○Product structure: Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.
1/30 TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
www.rohm.com
4.Jun.2015 Rev.002
Serial-in Parallel-out LED Driver
24ch Constant Current LED Driver IC
with 2-line Serial Interface
BD2808MUV-M
General Description
BD2808MUV-M is 24ch Constant current sink LED Driver
with a high output voltage capability.
This device is optimized for driving RGB LEDs featuring a
6bit Current DAC for each color.
8bit PWM control is integrated for each channel.
Small VQFN48MCV070 package.
.
Features
AEC-Q100 Qualified
(Note 1)
2-Line Serial Control + Enable Signal
VQFN48 Package
24 channel constant current LED driver (max
50mA / channel)
Independent PWM control for each channel
6 bit current DAC for RGB
Protection features
Equipped with PWM phase shift function to reduce
EMI
(Note1: Grade 2)
Applications
Instrument Cluster
LED status indicators
Instrument backlighting
LED Interior illumination
Key Specifications
Input Voltage Range: 3.0V to 5.5V
Output Voltage Range: 20V (Max)
DC Output Current (per ch): 50mA (Max)
Operating Temperature Range: -40°C to +105°C
Package W (Typ) x D (Typ) x H (Max)
VQFN48MCV070 7.00mm x 7.00mm x 1.00mm
Typical Application Circuit
Figure 1. Typical Application Circuit
VQFN48MCV070
BD2808MUV
Micro-
computer
OUTG5
OUTR6
OUTB5
OUTB6
A4
A3
OUTB7
VCC
3.0~5.5V
VLED
(Max=20V )
VCC
XERR
OUTG6
PGND
PGND
OUTR7
OUTG7
OUTR5
PGN D
OUTB4
OUTG4
OUTR4
OUTB3
OUTG3
OUTR3
PGN D
OUTB2
OUTG2
OUTR2
OUTB1
OUTG1
OUTR1
PGND
OUTB0
OUTG0
OUTR0
PGND
SDO
A2
A1
A5
SDI
TEST2
AGND
CLK
TEST3
OE
ISET
AGND
VCC
TEST1
A0
CVCC
RISET
RXERR
CVLED
ROUTR0～7
ROUTG0～7
ROUTB0～7
Fuse
2/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Pin Configuration Pin Descriptions
Figure 2. Pin Configuration
Pin No. Pin Name Functions
1 A1 Device-address bit
2 A2 Device-address bit
3 SDO Serial data output
4 PGND Ground
5 OUTR0 R0 constant-current output
6 OUTG0 G0 constant-current output
7 OUTB0 B0 constant-current output
8 PGND Ground
9 OUTR1 R1 constant-current output
10 OUTG1 G1 constant-current output
11 OUTB1 B1 constant-current output
12 OUTR2 R2 constant-current output
13 OUTG2 G2 constant-current output
14 OUTB2 B2 constant-current output
15 PGND Ground
16 OUTR3 R3 constant-current output
17 OUTG3 G3 constant-current output
18 OUTB3 B3 constant-current output
19 OUTR4 R4 constant-current output
20 OUTG4 G4 constant-current output
21 OUTB4 B4 constant-current output
22 PGND Ground
23 OUTR5 R5 constant-current output
24 OUTG5 G5 constant-current output
25 OUTB5 B5 constant-current output
26 OUTR6 R6 constant-current output
27 OUTG6 G6 constant-current output
28 OUTB6 B6 constant-current output
29 PGND Ground
30 OUTR7 R7 constant-current output
31 OUTG7 G7 constant-current output
32 OUTB7 B7 constant-current output
33 PGND Ground
34 XERR Error output
35 A3 Device-address bit
36 A4 Device-address bit
37 A5 Device-address MSB
38 SDI Serial data input
39 TEST3 Test terminal
40 AGND Analog Ground
41 CLK Serial data clock input
42 TEST2 Test terminal
43 OE Output enable
44 ISET Constant-current value setting
45 AGND Analog Ground
46 VCC Power supply
47 TEST1 Test terminal
48 A0 Device-address LSB
A4
A3
XERR
PGND
OUTB7
OUTG7
OUTR7
PGND
OUTB6
OUTG6
OUTR6
OUTB5
A5 OUTG5
SDI OUTR5
TEST3 PGND
AGND OUTB4
CLK OUTG4
TEST2 OUTR4
OE OUTB3
ISET OUTG3
AGND OUTR3
VCC PGND
TEST1 OUTB2
A0 OUTG2
A1
A2
SDO
PGND
OUTR0
OUTG0
OUTB0
PGND
OUTR1
OUTG1
OUTB1
OUTR2
37
48
112
13
24
2536
3/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
VCC
TSD
Digital
Control
1µF/10V
V
CC
SDO
VREF
A
GND
OE
VLED
ISET
PGND
A0
A1
A2
A3
A4
・
・
・
・
OUTR0
OUTG0
OUTB0
OUTR1
OUTG1
OUTB1
OUTR6
OUTG6
OUTB6
OUTR7
OUTG7
OUTB7
6bit
DAC
6bit
DAC
6bit
DAC
PWM 8bit-Log
for each Channel
PGND
PGND
XERR
A
GND
OSC
PGND
CL
K
SDI
I/O
A5
ISET
PGND
PGND
TEST1
TEST2
TEST3
Block Diagram
Figure 3. Block Diagram
4/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Description of Blocks
(1) Power Supply Start-up
The rise and fall time of a power supply can be from 10us to 1s.
