This is information on a product in full production.
September 2015 DocID024678 Rev 2 1/10
10
BAL-CW1250D3
50 Ω nominal input / conjugate match balun to
CW1250/CW1260/CW1150/CW1160, with integrated harmonic filter
Datasheet − production data
Features
•50 Ω nominal input / match ST-Ericsson RF IC
CW1250, CW1150, CW1260, CW1160
•Low insertion loss
•Low amplitude imbalance
•Low phase imbalance
•DC blocking access on single RF input
•Small footprint: < 1.2 mm2
Benefits
•Extremely low profile (< 550 µm after reflow)
•Integrate matching network
•High RF performance
•RF components count and area reduction
Applications
•Balun with integrated matching for ST-Ericsson
RF IC CW1250, C1150, CW1260
Description
STMicroelectronics BAL-CW1250D3 is a balun
(balanced/unbalanced device) designed to
transform a single ended signal to differential
signals in WLAN application.
This BAL-CW1250D3, with low insertion losses in
the bandwidth 2400 MHz to 2500 MHz, has been
customized for CW1250, CW1150, CW1260,
CW1160 transceiver. The differential output
embeds an integrated matching network adapted
to the transceiver.
The BAL-CW1250D3 has been designed using
STMicroelectronics IPD (integrated passive
device) technology on non-conductive glass
substrate to optimize RF performance.
Figure 1. Pinout diagram (top view)
Lead-free Flip-Chip package
5 bumps
A
B
C
321
SEGND
VCC
DIFFDIFF
www.st.com
Characteristics BAL-CW1250D3
2/10 DocID024678 Rev 2
1 Characteristics
Table 1. Absolute maxim um rating s (limiting values)
Symbol Parameter Value Unit
Min Typ Max
PIN Average power RFIN 24 dBm
VESD
ESD ratings MIL STD883C
(HBM: C = 100 pF, R = 1.5 kΩ, air discharge) 2000
V
ESD ratings charged device model
(JESD22-C101-D) 500
ESD ratings machine model
(MM: C = 200 pF, R = 25 Ω, L = 500 nH) 200
TOP Operating temperature -30 to +85 °C
Table 2. I m pedanc es (Tamb = 25 °C)
Symbol Parameter Value Unit
Min Typ Max
ZOUT Nominal differential output impedance matched Ω
ZIN Nominal input impedance 50 Ω
Table 3. RF pe rform ance (Tamb = 25 °C)
Symbol Parameter Value Unit
Min Typ Max
F Frequency range (bandwidth) 2400 2500 MHz
IL Insertion loss in bandwidth 0.97 dB
RL SE Single ended return loss in bandwidth -21 dB
RL DIFF Differential return loss in bandwidth -24 dB
φimb Phase imbalance -10 10 °
Aimb Amplitude imbalance -1 0.1 1 dB
Att2f0 2nd harmonic attenuation -19 dB
DocID024678 Rev 2 3/10
BAL-CW1250D3 Characteristics
1.1 Measurements
Figure 2. Insertion loss Figur e 3. Single indeed retu rn loss
S21 (dB)
F (GHz)
-0.90
-0.92
-0.94
-0.96
-0.98
-1.0
2.40 2.44 2.47 2.49 2.50
2.41 2.42 2.43 2.45 2.46 2.48
F (GHz)
-30
2.40 2.44 2.47 2.49 2.50
2.41 2.42 2.43 2.45 2.46 2.48
S11 (dB)
-20
-22
-24
-26
-28
Figure 4. Differential return loss Figure 5. Amplitude imbalance
F (GHz)
-34
-40
2.40 2.44 2.47 2.49 2.50
2.41 2.42 2.43 2.45 2.46 2.48
S22 (dB)
-24
-26
-28
-30
-36
-32
-38
F (GHz)
-0.32
-0.29
2.40 2.44 2.47 2.49 2.50
2.41 2.42 2.43 2.45 2.46 2.48
Absolute Aimb (dB)
-0.37
-0.36
-0.35
-0.34
-0.31
-0.33
