VSMY2940RGX01, VSMY2940GX01
www.vishay.com Vishay Semiconductors
Rev. 1.0, 08-Nov-17 1Document Number: 84583
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
High Speed Infrared Emitting Diodes, 940 nm,
Surface Emitter Technology
DESCRIPTION
As part of the SurfLightTM portfolio, the VSMY2940 series
are infrared, 940 nm emitting diodes based on GaAlAs
surface emitter chip technology with extreme high radiant
intensities, high optical power and high speed, molded in
clear, untinted plastic packages (with lens) for surface
mounting (SMD).
APPLICATIONS
• Miniature light barrier
• Photointerrupters
• Optical switch
• Emitter source for proximity sensors
FEATURES
• Package type: surface-mount
• Package form: GW, RGW
• Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8
• Peak wavelength: λp = 940 nm
• AEC-Q101 qualified
• High radiant power
• Very high radiant intensity
• Angle of half intensity: ϕ = ± 10°
• Suitable for high pulse current operation
• Terminal configurations: gullwing or reverse
gullwing
• Package matches with detector VEMD2000X01 series
• Floor life: 4 weeks, MSL 2a, according to J-STD-020
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
• Test conditions see table “Basic Characteristics“
Note
• MOQ: minimum order quantity
VSMY2940RGX01 VSMY2940GX01
PRODUCT SUMMARY
COMPONENT Ie (mW/sr) ϕ (deg) λP (nm) tr (ns)
VSMY2940RGX01 145 ± 10 940 10
VSMY2940GX01 145 ± 10 940 10
ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM
VSMY2940RGX01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing
VSMY2940GX01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing
VSMY2940RGX01, VSMY2940GX01
www.vishay.com Vishay Semiconductors
Rev. 1.0, 08-Nov-17 2Document Number: 84583
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage VR5V
Forward current IF100 mA
Peak forward current tp/T = 0.5, tp = 100 μs IFM 200 mA
Surge forward current tp = 100 μs IFSM 1A
Power dissipation PV170 mW
Junction temperature Tj100 °C
Operating temperature range Tamb -40 to +85 °C
Storage temperature range Tstg -40 to +100 °C
Soldering temperature According to Fig. 10, J-STD-020 Tsd 260 °C
Thermal resistance junction-to-ambient J-STD-051, soldered on PCB RthJA 250 K/W
0
20
40
60
80
100
120
140
160
180
0 20406080100
PV-Power Dissipation (mW)
Tamb - Ambient Temperature (°C)
RthJA = 250 K/W
0
20
40
60
80
100
0 20406080100
IF- Forward Current (mA)
Tamb - Ambient Temperature (°C)
RthJA = 250 K/W
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Forward voltage IF = 100 mA, tp = 20 ms VF-1.41.8V
IF = 1 A, tp = 100 μs VF-2.5-V
Temperature coefficient of VFIF = 100 mA TKVF --0.7-mV/K
Reverse current IRNot designed for reverse operation μA
Junction capacitance VR = 0 V, f = 1 MHz, E = 0 mW/cm2CJ-55-pF
Radiant intensity IF = 100 mA, tp = 20 ms Ie75 145 215 mW/sr
IF = 1 A, tp = 100 μs Ie-1000-mW/sr
Radiant power IF = 100 mA, tp = 20 ms φe-55-mW
Temperature coefficient of radiant power IF = 100 mA TKφe- -0.2 - %/K
Angle of half intensity ϕ-± 10-deg
Peak wavelength IF = 100 mA λp920 940 960 nm
Spectral bandwidth IF = 100 mA Δλ -50-nm
Temperature coefficient of λpIF = 100 mA TKλp-0.25-nm/K
Rise time IF = 100 mA, 10 % to 90 % tr-10-ns
Fall time IF = 100 mA, 10 % to 90 % tf-10-ns
VSMY2940RGX01, VSMY2940GX01
www.vishay.com Vishay Semiconductors
Rev. 1.0, 08-Nov-17 3Document Number: 84583
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 3 - Forward Current vs. Forward Voltage
Fig. 4 - Relative Forward Voltage vs. Ambient Temperature
Fig. 5 - Relative Radiant Intensity vs. Forward Current
Fig. 6 - Relative Radiant Intensity vs. Ambient Temperature
Fig. 7 - Relative Radiant Intensity vs. Wavelength
Fig. 8 - Relative Radiant Intensity vs. Angular Displacement
1
10
100
1000
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6
IF- Forward Current (mA)
VF- Forward Voltage (V)
tp= 100 μs
90
95
100
105
110
-60 -40 -20 0 20 40 60 80 100
VF, rel - Relative Forward Voltage (%)
