Serial-in Parallel-out LED Driver 24ch Constant Current LED Driver IC with 2-line Serial Interface BD2808MUV-M General Description Key Specifications BD2808MUV-M is 24ch Constant current sink LED Driver with a high output voltage capability. This device is optimized for driving RGB LEDs featuring a 6bit Current DAC for each color. 8bit PWM control is integrated for each channel. Small VQFN48MCV070 package. . Input Voltage Range: Output Voltage Range: DC Output Current (per ch): Operating Temperature Range: 3.0V to 5.5V 20V (Max) 50mA (Max) -40C to +105C W (Typ) x D (Typ) x H (Max) 7.00mm x 7.00mm x 1.00mm Package VQFN48MCV070 Features AEC-Q100 Qualified (Note 1) 2-Line Serial Control + Enable Signal VQFN48 Package 24 channel constant current LED driver (max 50mA / channel) Independent PWM control for each channel 6 bit current DAC for RGB Protection features Equipped with PWM phase shift function to reduce EMI (Note1: Grade 2) VQFN48MCV070 Applications Instrument Cluster LED status indicators Instrument backlighting LED Interior illumination VLED (Max=20V ) Typical Application Circuit CVLED VCC SDI Microcomputer OUTR5 PGN D AGND OUTB4 CLK OUTG4 OUTR4 BD2808MUV OE Fuse OUTG5 TEST2 TEST3 RISET OUTB5 OUTR6 OUTG6 PGND OUTB6 OUTR7 OUTG7 PGND A5 OUTB7 A3 XERR A4 RXERR OUTB3 ISET OUTG3 AGND OUTR3 VCC PGN D OUTR2 OUTB1 OUTG1 OUTR1 PGND OUTB0 OUTG0 OUTG2 OUTR0 A0 PGND OUTB2 SDO TEST1 A2 CVCC A1 VCC 3.0~5.5V Figure 1. Typical Application Circuit Product structure: Silicon monolithic integrated circuit www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ROUTR07 ROUTG07 ROUTB07 This product has no designed protection against radioactive rays. 1/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Pin Configuration Pin Descriptions OUTB5 OUTR6 OUTG6 OUTB6 PGND OUTR7 OUTG7 OUTB7 PGND XERR A3 25 A4 36 37 24 A5 OUTG5 SDI OUTR5 Pin No. Pin Name 1 A1 Device-address bit Functions 2 A2 Device-address bit 3 SDO Serial data output 4 PGND Ground 5 OUTR0 R0 constant-current output G0 constant-current output TEST3 PGND 6 OUTG0 AGND OUTB4 7 OUTB0 B0 constant-current output CLK OUTG4 8 PGND Ground TEST2 OUTR4 9 OUTR1 R1 constant-current output OE OUTB3 10 OUTG1 G1 constant-current output OUTG3 11 OUTB1 B1 constant-current output 12 OUTR2 R2 constant-current output 13 OUTG2 G2 constant-current output 14 OUTB2 B2 constant-current output 15 PGND Ground ISET AGND OUTR3 VCC PGND TEST1 OUTB2 A0 OUTG2 16 OUTR3 R3 constant-current output 13 17 OUTG3 G3 constant-current output Figure 2. Pin Configuration www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 OUTR2 OUTB1 OUTG1 PGND OUTR1 OUTB0 OUTG0 OUTR0 SDO PGND 1 A2 A1 48 12 18 OUTB3 B3 constant-current output 19 OUTR4 R4 constant-current output 20 OUTG4 G4 constant-current output 21 OUTB4 B4 constant-current output 22 PGND Ground 23 OUTR5 R5 constant-current output 24 OUTG5 G5 constant-current output 25 OUTB5 B5 constant-current output 26 OUTR6 R6 constant-current output 27 OUTG6 G6 constant-current output 28 OUTB6 B6 constant-current output 29 PGND Ground 30 OUTR7 R7 constant-current output 31 OUTG7 G7 constant-current output 32 OUTB7 B7 constant-current output 33 PGND Ground 34 XERR 35 A3 Device-address bit 36 A4 Device-address bit 37 A5 Device-address MSB Error output 38 SDI 39 TEST3 40 AGND 41 CLK 42 TEST2 Test terminal 43 OE Output enable 44 ISET 45 AGND Serial data input Test terminal Analog Ground Serial data clock input Constant-current value setting Analog Ground 46 VCC Power supply 47 TEST1 Test terminal 48 A0 2/30 Device-address LSB TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Block Diagram VCC VCC OSC TSD 1F/10V VLED VREF OUTR0 OUTG0 CLK OUTB0 PWM 8bit-Log for each Channel SDI Digital Control SDO