aa wakefield-vette Footprint Mounting Thermal Performance at Typical Load Standard Dimensions Height Hole Dia. Natural Forced Weight P/N in. (mm) in. (mm) in. (mm) Convection Convection lbs. (grams) B01E 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) 0.200 (5.1) 52C @ 5.0W 4.5O/W @ 175 LAM 0.0500 (22.68) 6O01F 2.000 (50.8) 1.250 (31.8) 0.562 (14.3) 0.270 (6.9) 52C @5.0W 4.5C/W @ 175 LFM 0.0500 (22.68) 601K 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) None 52C @5.0W 4.5C/W @175 LFM 0.0500 (22:68) 603K 2.000 (50.8) x 2.000 (50.8) 0.562 (14.3) None 41C @5.0W 4.0C.W @ 175 LAM 0.0810 (36.74) MECHANICAL DIMENSIONS 601 SERIES 603 SERIES (EXTRUSION PROFILE 1284) ne Per NATURAL AND FORCED et. 5) (14.5) CONVECTION CHARACTERISTICS E AIR VELOCITY (LEK) | a 100 200 a0 a - Mey 1 ye St a Os 23 @ 5 ne 6 as f aa 2 fil E 50.8} 0812 Fw ; ao o.oa3 | | mate 29 3 2S (24) ' ra 2 #2 ao 1 Fx , 72 | sf a WW 20 a0 a0 yo 9 + POWER DISSIPATION (WATTS) ees pon a Dimensions: in. (mm) SEMICONDUCTOR MOUNTING HOLES : 0.500 (12.7) re ve DIATHAU DIA FREE 027 oarHau Sia FREE (5.1) OF ANODIZE (6-3) OF ANODIZE BOTH SIDES BOTH SIDES BLANK NO HOLES ed E4&F available on 601 Series only as a standard product.