⎯ 0.01 5.0 μA
RAM standby voltage VRAM 2.5 ⎯ ⎯ V
VCC start voltage*5 V
ccstart ⎯ ⎯ ⎯ V
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 929 of 980
REJ09B0050-0600
Item
Symbol
Min.
Typ.
Max.
Unit
Test
Conditions
VCC rise slope*5 SVCC ⎯ ⎯ ⎯ ms/V
Notes: 1. When the A/D and D/A converters are not used, the AVCC, Vref, and AVSS pins should not
be open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS.
2. Current consumption values are for VIHmin = VCC − 0.2 V and VILmax = 0.2 V with all
output pins unloaded and all input pull-up MOSs in the off state.
3. The values are for VRAM ≤ VCC < 3.0 V, VIHmin = VCC × 0.9, and VILmax = 0.3 V.
4. ICC depends on VCC and f as follows:
ICCmax = 15 (mA) + 0.37 (mA/(MHz × V)) × VCC × f (normal operation)
ICCmax = 15 (mA) + 0.20 (mA/(MHz × V)) × VCC × f (sleep mode)
5. Applies when the RES pin is at low level at power-on.
Table 25.29 Permissible Output Currents
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC,
VSS = AVSS = 0 V*, Ta = −20°C to +75°C (regular specifications),
Ta = −40°C to +85°C (wide-range specifications)
Item Symbol Min. Typ. Max. Unit
SCL0 to SCL1, SDA0 to SDA1 ⎯ ⎯ 8.0 Permissible output low
current (per pin) Output pins other than the above
IOL
⎯ ⎯ 2.0
mA
Permissible output low
current (total)
Total of all output pins ΣIOL ⎯ ⎯ 80 mA
Permissible output high
current (per pin)
All output pins −IOH ⎯ ⎯ 2.0 mA
Permissible output high
current (total)
Total of all output pins Σ−IOH ⎯ ⎯ 40 mA
Caution: To protect the LSI’s reliability, do not exceed the output current values in table 25.29.
Note: * When the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS
pins should not be open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS.
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 930 of 980
REJ09B0050-0600
25.3.3 AC Characteristics
The clock, control signal, bus, DMAC, and on-chip peripheral function timings are shown below.
The measurement conditions of the AC characteristics are shown in figure 25.1.
(1) Clock Timing
Table 25.30 Clock Timing
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 34 MHz, Ta = −20°C to +75°C (regular specifications),
Ta = −40°C to +85°C (wide-range specifications)
Item Symbol Min. Max. Unit Test Conditions
Clock cycle time tcyc 29.4 125 ns Figure 25.2
Clock pulse high width tCH 9 ⎯ ns Figure 25.2
Clock pulse low width tCL 9 ⎯ ns
Clock rising time tCr ⎯ 5 ns
Clock falling time tCf ⎯ 5 ns
Reset oscillation settling time
(crystal)
tOSC1 10 ⎯ ms Figure 25.3 (1)
Software standby oscillation
settling time (crystal)
tOSC2 10 ⎯ ms Figure 25.3 (2)
External clock output delay
settling time
tDEXT 1 ⎯ ms Figure 25.3 (1)
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 931 of 980
REJ09B0050-0600
(2) Control Signal Timing
Table 25.31 Control Signal Timing
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 34 MHz, Ta = −20°C to +75°C (regular specifications),
Ta = −40°C to +85°C (wide-range specifications)
Item Symbol Min. Max. Unit Test Conditions
RES setup time tRESS 200 ⎯ ns Figure 25.4
RES pulse width tRESW 20 ⎯ t
cyc
NMI setup time tNMIS 150 ⎯ ns Figure 25.5
NMI hold time tNMIH 10 ⎯
NMI pulse width (in recovery from
software standby mode)
tNMIW 200 ⎯
IRQ setup time tIRQS 150 ⎯ ns
IRQ hold time tIRQH 10 ⎯
IRQ pulse width (in recovery from
software standby mode)
tIRQW 200 ⎯
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 932 of 980
REJ09B0050-0600
(3) Bus Timing
Table 25.32 Bus Timing (1)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 34 MHz, Ta = −20°C to +75°C (regular specifications),
Ta = −40°C to +85°C (wide-range specifications)
Item Symbol Min. Max. Unit Test Conditions
Address delay time TAD ⎯ 20 ns
Address setup time 1 TAS1 0.5 × tcyc −13 ⎯ ns
Figures 25.6 to
25.19
Address setup time 2 TAS2 1.0 × tcyc −13 ⎯ ns
Address setup time 3 TAS3 1.5 × tcyc −13 ⎯ ns
Address setup time 4 TAS4 2.0 × tcyc −13 ⎯ ns
Address hold time 1 TAH1 0.5 × tcyc −8 ⎯ ns
Address hold time 2 TAH2 1.0 × tcyc −8 ⎯ ns
Address hold time 3 TAH3 1.5 × tcyc −8 ⎯ ns
CS delay time 1 tCSD1 ⎯ 15 ns
CS delay time 2 tCSD2 ⎯ 15 ns
CS delay time 3 tCSD3 ⎯ 20 ns
AS delay time TASD ⎯ 15 ns
RD delay time 1 tRSD1 ⎯ 15 ns
RD delay time 2 tRSD2 ⎯ 15 ns
Read data setup time 1 tRDS1 15 ⎯ ns
Read data setup time 2 tRDS2 15 ⎯ ns
Read data hold time 1 tRDH1 0 ⎯ ns
Read data hold time 2 tRDH2 0 ⎯ ns
Read data access time 1 TAC1 ⎯ 1.0 × tcyc −25 ns
Read data access time 2 TAC2 ⎯ 1.5 × tcyc −25 ns
Read data access time 3 TAC3 ⎯ 2.0 × tcyc −25 ns
Read data access time 4 TAC4 ⎯ 2.5 × tcyc −25 ns
Read data access time 5 TAC5 ⎯ 1.0 × tcyc −25 ns
Read data access time 6 TAC6 ⎯ 2.0 × tcyc −25 ns
Read data access time 7 TAC7 ⎯ 4.0 × tcyc −25 ns
Read data access time 8 TAC8 ⎯ 3.0 × tcyc −25 ns
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 933 of 980
REJ09B0050-0600
Item Symbol Min. Max. Unit Test Conditions
Address read data access time 1 TAA1 ⎯ 1.0 × tcyc −25 ns
Address read data access time 2 TAA2 ⎯ 1.5 × tcyc −25 ns
Figures 25.6 to
25.19
Address read data access time 3 TAA3 ⎯ 2.0 × tcyc −25 ns
Address read data access time 4 TAA4 ⎯ 2.5 × tcyc −25 ns
Address read data access time 5 TAA5 ⎯ 3.0 × tcyc −25 ns
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 934 of 980
REJ09B0050-0600
Table 25.33 Bus Timing (2)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 34 MHz, Ta = −20°C to +75°C (regular specifications),
Ta = −40°C to +85°C (wide-range specifications)
Item Symbol Min. Max. Unit Test Conditions
WR delay time 1 tWRD1 ⎯ 15 ns
WR delay time 2 tWRD2 ⎯ 15 ns
Figures 25.6 to
25.19
WR pulse width 1 tWSW1 1.0 × tcyc −13 ⎯ ns
WR pulse width 2 tWSW2 1.5 × tcyc −13 ⎯ ns
Write data delay time tWDD ⎯ 23 ns
Write data setup time 1 tWDS1 0.5 × tcyc −15 ⎯ ns
Write data setup time 2 tWDS2 1.0 × tcyc −15 ⎯ ns
Write data setup time 3 tWDS3 1.5 × tcyc −15 ⎯ ns
Write data hold time 1 tWDH1 0.5 × tcyc −13 ⎯ ns
Write data hold time 2 tWDH2 1.0 × tcyc −13 ⎯ ns
Write data hold time 3 tWDH3 1.5 × tcyc −13 ⎯ ns
Write command setup time 1 tWCS1 0.5 × tcyc −10 ⎯ ns
Write command setup time 2 tWCS2 1.0 × tcyc −10 ⎯ ns
Write command hold time 1 tWCH1 0.5 × tcyc −10 ⎯ ns
Write command hold time 2 tWCH2 1.0 × tcyc −10 ⎯ ns
Read command setup time 1 tRCS1 1.5 × tcyc −10 ⎯ ns
Read command setup time 2 tRCS2 2.0 × tcyc −10 ⎯ ns
Read command hold time tRCH 0.5 × tcyc −10 ⎯ ns
CAS delay time 1 tCASD1 ⎯ 15 ns
CAS delay time 2 tCASD2 ⎯ 15 ns
CAS setup time 1 tCSR1 0.5 × tcyc −10 ⎯ ns
CAS setup time 2 tCSR2 1.5 × tcyc −10 ⎯ ns
CAS pulse width 1 tCASW1 1.0 × tcyc −20 ⎯ ns