I/O OUTR1 OUTG1 6bit DAC OE OUTB1 A0 6bit DAC A1 A2 6bit DAC A3 OUTR6 A4 OUTG6 A5 OUTB6 OUTR7 OUTG7 XERR OUTB7 TEST1 ISET TEST2 PGND PGND PGND PGND PGND PGND ISET AGND AGND TEST3 Figure 3. Block Diagram www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Description of Blocks (1) Power Supply Start-up The rise and fall time of a power supply can be from 10us to 1s. Allow at least 0.1ms after VCC exceeds VUVLORise UVLO before commencing communication. Input pin voltages must not exceed VCC or LED flicker may occur at start-up. VCCmin=3.0V VCC TrVCC TACSS=min 0.1ms Register access TfVCC Possible Impossible Impossible (2) LED Driver operation Maximum LED current can be set by selecting the value of RISET. The following formula gives the required value of RISET. _ / (Typ) (3) Reset Power on reset occurs when VCC voltage falls below VUVLOFall. Software reset is by command. If reset occurs, all registers are cleared (set to 0) (4) Protection function (XERR output) When thermal shutdown, channel open, or ISET terminal short to ground are detected, the XERR terminal is pulled LOW. All protection functions incorporate noise rejection. The XERR terminal output is low only during detection. (Latch and intentional delay time are not provided.) These signals are also written into a register. The flag returns to "0" only when the register is read. The thermal shutdown operates at 175C typically with 10C of hysteresis, release therefore occurring at 165C typically. All the channels of are turned OFF automatically when thermal shut down operates. When the RISET is out of range RISETSHT, a short to ground function prevents large current from flowing into the LEDs. All channels of LED driver are turned OFF automatically. A Channel OPEN is detected when VLED < VLOD. The individual channel is turned OFF automatically and VLED becomes high impedance. OPEN detection is not active if Brightness is set to 0. The Error flag output pin (XERR pin) is in the same period with the OUT** pin and outputs a flag. The flag stored in register retains the state once detected and is not changed until register is read. VOUT* VXERR Register (LEDOPEN) It returns to "0" when the register is read. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Description of Blocks - Continued (5) LED Current ON/OFF Function by External Pin (OE terminal) All channels can be controlled by the external pin. If OE pin is HIGH, the LED drivers are active. The internal PWM control circuit becomes asynchronous. (6) Unused Pins Set up the test terminals and the unused terminals as follows. Pin Name Connection Reason Short to GND OUT** To avoid uncertain/unfixed state. (Brightness setting of unused channel should be set to zero.) SDO Open CMOS output terminal XERR Open or Short to GND Open drain output terminal. When XERR is shorted to GND, noise is avoided. OE Short to VCC Voltage clamp is necessary for CMOS input terminal. When OE is set to "LOW", LED current is OFF. TESTx Short to GND To avoid test mode functionality. (7) LED Current Waveform To reduce EMI, the on-timing and off-timing of LED are shifted in 8 groups and simultaneous ON or OFF are avoided. The rise tr and tf fall time of the output current is also limited to further reduce EMI noise. OUTR0 OUTG0 OUTB0 OUTR1 OUTG1 OUTB1 tr 1/8 x 4ms tf 1/8 x 4ms OUTR7 OUTG7 OUTB7 Figure 4. PWM phase-shift (8 groups) (8) Diming function (PWM and DAC diming) This IC has 2 diming functions which are PWM and DAC. It is possible to set independent PWM control for each channel. DAC diming is made 3 groups(R: Red, G: Green, B: Blue). There are these detail at page 18, 19. (9) Others(VREF and OSC) There are VREF and OSC block for reference voltage and moving digital block. (10) Test Processing Test 1-3 are pins that are used for testing. These pins are not used in normal operations, therefore connect it to ground. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Absolute Maximum Ratings Item Symbol Value Unit VCC -0.3 to +7 (Note 1) V VLEDmax -0.3 to +20 (Note 1) V VXERR -0.3 to VCC V Input Voltage (Pin No: 1-3, 35-38, 41, 43-44, 48) VIN -0.3 to VCC V Power Dissipation1 Pd1 4.09 (Note 2) W Power Dissipation2 Pd2 5.20 (Note 3) W Operating Temperature Range Topr -40 to +105 C Storage Temperature Range Tstg -55 to +150 C Junction Temperature Tjmax 150 C Drive Current (DC) IomaxD 50 mA Power Supply Voltage Output Voltage 1 (Pin No: Pin No: 5-7, 9-14, 16-21, 23-28, 30-32) Output Voltage 2 (Pin No: 34) (Note 1) Pd should not be exceeded. (Note 2) Pd1 is decreased by 32.7mW/C for temperatures above Ta=25C, mounted on 114.3mm x76.2mm x1.6mm Glass-epoxy PCB. (Note 3) Pd2 is decreased by 41.6mW/C for temperatures above Ta=25C, mounted on 114.3mm x76.2mm x1.6mm Glass-epoxy PCB. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=-40C to 105C) Item Symbol Min Typ Max Unit Power Supply Voltage VCC 3.0 3.3 5.5 V LED Maximum Output Current IMAX - - 50 mA Symbols Min Max Unit VCC Capacitor CVCC 1.0 - F VLED Capacitor CVLED 10 - F ISET Resistor RISET 50 200 k XERR Resistor RXERR 10 100 k Application Conditions (External Constant Range) Parameters www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Electrical Characteristics (Unless specified, Ta=-40 to 105C VCC=3.0 to 5.5V) Parameter Symbol Min Typ Max Unit Standby VCC Circuit Current ISTB - 0.4 20 A VCC Circuit Current IVCC 2.7 5.0 mA ILEDSTP 64 Condition Circuit Current RESET state (all registers have default values) LED terminal leak current is excluded All Ch=ON, PWM=100% ILED=17.9mA setting, ISET=56k (Note1) LED driver LED Current Step step Current DAC mA ISET=50k (Note2) LED Maximum Setup Current IMAX - 50 LED Current Accuracy ILED -5 0 +5 % Terminal voltage=1V, Current accuracy of each OUT terminal ILED=17.9mA setting, ISET=56k (Note1) LED Current Matching ILEDMT -5 0 +5 % An error with the average value of output current, Terminal voltage=1V ILED=17.9mA setting, ISET=56k (Note1) LED Current Matching between RGB terminal ILEDMT_RGB -5 0 +5 % Terminal voltage=1V ILED=17.9mA setting, ISET=56k (Note1) LED Current Matching between devices ILEDMT_DEV -5 0 +5 % Terminal voltage=1V ILED=17.9mA setting, ISET=56k (Note1) Line Regulation ILIN - - 2 %/V VCC from 3V to 5.5V Load Regulation IRO - - 1 %/V VOUT from 1V to 20V ILINPWM - - 1.5 % PWM Duty over 3% ILKL - - 3 A Terminal voltage =20V ISET Terminal Output Voltage VISET - 0.96 - V ISET Resistance RISET 50 - 200 k OSC Frequency fOSC 0.82 1.02 1.23 MHz PWM Frequency fPWM 200 250 300 Hz UVLO Detection Voltage VUVLOFall 2.0 2.4 - V When power supply voltage falls UVLO Release Voltage VUVLORise - - 2.7 V When power supply voltage rises Hysteresis Voltage VUVLOHYS 50 - - mV LED Terminal Open Detection Voltage VLOD - 0.2 0.3 V ISET Short Detection Resistance RISETSHT 5.0 20 40 k Current Linearity at PWM Control LED OFF Leak Current - OSC UVLO Protection Function (Note1) At DAC Setting R: ad03, data=18h, DAC Setting G: ad04, data=18h, DAC Setting B: ad05, data=18h (R=56k: IMAX=40*64/56k =45.7mA) (Note2) IMAX=40*64/50k =50mA www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Electrical Characteristics - continued (Unless specified, Ta=-40 to 105C VCC=3.0 to 5.5V) Parameter Symbol Min Typ Input L Level Voltage VILI1 -0.3 - Input H Level Voltage VIHI1 Max Unit Condition CLK, SDI Input Hysteresis Voltage VHYSI1 Input Current 0.75 x VCC 0.05 x VCC - 0.25 x VCC VCC +0.3 - - V V V lINI1 -1 - 1 A Input