Allow at least 0.1ms after VCC exceeds VUVLORise UVLO before commencing communication.
Input pin voltages must not exceed VCC or LED flicker may occur at start-up.
(2) LED Driver operation
Maximum LED current can be set by selecting the value of RISET.
The following formula gives the required value of RISET.
_󰇟󰇠  /󰇟󰇠 (Typ)
(3) Reset
Power on reset occurs when VCC voltage falls below VUVLOFall.
Software reset is by command. If reset occurs, all registers are cleared (set to 0)
(4) Protection function (XERR output)
When thermal shutdown, channel open, or ISET terminal short to ground are detected, the XERR terminal is pulled LOW.
All protection functions incorporate noise rejection. The XERR terminal output is low only during detection. (Latch and
intentional delay time are not provided.) These signals are also written into a register. The flag returns to “0” only when
the register is read.
The thermal shutdown operates at 175°C typically with 10°C of hysteresis, release therefore occurring at 165°C
typically. All the channels of are turned OFF automatically when thermal shut down operates.
When the RISET is out of range RISETSHT, a short to ground function prevents large current from flowing into the LEDs.
All channels of LED driver are turned OFF automatically.
A Channel OPEN is detected when VLED < VLOD.
The individual channel is turned OFF automatically and VLED becomes high impedance.
OPEN detection is not active if Brightness is set to 0.
The Error flag output pin (XERR pin) is in the same period with the OUT** pin and outputs a flag.
The flag stored in register retains the state once detected and is not changed until register is read.
V
OUT*
V
XERR
Register
(LEDOPEN)
It returns to "0" when the register is read.
VCC
Impossible
Register
access Possible Impossible
Tr
VCC
Tf
VCC
T
ACSS
=min 0.1ms
VCC
min
=3.0V
5/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Description of Blocks – Continued
(5) LED Current ON/OFF Function by External Pin (OE terminal)
All channels can be controlled by the external pin. If OE pin is HIGH, the LED drivers are active.
The internal PWM control circuit becomes asynchronous.
(6) Unused Pins
Set up the test terminals and the unused terminals as follows.
Pin Name Connection Reason
OUT** Short to GND
To avoid uncertain/unfixed state.
(Brightness setting of unused channel should be set
to zero.)
SDO Open CMOS output terminal
XERR Open or
Short to GND
Open drain output terminal.
When XERR is shorted to GND, noise is avoided.
OE Short to VCC Voltage clamp is necessary for CMOS input terminal.
When OE is set to “LOW”, LED current is OFF.
TESTx Short to GND To avoid test mode functionality.
(7) LED Current Waveform
To reduce EMI, the on-timing and off-timing of LED are shifted in 8 groups and simultaneous ON or OFF are avoided.
The rise tr and tf fall time of the output current is also limited to further reduce EMI noise.
tr
OUTR0
OUTG0
OUTB0
tf
OUTR1
OUTG1
OUTB1
OUTR7
OUTG7
OUTB7
1/8 × 4ms 1/8 × 4ms
Figure 4. PWM phase-shift (8 groups)
(8) Diming function (PWM and DAC diming)
This IC has 2 diming functions which are PWM and DAC.
It is possible to set independent PWM control for each channel.
DAC diming is made 3 groups(R: Red, G: Green, B: Blue).
There are these detail at page 18, 19.
(9) Others(VREF and OSC)
There are VREF and OSC block for reference voltage and moving digital block.
(10) Test Processing
Test 1-3 are pins that are used for testing.
These pins are not used in normal operations, therefore connect it to ground.
6/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Absolute Maximum Ratings
Item Symbol Value Unit
Power Supply Voltage VCC -0.3 to +7 (Note 1) V
Output Voltage 1 (Pin No: Pin No: 5-7, 9-14, 16-21, 23-28, 30-32) VLEDmax -0.3 to +20 (Note 1) V
Output Voltage 2 (Pin No: 34) VXERR -0.3 to VCC V
Input Voltage (Pin No: 1-3, 35-38, 41, 43-44, 48) VIN -0.3 to VCC V
Power Dissipation1 Pd1 4.09 (Note 2) W
Power Dissipation2 Pd2 5.20 (Note 3) W
Operating Temperature Range Topr -40 to +105 °C
Storage Temperature Range Tstg -55 to +150 °C
Junction Temperature Tjmax 150 °C
Drive Current (DC) IomaxD 50 mA
(Note 1) Pd should not be exceeded.