CAS pulse width 2 tCASW2 1.5 × tcyc −20 ⎯ ns
CAS precharge time 1 tCPW1 1.0 × tcyc −20 ⎯ ns
CAS precharge time 2 tCPW2 1.5 × tcyc −20 ⎯ ns
OE delay time 1 tOED1 ⎯ 15 ns
OE delay time 2 tOED2 ⎯ 15 ns
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 935 of 980
REJ09B0050-0600
Item Symbol Min. Max. Unit Test Conditions
Precharge time 1 tPCH1 1.0 × tcyc −20 ⎯ ns
Precharge time 2 tPCH2 1.5 × tcyc −20 ⎯ ns
Figures 25.6 to
25.19
Self-refresh precharge time 1 tRPS1 2.5 × tcyc −20 ⎯ ns
Self-refresh precharge time 2 tRPS2 3.0 × tcyc −20 ⎯ ns
Figures 25.20 and
25.21
WAIT setup time tWTS 25 ⎯ ns
WAIT hold time tWTH 5 ⎯ ns
Figures 25.14
BREQ setup time tBREQS 30 ⎯ ns Figure 25.22
BACK delay time tBACD ⎯ 15 ns
Bus floating time tBZD ⎯ 40 ns
BREQO delay time tBRQOD ⎯ 25 ns Figure 25.23
(4) DMAC Timing
Table 25.34 DMAC Timing
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 34 MHz, Ta = −20°C to +75°C (regular specifications),
Ta = −40°C to +85°C (wide-range specifications)
Item Symbol Min. Max. Unit Test Conditions
DREQ setup time tDRQS 25 ⎯ ns Figure 25.27
DREQ hold time tDRQH 10 ⎯
TEND delay time tTED ⎯ 18 ns Figure 25.26
DACK delay time 1 tDACD1 ⎯ 18 Figures 25.24 and 25.25
DACK delay time 2 tDACD2 ⎯ 18
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 936 of 980
REJ09B0050-0600
(5) Timing of On-Chip Peripheral Modules
Table 25.35 Timing of On-Chip Peripheral Modules
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 34 MHz, Ta = −20°C to +75°C (regular specifications),
Ta = −40°C to +85°C (wide-range specifications)
Item Symbol Min. Max. Unit Test Conditions
I/O ports Output data delay time tPWD ⎯ 40 ns Figure 25.28
Input data setup time tPRS 25 ⎯ ns
Input data hold time tPRH 25 ⎯ ns
PPG Pulse output delay time tPOD ⎯ 40 ns Figure 25.29
TPU Timer output delay time tTOCD ⎯ 40 ns Figure 25.30
Timer input setup time tTICS 25 ⎯ ns
Timer clock input setup time tTCKS 25 ⎯ ns Figure 25.31
Timer clock
pulse width
Single-edge
specification
tTCKWH 1.5 ⎯ t
cyc
Both-edge
specification
tTCKWL 2.5 ⎯ t
cyc
8-bit timer Timer output delay time tTMOD ⎯ 40 ns Figure 25.32
Timer reset input setup time tTMRS 25 ⎯ ns Figure 25.34
Timer clock input setup time tTMCS 25 ⎯ ns Figure 25.33
Timer clock
pulse width
Single-edge
specification
tTMCWH 1.5 ⎯ t
cyc
Both-edge
specification
tTMCWL 2.5 ⎯ t
cyc
WDT Overflow output delay time tWOVD ⎯ 40 ns Figure 25.35
SCI Asynchronous tScyc 4 ⎯ t
cyc Figure 25.36
Input clock
cycle Synchronous 6 ⎯
Input clock pulse width tSCKW 0.4 0.6 tScyc
Input clock rising time tSCKr ⎯ 1.5 tcyc
Input clock falling time tSCKf ⎯ 1.5
Transmit data delay time tTXD ⎯ 40 ns Figure 25.37
Receive data setup time
(synchronous)
tRXS 40 ⎯ ns
Receive data hold time
(synchronous)
tRXH 40 ⎯ ns
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 937 of 980
REJ09B0050-0600
Item Symbol Min. Max. Unit Test Conditions
A/D
converter
Trigger input setup time tTRGS 30 ⎯ ns Figure 25.38
IIC2 SCL input cycle time tSCL 12 tcyc +600 ⎯ ns Figure 25.39
SCL input high pulse width tSCLH 3 tcyc +300 ⎯ ns
SCL input low pulse width tSCLL 5 tcyc +300 ⎯ ns
SCL, SDA Input falling time tSf ⎯ 300 ns
SCL, SDA Input spike pulse
removal time
tSP ⎯ 1 tcyc ns
SDA input bus free time tBUF 5 tcyc ⎯ ns
Start condition input hold
time
tSTAH 3 tcyc ⎯ ns
Retransmit start condition
input setup time
tSTAS 3 tcyc ⎯ ns
Stop condition input setup
time
tSTOS 1 tcyc +20 ⎯ ns
Data input setup time tSDAS 0 ⎯ ns
Data input hold time tSDAH 0 ⎯ ns
SCL, SDA capacitive load Cb ⎯ 400 pF
SCL, SDA falling time tSf ⎯ 300 ns
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 938 of 980
REJ09B0050-0600
25.3.4 A/D Conversion Characteristics
Table 25.36 A/D Conversion Characteristics
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 34 MHz, Ta = −20°C to +75°C (regular specifications),
Ta = −40°C to +85°C (wide-range specifications)
Item Min. Typ. Max. Unit
Resolution 10 10 10 Bit
Conversion time 7.6 ⎯ ⎯ μs
Analog input capacitance ⎯ ⎯ 20 pF
Permissible signal source impedance ⎯ ⎯ 5 kΩ
Nonlinearity error ⎯ ⎯ ±5.5 LSB
Offset error ⎯ ⎯ ±5.5 LSB
Full-scale error ⎯ ⎯ ±5.5 LSB
Quantization error ⎯ ⎯ ±0.5 LSB
Absolute accuracy ⎯ ⎯ ±6.0 LSB
25.3.5 D/A Conversion Characteristics
Table 25.37 D/A Conversion Characteristics
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V,
φ = 8 MHz to 34 MHz, Ta = −20°C to +75°C (regular specifications),
Ta = −40°C to +85°C (wide-range specifications)
Item Min. Typ. Max. Unit Test Conditions
Resolution 8 8 8 Bit
Conversion time ⎯ ⎯ 10 μs 20 pF capacitive load
Absolute accuracy ⎯ ±2.0 ±3.0 LSB 2 MΩ resistive load
⎯ ⎯ ±2.0 LSB 4 MΩ resistive load
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 939 of 980
REJ09B0050-0600
25.3.6 Flash Memory Characteristics
Table 25.38 Flash Memory Characteristics (0.18-μm F-ZTAT Version)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC,
VSS = AVSS = 0 V, Ta = 0°C to 75°C (Programming/Erasing Operating Temperature
Range: Normal Specifications), Ta = 0°C to 85°C (Programming/Erasing Operating
Temperature Range: Extended Temperature Range Specifications)
Item
Symbol
Min.
Typ.
Max.
Unit
Test
Conditions
Programming time*1*2*4 t
P ⎯ 1 10 ms/
128 bytes
Erase time*1*2*4 t
E ⎯ 250 1500 ms/
4 kbytes
⎯ 500 4000 ms/
32 kbytes
⎯ 750 6500 ms/
64 kbytes
Programming time (total)*1*2*4 Σtp ⎯ 2 6 s/256 kbytes Ta = 25°C
⎯ 3 9 s/384 kbytes
⎯ 4 12 s/512 kbytes
Erase time (total)*1*2*4 ΣtE ⎯ 7 20 s/All blocks Ta = 25°C
ΣtPE ⎯ 9 26 s/256 kbytes Ta = 25°C
⎯ 10 29 s/384 kbytes
Programming and erase time
(total)*1*2*4
⎯ 11 32 s/512 kbytes
Rewrite times NWEC 100*3 ⎯ ⎯ Times
Data storage time*4 t
DRP 10 ⎯ ⎯ Year
Notes: 1. Actual programming and erase times are dependent on data characteristics.
2. Programming and erase times do not include data transfer time.
3. The minimum number of times for which all characteristics are guaranteed. (The
guaranteed range is from 1 to the minimum number of times.)
4. Rewrite characteristics are for the operating range including the minimum value.
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 940 of 980
REJ09B0050-0600
25.4 Usage Note
The F-ZTAT and masked ROM versions both satisfy the electrical characteristics shown in this
manual, but actual electrical characteristic values, operating margins, noise margins, and other
properties may vary due to differences in manufacturing process, on-chip ROM, layout patterns,
and so on.
When system evaluation testing is carried out using the F-ZTAT version, the same evaluation
testing should also be conducted for the masked ROM version when changing over to that version.