voltage= 3.3V Output L Level Voltage VOLSDO - - 0.2 V IOL=1mA Output H Level Voltage VOHSDO VCC -0.2 - - V IOH=1mA - - 0.2 V IOL=1mA -0.3 - SDO XERR (CMOS Output Pin) (Open Drain Output Pin) Output L Level Voltage A0-5, OE VOLXE (CMOS input pin) Input L Level Voltage VILI2 Input H Level Voltage VIHI2 Input Hysteresis Voltage Input Current VHYSI2 lINI2 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 0.75 x VCC 0.05 x VCC -1 - 0.25 x VCC VCC +0.3 - - V - 1 A 8/30 V V Input voltage= 3.3V TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M 3.0 3.0 2.5 2.5 2.0 VCC Circuit Current: IVCC [A] VCC Circuit Current: IVCC [A] Typical Performance Curves 105C 1.5 25C 1.0 0.5 2.0 5.5V 1.5 1.0 3.3V 0.5 -40C 3.0V 0.0 0.0 3.0 3.5 4.0 4.5 5.0 -40 5.5 Supply Voltage: VCC [V] 4.0 3.5 3.5 105C VCC Circuit Current: IVCC [mA] VCC Circuit Current: IVCC [mA] 35 60 85 110 Figure 6. Standby Current (Temperature characteristic) 4.0 3.0 -40C 10 Ambient Temperature: Ta [] Figure 5. Standby Current (VCC characteristic) 2.5 -15 25C 2.0 1.5 5.5V 3.0 2.5 3.0V 2.0 3.3V 1.5 1.0 1.0 3.0 3.5 4.0 4.5 5.0 -40 5.5 10 35 60 85 110 Ambient Temperature: Ta [] Supply Voltage: VCC [V] Figure 8. Circuit Current (Temperature characteristic @ ALL OUTn=ON PWM=100% ILED=17.9mA ISET=56k) Figure 7. Circuit Current (VCC characteristic @ All OUTn=ON PWM=100% ILED=17.9mA ISET=56k) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 -15 9/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Typical Performance Curves - continued 18.6 18.6 18.4 18.4 18.2 LED Current: ILED [mA] LED Current: ILED [mA] 5.5V 105C 18.2 18.0 -40C 17.8 25C 17.6 17.4 18.0 17.8 17.6 17.4 17.2 17.2 17.0 17.0 3.0 3.5 4.0 4.5 5.0 -40 5.5 -15 10 35 60 85 110 Ambient Temperature: Ta [] Supply Voltage: VCC [V] Figure 10. LED Current (Temperature characteristic @ ISET=56k) Figure 9. LED Current (VCC characteristic @ ISET=56k) 50 50 40 40 105C LED Current: ILED [mA] LED Current: ILED [mA] 3.3V 3.0V -40C 30 20 105C 30 -40 C 20 25C 10 10 25C 0 0 0 16 32 48 64 0 Code: ILEDSTP [step] 128 192 256 Code: ILEDSTP [step] Figure 12. LED Current PWM Step (VCC=3.3V) Figure 11. LED Current DAC Step (VCC=3.3V) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 64 10/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Typical Performance Curves - continued 1.2 300 3.3V 5.5V 280 PWM Frequency: fPWM [Hz] OSC Frequency: fOSC [MHz] 1.1 1.0 3.0V 0.9 0.8 0.7 5.5V 3.3V 260 240 220 3.0V 200 -40 -15 10 35 60 85 110 -40 Ambient Temperature: Ta [] 10 35 60 85 110 Ambient Temperature: Ta [] Figure 14. PWM Frequency (Temperature characteristic) Figure 13. Oscillation Frequency (Temperature characteristic) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 -15 11/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Bus Format Device Address A7 A6 A5 A4 A3 A2 A1 A0 Device control mode 0 1 A5 A4 A3 A2 A1 A0 Bus control mode 0 0 * * * * * * Device control mode: Data is dependent on the A0 to A5 terminal settings. Bus control mode: Data can be received without being dependent on A0 to A5 terminal settings. START Condition At STARTUP, the device enters WAIT mode when "1" is written 16 times or more, and a device address is recognized after writing "0". WRITE PROTOCOL Data is shifted in the internal shift register on the rising edge CLK. MSB is entered first. The command format is: writing command "00" (2bit), device address (6bit), register address (8bit) and data (8bit). Register address is incremented after the fourth byte automatically. Device enters Sleep state when "1" is written eight times. 