INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1390-R08 1
CPC1390
Single Pole, Normally Open
4-Pin OptoMOS® Relay
Part Number Description
CPC1390G 4-Pin DIP (100/Tube)
CPC1390GV 4-Pin DIP V-Bend (100/Tube)
CPC1390GR 4-Pin Surface Mount (100/Tube)
CPC1390GRTR 4-Pin Surface Mount (1000/Reel)
Parameter Rating Units
Peak Blocking Voltage 400 VP
Load Current 140 mArms / mADC
On-Resistance (max) 22
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
The CPC1390G is a single-pole normally-open
(1-Form-A) Solid State Relay with an enhanced input
to output isolation barrier of 5000Vrms.
The relay output is constructed with efficient
MOSFET switches that use IXYS Integrated Circuits
Division's patented OptoMOS architecture. The input,
a highly efficient infrared LED, controls the optically
coupled output.
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
• 5000Vrms Input/Output Isolation
• 400VP Blocking Voltage
• 100% Solid State
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 4-Pin Package
Switching Characteristics
of Normally Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
1
23
4
+ Control
– Control
Load
Load
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R08
CPC1390
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Parameter Ratings Units
Peak Blocking Voltage 400 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1100 mW
Total Package Dissipation 2550 mW
Isolation Voltage, Input to Output, 60 sec. 5000 Vrms
ESD Rating, Human Body Model 8 kV
Operational Temperature -40 to +85 ºC
Storage Temperature -40 to +125 ºC
1 Derate linearly 1.33mW / ºC
2 Derate linearly 3mW / ºC
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L- - 140 mArms / mADC
Peak t=10ms ILPK - - ±400 mAP
On-Resistance 2IF=2mA, IL=140mA RON -1422
Off-State Leakage Current VL=400VPILEAK -- 1 A
Switching Speeds
Turn-On IF=10mA, VL=10V
(See Timing Diagram)
ton - 0.525 1 ms
Turn-Off toff - 0.42 1
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -13 - pF
Input Characteristics
Input Control Current to Activate 3IL=140mA IF- 0.4 2 mA
Input Control Current to Deactivate - IF0.2 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Input to Output Capacitance VIO=0V, f=1MHz CIO -3 - pF
1 Load current derates linearly from 140mA @ 25ºC to 70mA @ 85ºC.
2 Measurement taken within one second of turn-on time.
3 For applications requiring high-temperature operation (T
A>60ºC), a minimum LED drive current of 4mA is recommended.
Timing Diagram
10%
90%
toff
ton
0 mA
IL
IF
0 mA
INTEGRATED CIRCUITS DIVISION
CPC1390
www.ixysic.com 3
R08
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
Turn-On Time (ms)
0.420 0.455 0.490 0.525 0.560 0.595 0.630
Device Count (N)
0
5
10
15
20
Typical Turn-On Time
(N=50, IF=10mA, IL=140mA)
Turn-Off Time (ms)
0.33 0.35 0.38 0.40 0.42 0.45 0.47
Device Count (N)
0
5
10
15
20
25
30
Typical Turn-Off Time
(N=50, IF=10mA, IL=140mA)
LED Current (mA)
0.25 0.30 0.35 0.40 0.45 0.50 0.55
Device Count (N)
0
5
10
15
20
25
Typical IF for Switch Operation
(N=50, IL=140mA)
35
30
25
20
15
10
5
0
13.5 14.5 15.513.0 14.0 15.0
Device Count (N)
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=140mADC)
On-resistance (:)
35
30
25
20
15
10
5
0
450.5 468.5 486.5441.5 459.5 477.5
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Typical IF for Switch Operation
(IL=70mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (ms)
0
0.5
1.0
1.5
2.0
2.5
3.0
Typical Turn-On Time
vs. Temperature
(IL=70mA)
IF=2mA
IF=5mA
IF=10mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (ms)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Typical Turn-Off Time
vs. Temperature
(IL=70mA)
IF=2mA
IF=5mA
IF=10mA
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
Temperature (ºC)
IF=50mA
IF=5mA
IF=10mA
Typical LED Forward Voltage Drop