Appendix
Rev.6.00 Mar. 18, 2009 Page 941 of 980
REJ09B0050-0600
Appendix
A. I/O Port States in Each Pin State
Port Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus Release
State
Program
Execution
State Sleep
Mode
Port 1 1, 2. 4, 7 T T Keep Keep I/O port
Port 2 1, 2. 4, 7 T T Keep Keep I/O port
P34 to P30 1, 2. 4, 7 T T Keep Keep I/O port
P35/(OE) 1, 2. 4, 7 T T [OPE = 0,
OE (CKE)
output]
T
[OPE = 1,
OE output]
H
[Other than the
above]
Keep
[OE (CKE)
output]
T
[Other than the
above]
Keep
[OE output]
OE (CKE)
[Other than
the above]
I/O port
Port 4 1, 2. 4, 7 T T T T Input port
P53 to P50 1, 2. 4, 7 T T Keep Keep I/O port
Port 8 1, 2. 4, 7 T T Keep Keep I/O port
P95/DA3 1, 2. 4, 7 T T [DAOE3 = 1]
Keep
[DAOE3 = 0]
T
Keep Input port
P94/DA2 1, 2. 4, 7 T T [DAOE2 = 1]
Keep
[DAOE2 = 0]
T
Keep Input port
Appendix
Rev.6.00 Mar. 18, 2009 Page 942 of 980
REJ09B0050-0600
Port Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus Release
State
Program
Execution
State Sleep
Mode
PA7/A23/
CS7
1, 2. 4, 7 T T [OPE = 0, CS
output]
T
[OPE = 1, CS
output]
H
[OPE = 0,
address output]
T
[OPE = 1,
address output]
Keep
[Other than the
above]
Keep
[Address output]
T
[Other than the
above]
Keep
[CS output]
CS
[Address
output]
A23
[Other than
the above]
I/O port
PA6/A22
PA5/A21
1, 2. 4, 7 T T [OPE = 0,
address output]
T
[OPE = 1,
address output]
[Other than the
above]
Keep
[Address output]
T
[Other than the
above]
Keep
[Address
output]
A22 to A21
[Other than
the above]
I/O port
PA4/A20
PA3/A19
PA2/A18
PA1/A17
PA0/A16
1, 2 L T [OPE = 0]
T
[OPE = 1]
Keep
T Address
output
A20 to A16
3, 4, 7 T T [OPE = 0,
address output]
T
[OPE = 1,
address output]
Keep
[Other than the
above]
Keep
[Address output]
T
[Other than the
above]
Keep
[Address
output]
A20 to A16
[Other than
the above]
I/O port
Appendix
Rev.6.00 Mar. 18, 2009 Page 943 of 980
REJ09B0050-0600
Port Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus Release
State
Program
Execution
State Sleep
Mode
Port B 1, 2 L T [OPE = 0]
T
[OPE = 1]
Keep
T Address
output
A15 to A8
4 T T [OPE = 0,
address output]
T
[OPE = 1,
address output]
Keep
[Other than the
above]
Keep
[Address output]
T
[Other than the
above]
Keep
[Address
output]
A15 to A8
[Other than
the above]
I/O port
3, 7 T T [OPE = 0,
address output]
T
[OPE = 1,
address output]
Keep
[Other than the
above]
Keep
[Address output]
T
[Other than the
above]
Keep
[Address
output]
A15 to A8
[Other than
the above]
I/O port
Port C 1, 2 L T [OPE = 0]
T
[OPE = 1]
Keep
T Address
output
A7 to A0
4 T T [OPE = 0,
address output]
T
[OPE = 1,
address output]
Keep
[Other than the
above]
Keep
[Address output]
T
[Other than the
above]
Keep
[Address
output]
A7 to A0
[Other than
the above]
I/O port
Appendix
Rev.6.00 Mar. 18, 2009 Page 944 of 980
REJ09B0050-0600
Port Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus Release
State
Program
Execution
State Sleep
Mode
Port C 3, 7 T T [OPE = 0,
address output]
T
[OPE = 1,
address output]
Keep
[Other than the
above]
Keep
[Address output]
T
[Other than the
above]
Keep
[Address
output]
A7 to A0
[Other than
the above]
I/O port
Port D 1, 2, 4 T T T T D15 toD8
3, 7 T T [Data bus]
T
[Other than the
above]
Keep
[Data bus]
T
[Other than the
above]
Keep
[Data bus]
D15 to D8
[Other than
the above]
I/O port
Port E 1, 2,
4
8-bit
bus
T T Keep Keep I/O port
16-
bit
bus
T T T T D7 to D0
3, 7 8-bit
bus
T T Keep Keep I/O port
16-
bit
bus
T T [Data bus]
T
[Other than the
above]
Keep
[Data bus]
T
[Other than the
above]
Keep
[Data bus]
D7 to D0
[Other than
the above]
I/O port
1, 2, 4 Clock
output
PF7/φ
3, 7 T
T [Clock output]
H
[Other than the
above]
Keep
[Clock output]
Clock output
[Other than the
above]
Keep
[Clock
output]
Clock output
[Other than
the above]
Input port
Appendix
Rev.6.00 Mar. 18, 2009 Page 945 of 980
REJ09B0050-0600
Port Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus Release
State
Program
Execution
State Sleep
Mode
1, 2, 4
H
PF6/AS
3, 7 T
T [OPE = 0,
AS output]
T
[OPE = 1,
AS output]
H
[Other than the
above]
Keep
[AS output]
T
[Other than the
above]
Keep
[AS output]
AS
[Other than
the above]
I/O port
1, 2, 4 H [OPE = 0]
T
[OPE = 1]
H
T RD, HWR PF5/RD
PF4/HWR
3, 7 T
T
[OPE = 0, RD,
HWR output]
T
[OPE = 1, RD,
HWR output]
H
[Other than the
above]
Keep
[RD, HWR
output]
T
[Other than the
above]
Keep
[RD, HWR
output]
RD, HWR
[Other than
the above]
I/O port
1, 2, 4
H
PF3/LWR
3, 7 T
T [OPE = 0,
LWR output]
T
[OPE = 1,
LWR output]
H
[Other than the
above]
Keep
[LWR output]
T
[Other than the
above]
Keep
[LWR
output]
LWR
[Other than
the above]
I/O port
Appendix
Rev.6.00 Mar. 18, 2009 Page 946 of 980
REJ09B0050-0600
Port Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus Release
State
Program
Execution
State Sleep
Mode
PF2/LCAS/
CS6
1, 2, 4, 7 T T [OPE = 0, LCAS
(DQML) output]
T
[OPE = 1, LCAS
(DQML) output]
H
[OPE = 0, CS
output]
T
[OPE = 1, CS
output]
H
[Other than the
above]
Keep
[LCAS (DQML)
output]
T
[CS output]
T
[Other than the
above]
Keep
[LCAS
(DQML)
output]
LCAS
(DQML)
[CS output]
CS
[Other than
the above]
I/O port
PF1/UCAS/
CS5
1, 2, 4, 7 T T [OPE = 0, UCAS
(DQMU) output]
T
[OPE = 1, UCAS
(DQMU) output]
H
[OPE = 0, CS
output]
T
[OPE = 1, CS
output]
H
[Other than the
above]
Keep
[UCAS (DQMU)
output]
T
[CS output]
T
[Other than the
above]
Keep
[UCAS
(DQMU)
output]
UCAS
[CS output]
CS
[Other than
the above]
I/O port
PF0/WAIT/
OE
1, 2, 4, 7 T T [WAIT input]
T
[OE output, OPE
= 0]
T
[OE output, OPE
= 1]
H
[Other than the
above]
Keep
[WAIT input]
T
[OE output]
T
[Other than the
above]
Keep
[WAIT input]
WAIT
[OE output]
OE
[Other than
the above]
I/O port
Appendix
Rev.6.00 Mar. 18, 2009 Page 947 of 980
REJ09B0050-0600
Port Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus Release
State
Program
Execution
State Sleep
Mode
PG6/BREQ 1, 2, 4, 7 T T [BREQ input]
T
[Other than the
above]
Keep
BREQ input
BREQ
[BREQ
input]
BREQ
[Other than
the above]
I/O port
PG5/BACK 1, 2, 4, 7 T T [BACK output]
BACK
[Other than the
above]
Keep
BACK [BACK
output]
BACK
[Other than
the above]
I/O port
PG4/
BREQO/
CS4
1, 2, 4, 7 T T [BREQO output]
BREQO
[OPE = 0, CS
output]
T
[OPE = 1, CS
output]
H
[Other than the
above]
Keep
[BREQO output]
BREQO
[CS output]
T
[Other than the
above]
Keep
[BREQO
output]
BREQO
[CS output]
CS
[Other than
the above]
I/O port
PG3/CS3
PG2/CS2
PG1/CS1
1, 2, 4, 7 T T [OPE = 0,
CS output]
T
[OPE = 1,
CS output]
H
[Other than the
above]
Keep
[CS output]
T
[Other than the
above]
Keep
[CS output]
CS
[Other than
the above]
I/O port
Appendix
Rev.6.00 Mar. 18, 2009 Page 948 of 980
REJ09B0050-0600
Port Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus Release
State
Program
Execution
State Sleep
Mode
1, 2 H
3, 4, 7 T
PG0/CS0
T [OPE = 0,
CS output]
T
[OPE = 1,
CS output]
H
[Other than the
above]
Keep
[CS output]
T
[Other than the
above]
Keep
[CS output]
CS
[Other than
the above]
I/O port
WDTOVF 1, 2, 3, 4,
7
H H H H H*
Legend:
L: Low level
H: High level
Keep: Input port becomes high-impedance, output port retains state
T: High impedance
DDR: Data direction register
OPE: Output port enable
Notes: Indicates the state after the bus cycle being executed is completed.
* Low output if a watchdog overflow occurs when WT/IT is set to 1.
Appendix
Rev.6.00 Mar. 18, 2009 Page 949 of 980
REJ09B0050-0600
B. Product Lineup
Product Part No. Model Marking Package (Code)
H8S/2368F F-ZTAT version HD64F2368 HD64F2368VTE
H8S/2367F F-ZTAT version HD64F2367 HD64F2367VTE
120-pin TFP
(TFP-120, TFP-120V)*2
H8S/2367F F-ZTAT version HD64F2367 HD64F2367F 128-pin*1 QFP
(FP-128B, FP-128B)*2
H8S/2366F F-ZTAT version HD64F2366 HD64F2366F 128-pin*1 QFP
(FP-128B, FP-128B)*2
H8S/2364F F-ZTAT version HD64F2364 HD64F2364VTE
H8S/2362F F-ZTAT version HD64F2362 HD64F2362VTE
H8S/2361F F-ZTAT version HD64F2361 HD64F2361VTE
H8S/2360F F-ZTAT version HD64F2360 HD64F2360VTE
120-pin TFP
(TFP-120, TFP-120V)*2
H8S/2365 Masked ROM version HD6432365 HD6432365F 128-pin*1 QFP
(FP-128B, FP-128B)*2
H8S/2365 Masked ROM version HD6432365 HD6432365VTE 120-pin TFP
(TFP-120, TFP-120V)*2
H8S/2363 ROMless version HD6412363 HD6412363F 128-pin*1 QFP
(FP-128B, FP-128B)*2
H8S/2363 ROMless version HD6412363 HD6412363VTE 120-pin TFP
(TFP-120, TFP-120V)*2
Notes: When using the optional functions for the F-ZTAT version, ROMless version, which has the
common type name, contact a Renesas sales office.