-0.30
Figure 6. Phase imbalance Fi gure 7. Secon d harmo nic attenu ation
F (GHz)
2.52
2.46
2.40 2.44 2.47 2.49 2.50
2.41 2.42 2.43 2.45 2.46 2.48
Absolute PHimb (deg)
2.62
2.60
2.58
2.56
2.50
2.54
2.48
S21 (dB)
F (GHz)
-18.5
-19.0
-19.5
-20.0
-20.5
-21.0
2.40 2.44 2.47 2.49 2.50
2.41 2.42 2.43 2.45 2.46 2.48
Pack age informa tion BAL-CW 1250D3
4/10 DocID024678 Rev 2
2 Package information
•Epoxy meets UL94, V0
•Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1 Flip-Chip package information
Figu re 8. Fl ip -C hi p pack a ge outli ne
Table 4. Flip-Chip package mech anical data
Parameter Description Min. Typ. Max. Unit
A Bump height + substrate thickness 0.570 0.630 0.690 mm
A1 Bump height 0.155 0.205 0.255 mm
A2 Substrate thickness 0.400 mm
b Bump diameter 0.215 0.255 0.295 mm
D Y dimension of the die 1.150 1.200 1.250 mm
D1 Y pitch 0.760 mm
E X dimension of the die 0.940 0.990 1.040 mm
E1 X pitch 0.400 mm
fD Distance from bump to edge of die on Y axis 0.105 mm
ccc 0.05 mm
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DocID024678 Rev 2 5/10
BAL-CW1250D3 Package informati on
Figure 9. Footprint
Fi gur e 10. Fo ot pr i nt - 3 mil s st encil - non solder
ma sk defined Figure 11. Footprint - 3 mils stencil - solder
mask defined
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ma sk defined Figu re 13. Foo tprint - 5 mils stencil - solder
mask defined
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Pack age informa tion BAL-CW 1250D3
6/10 DocID024678 Rev 2
Figure 14. Recomm end ed land pattern (used for balun characte rization )
Figure 15. Marking
DocID024678 Rev 2 7/10
BAL-CW1250D3 Package informati on
Figure 16. Flip-Chip ta pe and reel specification s
Note: More information is available in the STMicroelectronics Application note:
AN2348 Flip-Chip: “Package desc ription and recommendations for use”
Dot identifying Pin A1 location
User direction of unreeling
All dimensions are typical values in mm
4.0
4.0
2.0
8.0
1.75
3.5
Ø 1.50
0.71± 0.05
1.09 ± 0.05
0.22
1.30 ± 0.05
ST ST ST
xxz xxz xxz
yww yww yww
Application information BAL-CW1250D3
8/10 DocID024678 Rev 2
3 Application information
Figu re 17 . Appl icat io n sche m atic
Note: More information is available in the application notes:
AN2348 Flip-Chip package description and recommendat ions for use
PA2.4GHz
PA
5GHz
LNA
2.4GHz
LNA
5GHz
ZF
BAL-CW1250D3 BPF 2.4GHz
BPF50-01D3
2.4G/5G RF transceiver
Bluetooth
Rx/Tx
5GHz FEM
2.4GHz FEM
DIP2450-01D3
DocID024678 Rev 2 9/10
BAL-CW1250D3 Order ing informati on
4 Ordering information
5 Revision history
Table 5. Ordering information
Part Number Marking Package Weight Base Qty Delivery Mode
BAL-CW1250D3 SG Flip-Chip 1.46 mg 5000 Tape and reel(7”)
Table 6. Document revision history
Date Revision Changes
23-May-2013 1 Initial release.
23-Sep-2015 2 Updated Figure 8. Added Figure 10, Figure 11, Figure 12, Figure 13
and Table 4. Reformatted to current standards.
BAL-CW1250D3
10/10 DocID024678 Rev 2
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