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THC63LVDM83D / THC63LVDF(R)84C Evaluation Kit
LVDS Single Link Evaluation Board
Parts Number: THEVAM83D, THEVAF(R)84C
1.General Description
THEVAM83D and, THEVAF(R)84C boards are
designed to support video data transmission
between the host and display. One high-speed lane
can carry up to 24bits data and 3bits of
synchronizing signals at a pixel clock frequency
from 8MHz to 160MHz.
Table 1 Clock Frequency
Type
Parts Number
TTL Clock Freq.
Tx THEVAM83D 8MHz to 160MHz
Rx THEVAF(R)84C 8MHz to 112MHz
2. Features
Compatible with TIA/EIA-644 LVDS Standard
7:1 LVDS Transmitter and Receiver
Single power supply
Power Down Mode
< THEVAM83D>
LVDS swing is reducible as 200mV by RS-pin
to reduce EMI and power consumption.
Input clock triggering edge is selectable by
R/F-pin
< THEVAF84C>Falling Edge Clock
< THEVAR84C>Rising Edge Clock
3. Overview
(a) THEVAM83D (Top Side) (b) THEVAF(R)84C (Top Side)
Figure 1 THEVAM83D and THEVAF(R)84C Top Side View
(a) THEVAM83D (Bottom Side) (b)THEVAF(R)84C (Bottom Side)
Figure 2 THEVAM83D and THEVAF(R)84C Bottom Side View
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4. Power Supply Set Up
This chapter shows power supply condition.
Caution: Please check if there is no power-GND short on below red trace before supplying any power.
3.3V Power Supply to Each Board
Each evaluation board require 3.3V power supply. Please use “CON1” connector typically.
3.3V Power Supply
Ground
(a)THEVAM83D (b) THEVAF(R)84C
Figure 3 Power Supply for Evaluation Board
Power Supply from / to Connector
3.3V power supply can be connected to Header1 and CON2 by using W1 and W2solder jumper.
THEVAM83D
W1: Connect the 3.3V power supply with pin#29 and 30 of CON2.
W2: Connect the 3.3V power supply with pin#1, 2 and 3 of Header1.
Figure 4 THEVAM83D Power Supply from / to Each Connector
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THEVAF(R)84C
W1: Connect the 3.3V power supply with pin#1, 2 and 3 of Header1.
W2: Connect the 3.3V power supply with pin#1 and 2 of CON2.
W2 W1
Figure 5 THEVAF(R)84C Power Supply from / to Each Connect
5. Function Setting
Setting pin of each boards are shown in yellow area of figure 6. HEADER is connected to IC’s setting pin.
Each setting pin’s high or low setting can set by connecting HEADER and high level or low level.
(a)THEVAM83D (b) THEVAF(R)84C
Figure 6 Position of Function Setting Pin
High setting
Low setting
Connected with
IC s setting pin
High side
Low side
Figure 7 High / Low Setting Description
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5. Function
This chapter shows function setting of THEVAM83D and THEVAF(R)84C.
Table 2 THEVAM83D Function Setting Description
Silk Symbol Function
RF RF
Input clock triggering edge select input for latching input
data
H: Rising edge L: Falling edge
RS RS
LVDS Swing Mode.
RS LVDS
Swing
Small Swing
Input Support
VCC 350mV N/A
0.6 to 1.4V 350mV RS=V
REF
GND 200mV N/A
V
REF
: is Input Reference Voltage
PWDN PWDN Power down input.
H: Normal operation L: Power down
Table 3 THEVAF(R)84C Function Setting Description
Silk Symbol Function
PWDN PWDN Power down input.