1. Supported only by the H8S/2368 0.18 μm F-ZTAT Group.
2. Pb free version
Appendix
Rev.6.00 Mar. 18, 2009 Page 950 of 980
REJ09B0050-0600
C. Package Dimensions
The package dimension that is shown in the Renesas Semiconductor Package Data Book has
Priority.
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
PTQP0120LA-AP-TQFP120-14x14-0.40
1.20
1.20
0.10
0.07
0.4
8
°
0
°
1.20
0.15
0.15
0.200.100.00
0.220.170.12
0.220.170.12
15.8 16.0 16.2
1
L
L
E
Z
D
Z
y
x
e
e
1
c
c
1
p
1
E
D
2
D
b
b
A
H
A
E
A
H
0.5g
MASS[Typ.]
TFP-120/TFP-120V
RENESAS CodeJEITA Package Code Previous Code
0.60.50.4
MaxNomMin
Dimension in Millimeters
Symbol
Reference
14
1.00
16.216.015.8
1.0
14
Index mark
*1
*2
*3p
E
D
E
D
F
xMy
120
13 0
31
90
91 60
61
Z
Z
b
H
E
H
D
2
1
1
Detail F
c
A A
L
A
L
Terminal cross section
p
1
1
b
c
b
c
θ
θ
Figure C.1 Package Dimensions (TFP-120)
Appendix
Rev.6.00 Mar. 18, 2009 Page 951 of 980
REJ09B0050-0600
PRQP0128KB-AP-QFP128-14x20-0.50
0.75
0.75
15.8 16.0 16.2
0.10
0.70.50.3
0.15
0.20
14
2.70
22.222.021.8
3.15
0.250.100.00
0.270.220.17
0.220.170.12
0.5
8
°
0
°
0.10
1.0
20
FP-128B/FP-128BV
RENESAS CodeJEITA Package Code Previous Code
MaxNomMin
Dimension in Millimeters
Symbol
Reference
1.7g
MASS[Typ.]
1
E
D
1
1
p
1
E
D
2
L
Z
Z
y
x
c
b
b
A
H
A
E
D
A
c
e
L
H
Index mark
*1
*2
*3
128
1
yMx
F
38
39
103
102
64
65
D
E
D
E
p
Z
Z
b
H
D
H
E
Detail F
1
12
c
L
A
A
A
L
1
1
p
Terminal cross section
b
c
c
b
θ
θ
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
Figure C.2 Package Dimensions (FP-128B)
Appendix
Rev.6.00 Mar. 18, 2009 Page 952 of 980
REJ09B0050-0600
D. Bus State during Execution of Instructions
Table D.1 shows the execution state of each instruction in this LSI.
R:W 2nd
1 state of inter-
nal operation
R:W EA
Order of execution
End of instruction
Read the effective address in words.
Read/write is not performed.
Read the second word of the instruction that is being executed in words.
1Instruction
[Explanation of Table Contents]
2345678
Legend:
R:B Reading in bytes
R:W Reading in words
W:B Writing in bytes
W:W Writing in words
:M Bus right cannot be handed over immediately after this cycle
2nd Address of second word (3rd and 4th bytes)
3rd Address of third word (5th and 6th bytes)
4th Address of fourth word (7th and 8th bytes)
5th Address of fifth word (9th and 10th bytes)
NEXT Start address of instruction immediately following the instruction being executed
EA Effective address
VEC Vector address
Figure D.1 shows the timing of the address bus, RD, HWR, and LWR during execution of the
sample instruction above (example in "Explanation of Table Contents") with an 8-bit bus, 3-state
access, and no wait.
Appendix
Rev.6.00 Mar. 18, 2009 Page 953 of 980
REJ09B0050-0600
RD
HWR, LWR
Address bus
R: W 2nd R: W EA
High
Internal
operation
Fetch of 3rd byte of
instruction being
executed
Fetch of 4th byte of
instruction being
executed
Fetch of 1st byte of
brunch destination
instruction
Fetch of 2nd byte of
brunch destination
instruction
φ
Figure D.1 Timing of Address Bus, RD, HWR, and LWR (8-bit bus, 3-state access, no wait)
Appendix
Rev.6.00 Mar. 18, 2009 Page 954 of 980
REJ09B0050-0600
Table D.1 Execution State of Instructions
Instruction 1 2 3 4 5 6 7 8 9
ADD.B
#xx:8,Rd
R:W
NEXT
ADD.B Rs,Rd R:W
NEXT
ADD.W
#xx:16,Rd
R:W 2nd R:W
NEXT
ADD.W Rs,Rd R:W
NEXT
ADD.L
#xx:32,ERd
R:W 2nd R:W 3rd R:W
NEXT
ADD.L
ERs,ERd
R:W
NEXT
ADDS
#1/2/4,ERd
R:W
NEXT
ADDX
#xx:8,Rd
R:W
NEXT
ADDX Rs,Rd R:W
NEXT
AND.B
#xx:8,Rd
R:W
NEXT
AND.B Rs,Rd R:W
NEXT
AND.W
#xx:16,Rd
R:W 2nd R:W:
NEXT
AND.W Rs,Rd R:W
NEXT
AND.L
#xx:32,ERd
R:W 2nd R:W 3rd R:W
NEXT
AND.L
ERs,ERd
R:W 2nd R:W
NEXT
ANDC
#xx:8,CCR
R:W
NEXT
ANDC
#xx:8,EXR
R:W 2nd R:W
NEXT
BAND
#xx:3,Rd
R:W
NEXT
Appendix
Rev.6.00 Mar. 18, 2009 Page 955 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
BAND
#xx:3,@ERd
R:W 2nd R:B EA R:W
NEXT
BAND
#xx:3,@aa:8
R:W 2nd R:B EA R:W
NEXT
BAND
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B EA R:W
NEXT
BAND
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B EA R:W
NEXT
BRA d:8
(BT d:8)
R:W
NEXT
R:W EA
BRN d:8
(BF d:8)
R:W
NEXT
R:W EA
BHI d:8 R:W
NEXT
R:W EA
BLS d:8 R:W
NEXT
R:W EA
BCC d:8
(BHS d:8)
R:W
NEXT
R:W EA
BCS d:8
(BLO d:8)
R:W
NEXT
R:W EA
BNE d:8 R:W
NEXT
R:W EA
BEQ d:8 R:W
NEXT
R:W EA
BVC d:8 R:W
NEXT
R:W EA
BVS d:8 R:W
NEXT
R:W EA
BPL d:8 R:W
NEXT
R:W EA
BMI d:8 R:W
NEXT
R:W EA
BGE d:8 R:W
NEXT
R:W EA
BLT d:8 R:W
NEXT
R:W EA
BGT d:8 R:W
NEXT
R:W EA
Appendix
Rev.6.00 Mar. 18, 2009 Page 956 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
BLE d:8 R:W
NEXT
R:W EA
BRA d:16
(BT d:16)
R:W 2nd 1 state of
internal
operation
R:W EA
BRN d:16
(BF d:16)
R:W 2nd 1 state of
internal
operation
R:W EA
BHI d:16 R:W 2nd 1 state of
internal
operation
R:W EA
BLS d:16 R:W 2nd 1 state of
internal
operation
R:W EA
BCC d:16
(BHS d:16)
R:W 2nd 1 state of
internal
operation
R:W EA
BCS d:16
(BLO d:16)
R:W 2nd 1 state of
internal
operation
R:W EA
BNE d:16 R:W 2nd 1 state of
internal
operation
R:W EA
BEQ d:16 R:W 2nd 1 state of
internal
operation
R:W EA
BVC d:16 R:W 2nd 1 state of
internal
operation
R:W EA
BVS d:16 R:W 2nd 1 state of
internal
operation
R:W EA
BPL d:16 R:W 2nd 1 state of
internal
operation
R:W EA
BMI d:16 R:W 2nd 1 state of
internal
operation
R:W EA
Appendix
Rev.6.00 Mar. 18, 2009 Page 957 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
BGE d:16 R:W 2nd 1 state of
internal
operation
R:W EA
BLT d:16 R:W 2nd 1 state of
internal
operation
R:W EA
BGT d:16 R:W 2nd 1 state of
internal
operation
R:W EA
BLE d:16 R:W 2nd 1 state of
internal
operation
R:W EA
BCLR
#xx:3,Rd
R:W
NEXT
BCLR
#xx:3,@ERd
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BCLR
#xx:3,@aa:8
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BCLR
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B:M
EA
R:W:M
NEXT
W:B EA
BCLR
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B:M
EA
R:W:M
NEXT
W:B EA
BCLR Rn,Rd R:W
NEXT
BCLR
Rn,@ERd
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BCLR
Rn,@aa:8
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BCLR
Rn,@aa:16
R:W 2nd R:W 3rd R:B:M
EA
R:W:M
NEXT
W:B EA
BCLR
Rn,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B:M
EA
R:W:M
NEXT
W:B EA
BIAND
#xx:3,Rd
R:W
NEXT
BIAND
#xx:3,@ERd
R:W 2nd R:B EA R:W
NEXT
BIAND
#xx:3,@aa:8
R:W 2nd R:B EA R:W
NEXT
Appendix
Rev.6.00 Mar. 18, 2009 Page 958 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
BIAND
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B EA R:W
NEXT
BIAND
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B EA R:W
NEXT
BILD #xx:3,Rd R:W
NEXT
BILD
#xx:3,@ERd
R:W 2nd R:B EA R:W
NEXT
BILD
#xx:3,@aa:8
R:W 2nd R:B EA R:W
NEXT
BILD
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B EA R:W
NEXT
BILD
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B EA R:W
NEXT
BIOR #xx:3,Rd R:W
NEXT
BIOR
#xx:3,@ERd
R:W 2nd R:B EA R:W
NEXT
BIOR
#xx:3,@aa:8
R:W 2nd R:B EA R:W
NEXT
BIOR
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B EA R:W
NEXT
BIOR
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B EA R:W
NEXT
BIST #xx:3,Rd R:W
NEXT
BIST
#xx:3,@ERd
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BIST
#xx:3,@aa:8
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BIST
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B:M
EA
R:W:M
NEXT
W:B EA
BIST
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B:M
EA
R:W:M
NEXT
W:B EA
BIXOR
#xx:3,Rd
R:W
NEXT
BIXOR
#xx:3,@ERd
R:W 2nd R:B EA R:W
NEXT
Appendix
Rev.6.00 Mar. 18, 2009 Page 959 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
BIXOR
#xx:3,@aa:8
R:W 2nd R:B EA R:W
NEXT
BIXOR
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B EA R:W
NEXT
BIXOR
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B EA R:W
NEXT
BLD #xx:3,Rd R:W
NEXT
BLD
#xx:3,@ERd
R:W 2nd R:B EA R:W
NEXT
BLD
#xx:3,@aa:8
R:W 2nd R:B EA R:W
NEXT
BLD
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B EA R:W
NEXT
BLD
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B EA R:W
NEXT
BNOT
#xx:3,Rd
R:W
NEXT
BNOT
#xx:3,@ERd
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BNOT