vs. Temperature
LED Current (mA)
0 1020304050
Turn-On Time (ms)
0
1
2
3
4
5
6
Typical Turn-On Time
vs. LED Forward Current
(IL=70mA)
LED Current (mA)
0 1020304050
Turn-Off Time (ms)
0.38
0.39
0.40
0.41
0.42
0.43
0.44
Typical Turn-Off Time
vs. LED Forward Current
(IL=70mA)
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R08
CPC1390
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
25
20
15
10
5
-40 -20 0 20 40 60 80 120100
Typical On-Resistance
vs. Temperature
(IF=2mA, IL=100mA Instantaneous)
Temperature (ºC)
On-Resistance (:)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150-2.5 -2.0 -1.5 -1.0 -0.5 0 1.51.00.5 2.0 2.5
Typical Load Current vs. Load Voltage
(IF=2mA)
Load Current (mA)
180
160
140
120
100
80
60
-40 -20 0 20 40 60 80 120100
Maximum Load Current
vs. Temperature
(IF=2mA)
Temperature (ºC)
Blocking Voltage (VP)
-40
480
475
470
465
460
455
450
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
Leakage (PA)
-40
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 3 & 4
(VL=400V)
Temperature (ºC) Load Voltage (V)
0 50 100 150 200
Output Capacitance (pF)
0
20
40
60
80
100
120
140
160
Output Capacitance vs. Load Voltage
(IF=0mA, f=1MHz)
Time
Load Current (A)
10Ps
1.2
1.0
0.8
0.6
0.4
0.2
0
1ms100Ps 100ms 1s
10ms 10s 100s
Energy Rating Curve
INTEGRATED CIRCUITS DIVISION
CPC1390
www.ixysic.com 5
R08
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1390G, CPC1390GV MSL 1
CPC1390GR MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1390GR, the solder
reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed.
For the through-hole devices, CPC1390G and CPC1390GV, and any other processes, the guidelines of J-STD-020
must be observed.
Device Maximum Body Temperature (Tc) Time
CPC1390GR 250ºC 15 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
6R08
CPC1390
MECHANICAL DIMENSIONS
PC Board Pattern (Top View)
Dimensions
mm
(inches)
PIN 1
6.350 ± 0.127
(0.250 ± 0.005)
4.572 ± 0.127
(0.180 ± 0.005)
0.991
(0.039)
9º (ALL)
3.30 ± 0.050
(0.130 ± 0.002)
0.254
(0.010)
9.144 ± 0.508
(0.360 ± 0.020)
7.620 ± 0.250
(0.300 ± 0.010)
7.620 ± 0.127
(0.300 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
9º (ALL)
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.127
(0.100 ± 0.005) 3.175
(0.125)
0.508
(0.020)
2.159
(0.085)
Dimensions
mm
(inches)
PC Board Pattern (Top View)
10.160 ± 0.127
(0.400 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
9º (ALL)
3.30 ± 0.050
(0.130 ± 0.002)
0.254
(0.010) 10.160 ± 0.508
(0.400 ± 0.020)
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.050
(0.250 ± 0.002)
4.572 ± 0.050
(0.180 ± 0.002)
0.991
(0.039)
9º (ALL)
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.050
(0.100 ± 0.002) 2.92
(0.115)
0.127
(0.005)
1.778
(0.070)
Pin 1
CPC1390G
CPC1390GV
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1390-R08
©Copyright 2016, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
1/7/2016
For additional information please visit our website at: www.ixysic.com
CPC1390
7
Dimensions
mm
(inches)
PCB Land Pattern
PIN #1
6.350 ± 0.127
(0.250 ± 0.005)
0.991
(0.039)
9.525
(0.375)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.254
(0.025 ± 0.010)
0.254
(0.010)
3.300 ± 0.050
(0.130 ± 0.002)
3.480 ± 0.076
(0.137 ± 0.003)
2.287
(0.09)
8.80
(0.346)
1.60
(0.063)
0.95
(0.037)
9º ± 1º
(ALL)
0.102 min / 0.254 max
(0.004 min / 0.010 max)
4.572 ± 0.127
(0.180 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
2.287 ± 0.127
(0.090 ± 0.005)
Dimensions
mm
(inches)
NOTES:
1. All dimensions meet EIA-481-C requirements
2. Unless otherwise noted, tolerances = ±0.10 (0.004)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max) K0=4.20
(0.165)
K1=3.70
(0.146)
W=16.00±0.30
(0.630±0.012)
A0=10.01
(0.394)
P=12.00
(0.472)
B0=5.00
(0.197)
CPC1390GR
CPC1390GRTR Tape & Reel
