502-1257 Engineering Report 16Feb09 Rev A Contact Retention Testing of Medical CPC Subassemblies 1. INTRODUCTION 1.1. Purpose Testing was perform ed on Tyco Electronics Medical Circular Plastic Connector (CPC) plug and receptacle subassem blies to determ ine the effects of soldering heat on contact retention. 1.2. Abstract Contact retention of specim ens in the "as received" condition were tested along with specim ens exposed to soldering heat for com parison. "As received" receptacle data was not available when this report was written. Test data was com piled from test num bers EA20080115T and EA20090067T, this docum entation is on file at and available from the Engineering Assurance Product Test Laboratory. 1.3. Conclusion W hen com paring m ean data, there was a statistically significant difference between "as received" plug specim ens and plug specim ens tested after exposure to soldering heat. Contact retention forces were higher after heat exposure. Since the retention m echanism geom etries and housing m aterials were the sam e between the plugs and the receptacles, it can be assum ed that sim ilar results could be expected for the receptacles. Statistically significant difference was calculated using a T-Test at 95% Confidence and 99% Reliability. 1.4. Test Specim ens Test specim ens were representative of norm al production lots. Specim ens identified with the following part num bers were used for test: Test Group Quantity Part Num ber 1 5 1811951-1 7 position plug insert assem bly with 26 AW G wire 2 5 1811952-1 6 position plug insert assem bly with 26 AW G wire 3 5 1811950-1 10 position plug insert assem bly with 28 AW G wire 4 5 1811953-1 5 position plug insert assem bly with 22 AW G wire 5 5 1811951-1 7 position plug insert assem bly 6 5 1811952-1 6 position plug insert assem bly 7 5 1811950-1 10 position plug insert assem bly 8 5 1811953-1 5 position plug insert assem bly 9 5 1877066-1 5 position receptacle assem bly 10 5 1877068-1 7 position receptacle assem bly 11 5 1877067-1 6 position receptacle assem bly 12 5 1877069-4 10 position receptacle assem bly Description Figure 1 (c)2009 Tyco Electronics Corporation Harrisburg, PA All International Rights Reserved * Trademark | Indicates change 1 of 3 LOC B 502-1257 1.5. Environm ental Conditions Unless otherwise specified, the following environm ental conditions prevailed during testing: ! ! 1.6. Tem perature: 22 to 24/C Relative Hum idity: 26 to 44% Test Sequence Test Group (a) Test or Exam ination 1 2 3 4 5 6 7 8 9 10 11 12 Test Sequence (b) Initial exam ination of product 1 1 1 1 Resistance to soldering heat 2 2 2 2 Contact retention 3 3 3 3 2 2 2 Final exam ination of product 4 4 4 4 3 3 3 NOTE (a) (b) 1 1 1 1 1 1 1 1 2 2 2 2 2 3 3 3 3 3 4 4 4 4 See paragraph 1.4. Numbers indicate sequence in which tests are performed. Figure 2 2. SUM M ARY OF TESTING 2.1. Initial Exam ination of Product - All Test Groups Specim ens were visually exam ined and no evidence of physical dam age detrim ental to product perform ance was observed. 2.2. Resistance to Soldering Heat - Test Groups 1, 2, 3, 4, 9, 10, 11 and 12 No evidence of physical dam age was visible as a result of exposure to soldering heat. 2.3. Contact Retention - All Test Groups Data sum m ary is shown in Figures 3 and 4. Statistically significant difference was calculated using a T-Test at 95% Confidence and 99% Reliability. Plugs Part Number Measurement (All values in pounds) 1811951-1 1811952-1 1811950-1 1811953-1 Test Group 1 5 2 6 3 7 4 8 Exposed As Received Exposed As Received Exposed As Received Exposed As Received Minimum 27.95 27.77 33.34 33.60 26.03 21.14 15.04 6.37 Maximum 39.34 41.73 41.17 37.70 43.05 39.88 29.22 17.33 Mean 36.71 35.98 37.58 35.70 35.00 32.12 21.26 12.26 Standard Deviation 2.06 2.26 1.78 1.20 3.33 2.90 3.95 3.41 30 30 30 30 40 40 25 25 N Statistically Significant Difference No Yes Yes Yes Figure 3 Rev A 2 of 3 502-1257 Receptacles Part Number Measurement (All values in pounds) 1877066-1 1877068-1 1877067-1 1877069-4 Test Group 9 10 11 12 Exposed Exposed Exposed Exposed Minimum 17.28 19.58 31.81 16.30 Maximum 34.77 64.05 43.89 38.42 Mean 26.59 44.83 36.89 26.45 Standard Deviation 5.08 8.61 3.16 7.38 25 30 30 30 N Figure 4 2.4 Final Exam ination of Product - All Test Groups Specim ens were visually exam ined and no evidence of physical dam age detrim ental to product perform ance (other than the typical destruction due to contact retention testing) was observed. 3. TEST M ETHODS 3.1. Initial Exam ination of Product Specim ens were visually exam ined for evidence of physical dam age detrim ental to product perform ance. 3.2. Contact Retention The force required to dislodge the contact was m easured using a tensile/com pression device with a free floating fixture. The force was applied to the solder tail end of the contacts at a rate of 12.7 m m per m inute until the contact dislodged. Testing was perform ed in accordance with EIA-364-29B. 3.3. Resistance to Soldering Heat A Type J therm ocouple was welded to the tip of the soldering iron to m onitor the tem perature during testing. In accordance with IEC 60512-12-5, a Size B iron tip was used and m aintained at 350/C. The gage wire specified in Figure 1 was soldered to the contact using rosin core Sn/Pb solder. Heat was applied to each contact for 10 seconds. Testing was perform ed in accordance with IEC 60512-12-5. 3.4. Final Exam ination of Product Specim ens were visually exam ined for evidence of physical dam age detrim ental to product perform ance. Rev A 3 of 3