#xx:3,@aa:8
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BNOT
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B:M
EA
R:W:M
NEXT
W:B EA
BNOT
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B:M
EA
R:W:M
NEXT
W:B EA
BNOT Rn,Rd R:W
NEXT
BNOT
Rn,@ERd
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BNOT
Rn,@aa:8
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BNOT
Rn,@aa:16
R:W 2nd R:W 3rd R:B:M
EA
R:W:M
NEXT
W:B EA
BNOT
Rn,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B:M
EA
R:W:M
NEXT
W:B EA
BOR #xx:3,Rd R:W
NEXT
Appendix
Rev.6.00 Mar. 18, 2009 Page 960 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
BOR
#xx:3,@ERd
R:W 2nd R:B EA R:W
NEXT
BOR
#xx:3,@aa:8
R:W 2nd R:B EA R:W
NEXT
BOR
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B EA R:W
NEXT
BOR
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B EA R:W
NEXT
BSET
#xx:3,Rd
R:W
NEXT
BSET
#xx:3,@ERd
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BSET
#xx:3,@aa:8
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BSET
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B:M
EA
R:W:M
NEXT
W:B EA
BSET
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B:M
EA
R:W:M
NEXT
W:B EA
BSET Rn,Rd R:W
NEXT
BSET
Rn,@ERd
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BSET
Rn,@aa:8
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BSET
Rn,@aa:16
R:W 2nd R:W 3rd R:B:M
EA
R:W:M
NEXT
W:B EA
BSET
Rn,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B:M
EA
R:W:M
NEXT
W:B EA
BSR
d:8
Advanced R:W
NEXT
R:W EA W:W:M
Stack
(H)
W:W
Stack (L)
BSR
d:16
Advanced R:W 2nd 1 state of
internal
operation
R:W EA W:W:M
Stack
(H)
W:W
Stack (L)
BST #xx:3,Rd R:W
NEXT
BST
#xx:3,@ERd
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
Appendix
Rev.6.00 Mar. 18, 2009 Page 961 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
BST
#xx:3,@aa:8
R:W 2nd R:B:M
EA
R:W:M
NEXT
W:B EA
BST
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B:M
EA
R:W:M
NEXT
W:B EA
BST
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B:M
EA
R:W:M
NEXT
W:B EA
BTST
#xx:3,Rd
R:W
NEXT
BTST
#xx:3,@ERd
R:W 2nd R:B EA R:W
NEXT
BTST
#xx:3,@aa:8
R:W 2nd R:B EA R:W
NEXT
BTST
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B EA R:W
NEXT
BTST
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B EA R:W
NEXT
BTST Rn,Rd R:W
NEXT
BTST
Rn,@ERd
R:W 2nd R:B EA R:W
NEXT
BTST
Rn,@aa:8
R:W 2nd R:B EA R:W
NEXT
BTST
Rn,@aa:16
R:W 2nd R:W 3rd R:B EA R:W
NEXT
BTST
Rn,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B EA R:W
NEXT
BXOR
#xx:3,Rd
R:W
NEXT
BXOR
#xx:3,@ERd
R:W 2nd R:B EA R:W
NEXT
BXOR
#xx:3,@aa:8
R:W 2nd R:B EA R:W
NEXT
BXOR
#xx:3,@aa:16
R:W 2nd R:W 3rd R:B EA R:W
NEXT
BXOR
#xx:3,@aa:32
R:W 2nd R:W 3rd R:W 4th R:B EA R:W
NEXT
Appendix
Rev.6.00 Mar. 18, 2009 Page 962 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
CLRMAC R:W
NEXT
1 state of
internal
operation
CMP.B
#xx:8,Rd
R:W
NEXT
CMP.B Rs,Rd R:W
NEXT
CMP.W
#xx:16,Rd
R:W 2nd R:W
NEXT
CMP.W Rs,Rd R:W
NEXT
CMP.L
#xx:32,ERd
R:W 2nd R:W 3rd R:W
NEXT
CMP.L
ERs,ERd
R:W
NEXT
DAA Rd R:W
NEXT
DAS Rd R:W
NEXT
DEC.B Rd R:W
NEXT
DEC.W
#1/2,Rd
R:W
NEXT
DEC.L
#1/2,ERd
R:W
NEXT
DIVXS.B
Rs,Rd
R:W 2nd R:W
NEXT
11 states of internal
operation
DIVXS.W
Rs,ERd
R:W 2nd R:W
NEXT
19 states of internal
operation
DIVXU.B
Rs,Rd
R:W
NEXT
11 states of internal
operation
DIVXU.W
Rs,ERd
R:W
NEXT
19 states of internal operation
EEPMOV.B R:W 2nd 2 states of internal
operation
R:B EAs
*1
W:B EAd
*1
R:W
NEXT
EEPMOV.W R:W 2nd 2 states of internal
operation
R:B EAs
*1
W:B EAd
*1
R:W
NEXT
Appendix
Rev.6.00 Mar. 18, 2009 Page 963 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
EXTS.W Rd R:W
NEXT
Repeated for n
times*1
EXTS.L ERd R:W
NEXT
EXTU.W Rd R:W
NEXT
EXTU.L ERd R:W
NEXT
INC.B Rd R:W
NEXT
INC.W
#1/2,Rd
R:W
NEXT
INC.L
#1/2,ERd
R:W
NEXT
JMP @ERn R:W
NEXT
R:W EA
JMP @aa:24 R:W 2nd 1 state of
internal
operation
R:W EA
JMP
@@aa
:8
Advanced R:W
NEXT
R:W:M
aa:8
R:W
aa:8
1 state of
internal
operation
R:W EA
JSR
@ERn
Advanced R:W
NEXT
R:W EA W:W:M
Stack
(H)
W:W
Stack (L)
JSR
@aa:2
4
Advanced R:W 2nd 1 state of
internal
operation
R:W EA W:W:M
Stack
(H)
W:W
Stack (L)
JSR
@@aa
:8
Advanced R:W
NEXT
R:W:M
aa:8
R:W
aa:8
W:W:M
Stack
(H)
W:W
Stack (L)
R:W EA
LDC
#xx:8,CCR
R:W
NEXT
LDC
#xx:8,EXR
R:W 2nd R:W
NEXT
LDC Rs,CCR R:W
NEXT
LDC Rs,EXR R:W
NEXT
Appendix
Rev.6.00 Mar. 18, 2009 Page 964 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
LDC
@ERs,CCR
R:W 2nd R:W
NEXT
R:W EA
LDC
@ERs,EXR
R:W 2nd R:W
NEXT
R:W EA
LDC@(d:16,E
Rs),CCR
R:W 2nd R:W 3rd R:W
NEXT
R:W EA
LDC@(d:16,E
Rs),EXR
R:W 2nd R:W 3rd R:W
NEXT
R:W EA
LDC@(d:32,E
Rs),CCR
R:W 2nd R:W 3rd R:W 4th R:W 5th R:W
NEXT
R:W EA
LDC@(d:32,E
Rs),EXR
R:W 2nd R:W 3rd R:W 4th R:W 5th R:W
NEXT
R:W EA
LDC
@ERs+,CCR
R:W 2nd R:W
NEXT
1 state of
internal
operation
R:W EA
LDC
@ERs+,EXR
R:W 2nd R:W
NEXT
1 state of
internal
operation
R:W EA
LDC
@aa:16,CCR
R:W 2nd R:W 3rd R:W
NEXT
R:W EA
LDC
@aa:16,EXR
R:W 2nd R:W 3rd R:W
NEXT
R:W EA
LDC
@aa:32,CCR
R:W 2nd R:W 3rd R:W 4th R:W
NEXT
R:W EA
LDC
@aa:32,EXR
R:W 2nd R:W 3rd R:W 4th R:W
NEXT
R:W EA
LDM.L @SP+,
(ERn-ERn+1)
*8
R:W 2nd R:W
NEXT
1 state of
internal
operation
R:W:M
Stack
(H)*2
R:W
Stack (L)
*2
LDM.L @SP+,
(ERn-ERn+2)
*8
R:W 2nd R:W
NEXT
1 state of
internal
operation
R:W:M
Stack
(H)*2
R:W
Stack (L)
*2
LDM.L @SP+,
(ERn-ERn+3)
*8
R:W 2nd R:W
NEXT
1 state of
internal
operation
R:W:M
Stack
(H)*2
R:W
Stack (L)
*2
LDMAC
ERs,MACH
R:W
NEXT
1 state of
internal
operation
Appendix
Rev.6.00 Mar. 18, 2009 Page 965 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
LDMAC
ERs,MACL
R:W
NEXT
1 state of
internal
operation
MAC
@ERn+,@ER
m+
R:W 2nd R:W
NEXT
R:W
EAn
R:W
EAm
MOV.B
#xx:8,Rd
R:W
NEXT
MOV.B Rs,Rd R:W
NEXT
MOV.B
@ERs,Rd
R:W
NEXT
R:B EA
MOV.B
@(d:16,ERs),
Rd
R:W 2nd R:W
NEXT
R:B EA
MOV.B
@(d:32,ERs),
Rd
R:W 2nd R:W 3rd R:W 4th R:W
NEXT
R:B EA
MOV.B
@ERs+,Rd
R:W
NEXT
1 state of
internal
operation
R:B EA
MOV.B
@aa:8,Rd
R:W
NEXT
R:B EA
MOV.B
@aa:16,Rd
R:W 2nd R:W
NEXT
R:B EA
MOV.B
@aa:32,Rd
R:W 2nd R:W 3rd R:W
NEXT
R:B EA
MOV.B
Rs,@ERd
R:W
NEXT
W:B EA
MOV.B Rs,
@(d:16,ERd)
R:W 2nd R:W
NEXT
W:B EA
MOV.B Rs,
@(d:32,ERd)
R:W 2nd R:W 3rd R:W 4th R:W
NEXT
W:B EA
MOV.B Rs, @-
ERd
R:W
NEXT
1 state of
internal
operation
W:B EA
MOV.B
Rs,@aa:8
R:W
NEXT
W:B EA
Appendix
Rev.6.00 Mar. 18, 2009 Page 966 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
MOV.B
Rs,@aa:16
R:W 2nd R:W
NEXT
W:B EA
MOV.B
Rs,@aa:32
R:W 2nd R:W 3rd R:W
NEXT
W:B EA
MOV.W
#xx:16,Rd
R:W 2nd R:W
NEXT
MOV.W Rs,Rd R:W
NEXT
MOV.W
@ERs,Rd
R:W
NEXT
R:W EA
MOV.W
@(d:16,ERs),
Rd
R:W 2nd R:W
NEXT
R:W EA
MOV.W
@(d:32,ERs),
Rd
R:W 2nd R:W 3rd R:W 4th R:W
NEXT
R:W EA
MOV.W
@ERs+,Rd
R:W
NEXT
1 state of
internal
operation
R:W EA
MOV.W
@aa:16,Rd
R:W 2nd R:W
NEXT
R:W EA
MOV.W
@aa:32,Rd
R:W 2nd R:W 3rd R:W
NEXT
R:B EA
MOV.W
Rs,@ERd
R:W
NEXT
W:W EA
MOV.W Rs,
@(d:16,ERd)
R:W 2nd R:W
NEXT
W:W EA
MOV.W Rs,
@(d:32,ERd)
R:W 2nd R:W 3rd R:W 4th R:W
NEXT
W:W EA
MOV.W Rs,@-
ERd
R:W
NEXT
1 state of
internal
operation
W:W EA
MOV.W
Rs,@aa:16
R:W 2nd R:W
NEXT
W:W EA
MOV.W
Rs,@aa:32
R:W 2nd R:W 3rd R:W
NEXT
W:W EA
MOV.L
#xx:32,ERd
R:W 2nd R:W 3rd R:W
NEXT
Appendix
Rev.6.00 Mar. 18, 2009 Page 967 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
MOV.L
ERs,ERd
R:W
NEXT
MOV.L
@ERs,ERd
R:W 2nd R:W
NEXT
R:W:M
EA
R:W
EA+2
MOV.L
@(d:16,ERs),
ERd
R:W 2nd R:W 3rd R:W
NEXT
R:W:M
EA
R:W
EA+2
MOV.L
@(d:32,ERs),
ERd
R:W 2nd R:W 3rd R:W 4th R:W 5th R:W
NEXT
R:W:M
EA
R:W
EA+2
MOV.L
@ERs+,ERd
R:W 2nd R:W
NEXT
1 state of
internal
operation
R:W:M
EA
R:W
EA+2
MOV.L
@aa:16,ERd
R:W 2nd R:W 3rd R:W
NEXT
R:W:M
EA
R:W
EA+2
MOV.L
@aa:32,ERd
R:W 2nd R:W 3rd R:W 4th R:W
NEXT
R:W:M
EA
R:W
EA+2
MOV.L
ERs,@ERd
R:W 2nd R:W
NEXT
W:W:M
EA
W:W
EA+2
MOV.L ERs,
@(d:16,ERd)
R:W 2nd R:W 3rd R:W
NEXT
W:W:M
EA
W:W
EA+2
MOV.L ERs,
@(d:32,ERd)
R:W 2nd R:W 3rd R:W 4th R:W 5th R:W
NEXT
W:W:M
EA
W:W
EA+2
MOV.L
ERs,@-ERd
R:W 2nd R:W
NEXT
1 state of
internal
operation
W:W:M
EA
W:W
EA+2
MOV.L
ERs,@aa:16
R:W 2nd R:W 3rd R:W
NEXT
W:W:M
EA
W:W
EA+2
MOV.L
ERs,@aa:32