1 0 X X X X X X X A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 1 "1"16 CLK Device Address(DAD) Register Address(RAD) D7 D6 D5 D4 D3 D2 D1 D0 1 1 1 1 1 1 1 1 Data Data SDI Sleep condition "FF" H L X X X X X X X A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 H D7 D6 D5 D4 D3 D2 D1 D0 "1"16 times "FF" READ PROTOCOL Read from the next byte after register address "WRITE data" for "READ data" and device address. READ data is output on the SDO pin. For a READ command 8 clocks cycles are necessary. At the 8th clock of last bit of the specified register address, it becomes Sleep state, and the SDO pin becomes "L" output. The last bit (D0) is outputted 7 clocks. 0 X X X X X X X A7 A6 A5 A4 A3 A2 A1 A0 D7 D7 D7 D7 D7 D7 D7 D7 D6 D6 D6 D6 D6 D6 D6 D6 Device Address(DAD) Register Address(RAD) Data SDO Data Data CLK SDI D0 D0 D0 D0 D0 D0 D0 A7 A6 A5 A4 A3 A2 A1 A0 L D7 D6 D5 8 clocks www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/30 D0 L 7 clocks TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Protocol Sleep Input "1" 16 times in a row "1"input Start standby "0" input Receive device address Different device address Input device address (1) Receive device address Input inexistent register address "FF" input Data 1) Condition becomes START standby in any condition, if "1" is detected more than 16 times. For example, Sleep condition starts if "1" is received 8 times while waiting for register address. Moreover, the condition becomes START standby after receiving "1" 8 times. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Timing Diagram tSP SDI t sh t ss CLK t whc t wlc tSP tdodl SDO Timing Characteristics (Ta=-40 to 105 C VCC=3.0 to 5.5V) Standard value Item Symbol Unit Min Typ Max Interface CLK cycle time tscyc 100 - - ns CLK cycle "H" period twhc 50 - - ns CLK cycle "L" period twlc 50 - - ns SDI setup time tss 45 - - ns SDI hold time tsh 45 - - ns Pulse width of spike removed by input filter of CLK and SDI tSP 5 - - ns Tdodl - - 500 ns SDO Output Delay (CL = 1,000pF) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Register Map Register Address Write Or Read D7 D6 D5 D4 D3 D2 D1 D0 00h R - - A5 A4 A3 A2 A1 A0 01h R - - - - - ISETSH - 02h W - - - - SFTRST ENMD MD1 MD0 Mode setup 03h W - - DAR5 DAR4 DAR3 DAR2 DAR1 DAR0 DAC setting for OUTRx terminal 04h W - - DAG5 DAG4 DAG3 DAG2 DAG1 DAG0 DAC setting for OUTGx terminal 05h W - - DAB5 DAB4 DAB3 DAB2 DAB1 DAB0 DAC setting for OUTBx terminal 06h W BRR0(7) BRR0(6) BRR0(4) BRR0(3) BRR0(2) BRR0(1) BRR0(0) OUTR0 PWM Setting 07h W BRG0(7) BRG0(6) BRG0(5) BRG0(4) BRG0(3) BRG0(2) BRG0(1) BRG0(0) OUTG0 PWM Setting 08h W BRB0(7) BRB0(6) BRB0(5) BRB0(4) BRB0(3) BRB0(0) OUTB0 PWM Setting 09h W BRR1(7) BRR1(6) BRR1(5) BRR1(4) BRR1(3) BRR1(2) BRR1(1) BRR1(0) OUTR1 PWM Setting 0Ah W BRG1(7) BRG1(6) BRG1(5) BRG1(4) BRG1(3) BRG1(2) BRG1(1) BRG1(0) OUTG1 PWM Setting 0Bh W BRB1(7) BRB1(6) BRB1(5) BRB1(4) BRB1(3) BRB1(0) OUTB1 PWM Setting 0Ch W BRR2(7) BRR2(6) BRR2(5) BRR2(4) BRR2(3) BRR2(2) BRR2(1) BRR2(0) OUTR2 PWM Setting 0Dh W BRG2(7) BRG2(6) BRG2(5) BRG2(4) BRG2(3) BRG2(2) BRG2(1) BRG2(0) OUTG2 PWM Setting 0Eh W BRB2(7) BRB2(6) BRB2(5) BRB2(4) BRB2(3) BRB2(0) OUTB2 PWM Setting 0Fh W BRR3(7) BRR3(6) BRR3(5) BRR3(4) BRR3(3) BRR3(2) BRR3(1) BRR3(0) OUTR3 PWM Setting 10h W BRG3(7) BRG3(6) BRG3(5) BRG3(4) BRG3(3) BRG3(2) BRG3(1) BRG3(0) OUTG3 PWM Setting 11h W BRB3(7) BRB3(6) BRB3(5) BRB3(4) BRB3(3) BRB3(0) OUTB3 PWM Setting 12h W BRR4(7) BRR4(6) BRR4(5) BRR4(4) BRR4(3) BRR4(2) BRR4(1) BRR4(0) OUTR4 PWM Setting 13h W BRG4(7) BRG4(6) BRG4(5) BRG4(4) BRG4(3) BRG4(2) BRG4(1) BRG4(0) OUTG4 PWM Setting 14h W BRB4(7) BRB4(6) BRB4(5) BRB4(4) BRB4(3) BRB4(0) OUTB4 PWM Setting 15h W BRR5(7) BRR5(6) BRR5(5) BRR5(4) BRR5(3) BRR5(2) BRR5(1) BRR5(0) OUTR5 PWM Setting 16h W BRG5(7) BRG5(6) BRG5(5) BRG5(4) BRG5(3) BRG5(2) BRG5(1) BRG5(0) OUTG5 PWM Setting 