H: Normal Operation L: Power Down
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6. Schematic
Figure 8 THEVAM83D Schematic
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
D D
C C
B B
A A
Title
Number RevisionSize
A3
Date: 2015/02/26 Sheet of
File: \\..\THC63LVDM83D.SchDoc Drawn By:
THEVAM83D
1.00
1 1
282836-2(NC)
1
2GND
VCC
CON1
GND 10uF
C4
GND
VDD3.3
SML-310MT
D1
150Ω
R1
GND
VDD3.3
MPZ1608R471A
L1
10uF
C1
GND
VDD3.3
MPZ1608R471A
L2
10uF
C2
GND
1
2
3
3HEAD(NC)
Header2
1
2
3
3HEAD(NC)
Header3
1
2
3
3HEAD(NC)
Header4
GND
R/F RS PDWN
PCN10-48P-2.54DSA_LEFT(NC)
1
20
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
30
29
28
27
26
25
24
23
22
21
40
39
38
37
36
35
34
33
32
31
48
47
46
45
44
43
42
41
Header1
VDD3.3
GND
R2
R3
G2
G3
B4
B5
B6
B7
B8
B9
HSYNC
VSYNC
DE
G9
R4
R5
R6
R7
R8
R9
G4
G5
G6
G7
G8
CLKIN
B2
B3
CTRL
VDD3.3
VCC LVDSVCC
GND 29
TC6 30
CLK IN 31
/PDWN 32
PLL GND 33
PLL VCC 34
PLL GND 35
LVDS GND 36
TD+ 37
TD- 38
TCLK+ 39
TCLK- 40
TC+ 41
TC- 42
LVDS GND 43
LVDS VCC 44
TB+ 45
TB- 46
TA+ 47
TA- 48
LVDS GND 49
TD0 50
TA0 51
TA1 52
GND 53
TA3 55
TA4 56
RS
1
TD1
2
TA5
3
TA6
4
GND
5
TB0
6
TB1
7
TD2
8
VCC
9
TD3
10
TB2
11
TB3
12
GND
13
TB4
14
TB5
15
TD4
16
R/F
17
TD5
18
TB6
19
TC0
20
GND
21
TC1
22
TC2
23
TC3
24
TD6
25
VCC
26
TC4
27
TC5
28
TA2 54
IC1
THC63LVDM83D
VDD3.3
MPZ1608R471A
L3
10uF
C3
GND
PLLVCC
0.01uFC8
0.1uFC5
0.01uFC11
0.1uFC12
GND
VCC
0.01uFC9
0.01uFC10
0.1uFC7
0.1uFC6
LVDSVCC
PLLVCC
GND
HSYNC
VSYNC
DE
CTRL
R2
R3
R4
R5
R6
R7
R8
R9
G2
G3
G9
G4
G5
G6
G7
G8
B4
B5
B6
B7
B8
B9
B2
B3
RS
CLKIN
PDWN
R/F
TD+
TD-
TCLK+
TCLK-
TC+
TC-
TB+
TB-
TA+
TA-
52271-3069(NC)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30 CON2
TD+
TD-
TCLK+
TCLK-
TC+
TC-
TB+
TB-
TA+
TA-
VDD3.3
GND
Solder Jumper
W2 Solder Jumper
W1
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Figure 9 THEVAF(R)84C Schematic
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
D D
C C
B B
A A
Title
Number RevisionSize
A3
Date: 2015/02/26 Sheet of
File: \\..\THC63LVDF(R)84.SchDoc Drawn By:
THEVAF(R) 84C
1.00
1 1
282836-2(NC)
1
2GND
VCC
CON1
GND 10uF
C4
GND
VDD3.3
SML-310MT
D1
150Ω
R1
GND
VDD3.3
MPZ1608R471A
L1
Inductor
10uF
C1
GND
VDD3.3
MPZ1608R471A
L2
Inductor
10uF
C2
GND
1
2
3
3HEAD(NC)
Header2
GND
PDWN
VDD3.3
VCC LVDSVCC VDD3.3
MPZ1608R471A
L3
Inductor
10uF
C3
GND
PLLVCC
0.01uFC8
0.1uFC6
0.01uFC11
0.1uFC12
GND
VCC
0.01uFC9
0.01uFC10
0.1uFC7
0.1uFC5
LVDSVCC
PLLVCC
GND