(Note 2) Pd1 is decreased by 32.7mW/°C for temperatures above Ta=25°C, mounted on 114.3mm x76.2mm x1.6mm Glass-epoxy PCB.
(Note 3) Pd2 is decreased by 41.6mW/°C for temperatures above Ta=25°C, mounted on 114.3mm x76.2mm x1.6mm Glass-epoxy PCB.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta=-40°C to 105°C)
Item Symbol Min Typ Max Unit
Power Supply Voltage VCC 3.0 3.3 5.5 V
LED Maximum Output Current IMAX - - 50 mA
Application Conditions (External Constant Range)
Parameters Symbols Min Max Unit
VCC Capacitor CVCC 1.0 - µF
VLED Capacitor CVLED 10 - µF
ISET Resistor RISET 50 200 kΩ
XERR Resistor RXERR 10 100 k
7/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Electrical Characteristics
(Unless specified, Ta=-40 to 105°C VCC=3.0 to 5.5V)
Parameter Symbol Min Typ Max Unit Condition
【Circuit Current】
Standby VCC Circuit
Current ISTB - 0.4 20 µA
RESET state (all registers have default
values)
LED terminal leak current is excluded
VCC Circuit Current IVCC 2.7 5.0 mA
All Ch=ON, PWM=100%
ILED=17.9mA setting, ISET=56k (Note1)
【LED driver】
LED Current Step ILEDSTP 64 step Current DAC
LED Maximum Setup
Current IMAX - 50
-
mA ISET=50k (Note2)
LED Current Accuracy ILED -5 0 +5 %
Terminal voltage=1V, Current accuracy of
each OUT terminal
ILED=17.9mA setting, ISET=56k (Note1)
LED Current Matching ILEDMT -5 0 +5 %
An error with the average value of output
current,
Terminal voltage=1V
ILED=17.9mA setting, ISET=56k (Note1)
LED Current Matching
between RGB terminal ILEDMT_RGB -5 0 +5 %
Terminal voltage=1V
ILED=17.9mA setting, ISET=56k (Note1)
LED Current Matching
between devices ILEDMT_DEV -5 0 +5 %
Terminal voltage=1V
ILED=17.9mA setting, ISET=56k (Note1)
Line Regulation ILIN - - 2 %/V
VCC from 3V to 5.5V
Load Regulation IRO - - 1 %/V
VOUT from 1V to 20V
Current Linearity at PWM
Control ILINPWM - - 1.5 %
PWM Duty over 3%
LED OFF Leak Current ILKL - - 3 A Terminal voltage =20V
ISET Terminal Output
Voltage VISET - 0.96 - V
ISET Resistance RISET 50 - 200 k
【OSC】
OSC Frequency fOSC 0.82 1.02 1.23 MHz
PWM Frequency fPWM 200 250 300 Hz
【UVLO】
UVLO Detection Voltage VUVLOFall 2.0 2.4 - V
When power supply voltage falls
UVLO Release Voltage VUVLORise - - 2.7 V
When power supply voltage rises
Hysteresis Voltage VUVLOHYS 50 - - mV
【Protection Function】
LED Terminal Open
Detection Voltage VLOD - 0.2 0.3 V
ISET Short Detection
Resistance RISETSHT 5.0 20 40 k
(Note1) At DAC Setting R: ad03, data=18h, DAC Setting G: ad04, data=18h, DAC Setting B: ad05, data=18h
(R=56k: IMAX=40*64/56k =45.7mA)
(Note2) IMAX=40*64/50k =50mA
8/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Electrical Characteristics - co ntinued
(Unless specified, Ta=-40 to 105°C VCC=3.0 to 5.5V)
Parameter Symbol Min Typ Max Unit Condition
【CLK, SDI】
Input L Level Voltage VILI1 -0.3 -
0.25 ×
VCC V
Input H Level Voltage VIHI1 0.75 ×
VCC - VCC
+0.3 V
Input Hysteresis Voltage VHYSI1 0.05 ×
VCC - - V
Input Current lINI1 -1 - 1 A Input voltage= 3.3V
【SDO】 (CMOS Output Pin)
Output L Level Voltage VOLSDO - - 0.2 V IOL=1mA
Output H Level Voltage VOHSDO VCC
-0.2 - - V IOH=1mA
【XERR】 (Open Drain Output Pin)
Output L Level Voltage VOLXE - -
0.2 V IOL=1mA
【A0-5, OE】 (CMOS input pin)
Input L Level Voltage VILI2 -0.3 -
0.25 ×
VCC V
Input H Level Voltage VIHI2 0.75 ×
VCC - VCC
+0.3 V
Input Hysteresis Voltage VHYSI2 0.05 ×
VCC - - V
Input Current lINI2 -1 - 1 A Input voltage= 3.3V