17h W BRB5(7) BRB5(6) BRB5(5) BRB5(4) BRB5(3) BRB5(0) OUTB5 PWM Setting 18h W BRR6(7) BRR6(6) BRR6(5) BRR6(4) BRR6(3) BRR6(2) BRR6(1) BRR6(0) OUTR6 PWM Setting 19h W BRG6(7) BRG6(6) BRG6(5) BRG6(4) BRG6(3) BRG6(2) BRG6(1) BRG6(0) OUTG6 PWM Setting 1Ah W BRB6(7) BRB6(6) BRB6(5) BRB6(4) BRB6(3) BRB6(0) OUTB6 PWM Setting 1Bh W BRR7(7) BRR7(6) BRR7(5) BRR7(4) BRR7(3) BRR7(2) BRR7(1) BRR7(0) OUTR7 PWM Setting 1Ch W BRG7(7) BRG7(6) BRG7(5) BRG7(4) BRG7(3) BRG7(2) BRG7(1) BRG7(0) OUTG7 PWM Setting 1Dh W BRB7(7) BRB7(6) OUTB7 PWM Setting 1Eh W Register data - BRR0(5) BRB7(5) - - BRB7(4) BRB7(3) - - BRB0(2) BRB1(2) BRB2(2) BRB3(2) BRB4(2) BRB5(2) BRB6(2) BRB0(1) BRB1(1) BRB2(1) BRB3(1) BRB4(1) BRB5(1) BRB6(1) Function Device address LEDOPN Error condition detection BRB7(2) BRB7(1) BRB7(0) - - EN Brightness reflection (latch) Assume that the input of "-"is "0". An undefined address may be assigned for test purposes. Access to undefined register is prohibited. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Register Description Register address 00h < Read Device address> Address (Index) R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 00h R - - A5 A4 A3 A2 A1 A0 Initial value (Arbitrary) 0 0 0 0 0 0 0 0 Bit [5: 0]: Device address (Read only) Device address set by external terminal (A0 - A5) is returned. Register address 01h <Read Error condition detection> Address (Index) R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 01h R - - - - - ISETSH - LEDOPN Initial Value (Arbitrary) 0 0 0 0 0 0 0 0 Bit 2: ISETSH ISET terminal short detection "0": Normal operation "1": ISET terminal GND short-circuit is detected Bit 0: LEDOPN LED open detect "0": Normal operation "1": Detect LED open on any channel (At LED is ON, detect LED terminal < 0.2V (Typ)) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Register address 02h <Write Mode setup> Address R/W Bit7 Bit6 (Index) Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 02h W - - - - SFTRST ENMD MD1 MD0 Initial value 00h 0 0 0 0 0 0 0 0 Bit 3: SFTRST Soft reset "0": Release reset "1": Reset (Auto return zero) Sleep condition starts after soft reset. Bit 2: ENMD Enable mode "0": Brightness register is latched on edge of EN "1": Ignore EN (brightness register is updated immediately) Bit [1: 0]: MD(1: 0) Mode setup "00": Increment mode0 "01": Increment mode1 "10": Increment mode2 Sleep after register address 1Eh. Example) 1Ch1Dh1EhSleep Return to 03h after register address 1Eh. (Round) Example) 1Ch1Dh1Eh03h04h Return to 06h after register address 1Eh. (Round) Example) 1Ch1Dh1Eh06h07h "11": Prohibited command www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 17/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Register address 03h-05h Address R/W (Index) < Write RGB DAC setup> Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 03h W - - DACR5 DACR4 DACR3 DACR2 DACR1 DACR0 04h W - - DACG5 DACG4 DACG3 DACG2 DACG1 DACG0 05h W - - DACB5 DACB4 DACB3 DACB2 DACB1 DACB0 Initial value 00h 0 0 0 0 0 0 0 0 DAC (R, G, B) deserve for changing OUT (R, G, B) current. Bit [5: 0]: RGB DAC setup "000000": Maximum LED current x 1/64 "000001": Maximum LED current x 2/64 "000010": Maximum LED current x 3/64 "000011": Maximum LED current x 4/64 "000100": Maximum LED current x 5/64 "000101": Maximum LED current x 6/64 "000110": Maximum LED current x 7/64 (Maximum LED current x 1/64 step) "111000": Maximum LED current x 57/64 "111001": Maximum LED current x 58/64 "111010": Maximum LED current x 59/64 "111011": Maximum LED current x 60/64 "111100": Maximum LED current x 61/64 "111101": Maximum LED current x 62/64 "111110": Maximum LED current x 63/64 "111111": Maximum LED current x 64/64 Maximum LED current : ILED_max [mA] www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 = 40 x 64 / RISET [k] 18/30 (Typ) TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Register address 06h-1Dh <Write OUT** brightness setup> Address (Index) R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 06h - 1Dh W BR**(7) BR**(6) BR**(5) BR**(4) BR**(3) BR**(2) BR**(1) BR**(0) Initial value 00h 0 0 0 0 0 0 0 0 Bit [7: 0]: OUT** brightness setup "00000000" : PWM Duty 0/512 LED driver OFF setting (OUT terminal open detect function OFF) "00000001" : PWM Duty 1/512 1/512 step setting "00000010" : PWM Duty 2/512 1/512 step setting "00000011" : PWM Duty 3/512 1/512 step setting (1/512 step) "01111101" : PWM Duty 125/512 1/512 step setting "01111110" : PWM Duty 126/512 1/512 step setting "01111111" : PWM Duty 128/512 2/512 step setting "10000000" : PWM Duty 130/512 2/512 step setting (2/512 step) "10111100" : PWM Duty 250/512 2/512 step setting "10111101" : PWM Duty 252/512 2/512 step setting "10111110" : PWM Duty 256/512 4/512 step setting "10111111" : PWM Duty 260/512 4/512 step setting "11000000" : PWM Duty 264/512 4/512 step setting (4/512 step) "11111101" : PWM Duty 508/512 4/512 step setting "11111110" : PWM Duty 512/512 DC setting It is possible to control PWM brightness by individual channels. [Duty] 100.00% 90.00% 80.00% 70.00% 60.00% 50.00% 40.00% 30.00% 20.00% 10.00% 0.00% 0 50 100 150 200 250 Figure 15. Register setup www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 19/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Register address 1Eh <Write Enable> Address (Index) R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 1Eh W - - - - - - - EN Initial value 00h 0 0 0 0 0 0 0 0 Bit 0: EN enable control "0": No reflect "1": Reflect into output data of 03h to 1Dh (Auto return zero) However, this bit is ignored at ENMD=1. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 20/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Timing Diagram Vcc > 3. Vcc < 3.0V Vcc > 2. Vcc < 2.4V Vcc > 1. Vcc < 1.65V Vcc 10s to 1s POR 10s to 1s 0.1ms 0.1ms CLK/SDA REF B12RST UVLO ILED GATE Hi_Z Hi_Z Normal Operation Power ON Release UVLO Release Figure 16. Timing Diagram The Power supply Rise and Fall time should be in the range of 10s to 1s. Digital communication can only start 0.1ms after VCC exceeds 3V. Always set the register voltage lower than VCC voltage. Otherwise, when it is driven with more than the VCC, LED may flicker at the start. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 21/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Application Example VLED (Max=20V ) CVLED13 Vcc TEST3 PGND AGND OUTB4 CLK OUTG4 TEST2 Fuse OUTR4 BD2808MUV OE RISET OUTG5 OUTR5 SDI Microcomputer OUTB5 OUTR6 OUTG6 OUTB6 PGND OUTR7 OUTG7 A5 OUTB7 PGND XERR A3 A4 RXERR OUTB3 ISET OUTG3 AGND OUTR3 PGND VCC OUTR2 OUTB1 OUTG1 OUTR1 PGND OUTB0 OUTG0 OUTG2 OUTR0 A0 PGND OUTB2 SDO TEST1 A2 CVCC A1 Vcc 3.0~5.5V ROUTR0-7 ROUTG0-7 ROUTB0-7 Figure 17. Application Circuit diagram No. Component Name Component Value 1 CVCC 1F 2 RISET 3 Product Name Company GCM188R71C105KA49 Murata 56k MCR03 Series Rohm RXERR 10k MCR03 Series Rohm 4 CVLED1 4.7F GCM31CR71E475KA40 Murata 5 CVLED2 4.7F GCM31CR71E475KA40 Murata 6 CVLED3 4.7F GCM31CR71E475KA40 Murata 7 ROUTR0-7/ROUTG0-7 /ROUTB0-7 - ESR25 Series Rohm www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 22/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M OUT pin and selection of external resistor (a) Loss on OUT pin The LED current is controlled by the driver. However to limit the power dissipation of the IC an external resistor can be used. This resistor limits the Vout seen by the IC, to reduce the power dissipation of