Tamb - Ambient Temperature (°C)
IF= 100 mA
tp= 20 ms
0.01
0.1
1
10
1101001000
Ie,rel - Relative Radiant Intensity
(Ie/I
e(100 mA))
IF- Forward Current (mA)
tp= 100 μs
85
90
95
100
105
110
115
-60 -40 -20 0 20 40 60 80 100
Ie, rel - Relative Radiant Intensity (%)
Tamb - Ambient Temperature (°C)
IF= 100 mA
tp= 20 ms
0
20
40
60
80
100
800 850 900 950 1000 1050
Ie, rel - Relative Radiant Intensity (%)
λ- Wavelength (nm)
IF= 100 mA
Ie, rel - Relative Radiant Intensity
0.6
80°
0°
0.7
0.4 0.2 0
30°
70°
60°
50°
40°
10° 20°
1.0
0.9
0.8
ϕ- Angular Displacement
VSMY2940RGX01, VSMY2940GX01
www.vishay.com Vishay Semiconductors
Rev. 1.0, 08-Nov-17 4Document Number: 84583
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SOLDER PROFILE
Fig. 9 - Lead (Pb)-free Reflow Solder Profile
According to J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, according to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
PACKAGE DIMENISONS in millimeters: VSMY2940RGX01
240 °C
Max. 260 °C
217 °C
255 °C
19841
10
100
1000
10000
0
100
200
300
0 50 100 150 200 300
Axis Title
1st line
2nd line
2nd line
Temperature (°C)
Time (s)
50
150
250
250
245 °C
Max. 100 s
Max. 30 s
Max. 120 s
Max. ramp down 6 °C/s
Max. ramp up 3 °C/s
0.4
0.19
Z
2.77 ± 0.2
1.6
0.05 ± 0.1
2.2
5.8 ± 0.2
2.2
0.3
Ø 1.8 ± 0.1
Drawing-No.: 6.544-5391.03-4
Issue: 2; 19.09.14
Not indicated tolerances ± 0.1
technical drawings
according to DIN
specications
1.1 ± 0.1
0.254
exposed copper Z 20:1
0.4
2.3 ± 0.2
0.5
2.3 ± 0.2
anode pin ID cathode
6.7
1.7
0.75
Ø 2.3 ± 0.1
solder pad proposal
acc. IPC 7351
VSMY2940RGX01, VSMY2940GX01
www.vishay.com Vishay Semiconductors
Rev. 1.0, 08-Nov-17 5Document Number: 84583
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters: VSMY2940GX01
Drawing-No.: 6.544-5383.03-4
Issue: 2; 19.09.14
Not indicated tolerances ± 0.1
technical drawings
according to DIN
specications
0.4
2.2
4.2 ± 0.2
0.05
1.6
2.77 ± 0.2
X
0.19
2.2
0.3
Ø 1.8
exposed copper
0.6
0.254
X 20:1
0.4
2.3 ± 0.2
0.5
2.3 ± 0.2
anode pin ID cathode
5.15
2.45
0.75
solder pad proposal
acc. IPC 7351
VSMY2940RGX01, VSMY2940GX01
www.vishay.com Vishay Semiconductors
Rev. 1.0, 08-Nov-17 6Document Number: 84583
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TAPING AND REEL DIMENSIONS in millimeters: VSMY2940RGX01
technical drawings
according to DIN
specications
Drawing-No.: 9.800-5100.01-4
Issue: 4; 19.09.14
Device
VSMY2940RG
VEMT2000
VEMT2500
VEMD2000
VEMD2500
VSMB2000
VSMG2000
VSMF2890RG
VSMY2850RG
Cathode Anode
Collector Emitter
Anode Cathode
Lead ILead II
Terminal position in tape
3.05 ± 0.1
II
I
Ø 1.55 ± 0.05
X 2:1
4 ± 0.1
4 ± 0.1
2 ± 0.05
1.75 ± 0.1
5.5 ± 0.05
12 ± 0.3
Leader and trailer tape
empty (160 mm min.) parts mounted
empty (400 mm min.)
direction of pulling out
Reel
12.4 ± 1.5
Ø 330 ± 1
Ø 62 ± 0.5
tape position
coming out from reel
6000 pcs/reel
X
unreel direction
label posted here
Ø 13 ± 0.5
2.5 ± 0.5
VSMY2940RGX01, VSMY2940GX01
www.vishay.com Vishay Semiconductors
Rev. 1.0, 08-Nov-17 7Document Number: 84583
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TAPING AND REEL DIMENSIONS in millimeters: VSMY2940GX01
technical drawings
according to DIN
specications
Drawing-No.: 9.800-5091.01-4
Issue: 5; 19.09.14
Device
VSMY2940G
VSMB2020
VSMG2020
VEMD2020
VEMD2520
VSMF2890G
VEMT2020
VEMT2520
VSMY2850G
Cathode Anode
Collector Emitter
Anode Cathode
Lead ILead II
Terminal position in tape
3.05 ± 0.1
II
I
Ø 1.55 ± 0.05
X 2:1
4 ± 0.1
4 ± 0.1
2 ± 0.05
1.75 ± 0.1
5.5 ± 0.05
12 ± 0.3
Leader and trailer tape
empty (160 mm min.) parts mounted
empty (400 mm min.)
direction of pulling out
Reel
12.4 ± 1.5
Ø 330 ± 1
Ø 62 ± 0.5
tape position
coming out from reel
6000 pcs/reel
X
unreel direction
label posted here
Ø 13 ± 0.5
2.5 ± 0.5
Legal Disclaimer Notice
www.vishay.com Vishay
Revision: 01-Jan-2021 1Document Number: 91000
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
© 2021 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