9/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Typical Performance Curves
5.5V
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-40 -15 10 35 60 85 110
VCC Circuit Current: IVCC [mA]
Ambient Temperature: Ta [℃]
1.0
1.5
2.0
2.5
3.0
3.5
4.0
3.0 3.5 4.0 4.5 5.0 5.5
VCC Circuit Current: IVCC [mA]
Supply Voltage: VCC [V]
Figure 5. Standby Current
(VCC characteristic)
Figure 6. Standby Current
(Temperature characteristic)
Figure 7. Circuit Current
(VCC characteristic @ All OUTn=ON
PWM=100% ILED=17.9mA ISET=56kΩ)
Figure 8. Circuit Current
(Temperature characteristic @ ALL OUTn=ON
PWM=100% ILED=17.9mA ISET=56k)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.0 3.5 4.0 4.5 5.0 5.5
VCC Circuit Current: IVCC [A]
Supply Voltage: VCC [V]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-40 -15 10 35 60 85 110
VCC Circuit Current: IVCC [A]
Ambient Temperature: Ta [℃]
5.5V
-40°C 25°C
105°C
105°C
25°C
-40°C
3.0V
3.3V
3.3V
3.0V
10/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Typical Performance Curves – continued
0
10
20
30
40
50
064128192256
LED Current: ILED [mA]
Code: ILEDSTP [step]
17.0
17.2
17.4
17.6
17.8
18.0
18.2
18.4
18.6
3.0 3.5 4.0 4.5 5.0 5.5
LED Current: ILED [mA]
Supply Voltage: VCC [V]
Figure 9. LED Current
(VCC characteristic @ ISET=56k)
17.0
17.2
17.4
17.6
17.8
18.0
18.2
18.4
18.6
-40 -15 10 35 60 85 110
LED Current: ILED [mA]
Ambient Temperature: Ta [℃]
Figure 10. LED Current
(Temperature characteristic @ ISET=56k)
3.3V
3.0V
5.5V
0
10
20
30
40
50
0 16324864
LED Current: ILED [mA]
Code: ILEDSTP [step]
-40°C
25°C
105°C
Figure 11. LED Current DAC Step
(VCC=3.3V)
105°C
Figure 12. LED Current PWM Step
(VCC=3.3V)
-40° C
25°C
25°C
-40°C
105°C
11/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Typical Performance Curves – continued
200
220
240
260
280
300
-40 -15 10 35 60 85 110
PWM Frequency: fPWM [Hz]
Ambient Temperature: Ta [℃]
0.7
0.8
0.9
1.0
1.1
1.2
-40 -15 10 35 60 85 110
OSC Frequency: fOSC [MHz]
Ambient Temperature: Ta [℃]
Figure 14. PWM Frequency
(Temperature characteristic)
3.0V
Figure 13. Oscillation Frequency
(Temperature characteristic)
5.5V
3.3V
5.5V
3.3V
3.0V
12/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Bus Format
Device Address
A7 A6 A5 A4 A3 A2 A1 A0
Device control mode 0 1 A5 A4 A3 A2 A1 A0
Bus control mode 0 0 * * * * * *
Device control mode: Data is dependent on the A0 to A5 terminal settings.
Bus control mode: Data can be received without being dependent on A0 to A5 terminal settings.
START Condition
At STARTUP, the device enters WAIT mode when “1” is written 16 times or more, and a device address is recognized
after writing “0”.
WRITE PROTOCOL
Data is shifted in the internal shift register on the rising edge CLK. MSB is entered first. The command format is: writing
command “00” (2bit), device address (6bit), register address (8bit) and data (8bit).
Register address is incremented after the fourth byte automatically.
Device enters Sleep state when “1” is written eight times.
READ PROTOCOL
Read from the next byte after register address “WRITE data” for “READ data” and device address.
READ data is output on the SDO pin. For a READ command 8 clocks cycles are necessary. At the 8
th
clock of last bit of
the specified register address, it becomes Sleep state, and the SDO pin becomes “L” output.
The last bit (D0) is outputted 7 clocks.