the IC. VLED The power dissipation of each channel is given by: LED Vf IC Iout R VBAT OUT There are 24 channels and W of total must be less than the power dissipation limit Pd of the IC. Then, the following expression holds true. M1 Vout V1 / PGND For correct operation the following expression must be satisfied Figure 18. OUT terminal Output Circuit Diagram From and , Vout voltage must meet the following ranges / ( if all 24 channels are active) When is not satisfied, a resistor is required between OUT pin and LED of the IC to reduce the power dissipation of the IC by dropping the voltage seen by OUT pin. Figure 19. OUT terminal Limit Voltage www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 23/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M (b) OUT pin and GND short When OUT pin is shorted to GND, high current may flow VLED to GND through the LED. It is recommended to insert a resistor in the path so that current can be restricted, similar to that of Figure 20. (c) Constant resistance of OUT pin and setting of LED voltage Set the value of R by this formula: / If there is a maximum current, Imax, then the resistor value must meet the following equation: / / Power Dissipation 6.0 (2) Pd=5.20W POWERDISSIPATION:Pd[W] 5.0 (1) Pd=4.09W 4.0 3.0 2.0 1.0 0.0 0 25 50 75 100 125 150 AMBIENTTEMPERATURE:Ta[] Figure 20. VQFN48MCV070 Power Dissipation Note 1: Power dissipation is calculated when mounted on 114.3mm X 76.2mm X 1.6mm glass epoxy substrate. Note 2: Connect the back exposure cooling body of package and board. Board(1): 2 Layer Board (Back Copper foil 74.2mm x 74.2mm) ja = 30.5 C/W Pd = 2.13W (Ta=85C) Board(2): 4 Layer Board (2,3 Cu Layer, Back Copper foil 74.2mm x 74.2mm) ja = 24.0 C/W Pd = 2.71W (Ta=85C) Power dissipation changes with copper foil density of the board. This value represents only observed values, not guaranteed values. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 24/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M I/O Equivalence Circuits Pin4,8,15,22,29,33 (PGND), Pin40,45(AGND) Pin46(VCC) VCC Pin1(A1),Pin2(A2),Pin35(A3), Pin36(A4),Pin37(A5),Pin38(SDI) Pin43(OE),Pin41(CLK),Pin48(A0) VCC VCC Pin3(SDO) Pin44(ISET) VCC Pin34(XERR) VCC VCC VCC Pin5,9,12,16,19,23,26,30 (OUTR[0:7]), Pin6,10,13,17,20,24,27,31(OUTG[0:7]), Pin7,11,14,18,21,25,28,32 (OUTB[0:7]) ( ) - Pin Name www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 25/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 26/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Operational Notes - continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Parasitic Elements N P+ GND N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B Parasitic Elements GND GND N Region close-by GND Figure 21. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 27/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Ordering Information B D 2 8 0 8 M U V - Package MUV : VQFN48MCV070 Part Number M E 2 Packaging and forming specification M: High reliability E2: Embossed tape and reel Marking Diagram VQFN48MCV070 (TOP VIEW) Part Number Marking BD2808 LOT Number 1PIN MARK www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 28/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 VQFN48MCV070 29/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet BD2808MUV-M Revision History Date Revision Changes 2014.12.12 001 New Release 2015.06.04 002 Page11 Delete Figure 13, 14 Page23 Add Figure 19 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 30/30 TSZ02201-0T3T0C500040-1-2 4.Jun.2015 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bd2808muv-m - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bd2808muv-m VQFN48MCV070 1500 1500 Taping inquiry Yes