HSYNC
VSYNC
DE
CTRL
R2
R3
R9
G2
G3
G9
G4
G5
G6
G7
G8
B4
B5
B6
B7
B8
B9
B2
B3
CLKOUT
PDWN
RD+
RD-
RCLK+
RCLK-
RC+
RC-
RB+
RB-
RA+
RA-
52271-3069(NC)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
CON2
RD+
RD-
RCLK+
RCLK-
RC+
RC-
RB+
RB-
RA+
RA-
VDD3.3
GND
RA1 29
RA2 30
VCC 31
RA3 32
RA4 33
RD1 34
RA5 35
GND 36
RA6 37
RB0 38
RB1 39
VCC 40
RD2 41
RD3 42
RB2 43
GND 44
RB3 45
RB4 46
RB5 47
VCC 48
RD4 49
RD5 50
RB6 51
GND 52
RC0 53
RC2 55
VCC 56
RC3
1
RD6
2
RC4
3
GND
4
RC5
5
RC6
6
RD0
7
LVDSGND
8
RA-
9
RA+
10
RB-
11
RB+
12
LVDSVCC
13
LVDSGND
14
RC-
15
RC+
16
RCLK-
17
RCLK+
18
RD-
19
RD+
20
LVDSGND
21
PLLGND
22
PLLVCC
23
PLLGND
24
/PDWN
25
CLKOUT
26
RA0
27
GND
28
RC1 54
IC1
THC63LVDF(R) 84C
R4
R5
R6
R7
R8
100Ω
R10
100Ω
R15
100Ω
R23
100Ω
R28
100Ω
R35
PCN10-48P-2.54DSA_RIGHT(NC)
1
20
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
30
29
28
27
26
25
24
23
22
21
40
39
38
37
36
35
34
33
32
31
48
47
46
45
44
43
42
41
Header1
R2_C
R3_C
G2_C
G3_C
VSYNC_C
DE_C
G9_C
R4_C
R5_C
R6_C
R7_C
R8_C
R9_C
G4_C
G5_C
G6_C
G7_C
G8_C
CLKOUT_C
B4_C
B5_C
B6_C
B7_C
B8_C
B9_C
HSYNC_C
B2_C
B3_C
CTRL_C
GND GND
VDD3.3
R2
G2
VSYNC
R4
R6
R8
G4
G6
G8
B4
B5
B6
B7
B8
B9
HSYNC
B2
B3
CTRL
R3
R5
R7
R9
G3
G9
G5
G7
DE
10ΩR2
10ΩR3
10ΩR4
10ΩR5
10ΩR8
10ΩR11
10ΩR13
10ΩR14
10ΩR16
10ΩR17
10ΩR18
10ΩR19
10ΩR21
10ΩR24
10ΩR26
10ΩR27
10ΩR29
10ΩR30
10ΩR31
10ΩR32
10ΩR33
10ΩR34
10ΩR36
10ΩR38
10ΩR39
10ΩR40
10ΩR41
10ΩR42
CLKOUT 10ΩR43
R2_C
G2_C
VSYNC_C
R4_C
R6_C
R8_C
G4_C
G6_C
G8_C
B4_C
B5_C
B6_C
B7_C
B8_C
B9_C
HSYNC_C
B2_C
B3_C
CTRL_C
R3_C
R5_C
R7_C
R9_C
G3_C
G9_C
G5_C
G7_C
DE_C
CLKOUT_C
Solder Jumper
W2
0Ω(NC) R6
0Ω(NC) R9
0Ω(NC) R12
0Ω(NC)R7
0Ω(NC)R22
0Ω(NC) R25
0Ω(NC) R37
0Ω(NC) R20
Solder Jumper
W1
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7. Bills of Materials
Table 4 THEVAM83D BOM
TYPE Value / Part No. Package SPEC Reference No. Qty.
Capacitor 10uF 2012 16V C1, C2, C3, C4 4
Capacitor 0.1uF 1005 16V C5, C6, C7, C12 4
Capacitor 0.01uF 1005 16V C8, C9, C10, C11 4
Connector 282836-2(NC) 5mm_pitch 2pin CON1 1
Connector 52271-3069(NC) 1mm_pitch 30pin CON2 1
Connector PCN10-48P-2.54DSA_LEFT(NC) 2.54mm_pitch 48pin Header1 1
Header 3HEAD(NC) 2.54mm_pitch --- Header2, Header3, Header4 3
IC THC63LVDM83D TSSOP56 --- IC1 1
Inductor MPZ1608R471A 1608 1.2A L1, L2, L3 3
LED0 SML-310MT 1608 GREEN D1 1
Resistor 150Ω 1005 0.1W R1 1
Table 5 THEVAF(R)84C BOM
TYPE Value / Part No. Package SPEC Reference No. Qty.