A6 A5 A4 A3 A2 A1 A0
L
SDO
SDI
CLK
D7
A7
D6 D5 ・・ D0 L
・・
0
Device Address(DAD)
X
X
X
X
X
X
X
Data
D7 D7 D7 D7 D7 D7 D7 D7
Register Address(RAD)
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
Data
D0
D0
D0
D0
D0 D0 D0D6 D6 D6 D6 D6 D6 D6 D6
Data
XX X X X X X
SDI
CLK ・・
A6 A5 A4 A3 A2 A1 A0
A7 D6 D5 D4 D3 D2 D1 D0
D7
・・
H L
“1”≧16 times
D6 D5 D4 D3 D2 D1 D0
D7 H
・・
“FF”
0
Register Address(RAD) Device Address(DAD) Data
D7 D6 D5 D4D3 D2 D1 D0
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
X X X X X X X
1 1
“1”≧16 回 Data
D7 D6 D5 D4D3 D2 D1 D0
“FF”
1 1 1 1 1 1 1 1
Sleep condition
8 clocks 7 clocks
13/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Protocol
Sleep
Start standby
Receive device
address
Receive device
address
Data
Input “1” 16 times in a row
“1”input
“0” input
Input device address
“FF” input
Input inexistent
register address
Different device address
※1) Condition becomes START standby in any condition, if “1” is detected more
than 16 times. For example, Sleep condition starts if “1” is received 8 times while
waiting for register address. Moreover, the condition becomes START standby
after receiving “1” 8 times.
(※1)
14/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Timing Diagram
CLK
SDI
t
ss
t
sh
t
wlc
t
whc
t
SP
t
SP
SDO
t
dodl
Timing Char acteristics (Ta=-40 to 105 °C VCC=3.0 to 5.5V)
Item Symbol
Standard value
Unit
Min Typ Max
【Interface】
CLK cycle time tscyc 100 - - ns
CLK cycle “H” period twhc 50 - - ns
CLK cycle “L” period twlc 50 - - ns
SDI setup time tss 45 - - ns
SDI hold time tsh 45 - - ns
Pulse width of spike removed by input filter
of CLK and SDI tSP 5 - - ns
SDO Output Delay (CL = 1,000pF) Tdodl - - 500 ns
15/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Register Map
Register
Address
Write
Or
Read
Register data
Function
D7 D6 D5 D4 D3 D2 D1 D0
00h R - - A5 A4 A3 A2 A1 A0
Device address
01h R - - - - - ISETSH - LEDOPN Error condition detection
02h W - - - - SFTRST ENMD MD1 MD0 Mode setup
03h W - - DAR5 DAR4 DAR3 DAR2 DAR1 DAR0 DAC setting for OUTRx terminal
04h W - - DAG5 DAG4 DAG3 DAG2 DAG1 DAG0 DAC setting for OUTGx terminal
05h W - - DAB5 DAB4 DAB3 DAB2 DAB1 DAB0 DAC setting for OUTBx terminal
06h W BRR0(7) BRR0(6) BRR0(5) BRR0(4) BRR0(3) BRR0(2) BRR0(1) BRR0(0) OUTR0 PWM Setting
07h W BRG0(7) BRG0(6) BRG0(5) BRG0(4) BRG0(3) BRG0(2) BRG0(1) BRG0(0) OUTG0 PWM Setting
08h W BRB0(7) BRB0(6) BRB0(5) BRB0(4) BRB0(3) BRB0(2) BRB0(1) BRB0(0) OUTB0 PWM Setting
09h W BRR1(7) BRR1(6) BRR1(5) BRR1(4) BRR1(3) BRR1(2) BRR1(1) BRR1(0) OUTR1 PWM Setting
0Ah W BRG1(7) BRG1(6) BRG1(5) BRG1(4) BRG1(3) BRG1(2) BRG1(1) BRG1(0) OUTG1 PWM Setting
0Bh W BRB1(7) BRB1(6) BRB1(5) BRB1(4) BRB1(3) BRB1(2) BRB1(1) BRB1(0) OUTB1 PWM Setting
0Ch W BRR2(7) BRR2(6) BRR2(5) BRR2(4) BRR2(3) BRR2(2) BRR2(1) BRR2(0) OUTR2 PWM Setting
0Dh W BRG2(7) BRG2(6) BRG2(5) BRG2(4) BRG2(3) BRG2(2) BRG2(1) BRG2(0) OUTG2 PWM Setting
0Eh W BRB2(7) BRB2(6) BRB2(5) BRB2(4) BRB2(3) BRB2(2) BRB2(1) BRB2(0) OUTB2 PWM Setting
0Fh W BRR3(7) BRR3(6) BRR3(5) BRR3(4) BRR3(3) BRR3(2) BRR3(1) BRR3(0) OUTR3 PWM Setting
10h W BRG3(7) BRG3(6) BRG3(5) BRG3(4) BRG3(3) BRG3(2) BRG3(1) BRG3(0) OUTG3 PWM Setting
11h W BRB3(7) BRB3(6) BRB3(5) BRB3(4) BRB3(3) BRB3(2) BRB3(1) BRB3(0) OUTB3 PWM Setting