R:W 2nd R:W 3rd R:W 4th R:W
NEXT
W:W:M
EA
W:W
EA+2
MOVFPE
@aa:16,Rd
Not available in this LSI.
MOVTPE
Rs,@aa:16
MULXS.B
Rs,Rd
R:W 2nd R:W
NEXT
2 status of internal
operation
MULXS.W
Rs,ERd
R:W 2nd R:W
NEXT
3 status of internal operation
Appendix
Rev.6.00 Mar. 18, 2009 Page 968 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
MULXU.B
Rs,Rd
R:W
NEXT
2 status of internal
operation
MULXU.W
Rs,ERd
R:W
NEXT
3 status of internal operation
NEG.B Rd R:W
NEXT
NEG.W Rd R:W
NEXT
NEG.L ERd R:W
NEXT
NOP R:W
NEXT
NOT.B Rd R:W
NEXT
NOT.W Rd R:W
NEXT
NOT.L ERd R:W
NEXT
OR.B #xx:8,Rd R:W
NEXT
OR.B Rs,Rd R:W
NEXT
OR.W
#xx:16,Rd
R:W 2nd R:W
NEXT
OR.W Rs,Rd R:W
NEXT
OR.L
#xx:32,ERd
R:W 2nd R:W 3rd R:W
NEXT
OR.L
ERs,ERd
R:W 2nd R:W
NEXT
ORC
#xx:8,CCR
R:W
NEXT
ORC
#xx:8,EXR
R:W 2nd R:W
NEXT
POP.W Rn R:W
NEXT
1 state of
internal
operation
R:W EA
Appendix
Rev.6.00 Mar. 18, 2009 Page 969 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
POP.L ERn R:W 2nd R:W
NEXT
1 state of
internal
operation
R:W:M
EA
R:W
EA+2
PUSH.W Rn R:W
NEXT
1 state of
internal
operation
W:W EA
PUSH.L ERn R:W 2nd R:W
NEXT
1 state of
internal
operation
W:W:M
EA
W:W
EA+2
ROTL.B Rd R:W
NEXT
ROTL.B #2,Rd R:W
NEXT
ROTL.W Rd R:W
NEXT
ROTL.W
#2,Rd
R:W
NEXT
ROTL.L ERd R:W
NEXT
ROTL.L
#2,ERd
R:W
NEXT
ROTR.B Rd R:W
NEXT
ROTR.B
#2,Rd
R:W
NEXT
ROTR.W Rd R:W
NEXT
ROTR.W
#2,Rd
R:W
NEXT
ROTR.L ERd R:W
NEXT
ROTR.L
#2,ERd
R:W
NEXT
ROTXL.B Rd R:W
NEXT
ROTXL.B
#2,Rd
R:W
NEXT
ROTXL.W Rd R:W
NEXT
Appendix
Rev.6.00 Mar. 18, 2009 Page 970 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
ROTXL.W
#2,Rd
R:W
NEXT
ROTXL.L ERd R:W
NEXT
ROTXL.L
#2,ERd
R:W
NEXT
ROTXR.B Rd R:W
NEXT
ROTXR.B
#2,Rd
R:W
NEXT
ROTXR.W Rd R:W
NEXT
ROTXR.W
#2,Rd
R:W
NEXT
ROTXR.L ERd R:W
NEXT
ROTXR.L
#2,ERd
R:W
NEXT
RTE R:W
NEXT
R:W
Stack
(EXR)
R:W
Stack
(H)
R:W
Stack (L)
1 state of
internal
operation
R:W*3
RTS Advanced R:W
NEXT
R:W:M
Stack
(H)
R:W
Stack (L)
1 state of
internal
operation
R:W*3
SHAL.B Rd R:W
NEXT
SHAL.B #2,Rd R:W
NEXT
SHAL.W Rd R:W
NEXT
SHAL.W
#2,Rd
R:W
NEXT
SHAL.L ERd R:W
NEXT
SHAL.L
#2,ERd
R:W
NEXT
SHAR.B Rd R:W
NEXT
Appendix
Rev.6.00 Mar. 18, 2009 Page 971 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
SHAR.B #2,Rd R:W
NEXT
SHAR.W Rd R:W
NEXT
SHAR.W
#2,Rd
R:W
NEXT
SHAR.L ERd R:W
NEXT
SHAR.L
#2,ERd
R:W
NEXT
SHLL.B Rd R:W
NEXT
SHLL.B #2,Rd R:W
NEXT
SHLL.W Rd R:W
NEXT
SHLL.W #2,Rd R:W
NEXT
SHLL.L ERd R:W
NEXT
SHLL.L
#2,ERd
R:W
NEXT
SHLR.B Rd R:W
NEXT
SHLR.B #2,Rd R:W
NEXT
SHLR.W Rd R:W
NEXT
SHLR.W
#2,Rd
R:W
NEXT
SHLR.L ERd R:W
NEXT
SHLR.L
#2,ERd
R:W
NEXT
SLEEP R:W
NEXT
Internal
operation:
M
Appendix
Rev.6.00 Mar. 18, 2009 Page 972 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
STC CCR,Rd R:W
NEXT
STC EXR,Rd R:W
NEXT
STC
CCR,@ERd
R:W 2nd R:W
NEXT
W:W EA
STC
EXR,@ERd
R:W 2nd R:W
NEXT
W:W EA
STC CCR,
@(d:16,ERd)
R:W 2nd R:W 3rd R:W
NEXT
W:W EA
STC EXR,
@(d:16,ERd)
R:W 2nd R:W 3rd R:W
NEXT
W:W EA
STC CCR,
@(d:32,ERd)
R:W 2nd R:W 3rd R:W 4th R:W 5th R:W
NEXT
W:W EA
STC EXR,
@(d:32,ERd)
R:W 2nd R:W 3rd R:W 4th R:W 5th R:W
NEXT
W:W EA
STC CCR,@-
ERd
R:W 2nd R:W
NEXT
1 state of
internal
operation
W:W EA
STC EXR,@-
ERd
R:W 2nd R:W
NEXT
1 state of
internal
operation
W:W EA
STC
CCR,@aa:16
R:W 2nd R:W 3rd R:W
NEXT
W:W EA
STC
EXR,@aa:16
R:W 2nd R:W 3rd R:W
NEXT
W:W EA
STC
CCR,@aa:32
R:W 2nd R:W 3rd R:W 4th R:W
NEXT
W:W EA
STC
EXR,@aa:32
R:W 2nd R:W 3rd R:W 4th R:W
NEXT
W:W EA
STM.L (ERn-
ERn+1),
@-SP*8
R:W 2nd R:W
NEXT
1 state of
internal
operation
W:W:M
Stack
(H)*2
W:W
Stack (L)
*2
STM.L (ERn-
ERn+2),
@-SP*8
R:W 2nd R:W
NEXT
1 state of
internal
operation
W:W:M
Stack
(H)*2
W:W
Stack (L)
*2
Appendix
Rev.6.00 Mar. 18, 2009 Page 973 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
STM.L (ERn-
ERn+3),
@-SP*8
R:W 2nd R:W
NEXT
1 state of
internal
operation
W:W:M
Stack
(H)*2
W:W
Stack (L)
*2
STMAC
MACH,ERd
R:W
NEXT
STMAC
MACL,ERd
R:W
NEXT
SUB.B Rs,Rd R:W
NEXT
SUB.W
#xx:16,Rd
R:W 2nd R:W
NEXT
SUB.W Rs,Rd R:W
NEXT
SUB.L
#xx:32,ERd
R:W 2nd R:W 3rd R:W
NEXT
SUB.L
ERs,ERd
R:W
NEXT
SUBS
#1/2/4,ERd
R:W
NEXT
SUBX
#xx:8,Rd
R:W
NEXT
SUBX Rs,Rd R:W
TAS @ERd*7 R:W 2nd R:W
NEXT
R:B:M
EA
W:B EA
TRAPA
#x:2
Advanced R:W
NEXT
1 state of
internal
operation
W:W
Stack (L)
W:W
Stack
(H)
W:W
Stack
(EXR)
R:W:M
VEC
R:W
VEC+2
1 state of
internal
operation
R:W*6
XOR.B
#xx8,Rd
R:W
NEXT
XOR.B Rs,Rd R:W
NEXT
XOR.W
#xx:16,Rd
R:W 2nd R:W
NEXT
XOR.W Rs,Rd R:W
NEXT
XOR.L
#xx:32,ERd
R:W 2nd R:W 3rd R:W
NEXT
Appendix
Rev.6.00 Mar. 18, 2009 Page 974 of 980
REJ09B0050-0600
Instruction 1 2 3 4 5 6 7 8 9
XOR.L
ERs,ERd
R:W 2nd R:W
NEXT
XORC
#xx:8,CCR
R:W
NEXT
XORC
#xx:8,EXR
R:W 2nd R:W
NEXT
Reset
exception
handling
Advanced R:W:M
VEC
R:W
VEC+2
1 state of
internal
operation
R:W*4
Interrupt
exception
handling
Advanced R:W*5 1 state of
internal
operation
W:W
Stack (L)
W:W
Stack
(H)
W:W
Stack
(EXR)
R:W:M
VEC
R:W
VEC+2
1 state of
internal
operation
R:W*6
Notes: 1. EAs is the ER5 value and EAd the ER6 value. 1 is added to each of them after
execution.
n is the initial value of R4L or R4, and the processing is not executed when n = 0.
2. Repeated two times when two registers are stored/retrieved, three times when three
registers are stored/retrieved, and four times when four registers are stored/retrieved.
3. Start address on returning.
4. Start address of program.
5. Prefetch address that is obtained by adding 2 to the saved PC.
Reading is not performed on returning from sleep mode or software standby mode, and
this is regarded as internal operation.
6. Start address of interrupt handling routine.
7. Registers ER0, ER1, ER4, and ER5 are used for a TAS instruction.
8. Registers ER0 to ER6 are used for an STM/LDM instruction.
Index
Rev.6.00 Mar. 18, 2009 Page 975 of 980
REJ09B0050-0600
Index
16-Bit Timer Pulse Unit.......................... 401
Buffer Operation................................. 447
Cascaded Operation ............................ 452
Input Capture Function ....................... 444
Phase Counting Mode......................... 459
PWM Modes....................................... 454
Synchronous Operation....................... 445
8-Bit Timer
16-Bit Counter Mode.......................... 520
Compare Match Count Mode ............. 520
Operation with Cascaded Connection. 520
Pulse Output ....................................... 515
TCNT Incrementation Timing ............ 516
8-Bit Timers............................................ 507
A/D Converter ........................................ 661
A/D Conversion Time......................... 670
A/D Converter Activation................... 468
External Trigger.................................. 673
Scan Mode .......................................... 669
Single Mode........................................ 669
Address Space........................................... 28
Addressing Mode...................................... 49
Absolute Address.................................. 50
Immediate ............................................. 51
Memory Indirect ................................... 51
Program-Counter Relative .................... 51
Register Direct...................................... 49
Register Indirect.................................... 49
Register Indirect with Displacement..... 50
Register Indirect with Post-Increment .. 50
Register indirect with pre-decrement.... 50
Bcc............................................................ 45
Bus Controller......................................... 119
Basic Bus Interface............................. 150
Basic Timing....................................... 153
DRAM Interface ................................. 165
Read Strobe (RD) Timing................... 162
BusController
Valid Strobes.......................................152
Clock Pulse Generator ............................813
PLL Circuit .........................................818
Condition Field .........................................47
Condition-Code Register...........................32
CPU Operating Modes..............................24
Advanced Mode .................................... 26