Capacitor 10uF 2012 16V C1, C2, C3, C4 4
Capacitor 0.1uF 1005 16V C5, C6, C7, C12 4
Capacitor 0.01uF 1005 16V C8, C9, C10, C11 4
Connector PCN10-48P-2.54DSA_RIGHT(N
C) 2.54mm_pitch 48pin Header1 1
Connector 52271-3069(NC) 1mm_pitch 30pin CON2 1
Connector 282836-2(NC) 5mm_pitch 2pin CON1 1
Header 3HEAD(NC) 2.54mm_pitch --- Header2 1
IC THC63LVDF(R)84C TSSOP56 --- IC1 1
Inductor MPZ1608R471A 1608 1.2A L1, L2, L3 3
LED0 SML-310MT 1608 GREEN D1 1
Resistor 150Ω 1005 0.1W R1 1
Resistor 100Ω 1005 0.1W R10, R15, R23, R28, R35 5
Resistor 10Ω 1005 0.1W
R2, R3, R4, R5, R8, R11, R13, R14,
R16, R17, R18, R19, R21, R24, R26,
R27, R29, R30, R31, R32, R33, R34,
R36, R38, R39, R40, R41, R42, R43
29
Resistor 0Ω(NC) 1005 1A R6, R7, R9, R12, R20, R22, R25, R37 8
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8. Set items
Table 6 Set Items
TYPE Part No.
DC Connector 282836-2
FFC Connector for LVDS Link 52271-3069
FFC 30pin 1mm pitch for LVDS Link 98267-0475
Pin Header ---
It's possible to mount these parts on this board and use.
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9. Notices and Requests
Please kindly read, understand and accept this Notes and Requests” before using this product.
For the Material:
1. The product specifications described in this material are subject to change without prior notice.
2. The circuit diagrams described in this material are examples of the application which may not always
apply to design of respective customers. THine Electronics, Inc. (“THine”) is not responsible for
possible errors and omissions in this material. Please note if the errors or omissions should be found in
this material, THine may not be able to correct them immediately.
3. This material contains THine’s copyright, know-how or other proprietary. Copying or disclosing of the
contents of this material to any third party without THine’s prior permission is strictly prohibited.
For the Product:
1. This product is solely designed for evaluation purpose, and other purposes including mass production
and distribution are not intended.
2. This product has been solely manufactured for electric design engineers but not for end-users.
3. This product is not radiation-tolerant product.
4. This product is presumed to be used for general electric device, not for applications which require
extremely high-reliability/safety (including medical device concerned with critical care, aerospace
device, or nuclear power control device). Also, when using this product for any device concerned with
control and/or safety of transportation mean, traffic signal device, or other various types of safety
device, such use must be after applying appropriate measures to the product.
5. This product has been designed with the utmost care to accomplish the purpose of evaluation of IC
products manufactured by THine Electronics, Inc., however, THine MAKES NO WARRANTIES OR
REPRESENTATIONS WITH REGARD TO ANY PERFORMANCE OR FUNCTION OF THIS
PRODUCT IN ANY CIRCUMSTANCE.
6. This product has been manufactured with the utmost care in quality control and product reliability,
however, there may be faults or defects with a low but fixed probability, as inevitable phenomenon
concerned with semiconductor manufacturing processes. Therefore, Customers are encouraged to have
sufficiently redundant or error-preventive design applied to the use of the product so as not to have
THine’s product cause any social or public damage. Replacement of the product is only available in
case of obvious defects of mount devices at the point of unpacking the product. Neither replacement
nor failure analysis of the product is available in any other case of defects with the product and/or the
product’s components.
7. Customers are asked, if required, to judge by themselves on whether this product falls under the
category of strategic goods under the Foreign Exchange and Foreign Trade Control Law.
8. Please Note that if infringement of any third partys industrial ownership should occur by using this
product, THine will be exempted from any responsibility unless it directly relates to the production
process or functions of the product.
9. Developing, designing and manufacturing of Customers’ own products, equipments or system by using
of this product is strictly prohibited in any way.
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