12h W BRR4(7) BRR4(6) BRR4(5) BRR4(4) BRR4(3) BRR4(2) BRR4(1) BRR4(0) OUTR4 PWM Setting
13h W BRG4(7) BRG4(6) BRG4(5) BRG4(4) BRG4(3) BRG4(2) BRG4(1) BRG4(0) OUTG4 PWM Setting
14h W BRB4(7) BRB4(6) BRB4(5) BRB4(4) BRB4(3) BRB4(2) BRB4(1) BRB4(0) OUTB4 PWM Setting
15h W BRR5(7) BRR5(6) BRR5(5) BRR5(4) BRR5(3) BRR5(2) BRR5(1) BRR5(0) OUTR5 PWM Setting
16h W BRG5(7) BRG5(6) BRG5(5) BRG5(4) BRG5(3) BRG5(2) BRG5(1) BRG5(0) OUTG5 PWM Setting
17h W BRB5(7) BRB5(6) BRB5(5) BRB5(4) BRB5(3) BRB5(2) BRB5(1) BRB5(0) OUTB5 PWM Setting
18h W BRR6(7) BRR6(6) BRR6(5) BRR6(4) BRR6(3) BRR6(2) BRR6(1) BRR6(0) OUTR6 PWM Setting
19h W BRG6(7) BRG6(6) BRG6(5) BRG6(4) BRG6(3) BRG6(2) BRG6(1) BRG6(0) OUTG6 PWM Setting
1Ah W BRB6(7) BRB6(6) BRB6(5) BRB6(4) BRB6(3) BRB6(2) BRB6(1) BRB6(0) OUTB6 PWM Setting
1Bh W BRR7(7) BRR7(6) BRR7(5) BRR7(4) BRR7(3) BRR7(2) BRR7(1) BRR7(0) OUTR7 PWM Setting
1Ch W BRG7(7) BRG7(6) BRG7(5) BRG7(4) BRG7(3) BRG7(2) BRG7(1) BRG7(0) OUTG7 PWM Setting
1Dh W BRB7(7) BRB7(6) BRB7(5) BRB7(4) BRB7(3) BRB7(2) BRB7(1) BRB7(0) OUTB7 PWM Setting
1Eh W - - - - - - - EN Brightness reflection (latch)
Assume that the input of “-“is “0”.
An undefined address may be assigned for test purposes. Access to undefined register is prohibited.
16/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Register Description
Register address 00h < Read De vice address>
Address
(Index) R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
00h R - - A5 A4 A3 A2 A1 A0
Initial
value (Arbitrary) 0 0 0 0 0 0 0 0
Bit [5: 0]: Device address (Read only)
Device address set by external terminal (A0 – A5) is returned.
Register address 01h <Read Error condition detection>
Address
(Index) R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
01h R - - - - - ISETSH -
LEDOPN
Initial
Value (Arbitrary) 0 0 0 0 0 0 0 0
Bit 2: ISETSH ISET terminal short detection
“0”: Normal operation
“1”: ISET terminal GND short-circuit is detected
Bit 0: LEDOPN LED open detect
“0”: Normal operation
“1”: Detect LED open on any channel
(At LED is ON, detect LED terminal < 0.2V (Typ))
17/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Register address 0 2h <Write Mode setup>
Address
(Index) R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
02h W - - - - SFTRST ENMD MD1
MD0
Initial
value 00h 0 0 0 0 0 0 0 0
Bit 3: SFTRST Soft reset
“0”: Release reset
“1”: Reset (Auto return zero)
Sleep condition starts after soft reset.
Bit 2: ENMD Enable mode
“0”: Brightness register is latched on edge of EN
“1”: Ignore EN (brightness register is updated immediately)
Bit [1: 0]: MD(1: 0) Mode setup
“00”: Increment mode0 Sleep after register address 1Eh.
Example) 1Ch→1Dh→1Eh→Sleep
“01”: Increment mode1 Return to 03h after register address 1Eh. (Round)
Example) 1Ch→1Dh→1Eh→03h→04h→･･･
“10”: Increment mode2 Return to 06h after register address 1Eh. (Round)
Example) 1Ch→1Dh→1Eh→06h→07h→･･･
“11”: Prohibited command
18/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Register address 0 3h - 05h < Write RGB DAC setup>
Address
(Index) R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
03h W - - DACR5 DACR4 DACR3 DACR2 DACR1 DACR0
04h W - - DACG5 DACG4 DACG3 DACG2 DACG1 DACG0
05h W - - DACB5 DACB4 DACB3 DACB2 DACB1 DACB0
Initial
value 00h 0 0 0 0 0 0 0 0
DAC (R, G, B) deserve for changing OUT (R, G, B) current.