Normal Mode........................................24
D/A Converter......................................... 681
Data Tranfer Controller
Block Transfer Mode .......................... 310
Data Transfer Controller .........................293
Activation by Software .......................316
Chain Transfer .................................... 311
Chain Transfer when Counter = 0....... 318
DTC Vector Table...............................302
Interrupts............................................. 312
Location of Register Information........ 302
Normal Mode.............................. 308, 317
Repeat Mode ....................................... 309
Software Activation ............................320
DMA Controller......................................213
Activation by Auto-Request................ 243
Activation by External Request ..........242
Full Address Mode.............................. 268
Interrupt Sources.................................287
Repeat Mode ....................................... 252
Sequential Mode ................................. 246
Short Address Mode............................267
Single Address Mode .......................... 256
Transfer Modes ................................... 244
Effective Address.......................... 49, 52, 53
Effective Address Extension.....................47
Exception Handling...................................79
Interrupts............................................... 84
Reset exception handling ......................81
Stack Status after Exception Handling.. 86
Index
Rev.6.00 Mar. 18, 2009 Page 976 of 980
REJ09B0050-0600
Traces.................................................... 84
Trap Instruction .................................... 85
Extended Control Register (EXR) ............ 31
Flash Memory......................................... 689
Boot Mode .......................................... 702
Erase/Erase-Verify.............................. 708
erasing units........................................ 695
Error Protection .................................. 710
Hardware Protection ........................... 710
Program/Program-Verify .................... 706
Programmer Mode.............................. 711
programming units.............................. 695
Software Protection ............................ 710
Flash Memory (0.18-μm F-ZTAT Version)
Boot Mode .......................................... 748
Communications Protocol................... 784
Error Protection .................................. 779
Flash MAT Configuration .................. 722
Hardware Protection ........................... 778
Mode Comparison .............................. 721
off-board programming mode............. 718
On-Board Programming ..................... 748
on-board programming mode ............. 718
Procedure Program ............................. 768
Programmer Mode.............................. 782
Protection............................................ 778
Serial Communication Interface
Specification ................................... 782
Software Protection ............................ 779
user boot MAT.................................... 781
user boot memory MAT ..................... 717
User Boot Mode.................................. 764
user MAT............................................ 781
user memory MAT ............................. 717
User Program Mode............................ 753
General Registers...................................... 30
I2C Bus Data Formats ............................. 643
I2C Bus Interface (IIC) ............................ 629
acknowledge ............... 644, 646, 648, 650
general call address............................. 641
Slave address.......................................644
Start condition..................................... 644
Stop condition ..................................... 644
Instruction Set ...........................................37
Arithmetic Operations Instructions .......40
Bit Manipulation Instructions ...............43
Block Data Transfer Instruction............47
Branch Instructions ...............................45
Data Transfer Instructions.....................39
Logic Operations Instructions...............42
Shift Instructions................................... 42
System Control Instruction ...................46
Interrupt Control Modes..........................108
Interrupt Controller ...................................89
Interrupt Mask Bit.....................................33
Interrupts
ADI .....................................................673
CMIA ..................................................521
CMIB .................................................. 521
ERI ...................................................... 620
OVI .....................................................521
RXI......................................................620
TCI1U .................................................467
TCI1V .................................................467
TCI2U .................................................467
TCI2V .................................................467
TCI3V .................................................467
TCI4U .................................................467
TCI4V .................................................467
TCI5U .................................................467
TCI5V .................................................467
TEI ...................................................... 620
TGI0A................................................. 467
TGI0B ................................................. 467
TGI0C ................................................. 467
TGI0D................................................. 467
TGI0E .................................................467
TGI1A................................................. 467
TGI1B ................................................. 467
TGI2A................................................. 467
Index
Rev.6.00 Mar. 18, 2009 Page 977 of 980
REJ09B0050-0600
TGI2B................................................. 467
TGI3A................................................. 467
TGI3B................................................. 467
TGI3C................................................. 467
TGI3D................................................. 467
TGI4A................................................. 467
TGI4B................................................. 467
TGI5A................................................. 467
TGI5B................................................. 467
TXI ..................................................... 620
WOVI ................................................. 536
MCU Operating Modes ............................ 57
Operation Field ......................................... 47
Program Counter....................................... 31
Programmable Pulse Generator .............. 485
Non-Overlapping Pulse Output........... 499
Programming/Erasing Interface Parameter
Download pass/fail result parameter... 736
Flash erase block select parameter...... 744
Flash multipurpose address area
parameter ........................................ 741
Flash multipurpose data destination
parameter ........................................ 741
Flash pass/fail parameter .................... 745
Flash programming/erasing frequency
parameter ........................................ 738
Programming/Erasing Interface Register 728
Register
ABWCR...................... 123, 843, 854, 866
ADCR ......................... 668, 847, 860, 870
ADCSR....................... 666, 847, 860, 870
ADDR......................... 664, 847, 859, 870
ASTCR ....................... 123, 843, 854, 866
BCR ............................ 133, 843, 855, 866
BROMCR ................... 132, 843, 854, 866
BRR ............................ 564, 846, 858, 869
CRA............................ 298, 840, 850, 863
CRB ............................ 298, 840, 850, 863
CSACR ....................... 130, 843, 854, 866
DACR ......................................... 684, 860