Bit [5: 0]: RGB DAC setup
“000000”: Maximum LED current × 1/64
“000001”: Maximum LED current × 2/64
“000010”: Maximum LED current × 3/64
“000011”: Maximum LED current × 4/64
“000100”: Maximum LED current × 5/64
“000101”: Maximum LED current × 6/64
“000110”: Maximum LED current × 7/64
・ ・
・ ・ (Maximum LED current × 1/64 step)
・ ・
“111000”: Maximum LED current × 57/64
“111001”: Maximum LED current × 58/64
“111010”: Maximum LED current × 59/64
“111011”: Maximum LED current × 60/64
“111100”: Maximum LED current × 61/64
“111101”: Maximum LED current × 62/64
“111110”: Maximum LED current × 63/64
“111111”: Maximum LED current × 64/64
Maximum LED current : ILED_max [mA] = 40 x 64 / RISET [k] (Typ)
19/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Register address 0 6h - 1Dh <Write OUT** brightness setup>
Address
(Index) R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
06h –
1Dh W BR**(7) BR**(6) BR**(5) BR**(4) BR**(3) BR**(2) BR**(1) BR**(0)
Initial
value 00h 0 0 0 0 0 0 0 0
Bit [7: 0]: OUT** brightness setup
“00000000” : PWM Duty 0/512 LED driver OFF setting (OUT terminal open detect function OFF)
“00000001” : PWM Duty 1/512 1/512 step setting
“00000010” : PWM Duty 2/512 1/512 step setting
“00000011” : PWM Duty 3/512 1/512 step setting
・ ・
・ ・ (1/512 step)
・ ・
“01111101” : PWM Duty 125/512 1/512 step setting
“01111110” : PWM Duty 126/512 1/512 step setting
“01111111” : PWM Duty 128/512 2/512 step setting
“10000000” : PWM Duty 130/512 2/512 step setting
・ ・
・ ・ (2/512 step)
・ ・
“10111100” : PWM Duty 250/512 2/512 step setting
“10111101” : PWM Duty 252/512 2/512 step setting
“10111110” : PWM Duty 256/512 4/512 step setting
“10111111” : PWM Duty 260/512 4/512 step setting
“11000000” : PWM Duty 264/512 4/512 step setting
・ ・
・ ・ (4/512 step)
・ ・
“11111101” : PWM Duty 508/512 4/512 step setting
“11111110” : PWM Duty 512/512 DC setting
It is possible to control PWM brightness by individual channels.
0.00%
10.00%
20.00%
30.00%
40.00%
50.00%
60.00%
70.00%
80.00%
90.00%
100.00%
0 50 100 150 200 250
[Duty]
Figure 15. Register setup
20/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Register address 1Eh <Write Enable>
Address
(Index) R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
1Eh W - - - - - - -
EN
Initial
value 00h 0 0 0 0 0 0 0 0
Bit 0: EN enable control
“0”: No reflect
“1”: Reflect into output data of 03h to 1Dh (Auto return zero)
However, this bit is ignored at ENMD=1.
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Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Timing Diagram
Vcc
Vcc > 3.
0.1ms
10µ s t o 1s
Vcc > 2.
Vcc > 1 .
Hi_Z
Vcc < 1.65V
Hi_Z
Power ON Release
POR
CLK/SDA
Vcc < 2.4V
Vcc < 3.0V
Hi_Z Hi_Z
UVLO Release Normal O perat ion
0.1ms
REF
B12RST
UVLO
ILED
GATE
10µs t o 1s
Figure 16. Timing Diagram
The Power supply Rise and Fall time should be in the range of 10s to 1s.
Digital communication can only start 0.1ms after VCC exceeds 3V.
Always set the register voltage lower than VCC voltage.
Otherwise, when it is driven with more than the VCC, LED may flicker at the start.
22/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Application Example
No. Component
Name
Component
Value
Product
Name Company
1 CVCC 1F GCM188R71C105KA49 Murata
2 RISET 56k MCR03 Series Rohm
3 RXERR 10k MCR03 Series Rohm
4 CVLED1 4.7F GCM31CR71E475KA40 Murata
5 CVLED2 4.7F GCM31CR71E475KA40 Murata
6 CVLED3 4.7F GCM31CR71E475KA40 Murata
7 ROUTR0-7/ROUTG0-7
/ROUTB0-7 - ESR25 Series Rohm
Figure 17. Application Circuit diagram
BD2808MUV
Micro-
computer
OUTG5
OUTR6
OUTB5
OUTB6
A4
A3
OUTB7
Vcc
3.0~5.5V
VLED
(Max=20V )
Vcc
XERR
OUTG6
PGND
PGND
OUTR7
OUTG7
OUTR5
PGN D
OUTB4
OUTG4
OUTR4
OUTB3
OUTG3
OUTR3
PGN D
OUTB2
OUTG2
OUTR2
OUTB1
OUTG1
OUTR1
PGND
OUTB0
OUTG0
OUTR0
PGND
SDO
A2
A1
A5
SDI
TEST3
AGND
CLK
TEST2
OE
ISET
AGND
VCC
TEST1
A0
CVCC
RISET
RXERR
CVLED1～3
Fuse
ROUTR0-7
ROUTG0-7
ROUTB0-7
23/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
OUT pin and selection of external resistor
(a) Loss on OUT pin
The LED current is controlled by the driver.