DADR ......................................... 683, 860
DAR ............................ 297, 840, 850, 863
DMABCR ...........................................226
DMATCR ........................................... 239
DMAWER ..........................................238
DRACCR ............................ 140, 843, 866
DRAMCR ................... 135, 843, 855, 866
DTCER ....................... 299, 844, 856, 867
DTVECR.............................................300
EBR1................................................... 700
EBR2................................................... 700
FLMCR1.............................................698
FLMCR2.............................................699
ICMR .................................................. 636
ICSR............................................ 639, 642
IER ................................ 95, 845, 857, 868
INTCR .......................... 92, 845, 857, 868
IPR ................................ 93, 840, 851, 863
IrCR ............................ 573, 841, 851, 864
ISCR............................................ 851, 864
ISCRL ...................................................96
ISR ................................ 99, 845, 857, 868
ITSR............................................ 100, 864
MDCR........................... 58, 845, 857, 868
MRA ........................... 295, 840, 850, 863
MRB............................ 297, 840, 850, 863
MSTPCR..................... 828, 845, 857, 868
NDER.......................... 488, 845, 857, 868
NDR ............................ 490, 845, 857, 868
P1DDR........................ 327, 841, 852, 864
P1DR........................... 328, 846, 858, 869
P2DDR........................ 337, 841, 852, 864
P2DR........................... 338, 846, 858, 869
P3DDR........................ 347, 841, 852, 864
P3DR........................... 348, 846, 858, 869
P3ODR........................ 349, 842, 852, 864
P5DDR........................ 357, 841, 852, 864
P5DR........................... 357, 846, 858, 869
P8DDR........................ 360, 841, 852, 864
P8DR........................... 361, 846, 858, 869
Index
Rev.6.00 Mar. 18, 2009 Page 978 of 980
REJ09B0050-0600
PADDR....................... 365, 841, 852, 864
PADR.......................... 366, 846, 858, 869
PAODR....................... 367, 842, 852, 864
PAPCR........................ 367, 841, 852, 864
PBDDR....................... 373, 841, 852, 864
PBDR.......................... 374, 846, 858, 869
PBPCR........................ 375, 841, 852, 864
PCDDR....................... 377, 841, 852, 864
PCDR.......................... 378, 846, 858, 869
PCPCR........................ 379, 841, 852, 864
PCR............................. 492, 845, 857, 868
PDDDR....................... 381, 841, 852, 864
PDDR.......................... 382, 846, 858, 869
PDPCR........................ 383, 841, 852, 864
PEDDR ....................... 385, 841, 852, 864
PEDR.......................... 386, 846, 858, 869
PEPCR........................ 387, 841, 852, 864
PFCR0 ........................ 368, 841, 852, 864
PFCR1 ........................ 369, 841, 852, 864
PFCR2 ........................ 350, 841, 852, 864
PFDDR ....................... 389, 841, 852, 864
PFDR .......................... 390, 846, 858, 869
PGDDR....................... 395, 841, 852, 864
PGDR.......................... 396, 846, 858, 869
PLLCR........................ 815, 845, 857, 868
PMR............................ 493, 845, 857, 868
PODR.......................... 489, 845, 857, 868
PORT1........................ 328, 845, 857, 868
PORT2........................ 338, 845, 857, 868
PORT3........................ 348, 845, 857, 868
PORT4........................ 354, 845, 857, 868
PORT5........................ 358, 845, 857, 868
PORT8........................ 361, 845, 857, 868
PORT9........................ 363, 845, 857, 868
PORTA ....................... 366, 846, 858, 869
PORTB ....................... 374, 846, 858, 869
PORTC ....................... 378, 846, 858, 869
PORTD ....................... 382, 846, 858, 869
PORTE........................ 386, 846, 858, 869
PORTF........................ 390, 846, 858, 869
PORTG ....................... 396, 846, 858, 869
RDNCR....................... 129, 843, 854, 866
RDR ............................ 546, 846, 858, 869
REFCR........................ 141, 843, 855, 866
RSR..................................................... 546
RSTCSR...................... 533, 848, 860, 871
RTCNT ....................... 144, 843, 855, 866
RTCOR ....................... 144, 843, 855, 866
SAR..................... 297, 641, 840, 850, 863
SBYCR ....................... 826, 845, 857, 868
SCKCR ....................... 814, 845, 857, 868
SCMR ......................... 563, 846, 858, 869
SCR............................. 551, 846, 858, 869
SEMR.................................. 574, 840, 851
SMR ............................ 547, 846, 858, 869
SSIER.......................... 101, 841, 851, 864
SSR ............................. 556, 846, 858, 869
SYSCR.......................... 58, 845, 857, 868
TCNT ................. 437, 509, 531, 847, 848,
................................ 860, 861, 871, 872
TCOR.................................. 510, 847, 860
TCR............................ 408, 510, 847, 848,
................................ 860, 861, 871, 872
TCSR .......... 512, 531, 847, 848, 860, 871
TDR ............................ 546, 846, 858, 869
TGR ............................ 437, 848, 861, 872
TIER............................ 432, 848, 861, 872
TIOR ........................... 414, 848, 861, 872
TMDR......................... 413, 848, 861, 872
TSR ..................... 434, 547, 848, 861, 872
TSTR................................... 437, 860, 871
TSYR .................................. 438, 860, 871
Wait Control........................................161
WTCR......................... 124, 843, 854, 866
Register Field ............................................47
Registers
FCCS................................................... 726
FECS................................................... 726
FKEY .................................................. 726
FMATS ...............................................726
Index
Rev.6.00 Mar. 18, 2009 Page 979 of 980
REJ09B0050-0600
FPCS................................................... 726
FTDAR ............................................... 726
FVACR............................................... 727
Reset ......................................................... 81
Serial Communication Interface ............. 541
Asynchronous Mode ........................... 576
bit rates ............................................... 564
Break................................................... 622
Clocked Synchronous Mode............... 595
framing error....................................... 584
Mark State...........................................622
overrun error ............................... 584, 600
parity error ..........................................584
Smart Card Interface Mode.................604
stack pointer (SP)......................................30
Trace Bit ...................................................31
TRAPA .....................................................51
Watchdog Timer .....................................529
Interval Timer Mode ........................... 535
Watchdog Timer Mode ....................... 534
Index
Rev.6.00 Mar. 18, 2009 Page 980 of 980
REJ09B0050-0600
Renesas 16-Bit Single-Chip Microcomputer
Hardware Manual
H8S/2368 Group
Publication Date: 1st Edition, March 2002
Rev.6.00, March 18, 2009
Published by: Sales Strategic Planning Div.
Renesas Technology Corp.
Edited by: Customer Support Department
Global Strategic Communication Div.
Renesas Solutions Corp.
©2009. Renesas Technology Corp., All rights reserved. Printed in Japan.
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http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
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