However to limit the power dissipation of the IC an external resistor can be used. This resistor limits the Vout seen by the
IC, to reduce the power dissipation of the IC.
The power dissipation of each channel is given by:
󰇛 󰇜
 
There are 24 channels and W of total must be less than the
power dissipation limit Pd of the IC. Then, the following
expression holds true.
 
 /󰇛 󰇜・・・①
For correct operation the following expression must be
satisfied
 ・・・②
From
①
and
②
, Vout voltage must meet the following
ranges
  /󰇛 󰇜
・・・③
( if all 24 channels are active)
When
③
is not satisfied, a resistor is required between
OUT pin and LED of the IC to reduce the power dissipation
of the IC by dropping the voltage seen by OUT pin.
Figure 19. OUT terminal Limit Voltage
Vf
VBAT
OUT
PGND
VLED
V1
M1
LED
IC Iout
Vout
R
Figure 18. OUT terminal Output Circuit Diagram
24/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
(b) OUT pin and GND short
When OUT pin is shorted to GND, high current may flow VLED to GND through the LED.
It is recommended to insert a resistor in the path so that current can be restricted, similar to that of Figure 20.
(c) Constant resistance of OUT pin and setting of LED voltage
Set the value of R by this formula:
󰇛  󰇜/
If there is a maximum current, Imax, then the resistor value must meet the following equation:
  / 󰇛  󰇜/
Power Dissipation
Figure 20. VQFN48MCV070 Power Dissipation
Note 1: Power dissipation is calculated when mounted on 114.3mm X 76.2mm X 1.6mm glass epoxy substrate.
Note 2: Connect the back exposure cooling body of package and board.
Board(1): 2 Layer Board (Back Copper foil 74.2mm × 74.2mm) ja = 30.5 °C/W Pd = 2.13W (Ta=85°C)
Board(2): 4 Layer Board (2,3 Cu Layer, Back Copper foil 74.2mm × 74.2mm) ja = 24.0 °C/W Pd = 2.71W (Ta=85°C)
Power dissipation changes with copper foil density of the board. This value represents only observed values, not guaranteed values.
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0 25 50 75 100 125 150
POWERDISSIPATION:Pd[W]
AMBIENTTEMPERATURE:Ta[℃]
(2) Pd=5.20W
(1) Pd=4.09W
25/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
I/O Equivalence Circuits
Pin46(VCC) Pin4,8,15,22,29,33 (PGND),
Pin40,45(AGND) Pin44(ISET)
Pin1(A1),Pin2(A2),Pin35(A3),
Pin36(A4),Pin37(A5),Pin38(SDI)
Pin43(OE),Pin41(CLK),Pin48(A0)
Pin3(SDO) Pin34(XERR)
Pin5,9,12,16,19,23,26,30 (OUTR[0:7]),
Pin6,10,13,17,20,24,27,31(OUTG[0:7]),
Pin7,11,14,18,21,25,28,32 (OUTB[0:7])
( ) – Pin Name
VCC VCC
VCC VCC VCC VCC VCC
26/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current
may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more
than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring,
width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 21. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
NN
P+P
NN
P+
P Substrate
GND
NP+
NN
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
BC
E
Parasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
28/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Ordering Information
B D 2 8 0 8 M U V - M E 2
Part Number
Package
MUV : VQFN48MCV070
Packaging and forming specification
M: High reliability
E2: Embossed tape and reel
Marking Diagram
V
QFN48MCV070
(
TOP VIEW
)
BD2808
Part Number Marking
1PIN MARK
LOT Number
29/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Physical Dimension, Tape and Reel Information
Package Name VQFN48MCV070
30/30
Datasheet
Datasheet
BD2808MUV-M
TSZ02201-0T3T0C500040-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 4.Jun.2015 Rev.002
www.rohm.com
TSZ22111・15・001
Revision History
Date Revision Changes
2014.12.12 001 New Release
2015.06.04 002 Page11 Delete Figure 13, 14
Page23 Add Figure 19
Datasheet
Notice-PAA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred b y you or third parti es arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expens es or losses arising from the
use of any ROHM’s Products under an y special or extraordinary envir onments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product perfor mance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Pro ducts.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Po wer Dissipation (P d) depe nding on Ambient temperature (T a). When us ed in sealed area, confirm the actual
ambient temperature.
8. Confirm that o peration temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or lia ble for failure induced under deviant condi tion from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Notice-PAA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificati on and judgme nt in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any d amag es, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H 2S, NH3, SO2, and NO2
[b] the temperature or humidit y exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Pro ducts within the specified time after opening a humidity barrier ba g. Baking is required before using Products of
which storage time is exceeding the recommended storage time perio d.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly us ing an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Datasheet
Part Number bd2808muv-m
Package VQFN48MCV070
Unit Quantity 1500
Minimum Package Quantity 1500
Packing Type Taping
Constitution Materials List inquiry
RoHS Yes
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